SPECIFICATION FOR APPROVAL CUSTOMER CUSTOMERS P/N PART NUMBER WAN3216F245L08 DESCRIPTION Chip Antenna 3216 L Ant 2.45G Type 08 VERSION V4.1 ISSUE DATE 2020/02/27 CUSTOMER APPROVED APPROVAL Ray R&D CENTER CHECKED Tennyson DRAWN Snow 11261 151 1
: (02) 2898-2220
: (02) 2898-5055 OneWave Electronic Co., Ltd. 1F, No. 151, Li Gong Street, Beitou District, Taipei City 11261, Taiwan TEL: +886 2 2898-2220 FAX: +886 2 2898-5055 3216 Chip antenna For Bluetooth / WLAN Applications P/N: WAN3216F245L08 Dimension (mm) 3.23 0.20 1.66 0.20 0.45 0.20 L W T ONEWAVE TECHNOLOGY CO., LTD. 2/11 Part Number Information WAN 3216 A B F C 245 D L E 08 F Product Series Dimension L x W Material A B C D Working Frequency E F Feeding mode Antenna type Antenna 3.2 x 1.6mm (0.2mm) High K material 2.4 ~ 2.5GHz Loop & Single Feeding Type = 08 1. Electrical Specification Specification WAN3216F245L08 Part Number Central Frequency Bandwidth Return Loss Peak Gain Impedance Operating Temperature Maximum Power 2450 110 (Min.)
-10 (Max) 1.15 50
-40+110 4 MHz MHz dB dBi Ohm W sec. Resistance to Soldering Heats 10 ( @ 260) Polarization Azimuth Beamwidth Termination Linear Omni-directional Ni / Au (Leadless) Remark : Bandwidth & Peak Gain was measured under evaluation board of next page ONEWAVE TECHNOLOGY CO., LTD. 3/11 2. Recommended PCB Pattern Evaluation Board Dimension Suggested Matching Circuit
0.1~0.3nH0.1pF ONEWAVE TECHNOLOGY CO., LTD. 4/11 Layout Dimensions in Clearance area( Size=5.8*9.9mm) FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 5/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 6/11 Radiation Pattern X Y Z Efficiency Peak Gain Directivity 2400MHz 64.38 %
1.04 dBi 2.95 dBi 2450MHz 68.15 %
1.15 dBi 2.81 dBi 2500MHz 66.68 %
1.12 dBi 2.88 dBi Chamber Coordinate System ONEWAVE TECHNOLOGY CO., LTD. 7/11 4.Reliability and Test Condictions ITEM Solderability REQUIREMENTS 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage TEMP () 230 150 41 sec. 60sec Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within 6%
1. No visible mechanical damage 1. No visible mechanical damage Component Adhesion
(Push test) Component Adhesion
(Pull test) Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within 6%
Phase 1 2 3 4 303 Within 3sec Temperature() Time(min)
+1105 Room Temperature
-402 Room Temperature 303 Within 3sec Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. Humidity 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. TEST CONDITION Pre-heating temperature:150/60sec. Solder temperature:2305 Duration:41sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Pre-heating temperature:150/60sec. Solder temperature:2605 Duration:100.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin The device should be reflow soldered(2305 for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged.
+110=>303min
-40=>303min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature:+1105 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature:-405 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature: 402 Humidity: 90% to 95% RH Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. ONEWAVE TECHNOLOGY CO., LTD. 8/11 100.5 sec. 60sec.. TEMP () 150 260 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 280 tip temperature (max) 1.0mm tip diameter (max) Limit soldering time to 3 sec. ONEWAVE TECHNOLOGY CO., LTD. 9/11 SOLDERINGCOOLINGNATURALPRE-HEATINGTEMPERATURE(C)60~120 s10s max.30~60s250~260230180150TIME(sec.)Reflow SolderingSOLDERINGCOOLINGNATURALPRE-HEATINGTEMPERATURE(C)within 3sGradualcooling150TIME(sec.)Iron SolderingOver 60s350300 6.Packaging Information Tape Specification:
Reel Specification: (7, 180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.00.5 602 13.50.5 1782 3000 ONEWAVE TECHNOLOGY CO., LTD. 10/11 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes:
1. Temperature and humidity conditions: -10~ 40 and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. ONEWAVE TECHNOLOGY CO., LTD. 11/11