FCC ID: MCQ-CCMP1 WLAN+Bluetooth Module

 

ConnectCore MP15 System-on-module Hardware Reference Manual Revision history90002510 Revision 1P Date December 2022 Description Initial draft. 2P A March 2023 Added mapping between SOM pads and ADC channels to IOMUX tables;

added note regarding data matrix on SOMlabel; added comment on pad B13; revised VCC_LICELL description; changed VSYS minimum voltage. October 2023 Added certifications. Trademarks and copyright Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United States and other countries worldwide. All other trademarks mentioned in this document are the property of their respective owners. 2022-2023 Digi International Inc. All rights reserved. Disclaimers Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document as is, without warranty of any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes in this manual or in the product(s) and/or the program(s) described in this manual at any time. Warranty To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms Customer support Gather support information: Before contacting Digi technical support for help, gather the following information:

Product name and model Product serial number (s) Firmware version Operating system/browser (if applicable) Logs (from time of reported issue) ConnectCore MP15 System-on-Module 2 Trace (if possible) Description of issue Steps to reproduce Contact Digi technical support: Digi offers multiple technical support plans and service packages. Contact us at +1 952.912.3444 or visit us at www.digi.com/support. Feedback To provide feedback on this document, email your comments to techcomm@digi.com Include the document title and part number (ConnectCore MP15 System-on-Module, 90002510 A) in the subject line of your email. ConnectCore MP15 System-on-Module 3 Contents ConnectCore MP15 module STMicroelectronics STM32MP157 application processor About the ConnectCore MP15 Features and functionality Safety instructions Block diagrams Power interfaces System-on-module power architecture Reference power diagram Electrical characteristics Bootstrap Wireless interfaces WLAN IEEE 802.11a/b/g/n/ac RF channels Transmit power Antenna ports Bluetooth Module pinout External signals and pin multiplexing Castellated pad signals and multiplexing LGA pad signals and multiplexing Module specifications Mechanical specifications Host PCB footprint and cutout Label Weight Environmental specifications Socket options Regulatory information and certifications United States FCC Labeling requirements Maximum power and frequency specifications (FCC) FCC notices ConnectCore MP15 System-on-Module 6 7 7 8 9 10 10 11 11 14 14 14 16 19 19 19 20 22 35 76 76 77 77 77 78 80 80 80 81 4 FCC-approved antennas RF exposure Operating frequency Europe and UK CE mark CE and UKCA OEM labeling requirements Declarations of Conformity Approved antennas Canada (IC) Canadian Notice Labeling requirements Transmitters with detachable antennas RF exposure Approved antennas Japan Approval Label (MIC Marking) ConnectCore MP15 System-on-Module 81 84 84 84 85 85 86 86 87 88 88 88 89 89 89 90 5 About the ConnectCore MP15 Features and functionality About the ConnectCore MP15 The Digi ConnectCore MP15 System-on-Module (SOM) platform is a highly integrated, cost-effective, connected, secure embedded solution, built on the STM32MP15x MPU family. It integrates memory, power management, the Digi Microcontroller Assist, pre-certified wireless connectivity and advanced Digi TrustFence device security with a complete, open-source Linux software platform based on the Yocto Project. Features and functionality n The ConnectCore MP15 system-on-module is based on the STM32MP processor from STMicroelectronics. This processor offers a number of interfaces, most of them multiplexed and not available simultaneously. The module has the following features:

n STM32MP157C dual ARM Cortex-A7 and single Cortex-M4 cores:

l Cortex-A7 operating at up to 650 MHz. l 32 KB L1 instruction cache. l 32 KB L1 data cache. l 256 KB level 2 cache. l 3D GPU (Vivante - OpenGL ES 2.0) running at up to 533 MHz with performances up to 26 Mtriangle/s, 133 Mpixel/s. l Cortex-M4 operating at up to 209 MHz. n Up to 512 MB, 16-bit DDR3 memory. n Up to 512 GB, 8-bit SLC NAND flash memory. n STPMIC1A Power Management IC (PMIC):

l x4 adjustable buck SMPS converter. l x1 boost SMPS. l x1 USB OTG compliant power switch. l x1 general purpose power switch. l x4 adjustable general purpose LDOs. l x1 DDR reference voltage LDO. l x1 DDR3 termination/DDR bypass mode/general purpose LDO. l x1 USB PHY LDO. n IEEE 802.11 a/b/g/n/ac WLAN interface. n Bluetooth version 5.0. n Debug interfaces:

l System JTAG controller for STM32MP157C. n STM32MP157C interfaces:

l x6 I2C. l x4 UART. ConnectCore MP15 System-on-Module 6 About the ConnectCore MP15 Safety instructions l x4 USART. l x6 SPI, three I2Ss full-duplex master/slave. l x4 SAI. l x1 SPDIF Rx. l Management data inpout/output slave (MDIOS). l x3 SDMMC. l USB high-speed Host with two ports, two high-speed PHYs and a USB OTG high-speed with full-speed PHY or high-speed PHY shared with second port of USB Host. l x2 FDCAN, one of them supporting TTCAN mode. l x1 Gigabit Ethernet. l HDMI-CED. l x1 Flexible memory control (FMC) interface. l x1 Quad-SPI Flash memory interface. l x2 ADCs with 16-bit max resolution. l x2 12-bit D/A converters. l x1 digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters. l x1 camera interface for CMOS sensors. l x1 LCD-TFT display controller. l x1 MIPI DSI. Safety instructions n The ConnectCore MP15 module cannot be guaranteed operation due to the radio link and so should not be used for interlocks in safety critical devices such as machines or automotive applications. n The ConnectCore MP15 module has not been approved for use in (this list is not exhaustive):

l nuclear applications l explosive or flammable atmospheres n There are no user serviceable components inside the ConnectCore MP15 module. Do not modify the ConnectCore MP15 in any way. Modifications may exclude the module from any warranty and can cause the ConnectCore MP15 to operate outside of regulatory compliance for a given country, leading to the possible illegal operation of the radio. n Use industry standard ESD protection when handling the ConnectCore MP15 module. n Take care while handling to avoid electrical damage to the PCB and components. n Do not expose ConnectCore MP15 module to water or moisture. n Use this product with the antennas specified in the ConnectCore MP15 module user guides. n The end user must be told how to remove power from the ConnectCore MP15 module or to locate the antennas 20 cm from humans or animals. Block diagrams The figures below show block diagrams of the ConnectCore MP15 module and of the STMicroelectronics STM32MP157 application processor. ConnectCore MP15 System-on-Module 7 About the ConnectCore MP15 Block diagrams ConnectCore MP15 module ConnectCore MP15 System-on-Module 8 About the ConnectCore MP15 Block diagrams STMicroelectronics STM32MP157 application processor ConnectCore MP15 System-on-Module 9 About the ConnectCore MP15 Power interfaces Power interfaces System-on-module power architecture The ConnectCore MP15 requires two primary power supply inputs: VSYS and VSYS2, which are the input power supplies to the on-module ST STPMIC1 power management IC (PMIC) that generates all required supply voltages for the module as well as the external interfaces. The following table summarizes the PMIC regulators and switches on the ConnectCore MP15 SOM:

PMIC regulator BUCK1 SOM power rail name

Input power supply VSYS2 Internally used YES Externally available NO BUCK2 BUCK3 BUCK4 LDO1 LDO2 LDO3 LDO4 LDO5 LDO6

VDD 3V3

2V8

VDD_SD 1V8 PWR_USB_SW VBUS_OTG PWR_SW DDR_REF BOOST VBUS_SW

VSYS2 VSYS VSYS 3V3 3V3

VSYS 3V3 3V3

VSYS2 VSYS YES YES YES YES NO YES YES NO NO NO NO YES YES NO YES YES NO YES NO NO YES YES YES YES NO NO In addition to the input power supplies of the PMIC, other power domains of the SOM must also be set externally. This allows power management flexibility so you can adapt the input voltage of the different interfaces. The following table lists the input power rails that must be powered externally to the SOM together with the devices/power domains they power:

Input rail VCC_ LICELL OTG_ VBUS Internally connected to STM32MP1 CPU, VBAT Support for RTC, backup registers, RAM retention and backup Description SRAM on the CPU. STM32MP1 CPU, OTG_VBUS ConnectCore MP15 System-on-Module 10 About the ConnectCore MP15 Power interfaces Reference power diagram The following diagram represents the power architecture of the ConnectCore MP15 module in a typicalapplication:

Electrical characteristics Input power rails The following table lists the electrical specifications of all input power rails for the ConnectCore MP15:

Device SOM power rail PMIC VSYS VSYS2 Input voltage (V) Minimum Typical 3.7

Maximum 5.5 2.8

5.5 ConnectCore MP15 System-on-Module 11 About the ConnectCore MP15 Power interfaces Device SOM power rail CPU VCC_LICELL OTG_VBUS 1 Absolute maximum ratings. Input voltage (V) Minimum Typical 1.2 Vss-0.31

Maximum 3.6 6.01 ConnectCore MP15 System-on-Module 12 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 1 3 Output power rails The following table lists the electrical specifications of all output power rails for the ConnectCore MP15:

SOM power rail 3V3 Used internally in the SOM YES VDD VDD_SD LDO2_2V8 LDO6_1V8 VBUS_OTG VBUS_SW YES NO NO NO NO NO Output voltage Min

Typ 3.3 Max

Accuracy

(%) Min

-4 Max 4 Continuous output current

(mA)1 2000 Turn-on time

(us) Typ 235 Max 400 Turn-off time

(ms) Max 1.5

1.7 1.7 0.9

3.3

3.9 3.3 3.3

-4

-2

-2

-2

4 2 2 2

500 350 350 150 500 1000 235 160 160 100 3000 3000 400 1.5

3 3 3 3 3 Note Some of the electrical characteristics may depend on the configuration and operation mode of the different regulators. For a complete description of the electrical characteristics of the different output power rails (PMIC regulators), see the STPMIC1 datasheet. 1 The maximum output current involves both external and internal circuitry. For those regulators that are used internally in the SOM, the current available outside will be lower. A b o u t t h e C o n n e c t C o r e M P 1 5 P o w e r i n t e r f a c e s About the ConnectCore MP15 Bootstrap Bootstrap The ConnectCore MP15 module can be configured to boot from different devices and interfaces as determined by the boot ROM. The configuration of the booting process of the CPU is done through the BOOT pin and OTP bytes. BOOT2 0 BOOT1 0 BOOT0 0 Boot mode UART and USB port 1 0 0 0 1 1 1 1 0 1 1 0 0 1 1 1 0 1 0 1 0 1 Serial NOR Flash eMMC (default SDMMC2) NAND Flash Reserved SD card (default SDMMC1) UART and USB port 2 Serial NAND Flash Wireless interfaces The ConnectCore MP15 System-on-module combines a wireless local area network (WLAN) and Bluetooth dual solution to support IEEE802.11 a/b/g/n/ac WLAN standards and Bluetooth 5, enabling seamless integration of WLAN/Bluetooth and Low Energy technology. Digi also offers a non-wireless variant of the ConnectCore MP15 module. The following sections include specifications for the wireless interfaces available on the ConnectCore MP15 module. WLAN IEEE 802.11a/b/g/n/ac The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the ConnectCore MP15 module. Modulation and data rates The following tables list modulation values for the ConnectCore MP15 module, which supports the following WLAN standards:

Mode 802.11b Modulation & coding Rate DBPSK 1 Mbps DQPSK CCK CCK 2 Mbps 5.5 Mbps 11 Mbps ConnectCore MP15 System-on-Module 14 About the ConnectCore MP15 Wireless interfaces Mode Modulation & coding Rate BPSK-1/2 6 Mbps 802.11ga 802.11n 802.11ac BPSK-3/4 QPSK-1/2 QPSK-3/4 16QAM-1/2 16QAM-3/4 64QAM-2/3 64QAM-3/4 BPSK-1/2 QPSK-1/2 QPSK-3/4 16QAM-1/2 16QAM-3/4 64QAM-2/3 64QAM-3/4 64QAM-5/6 BPSK-1/2 QPSK-1/2 QPSK-3/4 16QAM-1/2 16QAM-3/4 64QAM-2/3 64QAM-3/4 64QAM-5/6 256QAM-3/4 256QAM-5/6 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9 ConnectCore MP15 System-on-Module 15 About the ConnectCore MP15 Wireless interfaces Data rate (Mbps) - Non Short Guard Interval (Non-SGI) 802.11b 802.11ga 802.11n BPSK-

1/2 64QAM-

5/6 BPSK-

1/2 802.11ac 64QAM-

5/6 256QAM-

5/6 Data rate

(Mbps) Modulation HT20 2.4 GHz HT40 5 GHz HT20 HT40 HT80 DBPSK CCK 1 Mbps 1 11 Mbps 11 BPSK-

1/2 6 Mbps 6 64QAM-

3/4 54 Mbps 54 6 54 MCS0 MCS7 6.5 65 MCS0 MCS7 6.5 65 MCS9 13.5 6.5 13.5 135 65 135 13.5 6.5 13.5 29.3 135 65 135 292.5 180 180 390 Data rate (Mbps) - Short Guard Interval (SGI) Mode 802.11b DBPSK CCK 1 Mbps 1 11 Mbps 11 Modulation 2.4 HT20 GHz HT40 5 GHz HT20 HT40 HT80 802.11ga BPSK-

1/2 6 Mbps 6 64QAM-

3/4 54 Mbps 54 6 54 802.11n BPSK-

1/2 64QAM-

5/6 802.11ac BPSK-

1/2 64QAM-

5/6 256QAM-

5/6 MCS0 MCS7 7.2 72.2 MCS0 MCS7 7.2 72.2 15 7.2 15 150 72.2 150 15 7.2 15 32.5 150 72.2 150 325 MCS9 200 200 433.3 RF channels The ConnectCore MP15 module supports the following frequency bands:

RF band 2.4 GHz Ch. BW 20 MHz 40 MHz Ch. spacing 5 MHz Channel number (Center freq. MHz) 1(2412), 2(2417), 3(2422), 4(2427), 5(2432), 6(2437), 7(2442), 8(2447), 9

(2452), 10(2457), 11(2462), 12(2467), 13(2472), 14(2484) 5 MHz 3(2422), 11(2462) ConnectCore MP15 System-on-Module 16 About the ConnectCore MP15 Wireless interfaces RF band Ch. BW Ch. spacing Channel number (Center freq. MHz) 5 GHz 20 MHz 40 MHz 80 MHz 20 MHz 36(5180), 40(5200), 44(5220), 48(5240), 52(5260), 56(5280), 60(5300), 64

(5320), 100(5500), 104(5520), 108(5540), 112(5560), 116(5580), 120

(5600), 124(5620), 128(5640), 132(5660), 136(5680), 140(5700), 144

(5720), 149(5745), 153(5765), 157(5785), 161(5805), 165(5825) 40 MHz 38(5190), 46(5230), 54(5270), 62(5310), 102(5510), 110(5550), 118(5590), 126(5630), 134(5670), 142(5710), 151(5755), 159(5795) 80 MHz 42(5210), 58(5290), 106(5530), 122(5610), 138(5690), 155(5775) Note Dependent upon regulatory bodies. 2.4 GHz 2.4 GHz band channel

1 2 3 4 5 6 7 8 9 10 11 12 13 14 Center frequency (MHz) 2412 2417 2422 2427 2432 2437 2442 2447 2452 2457 2462 2467 2472 2484 EUROPE

(ETSI) No NORTH AMERICA

(FCC) No No No JAPAN 802.11b only ConnectCore MP15 System-on-Module 17 About the ConnectCore MP15 Wireless interfaces Center frequency (MHz) EUROPE (ETSI) 5 GHz 5 GHz band channel #

36 40 44 48 52 56 60 64 100 104 108 112 116 120 124 128 132 136 140 149 153 157 161 165 5180 5200 5220 5240 5260 5280 5300 5320 5500 5520 5540 5560 5580 5600 5620 5640 5660 5680 5700 5745 5765 5785 5805 5825 Indoors Indoors NORTH AMERICA (FCC) JAPAN Indoors / DFS / TPC DFS DFS / TPC Indoors Indoors Indoors / DFS / TPC DFS Indoors / DFS / TPC DFS Indoors / DFS / TPC DFS DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC SRD SRD SRD SRD SRD DFS DFS DFS DFS DFS DFS DFS DFS DFS DFS DFS DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC No Access No Access No Access No Access No Access Note DFS = Dynamic Frequency Selection TPC = Transmit Power Control SRD = Short Range Devices 25 mW max power ConnectCore MP15 System-on-Module 18 About the ConnectCore MP15 Wireless interfaces Transmit power The following table lists nominal transmit power values for the ConnectCore MP15 module based on Murata LBEE5PK2AE-564 specification. RF band Standard 802.11b Output power (dBm) 17 (1Mbps) - 17 (11Mbps) 2.4 GHz 802.11g 16 (6Mbps) - 16 (54Mbps) 802.11n 802.11a 16 (MCS0) - 14 (MCS7) 13 (6Mbps) - 14 (54Mbps) 802.11n (HT20) 16 (MCS0) - 14 (MCS7) 802.11ac (VHT20) 16 (MCS0) - 13 (MCS8) 802.11n (HT40) 14 (MCS0) - 13 (MCS7) 802.11ac (VHT40) 14 (MCS0) - 11 (MCS9) 802.11ac (VHT80) 13 (MCS0) - 12 (MCS9) 5 GHz Antenna ports The ConnectCore MP15 module has one antenna port on the module via a dedicated U.FL connector. The antenna port supports WLAN and Bluetooth functionality. Bluetooth The ConnectCore MP15 module supports both Bluetooth and Bluetooth Low Energy protocols:

n Bluetooth 5 with all Bluetooth 4.2 optional features. Bluetooth class 1 and class 2 transmitter operation. n Integrated WLAN-Bluetooth coexistence. ConnectCore MP15 System-on-Module 19 Module pinout External signals and pin multiplexing Module pinout The ConnectCore MP15 module has a mixed pad structure. The module provides 245 LGA pins, 76 of them connected to the peripheral castellated pads. The general layout can be found on the following diagram:

White cells: LGA pads Orange cells: castellated pads Note Pad A1 is unconnected. This pad is meant for module-orientation purposes; its shape is square, whereas all other pads are circular. Pad A1 should not be soldered down to a corresponding pad on the carrier board. External signals and pin multiplexing The following tables provide the pinout information of the ConnectCore MP15 module. For additional information related to the signals listed in the table, refer to the STMicroelectronics STM32MP1 technical documentation. ConnectCore MP15 System-on-Module 20 Module pinout External signals and pin multiplexing Note The Digi ConnectCore Smart IOmux tool can dramatically simplify pin configuration and resolution. You can enter the list of interfaces required by your project and use the Smart IOmux graphical interface to mock up configuration options, resulting in full pin assignment and device tree snippets that match your desired functionality. See the Smart IOmux User Guide for more information and download instructions. The microprocessor used on this module, like all CMOS devices, can be driven into a latch-

up condition if any I/O pin is driven outside of its associated power rail. Care must be taken to:

n Never drive an I/O pin beyond its positive rail or below ground. n Never drive an I/O pin from an external power source during the power-on or reset sequences. n Never hot-swap the module or interrupt its ground connection to external circuitry. Latch-up is a condition that can cause excessive current draw and result in excessive heating of the microprocessor or its power supplies. This excessive heating can permanently damage the microprocessor and/or its supporting components. When you use an external supply on the carrier board supporting the ConnectCore MP15 module, make sure this supply is NOT back driving STM32MP1 I/Os while their power rails are not enabled. For example, this can happen when an external 3.3V supply is available on the carrier board and this supply powers components driven by STM32MP1 I/Os. In this case, Digi recommends you enable the external power supply after internal 3.3V is enabled, or add the necessary protection circuitry to avoid back voltage (leakage). ConnectCore MP15 System-on-Module 21 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 2 Castellated pad signals and multiplexing Castellated pad ConnectCore MP15 pad 1 / B1 2 / C1 3 / D1 4 / E1 5 / F1 6 / G1 7 / H1 8 / J1 9 / K1 CPAD1 CPAD2 CPAD3 CPAD4 CPAD5 CPAD6 CPAD7 CPAD8 CPAD9 ConnectCore MP15 signal name STM32MP1 pad name VCC_LICELL VBAT VSYS NC NC GND VSYS VSYS2 GND 3V3

10 / L1 CPAD10 LTDC_G4 PH15 11 / M1 CPAD11 LTDC_G5 PF11 12 / N1 CPAD12 NC

Alternate functions

AF3: TIM8_CH3N AF13: DCMI_D11 AF14: LCD_G4 AF5: SPI5_MOSI AF10: SAI2_SD_B AF13: DCMI_D12 AF14: LCD_G5

13 / P1 CPAD13 NRST NRST

Additional functions

ADC1_INP2

Comments Coin cell supply. Input power line. Power group VCC_ LICELL VSYS

VSYS VSYS2 Input power line. Input power line.

3V3 VDD VDD

Output power line. Reset line of the CPU. Recommendation:

M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name Alternate functions Additional functions Power group Comments leave this pin floating. 14 / R1 CPAD14 I2S2_WS PI0 15 / T1 CPAD15 I2S2_CK PI1 16 / U1 CPAD16 SDMMC2_D1 PB15 17 / V1 CPAD17 SDMMC2_CMD PG6 18 / W1 CPAD18 PA13 PA13 19 / Y1 20 / AA2 CPAD19 CPAD20 BOOT1 BOOT1 SDMMC2_D0 PB14 AF2: TIM5_CH4 AF5: SPI2_NSS/I2S2_WS AF13: DCMI_D13 AF14: LCD_G5 AF3: TIM8_BKIN2 AF5: SPI2_SCK/I2S2_CK AF13: DCMI_D8 AF14: LCD_G6 AF0: RTC_REFIN AF1: TIM1_CH3N AF2: TIM12_CH2 AF3: TIM8_CH3N AF4: USART1_RX AF5: SPI2_MOSI/I2S2_SDO AF6: DFSDM1_CKIN2 AF9: SDMMC2_D1 AF0: TRACED14 AF1: TIM17_BKIN AF10: SDMMC2_CMD AF13: DCMI_D12 AF14: LCD_R7 AF0: DBTRGO AF1: DBTRGI AF2: MCO1 AF8: UART4_TX

AF1: TIM1_CH2N

BOOTFAILN

VDD VDD VDD VDD VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name Alternate functions Additional functions Power group Comments 21 / AA3 CPAD21 SDMMC2_CLK PE3 22 / AA4 CPAD22 SDMMC2_D2 PB3 23 / AA5 CPAD23 SDMMC2_D3 PB4 AF2: TIM12_CH1 AF3: TIM8_CH2N AF4: USART1_TX AF5: SPI2_MISO/I2S2_SDI AF6: DFSDM1_DATIN2 AF7: USART3_RTS/USART3_DE AF9: SDMMC2_D0 AF0: TRACED0 AF4: TIM15_BKIN AF6: SAI1_SD_B AF9: SDMMC2_CK AF12: FMC_A19 AF0: TRACED9 AF1: TIM2_CH2 AF4: SAI4_CK1 AF5: SPI1_SCK/I2S1_CK AF6: SPI3_SCK/I2S3_CK AF8: SPI6_SCK AF9: SDMMC2_D2 AF12: SAI4_MCLK_A AF13: UART7_RX AF0: TRACED8 AF1: TIM16_BKIN AF2: TIM3_CH1 AF4: SAI4_CK2 AF5: SPI1_MISO/I2S1_SDI AF6: SPI3_MISO/I2S3_SDI AF7: SPI2_NSS/I2S2_WS AF8: SPI6_MISO AF9: SDMMC2_D3 AF12: SAI4_SCK_A AF13: UART7_TX

VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 4 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 5 Power group Comments Additional functions

Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name 24 / AA6 CPAD24 UART4_TX PG11 25 / AA7 CPAD25 UART4_RX PB2 Alternate functions AF0: TRACED11 AF4: USART1_TX AF6: UART4_TX AF8: SPDIFRX_IN1 AF11: ETH1_GMII_TX_ EN/ETH1_MII_TX_EN/ETH1_ RGMII_TX_CTL/ETH1_RMII_ TX_EN AF13: DCMI_D3 AF14: LCD_B3 AF0: TRACED4 AF1: RTC_OUT2 AF2: SAI1_D1 AF3: DFSDM1_CKIN1 AF4: USART1_RX AF5: I2S_CKIN AF6: SAI1_SD_A AF7: SPI3_MOSI/I2S3_SDO AF8: UART4_RX AF9: QUADSPI_CLK 26 / AA8 CPAD26 USB2_D_P USB_DP2 27 / AA9 CPAD27 USB2_D_N USB_DM2 28 / AA10 CPAD28 GND

29 / AA11 CPAD29 OTG_VBUS OTG_VBUS

30 / AA12 CPAD30 I2S2_SDI PI2 AF3: TIM8_CH4 AF5: SPI2_MISO/I2S2_SDI AF13: DCMI_D9

USBH_HS_DP2 OTG_HS_DP USBH_HS_DM2 OTG_HS_DM

OTG_FS_VBUS OTG_HS_VBUS VDD VDD

VDD Input power line. M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 6 Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name 31 / AA13 CPAD31 USB_OTG_ID PA10 32 / AA14 CPAD32 I2S2_SDO PI3 33 / AA15 34 / AA16 35 / AA17 36 / AA18 CPAD33 CPAD34 CPAD35 CPAD36 BOOT2 BOOT2 JTMS-SWDIO JTMS-SWDIO -

USB1_D_P USB1_D_N USB_DP1 USB_DM1 37 / AA19 CPAD37 ETH1_MDC PC1 38 / AA20 CPAD38 ETH1_MDIO PA2 Alternate functions AF14: LCD_G7 AF1: TIM1_CH3 AF5: SPI3_NSS/I2S3_WS AF7: USART1_RX AF11: MDIOS_MDIO AF12: SAI4_FS_B AF13: DCMI_D1 AF14: LCD_B1 AF3: TIM8_ETR AF5: SPI2_MOSI/I2S2_SDO AF13: DCMI_D10

AF0: TRACED0 AF2: SAI1_D1 AF3: DFSDM1_DATIN0 AF4: DFSDM1_CKIN4 AF5: SPI2_MOSI/I2S2_SDO AF6: SAI1_SD_A AF9: SDMMC2_CK AF11: ETH1_MDC AF12: MDIOS_MDC AF1: TIM2_CH3 AF2: TIM5_CH3 AF3: LPTIM4_OUT AF4: TIM15_CH1 Additional functions OTG_FS_ID OTG_HS_ID

USBH_HS_DP1 USBH_HS_DM1 ADC1_INP11 ADC1_INN10 ADC2_INP11 ADC2_INN10 TAMP_IN3 WKUP6 ADC1_INP14 WKUP2 Power group Comments

VDD VDD

VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name Additional functions Power group Comments Alternate functions AF7: USART2_TX AF8: SAI2_SCK_B AF10: SDMMC2_D0DIR AF11: ETH1_MDIO AF12: MDIOS_MDIO AF14: LCD_R1 39 / Y21 40 / W21 41 / V21 42 / U21 CPAD39 CPAD40 CPAD41 CPAD42 JTDO-

TRACESWO JTDO-

TRACESWO

JTCK-SWCLK JTCK-SWCLK -

JTDI JTRST JTDI JTRST 43 / T21 CPAD43 USART3_TX PD8 44 / R21 CPAD44 USART3_RX PB12

AF3: DFSDM1_CKIN3 AF6: SAI3_SCK_B AF7: USART3_TX AF9: SPDIFRX_IN2 AF12: FMC_AD13/FMC_D13 AF14: LCD_B7 AF1: TIM1_BKIN AF2: I2C6_SMBA AF4: I2C2_SMBA AF5: SPI2_NSS/I2S2_WS AF6: DFSDM1_CKIN7 AF7: USART3_CK AF8: USART3_RX AF9: FDCAN2_RX AF11: ETH1_GMII_TXD0/ETH1_ MII_TXD0/ETH1_RGMII_ TXD0/ETH1_RMII_TXD0 AF14: UART5_RX

VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad 45 / P21 CPAD45 ConnectCore MP15 signal name GND STM32MP1 pad name

46 / N21 CPAD46 USART3_RTS PG8 47 / M21 CPAD47 USART3_CTS PB13 48 / L21 CPAD48 ETH1_RXD0 PC4 Comments Alternate functions

AF0: TRACED15 AF1: TIM2_CH1/TIM2_ETR AF2: ETH_CLK AF3: TIM8_ETR AF5: SPI6_NSS AF6: SAI4_D2 AF7: USART6_RTS/USART6_DE AF8: USART3_RTS/USART3_DE AF9: SPDIFRX_IN3 AF10: SAI4_FS_A AF11: ETH1_PPS_OUT AF14: LCD_G7 AF1: TIM1_CH1N AF3: DFSDM1_CKOUT AF4: LPTIM2_OUT AF5: SPI2_SCK/I2S2_CK AF6: DFSDM1_CKIN1 AF7: USART3_CTS/USART3_ NSS AF9: FDCAN2_TX AF11: ETH1_GMII_TXD1/ETH1_ MII_TXD1/ETH1_RGMII_ TXD1/ETH1_RMII_TXD1 AF14: UART5_TX AF3: DFSDM1_CKIN2 AF5: I2S1_MCK AF9: SPDIFRX_IN3 AF11: ETH1_GMII_ RXD0/ETH1_MII_RXD0/ETH1_ RGMII_RXD0/ETH1_RMII_RXD0 Additional functions

ADC1_INP4 ADC2_INP4 Power group

VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name Alternate functions 49 / K21 CPAD49 ETH1_RX_DV PA7 50 / J21 CPAD50 ETH1_RX_ER PB10 51 / H21 CPAD51 ETH1_TXD1 PG14 AF1: TIM1_CH1N AF2: TIM3_CH2 AF3: TIM8_CH1N AF4: SAI4_D1 AF5: SPI1_MOSI/I2S1_SDO AF8: SPI6_MOSI AF9: TIM14_CH1 AF10: QUADSPI_CLK AF11: ETH1_GMII_RX_ DV/ETH1_MII_RX_DV/ETH1_ RGMII_RX_CTL/ETH1_RMII_ CRS_DV AF12: SAI4_SD_A AF1: TIM2_CH3 AF3: LPTIM2_IN1 AF4: I2C2_SCL AF5: SPI2_SCK/I2S2_CK AF6: DFSDM1_DATIN7 AF7: USART3_TX AF9: QUADSPI_BK1_NCS AF11: ETH1_GMII_RX_ ER/ETH1_MII_RX_ER AF14: LCD_G4 AF0: TRACED1 AF1: LPTIM1_ETR AF5: SPI6_MOSI AF6: SAI4_DI AF7: USART6_TX AF9: QUADSPI_BK2_IO3 AF10: SAI4_SD_A AF11: ETH1_GMII_TXD1/ETH1_ MII_TXD1/ETH1_RGMII_ Power group Comments Additional functions ADC1_INP7 ADC1_INN3 ADC2_INP7 ADC2_INN3 VDD VDD VDD

C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 2 9 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name Alternate functions Additional functions Power group Comments 52 / G21 CPAD52 ETH1_TX_EN PB11 53 / F21 CPAD53 ETH1_REF_CLK PA1 54 / E21 CPAD54 ETH1_RXD1 PC5 TXD1/ETH1_RMII_TXD1 AF12: FMC_A25 AF14: LCD_B0 AF1: TIM2_CH4 AF3: LPTIM2_ETR AF4: I2C2_SDA AF6: DFSDM1_CKIN7 AF7: USART3_RX AF11: ETH1_GMII_TX_ EN/ETH1_MII_TX_EN/ETH1_ RGMII_TX_CTL/ETH1_RMII_ TX_EN AF13: DSI_TE AF14: LCD_G5 AF0: ETH_CLK AF1: TIM2_CH2 AF2: TIM5_CH2 AF3: LPTIM3_OUT AF4: TIM15_CH1N AF7: USART2_RTS/USART2_DE AF8: UART4_RX AF9: QUADSPI_BK1_IO3 AF10: SAI2_MCLK_B AF11: ETH1_GMII_RX_ CLK/ETH1_MII_RX_CLK/ETH1_ RGMII_RX_CLK/ETH1_RMII_ REF_CLK AF14: LCD_R2 AF2: SAI1_D3 AF3: DFSDM1_DATIN2 AF4: SAI4_D4 AF6: SAI1_D4

ADC1_INP17 ADC1_INN16 ADC1_INP8 ADC1_INN4 ADC2_INP8 ADC2_INN4 VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 0 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name Alternate functions Additional functions Power group Comments AF9: SPDIFRX_IN4 AF11: ETH1_GMII_ RXD1/ETH1_MII_RXD1/ETH1_ RGMII_RXD1/ETH1_RMII_RXD1 AF12: SAI4_D3 AF0: TRACED0 AF1: LPTIM1_OUT AF2: SAI1_CK2 AF4: SAI4_CK1 AF5: SPI6_SCK AF6: SAI1_SCK_A AF7: USART6_CTS/USART6_ NSS AF10: SAI4_MCLK_A AF11: ETH1_GMII_TXD0/ETH1_ MII_TXD0/ETH1_RGMII_ TXD0/ETH1_RMII_TXD0 AF12: FMC_A24 AF14: LCD_R0 AF0: TRACED5 AF6: SAI1_MCLK_A AF7: USART6_CK AF8: UART8_RTS/UART8_DE AF9: QUADSPI_CLK AF11: QUADSPI_BK2_IO3 AF13: DCMI_D13 AF14: LCD_CLK AF0: HDP0 AF8: USART3_CTS/USART3_ NSS AF11: ETH1_GMII_RX_ ER/ETH1_MII_RX_ER

VDD VDD VDD 55 / D21 CPAD55 ETH1_TXD0 PG13 56 / C21 CPAD56 LTDC_CLK PG7 57 / B21 CPAD57 LTDC_HSYNC PI10 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name Alternate functions Additional functions Power group Comments 58 / A20 CPAD58 LTDC_B6 PI6 59 / A19 CPAD59 LTDC_B0 PE4 60 / A18 CPAD60 LTDC_B2 PA3 61 / A17 CPAD61 LTDC_B5 PI5 AF14: LCD_HSYNC AF3: TIM8_CH2 AF10: SAI2_SD_A AF13: DCMI_D6 AF14: LCD_B6 AF0: TRACED1 AF2: SAI1_D2 AF3: DFSDM1_DATIN3 AF4: TIM15_CH1N AF5: SPI4_NSS AF6: SAI1_FS_A AF7: SDMMC2_CKIN AF8: SDMMC1_CKIN AF9: SDMMC2_D4 AF11: SDMMC1_D4 AF12: FMC_A20 AF13: DCMI_D4 AF14: LCD_B0 AF1: TIM2_CH4 AF2: TIM5_CH4 AF3: LPTIM5_OUT AF4: TIM15_CH2 AF7: USART2_RX AF9: LCD_B2 AF11: ETH1_GMII_COL/ETH1_ MII_COL AF14: LCD_B5 AF3: TIM8_CH1 AF10: SAI2_SCK_A AF13: DCMI_VSYNC AF14: LCD_B5

ADC1_INP15 PVD_IN

VDD VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name 62 / A16 CPAD62 LTDC_G2 PH13 63 / A15 CPAD63 LTDC_G3 PG10 64 / A14 CPAD64 LTDC_B7 PI7 65 / A13 CPAD65 GND

66 / A12 CPAD66 LTDC_B4 PI4 67 / A11 CPAD67 LTDC_VSYNC PI9 68 / A10 CPAD68 LTDC_B3 PD10 Alternate functions AF3: TIM8_CH1N AF8: UART4_TX AF9: FDCAN1_TX AF14: LCD_G2 AF0: TRACED10 AF8: UART8_CTS AF9: LCD_G3 AF10: SAI2_SD_B AF11: QUADSPI_BK2_IO2 AF12: FMC_NE3 AF13: DCMI_D2 AF14: LCD_B2 AF3: TIM8_CH3 AF10: SAI2_FS_A AF13: DCMI_D7 AF14: LCD_B7

AF3: TIM8_BKIN AF10: SAI2_MCLK_A AF13: DCMI_D5 AF14: LCD_B4 AF0: HDP1 AF1: UART4_RX AF9: FDCAN1_RX AF14: LCD_VSYNC AF0: RTC_REFIN AF1: TIM16_BKIN AF3: DFSDM1_CKOUT AF4: I2C5_SMBA AF5: SPI3_MISO/I2S3_SDI Additional functions

Comments Power group VDD

VDD VDD

VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP1 pad name 69 / A9 CPAD69 LTDC_DE PF10 70 / A8 71 / A7 72 / A6 73 / A5 74 / A4 75 / A3 76 / A2 CPAD70 CPAD71 CPAD72 CPAD73 CPAD74 CPAD75 CPAD76 NC NC NC NC NC NC NC

Alternate functions AF6: SAI3_FS_B AF7: USART3_CK AF12: FMC_AD15/FMC_D15 AF14: LCD_B3 AF1: TIM16_BKIN AF2: SAI1_D3 AF3: SAI4_D4 AF6: SAI1_D4 AF9: QUADSPI_CLK AF12: SAI4_D3 AF13: DCMI_D11 AF14: LCD_DE

Additional functions Power group Comments

VDD

C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 4 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 5 LGA pad signals and multiplexing LGA pad ConnectCore MP15 pad A2 A3 A4 A5 A6 A7 A8 LGA_A2 LGA_A3 LGA_A4 LGA_A5 LGA_A6 LGA_A7 LGA_A8 ConnectCore MP15 signal name NC NC NC NC NC NC NC

A9 LGA_A9 LTDC_DE PF10 A10 LGA_A10 LTDC_B3 PD10 STM32MP157 pad name Alternate functions

AF1: TIM16_BKIN AF2: SAI1_D3 AF3: SAI4_D4 AF6: SAI1_D4 AF9: QUADSPI_CLK AF12: SAI4_D3 AF13: DCMI_D11 AF14: LCD_DE AF0: RTC_REFIN AF1: TIM16_BKIN AF3: DFSDM1_CKOUT AF4: I2C5_SMBA AF5: SPI3_MISO/I2S3_ SDI AF6: SAI3_FS_B AF7: USART3_CK AF12: FMC_AD15/FMC_ Additional functions

Power group Comments

VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name A11 LGA_A11 LTDC_VSYNC PI9 A12 LGA_A12 LTDC_B4 PI4 A13 LGA_A13 GND

A14 LGA_A14 LTDC_B7 PI7 A15 LGA_A15 LTDC_G3 PG10 A16 LGA_A16 LTDC_G2 PH13 A17 LGA_A17 LTDC_B5 PI5 Alternate functions D15 AF14: LCD_B3 AF0: HDP1 AF1: UART4_RX AF9: FDCAN1_RX AF14: LCD_VSYNC AF3: TIM8_BKIN AF10: SAI2_MCLK_A AF13: DCMI_D5 AF14: LCD_B4

AF3: TIM8_CH3 AF10: SAI2_FS_A AF13: DCMI_D7 AF14: LCD_B7 AF0: TRACED10 AF8: UART8_CTS AF9: LCD_G3 AF10: SAI2_SD_B AF11: QUADSPI_BK2_ IO2 AF12: FMC_NE3 AF13: DCMI_D2 AF14: LCD_B2 AF3: TIM8_CH1N AF8: UART4_TX AF9: FDCAN1_TX AF14: LCD_G2 AF3: TIM8_CH1 Additional functions Power group Comments

VDD VDD

VDD VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 6 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name A18 LGA_A18 LTDC_B2 PA3 A19 LGA_A19 LTDC_B0 PE4 A20 LGA_ A20 LTDC_B6 PI6 A21 LGA_A21 GND

Alternate functions AF10: SAI2_SCK_A AF13: DCMI_VSYNC AF14: LCD_B5 AF1: TIM2_CH4 AF2: TIM5_CH4 AF3: LPTIM5_OUT AF4: TIM15_CH2 AF7: USART2_RX AF9: LCD_B2 AF11: ETH1_GMII_ COL/ETH1_MII_COL AF14: LCD_B5 AF0: TRACED1 AF2: SAI1_D2 AF3: DFSDM1_DATIN3 AF4: TIM15_CH1N AF5: SPI4_NSS AF6: SAI1_FS_A AF7: SDMMC2_CKIN AF8: SDMMC1_CKIN AF9: SDMMC2_D4 AF11: SDMMC1_D4 AF12: FMC_A20 AF13: DCMI_D4 AF14: LCD_B0 AF3: TIM8_CH2 AF10: SAI2_SD_A AF13: DCMI_D6 AF14: LCD_B6

Additional functions Power group Comments ADC1_INP15 PVD_IN VDD VDD VDD

C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 8 LGA pad B1 B2 ConnectCore MP15 pad LGA_B1 LGA_B2 ConnectCore MP15 signal name VCC_LICELL NC VBAT

STM32MP157 pad name Alternate functions B3 LGA_B3 DCMI_D3 PE1 B4 B5 B6 B7 B8 LGA_B4 DCMI_D4 PH14 LGA_B5 LGA_B6 LGA_B7 NC NC RESERVED

LGA_B8 DCMI_D1 PH10 B9 LGA_B9 DCMI_D2 PH11 B10 LGA_B10 DCMI_VSYNC PB7

AF1: LPTIM1_IN2 AF5: I2S2_MCK AF6: SAI3_SD_B AF8: UART8_TX AF12: FMC_NBL1 AF13: DCMI_D3 AF3: TIM8_CH2N AF8: UART4_RX AF9: FDCAN1_RX AF13: DCMI_D4 AF14: LCD_G3

AF2: TIM5_CH1 AF4: I2C4_SMBA AF5: I2C1_SMBA AF13: DCMI_D1 AF14: LCD_R4 AF2: TIM5_CH2 AF4: I2C4_SCL AF5: I2C1_SCL AF13: DCMI_D2 AF14: LCD_R5 AF1: TIM17_CH1N AF2: TIM4_CH2 Additional functions

Power group Comments Coin cell supply. Reserved pad.

VDD VDD

VDD VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name B11 LGA_B11 DCMI_HSYNC PD9 B12 LGA_B12 GND B13 LGA_B13 RF_ANT_EXT B14 B15 B16 B17 B18 B19 B20 LGA_B14 LGA_B15 LGA_B16 LGA_B17 LGA_B18 LGA_B19 LGA_B20 GND NC GND NC NC NC NC

Alternate functions AF4: I2C1_SDA AF6: I2C4_SDA AF7: USART1_RX AF10: SDMMC2_D1 AF11: DFSDM1_CKIN5 AF12: FMC_NL AF13: DCMI_VSYNC AF3: DFSDM1_DATIN3 AF6: SAI3_SD_B AF7: USART3_RX AF12: FMC_AD14/FMC_ D14 AF13: DCMI_HSYNC AF14: LCD_B0

Additional functions Power group Comments

VDD

External antenna pad. This signal is disconnected inside the module. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 3 9 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name B21 LGA_B21 LTDC_HSYNC PI10 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 LGA_C1 LGA_C2 LGA_C3 LGA_C4 LGA_C5 LGA_C6 LGA_C7 LGA_C8 LGA_C9 LGA_C10 LGA_C11 LGA_C12 LGA_C13 VSYS VSYS NC NC GND DSI_CK_P DSI_D0_P DSI_D0_N DSI_D1_P DSI_D1_N GND NC GND

DSI_CK_P DSI_D0_P DSI_D0_N DSI_D1_P DSI_D1_N

C14 LGA_C14 PG3 PG3 Alternate functions AF0: HDP0 AF8: USART3_ CTS/USART3_NSS AF11: ETH1_GMII_RX_ ER/ETH1_MII_RX_ER AF14: LCD_HSYNC

AF0: TRACED3 AF3: TIM8_BKIN2 AF4: DFSDM1_CKIN1 AF11: ETH1_GMII_TXD7 AF12: FMC_A13 Additional functions

Power group Comments VDD

VSYS VSYS Input power line. Input power line.

VDD VDD VDD VDD VDD

VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 0 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name C15 LGA_C15 PG2 PG2 Additional functions

Alternate functions AF0: TRACED2 AF1: MCO2 AF3: TIM8_BKIN AF11: ETH1_GMII_TXD6 AF12: FMC_A12 C16 LGA_C16 PI8 PI8 C17 C18 C19 C20 LGA_C17 PCM_OUT LGA_C18 PCM_SYNC LGA_C19 GND LGA_C20 PCM_CLK

C21 LGA_C21 LTDC_CLK PG7 D1 LGA_D1 NC

AF0: TRACED5 AF6: SAI1_MCLK_A AF7: USART6_CK AF8: UART8_ RTS/UART8_DE AF9: QUADSPI_CLK AF11: QUADSPI_BK2_ IO3 AF13: DCMI_D13 AF14: LCD_CLK

RTC_OUT2/ RTC_ LSCO TAMP_IN2/ TAMP_ OUT3 WKUP4

Power group Comments Signal connected to the Wireless MAC. Signal connected to the Wireless MAC. Signal connected to the Wireless MAC. VDD VDD

VDD

C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 2 STM32MP157 pad name Alternate functions LGA pad D2 D3 D4 D5 D6 D7 D8 D9 D10 ConnectCore MP15 pad LGA_D2 LGA_D3 LGA_D4 LGA_D5 LGA_D6 LGA_D7 LGA_D8 LGA_D9 LGA_D10 ConnectCore MP15 signal name GND LDO2_2V8 LDO6_1V8 GND

DSI_CK_N DSI_CK_N GND NC NC GND

D11 LGA_D11 DCMI_PIXCLK PA6 D12 D13 D14 D15 LGA_D12 LGA_D13 LGA_D14 LGA_D15 VDD_SD NC NC BT_DEV_WAKE

AF1: TIM1_BKIN AF2: TIM3_CH1 AF3: TIM8_BKIN AF4: SAI4_CK2 AF5: SPI1_MISO/I2S1_ SDI AF8: SPI6_MISO AF9: TIM13_CH1 AF11: MDIOS_MDC AF12: SAI4_SCK_A AF13: DCMI_PIXCLK AF14: LCD_G2

Additional functions

ADC1_INP3 ADC2_INP3 Power group Comments Output power line. Output power line.

2V8 1V8

VDD

VDD

VDD_SD Output power line.

Signal connected to the M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions D16 LGA_D16 BT_UART_CTS PA11 D17 LGA_D17 BT_UART_TX PZ7 D18 LGA_D18 BT_UART_RX PZ1 D19 LGA_D19 BT_UART_RTS PA12 AF1: TIM1_CH4 AF2: I2C6_SCL AF4: I2C5_SCL AF5: SPI2_NSS/I2S2_WS AF6: UART4_RX AF7: USART1_ CTS/USART1_NSS AF9: FDCAN1_RX AF14: LCD_R4 AF2: I2C6_SDA AF3: I2C2_SDA AF7: USART1_TX AF2: I2C6_SDA AF3: I2C2_SDA AF4: I2C5_SDA AF5: SPI1_MISO/I2S1_ SDI AF6: I2C4_SDA AF7: USART1_RX AF8: SPI6_MISO AF1: TIM1_ETR AF2: I2C6_SDA AF4: I2C5_SDA AF6: UART4_TX AF7: USART1_ RTS/USART1_DE AF8: SAI2_FS_B AF9: FDCAN1_TX AF14: LCD_R5 Additional functions OTG_FS_DM Power group Comments Wireless MAC.

OTG_FS_DP VDD Signal only available in non-wireless variants. VDD Signal only available in non-wireless variants. VDD Signal only available in non-wireless variants. VDD Signal only available in non-wireless variants. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad D20 ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions LGA_D20 PCM_IN

Additional functions

Power group

Comments Signal connected to the Wireless MAC. D21 LGA_D21 ETH1_TXD0 PG13 AF0: TRACED0 AF1: LPTIM1_OUT AF2: SAI1_CK2 AF4: SAI4_CK1 AF5: SPI6_SCK AF6: SAI1_SCK_A AF7: USART6_ CTS/USART6_NSS AF10: SAI4_MCLK_A AF11: ETH1_GMII_ TXD0/ETH1_MII_ TXD0/ETH1_RGMII_ TXD0/ETH1_RMII_TXD0 AF12: FMC_A24 AF14: LCD_R0 E1 LGA_E1 NC

VDD

PMIC External LDO gate control line. E2 LGA_E2 WKUP PA0 ADC1_INP16 WKUP1 VDD AF1: TIM2_CH1/TIM2_ ETR AF2: TIM5_CH1 AF3: TIM8_ETR AF4: TIM15_BKIN AF7: USART2_ CTS/USART2_NSS AF8: UART4_TX AF9: SDMMC2_CMD AF10: SAI2_SD_B AF11: ETH1_GMII_ CRS/ETH1_MII_CRS C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 4 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad E3 ConnectCore MP15 pad LGA_E3 ConnectCore MP15 signal name VDD STM32MP157 pad name

E19 LGA_E19 PE0 PE0 E20 LGA_E20 WL_REG_EN PD13 E21 LGA_E21 ETH1_RXD1 PC5 F1 LGA_F1 GND

Alternate functions

AF1: LPTIM1_ETR AF2: TIM4_ETR AF4: LPTIM2_ETR AF5: SPI3_SCK/I2S3_CK AF6: SAI4_MCLK_B AF8: UART8_RX AF10: SAI2_MCLK_A AF12: FMC_NBL0 AF13: DCMI_D2 AF1: LPTIM1_OUT AF2: TIM4_CH2 AF4: I2C4_SDA AF5: I2C1_SDA AF6: I2S3_MCK AF9: QUADSPI_BK1_IO3 AF10: SAI2_SCK_A AF12: FMC_A18 AF13: DSI_TE AF2: SAI1_D3 AF3: DFSDM1_DATIN2 AF4: SAI4_D4 AF6: SAI1_D4 AF9: SPDIFRX_IN4 AF11: ETH1_GMII_ RXD1/ETH1_MII_ RXD1/ETH1_RGMII_ RXD1/ETH1_RMII_RXD1 AF12: SAI4_D3

Additional functions

Power group Comments VDD Output power line.

VDD VDD Signal only available in non-wireless variants. ADC1_INP8 ADC1_INN4 ADC2_INP8 ADC2_INN4

VDD

C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 5 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad F2 F3 F19 ConnectCore MP15 pad LGA_F2 LGA_F3 LGA_F19 ConnectCore MP15 signal name GND VSYS WL_HOST_ WAKE STM32MP157 pad name Alternate functions

F20 LGA_F20 PZ2 PZ2 F21 LGA_F21 ETH1_REF_CLK PA1 G1 LGA_G1 VSYS

AF2: I2C6_SCL AF3: I2C2_SCL AF4: I2C5_SMBA AF5: SPI1_MOSI/I2S1_ SDO AF6: I2C4_SMBA AF7: USART1_TX AF8: SPI6_MOSI AF0: ETH_CLK AF1: TIM2_CH2 AF2: TIM5_CH2 AF3: LPTIM3_OUT AF4: TIM15_CH1N AF7: USART2_ RTS/USART2_DE AF8: UART4_RX AF9: QUADSPI_BK1_IO3 AF10: SAI2_MCLK_B AF11: ETH1_GMII_RX_ CLK/ETH1_MII_RX_ CLK/ETH1_RGMII_RX_ CLK/ETH1_RMII_REF_ CLK AF14: LCD_R2

Additional functions

Comments Power group

ADC1_INP17 ADC1_INN16 VSYS Input power line.

Signal connected to the Wireless MAC. VDD VDD

VSYS Input power line. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 6 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 7 LGA pad G2 G3 ConnectCore MP15 pad LGA_G2 LGA_G3 ConnectCore MP15 signal name VSYS VSYS

STM32MP157 pad name Alternate functions G19 LGA_G19 BT_REG_EN PZ6 G20 LGA_G20 GND

G21 LGA_G21 ETH1_TX_EN PB11 H1 H2 H3 LGA_H1 LGA_H2 LGA_H3 VSYS2 VSYS2 VSYS2

H19 LGA_H19 PG0 PG0

AF2: I2C6_SCL AF3: I2C2_SCL AF4: USART1_CK AF5: I2S1_MCK AF6: I2C4_SMBA AF7: USART1_RX

AF1: TIM2_CH4 AF3: LPTIM2_ETR AF4: I2C2_SDA AF6: DFSDM1_CKIN7 AF7: USART3_RX AF11: ETH1_GMII_TX_ EN/ETH1_MII_TX_ EN/ETH1_RGMII_TX_ CTL/ETH1_RMII_TX_EN AF13: DSI_TE AF14: LCD_G5

AF0: TRACED0 AF3: DFSDM1_DATIN0 AF11: ETH1_GMII_TXD4 AF12: FMC_A10 Additional functions

Power group VSYS VSYS Comments Input power line. Input power line. Signal only available in non-wireless variants. Input power line. Input power line. Input power line. VDD

VDD VSYS2 VSYS2 VSYS2 VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad H20 ConnectCore MP15 pad LGA_H20 ConnectCore MP15 signal name BT_HOST_ WAKE STM32MP157 pad name Alternate functions

Additional functions

Power group

Comments Signal connected to the Wireless MAC. H21 LGA_H21 ETH1_TXD1 PG14 J1 J2 J3 LGA_J1 LGA_J2 LGA_J3 GND GND VSYS2

J19 LGA_J19 PF15 PF15 J20 LGA_J20 3V3_RF_ EN/PF2 PF2 J21 LGA_J21 ETH1_RX_ER PB10 AF0: TRACED1 AF1: LPTIM1_ETR AF5: SPI6_MOSI AF6: SAI4_DI AF7: USART6_TX AF9: QUADSPI_BK2_IO3 AF10: SAI4_SD_A AF11: ETH1_GMII_ TXD1/ETH1_MII_ TXD1/ETH1_RGMII_ TXD1/ETH1_RMII_TXD1 AF12: FMC_A25 AF14: LCD_B0

AF0: TRACED7 AF4: I2C4_SDA AF5: I2C1_SDA AF11: ETH1_GMII_RXD7 AF12: FMC_A9 AF4: I2C2_SMBA AF9: SDMMC2_D0DIR AF10: SDMMC3_D0DIR AF11: SDMMC1_D0DIR AF12: FMC_A2 AF1: TIM2_CH3

VDD

VDD VDD VDD Input power line. Signal only available in non-wireless variants. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments K1 K2 K3 LGA_K1 LGA_K2 LGA_K3 3V3 3V3 3V3

K19 LGA_K19 WLAN_SD_CLK PG15 K20 LGA_K20 WLAN_SD_D2 PF5 K21 LGA_K21 ETH1_RX_DV PA7 AF3: LPTIM2_IN1 AF4: I2C2_SCL AF5: SPI2_SCK/I2S2_CK AF6: DFSDM1_DATIN7 AF7: USART3_TX AF9: QUADSPI_BK1_NCS AF11: ETH1_GMII_RX_ ER/ETH1_MII_RX_ER AF14: LCD_G4

AF0: TRACED7 AF2: SAI1_D2 AF4: I2C2_SDA AF6: SAI1_FS_A AF7: USART6_ CTS/USART6_NSS AF10: SDMMC3_CK AF13: DCMI_D13 AF7: USART2_TX AF9: SDMMC3_D2 AF12: FMC_A5

AF1: TIM1_CH1N AF2: TIM3_CH2 AF3: TIM8_CH1N AF4: SAI4_D1 AF5: SPI1_MOSI/I2S1_ SDO ADC1_INP7 ADC1_INN3 ADC2_INP7 ADC2_INN3 3V3 3V3 3V3 Output power line. Output power line. Output power line. VDD Signal only available in non-wireless variants. 47K pull-up on module connected to 3V3. Signal only available in non-wireless variants. VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 4 9 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments AF8: SPI6_MOSI AF9: TIM14_CH1 AF10: QUADSPI_CLK AF11: ETH1_GMII_RX_ DV/ETH1_MII_RX_ DV/ETH1_RGMII_RX_ CTL/ETH1_RMII_CRS_DV AF12: SAI4_SD_A AF3: TIM8_CH3N AF13: DCMI_D11 AF14: LCD_G4

AF4: I2C2_SCL AF9: SDMMC3_CMD AF10: SDMMC3_CDIR AF12: FMC_A1 AF7: USART2_RX AF9: SDMMC3_D1 AF10: SDMMC3_D123DIR AF12: FMC_A4 AF3: DFSDM1_CKIN2 AF5: I2S1_MCK AF9: SPDIFRX_IN3 AF11: ETH1_GMII_ RXD0/ETH1_MII_ RXD0/ETH1_RGMII_ RXD0/ETH1_RMII_RXD0 AF5: SPI5_MOSI

ADC1_INP4 ADC2_INP4 VDD

VDD VDD VDD ADC1_INP2 VDD 47K pull-up on module connected to 3V3. Signal only available in non-wireless variants. 47K pull-up on module connected to 3V3. Signal only available in non-wireless variants. LGA_L1 LTDC_G4 PH15 L1 L2 L3 LGA_L2 LGA_L3 GND VREF+

L19 LGA_L19 WLAN_SD_ CMD

VREF+

PF1 L20 LGA_L20 WLAN_SD_D1 PF4 L21 LGA_L21 ETH1_RXD0 PC4 M1 LGA_M1 LTDC_G5 PF11 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 0 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments M2 LGA_M2 DCMI_D0 PH9 M3 LGA_M3 DCMI_D5 PD3 M19 LGA_M19 WLAN_SD_D0 PF0 M20 LGA_M20 WLAN_SD_D3 PD7 AF10: SAI2_SD_B AF13: DCMI_D12 AF14: LCD_G5 AF2: TIM12_CH2 AF4: I2C3_SMBA AF13: DCMI_D0 AF14: LCD_R3 AF0: HDP5 AF3: DFSDM1_CKOUT AF5: SPI2_SCK/I2S2_CK AF6: DFSDM1_DATIN0 AF7: USART2_ CTS/USART2_NSS AF8: SDMMC1_D123DIR AF9: SDMMC2_D7 AF10: SDMMC2_D123DIR AF11: SDMMC1_D7 AF12: FMC_CLK AF13: DCMI_D5 AF14: LCD_G7 AF4: I2C2_SDA AF9: SDMMC3_D0 AF10: SDMMC3_CKIN AF12: FMC_A0 AF0: TRACED6 AF3: DFSDM1_DATIN4 AF4: I2C2_SCL AF6: DFSDM1_CKIN1 AF7: USART2_CK AF9: SPDIFRX_IN1 AF10: SDMMC3_D3

VDD VDD VDD VDD 47K pull-up on module connected to 3V3. Signal only available in non-wireless variants. 47K pull-up on module connected to 3V3. Signal only available in non-wireless variants. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments M21 LGA_M21 USART3_CTS PB13 N1 LGA_N1 NC

N2 LGA_N2 DCMI_D6 PB8

AF12: FMC_NE1 AF1: TIM1_CH1N AF3: DFSDM1_CKOUT AF4: LPTIM2_OUT AF5: SPI2_SCK/I2S2_CK AF6: DFSDM1_CKIN1 AF7: USART3_ CTS/USART3_NSS AF9: FDCAN2_TX AF11: ETH1_GMII_ TXD1/ETH1_MII_ TXD1/ETH1_RGMII_ TXD1/ETH1_RMII_TXD1 AF14: UART5_TX

AF0: HDP6 AF1: TIM16_CH1 AF2: TIM4_CH3 AF3: DFSDM1_CKIN7 AF4: I2C1_SCL AF5: SDMMC1_CKIN AF6: I2C4_SCL AF7: SDMMC2_CKIN AF8: UART4_RX AF9: FDCAN1_RX AF10: SDMMC2_D4 AF11: ETH1_GMII_ TXD3/ETH1_MII_ TXD3/ETH1_RGMII_TXD3 AF12: SDMMC1_D4 AF13: DCMI_D6 AF14: LCD_B6 VDD

VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad N3 ConnectCore MP15 pad LGA_N3 ConnectCore MP15 signal name GND STM32MP157 pad name

Alternate functions Additional functions

N19 LGA_N19 SPI4_MOSI PE14 N20 LGA_N20 SPI4_MISO PE13 N21 LGA_N21 USART3_RTS PG8

AF1: TIM1_CH4 AF5: SPI4_MOSI AF8: UART8_ RTS/UART8_DE AF10: SAI2_MCLK_B AF11: SDMMC1_D123DIR AF12: FMC_AD11/FMC_ D11 AF13: LCD_G0 AF14: LCD_CLK AF0: HDP2 AF1: TIM1_CH3 AF3: DFSDM1_CKIN5 AF5: SPI4_MISO AF10: SAI2_FS_B AF12: FMC_AD10/FMC_ D10 AF13: DCMI_D6 AF14: LCD_DE AF0: TRACED15 AF1: TIM2_CH1/TIM2_ ETR AF2: ETH_CLK AF3: TIM8_ETR AF5: SPI6_NSS AF6: SAI4_D2 AF7: USART6_ RTS/USART6_DE AF8: USART3_ RTS/USART3_DE AF9: SPDIFRX_IN3 Comments Power group

VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name P1 P2 P3 LGA_P1 NRST NRST LGA_P2 LGA_P3 3V3 GND

P19 LGA_P19 UART7_RTS PF8 P20 LGA_P20 UART7_CTS PF9 P21 LGA_P21 GND R1 LGA_R1 I2S2_WS

PI0 Alternate functions AF10: SAI4_FS_A AF11: ETH1_PPS_OUT AF14: LCD_G7

AF0: TRACED12 AF1: TIM16_CH1N AF5: SPI5_MISO AF6: SAI1_SCK_B AF7: UART7_ RTS/UART7_DE AF9: TIM13_CH1 AF10: QUADSPI_BK1_ IO0 AF0: TRACED13 AF1: TIM17_CH1N AF5: SPI5_MOSI AF6: SAI1_FS_B AF7: UART7_CTS AF9: TIM14_CH1 AF10: QUADSPI_BK1_ IO1

AF2: TIM5_CH4 AF5: SPI2_NSS/I2S2_WS AF13: DCMI_D13 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 4 Additional functions Power group Comments Reset line of the CPU. Recommendation: leave this pin floating. Output power line.

VDD 3V3

VDD VDD

VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments AF14: LCD_G5 AF0: HDP7 AF1: TIM17_CH1 AF2: TIM4_CH4 AF3: DFSDM1_DATIN7 AF4: I2C1_SDA AF5: SPI2_NSS/I2S2_WS AF6: I2C4_SDA AF7: SDMMC2_CDIR AF8: UART4_TX AF9: FDCAN1_TX AF10: SDMMC2_D5 AF11: SDMMC1_CDIR AF12: SDMMC1_D5 AF13: DCMI_D7 AF14: LCD_B7

AF1: TIM16_CH1 AF5: SPI5_NSS AF6: SAI1_SD_B AF7: UART7_RX AF9: QUADSPI_BK1_IO3 AF12: SAI4_SCK_B AF1: TIM17_CH1 AF5: SPI5_SCK AF6: SAI1_MCLK_B AF7: UART7_TX AF9: QUADSPI_BK1_IO2 AF1: TIM1_BKIN AF2: I2C6_SMBA AF4: I2C2_SMBA

VDD

VDD VDD VDD R2 LGA_R2 DCMI_D7 PB9 R3 LGA_R3 GND

R19 LGA_R19 UART7_RX PF6 R20 LGA_R20 UART7_TX PF7 R21 LGA_R21 USART3_RX PB12 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 5 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments AF5: SPI2_NSS/I2S2_WS AF6: DFSDM1_CKIN7 AF7: USART3_CK AF8: USART3_RX AF9: FDCAN2_RX AF11: ETH1_GMII_ TXD0/ETH1_MII_ TXD0/ETH1_RGMII_ TXD0/ETH1_RMII_TXD0 AF14: UART5_RX AF3: TIM8_BKIN2 AF5: SPI2_SCK/I2S2_CK AF13: DCMI_D8 AF14: LCD_G6

T1 LGA_T1 I2S2_CK PI1 T2 LGA_T2 ANA0 T3 LGA_T3 ANA1 ANA0 ANA1

T19 LGA_T19 SDMMC1_D3 PC11 AF0: TRACED3 AF3: DFSDM1_DATIN5 AF6: SPI3_MISO/I2S3_ SDI AF7: USART3_RX AF8: UART4_RX AF9: QUADSPI_BK2_NCS AF10: SAI4_SCK_B AF12: SDMMC1_D3 AF13: DCMI_D4 ADC1_INP0 ADC1_INN1 ADC2_INP0 ADC2_INN1 ADC1_INP1 ADC2_INP1 ANA0 VDD

VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 6 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name T20 LGA_T20 PF12 PF12 T21 LGA_T21 USART3_TX PD8 U1 LGA_U1 SDMMC2_D1 PB15 U2 LGA_U2 PF13 PF13 U3 LGA_U3 PF14 PF14 Alternate functions AF0: TRACED4 AF11: ETH1_GMII_RXD4 AF12: FMC_A6 AF3: DFSDM1_CKIN3 AF6: SAI3_SCK_B AF7: USART3_TX AF9: SPDIFRX_IN2 AF12: FMC_AD13/FMC_ D13 AF14: LCD_B7 AF0: RTC_REFIN AF1: TIM1_CH3N AF2: TIM12_CH2 AF3: TIM8_CH3N AF4: USART1_RX AF5: SPI2_MOSI/I2S2_ SDO AF6: DFSDM1_CKIN2 AF9: SDMMC2_D1 AF0: TRACED5 AF3: DFSDM1_DATIN6 AF4: I2C4_SMBA AF5: I2C1_SMBA AF6: DFSDM1_DATIN3 AF11: ETH1_GMII_RXD5 AF12: FMC_A7 AF0: TRACED6 AF3: DFSDM1_CKIN6 AF4: I2C4_SCL AF5: I2C1_SCL AF11: ETH1_GMII_RXD6 Additional functions ADC1_INP6 ADC1_INN2 Power group VDD Comments

ADC2_INP2 ADC2_INP6 ADC2_INN2 VDD VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name U19 LGA_U19 PB6 PB6 U20 LGA_U20 LTDC_R3 PB0 U21 LGA_U21 JTRST JTRST V1 LGA_V1 SDMMC2_CMD PG6 Additional functions

ADC1_INP9 ADC1_INN5 ADC2_INP9 ADC2_INN5

Alternate functions AF12: FMC_A8 AF1: TIM16_CH1N AF2: TIM4_CH1 AF4: I2C1_SCL AF5: CEC AF6: I2C4_SCL AF7: USART1_TX AF9: FDCAN2_TX AF10: QUADSPI_BK1_ NCS AF11: DFSDM1_DATIN5 AF12: UART5_TX AF13: DCMI_D5 AF1: TIM1_CH2N AF2: TIM3_CH3 AF3: TIM8_CH2N AF6: DFSDM1_CKOUT AF8: UART4_CTS AF9: LCD_R3 AF11: ETH1_GMII_ RXD2/ETH1_MII_ RXD2/ETH1_RGMII_RXD2 AF12: MDIOS_MDIO AF14: LCD_G1

AF0: TRACED14 AF1: TIM17_BKIN AF10: SDMMC2_CMD AF13: DCMI_D12 AF14: LCD_R7 Power group Comments VDD VDD

VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 5 9 LGA pad ConnectCore MP15 pad V2 V3 V4 LGA_V2 LGA_V3 LGA_V4 ConnectCore MP15 signal name GND BOOT0 GND

BOOT0

STM32MP157 pad name Alternate functions V5 LGA_V5 SDMMC1_D0 PC8 V6 V7 V8 LGA_V6 GND

LGA_V7 LTDC_G6 PI11 LGA_V8 LTDC_R2 PH8 V9 LGA_V9 LTDC_R5 PC0 V10 LGA_V10 LTDC_R0 PH2

AF0: TRACED0 AF2: TIM3_CH3 AF3: TIM8_CH3 AF6: UART4_TX AF7: USART6_CK AF8: UART5_ RTS/UART5_DE AF12: SDMMC1_D0 AF13: DCMI_D2

AF0: MCO1 AF5: I2S_CKIN AF9: LCD_G6 AF2: TIM5_ETR AF4: I2C3_SDA AF13: DCMI_HSYNC AF14: LCD_R2 AF3: DFSDM1_CKIN0 AF4: LPTIM2_IN2 AF6: DFSDM1_DATIN4 AF8: SAI2_FS_B AF10: QUADSPI_BK2_ NCS AF14: LCD_R5 AF1: LPTIM1_IN2 Additional functions

WKUP5

ADC1_INP10 ADC2_INP10

Power group Comments 100K pull-up resistor.

VDD

VDD

VDD VDD VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments V11 LGA_V11 GND

V12 LGA_V12 SPI4_SCK PE12 V13 LGA_V13 LTDC_G7 PB5 V14 LGA_V14 SDMMC1_D1 PC9 AF9: QUADSPI_BK2_IO0 AF10: SAI2_SCK_B AF11: ETH1_GMII_ CRS/ETH1_MII_CRS AF14: LCD_R0

AF1: TIM1_CH3N AF3: DFSDM1_DATIN5 AF5: SPI4_SCK AF8: SDMMC1_D0DIR AF10: SAI2_SCK_B AF12: FMC_AD9/DMC_D9 AF14: LCD_B4 AF0: ETH_CLK AF1: TIM17_BKIN AF2: TIM3_CH2 AF3: SAI4_D1 AF4: I2C1_SMBA AF5: SPI1_MOSI/I2S1_ SDO AF6: I2C4_SMBA AF7: SPI3_MOSI/I2S3_ SDO AF8: SPI6_MOSI AF9: FDCAN2_RX AF10: SAI4_SD_A AF11: ETH1_PPS_OUT AF12: UART5_RX AF13: DCMI_D10 AF14: LCD_G7 AF0: TRACED1

VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 0 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments AF2: TIM3_CH4 AF3: TIM8_CH4 AF4: I2C3_SDA AF5: I2S_CIN AF8: UART5_CTS AF9: QUADSPI_BK1_IO0 AF12: SDMMC1_D1 AF13: DCMI_D3 AF14: LCD_B2 AF0: TRACED2 AF3: DFSDM1_CKIN5 AF6: SPI3_SCK/I2S3_CK AF7: USART3_TX AF8: UART4_TX AF9: QUADSPI_BK1_IO1 AF10: SAI4_MCLK_B AF12: SDMMC1_D2 AF13: DCMI_D8 AF14: LCD_R2

AF1: TIM1_ETR AF11: ETH1_GMII_ CLK125/ETH1_RGMII_ CLK125 AF12: FMC_A15 AF1: TIM1_BKIN2 AF11: ETH1_GMII_GTX_ CLK/ETH1_RGMII_GTX_ CLK AF12: FMC_A14

VDD

VDD VDD V15 LGA_V15 SDMMC1_D2 PC10 V16 LGA_V16 GND

V17 LGA_V17 ETH1_CLK125 PG5 V18 LGA_V18 ETH1_GTX_ CLK PG4 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name V19 LGA_V19 PC3 PC3 V20 V21 LGA_V20 LGA_V21 PG1 JTDI W1 LGA_W1 PA13 PG1 JTDI PA13 W2 LGA_W2 SDMMC2_D4 PA8 W3 LGA_W3 SDMMC2_D6 PE5 Alternate functions AF0: TRACECLK AF3: DFSDM1_DATIN1 AF5: SPI2_MOSI/I2S2_ SDO AF11: ETH1_GMII_TX_ CLK/ETH1_MII_TX_CLK AF0: TRACED1 AF11: ETH1_GMII_TXD5 AF12: FMC_A11

AF0: DBTRGO AF1: DBTRGI AF2: MCO1 AF8: UART4_TX AF0: MCO1 AF1: TIM1_CH1 AF3: TIM8_BKIN2 AF4: I2C3_SCL AF5: SPI3_MOSI/I2S3_ SDO AF7: USART1_CK AF8: SDMMC2_CKIN AF9: SDMMC2_D4 AF10: OTG_FS_ SOF/OTG_HS_SOF AF12: SAI4_SD_B AF13: UART7_RX AF14: LCD_R6 AF0: TRACED3 AF2: SAI1_CK2 Additional functions ADC1_INP13 ADC1_INN12

BOOTFAILN

Power group Comments VDD VDD

VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments AF3: DFSDM1_CKIN3 AF4: TIM15_CH1 AF5: SPI4_MISO AF6: SAI1_SCK_A AF7: SDMMC2_D0DIR AF8: SDMMC1_D0DIR AF9: SDMMC2_D6 AF11: SDMMC1_D6 AF12: FMC_A21 AF13: DCMI_D6 AF14: LCD_G0 AF0: HDP0 AF2: TIM5_ETR AF4: SAI4_D2 AF5: SPI1_NSS/I2S1_WS AF6: SPI3_NSS/I2S3_WS AF7: USART2_CK AF8: SPI6_NSS AF12: SAI4_FS_A AF13: DCMI_HSYNC AF14: LCD_VSYNC AF0: HDP4 AF2: TIM3_CH2 AF3: TIM8_CH2 AF4: DFSDMI_DATIN3 AF6: I2S3_MCK AF7: USART6_RX AF8: SDMMC1_D123DIR AF9: SDMMC2_D123DIR AF10: SDMMC2_D7 AF12: SDMMC1_D7 AF13: DCMI_D1 AF14: LCD_G6 ADC1_INP18 ADC2_INP18 DAC_OUT1

VDD VDD W4 LGA_W4 PA4 PA4 W5 LGA_W5 SDMMC2_D7 PC7 C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 4 LGA pad W6 W7 W8 ConnectCore MP15 pad LGA_W6 LGA_W7 LGA_W8 ConnectCore MP15 signal name GND NC PMIC_ PONKEY_N STM32MP157 pad name Alternate functions

AF0: DBTRGI AF1: TIM2_CH1/TIM2_ ETR AF2: SAI4_D2 AF3: SDMMC1_CDIR AF4: CEC AF5: SPI1_NSS/I2S1_WS AF6: SPI3_NSS/I2S3_WS AF7: SPI6_NSS AF8: UART4_ RTS/UART4_DE AF9: SDMMC2_D5 AF10: SDMMC2_CDIR AF11: SDMMC1_D5 AF12: SAI4_FS_A AF13: UART7_TX AF14: LCD_R1 AF0: HDP2 AF2: TIM5_CH3 AF4: I2C4_SDA AF5: I2C1_SDA AF13: DCMI_D3 AF14: LCD_R6

W9 LGA_W9 PA15 PA15 W10 LGA_W10 LTDC_R6 PH12 W11 LGA_W11 GND

Additional functions

Power group Comments PMIC Power ON key. Recommendation: leave this pin floating.

VDD VDD VDD

M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad W12 ConnectCore MP15 pad LGA_W12 ConnectCore MP15 signal name GND STM32MP157 pad name

W13 LGA_W13 SDMMC1_CMD PD2 Alternate functions

AF2: TIM3_ETR AF4: I2C5_SMBA AF6: UART4_RX AF8: UART5_RX AF12: SDMMC1_CMD AF13: DCMI_D11 Additional functions

PWR_ONLP W14 LGA_W14 PWR_ON PWR_ON

W15 LGA_W15 SDMMC1_CLK PC12 W16 LGA_W16 GND

W17 LGA_W17 ETH1_RXD2 PH6

AF0: TRACECLK AF1: MCO2 AF2: SAI4_D3 AF6: SPI3_MOSI/I2S3_ SDO AF7: USART3_CK AF8: UART5_TX AF10: SAI4_SD_B AF12: SDMMC1_CK AF13: DCMI_D9

AF2: TIM12_CH1 AF4: I2C2_SMBA AF5: SPI5_SCK AF11: ETH1_GMII_ RXD2/ETH1_MII_ RXD2/ETH1_RGMII_RXD2 Comments CPU core supply enable output. Internally connected to the PMIC. Leave this pin unconnected unless otherwise noted. Power group

VDD

VDD

VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 5 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments W18 LGA_W18 ETH1_TXD2 PC2 W19 LGA_W19 ETH1_RXD3 PH7 W20 LGA_W20 ETH1_TXD3 PE2 W21 Y1 LGA_W21 LGA_Y1 JTCK-SWCLK JTCK-SWCLK BOOT1 BOOT1

AF12: MDIOS_MDIO AF13: DCMI_D8 AF3: DFSDM1_CKIN1 AF5: SPI2_MISO/I2S2_ SDI AF6: DFSDM1_CKOUT AF11: ETH1_GMII_ TXD2/ETH1_MII_ TXD2/ETH1_RGMII_TXD2 AF13: DCMI_PIXCLK AF4: I2C3_SCL AF5: SPI5_MISO AF11: ETH1_GMII_ RXD3/ETH1_MII_ RXD3/ETH1_RGMII_RXD3 AF12: MDIOS_MDC AF13: DCMI_D9 AF0: TRACECLK AF2: SAI1_CK1 AF4: I2C4_SCL AF5: SPI4_SCK AF6: SAI1_MCLK_A AF9: QUADSPI_BK1_IO2 AF11: ETH1_GMII_ TXD3/ETH1_MII_ TXD3/ETH1_RGMII_TXD3 AF12: FMC_A23

ADC1_INP12 ADC1_INN11

VDD VDD VDD

VDD 100K pull-up resistor. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 6 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Y2 LGA_Y2 SDMMC2_D5 PA9 Y3 LGA_Y3 LTDC_B1 PG12 Y4 LGA_Y4 I2S2_MCK PC6 Power group Comments Additional functions

VDD VDD VDD Alternate functions AF1: TIM1_CH2 AF4: I2C3_SMBA AF5: SPI2_SCK/I2S2_CK AF7: USART1_TX AF8: SDMMC2_CDIR AF10: SDMMC2_D5 AF13: DCMI_D0 AF14: LCD_R5 AF1: LPTIM1_IN1 AF5: SPI6_MISO AF6: SAI4_CK2 AF7: USART6_ RTS/USART6_DE AF8: SPDIFRX_IN2 AF9: LCD_B4 AF10: SAI4_SCK_A AF11: ETH1_PHY_INTN AF12: FMC_NE4 AF14: LCD_B1 AF0: HDP1 AF2: TIM3_CH1 AF3: TIM8_CH1 AF4: DFSDM1_CKIN3 AF5: I2S2_MCK AF7: USART6_TX AF8: SDMMC1_D0DIR AF9: SDMMC2_D0DIR AF10: SDMMC2_D6 AF11: DSI_TE AF12: SDMMC1_D6 AF13: DCMI_D0 AF14: LCD_HSYNC C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Y5 LGA_Y5 LTDC_G0 PB1 Y6 LGA_Y6 LTDC_G1 PE6 Y7 Y8 Y9 LGA_Y7 I2C2_SCL PH4 LGA_Y8 I2C2_SDA PH5 LGA_Y9 SPI4_NSS PE11 Alternate functions AF1: TIM1_CH3N AF2: TIM3_CH4 AF3: TIM8_CH3N AF6: DFSDM1_DATIN1 AF9: LCD_R6 AF11: ETH1_GMII_ RXD3/ETH1_MII_ RXD3/ETH1_RGMII_RXD3 AF12: MDIOS_MDC AF14: LCD_G0 AF0: TRACED2 AF1: TIM1_BKIN2 AF2: SAI1_D1 AF4: TIM15_CH2 AF5: SPI4_MOSI AF6: SAI1_SD_A AF7: SDMMC2_D0 AF8: SDMMC1_D2 AF10: SAI2_MCLK_B AF12: FMC_A22 AF13: DCMI_D7 AF14: LCD_G1 AF4: I2C2_SCL AF9: LCD_G5 AF14: LCD_G4 AF4: I2C2_SDA AF5: SPI5_NSS AF12: SAI4_SD_B AF1: TIM1_CH2 AF3: DFSDM1_CKIN4 AF5: SPI4_NSS Power group Comments Additional functions ADC1_INP5 ADC2_INP5 VDD VDD VDD VDD VDD

2.2K pull-up on module connected to VDD. 2.2K pull-up on module connected to VDD. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments Y10 Y11 LGA_Y10 LGA_Y11 GND VBUS_OTG

Y12 LGA_Y12 LTDC_R4 PA5 Y13 LGA_Y13 I2C6_SCL PZ0 Y14 LGA_Y14 I2C6_SDA PZ3 Y15 LGA_Y15 VBUS_SW

AF7: USART6_CK AF10: SAI2_SD_B AF12: FMC_AD8/FMC_D8 AF13: DCMI_D4 AF14: LCD_G3

AF1: TIM2_CH1/TIM2_ ETR AF3: TIM8_CH1N AF4: SAI4_CK1 AF5: SPI1_SCK/I2S1_CK AF8: SPI6_SCK AF12: SAI4_MCLK_A AF14: LCD_R4 AF2: I2C6_SCL AF3: I2C2_SCL AF5: SPI1_SCK/I2S1_CK AF7: USART1_CK AF8: SPI6_SCK AF2: I2C6_SDA AF3: I2C2_SDA AF4: I2C5_SDA AF5: SPI1_NSS/I2S1_WS AF6: I2C4_SDA AF7: USART1_ CTS/USART1_NSS AF8: SPI6_NSS

ADC1_INP19 ADC1_INN18 ADC2_INP19 ADC2_INN18 DAC_OUT2

Output power line.

VDD VDD VDD

Output power line. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 6 9 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 7 0 LGA pad Y16 ConnectCore MP15 pad LGA_Y16 ConnectCore MP15 signal name VBUS_SW STM32MP157 pad name

Y17 LGA_Y17 LTDC_R1 PH3 Y18 Y19 LGA_Y18 NC LGA_Y19 PA14

PA14 Y20 LGA_Y20 LTDC_R7 PE15 Alternate functions

AF3: DFSDM1_CKIN4 AF9: QUADSPI_BK2_IO1 AF10: SAI2_MCLK_B AF11: ETH1_GMII_ COL/ETH1_MII_COL AF14: LCD_R1

AF0: DBTRGO AF1: DBTRGI AF2: MCO2 AF0: HDP3 AF1: TIM1_BKIN AF4: TIM15_BKIN AF7: USART2_ CTS/USART2_NSS AF8: UART8_CTS AF10: FMC_NCE2 AF12: FMC_AD12/FMC_ D12 AF14: LCD_R7 Y21 AA1 LGA_Y21 JTDO-

TRACESWO JTDO-

TRACESWO

LGA_AA1 GND

AA2 LGA_AA2 SDMMC2_D0 PB14

AF1: TIM1_CH2N AF2: TIM12_CH1 AF3: TIM8_CH2N AF4: USART1_TX AF5: SPI2_MISO/I2S2_ Additional functions

Power group Comments

Output power line.

VDD

VDD VDD

VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments AA3 LGA_AA3 SDMMC2_CLK PE3 AA4 LGA_AA4 SDMMC2_D2 PB3 AA5 LGA_AA5 SDMMC2_D3 PB4

SDI AF6: DFSDM1_DATIN2 AF7: USART3_ RTS/USART3_DE AF9: SDMMC2_D0 AF0: TRACED0 AF4: TIM15_BKIN AF6: SAI1_SD_B AF9: SDMMC2_CK AF12: FMC_A19 AF0: TRACED9 AF1: TIM2_CH2 AF4: SAI4_CK1 AF5: SPI1_SCK/I2S1_CK AF6: SPI3_SCK/I2S3_CK AF8: SPI6_SCK AF9: SDMMC2_D2 AF12: SAI4_MCLK_A AF13: UART7_RX AF0: TRACED8 AF1: TIM16_BKIN AF2: TIM3_CH1 AF4: SAI4_CK2 AF5: SPI1_MISO/I2S1_ SDI AF6: SPI3_MISO/I2S3_ SDI AF7: SPI2_NSS/I2S2_WS AF8: SPI6_MISO AF9: SDMMC2_D3 AF12: SAI4_SCK_A AF13: UART7_TX VDD VDD VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 7 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Power group Comments Additional functions

LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name AA6 LGA_AA6 UART4_TX PG11 AA7 LGA_AA7 UART4_RX PB2 Alternate functions AF0: TRACED11 AF4: USART1_TX AF6: UART4_TX AF8: SPDIFRX_IN1 AF11: ETH1_GMII_TX_ EN/ETH1_MII_TX_ EN/ETH1_RGMII_TX_ CTL/ETH1_RMII_TX_EN AF13: DCMI_D3 AF14: LCD_B3 AF0: TRACED4 AF1: RTC_OUT2 AF2: SAI1_D1 AF3: DFSDM1_CKIN1 AF4: USART1_RX AF5: I2S_CKIN AF6: SAI1_SD_A AF7: SPI3_MOSI/I2S3_ SDO AF8: UART4_RX AF9: QUADSPI_CLK AA8 AA9 LGA_AA8 USB2_D_P USB_DP2 LGA_AA9 USB2_D_N USB_DM2 AA10 LGA_AA10 GND

AA11 LGA_AA11 OTG_VBUS OTG_VBUS

AA12 LGA_AA12 I2S2_SDI PI2 AF3: TIM8_CH4 AF5: SPI2_MISO/I2S2_

USBH_HS_DP2 OTG_HS_DP USBH_HS_DM2 OTG_HS_DM

OTG_FS_VBUS OTG_HS_VBUS VDD VDD

VDD Input power line. C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 7 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name Alternate functions Additional functions Power group Comments AA13 LGA_AA13 USB_OTG_ID PA10 AA14 LGA_AA14 I2S2_SDO PI3 AA15 AA16 AA17 AA18 LGA_AA15 LGA_AA16 LGA_AA17 LGA_AA18 BOOT2 BOOT2 JTMS-SWDIO JTMS-SWDIO USB1_D_P USB1_D_N USB_DP1 USB_DM1 AA19 LGA_AA19 ETH1_MDC PC1 SDI AF13: DCMI_D9 AF14: LCD_G7 AF1: TIM1_CH3 AF5: SPI3_NSS/I2S3_WS AF7: USART1_RX AF11: MDIOS_MDIO AF12: SAI4_FS_B AF13: DCMI_D1 AF14: LCD_B1 AF3: TIM8_ETR AF5: SPI2_MOSI/I2S2_ SDO AF13: DCMI_D10

AF0: TRACED0 AF2: SAI1_D1 AF3: DFSDM1_DATIN0 AF4: DFSDM1_CKIN4 AF5: SPI2_MOSI/I2S2_ SDO AF6: SAI1_SD_A AF9: SDMMC2_CK AF11: ETH1_MDC AF12: MDIOS_MDC OTG_FS_ID OTG_HS_ID

USBH_HS_DP1 USBH_HS_DM1 ADC1_INP11 ADC1_INN10 ADC2_INP11 ADC2_INN10 TAMP_IN3 WKUP6

VDD

VDD C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 7 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP15 pad ConnectCore MP15 signal name STM32MP157 pad name AA20 LGA_AA20 ETH1_MDIO PA2 AA21 LGA_AA21 GND

Alternate functions AF1: TIM2_CH3 AF2: TIM5_CH3 AF3: LPTIM4_OUT AF4: TIM15_CH1 AF7: USART2_TX AF8: SAI2_SCK_B AF10: SDMMC2_D0DIR AF11: ETH1_MDIO AF12: MDIOS_MDIO AF14: LCD_R1

Additional functions ADC1_INP14 WKUP2

Power group Comments VDD

C o n n e c t C o r e M P 1 5 S y s t e m

o n

M o d u l e 7 4 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Module specifications External signals and pin multiplexing Module specifications The following sections describe the specifications for the ConnectCore MP15 SOM. Mechanical specifications Environmental specifications Socket options 76 77 78 ConnectCore MP15 System-on-Module 75 Module specifications Mechanical specifications Mechanical specifications This section provides mechanical dimensions and host PCB footprint guidance for the Digi SMTplus form factor of the ConnectCore MP15 module. Host PCB footprint and cutout Note Host PCBs must have a cutout to accommodate the components on the bottom side of the module. Digi SMTplus LGA mounting ConnectCore MP15 System-on-Module 76 Module specifications Environmental specifications Digi SMTplus Castellated Edge Via mounting Label The MAC address and serial number of the SOM are encoded in the data matrix on the SOM label. Weight The weight of the ConnectCore MP15 module (with Wi-Fi/Bluetooth networking and shield) is 6.60 g. The weight of the non-wireless ConnectCore MP15 module variant is 6.35 g. Note See the ConnectCore MP15 product page for mechanical design documents, drawings, and other resources. Environmental specifications Operating temperature: -40 to 85 C. CAUTION! Your final product may require additional thermal management such as passive

(heatsink/spreader) or active (airflow) cooling to achieve the maximum operating temperature without exceeding the processor junction temp limit. ConnectCore MP15 System-on-Module 77 Module specifications Socket options Socket options For testing, prototyping, and other primarily development-related purposes, Digi International and E-

tec Interconnect AG have developed sockets allowing the easy insertion and removal of modules in a carrier board design. All drawings, user instructions, schematics and PCB footprints are posted on the ConnectCore MP15 technical support website. Note The ConnectCore MP1 Development Board (Digi P/N CC-WMP157-KIT) has been designed to support a RF-LPF246-129M-21AAEW55L-CCMP1 socket, and can be used as a reference design. All sockets are sold and built by E-tec Interconnect AG. The table below provides an overview of the available part numbers. Socket model ConnectCore MP15 RF-LPF246-129M-21AAEW55L-CCMP1 E-tec part number Note Please direct all socket-related purchase inquiries to E-tec Interconnect AG (info@e-tec.com). ConnectCore MP15 System-on-Module 78 Regulatory information and certifications Note The ConnectCore MP15 module complies with Part 15 of the United States FCC rules and regulations. United States FCC Europe and UK Canada (IC) Japan 80 84 87 89 ConnectCore MP15 System-on-Module 79 Regulatory information and certifications United States FCC United States FCC The ConnectCore MP15 module complies with Part 15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC Certification, the OEM must comply with the following regulations:

The system integrator must ensure that the text on top side of the module is placed on the outside of the final product. The ConnectCore MP15 module may only be used with approved antennas. (See FCC-approved antennas.) Labeling requirements WARNING! The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. Required FCC Label for OEM products containing the ConnectCore MP15 module. Contains FCC ID: MCQ-CCMP1 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Maximum power and frequency specifications (FCC) Peak antenna gain 2.5 dBi RF band 2.4 GHz Channel bandwidth 1 Technology BT + EDR Bluetooth LE WLAN 5 GHz 4.6 dBi WLAN 2 20 40 20 40 Channel number (Center frequency, MHz) 79 non-overlapping channels: 0 (2400) to 78

(2480) 40 non-overlapping channels: 0 (2402) to 39

(2480) 1(2412), 2(2417), 3(2422), 4(2427), 5(2432), 6

(2437), 7(2442), 8(2447), 9 (2452), 10(2457), 11

(2462) 3(2422), 4(2427), 5(2432), 6(2437), 7(2442), 8

(2447), 9(2452) 36(5180), 40(5200), 44(5220), 48(5240), 52

(5260), 56(5280), 60(5300), 64 (5320), 100(5500), 104(5520), 108(5540), 112(5560), 116(5580), 120

(5600), 124(5620), 128(5640), 132(5660), 136

(5680), 140(5700), 149 (5745), 153(5765), 157

(5785), 161(5805), 165(5825) 38(5190), 46(5230), 54(5270), 62(5310), 102

(5510), 110(5550), 118(5590), 126(5630), 134 ConnectCore MP15 System-on-Module 80 Regulatory information and certifications United States FCC RF band Peak antenna gain Technology Channel bandwidth 80 Channel number (Center frequency, MHz)

(5670), 151(5755), 159(5795) 42(5210), 58(5290), 106(5530), 122(5610), 155

(5775) FCC notices IMPORTANT: The ConnectCore MP15 module has been certified by the FCC for use with other products without any further certification (as per FCC section 2.1091). Modifications not expressly approved by Digi could void the user's authority to operate the equipment. IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section 15.107

& 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules. IMPORTANT: The ConnectCore MP15 module has been certified for remote and base radio applications. If the module will be used for portable applications, the device must undergo SAR testing. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Re-orient or relocate the receiving antenna, Increase the separation between the equipment and receiver, Connect equipment and receiver to outlets on different circuits, or Consult the dealer or an experienced radio/TV technician for help. IMPORTANT: This module has been tested and found to comply with the following requirements for Modular Approval. Part 15.247 - Operation within the bands 902-928 MHz, 2400-2483.5 MHz, and 5725-5850 MHz. Part 15.407 General technical requirements. FCC-approved antennas The ConnectCore MP15 module can be installed utilizing antennas and cables constructed with non-

standard connectors (RPSMA, RPTNC, and so on). The modules are FCC approved for fixed base station and mobile applications for the channels indicated in the tables below. If the antenna is mounted at least 20 cm (8 in) from nearby persons, the application is considered a mobile application. Antennas not listed in the table must be tested to comply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247 (Emissions). The following table shows the antenna that was used to certify the ConnectCore MP15 wireless module. This antenna can be replaced by others, however further certification testing is required. The number of tests to be carried out can be decreased by using an antenna of the same type, i.e. dualband omnidirectional dipole, showing lower peak gain. In such case, only a spot check may be required by the certification laboratories to keep current certifications valid according to FCC regulations. If replacing by an antenna with higher gain, complete radiated tests according to FCC regulations are required by the certification laboratories. ConnectCore MP15 System-on-Module 81 Regulatory information and certifications United States FCC Antenna used to certify the ConnectCore MP15 wireless module Antenna Type Dipole Supplier Linx Technologies Inc. Antenna part no. ANT-DB1-RAF-RPS Dipole KYOCERA X9001091-W3DRMB Dipole TAOGLAS GW.48.A151 PCB ETHERTRONICS 1001932 Freq.

(MHz) 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

Peak antenna gain (dBi) 2.5 Directional gain (dBi) 5.51 4.6 4.6 4.6 4.6 1.8 4.0 4.0 4.0 4.0 3.42 4.56 4.56 4.56 4.56 2.5 5 5 7.61 7.61 7.61 7.61

6.43 7.57 7.57 7.57 7.57 5.51 8.01 8.01 ConnectCore MP15 System-on-Module 82 Regulatory information and certifications United States FCC Antenna Type Supplier Antenna part no. PCB YAGEO ANTX100P001B24553 PCB KYOCERA W3P35x8W04-

U100D3B0A PCB TAOGLAS FXP830.07.0100C *

PCB TAOGLAS FXP831.07.0100C Freq.

(MHz) 5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

Peak antenna gain (dBi) Directional gain (dBi) 5 5 4.6 4.9 3.9 5.1 5.1 2.3 5 5 5 5 3.32 4.7 4.7 4.7 4.7 3 8.01 8.01 7.61 7.91 6.91 8.11 8.11

6.33 7.71 7.71 7.71 7.71 6.01 ConnectCore MP15 System-on-Module 83 Regulatory information and certifications Europe and UK Antenna Type Supplier Antenna part no. Freq.

(MHz) 2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 Peak antenna gain (dBi) Directional gain (dBi) 5.5 5.5 5.5 5.5 8.51 8.51 8.51 8.51

* Antenna gain in free space Note If using the RF module in a portable application (for example - if the module is used in a hand-

held device and the antenna is less than 20 cm (8 in) from the human body when the device is in operation): The integrator is responsible for passing additional SAR (Specific Absorption Rate) testing based on FCC rules 2.1091 and FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, OET Bulletin and Supplement C. The testing results will be submitted to the FCC for approval prior to selling the integrated unit. The required SAR testing measures emissions from the module and how they affect the person. RF exposure CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm (8 in) or more should be maintained between the antenna of this device and persons during device operation. To ensure compliance, operations at closer than this distance are not recommended. The antenna used for this transmitter must not be co-located in conjunction with any other antenna or transmitter. The preceding statement must be included as a CAUTION statement in OEM product manuals in order to alert users of FCC RF Exposure compliance. Operating frequency n 802.11 b/g/n: 2412-2462 MHz n 802.11 a/n/ac : 5150-5250 MHz; 5250-5350 MHz; 5470-5725MHz; 5725-5850 MHz n Bluetooth : 2402-2480 MHz Europe and UK n 2.412 to 2.472 GHz; 13 channels n 5.180 to 5.320 GHz; 8 channels n 5.500 to 5.700 GHz, 8 channels (excludes 5.600 to 5.640 GHz) ConnectCore MP15 System-on-Module 84 Regulatory information and certifications Europe and UK CE mark The ConnectCore MP15 module is certified for use in several European countries. For information, visit www.digi.com/resources/certifications. If the ConnectCore MP15 module is incorporated into a product, the manufacturer must ensure compliance of the final product with articles 3.1a and 3.1b of the RE Directive (Radio Equipment Directive). A Declaration of Conformity must be issued for each of these standards and kept on file as described in the RE Directive (Radio Equipment Directive). Furthermore, the manufacturer must maintain a copy of the ConnectCore MP15 module user manual documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. CE and UKCA OEM labeling requirements The CE and UKCA markings must be clearly visible and legible when you affix it to the product. If this is not possible, you must attach these marks to the packaging (if any) or accompanying documents. CE labeling requirements The CE marking must be affixed to a visible location on the OEM product. The following figure shows CE labeling requirements. The CE mark shall consist of the initials CE taking the following form:

n If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be respected. n The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus. n The CE marking must be affixed visibly, legibly, and indelibly. ConnectCore MP15 System-on-Module 85 Regulatory information and certifications Europe and UK UK Conformity Assessed (UKCA) labeling requirements See https://www.gov.uk/guidance/using-the-ukca-marking for further details. You must make sure that:

n if you reduce or enlarge the size of your marking, the letters forming the UKCA marking must be in proportion to the version set out below n the UKCA marking is at least 5 mm in height unless a different minimum dimension is specified in the relevant legislation n the UKCA marking is easily visible, legible (from 1 January 2023 it must be permanently attached) n the UKCA marking can take different forms (for example, the colour does not have to be solid), as long as it remains visible, legible and maintains the required proportions. Important note Digi customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Refer to the radio regulatory agency in the desired countries of operation for more information. Declarations of Conformity Digi has issued Declarations of Conformity for the ConnectCore MP15 module concerning emissions, EMC, and safety. For more information, see http://www.digi.com/resources/certifications. Important note Digi customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Refer to the radio regulatory agency in the desired countries of operation for more information. Approved antennas The same antennas have been approved for Europe as stated in the FCC table for use with the ConnectCore MP15 module. ConnectCore MP15 System-on-Module 86 Regulatory information and certifications Canada (IC) Country list Note This device is restricted to indoor use only when operating in the 5150-5350MHz frequency range within all member states. Transmitter Frequency(MHz) Maximum Output Power 2402 ~ 2480 15.86 dBm Radio Type / Description Bluetooth BR+EDR Low Energy WLAN 2.4G 802.11b 802.11g 802.11n 20 802.11n 40 WLAN 5G 802.11a 2402 ~ 2480 2412 ~ 2472 2412 ~ 2472 2412 ~ 2472 2422 ~ 2462 5150 ~ 5350 5470 ~ 5725 5725 ~ 5850 802.11n_20M 802.11ac_20M 5150 ~ 5350 5470 ~ 5725 5725 ~ 5850 802.11n_40M 802.11ac_40M 5150 ~ 5350 80211ac_80M 5470 ~ 5725 5725 ~ 5850 5150 ~ 5350 5470 ~ 5725 5725 ~ 5850 Canada (IC) IC: 1846A-CCMP1 6.88 dBm 19.24 dBm 19.31 dBm 19.54 dBm 19.45 dBm 22.16 dBm 21.99 dBm 13.17 dBm 22.22 dBm 22.00 dBm 13.16 dBm 22.55 dBm 21.82 dBm 13.28 dBm 21.52 dBm 20.90 dBm 13.15 dBm ConnectCore MP15 System-on-Module 87 Regulatory information and certifications Canada (IC) PMN: ConnectCore MP15 HVIN: 55002119-XX Canadian Notice This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. Avis Canadien Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1. Lappareil ne doit pas produire de brouillage;

2. Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Labeling requirements Labeling requirements for Industry Canada are similar to those of the FCC. Required End Product Labeling Any device incorporating this module must include an external, visible, permanent marking or label which states:

Contains IC : 1846A-CCMP1 Obligation d'tiquetage du produit final:

Tout dispositif intgrant ce module doit comporter un externe, visible, marquage permanent ou une tiquette qui dit:

Contient IC : 1846A-CCMP1 Transmitters with detachable antennas This radio transmitter (IC: 1846A-CCMP1) has been approved by Industry Canada to operate with the antenna types listed in the table above with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio (IC: 1846A-CCMP1) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal et l'impdance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the ConnectCore MP15 System-on-Module 88 Regulatory information and certifications Japan equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. The ConnectCore MP15 module is for professional (OEM) installation only. Le module ConnectCore MP15 doit imprativement tre install par un professionnel (OEM). RF exposure To satisfy Industry Canada RF exposure requirements, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during device operation. Pour satisfaire aux exigences dIndustrie Canada concernant lexposition RF, une distance gale ou suprieure 20cm doit tre respecte entre les antennes de ce produit et les personnes se trouvant proximit. The preceding statement must be included as a CAUTION statement in OEM product manuals in order to alert users of Industry Canada RF Exposure compliance. Cette information doit tre incluse dans le manuel du produit OEM afin dalerter les utilisateurs sur la ncessit de respecter lexposition RF dIndustrie Canada. Approved antennas The same antennas have been approved for Canada as stated in the FCC table for use with the ConnectCore MP15 module. Japan 5GHz This device has been granted a designation number by Ministry of Internal Affairs and Communications according to:

Ordinance concerning Technical Regulations Conformity Certification etc. of Specified Radio Equipment ( ). n Article 2, Paragraph 1, Item 19, 19-3, 19-3-2 Category: WW, XW, YW n Model/Name of equipment: ConnectCore MP15 n Radio label marking:

l R: 210-207701 This device should not be modified (otherwise the granted designation number will be invalid). n 2.412 to 2.472 GHz; 13 channels n 5.180 to 5.320 GHz; 8 channels n 5.500 to 5.700 GHz; 11 channels ConnectCore MP15 System-on-Module 89 Regulatory information and certifications Japan Approval Label (MIC Marking) Label text Note Due to space constraints, the ConnectCore MP15 module label doesnt support radio marking for Japan. If space allows, end product label should support radio marking for Japan. If not, radio marking shall be documented in the user manual. Note The warning Indoor only(5GHz) must go on the end product or E Label (Display). Master station: Indoor only

Slave station: The transmission of radio equipment is indoors use only (Except when communicating with 5.2GHz high power base stations or relay stations)

: 5.2GHz If the device is too small it can be displayed on the user manual and on the packaging or container. ConnectCore MP15 System-on-Module 90

 

 

ConnectCore MP13 System-on-module Hardware Reference Manual Revision history90002551 Revision 1P Date March 2023 Description Initial draft. 2P A May 2023 October 2023 Changed VSYS minimum voltage; added note regarding data matrix on SOMlabel. Added certifications. Trademarks and copyright Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United States and other countries worldwide. All other trademarks mentioned in this document are the property of their respective owners. 2023 Digi International Inc. All rights reserved. Disclaimers Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document as is, without warranty of any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes in this manual or in the product(s) and/or the program(s) described in this manual at any time. Warranty To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms Customer support Gather support information: Before contacting Digi technical support for help, gather the following information:

Product name and model Product serial number (s) Firmware version Operating system/browser (if applicable) Logs (from time of reported issue) Trace (if possible) Description of issue ConnectCore MP13 System-on-Module 2 Steps to reproduce Contact Digi technical support: Digi offers multiple technical support plans and service packages. Contact us at +1 952.912.3444 or visit us at www.digi.com/support. Feedback To provide feedback on this document, email your comments to techcomm@digi.com Include the document title and part number (ConnectCore MP13 System-on-Module, 90002551 A) in the subject line of your email. ConnectCore MP13 System-on-Module 3 Contents ConnectCore MP13 module STMicroelectronics STM32MP13x application processor About the ConnectCore MP13 Features and functionality Safety instructions Block diagrams Power interfaces System-on-module power architecture Reference power diagram Electrical characteristics Bootstrap Wireless interfaces WLAN IEEE 802.11a/b/g/n/ac RF channels Transmit power Antenna ports Bluetooth Module pinout External signals and pin multiplexing Castellated pad signals and multiplexing LGA pad signals and multiplexing Module specifications Mechanical specifications Host PCB footprint and cutout Label Environmental specifications Socket options Regulatory information and certifications United States FCC Labeling requirements Maximum power and frequency specifications (FCC) FCC notices FCC-approved antennas ConnectCore MP13 System-on-Module 6 7 7 8 9 10 10 11 11 13 13 13 15 18 18 18 19 21 35 74 74 74 75 75 77 77 77 78 78 4 RF exposure Operating frequency Europe and UK CE mark CE and UKCA OEM labeling requirements Declarations of Conformity Approved antennas Canada (IC) Canadian Notice Labeling requirements Transmitters with detachable antennas RF exposure Approved antennas Japan Approval Label (MIC Marking) ConnectCore MP13 System-on-Module 81 81 81 82 82 83 83 84 85 85 85 86 86 86 87 5 About the ConnectCore MP13 Features and functionality About the ConnectCore MP13 The Digi ConnectCore MP13 System-on-Module (SOM) platform is a highly integrated, cost-effective, connected, secure embedded solution, built on the STM32MP13x MPU family. It integrates memory, power management, the Digi Microcontroller Assist, pre-certified wireless connectivity and advanced Digi TrustFence device security with a complete, open-source Linux software platform based on the Yocto Project. Features and functionality The ConnectCore MP13 system-on-module is based on the STM32MP133C processor from STMicroelectronics. This processor offers a number of interfaces, most of them multiplexed and not available simultaneously. The module has the following features:

n STM32MP133C ARM Cortex-A7:

l Cortex-A7 operating at up to 650 MHz. l 32 KB L1 instruction cache. l 32 KB L1 data cache. l 128 KB level 2 unified coherent cache. n Up to 256 MB, 16-bit DDR3 memory. n Up to 256 MB, 8-bit SLC NAND flash memory. n STPMIC1D Power Management IC (PMIC):

l x4 adjustable buck SMPS converter. l x1 boost SMPS. l x1 USB OTG compliant power switch. l x1 general purpose power switch. l x4 adjustable general purpose LDOs. l x1 DDR3/general purpose LDO. l x1 USB PHY LDO. n IEEE 802.11 a/b/g/n/ac WLAN interface. n Bluetooth version 5.0. n Debug interfaces:

l System JTAG controller for STM32MP135F. n STM32MP133C interfaces:

l x5 I2C. l x4 UART. l x4 USART. l x5 SPI, four I2Ss full-duplex master/slave. l x2 SAI. l x1 SPDIF Rx. ConnectCore MP13 System-on-Module 6 About the ConnectCore MP13 Safety instructions l x2 SDMMC. l x1 USB OTG high-speed controller. l x1 USB high-speed Host with two ports, two high-speed PHYs. The second high-speed PHY can be shared between the USB high-speed Host and the USB OTG high-speed. l x2 FDCAN. l x2 Gigabit Ethernet. l x1 Flexible memory control (FMC) interface. l x1 Quad-SPI Flash memory interface. l x2 ADCs with 12-bit max resolution l x1 digital filter for sigma delta modulator (DFSDM) with 4 channels and 2 filters. Safety instructions n The ConnectCore MP13 module cannot be guaranteed operation due to the radio link and so should not be used for interlocks in safety critical devices such as machines or automotive applications. n The ConnectCore MP13 module has not been approved for use in (this list is not exhaustive):

l nuclear applications l explosive or flammable atmospheres n There are no user serviceable components inside the ConnectCore MP13 module. Do not modify the ConnectCore MP13 in any way. Modifications may exclude the module from any warranty and can cause the ConnectCore MP13 to operate outside of regulatory compliance for a given country, leading to the possible illegal operation of the radio. n Use industry standard ESD protection when handling the ConnectCore MP13 module. n Take care while handling to avoid electrical damage to the PCB and components. n Do not expose ConnectCore MP13 module to water or moisture. n Use this product with the antennas specified in the ConnectCore MP13 module user guides. Block diagrams The figures below show block diagrams of the ConnectCore MP13 module and of the STMicroelectronics STM32MP13x application processor. ConnectCore MP13 System-on-Module 7 About the ConnectCore MP13 Block diagrams ConnectCore MP13 module ConnectCore MP13 System-on-Module 8 About the ConnectCore MP13 Block diagrams STMicroelectronics STM32MP13x application processor ConnectCore MP13 System-on-Module 9 About the ConnectCore MP13 Power interfaces Power interfaces System-on-module power architecture The ConnectCore MP13 requires two primary power supply inputs: VSYS and VSYS2, which are the input power supplies to the on-module ST STPMIC1 power management IC (PMIC) that generates all required supply voltages for the module as well as the external interfaces. The following table summarizes the PMIC regulators and switches on the ConnectCore MP13 SOM:

PMIC regulator BUCK1 SOM power rail name

BUCK2 BUCK3 BUCK4 LDO1 LDO2 LDO3*

LDO4 LDO5 LDO6

VDD

2V8 LDO3

VDD_SD 1V8 PWR_USB_SW VBUS_OTG PWR_SW DDR_REF BOOST VBUS_SW

Input power supply VSYS2 VSYS2 VSYS VSYS VSYS VSYS

VSYS VSYS VSYS

VSYS2 VSYS Internally used YES Externally available NO YES YES YES YES NO NO YES NO NO NO NO YES YES NO YES NO NO YES YES NO YES YES YES YES NO NO

* This regulator is not available in initial versions of the module. In addition to the input power supplies of the PMIC, other power domains of the SOM must also be set externally. This allows power management flexibility so you can adapt the input voltage of the different interfaces. The following table lists the input power rails that must be powered externally to the SOM together with the devices/power domains they power:

Input rail VCC_ LICELL OTG_ VBUS Internally connected to STM32MP1 CPU, VBAT Support for RTC, backup registers, RAM retention and backup Description SRAM on the CPU. STM32MP1 CPU, OTG_VBUS ConnectCore MP13 System-on-Module 10 About the ConnectCore MP13 Power interfaces Reference power diagram The following diagram represents the power architecture of the ConnectCore MP13 module in a typicalapplication:

Electrical characteristics Input power rails The following table lists the electrical specifications of all input power rails for the ConnectCore MP13:

Device SOM power rail PMIC VSYS VSYS2 CPU VCC_LICELL OTG_VBUS Input voltage (V) Minimum Typical 3.7

Maximum 5.5 2.8 1.4 Vss-0.31

5.5 3.6 6.01 1 Absolute maximum ratings. ConnectCore MP13 System-on-Module 11 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 1 2 Output power rails The following table lists the electrical specifications of all output power rails for the ConnectCore MP13:

SOM power rail VDD Used internally in the SOM YES VDD_SD LDO2_2V8 LDO6_1V8 LDO3 VBUS_OTG VBUS_SW NO NO NO NO NO NO Output voltage Min

Typ 3.3 Max

Accuracy

(%) Min

-4 Max 4 Continuous output current

(mA)1 500 Turn-on time

(us) Typ 235 Max 400 Turn-off time

(ms) Max 1.5 1.7 1.7 0.9 1.8

3.9 3.3 3.3 3.3

-2

-2

-2

-2

2 2 2 2

350 350 150 100 500 1000 160 160 100 200 3000 3000

3 3 3 3 3 3 Note Some of the electrical characteristics may depend on the configuration and operation mode of the different regulators. For a complete description of the electrical characteristics of the different output power rails (PMIC regulators), see the STPMIC1 datasheet. 1 The maximum output current involves both external and internal circuitry. For those regulators that are used internally in the SOM, the current available outside will be lower. A b o u t t h e C o n n e c t C o r e M P 1 3 P o w e r i n t e r f a c e s About the ConnectCore MP13 Bootstrap Bootstrap The ConnectCore MP13 module can be configured to boot from different devices and interfaces as determined by the boot ROM. The configuration of the booting process of the CPU is done through the BOOT pin and OTP bytes. BOOT2 0 BOOT1 0 BOOT0 0 Boot mode UART and USB port 1 0 0 0 1 1 1 1 0 1 1 0 0 1 1 1 0 1 0 1 0 1 Serial NOR Flash eMMC (default SDMMC2) NAND Flash Reserved SD card (default SDMMC1) UART and USB port 2 Serial NAND Flash Wireless interfaces The ConnectCore MP13 System-on-module combines a wireless local area network (WLAN) and Bluetooth dual solution to support IEEE802.11 a/b/g/n/ac WLAN standards and Bluetooth 5, enabling seamless integration of WLAN/Bluetooth and Low Energy technology. Digi also offers a non-wireless variant of the ConnectCore MP13 module. The following sections include specifications for the wireless interfaces available on the ConnectCore MP13 module. WLAN IEEE 802.11a/b/g/n/ac The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the ConnectCore MP13 module. Modulation and data rates The following tables list modulation values for the ConnectCore MP13 module, which supports the following WLAN standards:

Mode 802.11b Modulation & coding Rate DBPSK 1 Mbps DQPSK CCK CCK 2 Mbps 5.5 Mbps 11 Mbps ConnectCore MP13 System-on-Module 13 About the ConnectCore MP13 Wireless interfaces Mode Modulation & coding Rate BPSK-1/2 6 Mbps 802.11ga 802.11n 802.11ac BPSK-3/4 QPSK-1/2 QPSK-3/4 16QAM-1/2 16QAM-3/4 64QAM-2/3 64QAM-3/4 BPSK-1/2 QPSK-1/2 QPSK-3/4 16QAM-1/2 16QAM-3/4 64QAM-2/3 64QAM-3/4 64QAM-5/6 BPSK-1/2 QPSK-1/2 QPSK-3/4 16QAM-1/2 16QAM-3/4 64QAM-2/3 64QAM-3/4 64QAM-5/6 256QAM-3/4 256QAM-5/6 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9 ConnectCore MP13 System-on-Module 14 About the ConnectCore MP13 Wireless interfaces Data rate (Mbps) - Non Short Guard Interval (Non-SGI) 802.11b 802.11ga 802.11n BPSK-

1/2 64QAM-

5/6 BPSK-

1/2 802.11ac 64QAM-

5/6 256QAM-

5/6 Data rate

(Mbps) Modulation HT20 2.4 GHz HT40 5 GHz HT20 HT40 HT80 DBPSK CCK 1 Mbps 1 11 Mbps 11 BPSK-

1/2 6 Mbps 6 64QAM-

3/4 54 Mbps 54 6 54 MCS0 MCS7 6.5 65 MCS0 MCS7 6.5 65 MCS9 13.5 6.5 13.5 135 65 135 13.5 6.5 13.5 29.3 135 65 135 292.5 180 180 390 Data rate (Mbps) - Short Guard Interval (SGI) Mode 802.11b DBPSK CCK 1 Mbps 1 11 Mbps 11 Modulation 2.4 HT20 GHz HT40 5 GHz HT20 HT40 HT80 802.11ga BPSK-

1/2 6 Mbps 6 64QAM-

3/4 54 Mbps 54 6 54 802.11n BPSK-

1/2 64QAM-

5/6 802.11ac BPSK-

1/2 64QAM-

5/6 256QAM-

5/6 MCS0 MCS7 7.2 72.2 MCS0 MCS7 7.2 72.2 15 7.2 15 150 72.2 150 15 7.2 15 32.5 150 72.2 150 325 MCS9 200 200 433.3 RF channels The ConnectCore MP13 module supports the following frequency bands:

RF band 2.4 GHz Ch. BW 20 MHz 40 MHz Ch. spacing 5 MHz Channel number (Center freq. MHz) 1(2412), 2(2417), 3(2422), 4(2427), 5(2432), 6(2437), 7(2442), 8(2447), 9

(2452), 10(2457), 11(2462), 12(2467), 13(2472), 14(2484) 5 MHz 3(2422), 11(2462) ConnectCore MP13 System-on-Module 15 About the ConnectCore MP13 Wireless interfaces RF band Ch. BW Ch. spacing Channel number (Center freq. MHz) 5 GHz 20 MHz 40 MHz 80 MHz 20 MHz 36(5180), 40(5200), 44(5220), 48(5240), 52(5260), 56(5280), 60(5300), 64

(5320), 100(5500), 104(5520), 108(5540), 112(5560), 116(5580), 120

(5600), 124(5620), 128(5640), 132(5660), 136(5680), 140(5700), 144

(5720), 149(5745), 153(5765), 157(5785), 161(5805), 165(5825) 40 MHz 38(5190), 46(5230), 54(5270), 62(5310), 102(5510), 110(5550), 118(5590), 126(5630), 134(5670), 142(5710), 151(5755), 159(5795) 80 MHz 42(5210), 58(5290), 106(5530), 122(5610), 138(5690), 155(5775) Note Dependent upon regulatory bodies. 2.4 GHz 2.4 GHz band channel

1 2 3 4 5 6 7 8 9 10 11 12 13 14 Center frequency (MHz) 2412 2417 2422 2427 2432 2437 2442 2447 2452 2457 2462 2467 2472 2484 EUROPE

(ETSI) No NORTH AMERICA

(FCC) No No No JAPAN 802.11b only ConnectCore MP13 System-on-Module 16 About the ConnectCore MP13 Wireless interfaces Center frequency (MHz) EUROPE (ETSI) 5 GHz 5 GHz band channel #

36 40 44 48 52 56 60 64 100 104 108 112 116 120 124 128 132 136 140 149 153 157 161 165 5180 5200 5220 5240 5260 5280 5300 5320 5500 5520 5540 5560 5580 5600 5620 5640 5660 5680 5700 5745 5765 5785 5805 5825 Indoors Indoors NORTH AMERICA (FCC) JAPAN Indoors / DFS / TPC DFS DFS / TPC Indoors Indoors Indoors / DFS / TPC DFS Indoors / DFS / TPC DFS Indoors / DFS / TPC DFS DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC SRD SRD SRD SRD SRD DFS DFS DFS DFS DFS DFS DFS DFS DFS DFS DFS DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC DFS / TPC No Access No Access No Access No Access No Access Note DFS = Dynamic Frequency Selection TPC = Transmit Power Control SRD = Short Range Devices 25 mW max power ConnectCore MP13 System-on-Module 17 About the ConnectCore MP13 Wireless interfaces Transmit power The following table lists nominal transmit power values for the ConnectCore MP13 module based on Murata LBEE5PK2AE-564 specification. RF band Standard 802.11b Output power (dBm) 17 (1Mbps) - 17 (11Mbps) 2.4 GHz 802.11g 16 (6Mbps) - 16 (54Mbps) 802.11n 802.11a 16 (MCS0) - 14 (MCS7) 13 (6Mbps) - 14 (54Mbps) 802.11n (HT20) 16 (MCS0) - 14 (MCS7) 802.11ac (VHT20) 16 (MCS0) - 13 (MCS8) 802.11n (HT40) 14 (MCS0) - 13 (MCS7) 802.11ac (VHT40) 14 (MCS0) - 11 (MCS9) 802.11ac (VHT80) 13 (MCS0) - 12 (MCS9) 5 GHz Antenna ports The ConnectCore MP13 module has one antenna port on the module via a dedicated U.FL connector. The antenna port supports WLAN and Bluetooth functionality. Bluetooth The ConnectCore MP13 module supports both Bluetooth and Bluetooth Low Energy protocols:

n Bluetooth 5 with all Bluetooth 4.2 optional features. Bluetooth class 1 and class 2 transmitter operation. n Integrated WLAN-Bluetooth coexistence. ConnectCore MP13 System-on-Module 18 Module pinout External signals and pin multiplexing Module pinout The ConnectCore MP13 module has a mixed pad structure. The module provides 245 LGA pins, 76 of them connected to the peripheral castellated pads. The general layout can be found on the following diagram:

White cells: LGA pads Orange cells: castellated pads Note Pad A1 is unconnected. This pad is meant for module-orientation purposes; its shape is square, whereas all other pads are circular. Pad A1 should not be soldered down to a corresponding pad on the carrier board. External signals and pin multiplexing The following tables provide the pinout information of the ConnectCore MP13 module. For additional information related to the signals listed in the table, refer to the STMicroelectronics STM32MP1 technical documentation. ConnectCore MP13 System-on-Module 19 Module pinout External signals and pin multiplexing Note The Digi ConnectCore Smart IOmux tool can dramatically simplify pin configuration and resolution. You can enter the list of interfaces required by your project and use the Smart IOmux graphical interface to mock up configuration options, resulting in full pin assignment and device tree snippets that match your desired functionality. See the Smart IOmux User Guide for more information and download instructions. The microprocessor used on this module, like all CMOS devices, can be driven into a latch-

up condition if any I/O pin is driven outside of its associated power rail. Care must be taken to:

n Never drive an I/O pin beyond its positive rail or below ground. n Never drive an I/O pin from an external power source during the power-on or reset sequences. n Never hot-swap the module or interrupt its ground connection to external circuitry. Latch-up is a condition that can cause excessive current draw and result in excessive heating of the microprocessor or its power supplies. This excessive heating can permanently damage the microprocessor and/or its supporting components. When you use an external supply on the carrier board supporting the ConnectCore MP13 module, make sure this supply is NOT back driving STM32MP1 I/Os while their power rails are not enabled. For example, this can happen when an external 3.3V supply is available on the carrier board and this supply powers components driven by STM32MP1 I/Os. In this case, Digi recommends you enable the external power supply after internal 3.3V is enabled, or add the necessary protection circuitry to avoid back voltage (leakage). ConnectCore MP13 System-on-Module 20 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 1 Castellated pad signals and multiplexing Castellated pad 1 / B1 ConnectCore MP13 pad CPAD1 ConnectCore MP13 signal name VCC_LICELL STM32MP1 pad name VBAT Alternate functions

Additional functions

2 / C1 3 / D1 4 / E1 5 / F1 6 / G1 7 / H1 8 / J1 9 / K1 10 / L1 11 / M1 12 / N1 13 / P1 CPAD2 CPAD3 CPAD4 CPAD5 CPAD6 CPAD7 CPAD8 CPAD9 CPAD10 CPAD11 CPAD12 CPAD13 VSYS NC NC GND VSYS VSYS2 GND VDD NC NC NC

NRST NRST 14 / R1 CPAD14 I2S1_WS PA4

Power group VCC_ LICELL VSYS NC

VSYS VSYS2

VDD

Comments Coin cell supply. Input power line. Input power line. Input power line. Output power line. Reset line of the CPU. Recommendation:

leave this pin floating. AF2: TIM5_ETR AF3: USART2_CK AF4: SAI1_SCK_B AF5: SPI1_NSS/I2S1_ ADC1_INP14 VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 15 / T1 CPAD15 I2S1_CK PC3 16 / U1 CPAD16 SDMMC1_D1 PC9 17 / V1 CPAD17 SDMMC1_CMD PD2 Additional functions Power group Comments ADC1_INP13 ADC1_INN12 TAMP_IN5 VDD

VDD VDD Alternate functions WS AF6: DFSDM1_CKIN1 AF10: ETH1_PPS_OUT AF11: ETH2_PPS_OUT AF12: SAI1_SCK_A AF2: SAI1_CK1 AF3: DFSDM1_CKOUT AF5: SPI1_MISO/I2S1_ SDI AF6: SPI1_SCK/I2S1_CK AF8: UART5_CTS AF10: SAI1_MCLK_A AF11: ETH1_MII_TX_ CLK AF12: ETH2_MII_TX_ CLK AF0: TRACED1 AF2: TIM3_CH4 AF3: TIM8_CH4 AF7: USART3_RTS AF8: UART5_CTS AF9: FDCAN1_TX AF12: SDMMC1_D1 AF14: LCD_B4 AF0: TRACED4 AF2: TIM3_ETR AF4: I2C1_SMBA AF5: SPI3_NSS/I2S3_ WP AF6: SAI2_D1 AF7: USART3_RX AF12: SDMMC1_CMD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad 18 / W1 ConnectCore MP13 pad CPAD18 ConnectCore MP13 signal name PA13 STM32MP1 pad name PA13 19 / Y1 20 / AA2 CPAD19 CPAD20 BOOT1 BOOT1 SDMMC1_D0 PC8 21 / AA3 CPAD21 SDMMC1_CLK PC12 22 / AA4 CPAD22 SDMMC1_D2 PC10 23 / AA5 CPAD23 SDMMC1_D3 PC11 Comments Alternate functions AF0: DBTRGO AF1: DBTRGI AF2: MCO1 AF8: UART4_TX

AF0: TRACED0 AF2: TIM3_CH3 AF3: TIM8_CH3 AF5: SPI3_MISO/I2S3_ SDI AF7: USART6_CK AF8: USART3_CTS AF10: SAI2_FS_B AF11: UART5_ RTS/UART5_DE AF12: SDMMC1_D0 AF14: LCD_G7 AF0: TRACECLK AF8: UART7_TX AF10: SAI2_SD_B AF12: SDMMC1_CK AF14: LCD_DE AF0: TRACED2 AF5: I2C1_SCL AF6: SPI3_SCK/I2S3_CK AF7: USART3_TX AF10: SAI2_MCLK_B AF12: SDMMC1_D2 AF0: TRACED3 AF4: I2C1_SDA Additional functions BOOTFAILN

Power group VDD VDD VDD VDD VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 24 / AA6 CPAD24 UART5_TX PA0 25 / AA7 CPAD25 UART5_RX PF13 26 / AA8 CPAD26 USB2_D_P USB_DP2 27 / AA9 CPAD27 USB2_D_N USB_DM2 28 / AA10 29 / AA11 30 / AA12 CPAD28 CPAD29 CPAD30 GND OTG_VBUS I2S1_SDI

PI7 PA6 Alternate functions AF6: SPI3_MOSI/I2S3_ SDO AF7: USART3_CK AF8: UART5_RX AF10: SAI2_SCK_B AF12: SDMMC1_D3 AF1: TIM2_CH1 AF2: TIM5_CH1 AF3: TIM8_ETR AF4: TIM15_BKIN AF6: SAI1_SD_B AF8: UART5_TX AF11: ETH1_MII_CRS AF12: ETH2_MII_CRS AF1: TIM2_ETR AF2: SAI1_MCLK_B AF6: DFSDM1_DATIN3 AF7: USART2_TX AF8: UART5_RX

AF1: TIM1_BKIN AF2: TIM3_CH1 AF3: TIM8_BKIN AF4: SAI2_CK2 Additional functions Power group Comments ADC1_INP7 ADC1_INN3 ADC2_INP7 ADC2_INN3 ADC1_INP11 ADC1_INN10 ADC2_INP11 ADC2_INN10 USBH_HS_DP2 OTG_HS_DP USBH_HS_DM2 OTG_HS_DM

OTG_HS_VBUS ADC1_INP17 ADC1_INN16 TAMP_IN2 VDD VDD

VDD Input power line. C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 4 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 5 Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 31 / AA13 32 / AA14 CPAD31 CPAD32 USB_OTG_ID I2S1_SDO PA10 PA3 33 / AA15 34 / AA16 35 / AA17 36 / AA18 37 / AA19 CPAD33 CPAD34 CPAD35 CPAD36 CPAD37 BOOT2 BOOT2 JTMS-SWDIO JTMS-SWDIO -

USB1_D_P USB1_D_N USB_DP1 USB_DM1 ETH1_MDC PG2 38 / AA20 CPAD38 ETH1_MDIO PA2 Alternate functions AF5: SPI1_MISO/I2S1_ SDI AF7: USART1_CK AF8: UART4_ RTS/UART4_DE AF9: TIM13_CH1 AF12: SAI2_SCK_A AF1: TIM1_CH3 AF1: TIM2_CH4 AF2: TIM5_CH4 AF3: LPTIM5_OUT AF4: TIM15_CH2 AF5: SPI1_MOSI/I2S1_ SDO AF6: SAI1_FS_B AF7: USART2_RX AF11: ETH1_MII_COL AF12: ETH2_MII_COL

AF1: MCO2 AF3: TIM8_BKIN AF10: SAI2_MCLK_B AF11: ETH1_MDC AF13: DCMIPP_D1 AF1: TIM2_CH3 Additional functions Power group Comments OTG_HS_ID ADC1_INP12 ADC1_INN11 PVD_IN WKUP6

USBH_HS_DP1 USBH_HS_DM1

VDD VDD VDD ADC1_INP1 VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 6 Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 39 / Y21 CPAD39 40 / W21 41 / V21 42 / U21 43 / T21 CPAD40 CPAD41 CPAD42 CPAD43 JTDO-

TRACESWO JTDO-

TRACESWO JTCK-SWCLK JTCK-SWCLK -

JTDI JTRST UART8_TX JTDI JTRST PE4 44 / R21 CPAD44 UART8_RX PE0 Alternate functions AF2: TIM5_CH3 AF3: LPTIM4_OUT AF4: TIM15_CH1 AF7: USART2_TX AF11: ETH1_MDIO

AF1: SPI5_MISO AF2: SAI1_D2 AF3: DFSDM1_DATIN3 AF4: TIM15_CH1N AF5: I2S_CKIN AF6: SAI1_FS_A AF7: UART7_ RTS/UART7_DE AF8: UART8_TX AF9: QUADSPI_BK2_ NCS AF10: FMC_NCE2 AF12: FMC_A25 AF13: DCMIPP_D3 AF14: LCD_G7 AF6: DCMIPP_D12 AF8: UART8_RX AF9: FDCAN2_RX AF11: LCD_B1 AF12: FMC_A11 Additional functions ADC2_INP1 Power group Comments

VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 45 / P21 46 / N21 CPAD45 CPAD46 GND

UART8_RTS PE14 47 / M21 CPAD47 UART8_CTS PG10 48 / L21 CPAD48 ETH1_RXD0 PC4 Additional functions Power group Comments

TAMP_IN6

VDD

VDD ADC1_INP4 ADC2_INP4 VDD Alternate functions AF13: DCMIPP_D1 AF14: LCD_B5

AF1: TIM1_BKIN AF4: SAI1_D4 AF8: UART8_ RTS/UART8_DE AF9: QUADSPI_BK1_ NCS AF10: QUADSPI_BK2_ IO2 AF12: FMC_D11/FMC_ AD11 AF13: DCMIPP_D7 AF14: LCD_G0 AF5: SPI5_SCK AF6: SAI1_SD_B AF8: UART8_CTS AF9: FDCAN1_TX AF10: QUADSPI_BK2_ IO1 AF12: FMC_NE3 AF13: DCMIPP_D2 AF2: TIM3_ETR AF3: DFSDM1_CKIN2 AF4: SAI1_D3 AF5: I2S1_MCK AF8: UART5_ RTS/UART5_DE AF9: SPDIFRX_IN2 AF11: ETH1_MII_ C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Additional functions Power group Comments ADC1_INP16 VDD Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 49 / K21 CPAD49 ETH1_RX_DV PA7 50 / J21 CPAD50 ETH1_RX_ER PI3 51 / H21 CPAD51 ETH1_TXD1 PG14 52 / G21 CPAD52 ETH1_TX_EN PB11 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 8 Alternate functions RXD0/ETH1_RGMII_ RXD0/ETH1_RMII_RXD0 AF12: SAI2_D3 AF1: TIM1_CH1N AF2: TIM3_CH2 AF3: TIM8_CH1N AF4: SAI2_D1 AF5: SPI1_SCK/I2S1_CK AF7: USART1_ CTS/USART1_NSS AF9: TIM14_CH1 AF11: ETH1_MII_RX_ DV/ETH1_RGMII_RX_ CTL/ETH1_RMII_CRS_ DV AF12: SAI2_SD_A AF8: SPDIFRX_IN3 AF11: ETH1_MII_RX_ER

AF1: LPTIM1_ETR AF6: SAI2_D1 AF7: USART6_TX AF10: SAI2_SD_A AF11: ETH1_MII_ TXD1/ETH1_RGMII_ TXD1/ETH1_RMII_TXD1 AF1: TIM2_CH4 AF3: LPTIM1_OUT AF4: I2C5_SMBA AF7: USART3_RX AF11: ETH1_MII_TX_ TAMP_IN4 TAMP_OUT5 WKUP2 VDD VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 53 / F21 CPAD53 ETH1_REF_CLK PD7 54 / E21 CPAD54 ETH1_RXD1 PC5 55 / D21 CPAD55 ETH1_TXD0 PG13 56 / C21 CPAD56 LTDC_CLK PD9 Alternate functions EN/ETH1_RGMII_TX_ CTL/ETH1_RMII_TX_EN AF0: MCO1 AF3: USART2_CK AF4: I2C2_SCL AF5: I2C3_SDA AF9: SPDIFRX_IN0 AF10: ETH1_MII_RX_ CLK/ETH1_RGMII_RX_ CLK/ETH1_RMII_REF_ CLK AF11: QUADSPI_BK1_ IO2 AF12: FMC_NE1 AF3: DFSDM1_DATIN2 AF4: SAI2_D4 AF5: I2S_CKIN AF6: SAI1_D4 AF7: USART2_ CTS/USART2_NSS AF9: SPDIFRX_IN3 AF11: ETH1_MII_ RXD1/ETH1_RGMII_ RXD1/ETH1_RMII_RXD1 AF1: LPTIM1_OUT AF7: USART6_ CTS/USART6_NSS AF11: ETH1_MII_ TXD0/ETH1_RGMII_ TXD0/ETH1_RMII_TXD0 AF0: TRACECLK C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 2 9 Additional functions Power group Comments

VDD ADC1_INP10 ADC2_INP10 VDD ADC2_INP6 ADC2_INN2

VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 57 / B21 CPAD57 LTDC_HSYNC PE1 58 / A20 CPAD58 LTDC_B6 PF9 59 / A19 60 / A18 CPAD59 CPAD60 NC LTDC_B2

PH7 Alternate functions AF3: DFSDM1_DATIN3 AF10: SDMMC2_CDIR AF11: LCD_B5 AF12: FMC_D14/FMC_ AD14 AF13: LCD_CLK AF14: LCD_B0 AF1: LPTIM1_IN2 AF8: UART8_TX AF9: LCD_HSYNC AF11: LCD_R4 AF12: FMC_NBL1 AF13: DCMIPP_D3 AF14: DCMIPP_D12 AF1: TIM17_CH1N AF2: TIM1_CH1 AF3: DFSDM1_CKIN3 AF6: SAI1_D4 AF7: UART7_CTS AF8: UART8_RX AF9: TIM14_CH1 AF10: QUADSPI_BK1_ IO1 AF11: QUADSPI_BK2_ IO3 AF12: FMC_A9 AF14: LCD_B6

AF2: SAI2_FS_B AF5: I2C3_SDA AF6: SPI5_SCK Additional functions Power group Comments

VDD VDD VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 0 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 61 / A17 CPAD61 LTDC_B5 PF10 62 / A16 CPAD62 LTDC_G2 PH13 63 / A15 CPAD63 LTDC_G3 PF3 Alternate functions AF9: QUADSPI_BK2_IO3 AF10: ETH2_MII_TX_ CLK AF11: ETH1_MII_TX_ CLK AF13: QUADSPI_BK1_ IO3 AF14: LCD_B2 AF1: TIM16_BKIN AF2: SAI1_D3 AF3: TIM8_BKIN AF5: SPI5_NSS AF7: USART6_ RTS/USART6_DE AF8: UART7_ RTS/UART7_DE AF9: QUADSPI_CLK AF13: DCMIPP_HSYNC AF14: LCD_B5 AF0: TRACED15 AF2: USART2_CK AF3: TIM8_CH1N AF4: I2C5_SCL AF6: SPI3_SCK/I2S3_CK AF8: UART4_TX AF13: LCD_G3 AF14: LCD_G2 AF3: LPTIM2_IN2 AF4: I2C5_SDA AF5: SPI4_MISO/I2S4_ SDI AF6: SPI3_NSS/I2S3_ C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 1 Additional functions Power group Comments TAMP_IN1 VDD

VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 64 / A14 CPAD64 LTDC_B7 PB6 65 / A13 66 / A12 CPAD65 CPAD66 GND LTDC_B4

PH3 67 / A11 68 / A10 CPAD67 CPAD68 NC LTDC_B3

PG15 Alternate functions WS AF12: FMC_A3 AF14: LCD_G3 AF0: TRACED6 AF1: TIM16_CH1N AF2: TIM4_CH1 AF3: TIM8_CH1 AF4: USART1_TX AF6: SAI1_CK2 AF7: LCD_B6 AF9: QUADSPI_BK1_ NCS AF11: ETH2_MDIO AF12: FMC_NE3 AF13: DCMIPP_D5 AF14: LCD_B7 AF15: HDP6 AF4: I2C3_SCL AF5: SPI5_MOSI AF9: QUADSPI_BK2_IO1 AF10: ETH1_MII_COL AF11: LCD_R5 AF12: ETH2_MII_COL AF13: QUADSPI_BK1_ IO0 AF14: LCD_B4

AF7: USART6_ CTS/USART6_NSS Additional functions Power group Comments

VDD

VDD VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 3 Castellated pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP1 pad name 69 / A9 CPAD69 LTDC_DE PH9 70 / A8 CPAD70 VCC_MCA 71 / A7 CPAD71 72 / A6 CPAD72 SWD_ DIO/MCA_IO7 SWD_ CLK/PWR_IO 73 / A5 CPAD73 MCA_RESET 74 / A4 CPAD74 MCA_VIN_DET

Alternate functions AF8: UART7_CTS AF9: QUADSPI_BK1_IO1 AF10: ETH2_PHY_INTN AF11: LCD_B4 AF13: DCMIPP_D10 AF14: LCD_B3 AF1: TIM1_CH4 AF2: TIM12_CH2 AF5: SPI4_SCK/I2S4_CK AF6: DCMIPP_D13 AF9: LCD_B5 AF11: LCD_DE AF12: FMC_A20 AF13: DCMIPP_D9 AF14: DCMIPP_D8

Additional functions Power group Comments

VDD VCC_ MCA VCC_ MCA VCC_ MCA VCC_ MCA VCC_ MCA Input power line. Input power on/off line of the module

(active low). Pull this line up to VCC_MCA. Input reset line of the module (active low). Pull this line up to VCC_MCA. M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Castellated pad 75 / A3 ConnectCore MP13 pad CPAD75 ConnectCore MP13 signal name MCA_IO4 STM32MP1 pad name

Alternate functions MCA GPIO/ADC Additional functions

76 / A2 CPAD76 MCA_IO0

MCA GPIO/ADC

Comments Power group VCC_ MCA VCC_ MCA C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 4 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad signals and multiplexing LGA pad A2 ConnectCore MP13 pad LGA_A2 ConnectCore MP13 signal name MCA_IO0 STM32MP135 pad name

Alternate functions MCA GPIO/ADC Additional functions

A3 A4 A5 A6 A7 A8 A9 LGA_A3 MCA_IO4 LGA_A4 MCA_VIN_DET LGA_A5 MCA_RESET LGA_A6 LGA_A7 SWD_CLK/PWR_ IO SWD_DIO/MCA_ IO7 LGA_A8 VCC_MCA

LGA_A9 LTDC_DE PH9 A10 LGA_A10 LTDC_B3 PG15 MCA GPIO/ADC

AF1: TIM1_CH4 AF2: TIM12_CH2 AF5: SPI4_ SCK/I2S4_CK AF12: FMC_A20 AF7: USART6_

Comments Input reset line of the module (active low). Pull this line up to VCC_MCA. Input power on/off line of the module (active low). Pull this line up to VCC_ MCA. Input power line. Power group VCC_ MCA VCC_ MCA VCC_ MCA VCC_ MCA VCC_ MCA VCC_ MCA VCC_ MCA VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 5 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name A11 A12 LGA_A11 LGA_A12 NC LTDC_B4

PH3 A13 A14 LGA_A13 LGA_A14 GND LTDC_B7

PB6 A15 LGA_A15 LTDC_G3 PF3 Alternate functions CTS/USART6_NSS AF8: UART7_CTS AF9: QUADSPI_ BK1_IO1 AF10: ETH2_PHY_ INTN

AF4: I2C3_SCL AF5: SPI5_MOSI AF9: QUADSPI_ BK2_IO1 AF10: ETH1_MII_ COL AF12: ETH2_MII_ COL AF13: QUADSPI_ BK1_IO0

AF0: TRACED6 AF1: TIM16_CH1N AF2: TIM4_CH1 AF3: TIM8_CH1 AF4: USART1_TX AF6: SAI1_CK2 AF9: QUADSPI_ BK1_NCS AF11: ETH2_MDIO AF12: FMC_NE3 AF15: HDP6 AF3: LPTIM2_IN2 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 6 Additional functions Power group Comments

VDD VDD VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name A16 LGA_A16 LTDC_G2 PH13 A17 LGA_A17 LTDC_B5 PF10 A18 LGA_A18 LTDC_B2 PH7 Additional functions Power group Comments

VDD TAMP_IN1 VDD

VDD Alternate functions AF4: I2C5_SDA AF5: SPI4_ MISO/I2S4_SDI AF6: SPI3_ NSS/I2S3_WS AF12: FMC_A3 AF0: TRACED15 AF2: USART2_CK AF3: TIM8_CH1N AF4: I2C5_SCL AF6: SPI3_ SCK/I2S3_CK AF8: UART4_TX AF1: TIM16_BKIN AF2: SAI1_D3 AF3: TIM8_BKIN AF5: SPI5_NSS AF7: USART6_ RTS/USART6_DE AF8: UART7_ RTS/UART7_DE AF9: QUADSPI_CLK AF2: SAI2_FS_B AF5: I2C3_SDA AF6: SPI5_SCK AF9: QUADSPI_ BK2_IO3 AF10: ETH2_MII_ TX_CLK AF11: ETH1_MII_ TX_CLK AF13: QUADSPI_ C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name A19 A20 LGA_A19 LGA_ A20 NC LTDC_B6

PF9 A21 LGA_A21 GND B1 B2 B3 LGA_B1 LGA_B2 LGA_B3 VCC_LICELL MCA_IO1 ETH2_TXD0

VBAT

PF7 B4 LGA_B4 ETH2_TXD1 PG11 Alternate functions BK1_IO3

AF1: TIM17_CH1N AF2: TIM1_CH1 AF3: DFSDM1_ CKIN3 AF6: SAI1_D4 AF7: UART7_CTS AF8: UART8_RX AF9: TIM14_CH1 AF10: QUADSPI_ BK1_IO1 AF11: QUADSPI_ BK2_IO3 AF12: FMC_A9

MCA GPIO/ADC AF1: TIM17_CH1 AF7: UART7_TX AF8: UART4_CTS AF10: ETH1_RGMII_ CLK125 AF11: ETH2_MII_ TXD0/ETH2_RGMII_ TXD0/ETH2_RMII_ TXD0 AF12: FMC_A18 AF4: SAI2_D3 Additional functions Power group Comments

VDD VDD VDD VDD Coin cell supply. C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name B5 B6 B7 B8 LGA_B5 LGA_B6 LGA_B7 LGA_B8 MCA_IO2/EXT_ VREF MCA_IO5 RESERVED

ETH2_TXD2 PG1 B9 LGA_B9 ETH2_TXD3 PE6 Additional functions Power group Comments

Reserved pad. VDD VDD Alternate functions AF5: I2S2_MCK AF7: USART3_TX AF8: UART4_TX AF10: ETH2_MII_ TXD1/ETH2_RGMII_ TXD1/ETH2_RMII_ TXD1 AF12: FMC_A24 MCA GPIO/ADC MCA GPIO/ADC

AF1: LPTIM1_ETR AF2: TIM4_ETR AF3: SAI2_FS_A AF4: I2C2_SMBA AF5: SPI2_ MISO/I2S2_SDI AF6: SAI2_D2 AF9: FDCAN2_TX AF10: ETH2_MII_ TXD2/ETH2_RGMII_ TXD2 AF12: FMC_NBL0 AF0: MCO2 AF1: TIM1_BKIN2 AF2: SAI2_SCK_B AF4: TIM15_CH2 AF5: I2C3_SMBA AF6: SAI1_SCK_B C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 3 9 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 0 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name B10 LGA_B10 ETH2_TX_EN PF6 B11 LGA_B11 ETH2_GTX_CLK PG3 B12 B13 LGA_B12 LGA_B13 GND RF_ANT_EXT B14 LGA_B14 GND

Alternate functions AF8: UART4_ RTS/UART4_DE AF11: ETH2_MII_ TXD3/ETH2_RGMII_ TXD3 AF12: FMC_A22 AF1: TIM16_CH1 AF5: SPI5_NSS AF7: UART7_RX AF9: QUADSPI_ BK1_IO2 AF11: ETH2_MII_ TX_EN/ETH2_ RGMII_TX_ CTL/ETH2_RMII_TX_ EN AF3: TIM8_BKIN2 AF4: I2C2_SDA AF6: SAI2_SD_B AF9: FDCAN2_RX AF10: ETH2_RGMII_ GTX_CLK AF11: ETH1_MDIO AF12: FMC_A13

Additional functions Power group Comments VDD VDD

External antenna pad. This signal is disconnected inside the module. M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g ConnectCore MP13 pad LGA_B15 ConnectCore MP13 signal name NC STM32MP135 pad name

Alternate functions

Additional functions

Power group Comments GND NC NC NC NC

LTDC_HSYNC PE1 VSYS VSYS MCA_IO3 MCA_ IO6/CLKOUT32K GND NC NC NC NC NC

AF1: LPTIM1_IN2 AF8: UART8_TX AF12: FMC_NBL1

MCA GPIO/ADC MCA GPIO/32KHz output

Input power line. Input power line. VDD VSYS VSYS VCC_ MCA VCC_ MCA VDD VDD VDD VDD VDD LGA pad B15 B16 B17 B18 B19 B20 B21 C1 C2 C3 C4 C5 C6 C7 C8 C9 LGA_B16 LGA_B17 LGA_B18 LGA_B19 LGA_B20 LGA_B21 LGA_C1 LGA_C2 LGA_C3 LGA_C4 LGA_C5 LGA_C6 LGA_C7 LGA_C8 LGA_C9 C10 LGA_C10 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g ConnectCore MP13 pad LGA_C11 ConnectCore MP13 signal name GND STM32MP135 pad name

Alternate functions

Additional functions

Power group Comments LGA pad C11 C12 C13 C14 C15 LGA_C12 LGA_C13 LGA_C14 LGA_C15 NC GND NC

ETH2_RX_DV PA12

AF1: TIM1_ETR AF2: SAI2_MCLK_A AF7: USART1_ RTS/USART1_DE AF11: ETH2_MII_ RX_DV/ETH2_ RGMII_RX_ CTL/ETH2_RMII_ CRS_DV AF12: FMC_A7 AF8: SPDIFRX_IN1

VDD VDD VDD RTC_OUT2/RTC_ LSCO TAMP_IN2/TAMP_ OUT3 WKUP4 C16 LGA_C16 LPO_32K/PI1 PI1 C17 LGA_C17 PCM_OUT C18 LGA_C18 PCM_SYNC C19 C20 LGA_C19 LGA_C20 GND PCM_CLK

Signal connected to the Wireless MAC. Signal connected to the Wireless MAC. Signal connected to the Wireless MAC. C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad C21 ConnectCore MP13 pad LGA_C21 ConnectCore MP13 signal name LTDC_CLK STM32MP135 pad name PD9 D1 D2 D3 D4 D5 D6 D7 D8 D9 LGA_D1 LGA_D2 LGA_D3 LGA_D4 LGA_D5 LGA_D6 LGA_D7 LGA_D8 LGA_D9 D10 D11 LGA_D10 LGA_D11 NC GND LDO2_2V8 LDO6_1V8 GND NC GND NC LDO3 GND

ETH2_REF_CLK PH11 Additional functions

Power group VDD Comments

Output power line. Output power line. 2V8 1V8 VDD LDO3 Output power line. VDD Alternate functions AF0: TRACECLK AF3: DFSDM1_ DATIN3 AF10: SDMMC2_ CDIR AF12: FMC_ D14/FMC_AD14

AF1: SPI5_NSS AF2: TIM5_CH2 AF3: SAI2_SD_A AF5: SPI2_ NSS/I2S2_WS AF6: I2C4_SCL AF7: USART6_RX AF9: QUADSPI_ BK2_IO0 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 4 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name D12 D13 D14 D15 LGA_D12 LGA_D13 LGA_D14 LGA_D15 VDD_SD 3V3_RF_EN/PB7 NC BT_DEV_WAKE

D16 LGA_D16 BT_UART_CTS PD3 D17 LGA_D17 BT_UART_TX PH12 Additional functions Power group Comments

VDD_SD Output power line. Signal only available in non-

wireless variants. Signal connected to the Wireless MAC. VDD Signal only available in non-

wireless variants. VDD Signal only available in non-

wireless variants. Alternate functions AF11: ETH2_MII_ RX_CLK/ETH2_ RGMII_RX_ CLK/ETH2_RMII_ REF_CLK AF12: FMC_A12

AF2: TIM2_CH1 AF3: USART2_ CTS/USART2_NSS AF4: DFSDM1_ CKOUT AF5: I2C1_SDA AF6: SAI1_D3 AF12: FMC_CLK AF1: USART2_TX AF2: TIM5_CH3 AF3: DFSDM1_ CKIN1 AF4: I2C3_SCL AF5: SPI5_MOSI AF6: SAI1_SCK_A AF9: QUADSPI_ BK2_IO2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 5 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name D18 LGA_D18 BT_UART_RX PH8 D19 LGA_D19 BT_UART_RTS PA1 Additional functions Power group Comments

VDD Signal only available in non-

wireless variants. ADC1_INP3 ADC2_INP3 VDD Signal only available in non-

wireless variants. Alternate functions AF10: SAI1_CK2 AF11: ETH1_MII_ CRS AF12: FMC_A6 AF0: TRACED9 AF2: TIM5_ETR AF3: USART2_RX AF4: I2C3_SDA AF12: FMC_A8 AF15: HDP2 AF1: TIM2_CH2 AF2: TIM5_CH2 AF3: LPTIM3_OUT AF4: TIM15_CH1N AF6: DFSDM1_ CKIN0 AF7: USART2_ RTS/USART2_DE AF11: ETH1_MII_ RX_CLK/ETH1_ RGMII_RX_ CLK/ETH1_RMII_ REF_CLK D20 LGA_D20 PCM_IN

Signal connected to the Wireless MAC. D21 LGA_D21 ETH1_TXD0 PG13 ADC2_INP6 ADC2_INN2 VDD AF1: LPTIM1_OUT AF7: USART6_ CTS/USART6_NSS AF11: ETH1_MII_ TXD0/ETH1_RGMII_ TXD0/ETH1_RMII_ M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 6 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name E1 E2 LGA_E1 NC LGA_E2 WKUP

PF8

E3 E19 E20 LGA_E3 LGA_E19 LGA_E20 VDD NC WL_REG_EN PD6 E21 LGA_E21 ETH1_RXD1 PC5 Additional functions Power group Comments

PMIC External LDO gate control line. WKUP1 VDD Output power line. Signal only available in non-

wireless variants.

ADC1_INP10 ADC2_INP10 VDD VDD VDD VDD Alternate functions TXD0

AF1: TIM16_CH1N AF2: TIM4_CH3 AF3: TIM8_CH3 AF6: SAI1_SCK_B AF7: USART6_TX AF9: TIM13_CH1 AF10: QUADSPI_ BK1_IO0

AF1: TIM16_CH1N AF2: SAI1_D1 AF6: SAI1_SD_A AF8: UART4_TX AF3: DFSDM1_ DATIN2 AF4: SAI2_D4 AF5: I2S_CKIN AF6: SAI1_D4 AF7: USART2_ CTS/USART2_NSS AF9: SPDIFRX_IN3 AF11: ETH1_MII_ RXD1/ETH1_RGMII_ RXD1/ETH1_RMII_ RXD1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 7 LGA pad F1 F2 F3 F19 F20 F21 ConnectCore MP13 pad LGA_F1 LGA_F2 LGA_F3 LGA_F19 LGA_F20 LGA_F21 ConnectCore MP13 signal name GND GND VSYS WL_HOST_WAKE NC

ETH1_REF_CLK PD7 G1 G2 G3 LGA_G1 LGA_G2 LGA_G3 VSYS VSYS VSYS

G19 LGA_G19 BT_REG_EN PD13 STM32MP135 pad name

Alternate functions

Additional functions

Power group Comments

AF0: MCO1 AF3: USART2_CK AF4: I2C2_SCL AF5: I2C3_SDA AF9: SPDIFRX_IN0 AF10: ETH1_MII_ RX_CLK/ETH1_ RGMII_RX_ CLK/ETH1_RMII_ REF_CLK AF11: QUADSPI_ BK1_IO2 AF12: FMC_NE1

AF1: LPTIM2_ETR AF2: TIM4_CH2 AF3: TIM8_CH2 AF4: SAI1_CK1 AF6: SAI1_MCLK_A VSYS Input power line. Signal connected to the Wireless MAC. VDD VDD VSYS VSYS VSYS VDD Input power line. Input power line. Input power line. Signal only available in non-

wireless variants. M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name G20 G21 LGA_G20 LGA_G21 GND

ETH1_TX_EN PB11 H1 H2 H3 LGA_H1 LGA_H2 LGA_H3 H19 LGA_H19 VSYS2 VSYS2 VSYS2 PI2

PI2 Alternate functions AF7: USART1_RX AF9: QUADSPI_ BK1_IO3 AF11: QUADSPI_ BK2_IO2 AF12: FMC_A18

AF1: TIM2_CH4 AF3: LPTIM1_OUT AF4: I2C5_SMBA AF7: USART3_RX AF11: ETH1_MII_ TX_EN/ETH1_ RGMII_TX_ CTL/ETH1_RMII_TX_ EN

AF8: SPDIFRX_IN2 H20 LGA_H20 BT_HOST_WAKE

H21 LGA_H21 ETH1_TXD1 PG14 AF1: LPTIM1_ETR AF6: SAI2_D1 AF7: USART6_TX AF10: SAI2_SD_A Additional functions Power group Comments

TAMP_IN3/TAMP_ OUT4 WKUP5

VDD VSYS2 VSYS2 VSYS2 VDD VDD Input power line. Input power line. Input power line. Signal connected to the Wireless MAC. C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 4 9 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name J1 J2 J3 J19 J20 J21 K1 K2 K3 K19 LGA_J1 LGA_J2 LGA_J3 LGA_J19 LGA_J20 LGA_J21 LGA_K1 LGA_K2 LGA_K3 GND GND VSYS2 NC NC

ETH1_RX_ER PI3 VDD VDD VDD

LGA_K19 WLAN_SD_CLK PE3 K20 LGA_K20 WLAN_SD_D2 PB3 Alternate functions AF11: ETH1_MII_ TXD1/ETH1_RGMII_ TXD1/ETH1_RMII_ TXD1

AF8: SPDIFRX_IN3 AF11: ETH1_MII_ RX_ER

AF0: TRACED11 AF2: SAI2_D4 AF4: TIM15_BKIN AF5: SPI4_ MISO/I2S4_SDI AF8: USART3_ RTS/USART3_DE AF9: FDCAN1_RX AF10: SDMMC2_CK AF0: TRACED2 AF1: TIM2_CH2 Additional functions Power group Comments

TAMP_IN4/TAMP_ OUT5 WKUP2

VDD VDD VDD VDD VDD VDD VDD Input power line. Output power line. Output power line. Output power line. Signal only available in non-

wireless variants. VDD 47K pull-up on module connected to VDD. M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 0 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name K21 LGA_K21 ETH1_RX_DV PA7 L1 L2 L3 L19 LGA_L1 LGA_L2 LGA_L3 NC GND VREF+

VREF+

LGA_L19 WLAN_SD_CMD PG6 Alternate functions AF4: SAI2_CK1 AF5: SPI4_ NSS/I2S4_WS AF8: SDMMC1_ D123DIR AF10: SDMMC2_D2 AF12: SAI2_MCLK_A AF13: UART7_RX AF1: TIM1_CH1N AF2: TIM3_CH2 AF3: TIM8_CH1N AF4: SAI2_D1 AF5: SPI1_ SCK/I2S1_CK AF7: USART1_ CTS/USART1_NSS AF9: TIM14_CH1 AF11: ETH1_MII_ RX_DV/ETH1_ RGMII_RX_ CTL/ETH1_RMII_ CRS_DV AF12: SAI2_SD_A

AF0: TRACED3 AF1: TIM17_BKIN AF2: TIM5_CH4 AF3: SAI2_D1 Additional functions Power group Comments Signal only available in non-

wireless variants. ADC1_INP16 VDD

VDD VDD 47K pull-up on module connected to VDD. Signal only available in non-

wireless variants. M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 1 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name L20 LGA_L20 WLAN_SD_D1 PB15 L21 LGA_L21 ETH1_RXD0 PC4 Additional functions Power group Comments

VDD 47K pull-up on module connected to VDD. Signal only available in non-

wireless variants. ADC1_INP4 ADC2_INP4 VDD Alternate functions AF4: USART1_RX AF6: SAI2_SD_A AF10: SDMMC2_ CMD AF15: HDP3 AF0: RTC_REFIN AF1: TIM1_CH3N AF2: TIM12_CH2 AF3: TIM8_CH3N AF4: SAI2_D2 AF5: SPI4_ MOSI/I2S4_SDO AF6: DFSDM1_ CKIN2 AF7: UART7_CTS AF8: SDMMC1_CKIN AF10: SDMMC2_D1 AF12: SAI2_FS_A AF2: TIM3_ETR AF3: DFSDM1_ CKIN2 AF4: SAI1_D3 AF5: I2S1_MCK AF8: UART5_ RTS/UART5_DE AF9: SPDIFRX_IN2 AF11: ETH1_MII_ RXD0/ETH1_RGMII_ RXD0/ETH1_RMII_ RXD0 AF12: SAI2_D3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 2 LGA pad M1 M2 ConnectCore MP13 pad LGA_M1 ConnectCore MP13 signal name NC STM32MP135 pad name

Alternate functions LGA_M2 ETH2_MDIO PB2 M3 LGA_M3 ETH2_MDC PG5 M19 LGA_M19 WLAN_SD_D0 PB14 M20 LGA_M20 WLAN_SD_D3 PB4 M21 LGA_M21 UART8_CTS PG10 Additional functions

TAMP_IN7 Power group VDD VDD Comments

47K pull-up on module connected to VDD. Signal only available in non-

wireless variants. 47K pull-up on module connected to VDD. Signal only available in non-

wireless variants. VDD VDD VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g AF1: RTC_OUT2 AF2: SAI1_D1 AF5: I2S_CKIN AF6: SAI1_SD_A AF8: UART4_RX AF9: QUADSPI_ BK1_NCS AF11: ETH2_MDIO AF12: FMC_A6 AF1: TIM17_CH1 AF10: ETH2_MDC AF12: FMC_A15 AF0: TRACED0 AF1: TIM1_CH2N AF2: TIM12_CH1 AF3: TIM8_CH2N AF4: USART1_TX AF10: SDMMC2_D0 AF11: SDMMC1_D4 AF0: TRACED14 AF1: TIM16_BKIN AF2: TIM3_CH1 AF4: SAI2_CK2 AF5: SPI4_ SCK/I2S4_CK AF7: USART3_CK AF10: SDMMC2_D3 AF12: SAI2_SCK_A AF5: SPI5_SCK AF6: SAI1_SD_B LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name N1 N2 LGA_N1 LGA_N2 NC FDCAN2_RX

PB5 N3 N19 LGA_N3 LGA_N19 GND SPI4_MOSI

PE11 Additional functions Power group Comments

VDD VDD Alternate functions AF8: UART8_CTS AF9: FDCAN1_TX AF10: QUADSPI_ BK2_IO1 AF12: FMC_NE3

AF0: TRACED4 AF1: TIM17_BKIN AF2: TIM3_CH2 AF5: SPI2_ MISO/I2S2_SDI AF6: I2C4_SMBA AF8: SDMMC1_CKIN AF9: FDCAN2_RX AF11: UART5_RX

AF1: TIM1_CH2 AF2: USART2_ CTS/USART2_NSS AF4: SAI1_D2 AF5: SPI4_ MOSI/I2S4_SDO AF6: SAI1_FS_A AF7: USART6_CK AF10: ETH2_MII_ TX_ER AF11: ETH1_MII_ TX_ER AF12: FMC_ D8/FMC_AD8 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad N20 ConnectCore MP13 pad LGA_N20 ConnectCore MP13 signal name SPI4_MISO STM32MP135 pad name PE13 N21 LGA_N21 UART8_RTS PE14 P1 LGA_P1 NRST NRST P2 P3 P19 LGA_P2 LGA_P3 LGA_P19 VDD GND

USART3_RTS PG8 Alternate functions AF1: TIM1_CH3 AF4: I2C5_SDA AF5: SPI4_ MISO/I2S4_SDI AF12: FMC_ D10/FMC_AD10 AF1: TIM1_BKIN AF4: SAI1_D4 AF8: UART8_ RTS/UART8_DE AF9: QUADSPI_ BK1_NCS AF10: QUADSPI_ BK2_IO2 AF12: FMC_ D11/FMC_AD11

AF1: TIM2_CH1 AF3: TIM8_ETR AF5: SPI5_MISO AF6: SAI1_MCLK_B AF8: USART3_ RTS/USART3_DE AF9: SPDIFRX_IN2 AF10: QUADSPI_ BK2_IO2 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 4 Additional functions

Power group VDD Comments TAMP_IN6 VDD

VDD Reset line of the CPU. Recommendation: leave this pin floating. VDD Output power line. TAMP_IN4 VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name P20 LGA_P20 USART3_CTS PG12 P21 R1 LGA_P21 LGA_R1 GND I2S1_WS

PA4 Additional functions Power group Comments VDD

ADC1_INP14 VDD Alternate functions AF11: QUADSPI_ BK1_IO3 AF12: FMC_NE2 AF13: ETH2_CLK AF1: LPTIM1_IN1 AF4: SAI2_SCK_A AF6: SAI2_CK2 AF7: USART6_ RTS/USART6_DE AF8: USART3_CTS AF10: ETH2_PHY_ INTN AF11: ETH1_PHY_ INTN AF12: ETH2_MII_ RX_DV/ETH2_ RGMII_RX_ CTL/ETH2_RMII_ CRS_DV

AF2: TIM5_ETR AF3: USART2_CK AF4: SAI1_SCK_B AF5: SPI1_ NSS/I2S1_WS AF6: DFSDM1_ CKIN1 AF10: ETH1_PPS_ OUT AF11: ETH2_PPS_ OUT C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 5 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name R2 LGA_R2 FDCAN2_TX PB13 R3 R19 LGA_R3 LGA_R19 GND USART3_RX

PG4 R20 LGA_R20 USART3_TX PD8 R21 LGA_R21 UART8_RX T1 LGA_T1 I2S1_CK PE0 PC3 Alternate functions AF12: SAI1_SCK_A AF0: TRACECLK AF1: TIM1_CH1N AF4: LPTIM2_OUT AF5: SPI2_ NSS/I2S2_WS AF6: I2C4_SCL AF8: SDMMC1_ D123DIR AF9: FDCAN2_TX AF11: UART5_TX

AF0: TRACED1 AF1: TIM1_BKIN2 AF4: DFSDM1_ CKIN3 AF8: USART3_RX AF10: SDMMC2_ D123DIR AF12: FMC_A14 AF15: HDP1 AF3: USART2_TX AF5: I2S4_WS AF7: USART3_TX AF8: UART4_RX AF8: UART8_RX AF9: FDCAN2_RX AF12: FMC_A11 AF2: SAI1_CK1 AF3: DFSDM1_ Additional functions

ADC1_INP13 ADC1_INN12 Comments Power group VDD VDD VDD VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 6 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name T2 T3 LGA_T2 LGA_T3 NC NC

T19 LGA_T19 ETH2_RXD3 PA8 T20 T21 LGA_T20 LGA_T21 NC UART8_TX

PE4 Alternate functions CKOUT AF5: SPI1_ MISO/I2S1_SDI AF6: SPI1_ SCK/I2S1_CK AF8: UART5_CTS AF10: SAI1_MCLK_A AF11: ETH1_MII_ TX_CLK AF12: ETH2_MII_ TX_CLK

AF0: MCO1 AF2: SAI2_MCLK_A AF3: TIM8_BKIN2 AF4: I2C4_SDA AF5: SPI5_MISO AF6: SAI2_CK1 AF7: USART1_CK AF8: SPI2_ MOSI/I2S2_SDO AF10: OTG_HS_SOF AF11: ETH2_MII_ RXD3/ETH2_RGMII_ RXD3 AF12: FMC_A21

AF1: SPI5_MISO AF2: SAI1_D2 Additional functions TAMP_IN5 Power group Comments

VDD VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name U1 LGA_U1 SDMMC1_D1 PC9 U2 U3 U19 LGA_U2 LGA_U3 LGA_U19 NC NC PA5

PA5 Additional functions Power group Comments

ADC1_INP2 VDD VDD VDD VDD Alternate functions AF3: DFSDM1_ DATIN3 AF4: TIM15_CH1N AF5: I2S_CKIN AF6: SAI1_FS_A AF7: UART7_ RTS/UART7_DE AF8: UART8_TX AF9: QUADSPI_ BK2_NCS AF10: FMC_NCE2 AF12: FMC_A25 AF0: TRACED1 AF2: TIM3_CH4 AF3: TIM8_CH4 AF7: USART3_RTS AF8: UART5_CTS AF9: FDCAN1_TX AF12: SDMMC1_D1

AF1: TIM2_ CH1/TIM2_ETR AF2: USART2_CK AF3: TIM8_CH1N AF4: SAI1_D1 AF5: SPI1_ NSS/I2S1_WS AF6: SAI1_SD_A AF10: ETH1_PPS_ OUT C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name U20 LGA_U20 LTDC_R3 PB10 U21 V1 LGA_U21 LGA_V1 JTRST JTRST SDMMC1_CMD PD2 V2 V3 V4 V5 LGA_V2 LGA_V3 LGA_V4 LGA_V5 GND BOOT0 GND ETH2_RXD0

BOOT0

PF4 Alternate functions AF11: ETH2_PPS_ OUT AF1: TIM2_CH3 AF3: LPTIM2_IN1 AF4: I2C5_SMBA AF5: SPI4_ NSS/I2S4_WS AF6: SPI2_ SCK/I2S2_CK AF7: USART3_TX

AF0: TRACED4 AF2: TIM3_ETR AF4: I2C1_SMBA AF5: SPI3_ NSS/I2S3_WS AF6: SAI2_D1 AF7: USART3_RX AF12: SDMMC1_ CMD

AF3: USART2_RX AF11: ETH2_MII_ RXD0/ETH2_RGMII_ RXD0/ETH2_RMII_ RXD0 AF12: FMC_A4 Additional functions Power group Comments

VDD VDD VDD 100K pull-up resistor. VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 5 9 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad V6 V7 V8 ConnectCore MP13 pad LGA_V6 LGA_V7 LGA_V8 ConnectCore MP13 signal name GND NC LTDC_R2

PG7 STM32MP135 pad name

Alternate functions

Additional functions

Power group Comments V9 LGA_V9 LTDC_R5 PF5 V10 V11 V12 LGA_V10 LGA_V11 LGA_V12 NC GND

SPI4_SCK PE12 V13 LGA_V13 LTDC_G7 PA15

AF0: TRACED8 AF1: TIM1_ETR AF5: SPI3_ MISO/I2S3_SDI AF8: UART7_CTS AF10: SDMMC2_ CKIN AF0: TRACED12 AF4: DFSDM1_ CKIN0 AF5: I2C1_SMBA AF12: FMC_A5

AF1: TIM1_CH3N AF5: SPI4_ SCK/I2S4_CK AF8: UART8_ RTS/UART8_DE AF12: FMC_ D9/FMC_AD9 AF15: HDP4 AF0: TRACED5 AF1: TIM2_CH1 AF5: I2S4_MCK AF7: UART4_ RTS/UART4_DE VDD VDD VDD VDD VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 0 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name V14 LGA_V14 ETH2_RXD1 PE2 V15 LGA_V15 ETH2_RXD2 PH6 Additional functions Power group Comments

VDD VDD Alternate functions AF8: UART4_RX AF12: FMC_A9 AF15: HDP5 AF0: TRACECLK AF1: TIM2_ETR AF4: I2C4_SCL AF5: SPI5_MOSI AF6: SAI1_FS_B AF7: USART6_ RTS/USART6_DE AF9: SPDIFRX_IN1 AF10: ETH2_MII_ RXD1/ETH2_RGMII_ RXD1/ETH2_RMII_ RXD1 AF12: FMC_A23 AF2: TIM12_CH1 AF3: USART2_CK AF4: I2C5_SDA AF5: SPI2_ SCK/I2S2_CK AF9: QUADSPI_ BK1_IO2 AF10: ETH1_PHY_ INTN AF11: ETH1_MII_ RX_ER AF12: ETH2_MII_ RXD2/ETH2_RGMII_ RXD2 AF13: QUADSPI_ BK1_NCS C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad V16 V17 ConnectCore MP13 pad LGA_V16 ConnectCore MP13 signal name GND STM32MP135 pad name

LGA_V17 ETH1_CLK125 PF12 V18 LGA_V18 ETH1_GTX_CLK PC1 V19 V20 LGA_V19 LGA_V20 PG0 PA11 PG0 PA11 Additional functions

ADC1_INP6 ADC1_INN2 Comments Power group VDD ADC2_INP2 VDD

VDD VDD Alternate functions

AF5: SPI1_ NSS/I2S1_WS AF6: SAI1_SD_A AF8: UART4_TX AF10: ETH1_MII_ TX_ER AF11: ETH1_RGMII_ CLK125 AF3: DFSDM1_ DATIN0 AF6: SAI1_D3 AF10: ETH1_MII_ RX_DV/ETH1_RMII_ CRS_DV AF11: ETH1_RGMII_ GTX_CLK AF9: FDCAN2_TX AF12: FMC_A10 AF1: TIM1_CH4 AF3: I2C5_SCL AF5: SPI2_ NSS/I2S2_WS AF7: USART1_ CTS/USART1_NSS AF10: ETH2_MII_ RXD1/ETH2_RGMII_ RXD1/ETH2_RMII_ RXD1 AF11: ETH1_CLK AF13: ETH2_CLK C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad V21 W1 ConnectCore MP13 pad LGA_V21 ConnectCore MP13 signal name JTDI STM32MP135 pad name JTDI LGA_W1 PA13 PA13 W2 LGA_W2 SDMMC1_D4 PH10 W3 LGA_W3 SDMMC1_D6 PC6 Power group Comments VDD VDD VDD Additional functions

BOOTFAILN

Alternate functions

AF0: DBTRGO AF1: DBTRGI AF2: MCO1 AF8: UART4_TX AF0: TRACED0 AF2: TIM5_CH1 AF3: SAI2_D3 AF4: DFSDM1_ DATIN2 AF5: I2S3_MCK AF6: SPI2_ MOSI/I2S2_SDO AF7: USART3_ CTS/USART3_NSS AF8: SDMMC1_D4 AF15: HDP0 AF0: TRACED2 AF2: TIM3_CH1 AF3: TIM8_CH1 AF4: DFSDM1_ DATIN0 AF5: I2S3_MCK AF7: USART6_TX AF8: SDMMC1_D6 AF9: SDMMC2_ D0DIR AF10: SDMMC2_D6 AF12: FMC_A19 AF15: HDP2 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 3 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 4 LGA pad W4 W5 ConnectCore MP13 pad LGA_W4 ConnectCore MP13 signal name NC STM32MP135 pad name

LGA_W5 SDMMC1_D7 PC7 W6 W7 W8 LGA_W6 LGA_W7 LGA_W8 GND NC

PMIC_PONKEY_N -

W9 W10 LGA_W9 LGA_W10 NC LTDC_R6 W11 W12 W13 LGA_W11 LGA_W12 LGA_W13 GND GND ETH2_RX_ER PF11

PF0

Alternate functions

AF0: TRACED4 AF2: TIM3_CH2 AF3: TIM8_CH2 AF6: I2S2_MCK AF7: USART6_RX AF8: USART3_CTS AF9: SDMMC2_CDIR AF10: SDMMC2_D7 AF12: SDMMC1_D7 AF15: HDP4

AF0: TRACED13 AF3: DFSDM1_ CKOUT AF7: USART3_CK AF10: SDMMC2_D4 AF12: FMC_A0

AF1: USART2_TX AF2: SAI1_D2 Additional functions

ADC1_INP8 ADC1_INN4 ADC2_INP8 Comments Power group VDD VDD PMIC Power ON key. Recommendation: leave this pin floating. VDD VDD VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 5 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name Additional functions ADC2_INN4 Power group Comments Alternate functions AF3: DFSDM1_ CKIN3 AF6: SAI1_FS_A AF12: ETH2_MII_ RX_ER W14 LGA_W14 PWR_ON PWR_ON

W15 LGA_W15 ETH2_CLK125 PH2 W16 W17 LGA_W16 LGA_W17 GND ETH1_RXD2

PB0 AF1: LPTIM1_IN2 AF8: UART7_TX AF9: QUADSPI_ BK2_IO0 AF10: ETH2_MII_ CRS AF11: ETH1_MII_ CRS AF12: FMC_NE4 AF13: ETH2_RGMII_ CLK125

AF0: DBTRGI AF1: TIM1_CH2N AF2: TIM3_CH3 AF3: TIM8_CH2N AF4: USART1_RX AF5: I2S1_MCK AF6: SAI2_FS_A AF7: USART1_CK AF8: UART4_CTS CPU core suply enable output. Internally connected to the PMIC. Leave this pin unconnected unless otherwise noted.

ADC1_INP9 ADC1_INN5 ADC2_INP9 ADC2_INN5 VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name W18 LGA_W18 ETH1_TXD2 PC2 W19 LGA_W19 ETH1_RXD3 PB1 W20 LGA_W20 ETH1_TXD3 PE5 Additional functions Power group Comments ADC1_INP15 VDD ADC1_INP5 ADC2_INP5 VDD

VDD Alternate functions AF10: SAI2_D2 AF11: ETH1_MII_ RXD2/ETH1_RGMII_ RXD2 AF1: SPI5_NSS AF5: SPI1_ NSS/I2S1_WS AF6: SAI2_MCLK_A AF7: USART1_ RTS/USART1_DE AF10: SAI2_CK1 AF11: ETH1_MII_ TXD2/ETH1_RGMII_ TXD2 AF1: TIM1_CH3N AF2: TIM3_CH4 AF3: TIM8_CH3N AF5: SPI1_ SCK/I2S1_CK AF6: DFSDM1_ DATIN1 AF7: UART4_RX AF11: ETH1_MII_ RXD3/ETH1_RGMII_ RXD3 AF2: SAI2_SCK_B AF3: TIM8_CH3 AF4: TIM15_CH1 AF8: UART4_RX AF10: ETH1_MII_ TXD3/ETH1_RGMII_ C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 6 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name W21 LGA_W21 JTCK-SWCLK JTCK-SWCLK Y1 Y2 LGA_Y1 LGA_Y2 BOOT1 SDMMC1_D5 BOOT1 PB12 Y3 Y4 Y5 Y6 Y7 LGA_Y3 LGA_Y4 NC I2S1_MCK LGA_Y5 LGA_Y6 LGA_Y7 NC NC I2C3_SCL

PC0

PB8 Additional functions Power group Comments

ADC1_INP0 ADC1_INN1 ADC2_INP0 ADC2_INN1 TAMP_IN3

VDD VDD VDD VDD VDD VDD VDD 100K pull-up resistor. 2.2K pull-up on module connected to VDD. Alternate functions TXD3 AF12: FMC_NE1

AF0: TRACED10 AF4: I2C2_SMBA AF6: DFSDM1_ DATIN1 AF7: UART7_ RTS/UART7_DE AF8: USART3_RX AF11: UART5_RX AF12: SDMMC1_D5

AF2: SAI1_SCK_A AF4: SAI1_CK2 AF5: I2S1_MCK AF6: SPI1_ MOSI/I2S1_SDO AF7: USART1_TX

AF1: TIM16_CH1 AF2: TIM4_CH3 AF4: I2C1_SCL AF5: I2C3_SCL AF6: DFSDM1_ DATIN1 C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 7 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name Y8 LGA_Y8 I2C3_SDA PH14 Y9 LGA_Y9 SPI4_NSS PD10 Y10 Y11 Y12 Y13 LGA_Y10 LGA_Y11 LGA_Y12 LGA_Y13 GND VBUS_OTG NC

I2C2_SCL PF2 Y14 LGA_Y14 I2C2_SDA PF1 Alternate functions AF8: UART4_RX AF10: SAI1_D1 AF12: FMC_ D13/FMC_AD13 AF3: DFSDM1_ DATIN2 AF4: I2C3_SDA AF8: UART4_RX AF0: RTC_REFIN AF4: I2C5_SMBA AF5: SPI4_ NSS/I2S4_WS AF7: USART3_CK AF12: FMC_ D15/FMC_AD15

AF0: TRACED1 AF4: I2C2_SCL AF6: DFSDM1_ CKIN1 AF7: USART6_CK AF9: SDMMC2_ D0DIR AF11: SDMMC1_ D0DIR AF12: FMC_A2 PF1: TRACED7 Additional functions Power group Comments

2.2K pull-up on module connected to VDD. Output power line. VDD VDD VDD VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 8 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 6 9 LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name VBUS_SW VBUS_SW NC NC PA14

PA14 NC

Y15 Y16 Y17 Y18 Y19 Y20 Y21 AA1 AA2 LGA_Y15 LGA_Y16 LGA_Y17 LGA_Y18 LGA_Y19 LGA_Y20 LGA_Y21 LGA_AA1 LGA_AA2 JTDO-TRACESWO JTDO-

TRACESWO

GND SDMMC1_D0

PC8

AF0: TRACED0 AF2: TIM3_CH3 AF3: TIM8_CH3 AF5: SPI3_ MISO/I2S3_SDI AF7: USART6_CK AF8: USART3_CTS AF10: SAI2_FS_B AF11: UART5_ RTS/UART5_DE Alternate functions AF4: I2C2_SDA AF5: SPI3_ MOSI/I2S3_SDO AF12: FMC_A1 AF15: HDP7

AF0: DBTRGO AF1: DBTRGI AF2: MCO2 AF10: OTG_HS_SOF

Additional functions Power group Comments Output power line. Output power line.

VDD VDD VDD VDD M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name AA3 LGA_AA3 SDMMC1_CLK PC12 AA4 LGA_AA4 SDMMC1_D2 PC10 AA5 LGA_AA5 SDMMC1_D3 PC11 AA6 LGA_AA6 UART5_TX PA0 Additional functions Power group Comments VDD VDD VDD VDD

ADC1_INP7 ADC1_INN3 ADC2_INP7 ADC2_INN3 Alternate functions AF12: SDMMC1_D0 AF0: TRACECLK AF8: UART7_TX AF10: SAI2_SD_B AF12: SDMMC1_CK AF0: TRACED2 AF5: I2C1_SCL AF6: SPI3_ SCK/I2S3_CK AF7: USART3_TX AF10: SAI2_MCLK_B AF12: SDMMC1_D2 AF0: TRACED3 AF4: I2C1_SDA AF6: SPI3_ MOSI/I2S3_SDO AF7: USART3_CK AF8: UART5_RX AF10: SAI2_SCK_B AF12: SDMMC1_D3 AF1: TIM2_CH1 AF2: TIM5_CH1 AF3: TIM8_ETR AF4: TIM15_BKIN AF6: SAI1_SD_B AF8: UART5_TX AF11: ETH1_MII_ CRS AF12: ETH2_MII_ CRS C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 7 0 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad AA7 ConnectCore MP13 pad LGA_AA7 ConnectCore MP13 signal name UART5_RX STM32MP135 pad name PF13 AA8 LGA_AA8 USB2_D_P USB_DP2 AA9 LGA_AA9 USB2_D_N USB_DM2 AA10 AA11 AA12 LGA_AA10 LGA_AA11 LGA_AA12 GND OTG_VBUS I2S1_SDI

PI7 PA6 AA13 AA14 LGA_AA13 LGA_AA14 USB_OTG_ID I2S1_SDO PA10 PA3 Alternate functions AF1: TIM2_ETR AF2: SAI1_MCLK_B AF6: DFSDM1_ DATIN3 AF7: USART2_TX AF8: UART5_RX

AF1: TIM1_BKIN AF2: TIM3_CH1 AF3: TIM8_BKIN AF4: SAI2_CK2 AF5: SPI1_ MISO/I2S1_SDI AF7: USART1_CK AF8: UART4_ RTS/UART4_DE AF9: TIM13_CH1 AF12: SAI2_SCK_A AF1: TIM1_CH3 AF1: TIM2_CH4 AF2: TIM5_CH4 AF3: LPTIM5_OUT AF4: TIM15_CH2 AF5: SPI1_ Additional functions ADC1_INP11 ADC1_INN10 ADC2_INP11 ADC2_INN10 USBH_HS_DP2 OTG_HS_DP USBH_HS_DM2 OTG_HS_DM

OTG_HS_VBUS ADC1_INP17 ADC1_INN16 TAMP_IN2 OTG_HS_ID ADC1_INP12 ADC1_INN11 PVD_IN WKUP6 Power group VDD Comments Input power line. VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 7 1 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g LGA pad ConnectCore MP13 pad ConnectCore MP13 signal name STM32MP135 pad name AA15 AA16 AA17 AA18 AA19 LGA_AA15 LGA_AA16 LGA_AA17 LGA_AA18 LGA_AA19 BOOT2 BOOT2 JTMS-SWDIO JTMS-SWDIO USB1_D_P USB1_D_N ETH1_MDC USB_DP1 USB_DM1 PG2 AA20 LGA_AA20 ETH1_MDIO PA2 AA21 LGA_AA21 GND

Alternate functions MOSI/I2S1_SDO AF6: SAI1_FS_B AF7: USART2_RX AF11: ETH1_MII_ COL AF12: ETH2_MII_ COL

AF1: MCO2 AF3: TIM8_BKIN AF10: SAI2_MCLK_B AF11: ETH1_MDC AF1: TIM2_CH3 AF2: TIM5_CH3 AF3: LPTIM4_OUT AF4: TIM15_CH1 AF7: USART2_TX AF11: ETH1_MDIO

Additional functions Power group Comments

USBH_HS_DP1 USBH_HS_DM1

ADC1_INP1 ADC2_INP1

VDD VDD C o n n e c t C o r e M P 1 3 S y s t e m

o n

M o d u l e 7 2 M o d u l e p n o u t i E x t e r n a l i s i g n a l s a n d p n m u l t i p l e x i n g Module specifications External signals and pin multiplexing Module specifications The following sections describe the specifications for the ConnectCore MP13 SOM. Mechanical specifications Environmental specifications Socket options 74 75 75 ConnectCore MP13 System-on-Module 73 Module specifications Mechanical specifications Mechanical specifications This section provides mechanical dimensions and host PCB footprint guidance for the Digi SMTplus form factor of the ConnectCore MP13 module. Host PCB footprint and cutout Note Host PCBs must have a cutout to accommodate the components on the bottom side of the module. Digi SMTplus LGA mounting Label The MAC address and serial number of the SOM are encoded in the data matrix on the SOM label. Note See the ConnectCore MP13 product page for mechanical design documents, drawings, and other resources. ConnectCore MP13 System-on-Module 74 Module specifications Environmental specifications Environmental specifications Operating temperature: -40 to 85 C. CAUTION! Your final product may require additional thermal management such as passive

(heatsink/spreader) or active (airflow) cooling to achieve the maximum operating temperature without exceeding the processor junction temp limit. Socket options For testing, prototyping, and other primarily development-related purposes, Digi International and E-

tec Interconnect AG have developed sockets allowing the easy insertion and removal of modules in a carrier board design. All drawings, user instructions, schematics and PCB footprints are posted on the ConnectCore MP13 technical support website. Note The ConnectCore MP1 Development Board (Digi P/N CC-WMP137-KIT) has been designed to support a RF-LPF246-129M-21AAEW55L-CCMP1 socket, and can be used as a reference design. All sockets are sold and built by E-tec Interconnect AG. The table below provides an overview of the available part numbers. Socket model ConnectCore MP13 RF-LPF246-129M-21AAEW55L-CCMP1 E-tec part number Note Please direct all socket-related purchase inquiries to E-tec Interconnect AG (info@e-tec.com). ConnectCore MP13 System-on-Module 75 Regulatory information and certifications Note The ConnectCore MP13 module complies with Part 15 of the United States FCC rules and regulations. United States FCC Europe and UK Canada (IC) Japan 77 81 84 86 ConnectCore MP13 System-on-Module 76 Regulatory information and certifications United States FCC United States FCC The ConnectCore MP13 module complies with Part 15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC Certification, the OEM must comply with the following regulations:

The system integrator must ensure that the text on top side of the module is placed on the outside of the final product. The ConnectCore MP13 module may only be used with approved antennas. (See FCC-approved antennas.) Labeling requirements WARNING! The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. Required FCC Label for OEM products containing the ConnectCore MP13 module. Contains FCC ID: MCQ-CCMP1 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Maximum power and frequency specifications (FCC) Peak antenna gain 2.5 dBi RF band 2.4 GHz Channel bandwidth 1 Technology BT + EDR Bluetooth LE WLAN 5 GHz 4.6 dBi WLAN 2 20 40 20 40 Channel number (Center frequency, MHz) 79 non-overlapping channels: 0 (2400) to 78

(2480) 40 non-overlapping channels: 0 (2402) to 39

(2480) 1(2412), 2(2417), 3(2422), 4(2427), 5(2432), 6

(2437), 7(2442), 8(2447), 9 (2452), 10(2457), 11

(2462) 3(2422), 4(2427), 5(2432), 6(2437), 7(2442), 8

(2447), 9(2452) 36(5180), 40(5200), 44(5220), 48(5240), 52

(5260), 56(5280), 60(5300), 64 (5320), 100(5500), 104(5520), 108(5540), 112(5560), 116(5580), 120

(5600), 124(5620), 128(5640), 132(5660), 136

(5680), 140(5700), 149 (5745), 153(5765), 157

(5785), 161(5805), 165(5825) 38(5190), 46(5230), 54(5270), 62(5310), 102

(5510), 110(5550), 118(5590), 126(5630), 134 ConnectCore MP13 System-on-Module 77 Regulatory information and certifications United States FCC RF band Peak antenna gain Technology Channel bandwidth 80 Channel number (Center frequency, MHz)

(5670), 151(5755), 159(5795) 42(5210), 58(5290), 106(5530), 122(5610), 155

(5775) FCC notices IMPORTANT: The ConnectCore MP13 module has been certified by the FCC for use with other products without any further certification (as per FCC section 2.1091). Modifications not expressly approved by Digi could void the user's authority to operate the equipment. IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section 15.107

& 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules. IMPORTANT: The ConnectCore MP13 module has been certified for remote and base radio applications. If the module will be used for portable applications, the device must undergo SAR testing. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Re-orient or relocate the receiving antenna, Increase the separation between the equipment and receiver, Connect equipment and receiver to outlets on different circuits, or Consult the dealer or an experienced radio/TV technician for help. IMPORTANT: This module has been tested and found to comply with the following requirements for Modular Approval. Part 15.247 - Operation within the bands 902-928 MHz, 2400-2483.5 MHz, and 5725-5850 MHz. Part 15.407 General technical requirements. FCC-approved antennas The ConnectCore MP13 module can be installed utilizing antennas and cables constructed with non-

standard connectors (RPSMA, RPTNC, and so on). The modules are FCC approved for fixed base station and mobile applications for the channels indicated in the tables below. If the antenna is mounted at least 20 cm (8 in) from nearby persons, the application is considered a mobile application. Antennas not listed in the table must be tested to comply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247 (Emissions). The following table shows the antenna that was used to certify the ConnectCore MP13 wireless module. This antenna can be replaced by others, however further certification testing is required. The number of tests to be carried out can be decreased by using an antenna of the same type, i.e. dualband omnidirectional dipole, showing lower peak gain. In such case, only a spot check may be required by the certification laboratories to keep current certifications valid according to FCC regulations. If replacing by an antenna with higher gain, complete radiated tests according to FCC regulations are required by the certification laboratories. ConnectCore MP13 System-on-Module 78 Regulatory information and certifications United States FCC Antenna used to certify the ConnectCore MP13 wireless module Antenna Type Dipole Supplier Linx Technologies Inc. Antenna part no. ANT-DB1-RAF-RPS Dipole KYOCERA X9001091-W3DRMB Dipole TAOGLAS GW.48.A151 PCB ETHERTRONICS 1001932 Freq.

(MHz) 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

Peak antenna gain (dBi) 2.5 Directional gain (dBi) 5.51 4.6 4.6 4.6 4.6 1.8 4.0 4.0 4.0 4.0 3.42 4.56 4.56 4.56 4.56 2.5 5 5 7.61 7.61 7.61 7.61

6.43 7.57 7.57 7.57 7.57 5.51 8.01 8.01 ConnectCore MP13 System-on-Module 79 Regulatory information and certifications United States FCC Antenna Type Supplier Antenna part no. PCB YAGEO ANTX100P001B24553 PCB KYOCERA W3P35x8W04-

U100D3B0A PCB TAOGLAS FXP830.07.0100C *

PCB TAOGLAS FXP831.07.0100C Freq.

(MHz) 5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 2402-

Peak antenna gain (dBi) Directional gain (dBi) 5 5 4.6 4.9 3.9 5.1 5.1 2.3 5 5 5 5 3.32 4.7 4.7 4.7 4.7 3 8.01 8.01 7.61 7.91 6.91 8.11 8.11

6.33 7.71 7.71 7.71 7.71 6.01 ConnectCore MP13 System-on-Module 80 Regulatory information and certifications Europe and UK Antenna Type Supplier Antenna part no. Freq.

(MHz) 2480 5150-

5250 5250-

5350 5470-

5725 5725-

5850 Peak antenna gain (dBi) Directional gain (dBi) 5.5 5.5 5.5 5.5 8.51 8.51 8.51 8.51

* Antenna gain in free space Note If using the RF module in a portable application (for example - if the module is used in a hand-

held device and the antenna is less than 20 cm (8 in) from the human body when the device is in operation): The integrator is responsible for passing additional SAR (Specific Absorption Rate) testing based on FCC rules 2.1091 and FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, OET Bulletin and Supplement C. The testing results will be submitted to the FCC for approval prior to selling the integrated unit. The required SAR testing measures emissions from the module and how they affect the person. RF exposure CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm (8 in) or more should be maintained between the antenna of this device and persons during device operation. To ensure compliance, operations at closer than this distance are not recommended. The antenna used for this transmitter must not be co-located in conjunction with any other antenna or transmitter. The preceding statement must be included as a CAUTION statement in OEM product manuals in order to alert users of FCC RF Exposure compliance. Operating frequency n 802.11 b/g/n: 2412-2462 MHz n 802.11 a/n/ac : 5150-5250 MHz; 5250-5350 MHz; 5470-5725MHz; 5725-5850 MHz n Bluetooth : 2402-2480 MHz Europe and UK n 2.412 to 2.472 GHz; 13 channels n 5.180 to 5.320 GHz; 8 channels n 5.500 to 5.700 GHz, 8 channels (excludes 5.600 to 5.640 GHz) ConnectCore MP13 System-on-Module 81 Regulatory information and certifications Europe and UK CE mark The ConnectCore MP13 module is certified for use in several European countries. For information, visit www.digi.com/resources/certifications. If the ConnectCore MP13 module is incorporated into a product, the manufacturer must ensure compliance of the final product with articles 3.1a and 3.1b of the RE Directive (Radio Equipment Directive). A Declaration of Conformity must be issued for each of these standards and kept on file as described in the RE Directive (Radio Equipment Directive). Furthermore, the manufacturer must maintain a copy of the ConnectCore MP13 module user manual documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. CE and UKCA OEM labeling requirements The CE and UKCA markings must be clearly visible and legible when you affix it to the product. If this is not possible, you must attach these marks to the packaging (if any) or accompanying documents. CE labeling requirements The CE marking must be affixed to a visible location on the OEM product. The following figure shows CE labeling requirements. The CE mark shall consist of the initials CE taking the following form:

n If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be respected. n The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus. n The CE marking must be affixed visibly, legibly, and indelibly. ConnectCore MP13 System-on-Module 82 Regulatory information and certifications Europe and UK UK Conformity Assessed (UKCA) labeling requirements See https://www.gov.uk/guidance/using-the-ukca-marking for further details. You must make sure that:

n if you reduce or enlarge the size of your marking, the letters forming the UKCA marking must be in proportion to the version set out below n the UKCA marking is at least 5 mm in height unless a different minimum dimension is specified in the relevant legislation n the UKCA marking is easily visible, legible (from 1 January 2023 it must be permanently attached) n the UKCA marking can take different forms (for example, the colour does not have to be solid), as long as it remains visible, legible and maintains the required proportions. Important note Digi customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Refer to the radio regulatory agency in the desired countries of operation for more information. Declarations of Conformity Digi has issued Declarations of Conformity for the ConnectCore MP13 module concerning emissions, EMC, and safety. For more information, see http://www.digi.com/resources/certifications. Important note Digi customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Refer to the radio regulatory agency in the desired countries of operation for more information. Approved antennas The same antennas have been approved for Europe as stated in the FCC table for use with the ConnectCore MP13 module. ConnectCore MP13 System-on-Module 83 Regulatory information and certifications Canada (IC) Country list Note This device is restricted to indoor use only when operating in the 5150-5350MHz frequency range within all member states. Transmitter Frequency(MHz) Maximum Output Power 2402 ~ 2480 15.86 dBm Radio Type / Description Bluetooth BR+EDR Low Energy WLAN 2.4G 802.11b 802.11g 802.11n 20 802.11n 40 WLAN 5G 802.11a 2402 ~ 2480 2412 ~ 2472 2412 ~ 2472 2412 ~ 2472 2422 ~ 2462 5150 ~ 5350 5470 ~ 5725 5725 ~ 5850 802.11n_20M 802.11ac_20M 5150 ~ 5350 5470 ~ 5725 5725 ~ 5850 802.11n_40M 802.11ac_40M 5150 ~ 5350 80211ac_80M 5470 ~ 5725 5725 ~ 5850 5150 ~ 5350 5470 ~ 5725 5725 ~ 5850 Canada (IC) IC: 1846A-CCMP1 6.88 dBm 19.24 dBm 19.31 dBm 19.54 dBm 19.45 dBm 22.16 dBm 21.99 dBm 13.17 dBm 22.22 dBm 22.00 dBm 13.16 dBm 22.55 dBm 21.82 dBm 13.28 dBm 21.52 dBm 20.90 dBm 13.15 dBm ConnectCore MP13 System-on-Module 84 Regulatory information and certifications Canada (IC) PMN: ConnectCore MP13 HVIN: 55002163-XX Canadian Notice This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. Avis Canadien Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1. Lappareil ne doit pas produire de brouillage;

2. Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Labeling requirements Labeling requirements for Industry Canada are similar to those of the FCC. Required End Product Labeling Any device incorporating this module must include an external, visible, permanent marking or label which states:

Contains IC : 1846A-CCMP1 Obligation d'tiquetage du produit final:

Tout dispositif intgrant ce module doit comporter un externe, visible, marquage permanent ou une tiquette qui dit:

Contient IC : 1846A-CCMP1 Transmitters with detachable antennas This radio transmitter (IC: 1846A-CCMP1) has been approved by Industry Canada to operate with the antenna types listed in the table above with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio (IC: 1846A-CCMP1) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal et l'impdance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the ConnectCore MP13 System-on-Module 85 Regulatory information and certifications Japan equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. The ConnectCore MP13 module is for professional (OEM) installation only. Le module ConnectCore MP13 doit imprativement tre install par un professionnel (OEM). RF exposure To satisfy Industry Canada RF exposure requirements, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during device operation. Pour satisfaire aux exigences dIndustrie Canada concernant lexposition RF, une distance gale ou suprieure 20cm doit tre respecte entre les antennes de ce produit et les personnes se trouvant proximit. The preceding statement must be included as a CAUTION statement in OEM product manuals in order to alert users of Industry Canada RF Exposure compliance. Cette information doit tre incluse dans le manuel du produit OEM afin dalerter les utilisateurs sur la ncessit de respecter lexposition RF dIndustrie Canada. Approved antennas The same antennas have been approved for Canada as stated in the FCC table for use with the ConnectCore MP13 module. Japan 5GHz This device has been granted a designation number by Ministry of Internal Affairs and Communications according to:

Ordinance concerning Technical Regulations Conformity Certification etc. of Specified Radio Equipment ( ). n Article 2, Paragraph 1, Item 19, 19-3, 19-3-2 Category: WW, XW, YW n Model/Name of equipment: ConnectCore MP13 n Radio label marking:

l R: 210-207701 This device should not be modified (otherwise the granted designation number will be invalid). n 2.412 to 2.472 GHz; 13 channels n 5.180 to 5.320 GHz; 8 channels n 5.500 to 5.700 GHz; 11 channels ConnectCore MP13 System-on-Module 86 Regulatory information and certifications Japan Approval Label (MIC Marking) Label text Note Due to space constraints, the ConnectCore MP13 module label doesnt support radio marking for Japan. If space allows, end product label should support radio marking for Japan. If not, radio marking shall be documented in the user manual. Note The warning Indoor only(5GHz) must go on the end product or E Label (Display). Master station: Indoor only

Slave station: The transmission of radio equipment is indoors use only (Except when communicating with 5.2GHz high power base stations or relay stations)

: 5.2GHz If the device is too small it can be displayed on the user manual and on the packaging or container. ConnectCore MP13 System-on-Module 87

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Section 2.911(d)(5)(i) Certification Equipment Type Company Name: Digi International Inc Address: 9350 Excelsior Blvd. Suite 700, MN 55343 USA Product Name: WLAN+Bluetooth Module FCC ID: MCQ-CCMP1 Model(s): LBEE5PK2AE 2.911(d)(5)(i) Equipment Type We, Digi International Inc (the applicant), certify that the equipment for which authorization is sought through, certification is not:

Prohibited from receiving an equipment authorization pursuant to 2.903; of the FCC rules. Identified as an equipment type in the Covered List NOTE 1 Yours sincerely, Date: 1 December 2024 Name: Dan Kobylarz Title and Company Name: VP, Engineering / Digi International Inc NOTE 1 Covered List; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References;

1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-

communications-supply-chain-through-the 2.911 (d)(5)(i) Equipment Type Attestation v1.2

 

 

Section 2.911(d)(5)(ii) Certification Applicant (Covered List ) Company Name: Digi International Inc Address: 9350 Excelsior Blvd. Suite 700, MN 55343 USA Product Name: WLAN+Bluetooth Module FCC ID: MCQ-CCMP1 Model(s): LBEE5PK2AE 2.911(d)(5)(ii) Applicant filing We, Digi International Inc (the applicant), certify that, as of the date of the filing of the application, the applicant is not identified NOTE 1 on the Covered List NOTE 2, established pursuant to 1.50002 of this chapter, as an entity producing covered communications equipment. Yours sincerely, Date: 1 March 2024 Name: Dan Kobylarz Title and Company Name: VP, Engineering / Digi International Inc NOTE 1 Delete option not applicable to this application. NOTE 2 Covered List; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References;

1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the 2.911 (d)(5)(ii) Applicant Attestation v1.3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

June 05, 2023 To whom it may concern:

Digi duly authorizes the following persons to sign regulatory applications, authorization letters, declarations, and other documents required for the use in regulatory files to the Federal Communications Commission, ISED Canada, and other agencies, on behalf of Digi International Inc. Harald Remmert Ken Bednasz Dan Kobylarz Erik Reynolds David Iacovelli Paul Dahl Pedro Perez Brad Ferguson Bill Kumpf Nathan Carlson Sincerely, CTO, Cellular VP of Engineering Sr. Director of Engineering Director of Engineering Director of Engineering Sr. Manager of Engineering Sr. Manager of Engineering Pr. Engineer Pr. Engineer Sr. Engineer Erik Reynolds Director of Engineering

 

 

Date: 1 March 2024 Federal Communications Commission Equipment Authorization Division 7435 Oakland Mills Road Columbia, MD 21046 USA Attn: OET Dept. Ref: FCC Class II Permissive change for FCC ID: MCQ-CCMP1 Applicant: Digi International Inc Dear Examiner, This is to request a Class II Permissive change for FCC ID: MCQ-CCMP1 originally granted on 02/08/2024. The change under this application is for the following reasons:-

We attest that the radio module remains unchanged and is electrically identical to what was certified, the only change being the new antennas added with hosts, ConnectCore CCMP13 and ConnectCore CCMP15. We attest that the certified device will not be capable of ad-hoc mode operation outside of the grant conditions. Sincerely, Name: Dan Kobylarz Title: VP, Engineering DIGI110 FCC Class II PC request letter Rev1.1

 

 

Letter of Authorization Company: Digi International Inc Address: 9350 Excelsior Blvd. Suite 700, Hopkins, Minnesota 55343 USA Product Name: LBEE5PK2AE Model Number(s): LBEE5PK2AE Product Description: WLAN+Bluetooth Module We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Dan Kobylarz VP, Engineering Signature:

Name:

Title:

Company: Digi International Inc Date: 1 March 2024

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Section 2.911(d)(7) USA Agent for Service of Process Company Name: Digi International Inc Address: 9350 Excelsior Blvd. Suite 700, MN 55343 USA Product Name: WLAN+Bluetooth Module FCC ID: MCQ-CCMP1 Model(s): LBEE5PK2AE 2.911(d)(7) USA Designated Agent for Service of Process We, Digi International Inc (the applicant) designate Digi International Inc NOTE1 for the purpose of accepting service of process on behalf of the applicant. Applicant consent: We acknowledge our consent to accept service of process in the United States for matters related to the applicable equipment, and at the physical U.S. address and email address of the designated agent and acknowledge our acceptance of our obligation to maintain an agent for service of process in the United States for no less than one year after either we the grantee have permanently terminated all marketing and importation of the applicable equipment within the U.S., or at the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. Agent obligation: We acknowledge our obligation to accept service of process in the United States for matters related to the applicable equipment at our physical U.S. address and email address for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or at the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. USA Agent Company name: same as Applicant USA Address:

FRN Number:

Contact Name:

Telephone No:

Email:

Applicant Company name: Digi International Inc Address: 9350 Excelsior Blvd. Suite 700, MN 55343 USA Grantee FRN Number: 0010283307 FCC Grantee Code: MCQ Contact Name: Dan Kobylarz Telephone No: 952-912-3029 Email: Daniel.kobylarz@digi.com 2.911 (d)(7)USA Agent v1.5 Signature: (if different from Applicant) Title:

Date:

Signature:

Title: VP, Engineering Date: 1 March 2024 NOTE 1: An applicant located in the United States may designate itself as the agent for service of process. Reference; Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-

national-security-threats-to-the-communications-supply-chain-through-the 2.911 (d)(7)USA Agent v1.5