www.sziton.com MBTL1_V1.3 MBTL1 Bluetooth Low Energy Module DISCLAIMER AND COPYRIGHT NOTICE Information in this document, including URL references, is subject to change without notice. This document is provided As if with no whatsoever, including any warranty of merchantability, noninfringement, fitness for any purpose, or any warranty otherwise arising out of any proposal, specification or samples. All liability, including liability for infringement of any proprietary rights, relating to use of information in this documen t is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Bluetooth logo and symbol belong to the Bluetooth SIG Inc. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright by ITON Technology Corp. All rights reserved. MBTL1_V1.3 www.sziton.com Contents Revision History ............................................................................................................................................................. 3 1 .Overview .................................................................................................................................................................... 3 1.1 Key features .................................................................................................................................................3 1.2 Typical applications ........................................................................................................................................4 1.3 Block diagram .................................................................................................................................................5 2 Pin Configuration and Functions ................................................................................................................................. 6 2.1 Pin Layout .......................................................................................................................................................6 3 Electrical Specifications ............................................................................................................................................... 9 3.1 Absolute maximum ratings .............................................................................................................................9 3.2 Recommended operating condition ............................................................................................................ 10 3.3 DC characteristics ......................................................................................................................................... 10 3.4 AC characteristics ......................................................................................................................................... 10 4 Application Diagram .................................................................................................................................................. 12 5 Mechanical and Package .......................................................................................................................................... 13 5.1 Recommended PCB Footprint ...................................................................................................................... 13 5.2 Packaging Information ................................................................................................................................. 14 6 Thermal Reflow ......................................................................................................................................................... 14 7 FCC & IC Statement ................................................................................................................................................... 15 ITON Technology Corp. Page 2 of 17 www.sziton.com Revision History Date Version No. Description 2019.10.31 2019.11.18 V1.0 V1.1 Initial version MBTL1_V1.3 Author WangLei WangLei WangLei Mainly updated the sections below 1) change Operating Temperature 2) update the RX Sensitivity 3) update the power dissipation in Section 3.3 4) update the mechanical size 1)update the module Number: MBTEL1 2)change support Bluetooth support 4.2 and keep BLE wireless technology standards 3)add FCC & IC streatment Update the TX output power up to +5.5dBm. 2019.12.20 V1.2 2020.01.06 V1.3 1 .Overview The MBTEL1 module is designed with Telink BLE SoC TLSR8258 with internal Flash and audio support, the radio frequency(RF), digital processing, protocols stack software and profiles. MBTEL1 support BLE specification up to Bluetooth 4.2, allows easy connectivity with Bluetooth Smart Ready mobile phones, tablets, laptops, which supports BLE slave and master mode operation, including broadcast, encryption, connection updates, and channel map updates. 1.1 Key features General features 1) Embedded 32-bit proprietary microcontroller , max. running speed up to 48MHz 2) Program memory: internal 512kB (TLSR8258F512) Data memory: 64kB on-chip SRAM 3) RTC and other timers:
Clock source of 24MHz&32.768kHz Crystal and 32kHz/24MHz embedded RC oscillator Three general 32-bit timers with four selectable modes in active mode Watchdog timer A low-frequency 32kHz timer available in low power mode 4) A rich set of I/Os:
Up to 32/17 GPIOs depending on package option. All digital IOs can be used as GPIOS. DMIC (Digital Mic). AMIC (Analog Mic). I2S. ITON Technology Corp. Page 3 of 17 MBTL1_V1.3 www.sziton.com Stereo Audio output. SPI. I2C. UART with hardware flow control and 7816 protocol support. USB. Swire debug Interface. 5) Up to 6 channels of differential PWM:
PWM1~PWM5: 5-channel normal PWM output. PWM0: 1 channel with IR/IR FIFO/IR DMA FIFO mode for IR generation. 6) Sensor:
14bit 10-channel (only GPIO input) SAR ADC, with 4-channel differential input PGA Temperature sensor 7) Power supply: 1.8V~3.6V. 8) Compatible with USB2.0 Full speed mode. Supports ISP (In-System Programming) via USB port. RF features 1) Supports 2.4GHz IoT standards into a single SoC, including BLE, BLE Mesh 2) Bluetooth version 4.2 with 1Mbps 3) Rx Sensitivity: -93dBm 4) Tx output power: up to +5.5dBm. 5) On-board PCB antenna. 6) With shielding cover 1.2 Typical applications The MBTEL1 module can be applied to IoT (Internet of Things) and HID (Human Interface Devices) applications, such as BLE smart devices, BLE mesh devices, Its typical applications include, but are not limited to the following:
Smartphone and tablet accessories;
Sports and fitness tracking;
Wireless toys;
Building Automation;
Consumer Electronics Health Care. RF Remote Control;
Wearable devices;
Smart Lighting, Smart Home devices;
Intelligent Logistics/Transportation/City;
Industrial Control;
ITON Technology Corp. Page 4 of 17 www.sziton.com 1.3 Block diagram MBTL1_V1.3
*Note: Modules marked with different colors belong to different power domains. Figure 1-1 Block diagram of TLSR8258 2.4G PCB ANT TLSR8258 QFN48 5.4*5.4mm DC supply PWM UART SPI 24MHz Crystal 32.768kHz Crystal Figure 1-2 Block diagram of MBTEL1 ITON Technology Corp. Page 5 of 17 2 Pin Configuration and Functions www.sziton.com 2.1 Pin Layout MBTL1_V1.3 Figure 2-1 Pin assignment for MBTEL1 Functions of 40 pins for the MBTEL1 Table 2-1 Pin functions for MBTEL1 No. Pin Name GND Type PWR Description Power ground PWM4/UART_TX/ATSEL2/lc_comp _ain<1>/sar_aio<1>/PB<1>
PWM4 output / UART_TX / Antenna select pin Digital I/O 2 / Low power comparator input / SAR ADC input / GPIO PB[1]
PWM3/UART_RX/ATSEL1/
sar_aio<0>/PB<0>
Digital I/O PWM3 output / UART_RX / Antenna select pin 1 / SAR ADC input / GPIO PB[0]
DI/UART_CTS/PWM1/PA<3>
Digital I/O DO/UART_TX/PWM0/PA<2>
Digital I/O CN/UART_RX/ATSEL0/PD<6>
Digital I/O SPI data input (I2C_SDA) / UART_CTS / PWM1 output / GPIO PA[3]
SPI data output / UART_TX / PWM0 output /
GPIO PA[2]
SPI chip select (Active low) / UART_RX /
Antenna select pin 0 / GPIO PD[6]
DP(SWS)/PA<6>
Digital I/O USB data positive (Single wire slave) / GPIO PA[6]
1 2 3 4 5 6 7 ITON Technology Corp. Page 6 of 17 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 28 29 30 www.sziton.com MBTL1_V1.3 CK/UART_RTS/PWM2/PA<4>
Digital I/O SPI clock (I2C_SCK) / UART_RTS / PWM2 output / GPIO PA[4]
DM/PA<5>
Digital I/O USB data minus / GPIO PA[5]
I2C_SCK/PWM1_N/PWM0/
PGA_N0/PC<1>
I2C serial clock / PWM1 inverting output /
Digital I/O PWM0 output / PGA left channel negative input / GPIO PC[1]
PWM1/UART_RX/I2C_SCK/XC32K_ I/PGA_N1/PC<3>
PWM1 output / UART_RX / I2C serial clock /
Digital I/O
(optional) 32kHz crystal input / PGA right channel negative input / GPIO PC[3]
PWM2/UART_CTS/PWM0_N/
PWM2 output / UART_CTS / PWM0 inverting sar_aio<8>/PC<4>
output / SAR ADC input / GPIO PC[4]
PWM3_N/UART_RX/ATSEL0/
PWM3 inverting output / UART_RX / Antenna sar_aio<9>/PC<5>
select pin 0 / SAR ADC input / GPIO PC[5]
RX_CYC2LNA/ATSEL1/PWM4_N/
Control external LNA / Antenna select pin 1 /
Digital I/O Power ground TX_CYC2PA/ATSEL2/PWM5_N/
Control external PA / Antenna select pin 2 /
DMIC_DI/PWM0_N/UART_RX/
DMIC data input / PWM0 inverting output /
Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O PWM4 inverting output / GPIO PC[6]
PWM5 inverting output / GPIO PC[7]
UART_RX / GPIO PA[0]
/ I2S clock / GPIO PA[1]
PWM0 output / PWM0 inverting output /
GPIO PD[5]
PWM0/PWM0_N/PD<5>
Digital I/O NC NC Digital I/O SWM/I2S_SDO/PWM2_N/
Single wire master / I2S serial data output /
PWM2 inverting output / GPIO PD[4]
SWS/UART_RTS/PA<7>
Digital I/O Single wire slave/ UART_RTS / GPIO PA[7]
TX_CYC2PA/UART_CTS/PD<1>
Digital I/O Control external PA / UART_CTS / GPIO PD[1]
RX_CYC2LNA/7816_TRX
(UART_TX)/PD<0>
Control external LNA / UART 7816 TRX Digital I/O
(UART_TX) / GPIO PD[0]
SDM_P0/PWM4/lc_comp_ain<4>/
sar_aio<4>/PB<4>
SDM_N0/PWM5/lc_comp_ain<5>/
sar_aio<5>/PB<5>
SDM positive output 0 / PWM4 output / Low Digital I/O power comparator input / SAR ADC input /
GPIO PB[4]
SDM negative output 0 / PWM5 output / Low Digital I/O power comparator input / SAR ADC input /
GPIO PB[5]
GND PC<6>
PC<7>
PA<0>
PA<1>
NC PD<4>
DMIC_CLK/7816_CLK/I2S_CLK/
DMIC clock / UART 7816 clock 27 GND PWR power ground I2C_SDA/PWM4_N/UART_RTS/
PGA_P0/PC<0>
I2C serial data / PWM4 inverting output /
Digital I/O UART_RTS / PGA left channel positive input /
PWR PWR GPIO PC[0]
power supply power ground VDD GND ITON Technology Corp. Page 7 of 17 MBTL1_V1.3 www.sziton.com 31 RESETB RESET Power on reset, active low 32 33 34 35 37 I2C_SDA/PWM4_N/UART_RTS/
PGA_P0/PC<0>
PWM0_N/UART_RTS/TX_CYC2PA/
lc_comp_ain<3>/sar_aio<3>/PB<3>
PWM5/UART_CTS/RX_CYC2LNA/
lc_comp_ain<2>/sar_aio<2>/PB<2>
I2C serial data / PWM4 inverting output /
Digital I/O UART_RTS / PGA left channel positive input
/GPIOPC[0]
PWM0 inverting output / UART_RTS / Control Digital I/O external PA / Low power comparator input /
SAR ADC input / GPIO PB[3]
PWM5 output / UART_CTS / Control external Digital I/O LNA / Low power comparator input / SAR ADC input / GPIO PB[2]
PWM0 output / UART 7816 TRX (UART_TX) /
PWM0/7816_TRX(UART_TX)/I2C_ I2C serial data / (optional) 32kHz crystal SDA/XC32K_O/PGA_P1/PC<2>
output / PGA right channel positive input /
Digital I/O 36 SPI_CN/I2S_LR/PWM3/PD<2>
Digital I/O SPI_CK/I2S_BCK/7816_TRX
(UART_TX)/PD<7>
SDM_P1/SPI_DI/UART_RTS/
Digital I/O GPIO PC[2]
SPI chip select (Active low) / I2S left right channel select / PWM3 output / GPIO PD[2]
SPI clock (I2C_SCK) / I2S bit clock / UART 7816 TRX (UART_TX) / GPIO PD[7]
SDM positive output 1 / SPI data input 38 lc_comp_ain<6>/sar_aio<6>/
Digital I/O
(I2C_SDA) / UART_RTS / Low power PB<6>
comparator input / SAR ADC input /GPIO PB[6]
SDM_N1/SPI_DO/UART_RX/
SDM negative output 1 / SPI data output /
39 lc_comp_ain<7>/sar_aio<7>/
Digital I/O UART_RX / Low power comparator input /
PB<7>
40 GND SAR ADC input / GPIO PB[7]
PWR power ground Notes 1) All digital IOs including PA<0> ~ PD<7> can be used as GPIOs and have configurable pull-up/pull-down resistor. 2) SPI:
PD<7>: SPI_CK, PB<6>: SPI_DI, PB<7>: SPI_DO, PD<2>: SPI_CN PA<2>: DO, PA<3>: DI, PA<4>: CK, PD<6>: CN 3) I2C:
PC<0> ~ PC<3> can be used as I2C. PC<0>: I2C_SDA, PC<1>: I2C_SCK, PC<2>: I2C_SDA,PC<3>: I2C_SCK I2C can also be multiplexed with SPI interface, i.e. I2C_SDA/I2C_SCK can be multiplexed with SPI_DI
(DI)/SPI_CK (CK) respectively. 4) Audio PGA/AMIC input: PC<0>~PC<3>. 5) DMIC: PA<0>: DMIC_DI, PA<1>: DMIC_CLK 6) 7) Stereo audio output: PB<4>: SDM_P0, PB<5>: SDM_N0, PB<6>: SDM_P1, PB<7>: SDM_N1 8) UART:
I2S: PD<7>: I2S_BCK, PA<1>: I2S_CLK, PD<2>: I2S_LR, PD<3>: I2S_SDI, PD<4>: I2S_SDO PA<0>: UART_RX, PA<2>: UART_TX, PB<0>: UART_RX, PB<1>: UART_TX, PB<7>: UART_RX, PC<3>: UART_RX, PC<5>: UART_RX, PD<6>: UART_RX UART hardware flow control:
PA<3>: UART_CTS, PA<4>: UART_RTS, PA<7>: UART_RTS, PB<2>: UART_CTS, PB<3>:UART_RTS, PB<6>:
UART_RTS, PC<0>: UART_RTS, PC<4>: UART_CTS, PD<1>: UART_CTS ITON Technology Corp. Page 8 of 17 www.sziton.com UART 7816:
PD<7>: 7816_TRX (UART_TX), PA<1>: 7816_CLK, PC<2>: 7816_TRX (UART_TX), PD<0>:7816_TRX (UART_TX), PD<3>: 7816_TRX (UART_TX) 9) USB: PA<5>: DM, PA<6>: DP 10) Single Wire debug interface:
MBTL1_V1.3 PA<7>: SWS. SWS can also be multiplexed with DP. PD<4>: SWM 11) RX_CYC2LNA & TX_CYC2PA:
PB<2>: RX_CYC2LNA, PB<3>: TX_CYC2PA, PC<6>: RX_CYC2LNA, PC<7>: TX_CYC2PA, PD<0>: RX_CYC2LNA, PD<0>: RX_CYC2LNA, PD<1>: TX_CYC2PA RX_CYC2LNA/TX_CYC2PA serves to control enabling external PA/LNA 12ATSEL0~2:
PB<0>: ATSEL1, PB<1>: ATSEL2, PC<5>: ATSEL0, PC<6>: ATSEL1, PC<7>: ATSEL2, PD<6>:ATSEL0 ATSEL0~2 serves to select one of up to eight external antennas connected to the antenna select component. The selected antenna channel is connected to the RF_IO pin. 13Low power comparator input: PB<1>~ PB<7>. 14ADC GPIO input: PB<0>~ PB<7>, PC<4>~ PC<5>. 15Do not use PC<7:5> for dynamic applications. Its highly recommended to use these IOs in DC applications, e.g. as control or detect lines. 16Pin drive strength:
PA<5:7> and PB<0:3> support drive strength up to 8mA (8mA when DS=1, 4mA whenDS=0);
PB<4:7> support drive strength up to 16mA (16mA when DS=1, 12mA whenDS=0); other GPIOs
(PA<0:4>, PC<0:7> and PD<0:7>) support drive strength up to 4mA(4mA when DS=1, 2mA when DS=0). DS: Drive strength. Default: 1 (high DS level). DS configuration will take effect when the pin is used as output. 3 Electrical Specifications Note: The electrical characteristics currently listed in this section are target specifications and only supplied for reference. Some data may be updated according to actual test results. 3.1 Absolute maximum ratings Table 3-1 Absolute maximum ratings Characteristics Sym. Min. Max Unit Test Condition Supply Voltage Storage temperature Range VDD TStr
-0.3
-30 3.6 85 V oC Includes ripples CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. ITON Technology Corp. Page 9 of 17 www.sziton.com 3.2 Recommended operating condition MBTL1_V1.3 Table 3-2 Recommended operating condition Item Sym. Min Typ. Max Unit Condition Power-supply voltage Storage temperature Range Operating Temperature Range VDD TStr TOpr 1.8
-30
-30 3.3 3.6 85 85 V oC oC Includes ripples 3.3 DC characteristics Table 3-3 DC characteristics (VDD=3.3V, T=25) Item RX current Tx current Sym. IRx ITx Min Typ. Max Unit Condition 6.3 5.4 mA mA
@BLE RX
@0dBM with DCDC 3.4 AC characteristics Table 3-4 AC characteristics (VDD=3.3V, T=25) Item Sym. Min Typ. Max Unit Condition Digital inputs/outputs Input high voltage Input low voltage Output high voltage Output low voltage VIH VIL VOH VOL 0.7VDD VSS 0.9VDD VSS VDD 0.3VDD VDD 0.1VDD V V V V RF performance RF frequency range 2380 2500 MHz Programmablein 1MHz step Data rate BLE 1Mbps, 250kHz deviation BLE 125kbps, 250kHz deviation BLE 500kbps, 250kHz deviation BLE 1Mbps RF_Rx performance (250kHz deviation)*1 Sensitivity 1Mbps Frequency Offset Tolerance
-250
-93
+300 dBm kHz Co-channel rejection
-11 dB Wanted signal at
-67dBm ITON Technology Corp. Page 10 of 17 BLE 1Mbps RF_Tx performance Item Sym. Min Max Unit 2.5 MHz 2.7 MHz BLE 500kbps RF_Rx performance (250kHz deviation)*2 500kbps
-93 dBm
-150
+50 kHz www.sziton.com In-band blocking rejection
(Equal Modulation Interference) Image rejection Output power, maximum setting Output power, minimum setting Programmable output power range Modulation 20dB bandwidth Modulation 20dB bandwidth Sensitivity Frequency Offset Tolerance Co-channel rejection In-band blocking rejection
(Equal Modulation Interference) Image rejection Output power, maximum setting Output power, minimum setting Programmable output power range Modulation 20dB bandwidth ITON Technology Corp.
+1/-1 MHz offset
+2/-2 MHz offset
>=3MHz offset
+1/-1 MHz offset
+2/-2 MHz offset
>=3MHz offset Typ. 1/3 37/39 42 37 10
-45 55
-1 34/36 42/42 42 42 10
-45 55 MBTL1_V1.3 Condition Wanted signal at
-67dBm Wanted signal at
-67dBm dB dB dB dB dBm dBm dB dB dB dB dB dB dBm dBm dB Wanted signal at
-67dBm Wanted signal at
-67dBm Wanted signal at
-67dBm Page 11 of 17 BLE 500kbps RF_Tx performance 2.5 MHz Item Sym. Min Typ. Max Unit BLE 125kbps RF_Rx performance (250kHz deviation)*3 125kbps
-93 dBm
-150
+50 kHz www.sziton.com Sensitivity Frequency Offset Tolerance Co-channel rejection In-band blocking
+2/-2 MHz rejection
+1/-1 MHz offset offset
>=3MHz offset Image rejection Output power, maximum setting Output power, minimum setting Programmable output power range Modulation 20dB bandwidth
-3 32/34 42/42 42 42 10
-45 55 2.5 BLE 125kbps RF_Tx performance MBTL1_V1.3 Condition Wanted signal at
-67dBm Wanted signal at
-67dBm Wanted signal at
-67dBm dB dB dB dB dB dBm dBm dB MHz
*1 For actual sensitivity level of BLE 1Mbps mode, please refer to Bluetooth 4.2 specification.
*2 For actual sensitivity level of BLE 500kbps mode, please refer to Bluetooth 4.2 specification.
*3 For actual sensitivity level of BLE 125kbps mode, please refer to Bluetooth 4.2 specification. 4 Application Diagram DC apply VDD TL8258-Q40P MCU UART I2C Outside circuit GPIO PWM ADC I2C I2S BLE/BLE MESH MODULE BT4.2 Mobile phone APP ITON Technology Corp. Page 12 of 17 www.sziton.com Figure 4-1 Application diagram for TL8258-Q40P MBTL1_V1.3 5 Mechanical and Package 5.1 Recommended PCB Footprint L: 15.33 mm0.15mmW: 25.15 mm0.15 mm ; H: 3.00 mm0.15 mm Figure 5-1 Recommended PCB Footprint Note It is recommended to place this module at the edge of the main board. The module PCB antenna isoriented towards the outside of the board. The antenna is away from some sources of interference such as DCDC. The antenna area should be hollowed all layers. Try not to route under the module. ITON Technology Corp. Page 13 of 17 www.sziton.com 5.2 Packaging Information MBTL1_V1.3 Figure 5-2 Package way 6 Thermal Reflow Referred to IPC/JEDEC standard Peak temperature :< 250 Number of times :< 2 ITON Technology Corp. Page 14 of 17 www.sziton.com MBTL1_V1.3 Figure 6-1. Recommended Reflow for Lead Free Solder 7 FCC & IC Statement For FCC statement This device complies with Part 15.247 of the FCC Rules. Host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. Host manufacturer in any case shall ensure host product which is installed and operating with the module is in compliant with Part 15B requirements. Please note that For a Class B or Class A digital device or peripheral, FCC Rules are as following you may refer to:
For Class B Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency For Class A ITON Technology Corp. Page 15 of 17 www.sziton.com MBTL1_V1.3 energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. Warning: changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. RF Exposure compliance statement This module complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The device can be used in portable exposure condition without restriction Antenna Information This module is tested with the following antenna Module No. MBTL1 Antenna Type PIFA Antenna Frequency 2402-2480MHz Max. Antenna Gain 0.47dBi Antenna Change Notice to Host manufacturer:
Recommend using antenna which certified with this module mentioned in this manual. If you desire to increase antenna gain and either change antenna type or use same antenna type certified, a Class II permissive change application is required to be filed by us, or you (host manufacturer) can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application, based on the new emissions testing. Please perform testing on frequency bands where the antenna gain is highest, worst-case band-edges based on original filing, and only on frequency bands where the antenna gain is highest. Notice regarding trace antenna to host product manufacturer:
Any deviation(s) from the defined parameters of the antenna trace, as described by this instruction, host product manufacturer must notify us that you wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by us, or you (host manufacturer) can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Labelling and compliance statement instruction for host product manufacturer Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC ID: PIYMBTL1-
19A5R any similar wording that expresses the same meaning may be used. FCC regulatory Compliance Statement mentioned in this manual shall be properly included in host product manual per FCC Rules. The host product manufacturer shall be aware not to provide information to the end user on how to install or remove this module in your host product manual. Guide on test modes and additional testing requirements Host product manufacturer is ultimately responsible for testing their end-product for any additional compliance ITON Technology Corp. Page 16 of 17 requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, additional transmitter(s) in the host, etc.). Test software access to different test modes:
(1) Fixed frequency test: 8258_Test_EMI_v0003.bin
(2) Bluetooth transmission8258_module.bin MBTL1_V1.3 www.sziton.com For IC statement This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. Lmetteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
1. Lappareil ne doit pas produire de brouillage;
2. Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Cet quipement est conforme aux limites d'exposition aux radiations IC CNR-102 tablies pour un environnement non contrl. Cet metteur ne doit pas tre situ ou fonctionner conjointement avec une autre antenne ou un autre metteur. Please notice that if the IC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains IC: 4390C-MBTL119A5R any similar wording that expresses the same meaning may be used. Ltiquette dhomologation dun module dInnovation, Sciences et Dveloppement conomique Canada devra tre pose sur le produit hte un endroit bien en vue, en tout temps. En labsence dtiquette, le produit hte doit porter une tiquette sur laquelle figure le numro dhomologation du module dInnovation, Sciences et Dveloppement conomique Canada, prcd du mot contient , ou dune formulation similaire allant dans le mme sens et qui va comme suit :
Contient IC: 4390C-MBTL119A5R est le numro dhomologation du module ITON Technology Corp. Page 17 of 17