| submitted | available | document details (if available) | source link |
|---|---|---|---|
| January 17 2017 | January 17 2017 |
| various | Users Manual | Users Manual | 332.16 KiB | January 17 2017 |
ESP-WROOM-S2 Datasheet Version 1.1 Copyright 2016 About This Guide This document introduces users to the specications of ESP-WROOM-S2 hardware, including the following topics. Chapter Title Subject Chapter 1 Overview Introduction to ESP-WROOM-S2, including dimensions and specications. Chapter 2 Pin Description Introduction to pin layout and the relevant description. Chapter 3 Functional Description Description of the major functional modules and protocols applied on ESP-WROOM-S2, including CPU, ash, memory and interfaces. Chapter 4 Electrical Characteristics Electrical data of ESP-WROOM-S2. Chapter 5 Release Notes Date Version Release notes 2016.06 2016.08 V1.0 V1.1 First release. Updated the operating temperature range;
Added NCC Wi-Fi standard;
Updated Section 3.4 Interface Description. Table of Contents 1. Overview
................................................................................................................................. 1 2. Pin Description
....................................................................................................................... 3 3. Functional Description 3.1. MCU 3.2. Memory
............................................................................................................ ......................................................................................................................................... ..................................................................................................................................... ............................................................................................ Internal SRAM and ROM
...................................................................................................................... ...................................................................................................................... ................................................................................................................ 3.2.1. 3.2.2. SPI Flash 3.3. Crystal Oscillator 3.4. Interface Description 5 5 5 5 5 6 7 4. Electrical Characteristics 8 8 8 8 9 9 10 11 5. .........................................................................................................................12
........................................................................................................ ...................................................................................................... ...................................................................................... ................................................................................................ ........................................................................................................................ .................................................................................................................................. ............................................................................................................... .......................................................................................................................... 4.1. Absolute Maximum Ratings 4.2. Recommended Operating Conditions 4.3. Digital Terminal Characteristics 4.4. RF Performance 4.5. Sensitivity 4.6. Power Consumption 4.7. Reow Prole 1. 1. Overview Overview Espressif provides the SMD module - ESP-WROOM-S2 that integrates ESP8266EX. The module has received various adjustments to achieve better RF performance. We recommend using ESP-WROOM-S2 for tests or for further development. Note:
For more information on ESP8266EX, please refer to ESP8266EX Datasheet. The module size is 16 mm x 23 mm x 3 mm (see Figure 1-1). The ash used on this module is a 2 MB SPI ash connected to HSPI, with the package size of SOP 8-150 mil. The gain of the on-board PCB antenna is 2 dBi. The ESP-WROOM-S2 works as the SDIO/SPI slave with the SPI speed of up to 8 Mbps. Figure 1-1. ESP-WROOM-S2 Module Table 1-1. ESP-WROOM-S2 Specications Categories Items Specications Standards FCC Wi-Fi Wi-Fi protocols Frequency range Peripheral interface 802.11 b/g/n 24M ~ 24 UART/I2C/GPIO/PWM/SDIO/SPI/IR Remote Control/
ADC GPIO/PWM Espressif
/1 13 2016.08 1. Overview Categories Items Specications Hardware Operating voltage 3.0V ~ 3.6V Operating current Average: 80 mA Operating temperature range
-40C ~ 85C Storage temperature
-40C ~ 85C Package size 16 mm x 23 mm x 3 mm External interface
-
Wi-Fi mode Security Encryption Station/SoftAP/SoftAP + Station WPA/WPA2 WEP/TKIP/AES Software Firmware upgrade Software development UART Download / OTA (via network) / Download and burn rmware via host Supports Cloud Server Development SDK for secondary development Network protocols IPv4, TCP/UDP/HTTP/FTP User conguration AT Instruction Set, Cloud Server, Android/iOS App Note:
ESP-WROOM-S2 with high temperature range option (-40C ~ 125C) is available for custom order. Espressif
/2 13 2016.08 2. Pin Description 2. Pin Description Figure 2-1 shows the pin distribution of the SMD Module. 16.00 PCB ANTENNA 6.00 GND 3V3 IO16 IO15 IO2 IO0 IO4 15.70 SD2/IO9 SD3/CS CMD/MOSI 1.75 0.85 4.50 1:GND 4.50 1.86 0.60 1.50 23.00 EN ADC_IN RST IO5 TXD RXD SD1/INT SD0/MISO 7.30 SCLK GND 0.90 7.00 Unit: mm Figure 2-1. Top View of The ESP-WROOM-S2 Table 2-1. ESP-WROOM-S2 Dimensions Length Width Height PAD size (bottom) Pin Pitch 16 mm 23 mm 3 mm 0.9 mm x 0.85 mm 1.5 mm ESP-WROOM-S2 has 20 pins, please see the pin denitions in Table 2-2. Espressif
/3 13 2016.08 2. Pin Description Table 2-2. ESP-WROOM-S2 Pin Denitions Pin Name Functional Description GND Ground 3.3 V power supply (VDD) Note:
It is recommended the maximum output current a power supply provides be of 500 mA or above. GPIO16; used for Deep-sleep wake-up when connected to RST pin. HSPICS UART download: pull down. SDIO boot: oating (internal pull-up) or pull up. GPIO2; UART1_TXD UART download: pull down. SDIO boot: dont-care. GPIO0 UART download: pull down. SDIO boot: dont-care. GPIO4 3V3 IO16 IO15 IO2 IO0 IO4 SD2/IO9 SD_D2 (Series resistor: 100 ~ 200 , 10 k pull-up resistor); GPIO9 SD3/CS SD_D3 (Series resistor: 100 ~ 200 , 10 k pull-up resistor); SLAVE_ SPI_CS CMD/MOSI SD_CMD (Series resistor: 100 ~ 200 , 10 k pull-up resistor); SLAVE_ SPI_MOSI GND SCLK Ground SD_CLK (Series resistor: 100 ~ 200 ); SLAVE_ SPI_CLK SD0/MISO SD_D0 (Series resistor: 100 ~ 200 , 10 k pull-up resistor); SLAVE_ SPI_MISO SD1/INT SD_D1 (Series resistor: 100 ~ 200 , 10 k pull-up resistor); SLAVE_ SPI_INT RXD TXD IO5 RST UART0_RXD, receive end in UART download;
GPIO3 UART0_TXD, transmit end in UART download, oating (internal pull-up) or pull up;
GPIO1 GPIO5 Reset ADC_IN Tests the power-supply voltage of VDD3P3 and the input power voltage of TOUT. These two functions cannot be used simultaneously. EN Chip enable pin (cannot be oating). Active high. No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Espressif
/4 13 2016.08 3. Functional Description Functional Description 3. 3.1. MCU ESP8266EX contained in the ESP-WROOM-S2 integrates Tensilica L106 32-bit micro controller (MCU) and a 16-bit RSIC. The CPU clock speed is 80 MHz and can reach a maximum value of 160 MHz. The system can readily run a Real Time Operating System
(RTOS). Currently, the Wi-Fi stack only takes up 20% of CPU time. The remaining CPU time
(80% of total MIPS) can be used for user application. The MCU can work in conjunction with the other parts of the chip through the following interfaces. Programmable RAM/ROM interface (iBus) that connects to memory controller and can access the external ash. Data RAM interface (dBus) that connects to memory controller. AHB interface that accesses the register. 3.2. Memory 3.2.1. Internal SRAM and ROM ESP8266EX Wi-Fi SoC integrates memory controller including SRAM and ROM. MCU can access the memory controller through iBus, dBus, and AHB interfaces. All these interfaces can access ROM or RAM units. A memory arbiter determines the running sequence in the arrival order of requests. According to our current version of SDK, SRAM space available to users is assigned as below. RAM size < 50 kB, that is, when ESP8266EX is working in Station mode and connects to the router, available space in Heap + Data sector is around 50 kB. There is no programmable ROM in ESP8266EX, therefore, user program must be stored in the SPI ash integrated into the ESP-WROOM-S2. 3.2.2. SPI Flash ESP8266EX supports SPI ash. Theoretically speaking, ESP8266EX can support up to 16 MB SPI ash. ESP-WROOM-S2 currently integrates 2 MB SPI ash memory. ESP-WROOM-S2 supports these SPI modes: Standard SPI, DIO (Dual I/O), DOUT (Dual Output), QIO (Quad I/O) and QOUT (Quad Output). Espressif
/5 13 2016.08 3. Functional Description Notice:
Please use the most updated download tool and congure SPI MODE in the download tool as DIO or DOUT. 3.3. Crystal Oscillator ESP-WROOM-S2 uses 26 MHz crystal oscillator. The accuracy of the crystal oscillator should be 10 PPM, and the operating temperature range is -20C to 85C. When using the download tool, please note to select the right crystal oscillator type. In circuit design, capacitors C1 and C2 which connect to the earth, are added to the input and output terminals of the crystal oscillator respectively. The values of the two capacitors can be exible, ranging from 6 pF to 22 pF, however, the specic capacitive values depend on further testing and adjustment on the overall performance of the whole circuit. Normally, the capacitive values of C1 and C2 are within 10 pF for the 26 MHz crystal oscillator. Crystal oscillator should be placed as close to the XTAL pins as possible (without the traces being too long). It is good practice to add high density ground vias around the clock trace for great insulation. There should be no vias on the input and output traces, which means the traces cannot cross layers. Place the input and output bypass capacitors on the near left or right side of the chip. Do not place them on the traces. Do not route high-frequency digital signal lines in the four-layer board. It is best not to route any signal line under the crystal oscillator. The larger the copper area on the top layer is, the better. As crystal oscillator is a sensitive component, do not place magnetic components such as high current inductance nearby. Espressif
/6 13 2016.08 3.4. Interface Description 3. Functional Description Table 3-1. Interface Description Interface Pin Functional Description SPI GPIO12/13/14/15 or GPIO6/7/8/11 PWM Any available GPIO
(EXCEPT GPIO16) IR Any available GPIO
(EXCEPT GPIO16) ADC TOUT I2C Any available GPIO
(EXCEPT GPIO16) UART UART0:
TXD(U0TXD), RXD(U0RXD) UART1: IO2(TXD) S2 can control SPI Slave as a Master or communicate with Host MCU as a Slave. In overlap mode, S2 can share the SPI interface with Flash, shifted by different CS signals. Currently the demo provides 4 PWM channels (users can extend to 6 channels). PWM interface can realize the control of LED lights, buzzers, relays, electronic machines, etc. The functionality of infrared remote control interface can be realized via software programming. The interface uses NEC coding, modulation, and demodulation. The frequency of modulated carrier signal is 38 kHz. Tests the power supply voltage of VDD3P3 (Pin 3 and Pin 4) and the input power voltage of TOUT (Pin 6). However, these two functions cannot be used simultaneously. This interface is typically used in sensors. Connects to external sensors and display screens, etc. Communicates with UART device. Downloading: U0TXD + U0RXD or GPIO2 + U0RXD Communicating (UART0): U0TXD, U0RXD Debugging: UART1_TXD (GPIO2) can be used to print debugging information. Espressif
/7 13 2016.08 4. Electrical Characteristics 4. Electrical Characteristics Note:
Unless otherwise specied, measurements are based on VDD = 3.3 V, TA = 25C. 4.1. Absolute Maximum Ratings Table 4-1. Absolute Maximum Ratings Rating Condition Value Unit Storage temperatue Maximum soldering temperature
-
-
-40 ~ 125 260 Supply voltage IPC/JEDEC J-STD-020 3.0 ~ 3.6 V 4.2. Recommended Operating Conditions Table 4-2. Recommended Operating Conditions Operating condition Symbol Min Typ Max Unit Operating temperature Supply voltage
-
VDD
-40 3.0 20 3.3 125 3.6 V 4.3. Digital Terminal Characteristics Table 4-3. Digital Terminal Characteristics Terminals Symbol Min Typ Max Unit Input logic level low Input logic level high Output logic level low Output logic level high VIL VIH VOL VOH
-0.3 0.75 VDD N 0.8 VDD
-
-
-
-
0.25 VDD VDD + 0.3 0.1 VDD N V V V V Espressif
/8 13 2016.08 4.4. RF Performance 4. Electrical Characteristics Table 4-4. RF Performance Description Min Typ Max Unit Input frequency Input impedance Input reection PA output power at 72.2 Mbps PA output power in 11b mode 2400
-
-
15.5 16 CCK, 1 Mbps CCK, 11 Mbps 6 Mbps (1/2 BPSK) 54 Mbps (3/4 64-QAM) HT20, MCS7 (65 Mbps, 72.2 Mbps)
-
-
-
-
-
Sensitivity
-
50
-
16.5 17
-98
-91
-93
-75
-72 OFDM, 6 Mbps OFDM, 54 Mbps HT20, MCS0 HT20, MCS7 Adjacent channel rejection
-
-
-
-
37 21 37 20 2483.5
-
-10 17.5 18
-
-
-
-
-
-
-
-
-
MHz ohm dB dBm dBm dBm dBm dBm dBm dBm dB dB dB dB 4.5. Sensitivity Table 4-5. Sensitivity Parameters Min Typ Max Unit Input frequency Input impedance Input reection PA output power at 72.2 Mbps PA output power in 11b mode DSSS, 1 Mbps
-
50
-
16.5 17
-98 2412
-
-
15.5 16 Sensitivity
-
/9 13 24
-
-10 17.5 18 MHz dB dBm dBm
-
dBm 2016.08 Espressif 4. Electrical Characteristics Parameters Min Typ Max Unit CCK, 11 Mbps 6 Mbps (1/2 BPSK) 54 Mbps (3/4 64-QAM) HT20, MCS7 (65 Mbps, 72.2 Mbps)
-
-
-
-
-91
-93
-75
-72 OFDM, 6 Mbps OFDM, 54 Mbps HT20, MCS0 HT20, MCS7 Adjacent channel rejection
-
-
-
-
37 21 37 20
-
-
-
-
-
-
-
-
dBm dBm dBm dBm dB dB dB dB 4.6. Power Consumption The following power consumption data were obtained from the tests with 3.3 V power supply and a voltage stabilizer, in 25C ambient temperature. All tests were performed at the antenna port without SAW lter. All data are based on 90% duty cycle in continuous transmission mode. Table 4-6. Power Consumption Modes Min Typ Max Unit Tx 802.11b, CCK 11 Mbps, POUT = +17 dBm Tx 802.11g, OFDM 54 Mbps, POUT = +15 dBm Tx 802.11n, MCS7, POUT = +13 dBm Rx 802.11b, 1024 bytes packet length , -80 dBm Rx 802.11g, 1024 bytes packet length , -70 dBm Rx 802.11n, 1024 bytes packet length , 65 dBm Modem-Sleep Light-Sleep Deep-Sleep Power O
-
-
-
-
-
-
-
-
-
-
170 140 120 50 56 56 15 0.9 10 0.5
-
-
-
-
-
-
-
-
-
-
mA mA mA mA mA mA mA mA A A Espressif
/10 13 2016.08 4. Electrical Characteristics Notes:
Modem-Sleep is used when applications require CPU to be working, such as PWM or I2S applications. In the scenarios where Wi-Fi connectivity is maintained and data transmission is not required, Wi-Fi Modem circuit can be shut down to save power, according to 802.11 standards (such as U-APSD). For example, in DTIM3, when ESP8266EX sleeps for 300 ms and wakes up for 3 ms to receive Beacon packages from AP, the overall average current consumption is about 15 mA.
Light-Sleep is used for applications whose CPU may be suspended, such as Wi-Fi switch. In the scenarios where Wi-Fi connectivity is maintained and data transmission is not required, Wi-Fi Modem circuit and CPU can be shut down to save power, according to 802.11 standards (such as U-APSD). For example, in DTIM3, when ESP8266EX sleeps for 300 ms and wakes up for 3 ms to receive Beacon packages from AP, the overall average current consumption is about 0.9 mA.
Deep-Sleep is for applications that do not require Wi-Fi connectivity and only transmit data with long time lags, e.g., a temperature sensor that measures temperature every 100 s. For example, when ESP8266EX sleeps for 300 s then wakes up to connect to AP (taking about 0.3 ~ 1 s), the overall average current consumption is far less than 1 mA. 4.7. Reow Prole Table 4-7. Reow Prole Indicator Value Ramp-up Rate (TS Max to TL) Preheat Temperature Min. (TS Min.) Temperature Typ. (TS Typ.) Temperature Min. (TS Max.) Time (TS) Ramp-up Rate (TL to TP) Time maintained above: Temperature (TL)/Time (TL) Peak temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual Peak Temperature (TP) TS max to TL (Ramp-down Rate) Time 25C to Peak Temperature (t) 3/second max. 150 175 200 60 ~ 180 seconds 3/second max. 217/60 ~ 150 seconds 260 max, for 10 seconds 260 + 0/-5 20 ~ 40 seconds 6/second max. 8 minutes max. Espressif
/11 13 2016.08 5. 5. Schematics
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC IDFCC ID
Espressif
/12 13 2016.08 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright 2016 Espressif Inc. All rights reserved. Espressif IOT Team www.espressif.com
This product uses the FCC Data API but is not endorsed or certified by the FCC