BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 BluNor BT840X is a powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) using Nordic nRF52840 SoC. With an ARMCortexTM M4F MCU, available 1MB flash, 256KB RAM, embedded 2.4GHz multi-
protocol transceiver, and an integrated PCB trace antenna or u.FL connector for an external antenna. A power amplifier is integrated in BT840X and BT840XE to increase Bluetooth range. It allows faster time to market with reduced development cost. Bluetooth ranges are measured in environments with Low Multiple Path Interference (LMPI) and antenna at 5 feet (1.52 meters), typical height of thermostat in the USA. Ranges for LMPI, correlating to actual link budget, indicates the Bluetooth signal strength for penetrating walls in buildings. Specifications:
nRF52840 QIAA, ARM Cortex M4F, 64 MHz ARM TrustZone Cryptocell-310 co-processor Complete RF solution with integrated antenna BLE 5 data rate: 2Mbps, 1Mbps, 500kbps, 125kbps. IEEE 802.15.4 Thread and Zigbee data rate: 250 Kbps 2.4 GHz proprietary data rate: 2 Mbps, 1 Mbps Integrated DC-DC converter, inductors on board. Direct powered by Lithium batteries or USB supply
(up to 5.5V) Serial Wire Debug (SWD) Nordic SoftDevice Ready Over-the-Air (OTA) firmware update Flash/RAM: 1MB/256KB. 48 General purpose I/O pins USB 2.0 full speed (12 Mbps) controller QSPI 32 MHz interface High speed 32 MHz SPI Programmable peripheral interconnect (PPI) 12 bit/200 Ksps ADC, 8 configurable channels with programmable gain 64 level comparator 15 level comparator with wake-up from OFF mode Temperature sensor 4x4-channel pulse width modulator (PWM) Audio peripherals: I2S, digital microphone interface
(PDM) 5 x 32 bit timers with counter mode Up to 4x SPI masters/3x SPI slaves Up to 2x I2C compatible 2-wire masters/slaves 2x UART (CTS/RTS) Quadrature Demodulator (QDEC) 3x real time counters (RTC) 128-bit AES HW encryption SoC Receiver Sensitivity: -96 dBm at 1Mbps SoC TX power: programmable +8dBm to -20dBm. Up to +6 dBi antenna gain. Hybrid pins: 16 castellated and 45 LGA. Integrated PCB trace antenna or u.FL connector Operation voltage: 1.7V to 3.6V Operation temperature: - 4 0 C t o + 8 5 C Q D I D : 1 0 8 6 2 1 Applications Secure IoT Beacons/Proximity Connected appliances Model Summaries module SoC Size BT Antenna 32.768 sleep crystal BT range,1 Mbps, LMPI BT range, 1Mbps, 1.52m BT range, 125 Kbps, LMPI. BT range, 125 kBps, 1.52m FCC ID IC ID Lighting products Sensors Home and building automation BT840X nRF52840-QIAA 15x20.8x1.9mm PCB trace + PA Integrated BT840XE nRF52840-QIAA 15x20.8x1.9mm PA + u.FL Integrated Pending Pending Pending Pending 1 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 CE Availability Sample Sample Table Of Contents 1. Introduction .......................................................................................................................................................... 4 BT840X Block Diagram ........................................................................................................................................ 4 BT840X ................................................................................................................................................................ 4 BT840XE .............................................................................................................................................................. 5 2. Codes Development Using Nordic Tools ............................................................................................................ 6 Easy, fast and safe code development ............................................................................................................... 6 Over-The-Air DFU ................................................................................................................................................ 6 SoftDevices .......................................................................................................................................................... 6 Development Tools .............................................................................................................................................. 6 3. Product Descriptions ............................................................................................................................................ 7 Block Diagram of nRF52840 ................................................................................................................................ 8 ARM Trustzone CryptoCell 310 ........................................................................................................................... 9 Mechanical Drawings ......................................................................................................................................... 12 Pin Assignments of BT840X .............................................................................................................................. 13 Pin Function ....................................................................................................................................................... 16 Mounting BT840X on the Host PCB .................................................................................................................. 17 Host Board Design for Low Cost or Long Range .............................................................................................. 18 Control Skyworks Power Amplifier .................................................................................................................... 19 4. Bluetooth Range Measurements ....................................................................................................................... 22 5. AT Commands ................................................................................................................................................... 23 6. BT840X Evaluation Board ................................................................................................................................. 23 Nordic Development Tools ................................................................................................................................ 24 Android OS Apps ............................................................................................................................................... 25 iOS Apps ............................................................................................................................................................ 25 BT840X V4 EvaluationBoard Schematics ......................................................................................................... 25 Suggestion for Battery Power Application ......................................................................................................... 26 7. Miscellaneous .................................................................................................................................................... 27 Soldering Temperature-Time Profile for Re-Flow Soldering ............................................................................. 27 Cautions, Design Notes, and Installation Notes ................................................................................................ 27 Packaging ........................................................................................................................................................... 30 FCC Label .......................................................................................................................................................... 30 Revision History ..................................................................................................................................................... 31 8. Contact Us ......................................................................................................................................................... 32 2 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 3 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 1. Introduction BluNor BT840X Series are powerful, highly flexible, ultra low power wireless modules using Nordic nRF52840 SoCs. With an ARMCortexTM M4F MCU, 1MB flash, 256KB RAM, embedded 2.4GHz multi-protocol transceiver, and an integrated antenna, it allows faster time to market with reduced development cost. The following is a block diagram of BT840X. Antenna circuit and main clock are integrated. All 48 GPIOs of nRF52840 can be accessed from main board. For lower power consumption at idle state, a 32.768 kHz crystal can be added on the host board. BT840X Block Diagram BlurNor BT840X is a sister module of BT832F. The physical size is the same. There are 21 additional LGA pins for additional GPIOs provided by nRF52840. There are 2 modules in the BT840X Series. BT840X Uses an nRF52840 QIAA with Cortex M4F MCU 1MB flash, 256 KB RAM integrated SKY66112 power amplifier Integrated 32.768 KHz sleep crystal Integrated PCB trace antenna 4 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Size: 15x28x1.9mm. BT840XE Uses an nRF52840 QIAA with Cortex M4F MCU 1MB flash, 256 KB RAM An u.FL connector for external antenna. Size: 15x28x1.9mm. Integrated SKY66112 power amplifier. Integrated 32.768 KHz sleep crystal. 5 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 2. Codes Development Using Nordic Tools Development tools by Nordic and other third party development tools recommended by Nordic should be used . Easy, fast and safe code development Nordic development environment for nRF52840 offers a clean separation between application code development and embedded protocol stacks. This means compile, link and run time dependencies with the embedded stack and associated debugging challenges are removed. The Bluetooth low energy and ANT stack is a pre-compiled binary, leaving application code to be compiled stand-alone. The embedded stack interface uses an asynchronous and event driven model removing the need for RTOS frameworks. Over-The-Air DFU The nRF52840 is supported by an Over-The-Air Device Firmware Upgrade (OTA DFU) feature. This allows for in the field updates of application software and SoftDevice. SoftDevices The Nordic protocol stacks are known as SoftDevices and complement the nRF52 Series SoCs. All nRF52 Series are programmable with software stacks from Nordic. This bring maximum flexibility to application development and allows the latest stack version to be programmed into the SoC. SoftDevices available from Nordic:
S140: Bluetooth low energy concurrent central/peripheral/observer/broadcaster stack. Development Tools Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52 Series devices. nRF52 DK board is recommended for firmware development. Nordic software development tools can be downloaded from the following webpage. http://infocenter.nordicsemi.com/index.jsp?topic=/com.nordic.infocenter.nrf52/dita/nrf52/development/nrf52_dev_kit.htm l&cp=1_1 6 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 3. Product Descriptions Brief description of nRF52840 SoC is provided. For full description of the SoC, please download from Nordic Semiconductor website. https://www.nordicsemi.com/eng/Products/Bluetooth-low-energy Block Diagram of nRF52840 7 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 The following is a block diagram of Nordic nRF52840 Bluetooth Low Energy (BLE) SoC. Arrows with white heads indicate signals that share physical pins with other signals. The 32 bit ARM Cortex M4F MCU with hardware supports for DSP instructions and floating point operations, code density and execution speed are higher than other Cortex M MCU. The Programmable Peripheral Interconnect (PPI) system provides a 20-channel bus for direct and autonomous system peripheral communication without CPU intervention. This brings predictable latency times for peripheral to peripheral interaction and power saving benefits associated with leaving CPU idle. The device has 2 global power modes 8 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 ON/OFF, but all system blocks and peripherals have individual power management control which allows for an automatic switching RUN/IDLE for system blocks based only on those required/not required to achieve particular tasks. The radio supports Bluetooth low energy and ANT. Output power is scalable from a maximum of +8dBm down to -20 dBm in 4dB steps. Sensitivity is increased to -96 dBm to -89 dBm, depending on data rate. Sensitivity for BLE is -96 dBm, and -92.5 dBm for ANT. ARM Trustzone CryptoCell 310 ARM TrustZone CryptoCell-310co-processor is a security subsystem which provides Root of Trust (RoT) and cryptographic services for a device. CryptoCell services are available to the application through a software library API, not a hardware register interface. The following cryptographic features are provided. FIPS-140-2 certified True Random Number Generator (TRNG) 9 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 RSA asymmetric encryption Up to 2048 bit key size PKCS#1 v2.1/v1.5 Optional CRT support Elliptic curve cryptography (ECC) NIST FIPS 186-4 recommended curves using pseudo-random parameters, up to 521 bits:
Prime field: P-192, P-224, P-256, P-384, P-521 SEC 2 recommended curves using pseudo-random parameters, up to 521 bits:
Prime field: P-160, P-192, P-224, P-256, P-384, P-521 Koblitz curves using fixed parameters, up to 256 bits:
Prime field: P-160, P-192, P-224, P-256 Edwards/Montgomery curves:
Ed25519, Curve 25519 ECDH/ECDSA support Secure remote password protocol (SRP) Up to 3072 bit operations Hashing functions SHA-1, SHA-2 up to 256 bit size keyed-hash message authentication code (HMAC) AES symmetric encryption General purpose AES engine (encrypt/decrypt, sign/verify) 128 bit key size Supported encryption modes: ECB, CBC, CMAC/CBC-MAC, CTR, CCM/CCM*. ChaCha20/Poly1305 symmetric encryption Supported keyed size: 128 and 256 bits Authenticated encryption with associated data (AEAD) mode 10 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 11 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Mechanical Drawings The followings are mechanical drawings of BT840X and BT832XE. The physical sizes of both are the same, 15x20.8x1.9mm. Except the 19 pins in solid black dots, BT840X and BT832XE is hardware pin to pin compatible. Firmware configuration is required to perform the same function. Two types of pins are available to meet different application requirements. 16 castellated pins for application needing limited number of IOs. SMT equipment is not required for soldering castellated pins. BT840X and BT840XE mechanical drawings 12 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Pin Assignments of BT840X The followings are BT840X pin assignment. Pin functions are in a table in next section. Please refer to Nordic nRF52840 Product Specifications for detailed descriptions and features supported. https://www.nordicsemi.com/eng/Products/nRF52840 BT840X pins is a super set of that of BT832F. A PCB developed for BT832 Series can be used for BT840X Series and vice versa. BT832F pin assignments. 13 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 BT840X pin assignments BT840X 52840 pin#
pin#
1 G1 2 H2 3 D2 4 F2 5 A12 6 B13 7 L24 8 J24 9 B1 10 B7 11 T2 12 AD22 13 AD8 14 AC13 15 AA24 16 AC24 pin name P0.26/SDA P0.27/SCL P0.00/XL1 P0.01/XL2 P0.02/AIN0 P0.03/AIN1 P0.09 P0.10 VDD GND P0.11 P1.00 P0.13 P0.18/RESET SWDCLK SWDIO BT832 pin#
52832 pin#
pin name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 38 P0.26 39 P0.27 2 P0.00/XL1 3 P0.01/XL2 4 P0.02/AIN0 5 P0.03/AIN1 11 P0.09 12 P0.10 13 VDD 45 VSS 16 P0.13 21 P0.18 23 P0.20 24 P0.21/RESET 25 SWDCLK 26 SWDIO 14 Descriptions GPIO, configured as I2C SDA on EV-BT840 GPIO, configured as I2C SCL on EV-BT840 GPIO, connection for 32.768kHz crystal GPIO, connection for 32.768kHz crystal GPIO, Analog input GPIO, Analog input GPIO GPIO DC supply 1.7V to 3.6V Ground GPIO GPIO GPIO GPIO, configurable as RESET pin Serial Wire Debug clock input Serial Wire Debug I/O BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Z0 Z1 Z2 Z3 Z4 Z5 Z6 A0 A1 A2 A3 A4 A5 A6 B0 B1 B2 B3 B4 B5 B6 C0 C1 C2 C3 C4 C5 C6 D0 D1 D2 D3 D4 D5 D6 E0 E1 E2 E3 E4 B19 B17 A16 B15 A14 A20 R24 B11 A10 J1 K2 M2 P2 AC21 B9 A8 L1 N1 V23 AD20 AD18 AD12 AD10 W24 U24 AC19 AC15 AC11 AC9 Y23 T23 P23 AD16 AC17 R1 AD6 P1.11 P1.12 P1.13 P1.14 P1.15 P1.10 P1.06 GND P0.28/AIN4 P0.29/AIN5 P0.04/AIN2 P0.05/AIN3 P0.07 P1.08 GND P0.25 P0.30/AIN6 P0.31/AIN7 P0.06 P0.08 P1.03 GND P0.24 P0.22 P0.17 P0.15 P1.02 P1.04 GND P0.23 P0.19 P0.16 P0.14 P1.01 P1.05 P1.07 P0.20 P0.21 P1.09 D+
A0 A1 A2 A3 A4 A5 B0 B1 B2 B3 B4 B5 C0 C1 C2 C3 C4 C5 D0 D1 D2 D3 D4 D5 45 VSS 40 P0.28/AIN4 41 P0.29/AIN5 6 P0.04/AIN2 7 P0.05/AIN3 9 P0.07 45 VSS 37 P0.25 42 P0.30 43 P0.31 8 P0.06 10 P0.08 45 VSS 29 P0.24 27 P0.22 20 P0.17 18 P0.15 15 P0.12 45 VSS 28 P0.23 22 P0.19 19 P0.16 17 P0.14 14 P0.11 15 GPIO GPIO GPIO GPIO GPIO GPIO GPIO Ground GPIO, Analog input GPIO, Analog input GPIO, Analog input GPIO, Analog input GPIO GPIO Ground GPIO GPIO GPIO GPIO, NC for BT840X, BT840XE, PA control GPIO, NC for BT840X, BT840XE, PA control GPIO Ground GPIO GPIO GPIO, NC for BT840X,BT840XE, PA control GPIO GPIO GPIO Ground GPIO GPIO, NC for BT840 X,BT840XE, PA control GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO USB D+
BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 E5 E6 F0 F1 F2 F3 F4 F5 F6 AD4 U1 Y2 AB2 AD2 D-
P0.12 VDDH DCCH VBUS USB D-
GPIO Ground pad Ground pad Ground pad Ground pad High Voltage Power Supply DC to DC converter output 5V DC power for USB 3.3V regulator Pin Function 16 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Mounting BT840X on the Host PCB The following figure shows recommended mounting of BT840X module on the host PCB. For the best Bluetooth range performance, the antenna area of module shall extend 9.8 mm outside the edge of host PCB board, or 9.8 mm outside the edge of a ground plane. The next choice is to place a module on a corner of host PCB, the antenna area shall extend 9.8 mm from the edge of ground plane. Ground plane shall be at least 5 mm from the edge of the antenna area of module. We dont recommend mounting BT840X module in the middle of a host PCB. For the best Bluetooth range performance, keep all external metal at least 30mm from the antenna area. 17 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Host Board Design for Low Cost or Long Range On nRF52 series SoCs, Nordic offers various memory options and protocol supports. Fanstel offers various antenna and power amplifier options. A host board can be designed to accommodate these nRF52 modules. Our suggestions for host PCB design:
If your main goal is minimum PCB cost, use a 2-sided PCB. Use library component from EV BT832 Gerber files, can be downloaded from http://www.fanstel.com/download-document/.It has 16 castellated pins plus 24 LGA pins. BT840X library component can be used. However, signal routing can be difficult on a 2-sided PCB. Be sure of no metal contact in the area of 21 additional BT840X pins. BT840X can be mounted on a BT832 pad. If you main goal is maximum wireless range, use a 4 or more layers PCB. Use library component from EV BT840X V4 or newer Gerber files, can be downloaded from http://www.fanstel.com/download-document/.It has 16 castellated pins plus 45 LGA pins. As much ground plane under BT840X, on top side of host PCB as possible. Use EV BT840X V4 Gerber files as an example. If your products may need wireless range of 1350 meters or more, allocate physical space for a 15x28x1.9mm module. This larger module size is required to accommodate Skyworks SKY66112 power amplifier. Dont use P0.06 (BT840X pin B4), P0.17 (BT840X pin C3), and P0.19 (BT840X pin D2) on the host board. These pins are used to control SKY66112 power amplifier in BT832X, BT832XE, BT840X and BT840XE. 18 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Control Skyworks Power Amplifier BT840X uses SKYWORKS SKY66112-11 power amplifier. The connection diagram with control signal pins is below. A firmware configuration example to contol Skyworks SKY66112 power amplifier is below. This firmware file, SKY66112_PAconfig.txt can be downloaded from http://www.fanstel.com/download-document/.
//PCA10040.h
//set the clock
#define NRF_CLOCK_LFCLKSRC {.source = NRF_CLOCK_LF_SRC_SYNTH, \
.rc_ctiv = 0, \
.rc_temp_ctiv = 0, \
.xtal_accuracy = NRF_CLOCK_LF_XTAL_ACCURACY_250_PPM}
19 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019
//main.c
//config the PA/LNA
#ifdef APP_PA_LAN
#define APP_PA_PIN
#define APP_LNA_PIN 17 19
#define APP_CPS_PIN 6
#define APP_AMP_PPI_CH_ID_SET 0
#define APP_AMP_PPI_CH_ID_CLR 1
#define APP_AMP_GPIOTE_CH_ID 0 static void pa_lna_setup(void)
{
uint32_t err_code;
nrf_gpio_cfg_output(APP_CPS_PIN);
nrf_gpio_pin_clear(APP_CPS_PIN); //enable nrf_gpio_cfg_output(APP_PA_PIN);
nrf_gpio_pin_clear(APP_PA_PIN); //
nrf_gpio_cfg_output(APP_LNA_PIN);
nrf_gpio_pin_clear(APP_LNA_PIN); //
static ble_opt_t pa_lna_opts = {
.common_opt = {
.pa_lna = {
20 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019
.pa_cfg = {
.enable = 1,
.active_high = 1,
.gpio_pin = APP_PA_PIN
},
.lna_cfg = {
.enable = 1,
.active_high = 1,
.gpio_pin = APP_LNA_PIN
},
.ppi_ch_id_set = APP_AMP_PPI_CH_ID_SET,
.ppi_ch_id_clr = APP_AMP_PPI_CH_ID_CLR,
.gpiote_ch_id = APP_AMP_GPIOTE_CH_ID
}
}
};
NRF_GPIO->DIRSET |= (1 << APP_PA_PIN) | (1 << APP_LNA_PIN) ;
err_code = sd_ble_opt_set(BLE_COMMON_OPT_PA_LNA, &pa_lna_opts);
APP_ERROR_CHECK(err_code);
}
#endif 21 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 4. Bluetooth Range Measurements Bluetooth range measurement reports and hex codes used in measurements can be downloaded from Bluetooth Range Measurements section of this webpage. http://www.fanstel.com/download-document/
Bluetooth ranges are measured between 2 modules on evaluation boards for various height of antenna. On the first measurement, both antennas pointing to sky and facing each other. The second antenna is rotated by 30 degrees clockwise after each measurement. Bluetooth range is specified as the average of 12 measurements with the least significant digit truncated. 1.52 meters (60 inches) is typical height of thermostat in the USA. 0.55 meter (21.5 inches) is typical height of antenna if an IoT device is plugged into a wall AC outlet in the USA. When USB840F USB dongle is plugged into a smart phone charger plugging into a wall AC outlet to collect Bluetooth sensor data or to be used as a Bluetooth signal repeater. Low Multiple Path Interference (LMPI). For longer range measurement, antenna must be higher to have LMPI. For example, when measuring Bluetooth range of BT840X at 125 Kbps, both antennas are 5.2 meters above ground. Antenna height BT840X Bluetooth range, 125Kbps, meters BT840X Bluetooth range, 1Mbps, meters LMPI 1.52 meters 2300 1000 640 390 0.55 meter 210 140 22 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 5. AT Commands User manual and hex codes for AT Commands supporting Bluetooth 5 features can be downloaded from AT Command Hex Codes, Bluetooth 5 section of this web page. http://www.fanstel.com/download-document/
AT commands can be used on UART interface and SPI interface. Advantage of SPI interface is higher speed data rate. A battery power product can complete data transmission sooner and go back to sleep mode. 6. BT840X Evaluation Board An evaluation board consists of the followings:
Mini USB cable Evaluation board 23 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 10-conductor cable for connection to Nordic nRF52 DK (DK is not included) Nordic Development Tools A Nordic nRF52 DK is recommended for programming this evaluation board. Nordic development tools can be downloaded from:
https://www.nordicsemi.com/eng/Products/nRF52840 Many application examples can be downloaded from Nordic website. Some firmware, Android OS, and iOS app codes can be downloaded from Bluetooth 5 Codes section of this Fanstel webpage. http://www.fanstel.com/download-document/
BT840 firmware can be used in all nRF52840 modules, e.g., BT840, BT840X, and BT840E. 24 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Android OS Apps The following Android OS apps are available for download from Google Play Store:
BlueNor nrf5x: to use with Bluetooth 5 stacks, AT commands, or Slave firmware. Master firmware does not connect to a smartphone. Source codes can be downloaded from http://www.fanstel.com/download-document/
BlueNor Mesh: to use with BlueNor mesh firmware to send command to any node in a mesh. Node number is displayed when acknowledgement is received. Source codes will be uploaded to Fanstel website when supporting Bluetooth 5. iOS Apps The following iOS apps can be downloaded from Apple APP Store. BlueNor Mesh: to use with BlueNor mesh firmware to send command to any node in a mesh. Node number is displayed when acknowledgement is received. BlueNor nrf5x firmware, apps, and source codes will be uploaded when ready. BT840X V4 EvaluationBoard Schematics Evaluation board schematics and Gerber files can be downloaded from http://www.fanstel.com/download-document/
25 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Evaluation board can be used as a reference design for using modules. EV BT840X V4 is designed for the BT840X soldering pads with 61 pins. These 21 pins in solid dark color are for BT840X. EV BT840X V4 evaluation board is developed for BT840X and BT832X. It can be used for BT832 and BT832F. Pins in solid color are used only for BT840X. Blue color pin names around U1 BT840(832) are for BT832/BT832F/BT832X. Red color pin names are for BT840X/BT840/BT840E. Firmware pin configuration is required for a host board to accommodate BT840X/BT840/BT840E and BT832/BT832F/BT832X. Additional feature enhancements for version V4 evaluation board:
1. It has the same foot print as Arduino Uno R3. Additional connectors are added for connection to extra GPIO pins of BlueNor modules. 2. EV BT840X is not an UNO R3 compatible board. You can use Nordic develop tools to develop firmware for many UNO R3 compatible shields. 3. Portable smartphone charger can be used to power this board. The circuitry to the left of micro USB connector, J16 produces periodic load to prevent portable smartphone charger from shutting down. Suggestion for Battery Power Application Standby current consumption is important for battery-powered product. We suggest adding a 32.768 kHz crystal and 2 capacitors on host board. The 32MHz main clock wont be active at idle state to save power. Two inductors required for on-board DC to DC converter are inside BT840X. You can enable DCDC converter to have lower power consumption. 26 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 7. Miscellaneous Soldering Temperature-Time Profile for Re-Flow Soldering Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight. Cautions, Design Notes, and Installation Notes Failure to follow the guidelines set forth in this document may result in degrading of the productsfunctions and damage to the product. Design Notes
(1) Follow the conditions written in this specification, especially the control signals ofthis module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life of these products.
(5) Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum tolerance. 27 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019
(6) The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes.
(7) this product away from other high frequency circuits. Notes on Antenna and PCB Layout
(1) Dont use a module with internal antenna inside a metal case.
(2) For PCB layout:
Avoid running any signal line below module whenever possible, No ground plane below antenna, If possible, cut-off the portion of main board PCB below antenna. Installation Notes
(1) Reflow soldering is possible twice based on the time-temperature profile in this data sheets.Set up the temperature at the soldering portion of this product according to this reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuitboards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due tothe effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) If you want to repair your board by hand soldering, please keep the conditions of this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit.
(10) For more details on LGA (Land Grid Array) soldering processes refer to the application note. Usage Condition Notes
(1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products.
(2)Do not use dropped products.
(3)Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to thisproduct.
(5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB 28 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage.
(7) These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, informationand communication equipment. Storage Notes
(1)The module should not be stressed mechanically during storage.
(2)Do not store these products in the following conditions or the performancecharacteristics of the product, such as RF performance will be adverselyaffected:
Storage in salty air or in an environment with a high concentration of corrosive gas. Storage in direct sunlight Storage in an environment where the temperature may be outside the range specified. Storage of the products for more than one year after the date of delivery storage period.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10). Safety Conditions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications, without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions, as a minimum.
(1)Ensure the safety of the whole system by installing a protection circuit and a protection device.
(2)Ensure the safety of the whole system by installing a redundant circuit or anothersystem to prevent a dual fault causing an unsafe status. Other Cautions
(1)This specification sheet is copyrighted. Reproduction of this data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
(2)Do not use the products for other purposes than those listed.
(3)Be sure to provide an appropriate failsafe function on your product to prevent anadditional damage that may be caused by the abnormal function or the failure of the product.
(4)This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 29 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019
(5)These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner. In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. In direct sunlight, outdoors, or in a dusty environment In an environment where condensation occurs. In an environment with a high concentration of harmful gas.
(6) If an abnormal voltage is applied due to a problem occurring in other componentsor circuits, replace these products with new products because they may not beable to provide normal performance even if their electronic characteristics and appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Fanstel. Packaging Production modules are delivered in reel, 1000 modules in each reel. FCC LABEL The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized. This device is intended for OEM integrator only. 30 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Revision History May 2018, Ver. 1.00: Initial release August 2018 Version 1.10: Add BT840X and BT840XE with update. Add BT840X and BT840 range measurement results. Remove AT commands and refer to external document. 31 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Contact Us United States:
Fanstel Corp. 7466 E. Monte Ctisto Ave. Scottsdale AZ 85260 Tel. 1 480-948-4928 Fax. 1-480-948-5459 Email: module@fanstel.com Website: www.fanstel.com Taiwan:
Fanstel Corp. 10F-10, 79 Xintai Wu Road Xizhu, New Taipei City, Taiwan 22101 79 10 10, 22101 Tel. 886-2-2698-9328 Fax. 886-2-2698-4813 Email: tp@fanstel.com Website: www.fanstel.com China:
Fanstel Technologies Corp. 11 Jiale Street Ping-Dih, Long-Gang, Shen Zhen, GD 518117
() 11 Tel. 86-755-8409-0928 Fax. 86-755-8409-0973 QQ. 3076221086 Email: sz@fanstel.com Website: www.fanstel.com 32 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Federal Communications Commission (FCC) Statement 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. 15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1) this device may not cause harmful interference, and 2) this device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Note: The end product shall has the words Contains Transmitter Module FCC ID: X8WBT840X 33 BLE 5, Thread, Zigbee Modules,BT840X/XEVer 1.11 April 2019 Canada, Industry Canada (IC) This Class B digital apparatus complies with Canadian ICES-003 Cet appareil numrique de classe B est conforme la norme NMB-003. Le present appareil est conforme aux CNR d'Industrie Canada applicables auxappareils radio exempts de licence.L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage adiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Dclaration d'exposition aux radiations:
Cet quipement est conforme aux limites d'exposition au rayonnement ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis une distance minimale de 20 cm entre le radiateur et votre corps. Cet metteur ne doit pas tre co-localis ou fonctionner en conjonction avec une autre antenne ou un autre metteur.
(Modular approval) End Product Labeling:
The final end product must be labeled in a visible area with the following: Contains IC: 4100A-BT840X. OEM statement The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized. This device is intended for OEM integrator only 34