| submitted | available | document details (if available) | source link |
|---|---|---|---|
| January 11 2019 | June 11 2019 | Microsoft Word - bm833_datasheets.docx 10108060 Acrobat Distiller 10.1.16 (Windows) |
| various | Users Manual | Users Manual | 1.85 MiB | January 11 2019 / June 11 2019 |
BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 BluNor BM833/A are powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) modules using Nordic nRF52 SoC. With an ARMCortexTM M4(F) MCU, up to 512KB flash, 128KB RAM, embedded 2.4GHz multi-protocol transceiver, and an integrated PCB trace antenna or an u.FL for external antenna. It allows faster time to market with reduced development cost. BM833A/AF are designed to minimize PCB cost and to maximize efficiency in production line dedicated for Bluetooth modules. The cost of using BM833A module can be lower than designing-
in SoC at any quantity. At low cost, BM833A are full feature modules. Inductors for DCDC converter are integrated. All 32 GPIOs are accessible. BM833/F/E, an nRF52833 module has compatible footprint for upgrading. It offers more GPIOs, more memories, +8 dBm TX. Array antenna will be supported in BT833 Series modules. BM833A Specifications:
Nordic nRF52 with ARM Cortex M4 at 64 MHz. Supported data rate:
AES HW encryption BLE 5.1: 2Mbps, 1Mbps, 500kbps, 125kbps Angle-of-Arrival (AoA) and Angle-of-Departure
(AoD) direction finding using Bluetooth. RSSI, 1 dB resolution Serial Wire Debug (SWD) Nordic SoftDevice Ready Over-the-Air (OTA) firmware update Flash/RAM: 192KB/24KB 32 General purpose I/O pins 12 bit/200KSPS ADC, 8 configurable channels with programmable gain. 2X SPI Master/Slave (8Mbps) 4-channel pulse width modulator (PWM) Low power comparator 2-wire Master/Slave (I2C compatible) Digital microphone interface (PDM) UART (with CTS/RTS and DMA) 20 channel CPU independent Programmable Peripheral Interconnect (PPI). Quadrature Demodulator (QDEC) Model Summaries 3 x 32 bit timer with counter mode 2x realtime counter SoC receiver Sensitivity: -97 dBm at 1Mbps; -104 SoC TX power: +/- 0 dBm; programmable 4 dBm to -
dBm at 125 kbps 20dBm in 4 dB steps. Hybrid pins: 16 castellated and 24 LGA. Operation voltage: 1.7V to 3.6V 4.6 mA peak current at RX or +0dBm TX. Integrated DC-DC converter. Embedded inductors for DCDC converter Operation temperature: - 4 0 C t o + 8 5 C Major BM833 Enhancement Cortex M4F at 64 MHz Max SoC TX power: +8 dBm. Secure boot ready 1.7V to 5.5V supply voltage USB 2.0 full speed controller (12 Mbps) Operation temperature - 4 0 C t o + 1 0 5 C module SoC Flash/RAM Size GPIO Antenna Antenna Gain BM833A nRF52811 QFAA 512KB/64KB 10.2x15x1.9mm PCB trace 0.01dBi BM833AF nRF52811 QFAA 192KB/24KB 15x20.6x1.9mm BM833 nRF52833 QIAA 512KB/128KB 10.2x15x1.9mm BM833F nRF52833 QIAA 512KB/128KB 15x20.6x1.9mm BM833E nRF52833 QIAA 512KB/128KB 10.2x15x1.9mm 32 PCB trace
-0.88dBi 32 42 PCB trace
-0.56dB PCB trace 0.51dBi 42 u.FL 6dBi 42 1 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Table Of Contents 1. BM833A Specifications: ................................................................................................................................. 1 Major BM833 Enhancement ............................................................................................................................ 1 Model Summaries ............................................................................................................................................ 1 Introduction ...................................................................................................................................................... 4 BM833, BM833F, BM833E Block Diagram .................................................................................................. 4 BM833 ............................................................................................................................................................. 4 BM833F ........................................................................................................................................................... 5 BM833E ........................................................................................................................................................... 5 BM833A, BM833AF Block Diagram ............................................................................................................. 5
......................................................................................................................................................................... 5 BM833A .......................................................................................................................................................... 5 BM833AF ........................................................................................................................................................ 6 2. Codes Development Using Nordic Tools ........................................................................................................ 7 Easy, fast and safe code development ............................................................................................................. 7 Over-The-Air DFU .......................................................................................................................................... 7 SoftDevices ...................................................................................................................................................... 7 Development Tools .......................................................................................................................................... 7 3. Product Overview ............................................................................................................................................ 8 Nordic nRF52811 SoC .................................................................................................................................... 8 Nordic nRF52833 SoC .................................................................................................................................... 9 Mechanical Drawings BM833A .................................................................................................................... 10 Mechanical Drawings BM833 ....................................................................................................................... 11 Mechanical Drawings BM833E .................................................................................................................... 12 Mechanical Drawings BM833AF .................................................................................................................. 13 Mechanical Drawings BM833F ..................................................................................................................... 14 http://www.fanstel.com/download-document/ .............................................................................................. 15 BM833A Pin Functions ................................................................................................................................. 16 BM833 Pin Functions .................................................................................................................................... 19 Mounting BM833 on the Host PCB .............................................................................................................. 24 4. Evaluation Board ........................................................................................................................................... 25 Nordic Development Environment ................................................................................................................ 25 Loading Firmware into Evaluation Board Through a Nordic DK ................................................................. 25 2 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019
............................. 28 Evaluation Board Schematic .......................................................................................................................... 29 Suggestion for Battery Power Application .................................................................................................... 30 5. Miscellaneous ................................................................................................................................................ 30 Soldering Temperature-Time Profile for Re-Flow Soldering ....................................................................... 30 Cautions, Design Notes, and Installation Notes ............................................................................................ 30 Packaging ....................................................................................................................................................... 33 FCC LABEL ................................................................................................................................................... 33 Revision History .................................................................................................................................................... 34 Contact Us ............................................................................................................................................................. 35 3 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 1. Introduction BluNor BM833 is powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) modules using Nordic nRF52 SoCs. With an ARMCortexTM M4F MCU, available 512KB flash, 128KB RAM, embedded 2.4GHz multi-
protocol transceiver, and an integrated antenna or an u.FL connector for external antenna, it allows faster time to market with reduced development cost. The following is a block diagram of BM833. Antenna circuit and main clock are integrated. All 32 GPIOs of nRF52833 can be accessed from main board. For lower power consumption at idle state, a 32.768 kHz crystal is added on the host board. BM833A is sister module of BM833 using nRF52811 instead. BM833 has 42 GPIOs comparing to 32 GPIOs for BM833A. Soldering pad footprints are compatible. In these data sheets, BM833, BM833F, and BM833E are referred as BM833. BM833A and BM833AF are referred as B833A. BM833, BM833F, BM833E Block Diagram A block diagram of BM833 Series is shown below. BM833 Series modules have the same features except the followings. BM833 Uses an nRF52833 QIAA with Cortex M4F MCU 512KB flash, 128 KB RAM 68 pins, 42 GPIOs Support Bluetooth 5.1 radio protocols. Up to + 8dBm TX. CODED PHY 4 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Size: 10.2x15x1.9 mm BM833F BM833 offers the same features as BM833 except:
High performance PCB trace antenna Size: 10.2 (15mm antenna area) x20.6x1.9mm BM833E BM833E offers the same features as BM833 excepts:
An u.FL connector for external antenna Size: 10.2 x20.6mm BM833A, BM833AF Block Diagram BM833A Uses an nRF52811 QFAA with Cortex M4 MCU 192 KB flash, 24 KB RAM 47 pins, 32 GPIOs 5 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Size: 10.2x15x1.9mm Bluetooth 5.1 radio protocols. Does not support NFC Up to + 4 dBm TX Support CODED PHY at 125 Kbps for longer range BM833AF Size: 10.2 (15 antenn area) x20.6x1.9mm Integrated high performance PCB trace antenna 6 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 2. Codes Development Using Nordic Tools Development tools by Nordic and other third party development tools recommended by Nordic should be used . Easy, fast and safe code development Nordic development environment for nRF52 offers a clean separation between application code development and embedded protocol stacks. This means compile, link and run time dependencies with the embedded stack and associated debugging challenges are removed. The Bluetooth low energy stack is a pre-compiled binary, leaving application code to be compiled stand-alone. The embedded stack interface uses an asynchronous and event driven model removing the need for RTOS frameworks. Over-The-Air DFU The nRF52 SoC is supported by an Over-The-Air Device Firmware Upgrade (OTA DFU) feature. This allows for in the field updates of application software and SoftDevice. SoftDevices The Nordic protocol stacks are known as SoftDevices and complement the nRF52 Series SoCs. All nRF52 Series are programmable with software stacks from Nordic. This bring maximum flexibility to application development and allows the latest stack version to be programmed into the SoC. SoftDevices available from Nordic:
S112 SoftDevice The S112 SoftDevice is a Bluetooth low energy peripheral protocol stack solution. It supports up to four peripheral connections with an additional broadcaster role running concurrently. The S112 SoftDevice integrates a Bluetoothlow energy Controller and Host, and provides a full and flexible API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions. S112 can be used for for BM832A. S132 SoftDevice The S132 SoftDevice is a Bluetooth low energy Central and Peripheral protocol stack solution. It supports up to twenty connections with an additional observer and a broadcaster role all running concurrently. The S132 SoftDevice integrates a Bluetooth low energy Controller and Host, and provides a full and flexible API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions. Development Tools Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52 Series devices. nRF52 DK board is recommended for firmware development. 7 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 3. Product Overview Nordic nRF52811 SoC For full description of the SoC, please download data sheets from Nordic Semiconductor website. https://www.nordicsemi.com/eng/Products/Bluetooth-low-energy The following is a block diagram of Nordic nRF52811 Bluetooth Low Energy (BLE) SoC. 8 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 The 32 bit ARM Cortex M4F MCU with hardware supports for DSP instructions and floating point operations, code density and execution speed are higher than other Cortex M MCU. The Programmable Peripheral Interconnect (PPI) system provides a 20-channel bus for direct and autonomous system peripheral communication without CPU intervention. This brings predictable latency times for peripheral to peripheral interaction and power saving benefits associated with leaving CPU idle. The device has 2 global power modes ON/OFF, but all system blocks and peripherals have individual power management control which allows for an automatic switching RUN/IDLE for system blocks based only on those required/not required to achieve particular tasks. The radio supports Bluetooth low energy. Output power is scalable from a maximum of +4dBm down to -20 dBm in 4dB steps. BLE Sensitivity is increased to -97 dBm at 1Mbps and -104 dBm at 125 kbps with CODED PHY. Nordic nRF52833 SoC The following is a block diagram of Nordic nRF52833 SoC. 9 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Mechanical Drawings BM833A The followings are mechanical drawings of BM833A, top view. Size of module is 10.2x15.0x1.9mm. X-axis and Y-axis coordinate of each pin is shown in table. BM833 drawings are on the following page. If you can use BM833 footprint for BM833A, your host board is upgradeable to an nRF52833 module. 10 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Mechanical Drawings BM833 The followings are mechanical drawings of BM833, top view. X-axis and Y-axis coordinate of each pin is shown in table. 11 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Mechanical Drawings BM833E The following is mechanical drawings of B833E. Its footprint is the same as that of BM833. 12 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Mechanical Drawings BM833AF 13 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Mechanical Drawings BM833F 14 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Library components for PADS and EAGLE can be downloaded from http://www.fanstel.com/download-document/
For other PCB layout tools, please download evaluation Gerber files and extract library component. 15 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 BM833A Pin Functions The followings are BM833A pin assignment. Pin functions are in a table below. Please refer to Nordic nRF52811 Product Specifications for detailed descriptions and features supported. https://www.nordicsemi.com/?sc_itemid=%7B7CBDF55C-9745-4A7D-A491-5B66AE9454B6%7D You may develop your host board using BM833 footprint described in next section. Your host board will then upgradable to BM833 module for more memories and higher TX power. 16 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 BM833A nRF52811 pin# pin name pin#
pin name Descriptions 1 GND 2 GND 3 GND 4 GND 5 GND 6 P025 7 P026 8 P027 9 P028 10 P029 11 P030 12 P031 13 GND 14 VDD 15 GND 16 P000 17 P001 18 GND 19 GND 20 P003 21 P004 22 P002 23 P005 24 P007 24 P006 24 P009 27 P008 28 VDD 29 P010 45 VSS 37 P0.25 38 P0.26 39 P0.27 40 P0.28/AIN4 Ground Ground Ground Ground Ground GPIO GPIO GPIO GPIO, Analog input 41 P0.29/AIN5 GPIO, Analog input 42 P0.30/AIN6 GPIO, Analog input 43 P0.31/AIN7 36 VDD 2 P0.00/XL1 3 P0.01/XL2 5 P0.03/AIN1 GPIO, Analog input Ground DC supply 1.7V to 3.6V Ground GPIO, connection for 32.768kHz crystal GPIO, connection for 32.768kHz crystal Ground Ground GPIO, Analog input 6 P0.04/AIN2 GPIO, Analog input 4 P0.02/AIN0 GPIO, Analog input 7 P0.05/AIN3 9 P0.07 8 P0.06 GPIO, Analog input GPIO GPIO 11 P0.09 GPIO 10 P0.08 VDD 12 P0.10 GPIO DC supply 1.7V to 3.6V GPIO 17 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 30 GND 31 P011 32 P012 33 P014 34 P013 35 P015 36 P016 37 P017 38 P018 39 P019 40 P021/RST 41 P020 42 SWDCLK 14 P0.11 Ground GPIO, used as UART RX on evaluation board 15 P0.12 17 P0.14 16 P0.13 18 P0.15 19 P0.16 20 P0.17 21 P0.18 22 P0.19 24 P0.21/RST 23 P0.20 25 SWDCLK GPIO, used as UART TX on evaluation board GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO, configurable as RESET pin GPIO Serial Wire Debug clock input 43 SWDIO 44 P022 45 GND 46 P023 47 P024 BM833A Pin Functions 26 SWDIO 27 P0.22 28 P0.23 29 P0.24 Serial Wire Debug I/O GPIO Ground GPIO GPIO 18 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 BM833 Pin Functions BM833 uses an nRF52833 QIAA, Nordic Product Specifications:
http://infocenter.nordicsemi.com/pdf/nRF52840_PS_v1.0.pdf Pin assignments are below. Pins 1 to 47 are exactly at the same locations as those of BM833A. Pins 48 to 68 as shown in solid square are for BM833 only. For BM833 exclusive pins, names are in green color. For shares pins,BM833 pin names are in red color. BM833A pin names are in blue color. 19 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 BM833A (BM833AF), BM833 (BM833F, BM833E) Pin Functions:
BM833A 5281 1 BM833 52833 pin#
pin
#
name pin# pin#
pin Descriptions 1 2 3 4 5 6 7 8 9 45 GND 1 B7 VSS GND GND GND GND 37 P025 38 P026 39 P027 2 3 4 5 6 7 G1 8 H2 P0.26 P0.27 Ground Ground Ground Ground Ground NC GPIO GPIO 40 P028 9 B11 P0.28/AIN4 GPIO, Analog input 10 41 P029 10 A10 P0.29/AIN5 GPIO, Analog input 11 42 P030 11 B9 P0.30/AIN6 GPIO, Analog input 12 43 P031 12 A8 P0.31/AIN7 GPIO, Analog input 13 14 15 16 17 18 19 GND 13 Ground 36 VDD 14 B1 VDD DC supply 1.7V to 3.6V GND 15 Ground 2 P000 16 D2 P0.00/XL1 GPIO, connection for 32.768kHz crystal 3 P001 17 F2 P0.01/XL2 GPIO, connection for 32.768kHz crystal GND GND 18 19 Ground Ground 20 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 20 5 P003 20 B13 P0.03/AIN1 GPIO, Analog input 21 6 P004 21 J1 P0.04/AIN2 GPIO, Analog input 22 4 P002 22 A12 P0.02/AIN0 GPIO, Analog input 7 P005 23 K2 P0.05/AIN3 GPIO, Analog input 9 P007 8 P006 24 M2 25 L1 P0.07 P0.06 26 11 P009 26 L24 P0.09 10 P008 VDD 27 N1 28 P0.08 VDD GPIO GPIO GPIO GPIO DC supply 1.7V to 3.6V 23 24 25 27 28 29 30 31 12 P010 29 J24 P0.10 GPIO GND 30 Ground 14 P011 31 Y23 P1.01 GPIO, used as UART RX on evaluation board 32 15 P012 32 W24 P1.02 GPIO, used as UART TX on evaluation board 33 34 17 P014 33 AC9 P0.14 16 P013 34 T2 P0.11 35 18 P015 35 AD10 P0.15 GPIO GPIO GPIO 36 19 P016 36 AC11 P0.16 GPIO 21 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 37 20 P017 37 AD12 P0.17 GPIO 38 21 P018 38 AD22 P1.00 GPIO 39 22 P019 39 NC 40 24 P021/RST 40 AC13 P0.18/RST GPIO, configurable as RESET pin 41 23 P013 41 AD8 P0.13 GPIO 42 25 SWDCLK 42 AA24 SWDCLK Serial Wire Debug clock input 43 26 SWDIO 43 AC24 SWDIO Serial Wire Debug I/O 44 27 P022 44 AD18 P0.22 GPIO 45 46 47 GND 28 P023 45 46 Ground NC 29 P024 47 AD20 P0.24 GPIO 48 A14 P0.19 49 B15 P1.03 50 51 A16 P1.05 52 R1 P1.09 53 B17 P0.23 GPIO GPIO NC GPIO GPIO GPIO 22 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 54 P2 P1.08 55 A20 P0.25 56 Y2 57 VDDH GPIO GPIO High voltage power supply NC 58 AD2 VBUS 5V input for USB3.3V regulator 59 V2 NC 60 AC17 P0.21 GPIO 61 U24 P1.04 GPIO GPIO NC GPIO GPIO GPIO USB D+
USB D-
62 AD16 P0.20 63 64 U1 P0.12 65 R24 P1.06 66 P23 P1.07 67 AD6 D+
68 AD4 D-
23 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Mounting BM833 on the Host PCB The following figure shows recommended mounting of BM833 module on the host PCB. For the best Bluetooth range performance, the antenna area of module shall extend 11.2 mm outside the edge of host PCB board, or 11.2 mm outside the edge of a ground plane. The next choice is to place a module on a corner of host PCB, the antenna area shall extend 11.2 mm from the edge of ground plane. Ground plane shall be at least 5 mm from the edge of the antenna area of module. We dont recommend mounting BM833 module in the middle of a host PCB. For the best Bluetooth range performance, keep all external metal at least 30mm from the antenna area. 24 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 4. Evaluation Board An evaluation board can be used to evaluate performance of module and to develop and test your firmware before an application-specific host board is developed. Nordic Development Environment Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52 Series devices. nRF52 DK board is recommended for firmware development. Document and Software development tools can be downloaded by the following links. Get started with Nordic chip and all online documents. http://infocenter.nordicsemi.com/index.jsp?topic=/com.nordic.infocenter.nrf52/dita/nrf52/development/nrf52 _dev_kit.html&cp=1_1 Nordic SDK with many example projects. https://developer.nordicsemi.com/nRF5_SDK/
Nordic development zone. https://devzone.nordicsemi.com/tutorials/b/gettingstarted/posts/developmentwithgccandeclipse ProgrammingtheNordicchip DownloadandinstallNrf5xCommandLineTools https://www.nordicsemi.com/eng/nordic/Products/nRF52840/nRF5xCommandLineToolsWin32/58850 Download and install nRF ConnectPC software https://www.nordicsemi.com/Software-and-Tools/Development-Tools/nRF-Connect-for-desktop Download and install Segger Embedded Studio. https://www.nordicsemi.com/Software-and-Tools/Development-Tools/Segger-Embedded-Studio nRF52DK The nRF52 DK is a versatile single board development kit for Bluetooth low energy applications using the nRF52833 SoC. It supports the standard Nordic Software Development Tool-chain using SES, Keil, IAR and GCC. Program/Debug options on the kit is Segger J-Link OB. nRF52840DK Nordic Semiconductor nRF52840 Development Kit (nRF52840-DK) is a versatile, single-board development tool for Bluetooth 5 / Bluetooth Low Energy (BLE) applications using the nRF52840 Multi-Protocol SoC
(System on Chip). The nRF52840-DK supports the standard Nordic tool-chain software using SES, Keil, IAR, and GCC. Program/debug options are available for Segger J-Link OB and external target boards. Loading Firmware into Evaluation Board Through a Nordic DK ProcedurestoconnectaNordicDKtoaFanstelnRF52moduleevaluationboard. ConnectNordicnRF52DKdebugouttoFanstelevaluationboarddebuginusingthe10pinflatcableasshown below. ConnectNordicnRF52DKtoPC. 25 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 ConnectaDCpowersourcetomicroorminiUSBportofevaluationboard. 26 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Check COM Port Connection After connecting nRF52DK and an nRF52 sensor/evaluation board, you can see You canJ-Link device and COM port on the PC control panel Device Manager. Starting Nordic nRFgo OpennRFgoStudio. 1. ClickSegger682990549asintheexamplebelow. 2. Eraseallifneeded 3. BrowseforBootloaderandprogram.Afterprogrammingbootloader,youcanuseOTAforfirmware update. 4. BrowsefortheSoftDeviceandprogram. 5. Browsefortheapplicationhexfileandprogram 27 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 28 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Evaluation Board Schematic 29 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Suggestion for Battery Power Application Standby current consumption is important for battery-powered product. We suggest adding a 32.768 kHz crystal and 2 capacitors as shown in the upper left corner of the evaluation board schematics. The 32MHz main clock wont be active at idle state to save power. Two inductors required for DCDC converter are inside BM832 module. You can enable DCDC to lower power consumption. 5. Miscellaneous Soldering Temperature-Time Profile for Re-Flow Soldering Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight. Cautions, Design Notes, and Installation Notes Failure to follow the guidelines set forth in this document may result in degrading of the productsfunctions and damage to the product. Design Notes
(1) Follow the conditions written in this specification, especially the control signals ofthis module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 30 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019
(5) Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes.
(7) this product away from other high frequency circuits. Notes on Antenna and PCB Layout
(1) Dont use a module with internal antenna inside a metal case.
(2) For PCB layout:
Avoid running any signal line below module whenever possible, No ground plane below antenna, If possible, cut-off the portion of main board PCB below antenna. Installation Notes
(1) Reflow soldering is possible twice based on the time-temperature profile in this data sheets.Set up the temperature at the soldering portion of this product according to this reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuitboards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due tothe effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) If you want to repair your board by hand soldering, please keep the conditions of this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. Usage Condition Notes
(1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products.
(2)Do not use dropped products.
(3)Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to thisproduct.
(5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 31 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019
(7) These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, informationand communication equipment. Storage Notes
(1)The module should not be stressed mechanically during storage.
(2)Do not store these products in the following conditions or the performancecharacteristics of the product, such as RF performance will be adverselyaffected:
Storage in salty air or in an environment with a high concentration of corrosive gas. Storage in direct sunlight Storage in an environment where the temperature may be outside the range specified. Storage of the products for more than one year after the date of delivery storage period.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10). Safety Conditions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications, without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions, as a minimum.
(1)Ensure the safety of the whole system by installing a protection circuit and a protection device.
(2)Ensure the safety of the whole system by installing a redundant circuit or anothersystem to prevent a dual fault causing an unsafe status. Other Cautions
(1)This specification sheet is copyrighted. Reproduction of this data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
(2)Do not use the products for other purposes than those listed.
(3)Be sure to provide an appropriate failsafe function on your product to prevent anadditional damage that may be caused by the abnormal function or the failure of the product.
(4)This product has been manufactured without any ozone chemical controlled under the Montreal Protocol.
(5)These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner. In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. 32 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 In direct sunlight, outdoors, or in a dusty environment In an environment where condensation occurs. In an environment with a high concentration of harmful gas.
(6) If an abnormal voltage is applied due to a problem occurring in other componentsor circuits, replace these products with new products because they may not beable to provide normal performance even if their electronic characteristics and appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Fanstel. Packaging Production modules are delivered in reel, 1000 modules in each reel. FCC LABEL The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized. This device is intended for OEM integrator only. 33 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Revision History Sep. 2019, Ver. 0.50: The first draft release 34 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Contact Us United States:
Fanstel Corp. 7466 E. Monte Ctisto Ave. Scottsdale AZ 85260 Tel. 1 480-948-4928 Fax. 1-480-948-5459 Email: module@fanstel.com Website: www.fanstel.com Taiwan:
Fanstel Corp. 10F-10, 79 Xintai Wu Road Xizhu, New Taipei City, Taiwan 22101 79 10 10, 22101 Tel. 886-2-2698-9328 Fax. 886-2-2698-4813 Email: tp@fanstel.com Website: www.fanstel.com China:
Fanstel Technologies Corp. 11 Jiale Street Ping-Dih, Long-Gang, Shen Zhen, GD 518117
() 11 Tel. 86-755-8409-0928 Fax. 86-755-8409-0973 QQ. 3076221086 Email: sz@fanstel.com Website: www.fanstel.com 35 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Federal Communications Commission (FCC) Statement You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:
1) this device may not cause harmful interference, and 2) this device must accept any interferencereceived, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. RF exposure warning This equipment must be installed and operated in accordance with provided instructions and the antenna(s) usedfor this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and mustnot be co-located or operating in conjunction with any other antenna or transmitter. End-users and installers mustbe provide with antenna installation instructions and transmitter operating conditions for satisfying RF exposurecompliance. Industry Canada (IC) Statement This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subjectto the following two conditions: (1) this device may not cause interference, and (2) this devicemust accept any interference, including interference that may cause undesired operation of thedevice. 36 BLE 5.1 Modules BM833/F/EVer 0.50 June 2019 Canada, avis dIndustry Canada (IC) Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Informations concernant l'exposition aux frquences radio (RF) Cet quipement est conforme avec l'exposition aux radiations IC dfinies pour un environnement noncontrl. Cet quipement doit tre install et utilis une distance minimum de 20 cm entre le radiateuret votre corps. Cet metteur ne doit pas tre co-localises ou oprant en conjonction avec une autreantenne ou transmetteur. Les utilisateurs finaux et les installateurs doivent tre informs des instructions d'installation de l'antenne et des conditions de fonctionnement de l'metteur afin de satisfaire la conformit d'exposition RF. Note: The end product shall has the words Contains Transmitter Module FCC ID:X8WBM833, IC: 4100A-BM833 Information for the OEM and Integrators The following statement must be included with all versions of this document supplied to an OEM or integrator, but should not be distributed to the end user.
(1) This device is intended for OEM integrators only.
(2) Please see the full Grant of Equipment document for other restrictions. 37
This product uses the FCC Data API but is not endorsed or certified by the FCC