| submitted | available | document details (if available) | source link |
|---|---|---|---|
| Microsoft Word - BlueNor_BT840F_datasheets_update 1.docx 10004066 Acrobat Distiller 9.0.0 (Windows) |
| various | Users Manual | Users Manual | 1.87 MiB |
Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft BluNor BT840F is a powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) using Nordic nRF52840 SoC. With an ARMCortexTM M4F MCU, available 1MB flash, 256KB RAM, embedded 2.4GHz multi-
protocol transceiver, and an integrated PCB trace antenna or u.FL connector for an external +6dBi antenna. It allows faster time to market with reduced development cost. For applications needing limited number of IO pins, prototyping and production are easier using 16 castellated pins. Additional 45 LGA (Land Grid Array) pins provide full access to 48 GPIOs of nRF52840. BT840F hasan ARM TrustZone CryptoCell-310co-processor for implementation of IoT security. Specifications:
Nordic nRF52840 with ARM Cortex M4F, 64 MHz ARM TrustZone Cryptocell-310 co-processor Complete RF solution with integrated antenna Bluetooth 5 data rate: 2Mbps, 1Mbps, 500kbps, 125kbps. Kbps IEEE 802.15.4 Thread and Zigbee data rate: 250 2.4 GHz proprietary data rate: 2 Mbps, 1 Mbps Integrated DC-DC converter, inductors on board. Direct powered by Lithium batteries or USB supply
(up to 5.5V) Serial Wire Debug (SWD) Nordic SoftDevice Ready Over-the-Air (OTA) firmware update Flash/RAM: 1MB/256KB. 48 General purpose I/O pins USB 2.0 full speed (12 Mbps) controller QSPI 32 MHz interface High speed 32 MHz SPI Type 2 NFC-A tag with wake-on field, Touch-to-pair support Programmable peripheral interconnect (PPI) Applications Secure IoT Wearable Beacons/Proximity Connected appliances Model Summaries module SoC Size BT Antenna BT range at 1Mbps BT range at 125 Kbps FCC ID Canada IC ID Europe BT840F nRF52840-QIAA 15x20.8x1.9mm PCB trace 510 meters 930 meters 12 bit/200 Ksps ADC, 8 configurable channels with programmable gain 64 level comparator 15 level comparator with wake-up from OFF mode Temperature sensor 4x4-channel pulse width modulator (PWM) Audio peripherals: I2S, digital microphone interface
(PDM) 5 x 32 bit timers with counter mode Up to 4x SPI masters/3x SPI slaves Up to 2x I2C compatible 2-wire masters/slaves 2x UART (CTS/RTS) Quadrature Demodulator (QDEC) 3x real time counters (RTC) 128-bit AES HW encryption SoC Receiver Sensitivity: -96 dBm at 1Mbps SoC TX power: programmable +8dBm to -20dBm. Up to +6 dBi antenna gain. Hybrid pins: 16 castellated and 45 LGA. Integrated PCB trace antenna or u.FL connector Operation voltage: 1.7V to 5.5V Operation temperature: - 4 0 C t o + 8 5 C Lighting products Sensors Home and building automation Wrist watches BT840 nRF52840-QIAA 14x16x1.9mm PCB trace 180 M, estimated 1 BT840E nRF52840-QIAA 14x16x1.9mm u.FL
>1000 M Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft Table Of Contents 1. Introduction .......................................................................................................................................................... 3 BT840F Block Diagram ........................................................................................................................................ 3 BT840F ................................................................................................................................................................. 3 BT840 ................................................................................................................................................................... 4 BT840E ................................................................................................................................................................ 4 2. Codes Development Using Nordic Tools ............................................................................................................ 5 Easy, fast and safe code development ............................................................................................................... 5 Over-The-Air DFU ................................................................................................................................................ 5 SoftDevices .......................................................................................................................................................... 5 Development Tools .............................................................................................................................................. 5 3. Product Descriptions ............................................................................................................................................ 6 Block Diagram of nRF52840 ................................................................................................................................ 6 ARM Trustzone CryptoCell 310 ........................................................................................................................... 8 Mechanical Drawings ......................................................................................................................................... 10 Pin Assignments of BT840 ................................................................................................................................ 11 Pin Function ....................................................................................................................................................... 14 Mounting BT840F on the Host PCB .................................................................................................................. 15 Host Board Design for Low Cost or Long Range .............................................................................................. 16 4. BT840F Evaluation Board ................................................................................................................................. 17 Communicating with a PC ................................................................................................................................. 17 EV BT840F V4 EvaluationBoard Schematics ................................................................................................... 18 Suggestion for Battery Power Application ......................................................................................................... 19 5. Miscellaneous .................................................................................................................................................... 20 Soldering Temperature-Time Profile for Re-Flow Soldering ............................................................................. 20 Cautions, Design Notes, and Installation Notes ................................................................................................ 20 Packaging ........................................................................................................................................................... 23 FCC Label .......................................................................................................................................................... 23 6. Contact Us ......................................................................................................................... !
2 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft 1. Introduction BluNor BT840F Series are powerful, highly flexible, ultra low power wireless modules using Nordic nRF52840 SoCs. With an ARMCortexTM M4F MCU, 1MB flash, 256KB RAM, embedded 2.4GHz multi-protocol transceiver, and an integrated antenna, it allows faster time to market with reduced development cost. The following is a block diagram of BT840F. Antenna circuit and main clock are integrated. All 48 GPIOs of nRF52840 can be accessed from main board. For lower power consumption at idle state, a 32.768 kHz crystal can be added on the host board. Connection to an external NFC (Near Field Communication) antenna is provided. BT840F Block Diagram BlurNor BT840F is a sister module of BT832F. The physical size is the same. There are 21 additional LGA pins for additional GPIOs provided by nRF52840. There are 3 modules in the BT840F Series. BT840F Uses an nRF52840 QIAA with Cortex M4F MCU 1MB flash, 256 KB RAM 3 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft Integrated PCB trace range antenna. Bluetooth range is 510 meters at 1Mbps and 930 meters at 125 Kbps. Supports NFC Size: 15x20.8x1.9mm. BT840 Uses an nRF52840 QIAA with Cortex M4F MCU 1MB flash, 256 KB RAM Supports NFC Size: 14x16x1.9mm. BT840E Uses an nRF52840 QIAA with Cortex M4F MCU 1MB flash, 256 KB RAM Supports NFC An u.FL connector for external antenna. Bluetooth range is estimated at over 1000 meters at 125 Kbps with Integrated PCB trace range antenna. Bluetooth range is estimated at 180 meters at 1Mbps. ANT060 external antenna. Size: 14x16x1.9mm. 4 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft 2. Codes Development Using Nordic Tools Development tools by Nordic and other third party development tools recommended by Nordic should be used . Easy, fast and safe code development Nordic development environment for nRF52840 offers a clean separation between application code development and embedded protocol stacks. This means compile, link and run time dependencies with the embedded stack and associated debugging challenges are removed. The Bluetooth low energy and ANT stack is a pre-compiled binary, leaving application code to be compiled stand-alone. The embedded stack interface uses an asynchronous and event driven model removing the need for RTOS frameworks. Over-The-Air DFU The nRF52840 is supported by an Over-The-Air Device Firmware Upgrade (OTA DFU) feature. This allows for in the field updates of application software and SoftDevice. SoftDevices The Nordic protocol stacks are known as SoftDevices and complement the nRF52 Series SoCs. All nRF52 Series are programmable with software stacks from Nordic. This bring maximum flexibility to application development and allows the latest stack version to be programmed into the SoC. SoftDevices available from Nordic:
S140: Bluetooth low energy concurrent central/peripheral/observer/broadcaster stack. Development Tools Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52 Series devices. nRF52 DK board is recommended for firmware development. Nordic software development tools can be downloaded from the following webpage. http://infocenter.nordicsemi.com/index.jsp?topic=/com.nordic.infocenter.nrf52/dita/nrf52/development/nrf52_dev_kit.htm l&cp=1_1 5 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft 3. Product Descriptions Brief description of nRF52840 SoC is provided. For full description of the SoC, please download from Nordic Semiconductor website. https://www.nordicsemi.com/eng/Products/Bluetooth-low-energy Block Diagram of nRF52840 6 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft The following is a block diagram of Nordic nRF52840 Bluetooth Low Energy (BLE) SoC. Arrows with white heads indicate signals that share physical pins with other signals. The 32 bit ARM Cortex M4F MCU with hardware supports for DSP instructions and floating point operations, code density and execution speed are higher than other Cortex M MCU. The Programmable Peripheral Interconnect (PPI) system provides a 20-channel bus for direct and autonomous system peripheral communication without CPU intervention. This brings predictable latency times for peripheral to peripheral interaction and power saving benefits associated with leaving CPU idle. The device has 2 global power modes 7 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft ON/OFF, but all system blocks and peripherals have individual power management control which allows for an automatic switching RUN/IDLE for system blocks based only on those required/not required to achieve particular tasks. The radio supports Bluetooth low energy and ANT. Output power is scalable from a maximum of +8dBm down to -20 dBm in 4dB steps. Sensitivity is increased to -96 dBm to -89 dBm, depending on data rate. Sensitivity for BLE is -96 dBm, and -92.5 dBm for ANT. The NFC block supports NFC-A tags with proximity detection and Wake-on-field from low power mode. The NFC enables Out-Of-Band (OOB) Bluetooth pairing of devices and thus greatly simplifying deployment. ARM Trustzone CryptoCell 310 ARM TrustZone CryptoCell-310co-processor is a security subsystem which provides Root of Trust (RoT) and cryptographic services for a device. CryptoCell services are available to the application through a software library API, not a hardware register interface. The following cryptographic features are provided. FIPS-140-2 certified True Random Number Generator (TRNG) 8 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft RSA asymmetric encryption Up to 2048 bit key size PKCS#1 v2.1/v1.5 Optional CRT support Elliptic curve cryptography (ECC) NIST FIPS 186-4 recommended curves using pseudo-random parameters, up to 521 bits:
Prime field: P-192, P-224, P-256, P-384, P-521 SEC 2 recommended curves using pseudo-random parameters, up to 521 bits:
Prime field: P-160, P-192, P-224, P-256, P-384, P-521 Koblitz curves using fixed parameters, up to 256 bits:
Prime field: P-160, P-192, P-224, P-256 Edwards/Montgomery curves:
Ed25519, Curve 25519 ECDH/ECDSA support Secure remote password protocol (SRP) Up to 3072 bit operations Hashing functions SHA-1, SHA-2 up to 256 bit size keyed-hash message authentication code (HMAC) AES symmetric encryption General purpose AES engine (encrypt/decrypt, sign/verify) 128 bit key size Supported encryption modes: ECB, CBC, CMAC/CBC-MAC, CTR, CCM/CCM*. ChaCha20/Poly1305 symmetric encryption Supported keyed size: 128 and 256 bits Authenticated encryption with associated data (AEAD) mode 9 B luetooth h Low E Energy(
BLE) 5 Module e BT840 FVer 0.91 N Nov. 2017 dr raft M echanica he followings Th x20.8x1.9m 15 Fir rmware con al Drawin s are mecha mm. Except figuration is ngs anical drawi the 19 pins s required to ings of BT8 in solid blac o perform th 40F and BT ck dots, BT he same fun T832F. The 840F and B nction. physical siz BT832F is ha zes of both ardware pin are the sam n to pin com me, mpatible. Tw wo types of p pins are ava ailable to me eet differen t application n requireme ents. 16 cas solder stellated pin ring castella ns for applic ated pins. cation needi ing limited n number of IO Os. SMT eq quipment is not required d for 45 LG GA (Land Gr rid Array) pi ns to acces ss all 48 GP IOs of nRF5 52840 when n needed. T840F and B BT832F Me BT chanical dra awings, top view 10 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft Pin Assignments of BT840 The followings are BT840 pin assignment. Pin functions are in a table in next section. Please refer to Nordic nRF52840 Product Specifications for detailed descriptions and features supported. https://www.nordicsemi.com/eng/Products/nRF52840 BT840F pins is a super set of that of BT832F. A PCB developed for BT832 Series can be used for BT840 Series and vice versa. BT832F pin assignments. 11 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft BT840F pin assignments BT840 pin#
52840 pin#
1 G1 2 H2 3 D2 4 F2 5 A12 6 B13 7 L24 8 J24 9 B1 10 B7 11 T2 12 AD22 13 AD8 14 AC13 15 AA24 16 AC24 pin name P0.26/SDA P0.27/SCL P0.00/XL1 P0.01/XL2 P0.02/AIN0 P0.03/AIN1 P0.09/NFC1 P0.10/NFC2 VDD GND P0.11 P1.00 P0.13 P0.18/RESET SWDCLK SWDIO BT832 pin#
52832 pin#
pin name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 38 P0.26 39 P0.27 2 P0.00/XL1 3 P0.01/XL2 4 P0.02/AIN0 5 P0.03/AIN1 11 P0.09/NFC1 12 P0.10/NFC2 13 VDD 45 VSS 16 P0.13 21 P0.18 23 P0.20 24 P0.21/RESET 25 SWDCLK 26 SWDIO 12 Descriptions GPIO, configured as I2C SDA on EV-BT840 GPIO, configured as I2C SCL on EV-BT840 GPIO, connection for 32.768kHz crystal GPIO, connection for 32.768kHz crystal GPIO, Analog input GPIO, Analog input GPIO, NFC antenna connection GPIO, NFC antenna connection DC supply 1.7V to 3.6V Ground GPIO GPIO GPIO GPIO, configurable as RESET pin Serial Wire Debug clock input Serial Wire Debug I/O Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft Z0 Z1 Z2 Z3 Z4 Z5 Z6 A0 A1 A2 A3 A4 A5 A6 B0 B1 B2 B3 B4 B5 B6 C0 C1 C2 C3 C4 C5 C6 D0 D1 D2 D3 D4 D5 D6 E0 E1 E2 E3 E4 B19 B17 A16 B15 A14 A20 R24 B11 A10 J1 K2 M2 P2 AC21 B9 A8 L1 N1 V23 AD20 AD18 AD12 AD10 W24 U24 AC19 AC15 AC11 AC9 Y23 T23 P23 AD16 AC17 R1 AD6 P1.11 P1.12 P1.13 P1.14 P1.15 P1.10 P1.06 GND P0.28/AIN4 P0.29/AIN5 P0.04/AIN2 P0.05/AIN3 P0.07 P1.08 GND P0.25 P0.30/AIN6 P0.31/AIN7 P0.06 P0.08 P1.03 GND P0.24 P0.22 P0.17 P0.15 P1.02 P1.04 GND P0.23 P0.19 P0.16 P0.14 P1.01 P1.05 P1.07 P0.20 P0.21 P1.09 D+
A0 A1 A2 A3 A4 A5 B0 B1 B2 B3 B4 B5 C0 C1 C2 C3 C4 C5 D0 D1 D2 D3 D4 D5 45 VSS 40 P0.28/AIN4 41 P0.29/AIN5 6 P0.04/AIN2 7 P0.05/AIN3 9 P0.07 45 VSS 37 P0.25 42 P0.30 43 P0.31 8 P0.06 10 P0.08 45 VSS 29 P0.24 27 P0.22 20 P0.17 18 P0.15 15 P0.12 45 VSS 28 P0.23 22 P0.19 19 P0.16 17 P0.14 14 P0.11 13 GPIO GPIO GPIO GPIO GPIO GPIO GPIO Ground GPIO, Analog input GPIO, Analog input GPIO, Analog input GPIO, Analog input GPIO GPIO Ground GPIO GPIO GPIO GPIO, NC for BT832X, BT840X, PA conrol GPIO GPIO Ground GPIO GPIO GPIO, NC for BT832X,BT840X, PA control GPIO GPIO GPIO Ground GPIO GPIO, NC for BT832X,BT840X, PA control GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO USB D+
Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft E5 E6 F0 F1 F2 F3 F4 F5 F6 AD4 U1 Y2 AB2 AD2 D-
P0.12 VDDH DCCH VBUS USB D-
GPIO Ground pad, for BT840F V1, BT832X, BT840X Ground pad, for BT840F V1, BT832X, BT840X Ground pad, for BT840F V1, BT832X, BT840X Ground pad, for BT840F V1, BT832X, BT840X High Voltage Power Supply DC to DC converter output 5V DC power for USB 3.3V regulator Pin Function 14 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft Mounting BT840F on the Host PCB The following figure shows recommended mounting of BT840F module on the host PCB. For the best Bluetooth range performance, the antenna area of module shall extend 9.8 mm outside the edge of host PCB board, or 9.8 mm outside the edge of a ground plane. The next choice is to place a module on a corner of host PCB, the antenna area shall extend 9.8 mm from the edge of ground plane. Ground plane shall be at least 5 mm from the edge of the antenna area of module. We dont recommend mounting BT840F module in the middle of a host PCB. For the best Bluetooth range performance, keep all external metal at least 30mm from the antenna area. 15 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft Host Board Design for Low Cost or Long Range On nRF52 series SoCs, Nordic offers various memory options and protocol supports. Fanstel offers various antenna and power amplifier options. A host board can be designed to accommodate these nRF52 modules. Our suggestions for host PCB design:
If your main goal is minimum PCB cost, use a 2-sided PCB. Use library component from EV BT832 Gerber files, can be downloaded from http://www.fanstel.com/download-document/.It has 16 castellated pins plus 24 LGA pins. BT840F library component can be used. However, signal routing can be difficult on a 2-sided PCB. Be sure of no metal contact in the area of 21 additional BT840F pins. BT840F can be mounted on a BT832 pad. If you main goal is maximum wireless range, use a 4 or more layers PCB. Use library component from EV BT840F V4 or newer Gerber files, can be downloaded from http://www.fanstel.com/download-document/.It has 16 castellated pins plus 45 LGA pins. As much ground plane under BT840F, on top side of host PCB as possible. Use EV BT840F V4 Gerber files as an example. If your products may need wireless range of 1350 meters at 1 Mbps, allocate physical space for a 15x28x1.9mm module. This larger module size is required to accommodate Skyworks SKY66112 power amplifier. Dont use P0.06 (BT840F pin B4), P0.17 (BT840F pin C3), and P0.19 (BT840F pin D2) on the host board. These pins are used to control SKY66112 power amplifier. 16 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft 4. BT840F Evaluation Board Communicating with a PC A quick and easy way to evaluate BT840F is to use a PC as the host processor. Connect the development board EV-BT840F to a PC with an USB cable. Then, SetS1, BT840F is set to command mode. PC will communicate with BT840F. Set switch S1 to the other position, BT840F is set to data mode. PC will communicate with a remote device through BT840F Bluetooth wireless connection. Docklight is a testing, analysis and simulation tool for serial communication protocols (RS232, RS485/422 and others). It allows you to monitor the communication between two serial devices or to test the serial communication of a single device. Docklight significantly increases productivity in a broad range of industries, including automation and control, communications, automotive, equipment manufacturers, and embedded /
consumer products. Docklight is easy to use and runs on almost any standard PC using Windows 10, Windows 8, Windows 7, Windows Vista or Windows XP operating system. Docklight software can be downloaded from the following:
http://www.docklight.de/download_en.htm 17 B luetooth h Low E Energy(
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. These 21 esign for us pins in solid ing modules d dark color s. EV BT84 are for BT8 0F V4 is de 840F. esigned for t the EV Pin BT bo V BT840F V ns in solid c T832/BT832 ard to acco V4 evaluation color are use 2F/BT832X. mmodate B n board is d ed only for B Red color p BT840F and developed fo BT840F. Blu pin names a BT832/BT8 or BT840F a ue color pin are for BT84 832F/BT832 and BT832X names aro 40F. Firmwa 2X. X. It can be ound U1 BT8 are pin conf used for BT 840(832) ar figuration is T832 and BT re for required fo T832F. r a host Ad dditional fea ture enhanc cements for r version V4 4 evaluation board:
1. It has the sa pins of Blue ame foot pr eNor module int as Ardui es. no Uno R3. Additional connectors are added for connect tion to extra a GPIO 2. EV BT840F many UNO F is not an U R3 compat UNO R3 com mpatible boa s. tible shields ard. You ca n use Nord ic develop t tools to deve elop firmwa are for 18 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft 3. Portable smartphone charger can be used to power this board. The circuitry to the left of micro USB connector, J16 produces periodic load to prevent portable smartphone charger from shutting down. Suggestion for Battery Power Application Standby current consumption is important for battery-powered product. We suggest adding a 32.768 kHz crystal and 2 capacitors on host board. The 32MHz main clock wont be active at idle state to save power. Two inductors required for on-board DC to DC converter are inside BT840F. You can enable DCDC converter to have lower power consumption. 19 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft 5. Miscellaneous Soldering Temperature-Time Profile for Re-Flow Soldering Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight. Cautions, Design Notes, and Installation Notes Failure to follow the guidelines set forth in this document may result in degrading of the productsfunctions and damage to the product. Design Notes
(1) Follow the conditions written in this specification, especially the control signals ofthis module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life of these products.
(5) Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum tolerance. 20 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft
(6) The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes.
(7) this product away from other high frequency circuits. Notes on Antenna and PCB Layout
(1) Dont use a module with internal antenna inside a metal case.
(2) For PCB layout:
Avoid running any signal line below module whenever possible, No ground plane below antenna, If possible, cut-off the portion of main board PCB below antenna. Installation Notes
(1) Reflow soldering is possible twice based on the time-temperature profile in this data sheets.Set up the temperature at the soldering portion of this product according to this reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuitboards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due tothe effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) If you want to repair your board by hand soldering, please keep the conditions of this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit.
(10) For more details on LGA (Land Grid Array) soldering processes refer to the application note. Usage Condition Notes
(1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products.
(2)Do not use dropped products.
(3)Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to thisproduct.
(5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB 21 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage.
(7) These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, informationand communication equipment. Storage Notes
(1)The module should not be stressed mechanically during storage.
(2)Do not store these products in the following conditions or the performancecharacteristics of the product, such as RF performance will be adverselyaffected:
Storage in salty air or in an environment with a high concentration of corrosive gas. Storage in direct sunlight Storage in an environment where the temperature may be outside the range specified. Storage of the products for more than one year after the date of delivery storage period.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10). Safety Conditions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications, without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions, as a minimum.
(1)Ensure the safety of the whole system by installing a protection circuit and a protection device.
(2)Ensure the safety of the whole system by installing a redundant circuit or anothersystem to prevent a dual fault causing an unsafe status. Other Cautions
(1)This specification sheet is copyrighted. Reproduction of this data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
(2)Do not use the products for other purposes than those listed.
(3)Be sure to provide an appropriate failsafe function on your product to prevent anadditional damage that may be caused by the abnormal function or the failure of the product.
(4)This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 22 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft
(5)These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner. In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. In direct sunlight, outdoors, or in a dusty environment In an environment where condensation occurs. In an environment with a high concentration of harmful gas.
(6) If an abnormal voltage is applied due to a problem occurring in other componentsor circuits, replace these products with new products because they may not beable to provide normal performance even if their electronic characteristics and appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Fanstel. Packaging Production modules are delivered in reel, 1000 modules in each reel. FCC LABEL The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized. This device is intended for OEM integrator only. 23 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft 6.Contact Us United States:
Fanstel Corp. 7466 E. Monte Ctisto Ave. Scottsdale AZ 85260 Tel. 1 480-948-4928 Fax. 1-480-948-5459 Email: module@fanstel.com Website: www.fanstel.com Taiwan:
Fanstel Corp. 10F-10, 79 Xintai Wu Road Xizhu, New Taipei City, Taiwan 22101 79 10 10, 22101 Tel. 886-2-2698-9328 Fax. 886-2-2698-4813 Email: tp@fanstel.com Website: www.fanstel.com China:
Fanstel Technologies Corp. 11 Jiale Street Ping-Dih, Long-Gang, Shen Zhen, GD 518117
() 11 Tel. 86-755-8409-0928 Fax. 86-755-8409-0973 QQ. 3076221086 Email: sz@fanstel.com Website: www.fanstel.com Federal Communications Commission (FCC) Statement 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. 15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not 24 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1) this device may not cause harmful interference, and 2) this device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement 1) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2) This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed. Note: The end product shall has the words Contains Transmitter Module FCC ID: X8WBT832X 25 Bluetooth Low Energy(BLE) 5 Module BT840FVer 0.91 Nov. 2017 draft Canada, Industry Canada (IC) This Class B digital apparatus complies with Canadian ICES-003 Cet appareil numrique de classe B est conforme la norme NMB-003. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the Le present appareil est conforme aux CNR d'Industrie Canada applicables auxappareils radio exempts de licence.L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage adiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Canada, avis d'Industry Canada (IC) Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."
Dclaration d'exposition aux radiations:
Cet quipement est conforme aux limites d'exposition aux rayonnements ISEDtablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.
(Modular approval) End Product Labeling:
The final end product must be labeled in a visible area with the following: Contains IC: 4100A-BT840. Caution: Exposure to Radio Frequency Radiation. To comply with RSS 102 RF exposure compliance requirements OEM statement The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized. This device is intended for OEM integrator only 26
This product uses the FCC Data API but is not endorsed or certified by the FCC