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1 | User Manual | Users Manual | 1.51 MiB | / November 04 2016 |
L811-EA Series Module Hardware User Manual VersionV1.0.2 Date2015.09.08 Copyright Copyright 2015 Fibocom Wireless Inc . All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or transmit the document in any form. Attention The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Trademark Versions The trademark is registered and owned by Fibocom Wireless Inc. Version Date Remarks V1.0.0 V1.0.1 V1.0.2 2014-10-17 Initial Version. 2015-08-25 Update the logo. 2015-09-08 Modify descriptions for power on and RTC timing. L811-EA Module Hardware User Manual Page 2 of 43 Applicable Model List No. 1 Type L811-EA Note The supported frequency bands of L811-EA wireless modules as shown in the following tables:
Model No. LTE FDD WCDMA GSM/GPRS/EDGE L811-EA Band 1,2,3,4,5,7,8,13,17, 18,19,20 Band 1,2,4,5,8 850/900/1800/1900 MHz L811-EA Module Hardware User Manual Page 3 of 43 Content 1 Foreword.................................................................................................................................................................... 6 1.1 Introduction.....................................................................................................................................................6 1.2 Reference Standard......................................................................................................................................6 2 Product Overview..................................................................................................................................................... 8 2.1 Description......................................................................................................................................................8 2.2 Specifications.................................................................................................................................................8 2.3 Appearance..................................................................................................................................................13 3 Structure...................................................................................................................................................................14 3.1 Dimension Diagram of Structure.............................................................................................................. 14 3.2 Recommended PCB Layout Design........................................................................................................15 4 Hardware Introduction........................................................................................................................................... 17 4.1 Pin Definition................................................................................................................................................17 4.1.1 Pin Map............................................................................................................................................. 17 4.1.2 Description of Pins...........................................................................................................................18 5 Hardware Interface.................................................................................................................................................24 5.1 Power Interface........................................................................................................................................... 24 5.1.1 Power Supply................................................................................................................................... 24 5.1.2 VSD2_1V8........................................................................................................................................ 24 5.1.3 VRTC................................................................................................................................................. 25 5.2 Power on/off and Reset Signal................................................................................................................. 26 5.2.1 Power on /off Signal........................................................................................................................ 26 5.2.1.1 Power on................................................................................................................................26 5.2.1.2 Power off................................................................................................................................27 5.2.1.3 The Recommended Design of Power on/off................................................................... 28 5.2.2 RESET Signal.................................................................................................................................. 28 5.3 Status Indicating Signals........................................................................................................................... 29 5.3.1 CORE DUMP Indicating................................................................................................................. 29 5.3.2 LPG Signal........................................................................................................................................29 5.3.3 WAKEUP_HOST Signal.................................................................................................................30 5.3.4 PA_BLANKING Signal....................................................................................................................30 5.4 Interrupt Control Signal.............................................................................................................................. 31 5.4.1 WAKE_UP Signal............................................................................................................................ 31 L811-EA Module Hardware User Manual Page 4 of 43 5.4.2 W_DISABLE# Signal.......................................................................................................................31 5.4.3 Android & Linux / Win8 & Win10 Dual Systems Switch Control Signal................................. 31 5.5 USB Interface...............................................................................................................................................32 5.5.1 USB Interface Definition................................................................................................................. 32 5.5.2 USB Interface Application.............................................................................................................. 33 5.6 UART Interface............................................................................................................................................33 5.6.1 UART Interface Description...........................................................................................................33 5.6.2 UART Interface Application............................................................................................................34 5.7 USIM Interface.............................................................................................................................................34 5.7.1 USIM Pins......................................................................................................................................... 34 5.7.2 USIM Interface Design....................................................................................................................35 5.7.2.1 Normally Closed SIM Card Circuit Design....................................................................35 5.7.2.2 Normally Open SIM Circuit Design.................................................................................35 5.7.3 Highlights for USIM Design............................................................................................................36 5.7.4 USIM Hot-Plugging..........................................................................................................................36 5.7.4.1 Hardware Connection..........................................................................................................36 5.7.4.2 Software Setup..................................................................................................................... 37 5.8 Digital Audio.................................................................................................................................................37 5.8.1 I2S Interface..................................................................................................................................... 37 5.8.2 PCM Mode Description...................................................................................................................38 5.9 I2C Interface.................................................................................................................................................38 5.10 Clock Interface.......................................................................................................................................... 39 5.11 Other Interfaces.........................................................................................................................................39 6 Electrical and Environmental Characteristic...................................................................................................... 40 6.1 Electrical Characteristic............................................................................................................................. 40 6.2 Environmental Characteristic....................................................................................................................40 7 RF Interface.............................................................................................................................................................41 7.1 RF PCB Design........................................................................................................................................... 41 7.1.1 Wire Routing Principle.................................................................................................................... 41 7.1.2 Impedance........................................................................................................................................ 42 7.2 Antenna Design...........................................................................................................................................42 7.2.1 Main Antenna Design Requirements........................................................................................... 42 L811-EA Module Hardware User Manual Page 5 of 43 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L811-EA wireless modules. With the assistance of the document and other instructions, developers can quickly understand the performance of L811-EA wireless modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards 3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE) 3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) 3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS) 3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile radio interface 3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol 3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services 3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell reselection in connected mode 3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;
Stage 2 3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2 3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information 3GPP TS 21.111 -v6.3.0: USIM and IC card requirements 3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path 3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity Module - Mobile Equipment (SIM-ME) interface 3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance specification 3GPP TS 22.004 -v6.0.0: General on supplementary services L811-EA Module Hardware User Manual Page 6 of 43 3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2 3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;
3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD) 3GPP TS 36.101V9.18.0: User Equipment (UE) radio transmission and reception 3GPP TS 36.104V9.13.0: Base Station (BS) radio transmission and reception 3GPP TS 36.106V9.4.0: FDD Repeater radio transmission and reception 3GPP TS 36.113V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC) 3GPP TS 36.124V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 36.133V9.18.0:Requirements for support of radio resource management 3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the FDD UE 3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 34.122V5.7.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD) 3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+);Radio transmission and reception L811-EA Module Hardware User Manual Page 7 of 43 2 Product Overview 2.1 Description The L811-EA modules are highly integrated wireless communication LTE modules, which support three modes and twelve bands, including the 4G/3G/2G mainstream modes (LTE FDD/WCDMA/GSM) for Europe and North America and cover a wide range of frequency bands. The modules support the cellular communication networks of Europe, North America as well as the mobile operators in some regions of Asia. 2.2 Specifications Specifications L811-EA Operating Frequency Range LTE FDD: Band 1,2,3,4,5,7,8,13,17,18,19,20 WCDMA HSPA+: Band 1,2,4,5,8 GSM/GPRS/EDGE: 850/900/1800/1900MHz Data Rate LTE FDD UMTS/HSDPA/HSUPA 3GPP Rel.8 GSM 3GPP release 7 Category 4 (150Mbps DL,50Mbps UL) DC-HSDPA 42Mbps(Cat24) HSUPA 11.5Mbps(Cat7) EDGE (E-GPRS) multi-slot class 33(296kbps DL 236.8kbps UL) GPRS multi-slot class 33 (107kbps DL85.6kbps UL) GPS Not supported. Dimension32 x 26 x 2.0mm Physical Characteristics InterfaceLGA Weight4 grams Environment Operating Temperature-40 ~ +85 Storage Temperature-40 ~ +85 L811-EA Module Hardware User Manual Page 8 of 43 Performance Operating Voltage Voltage: 3.3V ~ 4.4V Normal: 3.8V Current Consumption
(Typical Value) Interfaces RF Interface 4mA (Sleep Mode) LTE FDD DATA700mA WCDMA Talk570mA 2G Talk250mA (GSM PCL5) AntennaMain x1Diversity x1 USB 2.0 x1Multiple Profiles over USB Function Interface SIM SupportI2C SupportI2S/PCM Support GPIOClock Data Features Protocol Stack EDGE GPRS CSD USSD SMS Embedded TCP/IP and UDP/IP protocol stack Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~9 Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~4 UMTS(14.4kbps)GSM(9.6kbps) Supported MO / MT Text and PDU modes Cell broadcast Digital Audio Audio Voice Coders: EFR/HR/FR/AMR VoLTEnot supported yet Audio Control Gain Control Character Set IRAGSMUCS2HEX L811-EA Module Hardware User Manual Page 9 of 43 FIBOCOM proprietary AT commands AT Commands GSM 07.05 GSM 07.07 Firmware Loader Tool over USB/UART Accessories User Manual Developer Kit Note:
1. Please make sure the temperature for device will not be higher than 85C. 2. The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. 3. Assessment of compliance of the product with the requirements relating to the Radio and Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by PHOENIX TESTLAB (Notified Body No.0700), L811-EA Module Hardware User Manual Page 10 of 43 Note:
Federal Communications Commission (FCC) Declaration of Conformity This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. FCC Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. RF Exposure Information This device meets the governments requirements for exposure to radio waves. This device is designed and manufactured not to exceed the emission limits for exposure to radio frequency (RF) energy set by the Federal Communications Commission of the U.S. Government. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC L811-EA Module Hardware User Manual Page 11 of 43 compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
ZMOL811". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. L811-EA Module Hardware User Manual Page 12 of 43 2.3 Appearance Top View L811-EA Figure 2- 1 Top View Bottom view:
Figure 2- 2 Bottom View L811-EA Module Hardware User Manual Page 13 of 43 3 Structure 3.1 Dimension Diagram of Structure Figure 3- 1 Dimension Diagram of Structure L811-EA Module Hardware User Manual Page 14 of 43 3.2 Recommended PCB Layout Design Figure 3- 2 Perspective drawing of top view L811-EA Module Hardware User Manual Page 15 of 43 Figure 3- 3 Structure Diagram of PCB Layout L811-EA Module Hardware User Manual Page 16 of 43 4 Hardware Introduction 4.1 Pin Definition 4.1.1 Pin Map A B C D E F G H J K L M N GND GND GND ANT_DI V GND GND GND ANT_MA IN GND GND GND GND GND GND GND GND GND GND GND GND GND GND FSYS2_ 26M RFE_RF FE1_VIO GND GND GND GND GND GND GND GND GND VBAT VBAT GND GND GND VBAT VBAT TDO TRST_N VRTC HW_MO N17
(TRC_D ATA0) HW_MO N18
(TRC_C LK) TRIG_IN VSD2_1 V8 TMS RESET_ N 12 USB_DN USB_HS IC_STR B USB_HS IC_DAT A USB_DP NC NC NC NC GND NC NC NC NC GND GND I2C_SCL I2S2_CL K GND GND GND GND GND GND GND GND SIM1_D P SIM1_D N EINT3 BODY_S AR UART1_ RTS UART1_ CTS GND GND A GND VSIM1 SIM1_R ST SIM1_C LK SIM1_D ATA SIM1_C D WAKEU P W_DISA BLE#
PA_BLA NKING/T RIG_OU T B C D E F G H J K L M GND N Figure 4-2 Pins Definition L811-EA Module Hardware User Manual Page 17 of 43 CORE_D UMP LPG RFE_RF FE1_SC LK RFE_RF FE1_SD ATA IPC_HO ST_WA KEUP IPC_TRI G_OUT GND GND GND WAKEU P_HOST GND CLK32K GND IPC_TRI G_IN IPC_SL AVE_W AKEUP UART1_ TXD UART1_ RXD GND GND GND NC VBUS GND GND 1 2 3 4 5 6 7 8 9 10 11 13 14 15 1 2 3 4 5 6 7 8 9 12 13 14 15 GND GND PWR_O N/OFF#
I2S2_W A TCK TDI I2S2_TX 10 I2C_SD A I2S2_RX 11 HW_MO N19
(TRC_D ATA1) HW_MO N20
(TRC_D ATA2) HW_MO N21
(TRC_D ATA3) 4.1.2 Description of Pins The logic signal level of L811-EA module is 1.8V. Reset Value Pin Name Pin#
I/O Power N3 N4 M3 M4 N5 VBAT VBAT VBAT VBAT VRTC VSD2_1V8 N6 POWER_ON/OFF#,RESET RESET_N POWER_ON/OFF#
I2S2_WA I2S2_TX I2S2_RX I2S2_CLK N7 N8 I2S N9 N10 N11 N12 I2C PI PI PI PI PO PO I I O O I O PD PD PD PD M11 I2C_SDA IO PU Idle Value Description Power input Power input Power input Power input VRTC output VSD2_1V8 output Module reset input, pull up(100K ohms),1.8V Module power on/off signal, pull down (200K ohms),1.8V T T T T PU PU I2S LRCK,CMOS 1.8V I2S data transmit, CMOS 1.8V I2S data receive, CMOS 1.8V I2S serial clock, CMOS 1.8V I2C serial data, pull up(4.7K ohms)CMOS 1.8V I2C serial clock, pull up(4.7K ohms)CMOS 1.8V PU M12 I2C_SCL Clock A3 A8 SIM1 D15 E15 F15 FSYS2_26M CLK32K VSIM1 SIM1_RST SIM1_CLK O O O PO O O 26MHz clock output,1.8V PD PD 32kHz clock output,1.8V SIM1 power supply,1.8V/2.8V L L SIM1 reset SIM1 clock L811-EA Module Hardware User Manual Page 18 of 43 SIM1 data, internal 4.7K resistor pull up SIM1 detect, pull up(390K ohms)CMOS 1.8V USB data plus for SIM1 card USB data minus for SIM1 card USB VBUS Supply USB Data Minus USB Data Plus High speed Inter IC clock (not supported now) High speed Inter IC data (not supported now) H L IPC host wakeup (not supported now) IPC trig out (not supported now) PU IPC trig in (not supported now) IPC slave wake up (not supported now) IO I IO IO PI IO IO IO IO O O I I L T PD PD T T PU PD PU PD SIM1_DATA SIM1_CD SIM1_DP SIM1_DN VBUS USB_DN USB_DP NC NC NC NC G15 H15 F14 G14 USB2.0 A11 A12 A13 USB3.0 C13 B13 C14 B14 HSIC B12 USB_HSIC_STRB USB_HSIC_DATA IPC_HOST_WAKEU P IPC_TRIG_OUT IPC_TRIG_IN IPC_SLAVE_WAKEU P NC NC NC NC C12 C4 C5 C7 C8 SSIC D14 E14 D13 E13 UART1 A9 A10 K14 UART1_TXD UART1_RXD UART1_RTS O I O PU PD PU PP PU PP UART1 transmit Data, CMOS 1.8V UART1 receive Data, CMOS 1.8V UART1 Request To Send, CMOS 1.8V L811-EA Module Hardware User Manual Page 19 of 43 L14 EINT J15 K15 H14 UART1_CTS WAKEUP W_DISABLE#
EINT3 BODY_SAR J14 System status indicator A4 A5 A7 L15 ADC C10 JTAG L5 M10 M7 M9 M5 M6 CORE_DUMP LPG WAKEUP_HOST PA_BLANKING/
TRIG_OUT(T_OUT1) NC TDO TDI TMS TCK TRST_N TRIG_IN MIPI2 Trace L7 L6 L9 MIPI2_TRC_CLK MIPI2_TRC_DATA0 MIPI2_TRC_DATA1 L10 MIPI2_TRC_DATA2 MIPI2_TRC_DATA3 L11 ANT Tunable I I I I I O O O O O I I I I I O IO IO IO IO B5 B4 RFE_RFFE1_SDATA IO RFE_RFFE1_SCLK O PU PU UART1 Clear To Send, CMOS 1.8V PD PD PD PU PD PD PD PD T PU PU PD PD PD PD PD PD PD PD PU WAKEUP,CMOS 1.8V PU W_DISABLE#,CMOS 1.8V PU PU L L L PP PP PP PP PP PP PP EINT3,CMOS 1.8V BODY_SAR,CMOS 1.8V Core dump indicator, CMOS 1.8V LPG,CMOS 1.8V WAKEUP_HOST,CMOS 1.8V PA blanking output/Monitoring Signal Output, CMOS 1.8V Serial Data Out Serial Data Input State machine control signal JTAG clock input Reset/Module enable Monitoring Signal Input, CMOS 1.8V MIPI2 trace clock, CMOS 1.8V MIPI2 trace data0,CMOS 1.8V MIPI2 trace data1,CMOS 1.8V MIPI2 trace data2,CMOS 1.8V MIPI2 trace data3,CMOS 1.8V RFFE1 serial data for tunable ANT,CMOS 1.8V RFFE1 serial clock for tunable ANT,CMOS 1.8V L811-EA Module Hardware User Manual Page 20 of 43 B3 ANT J1 E1 B8 B9 B10 B11 C11 F13 L12 M13 L13 G13 H13 J13 K13 A6 B2 B6 B7 C1 C2 C3 C6 C9 C15 D1 D2 D3 D4 RFE_RFFE1_VIO PO RFFE1 VIO for tunable ANT,1.8V ANT_MAIN ANT_DIV IO I Main antenna Diversity antenna GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND L811-EA Module Hardware User Manual Page 21 of 43 D12 E2 E3 F1 F2 F3 G1 G2 G3 H1 H2 H3 J2 J3 K1 K2 K3 K4 K12 L1 L2 L3 L4 L8 M2 M8 M14 N13 A1 A15 N1 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND L811-EA Module Hardware User Manual Page 22 of 43 N15 TG1 TG2 TG3 TG4 TG5 TG6 TG7 TG8 TG9 GND GND GND GND GND GND GND GND GND GND TG10 GND TG11 GND TG12 GND TG13 GND TG14 GND TG15 GND TG16 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND HHigh Voltage Level LLow Voltage Level PDPull-Down PUPull-Up TTristate ODOpen Drain PPPush-Pull Note : The unused pins can be left floating in case of circuit design. L811-EA Module Hardware User Manual Page 23 of 43 5 Hardware Interface 5.1 Power Interface 5.1.1 Power Supply The L811-EA module requires a 3.3V - 4.5V DC power supply that capable of supplying maximum GSM emission current which may up to 2A. Input power supply requirements:
Parameter Minimum Value Recommended Value Maximum Value VBAT 3.3 3.8 4.4 Unit V Important notes for the power supply:
1. Voltage fluctuation of the power supply should be lower than 200mV. 2. VBAT should not lower than 3.3V when the voltage dropping occurs. The filtering capacitors for designing the power supply as shown in the following tables:
Recommended capacitance Application Description 330uF Power supply 1uF,100nF Digital signal noise Reduce voltage fluctuation during the phone call. For capacitance value, the bigger the better. Filter for the interference caused by clock and digital signals. 39pF,33pF 700 /850 /900 MHz Filter for RF interference. 18pF,8.2pF,6.8pF 1700/1800/1900, 2100/2600MHz Filter for RF interference. 5.1.2 VSD2_1V8 VSD2_1V8 is the power source of the internal digital circuits, it can be also used as the power indicator and the reference voltage. For circuit design, it can be only used for low current application (<50mA), floating if not used. L811-EA Module Hardware User Manual Page 24 of 43 Parameters Minimum Value Typical Value Maximum Value Unit VSD2_1V8 1.7135 VIH VIL 0.7* VSD2_1V8
-0.3 1.8 1.8 0 1.8865 1.8865 0.3* VSD2_1V8 V V V 5.1.3 VRTC VRTC is the power supply for the internal RTC of the module. In order to let RTC work for a certain time when lost the VBAT power, as the backup power, it is recommended to add a big capacitor at the VRTC pin. The voltage range of the VRTC as shown in the following tables:
Parameters Minimum Value Recommended Value Maximum Value Unit RTC working voltage 0.4 1.8 1.89 V Voltage of VRTC RTC Current Consumption 0.4V ~ 1V 1V ~ 1.89V 1 uA 2 uA The reference design of VRTC circuit shown as follows:
Figure 5- 1 VRTC Reference Design Note:
R8 is a current-limiting resistor, used to ensure the VRTC works properly and free from being affected by peripheral circuits. R8 1k Ohm. The current consumption is about 2A when 1.8V VRTC is supplied from the external capacitor. The value of C9 will affect the retaining time of RTC after VBAT is lost. The remaining time of RTC can be roughly calculated by the following formula:
L811-EA Module Hardware User Manual Page 25 of 43
(1.8-1)*C/2 + (1-0.4)*C/1 = 0.4C + 0.6C = 1C Ex. When using a 100uF capacitor, the remaining time is 1*100 = 100 Sec. When using a 330uF capacitor, the remaining time is 1*330 = 330 Sec. If the RTC backup power function is not required, the VRTC pin can be left floating. 5.2 Power on/off and Reset Signal The L811-EA module provides two control signals for power on/off and reset functions. Pin definition as shown in the following tables:
Pin#
N8 Pin Name Electrical Level Description POWER_ON/OFF#
CMOS 1.8V Power on/off signal RESET_N N7 5.2.1 Power on /off Signal 5.2.1.1 Power on CMOS 1.8V External reset signal input, active low. After the power is applied to the module, pull up the POWER_ON/OFF# signal for at least 20ms then the module will boot up. The timing sequence diagram as follows:
Figure 5- 2 Power on Timing Control Diagram Note :
The >1s time starts from the external capacitor being charged when the power is applied to the module. If VBAT is already applied to the module then the time can be ignored, and AP(Application Processor) L811-EA Module Hardware User Manual Page 26 of 43 only needs to control the timing of RESET_N and POWER_ON/OFF# signals. 5.2.1.2 Power off The L811-EA module can be turned off by software or hardware control. Software control is preferred for normal cases, only when software control is not usable, then use the hardware control. By pulling down or float the POWER_ON/OFF# signal, the module will be shut down. For details as shown in the following tables:
Control Method Action Condition Software AT+CPWROFF Normal control for power off. Hardware Pull down or floating the POWER_ON/OFF#
signal. Only used when a hardware exception occurs and the software control cannot be used. The hardware control description:
By pulling down or float the POWER_ON/OFF# signal, the PMU (Power Management Unit) of the module will be reset, which results in the state changes from the working state to the shutdown state. The timing sequence diagram as follows:
Figure 5- 3 Power off Timing Sequence Diagram Note : To safely shut down the module, the RESET_N signal must be pulled down (for at least 100ms) before pulling down the POWER_ON/OFF# signal. L811-EA Module Hardware User Manual Page 27 of 43 5.2.1.3 The Recommended Design of Power on/off The recommended design of POWER_ON/ OFF# signal is as follows:
L811-EA Figure 5- 4 Recommended Design of POWER_ON/OFF# Signal 5.2.2 RESET Signal The L811-EA module supports the external reset function. By controlling the RESET_N signal, the module will reset to its initial state. When pulling down the RESET_N signal for 100ms, the module will be reset and restarted. If the module is already turned on and working before the reset, there is no need to control POWER_ON/OFF# signal to turn it on. PMU inside the module remains its power during the reset procedure. Note:
The reset signal is very sensitive. It should be kept away from RF interference and well wrapped with ground planes in case of PCB layout. It is recommended to add a filter capacitor close to the module. Also, RESET_N signal trace shall neither near the PCB edge nor route on the surface planes to avoid module from reset caused by ESD. The timing sequence requirement as follows:
Parameter Condition Minimum Value Typical Value Maximum Value Unit Pulse Width Reset 7 100 1000 ms L811-EA Module Hardware User Manual Page 28 of 43 Recommended design:
L811-EA Figure 5- 5 Recommended Design of Reset Circuit 5.3 Status Indicating Signals Pin#
Pin Name A4 A5 A7 CORE_DUMP LPG WAKEUP_HOST I/O O O O Description Core Dump Indicator LPG status Indicating The module wakes up the host (Application processor). PA Blanking output, external GPS control signal. O PA_BLANKING L15 5.3.1 CORE DUMP Indicating The CORE_DUMP signal is used to indicate the mode of the module. Status Mode Normal mode Low level Core Dump High level 5.3.2 LPG Signal The LPG signal timing description as shown in the following tables:
Operating Modes LPG signal L811-EA Module Hardware User Manual Page 29 of 43 Idle (unregistered) 600ms high level and 600ms low level Idle (registered) 75ms high level and 3s low level Voice communication (Call) Always low level Data communication 75ms high level and 75ms low level Sleep (sleep mode) Always high level 5.3.3 WAKEUP_HOST Signal The WAKEUP_HOST signal is used to wake up the host when there are incoming calls, SMS or other data requests. Status Default WAKEUP_HOST Signal High level Low level Waking HOST(telephone ringing/SMS/other data request) 5.3.4 PA_BLANKING Signal The default is low for the signal. While the module works in GSM frequency band, PA_BLANKING will output the pulses that synchronized with the GSM burst timing sequence. Due to the GSM TX may interfere the receiving of the GPS signal, AP can turn off GPS or stop receiving data from the GPS when it detecting the PA_BLANKING pulses. Operating modes PA_BLANKING Signal Default modes Low level GSM TX Output the pulse signal that synchronize with the GSM burst L811-EA Module Hardware User Manual Page 30 of 43 5.4 Interrupt Control Signal The interrupt control signals as shown in the following tables:
Pin#
Name I/O Description J15 K15 H14 WAKEUP W_DISABLE#
EINT3 I I I BODY_SAR J14 5.4.1 WAKE_UP Signal WAKE_UP signal description as shown in the following tables:
I Wake up the module. Enable/Disable RF network. Android & Linux/Win8 & Win10 dual systems switch. Body SAR detection. Module Mode WAKE_UP Signal Description Sleep Idle/Call Low level High level Low level High level Wake up the module from Sleep to Idle mode Keep the module in Sleep mode Keep the current mode The module will not enter Sleep mode 5.4.2 W_DISABLE# Signal The module provides a hardware signal to enable/disable WWAN RF function, it can be controlled by an AT command also. The module will enter the Airplane mode by disabling RF function. The definition of W_DISABLE# signal as shown in the following tables:
No. W_DISABLE#
Function 1 2 Low High WWAN disabled, module enters Airplane mode. WWAN enabled, module exits Airplane mode. Floating The WWAN function is defined by the AT command, enabled by default. 3 5.4.3 Android & Linux / Win8 & Win10 Dual Systems Switch Control Signal The L811-EA module supports Android & Linux / Win8 & Win10 dual systems switch by detecting the voltage level of the interrupt signal EINT3. The function of EINT3 signal as shown in the following tables:
No. Function EINT3 L811-EA Module Hardware User Manual Page 31 of 43 1 2 High/Floating Low For Android or Linux system, the module`s USB ports mapped as 3*ACM ports. For Win8 or Win10 system, the module`s USB port is mapped as a MBIM mode. Description:
1. During booting, the implementation of Android & Linux / Win8 & Win10 system change is done by detecting the level of EINT3 signal. The voltage level of EINT3 should be kept stable during booting. 2. After boot up, the implementation of Android & Linux / Win8 & Win10 system change is done by detecting the rising or falling edge of the EINT3 interrupt with the debounce time of 100ms. If the interrupt event meets the condition, the module will restart and change over its USB mode for the desired system. 5.5 USB Interface 5.5.1 USB Interface Definition Pin#
A13 A12 A11 Pin Name USB_DP USB_DN VBUS I/O I/O I/O I Description USB D+ signal USB D- signal USB power input The L811-EA wireless communication module supports USB 2.0 interface. Before connecting it to the Win7 system, it is necessary to install the USB driver (For Android & Linux system, no USB driver needed but configuring the related kernel settings). After connecting the USB port to a PC, the USB driver resides in the Windows system will map three ACM ports and four NCM ports, as listed below:
2 ACM ports used for AT Commands. 1 ACM ports used for LOG information captured by the debug software. 4 NCM ports are virtual network ports, mainly used for initiating data transmission serves. Note:
One of the ACM ports can be used as a Modem COM port to initiate the data services. It is not recommended to use due to the speed of Modem COM port is insufficient for the 100Mbps download speed of the LTE standard. Only when the NCM ports are not available, the Modem COM port could initiate the data service as the temporary solution. L811-EA Module Hardware User Manual Page 32 of 43 5.5.2 USB Interface Application Reference Circuit Design:
L811-EA Figure 5- 6 USB Interface Reference Circuit Design The choice of capacitance for RV101 and RV102 TVS diodes should not greater than 1pF, recommended to use 0.5pF TVS diodes. There is no recommended capacitance value for RV100. VUSB pin supplies the power for USB, the recommended power range is 3.3V ~ 4.5V. VBUS pin should not floated or it will become the unknown device. USB_DP and USB_DM are the high-speed differential signals, and the maximum data rate is 480Mbps. The following requirements should be followed in case of PCB layout. is it USB_DP and USB_DN signal traces should be parallel and have the equal length, avoid right angle layout. USB_DP and USB_DN signal traces should be wrapped with GND on both sides. USB2.0 differential signal traces should be routed on the layer nearest to the ground plane. Ensure the match of impedance, which is required to be 90 Ohm. Note:
VBUS is the power for USB detection (its the low current signal, current value < 100uA). In circuit design, its not permitted to apply VBUS power individually when the USB_DN and USB_DP are disconnected, or the module will not go into the sleep mode. 5.6 UART Interface 5.6.1 UART Interface Description The L811-EA module provides one 4-wire UART port. The UART1 port supports AT commands, the users can receive and transmit AT commands through UART1. L811-EA Module Hardware User Manual Page 33 of 43 The definition of UART1 signals as shown in the following tables:
Pin#
L14 K14 A9 Pin Name UART1_CTS UART1_RTS UART1_TXD I/O I O O Description Clear to send Request to send Data Transmit I UART1_RXD A10 5.6.2 UART Interface Application The signal direction when connecting the UART1 of L811-EA module (DCE) and MCU (DTE) as shown in the following tables:
Date Receive MCU (DTE) application Signal direction L811-EA module (DCE) RXD UART1_TXD UART1_RXD TXD Note:
The voltage level of UART interface is 1.8V. When connecting to 2.8V or 3.3V I/O, it is necessary to convert the voltage level. In circuit design, it is recommended to use a SN74LVC2G07 to convert the voltage level from 1.8V to 3.3V. For connecting to a PC, first convert 1.8V to 3.3V, then use a SPIEX3232EEA to convert it to RS-232 level. The direction of the signals should be properly handled. 5.7 USIM Interface The L811-EA module supports USIM and high speed SIM cards (The 8-wire USIM is not supported yet). 5.7.1 USIM Pins Pin#
D15 E15 F15 G15 Pin Name VSIM1 SIM1_RST SIM1_CLK I/O O O O SIM1_DATA I/O H15 SIM1_CD I Function Description USIM power, 1.8V/2.8V USIM reset USIM clock USIM data USIM card detection signal, pulled up with a 390k resistor by default. High when SIM card is inserted. Low when SIM card is not inserted. L811-EA Module Hardware User Manual Page 34 of 43 5.7.2 USIM Interface Design 5.7.2.1 Normally Closed SIM Card Circuit Design Reference Circuit Design:
Figure 5- 7 Reference Design of Normally Closed SIM Card Interface Normally closed SIM Connector:
1When detaching the SIM card, pin 7 and pin 8 shorted together. 2When inserting the SIM card, pin 7 and pin 8 opened. 5.7.2.2 Normally Open SIM Circuit Design Referenced Circuit Design:
Figure 5- 8 Reference Design of Normally Open SIM Card Interface Normally open SIM Connector:
1When detaching the SIM card, pin 7 and pin 8 opened . 2When inserting the SIM card, pin 7 and pin 8 shorted. L811-EA Module Hardware User Manual Page 35 of 43 Note:
In order to improve the EMC performance, the SIM card slot should be close to the module as much as possible. The filter capacitors for the SIM card signals should be placed close to the SIM card slot as much as possible. The ESD devices (e.g. TVS) shall be added to the SIM card signals for ESD protection. They should be placed close to the SIM card slot as much as possible. SIM1_CD signal supports hot-plugging. Active high by default (It can be changed to active low by an AT command). If the module detects the signal with high level, it means a card insertion has detected. 5.7.3 Highlights for USIM Design The SIM card interface design is very important to have the module and SIM card work normally. The rules should be followed carefully as below:
SIM card slot and signal routing must keep away from the EMI interference sources, e.g. RF antenna and digital signals. The trace length between the module and SIM card should not exceed 100mm. To avoid crosstalk, USIM_CLK and USIM_IO signals should keep away in case of recommended to wrap them with ground planes. SIM card signals should be ESD protected. The ESD devices should have low capacitance (e.g. Zener diode). Its recommended to choose ESD devices with capacitance equal or less than 33pF. In case of layout, ESD devices should be close to the SIM card interface. layout. Its 5.7.4 USIM Hot-Plugging The L811-EA module supports the insert detection of the SIM card. With this function, the hot-plugging of SIM card can be designed. 5.7.4.1 Hardware Connection The function of SIM card hot-plugging is done by the SIM_CD signal. The SIM1_CD signal is low when the SIM card is detached, high when the SIM card is inserted. Note For Normally closed design, as shown in the figure5-7, the SIM1_CD signal is connected to U2s Pin8 (SW2), and Pin7 (SW1) is connected to the ground. When the SIM card is not inserted, SW2 and SW1 are shorted, and SW2 is low. When the SIM card is inserted, SW2 and SW1 are opened, and the SIM1_CD signal will be pulled high. For Normally open design, as shown in the figure5-8, the SIM1_CD signal is connected to U2s Pin8 L811-EA Module Hardware User Manual Page 36 of 43
(SW2), and Pin7 (SW1) is pulled up with a 4.7K resistor. When the SIM card is not inserted, SW2 and SW1 are opened, and SW2 is low. When the SIM card is inserted, SW2 and SW1 are shorted, and SIM1_CD signal will be pulled high. 5.7.4.2 Software Setup
+MSMPD command is used for the SIM card detection function:
If set AT+MSMPD=0, the SIM card detection function is disabled, and the module will not detect the SIM1_CD signal. If set AT+MSMPD=1, the SIM card detection function is enabled, and the module will detect the insertion of the SIM card via SIM1_CD Pin. If SIM1_CD is high, which indicates the insertion of a SIM card, and the module will automatically register to the network. If SIM1_CD is low or disconnected, which indicates the SIM card is not inserted, and the module will not register to the network. Note:
The default value of +MSMPD is 1. The SIM_CD signal is used for SIM card detection. The module detects the presence of the SIM card via the SIM1_CD signal during the first booting. After the module boots up, it detects the SIM card by the level change of the SIM1_CD signal. In other words, if SIM1_CD is at low level, the module cannot access the SIM card. 5.8 Digital Audio The L811-EA module supports I2S interface for digital audio. The I2S port supports normal I2S mode and PCM mode for data transfer. I2S interface is at 1.8V voltage level. I2S signal description as shown in the following tables:
Pin#
N12 N9 N10 Pin Name I2S2_CLK I2S2_WA0 I2S2_TX I/O O O O I2S2_RX N11 I 5.8.1 I2S Interface Description Bit clock, 1.8V signal Left and right channel clock (LRCK), 1.8V signal Serial data output, 1.8V signal Serial data input, 1.8V signal L811-EA Signal Direction Audio CODEC I2S Port L811-EA Module Hardware User Manual Page 37 of 43 I2S2_CLK0 I2S2_WA0 I2S2_RX I2S2_TX Description:
I2S_CLK I2S_LRCK I2S_SDOUT I2S_SDIN I2S interface can be configured as master or slave mode. It supports various audio sampling rates (48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz, 11.025KHz and 8KHz). 5.8.2 PCM Mode Description L811-EA Signal Direction Audio CODEC PCM Port I2S2_CLK(PCM_CLK ,PCM clock signal) PCM_CLKPCM clock signal I2S2_WA(PCM_SYNC , PCM frame synchronization signal) PCM_SYNCPCM frame synchronization signal I2S2_RX(PCM_DIN , PCM data input) PCM_DOUTPCM data output I2S2_TX(PCM_DOUT , PCM data output) PCM_DINPCM data input Note:
PCM port can be configured as master or slave mode. It supports short frame sync for 16, 32, 48, and 64 bit mode. It supports burst and continuous transmission modes. It supports clock length trigger for frame sync signal and rising/falling edge trigger for data transmission. It supports various audio sampling rates (48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz, 11.025KHz and 8KHz). Note:
Because of the timing of I2S mode is simpler than PCM mode, it is recommended to use I2S mode for audio transmission. For PCM mode, the audio quality issues caused by the PCM timing adjusting must be avoided. 5.9 I2C Interface L811-EA module supports one I2C interface, default configured as I2C master. The I2C master is used for driving external I2C slave devices, such as audio codecs and so on. L811-EA Module Hardware User Manual Page 38 of 43 Pin#
M11 M12 Name I2C_DATA I2C_SCL I/O I/O O Description I2C data signal,1.8V signal level I2C clock signal, 1.8V signal level The signal connection of L811-EA I2C master and external I2C slave ( such as an audio codecas shown in the following tables:
L811-EA I2C_SDA I2C_SCL Signal Direction Audio Codec I2C Port I2C_SDA I2C_SCL 5.10 Clock Interface L811-EA module supports one 26MHz clock output and one 32KHz clock output. Pin#
Pin Name I/O Description A3 A8 FSYS2_26M CLK32K O O 26MHz clock output, 1.8V level. (It is recommended to be used for external GPS, and it can also be used for the main clock of the audio codec) 32K clock output, 1.8V level. 5.11 Other Interfaces The module does not support the following ports yet: HSICANT TunableGPIO. L811-EA Module Hardware User Manual Page 39 of 43 6 Electrical and Environmental Characteristic 6.1 Electrical Characteristic The table below lists the range of L811-EAs electrical characteristics:
Parameters Minimum Value Maximum Value Unit Power supply signal Digital signal 0 0 4.4 1.9 V V 6.2 Environmental Characteristic This table below shows the environmental features of L811-EA. Parameters Minimum Value Maximum Value Operating Temperature Storage Temperature
-40
-40
+85
+85 Unit C C L811-EA Module Hardware User Manual Page 40 of 43 7 RF Interface 7.1 RF PCB Design 7.1.1 Wire Routing Principle The L811-EA module supports double RF antennas, the MAIN_ANT is for transmitting and receiving, and the DIV_ANT is for receiving. Diversity antenna can improve the receiver sensitivity as well as the downlink speed. The RF connectors or solder joints must be connected to the L811-EA module by the trace lines. It is recommended to use the microstrip line for RF line. It should be as short as possible with the insertion loss controlled below 0.2dB, and has the impedance of 50 Ohm. For antenna fine tuning, it is recommended to reserve a circuit (the parallel inductors should connect to the main ground) between L811-EA module and the antenna connector (or the solder joint). L811-EA Figure 7- 1 L811-EA -type Circuit L811-EA Module Hardware User Manual Page 41 of 43 7.1.2 Impedance The impedance of the RF signal line needs to be controlled at 50 Ohm. 7.2 Antenna Design 7.2.1 Main Antenna Design Requirements
(1) Antenna efficiency Antenna efficiency is the ratio of the input power and radiant power. Because of the return loss, material loss and coupling loss of the antenna, the radiant power is always lower than the input power. The ratio is recommended to be controlled over 40% (4dB).
(2) S11 or VSWR S11 indicates the matching level of the 50 Ohm impedance for the antenna. It affects the antenna efficiency in a certain extent. The VSWR testing method could be used for measuring purposes. The recommended value for S11 is less than 10dB.
(3) Polarization Polarization refers to the rotation direction of electric field while the antenna is in the direction of maximum radiation. Linear polarization is recommended. It is recommended to use the diversity antenna which has the different polarization direction from the main antenna.
(4) Radiation pattern The radiation pattern refers to the intensity of the electromagnetic field while the antenna is in every direction of the far field. Dipole antenna is perfect as the terminal antenna. For built-in antenna, it is recommended to use PIFA or IFA antennas. Antenna dimension: 6mm * 10mm * 100mm (H*W*L). Antenna radiation direction: Omnidirectional.
(5) Gain and directivity Antenna directivity refers to the intensity of the electromagnetic field while the electromagnetic wave is in all directions. Gain is the collection of of the efficiency and directivity of the antenna. It is recommended that antenna gain is less than or equal to 3dBi.
(6) Interference In addition to antenna performance, some other interference from the PCB will also affect the module performance. To ensure the high performance of the module, the interference must be under control. Suggestions: Keep speaker, LCD, CPU, FPC wire routing, audio circuits, and power supply away from the L811-EA Module Hardware User Manual Page 42 of 43 antenna, and add appropriate filtering and shielding protection, or adding filtering devices on the traces.
(7) TRP/TIS TRP (Total Radiated Power) GSM850/900>28dBm GSM DCS1800/PCS1900 >25dBm WCDMA Band 1,2,4,5,8>19dBm LTE FDD Band 1,2,3,4,5,7,8,13,17,18,19,20>19dBm TIS (Total Isotropic Sensitivity) GSM850/900/DCS1800/PCS1900<-102dBm WCDMA Band 1,2,4,5,8<-102dBm LTE FDD Band 1,2,3,4,5,7,8,13,17,18,19,20<-95dBm (10MHz Bandwidth) L811-EA Module Hardware User Manual Page 43 of 43
frequency | equipment class | purpose | ||
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1 | 2015-10-13 | 2510 ~ 2560 | PCB - PCS Licensed Transmitter | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2015-10-13
|
||||
1 | Applicant's complete, legal business name |
Fibocom Wireless Inc.
|
||||
1 | FCC Registration Number (FRN) |
0020891057
|
||||
1 | Physical Address |
5/F,Tower A,Technology Building II,1057 Nanhai Ave
|
||||
1 |
ShenZhen, N/A 518000
|
|||||
1 |
China
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
b******@phoenix-testlab.de
|
||||
1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
ZMO
|
||||
1 | Equipment Product Code |
L811
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
X****** H********
|
||||
1 | Title |
Regulatory Principal Engineer
|
||||
1 | Telephone Number |
+8675********
|
||||
1 | Fax Number |
+86-7********
|
||||
1 |
k******@fibocom.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 04/11/2016 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Modular Transmitter. Output Power listed is conducted. This device contains functions that are not operational in U.S Territories. This filing is only applicable for US operations. This OEM module is approved for use in products operating as fixed or mobile transmitting device. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. A separate approval is required for portable operating configurations, as defined in 2.1093 of the rules. The final product operating with this transmitter must include operating instructions and applicable warnings for end users and installers to satisfy RF exposure compliance requirements. Antenna gain must meet RF exposure and max radiated output power limits of the applicable rule section. The max. antenna gain for this device as reported to the FCC is: 3dBi (LTE FDD), 3dBi (WCDMA) and 3dBi (GSM/GPRS/EDGE). This Grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. This device supports LTE of 1.4, 3, 5, 10, 15, and 20MHz bandwidth modes for LTE Bands 2 and 4; LTE of 1.4, 3, 5, and 10 MHz bandwidth modes for LTE Bands 5; LTE of 5, 10, 15, and 20 MHz bandwidth modes for LTE Band 7; and LTE of 5 and 10 MHz bandwidth modes for LTE Band 13 and 17. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
SPORTON INTERNATIONAL (Shenzhen) INC.
|
||||
1 | Name |
M**** L********
|
||||
1 | Telephone Number |
86-75********
|
||||
1 | Fax Number |
86-75********
|
||||
1 |
m******@sporton.com.tw
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 22H | 824.2 | 848.8 | 1.9011 | 0.0478 ppm | 247KGXW | ||||||||||||||||||||||||||||||||||
1 | 2 | 22H | 824.2 | 848.8 | 0.5333 | 0.0179 ppm | 247KG7W | ||||||||||||||||||||||||||||||||||
1 | 3 | 24E | 1850.2 | 1909.8 | 1.0914 | 0.009 ppm | 248KGXW | ||||||||||||||||||||||||||||||||||
1 | 4 | 24E | 1850.2 | 1909.8 | 0.4624 | 0.0064 ppm | 246KG7W | ||||||||||||||||||||||||||||||||||
1 | 5 | 22H | 826.4 | 846.6 | 0.2168 | 0.0335 ppm | 4M09F9W | ||||||||||||||||||||||||||||||||||
1 | 6 | 24E | 1852.4 | 1907.6 | 0.2259 | 0.0037 ppm | 4M09F9W | ||||||||||||||||||||||||||||||||||
1 | 7 | 27 | 1712.4 | 1752.6 | 0.2307 | 0.0052 ppm | 4M09F9W | ||||||||||||||||||||||||||||||||||
1 | 8 | 24E | 1860 | 1900 | 0.1963 | 0.0069 ppm | 18M5G7D | ||||||||||||||||||||||||||||||||||
1 | 9 | 24E | 1860 | 1900 | 0.1811 | 0.0069 ppm | 18M4W7D | ||||||||||||||||||||||||||||||||||
1 | 1 | 27 | 1720 | 1745 | 0.2163 | 0.0085 ppm | 18M4G7D | ||||||||||||||||||||||||||||||||||
1 | 11 | 27 | 1720 | 1745 | 0.1786 | 0.0085 ppm | 18M4W7D | ||||||||||||||||||||||||||||||||||
1 | 12 | 27 | 1717.5 | 1747.5 | 0.1901 | 0.0085 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
1 | 13 | 22H | 829 | 844 | 0.1936 | 0.0037 ppm | 9M09G7D | ||||||||||||||||||||||||||||||||||
1 | 14 | 22H | 829 | 844 | 0.1667 | 0.0037 ppm | 9M03W7D | ||||||||||||||||||||||||||||||||||
1 | 15 | 22H | 826.5 | 846.5 | 0.171 | 0.0037 ppm | 4M51W7D | ||||||||||||||||||||||||||||||||||
1 | 16 | 27 | 2510 | 2560 | 0.1455 | 0.0144 ppm | 18M6G7D | ||||||||||||||||||||||||||||||||||
1 | 17 | 27 | 2510 | 2560 | 0.1271 | 0.0144 ppm | 18M5W7D | ||||||||||||||||||||||||||||||||||
1 | 18 | 27 | 2507.5 | 2562.5 | 0.1483 | 0.0144 ppm | 13M6G7D | ||||||||||||||||||||||||||||||||||
1 | 19 | 27 | 2507.5 | 2562.5 | 0.1297 | 0.0144 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
1 | 2 | 27 | 782 | 782 | 0.1884 | 0.0141 ppm | 9M05G7D | ||||||||||||||||||||||||||||||||||
1 | 21 | 27 | 782 | 782 | 0.151 | 0.0141 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
1 | 22 | 27 | 779.5 | 784.5 | 0.1726 | 0.0141 ppm | 4M53W7D | ||||||||||||||||||||||||||||||||||
1 | 23 | 27 | 709 | 711 | 0.2104 | 0.0155 ppm | 9M11G7D | ||||||||||||||||||||||||||||||||||
1 | 24 | 27 | 709 | 711 | 0.1811 | 0.0155 ppm | 9M07W7D | ||||||||||||||||||||||||||||||||||
1 | 25 | 27 | 706.5 | 713.5 | 0.1832 | 0.0155 ppm | 4M50W7D |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC