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User manual | Users Manual | 1.31 MiB | February 02 2016 | |||
| 1 2 | Cover Letter(s) | February 02 2016 | ||||||
| 1 2 | External Photos | February 02 2016 | ||||||
| 1 2 | Internal Photos | February 02 2016 | ||||||
| 1 2 | ID Label/Location Info | February 02 2016 | ||||||
| 1 2 | ID Label/Location Info | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Setup Photos | February 02 2016 | ||||||
| 1 2 | RF Exposure Info | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Report | February 02 2016 | ||||||
| 1 2 | Test Setup Photos | February 02 2016 | ||||||
| 1 2 | Test Setup Photos | February 02 2016 |
| 1 2 | User manual | Users Manual | 1.31 MiB | February 02 2016 |
L830-EA M.2 Module Hardware User Manual VersionV1.0.3 Date2015.09.19 Copyright Copyright 2015 Fibocom Wireless Inc . All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or transmit the document in any form. Attention The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Trademark Versions The trademark is registered and owned by Fibocom Wireless Inc. Version Date Remarks V1.0.0 2015-06-05 Initial Version V1.0.1 2015-06-16 Update the supported Cat of HSPA ;
Update the description of digital voice ;
Update the description of USB and Win8/Android switch ;
Update the consumption V1.0.2 2015-07-07 Update part of error description V1.0.3 2015-09-19 Delete the Band25, Update the parameters of GPS, and update the logo L830-EA M.2 Module Hardware User Manual Page 2 of 45 Applicability Table No. Type 1 L830-EA Note NA The difference of L830-EA M.2 wireless module as listed below:
Model No. LTE FDD WCDMA GSM/GPRS/EDGE L830-EA Band 1,2,3,4,5,7,8,9,13,17,18,19,20,26,29 Band 1,2,4,5,6,8 850/900/1800/1900MHz L830-EA M.2 Module Hardware User Manual Page 3 of 45 Content 1 Foreword.................................................................................................................................................................... 7 1.1 Introduction.....................................................................................................................................................7 1.2 Reference Standard......................................................................................................................................7 2 Product Overview..................................................................................................................................................... 9 2.1 Description......................................................................................................................................................9 2.2 Specifications.................................................................................................................................................9 2.3 Appearance..................................................................................................................................................14 3 Structure...................................................................................................................................................................15 3.1 Dimension Diagram of Structure.............................................................................................................. 15 3.2 Application Interface Description..............................................................................................................16 3.3 M.2 Connector............................................................................................................................................. 17 4 Hardware Introduction........................................................................................................................................... 18 4.1 Pin Definitions..............................................................................................................................................18 4.1.1 Pin Map............................................................................................................................................. 18 4.1.2 Description of Pins...........................................................................................................................19 5 Hardware Interface.................................................................................................................................................23 5.1 Power Interface........................................................................................................................................... 23 5.1.1 Power Supply................................................................................................................................... 23 5.1.2 VIO_1V8............................................................................................................................................23 5.2 Power on/off and Reset Signal................................................................................................................. 24 5.2.1 Power on /off Signal........................................................................................................................ 24 5.2.1.1 Power on Signal................................................................................................................... 24 5.2.1.2 Power off signal....................................................................................................................25 5.2.1.3 The Recommended Design of Power on/off................................................................... 26 5.2.2 RESET Signal.................................................................................................................................. 26 5.3 Status Indicating Signal............................................................................................................................. 27 5.3.1 Status Indicating Pin....................................................................................................................... 27 5.4 USB /SSIC Interface...................................................................................................................................28 5.4.1 USB Interface................................................................................................................................... 28 5.4.2 USB SSIC Interface.........................................................................................................................29 5.5 USIM Interface.............................................................................................................................................29 5.5.1 USIM Pins......................................................................................................................................... 29 L830-EA M.2 Module Hardware User Manual Page 4 of 45 5.5.2 USIM Interface Design....................................................................................................................30 5.5.2.1 Normal Closed SIM Card Circuit Design.......................................................................30 5.5.2.2 Normally Open SIM Circuit Design.................................................................................30 5.5.3 Points for Attention in USIM Design.............................................................................................31 5.5.4 USIM Hot-Plugging..........................................................................................................................32 5.5.4.1 Hardware Connection..........................................................................................................32 5.5.4.2 Software Settings................................................................................................................. 32 5.6 Digital Audio.................................................................................................................................................33 5.6.1 I2S Interface..................................................................................................................................... 33 5.6.2 PCM Port Description..................................................................................................................... 33 5.7 Win8/Android Switch Control Interface................................................................................................... 34 5.8 W_DISABLE# Interface............................................................................................................................. 35 5.8.1 Description of WWAN_DISABLE# Interface...............................................................................35 5.8.2 GPS_DISABLE# Interface............................................................................................................. 35 5.9 TX_BLANKING Interface...........................................................................................................................35 5.10 WAKEUP_Host Interface.........................................................................................................................36 5.11 BODY_SAR Interface...............................................................................................................................36 5.12 I2C Interface.............................................................................................................................................. 36 5.13 Clock Interface.......................................................................................................................................... 37 5.14 Config Interface.........................................................................................................................................37 5.15 RF Interface............................................................................................................................................... 37 5.15.1 RF Connector Interface................................................................................................................37 5.15.2 RF Connecting Seat......................................................................................................................38 5.15.3 Main Performance of RF Connector.......................................................................................... 39 5.16 Other Interfaces........................................................................................................................................ 39 6 Electrical and Environmental Features...............................................................................................................39 6.1 Electrical Features...................................................................................................................................... 39 6.2 Environmental Features.............................................................................................................................40 7 RF Interface.............................................................................................................................................................41 7.1 Operating Frequency Band....................................................................................................................... 41 7.2 Receiving Sensitivity...................................................................................................................................42 7.3 GNSS............................................................................................................................................................ 43 7.4 RF PCB Design........................................................................................................................................... 43 7.4.1 Wiring Principle................................................................................................................................ 43 L830-EA M.2 Module Hardware User Manual Page 5 of 45 7.4.2 Impedance Design...........................................................................................................................43 7.5 Antenna Design...........................................................................................................................................44 7.5.1 Main Antenna Design Requirements........................................................................................... 44 L830-EA M.2 Module Hardware User Manual Page 6 of 45 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L830-EA M.2 wireless modules. With the assistance of the document and other instructions, developers can quickly understand the performance of L830-EA M.2 wireless modules and develop products. 1.2 Reference Standard The design of the product compiles with the following standards 3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE) 3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) 3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS) 3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile radio interface 3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol 3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services 3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell reselection in connected mode 3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;
Stage 2 3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2 3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information 3GPP TS 21.111 -v6.3.0: USIM and IC card requirements 3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path 3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity Module - Mobile Equipment (SIM-ME) interface 3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance specification 3GPP TS 22.004 -v6.0.0: General on supplementary services 3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2 L830-EA M.2 Module Hardware User Manual Page 7 of 45 3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;
3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD) 3GPP TS 36.101 V9.18.0: User Equipment (UE) radio transmission and reception 3GPP TS 36.104 V9.13.0: Base Station (BS) radio transmission and reception 3GPP TS 36.106 V9.4.0: FDD Repeater radio transmission and reception 3GPP TS 36.113 V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC) 3GPP TS 36.124 V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 36.133 V9.18.0: Requirements for support of radio resource management 3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the FDD UE 3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 34.122 V5.7.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD) 3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+); Radio transmission and reception L830-EA M.2 Module Hardware User Manual Page 8 of 45 2 Product Overview 2.1 Description L830-EA M.2 modules are highly integrated 4G wireless modules, supports 3 modes 16 bands that including the main 4G/3G/2G modes (LTE FDD/ WCDMA/ /GSM) and with wide bands, but not TDD mode in China. These bands support the main operators of Europe and North America and the cellular network of parts of the Asia . 2.2 Specifications Specification L830-EA Operating Frequency Range LTE FDD: Band 1,2,3,4,5,7,8,9,13,17,18,19,20,26,29 WCDMA HSPA+: Band 1,2,4,5,6,8 GSM/GPRS/EDGE: 850/900/1800/1900MHz 1 +5,8,18,19,26 2 +4,5,13,17,29 LTE inter-band CA 3 +5,8,19,20,26 4 +5,13,17,29 7 +3,20 LTE intra-band CA 4 GNSS Weight Data Rate Supported 5.7 grams LTE FDD Cat6 (300Mbps DL,50Mbps UL) UMTS/HSDPA/HSUPA 3GPP Rel.10 DC-HSDPA 42Mbps(Cat 24) HSUPA 5.76Mbps(Cat6) GSM 3GPP release 7 EDGE (E-GPRS) multi-slot class 33(296kbps DL, 236.8kbps UL) GPRS multi-slot class 33 (107kbps DL,85.6kbps UL) Physical Dimension 42x 30 x 2.3 mm L830-EA M.2 Module Hardware User Manual Page 9 of 45 Characteristics Interface M.2 Environment Performance Operating Temperature-30 ~ +65 Storage Temperature-40 ~ +85 Operating Voltage Voltage3.135V ~ 4.4V Normal3.3V Current Consumption
(Typical Value) Interface RF Interface 5mA (Sleep Mode) LTE FDD DATA750mA WCDMA580mA 2G Talk300mA (GSM PCL5) Antenna Mainx1Diversityx1 1 x USB 2.0Multiple Profiles over USBUSB SSIC Function Interface SIM Support I2C SupportI2S/PCM Support GPIOClock Data Features Protocol Stack EDGE GPRS CSD USSD SMS Audio External TCP/IP and UDP/IP protocol stack Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~9 Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~4 UMTS(14.4kbps)GSM(9.6kbps) Support MO / MT Text and PDU modes Cell broadcast not supported yet Character Set IRAGSMUCS2HEX FIBOCOM proprietary AT commands AT Commands GSM 07.05 GSM 07.07 L830-EA M.2 Module Hardware User Manual Page 10 of 45 Firmware Loader Tool over USB Accessories User Manual Developer Kit Note:
1. Please make sure the temperature for device will not be higher than 65C. 2. The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. 3. Assessment of compliance of the product with the requirements relating to the Radio and Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by PHOENIX TESTLAB (Notified Body No.0700), L830-EA M.2 Module Hardware User Manual Page 11 of 45 Note:
Federal Communications Commission (FCC) Declaration of Conformity This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. FCC Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. RF Exposure Information This device meets the governments requirements for exposure to radio waves. This device is designed and manufactured not to exceed the emission limits for exposure to radio frequency (RF) energy set by the Federal Communications Commission of the U.S. Government. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC L830-EA M.2 Module Hardware User Manual Page 12 of 45 compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
ZMOL830". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. L830-EA M.2 Module Hardware User Manual Page 13 of 45 2.3 Appearance The product appearance of L830-EA M.2 wireless module is shown as below:
Top View Bottom view:
L830-EA Figure 2- 1 Top View Figure 2- 2 Bottom View L830-EA M.2 Module Hardware User Manual Page 14 of 45 3 Structure 3.1 Dimension Diagram of Structure Figure 3- 1 Dimension Diagram of Structure L830-EA M.2 Module Hardware User Manual Page 15 of 45 3.2 Application Interface Description L830-EA M.2 module uses 75-pin gold fingers as the external interface, the size of the module please refer to the section 3.1.As shown in Figure 4-2, L830-EA M.2 module uses the 75-pin fingers interface
( 67 pins are the signal interface and 8 pins are notch) .About the naming rules of M.2, L830-EA adopts the Type 3042-S3-B (30mmx42mm,the maximum thickness of element layer of Top surface is 1.5mm , the thickness of PCB is 0.8mm , Key ID is B ) . L830-EA M.2 Module Hardware User Manual Page 16 of 45 3.3 M.2 Connector Recommend to use the M.2 connector from LOTES, the type is APCI0026-P001A, the package of connector design please refer to the relevant specifications. As shown in Figure 3-2:
Figure 3- 2 APCI0026-P001A M.2 connector dimension L830-EA M.2 Module Hardware User Manual Page 17 of 45 4 Hardware Introduction 4.1 Pin Definitions 4.1.1 Pin Map 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 10 8 6 4 2
+3.3V
+3.3V
+3.3V CLK32K SIM_DETECT NC NC NC NC NC NC NC NC TX_BLANKING SYSCLK GNSS_IRQ GNSS_SDA GNSS_SCL NC UIM_PWR UIM_DATA UIM_CLK UIM_RESET I2S_WA W_DISABLE2#
I2S_TX I2S_RX I2S_CLK Notch Notch Notch Notch LED1#(3.3V) W_DISABLE1#(3.3V) FUL_CARD_POWER_OFF#(1.8V)
+3.3V
+3.3V CONFIG_2 GND GND CONFIG_1 RESET#
ANTCTL3 ANTCTL2 ANTCTL1 ANTCTL0 GND NC NC GND NC NC GND NC NC GND SSIC-RXP SSIC-RXN GND SSIC-TXP SSIC-TXN GND DPR WOWWAN#
CONFIG_0 Notch Notch Notch Notch GND USB D-
USB D+
GND GND 75 73 71 69 67 65 63 61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 11 9 7 5 3 L830-EA M.2 Module Hardware User Manual Page 18 of 45 Figure 4-2 Pin Diagram (TOP View) CONFIG_3 1 4.1.2 Description of Pins Pins of L830-EA M.2 modules are described in the table below:
Idle Value Reset Value PIN Name Pin#
I/O 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 CONFIG_3 O L L
+3.3V GND
+3.3V GND PI PI FUL_CARD_POWER_OFF#
I PU PU USB D+
I/O W_DISABLE1#
I PD PU I/O O OD OD USB D-
LED1#
GND Notch Notch Notch Notch Notch Notch Notch Notch I2S_CLK O PD T Description The internal connected with GND, L830-EA M.2 module shall configure as the WWAN-SSIC0 interface type. Main power supply, voltage range:
3.135V ~ 4.4V GND Main power supply, voltage range:
3.135V ~ 4.4V GND Power off control signal, internal 200K pull-down resistor, CMOS 1.8V USB2.0 signal +
WWAN Disable, Low active, CMOS 3.3V USB2.0 signal -
System status LED, drain output , active low , CMOS 3.3V GND Notch Notch Notch Notch Notch Notch Notch Notch I2S serial clockCMOS 1.8V , L830-EA M.2 Module Hardware User Manual Page 19 of 45 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 CONFIG_0 O NC NC I2S_RX WOWWAN#
I2S_TX DPR W_DISABLE2#
GND I2S_WA SSIC-TXN UIM_RESET SSIC-TXP UIM_CLK GND I O O I I O O O O O PD T PD PU PD PD PD T PU PU PD T PP PP PP PP UIM_DATA I/O PU PU I O I SSIC-RXN UIM_PWR SSIC-RXP NC GND GNSS_SCL O PU PU
(Not supported yet ) Not connected. L830-EA M.2 module shall configure as the WWAN-SSIC0 interface type. I2S serial data input, CMOS 1.8V ,
(Not supported yet ) The module wake-up Host device signal, active low, CMOS 1.8V I2S serial data outputCMOS 1.8V ,
(Not supported yet ) Body SAR DetectCMOS 1.8V GPS Disable signal, active low, CMOS 1.8Vnot supported yet GND I2S left and right channel clock
(LRCK) , CMOS 1.8V ,
(Not supported yet ) USB SSIC Transmit data minus USIM card reset signal USB SSIC Transmit data plus USIM card clock signal GND USIM card data signal internal 4.7K pull-up resistor USB SSIC Receive data minus SIM card power supply output 1.8V/3.0V USB SSIC Receive data plus NC GND I2C serial data clock signal internal 4.7K pull-up resistor CMOS 1.8V L830-EA M.2 Module Hardware User Manual Page 20 of 45 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 NC GNSS_SDA I/O PU PU NC GNSS_IRQ I PU PU GND SYSCLK NC O PD TX_BLANKING O L NC NC GND NC NC NC NC NC GND NC ANTCTL0 NC ANTCTL1 NC O O L L ANTCTL2 O L L L L L L NC I2C serial data clock signal internal 4.7K pull-up resistor CMOS 1.8V NC Win8/Android dual system switch interrupt input signal, CMOS 1.8V GND 26MHz clock signal output NC GSM TDMA Timer output signal External GPS control signal , CMOS 1.8V NC NC GND NC NC NC NC NC GND NC Tunable antenna control signal,bit0, CMOS 1.8V. NC Tunable antenna control signal, MIPI RFFE SDATA, CMOS 1.8V .
(Not supported yet) NC Tunable antenna control signal, MIPI RFFE SCLK, CMOS 1.8V.
(Not supported yet)
(Not supported yet) L830-EA M.2 Module Hardware User Manual Page 21 of 45 64 65 66 67 68 69 70 71 72 73 74 75 NC ANTCTL3 SIM_DETECT RESET#
CLK32K CONFIG_1
+3.3V GND
+3.3V GND
+3.3V PU PU PU PU PD L L O I I O O PI PI PI CONFIG_2 O L L NC Tunable antenna control signal, MIPI RFFE VIO, CMOS 1.8V .
(Not supported yet) SIM DetectCMOS 1.8V,390K ohm pull-up resistor External reset signal input, pull up(100K ohms),CMOS 1.8V 32KHz clock output The inside connect with GND L830-EA M.2 module configure as the WWAN-SSIC0 interface type. Main power supply input, voltage range: 3.135V ~ 4.4V GND Main power supply input, voltage range: 3.135V ~ 4.4V GND Main power supply input , voltage range: 3.135V ~ 4.4V The inside connect with GND L830-EA M.2 module configure as the WWAN-SSIC0 interface type. PIPower Input HHigh Voltage Level LLow Voltage Level PDPull-Down PUPull-Up TTristate ODOpen Drain PPPush-Pull Note : the unused pins can NC directly while designing. L830-EA M.2 Module Hardware User Manual Page 22 of 45 5 Hardware Interface 5.1 Power Interface 5.1.1 Power Supply L830-EA M.2 modules require 3.135V ~ 4.4V direct current power supply, which can provide the maximum GSM emission current of 2A. Input power supply requirements:
Parameter Minimum Value Recommended Value Maximum Value Unit
+3.3V 3.135 3.3 4.4 V Points for attention in design:
1. Supply voltage fluctuation shall be lower than 200mV. 2. Minimum supply voltage drop shall be higher than 3.135V. The filter capacitor design of power supply circuit as follows:
Recommended capacitor Application Description 330uF Supply capacitance 1uF,100nF Digital signal noise Reduce power-supply fluctuation during phone call. The capacitance value bigger is better Filter the interference caused by clock and digital signals 39pF,33pF 700 /850 /900 MHz Filter RF interference 18pF,8.2pF,6.8pF 800/1700/1800/1900, 2100/2600MHz Filter RF interference 5.1.2 VIO_1V8 As the power supply for the digital circuit inside the module, VIO_1V8 can be used as the module`s reference level of the status index signal and digital signal. Only used for internal circuit. Parameter Minimum Value Recommended Value Maximum Value Unit L830-EA M.2 Module Hardware User Manual Page 23 of 45 VIO_1V8 1.7135 VIH VIL 0.7* VSD2_1V8
-0.3 1.8 1.8 0 1.8865 1.8865 0.3* VSD2_1V8 V V V 5.2 Power on/off and Reset Signal L830-EA M.2 wireless modules provide two control signals to power on /power off and reset the modules. Pins definition as listed below :
Pin#
Electrical Level Description Pin Name 6 FUL_CARD_POWER_OFF#
CMOS 1.8V Power on/off signal RESET#
67 5.2.1 Power on /off Signal 5.2.1.1 Power on Signal CMOS 1.8V External reset signal input After the M.2 module is connected to the power supply, the user can through pull up the signal of FUL_CARD_POWER_OFF# to make the module power on. Timing sequence requirement of the startup pulse:
Parameter Minimum Value Typical Value Maximum Value Condition Unit Pulse Width Power on 20 100 ms The timing sequence control is shown in the diagram below:
L830-EA M.2 Module Hardware User Manual Page 24 of 45 Figure 5- 1 Power on Timing Control Diagram Note : the>1sof VBAT is the time aim at the module power supply(that is the capacitance charging). If the VBAT is already set up or supplied in the long term, then the control time that aimed at VBAT can ignore and only control the RESET_Nand POWER_ON/OFF# . 5.2.1.2 Power off signal L830-EA M.2 module supports two power_off modes. Through the software modes to turn off the module in general condition. Only the system halted or happened exceptions, use the following hardware modes to turn off it, pull down the FUL_CARD_POWER_OFF# signal or floating. For details as listed below:
Off modes Methods Condition Software off Send AT+CPWROFF commands. Normal power_off Hardware off Pull down the FUL_CARD_POWER_OFF# signal or floating Only used for system halted or happens exceptions and the software modes cannot be used. The description of hardware power_off as follows (Pull down the FUL_CARD_POWER_OFF signal or floating) :
While pulling down the FUL_CARD_POWER_OFF signal or floating, the modules` PMU (Power Management Unit) will be reset, then the module will get into off modes from working modes. Note : the RESET_N must be pulled down before pulling down the FUL_CARD_POWER_OFF signal, and then the module will be turned off safely. The timing sequence requirements of the pulse are as follows:
Parameter Condition Pulse Width Power off Minimum Value 5 Typical Value Maximum Value Unit ms 100 The timing sequence control is shown in the diagram below:
L830-EA M.2 Module Hardware User Manual Page 25 of 45 Figure 5- 2 Power off Timing Control Diagram 5.2.1.3 The Recommended Design of Power on/off The recommended design of FUL_CARD_POWER_OFF# signal is as follows:
Figure 5- 3 Recommended Design of FUL_CARD_POWER_OFF# Signal 5.2.2 RESET Signal L830-EA M.2 wireless modules support external reset function. It is feasible to reset the module back to the original state by the Reset Signal. When setting the Reset Signal low for 100ms, the module will be reset and restarted. When the user uses the Reset function, the PMU inside the module will not lose power. Note: Reset signal is a sensitive signal line. In designing PCB layout, please keep the line away from RF interference, and make it well wrapped with ground wire. And it is advised to add an anti-shaking capacitor at the place close to the module end. At the same time; Reset_N signal line shall avoid the PCB edge and the surface, then reset the ESD can be avoided. The timing sequence requirements of its pulse are as follows:
Parameters Condition Minimum Value Typical Value Maximum Value Pulse Width Reset 7 100 1000 Unit ms Recommended design:
L830-EA M.2 Module Hardware User Manual Page 26 of 45 Figure 5- 4 Reset# Circuit Recommended Design 5.3 Status Indicating Signal 5.3.1 Status Indicating Pin L830-EA M.2 modules provide drain output signal for indexing RF status. Pin#
10 Pin Name Description LED1#
Close or open RF network status index, ,CMOS 3.3V LED# signal description as listed below :
No Status LED1#
1 2 RF function opened Low level RF function closed High level Recommended design:
Figure 5- 5 Recommended design of LED Status Index L830-EA M.2 Module Hardware User Manual Page 27 of 45 5.4 USB /SSIC Interface L830-EA M.2 wireless modules support USB 2.0 and USB SSIC. While the L830-EA M.2 module insert into the PC, the USB/SSIC interface will map one MBIM interface and one ACM interface in the PC side on Win8/8.1/10 system. (it will display GNSS Sensor while the ACM port is installed driver ). Through the Win8/Android switch pin can switch to three ACM ports and three NCM ports . For details as follows:
Win8/8.1/10 system supports MBIM interface without extra drive. If you need to support GNSS you should install the corresponding ACM port drive. Three AOM ports will use for sending AT command(2 of the AOM ports) and grab software LOG information (one of the AOM port). Three NCM ports are virtual network ports, mainly for initiating data traffic. Note: About the Win8/Android system switch refer to the section 5.7, Android system requires the corresponded drive is installed on PC. Note: One of the AOM port can use for Modem COM port and initiate data services. Due to the speed of Modem COM port is too slow to up to DL 300Mbpss, so it is not suggested. The Modem COM can be used to initiate data services temporarily only while the client`s NCM port is useless. 5.4.1 USB Interface Pin#
Pin Name 7 9 USB_DP USB_DM Reference Circuit Design:
I/O I/O I/O Description USB signal+
USB signal-
Figure 5- 6 USB Interface Reference Circuit Design T101 and T102 shall be TVS with capacitance lower than 1pF . VUSB power supply has built connected within the module, so the VBUS PIN of Host side can be floating. USB_D+ and USB_D- are the high-speed differential signal line, and their highest transmission rate is L830-EA M.2 Module Hardware User Manual Page 28 of 45 480Mbps. The following requirements should be followed in designing PCB layout. USB_D+ and USB_D- signal lines should have the same length, and should be parallel; avoid right angle wiring. USB_D+ and USB_D- signal lines should be wrapped with GND at the ends. USB2.0 differential signal line should be laid at the signal layer closest to the ground layer. USB signal line shall be far away from stronger interference signal, such as power supply. Ensure impedance matching; impedance is required to be 90ohm. 5.4.2 USB SSIC Interface L830-EA M.2 wireless modules support USB Super Speed Inter-ChipUSB SSIC, achieve the high speed transmission with low consumption between the chips, meet the high bandwidth transmission requires of the 4G LTE and mobile network. The definition of USB SSIC interface as listed below:
Pin#
Function Description Pin Name I/O 29 31 35 37 SSIC_TXN SSIC_TXP SSIC_RXN SSIC_RXP O O I I USB SSIC Transmitter Signal Nconnect SSIC_RXN in AP side USB SSIC Transmitter Signal Pconnect SSIC_RXP in AP side USB SSIC Receiver Signal Nconnect SSIC_TXN in AP side USB SSIC Receiver Signal Pconnect SSIC_TXP in AP side USB SSIC is the high-speed differential signal line, and their highest transmission rate is up to 5Gbps. The following requirements should be followed in designing PCB layout. SSIC_TXN/ SSIC_TXP and SSIC_RXN/ SSIC_RXP are two differential signal requires parallel and equal length, meanwhile, it requires to avoid right angle routing;
TX and RX signal lines should be wrapped with GND at the ends. TX and RX signal lines require isolate. The differential signal line should be laid at the signal layer closest to the ground layer. Ensure impedance matching; impedance is required to be 100ohm. lines, the routing 5.5 USIM Interface L830 M.2 series wireless modules support USIM and high speed SIM cards. But 8-line intelligent USIM is not supported yet. 5.5.1 USIM Pins Pin#
Pin Name I/O Function Description L830-EA M.2 Module Hardware User Manual Page 29 of 45 36 30 32 34 66 UIM_PWR UIM_RESET UIM_CLK O O O UIM_DATA I/O SIM_DETECT I USIM power supply signal USIM Reset Signal USIM clock signal USIM data signal USIM Plug-in detection signal , 390K resistor will be pulled up by default. High level indicates that SIM card is inserted. Low level indicates that card is not inserted. 5.5.2 USIM Interface Design 5.5.2.1 Normal Closed SIM Card Circuit Design Reference Circuit Design:
Figure 5- 7 Reference Design of Normally Closed SIM Card Interface Normally closed SIM Connector:
1Pull out SIM card, pin 7 and pin 8 will short-circuit . 2Insert SIM card, pin 7 and pin 8 will disconnect. 5.5.2.2 Normally Open SIM Circuit Design Referenced Circuit Design:
L830-EA M.2 Module Hardware User Manual Page 30 of 45 Figure 5- 8 Reference Design of Normally Open SIM Card Interface Normally Open SIM Connector:
1Pull out SIM card, pin 7 and pin 8 will disconnect. 2Insert SIM card, pin 7 and pin 8 will short-circuit Note:
In order to improve EMC performance, the SIM card slot should be close to the module to the largest extent. The filter capacitor on the SIM-card signal circuit should be placed close to SIM card pin to the largest extent. ESD device (like TVS) shall be added to the SIM-card signal circuit protection. ESD device should be placed close to SIM card pin. SIM card connector shall be with shielding function, to improve the anti-jamming capability of SIM card SIM1_CD signal connection supports hot-plugging; active high level by default(change to active low through AT commands ). If the module detects the signal at high level, it means there is a card in the module. 5.5.3 Points for Attention in USIM Design SIM card interface design is very important for the normal operation of the module and SIM card. The following points need to be complied with during the design:
SIM card layout and wiring must keep away from EMI interference source, like RF antenna and digital L830-EA M.2 Module Hardware User Manual Page 31 of 45 switch signal. In order to ensure signal completeness, the wire distance between the module and SIM card should not exceed 100mm. In order to avoid mutual interference, USIM_CLK and USIM_IO signals should be separated in wiring. It would be best to wrap them with ground wire respectively. SIM card signal line should be protected with ESD. These protective devices should have small capacitance (like Zener diode, etc.). Users are recommended to select ESD devices with equivalent capacitance lower than 33pF. During layout, ESD device should be close to the SIM card interface. 5.5.4 USIM Hot-Plugging L830-EA M.2 module supports SIM card status-detection function. This function allows the hot-plugging of SIM card. 5.5.4.1 Hardware Connection SIM card hot-plugging function needs to work with SIM_DETECT signal. SIM_DETECT will be at low level without SIM card; after inserting SIM card, SIM_DETECT will be at high level. Note :
For Normal closed SIM card, as shown in the figure 5-7, SIM_DETECT signal line is connected to U2s Pin8 (SW2), and Pin7 (SW1) is connected to the ground. When the SIM card is not inserted, SW2 and SW1 short circuit, SW2 will be at low level. When the SIM card is inserted, SW2 and SW1 will be disconnected, SIM_DETECT level will be pulled up. For Normal opened SIM card, as shown in the figure 5-8, SIM_DETECT signal line is connected to U2s Pin8 (SW2), and Pin7 (SW1) will be pulled up 4.7K resistor . When the SIM card is not inserted, SW2 and SW1 will be disconnected, then SW2 will be at low level. When the SIM card is inserted, SW2 and SW1 will short circuit, SIM_DETECT level will be pulled up. 5.5.4.2 Software Settings
+MSMPD configures AT command for the SIM card status-detection function. If set AT+MSMPD=0, SIM card status-detection function will be closed, and the module will not detect SIM_DETECT signal. If set AT+MSMPD=1, SIM card status-detection function will be in operation, and the module will detect if the SIM card is inserted by SIM_DETECT Pin. If SIM_DETECT is at high level, which indicates SIM card is inserted, the module will automatically register it to the network. L830-EA M.2 Module Hardware User Manual Page 32 of 45 If SIM_DETECT is at low level, which indicates SIM card is not inserted, the module will not register it to the network. Note: the default of +MSMPD parameter is 1.SIM_DETECT is the detection signal. While the module first power on or plug after that, SIM_DETECT will detect if the SIM card is existing or not. Just only if the SIM_DETECT is low level, the module will cannot read SIM card. 5.6 Digital Audio L830-EA M.2 module supports digital audio I2S interface that supports normal I2S mode and PCM mode. I2S interface level is 1.8V on average. I2S signal description:
Pin#
Pin Name I/O 20 28 22 24 I2S_CLK I2S_WA I2S_RX I2S_TX O O I O Description Bit Clock Left and right channel clock (LRCK) Serial data input Serial data output Note : The digital audio interface is not supported yet. 5.6.1 I2S Interface L830-EA M.2 Signal Direction Audio CODEC I2S Port I2S_CLK I2S_WA I2S_RX I2S_TX Description:
I2S_CLK I2S_LRCK I2S_SDOUT I2S_SDIN I2S interface can be configured as client-server work mode. Suitable for various audio sampling frequencies(48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz, 11.025KHz and 8KHz). 5.6.2 PCM Port Description L830-EA M.2 Signal Direction Audio CODEC PCM Port I2S_CLK0(PCM_CLK ,PCM clock signal) PCM_CLKPCM clock signal L830-EA M.2 Module Hardware User Manual Page 33 of 45 I2S_WA0(PCM_SYNC , PCM frame synchronization signal) I2S_RX(PCM_DIN , PCM data input) I2S_TX(PCM_DOUT , PCM data output) Note:
PCM_SYNCPCM frame synchronization signal PCM_DOUTPCM data output PCM_DINPCM data input PCM interface can be configured as client-server work mode. Support short frame synchronization at 16, 32, 48, and 64 bit mode Support burst and continuous mode transmission Supports clock length of frame synchronization signal and rising edge/ falling edge trigger configuration of data transmission. Suitable for various audio sampling frequencies(48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz, 11.025KHz and 8KHz). Note: Cause the timing of I2S modes is easier than PCM modes and easier to fit, recommend clients to use transmission audio of I2S mode. While transmission with PCM modes, the PCM timing sequence is difficult to fit to make the tone quality become bad. 5.7 Win8/Android Switch Control Interface L830-EA M.2 module supports the Win8/Android dual system switch. Check and achieve the switch function through interrupt signal GNSS_IRQ. Pin#
Name 44 GNSS_IRQ I/O I Description The detection signal of Win8/Android dual system switch, CMOS 1.8V The definition of GNSS_IRQ signal function as listed below :
No. GNSS_IRQ Function 1 2 High/Floating Win8 system supports, , the module`s USB ports shall set as MBIM mode. Low Android system supports, the module`s `USB ports shall set as 3ACM+3NCM modes. Note 1. Check and achieve the Win8/Android system switch through GNSS_IRQ level while module starting . Keep the GNSS_IRQ level stability during starting. 2. Check and achieve the Win8/Android system switch through GNSS_IRQ rising edge/ falling edge while the module starting. The de-bouncing time sets as 100ms. The module will reboot once meeting all the requirements and switch different system supports. L830-EA M.2 Module Hardware User Manual Page 34 of 45 3. Win8 refers to Windows version above the Win8, including Win8 / 8.1/10 systems that support MBIM port. For the low version of Windows 7 system, still use the Android system of ACM. 5.8 W_DISABLE# Interface 5.8.1 Description of WWAN_DISABLE# Interface L830-EA M.2 module supports open/close the WWAN RF functional signal through hardware, and this function can also be controlled by AT commands. Pin#
8 Name W_DISABLE1#
I/O I Description WWAN on/off signal, CMOS 3.3V The definition of W_DISABLE# signal as listed below:
No. W_DISABLE#
Function 1 2 Low High WWAN off WWAN on Floating 3 5.8.2 GPS_DISABLE# Interface WWAN function is controlled by AT commands, it is on by default. L830-EA M.2 module supports open/close GPS functional signal, and this function is also controlled by AT commands. Pin#
Name 26 W_DISABLE2#
I/O I Description GPS on/off signal , 1.8V The definition of GPS_DISABLE# signal as listed below:
No. GPS_DISABLE#
Function 1 2 3 Low High GPS off GPS on Floating GPS function is controlled by AT commands, it is on by default. Note: This function is not supported yet. 5.9 TX_BLANKING Interface Output the low level by default. While the module works in GSM bands, TX_BLANKING will output the pulse signal that synchronized with GSM burst timing sequence. Because of the GSM TX will interface L830-EA M.2 Module Hardware User Manual Page 35 of 45 GPS signal receiving, suggest to close GPS or stop GPS data receiving while AP has detected the TX_BLANKING pulse signal. Pin#
48 Name TX_BLANKING I/O O Description External GPS control signal 5.10 WAKEUP_Host Interface L830-EA M.2 module supports WAKEUP_Host; the pin is high level by default. Output low level while awaking host. Pin#
Description Name I/O 23 WOWWAN#
O L830-EA M.2 module wakes up the Host signal, 1.8V signal low level is available 5.11 BODY_SAR Interface L830-EA M.2 module supports BODY_SARDPR pin. BODY_SAR is input signal(this signal is output by AP-side) and with high level by default. Low level is available. AP can detect the human body`s nearing through distance sensor, then output the BODY_SAR signal with low level. Once the module detect the signal through interrupt detection, it will reduce the TX power. The reduced threshold value can be set by AT commands. Pin#
Description Name I/O 25 DPR I BODY_SAR detection 5.12 I2C Interface L830-EA M.2 module supports a 12C interface and with I2C master by default. This I2C used for drive external I2C slave device, such as Audio codec and so on. Pin#
Description Name I/O 42 40 GNSS_SDA GNSS_SCL I/O O I2C control signal input/output ,1.8V signal I2C control clock signal, 1.8V signal The signal connection of L830-EA I2C and external 12C slave device ( such as Audio Codecas listed below:
L830-EA M.2 Direction Audio Codec I2C Port L830-EA M.2 Module Hardware User Manual Page 36 of 45 GNSS_SDA GNSS_SCL I2C_SDA I2C_SCL 5.13 Clock Interface L830-EA M.2 module supports a 26MHz clock output and a 32KHz clock output. Pin#
Name 46 68 SYSCLK CLK32K I/O O O Description 26MHz clock output (recommend the external GPS to use it, and can also use as MCLK of audio codec) 32KHz clock output 5.14 Config Interface L830-EA M.2 module supports 4 config pins and the module is configured to WWAN-SSIC-0:
Pin#
Pin Name I/O Description Value 1 21 69 75 CONFIG_3 CONFIG_0 CONFIG_1 CONFIG_2 O O O O The internal connect to GND NC The internal connect to GND The internal connect to GND 0
-
0 0 The configuration of L830-EA M.2 Socket 2 Module type as listed below :
Config_0
(pin21) Config_1
(pin69) Config_2
(pin75) GND GND N/C GND GND GND GND N/C GND Config_3 Module Type and Main Port
(pin1) GND GND GND Host Interface Configuration SSD-SATA WWAN-PCIe WWAN-SSIC N/A N/A 0 5.15 RF Interface 5.15.1 RF Connector Interface L830-EA M.2 module provide 2 RF connected interface, used for the connection of external antenna. M is the RF main antenna, D/G is the Diversity/GNSS antenna. L830-EA M.2 Module Hardware User Manual Page 37 of 45 5.15.2 RF Connecting Seat Figure 5- 9 RF connector diagram L830-EA M.2 module adopts the Murata MM4829-2702 RF connecting seat. The dimension is 2.0*2.0*0.6mm. The structure diagram as follows :
Figure 5- 10 Structure diagram of RF connecting seat L830-EA M.2 Module Hardware User Manual Page 38 of 45 Figure 5-11 0.81mm coaxial cable matching RF connector Figure 5-12 the RF connector insert into RF connecting seat 5.15.3 Main Performance of RF Connector Rated condition Environmental condition Frequency range DC to 6GHz Temperature range:
50 Characteristic impedance 5.16 Other Interfaces L830-EA M.2 module does not support the GPIO and Tunable ANT interface yet. 40C to +85C 6 Electrical and Environmental Features 6.1 Electrical Features The table below lists the range of L830-EA module s electrical characteristics:
L830-EA M.2 Module Hardware User Manual Page 39 of 45 Parameters Minimum Value Maximum Value Unit Power supply signal 0 Digital signal 6.2 Environmental Features 0 4.4 1.9 V V This table below shows the environmental features of L830-EA. Parameters Minimum Value Maximum Value Operational Temperature Storage Temperature
-30
-40
+65
+85 Unit C C L830-EA M.2 Module Hardware User Manual Page 40 of 45 7 RF Interface 7.1 Operating Frequency Band The RF operating frequency band as listed below:
Operating Band Description Mode Tx (MHz) Rx (MHz) Band 1 Band 2 Band 3 Band 4 Band 5 Band 6 Band 7 Band 8 Band 9 Band 13 Band 17 Band 18 Band 19 Band 20 Band 26 Band 29 GPS L1 GLONASS L1 1920 - 1980 LTE FDD/WCDMA IMT 2100MHz LTE FDD/WCDMA/GSM 1850 - 1910 PCS 1900MHz LTE FDD/GSM 1710 - 1785 DCS 1800MHz LTE FDD/WCDMA 1710 - 1755 AWS 1700MHz LTE FDD/WCDMA/GSM 824 - 849 CLR 850MHz WCDMA 830 - 840 UMTS 800MHz LTE FDD 2500 - 2570 IMT-E 2600Mhz LTE FDD/WCDMA/GSM 880 - 915 E-GSM 900MHz LTE FDD UMTS 1700MHz USMH Block C LTE FDD LSMH Blocks B/C LTE FDD Japan Lower 800Mhz Japan Upper 800Mhz LTE FDD EUDD 800MHz ECLR 850MHz LTE FDD LSMH blocks D/E LTE FDD 832 - 862 814 - 849 N/A 815 - 830 830 - 845 LTE FDD LTE FDD 1749.9 -1784.9 777 - 787 704 - 716 2110 - 2170 1930 - 1990 1805 - 1880 2110 - 2155 869 - 894 875 - 885 2620 - 2690 925 - 960 1844.9 -1879.9 746 - 756 734 - 746 860 - 875 875 - 890 791 - 821 859 - 894 716 - 728 1574.42
-1576.42 1597.55
-1605.89 L830-EA M.2 Module Hardware User Manual Page 41 of 45 7.2 Receiving Sensitivity For different modes , the receiving sensitivity of L830-EA bands as listed below :
Mode GSM WCDMA LTE FDD Band GSM850 GSM900 DCS1800 PCS1900 Band 1 Band 2 Band 4 Band 5 Band 6 Band 8 Band 1 Band 2 Band 3 Band 4 Band 5 Band 7 Band 8 Band 9 Band 13 Band 17 Band 18 Band 19 Band 20 Band 26 Band 29 Rx Sensitivity(dbm)
-109
-109
-109
-109
-110
-110
-110
-110
-110
-110
-101
-99
-101
-100
-101
-98
-100
-100
-100
-100
-100
-100
-101
-100
-100 Note BER<2.43%
BER<2.43%
BER<2.43%
BER<2.43%
BER<0.1%
BER<0.1%
BER<0.1%
BER<0.1%
BER<0.1%
BER<0.1%
10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width 10MHz Band width Note : The above values are tested in the double antenna situation (Main+Diversity). If used the single antenna (without Diversity), the value of sensitivity will accordingly drop by some 3dbm. L830-EA M.2 Module Hardware User Manual Page 42 of 45 7.3 GNSS L830-EA M.2 module supports GPS , GLONASS and aGPS. The antenna with RF Diversity and GNSS.Through the AT order can open or close the GNSS functions, please reference the AT order manual. For Android system, GNSS output by ACM according to the data format of NEMA0183 , and the baud rate is 115200;
For Win8/8.1/10 system, GNSS output by GNSS Sendor. Description Power GPS/
TTFF GLONASS Condition GPS fixing GPS tracking GLONASS fixing GLONASS tracking Sleep Cold start Warm start Hot Start Cold start 158dBm aGPS GPS Sensitivity GLONASS 157dBm Test Result 70mA 70mA 65mA 65mA 3.5mA 38s/130dBm 35s/130dBm 1s/130dBm (GPS signal powers off 1s) 1s/130dBm 160dBm 158dBm NoteThe current of GNSS is testing under the situation of RF disable. 7.4 RF PCB Design 7.4.1 Wiring Principle L830-EA adopts double RF antennas, the MAIN_ANT used for transmitting and receiving, the DIV_ANT used for receiving. On the one hand, diversity antenna can improve the receiving sensitivity, on the other hand, it can also improve the download speed. Because the L830-EA project is for LTE module, the Antenna need double antennas can meet the performance requirements. 7.4.2 Impedance Design The impedance of RF signal line of antenna interface needs to be controlled at 50 ohm. L830-EA M.2 Module Hardware User Manual Page 43 of 45 7.5 Antenna Design 7.5.1 Main Antenna Design Requirements
(1) Antenna efficiency Antenna efficiency is the ratio of the input power and radiant power. Because of the antennas return loss, material loss and coupling loss, the radiant power is always lower than the input power. The ratio is recommended to be > 40% (4dB).
(2) S11 or VSWR S11 shows the matching degree of the antennas 50 ohm impedance, which affects antenna efficiency to a certain extent. It is feasible to use VSWR testing method to measure the index. It is recommended that S11 < 10dB.
(3) Polarization Polarization is the rotation direction of the electric field of the antenna at the direction of the largest radiation. It is recommended to use linear polarization; for diversity antenna, it is recommended to use different polarization directions from that of the main antenna.
(4) Radiation pattern Radiation pattern refers to the electromagnetic field intensity at various directions in the far field of the antenna. Half-wave doublet antenna is the perfect terminal antenna. In the case of built-in antenna, it is recommended to use PIFA. Antenna area: H 6mm * W 10mm * L 100mm. It is recommended to use PIFA or IFA. Antenna radiation direction: Omni-directional.
(5) Gain and directivity Antenna directivity refers to the electromagnetic field intensity at various directions of the electromagnetic wave. Gain is the combination of the antenna efficiency and antenna directivity. It is recommended that antenna gain 3dBi.
(6) Interference the module In addition to antenna performance, other interference from the PCB will also affect performance. In order to ensure the high performance of the module, the interference must be under control. Suggestions: keep speaker, LCD, CPU, FPC wiring, audio circuit, and power supply away from the antenna; add appropriate separation and shielding devices, or conduct filtering on the path.
(7) TRP/TIS L830-EA M.2 Module Hardware User Manual Page 44 of 45 TRP (Total Radiated Power) GSM850/900>28dBm DCS1800/PCS1900 >25dBm WCDMA Band 1, 2, 4, 5, 6, 8>19dBm LTE FDD Band 1, 2, 3, 4, 5, 7, 8, 9, 13, 17, 18, 19, 20, 26 >19dBm TIS (Total Isotropic Sensitivity) GSM850/900/DCS1800/PCS1900 <-102dBm WCDMA Band 1, 2, 4, 5, 6, 8<-102dBm LTE FDD Band 1, 2, 3, 4, 5, 7, 8, 9, 13, 17, 18, 19, 20, 26 <-95dBm (10MHz Band width) L830-EA M.2 Module Hardware User Manual Page 45 of 45
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2016-02-02 | JBP - Part 15 Class B Computing Device Peripheral | Original Equipment | |
| 2 | 2510 ~ 2560 | PCB - PCS Licensed Transmitter |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 2 | Effective |
2016-02-02
|
||||
| 1 2 | Applicant's complete, legal business name |
Fibocom Wireless Inc.
|
||||
| 1 2 | FCC Registration Number (FRN) |
0020891057
|
||||
| 1 2 | Physical Address |
5/F,Tower A,Technology Building II,1057 Nanhai Ave
|
||||
| 1 2 |
ShenZhen, N/A 518000
|
|||||
| 1 2 |
China
|
|||||
| app s | TCB Information | |||||
| 1 2 | TCB Application Email Address |
s******@nemko.com
|
||||
| 1 2 | TCB Scope |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
||||
| 1 2 |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
|||||
| app s | FCC ID | |||||
| 1 2 | Grantee Code |
ZMO
|
||||
| 1 2 | Equipment Product Code |
L830
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 2 | Name |
X******** H******
|
||||
| 1 2 | Title |
Regulatory Principal Engineer
|
||||
| 1 2 | Telephone Number |
+8675********
|
||||
| 1 2 | Fax Number |
+86-7********
|
||||
| 1 2 |
k******@fibocom.com
|
|||||
| app s | Technical Contact | |||||
| n/a | ||||||
| app s | Non Technical Contact | |||||
| n/a | ||||||
| app s | Confidentiality (long or short term) | |||||
| 1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 2 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 07/31/2016 | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 2 | Equipment Class | JBP - Part 15 Class B Computing Device Peripheral | ||||
| 1 2 | PCB - PCS Licensed Transmitter | |||||
| 1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE Module | ||||
| 1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 2 | Modular Equipment Type | Single Modular Approval | ||||
| 1 2 | Purpose / Application is for | Original Equipment | ||||
| 1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
| 1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 2 | Grant Comments | Single Modular Approval. Power output listed is conducted at the antenna terminal. This device is to be used only for mobile and fixed application, and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi- transmitter evaluation procedures. OEM integrators must be provided with antenna installation instructions and labeling requirements for finished products, and must ensure that the end user has no manual instructions to remove or install this modular. End-users must be provided with transmitter operation conditions for satisfying RF exposure compliance. For mobile and fixed operating configurations the antenna gain, including cable loss, must not exceed 5 dBi and 3 dBi for below and above 1 GHz, respectively, as defined in 2.1091 for satisfying RF exposure compliance. Under no conditions may an antenna gain be used that would exceed the ERP and EIRP power limits as specified in Part 22, Part 24 and Part 27. This device contains functions that are not operational in the U.S. Territories. This filing is only applicable for U.S. operations. | ||||
| 1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 2 | Firm Name |
SPORTON INTERNATIONAL (Shenzhen) INC.
|
||||
| 1 2 | Name |
M******** L******
|
||||
| 1 2 | Telephone Number |
86-75********
|
||||
| 1 2 | Fax Number |
86-75********
|
||||
| 1 2 |
m******@sporton.com.tw
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 15B | |||||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 2 | 1 | 22H | 824.2 | 848.8 | 1.7947 | 0.0203 ppm | 248KGXW | ||||||||||||||||||||||||||||||||||
| 2 | 2 | 22H | 824.2 | 848.8 | 0.5117 | 0.0108 ppm | 256KG7W | ||||||||||||||||||||||||||||||||||
| 2 | 3 | 22H | 826.4 | 846.6 | 0.1986 | 0.0478 ppm | 4M08F9W | ||||||||||||||||||||||||||||||||||
| 2 | 4 | 24E | 1850.2 | 1909.8 | 0.9462 | 0.0115 ppm | 246KGXW | ||||||||||||||||||||||||||||||||||
| 2 | 5 | 24E | 1850.2 | 1909.8 | 0.4305 | 0.0125 ppm | 254KG7W | ||||||||||||||||||||||||||||||||||
| 2 | 6 | 24E | 1852.4 | 1907.6 | 0.1972 | 0.0186 ppm | 4M09F9W | ||||||||||||||||||||||||||||||||||
| 2 | 7 | 27 | 1712.4 | 1752.6 | 0.2 | 0.0242 ppm | 4M08F9W | ||||||||||||||||||||||||||||||||||
| 2 | 8 | 24E | 1860 | 1900 | 0.1622 | 0.0133 ppm | 18M4G7D | ||||||||||||||||||||||||||||||||||
| 2 | 9 | 24E | 1860 | 1900 | 0.1371 | 0.0133 ppm | 18M5W7D | ||||||||||||||||||||||||||||||||||
| 2 | 1 | 24E | 1850.7 | 1909.3 | 0.1762 | 0.0133 ppm | 1M10G7D | ||||||||||||||||||||||||||||||||||
| 2 | 11 | 24E | 1851.5 | 1908.5 | 0.1472 | 0.0133 ppm | 2M73W7D | ||||||||||||||||||||||||||||||||||
| 2 | 12 | 27 | 1720 | 1745 | 0.1607 | 0.0139 ppm | 18M5G7D | ||||||||||||||||||||||||||||||||||
| 2 | 13 | 27 | 1720 | 1745 | 0.1374 | 0.0139 ppm | 18M5W7D | ||||||||||||||||||||||||||||||||||
| 2 | 14 | 27 | 1710.7 | 1754.3 | 0.1758 | 0.0139 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
| 2 | 15 | 27 | 1710.7 | 1754.3 | 0.1496 | 0.0139 ppm | 1M09W7D | ||||||||||||||||||||||||||||||||||
| 2 | 16 | 22H | 829 | 844 | 0.1667 | 0.0191 ppm | 9M13G7D | ||||||||||||||||||||||||||||||||||
| 2 | 17 | 22H | 829 | 844 | 0.1419 | 0.0191 ppm | 9M09W7D | ||||||||||||||||||||||||||||||||||
| 2 | 18 | 22H | 824.7 | 848.3 | 0.171 | 0.0191 ppm | 1M10G7D | ||||||||||||||||||||||||||||||||||
| 2 | 19 | 22H | 824.7 | 848.3 | 0.1479 | 0.0191 ppm | 1M10W7D | ||||||||||||||||||||||||||||||||||
| 2 | 2 | 27 | 2510 | 2560 | 0.1968 | 0.0114 ppm | 18M7G7D | ||||||||||||||||||||||||||||||||||
| 2 | 21 | 27 | 2510 | 2560 | 0.1675 | 0.0114 ppm | 18M5W7D | ||||||||||||||||||||||||||||||||||
| 2 | 22 | 27 | 2507.5 | 2562.5 | 0.171 | 0.0114 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
| 2 | 23 | 27 | 782 | 782 | 0.1652 | 0.0153 ppm | 8M97G7D | ||||||||||||||||||||||||||||||||||
| 2 | 24 | 27 | 782 | 782 | 0.1358 | 0.0153 ppm | 8M97W7D | ||||||||||||||||||||||||||||||||||
| 2 | 25 | 27 | 709 | 711 | 0.1626 | 0.0155 ppm | 9M05G7D | ||||||||||||||||||||||||||||||||||
| 2 | 26 | 27 | 709 | 711 | 0.14 | 0.0155 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
| 2 | 27 | 22H,9 | 821.5 | 841.5 | 0.1663 | 0.0116 ppm | 13M5G7D | ||||||||||||||||||||||||||||||||||
| 2 | 28 | 22H,9 | 821.5 | 841.5 | 0.1422 | 0.0116 ppm | 13M7W7D | ||||||||||||||||||||||||||||||||||
| 2 | 29 | 22H,9 | 814.7 | 848.3 | 0.1816 | 0.0116 ppm | 1M10G7D | ||||||||||||||||||||||||||||||||||
| 2 | 3 | 22H,9 | 814.7 | 848.3 | 0.1581 | 0.0116 ppm | 1M10W7D | ||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC