ng L831-EA Module Hardware User Manual Version: V1.0.1 Date: 2015-02-12 Confidential Material This document contains information highly confidential to Fibocom Wireless Inc. (Fibocom). Fibocom offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Fibocom. The information provided is based upon requirements specifically provided to Fibocom by the customers. All specifications supplied herein are subject to change. Disclosure of this information to other parties is prohibited without the written consent of Fibocom. Copyright Copy, Reproduce, Distribute and/or Edit of this document or part of it as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2015 Fibocom Wireless Inc. All rights reserved. Trademarks Notice The FIBOCOM Logo is registered by Fibocom Wireless Inc. All other product or service names or logos are the property of their respective owners. Copyright 2015 Fibocom Wireless Inc. All rights reserved. L831-EA Module Hardware User Manual Page 2 of 43 FOR FCC Federal Communications Commission (FCC) Declaration of Conformity This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the interference by one or more of the following measures:
the user is encouraged to try to correct
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. FCC Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. RF Exposure Information This device meets the governments requirements for exposure to radio waves. This device is designed and manufactured not to exceed the emission limits for exposure to radio frequency (RF) energy set by the Federal Communications Commission of the U.S. Government. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. L831-EA Module Hardware User Manual Page 3 of 43 IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
ZMOL831". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. L831-EA Module Hardware User Manual Page 4 of 43 Revision History Version Date Remarks V1.0.0 V1.0.1 2014-12-30 Initial version 2015-02-12 Update the consumption and the power on/off timing L831-EA Module Hardware User Manual Page 5 of 43 Applicability Table No. Type Note 1 L831-EA The difference of L831-EA wireless module as listed below:
Model Type LTE FDD WCDMA GSM/GPRS/EDGE L831-EA Band 1,2,3,4,5,7,8,13,17, 18,19,20 Band 1,2,4,5,8 850/900/1800/1900MHz L831-EA Module Hardware User Manual Page 6 of 43 Contents IMPORTANT NOTE:................................................................................................................................................... 4 1 Preface..................................................................................................................................................................... 10 1.1 Outline...........................................................................................................................................................10 1.2 Standards..................................................................................................................................................... 10 2 Introduction..............................................................................................................................................................12 2.1 Description................................................................................................................................................... 12 2.2 Specifications...............................................................................................................................................12 2.3 Appearance..................................................................................................................................................15 3 Mechanical...............................................................................................................................................................16 3.1 Dimension.....................................................................................................................................................16 3.2 Application Interface Description..............................................................................................................17 3.3 M.2 Connector............................................................................................................................................. 18 4 Hardware Overview................................................................................................................................................19 4.1 Pins Definition..............................................................................................................................................19 4.1.1 Pins Number.....................................................................................................................................19 4.1.2 Pins Description...............................................................................................................................20 5 Hardware Interface.................................................................................................................................................24 5.1 Power Interface........................................................................................................................................... 24 5.1.1 Power Supply................................................................................................................................... 24 5.1.2 VSD2_1V8........................................................................................................................................ 24 5.2 Power on/off and Reset Signal................................................................................................................. 25 5.2.1 Power on/off Signal......................................................................................................................... 25 5.2.1.1 Power on................................................................................................................................25 5.2.1.2 Power off................................................................................................................................25 5.2.1.3 Recommended Circuit Design of Power on/off signals................................................. 26 5.2.2 RESET Signal.................................................................................................................................. 27 5.3 Index Signal................................................................................................................................................. 28 5.3.1 Index Signal Pins.............................................................................................................................28 5.4 USB Interface...............................................................................................................................................28 5.4.1 Definition of USB Interface.............................................................................................................28 5.4.2 Application for USB Interface........................................................................................................ 29 5.5 USIM Interface.............................................................................................................................................29 L831-EA Module Hardware User Manual Page 7 of 43 5.5.1 USIM Pins......................................................................................................................................... 30 5.5.2 Description of USIM........................................................................................................................ 30 5.5.2.1 Normally ClosedSIM Circuit Design............................................................................ 30 5.5.2.2 Normally Open SIM Circuit Design.................................................................................31 5.5.3 USIM Design Points........................................................................................................................ 31 5.5.4 USIM Hot Plug..................................................................................................................................32 5.5.4.1 Hardware Connection..........................................................................................................32 5.5.4.2 Software Configuration........................................................................................................32 5.6 Digital Audio.................................................................................................................................................32 5.6.1 Description of I2S Interface............................................................................................................33 5.6.2 Description of PCM Interface.........................................................................................................33 5.7 Android/Win8Dual System Switch Control Interface.............................................................................34 5.8 W_DISABLE# Interface............................................................................................................................. 34 5.8.1 Description of WWAN_DISABLE# Interface...............................................................................34 5.8.2 Description of GPS_DISABLE# Interface................................................................................... 35 5.9 TX_BLANKING Interface...........................................................................................................................35 5.10 The WAKEUP_HOST Interface..............................................................................................................35 5.11 BODY_SAR Interface...............................................................................................................................36 5.12 Description of I2C Interface.................................................................................................................... 36 5.13 Clock Interface.......................................................................................................................................... 36 5.14 Config Interface.........................................................................................................................................36 5.15 RF Interface............................................................................................................................................... 37 5.15.1 Description of RF Connector.......................................................................................................37 5.15.2 Description of RF Connecting Seat............................................................................................37 5.15.3 Main Performance of RF Connector.......................................................................................... 38 5.16 Other Interfaces........................................................................................................................................ 39 6 Electrical and Environmental................................................................................................................................40 6.1 Electrical....................................................................................................................................................... 40 6.2 Environmental..............................................................................................................................................40 7 RF Interface.............................................................................................................................................................41 7.1 Operating Band........................................................................................................................................... 41 7.1.1 Antenna Band...................................................................................................................................41 7.2 RF PCB Design........................................................................................................................................... 41 7.2.1 Routing Principle..............................................................................................................................41 L831-EA Module Hardware User Manual Page 8 of 43 7.2.2 Impedance Design...........................................................................................................................42 7.3 Antenna Design...........................................................................................................................................42 7.3.1 Antenna Design Requirements..................................................................................................... 42 L831-EA Module Hardware User Manual Page 9 of 43 1 Preface 1.1 Outline The document outlines the electrical, RF performance, mechanical size and application environment of L831-EA wireless module. Under the help of the document and others application notice, the application developer could understand quickly the performance of L831-EA series wireless module, and developing the product. 1.2 Standards The products `reference design standard as listed below:
3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE) 3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) 3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS) 3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile radio interface 3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol 3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services 3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell reselection in connected mode 3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;
Stage 2 3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2 3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information 3GPP TS 21.111 -v6.3.0: USIM and IC card requirements 3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path 3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity Module - Mobile Equipment (SIM-ME) interface 3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance specification 3GPP TS 22.004 -v6.0.0: General on supplementary services L831-EA Module Hardware User Manual Page 10 of 43 3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2 3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;
3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD) 3GPP TS 36.101 V9.18.0: User Equipment (UE) radio transmission and reception 3GPP TS 36.104 V9.13.0: Base Station (BS) radio transmission and reception 3GPP TS 36.106 V9.4.0: FDD Repeater radio transmission and reception 3GPP TS 36.113 V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC) 3GPP TS 36.124 V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 36.133 V9.18.0: Requirements for support of radio resource management 3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the FDD UE 3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 34.122 V5.7.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD) 3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+);Radio transmission and reception L831-EA Module Hardware User Manual Page 11 of 43 2 Introduction 2.1 Description L831-EA modules are highly integrated LTE M.2 wireless communication modules, supports 3 module 12 band and the global main 4G/3G/2G modes (LTE FDD/WCDMA/GSM) These bands support the mobile operators `cellular network of the Europe & Asia-Pacific and American marketing. 2.2 Specifications Specifications L831-EA LTE FDD: Band 1,2,3,4,5,7,8,13,17,18,19,20 WCDMA HSPA+: Band 1,2,4,5,8 GSM/GPRS/EDGE: 850/900/1800/1900MHz LTE FDD Category 4 (150Mbps DL,50Mbps UL) UMTS/HSDPA/HSUPA 3GPP Rel.8 DC-HSDPA 42Mbps(Cat24)/42Mbps(Cat20) HSUPA 11.5Mbps(Cat7) GSM 3GPP release 7 EDGE (E-GPRS) multi-slot class 33(296kbps DL 236.8kbps UL) GPRS multi-slot class 33 (107kbps DL85.6kbps UL) Dimension : 32mm x 42mm x 2.3 mm Interface : M.2 Weight : 5.9 grams Operating Temperature: -30 ~ +55 Storage Temperature: -40 ~ +85 Bands Data Physical Environment Performance Operating Voltage Voltage3.135V ~ 4.4V Normal3.3V Operating Current
(Typical Value) 5.5mA (Sleep Mode) 3G Idle16mA LTE FDD Idle: 17mA LTE FDD DATA700mA WCDMA Talk580mA L831-EA Module Hardware User Manual Page 12 of 43 Interfaces RF Interface 2G Talk300mA (GSM PCL5) Antenna : Mainx1Diversityx1 1 x USB 2.0Multiple Profiles over USB Function Interface SIM SupportI2C SupportI2S/PCM Support GPIOClock Data Features Protocol Stack EDGE GPRS CSD USSD SMS Embedded TCP/IP and UDP/IP protocol stack Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~9 Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~4 UMTS(14.4kbps)GSM(9.6kbps) Support MO / MT Text and PDU modes Cell broadcast Digital Audio Audio Voice coders :EFR/HR/FR/AMR Audio Control Character Set AT commands VoLTE (not support yet Gain control IRAGSMUCS2HEX FIBOCOM proprietary AT commands GSM 07.05 GSM 07.07 Firmware Loader Tool over USB Accessories User Manual Developer Kit L831-EA Module Hardware User Manual Page 13 of 43 Note:
1. Please make sure the temperature for device will not be higher than 55C. 2. The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. 3. Assessment of compliance of the product with the requirements relating to the Radio and Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by PHOENIX TESTLAB (Notified Body No.0700), L831-EA Module Hardware User Manual Page 14 of 43 2.3 Appearance The following pictures show the L831-EA wireless module. Top view:
Bottom view:
Figure 2- 1 Top View Figure 2- 2 Bottom View L831-EA Module Hardware User Manual Page 15 of 43 3 Mechanical 3.1 Dimension Figure3- 1Dimension Diagram L831-EA Module Hardware User Manual Page 16 of 43 3.2 Application Interface Description L831-EA module uses 75-pin gold fingers as the external interface, the size of the module please refer to the section3.1. As shown in Figure 4-2, L831-EA module uses the 75-pin fingers interface (67pin is the signal interface and Pin8 is notch). About the naming rules of M.2, L831-EA adopts the Type 3042-S3-B (30mmx42mm,the maximum thickness of element layer of Top surface is 1.5mm, the thickness of PCB is 0.8mm, Key ID is B). L831-EA Module Hardware User Manual Page 17 of 43 3.3 M.2 Connector Recommend to use the M.2 connector from LOTES, the type is APCI0026-P001A,the package of connector design please refer to the relevant specifications. As shown in Figure 3-2:
Figure 3-2 Size of APCI0026-P001A M.2 connector L831-EA Module Hardware User Manual Page 18 of 43 4 Hardware Overview 4.1 Pins Definition 4.1.1 Pins Number 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 10 8 6 4 2
+3.3V
+3.3V
+3.3V CLK32K SIM_DETECT NC NC NC NC NC NC NC NC TX_BLANKING SYSCLK GNSS_IRQ GNSS_SDA GNSS_SCL NC UIM_PWR UIM_DATA UIM_CLK UIM_RESET I2S_WA W_DISABLE2#
I2S_RX I2S_TX I2S_CLK Notch Notch Notch Notch LED1#(3.3V) W_DISABLE1#(3.3V) FUL_CARD_POWER_OFF#(1.8V)
+3.3V
+3.3V CONFIG_2 GND GND CONFIG_1 RESET#
ANTCTL3 ANTCTL2 ANTCTL1 ANTCTL0 GND NC NC GND NC NC GND NC NC GND SSIC-TXP/USB3.0-TX+(NC) SSIC-TXN/USB3.0-TX-(NC) GND SSIC-RXP/USB3.0-RX+(NC) SSIC-RXN/USB3.0-RX-(NC) GND DPR WOWWAN#
CONFIG_0 Notch Notch Notch Notch GND USB D-
USB D+
GND GND 75 73 71 69 67 65 63 61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 11 9 7 5 3 L831-EA Module Hardware User Manual Page 19 of 43 Figure4- 2 Pins Definition (Top View) CONFIG_3 1 4.1.2 Pins Description The description of L831-EA pins as listed below:
Pin#
Name I/O Reset Value Idle Value Description CONFIG_3 O L L
+3.3V GND
+3.3V GND PI PI FUL_CARD_POWER_OFF#
I PU PU USB D+
I/O W_DISABLE1#
I PU PU I/O O OD OD USB D-
LED1#
GND Notch Notch Notch Notch Notch Notch Notch Notch I2S_CLK CONFIG_0 O O T NC T NC The internal connects with GND, the interface type of L831-EA module is WWAN-SSIC0. The main power input, the voltage range is: 3.135V ~ 4.4V GND The main power input, the voltage range is: 3.135V ~ 4.4V GND Off control signalthe internal 200K ohm will be pulled down, CMOS 1.8V USB 2.0 signal+
WWAN Disable, Low active, CMOS 3.3V USB 2.0 signal-
System status LEDdrain output, low level is available, CMOS 3.3V GND Notch Notch Notch Notch Notch Notch Notch Notch I2S serial clockCMOS 1.8V NCthe interface type of L831-EA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 L831-EA Module Hardware User Manual Page 20 of 43 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 I2S_RX WOWWAN#
I2S_TX DPR W_DISABLE2#
GND I2S_WA SSIC-RXN/USB3.0-RX-(NC) UIM_RESET SSIC-RXP/USB3.0-RX+(NC) UIM_CLK GND O O I I I T T PU PU T T PU PU O T T O I/O O PP PP PP PP UIM_DATA I/O PU PU SSIC-TXN/USB3.0-TX-(NC) UIM_PWR O SSIC-TXP/USB3.0-TX+(NC) NC GND GNSS_SCL O PU PU NC GNSS_SDA I/O PU PU module is WWAN-SSIC0 I2Sserial data output, CMOS 1.8V The module wake up the Host device signallow level is availableCMOS 1.8V. I2Sserial data input, CMOS 1.8V Body SAR DetectCMOS 1.8V GPS Disable signal, low level is available, CMOS 1.8V (not support yet). GND I2S left/right channel clock signal, CMOS 1.8V NC Reset signal of USIM card. NC Clock signal of USIM card. GND Data signal of USIM card. the internal 4.7K resistance will be pulled up. NC Power output of SIM card, 1.8V/3.0V NC NC GND I2C serial data signal clock, the internal 4.7K resistance will be pulled up, CMOS 1.8V. NC I2C serial data signal data, the internal 4.7K resistance will be pulled up, CMOS 1.8V L831-EA Module Hardware User Manual Page 21 of 43 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 NC GNSS_IRQ I PU PU GND SYSCLK NC TX_BLANKING O O L L NC NC GND NC NC NC NC NC GND NC ANTCTL0 O NC ANTCTL1 O L NC ANTCTL2 O L L L L L NC ANTCTL3 SIM_DETECT O I PU PU NC The switch interrupt signal of Win8/Android system. GND 26MHz clock output. NC GSM TDMA Timer output signal, the GPS control signal, CMOS 1.8V NC NC GND NC NC NC NC NC GND NC Tunable antenna control signal GPO,CMOS 1.8V (not support yet) NC Tunable antenna control signal, MIPI RFFE SDATA, CMOS 1.8V (not support yet) NC Tunable antenna control signal, MIPI RFFE SCLK, CMOS 1.8V (not support yet) NC Tunable antenna control signal, MIPI RFFE VIO, CMOS 1.8V (not support yet) SIM DetectCMOS 1.8V,390K ohm L831-EA Module Hardware User Manual Page 22 of 43 67 68 69 70 71 72 73 74 75 RESET#
CLK32K CONFIG_1
+3.3V GND
+3.3V GND
+3.3V PU PU L L I O O PI PI PI CONFIG_2 O L L will be pulled up. External reset signal input, CMOS 1.8V 32KHz clock output. The internal connects with GND, the interface type of L831-EA module is WWAN-SSIC0. The main power input, the voltage range is : 3.135V ~ 4.4V GND The main power input, the voltage range is : 3.135V ~ 4.4V GND The main power input, the voltage range is : 3.135V ~ 4.4V The internal connects with GND, the interface type of L831-EA module is WWAN-SSIC0. Note :put the pins not used in circuit design NC directly. PIPower Input HHigh Voltage Level LLow Voltage Level PDPull-Down PUPull-Up TTristate ODOpen Drain PPPush-Pull L831-EA Module Hardware User Manual Page 23 of 43 5 Hardware Interface 5.1 Power Interface 5.1.1 Power Supply L831-EA module requires a 3.135V~ 4.4V DC power supply to provide the maximum GSM emission current with 2A. Input power supply requirements as listed below:
Parameters Minimum Recommended Maximum
+3.3V 3.135 3.3 4.4 Unit V Note:
1. The ripple of Power supply must be lower than 200mV. 2. The minimum value of power supply voltage drops shall more than 3.135V. The filter capacitor design of the supply circuit is as follows:
Recommended capacitor Application Description 330uF Supply capacitor 1uF,100nF Digital signal noise 39pF,33pF 700/850/900 MHz band Reduce power wave in call. The value of capacitor is bigger better. Filtering interference from clock and digital signal. Filtering the RF reference. 18pF,8.2pF,6.8pF 5.1.2 VSD2_1V8 1700/1800/1900,2100,2500/2600MHz band Filtering the RF reference. VSD2_1V8 is the digital part circle`s` power supply within the module, VSD2_1V8 can use for the index signal and the reference level. With the circle design only use for external low current application
<50mA, and floating it if not use. Parameters VSD2_1V8 Minimum 1.7135 VIH VIL 0.7* VSD2_1V8
-0.3 Recommended Maximum Unit 1.8 1.8 0 1.8865 1.8865 0.3* VSD2_1V8 V V V L831-EA Module Hardware User Manual Page 24 of 43 5.2 Power on/off and Reset Signal L831-EA wireless module supports 2 control signals for the modules` power on/off and the reset operation. The definition of the pins as listed below:
Pin#
6 Pin Name FUL_CARD_POWER_OFF#
Electrical Level Description CMOS 1.8V Power on/off signal RESET#
67 5.2.1 Power on/off Signal 5.2.1.1 Power on CMOS 1.8V External reset signal input. Clients can pull up the FUL_CARD_POWER_OFF# signal while the module is power on, then the module will turn on. The Pulse Timing requirements as listed below:
Parameters Condition Maximum Minimum Typical Unit Pulse Width Power on 20 100 ms The Figure5- 1 shows the power_on timing control:
Figure5- 1 Power_on Timing Control 5.2.1.2 Power off L831-EA module supports two powers off modes. Through the software modes to turn off the module in general condition. If the system halted or happen exceptions, use the following hardware modes to turn L831-EA Module Hardware User Manual Page 25 of 43 off it, pull down the FUL_CARD_POWER_OFF# or floating. For details as listed below:
Off modes Methods Software Send AT+CPWROFF commands. Hardware Pull down the FUL_CARD_POWER_OFF#
or floating. Condition Normal power_off Only used for system halted or happens exceptions and the software modes can not be used. The description of hardware power_off as follows ( Pull down the FUL_CARD_POWER_OFF# or floating ):
While pulling down the FUL_CARD_POWER_OFF# signals or floating, the modules` PMU (Power Management Unit) will be reset, then the module will get into off modes from working modes. Note : the RESET_N signal must be pulled down before pulling down the FUL_CARD_POWER_OFF#
signal, and then the module will be turned off safely. The Pulse Timing requirements as listed below:
Parameters Pulse Width The Figure 5- 2 shows the power off timing control:
Condition Power off Minimum 5 Typical 100 Unit ms Maximum Figure5- 2 Power off Timing Control 5.2.1.3 Recommended Circuit Design of Power on/off signals The recommended design of FUL_CARD_POWER_OFF# signal as follows:
L831-EA Module Hardware User Manual Page 26 of 43 Figure 5- 3 the recommended design of FUL_CARD_POWER_OFF# signal 5.2.2 RESET Signal L831-EA wireless module supports external reset function. The module can back to initial state through Reset _N signal. While the RESET# signal is active low and keep 100ms, the module will reset and restart. The internal PMU cannot power cut while the clients execute the RESET function. Note: Reset signal is sensitive signal line , while PCB layout, please keep it away from RF interference, add the surrounding processing and recommend to decouple capacitor near the module. Dont layout the Reset signal in PCB edge or surface to avoid ESD causing system reset. The requirements of Pulse Timing as listed below:
Parameters Condition Minimum Typical Maximum Pulse Width Reset 7 100 1000 Unit ms The recommended design as follows:
Figure5- 4 Recommended design of RESET# circuit L831-EA Module Hardware User Manual Page 27 of 43 5.3 Index Signal 5.3.1 Index Signal Pins L831-EA module used for providing drain output signal and indicate RF condition:
Pin #
10 Name LED1#
Description Close or open the condition indication of RF network, CMOS 3.3V The condition description of LED1# signal as listed below :
No. Condition LED1#
1 2 RF open RF closed Low level High level The recommended design as follows:
Figure5- 5 Recommended design of LED condition index 5.4 USB Interface 5.4.1 Definition of USB Interface Pin No Pin Name 7 8 USB_DP USB_DM I/O I/O I/O Description USB signal+
USB signal-
L831-EA wireless module supports USB 2.0. It should be installed USB driver before using on PC. While L831-EA wireless module plugged into the PC, the USB interface with the drive can map 3 COM ports and 4 NCM ports at PC end of Windows system, and for details as listed below:
Two COM ports for sending AT Commands. One COM port for tracing LOG information. Four NCM ports are VLAN ports, mainly used for initiating data services . Note: The COM port can used as Modem COM port and initiate data services. But cause of the speed of L831-EA Module Hardware User Manual Page 28 of 43 Modem COM port is so slow, and cannot up to 100Mbpss, the uplink requirements of LTE. So it is not suggested. The Modem COM can be used to initiate data services temporarily only while the client`s NCM port is useless. 5.4.2 Application for USB Interface The recommended circuit design as follows:
Figure5- 6 Recommended circuit design of USB interface T101 and T102 shall choose the TVS pipes witch less than 1pF. VUSB supply power has connected within the module, so the VBUS pin of Host end can float. USB_D+ and USB_D- is high speed differential signal line , the highest transmit speed is up to480Mbps. Not the following requirements while PCB Layout:
USB_DP+ and USB_D- signal lines request with the same length, parallel, and try to avoid right angle routing. Around the USB_DP +and USB_D- signal lines should be packaged with GND. Put the USB2.0 differential signal lines in the signal layer while are nearest to the ground. USB signal lines shall far away from strong interference signals, like power supply. Do the impedance matching, the impedance requests 90 ohm. 5.5 USIM Interface L831-EA wireless module supports USIM and high speed SIM card, and does not supports 8-wire smart USIM yet. L831-EA Module Hardware User Manual Page 29 of 43 5.5.1 USIM Pins Pin#
Name Type Description 36 30 32 34 66 UIM_PWR UIM_RESET UIM_CLK O O O USIM power supply signal USIM Reset signal USIM clock signal UIM_DATA I/O USIM data signal SIM_DETECT I The detection signal for SIM insetting The default is 390K ohm resistance pulled up and input. High level: SIM is present. Low level: SIM is absent 5.5.2 Description of USIM 5.5.2.1 Normally ClosedSIM Circuit Design Referenced Circuit Design:
Figure5- 7 Reference Design of Normally Closed SIM Card Interface Normally closed SIM Connector:
1Pull out SIM card, pin 7 and pin 8 short-circuit . 2Insert SIM card, pin 7 and pin 8 disconnect. L831-EA Module Hardware User Manual Page 30 of 43 5.5.2.2 Normally Open SIM Circuit Design Referenced Circuit Design:
Figure5- 8 Reference Design of Normally open SIM Card Interface Normally Open SIM Connector:
1Pull out SIM card, pin 7 and pin 8 disconnect. 2Inset SIM card, pin 7 and pin 8 short-circuit . Note:
For improving EMC performance, SIM card connector should be closed to the module. For improving the anti-jamming capability of SIM card, please choose the SIM card socket with masking function. Filtering capacitor on SIM card should be closed to SIM card pin. SIM card signal need add ESD protection (just like TVS pipe), ESD components should be closed to SIM card pin. SIM_CD signal connection supports hot plug, default high level is available (switch to low level is available through AT commands). If high level is detected, it means the SIM card is inserted. 5.5.3 USIM Design Points The design of SIM interface is very important to its own normal working and the module. There are several design guidelines that must be followed:
The layout and routing of SIM card should be away from EMI interference source , such as RF antenna and digital switching signals. To ensure signal integrity, the routing length between module and SIM card should not exceed 100mm. To avoid mutual interference, the routing of UIM_CLK and UIM_DATA signal shall keep separate. L831-EA Module Hardware User Manual Page 31 of 43 The signal lines of SIM cards shall do some ESD protection , and it request to choose the ESD protected components with low capacitance, such as Zener diode. Recommend the clients to use the ESD components and the equivalent capacitance shall be less than 33pF. ESD components shall near to SIM card interfaces while layout. 5.5.4 USIM Hot Plug L831-EA module supports the status detection function, and this function can realize hot plug of SIM card . 5.5.4.1 Hardware Connection The hot plug function of SIM card needs the cooperation of SIM_DETECT signal. SIM_DETECT is low level while no SIM card; SIM_DETECT is high level while installing SIM card. Principle description:
1 For normally closed SIM card, as shown in Figure 5-7.SIM_DETECT signal connects Pin8 (SW2) of U2, pull down the Pin7 (SW1) to GND. SW2 and SW1 short-circuit while SIM card is not inserted, so SW2 is low level. SW1 and SW2 disconnect while SIM card installed, SIM_DETECT is pulled high. 2 For normally openSIM card, as shown in Figure 5-8. SIM_DETECT signal connects Pin8 (SW2) of U2 and pull down to ground through 47Kohm resistance. Pin 7 (SW1) shall be pulled up with4.7Kohms. SW2 and SW1 is disconnected while SIM card is not inserted, so SW2 is low level. SW1 and SW2 is short-circuiting while SIM card installed, SIM_DETECT is pulled high. 5.5.4.2 Software Configuration
+MSMPD is used for setting the state detection of SIM card. AT+MSMPD=0, state detection function of SIM card is closed. The module does not detect the SIM_DETECT signal. AT+MSMPD=1, state detection function of SIM card is open. Detect the SIM card if installing or not through the SIM_DETECT Pin . SIM_DETECT is high level, SIM card is installed, and the module registers the network automatically. SIM_DETECT is low level, SIM card is not inserted, and the module does not register the network. Note: The parameters of +MSMPD is 1 by default. SIM_DETECT is the detection signal. While the module first power on or plug after that, SIM_DETECT will detect if the SIM card is existing or not. Just only if the SIM_DETECT is low level, the module will cannot read SIM card. 5.6 Digital Audio L831-EA supports digital audio I2S interface.12S interface can support normal I2S modes and data transmission of PCM modes. The level of I2S interface signal is 1.8V. L831-EA Module Hardware User Manual Page 32 of 43 The description of I2S signal as listed below:
Pin#
Name Type 20 28 22 24 I2S2_CLK I2S2_WA0 I2S2_TX I2S2_RX O O O I Description Bit clock Left- right clock (LRCK) Serial data output Serial data input 5.6.1 Description of I2S Interface L831-EA I2S_CLK I2S_WA I2S_RX I2S_TX Note:
Signal Direction Audio CODEC I2S Port I2S_CLK I2S_LRCK I2S_SDOUT I2S_SDIN I2S interfaces can be configured to master or slave modes . It supports various audio sample rates (48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz, 11.025KHz, 8KHz). 5.6.2 Description of PCM Interface L831-EA Signal Direction Audio CODEC PCM Port I2S_CLK0(PCM_CLK PCM clock signal) PCM_CLK (PCM clock signal) I2S_WA0(PCM_SYNCPCM frame synchronization signal) I2S_RX(PCM_DINPCM data input) PCM_SYNC (PCM frame synchronization signal ) PCM_DOUT (PCM data output) I2S_TX(PCM_DOUTPCM data output) PCM_DIN (PCM data input) Description:
PCM interfaces can be configured to master or slave modes. Supports short frame synchronization under16 bit, 32bit, 48bit and 64bit modes. Supports sending data in burst modes and continuous modes. Supports clock length of frame synchronization signal and rising edge/ falling edge trigger L831-EA Module Hardware User Manual Page 33 of 43 configuration of data transmission. Supports various audio sample rates (48KHz,44.1KHz,32KHz, 24KHz,22.5KHz,16KHz,12KHz,8KHz, 11.025KHz). Note: Cause the timing of I2S modes is easier than PCM modes and easier to fit, recommend clients to use transmission audio of I2S mode. While transmission with PCM modes, the PCM timing sequence is difficult to fit to make the tone quality become bad. 5.7 Android/Win8Dual System Switch Control Interface L831-EA module supports Win8/Android dual system switch, check and achieve the dual system switch through interrupt signal GNSS_IRQ. I/O Pin#
Description Name 44 GNSS_IRQ I Win8/Android dual system switch detection signal, CMOS 1.8V The function definition of GNSS_IRQ signal as listed below:
No. GNSS_IRQ Function 1 2 High/Floating Support Win8 system, the module`s USB ports shall set as MBIM modes. Low Support Android system, the module`s `USB ports shall set as 3ACM modes. Description:
1. Check and achieve the Win8/Android system switch through GNSS_IRQ level when the module power on. Keep the GNSS_IRQ level stability during booting. 2. Check and achieve the Win8/Android system switch through GNSS_IRQ rising edge/ falling edge while the module power on, the de-bouncing time sets as 100ms. The module will reboot after meeting the requirements and can switch different system supports. 5.8 W_DISABLE# Interface 5.8.1 Description of WWAN_DISABLE# Interface L831-EA module provides through hardware to open/close the WWAN RF function signal, this function can also controlled by AT commands. I/O Pin#
Description Name 8 W_DISABLE1#
I WWAN open/close signal ,CMOS 3.3V The definition of W_DISABLE# signal as listed below:
L831-EA Module Hardware User Manual Page 34 of 43 No. W_DISABLE#
Function 1 2 3 Low High Floating WWAN closed WWAN opened The function of WWAN defined by AT commands , and keep open by default . 5.8.2 Description of GPS_DISABLE# Interface L831-EA module provides through hardware to open/close GPS function signal, this function can also control by AT commands. Pin# Name I/O 26 W_DISABLE 2#
I Description GPS open/close signal , and the signal with 1.8V The definition of GPS_DISABLE# signal as listed below:
No. GPS_DISABLE#
Description 1 2 3 Low High Floating GPS closed GPS open The function of GPS defined by AT commands, keeps open by default. Note: this function don`t support yet. 5.9 TX_BLANKING Interface Output low level by default, the TX_BLANKING output the pulse signal that synchronized with GSM burst timing while the module works in GSM band. Cause GSM transmitting may interfere the receiving of GPS signal, close GPS or stop the data receiving of GPS while AP detected TX_BLANKING pulse signal. Pin#
Description Name I/O 48 TX_BLANKING O External GPS control signal 5.10 The WAKEUP_HOST Interface The module supports the WAKEUP_HOST function, the pin is high level by default, but it outputs low level while awaking Host. Pin#
Name Description I/O 23 WOWWAN#
O The module wakes up Host signal with 1.8Vand low level is available. L831-EA Module Hardware User Manual Page 35 of 43 5.11 BODY_SAR Interface L831-EA module supports BODY_SAR (DPR pin) function. BODY_SAR is input signal (the signal is output directly by the AP end), with high level by default, and low level is effectively. While the human nearing, AP can detect it through the distance sensor, then output the BODY_SAR signal with low level. While the module detected the signal through the interruption, the module `s Tx power will be reduced and the threshold value can be set by the AT commands. Pin#
Description Name I/O 25 DPR I BODY_SAR detection 5.12 Description of I2C Interface L831-EA module supports one 12C interface, default configuration is I2C master. The I2C can used for driving external 12C slave device, such as Audio codes and so on. Pin#
Name 42 40 GNSS_SDA GNSS_SCL I/O I/O O Description I2C control signal input/output ,1.8V signal I2C control clock signal, 1.8V signal The signal connection between L831-EA module and external 12C slave device ( such as Audio Codec as listed below:
L831-EA GNSS_SDA Direction Audio Codec I2C Port I2C_SDA GNSS_SCL 5.13 Clock Interface L831-EA module supports one 26MHz clock output and one 32KHz clock output. I2C_SCL Pin#
Name 68 46 CLK32K SYSCLK I/O O O Description 32K clock output , 26Mclock output , (recommend used for external GPS, and can also used as audio codec`s MCLK) 5.14 Config Interface L831-EA module provides four config pins and with the configuration of WWAN-USB3.0-0. PIN#
Name I/O Description Value L831-EA Module Hardware User Manual Page 36 of 43 1 21 69 75 CONFIG_3 CONFIG_0 CONFIG_1 CONFIG_2 O O O O Connect to GND within the module NC Connect to GND within the module Connect to GND within the module 0
-
0 0 The configuration of M.2 Socket 2 Module as listed below :
Config_0
(pin21) Config_1
(pin69) Config_2
(pin75) Config_3
(pin1) Module Type and Main Host Interface Port Configuration GND GND GND GND GND GND GND N/C GND GND GND N/C SSD-SATA WWAN-PCIe WWAN-USB3.0 N/A N/A 0 5.15 RF Interface 5.15.1Description of RF Connector L831-EA module provides two RF connector for the connection of external antenna , the MAIN means the main antenna of RF, and DIV means the diversity antenna . 5.15.2Description of RF Connecting Seat Figure 5-9 RF connectors Diagram L831-EA module adopts the RF connecting seat with Murata MM4829-2702, the size is 2*2*0.6mm, and the structure diagram as follows:
L831-EA Module Hardware User Manual Page 37 of 43 Figure 5-10 Structure diagram of RF connecting seat Figure 5-11 0.81mm coaxial line Figure 5-12 RF connector insert into RF connecting seat 5.15.3Main Performance of RF Connector Rated conditions Environment condition L831-EA Module Hardware User Manual Page 38 of 43 Frequency range DC to 6GHz Temperature range :
Characteristic impedance 50 40C to +85C 5.16 Other Interfaces The following interfaces are not supported now: GPIO and Tunable ANT. L831-EA Module Hardware User Manual Page 39 of 43 6 Electrical and Environmental 6.1 Electrical This table shows the electrical features range of L831-EA module. Parameter Power supply Digital Signal Minimum Value Maximum Value Unit 0 0 4.4 1.9 6.2 Environmental This table shows the environmental features of L831-EA module Parameter Minimum Value Maximum Value Operational Temperature Storage Temperature
-30
-40
+55
+85 V V Unit C C L831-EA Module Hardware User Manual Page 40 of 43 7 RF Interface 7.1 Operating Band 7.1.1 Antenna Band Operating Band Description IMT 2100MHz PCS 1900MHz DCS 1800MHz Band 1 Band 2 Band 3 Band 4 Band 5 Band 7 Band 8 Mode Tx (MHz) Rx (MHz) LTE FDD/WCDMA 1920 - 1980 2110 - 2170 LTE FDD/WCDMA/GSM 1850 - 1910 1930 - 1990 LTE FDD/GSM 1710 - 1785 1805 - 1880 AWS 1700MHz LTE FDD 1710 - 1755 2110 - 2155 CLR 850MHz LTE FDD/WCDMA/GSM 824 - 849 869 - 894 IMT-E 2600Mhz LTE FDD 2500 - 2570 2620 - 2690 E-GSM 900MHz LTE FDD/WCDMA/GSM 880 - 915 925 - 960 Band 13 US 700MHz blocks C LTE FDD 777 - 787 746 - 756 Band 17 US 700MHz blocks B/C LTE FDD 704 - 716 734 - 746 Band 18 Japan 850MHz LTE FDD 815 830 860 875 Band 19 Japan Extend 850MHz LTE FDD 830 845 875 890 Band 20 EUDD 800MHz LTE FDD 832 - 862 791 - 821 7.2 RF PCB Design 7.2.1 Routing Principle L831-EA module adopts double RF antennas, the MAIN_ANT used for transmitting and receiving, the DIV_ANT used for receiving. On the one hand, diversity antenna can improve the receiving sensitivity; on the other hand, it can also improve the download speed. Because the L831-EA module belong to LTE module, the Antenna need double antennas can meet the performance requirements. L831-EA Module Hardware User Manual Page 41 of 43 7.2.2 Impedance Design The impedance of RF signal lines should be controlled within 50ohm. 7.3 Antenna Design 7.3.1 Antenna Design Requirements
(1) Antenna Efficiency Antenna efficiency is the ratio of antenna input power to radiation power. Cause the return loss, material loss, and coupling loss, the radiation power is always lower than the input power. Recommended value> 40% (4dB)
(2) S11 or VSWR S11 can indicates the 50ohm`s matched-degree of antenna .To some degree, it affects the antenna efficiency. It can measure the indicator through VSWR test, recommended value: S11 < 10 dB.
(3) Polarization The antenna`s polarization means the rotate direction of electric field in the direction of the maximum radiation. Recommend to use linear polarization: it would be better if the polarization direction of diversity antenna is different from main antenna.
(4) Radiation Pattern Radiation pattern is the antenna`s electromagnetic-field strength in all directions of far field .Half-wave dipole antenna is the most suitable terminal antenna. If it is built-in antenna, PIFA antenna is recommended:
Antenna area (H x W x L): 6mm x 10mm x 100mm. PIFA or IFA antenna is recommended. Radiation Pattern: Omni-directional.
(5) Gain and Direction The direction of the antenna is the electromagnetic field strength of the electromagnetic wave in all directions. The gain is a collection of antenna efficiency and the direction of antenna. Recommended antenna gain 3dBi
(6) Interference Besides the antenna`s performance, the other interference on the PCB board can also affect the module`s performance. To ensure the module`s high performance, we must have a good control to the interference. Suggestions: such as the routing of Speak, LCD, CPU and FPC, the audio circuits and the power part shall try to keep away from the antenna. At the same time, note the corresponding isolation and shielding, L831-EA Module Hardware User Manual Page 42 of 43 or do some filtering on the routing. 7TRP/TIS TRP (Total Radiated Power) GSM850/900>28dBm GSM DCS1800/PCS1900 >25dBm WCDMA Band 1,2,4,5,8>19dBm LTE FDD Band 1,2,3,5,7,8,13,17,18,19,20 >19dBm TIS (Total Isotropic Sensitivity) GSM850,GSM 900,DCS1800,PCS1900 <-102dBm WCDMA Band1,2,4,5,8<-102dBm LTE FDD Band1,2,3,5,7,8,13,17,18,19,20 <-95dBm (10MHz band width) L831-EA Module Hardware User Manual Page 43 of 43