FCC ID: ZMOH330 UMTS/HSPA + MODULE

H330 HSPA+ Module Hardware User Manual Version: V1.0.0 Date: 2012-05-29 Confiden ntial Mat terial ment contains Fibocom off g efforts that ts specifical hange. Disc s information fers this info use the pro ly provided closure of th n highly con ormation as a oducts desig to Fibocom is informatio nfidential to S a service to gned by Fibo by the custo on to other p Shenzhen G its custome ocom. The in omers. All sp parties is pro G&T Industria ers, to suppo nformation p pecifications ohibited with al Developm ort applicatio provided is b s supplied h hout the writt ment Co., Ltd d on and based upon erein are ten consent ht This docum

(Fibocom). engineering requirement subject to c of G&T. Copyrig Transmittal, contents an be held liab or design pa Copyright Revision nation and/o of to others ges. All righ or editing of t without exp hts created b this docume ress authori by patent gra ent as well a zation are p ant or regist s utilization prohibited. O ration of a u Offenders wil ll utility model of its G&T Industr rial Developm ment Co., Lt td. All rights s reserved.

, reproductio nd communic le for payme atent are res 1999-2010 on, dissemin cation thereo ent of dama served. Shenzhen G n History y Ve V1 rsion 1.0.0 Date 2012-05-29 9 Initial Rema arks Tradema arks Not ice OM Logo is mes or Logos 1999-2012 registered b s are the pro Shenzhen G by Shenzhen operty of the G&T Industr n G&T Indus eir respectiv rial Developm strial Develo e owners. ment Co., Lt td. All rights s reserved. opment Co., Ltd. All othe er product o r The FIBOC service nam Copyright H330 HSPA+

Module Hard ware User Ma anual Page 2 of 44 2 4.1 4.2 1 Preface e ................. S Scope ........ 1.1 S Standards .. 1.2 Introdu ction .......... P Product Des 2.1 2.2 P Product Spe P 2.3 Product App 3 Machan nical ........... Dimension . 3.1 D 3.2 R Recommend 4 Hardwa are Scope .. B Block Diagra P Pin Definitio Pin M 2.1 4.2 4.2 2.2 Pin D 5 Hardwa are Interface Power Interf P 5.1 1.1 VBAT Powe 1.2 5.1 5.1 1.3 VIO . 5.1 1.4 VRTC On/Off/Rese 5.2 O 5.2 2.1 Pin D Powe 2.2 5.2 2.3 5.2 Powe 5.2 2.4 Rese Indicator Sig 3.1 Pin D 3.2 Indica USB Interfac 4.1 USB USB 4.2

.................. ................. ................. ................. scription ..... ecification ... pearance .... ................. ................. d PCB Desig

.................. am ............. on ............... Map ............ Description .. e ................. face ........... T................. er Consump

.................. C ................ et................ Description .. er on .......... er off ........... et ................ gnal ............ Description .. ator Descrip ce .............. Pin Descrip Design ...... 5.3 5.3 5.4 U 5.4 5.4 s Contents C

................... .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. gn ............... ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. ption ............ ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. .................. ................. .................. ption ............ ................. .................. .................. ................. ption ............ .................. ................. .................. .................. ................. 5.1 5.3

.................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. ................ 5 5

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............... 30 0

............... 30 0

............... 30 0 H330 HSPA+

Module Hard ware User Ma anual Page 3 of 44 5.7 UART ......... 5.5 U 5.1 UART 5.5 5.2 UART 5.5 USIM ......... 5.6 U 6.1 USIM 5.6 USIM 6.2 5.6 6.3 USIM 5.6 6.4 5.6 USIM Analog Audi A 5.7 7.1 Pin D 7.2 Audio 5.7 Digital Audio 5.8 D 5.8 8.1 I2S .. 8.2 I2C .. 5.8 5.9 O Other ......... 6 Electric cal and Envi E Electrical Ch E Environmen erface ......... 7 RF Inte 7.1 O Operational 1.1 Main 7.1 1.2 7.1 Diver 7.2 R RF PCB De Layo 2.1 7.2 7.2 2.2 Impe A Antenna De 3.1 Main 7.3 7.3 3.2 Diver

.................. T Interface . T Design .... ................. M Interface .. M Design ..... M Design No M Hot Plug .. io ............... Description .. o Descriptio o ................ ................. ................. ................. ronmental .. haracteristic ntal Characte

.................. Band ........ Antenna .... rsity ............ sign ........... ut Guideline dance ........ esign ........... Antenna De rsity antenna

................... .................. .................. .................. .................. .................. otice ............ .................. .................. .................. n ................. .................. .................. .................. .................. .................. c .................. eristic .......... .................. .................. .................. .................. .................. e .................. .................. .................. esign Requi a design ..... .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. rement ....... .................. 6.1 6.2 7.3

.................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .............. 31 1

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............... 43 3 H330 HSPA+

Module Hard ware User Ma anual Page 4 of 44 1 Prefa 1.1 Sco ace ope This manua the H330 H This manua availability o and softwar 1.2 Stan al provides th SPA+ modu al gives a co of any featur re version of ndards TS 27.007 3GPP T TS 27.005 3GPP T DCE) interfac

(DTE-D TS 23.040 3GPP T TS 24.011 3GPP T nterface radio in TS 27.010 3GPP T TS 27.060 3GPP T TS 25.30 3GPP ction in conn reselec 3GPP T TS 25.308 2 Stage 2 3GPP T TS 25.309 TS 23.038 3GPP T 3GPP T TS 21.111 TS 31.111 3GPP T TS 45.002 3GPP T 3GPP T TS 51.014 e - Mobile E Module 3GPP T TS 51.010 cation specific TS 22.004 3GPP T 3GPP T TS 23.090 TS 24.008 3GPP T he electrical ule in a host mplete set o re or functio f a specific H

, mechanica al and enviro application. features an of hardware n, which is d described in

+ module. H330 HAPA+

onmental re quirements for properly y integrating nd functions this manua that may be l, depends o e provided b on the hardw y H330. The e ware revision n

-v6.9.0: AT

-v6.0.1: Us ce for Short

-v6.9.0: Tec

-v6.1.0: Po command s e of Data Te Message S chnical reali int- to - Poin set for User erminal Equ Service (SMS zation of Sh nt (PP) Shor Equipment ipment -Dat S) and Cell B hort Messag rt Message S

(UE) a Circuit ter Broadcast S e Service (S Service (SM minating Eq Service (CBS SMS) MS) support o quipment S) on mobile

-v6.0.0: Ter rminal Equip cket domain

-v6.0.0: Pa 04-v6.10.0: U User Equipm e nected mode gh Speed Do

-v6.4.0: Hig pment to Us n; Mobile Sta ment (UE) pr er Equipme ation (MS) s rocedures in nt (TE-UE) m upporting P n idle mode multiplexer p acket Switch and proced protocol hed services s ures for cell ownlink Pac cket Access

(HSDPA); O Overall desc ription;

2 ption; Stage ormation

-v6.6.0: FD

-v6.1.0: Alp

-v6.3.0: US

-v6.11.0 "US

-v6.12.0: M

-v4.5.0: Sp Equipment (

-1 -v6.7.0:

DD enhanced phabets and IM and IC c SIM Applica Multiplexing a ecification o

(SIM-ME) in Mobile Stati d uplink; Ov language -

card requirem ation Toolkit and multip of the SIM A terface ion (MS) con erall descrip specific info ments

(USAT)"

le access on pplication To n the radio p oolkit for the path e Subscriber r Identity nformance s specification n; Part 1: Co onformance

-v6.0.0: Ge

-v6.1.0: Un v6.19, Mob eneral on su nstructured S bile radio inte pplementary Supplementa erface Laye y services ary Service r 3 specifica Data (USSD ation;

D); Stage 2 H330 HSPA+

Module Hard ware User Ma anual Page 5 of 44 2 Intro 2.1 Prod n oduction scription duct Des n H330 is a h GSM/GPRS 850/900/190 2.2 Prod 3G WCDMA igh integrity M850/900/D S/EDGE GS z. 00/2100MHz duct Spe ecificatio on A wireless m DCS1800/PC module, LGA CS1900MHz A package, 1 z and UMTS 120 pin. It ca S/HSDPA/HS an support SUPA/HSPA A+

Product F Features Supporte ed Bands 4 Band U UMTS/HSPA A (WCDMA/

/FDD) 850/900 0/1900/2100 0 MHz 4 Band G GSM 850/900 0/1800/1900 0 MHz Data UMTS/H SDPA/HSU PA 3GPP re elease 7 HSUPA 5 5.76Mbps (C Cat 6) HSDPA 2 21Mbps (Ca at 14) GSM 3G GPP release 7 EDGE (E E-GPRS) mu ulti-slot class s 12 GPRS m multi-slot clas ss 12 Physical Size33 3.8mm x 27. 8mm Height 2.45 mm Mounting gLGA Weight

< 6 grams Environm mental Operatin g Temperat ture-30

~ +65 H330 HSPA+

Module Hard ware User Ma anual Page 6 of 44 Storage Temperatur re-40 ~

+85 Performa ance Operating g Voltage Voltage:

3.6 ~ 4.2V Current C Consumptio on(Typical) 2mA (Sle eep Mode) 3G Idle:

35mA 3G Talk:

500mA 2G Talk:

260mA (GS SM PCL5) Tx Power r(Typical) UMTS/H SPA Class3 3 (24dBm) GSM 850 0/900 MHz C Class4 (33d dBm) GSM 180 00/1900 MH Hz Class1 (3 30dBm) EDGE 85 50/900 MHz z Class E2 (2 27dBm) EDGE 18 800/1900 M Hz Class E2 2 (26dBm) Rx Sensit tivity(Typic cal) UMTS/H SPA-109d dBm GSM-1 107dBm Interface Connecto ors RF Throu ugh Pads in LGA, 2 x m mini-UFL in P PCIe model Main Ant tenna Diversity y Antenna Connectiv vity 1*USB 2

.0 2*UART H330 HSPA+

Module Hard ware User Ma anual Page 7 of 44 MUX Ov er UART1 Multiple Profiles ove r USB SPI Supp port I2C Supp port I2S Supp port Data Feat tures Embedde ed TCP/IP a and UDP/IP protocol sta ack HSPA+

EDGE GPRS Max uplin nk 5.76Mbp s Max dow wnlink 21Mbp ps Multi-slot t class 12

(4 Down; 4 4 Up; 5 Tota al) Coding S Scheme MC CS1-MCS9 Multi-slot t class 12

(4 Down; 4 4 Up; 5 Tota al) Coding S Scheme CS1 1-CS4 CSD SMS UMTS GSM MO / MT T Text and P PDU modes Cell broa adcast Voice Fea atures Telephon ny H330 HSPA+

Module Hard ware User Ma anual Page 8 of 44 Analog a and Digital A Audio Voice co oders EFR/H HR/FR/AMR Audio Co ontrol Broad ga ain control Echo sup ppression Noise su uppression Side tone e Characte r Set IRA GSM UCS2 HEX Control/S Status Indic cations GPIOs A/D RTC AT Comm mand Set G&T pro prietary AT commands GSM 07. 05 GSM 07. 07 Accessor ries Firmware e Loader To ool over USB B/UART User Ma nual Develope er Kit Regulato ry and App provals FCC H330 HSPA+

Module Hard ware User Ma anual Page 9 of 44 RoHS CE RRB 2.3 Prod duct App pearance e H330 H Top Vie HSPA+ Modu ew ule Appeara ance is below w Bottom m View H330 HSPA+

Module Hardw ware User Ma anual Page 10 of 44 4 3 Mech 3.1 Dim hanical mension Top View Side View Bottom View w Page 11 of 44 4 H330 HSPA+

Module Hardw ware User Maanual 3.2 Rec commend d PCB De esign H330 HSPA+

Module Hardw ware User Ma anual Page 12 of 44 4 4 Hard 4.1 Bloc dware Sc ck Diagra cope am H330 HSPA+

Module Hardw ware User Ma anual Page 13 of 44 4 4.2 Pin 4.2.1 Pin Definitio n Map on 4.2.2 Pin n Descripti ion Notice: H33 30 logic elec ctrical level is escription H330 Pin de P Pin#

Pin Name s1.8V. I/O Descript tion Power 59 60 61 62 64 1 V VBAT V VBAT V VBAT V VBAT V VPA V VTRX I I I I O O H330 HSPA+

Module Hardw ware User Ma anual Power su upply Power su upply indicat tor for RF PA A Power su upply indicat tor for RF tra ansceiver Page 14 of 44 4 V VIO V VRTC P POWER_OF FF POWER_ON P N 46 47 On/off 48 49 Reset 77 R RESET_ALL L_N USIM 4 5 6 7 8 U USIM_CD U USIM_VCC U USIM_RST U USIM_CLK High Speed d SIM U USIM_D+

U USIM_D-

9 10 Audio 13 14 15 16 17 18 19 20 21 A AUXO+

A AUXO-

E EAR-

E EAR+

M MIC+

M MIC-

A AUXI-

A AUXI+

A AGND Digital po ower supply 1.8V. Real time e clock powe er ,1.71V ~

Off contro ol signal On contro ol signal External reset signal USIM ins sert detect, l ow activity USIM po ower supply USIM res set USIM clo ock O I/O I I I I O O O 1.89V No suppo ort O O O O I I I I High spe eed SIM USB B data line+

High spe eed SIM USB B data line-

No suppor rt Audio ch annel2 outp put+

Audio ch annel2 outp put -

Audio ch annel1 outp put -

Audio ch annel1 outp put +

Audio ch annel1 inpu ut +

Audio ch annel1 inpu ut -

Audio ch annel2 inpu ut -

Audio ch annel2 inpu ut +

GND Audio GN ND USIM_DATA U A I/O USIM da ata H330 HSPA+

Module Hardw ware User Ma anual Page 15 of 44 4 V VSPK I2 2S2_CLK1 I2 2S2_CLK0 I2 2S2_WA0 I2 2S2_TX I2 2S2_RX U USB_DP U USB_DM U USB_ID V VUSB U USB_TEST I2 2C_SDA I2 2C_SCL U UART1_RI UART1_DSR U R UART1_DTR U R UART1_DCD U D UART1_CTS U S UART1_RTS U S UART1_TXD U D UART1_RXD U D 22 I2S 11 24 25 26 27 USB 31 32 33 34 92 I2C 28 29 UART1 35 36 37 38 39 40 41 42 UART2 I O O O O I I/O I/O I I/O O O I O O I O O I H330 HSPA+

Module Hardw ware User Ma anual odec speake er part power r supply, con nnect to Audio co VBAT I2S2 cloc ck I2S2 cloc ck I2S2 wor rd alignment t select I2S2 tran nsmit line I2S2 rece eive line USB data a line +

USB data a line -

USB ID l ine USB pow wer supply USB TES ST line I2C data line I2C clock k line UART1 R Ring indicato or UART1 D DTE Data Se et ready UART1 D DCE Data Te erminal read dy UART1 C Carrier Dete ct UART1 C Clear to sen d UART1 R Request to s send UART1 T Transmitted Data UART1 R Received Da ata Page 16 of 44 4 45 44 ADC 50 51 EINT 56 57 UART2_TXD U D UART2_RXD U D A ADC2 A ADC1 W WAKE_UP E EINT2 USB HSIC 90 91 H HSIC_USB_ _DATA H HSIC_USB_ _STRB Antenna 67 71 Other 23 53 54 55 89 86 A ANT_MAIN A ANT_DIV D DACOUT T T_OUT0 C CLKOUT0 C CLK32K S SMI L LPG Not Conne ct 73 74 75 76 N NC N NC N NC N NC UART2 T Transmitted Data UART2 R Received Da ata Analog d digital conve rter 2No s support Analog d digital conve rter 1No s support Wake up p signal, low activity. External interrupt, low w activity. HSIC US SB data sign nalNo supp port HSIC US SB pulse sig nalNo sup pport Main ant enna port, 5 50ohm impe edance Diversity antenna po ort, 50ohm im mpedance No Supp port No suppo ort No suppo ort No suppo ort Sleep Mo ode Indicato or Module w word mode i ndicator O I I I I I I O H330 HSPA+

Module Hardw ware User Ma anual Page 17 of 44 4 105 106 107 108 78 79 80 81 82 83 84 85 87 88 94 95 96 101 GND 2 12 21 30 43 58 63 N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC N NC G GND G GND G GND G GND G GND G GND G GND H330 HSPA+

Module Hardw ware User Maanual Page 18 of 44 4 65 66 68 69 70 72 93 97 98 99 100 102 103 104 109 110 111 112 113 114 115 116 117 118 119 120 G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND G GND H330 HSPA+

Module Hardw ware User Maanual Page 19 of 44 4 5 Hard 5.1 Pow 5.1.1 VBA dware In wer Interf AT terface face power supply le to sustain y must be a n the voltage single exter e level during rnal DC volta g a GSM tra age source ansmit burst of 3.6V to 4 current serg

.2V. The pow ge, which m wer supply ay reach VBAT 3 3.6 3.8 Rec commend Max. 4.2 Unit V The H330 p must be abl 2.0A. It is requirem Paramet ment below:

M ter Min. Special care e must be ta source indir rectly supplie amplifier (PA A). Therefor transients, w will directly a The burst-m mode operat from the pow wer supply, transmissio n bursts con drop. If the v voltage drop performanc e. It is recomm mended that H330 interfa ace connect In any case

, the H330 s burst. Dropp ping below t an automati ic power-off To minimize e the losses guidelines:

Use a 1 1000 uF, or g d as near to located w impedance Use low Use ca bling and ro he H330 sup Filter th aken when d es all the dig re, any degr affect the H3 ion of the G which cause nsume the m ps are not m designing the gital and ana adation in th 330 perform SM transmis es temporar most instanta minimized, th e power sup alog interfac he power su ance. ssion and re ry voltage dr aneous curr he frequent v pply of the H ces, but also pply perform H330. The si o directly sup mance, due ngle externa pplies the R to losses, n al DC power r RF power oises or ent surges eception dra rops of the p rent, and the voltage fluct aws instanta power suppl erefore caus tuations may neous curre y level. The e the larges y degrade th st voltage he H330 the voltage tor. supply input he minimum

. and transie drops durin ng a transmit t burst will n ot exceed 3 300mV, meas sured on the e must not dr m operating l rop below th evel may re he minimum esult in a low operating le w voltage det evel during a tection, whic a transmit ch will initiate e nts on the p power supply y lines, it is r recommend ed to follow these y inputs. The e capacitor s should be greater, low the H330 in e power sou outing as sho pply lines us ESR capac terface conn urce, cabling ort as possib sing filtering citor on the H nector as po g and board ble. capacitors, H330 supply ossible. routing. as describe d in the tabl le. H330 HSPA+

Module Hardw ware User Ma anual Page 20 of 44 4 Recom Capacito mended or Usage Desc cription nt GSM Tra ansmit curre s serge Digital sw witching nois se 00 MHz GSM 1800/190 M b bands Hz GSM ba 850/900 M nds 1000uF 10nF, 10 00nF 8.2pF, 1 0pF 33pF, 39 9pF er supply los imum possi gic noises fr sses during ble value. rom clocks transmit and data Minim burst Filter sourc Filter mizes powe ts. Use max rs digital log ces. rs transmiss sion EMI. Filter rs transmiss sion EMI. 5.1.2 Pow wer Consu umption Paramet ter Des scription Conditio on T Typical I off I idle RTC C mode Idle e mode I sleep Low mo w power de DRX DRX DRX GSM850 0 PCL IGSM-RMS GS 1 T 1 R M voice -

TX slot Rx slot EGSM90 00 PCL DCS180 00 PCL 5 53uA 2 20.4 2 2.0 2 2.0 2 2.0 2 222.8 7 77.8 4 48.9 4 44.9 2 229.8 7 78.3 4 45.3 4 44.3 152.0 6 68.0 4 47.1 2 5 9 5 10 15 19 5 10 15 19 0 5 10 Unit uA mA mA mA H330 HSPA+

Module Hardw ware User Ma anual Page 21 of 44 4 PCS190 00 PCL GSM850 0 PCL EGSM90 00 PCL DCS180 00 PCL PCS190 00 PCL IGPRS-RMS S PRS Class 12 2 GP

4 T 1 R TX slot Rx slot IEGPRS-RM MS EG PRS Class 12

TX slot 4 T 1 R Rx slot GSM850 0 PCL EGSM90 00 PCL 15 0 5 10 15 5 10 15 19 5 10 15 19 0 5 10 15 0 5 10 15 8 14 19 8 14 4 45.0 150.9 6 68.6 4 47.1 4 44.6 5 565.1 2 213.6 105.4 9 91.3 5 583.4 2 217.7 105.5 9 911.0 3 353.5 167.6 9 95.3 8 86.3 3 373.7 174.4 100.4 9 91.6 4 488.7 142.4 9 90.9 5 504.7 146.9 mA mA H330 HSPA+

Module Hardw ware User Ma anual Page 22 of 44 4 DCS180 00 PCL PCS190 00 PCL GSM850 0 PCL EGSM90 00 PCL DCS180 00 PCL PCS190 00 PCL 19 2 9 15 2 9 15 5 10 15 19 5 10 15 19 0 5 10 15 0 5 10 15 9 91.2 4 498.4 104.6 9 91.0 4 496.9 113.1 9 98.4 1556.4 3 350.2 120.5 9 91.3 1595.4 3 358.8 9 90.9 9 97.9 9 952.9 2 270.6 115.1 9 92.4 9 957.2 2 278.1 110.6 9 92.4 mA IGSM-MAX Pea Dur ak current ring TX slot IWCDMA-RM MS WC CDMA Band5 (8 850) 0dBm 142.0 mA

-24dBm 135.4 24dBm 4 455.7 H330 HSPA+

Module Hardw ware User Ma anual Page 23 of 44 4 Band2 (1 1900) Band1 (2 2100) Band8 (9 900)

-50dBm 133.7 24dBm 5 512.5 0dBm 146.3

-24dBm 137.2

-50dBm 135.6 24dBm 5 564.2 0dBm 117.1

-24dBm 105.4

-50dBm 103.4 24dBm 4 431.9 0dBm 142.3

-24dBm 135.8

-50dBm 134.1 5.1.3 VIO O a regulated on. It can be er supply dig d voltage out used as a in gital signal in tput VIO. Th ndicator. nternal H330 he regulator provides a 1 1.8V output for use by 0, so it can b be used as a a reference level for ncorporates er applicatio dule to powe al. The H330 in the custome It is for mod digital signa Paramet ter M Min. VIO @ w working 1 1.773 Typ pical 1.8 Max. 1.827 7 Unit V 5.1.4 VRT TC VRTC is a p Paramet power suppl ter VRTC O Output Voltag ge Min. 1.71 y for module e RTC circu e connect to it and can b Typical o external R Max. RTC battery. U Unit H330 HSPA+

Module Hardw ware User Ma anual 1.8 1.89 V V Page 24 of 44 4 1.8 0.5 1.89 1.5 V V uA A VRTC In

(RTC is w VRTC In

(RTC is w VRTC refere nput Voltage e working) nput Current working) ence design t n is below:

Notes R8 is limited VRTC cons C9 can dete d resistor. umption cur ermine the re rrent is less eserved tim than 2uA. e. 5.2 On/O 5.2.1 Pin Off/Rese et ion n Descripti nals to on, o off ,reset mod dule. H330 has 3 Pin definitio Pin control sign on is below:

n#

Pin Na me Electr rical Level Descr iption POWE R_OFF CMOS S 1.8V Off con ntrol signal POWE R_ON CMOS S 1.8V On con ntrol signal RESET T_ALL_N CMOS S 1.8V Extern nal reset sign nal 48 49 77 H330 HSPA+

Module Hardw ware User Ma anual Page 25 of 44 4 5.2.2 Pow wer on When the H H330 will po low for a mi H330 is powe ower on aga nimum of 10 ered off, the ain when the 00 milliseco e PMU opera e POWER_O onds will tur ates at low p ON signal is rn H330 on power mode falling edge

, with only th e. Asserting he RTC time the POWER er active. R_ON signa l Par rameter Condition Min. Typi ical M Max Pul lse width 100 300 Unit ms ng is below:

Control timi d Design:

Recomman 5.2.3 Pow wer off set POWER R_OFF to low w level, H33 0 will be pow wer down. When s H330 HSPA+

Module Hardw ware User Ma anual Page 26 of 44 4 Par rameter Condition Min. Typi ical Pul lse width 100 300 M Max 3 3000 Unit ms Control timi ng is below:

Recomman d Design:

5.2.4 Res set The RESET H330 is res Important:

The reset si Its recomm ET_N signa al is low, the T_N input sig et without th gnal would b he work net H330 imme be reset the logging out. ediately. Whe en the RES ignal is very ended that y important fo it should con or the syste nnect he 33/

m. When de

/39pF capac esign it need citor to GND d be protecte D on externa ed totally. al circuit. H330 HSPA+

Module Hardw ware User Ma anual Page 27 of 44 4 Par rameter Condition Min. Typi ical Pul lse width 100 300 M Max 3 3000 Unit ms Control timi ng is below Recomman d Design 5.3 Indi 5.3.1 Pin cator Sig n Descripti gnal ion Pin#

86 89 56 1 64 P Pin Name Descrip ption L PG S MI W WAKE_UP V VTRX V VPA Work m mode indicato or Sleep M Mode Indica tor Wake u Power s transce Power s up module supply indic eiver supply indic cator for cator for RF PA H330 HSPA+

Module Hardw ware User Ma anual Page 28 of 44 4 5.3.2 Ind icator Des scription 5.3.2.1 LP PG ng state desc LPG workin State cription is be elow:

W Work mode ard NO SIM ca SIM Error Registering Register n

(always) g network etwork failur re 60 00ms High, 600ms Low w IDLE mode e Calling 75 5ms High, 3 3S Low Lo ow Data comm municating 75 5ms High, 7 75ms Low Calling Sle eep H High gh level is 1. 8V. NoticeHig 5.3.2.2 SM MI Module Mode Sleep Mode e SMI W Working mod de 2.5S H High; 100ms Low Other Mode e Low AKE_UP 5.3.2.3 WA Module Mode Sleep Idle/Call WAKE E_UP Low High Low High Workin ng Descript tion Wake u up the modu ule, from Sle eep to Idle Keep S Sleep mode Keep m mode, no aff fect Module e cannot set to Sleep mo ode H330 HSPA+

Module Hardw ware User Ma anual Page 29 of 44 4 5.3.2.4 Ot ther Pin Name Electri ical Level Descri ption RF Tra nsceiver PM It works s in Tx mode 0.65V V, when the m V it is 0V nal, it cannot t be used fo MU work ind e, when the max. power icator low power i it is about 4. it is about

.3V, other m mode They are in ndicator sign r other, it ca an be set NC C. VTRX 1.8V VPA 0-4.3V Notice:

5.4 USB 5.4.1 US B Interfac B Pin Des ce scription Pin#

Pin Na ame I/O Desc cription 31 32 33 34 92 USB_D DP USB_D DM USB_I ID VUSB USB_T TEST I/O I/O I USB signal +

USB signal -

USB ID signal USB power supp ply USB TEST signa al USB driver. et 7 port blow w:

eration ed to install B, PC will ge do data ope and. H330 can s When H330 1 p 2 p 2 p 2 p upport USB 0 connect to port is for 3G ports are for ports are for ports are res 2.0. It is nee PC by USB G Modem to r AT Comma r trace. served. 5.4.2 US B Design Reference D Design H330 HSPA+

Module Hardw ware User Ma anual Page 30 of 44 4 T101 and T VUSB is US Notice:

VUSB shou USB_DP an 102 should SB power su be low capa upply, it is 2. acitor TVS, i t is below 1 5V ~ 5.25V. pF. uld be conne nd USB_DM ect to a level M are high sp

(2.5V ~ 5.2 peed lines, it 25V) or USB t is 480 Mbp B cannot be r ps, It is PCB recognized. B Layout req he layout des Th pro otocol, with d s recommen It is po ints on the A Yo ou don t nee ue to the use Du Int terface of ve RT 5.5 UAR RT Interfa 5.5.1 UA port 2 UART H330 supp ines UART1 8 l 2 l ines UART2 UART1 and UART sign of this c differential l nded that se AP for debug ed to connec ed enclosure ersion 2.0 or circuit on the ining and im et USB_DP a g. ct the USB_V e material, th r higher. The ace T, one is 8 lin 1 support flo 2 only suppo 2 defined be nes ; the oth ow control, c ort AT elow e AP board s mpedance co and USB_D should comp ontrol to 90 o M pins as te ply with the ohm. est points an uirement be elow:

USB 2.0 hig gh speed nd then plac ce these test t VBUS when he mobile p e connection n the function hone shall o n to so called n of USB is only be conn d power USB not used. USB nected to a U B is prohibit ed. her is 2 lines an be used s to download d or AT com munication. UART1 Pin#

Pin Name e 35 36 37 UART1_R RI UART1_D DSR UART1_D DTR I/O O I O H330 HSPA+

Module Hardw ware User Ma anual Descr iption UART 1 Ring indic cator UART 1 DTE Data Set ready UART 1 DCE Data a Terminal re eady Page 31 of 44 4 38 39 40 41 42 UART1_D DCD UART1_C CTS UART1_R RTS UART1_T TXD UART1_R RXD UART2 Pin#

Pin Name e 44 45 UART2_R RXD UART2_T TXD 5.5.2 UA RT Design n O I O O I I/O I O UART 1 Carrier De etect UART 1 Clear to se end UART 1 Request to o send UART 1 Transmitte ed Data UART 1 Received Data Descr iption UART2 2 Transmitte ed Data UART2 2 Received Data H330DCE Appli EUART1 c ication MCU connect to P U(DTE) PCDTE, Signal dir

, the signal d rection direction is b H33 below:

30 Module (

(DCE) RXD TXD RTS CTS DSR DTR RI DCD UA RT1_TXD UA RT1_RXD UA RT1_CTS UA RT1_RTS UA RT1_DTR UA RT1_DSR UA RT1_RI UA RT1_DCD H330DCE EUART2 c connect to P PCDTE,

, the signal d direction is b below:

Appli ication MCU U(DTE) RXD TXD Signal dir rection H33 30 Module (

(DCE) UA RT2_TXD UA RT2_RXD H330 HSPA+

Module Hardw ware User Ma anual Page 32 of 44 4 T high level i ot suitable, n t, need care is 1.8V. need add ele e about the s ectrical level signal directi translation. ion. Notice:

H330 UART If DTE is no When use it 5.6 USIM M H330 s support USIM M ,now don t support hig gh speed SI M. 5.6.1 USI IM Interfac ce P Pin#

Pin Nam e I/O O Descrip ption 5 5 6 6 7 7 8 8 1 2 4 4 USIM_VC CC USIM_RS ST USIM_CL LK USIM_IO O GND O O O I/O O G ND USIM_CD D I 5.6.2 USI IM Design n Reference d design:

USIM po ower supply output USIM Re eset signal USIM clo ock signal USIM da ata signal USIM gr round USIM ins sert detect s signal H330 HSPA+

Module Hardw ware User Ma anual Page 33 of 44 4 Notice:

USIM_IO USIM_CD is pulled up D can suppo p internal H3 rt SIM hot p 330. plug, low is a active and S IM card is in nserted 5.6.3 USI IM Design n Notice terface and s The SIM int are several card. There equired stan meets the re he SIM shou Th so urces, such Th he SIM interf nnector and co avoid cross To rec commended su rrounding gr Th he SIM card ements (zen ele

(TD DK). We als mely importa signals desi gn is extrem delines that m must be follo design guid ndards and r regulations. ld be locate d, and its sig gnals should d digital switc as the RF a antenna and face signals length shou uld not exce meet with E d the SIM tra ay. This is to clock and da stalk betwee en the SIM c d to rout them m separately y on the app e. round plane signals sho uld be prote etc.). The rec ner diodes, e so recommen nded the ES ected from E commended SD compone ant for prope owed to ach er operation hieve a robus of H330 and st and stable d the SIM e design tha at any possibl e EMI d be routed, ching signal ed 100 mm EMC regulat ta signals (S plication boa away from ls. between the tions and im SIM_CLK an ard, and pref e H330 inter mprove signa nd SIM_DAT ferably isola rface al integrity. TA), it is ated by a ESD using ve d part no of E ent should la ery low capa ESD is AVR ayout with S acitance pro R-M1005C08 SIM hold clos otective 80MTAAB sely. H330 HSPA+

Module Hardw ware User Ma anual Page 34 of 44 4 5.6.4 USI IM Hot Plu ug H330 suppo ort SIM hot p plug. 5.6.4.1 Ha ardware De sign When SIM i In reference When no SI is removed, e design US IM card, SW USIM_CD i IM_CD conn W2 is high; In s high; inse nect U3 Pin8 nsert SIM, S rt SIM ,USIM 8SW2,P SW2 connect M_CD is low Pin7SW1 t SW1,USIM w connect M_CD is pull GND. ed down 5.6.4.2 So oftware Des sign detected fea ature will be e actives. Th e SIM card is on site or r not will be nsite and reg off site and H MSMPD par gister the ne H330 drop o rameter is 0 etwork autom out the netw 0. And also, matically. ork.

, the SIM de etected featu ure was When set AT detected wit SIM_CD=Lo SIM_CD=H Important:

disabled co 5.7 Ana 5.7.1 Pin AT+MSMPD=

th SIM_CD ow level, SIM igh or NC, S The defau rresponding alog Aud n Descripti

=1, the SIM pin. M card is on SIM card is o ult value of M gly. io ion ce supports odes, active ost applicat two channe e devices, am ion, through el audio dev mplification l h advanced p ices and op levels and s programmin erating mod speech proce ng options an des. The aud essing algor nd a versatil dio rithms are le AT audio interfac operating mo led by the h set. The H330 a interface's o fully control commands Pin#

Pin Nam me I/O Desc cription 13 14 15 16 17 18 19 20 AUXO+

AUXO-

EAR-

EAR+

MIC+

MIC-

AUXI-

AUXI+

O O O O I I I I H330 HSPA+

Module Hardw ware User Ma anual Audio o channel2 o output+

Audio o channel2 o output -

Audio o channel1 o output -

Audio o channel1 o output +

Audio o channel1 i nput +

Audio o channel1 i nput -

Audio o channel2 i nput -

Audio o channel2 i nput +

Page 35 of 44 4 Audio Audio to V o GND o codec spe BAT aker part po ower supply, connect AGND VSPK GND I 21 22 5.7.2 Aud dio Descr iption The au Spurious su In PCB performanc dio input an uppression. W B Layout, the e, the input nd output cha When conne e differential and output annels are d ect to the ha lines need e need GND I differential in andset, need equal length Isolation and nterfaces. An d external au h, parallel, a d the interfa nd have pre udio amplifie s short as p ce need add fect perform er. possible, for d ESD prote a better ection. mance at RF 5.7.2.1 Au udio Chann nel 1 Audio c Audio c Parame channel 1 in channel 1 eters terface are d MIC input ch Test con differential li haracteristic nditions ines, Can be c e use as Ha and-phone. Bias vo ltage Gain Load re esistance Audio c Parame channel 1 eters No load Programm gain:2dB mablestep ps characteris tic EAR output Test con nditions Out volt tage No load Load re esistance DC Bia s voltage 5.7.2.2 Au udio Chann nel 2 Min 1.9 0 Min Typ 2.0 2.2 Typ 32 1 Max x Un nit 2.1 32 Max x 2 V dB B Ko ohm Un nit Vp pp oh m V Audio c Note Audio c Param channel 2 in The VSPK m channel 2A meters terface are d must be con AUXI input c Test cond differential li nnected to V characterist ditions ines, Can be VBAT, Otherw ic e use as Ha wise it will be and-free. e outwork. Bias v voltage No load Min 1.9 Typ 2.0 Max 2.1 Unit V H330 HSPA+

Module Hardw ware User Ma anual Page 36 of 44 4 mablestep ps 0 Programm gain:2dB 2.2 32 dB Kohm Gain Load r resistance Audio c channel 2A AUXO outpu ut character ristic Param meters Test con nditions Min Typ Max Out vo oltage No load Load r resistance DC Bia as voltage 5.8 Digi ital Audio o 8 2 4 Unit Vpp ohm V Pin#

24 25 26 27 28 29 54 Pin Name e I/O Des scription I2S2_CLK K0 I2S2_WA0 0 I2S2_TX I2S2_RX I2C_DATA A I2C_SCL CLKOUT0 0 O O O I I/O O O Bit C Clock Fra me clock(LR RCK) Ser rial data outp put Ser rial data inpu ut I2C data line I2C clock line 26M MHz clock ou utput Page 37 of 44 4 H330 HSPA+

Module Hardw ware User Ma anual 5.8.1 I2S 5.8.2 I2C C Notice:

1 I I2S can be s It support so 2 I K KHz, 11.025 5.9 Othe er set master m ome audio s 5 KHz, 8 KHz mode of slav ample rate (

z ). ver mode

(48KHz, 44. 1KHz, 32KH Hz, 24 KHz, 22.5 KHz, 1 16 KHz, 12 Other a are not supp ported like G GPIOMIPI MMCDA AC now. H330 HSPA+

Module Hardw ware User Ma anual Page 38 of 44 4 Min.

-0.2

-0.2 6 Elect 6.1 Elec trical an ctrical Ch nd Envir haracter onment istic tal s H330 elect trical charac teristic The table is VBAT Digital Sign nal The table is al Operationa Temperatu ure Storage Temperatu ure 6.2 Env vironmen ntal Char racteristi c s H330 envir ronmental ch C Condition haracteristic c:

Min n.

-30

-40 Max. 4.2 1.9 Un nit V V Max.

+85

+85 Unit C C H330 HSPA+

Module Hardw ware User Ma anual Page 39 of 44 4 7 RF In nterface e tenna. ntenna and diversity ant

. A Tx and Rx iversity Rx . H330 m Main an Diversit 7.1 Ope 7.1.1 Ma module inclu udes main an ntennaGS SM/WCDMA ty antenna WCDMA d Band erational a in Antenn Opera ating Band Tx Rx UMTS S 2100 (Ban d I IMT) UMTS S 1900 (Ban d II PCS) UMTS S 850 (Ban nd V CLR) UMTS S 900 (Ban nd VIII GSM M) GSM 850 MHz GSM 900 GSM 1800(DCS) GSM 1900(PCS) 7.1.2 Div versity 1920198 80 MHz 21102 2170 MHz 1850191 10 MHz 19301 990 MHz 824849M MHz 86989 94 MHz 880915 MHz 92596 60 MHz 824849 86989 94 MHz 880915 MHz 92596 60 MHz 1710178 85 MHz 18051 880 MHz 1850191 10 MHz 19301 990 MHz Opera ating Band Rx UMTS S 2100 (Ban d I IMT) UMTS S 1900 (Ban d II PCS) UMTS S 850 (Band V CLR) UMTS S 900 (Band VIII GSM) 2110217 70 MHz 1930199 90 MHz 869894 MHz 925960 MHz H330 HSPA+

Module Hardw ware User Ma anual Page 40 of 44 4 RF PCB 7.1.3 Lay Design yout Guide eline When desig The shorter It is recomm Add a -typ gn RF, we ne r the better, i mended to m pe circuit (tw eed connect insert loss <

mount H330 wo parallel de t H330 modu

<0.2dBand module and evice ground ule RF pin to d impedance d antenna co d pin directly o antenna, w we recomme e is 50ohm. the same sid onnector to t y to the mai n land) for a

. de of layout antenna mat tching. ended to use e micro-line 7.1.4 Imp pedance All RF lines should be 5 50ohm impe edance 7.2 Ante 7.2.1 Ma enna Des in Antenn sign a Design Requirem ment cy e ratio of the an antenna terial loss, a na Efficienc 1. Antenn ficiency is th Antenna eff d power of a The radiated losses: retu rn loss, mat

. dimensions Efficiency VSWR loss) indica

(50 ohm). S 2. S11 or S11 (return impedance e input powe is always low nd coupling er to the rad wer than the loss. The e diated or rec e input powe fficiency of a ceived powe er due to the an antenna r of an ante e following a relates to its nna. antenna s electrical y of the mas ster antenna a > 40% (4 4dB) tes the degr S11 shows th ree to which he resonanc h the input im e feature an mpedance of nd impedanc f an antenna ce bandwidth a matches th h of an ante he reference e nna. Voltage e H330 HSPA+

Module Hardw ware User Ma anual Page 41 of 44 4 other expres ssion of S11. S11 relates s to the ante enna efficien ncy. S11 can n

< 10 dB he orientatio on of the elec ctric field ve ector that rot tates with tim me in the mended for r the antenn nadiversit ty antenna different to o main SWR) is ano or analyzer. er antenna <

antenna is th adiation n is recomm ave ratio (VS standing wa ed with vecto be measure f the maste S11 o zation 3. Polariz ation of an a The polariza maximum ra direction of The linear p polarization antenna ion Pattern 4. Radiat on pattern of The radiatio f an antenna f half wave d on pattern of The radiatio mended:

na is recomm PIFA antenn high 6mm An ntenna area attern om adiation Pa Ra 5. Gain a nd Directiv ity f an antenna on pattern of The radiatio all directions s rence e antenna pe the TIS) of t the user boa ch as the LC e signals tha reased due t effects of int ptimized per ter circuits. IS 6. Interfe Besides the

(especially t sources on sources, su interference can be decr reduce the e LCD with op or design fil 7. TRP/TI TRP (T Total Radiated W850/W GSM850 GSM900 DCS1800 d Power):

900/W1900 0>27dBm 0>28dBm 0>25dBm a reflects the dipole anten e radiation fe nas is the be eatures of th est for wirele he antenna in ess termina n the remote ls. If it is bui e field region n. lt-in antenna a, m*wide 10m mm*long 1 nal mnidirection 00mm a represents s the field str rength of the e radiated el lectromagne etic waves in n Recom mmended an ntenna gain n 2.5dBi. erformance, he module. ard must be CD, CPU, au at affect the to interferen terference s rformance; s the interfere To guarante e properly co udio circuits normal oper nce signals. sources on th shield the LC ence on the ee high perfo ontrolled. On s, and power ration of the Therefore, d he module. Y CD interferen user board ormance of n the user bo r supply. All module. Fo during the de You can tak nce signals;

also affects the module, oard, there a the interfere or example, t esign, you n ke the follow shield the s s the radio p

, the interfer are various ence source the module need to cons ing measure signal cable erformance rence interference e s emit sensitivity sider how to o es: Use an of the board d;

0/W2100>1 19dBm H330 HSPA+

Module Hardw ware User Ma anual Page 42 of 44 4 TIS (To PCS1900 0>25dBm Sensitivity):

dBm 900<-102d W2100<-10 03dBm;

m 0<-102dBm m 0<-102dBm 0<-102dBm 0/PCS1900 m otal Isotropic W850/W

/W1900/W GSM850 GSM900 DCS1800 7.2.2 Div versity ant tenna desi ign sity antenna ntenna desig na and diver is optical, If gn methods rsity antenna f need to su and the mai a isolation re pport divers in antenna, equirements sity, must to its efficiency s greater tha increase the y indicators an 12dB. e diversity a to allow the ntenna. lower 3dB. ulatory C enzhen G&T with the ess Conforma T Industrial D sential requ ance Developmen irements an nt Co., Ltd., d other rele declares tha vant provisio at this modu ons of Direc ule, model H ctive 1999/5/

H330 is in

/EC. nt compl iance inf formation n for Nor rth Amer rican use ers Module has b ule in their fin Otherwise, a been grante nal products additional FC ed modular a s without add CC approva approval for ditional FCC als must be o mobile appl C certification obtained. lications. Int n if they mee tegrators ma et the follow ay use the wing t 20cm sepa aration dista ance betwee en the anten na and the u users body must be ma aintained at C regulation m antenna ga ns limiting bo ain including oth maximum g cable loss m RF outpu in a mobile-

t power and

-only exposu d human exp ure condition posure to RF F n must not mply with FC he maximum dBi. 330 Module or antenna w and its ante within a hos enna must no t device. ot be co-loca ated or oper rating in con njunction wit th any other H330 divers Diversity an Main antenn EU Reg Hereby, She compliance Importan The H330 M H330 Modu conditions. 1. At least all times. 2. To com radiation, th exceed 2.5d 3. The H3 transmitter o H330 HSPA+

Module Hardw ware User Ma anual Page 43 of 44 4 must be aff ment similar fixed to the o r to the follo outside of th wing: For H he end produ 330: This de uct into whic evice contai ch the H330 ns FCC ID:

ncorporated Module is in

, ZMOH330. 4. A label with a state 5. A user that must be The end pro emission te Note: If this satisfy the S FCC NOTIC Changes or Developme manual with e observed t h the end pro to ensure co oduct must c ompliance w clearly indic with current F cate the oper FCC RF exp rating requir posure guide rements and elines. d conditions oduct with a sting require n embedded ements and d H330 Mod be properly dule may als y authorized so need to p per FCC Pa ass the FCC art 15. C Part 15 un nintentional module is in SAR require ntended for ments of FC use in a por CC Part 2.10 rtable device 093. e, you are re esponsible f for separate approval to o CE:

r modificatio nt Co., Ltd. ns made to may void th this equipm e FCC auth ment not exp orization to ressly appro operate this enzhen G&T oved by She

. s equipment T Industrial H330 HSPA+

Module Hardw ware User Ma anual Page 44 of 44 4

BS FIBOCOM Wireless Module H330 WCDMA 850/900/1900/2100MHz GPRS/EDGE 850/900/1800/1900MHz C0168 X 24. 4mm FCC ID:ZMOH330 S/N:AOA2BEC095 IMEI:123456789012345 e@ MADE IN CHINA Bar isocom eee .

) 88 68 06 16 -6f i ai ht cd ren:

TUT) RA ee Tre ee hh ed rae ee BS

Shenzhen G&T Industrial Development Co., Ltd. 5/E, Building A, Technology Building II, 1057#Nanhai Blvd, Nanshan District, Shenzhen Date: 4" June, 2012 To: Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 To Whom It May Concern:

The Shenzhen G&T Industrial Development Co., Ltd. the undersigned, hereby . authorizes Mr. Wu Xuewen from Shenzhen Morlab Communications. Technology Co., Ltd., to act on the behalf of the Shenzhen G&T Industrial Development Co., Ltd. solely in matters relating to the application for an FCC. equipment authorization for FCC ID ZMOH330 including the signing of docunients -

in connection with this Application. Necessary acts carried out by Shenzhen G&T Industrial Development Co., Ltd. on our behalf of the Shenzhen G&T-

Industrial Development Co., Ltd. in connection with the Application: shall have the same effect as acts of the Shenzhen G&T Industrial Development Co., Ltd. The Shenzhen G&T Industrial Development Co., Ltd. also hereby certify that no party to this application is subject to a denial of benefits, including FCC -

benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 853(a). Thank you for your attention to this matter. Yours Sincerely, _ Signatory: J ery" . Name/Position: Project Manager Company Name: Shenzhen G&T Industrial Development Co., Ltd.

Shenzhen G&T Industrial Development Co., Ltd. 5/F, Building A, Technology Building H, ;

1057#Nanhai Blvd, Nanshan District, Shenzhen a . Date: 4 June, 2012 To: Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 Re: Shenzhen G&T Industrial Development Co., Ltd. FCC ID: ZMOH330 FCC Part 24 Certification Confidentiality Request Gentlemen:

This letter is to comply with 47 CFR 0.457 and 0.459 pertaining to confidentiality material. Shenzhen G&T Industrial Development Co., Ltd. requests that the. following documents regarding this submission for FCC ID: ZMOH330 be kept |

~ confidential:

Exhibit Type File Name Block Diagram Block Diagram.pdf Schematics Circuit Diagram.pdf Operational Description Operational Description.pdf Tune UP Tune UP.pdf Part list part list.pdf Those documents contain detailed system and equipment description and related information about the product which Shenzhen G&T Industrial Development Co., Ltd. considers to be confidential proprietary, a custom design and, otherwise, not releasable to the general public. Since this design is a basis form which future technological products will evolve, Shenzhen G&T Industrial Development Co., Ltd. considers this information would be of benefit to its competitors, and that the disclosure of the information in these documents would give competitors an unfair advantage in the market. Signatory: err Name/Position: Project Manager Company Name: Shenzhen G&T Industrial Development Co., Ltd.

Shenzhen G&T Industrial Development Co., Ltd. 5/F,A Building,Technology Building II, 1057#Nanhai Blvd,Nanshan District,Shenzhen To Whom It May Concern:

The Shenzhen G&T Industrial Development Co.,Ltd. the undersigned, declared that the model H330 support Quad-band GSM and UMTS bands, but GSM900MHz and 1800MHz, UMTS 900MHz and 2100MHz bands cannot be used in North America. Thank you for your attention to this matter. Yours Sincerely, Jerry Gao Program Manager Shenzhen G&T Industrial Development Co.,Ltd.

Shenzhen G&T Industrial Development Co., Ltd. 5/F,A Building,Technology Building II, 1057#Nanhai Blvd,Nanshan District,Shenzhen RequestforModularApprovalFCCID:ZMOH330 Item EUT Requirements HaveitsownRFshielding Haveitsownpowersupplyregulation Module chipset incorporates voltage 1 2 3 4 5 6 7 8 Havebufferedmodulation/data inputs(ifsuchinputsareprovided) Meettheantennarequirementsof section15.203 Demonstratecomplianceina standaloneconfiguration ThelicensedmodulemusthaveaFCC IDlabelonthemoduleitself.ThatFCC IDlabelmustbevisiblethrougha windowonthefinaldeviceoritmust bevisiblewhenanaccesspanel,door orcoveriseasilyremoved.Ifnot,a secondlabelmustbeplacedonthe outsideofthefinaldevicethat containsthefollowingtext:Contains FCCID:ZMOH330 Themodulemustcomplywithall specificrulesapplicabletothe transmitter.Thegranteemust providecomprehensiveinstructions toexplaincompliancerequirements. The module must comply with RF exposure requirements. See FCC Rules. Spread Spectrum transmitters must comply with RF exposure limits in15.247. Deviceisequippedwithmetalshielding to cover RF section. Refer to external andinternalphotos. All inputs to the modules are buffered through logic and microprocessor inputs regulationtotransceivercircuitry The device contains a unique antenna connector, and the maximum antenna gain in both 850MHz and 1900MHz is 2.5dBi. Device is tested in a test fixture in a standaloneconfiguration FCC ID label format will be included in the label will be displayedonthehostsystem. filling. Host ID PleaserefertoUserManualExhibit CompliancewithRFexposure requirementsisaddressedinRF exposurereport(MPE).