FCC ID: 2ANDL-BT3L BLE Module

Product Manual Tuya BT3L BLE Module Version: 2.0.0 Date: 2019-07-23 No.: 0000000001 1 Product Overview BT3L is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several peripheral components, with an embedded Bluetooth network protocol stack and robust library functions. BT3L also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0 component, 2.4 GHz radio component, 4 MB flash memory, 48 KB static random-

access memory (SRAM), and nine multiplexing I/O interfaces. 1.1 Features Embedded low-power 32-bit MCU, which can also function as an application processor Dominant frequency: 48 MHz Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is normal.) Peripherals: nine pulse width modulation (PWM) interfaces BLE RF features Compatible with BLE 5.0 Up to 2 Mbit/s RF data rate TX power: +10 dBm RX sensitivity: 94.5 dBm at BLE 1 Mbit/s Embedded advanced encryption standard (AES) hardware encryption Onboard PCB antenna with 2.5 dBi gain Working temperature: 20C to +85C BT3L Datasheet 1.2 Applications Smart LED lights Smart households Smart low-power sensors 2 Change History BT3L Datasheet No. Date Change Description 1 2019-03-09 This is the first release. 2 2019-07-23 1. Optimized the pin definition. 2. Standardized the dimensional tolerances. 3.Updated the temperature range, oven temperature, and working voltage settings. 4. Added packing methods. Version After Change 1.0.0 2.0.0 3 BT3L Datasheet Contents 1 Product Overview ............................................................................................................1 1.1 Features ................................................................................................................1 1.2 Applications ...........................................................................................................2 Change History...................................................................................................................3 2 Module Interfaces ............................................................................................................6 2.1 Dimensions and Footprint .....................................................................................6 2.2 Interface Pin Definition ..........................................................................................7 3 Electrical Parameters ......................................................................................................9 3.1 Absolute Electrical Parameters .............................................................................9 3.2 Electrical Conditions..............................................................................................9 3.3 Working Current ..................................................................................................10 4 RF Features...................................................................................................................11 4.1 Basic RF Features...............................................................................................11 4.2 RF Output Power.................................................................................................11 4.3 RF RX Sensitivity ................................................................................................12 5 Antenna Information ......................................................................................................12 5.1 Antenna Type ......................................................................................................12 5.2 Antenna Interference Reduction..........................................................................12 6 Packaging Information and Production Instructions..........................................................13 6.1 Mechanical Dimensions ......................................................................................13 6.2 Production Instructions........................................................................................14 6.3 Recommended Oven Temperature Curve ..........................................................15 6.4 Storage Conditions..............................................................................................17 7 MOQ and Packing Information ......................................................................................18 8 Appendix: Statement .....................................................................................................18 4 BT3L Datasheet Figures Figure 2-1 BT3L pins ..........................................................................................................6 Figure 6-1 BT3L mechanical dimensions .........................................................................13 Figure 6-2 HIC for BT3L ...................................................................................................14 Figure 6-3 Oven temperature curve .................................................................................16 Tables Table 2-1 BT3L interface pins ............................................................................................7 Table 3-1 Absolute electrical parameters ...........................................................................9 Table 3-2 Normal electrical conditions ...............................................................................9 Table 3-3 Current during constant transmission and receiving ........................................10 Table 4-1 Basic RF features.............................................................................................11 Table 4-2 Power during constant transmission ................................................................11 Table 4-3 RX sensitivity....................................................................................................12 5 BT3L Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint BT3L has two rows of pins with a 2 mm pin spacing. The BT3L dimensions (H x W x D) are 3.30.15 mm x 160.35 mm x 240.35 mm. The PCB thickness is 0.80.1 mm. Figure 2-1 shows the BT3L pins. Figure 2-1 BT3L pins 6 BT3L Datasheet 2.2 Interface Pin Definition Table 2-1 BT3L interface pins Pin No. Symbol I/O Type Function 1 2 3 4 5 6 7 8 9 10 11 RST I/O Hardware reset pin, which is active at a low level and is connected to pin 25 on the IC ADC AI 12-bit ADC, which is connected to pin 24 on the IC NC I/O NC TL_D7 I/O GPIO, which is connected to pin 2 on the IC TL_D2 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin 31 on the IC TL_C3 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin 23 on the IC TL_C2 I/O VDD_BAT GND P P Common I/O, which can be used as a PWM output of the LED drive and is connected to pin 22 on the IC Power supply pin (3.3 V) Power supply reference ground pin TL_C0 I/O GPIO, which is connected topin 20 on the IC SWS Input Programming pin, which is connected to pin 5 on the IC 7 BT3L Datasheet Pin No. Symbol I/O Type Function 12 TL_A0 I/O GPIO, which is connected to pin 3 on the IC 13 TL_B4 I/O 14 TL_B5 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin 14 on the IC Common I/O, which can be used as a PWM output of the LED drive and is connected to pin 15 on the IC 15 TL_B7 I/O Serial interface receiving pin (UART RX), which is connected to pin 17 on the IC 16 TL_B1 I/O Serial interface transmission pin (UART TX), which is connected to pin 6 on the IC Note:

1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2. If you have special requirements for light colors controlled by PWM outputs, contact Tuya business personnel. 8 BT3L Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Value Value Unit Ts VCC Storage temperature Power supply voltage 65 150 C 0.3 3.9 V Static electricity voltage

(human body model) Static electricity voltage

(machine model) Tamb = 25C N/A 2 kV Tamb = 25C N/A 0.5 kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typica l Value Maximum Value Unit Working temperature Working voltage Ta VCC VIH 20 N/A 85 C 2.8 3.3 3.6 I/O high-

VCC x 0.7 N/A VCC 9 V V BT3L Datasheet Parameter Description Minimum Value Typica l Value Maximum Value Unit level input I/O low-

level output I/O high-

level output VOL VOH VSS N/A VCC x 0.1 V VCC x 0.9 N/A VCC V 3.3 Working Current Table 3-3 Current during constant transmission and receiving Symbol Description Typical Value Unit Itx Irx Constant transmission, 0 dBm output power Constant receiving IDC Connected to a mesh network Ideepsleep1 Deep sleep mode 1 (16 KB RAM is reserved.) Ideepsleep2 Deep sleep mode 2 (No RAM is reserved.) 6.7 6.3 7.4 1.2 0.4 mA mA mA A A 10 BT3L Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4 GHz ISM band Wireless standard BLE 5.0 Data transmission rate 1 Mbit/s or 2 Mbit/s Antenna type Onboard PCB antenna 4.2 RF Output Power Table 4-2 Power during constant transmission Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power 22 10 10.5 dBm 20 dB modulation signal bandwidth (1 Mbit/s) 20 dB modulation signal bandwidth (2 Mbit/s) N/A 2500 N/A kHz N/A 1400 N/A kHz 11 BT3L Datasheet 4.3 RF RX Sensitivity Table 4-3 RX sensitivity Parameter Minimum Value Typica l Value Maximum Value Unit RX sensitivity Frequency offset 1 Mbit/s N/A 94.5 2 Mbit/s N/A 1 Mbit/s 250 2 Mbit/s 300 91 N/A N/A N/A N/A

+300

+200 dBm kHz Co-channel interference suppression N/A N/A 10 N/A dB 5 Antenna Information 5.1 Antenna Type BT3L uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance. Because BT3L is inserted to the PCB, sufficient space needs to be reserved for the antenna. 12 6 Packaging Information and Production Instructions BT3L Datasheet 6.1 Mechanical Dimensions Figure 6-1 BT3L mechanical dimensions Note:

The default dimensional tolerance is 0.35 mm, and the tolerance for some measurements is 0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 13 BT3L Datasheet 6.2 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.

(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter

(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:

(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.

(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

(3) The package contains a humidity indicator card (HIC). Figure 6-2 HIC for BT3L 14 BT3L Datasheet 3. Bake a module based on HIC status as follows when you unpack the module package:

(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.

(2) If the 30% circle is pink, bake the module for 4 consecutive hours.

(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:

(1) Baking temperature: 1255C

(2) Alarm temperature: 130C

(3) SMT placement ready temperature after natural cooling: < 36C

(4) Number of drying times: 1

(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.3 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. 15 BT3L Datasheet Figure 6-3 Oven temperature curve 16 6.4 Storage Conditions BT3L Datasheet 17 BT3L Datasheet 7 MOQ and Packing Information MOQ and Packing Information Product Model MOQ (PCS) Packing Method Number of Modules in Number of Reel Packs in Each Each Reel Pack Box BT3L 3600 Carrier tape and 900 4 reel packing 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.

(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause 18 BT3L Datasheet harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labeled in a visible area with the following:

"Contains Transmitter Module 2ANDL-BT3L"

This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio. 19 Declaration of Conformity European notice BT3L Datasheet Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com. EN 300 328 V2.1.1 EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1 EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 20

Form Page number:___1___ Photos Documentation Test Worksheet - Test Summary for IEC/EN 60950-1 Project No.: 704201621801 Model No.: N/A Sample No.:1#

Manufacturer: Hangzhou Tuya Information Technology Co.,Ltd Product: BLE Module FCC ID: 2ANDL-BT3L Page 1 of 1 Standard: IEC 60529 Product:

Project Engineer:

Test Engineer:

Application Date:

Pad XIAO Yanqin XIAO Yanqin 2016-07-12 Model: BT3L Requested Date:

Type of test:

2016-07-13 Full test Re-test Rated input (V/Hz/A) Rated output (V/A) Protection class:

Protection against moisture:

Construction:

Operation mode:

Others:

Weight (kg):

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....................................... Signature / Date Record by Test Engineer Helical Antenna

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Photos Documentation Manufacturer: Hangzhou Tuya Information Technology Co.,Ltd Product: BLE Module FCC ID: 2ANDL-BT3L Form Page number:___1___ Test Worksheet - Test Summary for IEC/EN 60950-1 Project No.: 704201621801 Model No.: N/A Sample No.:1#

Page 1 of 1 Model: BT3L Standard: IEC 60529 Product:

Project Engineer:

Test Engineer:

Application Date:

Pad XIAO Yanqin XIAO Yanqin 2016-07-12 Rated input (V/Hz/A) Rated output (V/A) Protection class:

Protection against moisture:

Construction:

Operation mode:

Requested Date:

Type of test:

2016-07-13 Full test Re-test Others:

Weight (kg):

Other information:

Total page : __2_ pages

....................................... Signature / Date Record by Test Engineer Helical Antenna F o r m I

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Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (07/23/2019) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Modular Approval Request FCC ID: 2ANDL-BT3L The following attestation addresses the requirements to support modular approval:

Modular approval requirement Yes (provide brief statement) No *

(a) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly

(b) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal

(c) The module must contain power supply regulation on the module The module has a metal shied. Refer to the external photo of EUT. Data to the modulation circuit is buffered as described in the operational description provided with the application. The module contains its own power supply regulation. Please refer to schematic filed with this application.

(d) The module must contain a permanently attached antenna, or The module has a PCB antenna and which permanently attached Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b)

(e) The module must demonstrate compliance in a stand-alone configuration

(f) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements)

(g) The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements the module. Refer to the photo of EUT. The module was tested stand-

alone as shown in test setup photographs filed with this application. The FCC ID is printed on the label of the module.Refer to the label of EUT. The module comply with all specific rules.Refer to the datasheet. Modular approval requirement Yes (provide brief statement) No *

(h) The module must comply with RF exposure requirements The module meets Portable exclusion levels as shown in the RF exposure information filed with this application.

* Please provide a detailed explanation if the answer is No. Yours sincerely, Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Name:

Title:

General Manager

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 1a 00 re) Date (05/06/2019) TUV SUD BABT TCB Octagon House, Segensworth Road, Fareham, Hampshire, PO15 5RL Dear Sir or Madam, We, (Hangzhou Tuya Information Technology Co., Ltd ,; Room701, Building3, More Center,No.87 GuDun Road, Hangzhou, Zhejiang, China), matters. This authorization expires on (Dec. 31, 2019). sow ay Sho Sincerely, Company Officer: XiaoDong Shou Telephone Number: 86-571-86581 786 Email: mikeshou@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (07/23/2019) TUV SUD BABT TCB Octagon House, Segensworth Road, Fareham, Hampshire, PO15 5RL Confidentiality Request FCC ID: 2ANDL-BT3L Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commissions Rules, (Hangzhou Tuya Information Technology Co.,Ltd) hereby requests permanent confidential treatment of information accompanying this application as outlined below:

Schematics Bill of Materials/Parts List Block Diagrams Theory of Operation The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Yours sincerely, Company Officer:

Telephone Number:

86-571-86581786 Email:

mikeshou@tuya.com