Global Intelligent Platform Tuya BT7L-G BLE Module Version: 1.0.0 Date: 2019-10-14 No.: 0000000001 Product Manual 1 Product Overview BT7L-G is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several peripheral components, with an embedded Bluetooth network protocol stack and robust library functions. BT7L-G also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0 component, 2.4 GHz radio component, 4 MB flash memory, 48 KB static random-access memory (SRAM), and nine multiplexing I/O interfaces. 1.1 Features Embedded low-power 32-bit MCU, which can also function as an application processor Dominant frequency: 48 MHz Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is normal.) Peripherals: nine pulse width modulation (PWM) interfaces BLE RF features Compatible with BLE 5.0 Up to 2 Mbit/s RF data rate TX power: +10 dBm RX sensitivity: 94.5 dBm at BLE 1 Mbit/s Embedded advanced encryption standard (AES) hardware encryption Onboard PCB antenna with 2.5 dBi gain Working temperature: 20C to +105C BT7L-G Datasheet 1.2 Applications Smart LED lights Smart households Smart low-power sensors 2 BT7L-G Datasheet Change History No. Date Change Description Version After Change 1 2019-10-14 This is the first release. 1.0.0 3 BT7L-G Datasheet Contents 1 Product Overview ............................................................................................................. 1 1.1 Features.................................................................................................................. 1 1.2 Applications ............................................................................................................ 2 Change History .................................................................................................................... 3 2 Module Interfaces ............................................................................................................. 6 2.1 Dimensions and Footprint ...................................................................................... 6 2.2 Interface Pin Definition ........................................................................................... 7 3 Electrical Parameters ........................................................................................................ 9 3.1 Absolute Electrical Parameters .............................................................................. 9 3.2 Electrical Conditions ............................................................................................... 9 3.3 Working Current ................................................................................................... 10 4 RF Features .................................................................................................................... 11 4.1 Basic RF Features ................................................................................................ 11 4.2 RF Output Power .................................................................................................. 11 4.3 RF RX Sensitivity.................................................................................................. 12 5 Antenna Information ........................................................................................................ 12 5.1 Antenna Type ........................................................................................................ 12 5.2 Antenna Interference Reduction ........................................................................... 12 6 Packaging Information and Production Instructions .......................................................... 13 6.1 Mechanical Dimensions ....................................................................................... 13 6.2 Production Instructions ......................................................................................... 14 6.3 Recommended Oven Temperature Curve ........................................................... 15 6.4 Storage Conditions ............................................................................................... 17 7 MOQ and Packing Information ....................................................................................... 18 8 Appendix: Statement ....................................................................................................... 18 4 BT7L-G Datasheet Figures Figure 1-1 BT7L-G architecture .......................................... 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Figure 2-1 BT7L-G pins ....................................................................................................... 6 Figure 6-1 BT7L-G mechanical dimensions ...................................................................... 13 Figure 6-2 HIC for BT7L-G ................................................................................................ 14 Figure 6-3 Oven temperature curve .................................................................................. 16 Tables Table 2-1 BT7L-G interface pins .......................................................................................... 7 Table 3-1 Absolute electrical parameters ............................................................................ 9 Table 3-2 Normal electrical conditions ................................................................................. 9 Table 3-3 Current during constant transmission and receiving ......................................... 10 Table 4-1 Basic RF features .............................................................................................. 11 Table 4-2 Power during constant transmission ................................................................. 11 Table 4-3 RX sensitivity ..................................................................................................... 12 5 BT7L-G Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint BT7L-G has two rows of pins with a 2 mm pin spacing. The BT7L-G dimensions are 15mm0.35 (W)16.5mm0.35 (L)2.85mm(H). The PCB thickness is 0.80.1 mm. Figure 2-1 shows the BT7L-G pins. Figure 2-1 BT7L-G pins 6 BT7L-G Datasheet 2.2 Interface Pin Definition Table 2-1 BT7L-G interface pins Pin No. Symbol I/O Type Function 1 2 3 SDC I/O I2C SDC,can be used as a common I/O SCL I/O I2C SCL,can be used as a common I/O Common I/O, which can be used as a PWM C3 I/O output of the LED drive and is connected to pin 23 on the IC 4 D2 I/O output of the LED drive and is connected to pin 31 Common I/O, which can be used as a PWM on the IC 5 C2 I/O output of the LED drive and is connected to pin 22 Common I/O, which can be used as a PWM on the IC 6 B5 I/O output of the LED drive and is connected to pin 15 Common I/O, which can be used as a PWM on the IC 7 8 9 Common I/O, which can be used as a PWM B4 I/O output of the LED drive and is connected to pin 14 on the IC 3.3V P Power supply pin (3.3 V) TX I/O Serial interface transmission pin (UART TX), which is connected to pin 6 on the IC 10 RX I/O Serial interface receiving pin (UART RX), which is connected to pin 17 on the IC 7 BT7L-G Datasheet Pin No. Symbol I/O Type Function 11 GND P Power supply reference ground pin 12 SWS Input Programming pin, which is connected to pin 5 on the IC 13 RST I/O Hardware reset pin, which is active at a low level and is connected to pin 25 on the IC 14 GND P Power supply reference ground pin Note:
1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2. If you have special requirements for light colors controlled by PWM outputs, contact Tuya business personnel. 8 BT7L-G Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Value Value Unit Ts VCC Storage temperature Power supply voltage 65 150 C 0.3 3.9 V Static electricity voltage
(human body model) Static electricity voltage
(machine model) Tamb = 25C N/A 2 kV Tamb = 25C N/A 0.5 kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Typical Maximum Value Value Value Unit Ta Working temperature VCC Working voltage 20 N/A 105 C 2.8 3.3 3.6 V VIH I/O VCC x 0.7 N/A VCC V 9 BT7L-G Datasheet Parameter Description Minimum Typical Maximum Value Value Value Unit high-level input I/O VOL low-level VSS N/A VCC x 0.1 V output I/O VOH high-level VCC x 0.9 N/A VCC V output 3.3 Working Current Table 3-3 Current during constant transmission and receiving Symbol Description Typical Value Unit Itx Constant transmission, 0 dBm output power 6.7 mA Irx Constant receiving 6.3 IDC Connected to a mesh network 7.4 mA mA Ideepsleep1 Ideepsleep2 Deep sleep mode 1 (16 KB RAM is reserved.) 1.2 A Deep sleep mode 2 (No RAM is reserved.) 0.4 A 10 BT7L-G Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4 GHz ISM band Wireless standard BLE 5.0 Data transmission rate 1 Mbit/s or 2 Mbit/s Antenna type Onboard PCB antenna 4.2 RF Output Power Table 4-2 Power during constant transmission Parameter Minimum Typical Maximum Value Value Value Unit Average RF output power 22 9 10 dBm 20 dB modulation signal bandwidth (1 Mbit/s) 20 dB modulation signal bandwidth (2 Mbit/s) N/A 2500 N/A kHz N/A 1400 N/A kHz 11 BT7L-G Datasheet 4.3 RF RX Sensitivity Table 4-3 RX sensitivity Parameter Minimum Typical Maximum Value Value Value RX sensitivity 1 Mbit/s N/A 94.5 N/A 2 Mbit/s N/A 91 N/A Frequency offset 1 Mbit/s 250 N/A
+300 2 Mbit/s 300 N/A
+200 Unit dBm kHz Co-channel interference suppression N/A N/A 10 N/A dB 5 Antenna Information 5.1 Antenna Type BT7L-G uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance. Because BT7L-G is inserted to the PCB, sufficient space needs to be reserved for the antenna. 12 BT7L-G Datasheet 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions Figure 6-1 BT7L-G mechanical dimensions Note:
The default dimensional tolerance is 0.35 mm, and the tolerance for some measurements is 0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 13 BT7L-G Datasheet 6.2 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-2 HIC for BT7L-G 14 BT7L-G Datasheet 3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.3 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. 15 BT7L-G Datasheet Figure 6-3 Oven temperature curve 16 BT7L-G Datasheet 6.4 Storage Conditions 17 BT7L-G Datasheet 7 MOQ and Packing Information MOQ and Packing Information Product Model MOQ (PCS) Packing Number of Number of Reel Method Modules in Packs in Each Each Reel Pack Box BT7L-G 3600 Carrier tape and 900 4 reel packing 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause 18 BT7L-G Datasheet harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. This equipment have got a FCC ID2ANDL-BT7L-G.The final end product must be labeled in a visible area with the following:
"Contains Transmitter Module2AFNL-BT7L-G"
This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio. 19 BT7L-G Datasheet Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com. EN 300 328 V2.1.1 EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1 EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 20