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Hangzhou Tuya Inc. NM1 Module Hardware Design Manual NM1 Module Hardware Design Manual NB-IoT Series Issue: V1.1 Date: 2019-05-06 The Tuya Smart platform is a global intelligent platform, AI and IoT developer platform, and world-leading voice interaction platform that provides one-stop AI and IoT solutions to meet intelligence requirements of consumers, manufacturers, OEMs, and retail chain stores. Its solutions cover hardware access, cloud services, and app software development, forming a closed service loop of AI and manufacturing. It provides business group technologies and business model upgrade services for consumer-level smart IoT devices to meet consumers' higher requirements for hardware. Tuya has always been committed to providing customers with timely and comprehensive services. If you need any help, contact Tuya headquarters. Tuya's contact information is as follows:
Hangzhou Tuya Inc. Floor 7, Zheshang Fortune Center, No. 99, Gudun Road, Xihu District, Hangzhou, Zhejiang Province, China 400-881-8611 https://www.tuya.com Page 1 of 29 Hangzhou Tuya Inc. Change History NM1 Module Hardware Design Manual Date 2019-03-01 Version 1.0 Change Description This is the first release. Prepared By Wang Yanfeng Reviewed By Wang Yanfeng Approved By Chen Lihuan https://www.tuya.com Page 2 of 29 Hangzhou Tuya Inc. NM1 Module Hardware Design Manual Notice Copyright Statement Tuya reserves rights for this document and its content, which is protected by Chinese laws and related copyright laws in applicable international conventions. No part of this document may be reproduced, transmitted, distributed, or modified in any form or by any means without prior written consent of Tuya. Those who violate shall be held liable. Statement of Non-Guarantee Tuya does not provide guarantees or presentations of any kind, either express or implied for content in this document and is not reliable for specific merchantability, applicability, and indirect, special, or associated losses. Confidentiality Statement Information, including attachments in this document, is confidential. Those who receive this document shall know that it is confidential, not use it for other purposes except the specified one, and not disclose it to any third party. Disclaimer Tuya is not reliable for human injuries or property damages caused by misoperations. You shall develop products based on the technical specifications and reference design provided in this document. The information in this document is subject to changes without notice. https://www.tuya.com Page 3 of 29 Hangzhou Tuya Inc. NM1 Module Hardware Design Manual Contents 3 2 1 About This Document................................................................................................................................................... 6 1.1 Applicable Scope....................................................................................................................................................6 1.2 Purpose................................................................................................................................................................... 6 1.3 Reference Documents............................................................................................................................................6 1.4 Acronyms and Abbreviations.................................................................................................................................. 6 Product Overview..........................................................................................................................................................7 2.1 Package Size........................................................................................................................................................... 7 2.2 Technical Parameters...............................................................................................................................................8 2.3 Product Functions................................................................................................................................................. 9 2.3.1 Baseband Functions..................................................................................................................................... 9 2.3.2 RF Functions.................................................................................................................................................9 Interfaces......................................................................................................................................................................11 3.1 Pin Definition....................................................................................................................................................... 11 3.1.1 Pin Symbols..................................................................................................................................................11 3.1.2 Pin Configuration Diagram.......................................................................................................................11 3.1.3 Pins...............................................................................................................................................................11 3.2 Electrical Conditions............................................................................................................................................. 15 3.3 Power Interface....................................................................................................................................................15 3.3.1 Power Pins and Grounding....................................................................................................................... 15 3.3.2 Power Supply Requirements.....................................................................................................................15 3.4 SIM Card Interface.............................................................................................................................................16 3.4.1 Pins...............................................................................................................................................................16 3.4.2 SIM Card Interface Application...................................................................................................................16 3.5 SPIs........................................................................................................................................................................17 3.5.1 Pins............................................................................................................................................................... 17 3.5.2 SPI Electrical Parameters and Application.................................................................................................. 17 3.6 I2C Interface.........................................................................................................................................................17 3.6.1 Pins...............................................................................................................................................................17 3.6.2 I2C Interface Electrical Parameters and Application.............................................................................18 3.7 UART Interface................................................................................................................................................... 18 3.7.1 Pins............................................................................................................................................................... 18 3.7.2 UART Interface Electrical Parameters and Application.............................................................................. 18 3.8 USB Interface.......................................................................................................................................................19 3.8.1 USB and Downloading Interface Pins (COM Function Not Supported).................................................... 19 3.8.2 USB and Downloading Interface Application............................................................................................. 20 3.9 Power-On/Power-Off and Reset Interface............................................................................................................ 20 3.9.1 PWRKEY Pin...............................................................................................................................................20 3.9.2 Power-On/Power-Off Interface Application................................................................................................ 20 3.9.3 RESET Pin....................................................................................................................................................21 3.9.4 RESET Interface Application.......................................................................................................................21 Design Instructions......................................................................................................................................................21 4.1 General Design Rules and Requirements..............................................................................................................21 4.2 Power Supply Circuit Design................................................................................................................................21 4.3 RF Circuit Design................................................................................................................................................ 21 4.3.1 RF Antenna Circuit Design.......................................................................................................................... 22 4.3.2 Precautions for Initial Antenna Design........................................................................................................ 23 4.4 Suggestions on EMC and ESD Design................................................................................................................. 23 4.5 PCB Solder Pad Design.......................................................................................................................................23 4.6 Thermal Design..................................................................................................................................................... 23 Production Instructions................................................................................................................................................24 5.1 Stencil Design........................................................................................................................................................24 5.2 Oven Temperature Curve...................................................................................................................................24 6 Mechanical Size...........................................................................................................................................................26 6.1 NM1 Module Mechanical Size............................................................................................................................. 26 6.2 Recommended Package Size.................................................................................................................................28 5 4 https://www.tuya.com Page 4 of 29 Hangzhou Tuya Inc. Figures NM1 Module Hardware Design Manual Figure 2- 1 Product appearance..................................................................................................................................... 7 Figure 2- 2 Package size diagram (unit: mm)............................................................................................................... 7 Figure 2- 3 System connection framework................................................................................................................... 9 Figure 3- 1 Pin configuration diagram.........................................................................................................................11 Figure 3- 2 Power supply of the NM1 module............................................................................................................15 Figure 3- 3 SIM card interface application..................................................................................................................16 Figure 3- 4 Reference circuit....................................................................................................................................... 17 Figure 3- 5 Reference circuit....................................................................................................................................... 18 Figure 3- 6 Reference circuit....................................................................................................................................... 18 Figure 3- 7 Reference circuit with a level converter...................................................................................................19 Figure 3- 8 Reference circuit with a triode for level conversion................................................................................ 19 Figure 3- 9 Downloading interface application circuit............................................................................................... 20 Figure 3- 10 PWRKEY interface application circuit.................................................................................................. 20 Figure 3- 11 RESET interface application circuit....................................................................................................... 21 Figure 4- 1 Antenna impedance calculation model.....................................................................................................22 Figure 4- 2 Antenna PCB cabling impedance calculation data...................................................................................23 Figure 5- 1 Recommended stencil strips..................................................................................................................... 24 Figure 5- 2 Over temperature curve............................................................................................................................ 25 Figure 6- 1 Top view (unit: mm)................................................................................................................................. 26 Figure 6- 2 Side view (unit: mm)................................................................................................................................ 26 Figure 6- 3 Transparent view (unit: mm).................................................................................................................... 27 Figure 6- 4 Recommended package size (unit: mm)...................................................................................................28 Tables Table 1- 1 Reference documents....................................................................................................................................6 Table 1- 2 Acronyms and abbreviations........................................................................................................................ 6 Table 2- 1 Technical parameters of the NM1 module................................................................................................... 8 Table 2- 2 Working frequency bands.............................................................................................................................9 Table 2- 3 Line loss requirements................................................................................................................................10 Table 2- 4 Antenna requirements.................................................................................................................................10 Table 2- 5 Conducted RF transmit power....................................................................................................................10 Table 3- 1 Pin symbols.................................................................................................................................................11 Table 3- 2 Interface pin definition............................................................................................................................... 11 Table 3- 3 Electrical conditions................................................................................................................................... 15 Table 3- 4 Definition and description of SIM card interface signals.......................................................................... 16 Table 3- 5 SPI signal definition................................................................................................................................... 17 Table 3- 6 I2C interface signal definition.....................................................................................................................17 Table 3- 7 UART interface signal definition............................................................................................................... 18 Table 3- 8 USB and downloading interface signal definition..................................................................................... 19 Table 3- 9 PWRKEY signal definition........................................................................................................................ 20 Table 3- 10 RESET signal definition...........................................................................................................................21 Table 5- 1 Over temperature curve parameter settings................................................................................................24 https://www.tuya.com Page 5 of 29 Hangzhou Tuya Inc. 1 About This Document 1.1 Applicable Scope NM1 Module Hardware Design Manual This document describes hardware interface specifications, electrical features, mechanical specifications, and other related information about the NM1 module to help you design and develop NM1 module hardware. 1.2 Purpose This document provides NM1 module design and development bases. Through this document, you can know the NM1 module and its technical parameters and develop related functional product or devices. In addition to functional features and technical parameters, this document also describes the product reliability test, related test standards, service function implementation process, RF performance indicators, and circuit design. 1.3 Reference Documents Document No. Table 1- 1 Reference documents Document Name NM1 Module Hardware Manual.pdf NM1 Module Software Manual.pdf NM1 Module TE-B User Manual.pdf 1.4 Acronyms and Abbreviations Acronyms ESD USB UART SIM SPI I2C I/O GPIO TDB RTC ADC Table 1- 2 Acronyms and abbreviations Full Spelling electrostatic discharge Universal Serial Bus universal asynchronous receiver/transmitter subscriber identity module serial peripheral interface inter-integrated circuit Input/Output General Purpose Input/Output To be determined real-time clock analog to digital converter https://www.tuya.com Page 6 of 29 Hangzhou Tuya Inc. 2 Product Overview NM1 Module Hardware Design Manual NM1 is a compact, high-performance, and low-power NB-IoT series module. It has the following features:
Supports the B1, B3,B5,B8, B20 frequency bands. Provides the SIM card interface (1.8 V), USB 1.1 interface, UART interface, SPI, I2C interface, and GPIO interface. 2.1 Package Dimensions Figure 2- 1 Product appearance The NM1 module has 66 pins. Its dimensions is 17.7 2.4 mm (H) x 17.7 mm (W) x 15.8 mm (D). Figure 2- 2 Package dimensions diagram (unit: mm) https://www.tuya.com Page 7 of 29 Hangzhou Tuya Inc. 2.2 Technical Parameters NM1 Module Hardware Design Manual Table 2- 1 describes mechanical features, baseband features, RF features, technical standards, and environment features of the NM1 module. Table 2- 1 Technical parameters of the NM1 module Item Mechanical features Parameter Package size and type Platform Processor architecture SIM card interface USB interface Voltage Working mode Module Power-saving Serial port Working current RTC ADC*
RI signal*
Network status indication*
Frequency band Maximum TX power Receiving sensitivity Main antenna interface Antenna interface RF Technical standard Data rate Network protocol Environment feature Application Temperature SMS*
Upgrade Specifications 17.7 mm x 15.8 mm x 2.6 mm Stamp hole (52 pins) and base pad (14 pins) MT2625 ARM Cortex-M4 1.8 V USB 1.1 2.1 V to 3.63 V Active: The NM1 module is active and can send and receive data. All functions are available. An active NM1 module can switch to the idle or PSM mode. Idle: The NM1 module is in idle state, connected to a network, and can receive paging messages. An idle NM1 module can switch to the active or PSM mode. PSM: Only RTC of the module works, and the module is disconnected from the network and cannot receive paging messages. The NM1 module is woken up from the PSM mode when the timer expires or the PWRKEY and PSM_EINT* pins are lowered. In PSM mode, the NM1 module consumes the minimum power of 5 A. The PSM mode is provided to reduce power consumption and prolong the power supply duration of the battery. Primary serial interface: transmits AT commands and data. The default baud rate is 115.2 kbit/s. It can also be used for firmware upgrade and the baud rate is 921.6 kbit/s. Debugging serial interface: exports log information for software commissioning. Auxiliary serial interface: transmits AT commands and data. TBD Supported The NM1 module has a 10-bit analog-digit conversion input interface to measure the voltage. This interface works in both active and idle modes. When the NM1 module receives SMS messages or exports URC, it notifies the DTE over the RI pin. The NETLIGHT signal indicates the module's network connection status. B1, B3, B5,B8, B20 232 dBm TBD Supported Characteristic impedance of 50 ohms. The antenna is provided by a third party, but not Tuya. Single-tone: downlink 25.5 kbit/s and uplink 16.7 kbit/s Multi-tone*: downlink 25.5 kbit/s and uplink 62.5 kbit/s UDP/TCP/CoAP/LWM2M/PPP*/SSL*/DTLS*/FTP*/HTTP*/MQTT*/HTTPS*
Normal operating temperature: 35C to +75C1 Extended operating temperature: 40C to +85C2 Storage temperature: 40C to +90C Text and packet data unit (PDU) modes Upgrade is performed over the primary serial interface. Note:
3GPP standards. 1. When the NM1 module works at a temperature within the normal operating temperature range1, its performance complies with 2. When the NM1 module works at a temperature within the extended operating temperature range2, it works properly, has the SMS* and data transmission functions, and will not have unrecoverable faults. The RF spectrum and network are not affected. Several indicators, for example, the output power, may exceed the 3GPP limits. After the operating temperature is restored to the normal operating temperature, all NM1 module indicators can meet 3GPP standard requirements. A feature with an asterisk (*) is being developed. 3. https://www.tuya.com Page 8 of 29 Hangzhou Tuya Inc. 2.3 Product Functions 2.3.1 Baseband Functions NM1 Module Hardware Design Manual The NM1 module baseband includes the USB interface signal, SIM card interface signal, I2C interface signal, UART interface signal, working status indicator signal, module startup and reset signals, and multiplexing control signals, power supply, and grounding of multiple GPIO interfaces. Figure 2- 3 System connection framework 2.3.2 RF Functions Table 2- 2 Working frequency bands Working Frequency Band B1 B3 B5 B8 B20 Uplink (MHz) 19201980 17101785 824849 880915 832862 Downlink (MHz) 21102170 18051880 869-894 925960 791821 Note: The NM1 module is being developed to support the frequency bands with an asterisk (*). https://www.tuya.com Page 9 of 29 Hangzhou Tuya Inc. Frequency Band LTE B5, B8, B20 LTE B1, B3 Item Frequency band Standing wave ratio (SWR) Efficiency (%) Maximum input power (W) Input impedance (ohm) Polarization type Table 2- 3 Line loss requirements NM1 Module Hardware Design Manual Requirement Line loss < 1 dB Line loss < 1.5 dB Table 2- 4 Antenna requirements Requirement LTE B1, B3, B5,B8, B20 2 30 50 50 Linear polarization Note: The NM1 module is being developed to support the frequency bands with an asterisk (*). Table 2- 5 Conducted RF transmit power Frequency Band Maximum Value (dBm) Minimum Value (dBm) B1 B3 B5 B8 B20 Note:
1. The designed conducted RF transmit power complies with the NB-IoT protocol in 3GPP Release 13 and Release 14. 2. The NM1 module is being developed to support the frequency bands with an asterisk (*). 232 dBm 232 dBm 232 dBm 232 dBm 232 dBm
< 39
< 39
< 39
< 39
< 39 https://www.tuya.com Page 10 of 29 Hangzhou Tuya Inc. 3 Interfaces 3.1 Pin Definition 3.1.1 Pin Symbols Table 3- 1 Pin symbols NM1 Module Hardware Design Manual Pin Symbol I O I/O 3.1.2 Pin Configuration Diagram Figure 3- 1 shows the NM1 module's interface pins. Description Input Output Input/Output 3.1.3 Pins Figure 3- 1 Pin configuration diagram Table 3- 2 Interface pin definition Pin No. Analog Signal Definition Pin Attribute 1 2 AGND GPIO0 https://www.tuya.com GND GPIO0 Input/
Output N/A N/A Pin Voltage (V) Remarks N/A 1.8 N/A N/A Page 11 of 29 Hangzhou Tuya Inc. Pin No. Analog Signal Definition Input/
Output NM1 Module Hardware Design Manual Remarks Pin Voltage (V) SPI_MISO SPI_MOSI Pin Attribute Primary device input and secondary device output signal Primary device output and secondary device input signal SPI_SCLK Serial clock signal SPI_CS Chip selection signal PWRKEY GPIO22 ADC0 SIM_GND Lower PWRKEY to power on the NM1 module. GPIO22 Common analog-digit conversion interface GND dedicated for the SIM card SIM_DATA SIM card data signal I/O SIM_RST SIM card reset signal I/O SIM_CLK SIM card clock signal I/O I O O O I N/A I N/A 1.8 1.8 1.8 1.8 Maximum value of VIL: 0.3 x Minimum value of VIH: 0.7 x VBAT VBAT N/A 01.4 V N/A Maximum value of VIL: 0.25 x Minimum value of VIH: 0.75 x SIM_VDD SIM_VDD SIM_VDD SIM_VDD SIM_VDD SIM_VDD SIM_VDD SIM_VDD Maximum value of VOL: 0.15 x Minimum value of VOH: 0.85 x Maximum value of VOL: 0.15 x Minimum value of VOH: 0.85 x Maximum value of VOL: 0.15 x Minimum value of VOH: 0.85 x SIM_VDD RESET SIM card power signal Used to reset the NM1 module, which is active at low level NETLIGHT Network status indication RXD TXD Primary serial interface that receives data Primary serial interface that transmits data PSM_EINT SRCLKENAI External interrupt pin, which is used to wake up the NM1 module from the PSM mode NFC interface O I O I O I N/A 1.8 N/A N/A 1.8 1.8 N/A 1.8 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 https://www.tuya.com Page 12 of 29 Hangzhou Tuya Inc. Pin No. Analog Signal Definition USB_DP 21 USB_DM Pin Attribute USB+ signal USB signal 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 USB_EINT USB_EINT VIO18_EXT DVDD_IO NC GND UART1_RXD UART1_TXD UART1_CTS UART1_RTS I2C0_SDA I2C0_SCL GND RF_ANT GND GND RXD_DBG TXD_DBG GND GND 1.8 V output power (In PSM mode, no voltage is output.) NC NC GND Auxiliary serial interface that receives data Auxiliary serial interface that transmits data Determines whether data is received. Determines whether data is transmitted. I2C0 data I2C0 clock GND RF antenna GND GND Debugging serial interface that receives Debugging serial interface that transmits data data GND GND VSYS_BB Input power VBAT_BOOST Input power Input/
Output NM1 Module Hardware Design Manual Remarks Pin Voltage (V) N/A N/A O NC N/A N/A I O N/A N/A I/O O N/A N/A N/A I O N/A N/A I I N/A N/A Vmin = 1.53 V Vnorm = 1.8 V NC N/A N/A 1.8 1.8 1.8 1.8 N/A N/A N/A Characteristic impedance of 50 ohms N/A N/A 1.8 1.8 N/A N/A Vmin = 2.1 V Vnorm = 3.3 V Vmax = 3.63 V Vmin = 2.1 V Vnorm = 3.3 V Vmax = 3.63 V N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A https://www.tuya.com Page 13 of 29 Hangzhou Tuya Inc. Pin No. Analog Signal Definition VSYS_PA 44 Pin Attribute Output power 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 GPIO11 GPIO10 GPIO25 MD_WAKEUP GPIO28 AP_READY STATUS GPIO24 GPIO34 GPIO33 GPIO21 GPIO20 GPIO8 GPIO1 GPIO19 RTC_GPIO0 SIM_DET GPIO32 Reserved Reserved Reserved N/A Reserved N/A N/A Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved N/A GPIO35 Reserved AVDD33_VUSB N/A FREF GPIO31 GND Base frequency GPIO31 GND Input/
Output NM1 Module Hardware Design Manual Remarks Pin Voltage (V) O N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A I I N/A N/A 3.3 1.8 1.8 1.8 N/A 1.8 N/A N/A 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 N/A SIM card detection 1.8 N/A N/A 1.8 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A https://www.tuya.com Page 14 of 29 Hangzhou Tuya Inc. 3.2 Electrical Conditions Table 3- 3 Electrical conditions NM1 Module Hardware Design Manual Signal VBAT_BOOST VSYS_BB VSYS_PA Description Input power Input power Output power 3.3 Power Interface 3.3.1 Power Pins and Grounding Minimum Value 2.1 2.1 N/A Typical Value 3.3 3.3 3.3 Maximum Value 3.63 3.63 N/A Unit V V V The NM1 module can be powered by a battery or external power supply. The GND signal pins indicate the power ground and signal ground of the NM1 module and need to be connected to the ground of the PCB. Improper connections of the GND signal pins may have adverse impact on the NM1 module performance. 3.3.2 Power Supply Requirements The NM1 module's power design is important to its performance. The NM1 module can be powered by the low-dropout regulator (LDO) with low static current and output current (up to 0.5 A) or the Li-MnO2 battery. The input voltage range is from 2.1 V to 3.63 V. During data transmission, the power cannot be lower than the minimum working voltage 2.1 V. Otherwise, errors will occur. To ensure better power supply performance, it is recommended that three 47 F (0805) ceramic capacitors and 100 nF, 100 pF, and 22 pF (0402) filter capacitors be connected in parallel at the VBAT input end of the module. In addition, it is recommended that a TVS tube be connected to the VBAT input end to enhance the surge voltage bearing capability of the module. In principle, a longer VBAT cable leads to a larger trace width. Figure 3- 2 shows the reference circuit. Figure 3- 2 Power supply of the NM1 module https://www.tuya.com Page 15 of 29 Hangzhou Tuya Inc. 3.4 SIM Card Interface 3.4.1 Pins NM1 Module Hardware Design Manual Table 3- 4 Definition and description of SIM card interface signals Pin No. 11 13 12 14 Signal Name Signal Definition Remarks SIM_DATA SIM_CLK SIM_RST SIM_VDD SIM card data pin SIM card clock pin SIM card reset pin SIM card power supply pin Voltage precision: 1.8 V5%
Maximum current: about 60 mA 3.4.2 SIM Card Interface Application Figure 3- 3 SIM card interface application 2. 3. To ensure a better external SIM card performance and prevent the external SIM card being damaged, design the SIM card interface circuit in compliance with the following rules:
1. Place the external SIM card holder near the NM1 module. The external SIM card signal cable is 200 mm or shorter and is away from the RF cable and VBAT power cable. The SIM_VDD decoupling capacitance does not exceed 1 F, and the capacitor is near the external SIM card holder. To prevent interference, keep the SIM_CLK and SIM_DATA signal cables at a certain distance from each other and use a ground cable to separate them. 4. Connect the SIM_RST signal cable to the ground. To ensure a better ESD performance, you are advised to use TVS tubes to protect the pins of the external SIM card holder. The parasitic capacitance of the TVS tubes cannot be greater than 50 pF. Place ESD components near the external SIM card holder. Route the external SIM card signal cable from the external SIM card holder to the NM1 module through the ESD components. https://www.tuya.com Page 16 of 29 Hangzhou Tuya Inc. 3.5 SPIs 3.5.1 Pins NM1 Module Hardware Design Manual Table 3-7 defines the SPI signals. (SPIs support the slave mode.) Table 3- 5 SPI signal definition Pin No. 3 4 5 6 Signal Name SPI_MISO SPI_MOSI SPI_ SCLK SPI_CS Function Description Master input and slave output Master output and slave input SPI clock signal SPI selection signal 3.5.2 SPI Electrical Parameters and Application The level of the SPI on the NM1 module is 1.8 V. If the host level is 3.3 V, add a level converter between the NM1 module and host. The level converter that supports the SPI data rate is recommended. Figure 3- 4 shows the reference circuit. 3.6 I2C Interface 3.6.1 Pins Figure 3- 4 Reference circuit Table 3- 6 I2C interface signal definition Pin No. 32 33 Signal Name SDA SCL Function Description I2C serial data I2C serial clock I2C is a two-line bus for communication between ICs. It has a serial data cable (SDA) and a serial clock cable
(SCL) to transmit information between connected devices. I2C identifies each device based on its unique address and can be used as both a transmitter and a receiver. https://www.tuya.com Page 17 of 29 Hangzhou Tuya Inc. 3.6.2 I2C Interface Electrical Parameters and Application NM1 Module Hardware Design Manual Figure 3- 5 Reference circuit 3.7 UART Interface 3.7.1 Pins The NM1 module provides three UART interfaces. The primary serial interface can be used for firmware upgrade. The default baud rate is 115.2 kbit/s, and the downloading baud rate is 921.6 kbit/s. You can use a log viewing tool to view logs over the debugging serial interface to debug software. Table 3- 7 UART interface signal definition Pin No. Signal Name Function Description 17 18 28 29 38 39 RXD TXD Data receiving over the primary serial interface Data transmission over the primary serial interface UART1_RXD Data receiving over the auxiliary serial interface Data transmission over the auxiliary serial UART1_TXD RXD_DBG TXD_DBG Data receiving over the debugging serial Data transmission over the debugging serial interface interface interface 3.7.2 UART Interface Electrical Parameters and Application Figure 3- 6 Reference circuit The level of the UART interfaces on the NM1 module is 1.8 V. If the application system level is 3.3 V, add a level converter to the connection between the NM1 module and application system over the serial interface. Figure 3- 7 shows the reference circuit with a level converter, UM3202. https://www.tuya.com Page 18 of 29 Hangzhou Tuya Inc. NM1 Module Hardware Design Manual Figure 3- 7 Reference circuit with a level converter A triode can also be used for level conversion. Note: Connection methods of the debugging, auxiliary, and primary serial interfaces are similar. Figure 3- 8 Reference circuit with a triode for level conversion 3.8 USB Interface 3.8.1 Pins The NM1 module has a USB 1.1 interface, which can only be used for module upgrade. If ESD design is required, the maximum capacitance of ESD components must be less than 0.5 pF. Otherwise, waveform distortion may occur, affecting bus communication. The differential impedance of differential data cables must be within 90 ohms. Table 3- 8 USB interface signal definition Pin No. Signal Name Function Description 17 18 21 22 63 RXD TXD USB_DP USB_DM Receiving over the serial interface Transmission over the serial interface USB+ signal USB signal AVDD33_VUSB Internal USB power supply https://www.tuya.com Page 19 of 29 Hangzhou Tuya Inc. 3.8.2 USB Interface Application NM1 Module Hardware Design Manual Figure 3- 9 Downloading interface application circuit The nominated input power of the NM1 module is 3.3 V. When the USB interface is used for downloading, add an LDO circuit to keep the circuit voltage at 3.3 V. 3.9 Power-On/Power-Off and Reset Interface 3.9.1 PWRKEY Pin Table 3- 9 PWRKEY signal definition Pin No. 7 Signal Name PWRKEY Function Description NM1 module power-on 3.9.2 Power-On/Power-Off Interface Application To power on the NM1 module, lower the PWRKEY pin to a low level for a period of time and then disconnect it or raise it to a high level. Figure 3- 10 PWRKEY interface application circuit https://www.tuya.com Page 20 of 29 Hangzhou Tuya Inc. 3.9.3 RESET Pin NM1 Module Hardware Design Manual Table 3- 10 RESET signal definition Pin No. 15 Signal Name RESET Function Description NM1 module resetting To reset the NM1 module, lower the RESET pin to a low level for a period of time and then disconnect it or raise it to a high level. 3.9.4 RESET Interface Application 4 Design Instructions Figure 3- 11 RESET interface application circuit This chapter provides general design guidance about the NM1 module to ensure a better product performance. 4.1 General Design Rules and Requirements During peripheral circuit design, ensure that the external power supply have sufficient power and the differential impedance of the USB 1.1 signal cable is within 90 ohms. Design general signal interfaces as required to match the interface signal level and prevent the NM1 module being damaged due to inconsistent levels. The NM1 module has good RF indicator performance. You need to design the antenna circuit on the PCB as required and control the impedance to prevent the RF indicators being affected. 4.2 Power Supply Circuit Design The power supply on the PCB should supply 0.5 A or higher power to meet peak current requirements of the NM1 module. The trace width on the PCB must be large enough and form good circulation with the ground. In addition, add a large capacitor with over 1000 F to the power supply circuit to ensure transient power supply, and control the power ripple within 100 mV. 4.3 RF Circuit Design 34 35 36 37 GND RF_ANT GND GND https://www.tuya.com GND RF antenna GND GND N/A N/A N/A N/A 50 ohms characteristic impedance N/A N/A Page 21 of 29 N/A N/A N/A Hangzhou Tuya Inc. 4.3.1 RF Antenna Circuit Design NM1 Module Hardware Design Manual It is recommended that a -type matching circuit be reserved during RF antenna peripheral circuit design. Ensure that the matching circuit is near the antenna, and attach resistors based on actual debugging conditions. By default, no resistor is attached to C1 and C2, and a 0 ohms resistor is attached to R1. The RF antenna peripheral circuit must have 50 ohms impedance. In the recommended RF antenna peripheral circuit layout solution, the RF cable is routed at layer 1 and the reference cable at layer 2. Use the Shortcut to Si9000 software to calculate the PCB cable impedance of the RF antenna. Figure 4- 1 shows a model. During PCB cabling design, ensure that the RF reference point is complete. Figure 4- 1 Antenna impedance calculation model During impedance calculation, specify parameters shown in Figure 4- 2 and change the RF trace width to obtain the required impedance value. For typical antennas, 50-ohm impedance is recommended. https://www.tuya.com Page 22 of 29 Hangzhou Tuya Inc. NM1 Module Hardware Design Manual Figure 4- 2 Antenna PCB cabling impedance calculation data 4.3.2 Precautions for Initial Antenna Design 4.3.2.1 Pre-project Evaluation Ensure that the antenna is horizontal with the base station for maximum efficiency. Do not place the antenna near the power cable, data cable, or chip that may generate electromagnetic interference. Do not reserve a place for hands on the antenna to prevent attenuation caused by the human body. Consider radiation reduction and structure implementation. In the initial design phase, the structure, ID, circuit, and antenna engineers evaluate the antenna layout together. 4.3.2.2 Antenna Matching Circuit If a long cable exists between the RF and antenna interfaces on the NM1 module, design 50 ohms characteristics impedance for the microstrip or stripline between the RF pad and the antenna interface during PCB circuit design. In addition, reserve a matching circuit. 4.4 Suggestions on EMC and ESD Design During overall design, consider EMC issues related to signal integrity and power integrity. During peripheral circuit cabling of the NM1 module, reserve doubled trace width between the power cable and signal cable to reduce signal coupling and ensure pure return current. During peripheral power circuit design, place the decoupling capacitor near the power pin on the NM1 module, keep high-frequency and high-speed circuits and sensitive circuits away from the PCB edges, and isolate the circuits from each other to reduce interference. Protect sensitive signals, and shield circuits or components on the PCB that may interfere the NM1 module. Consider ESD protection during design. Place ESD components near the key input and output signal interfaces, for example, the SIM card signal interface, to protect them. On the PCB, reasonably design mechanical parts and PCB layout and ensure proper grounding of metal shielding covers to provide a smooth channel for static electricity discharging. 4.5 PCB Solder Pad Design You are advised to design the middle 14 pads on the PCB based on the sizes in the structure diagram. Externally extend the 52 signal pads around the PCB to the NM1 module for over 0.3 mm, and externally extend other three sides of the pads for 0.05 mm. Use 50 ohms impedance cables for the main antenna and Wi-Fi antenna. 4.6 Thermal Design The NM1 module generates heat when it works and may be affected by other high-temperature components. The NM1 module design ensures good heat dissipation. When connecting the NM1 module to the PCB, properly connect the thermal pad to the ground to ensure thermal conduction and balance and a better electrical performance. Note:
1. Place the NM1 module away from the power supply and high-speed signal cables, and protect these cables. https://www.tuya.com Page 23 of 29 2. 3. Hangzhou Tuya Inc. NM1 Module Hardware Design Manual Place the antenna and the coaxial cable that is used to connect the antenna and NIC away from these interference sources. Place the NM1 module away from components that generate a large amount of heat such as the CPU to prevent the RF performance being affected by high temperature. 5 Production Instructions 5.1 Stencil Design During stencil design, note the following:
(1) When making the stencil of the thermal pad at the bottom of the NM1 module, reduce the stencil opening by 25% to reduce short circuits between the thermal pad and functional pins around the NM1 module.
(2) To ensure better soldering, use step stencils.
(3) Use a diagonal opening for the stencil of the thermal pad. Figure 5- 1 shows recommended stencil strips. 5.2 Oven Temperature Curve Figure 5- 1 Recommended stencil strips The oven temperature curve has great impact on the soldering quality and material status. When the temperature rises from the ambient temperature to 150C, the rising speed is less than 3C per second. A temperature higher than 217C is allowed for a maximum of 70s, and 55s is recommended. Otherwise, some components may be invalid due to strong thermal attacks, resulting in a higher defect rate and more repair difficulty. The highest temperature cannot exceed 245C. Some materials such as the crystal may have die cracks at a high temperature. As a result, the crystal does not work and the module functions are affected. Table 5- 1 describes the oven temperature curve parameter settings, and Figure 5- 2 shows the oven temperature curves. Phase Preheating Heat preservation Soldering Table 5- 1 Over temperature curve parameter settings Lead-free Oven Temperature Curve Temperature From the ambient temperature to 150C 150C to 200C
> 217C
> 230C Peak temperature Description Rising speed: < 3C per second Duration: 40s to 110s Duration: 40s to 70s Duration: 15s to 45s Maximum: 245C Minimum: 230C https://www.tuya.com Page 24 of 29 Hangzhou Tuya Inc. NM1 Module Hardware Design Manual To prevent the NM1 module being damaged due to overheating, you are advised to attach the module after reflow soldering of the PCB's first side. Figure 5- 2 Over temperature curve https://www.tuya.com Page 25 of 29 Hangzhou Tuya Inc. 6 Mechanical Dimensions NM1 Module Hardware Design Manual This chapter describes the mechanical dimensions of the NM1 module, in millimeters. 6.1 NM1 Module Mechanical Dimensions Figure 6- 1 Top view (unit: mm) Figure 6- 2 Side view (unit: mm) https://www.tuya.com Page 26 of 29 Hangzhou Tuya Inc. NM1 Module Hardware Design Manual Figure 6- 3 Transparent view (unit: mm) https://www.tuya.com Page 27 of 29 Hangzhou Tuya Inc. 6.2 Recommended Package Dimensions NM1 Module Hardware Design Manual Figure 6- 4 Recommended package dimensions (unit: mm) 7 Certification FCC Statement 15.19 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful including interference that may cause undesired operation. 15.21 Note: The grantee is not responsible for any changes or modifications not expressly approved by the party responsible for compliance. Such modifications could void the users authority to operate the equipment. 15.105(b) interference. (2) This device must accept any interference received, https://www.tuya.com Page 28 of 29 Hangzhou Tuya Inc. NM1 Module Hardware Design Manual NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. RF Exposure Statement To satisfy FCC RF exposure requirements, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during device operation. To ensure compliance, operations at closer than this distance is not recommended Information for the OEM Integrators This device is intended for OEM integrators only. Please see the full grant of equipment document for restrictions. Label Information to the End User by the OEM Integrators If this certified module is installed inside the host device, then the outside of the host must be labeled with Contains FCC ID: 2ANDL-NM1. https://www.tuya.com Page 29 of 29
1 | Internal photo | Internal Photos | 235.62 KiB | December 19 2019 / December 20 2019 |
FCC ID: 2ANDL-NM1 Internal Picture Page 1 of 2 FCC ID: 2ANDL-NM1 EUT Page 2 of 2
1 | External photo | External Photos | 422.67 KiB | December 19 2019 / December 20 2019 |
FCC ID: 2ANDL-NM1 External Picture Page 1 of 3 FCC ID: 2ANDL-NM1 Page 2 of 3 FCC ID: 2ANDL-NM1 Antenna Page 3 of 3
1 | ACB-FORM-FCC-Modular-Letter Rev1 | Cover Letter(s) | 462.58 KiB | December 19 2019 / December 20 2019 |
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Request for Modular/Limited Modular Approval Date: November 29, 2019 Subject: Manufacturers Declaration for - Modular Approval
- Split Modular Approval
- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: ______(2ANDL-NM1)______ For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages 8 Basic Requirements FCC Part 15.212(a)(1) Modular Approval Requirement Requirement Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)
- YES - NO(*) Details: The module has a metal shied.Refer to the external photo of EUT. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)
- YES - NO(*) Details: Data to the modulation circuit is buffered as described in the operational description provided with the application. 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)
- YES - NO(*) Details: The module contains its own power supply regulation. Please refer to schematic filed with this application. 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)
- YES - NO(*) Details: The module has no antenna, it will use the host antenna. 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)
- YES - NO(*) Details: The module was tested stand-alone as shown in test setup photographs filed with this application 053019-02a THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see KDB Publication 784748). Modular Approval Requirement If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:
XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Requirement Met
- YES - NO(*) Details: The Module will be labeled with its own FCC ID, and the instruction on the labeling rule of the end product has been stated in the User Manual of this module. Please refer to the Label and User Manual exhibition. 7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)
- YES - NO(*) Details: The required FCC rule has been fulfilled and all the instructions for maintaining compliance have been clearly stated in the User Manual. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii)
- YES - NO(*) Details: The module meets Portable exclusion levels as shown in the RF exposure information filed with this application. 053019-02a THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Limited Module Description When Applicable
* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA;
the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details:
Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met
- Provided in Separate Cover Letter
- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >
2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.
- Provided in Separate Cover Letter
- N/A Details: <example N/A>
Split Modular Requirements Requirement 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Provided in Manual
- Provided in Separate Cover Letter
- N/A Details: <example N/A >
053019-02a THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?
- YES
- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types
(monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product a. 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 b.
- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.
- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. Sincerely, By:
(Signature/Title1) _______Xiaodong Shou_____
(Print name) 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 053019-02a
1 | FCC-Authority-Letters Rev1 | Cover Letter(s) | 30.28 KiB | December 19 2019 / December 20 2019 |
Hangzhou Tuya Information Technology Co.,Ltd Authority to Act as Agent Date: __July 1, 2019__ American Certification Body, Inc. 6731 Whittier Avenue Suite C110 McLean, VA 22101 To Whom It May Concern:
__ Intertek Testing Services Shanghai __ is authorized to act on our behalf, until otherwise notified, for applications to American Certification Body, Inc. (ACB). We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002 (b), to the application is subject to denial of federal benefits, that includes FCC benefits. Thank you, Agency Agreement Expiration Date: ____July 1, 2020_____ By:
Title:
On behalf of: ____Hangzhou Tuya Information Technology Co.,Ltd____ Telephone:
_____xiaodong shou______ ____________ _____General Manager_______ ____86-571-86581786______
(Company Name)
(Signature1)
(Print name) 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead.
1 | FCC-Confidentiality-Letters Rev1 | Cover Letter(s) | 95.51 KiB | December 19 2019 / December 20 2019 |
Hangzhou Tuya Information Technology Co.,Ltd Request for Confidentiality Date: ___July 1, 2019___ Subject: Confidentiality Request for: _____FCC ID:_2ANDL-NM1______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 9.4, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*3 Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual ____Hangzhou Tuya Information Technology Co.,Ltd__ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:
The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:
The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ___(specify number of days not to exceed 180)2___ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify ACB in the event information regarding the product or the product is made available to the public. ACB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:
IC currently only distinguishes Permanent Confidentiality exhibits as shown above. Short Term confidentiality is not considered applicable to IC applications. Sincerely, By:
(Signature/Title3) _________ ____xiaodong shou__
(Print name) 1 - The asterisked items (*) require further information to be provided to ACB before permanent confidentiality will be extended to these exhibits. Please refer to FCC KDB 726920 and the specific Document link for D01 found at:
https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=41731 and review section II, 3) regarding specific information that must accompany these requests. 2 - Please refer to http://acbcert.com/documents/misc-docs/Memo-Short-Term-Vs-Standard-Confidentiality.pdf for complete details. 3 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead.
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-12-20 | 824.1 ~ 848.9 | TNB - Licensed Non-Broadcast Station Transmitter | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2019-12-20
|
||||
1 | Applicant's complete, legal business name |
Hangzhou Tuya Information Technology Co.,Ltd
|
||||
1 | FCC Registration Number (FRN) |
0026759332
|
||||
1 | Physical Address |
Room701,Building3,More Center,No.87 GuDun Road
|
||||
1 |
Hangzhou,Zhejiang
|
|||||
1 |
China
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
h******@acbcert.com
|
||||
1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
2ANDL
|
||||
1 | Equipment Product Code |
NM1
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
x**** S********
|
||||
1 | Title |
General Manager
|
||||
1 | Telephone Number |
+86-5********
|
||||
1 | Fax Number |
+86-5********
|
||||
1 |
m******@tuya.com
|
|||||
app s | Technical Contact | |||||
1 | Firm Name |
Intertek Testing Services Limited Shanghai
|
||||
1 | Name |
E**** L********
|
||||
1 | Physical Address |
Building No.86, 1198 Qinzhou Road(North)
|
||||
1 |
Shanghai, 200233
|
|||||
1 |
China
|
|||||
1 | Telephone Number |
86 21********
|
||||
1 | Fax Number |
86 21********
|
||||
1 |
E******@intertek.com
|
|||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | TNB - Licensed Non-Broadcast Station Transmitter | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | NB IOT Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Power out is conducted at the antenna terminal. Single Modular Approval. ERP is 23.01 dBm. This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter evaluation procedures as documented in this filing. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must insure that the end user has no manual instructions to remove or install the module. For mobile and fixed operating configurations the antenna gain, including cable loss, must not exceed 3 dBi at 850 MHz as defined in 2.1091 for satisfying RF exposure compliance. Under no condition may an antenna gain be used that would exceed the ERP power limits as specified in Part 22. This device contains LTE functions that are not operational in U.S. Territories. The LTE feature supported for this device is for CAT NB2, Release 14. This module can only be used with a host antenna circuit trace layout design in strict compliance with the OEM instructions provided. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
Intertek Testing Services Shanghai
|
||||
1 | Name |
L****** X******
|
||||
1 | Telephone Number |
+86 2********
|
||||
1 |
l******@intertek.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 22H | BC | 824.10000000 | 848.90000000 | 0.1560000 | 0.1000000000 ppm | 181KG7D |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC