Global Intelligent Platform Product Manual Tuya WB1S Wi-Fi Module Version: 1.0.0 Date: 2019-11-20 No.: 0000000001 1 Product Overview WB1S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB1S also contains a low-power Arm Cortex-M4 MCU, 1T1R WLAN module, 256 KB static random-access memory (SRAM), and 2 MB flash memory, and has extensive peripherals. WB1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC) 1.1 Features processor Clock rate: 120 MHz Working voltage: 3.0 V to 3.6 V Wi-Fi connectivity 802.11b/g/n Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Up to +18 dBm output power in 802.11b mode Smart network configuration for Android and iOS devices Onboard PCB antenna with a gain of 0.5 dBi Working temperature: 20C to +85C 1 BT Support Bluetooth (V4.0) Maximum output power + 9dBm EIRP Onboard PCB antenna with a gain of 0.5 dBi Smart household and home appliances 1.2 Applications Intelligent building Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 Change History No. Date Change Description Version After Change 1 2019-11-20 This is the first release. 1.0.0 3 Contents 1 Product Overview ......................................................................................................... 1 1.1 Features ............................................................................................................. 1 1.2 Applications ....................................................................................................... 2 2 Module Interfaces ......................................................................................................... 6 2.1 Dimensions and Footprint ................................................................................. 6 2.2 Interface Pin Definition ...................................................................................... 6 2.3 Test Pin Definition .............................................................................................. 8 3 Electrical Parameters ................................................................................................... 9 3.1 Absolute Electrical Parameters ......................................................................... 9 3.2 Electrical Conditions .......................................................................................... 9 3.3 RF Current Consumption ................................................................................ 10 3.4 Working Current ............................................................................................... 11 4 RF Features ................................................................................................................ 11 4.1 Basic RF Features ........................................................................................... 11 4.2 TX Performance .............................................................................................. 12 4.3 RX Performance .............................................................................................. 12 5 Antenna Information ................................................................................................... 13 5.1 Antenna Type ................................................................................................... 13 5.2 Antenna Interference Reduction...................................................................... 13 5.3 Antenna Connector Specifications .................................................................. 13 6 Packaging Information and Production Instructions................................................... 14 6.1 Mechanical Dimensions................................................................................... 14 6.2 Recommended PCB Layout ............................................................................ 15 6.3 Production Instructions .................................................................................... 15 6.4 Recommended Oven Temperature Curve ...................................................... 17 6.5 Storage Conditions .......................................................................................... 18 4 Figure 2-1 WB1S front and rear views ......................................................................... 6 Figure 5-1 Antenna clearance part ............................................................................. 13 Figure 6-1 WB1S mechanical dimensions ................................................................. 14 Figure 6-2 Side view ................................................................................................... 14 Figure 6-3 Layout of the PCB to which WB1S applies .............................................. 15 Figure 6-4 HIC for WB1S ........................................................................................... 16 Figure 6-5 Oven temperature curve ........................................................................... 17 Table 2-1 WB1S interface pins ..................................................................................... 6 Table 2-2 WB1S test pins ............................................................................................. 8 Table 3-1 Absolute electrical parameters ..................................................................... 9 Table 3-2 Normal electrical conditions ......................................................................... 9 Table 3-3 Current consumption during constant transmission and receiving ............ 10 Table 3-4 WB1S working current ................................................................................ 11 Table 4-1 Basic RF features ....................................................................................... 11 Table 4-2 Performance during constant transmission ................................................ 12 Table 4-3 RX sensitivity .............................................................................................. 12 Figures Tables 5 2 Module Interfaces 2.1 Dimensions and Footprint WB1S has two rows of pins with a 2 mm pin spacing. The WB1S dimensions (H x W x D) are 3.0 mm x 16 mm x 24 mm. Figure 2-1 shows the WB1S front and rear views. Note: The default dimensional tolerance is 0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. Figure 2-1 WB1S front and rear views 2.2 Interface Pin Definition Table 2-1 WB1S interface pins Symbol Pin No. I/O Type Function 1 VCC P Power supply pin (3.3 V) 6 Symbol Pin No. I/O Type 2 TXD1 I/O Function 3 RXD1 I/O 4 5 6 3V3 GND P P P26 I/O 7 P24 I/O 8 TXD2 I/O 9 P8 I/O 10 P7 I/O 11 RXD2 I/O 12 P9 I/O 13 P6 I/O UART1_TXD, which is used as a user-side serial interface pin and connected to the P11 pin on the internal IC UART1_RXD, which is used as a user-side serial interface pin and connected to the P10 pin on the internal IC Power supply pin (3.3 V) Power supply reference ground pin Common I/O pin, which can be used as a hardware PWM pin and is connected to the P26 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P24 pin on the internal IC UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P8 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P7 pin on the internal IC UART0_RXD, which is used for displaying the module internal information and is connected to the P1 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P9 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P6 pin on the internal IC 14 GND P Power supply reference ground pin 7 Symbol Pin No. I/O Type Function 15 GND P Power supply reference ground pin 16 CEN I/O Chip enabling pin, which is active at a low level and is connected to the CEN pin on the internal IC 17 ADC3 AI ADC pin, which is connected to the P23 pin on the internal IC 18 GND P Power supply reference ground pin Note:
input pins. 1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog 2. CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration. 2.3 Test Pin Definition Table 2-2 WB1S test pins Pin No. Symbol I/O Type Function N/A SO I/O N/A SI I/O N/A CS I/O Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P23 or ADC3 pin on the internal IC Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P22 pin on the internal IC Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P21 pin on the internal IC 8 Pin No. Symbol I/O Type Function N/A SCK I/O Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC Note: Test pins are not recommended. 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Ts VCC Value Value 40 150 C 0.3 3.6 V Storage temperature Power supply voltage Static electricity voltage
(human body model) Static electricity voltage
(machine model) Tamb = 25C N/A 2 Tamb = 25C N/A 0.5 kV kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Maximum Unit Value Value Typical Value Ta Working temperature 20 N/A 85 C 9 Parameter Description Minimum Maximum Unit Value Value Typical Value VCC Power supply voltage 3.0 3.3 3.6 VIL I/O low-level input 0.3 N/A VCC x 0.25 VIH VOL VOH Imax I/O high-level input VCC x 0.75 N/A 3.6 I/O low-level output N/A N/A VCC x 0.1 I/O high-level output VCC x 0.8 N/A VCC I/O drive current N/A 6 15 mA V V V V V 3.3 RF Current Consumption Table 3-3 Current consumption during constant transmission and receiving Working Status Parameter Mode Rate TX Power/Receiving Typical Value Unit 802.11b 11 Mbit/s
+16 dBm 802.11g 54 Mbit/s
+14 dBm 802.11n MCS7
+13 dBm 802.11n HT40 MCS7
+13 dBm 802.11b 11 Mbit/s Constant receiving 802.11g 54 Mbit/s Constant receiving 802.11n MCS7 Constant receiving 802.11n HT40 MCS7 Constant receiving 116 222 195 185 190 98 98 98 mA mA mA mA mA mA mA mA 10 TX RX 3.4 Working Current Table 3-4 WB1S working current Working Mode Working Status (Ta = 25C) EZ The module is in EZ mode, and the Wi-Fi indicator blinks quickly. Typical Value Peak Value*
Unit 100 150 mA Connected and idle The module is connected to the network, and the Wi-Fi indicator is steady on. 50 125 mA Connected and operating The module is connected to the network, and the Wi-Fi indicator is steady on. 40 180 mA Disconnected 60 110 mA The module is disconnected from the network, and the Wi-Fi indicator is steady off. 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band BT:2.400 GHz to 2.4835 GHz WIFI:2.412 GHz to 2.484 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14Ch1-11 for US/CA,Ch1-13 for EU/CN) BT standard BT 4.0 Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7 Antenna type Onboard PCB antenna with a gain of 0.5 dBi 11 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Value Maximum Unit 11 Mbit/s N/A 16 N/A dBm 54 Mbit/s N/A 14 N/A dBm MCS7 N/A 13 N/A dBm Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error EVM under 802.11b CCK, 11 Mbit/s, 16 dBm EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm EVM under 802.11n OFDM, MCS7, 13 dBm 2 N/A 18
+2 ppm dB 30 29 25 dB 31 28 27 dB 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit 1 Mbit/s N/A 92 N/A dBm 54 Mbit/s N/A 75 N/A dBm MCS7 N/A 68 N/A dBm PER < 8%, 802.11b CCK mode PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode 12 5 Antenna Information 5.1 Antenna Type WB1S uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions shown in the following figures. Figure 5-1 Antenna clearance part 5.3 Antenna Connector Specifications WB1S does not use an antenna connector. 13 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions Figure 6-1 WB1S mechanical dimensions Figure 6-2 Side view Note: The default dimensional tolerance is 0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 14 6.2 Recommended PCB Layout Figure 6-3 Layout of the PCB to which WB1S applies Note: The default dimensional tolerance is 0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter 15
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 85%.
(2) The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-4 HIC for WB1S 3. Bake a module based on HIC status as follows when you unpack the module package:
hours.
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1 16
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve 1. Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Figure 6-5 Oven temperature curve 17 6.5 Storage Conditions 18 7 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional to operating simultaneously with other radio. testing and equipment authorization may be required The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. 19 The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WB1S.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WB1S This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 20