FCC ID: 2ANDL-WB2L Wi-Fi and Bluetooth Module

Global Intelligent Platform WB2L Datasheet Tuya WB2L Wi-Fi Module Version: 1.0.0 Date: 2019-11-07 No.: 0000000004 Product Manual 1 Product Overview WB2L is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB2L is embedded with a low-power Arm Cortex-M4 MCU, 2 MB flash memory, and 256 KB static random-access memory (SRAM), and has extensive peripherals. WB2L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application 1.1 Features processor Clock rate: 120 MHz Working voltage: 3.0 V to 3.6 V Peripherals: five GPIOs Wi-Fi connectivity 802.11b/g/n Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Up to +17.5 dBm output power in 802.11b mode STA, AP, and STA+AP working modes Smart and AP network configuration modes for Android and iOS devices Onboard PCB antenna with a gain of 1 dBi Working temperature: 20C to +105C Hangzhou Tuya Information Technology Co., Ltd. 1 V1.0.0 WB2L Datasheet BT Support Bluetooth (V4.0) Maximum output power + 7dBm EIRP Onboard PCB antenna with a gain of 1 dBi 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.0 WB2L Datasheet Change History No. Date Change Description Version After Change 1 2019-11-07 This is the first release. 1.0.0 Hangzhou Tuya Information Technology Co., Ltd. 3 V1.0.0 WB2L Datasheet Contents 1 Product Overview ......................................................................................................... 1 Features ......................................................................................................... 1 Applications .................................................................................................... 2 2 Module Interfaces ......................................................................................................... 6 Dimensions and Footprint .............................................................................. 6 Interface Pin Definition ................................................................................... 6 Test Pin Definition .......................................................................................... 7 3 Electrical Parameters ................................................................................................... 8 Absolute Electrical Parameters...................................................................... 8 Electrical Conditions ...................................................................................... 8 RF Current Consumption ............................................................................... 9 Working Current ............................................................................................. 9 4 RF Features ................................................................................................................ 10 Basic RF Features ....................................................................................... 10 TX Performance ........................................................................................... 10 RX Performance .......................................................................................... 11 5 Antenna Information ................................................................................................... 11 Antenna Type ............................................................................................... 11 Antenna Interference Reduction .................................................................. 11 6 Packaging Information and Production Instructions................................................... 11 Mechanical Dimensions ............................................................................... 11 Recommended PCB Layout ........................................................................ 13 Production Instructions ................................................................................ 14 Recommended Oven Temperature Curve ................................................... 16 Storage Conditions ...................................................................................... 17 1.1 1.2 2.1 2.2 2.3 3.1 3.2 3.3 3.4 4.1 4.2 4.3 5.1 5.2 6.1 6.2 6.3 6.4 6.5 7 MOQ and Packing Information ................................................................................... 18 8 Appendix: Statement ....................................................................... !

Hangzhou Tuya Information Technology Co., Ltd. 4 V1.0.0 WB2L Datasheet Figures Figure 2-1 WB2L front and rear views.......................................................................... 6 Figure 6-1 WB2L mechanical dimensions .................................................................. 12 Figure 6-2 Side view ................................................................................................... 12 Figure 6-3 WB2L pins ................................................................................................. 13 Figure 6-4 WB2L pin header dimensions ................................................................... 13 Figure 6-5 Layout of the PCB to which WB2L applies ............................................... 14 Figure 6-6 HIC for WB2L ............................................................................................ 15 Figure 6-7 Oven temperature curve ........................................................................... 16 Tables Table 2-1 WB2L interface pins ..................................................................................... 6 Table 2-2 WB2L test pins .............................................................................................. 7 Table 3-1 Absolute electrical parameters ..................................................................... 8 Table 3-2 Normal electrical conditions ......................................................................... 8 Table 3-3 Current consumption during constant transmission and receiving .............. 9 Table 3-4 WB2L working current .................................................................................. 9 Table 4-1 Basic RF features ....................................................................................... 10 Table 4-2 Performance during constant transmission ................................................ 10 Table 4-3 RX sensitivity .............................................................................................. 11 Hangzhou Tuya Information Technology Co., Ltd. 5 V1.0.0 WB2L Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint WB2L has two rows of pins with a 20.1 mm pin spacing. The WB2L dimensions (H x W x D) are 2.80.15 mm x 17.30.35 mm x 150.35 mm. Figure 2-1 shows the WB2L front and rear views. Figure 2-1 WB2L front and rear views 1 2 3 2.2 Interface Pin Definition Table 2-1 WB2L interface pins Pin No. Symbol I/O Type Function PWM2 I/O Hardware PWM pin, which is connected to BT_ACTIVE/PWM2 (pin 24) on the internal IC PWM1 I/O Hardware PWM pin, which is connected to WIFI_ACTIVE/PWM1 (pin 23) on the internal IC PWM0 I/O Hardware PWM pin, which is connected to CLK13M/PWM0

(pin 22) on the internal IC Hangzhou Tuya Information Technology Co., Ltd. 6 V1.0.0 WB2L Datasheet Pin No. Symbol I/O Type Function PWM5 I/O Hardware PWM pin, which is connected to IRDA/PWM5 (pin 15) on the internal IC 4 5 6 7 PWM4 I/O GND 3V3 P P Hardware PWM pin, which is connected to LPO_CLK/PWM4

(pin 16) on the internal IC Power supply reference ground pin Power supply pin (3.3 V) Note: P indicates power supply pins, and I/O indicates input/output pins. 2.3 Test Pin Definition Table 2-2 WB2L test pins Pin No. Symbol I/O Type Function N/A N/A GND RST P Input N/A U1_TXD I/O N/A U1_RXD I/O Power supply reference ground pin Hardware reset pin (It is at a high level by default and is active at a low level.) UART1_TX, which is used as a user-side serial interface pin UART2_RX, which is used as a user-side serial interface pin N/A N/A N/A U2_TXD U2_RXD F_SCK I/O I/O I/O Log TX pin Log RX pin N/A F_CSN I/O N/A F_SI I/O N/A F_SO I/O Note: Test pins are not recommended. Clock pin when data is downloaded from the flash memory Command enabling pin when data is downloaded from the flash memory Data input pin when data is downloaded from the flash memory Data output pin when data is downloaded from the flash memory Hangzhou Tuya Information Technology Co., Ltd. 7 V1.0.0 WB2L Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Ts VBAT Static electricity voltage

(human body model) Static electricity voltage

(machine model) Value Value 40 105 3.0 3.6 Storage temperature Power supply voltage Tamb = 25C N/A 2 Tamb = 25C N/A 0.5 C V kV kV VIL VIH VOL VOH Imax 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Maximum Unit Value Value Typical Value Ta Working temperature 40 VBAT Power supply voltage 3.0 105 3.6 N/A 3.3 N/A I/O low-level input 0.3 VCC x 0.25 I/O high-level input VCC x 0.75 N/A VCC I/O low-level output N/A N/A VCC x 0.1 I/O high-level output VCC x 0.8 N/A VCC I/O drive current N/A N/A 12 mA C V V V V V Hangzhou Tuya Information Technology Co., Ltd. 8 V1.0.0 WB2L Datasheet 3.3 RF Current Consumption Table 3-3 Current consumption during constant transmission and receiving Working Status Parameter Mode Rate TX Power/

Receiving 802.11b 11 Mbit/s

+17 dBm TX 802.11g 54 Mbit/s

+13.5 dBm 802.11n MCS7

+13 dBm 802.11b 11 Mbit/s Typical Value Maximum Value Unit 295 266 260 98 354 300 290 100 mA mA mA mA RX 802.11g 54 Mbit/s 98 100 mA 802.11n MCS7 98 100 mA Constant receiving Constant receiving Constant receiving 3.4 Working Current Table 3-4 WB2L working current Working Status (Ta = 25C) Average Maximum Unit Value Value Working Mode EZ AP The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and the Wi-Fi indicator blinks slowly. Connected The module is connected to the network, and the Wi-Fi indicator is steady on. Disconnected The module is disconnected from the network, and the Wi-Fi indicator is steady off. 98 53 60 40 100 mA 125 mA 170 mA 88 mA Hangzhou Tuya Information Technology Co., Ltd. 9 V1.0.0 WB2L Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band BT:2.400 GHz to 2.4835 GHz WIFI:2.412 GHz to 2.484 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14Ch1-11 for US/CA,Ch1-13 for EU/CN) BT standard BT 4.0 Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7 Antenna type Onboard PCB antenna with a gain of 1 dBi 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Unit Value 11 Mbit/s N/A 17 N/A dBm 54 Mbit/s N/A 13.5 N/A dBm MCS7 N/A 12 N/A dBm Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error 10 N/A

+10 ppm Hangzhou Tuya Information Technology Co., Ltd. 10 V1.0.0 WB2L Datasheet 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit 11 Mbit/s N/A 85 N/A dBm 54 Mbit/s N/A 72 N/A dBm MCS7 N/A 68 N/A dBm PER < 8%, 802.11b DSSS mode PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode 5 Antenna Information 5.1 Antenna Type WB2L uses an onboard PCB antenna or external antenna with an I-PEX connector. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. For details about the onboard PCB antenna area on WB2L, see Figure 6-1. 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions The PCB dimensions (H x W x D) are 2.80.15 mm x 17.30.35 mm x 150.35 mm. Hangzhou Tuya Information Technology Co., Ltd. 11 V1.0.0 WB2L Datasheet Figure 6-1 WB2L mechanical dimensions Figure 6-2 Side view Hangzhou Tuya Information Technology Co., Ltd. 12 V1.0.0 WB2L Datasheet 6.2 Recommended PCB Layout Figure 6-3 WB2L pins WB2L can be mounted onto a PCB by using an SMT placement machine or connected to the PCB through a pin header. Figure 6-4 shows the pin header dimensions. Figure 6-4 WB2L pin header dimensions Hangzhou Tuya Information Technology Co., Ltd. 13 V1.0.0 WB2L Datasheet Figure 6-5 Layout of the PCB to which WB2L applies 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.

(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter

(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:

(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%. Hangzhou Tuya Information Technology Co., Ltd. 14 V1.0.0 WB2L Datasheet

(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

(3) The package contains a humidity indicator card (HIC). Figure 6-6 HIC for WB2L package:

hours. 3. Bake a module based on HIC status as follows when you unpack the module

(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive

(2) If the 30% circle is pink, bake the module for 4 consecutive hours.

(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:

(1) Baking temperature: 1255C

(2) Alarm temperature: 130C

(3) SMT placement ready temperature after natural cooling: < 36C

(4) Number of drying times: 1

(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent Hangzhou Tuya Information Technology Co., Ltd. 15 V1.0.0 WB2L Datasheet batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve 1. Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Figure 6-7 Oven temperature curve Hangzhou Tuya Information Technology Co., Ltd. 16 V1.0.0 WB2L Datasheet 6.5 Storage Conditions Hangzhou Tuya Information Technology Co., Ltd. 17 V1.0.0 WB2L Datasheet 7 MOQ and Packing Information MOQ and Packing Information Product Model MOQ Packing Method Number of Modules in Each Reel Pack Number of Reel Packs in Each Box WB2L 4000 1000 4 Carrier tape and reel packing Hangzhou Tuya Information Technology Co., Ltd. 18 V1.0.0 WB2L Datasheet 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional to operating simultaneously with other radio. testing and equipment authorization may be required The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. Hangzhou Tuya Information Technology Co., Ltd. 19 V1.0.0 WB2L Datasheet The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WB2L.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WB2L This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. Hangzhou Tuya Information Technology Co., Ltd. 20 V1.0.0

Hangzhou Tuya Information Technology Co.,Ltd Room701,Building3,More Center,No.87 GuDun Road,Hangzhou,Zhejiang China Tel: +86-571-86581786; Fax: +86-571-86581786

: Certification Application Date: January 13, 2020 Federal Communications Commission Authorization and Evaluation Division RE FCC ID : 2ANDL-WB2L To Whom It May Concern, Pursuant to sections 0.457 and 0.459 of CFR 47, Public Notice DA 04-1705 of the Commissions policy and to avoid premature release of sensitive information prior to marketing or release of the product to the public, the applicant requests the following documents contained in this certification application be temporarily withheld from public disclosure for an initial period of 180 days:

External Photos Internal Photos Test set-up photos Users Manual The application contains technical information, which Hangzhou Tuya Information Technology Co.,Ltd deems to be trade secrets and proprietary. If made public, the information might be used to the disadvantage of the applicant in the market place. The Applicant understands that pursuant to Rule 0.457, disclosure of this Application and all accompanying documentation will not be made before the date of the Grant for this application Sincerely, ____ Contact Person: xiaodong Shou Company: Hangzhou Tuya Information Technology Co.,Ltd TEL: +86-571-86581786 FAX: +86-571-86581786 1/2 E-mail: mikeshou@tuya.com 2/2