Global Intelligent Platform WB2S Datasheet Product Manual Tuya WB2S Wi-Fi Module Version: 1.0.0 Date: 2019-11-23 No.: 0000000001 1 Product Overview WB2S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231D) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB2S also contains a low-power Arm Cortex-M4 microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB2S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application 1.1 Features processor Clock rate: 120 MHz Working voltage: 3.0 V to 3.6 V Peripherals: five GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC) Wi-Fi connectivity 802.11b/g/n20/n40 Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Up to +16 dBm output power in 802.11b mode EZ net pairing mode for Android and iOS devices Onboard PCB antenna 1 WB2S Datasheet Certified by CE and FCC Working temperature: 20C to +85C BT Support Bluetooth (V4.0) Maximum output power + 7dBm EIRP Onboard PCB antenna with a gain of -1 dBi 1.2 Application Scenarios Intelligent building Smart household and home appliances Healthcare Industrial wireless control Baby monitor Network camera Intelligent bus Change History No. Date Change Description Version After Change 2019-11-23 This is the first release. 1.0.0 1 2 WB2S Datasheet Contents 1 Product Overview ............................................................................................................. 1 1.1 Features .................................................................................................................. 1 1.2 Application Scenarios ............................................................................................. 2 2 Module Interfaces ............................................................................................................. 6 2.1 Dimensions and Footprint ...................................................................................... 6 2.2 Interface Pin Definition ........................................................................................... 6 3 Electrical Parameters ........................................................................................................ 7 3.1 Absolute Electrical Parameters .............................................................................. 7 3.2 Working Conditions ................................................................................................ 8 3.3 TX Current Consumption ........................................................................................ 9 3.4 RX Current Consumption ....................................................................................... 9 3.5 Working Current ..................................................................................................... 9 4 RF Features .................................................................................................................... 10 4.1 Basic RF Features ................................................................................................ 10 4.2 WB2S TX Power ................................................................................................... 11 4.3 WB2S RX Sensitivity ............................................................................................ 11 5 Antenna Information ........................................................................................................ 12 5.1 Antenna Type ........................................................................................................ 12 5.2 Antenna Interference Reduction ........................................................................... 12 5.3 Antenna Connector Specifications ....................................................................... 13 6 Packaging Information and Production Instructions ....................................................... 13 6.1 Mechanical Dimensions ....................................................................................... 13 6.2 Recommended PCB Layout ................................................................................. 14 6.3 Production Instructions ......................................................................................... 14 6.4 Recommended Oven Temperature Curve ........................................................... 16 6.5 Storage Conditions ............................................................................................... 17 3 WB2S Datasheet 7. Reference Circuit ........................................................................................................... 18 7.1 Schematic Diagram .............................................................................................. 18 8 MOQ and Packing Information ....................................................................................... 19 4 WB2S Datasheet Figures Figure 2-1 WB2S front and rear views ................................................................................ 6 Figure 5-1 Antenna clearance part .................................................................................... 12 Figure 6-1 WB2S mechanical dimensions ........................................................................ 13 Figure 6-2 WB2S pins ........................................................................................................ 14 Figure 6-3 Top and bottom views of the PCB to which WB2S applies .............................. 14 Figure 6-4 HIC for WB2S ................................................................................................... 15 Figure 6-5 Oven temperature curve .................................................................................. 16 Figure 7-1 WB2S schematic diagram ................................................................................ 18 Tables Table 2-1 WB2S interface pins ............................................................................................ 6 Table 3-1 Absolute electrical parameters ............................................................................ 7 Table 3-2 Normal working conditions ................................................................................... 8 Table 3-3 Current consumption during constant transmission ............................................ 9 Table 3-4 Current consumption during constant receiving .................................................. 9 Table 3-5 WB2S working current ......................................................................................... 9 Table 4-1 Basic RF features .............................................................................................. 10 Table 4-2 Power during constant transmission.................................................................. 11 Table 4-3 RX sensitivity ..................................................................................................... 11 Table 8-1 Packing information ........................................................................................... 19 5 WB2S Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint WB2S has two rows of pins with a 2 mm pin spacing. The WB2S dimensions (H x W x D) are 3.3 mm x 15 mm x 18 mm. Figure 2-1 shows the WB2S front and rear views. Figure 2-1 WB2S front and rear views Note:
The default dimensional tolerance is 0.35 mm, and the tolerance for some measurements is 0.1 mm. The PCB thickness is 1.00.1 mm. 2.2 Interface Pin Definition Table 2-1 WB2S interface pins Pin No. Symbol I/O Type Function 1 2 3 4 VBAT P Power supply pin (3.3 V), which is connected to the VBAT pin on the internal IC PWM2 I/O Common GPIO, which is connected to the P8 pin on the internal IC GND P Power supply reference ground pin PWM1 I/O Common GPIO, which is connected to the P7 pin on the internal IC 6 WB2S Datasheet Pin No. Symbol I/O Type Function 5 RX I/O UART1_RXD, which is used as a user-side serial interface pin and is connected to the P10 pin on the internal IC 6 PWM0 I/O Common GPIO, which is connected to the P6 pin on the internal IC 7 8 9 TX I/O UART1_TXD, which is used as a user-side serial interface pin and is connected to the P11 pin on the internal IC AD AI ADC pin, which is connected to the P23 pin on the internal IC PWM4 I/O Common GPIO, which is connected to the P24 pin on the internal IC 10 CEN I/O External enabled reset pin, which is active at a low level and is connected to the CEN pin on the internal IC 11 PWM5 I/O Common GPIO, which is connected to the P26 pin on the internal IC Note:
P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin. 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Ts VCC Storage temperature Power supply voltage 7 Value Value 20 85 C 0.3 3.6 V WB2S Datasheet Parameter Description Minimum Maximum Unit Value Value Static electricity voltage
(human body model) Static electricity voltage
(machine model) Tamb = 25C N/A 2 kV Tamb = 25C N/A 0.5 kV 3.2 Working Conditions Table 3-2 Normal working conditions Parameter Description Minimum Maximum Unit Value Value Typical Value 20 N/A 85 C Ta VCC VIL Working temperature Power supply voltage I/O low-level 3.0 3.3 3.6 0.3 N/A V V V VCC x 0.25 VCC x 0.1 VIH high-level VCC x 0.75 N/A VCC V VOL I/O low-level N/A N/A VOH high-level VCC x 0.8 N/A VCC V Imax Cpad I/O drive current Input pin capacitance N/A N/A 12 mA N/A 2 N/A pF input I/O input output I/O output 8 WB2S Datasheet 3.3 TX Current Consumption Table 3-3 Current consumption during constant transmission Symbol Mode Power Typical Value Unit IRF IRF IRF IRF IRF IRF IRF IRF 802.11b 11 Mbit/s 802.11g 54 Mbit/s 16 dBm 15 dBm 15 dBm 14 dBm 802.11n BW20 13 dBm MCS7 12 dBm 802.11n BW40 12 dBm MCS7 11 dBm 222 215 210 195 200 185 190 190 mA mA mA mA mA mA mA mA 3.4 RX Current Consumption Table 3-4 Current consumption during constant receiving Symbol Mode Typical Value Unit IRF IRF CPU sleep CPU active 50 95 mA mA 3.5 Working Current Table 3-5 WB2S working current Working Mode EZ AP Working Status (Ta = 25C) Average Maximum Unit Value Value The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and 100 50 170 mA 125 mA 9 Working Mode Working Status (Ta = 25C) Average Maximum Unit Value Value WB2S Datasheet Connected 40 180 mA Disconnected 60 110 mA the Wi-Fi indicator blinks slowly. The module is connected to the network, and the Wi-Fi indicator is steady on. The module is disconnected from the network, and the Wi-Fi indicator is steady off. 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band BT:2.400 GHz to 2.4835 GHz WIFI:2.412 GHz to 2.484 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14Ch1-11 for US/CA,Ch1-13 for EU/CN) BT standard BT 4.0 Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7 Antenna type PCB antenna with a gain of -1.0 dBi 10 WB2S Datasheet 4.2 WB2S TX Power Table 4-2 Power during constant transmission Parameter Minimum Value Typical Value Maximum Unit Value 1 Mbit/s N/A 16 N/A dBm Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error 54 Mbit/s N/A 14 N/A dBm MCS7 N/A 12 N/A dBm EVM under 802.11b CCK, 11 Mbit/s, 16 dBm EVM under 802.11g OFDM, 54 Mbit/s, 14.0 dBm EVM under 802.11n OFDM, MCS7, 13 dBm 2
+2 ppm N/A 23 27 28 dB dB dB 4.3 WB2S RX Sensitivity Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit PER < 8%, 802.11b CCK mode PER < 10%, 802.11g OFDM mode 1 Mbit/s N/A 91 N/A dBm 54 Mbit/s N/A 75 N/A dBm PER < 10%, 802.11n MCS7 N/A 68 N/A dBm 11 WB2S Datasheet OFDM mode 5 Antenna Information 5.1 Antenna Type WB2S uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance. Figure 5-1 Antenna clearance part 12 WB2S Datasheet Note:
For details about the onboard PCB antenna area on WB2S, see Figure 6-1. The default dimensional tolerance is 0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 5.3 Antenna Connector Specifications WB2S does not use an antenna connector. 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions Figure 6-1 WB2S mechanical dimensions 13 Note:
WB2S Datasheet The default dimensional tolerance is 0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.2 Recommended PCB Layout Figure 6-2 WB2S pins Figure 6-3 Top and bottom views of the PCB to which WB2S applies 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine 14 WB2S Datasheet ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 85%.
(2) The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-4 HIC for WB2S package:
hours. 3. Bake a module based on HIC status as follows when you unpack the module
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C 15 WB2S Datasheet
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. Figure 6-5 Oven temperature curve 16 WB2S Datasheet 6.5 Storage Conditions 17 WB2S Datasheet 7. Reference Circuit 7.1 Schematic Diagram Figure 7-1 WB2S schematic diagram 18 WB2S Datasheet 8 MOQ and Packing Information Table 8-1 Packing information MOQ and packing information Product Model MOQ Packing Method WB2S 4000 Carrier tape and reel packing Number of Modules in Each Number of Reel Packs in Each Reel Pack 1000 Box 4 19 WB2S Datasheet Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. 20 WB2S Datasheet The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WB2S.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WB2S This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 21