Global Intelligent Platform WB3S Datasheet Tuya WB3S Wi-Fi Module Version: 1.0.0 Date: 2019-11-22 No.: 0000000001 Product Manual 1. Product Overview WB3S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3S also contains a low-power Arm Cortex-M4 microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB3S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC) 1.1 Features processor Clock rate: 120 MHz Working voltage: 3.0 V to 3.6 V Wi-Fi connectivity 802.11b/g/n Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Up to +20 dBm output power in 802.11b mode EZ net pairing mode for Android and iOS devices Onboard PCB antenna with a gain of 1.5 dBi 1 WB3S Datasheet Working temperature: 20C to +85C BT Support Bluetooth (V4.0) Maximum output power + 7dBm Onboard PCB antenna with a gain of 1.5 dBi Smart household and home appliances 1.2 Applications Intelligent building Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 WB3S Datasheet Change History No. Date Change Description Version After Change 1 2019-11-22 This is the first release. 1.0.0 3 WB3S Datasheet Contents 1. Product Overview ............................................................................................................ 1 1.1 Features .................................................................................................................. 1 1.2 Applications ............................................................................................................ 2 2 Module Interfaces ............................................................................................................. 6 2.1 Dimensions and Footprint ...................................................................................... 6 2.2 Interface Pin Definition ........................................................................................... 6 2.3 Test Pin Definition ................................................................................................... 8 3 Electrical Parameters ........................................................................................................ 9 3.1 Absolute Electrical Parameters .............................................................................. 9 3.2 Electrical Conditions ............................................................................................... 9 3.3 RF Current Consumption ..................................................................................... 10 3.4 Working Current ................................................................................................... 10 4 RF Features .................................................................................................................... 11 4.1 Basic RF Features ................................................................................................ 11 4.2 TX Performance ................................................................................................... 11 4.3 RX Performance ................................................................................................... 12 5 Antenna Information ........................................................................................................ 13 5.1 Antenna Type ........................................................................................................ 13 5.2 Antenna Interference Reduction ........................................................................... 13 5.3 Antenna Connector Specifications ....................................................................... 13 6 Packaging Information and Production Instructions ....................................................... 14 6.1 Mechanical Dimensions ....................................................................................... 14 6.2 Recommended PCB Layout ................................................................................. 15 6.3 Production Instructions ......................................................................................... 16 6.4 Recommended Oven Temperature Curve ........................................................... 18 6.5 Storage Conditions ............................................................................................... 19 4 WB3S Datasheet Figures Figure 2-1 WB3S front and rear views ................................................................................ 6 Figure 5-1 Antenna clearance part .................................................................................... 13 Figure 6-1 WB3S mechanical dimensions ........................................................................ 14 Figure 6-2 Side view .......................................................................................................... 15 Figure 6-3 Layout of the PCB to which WB3S applies ...................................................... 15 Figure 6-4 HIC for WB3S ................................................................................................... 16 Figure 6-5 Oven temperature curve .................................................................................. 18 Tables Table 2-1 WB3S interface pins ............................................................................................ 6 Table 2-2 WB3S test pins .................................................................................................... 8 Table 3-1 Absolute electrical parameters ............................................................................ 9 Table 3-2 Normal electrical conditions ................................................................................. 9 Table 3-3 Power consumption during constant transmission and receiving ..................... 10 Table 3-4 WB3S working current ....................................................................................... 10 Table 4-1 Basic RF features .............................................................................................. 11 Table 4-2 Performance during constant transmission ....................................................... 11 Table 4-3 RX sensitivity ..................................................................................................... 12 5 WB3S Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint WB3S has two rows of pins with a 2 mm pin spacing. The WB3S dimensions (H x W x D) are 3.5 mm x 16 mm x 24 mm. Figure 2-1 shows the WB3S front and rear views. Note:
The default dimensional tolerance is 0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. Figure 2-1 WB3S front and rear views 1 2 2.2 Interface Pin Definition Table 2-1 WB3S interface pins Pin No. Symbol I/O Type Function CEN I/O Chip enabling pin, which is active at a low level and is connected to the CEN pin on the internal IC ADC3 AI ADC pin, which is connected to the P23 pin on the internal IC 6 WB3S Datasheet Pin No. Symbol I/O Type Function EN Input Enabling pin, which is internally pulled up and compatible with other module design P14 I/O PWM5 I/O PWM4 I/O PWM0 I/O VCC GND P P Common GPIO, which is connected to the P14 pin on the internal IC GPIOP_26, which is connected to the P26 pin on the internal IC GPIOP_24, common GPIO, which is connected to the P24 pin on the internal IC GPIOP_6, which is connected to the P6 pin on the internal IC Power supply pin (3.3 V) Power supply reference ground pin 10 PWM1 I/O GPIOP_7, which is connected to the P7 pin on the internal IC 11 TXD2 I/O 12 RXD2 I/O UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC UART0_RXD, which is used to display the module internal information and connected to the P1 pin on the internal IC 13 PWM3 I/O GPIOP_9, common GPIO, which is connected to the P9 pin on the internal IC 14 PWM2 I/O GPIOP_8, which is connected to the P8 pin on the internal IC RXD1 I/O TXD1 I/O UART1_RXD, which is used as a user-side serial interface pin and is connected to the P10 pin on the internal IC UART1_TXD, which is used as a user-side serial interface pin and is connected to the P11 pin on the internal IC 3 4 5 6 7 8 9 15 16 7 WB3S Datasheet Note:
analog input pins. 1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates 2. CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration. 3. UART1 is a user-side serial interface pin, which generates information when the module is powered on and starts. 2.3 Test Pin Definition Table 2-2 WB3S test pins Pin No. Symbol I/O Type Function N/A SO I/O Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P23 or ADC3 pin on the internal IC Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P22 pin on the internal IC Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P21 pin on the internal IC Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC N/A SI I/O N/A CS I/O N/A SCK I/O Note:
Test pins are not recommended. 8 WB3S Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value 40 150 0.3 3.6 Storage temperature Power supply voltage Static electricity voltage
(human body model) Static electricity voltage
(machine model) Tamb = 25C N/A Tamb = 25C N/A 2 0.5 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Maximum Unit Value Value Typical Value 20 N/A 85 C Working temperature Power supply voltage I/O low-level input I/O high-level input I/O low-level output 3.0 3.3 3.6 0.3 N/A VCC x 0.75 N/A 3.6 N/A N/A VCC x 0.25 VCC x 0.1 9 VOH I/O high-level VCC x 0.8 N/A VCC Ts VCC Ta VCC VIL VIH VOL C V kV kV V V V V V WB3S Datasheet Parameter Description Minimum Maximum Unit Value Value Typical Value output Imax I/O drive current N/A 6 15 mA Working Status TX RX 3.3 RF Current Consumption Table 3-3 Power consumption during constant transmission and receiving Parameter Typical Value Unit Mode Rate TX Power/Receiving 802.11b 11 Mbit/s
+16 dBm 802.11g 54 Mbit/s
+14 dBm 802.11n MCS7
+12 dBm 802.11n HT40 MCS7
+12 dBm 802.11b 11 Mbit/s Constant receiving 802.11g 54 Mbit/s Constant receiving 802.11n MCS7 Constant receiving 802.11n HT40 MCS7 Constant receiving 116 222 195 185 190 98 98 98 mA mA mA mA mA mA mA mA 3.4 Working Current Working Mode EZ Table 3-4 WB3S working current Working Status (Ta = 25C) The module is in EZ mode, and the Wi-Fi indicator blinks quickly. Typical Value Peak Value*
Unit 100 170 mA Connected and idle The module is connected to the network, and the Wi-Fi indicator is steady on. 50 125 mA Connected The module is connected to the network, 40 180 mA 10 Working Mode and operating Disconnect ed Working Status (Ta = 25C) and the Wi-Fi indicator is steady on. WB3S Datasheet Typical Value Peak Value*
Unit The module is disconnected from the network, and the Wi-Fi indicator is steady off. 60 110 mA 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band Wi-Fi standard BT:2.400 GHz to 2.4835 GHz WIFI:2.412 GHz to 2.484 GHz IEEE 802.11b/g/n (channels 1 to 14Ch1-11 for US/CA,Ch1-13 for EU/CN) BT standard BT 4.0 Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7 Antenna type Onboard PCB antenna with a gain of 1.5 dBi 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Value Maximum Unit Average RF output power, 11 Mbit/s N/A 16 N/A dBm 11 Parameter 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error WB3S Datasheet Minimum Value Typical Value Value Maximum Unit 54 Mbit/s N/A 14 N/A dBm MCS7 N/A 13 N/A dBm EVM under 802.11b CCK, 11 Mbit/s, 17 dBm EVM under 802.11g OFDM, 54 Mbit/s, 11 dBm EVM under 802.11n OFDM, MCS7, 10 dBm 2 N/A 23
+2 ppm dB 26 27 29 dB 26 27 29 dB 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit PER < 8%, 802.11b CCK mode 1 Mbit/s N/A 92 N/A dBm PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode 54 Mbit/s N/A 75 N/A dBm MCS7 N/A 68 N/A dBm PER < 10%,BT 1M 95 12 WB3S Datasheet 5 Antenna Information 5.1 Antenna Type WB3S uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions, as shown in Figure 5-1. Figure 5-1 Antenna clearance part 5.3 Antenna Connector Specifications WB3S does not use an antenna connector. 13 WB3S Datasheet 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions Figure 6-1 WB3S mechanical dimensions 14 WB3S Datasheet Figure 6-2 Side view Note:
The default dimensional tolerance is 0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.2 Recommended PCB Layout Figure 6-3 Layout of the PCB to which WB3S applies 15 Note:
WB3S Datasheet The default dimensional tolerance is 0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 85%.
(2) The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-4 HIC for WB3S 16 package:
hours. 3. Bake a module based on HIC status as follows when you unpack the module WB3S Datasheet
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 17 WB3S Datasheet 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Figure 6-5 Oven temperature curve 18 WB3S Datasheet 6.5 Storage Conditions 19 WB3S Datasheet Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. 20 WB3S Datasheet The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WB3S.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WB3S This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 21