Global Intelligent Platform Product Manual Tuya WBR2 Wi-Fi and Bluetooth Module Version: 2.0.0 Date: 2019-10-28 No.: 0000000001 1. Product Overview WBR2 is a low-power embedded Wi-Fi and Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip (RTL8720CF) with an embedded Wi-Fi network protocol stack and robust library functions. WBR2 also contains a low-power KM4 microcontroller unit (MCU), a WLAN MAC, a 1T1R capable WLAN baseband, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WBR2 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi and Bluetooth products as required. Figure 1-1 shows the WBR2 architecture. Figure 1-1 WBR2 architecture 1 WBR2 Datasheet 1.1 Features Embedded low-power KM4 MCU, which can also function as an application processor Clock rate: 100 MHz Working voltage: 3.0 V to 3.6 V Peripherals: six GPIOs and one universal asynchronous receiver/transmitter (UART) Wi-Fi connectivity 802.11b/g/n20 Channels 1 to 14 at 2.4 GHz Compatible with Bluetooth low energy (BLE) 4.2(Up to +9dBm EIPR output power) WPA and WPA2 security modes Up to +20 dBm EIRP output power in 802.11b mode EZ net pairing mode for Android and iOS devices Onboard PCB antenna Certified by CE, FCC, and SRRC Working temperature: 20C to +85C 1.2 Application Scenarios Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 WBR2 Datasheet Change History No. 1 Date Change Description Version After Change 2019-10-28 This is the first release. 2.0.0 3 WBR2 Datasheet Contents 1. Product Overview........................................................................................................................ 1 1.1 Features.............................................................................................................................. 2 1.2 Application Scenarios....................................................................................................... 2 2. Module Interfaces........................................................................................................................ 6 2.1 Dimensions and Footprint................................................................................................6 2.2 Interface Pin Definition..................................................................................................... 6 3. Electrical Parameters..................................................................................................................7 3.1 Absolute Electrical Parameters.......................................................................................7 3.2 Working Conditions...........................................................................................................8 3.3 RF Current Consumption................................................................................................. 8 3.4 Working Current.................................................................................................................9 4. RF Features................................................................................................................................10 4.1 Basic RF Features.......................................................................................................... 10 4.2 TX Performance.............................................................................................................. 10 4.3 RX Performance.............................................................................................................. 11 5. Antenna Information.................................................................................................................. 11 5.1 Antenna Type................................................................................................................... 11 5.2 Antenna Interference Reduction................................................................................... 11 6. Packaging Information and Production Instructions............................................................ 11 6.1 Mechanical Dimensions................................................................................................. 11 6.2 Recommended PCB Layout..........................................................................................12 6.3 Production Instructions...................................................................................................13 6.4 Recommended Oven Temperature Curve and Soldering Temperature................ 14 6.5 Storage Conditions......................................................................................................... 16 7. MOQ and Packing Information................................................................................................18 8. Appendix: Statement.................................................................................................................19 4 WBR2 Datasheet Tables Table 2-1 WBR2 interface pins.............................................................................................. 6 Table 3-1 Absolute electrical parameters.............................................................................7 Table 3-2 Normal working conditions....................................................................................8 Table 3-3 Current consumption during constant transmission.........................................8 Table 3-4 Current consumption during constant receiving............................................... 9 Table 3-5 Working current.......................................................................................................9 Table 4-1 Basic RF features.................................................................................................10 Table 4-2 Performance during constant transmission..................................................... 10 Table 4-3 RX sensitivity.........................................................................................................11 Table 6-1 Recommended wave soldering temperature.................................................. 15 Figures Figure 1-1 WBR2 architecture............................................................................................... 1 Figure 2-1 WBR2 front and rear views.................................................................................6 Figure 6-1 WBR2 mechanical dimensions........................................................................ 12 Figure 6-2 WBR2 pins...........................................................................................................12 Figure 6-3 Top and bottom views of the PCB to which WBR2 applies.........................13 Figure 6-4 Oven temperature curve................................................................................... 15 Figure 6-5 HIC for WBR2..................................................................................................... 16 5 WBR2 Datasheet 2. Module Interfaces 2.1 Dimensions and Footprint WBR2 has two rows of pins with a 2 mm pin spacing. The WBR2 dimensions (H x W x D) are 2.90.15 mm x 150.35 mm x 180.35 mm. Figure 2-1 shows the WBR2 front and rear views. Figure 2-1 WBR2 front and rear views 2.2 Interface Pin Definition Table 2-1 WBR2 interface pins Pin No. Symbol I/O Type Function 1 2 3V3 A19 N/A I/O Power supply pin (3.3 V) GPIOA_19, hardware PWM pin, which is connected to pin 40 on the internal IC 6 Pin No. Symbol I/O Type Function WBR2 Datasheet GND A18 A13 A17 A14 A20 A12 EN A11 P I/O I/O I/O I/O I/O I/O I/O I/O Power supply reference ground pin GPIOA_18, hardware PWM pin, which is connected to pin 39 on the internal IC GPIOA_13, user-side serial interface pin
(UART0_RXD) GPIOA_17, hardware PWM pin, which is connected to pin 38 on the internal IC GPIOA_14, user-side serial interface pin
(UART0_TXD) GPIOA_20, common GPIO, which is connected to pin 1 on the internal IC GPIOA_12, hardware PWM pin, which is connected to pin 26 on the internal IC Enable pin, which is active at a high level (The pin has been pulled up and is externally controllable.) GPIOA_11, hardware PWM pin, which is connected to pin 25 on the internal IC 3 4 5 6 7 8 9 10 11 Note:
P indicates a power supply pin, and I/O indicates an input/output pin. 3. Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Ts VDD Storage temperature Power supply voltage 40 0.3 105 3.6 Unit C V 7 WBR2 Datasheet Parameter Description Static electricity voltage
(human body model) Static electricity voltage
(machine model) Tamb = 25C Tamb = 25C Minimum Value Maximum Value N/A N/A 2 0.5 3.2 Working Conditions Table 3-2 Normal working conditions Parameter Description Minimum Value Typical Value Maximum Value Ta VDD VIL VIH VOL VOH Imax Cpad Working temperature Working voltage I/O low-level input I/O high-level input I/O low-level output I/O high-level output I/O drive current Input pin capacitance 20 3.0 N/A 2.0 N/A 2.4 N/A N/A N/A N/A N/A N/A N/A N/A N/A 2 85 3.6 0.8 N/A 0.4 N/A 16 N/A Unit kV kV Unit C V V V V V mA pF 3.3 RF Current Consumption Table 3-3 Current consumption during constant transmission Symbol Mode IRF IRF IRF 802.11b 11 Mbit/s 802.11g Typical Value Peak Value Unit 217 231 159 268 283 188 mA mA mA Power 17 dBm 18 dBm 15 dBm 8 WBR2 Datasheet Symbol IRF IRF IRF Mode 54 Mbit/s 802.11n BW20 MCS7 Power Typical Value Peak Value Unit 17.5 dBm 13 dBm 16.5 dBm 177 145 165 213 167 193 mA mA mA Table 3-4 Current consumption during constant receiving Symbol IRF IRF IRF Mode 802.11b 11 Mbit/s 802.11g 54 Mbit/s 802.11n HT20 MCS7 Typical Value Peak Value 63 65 65 65 67 67 Unit mA mA mA 3.4 Working Current Table 3-5 Working current Working Mode Working Status (Ta = 25C) EZ The module is in EZ mode, and the Wi-Fi indicator blinks quickly. Connected and idle The module is connected to the network, and the Wi-Fi indicator is steady on. Connected and operating The module is connected to the network, and the Wi-Fi indicator is steady on. Disconnected The module is disconnected from the network, and the Wi-Fi indicator is steady off. Typical Value Peak Value Unit 75 64 66 66 324 mA 314 mA 305 mA 309 mA 9 WBR2 Datasheet 4. RF Features 4.1 Basic RF Features Parameter Frequency range Wi-Fi standard Data transmission rate Table 4-1 Basic RF features Description Bluetooth:2.400 GHz to 2.4835 GHz Wi-Fi:2.412 GHz to 2.484 GHz IEEE 802.11b/g/n (channels 1 to 14,Ch1-11 for US/CA,Ch1-13 for EU/CN) 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7;
Antenna type PCB antenna 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power, 802.11b CCK mode 1 Mbit/s Average RF output power, 802.11g OFDM mode 54 Mbit/s Average RF output power, 802.11n OFDM mode MCS7 Frequency error EVM under 802.11b CCK, 11 Mbit/s, 17.5 dBm EVM under 802.11g OFDM, 54 Mbit/s, 14.5 dBm EVM under 802.11n OFDM, MCS7, 13.5 dBm N/A N/A N/A 20 17.5 N/A dBm 14.5 N/A dBm 13.5 N/A N/A
+20 10 29 30 dBm ppm dB dB dB 10 WBR2 Datasheet 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value PER < 8%, 802.11b CCK mode 1 Mbit/s PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode 54 Mbit/s MCS7 N/A N/A N/A 91 75 72 N/A N/A N/A Unit dBm dBm dBm 5. Antenna Information 5.1 Antenna Type WBR2 uses an onboard PCB antenna with a gain of 2.5 dBi. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi and Bluetooth module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. 6. Packaging Information and Production Instructions 6.1 Mechanical Dimensions The PCB dimensions (H x W x D) are 0.80.1 mm x 150.35 mm x 180.35 mm, as shown in Figure 6-1. 11 WBR2 Datasheet Figure 6-1 WBR2 mechanical dimensions 6.2 Recommended PCB Layout Figure 6-2 WBR2 pins 12 WBR2 Datasheet Figure 6-3 Top and bottom views of the PCB to which WBR2 applies 6.3 Production Instructions 1. Preferentially use the wave soldering machine to solder the module, which is recommended for Tuya-developed modules that are through-hole mounted onto PCBs. Use hand soldering only when there is no operational wave soldering machine. Complete soldering within 24 hours after the module is unpacked. If not, vacuum pack the module again.
(1) Required materials for soldering:
i. Wave soldering machine ii. Wave soldering fixture iii. Constant-temperature iron iv. Wave solder bar, wire, and flux v. Oven temperature tester
(2) Baking equipment:
i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Bake the module if any of the following conditions is met:
(1) The vacuum package is damaged before the module is unpacked.
(2) The package does not contain a humidity indicator card (HIC). 13
(3) After the module is unpacked, the HIC shows that the 30% and higher rate circles are pink.
(4) Production is not completed within 72 hours after the module is unpacked.
(5) The module has been packed for more than six months. WBR2 Datasheet 3. Baking settings:
(1) Baking temperature: 655C in reel pack mode and 1255C in tray pack mode
(2) Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode
(3) Alarm temperature: 70C in reel pack mode and 130C in tray pack mode
(4) Production ready temperature after natural cooling: < 36C
(5) Number of baking times: 1
(6) Rebaking condition: Production is not completed within 72 hours after baking. 4. Do not wave solder modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 5. Throughout the production process, take electrostatic discharge (ESD) protective measures. 6. For a good product quality, ensure that the following items meet requirements:
(1) Flux amount
(2) Wave height
(3) Amount of tin dross and copper in the solder pot
(4) Wave soldering fixture window and thickness
(5) Oven temperature curve for wave soldering 6.4 Recommended Oven Temperature Curve and Soldering Temperature Set the oven temperature to a value recommended for wave soldering. The peak temperature is 2605C. Figure 6-4 shows the oven temperature curve for wave soldering. 14 WBR2 Datasheet Figure 6-4 Oven temperature curve Table 6-1 Recommended wave soldering temperature Wave Soldering Hand Soldering Preheat temperature 80C to 130C Wave soldering 36020C temperature Preheat time 75s to 100s Soldering time
< 3s per point Contact time 3s to 5s Solder pot temperature 2605C Temperature increase 2C per second rate Temperature drop rate 6C per second N/A N/A N/A N/A N/A N/A N/A N/A 15 WBR2 Datasheet 6.5 Storage Conditions Storage conditions for a delivered module are as follows:
1. The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%. 2. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. 3. The package contains a HIC. Figure 6-5 HIC for WBR2 16 WBR2 Datasheet 17 7. MOQ and Packing Information WBR2 Datasheet 18 WBR2 Datasheet 8. Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. interference in a residential Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
this equipment does cause harmful If Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. 19 WBR2 Datasheet The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WBR2.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WBR2 This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. 20