Global Intelligent Platform WBR3 Datasheet Product Manual Tuya WBR3 Wi-Fi and Bluetooth Version: 2.0.0 Date: 2019-10-21 No.: 0000000001 1. Product Overview WBR3 is a low-power embedded Wi-Fi and Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip (RTL8720CF) with an embedded Wi-Fi network protocol stack and robust library functions. WBR3 also contains a low-power KM4 multipoint control unit (MCU), WLAN MAC, 1T1R WLAN, 256 KB static random-access memory (SRAM), and 2 MB flash memory, and has extensive peripherals. WBR3 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Figure 1-1 shows the WBR3 architecture. Figure 1-1 WBR3 architecture 1 WBR3 Datasheet 1.1 Features Embedded low-power KM4 MCU, which can also function as an application processor Clock rate: 100 MHz Working voltage: 3.0 V to 3.6 V Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one Log_TX pin Wi-Fi connectivity 802.11b/g/n20 Channels 1 to 14 at 2.4 GHz Compatible with Bluetooth low energy (BLE) 4.2(Up to +9dBm EIPR output power) WPA and WPA2 security modes Up to +20 dBm EIRP output power in 802.11b mode Smart network configuration for Android and iOS devices Onboard PCB antenna Certified by CE, FCC, and SRRC Working temperature: 20C to +85C 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 Change History No. Date Change Description 1 2019-10-21 This is the first release. WBR3 Datasheet Version After Change 2.0.0 3 WBR3 Datasheet Contents 1. Product Overview........................................................................................................................ 1 1.1 Features.............................................................................................................................. 2 1.2 Applications........................................................................................................................ 2 2 Module Interfaces......................................................................................................................... 6 2.1 Dimensions and Footprint................................................................................................6 2.2 Interface Pin Definition..................................................................................................... 6 3 Electrical Parameters................................................................................................................... 8 3.1 Absolute Electrical Parameters.......................................................................................8 3.2 Electrical Conditions......................................................................................................... 8 3.3 RF Current Consumption................................................................................................. 9 3.4 Working Current.............................................................................................................. 10 4 RF Features.................................................................................................................................10 4.1 Basic RF Features.......................................................................................................... 10 4.2 TX Performance...............................................................................................................11 4.3 RX Performance.............................................................................................................. 11 5 Antenna Information...................................................................................................................12 5.1 Antenna Type................................................................................................................... 12 5.2 Antenna Interference Reduction...................................................................................12 6 Packaging Information and Production Instructions.............................................................12 6.1 Mechanical Dimensions................................................................................................. 12 6.2 Recommended PCB Layout..........................................................................................14 6.3 Production Instructions...................................................................................................15 6.4 Recommended Oven Temperature Curve..................................................................17 6.5 Storage Conditions......................................................................................................... 18 7 MOQ and Packing Information.................................................................................................19 8 Appendix: Statement..................................................................................................................20 4 WBR3 Datasheet Tables Table 2-1 WBR3 interface pins...................................................................................................... 6 Table 3-1 Absolute electrical parameters.....................................................................................8 Table 3-2 Normal electrical conditions..........................................................................................8 Table 3-3 Power consumption during constant transmission................................................... 9 Table 3-4 Power consumption during constant receiving..........................................................9 Table 3-5 WBR3 working current................................................................................................ 10 Table 4-1 Basic RF features.........................................................................................................10 Table 4-2 Performance during constant transmission............................................................. 11 Table 4-3 RX sensitivity.................................................................................................................11 Figures Figure 1-1 WBR3 architecture....................................................................................................... 1 Figure 2-1 WBR3 front and rear views.........................................................................................6 Figure 6-1 WBR3 mechanical dimensions................................................................................ 13 Figure 6-2 Side view......................................................................................................................13 Figure 6-3 WBR3 pins...................................................................................................................14 Figure 6-4 Layout of the PCB to which WBR3 applies............................................................15 Figure 6-5 HIC for WBR3............................................................................................................. 16 Figure 6-6 Oven temperature curve........................................................................................... 17 5 WBR3 Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint WBR3 has two rows of 16 pins (2 x 8) with a 2 mm pin spacing. The WBR3 dimensions (H x W x D) are 2.90.15 mm x 160.35 mm x 240.35 mm. Figure 2-1 shows the WBR3 front and rear views. Figure 2-1 WBR3 front and rear views 2.2 Interface Pin Definition Table 2-1 WBR3 interface pins Pin No. Symbol I/O Type Function 1 2 NC N/A Disconnected to be compatible with other modules A_7 I/O GPIOA_7, hardware PWM pin, which is 6 Pin No. Symbol I/O Type Function WBR3 Datasheet 3 4 5 6 7 8 9 10 11 12 13 14 15 16 EN I/O connected to pin 21 on the internal IC Enable pin, which is active at a high level (The pin has been pulled up and is externally controllable.) A_11 A_2 A_3 A_4 VCC GND A_12 A_16 A_17 A_18 A_19 RXD TXD I/O I/O I/O I/O P P I/O I/O I/O I/O I/O I/O I/O GPIOA_11, hardware PWM pin, which is connected to pin 25 on the internal IC GPIOA_2, hardware PWM pin, which is connected to pin 18 on the internal IC GPIOA_3, hardware PWM pin, which is connected to pin 19 on the internal IC GPIOA_4, hardware PWM pin, which is connected to pin 20 on the internal IC Power supply pin (3.3 V) Power supply reference ground pin GPIOA_12, hardware PWM pin, which is connected to pin 26 on the internal IC GPIOA_16, UART_Log_TXD, which is used for printing the module internal information and can be configured as a common GPIO GPIOA_17, hardware PWM pin, which is connected to pin 38 on the internal IC GPIOA_18, hardware PWM pin, which is connected to pin 39 on the internal IC GPIOA_19, hardware PWM pin, which is connected to pin 40 on the internal IC GPIOA_13, UART0_RXD (user-side serial interface) GPIOA_14, UART0_TXD (user-side serial interface) Note:
P indicates power supply pins, and I/O indicates input/output pins. 7 WBR3 Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value Ts VDD Static electricity voltage
(human body model) Static electricity voltage
(machine model) Storage temperature Power supply voltage 40 0.3 Tamb = 25C N/A Tamb = 25C N/A 105 3.6 2 0.5 C V kV kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typical Value Maximum Unit Value Ta VDD VIL VIH VOL VOH Working temperature Working voltage I/O low-level input I/O high-level input I/O low-level output 20 3.0 N/A 2.0 N/A I/O high-level 2.4 8 N/A N/A N/A N/A N/A N/A 85 3.6 0.8 N/A 0.4 N/A C V V V V V Parameter Description Minimum Value Typical Value Maximum Unit Value WBR3 Datasheet Imax Cpad output I/O drive current Input pin capacitance N/A N/A N/A 2 16 N/A mA pF 3.3 RF Current Consumption Table 3-3 Power consumption during constant transmission Symbol Mode Power Typical Value Peak Value Unit IRF IRF IRF IRF IRF IRF 802.11b 11 Mbit/s 802.11g 54 Mbit/s 802.11n BW20 MCS7 17 dBm 18 dBm 15 dBm 17.5 dBm 13 dBm 16.5 dBm 217 231 159 177 145 165 268 283 188 213 167 193 mA mA mA mA mA mA Table 3-4 Power consumption during constant receiving Symbol Mode Typical Value Peak Value Unit IRF IRF IRF 802.11b 11 Mbit/s 802.11g 54 Mbit/s 802.11n HT20 MCS7 63 65 65 65 67 67 mA mA mA 9 WBR3 Datasheet 3.4 Working Current Table 3-5 WBR3 working current Working Mode Working Status (Ta = 25C) Typical Value Peak Value Unit EZ Connected and idle Connected and operating Disconnected The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is connected to the network, and the Wi-Fi indicator is steady on. The module is connected to the network, and the Wi-Fi indicator is steady on. The module is disconnected from the network, and the Wi-Fi indicator is steady off. 75 64 66 66 324 mA 314 mA 305 mA 309 mA 4 RF Features 4.1 Basic RF Features Parameter Frequency range Wi-Fi standard Data transmission rate Table 4-1 Basic RF features Description Bluetooth:2.400 GHz to 2.4835 GHz Wi-Fi:2.412 GHz to 2.484 GHz IEEE 802.11b/g/n (channels 1 to 14,Ch1-11 for US/CA,Ch1-13 for EU/CN) 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 Antenna type PCB antenna 10 4.2 TX Performance WBR3 Datasheet Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Unit Value 1 Mbit/s N/A 17.5 N/A 54 Mbit/s N/A 14.5 N/A Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error MCS7 N/A 20 dBm dBm dBm ppm dB dB dB 13.5 N/A N/A
+20 10 29 30 EVM under 802.11b CCK, 11 Mbit/s, 17.5 dBm EVM under 802.11g OFDM, 54 Mbit/s, 14.5 dBm EVM under 802.11n OFDM, MCS7, 13.5 dBm 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit PER < 8%, 802.11b CCK mode 1 Mbit/s N/A PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode 54 Mbit/s N/A MCS7 N/A 91 75 72 N/A N/A N/A dBm dBm dBm 11 WBR3 Datasheet 5 Antenna Information 5.1 Antenna Type WBR3 uses an onboard PCB antenna with a gain of 2.5 dBi. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions The PCB dimensions (H x W x D) are 0.80.1 mm x 160.35 mm x 240.35 mm. Figure 6-1 shows the WBR3 mechanical dimensions. 12 WBR3 Datasheet Figure 6-1 WBR3 mechanical dimensions Figure 6-2 Side view Note:
The default dimensional tolerance is 0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 13 6.2 Recommended PCB Layout WBR3 Datasheet Figure 6-3 WBR3 pins 14 WBR3 Datasheet Figure 6-4 Layout of the PCB to which WBR3 applies 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven 15 WBR3 Datasheet ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-5 HIC for WBR3 3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are 16 WBR3 Datasheet exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. Figure 6-6 Oven temperature curve 17 6.5 Storage Conditions WBR3 Datasheet 18 7 MOQ and Packing Information WBR3 Datasheet 19 WBR3 Datasheet 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. interference in a residential Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
this equipment does cause harmful If Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. 20 WBR3 Datasheet The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WBR3.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WBR3 This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. 21