Global Intelligent Platform TYLC6E Datasheet Product Manual Tuya TYLC6E Wi-Fi Module Version: 2.0.0 Date: 2019-07-22 No.: 0000000001 1. Product Overview TYLC6E is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (ESP8285) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. TYLC6E is embedded with a low-power 32-bit CPU, 2 MB flash memory, and 50 KB static random-access memory (SRAM), and has extensive peripherals. TYLC6E is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. 1.1 Features Embedded low-power 32-bit CPU, which can also function as an application processor Dominant frequencies: 80 MHz and 160 MHz Working voltage: 3.0 V to 3.6 V Peripherals: five GPIOs Wi-Fi connectivity 802.11b/g/n Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Up to +20 dBm output power in 802.11b mode STA, AP, and STA+AP working modes Smart and AP network configuration modes for Android and iOS devices External helical antenna with a gain of 1.0 dBi Working temperature: 20C to +105C 1 TYLC6E Datasheet 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 TYLC6E Datasheet Change History No. 1 2 Date Change Description Version After Change 2019-03-19 This is the first release. 2019-07-24 Added GPIO information. 1.0.0 1.0.1 3 TYLC6E Datasheet Contents 1. Product Overview........................................................................................................................ 1 1.1 Features.............................................................................................................................. 1 1.2 Applications........................................................................................................................ 2 Tables.........................................................................................................................................6 Figures....................................................................................................................................... 6 2. Module Interfaces........................................................................................................................ 7 2.1 Dimensions and Footprint................................................................................................7 2.2 Interface Pin Definition..................................................................................................... 7 2.3 Test Pin Definition..............................................................................................................8 3. Electrical Parameters..................................................................................................................9 3.1 Absolute Electrical Parameters.......................................................................................9 3.2 Electrical Conditions......................................................................................................... 9 3.3 RF Current........................................................................................................................10 3.4 Working Current...............................................................................................................11 4. RF Features................................................................................................................................11 4.1 Basic RF Features...........................................................................................................11 4.2 TX Performance.............................................................................................................. 12 4.3 RX Performance..............................................................................................................12 5. Antenna Information..................................................................................................................12 5.1 Antenna Type................................................................................................................... 12 5.2 Antenna Interference Reduction...................................................................................13 5.3 Antenna Connector Specifications............................................................................... 13 6. Packaging Information and Production Instructions............................................................14 6.1 Mechanical Dimensions................................................................................................. 14 6.2 Recommended PCB Encapsulation............................................................................ 14 6.3 Production Instructions...................................................................................................15 6.4 Recommended Oven Temperature Curve..................................................................17 4 6.5 Storage Conditions......................................................................................................... 18 7 MOQ and Packing Information.................................................................................................19 8 Appendix: Statement..................................................................................................................20 TYLC6E Datasheet 5 TYLC6E Datasheet Tables Table 2-1 TYLC6E interface pins...........................................................................................7 Table 2-2 TYLC6E test pins....................................................................................................8 Table 3-1 Absolute electrical parameters.............................................................................9 Table 3-2 Normal electrical conditions..................................................................................9 Table 3-3 Current during constant transmission and receiving......................................10 Table 3-4 TYLC6E working current..................................................................................... 11 Table 4-1 Basic RF features.................................................................................................11 Table 4-2 Performance during constant transmission..................................................... 12 Table 4-3 RX sensitivity.........................................................................................................12 Figures Figure 2-1 TYLC6E front and rear views
............................................................................. 7 Figure 5-1 Antenna dimensions
........................................................................................... 13 Figure 6-1 TYLC6E mechanical dimensions
..................................................................... 14 Figure 6-2 TYLC6E pins
....................................................................................................... 14 Figure 6-3 PCB encapsulation diagram of TYLC6E
........................................................ 15 Figure 6-4 HIC for TYLC6E
.................................................................................................. 16 Figure 6-5 Oven temperature curve
................................................................................... 17 6 TYLC6E Datasheet 2. Module Interfaces 2.1 Dimensions and Footprint TYLC6E has two rows of pins with a 2 mm pin spacing. The TYLC6E dimensions (HxWxD) are 30.1 mm x 120.15 mm x 140.15 mm. The PCB thickness is 1.00.1 mm. The shield cover height is 2.00.05 mm. Figure 2 shows the TYLC6E front and rear views. Figure 2-1 TYLC6E front and rear views 2.2 Interface Pin Definition Table 2-1 TYLC6E interface pins Pin No. Symbol I/O Type Function 1 2 3 4 5 GPIO14 I/O GPIO13 I/O GPIO12 I/O VCC GPIO5 P I/O Used as a GPIO, which is connected to MTMS (pin 9) on the internal IC Used as a GPIO, which is connected to MTCK (pin 12) on the internal IC Used as a GPIO, which is connected to MTDI
(pin 10) on the internal IC Power supply pin (3.3 V) Used as a GPIO, which is connected to GPIO5 (pin 24) on the internal IC 7 TYLC6E Datasheet Pin No. Symbol I/O Type Function 6 7 GND GPIO4 P I/O Power supply reference ground pin Used as a GPIO, which is connected to GPIO4 (pin 16) on the internal IC Note: P indicates power supply pins, and I/O indicates input/output pins. 2.3 Test Pin Definition Table 2-2 TYLC6E test pins Pin No. Symbol I/O Type Function N/A TP1 TP2 TP3 TP4 TP5 I/O I/O RST UART0_ TXD UART0_ RXD GPIO2, used for query of the module printing information GPIO0, used for the module production test Hardware reset pin, which cannot clear the Wi-Fi network configuration User-side serial interface, which generates information for the module production test when the module is powered on and starts User-side serial interface, which generates information for the module production test when the module is powered on and starts Note:
1. Test pins are not recommended. 2. RST is only a hardware reset pin and cannot clear the Wi-Fi network configuration. 3. UART0 is a user-side serial interface, which generates information when the module is powered on and starts. 8 3. Electrical Parameters 3.1 Absolute Electrical Parameters TYLC6E Datasheet Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value Ts VCC Static electricity voltage
(human body model) Static electricity voltage
(machine model) Storage temperature Power supply voltage 40 0.3 Tamb = 25C N/A Tamb = 25C N/A 125 3.6 2 0.5 C V kV kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typical Value Maximum Unit Value Ta VCC VIL VIH VOL Working temperature Power supply voltage I/O low-level input I/O high-level input I/O low-level output 20 3.0 N/A 105 C 3.3 3.6 0.3 N/A VCC x 0.25 VCC x 0.75 N/A VCC N/A N/A VCC x 0.1 9 V V V V TYLC6E Datasheet Parameter Description Minimum Value Typical Value Maximum Unit Value VOH Imax I/O high-level output I/O drive current VCC x 0.8 N/A VCC N/A N/A 12 V mA 3.3 RF Current Table 3-3 Current during constant transmission and receiving Working Status Parameter Mode Rate Typical Value Unit TX Power/
Receiving 802.11b 11 Mbit/s
+17 dBm 802.11g 54 Mbit/s
+15 dBm TX 220 110 120 100 76 76 76 mA mA mA mA mA mA mA
+14 dBm
+13 dBm Constant receiving Constant receiving Constant receiving 802.11n MCS0 802.11n MCS7 802.11b 11 Mbit/s RX 802.11g 54 Mbit/s 802.11n MCS7 10 TYLC6E Datasheet 3.4 Working Current Working Mode EZ AP Connected Disconnected Table 3-4 TYLC6E working current Working Status (Ta = 25C) Average Value Maximum Unit Value The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and the Wi-Fi indicator blinks slowly. The module is connected to the network, and the Wi-Fi indicator is steady on. The module is disconnected from the network, and the Wi-Fi indicator is steady off. 80 90 58.5 151 451 411 mA mA mA 80 430 mA 4. RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.412 GHz to 2.484 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14) Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 Antenna type External helical antenna with a gain of 1 dBi 11 4.2 TX Performance TYLC6E Datasheet Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Unit Value dBm dBm dBm ppm dB dB dB Unit dBm dBm dBm Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error 11 Mbit/s 54 Mbit/s MCS7 N/A N/A N/A 10 EVM under 802.11b CCK 11 Mbit/s 17.5 dBm EVM under 802.11g OFDM 54 Mbit/s 15.0 dBm EVM under 802.11n OFDM MCS7 14.0 dBm N/A N/A N/A
+10 17 14 13 N/A 15 29 30 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value PER < 8%, 802.11b CCK mode 1 Mbit/s PER < 10%, 802.11g OFDM mode 54 Mbit/s PER < 10%, 802.11n OFDM mode MCS7 N/A N/A N/A 91 75 72 N/A N/A N/A 5. Antenna Information 5.1 Antenna Type An external antenna can be soldered onto the ANT solder pad of the module. 12 An 11.5 mm antenna is recommended. Figure 5-1 shows the antenna dimensions. TYLC6E Datasheet Figure 5-1 Antenna dimensions 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an external antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. 5.3 Antenna Connector Specifications TYLC6E does not use an antenna connector. 13 6. Packaging Information and Production Instructions TYLC6E Datasheet 6.1 Mechanical Dimensions Figure 6-1 TYLC6E mechanical dimensions Note: The default dimensional tolerance is 0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.2 Recommended PCB Encapsulation Figure 6-2 TYLC6E pins 14 TYLC6E Datasheet Figure 6-3 PCB encapsulation diagram of TYLC6E 6.3 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. ii. Cabinet oven Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). 15 TYLC6E Datasheet Figure 6-4 HIC for TYLC6E 3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 16 TYLC6E Datasheet 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. Figure 6-5 Oven temperature curve 17 6.5 Storage Conditions TYLC6E Datasheet 18 7 MOQ and Packing Information TYLC6E Datasheet 19 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity TYLC6E Datasheet FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 20 This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. TYLC6E Datasheet Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labeled in a visible area with the following:
"Contains Transmitter Module 2AND L-TYLC6E"
This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com. 21 TYLC6E Datasheet EN 300 328 V2.1.1 EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1 EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 22