Technical Specification
(TM03LNNAHK0) 1/11 History Ver. Date Contents 1.0 2016.12.16 Written Checked Approved by by by Note 2/11 Contents 1. Product Introduction..................................................................................................... 4 1.1 Block Diagram .................................................................................................... 5 1.2 Environmental Specifications .............................................................................. 5 1.3 Electrical Specifications ...................................................................................... 5 1.3.1 Absolute Maximum and ESD Ratings ........................................................... 5 1.3.2 Current Consumption ................................................................................... 6 1.4 Mechanical Specifications ................................................................................. 6 1.4.1 Physical Dimensions and Connection Interface ........................................... 6 1.4.2 Mechanical Drawing ..................................................................................... 7 2. Pin Definitions.............................................................................................................. 8 3 RF Specification ........................................................................................................... 9 3.1. LTE B4, B13 Specification ................................................................................. 9 3.2. CDMA BC0, BC1 Specification.. 10 3/11 1. Product Introuction The TM03LNNAHK0 are designed for the automotive industry. They support LTE and CDMA air Interface standards. The TM03LNNAHK0 are based on the Qualcomm MDM9628 wireless chipsets and support the following bands. Table 1. Supported Band Region US LTE B4/B13 Band CDMA BC0/BC1 1.1 Block Diagram Figure 1.1. TM03LNNAHK0 Block diagram 4/11 1.2 Environmental Specifications The environmental specification for operating and storage of the TM03LNNAHK0 are defined in the the table below. Table 2. Environmental Specifications Parameter Temperature Range Operating Temperature Storage Temperature Humidity 1.3 Electrical Specifications
-40 to 85
-40 to +90 95% or less This section provides details for some of the key electrical specifications of the TM03LNNAHK0 embedded modules. 1.3.1 Absolute Maximum Rating and ESD Ratings This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the TM03LNNAHK0 embedded modules. Warning: If these parameters are exceeded, even momentarily, damage may occur to the device. Table 3. Absolute Maximum Ratings Parameter
+4.0_VPWR Power Supply Input VIN ESD Ratings ESD1) Voltage on any digital input or output pin Primary, Diversity antenna pads - Contact Min
-
-
Max 4.4V VREG_MDME+0.5 10 Units V V kV 1) The ESD Simulator configured with 330pF, 2000. Caution: The TM03LNNAHK0 embedded modules are sensitive to Electrostatic Discharge. ESD countermeasures and handling methods must be used when handling the TM03LNNAHK0 devices. 5/11 1.3.2 Current Consumption Table 4. TM03LNNAHK0 Current Consumption (TBD) Mode Parameter Band4, Max TX Output /Full RB Typical Max 650 600 Units LTE CDMA Band13, Max TX Output /Full RB 800MHz 1900MHz LTE Idle, Registered CDMA Idle, Registered LTE Sleep Mode, Average Current CDMA Sleep Mode, Average Current 550 550 600 1.8 1.8 1.8 1.8 600 600 650 2.2 2.2 2.2 2.2 mA mA mA mA mA mA 1.4 Mechanical Specifications 1.4.1 Physical Dimensions and Connection Interface The TM03LNNAHK0 embedded modules are a Land Grid Array (LGA) form factor device. The device does not have a System or RF connectors. All electrical and mechanical connections are made via the 323 pad TM03LNNAHK0 on the underside of the PCB. Table5. TM03LNNAHK0 Embedded Module Dimensions Parameter Overall Dimension Overall Module Height PCB Thickness Flatness Specification Weight Nominal 34 x 40 3.5 1.0 TBD Max 34.35 x 40.35 3.85 1.1 0.1 Units mm mm mm mm g 6/11 1.4.2 Mechanical Drawing 1.4.2.1 Carrier PCB
[TOP View]
[Bottom View]
7/11 2. Pin Definitions Table6. PIN Definitions 8/11 3. RF Specification The specifications for the LTE and CDMA interfaces are defined. TM03LNNAHK0 is designed to be compliant with the standard shown in the table below. Table20. Standards Compliance Technology LTE CDMA 3.1 LTE B4, B13 Specification 3.1.1 LTE TX Output Power Standards 3GPP Release 8 3GPP2 Release IxEVDO, REV.H The Maximum / Minimum Transmitter Output Power of the TM03LNNAHK0 are specified in the following table. Table21. Conducted TX (Transmit) Max output Power Tolerances LTE Bands BAND Method (UL CH) Specification Measure Max and Min and Min Transmit Power of Low Channel (20000) Measure Max and Min Transmit Power of Mid Channel (20175) Measure Max and Min Transmit Power of High Channel (20350) Max Power : 20.3~25.7dBm Min Power : -39dBm Max Power : 20.3~25.7dBm Min Power : -39dBm Max Power : 20.3~25.7dBm Min Power : -39dBm Measure Max and Min and Min Transmit Power of Low Channel (23230) Max Power : 20.3~25.7dBm Min Power : -39dBm BAND4 UE Maximum Output Power BAND13 UE Maximum Output Power 3.1.2 LTE RX Sensitivity The Receiver Sensitivity of the TM03LNNAHK0 are specified in the following table. Table22. Conducted RX (Receive) Sensitivity LTE Bands BAND Method (DL CH) Measure BLER of Low Channel (2000) in Band4 Measure BLER of Mid Channel (2175) in Band4 Measure BLER of High Channel (2350) in Band4 Measure BLER of Low Channel (23230) in Band13 Specification sensitivity : -97 BLER : 5%
sensitivity : -97 BLER : 5%
sensitivity : -97 BLER : 5%
sensitivity : -94 BLER : 5%
BAND 4 Reference sensitivity level(DUAL) BAND 13 Reference 9/11 sensitivity level(DUAL) 3.2 CDMA 800/1900 Specification 3.2.1 CDMA TX Output Power The Maximum Transmitter Output Power of the TM03LNNAHK0 are specified in the following table. Table23. Conducted TX (Transmit) Max output Power Tolerances CDMA Bands Item Method (DL CH) Specification CDMA800 Power Level PCS1900 Power Level Measure Max Transmit Power of Low Channel
(CH=384) in CDMA Mode Measure Max Transmit Power of Middle Channel
(CH=779) in CDMA Mode Measure Max Transmit Power of High Channel
(CH=1013) in CDMA Mode Measure Max Transmit Power of Low Channel
(CH=25) in DCS1900 Mode Measure Max Transmit Power of Middle Channel
(CH=600) in DCS1900 Mode Measure Max Transmit Power of High Channel
(CH=1175) in DCS1900 Mode Max Power : 23~30dBm Max Power : 23~30dBm Max Power : 23~30dBm Max Power : 23~30dBm Max Power : 23~30dBm Max Power : 23~30dBm 3.2.2 CDMA RX Sensitivity The Receiver Sensitivity of the TM03LNNAHK0 are specified in the following table. Table24. Conducted RX (Receive) Sensitivity CDMA Bands Item Method (DL CH) Specification CDMA800 BER(Bit Error Rate) PCS1900 BER(Bit Error Rate) Measure BER of Low Channel (CH=384) in EGSM Mode Measure BER of Middle Channel (CH=779) in EGSM Mode Measure BER of High Channel (CH=1013) in EGSM Mode Measure BER of Low Channel (CH=25) in PCS1900 Mode Measure BER of Middle Channel (CH=600) in PCS1900 Mode Measure BER of High Channel (CH=1175) in PCS1900 Mode 0.5% @-104dBm 0.5% @-104dBm 0.5% @-104dBm 0.5% @-104dBm 0.5% @-104dBm 0.5% @-104dBm 10/11
<Warning Statements>
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. RF Exposure Statement The antenna(s) must be installed such that a minimum separation distance of at least 20 cm is maintained between the radiator (antenna) and all persons at all times. This device must not be co-located or operating in conjunction with any other antenna or transmitter. The highest permitted antenna gains including cable loss for use with this device are: CDMA 800 : 0.89 dBi, CDMA1900 : 3.20 dBi, LTE Band 4: 2.41 dBi, LTE Band 13: 0.42 dBi. End Product Labeling The module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
Contains FCC ID: BEJGEN21NA OEM Responsibilities to comply with FCC Regulations The module has been certified for integration into products only by OEM integrators under the following condition:
- The antenna(s) must be installed such that a minimum separation distance of at least 20 cm is maintained between the radiator (antenna) and all persons at all times.
- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the two condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions can t be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cant be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 11/11