FCC ID: YQD-M10 GSM Module

M10 User Manual M10 User Manual Contents Contents ........................................................................................................................... 1 0. Revision history ............................................................................................................. 4 1. Introduction ................................................................................................................... 5 1.1. Reference ............................................................................................................. 5 2. Product Concept............................................................................................................. 6 3. Placement...................................................................................................................... 8 3.1. Pin Assignment ..................................................................................................... 8 3.2. Placement recommendation................................................................................... 15 3.3. Placement clearance ............................................................................................. 15 4. Digital I/O Connection .................................................................................................. 17 5. VDD_EXT Pin ............................................................................................................ 18 6. Serial Interface and Debug Interface ............................................................................... 19 7. SIM Card .................................................................................................................... 20 8. SLEEP Mode ............................................................................................................... 21 9. Audio Trace................................................................................................................. 22 10. RF Design Guide ........................................................................................................ 23 10.1. Recommended Impedance Matching Circuit.......................................................... 23 10.2. Matched RF Transmission Line Design ................................................................. 24 10.3. PCB Layout Consideration .................................................................................. 24 11. The Recommended Ramp-soak-spike Reflow Profile ...................................................... 28 M10 User Manual Table Index TABLE 2: DIGITAL I/ O ELECTRICAL CHARA CTERISTICS.................................................................. 17 M10 User Manual Figure Index FIGURE 1: PIN ASSIGNM ENT ........................................................................................................................... 9 FIGURE 2: RECOMM ENDATION OF PLA CEM ENT ................................................................................. 15 FIGURE 3: PLACEMENT CLEARANCE ................................................................................................... 16 FIGURE 4: CIRCUIT OF THE SIM CARD ............................................................................................... 20 FIGURE 5: A UDIO TRACE ROUTING EXAMPLE ..................................................................................... 22 FIGURE 6: T-TYPE MATCHING CIRCUIT.................................................................................................... 23 FIGURE 7: -TYPE MATCHING CIRCUIT................................................................................................... 23 FIGURE 8: M 10 RF_ANT PCB LAYOUT ....................................................................................................... 24 FIGURE 9: REFERENCE PCB DESIGN WITH ANTENNA PAD IN A FOUR-LAYER PCB ............. 26 FIGURE 10: REFERENCE PCB DESIGN WITH RF CONNECTOR IN A FOUR-LAYER PCB ........ 27 FIGURE 11: STACK-UP OF THE FOUR-LAYER PCB................................................................................ 27 FIGURE 12: THE RECOMM ENDED RAMP-SOAK-SPIKE REFLOW P ROFILE............................... 28 M10 User Manual 0. Revision history Revision Date 1.00 Author Ken Ji/

Samuel Hong Description of change Origin 1. Introduction This document gives recommendation for M10 module integration in a wireless application, such as vehicle tracking system, smart metering and PDA. It gives some recommendations for design notes, reference circuit and PCB layout. The M10 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850, and PCS1900. M10 features GPRS and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. With a tiny profile of 29mm 29mm 3.6 mm, the module can meet almost all the requirements for M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS, Security, Telematics, Remote Controlling, etc. M10 is an SMD type module, which can be embedded in customer application through its 64-pin pads. It provides all hardware interfaces between the module and customers host board. 1.1. Reference 2. Product Concept The M10 is a Quad-band GSM/GPRS engine that works at frequency bands of GSM850 and PCS 1900. The M10 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. The M10 is an SMD type module with 64-pin pads and a tiny profile of 29mm x 29mm x 3.6 mm

(the thickness of PCB is 1.6mm), which can fit into almost all customers applications. It provides all hardware interfaces between the module and customer host board. External controller can communicate with M10 through its main UART port. Two audio channels include two microphone inputs and two speaker outputs, which can be easily configured by AT command. The module is designed with power saving technique so that the current consumption could be very low. TCP/IP protocol stack has been integrated in the module. Moreover, extended TCP/IP AT commands have been developed for customer to use the internal TCP/IP protocol easily, which is very useful for data transfer application. The module is fully RoHS compliant to EU regulation. Mechanical dimensions of module 3. Placement Please pay attention to the placement and the PCB layout in your application design. 3.1. Pin Assignment The pin assignment of the M10 module is show n in Figure 1. Placement of module should be carefully considered to make the RF_IN pad as close as possible to antenna so as to reduce overall RF trace length. The longer the RF trace to antenna, the larger the RF insertion loss. In addition, please keep RF part and antenna from the system crystal and the audio part in host board as far as possible to reduce possible RF interference due to GSM transmission bursts from antenna and RF trace. M10 module include the following major functional parts:

The GSM baseband part Flash and SRAM The GSM radio frequency part The SMT pads interface LCD interface SIM card interface Audio interface Key-board interface UART interface Power supply RF interface Figure 1: Pin assignment 3.2. Placement recommendation The analog part components such as microphone should be placed far away from antenna and power supply. General placement recommendation is shown in Figure 2. Figure 2: Recommendation of placement 3.3. Placement clearance The module mounts with 64 SMT pads. For easy maintenance of this module and accessing to these pads, please keep a distance no less than 3mm between M10 and other components. Power SupplyModuleLCD InterfaceSIM InterfacePwrkey&Audio InterfaceKeypad InterfaceUART InterfacePowerAntennaAudio PartKeypad PartDigital Part & Other PartRF Figure 3: Placement clearance 4. Digital I/O Connection If the voltage level of peripheral interface circuit does not match module interface, the power consumption of the system could increase, and could even cause the module damaged. Each digital I/O of the module operates in a 2.8V logic level inside the module. The voltage level of those digital interfaces connected to the module should match the electrical characteristics of the module listed in Table 2. Otherwise, a level shifter circuit must be inserted between the host and the module. Table 1: Digital I/O electrical characteristics SYMBOL MIN VIL VIH VOL VOH 0 1.7 0 2.0 MAX 0.67 3.1 0.34 2.8 UNITS V V V V For direct connection between I/Os, please pay attention to I/Os input or output configuration. If the I/O direction configuration conflicts with each other, the power consumption could increase, and the module could be very hot, and even be damaged. For example, it is forbidden that users I/O outputs a low level while modules connected I/O outputs a high level. 5. VDD_EXT Pin This pin is a power supply from a regulator inside the module which can supply current of about 20mA. Customer can also use this pin to judge whether the module is off or not. When the module is turned off, the VDD_EXT pin will change from high level to low level. 6. Serial Interface and Debug Interface The TXD and RXD pins should be connected to host MCU. The DTR pin should be controlled to trigger SLEEP mode or wakeup the module. The RTS and CTS pins should be connected to the host MCU if hardware flow control is required. The TXD, RXD, PWRKEY and GND pins can also be used for software upgrade and high-level acoustic parameters configuration. The DBG_TXD and DBG_RXD pins are only used for software debug. Please note that the PWRKEY pin should be pulled to low level when the M10 is being upgraded. For more detailed information on serial port design, please refer to document [2]

Notes: Its recommended to connect the pins necessary for firmware upgrade to external interface. 7. SIM Card As shown in Figure 4, connecting a large volume capacitor such as 10uF in the SIM_VDD line could lead to failure of detecting the SIM card. A capacitor between 100nF and 1uF is recommended. Figure 4: Circuit of the SIM card 8. SLEEP Mode The command AT+CSCLK can enable or disable SLEEP mode. When the SLEEP mode is enabled, pulling the DTR pin to high level would drive the module into SLEEP mode; and pulling the DTR pin to low level the module would exit from SLEEP mode. 9. Audio Trace If possible, the audio trace should be placed in inner layer, and shielded by ground in the same layer and the upper and lower adjacent layers to prevent from RF interference. In addition, it is recommended to add as many via as possible between ground layers so as to reduce RF noise. The AGND signal is usually used for AOUT2 channel to establish a single-end output with SPK2P. Do not pair GND with SPK2P to establish an audio output, otherwise TDD (Time Division Duplex) noise from power supply could occur in AOUT2. Figure 5: Audio trace routing example 10. RF Design Guide Correct RF design is essential for RF performance such as transmitting power, receiving sensitivity and harmonics. Following this RF design guide could benefit to improve the RF performance of customers product. 10.1. Recommended Impedance Matching Circuit The impedance of M10s RF_ANT port is 50. If the impedance of antenna is close to 50 in all working frequency bands, the antenna could be connected to the RF_ANT port directly via 50 transmission line. But if the impedance of antenna is not close to 50, a T-type or -type matching circuit should be inserted between transmission line and antenna. The matching components should be placed as close as possible to the antennas feed point. Figure 6 and Figure 7 show the reference designs of T-type and -type matching circuits. Figure 6: T-type matching circuit Figure 7: -type matching circuit NOTE: The impedance of traces in Bold type must be 50. 10.2. Matched RF Transmission Line Design In PCB layout, a matched RF transmission line has a fixed characteristic impedance, which is called Z0, from its source to its load. The source should have an internal resistance of Z0 and the resistance of matching load should close to Z0. Since the impedance of M10s RF_ANT port is 50, the impedance of the RF transmission line from this port to the antenna or the matching circuit should also be made to 50. More than twelve different types of transmission line can be created on a PCB s imply by controlling trace geometry, and some of them are shown in Figure 8. Figure 8: M10 RF_ANT PCB layout Customer may adopt one or certain types of them to design RF trace. Upon the demand of application design, the number of PCB layer can be different such as two and four. Each type of PCB has corresponding stack-up. The stack-up is the name given to the order of the various etched copper foil and dielectric layers that are laminated together under pressure and heat to make a PCB. 10.3. PCB Layout Consideration PCB Layout is essential to the performance of customers product. Here are some rules that should be followed:

Impedance control Control the impedance of RF trace as close as possible to 50. If the thickness between RF_ANT pad and the ground layer is less than 0.4mm, it could significantly decrease the output power. Therefore, when they are too close, we strongly suggest removing the copper in the layer beneath the RF_ANT pad. If RF trace routes to another layer, add GND via along with it to keep GND integral. The clearance between RF trace and ground plane in same layer should be at least twice the RF trace width. Make RF trace as short as possible Place the module and the matching circuit near the antenna pad. Shorten the length of RF trace. Place the antenna PAD in the corner or at the edge of host board. Protect RF trace Avoid placing noise generating traces such as digital signal or clock line near RF trace in the same layer. Carefully route other traces in the layers adjacent to the RF trace, remember not to route in parallel with the RF trace. If possible, keep those traces far away from the RF trace. An RF test point is located at the bottom side of M10 for manufacture purpose. The copper which is close to this test point in the top layer of customers host board must be kept out or removed. No signal trace should be placed in the top layer and the second layer beneath this test point. Insert a picture. Customer can use either antenna PAD or RF connector to connect the antenna. If antenna PAD is adopted, Figure 9 is a reference design for a four-layer PCB. Make the space on all layers beneath antenna pad keep-out. Place a ground PAD near the antenna PAD. The distance between GND PAD and antenna PAD can be around 1.8mm. The size of antenna PAD can be 1.8mm*1.8mm, and the GND PAD should be a little bigger, e.g. 2.5mm*2.5mm. Add several GND via near or on the GND PAD to reduce impedance from the GND PAD to the RF reference ground. Figure 9: Reference PCB design w ith antenna pad in a four-layer PCB If RF connector is adopted, place the RF connector close to module RF_ANT, and add several ground via close to the GND PAD of RF connector. Figure 10 is the reference PCB design. Layer3L2 under ANT PADL2 under RF PADL3 under ANT PADLayer2Layer4L4 under ANT PADLayer1Under RF TEST pointRF PADANT PADGND PADMatching Figure 10: Reference PCB design w ith RF connector in a four-layer PCB The stack-up of the four-layer PCB is shown in Figure 11. Figure 11: Stack-up of the four-layer PCB Layer2Layer4Layer1Layer3MatchingRF connectorUnder RF TEST pointRF PADUnder RF connectorUnder RF PAD 11. The Recommended Ramp-soak-spike Reflow Profile Figure 12: The recommended ramp-soak-spike reflow p rofile FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. FCC RF exposure statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. FCC Label Instructions The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: Contains Transmitter Module FCC ID: YQD-M10" or Contains FCC ID: YQD-M10 Any similar wording that expresses the same meaning may be used.

EXHIBIT C - EUT INTERNAL PHOTOGRAPHS EUT Shielding off View EUT Bottom View

EXHIBIT B - EUT EXTERNAL PHOTOGRAPHS EUT Top View EUT Top Shielding off View EUT Bottom View

M 1 0 $2-W1531 FCC ID:YQD-M10 RFROOA01V11M128_NMX MIMI SN:MP6F709D3000137 MINI IMEI:862894022491636

Company:Queclink Wireless Solutions Co.,Ltd Add:Room 501, Building 9, No 99, TianZhou Road, Shanghai, China Tel+86 21 51082965-805 Fax+86 21 54451990 FCC Confidential Authorization Date:2017-09-21 FEDERAL COMMUNICATIONS COMMISSIONS Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Subject: Confidentiality Request regarding application for certification of FCC ID: YQD-M10 . In accordance with Sections 0.457 and 0.459 of the Commissions Rules, Queclink Wireless Solutions Co.,Ltd , hereby requests long-term confidential treatment of information accompanying this application as outlined below:

Block Diagram Schematics Circuit Description Bom Tune up procedure The above materials contain proprietary and confidential information not customarily released to the public. The public disclosure of these materials provides unjustified benefits to its competitors in the market. Sincerely, Signature:

Typed or Printed Name : Wei Peng Title :Manager QA-FR-171-A

Company:Queclink Wireless Solutions Co.,Ltd Add:Room 501, Building 9, No 99, TianZhou Road, Shanghai, China Tel: +86 21 51082965-805 Fax:+86 21 54451990 Applicant FCCID:

QueclinkWirelessSolutionsCo.,Ltd YQDM10 RequestforModularApproval RequestforLimitedModularApproval Section15.212ModularTransmitters 1 2 3 4 5 Requirements EUTConditions Comply(Y/N) SingleModularApprovalRequirements conditions The radio elements of the modular transmittermusthavetheirownshielding. Thephysicalcrystalandtuningcapacitors may be located external to the shielded radioelements. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the comply with part 15 module will requirements under of excessivedataratesorovermodulation. The modular transmitter must have itsownpowersupplyregulation. The modular transmitter must comply withtheantennaandtransmissionsystem requirements of 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique all connectionsbetweenthemoduleandthe antenna, cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals underparagraph(b)ofthissection. The modular transmitter must be testedinastandaloneconfiguration, i.e., the module must not be inside another device during testing for compliance 15 requirements.Unlessthetransmitter module will be battery powered, it line must comply with the AC conducted requirements found in including antenna coupler with part the

(at Y Y Y Y Y The shielding of the radio portion be demonstrated in EXHIBIT B ExternalPhoto. can All inputs to the modules are buffered through logic ormicroprocessorinputs. RefertoSchematics. Themodularratedpoweris 4.0V.RefertoUsermanual. Themodulartransmitter doesnthaveantenna connectorwhichis accessiblebyuser.Please referto:External photographexhibit.The Maximumantennagain allowedforuserwiththis deviceis7.0dBiinGSM850/

GPRS850and3.00dBiin GSM1900/GPRS1900. Themodulartransmitter isconnectedtothe controlledboardwhen testing. Pleaserefertosetup photo. 6 its and own is unknown, at 15.207. AC or DC power lines and datainput/outputlinesconnectedto the module must not contain ferrites,unlesstheywillbemarketed withthemodule(see15.27(a)).The length of these lines shall be the lengthtypicalofactualuseor,ifthat length least 10 centimeterstoinsurethatthereisno coupling between the case of the module and supporting equipment. Any accessories, peripherals, or supportequipmentconnectedtothe module during testing shall be unmodified commercially available(see15.31(i)). If using a permanently affixed label, the modular transmitter must be labeled with FCC identificationnumber,and,iftheFCC identification number is not visible when the module is installed inside another device, then the outside of thedeviceintowhichthemoduleis installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module ID:

YQDM10 or Contains FCC ID:

YQDM10. Any similar wording that expressesthesamemeaningmaybe used. The Grantee may either provide such a label, an example of in the which must be application equipment authorization, or, must provide adequateinstructionsalongwiththe module this requirement. In the latter case, a copy of these instructions must be included for equipmentauthorization. the application included explain which FCC for in Y FCCIDisshownonthe labelandpermanently affixedtothismodular transmitter,pleaseRefer tothelabeldrawing. 7 8 requirements The modular transmitter must comply with any specific rules or operating that to a complete ordinarily apply transmitter and the manufacturer must provide adequate instructions alongwiththemoduletoexplainany such requirements. A copy of these instructionsmustbeincludedinthe application equipment authorization. The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. for Y Y Thenecessary explanationtobe compliedwiththis requirementis containedintheuser manual,please referstotheUser manual. Themodularcomply withanyapplicableRF exposurerequirements initsfinal configuration. SincerelyYours, Signature:

Printedname:WeiPeng Title:manager

Company:Queclink Wireless Solutions Co.,Ltd Add:Room 501, Building 9, No 99, TianZhou Road, Shanghai, China Tel+86 21 51082965-805 Fax+86 21 54451990 FCC Authorization Date: 2017-09-21 FEDERAL COMMUNICATIONS COMMISSION Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Subject: Agent Authorization To whom it may concern:

We, Queclink Wireless Solutions Co.,Ltd,the undersigned, Hereby authorizes Bay Area Compliance Laboratories Corporation to act on its behalf in all matters relating to application for Equipment authorization, including the signing of all documents relating to these matters. All acts carried out by Bay Area Compliance Laboratories Corp. on our behalf shall have the same effect as our own action. We, the undersigned, hereby certify that we are not subject to a denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. This authorization is valid until further written notice from the applicant. Sincerely Yours, Signature:

Typed or Printed Name: Wei Peng Title : Manager QA-FR-170-B