FCC ID: XMR202107HC06U Bluetooth Module

HC06U Hardware Design Bluetooth Module Series Version: 1.0 Date: 2021-08-10 Status: Released Bluetooth Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to support@quectel.com. General Notes Quectel offers the information as a service to its customers. The information provided is based upon customers requirements. Quectel makes every effort to ensure the quality of the information it makes available. Quectel does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. All information supplied herein is subject to change without prior notice. Disclaimer it is possible that While Quectel has made efforts to ensure that the functions and features under development are free from errors, these functions and features could contain errors, inaccuracies and omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, features and functions under development. To the implied or express, with respect maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable. to the use of Duty of Confidentiality The Receiving Party shall keep confidential all documentation and information provided by Quectel, except when the specific permission has been granted by Quectel. The Receiving Party shall not access or use Quectels documentation and information for any purpose except as expressly provided herein. Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to any third party without the prior written consent by Quectel. For any noncompliance to the above requirements, unauthorized use, or other illegal or malicious use of the documentation and information, Quectel will reserve the right to take legal action. HC06U_Hardware_Design 1 / 31 Bluetooth Module Series Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. HC06U_Hardware_Design 2 / 31 Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. if the device supports it. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or HC06U_Hardware_Design 3 / 29 metal powders. Bluetooth Module Series HC06U_Hardware_Design 4 / 31 Bluetooth Module Series About the Document Revision History Version Date Author Description

1.0 2021-08-10 Elinor WANG/Lucas HUANG Creation of the document 2020-08-10 Elinor WANG/Lucas HUANG First official release HC06U_Hardware_Design 5 / 31 Bluetooth Module Series Contents Safety Information........................................................................................................................................................ 3 About the Document.................................................................................................................................................... 5 Contents.........................................................................................................................................................................6 Table Index.................................................................................................................................................................... 7 Figure Index.................................................................................................................................................................. 8 1 Introduction.................................................................................................................................................................9 2 Product Overview......................................................................................................................................................10 2.1. General Description....................................................................................................................................... 10 2.2. Key Features...................................................................................................................................................11 2.3. Antenna requirement.................................................................................................................................... 12 3 Application Interfaces............................................................................................................................................... 14 3.1. Pin Assignment...............................................................................................................................................14 3.2. Pin Description...............................................................................................................................................15 3.3. Power Supply................................................................................................................................................. 16 3.4. UART Interfaces..............................................................................................................................................16 3.5. RESET..............................................................................................................................................................17 3.6. I2C Interface................................................................................................................................................... 17 3.7. SPI...................................................................................................................................................................17 3.8. GPIOs..............................................................................................................................................................18 3.9. ADC Interfaces................................................................................................................................................18 4 Electrical Characteristics........................................................................................................................................... 20 4.1. Absolute Maximum Ratings...........................................................................................................................20 4.2. Recommended Operating Conditions........................................................................................................... 20 4.3. RF Characteristics...........................................................................................................................................21 4.3.1. BLE Transmitter...............................................................................................................................21 4.3.2. BLE Receiver...................................................................................................................................21 4.3.3. Power Consumption....................................................................................................................... 22 5 Module Function Description................................................................................................................................... 23 5.1. RF Transmitter................................................................................................................................................ 23 5.2. Bluetooth Baseband Unit...............................................................................................................................23 6 Mechanical Information............................................................................................................................................25 6.1. Mechanical Dimensions.................................................................................................................................25 6.2. Recommended Footprint...............................................................................................................................26 6.3. Top and Bottom Views................................................................................................................................... 27 7 Storage, Manufacturing and Packaging.................................................................................................................... 28 7.1. Storage Condition.......................................................................................................................................... 28 7.2. Manufacturing and Soldering........................................................................................................................ 29 7.3. Packaging Specification..................................................................................................................................30 8 Appendix Reference.................................................................................................................................................. 32 HC06U_Hardware_Design 6 / 31 Bluetooth Module Series Table Index Table 1: Key Features...............................................................................................................................................11 Table 2: Pin Description........................................................................................................................................... 15 Table 3: Absolute Maximum Ratings..................................................................................................................... 20 Table 4: Recommended Operating Conditions.................................................................................................... 20 Table 5: BLE Transmitter......................................................................................................................................... 21 Table 6: BLE Receiver..............................................................................................................................................21 Table 7: Power Consumption.................................................................................................................................. 22 Table 8: Mechanical Dimensions (Top View)....................................................................................................... 25 Table 9: Recommended Thermal Profile Parameters.........................................................................................30 Table 10: Related Document...................................................................................................................................32 HC06U_Hardware_Design 7 / 31 Bluetooth Module Series Figure Index Figure 1: Module Block Diagram.......................................................................................... Figure 2: Pin Assignment....................................................................................................................................... 14 Figure 3: Power on Reset Timing......................................................................................................................... 17 Figure 4: SPI Connection....................................................................................................................................... 17 Figure 5: SPI Timing................................................................................................................................................18 Figure 6: Bluetooth Baseband............................................................................................................................... 24 Figure 7: Top and Side Dimensions (Top and Side View)...............................................................................25 Figure 8: PCB Package Dimensions....................................................................................................................26 Figure 9: Top and Bottom Views...........................................................................................................................27 Figure 10: Reflow Soldering Thermal Profile......................................................................................................29 Figure 11: Tape Specifications..............................................................................................................................31 HC06U_Hardware_Design 8 / 29 Bluetooth Module Series 1 Introduction This document defines the HC06U module and describes its air interfaces and hardware interfaces which are connected with customers application. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use HC06U module to design and set up applications easily. The module is limited to OEM installation ONLY. And the OEM integrator is responsible for ensuring the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile or fixed applications. HC06U_Hardware_Design 9 / 31 Bluetooth Module Series 2 Product Overview 2.1. General Description Quectel HC06U is a low power Bluetooth on-chip system (SoC) solution. It integrates high performance and low power RF transceiver and rich peripheral IO extension. Mainly used in low-power data transmission, keyboard, mouse, remote control, sports and leisure equipment, mobile phone accessories and consumer electronics products. HC06U conforms to the Bluetooth 5.0 Specification and supports all Bluetooth Standard 5.0 functions. This module integrates 48 MHz high-performance MCU, GPIO, I2S, I2C, SPI and UART, supports 24 MHz external crystal oscillator, multi-purpose 12-bit ADC. The module Integrates with 256 KB ROM, 128 KB SRAM. It also supports user-defined IDE system SFLASH MCU development and JTAG software upgrade. Radio frequency:

Receiving sensitivity: -90 dBm Transmission power: max. 2 dBm Peripherals:

SPI 1 I2C 1 UART 1 GPIOs Battery test Software:

Supports Bluetooth 5.0 single mode protocol stack (BLE) Support air software upgrade and configuration ROM boot Support for debugging mode Power management:

Multiple power management modes, support for software shutdown and hardware wake up Wide voltage input: 2.03.6 V HC06U_Hardware_Design 10 / 31 Bluetooth Module Series CPU:

ARM CM3, max. 48 MHz 128 KB SRAM 256 KB ROM, ROM Encryption 4 Mb SFLASH Clocks:

24 MHz crystal oscillator clock, 24 MHz RC clock, 32.768 kHz crystal oscillator clock, 32.768 kHz RC clock Link Controller:

Bluetooth 5.0 LE physical layer, controller layer 2.4 GHz Private transport protocol 2.2. Key Features The following table describes the key features of HC06U module. Table 1: Key Features Specification HC06U Bluetooth specification Bluetooth 5.0 Bluetooth level Class 2 Distance Antenna Bluetooth 45 m (open area) Built-in ceramic antenna or external antenna Output power 2 dBm (typical) Receive sensitivity

-90 dBm (typical) Support mode Master-slave Profile GATT Hardware interface UART, GPIO Operating voltage 3.3 V Operating temperature

-40 to +85 C HC06U_Hardware_Design 11 / 31 Physical Characteristics

(16.5 0.2) mm (13.3 0.2) mm (2.3 0.2) mm Bluetooth Module Series 2.3. Antenna requirement Type Requirements Frequency Range 2.4002.500 GHz VSWR Gain (dBi) Input Impedance () Polarization Type 2 1dBi 50 Vertical Description 50 mm 10 mm with reverse SMA Male Antenna The reference impedence simulation and PCB design is shown below:

HC06U_Hardware_Design 12 / 31 Bluetooth Module Series HC06U_Hardware_Design 13 / 31 Bluetooth Module Series 3 Application Interfaces 3.1. Pin Assignment GND 3V3 BOOT0 SWDIO SWCLK PA7 SPI_CSB SPI_CLK SPI_MISO SPI_MOSI I2C_SCL I2C_SDA 1 2 3 4 5 6 7 8 9 10 11 12 HC06U Top View 3 1 4 1 5 1 6 1 7 1 8 1 9 1 31 30 29 28 27 26 25 24 23 22 21 20 GND ANT GND PB14 PB13 PB11 PB10 PB12 ADC_IN5 ADC_IN4 UART_TX UART_RX S T C _ T R A U

I C S D N N O C S T R _ T R A U 0 B P 1 B P 2 B P T E S E R Power GND SPI DEBUG I2C UART RF Other signal Figure 2: Pin Assignment HC06U_Hardware_Design 14 / 31 Bluetooth Module Series 3.2. Pin Description Table 2: Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Pin Description Functions GND 3V3 BOOT0 SWDIO SWCLK PA7 SPI_CSB SPI_CLK GND

+3.3 V power supply Pull down into programming mode, hover or pull up into working mode Debug port: SWDIO Debug port: SWCLK Pull up into sleep, pull down the wake device SPI communication port SPI communication port SPI_MISO SPI communication port SPI_MOSI SPI communication port I2C_SCL I2C_SDA I2C communication port I2C communication port UART_CTS Clear to Send (active low) CONN/DISC CONN/DISC UART_RTS Request to Send (active low) PB0 PB1 PB2 Configurable GPIO Configurable GPIO Configurable GPIO RESET RESET (active low) UART_RX UART data receive UART_TX UART data transmission ADC_IN4 Analog-digital conversion HC06U_Hardware_Design 15 / 31 Bluetooth Module Series ADC_IN5 Analog-digital conversion PB12 PB10 PB11 PB13 PB14 GND ANT GND Configurable GPIO Configurable GPIO Configurable GPIO Configurable GPIO Configurable GPIO Ground RF Antenna (optional) Ground 23 24 25 25 27 28 29 30 31 NOTE All digital IO ports can be configured as any function of GPIO. 3.3. Power Supply Standard 3.3 V power supply. 3.4. UART Interfaces The UART interface is used for serial communication with a peripheral, modem (data carrier equipment, DCE) or data set. Data is written from a master (CPU) over the APB bus to the UART interface and it is converted to serial form and transmitted to the destination device. Serial data is also received by the UART interface and stored for the master (CPU) to read back. The UART interface contains registers to control the character length, baud rate, parity generation/checking, and interrupt generation. Although there is only one interrupt output signal from the UART interface, there are several prioritized interrupt types that can be responsible for its assertion. Each of the interrupt types can be separately enabled or disabled by the control registers. HC06U has 2 UARTs; the UART0 is a common 2 wire (TX/RX) controller, and the UART1 support low control (CTS/RTS). UART1 also supports ISO7816 protocols. HC06U_Hardware_Design 16 / 31 Bluetooth Module Series 3.5. RESET It supports hardware reset. The reset sequence is shown in the figure below, the Trst > 50 ms. Figure 3: Power on Reset Timing 3.6. I2C Interface The I2C interface is a master or slave interface. It supports 100 kHz, 400 kHz and 800 kHz clock rates for controlling EEPROM etc. The I2C interface provides several data formats and can fit various I2C peripherals. Sequential reading and writing are supported to improve throughputs. The I2C support DMA operation for extra MCU free data transfer. The I2C work as either master or slave, but cannot change the working mode after configuration. 3.7. SPI The Serial Peripheral Interface (SPI) bus is a synchronous serial communication interface specification used for short distance communication, primarily in embedded systems. The HC06U integrates 2 SPIs, they can work in either master or slave mode and support DMA or software mode to transfer data. The master or slave controller only supports point-to-point connection by hardware. Both the SPI has only one CS pin. The connection is shown below. Figure 4: SPI Connection HC06U_Hardware_Design 17 / 31 SPI makes it suitable for most of SPI slave devices for its flexibility. SPI offers four modes due to the programmable ability of SCKs polarity and phase. The delay from CS to SCK, the delay from SCK to NCS and SCK period are also programmable. SPI timing diagram is shown in figure below:

Bluetooth Module Series Figure 5: SPI Timing 3.8. GPIOs Programmable GPIOs;

Each pin can choose either pull-up or pull-down resistors;

Each pin remains the last state when the chipset enters sleep mode;

Each pin interrupt can wake up chipset from sleep mode. 3.9. ADC Interfaces HC06U integrates high speed and low power consumption 12-bit General Purpose Analog-to-Digital Converter (GPADC) for sampling an external signal. It can operate in unipolar (single-ended) mode as well as bipolar (differential) mode. The ADC has its own 1.2 V voltage regulator (LDO), which represents the full-scale reference voltage. The features of ADC interfaces are as follows:

12-bit dynamic ADC with 65 ns conversion time Maximum sampling rate 3.3 M sample/s Ultra-low power (5 A typical supply current at 100 k sample/s) HC06U_Hardware_Design 18 / 31 Bluetooth Module Series Single-ended as well as differential input with two input scales Eight single-ended or four differential external input channels Battery monitor function Chopper function Offset and zero scale adjustment Common-mode input voltage adjustment HC06U_Hardware_Design 19 / 31 Bluetooth Module Series 4 Electrical Characteristics 4.1. Absolute Maximum Ratings Table 3: Absolute Maximum Ratings Operating mode Storage Temperature Human Body Model ESD Machine Model Charge Device Mode Min.

-40 2000 200 500 Max. 125

Unit C V V V 4.2. Recommended Operating Conditions Table 4: Recommended Operating Conditions Operating mode Min. Typ. Max. Unit Operating temperature I/O voltage Supply voltage

-40 3.1 2

3.3 3.3 85 3.5 3.6 C V V HC06U_Hardware_Design 20 / 31 Bluetooth Module Series 4.3. RF Characteristics 4.3.1. BLE Transmitter Table 5: BLE Transmitter Parameter Min. Typ. Max. BLE Specification Unit RF transmitted power Power control range Frequency offset Frequency drift Frequency drift rate Initial carrier drift MOD Char f1avg MOD Char f2max

-18

225

MOD Char f2avg/f1avg 0.84 2

4.02

-3.31

-3.13

-2.25 250 220

2

-64

-150150

-5050

-2020

-2020 275

> 185

> 0.8 dBm dB kHz kHz kHz/50 s kHz kHz kHz

4.3.2. BLE Receiver Table 6: BLE Receiver Parameter Sensitivity I/C co-channel Adjacent channel selectivity

F = F0 + 1 MHz F = F0 - 1 MHz F = F0 + 2 MHz F = F0 - 2 MHz F = F0 + 3 MHz F = F0 - 3 MHz Min. Typ. Max. BLE Standard Unit

-93

-90

-81

-70 dBm

9 1

-3 21 23 33 34

-21

-15

-15 15 15 27 27 dB dB dB dB dB dB dB HC06U_Hardware_Design 21 / 31 NOTE Carrier signal strength -67 dBm, adjacent channel interference modulation signal, BER = 0.1 %. Bluetooth Module Series 4.3.3. Power Consumption Table 7: Power Consumption Operating Modes Min. Typ. Max. Unit Note Deep sleep Advertising Advertising Bluetooth receive Bluetooth transmit BLE

31.44 227 3.98 10.88 8.42 4.7

A A mA mA mA mA Stop the broadcast function, the module enters the sleep state ADV interval = 320 ms, the module enters the sleep state ADV interval = 320 ms, the module exits the sleep state Conn interval = 11.25 ms 519 bytes transmit every 1 ms ADV interval = 320 ms, ACTIVE state after connecting the device HC06U_Hardware_Design 22 / 31 Bluetooth Module Series 5 Module Function Description 5.1. RF Transmitter The Radio Transceiver implements the RF part of the Bluetooth Low Energy protocol. Together with the Bluetooth 5.0 PHY layer, this provides a reliable wireless communication. All RF blocks are supplied by on-chip low-drop out-regulators (LDOs). The Bluetooth LE radio comprises the receiver, transmitter, synthesizer, Rx/Tx combiner block, and biasing LDOs. 5.2. Bluetooth Baseband Unit The BLE (Bluetooth Low Energy) core is a qualified Bluetooth 5.0 baseband controller compatible with Bluetooth Smart specification and it oversees packet encoding/decoding and frame scheduling. Features:

All device classes support (broadcaster, central, observer, peripheral) All packet types (advertising/data/control) Encryption (AES/CCM) Bit stream processing (CRC) Frequency Hopping calculation Low power modes supporting 32.768 kHz HC06U_Hardware_Design 23 / 31 Bluetooth Module Series Figure 6: Bluetooth Baseband HC06U_Hardware_Design 24 / 31 Bluetooth Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of HC06U module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified 6.1. Mechanical Dimensions Figure 7: Top and Side Dimensions (Top and Side View) The detailed size information of HC06U is as follows:

Table 8: Mechanical Dimensions (Top View) PCB Package Mechanical Size Stamp holes

(16.5 0.2) mm (13.3 0.2) mm (2.3 0.2) mm Process Type SMD HC06U_Hardware_Design 25 / 31 Bluetooth Module Series 6.2. Recommended Footprint Figure 8: PCB Package Dimensions HC06U_Hardware_Design 26 / 31 6.3. Top and Bottom Views Bluetooth Module Series Figure 9: Top and Bottom Views HC06U_Hardware_Design 27 / 31 Bluetooth Module Series 7 Storage, Manufacturing and Packaging 7.1. Storage Condition The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 35 % to 60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 1 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 1 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. HC06U_Hardware_Design 28 / 31 Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking the drying oven. procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [1]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 10: Reflow Soldering Thermal Profile HC06U_Hardware_Design 29 / 31 Bluetooth Module Series Table 9: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 23 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 7.3. Packaging Specification The module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The following figures show the packaging details, measured in mm. HC06U_Hardware_Design 30 / 31 Bluetooth Module Series Figure 11: Tape Specifications HC06U_Hardware_Design 31 / 31 Bluetooth Module Series 8 Appendix Reference Table 10: Related Document Document Name

[1] Quectel_Module_Secondary_SMT_Application_Note HC06U_Hardware_Design 32 / 31 Bluetooth Module Series Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. this device must accept any interference received, including interference that may cause un-desired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equip-ment does cause harmful interference to radio or television reception, which can be determined by turning the equipment o and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important NoteThis radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other ra-dio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the mod-ular HC06U_Hardware_Design 33 / 31 Bluetooth Module Series transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be in-stalled and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID: XMR202107HC06U.The final end product must be labeled in a visible area with the following: Contains Transmitter Mod-ule FCC ID: XMR202107HC06U This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20cm is main-tained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance require-ments required with this module installed. HC06U_Hardware_Design 34 / 31

Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2021/7/25_ Subject: Confidentiality Request for: _____ FCC ID: XMR202107HC06U ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR202107HC06U _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

Jean Hu

(Signature/Title2)

(Print name)

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Company Limited XMR202107HC06U HC06U The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Modular approval requirement

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and to the tuning capacitors may be located external shielded radio elements. EUT Condition The radio elements of the modular transmitter have their own shielding. Comply YES

(b) The modular transmitter have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. must

(c)The modular transmitter must have its own power supply regulation.

(d) the The modular antenna transmitter must transmission comply with system and requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, installation including the cable). The professional provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The be must modular transmitter tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES All power lines derived from the host device are regulated before energizing other circuits internal to SMART MODULE . Please see schematic.pdf the modular has specific antenna with unique antenna connector, refer to external photos. YES YES YES SMART MODULE was tested in a standalone configuration via a PCMCIA extender. Please see spurious setup Quectel Wireless Solutions Company Limited least 10 centimeters to insure that lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at there is no the module and coupling between the case of supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)) must not be in side another device during testing.

(f)The modular be transmitter equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. must

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedon theintendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. YES YES YES The label position of SMART MODULE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID:

XMR202107HC06U. Please see the label.pdf SMART MODULE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. SMART MODULE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. Quectel Wireless Solutions Company Limited Dated By:

2021/07/25 Jean Hu Signature Printed Title: Project Manager On behalf of :

Quectel Wireless Solutions Company Limited Telephone:

+86-21-51086236 ext 6511

Quectel Wireless Solutions Company Limited POWER OF ATTORNEY DATE:July 25, 2021 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR202107HC06U. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited