FCC ID: XMR201202M10 GSM/GPRS Module

 

M10 Quectel Cellular Engine Hardware Design M10_HD_V3.0 M10 Hardware Design Document Title M10 Hardware Design Revision Date Status 3.0 2012-03-02 Released Document Control ID M10_HD_V3.0 General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel. Quectel has not undertaken any independent search for additional information, relevant to any information that may be in the customers possession. Furthermore, system validation of this product designed by Quectel within a larger electronic system remains the responsibility of the customer or the customers system integrator. All specifications supplied herein are subject to change. Copyright This document contains proprietary technical information of Quectel Co., Ltd. Copying of this document, distribution to others, and communication of the contents thereof, are forbidden without permission. Offenders are liable to the payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. All specification supplied herein are subject to change without notice at any time. Copyright Quectel Wireless Solutions Co., Ltd. 2012 M10_HD_V3.0

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M10 Hardware Design Contents Contents ............................................................................................................................................ 2 Table Index ........................................................................................................................................ 4 Figure Index ...................................................................................................................................... 5 0. Revision history ............................................................................................................................ 7 1. Introduction ................................................................................................................................... 9 1.1. Related documents .............................................................................................................. 9 1.2. Terms and abbreviations .................................................................................................... 10 1.3. Directives and standards .................................................................................................... 12 1.3.1. FCC Statement ........................................................................................................ 12 1.3.2. FCC Radiation exposure statement ......................................................................... 12 1.3.3. Industry Canada licence .......................................................................................... 12 1.4. Safety cautions .................................................................................................................. 13 2. Product concept ........................................................................................................................... 15 2.1. Key features ...................................................................................................................... 15 2.2. Functional diagram ............................................................................................................ 17 2.3. Evaluation board ............................................................................................................... 18 3. Application interface ................................................................................................................... 19 3.1. Pin of module .................................................................................................................... 19 3.1.1. Pin assignment ......................................................................................................... 19 3.1.2. Pin description ......................................................................................................... 20 3.2. Operating modes ............................................................................................................... 25 3.3. Power supply ..................................................................................................................... 26 3.3.1. Power supply pins.................................................................................................... 27 3.3.2. Minimizing supply voltage drop.............................................................................. 27 3.3.3. Monitor power supply ............................................................................................. 28 3.4. Power up and down scenarios ........................................................................................... 28 3.4.1. Power on .................................................................................................................. 28 3.4.2. Power down ............................................................................................................. 31 3.4.3. Restart module using the PWRKEY pin.................................................................. 35 3.5. Power saving ..................................................................................................................... 36 3.5.1. Minimum functionality mode .................................................................................. 36 3.5.2. SLEEP mode (slow clock mode) ............................................................................. 36 3.5.3. Wake up module from SLEEP mode ...................................................................... 37 3.6. Summary of state transitions (except SLEEP mode) ......................................................... 37 3.7. RTC backup ...................................................................................................................... 37 3.8. Serial interfaces ................................................................................................................. 39 3.8.1. UART Port .............................................................................................................. 40 3.8.2. Debug Port ............................................................................................................... 43 3.8.3. UART Port 3 ........................................................................................................... 44 3.8.4. UART Application .................................................................................................. 45 3.9. Audio interfaces................................................................................................................. 46 M10_HD_V3.0

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M10 Hardware Design 3.9.1. Decrease TDD noise and other noise ...................................................................... 47 3.9.2. Microphone interfaces configuration ....................................................................... 48 3.9.3. Receiver and speaker interface configuration .......................................................... 49 3.9.4. Earphone interface configuration ............................................................................ 51 3.10. SIM card interface ........................................................................................................... 52 3.10.1. SIM card application ............................................................................................. 52 3.10.2. Design considerations for SIM card holder ........................................................... 54 3.11. Keypad interface .............................................................................................................. 56 3.12. ADC................................................................................................................................. 57 3.13. Behaviors of the RI ......................................................................................................... 58 3.14. Network status indication ................................................................................................ 60 3.15. Operating status indication .............................................................................................. 61 3.16. General purpose input & output (GPIO) ......................................................................... 61 3.17. Open drain output (LIGHT_MOS) .................................................................................. 62 3.18. SD card interface ............................................................................................................. 63 4. Antenna interface ........................................................................................................................ 65 4.1. Antenna installation ........................................................................................................... 65 4.2. RF output power ................................................................................................................ 66 4.3. RF receiving sensitivity ..................................................................................................... 66 4.4. Operating frequencies ....................................................................................................... 66 4.5. Recommendation of RF pad welding ................................................................................ 66 5. Electrical, reliability and radio characteristics ............................................................................ 68 5.1. Absolute maximum ratings ................................................................................................ 68 5.2. Operating temperature ....................................................................................................... 68 5.3. Power supply ratings ......................................................................................................... 69 5.4. Current consumption ......................................................................................................... 70 5.5. Electro-static discharge ..................................................................................................... 72 6. Mechanical dimensions ............................................................................................................... 73 6.1. Mechanical dimensions of module .................................................................................... 73 6.2. Footprint of recommendation ............................................................................................ 75 6.3. Top view of the module .................................................................................................... 77 6.4. Bottom view of the module ............................................................................................... 77 Appendix A: GPRS coding schemes ............................................................................................... 78 Appendix B: GPRS multi-slot classes ............................................................................................. 79 M10_HD_V3.0

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M10 Hardware Design Table Index TABLE 1: RELATED DOCUMENTS ............................................................................................. 9 TABLE 2: TERMS AND ABBREVIATIONS ................................................................................ 10 TABLE 3: MODULE KEY FEATURES ........................................................................................ 15 TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE .................................................................................................................. 17 TABLE 5: PIN DESCRIPTION ...................................................................................................... 20 TABLE 6: OVERVIEW OF OPERATING MODES ...................................................................... 25 TABLE 7: AT COMMANDS USED IN ALARM MODE ............................................................. 31 TABLE 8: SUMMARY OF STATE TRANSITION ....................................................................... 37 TABLE 9: LOGIC LEVELS OF THE SERIAL INTERFACE ....................................................... 40 TABLE 10: PIN DEFINITION OF THE SERIAL INTERFACES ................................................. 40 TABLE 11: PIN DEFINITION OF AUDIO INTERFACE ............................................................. 47 TABLE 12: TYPICAL ELECTRET MICROPHONE CHARACTERISTIC ................................. 51 TABLE 13: TYPICAL SPEAKER CHARACTERISTIC ............................................................... 51 TABLE 14: PIN DEFINITION OF THE SIM INTERFACE .......................................................... 52 TABLE 15: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER .................................. 55 TABLE 16: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ......................................... 55 TABLE 17: PIN DEFINITION OF THE KEYPAD INTERFACE ................................................. 56 TABLE 18: PIN DEFINITION OF THE ADC ............................................................................... 57 TABLE 19: CHARACTERISTIC OF THE ADC ........................................................................... 58 TABLE 20: BEHAVIORS OF THE RI ........................................................................................... 58 TABLE 21: WORKING STATE OF THE NETLIGHT .................................................................. 60 TABLE 22: PIN DEFINITION OF THE STATUS ......................................................................... 61 TABLE 23: PIN DEFINITION OF THE GPIO INTERFACE ....................................................... 62 TABLE 24: PIN DEFINITION OF THE LIGHT_MOS ................................................................. 62 TABLE 25: PIN DEFINITION OF THE SD CARD INTERFACE ............................................... 63 TABLE 26: PIN NAME OF THE SD CARD AND T-FLASH(MICRO SD) CARD ..................... 64 TABLE 27: PIN DEFINITION OF THE RF_ANT ........................................................................ 65 TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER ............................................ 66 TABLE 29: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY ............................ 66 TABLE 30: THE MODULE OPERATING FREQUENCIES ........................................................ 66 TABLE 31: ABSOLUTE MAXIMUM RATINGS ......................................................................... 68 TABLE 32: OPERATING TEMPERATURE ................................................................................. 68 TABLE 33: THE MODULE POWER SUPPLY RATINGS ........................................................... 69 TABLE 34: THE MODULE CURRENT CONSUMPTION .......................................................... 70 TABLE 35: THE ESD ENDURANCE (TEMPERATURE:25,HUMIDITY:45 %) .................... 72 TABLE 36: DESCRIPTION OF DIFFERENT CODING SCHEMES ........................................... 78 TABLE 37: GPRS MULTI-SLOT CLASSES ................................................................................ 79 M10_HD_V3.0

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M10 Hardware Design Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ...................................................................... 18 FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT ......................................................... 19 FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ................... 26 FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ................... 27 FIGURE 5: REFERENCE CIRCUIT OF THE VBAT INPUT ....................................................... 28 FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ......................................... 29 FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ................................................... 29 FIGURE 8: TIMING OF TURN ON SYSTEM ............................................................................. 30 FIGURE 9: TIMING OF TURN OFF THE MODULE .................................................................. 32 FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT .... 34 FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON ...................... 34 FIGURE 12: TIMING OF RESTART SYSTEM ............................................................................ 35 FIGURE 13: TIMING OF RESTART SYSTEM AFTER EMERGENCY SHUTDOWN ............. 35 FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ........................................ 38 FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ............................................ 38 FIGURE 16: RTC SUPPLY FROM CAPACITOR ......................................................................... 38 FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC ....................................... 39 FIGURE 18: CONNECTION OF ALL FUNCTIONAL UART PORT .......................................... 42 FIGURE 19: CONNECTION OF THREE LINES UART PORT ................................................... 42 FIGURE 20: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL .......... 43 FIGURE 21: CONNECTION OF SOFTWARE UPGRADE ......................................................... 43 FIGURE 22: CONNECTION OF SOFTWARE DEBUG .............................................................. 44 FIGURE 23: CONNECTION OF AUXILIARY UART PORT ...................................................... 44 FIGURE 24: 3.3V LEVEL MATCH CIRCUIT .............................................................................. 45 FIGURE 25: 5V LEVEL MATCH CIRCUIT ................................................................................. 45 FIGURE 26: RS232 LEVEL MATCH CIRCUIT ........................................................................... 46 FIGURE 27: MICROPHONE INTERFACE CONFIGURATION OF AIN1&AIN2 ..................... 48 FIGURE 28: SPEAKER INTERFACE CONFIGURATION OF AOUT1 ...................................... 49 FIGURE 29: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1 ..... 49 FIGURE 30: SPEAKER INTERFACE CONFIGURATION OF AOUT2 ...................................... 50 FIGURE 31: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2 ..... 50 FIGURE 32: EARPHONE INTERFACE CONFIGURATION ...................................................... 51 FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD ............................................ 53 FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD ............................................ 53 FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER ...................................... 54 FIGURE 36: MOLEX 91228 SIM CARD HOLDER ..................................................................... 55 FIGURE 37: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE ..................................... 57 FIGURE 38: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER .................................... 59 FIGURE 39: RI BEHAVIOUR OF DATA CALLING AS A RECEIVER ...................................... 59 FIGURE 40: RI BEHAVIOUR AS A CALLER ............................................................................. 59 FIGURE 41: RI BEHAVIOUR OF URC OR SMS RECEIVED .................................................... 60 M10_HD_V3.0

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M10 Hardware Design FIGURE 42: REFERENCE CIRCUIT OF THE NETLIGHT ........................................................ 60 FIGURE 43: REFERENCE CIRCUIT OF THE STATUS ............................................................. 61 FIGURE 44: REFERENCE CIRCUIT OF THE LIGHT_MOS ..................................................... 62 FIGURE 45: REFERENCE CIRCUIT OF SD CARD ................................................................... 63 FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE ......................................................... 65 FIGURE 47: RECOMMENDATION OF RF PAD WELDING ..................................................... 67 FIGURE 48: M10 TOP AND SIDE DIMENSIONSUNIT: MM ............................................ 73 FIGURE 49: M10 BOTTOM DIMENSIONSUNIT: MM ...................................................... 74 FIGURE 50: PAD BOTTOM DIMENSIONSUNIT: MM ...................................................... 74 FIGURE 51: FOOTPRINT OF RECOMMENDATIONUNIT: MM ...................................... 76 FIGURE 52: TOP VIEW OF THE MODULE ................................................................................ 77 FIGURE 53: BOTTOM VIEW OF THE MODULE ...................................................................... 77 FIGURE 54: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 .................................... 78 FIGURE 55: RADIO BLOCK STRUCTURE OF CS-4 ................................................................ 78 M10_HD_V3.0

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M10 Hardware Design 0. Revision history Revision Date 1.00 1.01 2009-06-27 Tracy ZHANG Initial 2009-09-18 Yong AN Author Description of change 1. Modified VRTC voltage inputting range. 2. Modified Figure 1. 3. Added Table 7 and Figure 4 with remark. 4. Modified ordering information content in 1.02 2009-11-12 Yong AN 1.03 2010-06-09 Yong AN 2.0 3.0 2010-07-30 DavidWEI 2012-02-28 LayneYE Chapter 6. 5. Added VCHG pin description. 6. Modified current consumption data in Table 36. 7. Added appendix A and B. 1. Baud rate of the main UART port is set to autobauding mode from former fixed baud rate of 115200 in default configuration. 2. Modified contents about autobauding in Chapter 3.8 3. Modified the SIM card detection function through AT+QSIMDET. 1. Added charging interface description. 2. Added Serial Port 3 interface description. 3. Added STATUS pin and its function description. 4. Added GPIO control by AT+QGPIO command. 5. Modified timing of powering on, powering down and restarting the module. 6. Added ESD level of SIM card interface. 7. Modified function description of audio AOUT2 channel. 8. Disabled VDD_EXT pin as the indication of power-on and power-down. 9. Both STATUS and AT+QGPIO functions are supported at R05A05 release version and later, while Serial Port 3 function will be supported at R06AXX and later. 1. Added recommendation of RF pad welding. 1. Modified the power supply range 2. Modified buzzer interface as RESERVED 3. Modified the display interface as SD interface 4. Modified the peak current in a transmitting burst 5. Modified the current consumption in GSM talk mode and GPRS communication mode 6. Modified the RF receiving sensitivity M10_HD_V3.0

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M10 Hardware Design 7. Deleted the content of charging function. M10_HD_V3.0

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M10 Hardware Design 1. Introduction This document defines the M10 module and describes the hardware interface of M10 module which are connected with the customer application and the air interface. This document can help customer quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customer can use M10 module to design and set up mobile applications easily. 1.1. Related documents Table 1: Related documents Document name SN

[1] M10_ATC Remark AT commands set new Serial asynchronous automatic dialing and control

[2]

[3]

[4]

[5]

Draft ITU-T recommendation V.25ter GSM 07.07 GSM 07.10 GSM 07.05

[6]

GSM 11.14

[7]

GSM 11.11

[8]

GSM 03.38

[9]

GSM 11.10

[10] GSM_UART_AN

[11] M10_HD_AN01

[12] GSM_FW_Upgrade_AN01

[13] M10_EVB_UGD cellular telecommunications Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment Data Circuit terminating Equipment (DTE DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital

(Phase 2+);

Specification of the SIM Application Toolkit for the Subscriber Identity module Mobile Equipment (SIM ME) interface Digital

(Phase 2+);

Specification of the Subscriber Identity module Mobile Equipment (SIM ME) interface Digital Alphabets and language-specific information Digital cellular telecommunications (Phase 2); Mobile Station

(MS) conformance specification; Part 1:

Conformance specification UART port application notes M10 hardware design application notes GSM Firmware upgrade application note M10 EVB user guide application notes telecommunications telecommunications

(Phase 2+);

cellular cellular M10_HD_V3.0

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M10 Hardware Design 1.2. Terms and abbreviations Table 2: Terms and abbreviations Abbreviation Description ADC AMR ARP ASIC BER BOM BTS CHAP CS CSD CTS DAC DRX DSP DCE DTE DTR DTX EFR EGSM EMC ESD ETS FCC FDMA FR GMSK GPRS GSM HR I/O IC IMEI Imax Inorm kbps LED Analog-to-Digital Converter Adaptive Multi-Rate Antenna Reference Point Application Specific Integrated Circuit Bit Error Rate Bill Of Material Base Transceiver Station Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data Clear To Send Digital-to-Analog Converter Discontinuous Reception Digital Signal Processor Data Communications Equipment (typically module) Data Terminal Equipment (typically computer, external controller) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global System for Mobile Communications Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity Maximum Load Current Normal Current Kilo Bits Per Second Light Emitting Diode M10_HD_V3.0

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M10 Hardware Design Abbreviation Description Lithium-Ion Li-Ion Mobile Originated MO MS Mobile Station (GSM engine) Mobile Terminated MT Password Authentication Protocol PAP PBCCH Packet Switched Broadcast Control Channel Printed Circuit Board PCB Protocol Data Unit PDU PPP Point-to-Point Protocol Radio Frequency RF Root Mean Square (value) RMS RTC Real Time Clock Receive Direction RX Subscriber Identification Module SIM SMS Short Message Service Time Division Multiple Access TDMA Terminal Equipment TE TX Transmitting Direction Universal Asynchronous Receiver & Transmitter UART Unsolicited Result Code URC USSD Unstructured Supplementary Service Data Voltage Standing Wave Ratio VSWR Maximum Voltage Value Vmax Vnorm Normal Voltage Value Minimum Voltage Value Vmin Maximum Input High Level Voltage Value VIHmax VIHmin Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value VILmax Minimum Input Low Level Voltage Value VILmin VImax Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value VImin Maximum Output High Level Voltage Value VOHmax VOHmin Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value VOLmax VOLmin Minimum Output Low Level Voltage Value Phonebook abbreviations FD LD MC ON RC SIM Fix Dialing phonebook SIM Last Dialing phonebook (list of numbers most recently dialed) Mobile Equipment list of unanswered MT Calls (missed calls) SIM (or ME) Own Numbers (MSISDNs) list Mobile Equipment list of Received Calls M10_HD_V3.0

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M10 Hardware Design Abbreviation Description SM SIM phonebook 1.3. Directives and standards The M10 module is designed to comply with the FCC statements. FCC ID is XMR201202M10. The Host system using M10, should have label indicating FCC ID: XMR201202M10. 1.3.1. FCC Statement Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. 1.3.2. FCC Radiation exposure statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. The manual of the host system, which uses M10, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M10 module depending on portable or Mobile status. Note: If a portable device (such as PDA) uses M10 module, the device needs to do permissive change and SAR testing. 1.3.3. Industry Canada license English version This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:

The Host system using M10, should have label indicating transmitter module IC:

a) This device may not cause harmful interference. b) This device must accept any interference, including interference that may cause undesired operation of the device. 10064-201202M10. French version Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio M10_HD_V3.0

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M10 Hardware Design exempts de licence. L'exploitation est autorise aux deux conditions suivantes :

a) b) l'appareil ne doit pas produire de brouillage, et Lutilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. 1.4. Safety cautions The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M10 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions about the use of mobile. Switch the cellular terminal or mobile off. Medical equipment may be sensitive to not operate normally for RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forget to think much of these instructions may lead to the flight safety or offend against local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gas or fume. Switch off the cellular terminal when you are near petrol station, fuel depot, chemical plant or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmosphere can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile while driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. M10_HD_V3.0

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M10 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in cellular terminal or mobile. M10_HD_V3.0

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M10 Hardware Design 2. Product concept The M10 is a Quad-band GSM/GPRS engine that works at frequencies GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M10 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B. With a tiny profile of 29mm29mm 3.6 mm, the module can meet almost all the requirements for M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS, Security, Telematics, Remote Controlling, etc. M10 is an SMD type module, which can be embedded in customer application through its 64-pin pads. It provides all hardware interfaces between the module and customers host board. Designed with power saving technique, current consumption of M10 is as low as 1.1 mA in SLEEP mode when DRX is 5. M10 is integrated with Internet service protocols, which are TCP/IP, PPP. Extended AT commands have been developed for customer to use these Internet service protocols easily. The modules are fully RoHS compliant to EU regulation. 2.1. Key features Table 3: Module key features Feature Power supply Power saving Frequency bands GSM class Transmitting power GPRS connectivity Temperature range Implementation Single supply voltage: 3.3V~4.6V Typical supply voltage: 4V Typical power consumption in SLEEP mode to 1.1 mA@ DRX=5 0.95mA@ DRX=9 Daud-band: GSM850, GSM900, DCS1800, PCS1900. The module can search these frequency bands automatically The frequency bands can be set by AT command. Compliant to GSM Phase 2/2+

Small MS Class 4 (2W) at GSM850 and GSM900 Class 1 (1W) at DCS1800 and PCS1900 GPRS multi-slot class 12 (default) GPRS multi-slot class 1~12 (configurable) GPRS mobile station class B Normal operation: -35C ~ +80C M10_HD_V3.0

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M10 Hardware Design DATA GPRS:

CSD:

SMS FAX SIM interface Antenna interface Audio features Serial interface Restricted operation: -45C ~ -35C and +80C ~ +85C 1) Storage temperature: -45C ~ +90C GPRS data downlink transfer: max. 85.6 kbps GPRS data uplink transfer: max. 85.6 kbps Coding scheme: CS-1, CS-2, CS-3 and CS-4 Support the protocols PAP (Password Authentication Protocol) usually used for PPP connections Internet service protocols TCP/UDP/FTP/HTTP/MMS/SMTP Support Packet Switched Broadcast Control Channel (PBCCH) CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent Support Unstructured Supplementary Services Data (USSD) MT, MO, CB, Text and PDU mode SMS storage: SIM card Group 3 Class 1 and Class 2 Support SIM card: 1.8V, 3V Connected via 50 Ohm antenna pad Speech codec modes:

Half Rate (ETS 06.20) Full Rate (ETS 06.10) Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) Adaptive Multi-Rate (AMR) Echo Cancellation Echo Suppression Noise Reduction Serial Port:

Seven lines on serial port interface Use for AT command, GPRS data and CSD data Multiplexing function Support autobauding from 4800 bps to 115200 bps Debug Port:

Two lines on second serial port interface DBG_TXD and DBG_RXD Debug Port used for software debugging and log output UART3:

Use for AT command Support phonebook types: SM, FD, LD, RC, ON, MC Phonebook management SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99 Real time clock Alarm function Physical characteristics Implemented Programmable via AT command Size:

290.15290.153.60.3mm Weight: 6g Firmware upgrade over Serial Port Firmware upgrade M10_HD_V3.0

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M10 Hardware Design 1) When the module works in this temperature range, the deviation from the GSM specification might occur. For example, the frequency error or the phase error could increase. Table 4: Coding schemes and maximum net data rates over air interface Coding scheme CS-1:

CS-2:

CS-3:

CS-4:

1 Timeslot 9.05kbps 13.4kbps 15.6kbps 21.4kbps 2.2. Functional diagram 2 Timeslot 18.1kbps 26.8kbps 31.2kbps 42.8kbps 4 Timeslot 36.2kbps 53.6kbps 62.4kbps 85.6kbps The following figure shows a block diagram of M10 and illustrates the major functional parts. Power management Baseband Serial Flash The GSM radio frequency part The Peripheral interface Power supply Turn on/off interface UART interface Audio interface SIM interface Keypad interface ADC SD card interface RF interface M10_HD_V3.0

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M10 Hardware Design Figure 1: Module functional diagram 2.3. Evaluation board In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB) that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the module. For details, please refer to the document [13]. M10_HD_V3.0

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M10 Hardware Design 3. Application interface The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular application platform. Sub-interfaces included in these pads are described in detail in following chapters:

Power supply (refer to Chapter 3.3) Serial interfaces (refer to Chapter 3.8) Two analog audio interfaces (refer to Chapter 3.9) SIM interface (refer to Chapter 3.10) SD card interface(refer to Chapter 3.18) Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6. 3.1. Pin of module 3.1.1. Pin assignment The following figure shows pin name and assignment of M10. Figure 2: Top view of module pin assignment M10_HD_V3.0

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M10 Hardware Design 3.1.2. Pin description Table 5: Pin description Power supply PIN NAME VBAT PIN NO. 50,51 52 VRTC 16 VDD_EXT 7 GND Turn on /off PIN NAME PWRKEY 8,42, 44~

49 PIN NO. 18 I/O DESCRIPTION I Module main power supply. VBAT=3.3V~4.6V

. DC CHARACTERISTICS Vmax= 4.6V Vmin=3.3V Vnorm=4.0V I/O Power supply for RTC when VBAT is not supplied. Charging for backup battery or golden capacitor when the VBAT is supplied. Supply 2.8V voltage for external circuit. O VImax=VBAT VImin=2.6V VInorm=2.75V VOmax=2.85V VOmin=2.6V VOnorm=2.75V Iout(max)= 730uA Iin=2.6~5 uA Vmax=2.9V Vmin=2.7V Vnorm=2.8V Imax=20mA Digital ground COMMENT It must be able to provide sufficient current in a transmitting burst which typically rises to 1.6A. Recommended to connect to a backup battery or a golden capacitor. 1. If unused, keep this pin open. 2. Recommended to add a 2.2~4.7uF bypass capacitor, when used for power supply. DC CHARACTERISTICS VILmax=0.1*VBAT VIHmin=0.6*VBAT VImax=VBAT COMMENT Pull up to VBAT internally. I/O DESCRIPTION I Power on/off key PWRKEY should be pulled down for a moment to turn on or off the system. Emergency shutdown PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT M10_HD_V3.0

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M10 Hardware Design EMERG_ OFF 17 I VILmax=0.4V VIHmin=2.2V Vopenmax=2.8V Open drain/collector driver required in cellular device application. If unused, keep this pin open. Emergency off. Pulling down for at least 20ms will turn off the module in case of emergency. Use it only when normal shutdown through PWRKEY or AT command cannot perform well. PIN NO. 54 PIN NO. 23 24 Module status indication PIN NAME I/O DESCRIPTION STATUS O Used to indicate modules operating status. High level indicates module power-on and low level indicates power-down. I/O DESCRIPTION Audio interfaces PIN NAME I I O 22 21 25 26 SPK1P SPK1N MIC2P MIC2N MIC1P MIC1N Positive and negative voice-band input. Auxiliary positive and negative voice-band input. Positive and negative voice-band output. Auxiliary positive voice-band output. AGND is separate ground connection for external audio circuits. General purpose input/output PIN NAME I/O DESCRIPTION SPK2P AGND 19 20 O PIN NO. DC CHARACTERISTICS VOLmax=

0.15*VDD_EXT VOHmax=

0.85*VDD_EXT COMMENT If unused, keep this pin open. DC CHARACTERISTICS For Audio DC characteristics refer to Chapter 3.10. COMMENT If unused, keep these pins open. DC CHARACTERISTICS COMMENT M10_HD_V3.0

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M10 Hardware Design VILmin=-0.3V VILmax=

0.25*VDD_EXT VIHmin=

0.75*VDD_EXT VIHmax=

VDD_EXT+0.3 VOLmax=

0.15*VDD_EXT VOHmin=

0.85*VDD_EXT If unused, keep these pins open. Pull up to VDD_EXT, if unused, keep these pins open. If unused, keep these pins open. Imax=60mA DC CHARACTERISTICS VILmin=-0.3V VILmax=

0.25*VDD_EXT VIHmin=

0.75*VDD_EXT VIHmax=

VDD_EXT+0.3 VOLmax=

0.15*VDD_EXT VOHmin=

0.85*VDD_EXT If unused, keep this pin open. COMMENT If only use TXD, RXD and GND to communicate, recommend connecting RTS to GND via 0R resistor and keeping other pins open. KBC0~

KBC4 KBR0~

KBR4 GPIO1_ KBC5 GPIO0 33~37 28~32 38 64 NETLIGHT 6 27 LIGHT_ MOS Main Serial port PIN NAME I Keypad interface O I/O Normal input/output port/Keypad interface I/O Normal O O input/output port Network status indication Open drain output port I/O DESCRIPTION Data terminal ready Receive data Transmit data Request to send Clear to send Ring indicator Data carrier detection PIN NO. 59 61 60 58 57 55 56 10 9 62 63 DTR RXD TXD RTS CTS RI DCD Debug port DBG_TXD DBG_RXD UART3 TXD3 RXD3 I I O I O O O O I O I Serial interface for debugging only Same as above If unused, keep these pins open. Transmit data Receive data Same as above If unused, keep these pins open. SD card interface PIN PIN NAME NO. 1 SD_DATA I/O DESCRIPTION I/O SD serial data DC CHARACTERISTICS VILmin=-0.3V COMMENT If unused, keep M10_HD_V3.0

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M10 Hardware Design these pins open. If used, SD_DATA is connected to SD card DATA0 pin. COMMENT All signals of SIM interface should be protected against ESD with a TVS diode array. Maximum cable length is 200mm from the module pad to SIM card holder. SD_CLK SD_CMD 2 3 O O SD serial clock VILmax=

SD command VIHmin=

0.25*VDD_EXT SIM interface PIN NAME SIM_VDD PIN NO. 12 I/O DESCRIPTION O Voltage supply for SIM card SIM_DATA 13 I/O SIM data SIM_CLK 14 O SIM clock 0.75*VDD_EXT VIHmax=

VDD_EXT+0.3 VOLmax=

0.15*VDD_EXT VOHmin=

0.85*VDD_EXT DC CHARACTERISTICS The voltage can be selected by software automatically. Either 1.8V or 3V. When SIM_VDD=3V VILmax=0.4V VIHmin=

SIM_VDD-0.4 VOLmax=0.4V VOHmin=

SIM_VDD-0.4 When SIM_VDD=1.8V VILmax=

0.15*SIM_VDD VIHmin=

SIM_VDD-0.4 VOLmax=

0.15*SIM_VDD VOHmin=

SIM_VDD-0.4 When SIM_VDD=3V VILmax=0.4V VIHmin=

0.9*SIM_VDD VOLmax=0.4V VOHmin=

0.9*SIM_VDD When SIM_VDD=1.8V VILmax=

0.12*SIM_VDD VIHmin=

M10_HD_V3.0

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M10 Hardware Design SIM_RST 15 O SIM reset 0.9*SIM_VDD VOLmax=

0.12*SIM_VDD VOHmin=

0.9*SIM_VDD When SIM_VDD=3V VILmax=0.36V VIHmin=

0.9*SIM_VDD VOLmax=0.4V VOHmin=

0.9*SIM_VDD When SIM_VDD=1.8V VILmax=

0.12*SIM_VDD VIHmin=

0.9*SIM_VDD VOLmax=

0.12*SIM_VDD VOHmin=

0.9*SIM_VDD 11 I SIM card detection VILmax=0.67V VIHmin=1.7V If unused, keep this pin open. SIM_ PRESENCE AUX ADC PIN NAME ADC0 ADC1 RF interface PIN NAME RF_ANT PIN NO. 41 40 PIN NO. 43 Other interfaces PIN NAME PIN NO. RESERVED 4,5, 39,53 I/O DESCRIPTION I I General purpose analog to digital converter DC CHARACTERISTICS Voltage range:

0V ~ 2.8V COMMENT If unused, keep this pin open. I/O DESCRIPTION I/O RF antenna pad DC CHARACTERISTICS Impedance of 50 COMMENT Refer to Chapter 4. I/O DESCRIPTION DC CHARACTERISTICS COMMENT Keep these pins open M10_HD_V3.0

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M10 Hardware Design 3.2. Operating modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Mode Normal operation Function GSM/GPRS SLEEP GSM IDLE GSM TALK GPRS IDLE GPRS STANDBY GPRS READY The module will automatically go into SLEEP mode if DTR is set to high level and there is no interrupt (such as GPIO interrupt or data on serial port). In this case, the current consumption of module will reduce to the minimal level. During SLEEP mode, the module can still receive paging message and SMS from the system normally. Software is active. The module has registered to the GSM network, and the module is ready to send and receive data. GSM connection is ongoing. In this mode, the power consumption is decided by the configuration of Power Control Level (PCL), dynamic DTX control and the working RF band. The module is not registered to GPRS network. The module is not reachable through GPRS channel. The module is registered to GPRS network, but no GPRS PDP context is active. The SGSN knows the Routing Area where the module is located at. The PDP context is active, but no data transfer is going on. The module is ready to receive or send GPRS data. The SGSN knows the cell where the module is located at. GPRS DATA There is GPRS data in transfer. In this mode, power consumption is decided by the PCL, working RF band and GPRS multi-slot configuration. Normal shutdown by sending the AT+QPOWD=1 command, using the PWRKEY or using the EMERG_OFF pin. The power management ASIC disconnects the power supply from the base band part of the module, and only the power supply for the RTC is remained. Software is not active. The serial interfaces are not accessible. Operating voltage (connected to VBAT) remains applied. AT+CFUN command can be set the module to a minimum functionality mode without removing the power supply. In this case, the RF part of the module will not work or the SIM card will not be accessible, or both RF part and SIM card will be closed, but the serial port is still accessible. The power consumption in this case is very low. POWER DOWN1) Minimum functionality mode (without removing power supply) M10_HD_V3.0

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M10 Hardware Design Alarm mode RTC alert function launches this restricted operation while the module is in POWER DOWN mode. The module will not be registered to GSM network and only parts of AT commands can be available. 1) Use the EMERG_OFF pin only while failing to turn off the module by the command AT+QPOWD=1 and the ON/OFF pin. Please refer to Chapter 3.4.2.4. 3.3. Power supply The power supply range of M12 is from 3.3V to 4.6V which is supplied with a single voltage source of VBAT. The GSM transmitting burst can cause obvious voltage drop at the supply voltage thus the power supply must be carefully designed and is capable of providing sufficient current up to 1.6A. A reference design of DC 5V/2A input power source is shown in Figure 3. The designed output for the power supply is 4.16V, thus a linear regulator can be used. If theres a big voltage difference between the input source and the desired output (VBAT), a switching converter power supply would be preferable for its better efficiency especially with the 1.6A peak current in burst mode of the module. Figure 3: Reference circuit of the source power supply input The RF Power Amplifier current (1.6A peak in GSM/GPRS mode) flows with a ratio of 1/8 of time, around 577us every 4.615ms, in talking mode. The following figure is the VBAT voltage and current ripple at the maximum power transmitting phase, the test condition is VBAT=4.16V, VBAT maximum output current is 1.6A, C3=100F tantalum capacitor (ESR=0.7). M10_HD_V3.0

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M10 Hardware Design 4.615ms 577us IBAT VBAT Burst:1.6A Max:400mV Figure 4: Ripple in supply voltage during transmitting burst 3.3.1. Power supply pins The VBAT pins are dedicated to connect the module supply voltage. VRTC pin can be used to connect a rechargeable coin battery or a golden capacitor which can help to maintain the system clock when VBAT supply is not applied. 3.3.2. Minimizing supply voltage drop Please pay special attention to the power supply design for your applications. Make sure that the input voltage will never drop below 3.3V even in a transmitting burst during which the current consumption may rise up to 1.6A. If the power voltage drops below 3.3V, the module could turn off automatically. The PCB traces from the VBAT pads to the power source must be wide enough to ensure that there is not too much voltage drop occur in the transmitting burst mode. The width of trace should be no less than 2mm and the principle of the VBAT trace is the longer route, the wider trace. The VBAT voltage can be measured by oscilloscope. For the VBAT input, a bypass capacitor of about 100 F with low ESR is recommended. Multi-layer ceramic chip (MLCC) capacitor can provide the best combination of low ESR and small size but may not be economical. A lower cost choice could be a 100 F tantalum capacitor with low ESR. Other small ceramic capacitors should be in parallel with the 100F capacitor, which is illustrated in Figure 5. The capacitors should be placed close to the M12 VBAT pins. M10_HD_V3.0

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M10 Hardware Design C1>=100uF; C2=0.1uF~1uF; C3=10pF; C4=33pF Figure 5: Reference circuit of the VBAT input 3.3.3. Monitor power supply To monitor the supply voltage, you can use the AT+CBC command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0-100 percent of battery capacity and actual value measured between VBAT and GND. The voltage is continuously measured at an interval depending on the operating mode. The displayed voltage (in mV) is averaged over the last measuring period before the AT+CBC command is executed. For details, please refer to document [1]. 3.4. Power up and down scenarios 3.4.1. Power on The module can be turned on through the two ways, which are described in following chapters:

Via PWRKEY pin: start normal operating mode (please refer to chapter 3.4.1.1);

Via RTC interrupt: start ALARM mode (please refer to chapter 3.4.1.2). Note: The module is set to autobauding mode (AT+IPR=0) in default configuration. In the autobauding mode, the URC RDY is not sent to host controller after powering on. AT command can be sent to the module 2-3 seconds after the module is powered on. Host controller should firstly send an AT or at string in order that the module can detect baud rate of host controller, and it should send the second or the third AT or at string until receiving OK string from module. Then an AT+IPR=x;&W should be sent to set a fixed baud rate for M10_HD_V3.0

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M10 Hardware Design module and save the configuration to flash memory of module. After these configurations, the URC RDY would be received from the Serial Port of module every time when the module is powered on. Refer to Chapter AT+IPR in document [1]. 3.4.1.1. Power on module using the PWRKEY pin Customers application can turn on the module by driving the pin PWRKEY to a low level voltage and after STATUS pin outputs a high level, PWRKEY pin can be released. Customer may monitor the level of the STATUS pin to judge whether the module is power-on or not. An open collector driver circuit is suggested to control the PWRKEY. A simple reference circuit is illustrated in Figure 6. Figure 6: Turn on the module using driving circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate from finger. A reference circuit is showed in Figure 7. Figure 7: Turn on the module using keystroke M10_HD_V3.0

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M10 Hardware Design The power on scenarios is illustrated as following figure. 1 54ms VBAT 2 EMERG_OFF

(INPUT) PWRKEY

(INPUT) VDD_EXT

(OUTPUT) STATUS

(OUTPUT) MODULE STATUS VIH > 0.6*VBAT

>1s VIL<0.1*VBAT 800ms OFF BOOTING RUNNING Figure 8: Timing of turning on system Make sure that VBAT voltage is stable before pulling down PWRKEY pin. The interval time between them is recommended 30ms. Keep the EMERG_OFF pin open if not used. Note: Customer can monitor the voltage level of the STATUS pin to judge whether the module is power-on. After the STATUS pin goes to high level, PWRKEY may be released. If the STATUS pin is ignored, pull the PWRKEY pin to low level for more than 2 seconds to turn on the module. 3.4.1.2. Power on module using the RTC (Alarm mode) Alarm mode is a power-on approach by using the RTC. The alert function of RTC can wake-up the module while it is in power-off state. In alarm mode, the module will not register to GSM network and the GSM protocol stack software is closed. Thus the part of AT commands related with SIM card and the protocol stack will not be accessible, and the others can be used. Use the AT+QALARM command to set the alarm time. The RTC remains the alarm time if the module is powered off by AT+QPOWD=1 or by PWRKEY pin. Once the alarm time is expired, M10_HD_V3.0

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M10 Hardware Design the module will go into the alarm mode. In this case, the module will send out an Unsolicited Result Code (URC) when the baud rate of the Serial Port is set to a fixed one. RDY ALARM MODE

+CFUN:0 Note: This result code does not appear when autobauding is active because a valid baud rate is not available immediately after powering up the module. Therefore, the module is recommended to set to a fixed baud rate. During alarm mode, use AT+CFUN command to query the status of software protocol stack; it will return 0 which indicates that the protocol stack is closed. After 90 seconds, the module will power down automatically. However, if the GSM protocol stack is started by AT+CFUN=1 command during the alarm mode, the process of automatic power-off will not be executed. In alarm mode, driving the PWRKEY to a low level voltage for a period will cause the module to power down. The frequently-used AT commands during alarm mode are briefly summarized In Table 7. For details of these instructions, please refer to document [1]. Table 7: AT commands used in alarm mode AT command AT+QALARM AT+CCLK AT+QPOWD AT+CFUN 3.4.2. Power down Function Set alarm time Set data and time of RTC Power down the module Start or close the protocol stack The following procedures can be used to turn off the module:

Normal power down procedure: Turn off module using the PWRKEY pin Normal power down procedure: Turn off module using command AT+QPOWD Over-voltage or under-voltage automatic shutdown: Take effect when over-voltage or under-voltage is detected Emergent power down procedure: Turn off module using the EMERG_OFF pin M10_HD_V3.0

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M10 Hardware Design 3.4.2.1. Power down module using the PWRKEY pin Customers application can turn off the module by driving the PWRKEY to a low level voltage for certain time. The power-down scenario is illustrated as in Figure 9. The power-down procedure causes the module to log off from the network and allows the software to save important data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure, the module sends out the result code as shown below:

NORMAL POWER DOWN Note: This result code does not appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set a fixed baud rate. After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by the STATUS pin, which is a low level voltage in this mode. 0.6s<Pulldown<1s

>160us Logout net about 2s to 12s VBAT PWRKEY

(INPUT) STATUS

(OUTPUT) EMERG_OFF

(INPUT) Figure 9: Timing of turning off the module 3.4.2.2. Power down module using AT command Customers application can use an AT command AT+QPOWD=1 to turn off the module. This command will let the module to log off from the network and allow the software to save important M10_HD_V3.0

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M10 Hardware Design data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure, the module sends out the result code as shown below:

NORMAL POWER DOWN After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by STATUS pin, which is a low level voltage in this mode. For details about the AT command of AT+QPOWD, please refer to document [1]. 3.4.2.3. Over-voltage or under-voltage automatic shutdown The module will constantly monitor the voltage applied on the VBAT, if the voltage is 3.5V, the following URC will be presented:

UNDER_VOLTAGE WARNING If the voltage is 4.5V, the following URC will be presented:

OVER_VOLTAGE WARNING The normal input voltage range is 3.3V to 4.6V. If the voltage is > 4.6V or <3.3V, the module would automatically shutdown itself. If the voltage is <3.3V, the following URC will be presented:

UNDER_VOLTAGE POWER DOWN If the voltage is >4.6V, the following URC will be presented:

OVER_VOLTAGE POWER DOWN Note: These result codes dont appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set to a fixed baud rate. After this moment, no other AT command can be executed, the module logs off from network and enters POWER DOWN mode, and only RTC is still active. The POWER DOWN mode can also be indicated by the pin STATUS, which is a low level voltage in this mode. M10_HD_V3.0

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M10 Hardware Design 3.4.2.4. Emergency shutdown The module can be shut down by driving the pin EMERG_OFF to a low level voltage for over 20ms and then releasing it. The EMERG_OFF line can be driven by an Open Drain/Collector driver or a button. The circuit is illustrated as the following figures. Figure 10: Reference circuit for EMERG_OFF by using driving circuit Figure 11: Reference circuit for EMERG_OFF by using button Be cautious to use the pin EMERG_OFF. It should only be used under emergent situation. For instance, if the module is unresponsive or abnormal, the pin EMERG_OFF could be used to shutdown the system. Although turning off the module by EMERG_OFF is fully tested and nothing wrong is detected, this operation is still a big risk as it could cause destroying of the code or data area of the NOR flash memory in the module. Therefore, it is recommended that PWRKEY or AT command should always be the preferential way to turn off the system. M10_HD_V3.0

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M10 Hardware Design 3.4.3. Restart module using the PWRKEY pin Customers application can restart the module by driving the PWRKEY to a low level voltage for certain time, which is similar to the way to turn on the module. Before restarting the module, at least 500ms should be delayed after detecting the low level of STATUS. The restart scenario is illustrated as the following figure. Figure 12: Timing of restarting system The module can also be restarted by the PWRKEY after emergency shutdown. Pulldown > 20ms Delay>2s EMERG_OFF INPUT PWRKEY INPUT Figure 13: Timing of restarting system after emergency shutdown M10_HD_V3.0

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M10 Hardware Design 3.5. Power saving Upon system requirement, there are several actions to drive the module to enter low current consumption status. For example, AT+CFUN can be used to set the module into minimum functionality mode and DTR hardware interface signal can be used to lead system to SLEEP mode. 3.5.1. Minimum functionality mode Minimum functionality mode reduces the functionality of the module to minimum level, thus minimizes the current consumption when the slow clocking mode is activated at the same time. This mode is set with the AT+CFUN command which provides the choice of the functionality levels <fun>=0,1,4. 0: minimum functionality 1: full functionality (default) 4: disable both transmitting and receiving of RF part If the module is set to minimum functionality by AT+CFUN=0, the RF function and SIM card function would be closed. In this case, the serial port is still accessible, but all AT commands correlative with RF function or SIM card function will not be accessible. If the module has been set by AT+CFUN=4, the RF function will be closed but the serial port is still active. In this case, all AT commands correlative with RF function will not be accessible. After the module is set by AT+CFUN=0 or AT+CFUN=4, it can return to full functionality by AT+CFUN=1. For detailed information about AT+CFUN, please refer to document [1]. 3.5.2. SLEEP mode (slow clock mode) The SLEEP mode is disabled in default software configuration. Customers application can enable this mode by AT+QSCLK=1. On the other hand, the default setting is AT+QSCLK=0 and in this mode, the module cannot enter SLEEP mode. When AT+QSCLK=1 is set to the module, customers application can control the module to enter or exit from the SLEEP mode through pin DTR. When DTR is set to high level, and there is no on-air or hardware interrupt such as GPIO interrupt or data on serial port, the module will enter SLEEP mode automatically. In this mode, the module can still receive voice, SMS or GPRS paging from network but the serial port is not accessible. M10_HD_V3.0

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M10 Hardware Design 3.5.3. Wake up module from SLEEP mode When the module is in the SLEEP mode, the following methods can wake up the module. If the DTR Pin is pulled down to a low level, it would wake up the module from the SLEEP mode. The serial port will be active about 20ms after DTR is changed to low level. Receive a voice or data call from network to wake up module. Receive an SMS from network to wake up module. RTC alarm expired to wake up module. Note: DTR pin should be held low level during communicating between the module and DTE. 3.6. Summary of state transitions (except SLEEP mode) Table 8: Summary of state transition Current mode POWER DOWN Normal mode Next mode POWER DOWN Normal mode Use PWRKEY Use AT+QPOWD command, PWRKEY pin, or EMERG_OFF pin Alarm mode Use PWRKEY pin or wait module turning off automatically Use AT+CFUN command 3.7. RTC backup Alarm mode Turn on the module by RTC alarm Set alarm by AT+QALARM, and then turn off the module. When the timer expires, the module turns on automatically and enters Alarm mode. The RTC (Real Time Clock) can be supplied by an external capacitor or battery (rechargeable or non-chargeable) through the pin VRTC. A 1.5K resistor has been integrated in the module for current limiting. A coin-cell battery or a super-cap can be used to backup power supply for RTC. The following figures show various sample circuits for RTC backup. M10_HD_V3.0

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M10 Hardware Design Figure 14: RTC supply from non-chargeable battery Figure 15: RTC supply from rechargeable battery MODULE VRTC 1.5K RTC Core Large Capacitance Capacitor Figure 16: RTC supply from capacitor Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used. M10_HD_V3.0

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M10 Hardware Design Figure 17: Seiko XH414H-IV01E Charge Characteristic 3.8. Serial interfaces The module provides two unbalanced asynchronous serial ports including Serial Port, Debug Port. The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps. The UART Port:

TXD: Send data to RXD of DTE RXD: Receive data from TXD of DTE RTS: Requests to send CTS: Clear to send DTR: DTE is ready and inform DCE (this pin can wake the module up) RI: Ring indicator (when the call, SMS, data of the module are coming, the module will output signal to inform DTE) DCD: Data carrier detection (the validity of this pin demonstrates the communication link is set up) Note: The module disables hardware flow control by default. When hardware flow control is required, RTS and CTS should be connected to the host. AT command AT+IFC=2,2 is used to enable hardware flow control. AT command AT+IFC=0,0 is used to disable the hardware flow control. For more details, please refer to document [1]. M10_HD_V3.0

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M10 Hardware Design The Debug Port:

DBG_TXD: Send data to the COM port of a debugging computer DBG_RXD: Receive data from the COM port of a debugging computer UART3:

TXD_AUX: Send data to the RXD of DTE RXD_AUX: Receive data from the TXD of DTE The logic levels are described in the following table. Table 9: Logic levels of the serial interface Parameter VIL VIH VOL VOH Min 0 0.75*VDD_EXT 0 0.85*VDD_EXT Max 0.25*VDD_EXT VDD_EXT +0.3 0.15*VDD_EXT VDD_EXT Unit V V V V Table 10: Pin definition of the serial interfaces Name DBG_RXD DBG_TXD RI RTS CTS RXD TXD DTR DCD TXD3 RXD3 Pin 9 10 55 58 57 61 60 59 56 62 63 Function Receive data of the debug port Transmit data of the debug port Ring indicator Request to send Clear to send Receive data of the serial port Transmit data of the serial port Data terminal ready Data carrier detection Transmit data of UART3 Receive data of UART3 Interface Debug Port Serial Port UART3 3.8.1. UART Port 3.8.1.1. The features of UART Port. Seven lines on UART interface:

Contain data lines TXD and RXD, hardware flow control lines RTS and CTS, other control lines DTR, DCD and RI. M10_HD_V3.0

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M10 Hardware Design The module disables hardware flow control in default, AT command AT+IFC=2,2 is used to enable hardware flow control. Used for AT command, GPRS data, CSD FAX, etc. Multiplexing function is supported on the UART Port. So far only the basic mode of multiplexing is available. Support the communication baud rates as the following:

300,600,1200,2400,4800,9600,14400,19200,28800,38400,57600,115200. The default setting is autobauding mode. Support the following baud rates for Autobauding function: 4800, 9600, 19200, 38400, 57600, 115200. After setting a fixed baud rate or Autobauding, please send AT or at string at that rate. The UART port is ready when it responds with OK. Autobauding allows the module to detect the baud rate by receiving the string AT or at from the host or PC automatically, which gives module flexibility without considering which baud rate is used by the host controller. Autobauding is enabled by default. To take advantage of the autobauding mode, special attention should be paid according to the following requirements:

Synchronization between DTE and DCE:

When DCE (the module) powers on with the autobauding enabled, it is recommended to wait 2 to 3 seconds before sending the first AT string. After receiving the OK response, DTE and DCE are correctly synchronized. If the host controller needs URC in the mode of autobauding, it must be synchronized first. Otherwise the URC will be discarded. Restrictions on autobauding operation The UART port has to be operated at 8 data bits, no parity and 1 stop bit (factory setting). The A/ and a/ commands cant be used. Only the strings AT or at can be detected (neither At nor aT). The Unsolicited Result Codes like RDY, +CFUN: 1 and +CPIN: READY will not be indicated when the module is turned on with autobauding enabled and not be synchronized. Any other Unsolicited Result Codes will be sent at the previous baud rate before the module detects the new baud rate by receiving the first AT or at string. The DTE may receive unknown characters after switching to new baud rate. It is not recommended to switch to autobauding from a fixed baud rate. If autobauding is active it is not recommended to switch to multiplex mode Note: To assure reliable communication and avoid any problems caused by undetermined baud rate between DCE and DTE, it is strongly recommended to configure a fixed baud rate and save it instead of using autobauding after start-up. For more details, please refer to Section AT+IPR in document [1]. M10_HD_V3.0

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M10 Hardware Design 3.8.1.2. The connection of UART The connection between module and host via UART port is very flexible. Three connection styles are illustrated as below. UART Port connection is shown as below when it is applied in modulation-demodulation. Figure 18: Connection of all functional UART port Three lines connection is shown as below. Figure 19: Connection of three lines UART port UART Port with hardware flow control is shown as below. This connection will enhance the M10_HD_V3.0

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M10 Hardware Design reliability of the mass data communication. Figure 20: Connection of UART port with hardware flow control 3.8.1.3. Software upgrade The TXD and RXD can be used to upgrade software. The PWRKEY pin must be pulled down before the software upgrade. Please refer to the following figure for software upgrade. Module (DCE) UART port TXD RXD GND PWRKEY IO Connector TXD RXD GND PWRKEY Figure 21: Connection of software upgrade 3.8.2. Debug Port Debug Port:

Two lines: DBG_TXD and DBG_RXD It outputs log information automatically. Debug Port is only used for software debugging and its baud rate must be configured as M10_HD_V3.0

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M10 Hardware Design 460800bps. Figure 22: Connection of software debug 3.8.3. UART Port 3 UART3:

Two data lines: TXD3and RXD3 UART3 port is used for AT command only and does not support GPRS data, CSD FAX, Multiplexing function etc. Support the communication baud rates as the following:

4800, 9600, 14400, 19200,28800,38400,57600,115200. The default baud rate setting is 115200bps, and does not support autobauding. The baud rate can be modified by AT+QSEDCB command. For more details, please refer to document [1]. Figure 23: Connection of Auxiliary UART port M10_HD_V3.0

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M10 Hardware Design 3.8.4. UART Application The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is 3V, the divider resistor should be changed from 5.6K to 10K. Figure 24: 3.3V level match circuit The reference design of 5V level match is shown as below. The construction of dotted line can refer to the construction of solid line. Please pay attention to direction of connection. Input dotted line of module should refer to input solid line of the module. Output dotted line of module should refer to output solid line of the module. 4.7k VCC_MCU VDD_EXT 4.7k 1K 4.7k 4.7k VCC_MCU VDD_EXT MCU/ARM

/TXD

/RXD

/RTS

/CTS GPIO EINT GPIO MODULE VBAT GND RXD TXD RTS CTS DTR RI STATUS Voltage level: 5V Figure 25: 5V level match circuit M10_HD_V3.0

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M10 Hardware Design The following picture is an example of connection between module and PC. A RS_232 level shifter IC or circuit must be inserted between module and PC, since these three UART ports do not support the RS_232 level, while support the CMOS level only. SP3238 28 25 1 3 24 23 22 19 17 16 21 20 18 13 C1+

C1-

C2+

C2-

T1IN T2IN T3IN T4IN T5IN

/R1OUT R1OUT R2OUT R3OUT ONLINE V+

GND VCC V-

T4OUT T2OUT T3OUT T1OUT T5OUT R1IN R2IN R3IN

/STATUS

/SHUTDOWN 27 2 26 4 10 6 7 5 12 8 9 11 15 14 DCD TXD CTS RI MODULE GND RXD DTR RTS 3V 3V GND GND 6 7 8 9 1 2 3 4 5 TO PC serial port GND Figure 26: RS232 level match circuit 3.9. Audio interfaces The module provides two analogy input channels and two analogy output channels. M10_HD_V3.0

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M10 Hardware Design Table 11: Pin definition of Audio interface Interface

(AIN1/AOUT1)

(AIN2/AOUT2) Name MIC1P MIC1N SPK1P SPK1N MIC2P MIC2N SPK2P AGND Pin 23 24 22 21 25 26 20 19 Function Microphone1 input +

Microphone1 input -

Audio1 output+

Audio1 output-

Microphone2 input +

Microphone2 input -

Audio2 output+

Suggested to be used in audio circuit. Do not connect to digital GND in host PCB as it could produce TDD noise. AIN1 and AIN2, which may be used for both microphone and line inputs. An electret microphone is usually used. AIN1 and AIN2 are both differential input channels. AOUT1 and AOUT2, which may be used for both receiver and speaker outputs. AOUT1 channel is typically used for a receiver built into a handset, while AOUT2 channel is typically used with headset or hands-free speaker. AOUT1 channel is a differential channel and AOUT2 is a single-ended channel. SPK2P and AGND can establish a pseudo differential mode. If customer needs to play Melody or Midi ringtone for incoming call, AOUT2 Channel should always be used. These two audio channels can be swapped by AT+QAUDCH command. For more details, please refer to document [1]. Use AT command AT+QAUDCH to select audio channel:

0--AIN1/AOUT1 (normal audio channel), the default value is 0. 1--AIN2/AOUT2 (aux audio channel). For each channel, customer can use AT+QMIC to adjust the input gain level of microphone. Customer can also use AT+CLVL to adjust the output gain level of receiver and speaker. AT+QECHO is to set the parameters for echo cancellation control. AT+QSIDET is to set the side-tone gain level. For more details, please refer to document [1]. 3.9.1. Decrease TDD noise and other noise The 33pF capacitor is applied for filtering out 850MHz/900MHz RF interference when the module is transmitting at GSM900MHz. Without placing this capacitor, TDD noise could be heard. Moreover, the 10pF capacitor here is for filtering out 1800MHz/1900MHz RF interference. However, the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, customer would have to discuss with its capacitor vendor to choose the most suitable capacitor for filtering out GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz separately. M10_HD_V3.0

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M10 Hardware Design The severity degree of the RF interference in the voice channel during GSM transmitting period largely depends on the application design. In some cases, GSM850/GSM900 TDD noise is more severe; while in other cases, DCS1800/PCS1900 TDD noise is more obvious. Therefore, customer can have a choice based on test results. Sometimes, even no RF filtering capacitor is required. The capacitor which is used for filtering out RF noise should be close to RJ11 or other audio interfaces. Audio alignment should be as short as possible. In order to decrease radio or other signal interference, the position of RF antenna should be kept away from audio interface and audio alignment. Power alignment and audio alignment should not be parallel, and power alignment should be far away from audio alignment. The differential audio traces have to be placed according to the differential signal layout rules. 3.9.2. Microphone interfaces configuration AIN1/IN2 channels come with internal bias supply for external electret microphone. A reference circuit is shown in Figure27. Close to Microphone GND GND GND Differential layout Module MICxP MICxN AGND Electret Microphone 33pF ESD 33pF 33pF ESD GND GND GND 10pF 10pF 10pF Figure 27: Microphone interface configuration of AIN1&AIN2 M10_HD_V3.0

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M10 Hardware Design 3.9.3. Receiver and speaker interface configuration Differential layout Module SPK1P SPK1N Close to speaker GND 10pF 10pF 10pF 33pF ESD 33pF 33pF ESD GND Figure 28: Speaker interface configuration of AOUT1 Module SPK1P SPK1N Differential layout Amplifier circuit Close to speaker GND 10pF 10pF 10pF 33pF ESD 33pF 33pF ESD GND Figure 29: Speaker interface with amplifier configuration of AOUT1 Texas Instruments TPA6205A1is recommended for a suitable differential audio amplifier. There are plenty of excellent audio amplifiers in the market. M10_HD_V3.0

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M10 Hardware Design Close to speaker GND Differential layout 10pF 33pF ESD Module 22uF SPK2P AGND Figure 30: Speaker interface configuration of AOUT2 Module SPK2P AGND C1 C2 Close to speaker GND Differential layout Amplifier circuit 10pF 33pF ESD 10pF 33pF ESD GND Figure 31: Speaker interface with amplifier configuration of AOUT2 Note: The value of C1 and C2 depends on the input impedance of audio amplifier. M10_HD_V3.0

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M10 Hardware Design 3.9.4. Earphone interface configuration Close to Socket Differential layout 4.7uF GND GND GND 33pF 33pF 68R 33pF 10pF 3 4 2 1 GND GND GND AGND Amphenol 9001-8905-050 MIC2N MIC2P Module 22uF SPK2P AGND AGND Figure 32: Earphone interface configuration Table 12: Typical electret microphone characteristic Parameter Working Voltage Working Current External Microphone Load Resistance Min 1.2 200 Type 1.5 2.2 Max 2.0 500 Unit V uA k Ohm Table 13: Typical speaker characteristic Parameter Normal Output(SPK1) Single Ended Differential Load resistance Load resistance Ref level Auxiliary Output(SPK2) Maxim driving current limit of SPK1 and SPK2 Single Ended Ref level Load resistance Ref level Min 28 0 28 0 16 0 Typ 32 32 32 Max 2.4 4.8 2.4 50 Unit Ohm Vpp Ohm Vpp Ohm Vpp mA M10_HD_V3.0

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M10 Hardware Design 3.10. SIM card interface 3.10.1. SIM card application The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM card, which is intended for use with a SIM application Tool-kit. The SIM interface is powered from an internal regulator in the module. Both 1.8V and 3.0V SIM Cards are supported. Table 14: Pin definition of the SIM interface Name SIM_VDD Pin 12 13 SIM_DATA 14 SIM_CLK SIM_RST 15 SIM_PRESENCE 11 Function Supply power for SIM Card. Automatic detection of SIM card voltage. 3.0V10% and 1.8V10%. Maximum supply current is around 10mA. SIM Card data I/O SIM Card Clock SIM Card Reset SIM Card Presence Figure 33 is the reference circuit for SIM interface, and here an 8-pin SIM card holder is used. The pin SIM_PRESENCE is used to detect whether the tray of the Molex SIM socket, which is used for holding SIM card, is present in the card socket. When the tray is inserted in the socket, SIM_PRESENCE is at low level. Regardless of the SIM card is in the tray or not, the change of SIM_PRESENCE level from high to low level prompts the module to reinitialize SIM card. In default configuration, SIM card detection function is disabled. Customers application can use AT+QSIMDET=1,0 to be switched on and AT+QSIMDET=0,0 to switch off the SIM card detection function. For detail of this AT command, please refer to document [1]. When AT+QSIMDET=1,0 is set and the tray with SIM card is removed from SIM socket, the following URC will be presented.

+CPIN: NOT READY When the tray with SIM card is inserted into SIM socket again and the module finishes re-initializing SIM card, the following URC will be presented. Call Ready M10_HD_V3.0

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M10 Hardware Design VDD_EXT 10K Module SIM_VDD SIM_RST SIM_CLK SIM_PRESENCE SIM_DATA 22R 22R 22R 100nF SIM_CARD VCC RST CLK PRESENCE GND VPP IO GND ESDA6V8V6 GND GND Figure 33: Reference circuit of the 8 pins SIM card Note: Please do not use AT+QSIMDET=1,1 which causes to initialize SIM card when Figure 33 circuit is adopted. If customer does not need the SIM card detection function, keep SIM_PRESENCE open. The reference circuit using a 6-pin SIM card socket is illustrated as the following figure. Figure 34: Reference circuit of the 6 pins SIM card M10_HD_V3.0

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M10 Hardware Design In SIM interface designing, in order to ensure good communication performance with SIM card, the following design principles should be complied with. Place the SIM card holder close to module as close as possible. Ensure the trace length of SIM signals do not exceed 20mm. Keep the SIM signals far away from VBAT power and RF trace. The width of SIM_VDD trace is not less than 0.5mm. Place a bypass capacitor close to SIM card power pin. The value of capacitor is less than 1uF. To avoid possible cross-talk from the SIM_CLK signal to the SIM_DATA signal be careful that both lines are not placed closely next to each other. A useful approach is to use GND to shield the SIM_DATA line from the SIM_CLK line. In order to ensure good ESD protection, it is recommended to add TVS such as WILL

(http://www.willsemi.com) ESDA6V8AV6. The capacitance of ESD component is less than 50pF. The 22 resistors should be added in series between the module and the SIM card so as to suppress the EMI spurious transmission and enhance the ESD protection. Note that the SIM peripheral circuit should be close to the SIM card socket. 3.10.2. Design considerations for SIM card holder For 6-pin SIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit http://www.amphenol.com for more information. Figure 35: Amphenol C707 10M006 512 2 SIM card holder M10_HD_V3.0

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M10 Hardware Design Table 15: Pin description of Amphenol SIM card holder Name SIM_VDD SIM_RST SIM_CLK GND VPP SIM_DATA Pin C1 C2 C3 C5 C6 C7 Function SIM Card Power supply SIM Card Reset SIM Card Clock Ground Not Connect SIM Card data I/O For 8-pin SIM card holder, http://www.molex.com for more information. it is recommended to use Molex 91228. Please visit Figure 36: Molex 91228 SIM card holder Table 16: Pin description of Molex SIM card holder Pin Name C1 SIM_VDD C2 SIM_RST C3 SIM_CLK SIM_PRESENCE C4 GND C5 Function SIM Card Power supply SIM Card Reset SIM Card Clock SIM Card Presence Detection Ground M10_HD_V3.0

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M10 Hardware Design Not Connect SIM Card Data I/O Pulled down GND with external circuit. When the tray is present, C4 is connected to C8. VPP SIM_DATA SIM_DETECT C6 C7 C8 3.11. Keypad interface The keypad interface consists of 5 keypad column inputs and 5 keypad row outputs. The basic configuration is 5 keypad columns and 5 keypad rows, giving 25 keys. Table 17: Pin definition of the keypad interface Name KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 KBR1 KBR2 KBR3 KBR4 Function Keypad matrix column Keypad matrix row Pin 33 34 35 36 37 28 29 30 31 32 The keypad interface allows a direct external matrix connection. A typical recommended circuit about the keypad is shown in the following figure. M10_HD_V3.0

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M10 Hardware Design Module KBC0 KBC1 KBC2 KBC3 KBC4 GPIO1_KBC5 KBR0 KBR1 KBR2 KBR3 KBR4 Figure 37: Reference circuit of the keypad interface If a 5*5 matrix does not provide enough keys, GPIO1 could be multiplexed as KBC5 to configure a 5*6 keypad matrix. Then, the keypad interface consists of 5 keypad row outputs and 6 keypad column inputs. The basic configuration is 5 keypad rows and 6 keypad columns, giving 30 keys. Note: This function is not supported in the default firmware. 3.12. ADC The module provides two auxiliary ADC interfaces to measure the values of two analog inputs. AT command AT+QADC? is used to read the voltage value present on ADC0 pin. AT command AT+QEADC? is used to read the voltage value present on ADC1 pin. For details of this AT command, please refer to document [1]. Table 18: Pin definition of the ADC Pin 41 40 Function Analog to digital converter. Analog to digital converter Name ADC0 ADC1 M10_HD_V3.0

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M10 Hardware Design Table 19: Characteristic of the ADC Item Voltage range ADC Resolution ADC accuracy Min 0 Typ 10 2.7 Max 2.8 Units V bits mV 3.13. Behaviors of the RI Table 20: Behaviors of the RI State Standby Voice calling Data calling SMS URC RI response HIGH Changed to LOW, then:

1. Changed to HIGH when call is established. 2. Use ATH to hang up the call, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating NO CARRIER as an URC, then changes to HIGH again. 4. Change to HIGH when SMS is received. Changed to LOW, then 1. Changed to HIGH when data connection is established. 2. Use ATH to hang up the data calling, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating NO CARRIER as an URC, then changes to HIGH again. 4. Changed to HIGH when SMS is received. When a new SMS comes, the RI changes to LOW and holds low level for about 120 ms, then changes to HIGH. Certain URCs can trigger 120ms low level on RI. For more details, please refer to the document [10]

If the module is used as a caller, the RI would maintain high except the URC or SMS is received. On the other hand, when it is used as a receiver, the timing of the RI is shown below. M10_HD_V3.0

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M10 Hardware Design Figure 38: RI behaviour of voice calling as a receiver Figure 39: RI behaviour of data calling as a receiver Figure 40: RI behaviour as a caller M10_HD_V3.0

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M10 Hardware Design Figure 41: RI behaviour of URC or SMS received 3.14. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in Table 21. Table 21: Working state of the NETLIGHT State Module function Off 64ms On/ 800ms Off 64ms On/ 2000ms Off The module is not running. The module is not synchronized with network. The module is synchronized with network. 64ms On/ 600ms Off GPRS data transfer is ongoing. A reference circuit is shown in following figure. Figure 42: Reference circuit of the NETLIGHT M10_HD_V3.0

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M10 Hardware Design 3.15. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on, please refer to Chapter 3.4. In customer design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the modules operation status. A reference circuit is shown in figure 43. Table 22: Pin definition of the STATUS Name STATUS Pin 54 Function Indicate modules operating status Figure 43: Reference circuit of the STATUS 3.16. General purpose input & output (GPIO) The module provides a limited number of General Purpose Input/Output signal pins. The driving capability of these pins is 4mA. Every GPIO can be configured as input or output, and set to high or low when working as an output pin by AT+CEQGPIO command. Before using these GPIO pins, customer should configure them with AT+CEQGPIO=1,x,x,x,x first. For details, please refer to document [1]. M10_HD_V3.0

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M10 Hardware Design Table 23: Pin definition of the GPIO interface Name GPIO0 Pin 64 GPIO1_KBC5 38 PU/PD Pulled up internally to 75K resistor Pulled up internally to 75K resistor Function General Purpose Input/Output Port General Purpose Input/Output Port Keypad interface KBC5 3.17. Open drain output (LIGHT_MOS) The module provides an open drain output pin to control keyboard backlight. The output LIGHT_MOS can sink 60mA. This open-drain output switch is high impedance when disabled. Table 24: Pin definition of the LIGHT_MOS Name LIGHT_MOS Pin 27 Function Open drain output port Note: This function is not supported in the default firmware. There must be special firmware if customer needs this function. Please contact Quectel for more details. Module LIGHT_MOS VBAT 300R Figure 44: Reference circuit of the LIGHT_MOS M10_HD_V3.0

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M10 Hardware Design 3.18. SD card interface The module provides SD card interface that supports many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD card interface. Only supports 1bit serial mode Dose not support the SPI mode SD/MMC memory card Dose not support multiple SD memory cards Dose not support hot plug The data rate up to 26MHz in serial mode Up to 32GB maximum memory card capacity With the SD card interface features and reference circuit shown in figure 45, the users can easily design the SD card application circuit to enhance the memory capacity of the module. The users can store some high-capacity files to external memory card. Such as in the automotive application system, the module can record and store the audio file to the SD card, and also can play the audio files in SD card. Table 25: Pin definition of the SD card interface Name SD_DATA SD_CLK SD_CMD Pin 1 2 3 Function Data output and input signal of SD card Clock signal of SD card output Command signal of SD card output Figure 45: Reference circuit of SD card M10_HD_V3.0

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M10 Hardware Design Table 26: Pin name of the SD card and T-Flash(Micro SD) card Pin NO. 1 2 3 4 5 6 7 8 9 Pin name of SD card CD/DATA3 CMD VSS1 VCC CLK VSS2 DATA0 DATA1 DATA2 Pin name of T-Flash(Micro SD) card DATA2 CD/DATA3 CMD VCC CLK VSS DATA0 DATA1 In SD card interface designing, in order to ensure good communication performance with SD card, it should be complied with following design principles. Route SD card signals as short as possible. Ensure the length of trace do not exceed 20mm. In order to offer good ESD protection, it is recommended to add TVS on signals with the capacitance is less than 15pF. Reserve external pull-up resistor for other data lines except the DATA0. The SD_CLK and SD_DATA line must be shielded by GND in order to avoid interference. The SD_CLK and SD_DATA and SD_CMD trace should be routed together and keep each trace as close as possible. M10_HD_V3.0

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M10 Hardware Design 4. Antenna interface The Pin 43 is the RF antenna pad. The RF interface has an impedance of 50. A reference circuit is shown in following figure. By default, the resistor R1 is 0 ohm and capacitor C1 and C2 are not mounted. RF_ANT MODULE R1 0R C1 NM C2 NM Figure 46: Reference circuit of RF interface 4.1. Antenna installation M10 provides an RF antenna PAD for customers antenna connection. The RF trace in host PCB connecting to the module RF antenna pad should be micro-strip line or other types of RF trace, whose characteristic resistance should be close to 50. M10 comes with two grounding pads which are next to the antenna pad in order to give a better grounding. Table 27: Pin definition of the RF_ANT Name RF_ANT GND GND Pin 43 42 44 Function RF antenna pad Ground Ground To minimize the loss on the RF trace and RF cable, they should be designed carefully. It is recommended that the insertion loss should try to meet the following requirements:

GSM850/EGSM900<1dB DCS1800/PCS1900<1.5dB M10_HD_V3.0

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M10 Hardware Design 4.2. RF output power Table 28: The module conducted RF output power Frequency GSM850 EGSM900 DCS1800 PCS1900 Max 33dBm 2dB 33dBm 2dB 30dBm 2dB 30dBm 2dB Min 5dBm5dB 5dBm5dB 0dBm5dB 0dBm5dB Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in chapter 13.16 of 3GPP TS 51.010-1. 4.3. RF receiving sensitivity Table 29: The module conducted RF receiving sensitivity Frequency GSM850 EGSM900 DCS1800 PCS1900 Receive sensitivity

< -108.5dBm

< -108.5dBm

< -108dBm

< -108dBm 4.4. Operating frequencies Table 30: The module operating frequencies Frequency Receive GSM850 EGSM900 DCS1800 PCS1900 869~894MHz 925~960MHz 1805~1880MHz 1930~1990MHz Transmit 824~849MHz 880~915MHz 1710~1785MHz 1850~1910MHz ARFCH 128~251 0~124, 975~1023 512~885 512~810 4.5. Recommendation of RF pad welding If external antenna is connected with RF cable welded on the RF pads, please refer to figure 47. Any incorrect welding type may cause poor performance both in transmitting power and receiving sensitivity. M10_HD_V3.0

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M10 Hardware Design Figure 47: Recommendation of RF pad welding M10_HD_V3.0

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M10 Hardware Design 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table:

Table 31: Absolute maximum ratings Parameter VBAT Peak current of power supply RMS current of power supply (during one TDMA- frame) Voltage at digital pins Voltage at analog pins Voltage at digital/analog pins in POWER DOWN mode Min

-0.3 0 0

-0.3

-0.3

-0.25 Max 4.7 2 0.7 3.3 3.0 0.25 Unit V A A V V V 5.2. Operating temperature The operating temperature is listed in the following table:

Table 32: Operating temperature Parameter Normal temperature Restricted operation*

Storage temperature Min

-35

-45 to -35

-45 Typ 25 Unit Max

+80

+80 to +85

+90

* When the module works in this temperature range, the deviation from the GSM specification may occur. For example, the frequency error or the phase error could increase. M10_HD_V3.0

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M10 Hardware Design 5.3. Power supply ratings Table 33: The module power supply ratings Parameter Description Conditions VBAT Supply voltage Voltage must stay within the min/max values, including voltage drop, ripple, and spikes. Min Type 3.3 4.0 Max Unit 4.6 V Voltage drop during transmitting burst Voltage ripple IVBAT Average supply current Maximum power control level on GSM850 and GSM900. Maximum power control level on GSM850 and GSM900

@ f<200kHz

@ f>200kHz POWER DOWN mode SLEEP mode @ DRX=5 Minimum functionality mode AT+CFUN=0 IDLE mode SLEEP mode AT+CFUN=4 IDLE mode SLEEP mode IDLE mode GSM850/EGSM900 DCS1800/PCS1900 TALK mode GSM850/EGSM9001) DCS1800/PCS19002) DATA mode, GPRS (3 Rx,2Tx) GSM850/EGSM9001) DCS1800/PCS19002) DATA mode, GPRS(2 Rx,3Tx) GSM850/EGSM9001) DCS1800/PCS19002) DATA mode, GPRS (4 Rx,1Tx) GSM850/EGSM9001) DCS1800/PCS19002) DATA mode, GPRS(1Rx,4Tx) GSM850/EGSM9001) 400 mV 50 2 mV mV uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 29 1.1 13 0.84 13 0.83 13 13 209/208 191/202 341/347 318/335 394/408 377/396 225/226 210/219 449/464 M10_HD_V3.0

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M10 Hardware Design Parameter Description Conditions Min Type DCS1800/PCS19002) Maximum power control level on GSM900. 423/445 1.6 Peak supply current

(during transmission slot) Max Unit mA A 1.8 1) Power control level PCL 5 2) Power control level PCL 0 5.4. Current consumption The values of current consumption are shown in Table 34. Table 34: The module current consumption Condition Voice Call GSM850 GSM900 DCS1800 PCS1900 Current Consumption

@power level #5 <300mA,Typical 209mA

@power level #12,Typical 96mA

@power level #19,Typical 73mA

@power level #5 <300mA,Typical 208mA

@power level #12,Typical 96mA

@power level #19,Typical 73mA

@power level #0 <250mA,Typical 191mA

@power level #7,Typical 93mA

@power level #15,Typical 70mA

@power level #0 <250mA,Typical 202mA

@power level #7,Typical 95mA

@power level #15,Typical 71mA GPRS Data DATA mode, GPRS ( 1 Rx,1 Tx ) CLASS 12 GSM850 EGSM 900 DCS 1800 PCS 1900

@power level #5 <350mA,Typical 199mA

@power level #12,Typical 87mA

@power level #19,Typical 63mA

@power level #5 <350mA,Typical 200mA

@power level #12,Typical 96mA

@power level #19,Typical 70mA

@power level #0 <300mA,Typical 184mA

@power level #7,Typical 82mA

@power level #15,Typical 66mA

@power level #0 <300mA,Typical 192mA

@power level #7,Typical 82mA M10_HD_V3.0

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M10 Hardware Design

@power level #15,Typical 66mA DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 12 GSM850 DATA mode, GPRS ( 2 Rx, 3 Tx ) CLASS 12 GSM850 DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 12 GSM850 EGSM 900 DCS 1800 PCS 1900 EGSM 900 DCS 1800 PCS 1900 EGSM 900 DCS 1800 PCS 1900

@power level #5 <550mA,Typical 341mA

@power level #12,Typical 135mA

@power level #19,Typical 85mA

@power level #5 <550mA,Typical 347mA

@power level #12,Typical 156mA

@power level #19,Typical 103mA

@power level #0 <450mA,Typical 318mA

@power level #7,Typical 118mA

@power level #15,Typical 84mA

@power level #0 <450mA,Typical 335mA

@power level #7,Typical 128mA

@power level #15,Typical 95mA

@power level #5 <600mA,Typical 394mA

@power level #12,Typical 176mA

@power level #19,Typical 102mA

@power level #5 <600mA,Typical 408mA

@power level #12,Typical 189mA

@power level #19,Typical 110mA

@power level #0 <490mA,Typical 377mA

@power level #7,Typical 147mA

@power level #15,Typical 97mA

@power level #0 <480mA,Typical 396mA

@power level #7,Typical 146mA

@power level #15,Typical 98mA

@power level #5 <350mA,Typical 225mA

@power level #12,Typical 87mA

@power level #19,Typical 62mA

@power level #5 <350mA,Typical 226mA

@power level #12,Typical 97mA

@power level #19,Typical 69mA

@power level #0 <300mA,Typical 210mA

@power level #7,Typical 82mA

@power level #15,Typical 66mA

@power level #0 <300mA,Typical 219mA

@power level #7,Typical 82mA

@power level #15,Typical 66mA DATA mode, GPRS ( 1 Rx, 4 Tx ) CLASS 12 GSM850

@power level #5 <660mA,Typical 449mA

@power level #12,Typical 207mA M10_HD_V3.0

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M10 Hardware Design EGSM 900 DCS 1800 PCS 1900

@power level #19,Typical 109mA

@power level #5 <660mA,Typical 464mA

@power level #12,Typical 221mA

@power level #19,Typical 117mA

@power level #0 <530mA,Typical 423mA

@power level #7,Typical 166mA

@power level #15,Typical 99mA

@power level #0 <530mA,Typical 445mA

@power level #7,Typical 165mA

@power level #15,Typical 100mA Note: GPRS Class 12 is the default setting. The module can be configured from GPRS Class 1 to Class 12 by AT+QGPCLASS. Setting to lower GPRS class would make it easier to design the power supply for the module. 5.5. Electro-static discharge Although the GSM engine is generally protected against Electrostatic Discharge (ESD), precautions about ESD protection should still be emphasized. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any applications using the module. The measured ESD values of module are shown as the following table:

Table 35: The ESD endurance (Temperature:25,Humidity:45 %) Tested point VBAT,GND PWRKEY SIM Card Interface Antenna port SPK1P/1N, SPK2P/2N, MIC1P/1N, MIC2P/2N Contact discharge 5KV 4KV 4KV 5KV 4KV Air discharge 12KV

+8KV/-6 KV

+8KV/-6 KV 10KV

+8KV/-6 KV M10_HD_V3.0

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M10 Hardware De esign 6. M Mechani cal dime ensions This s chapter desc cribes the me chanical dim mensions of th e module. al dimensio ons of mod dule Figure 4 48: M10 top a and side dim mensionsUn nit: mm 6.1. Mechanic M10_ _HD_V3.0

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M10 Hardware Design test point Figure 49: M10 bottom dimensionsUnit: mm Figure 50: PAD bottom dimensionsUnit: mm M10_HD_V3.0

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M10 Hardware Design 6.2. Footprint of recommendation single pad M10_HD_V3.0

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M10 Hardware Design safe area line module dimension keepout area Figure 51: Footprint of recommendationUnit: mm Note1Keep out the area below the test point in the host PCB. Place solder mask. Note2In order to maintain the module, keep about 3mm between the module and other components in host PCB. Note3Keep out area in above figure in which is forbid to pour GND copper. Since the RF test point in this area, avoid generating parasitic capacitance between RF test point and GND. M10_HD_V3.0

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M10 Hardware De esign 6.3. Top view of the mod dule Figure 52:

Top view of f the module 6.4. Bottom vi ew of the m module F Figure 53: B Bottom view o of the modul le M10_ _HD_V3.0

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M10 Hardware Design Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 36. Table 36: Description of different coding schemes Scheme Code rate USF Pre-coded USF CS-1 CS-2 CS-3 CS-4 1/2 2/3 3/4 1 3 3 3 3 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS Tail Coded bits Punctured bits 40 16 16 16 4 4 4

-

456 588 676 456 0 132 220

-

Data rate Kb/s 9.05 13.4 15.6 21.4 USF Radio Block Radio block structure of CS-1, CS-2 and CS-3 is shown as Figure 54:

Rate 1/2 convolutional coding Puncturing 456 bits BCS Figure 54: Radio block structure of CS-1, CS-2 and CS-3 Radio Block Radio block structure of CS-4 is shown as Figure 55:

USF Block Code 456 bits No coding BCS Figure 55: Radio block structure of CS-4 M10_HD_V3.0

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M10 Hardware Design Appendix B: GPRS multi-slot classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependant, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes of the M10 module support is shown in Table 37. Table 37: GPRS multi-slot classes Multislot class Downlink slots Uplink slots Active slots 1 2 2 3 2 3 3 4 3 4 4 4 1 1 2 1 2 2 3 1 2 2 3 4 2 3 3 4 4 4 4 5 5 5 5 5 1 2 3 4 5 6 7 8 9 10 11 12 M10_HD_V3.0

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