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EC C21 Ha rdw war re DDes sign n LTEM Module S Series Rev. EC21_Ha ardware_ _Design_ _V1.4 Date:
2017-03 3-01 w www.quecte l.com LTE Module Series EC21 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email:info@quectel.com Or our local office.For more information, please visit:
http://www.quectel.com/support/salesupport.aspx For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/techsupport.aspx Or email to: Support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. THE INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved. EC21_Hardware_Design Confidential / Released 1 / 94 LTE Module Series EC21 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-15 Yeoman CHEN Initial 1.1 2016-09-22 Yeoman CHEN/
Frank WANG/
Lyndon LIU 1.2 2016-11-04 Lyndon LIU/
Michael ZHANG 1. Updated frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART, supported internet protocols, supported USB drivers of USB interface, and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated main UART supports baud rate in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS Performance in Table 21. 9. Updated operating frequencies of module in Table 23. 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in Table 4. 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 5.1.4. 9. Added current consumption of EC21-V in Chapter EC21_Hardware_Design Confidential / Released 2 / 94 LTE Module Series EC21 Hardware Design 1.3 2017-01-24 Lyndon LIU/
Rex WANG 6.4. 10. Added note about SIMO in Chapter 6.6. 1. Updated frequency bands in Table 1. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (top view) in Figure 2. 4. Added BT interface in Chapter 3.18.2. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated GNSS performance in Table 24. 7. Updated module operating frequencies in Table 26. 8. Added EC21-AUV current consumption in Table 38. 9. Updated EC21-A conducted RF receiving sensitivity of in Table 42. 10. Added EC21-J conducted RF receiving sensitivity in Table 48. 1.4 2017-03-01 Geely YANG Deleted the LTE band TDD B41 of EC21-CT EC21_Hardware_Design Confidential / Released 3 / 94 LTE Module Series EC21 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 4 Table Index ............................................................................................................................................... 6 Figure Index .............................................................................................................................................. 8 1 Introduction ..................................................................................................................................... 10 1.1. Safety Information ..................................................................................................................11 2 Product Concept ............................................................................................................................. 12 2.1. General Description .............................................................................................................. 12 Key Features ......................................................................................................................... 13 2.2. 2.3. Functional Diagram ............................................................................................................... 15 Evaluation Board ................................................................................................................... 16 2.4. 3.6. 3 Application Interfaces ..................................................................................................................... 17 3.1. General Description .............................................................................................................. 17 Pin Assignment ..................................................................................................................... 18 3.2. 3.3. Pin Description ...................................................................................................................... 19 3.4. Operating Modes .................................................................................................................. 28 3.5. Power Saving ........................................................................................................................ 28 3.5.1. Sleep Mode.................................................................................................................. 28 3.5.1.1. UART Application ............................................................................................... 28 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 29 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 30 3.5.1.4. USB Application without USB Suspend Function ............................................... 31 3.5.2. Airplane Mode .............................................................................................................. 32 Power Supply ........................................................................................................................ 32 3.6.1. Power Supply Pins ....................................................................................................... 32 3.6.2. Decrease Voltage Drop ................................................................................................ 33 3.6.3. Reference Design for Power Supply ............................................................................ 34 3.6.4. Monitor the Power Supply ............................................................................................ 35 Turn on and off Scenarios ..................................................................................................... 35 3.7.1. Turn on Module Using the PWRKEY ........................................................................... 35 3.7.2. Turn off Module ............................................................................................................ 37 3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 37 3.7.2.2. Turn off Module Using AT Command ................................................................. 37 3.8. Reset the Module .................................................................................................................. 38 3.9. USIM Card Interface ............................................................................................................. 39 3.10. USB Interface ........................................................................................................................ 41 3.11. UART Interfaces .................................................................................................................... 43 3.12. PCM and I2C Interfaces ........................................................................................................ 45 3.13. ADC Function ........................................................................................................................ 48 3.14. Network Status Indication ..................................................................................................... 49 3.7. EC21_Hardware_Design Confidential / Released 4 / 94 LTE Module Series EC21 Hardware Design 3.15. STATUS ................................................................................................................................ 50 3.16. Behavior of the RI ................................................................................................................. 51 3.17. SGMII Interface ..................................................................................................................... 51 3.18. Wireless Connectivity Interfaces ........................................................................................... 54 3.18.1. WLAN Interface ........................................................................................................... 56 3.18.2. BT Interface* ................................................................................................................ 56 3.19. USB_BOOT Interface ............................................................................................................ 57 4 GNSS Receiver ................................................................................................................................ 58 4.1. General Description .............................................................................................................. 58 4.2. GNSS Performance .............................................................................................................. 58 Layout Guidelines ................................................................................................................. 59 4.3. 5 Antenna Interfaces .......................................................................................................................... 60 5.1. Main/Rx-diversity Antenna Interface ..................................................................................... 60 5.1.1. Pin Definition ................................................................................................................ 60 5.1.2. Operating Frequency ................................................................................................... 60 5.1.3. Reference Design of RF Antenna Interface ................................................................. 61 5.1.4. Reference Design of RF Layout ................................................................................... 62 5.2. GNSS Antenna Interface ....................................................................................................... 64 5.3. Antenna Installation .............................................................................................................. 65 5.3.1. Antenna Requirement .................................................................................................. 65 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 66 6 Electrical, Reliability and Radio Characteristics .......................................................................... 68 Absolute Maximum Ratings .................................................................................................. 68 6.1. 6.2. Power Supply Ratings ........................................................................................................... 68 6.3. Operating Temperature ......................................................................................................... 69 Current Consumption ............................................................................................................ 70 6.4. RF Output Power .................................................................................................................. 76 6.5. 6.6. RF Receiving Sensitivity ....................................................................................................... 76 Electrostatic Discharge ......................................................................................................... 80 6.7. 7 Mechanical Dimensions.................................................................................................................. 81 7.1. Mechanical Dimensions of the Module.................................................................................. 81 Recommended Footprint ....................................................................................................... 83 7.2. 7.3. Design Effect Drawings of the Module .................................................................................. 84 8 Storage, Manufacturing and Packaging ........................................................................................ 85 8.1. Storage ................................................................................................................................. 85 8.2. Manufacturing and Soldering ................................................................................................ 86 8.3. Packaging ............................................................................................................................. 87 9 Appendix A References .................................................................................................................. 88 10 Appendix B GPRS Coding Schemes ............................................................................................. 92 11 Appendix C GPRS Multi-slot Classes ............................................................................................ 93 12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 94 EC21_Hardware_Design Confidential / Released 5 / 94 LTE Module Series EC21 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC21 SERIES MODULE ........................................................................ 12 TABLE 2: KEY FEATURES OF EC21 MODULE ............................................................................................... 13 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 19 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 28 TABLE 6: VBAT AND GND PINS ....................................................................................................................... 33 TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 35 TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 38 TABLE 9: PIN DEFINITION OF THE USIM CARD INTERFACE ...................................................................... 39 TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 41 TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE ..................................................................... 43 TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE ................................................................. 43 TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 44 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 46 TABLE 15: PIN DEFINITION OF THE ADC ...................................................................................................... 48 TABLE 16: CHARACTERISTIC OF THE ADC .................................................................................................. 48 TABLE 17: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ...................... 49 TABLE 18: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ................... 49 TABLE 19: PIN DEFINITION OF STATUS ........................................................................................................ 50 TABLE 20: BEHAVIOR OF THE RI ................................................................................................................... 51 TABLE 21: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. 52 TABLE 22: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ................................................ 54 TABLE 23: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 57 TABLE 24: GNSS PERFORMANCE ................................................................................................................. 58 TABLE 25: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 60 TABLE 26: MODULE OPERATING FREQUENCIES ........................................................................................ 60 TABLE 27: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 64 TABLE 28: GNSS FREQUENCY ....................................................................................................................... 64 TABLE 29: ANTENNA REQUIREMENTS .......................................................................................................... 65 TABLE 30: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 68 TABLE 31: POWER SUPPLY RATINGS ........................................................................................................... 68 TABLE 32: OPERATING TEMPERATURE ........................................................................................................ 69 TABLE 33: EC21-A CURRENT CONSUMPTION ............................................................................................. 70 TABLE 34: EC21-AUT CURRENT CONSUMPTION ........................................................................................ 71 TABLE 35: EC21-E CURRENT CONSUMPTION ............................................................................................. 72 TABLE 36: EC21-KL CURRENT CONSUMPTION ........................................................................................... 73 TABLE 37: EC21-V CURRENT CONSUMPTION ............................................................................................. 74 TABLE 38: EC21-AUV CURRENT CONSUMPTION ........................................................................................ 74 TABLE 39: GNSS CURRENT CONSUMPTION OF EC21 SERIES MODULE ................................................. 75 TABLE 40: RF OUTPUT POWER ..................................................................................................................... 76 TABLE 41: EC21-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 76 EC21_Hardware_Design Confidential / Released 6 / 94 LTE Module Series EC21 Hardware Design TABLE 42: EC21-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 77 TABLE 43: EC21-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 77 TABLE 44: EC21-AUT CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 77 TABLE 45: EC21-AUTL CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 78 TABLE 46: EC21-KL CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 78 TABLE 47: EC21-CT CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 78 TABLE 48: EC21-J CONDUCTED RF RECEIVING SENSITIVITY................................................................... 79 TABLE 49: EC21-AUV CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 79 TABLE 50: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 80 TABLE 51: RELATED DOCUMENTS ................................................................................................................ 88 TABLE 52: TERMS AND ABBREVIATIONS ...................................................................................................... 88 TABLE 53: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 92 TABLE 54: GPRS MULTI-SLOT CLASSES ...................................................................................................... 93 TABLE 55: EDGE MODULATION AND CODING SCHEMES ........................................................................... 94 EC21_Hardware_Design Confidential / Released 7 / 94 LTE Module Series EC21 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 18 FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 29 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 30 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 31 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 31 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 33 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 34 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 34 FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 35 FIGURE 11: TURN ON THE MODULE USING KEYSTROKE .......................................................................... 36 FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 36 FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 37 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 38 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 38 FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 39 FIGURE 17: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH AN 8-PIN USIM CARD CONNECTOR .................................................................................................................................................... 40 FIGURE 18: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH A 6-PIN USIM CARD CONNECTOR
........................................................................................................................................................................... 40 FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 42 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 44 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 45 FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 46 FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 46 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 47 FIGURE 25: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 50 FIGURE 26: REFERENCE CIRCUITS OF STATUS ......................................................................................... 50 FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 52 FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................. 53 FIGURE 29: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE
........................................................................................................................................................................... 55 FIGURE 30: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 57 FIGURE 31: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61 FIGURE 32: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62 FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 62 FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND) .......................................................................................................................................................... 63 FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) .......................................................................................................................................................... 63 FIGURE 36: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 64 EC21_Hardware_Design Confidential / Released 8 / 94 LTE Module Series EC21 Hardware Design FIGURE 37: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 66 FIGURE 38: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 66 FIGURE 39: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 67 FIGURE 40: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 81 FIGURE 41: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 82 FIGURE 42: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 83 FIGURE 43: TOP VIEW OF THE MODULE ...................................................................................................... 84 FIGURE 44: BOTTOM VIEW OF THE MODULE .............................................................................................. 84 FIGURE 45: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 86 FIGURE 46: TAPE AND REEL SPECIFICATIONS ........................................................................................... 87 EC21_Hardware_Design Confidential / Released 9 / 94 LTE Module Series EC21 Hardware Design 1 Introduction This document defines the EC21module and describes its air interface and hardware interface which are connected with your application. This document can help you quickly understand module interface specifications, electrical andmechanical details, as well as other related information of EC21 module. Associated with application note and user guide, you can use EC21 module to design and set up mobile applications easily. EC21_Hardware_Design Confidential / Released 10 / 94 LTE Module Series EC21 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC21 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, andincorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals,clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operatingover radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid USIM/SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres includefuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC21_Hardware_Design Confidential / Released 11 / 94 LTE Module Series EC21 Hardware Design 2 Product Concept 2.1. General Description EC21 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD,DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA,EDGE andGPRSnetworks. It also provides GNSS1) and voice functionality2) for your specific applications.EC21 EC21-AUT, EC21-AU,EC21-AUV,EC21-AUTL, EC21-J, EC21-CT and EC21-KL. You can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC21 series module. tenvariants:EC21-E, EC21-A, contains EC21-V, Table 1: Frequency Bands of EC21 Series Module Modules2) LTE Bands 3G Bands GSM EC21-E FDD:B1/B3/B5/B7/B8/B20 EC21-A FDD:B2/B4/B12 EC21-V FDD:B4/B13 EC21-AUT FDD:B1/B3/B5/B7/B28 EC21-AU3) FDD: B1/B2/B3/B4/B5/B7/B8/
B28 TDD: B40 WCDMA:B1/B 5/B8 WCDMA:B2/B 4/B5 N WCDMA:
B1/B5 900/1800 N N N WCDMA:
B1/B2/B5/B8 850/900/
1800/1900 EC21-AUV FDD: B1/B3/B5/B8/B28 B1/B5/B8 EC21-AUTL FDD:B3/B7/B28 EC21-J FDD: B1/B3/B8/B18/B19/B26 EC21-CT FDD:B1/B3/B5 EC21-KL FDD:B1/B3/B5/B7/B8 N N N N N N N N N Rx-
diversity GNSS1) Y Y Y Y Y Y Y Y N Y GPS, GLONASS, BeiDou/
Compass, Galileo,QZS S N N N N N EC21_Hardware_Design Confidential / Released 12 / 94 LTE Module Series EC21 Hardware Design NOTES 1. 2. 1) GNSS function is optional. 2) EC21 series module (EC21-E, EC21-A, EC21-V, EC21-AUT, EC21-AU,EC21-AUV, EC21-AUTL, EC21-J, EC21-CT and EC21-KL) includes Data-only and Telematics versions. Data-only version does not support voice function, while Telematics version supports it. 3) B2 band on EC21-AU module does not support Rx-diversity. 3. 4. Y = supported (including LTE and WCDMA). N = Not supported. With a compact profile of 32.0mm 29.0mm 2.4mm, EC21 can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone,tablet PC, etc. EC21 is an SMD type module which can be embedded into applications through its 144-pin pads, including 80LCC signal pads and 64 other pads. 2.2. Key Features The following table describes the detailed features of EC21 module. Table 2: Key Features of EC21 Module Features Details Power Supply Supply voltage: 3.3V~4.3VTypical supply voltage: 3.8V Transmitting Power LTE Features WCDMA Features Class 4 (33dBm2dB) for GSM900 Class 1 (30dBm2dB) for DCS1800 Class E2 (27dBm3dB) for GSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class 3 (22.5dBm -3/+1dB) for WCDMA bands Class 3 (22.5dBm -3/+1dB) for LTE-FDD bands Class 3 (22.5dBm -3/+1dB) for LTE-TDD bands Support up to non-CA CAT1 Support 1.4 to 20MHz RF bandwidth SupportMIMO in DL direction FDD: Max 5Mbps (UL), 10Mbps (DL) TDD: Max 3.1Mbps(UL), 8.96Mbps(DL) Support 3GPP R8 DC-HSPA+
Support 16-QAM, 64-QAM and QPSKmodulation 3GPP R6 CAT6 HSUPA: Max 5.76Mbps (UL) EC21_Hardware_Design Confidential / Released 13 / 94 LTE Module Series EC21 Hardware Design 3GPP R8 CAT24 DC-HSPA+: Max 42Mbps (DL) R99:
CSD: 9.6kbps, 14.4kbps GPRS:
Support GPRS multi-slot class 12 (12 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Maximum of four Rx time slots per frame EDGE:
Support EDGE multi-slot class 12 (12 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/MMS*/FTPS*/
SSL*protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default GSMFeatures Internet Protocol Features SMS USIM Interface Support USIM/SIM card: 1.8V, 3.0V Audio Features PCM Interface USB Interface UART Interface Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 8-bit A-law*, -law*and 16-bit linear data formats Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only);the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgradeand voice over USB*
SupportUSB drivers for Windows XP, Windows Vista, Windows 7, Windows 8/8.1, Window 10, Linux 2.6 or later, Android 4.0/4.2/4.4/5.0/5.1/6.0 Main UART:
Used for AT command communication and data transmission EC21_Hardware_Design Confidential / Released 14 / 94 LTE Module Series EC21 Hardware Design Baud rate reach up to 3000000bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART:
Used for Linux console, log output 115200bps baud rate SGMII Interface Support 10/100/1000Mbps Ethernet connectivity Wireless Connectivity Interfaces Support a low-power SDIO 3.0 interface for WLAN and UART/PCM interface for Bluetooth*
Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Network Indication Antenna Interface Physical Characteristics Temperature Range Gen8CLite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Including main antennainterface(ANT_MAIN), Rx-diversity antenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS) Size: (32.00.15)(29.00.15)(2.40.2)mm Weight: approx. 4.9g Operation temperature range: -35C ~ +75C1) Extended temperature range: -40C ~ +85C2) Firmware Upgrade USB interfaceand DFOTA*
All hardware components are fully compliant with EU RoHS directive RoHS NOTES 1) Within operating temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operating temperature levels, the module will meet 3GPP specificationsagain.
* means under development. 1. 2. 3. 2.3. Functional Diagram EC21_Hardware_Design Confidential / Released 15 / 94 LTE Module Series EC21 Hardware Design The following figure shows a block diagram of EC21 and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces ANT_MAIN ANT_GNSS ANT_DIV Switch SAW Switch Duplex LNA APT PA Tx PRx SAW DRx Transceiver NAND DDR2 SDRAM IQ Control Baseband PMIC Control 19.2M XO VDD_EXT USB USIM PCM SGMII WLAN I2C UART GPIOs BT Figure 1: Functional Diagram VBAT_RF VBAT_BB PWRKEY RESET_N ADCs STATUS 2.4. Evaluation Board In order to help youdevelop applications with EC21, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module. EC21_Hardware_Design Confidential / Released 16 / 94 LTE Module Series EC21 Hardware Design 3 Application Interfaces 3.1. General Description EC21 is equipped with 80-pin SMT pads plus 64-pin ground pads and reserved pads that can beconnected to cellular application platform. Sub-interfaces included in these pads are described in detail in the following chapters:
Power supply USIM interface USB interface UART interfaces PCM interface ADC interface Status indication SGMII interface Wireless connectivity interfaces USB_BOOT interface EC21_Hardware_Design Confidential / Released 17 / 94 LTE Module Series EC21 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC21 module. Figure 2: Pin Assignment (Top View) NOTES 1)means that these pins cannot be pulled up before startup. 2) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 1. 2. 3. Pads 119~126 are SGMII function pins. 4. Pads 37~40, 118, 127 and 129~139 are wireless connectivity interfaces, among which pads 127 and 129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT function is under development. 5. Pads 24~27 are multiplexing pinsused for audio design on EC21 module and BT function on FC20 EC21_Hardware_Design Confidential / Released 18 / 94 LTE Module Series EC21 Hardware Design module. 6. Keep all RESERVEDpins and unused pins unconnected. 7. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84should not be designed in schematic and PCB decal. means these interface functions are only supported on Telematics version. 8. 3.3. Pin Description The following tables show the pin definition of EC21 module. Table 3: I/O Parameters Definition Type IO DI DO PI PO AI AO OD Description Bidirectional Digital input Digital output Power input Power output Analog input Analog output Open drain Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59,60 PI VBAT_RF 57,58 PI Power supply for module baseband part Power supply for module RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be able to provide sufficient current up to 0.8A. It must be able to provide sufficient current up to 1.8A in a burst transmission. EC21_Hardware_Design Confidential / Released 19 / 94 LTE Module Series EC21 Hardware Design VDD_EXT 7 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIOs pull up circuits. 8,9,19,22,3 6,46,48,50
~54,56,72, 85~112 GND Turn on/off Ground Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI Turnon/off the module RESET_N 20 DI Reset the module Status Indication VIHmax=2.1V VIHmin=1.3V VILmax=0.5V VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module operating status The drive current should be less than 0.9mA. NET_MODE 5 DO NET_ STATUS 6 DO USB Interface Indicate the module network registration mode Indicate the module network activity status VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V Require external pull-up. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 71 PI USB detection Vnorm=5.0V USB_DP 69 USB_DM 70 IO IO USB differential data bus USB differential data bus Compliant with USB 2.0 standard specification. Compliant with USB 2.0 standard specification. Require differential impedance of 90ohm. Require differential impedance of 90ohm. EC21_Hardware_Design Confidential / Released 20 / 94 LTE Module Series EC21 Hardware Design USIM Interface Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 10 Specified ground for USIM card USIM_VDD 14 PO Power supply for USIM card USIM_DATA 15 IO Data signal of USIM card USIM_CLK 16 DO Clock signal of USIM card USIM_RST 17 DO Reset signal of USIM card USIM_ PRESENCE 13 DI USIM card insertion detection For 1.8V USIM:
Vmax=1.9V Vmin=1.7V For 3.0V USIM:
Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V USIM:
VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V USIM:
VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V USIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V USIM:
VOLmax=0.45V VOHmin=2.55V For 1.8V USIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V USIM:
VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V Either 1.8V or 3.0V is supported by the module automatically. 1.8V power domain. If unused, keep it open. EC21_Hardware_Design Confidential / Released 21 / 94 LTE Module Series EC21 Hardware Design UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI DCD CTS RTS 62 63 64 65 DO Ring indicator DO Data carrier detection DO Clear to send DI Request to send DTR 66 DI Data terminal ready,sleep mode control TXD RXD 67 68 DO Transmit data DI Receive data Debug UART Interface VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 12 DO Transmit data DBG_RXD 11 DI Receive data ADC Interface VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 ADC1 45 44 AI AI General purpose analog to digital converter General purpose analog to digital converter Voltage range:
0.3V to VBAT_BB Voltage range:
0.3V to VBAT_BB If unused, keep it open. If unused, keep it open. EC21_Hardware_Design Confidential / Released 22 / 94 LTE Module Series EC21 Hardware Design PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_IN 24 DI PCM data input PCM_OUT 25 DO PCM data output PCM_SYNC 26 IO frame PCM data synchronization signal PCM_CLK 27 IO PCM clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 41 OD I2C_SDA 42 OD SGMII Interface I2C serial clock. Used for external codec I2C serial data. Used for external codec External pull-up resistor is required. 1.8V only. If unused, keep it open. External pull-up resistor is required. 1.8V only. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment EPHY_RST_N 119 DO Ethernet PHY reset For 1.8V:
VOLmax=0.45V VOHmin=1.4V For 2.85V:
VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open. EC21_Hardware_Design Confidential / Released 23 / 94 LTE Module Series EC21 Hardware Design EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_ MDATA 121 IO SGMII MDIO
(Management Data Input/Output) data SGMII_ MCLK 122 DO SGMII MDIO
(Management Data Input/Output) clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V:
VOLmax=0.45V VOHmin=1.4V VILmax=0.58V VIHmin=1.27V For 2.85V:
VOLmax=0.35V VOHmin=2.14V VILmax=0.71V VIHmin=1.78V For 1.8V:
VOLmax=0.45V VOHmin=1.4V For 2.85V:
VOLmax=0.35V VOHmin=2.14V USIM2_VDD 128 PO SGMII MDIO pull-up power source SGMII_TX_M 123 SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 AO AO AI AI SGMII transmission
- minus SGMII transmission
- plus SGMII receiving
- plus SGMII receiving
-minus Wireless Connectivity Interfaces 1.8V power domain. If unused, keep it open. 1.8V/2.85V power domain. If unused, keep it open. 1.8V/2.85V power domain. If unused, keep it open. for Configurable power source. 1.8V/2.85V power domain. External pull-up SGMII MDIO pins. If unused, keep it open. If unused, keep it open. If unused, keep it open. If unused, keep it open. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment SDC1_ DATA3 129 IO SDIO data bus D3 VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it EC21_Hardware_Design Confidential / Released 24 / 94 LTE Module Series EC21 Hardware Design SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 130 IO SDIO data bus D2 131 IO SDIO data bus D1 132 IO SDIO data bus D1 SDC1_CLK 133 DO SDIO clock SDC1_CMD 134 DO SDIO command PM_ENABLE 127 DO External power control WAKE_ON_ WIRELESS 135 DI WLAN_EN 136 DO Wake up the host
(EC21 module) by FC20 module. WLAN function controlvia FC20 module COEX_UART_ RX 137 DI LTE/WLAN coexistence signal VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Active low. If unused, keep it open. 1.8V power domain. Active high. If unused, keep it open. 1.8V power domain. If unused, keep it open. EC21_Hardware_Design Confidential / Released 25 / 94 LTE Module Series EC21 Hardware Design COEX_UART_ TX WLAN_SLP_ CLK 138 DO LTE/WLAN coexistence signal VOLmax=0.45V VOHmin=1.35V 118 DO WLAN sleep clock BT_RTS*
37 DI BT UART request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V BT_TXD*
38 DO BT UART data transmit VOLmax=0.45V VOHmin=1.35V BT_RXD*
39 DI BT UART data receive VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V BT_CTS*
40 DO BT UART clear to send VOLmax=0.45V VOHmin=1.35V BT_EN*
139 DO BTfunctioncontrolvia FC20 module VOLmax=0.45V VOHmin=1.35V RF Interface 1.8V power domain. If unused, keep it open. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment 35 49 47 ANT_DIV ANT_MAIN ANT_GNSS GPIO Pins AI Diversity antenna pad 50ohm impedance If unused, keep it open. IO Main antenna pad 50ohm impedance AI GNSS antenna pad 50 ohm impedance If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI Sleep mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. W_DISABLE# 4 DI Airplane mode VILmin=-0.3V 1.8V power domain. EC21_Hardware_Design Confidential / Released 26 / 94 LTE Module Series EC21 Hardware Design control VILmax=0.6V VIHmin=1.2V VIHmax=2.0V AP_READY 2 DI Other Interface Pins Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V Pull-up by default. In low voltage level, module can enter into airplane mode. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 115 DI Force the module to boot from USB port. RESERVED Pins VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment Reserved Keep these pins unconnected. 3, 18, 23, 28~34, 43, 55, 73~84, 113, 114, 116, 117, 140~144 RESERVED NOTES
* means under development. 1. 2. Pads 24~27 are multiplexing pins used for audio design on EC21 module and BT function on FC20 module. EC21_Hardware_Design Confidential / Released 27 / 94 LTE Module Series EC21 Hardware Design 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Idle Talk/Data Software is active. The module hasbeen registered onthe network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network settingand data transfer rate. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and USIM card will be invalid. AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Normal Operation Minimum Functionality Mode Airplane Mode Sleep Mode Power down Mode 3.5. Power Saving 3.5.1. Sleep Mode EC21 is able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedure of EC21 module. 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. EC21_Hardware_Design Confidential / Released 28 / 94 LTE Module Series EC21 Hardware Design The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving thehost DTR to low level will wake up the module. When EC21 has URC to report, RI signal will wake up the host. Refer to Chapter 3.16 for details about RI behavior. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG=apreadycommand for details. NOTE AT+QCFG=apreadycommandis under development. 3.5.1.2. USB Application with USB Remote Wakeup Function the host supports USB suspend/resume and If threepreconditionsmust be mettolet the module enter into sleep mode. Execute AT+QSCLK=1command to enable sleep mode. Ensure the DTR is held in high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspended remote wakeup functions, following the state. EC21_Hardware_Design Confidential / Released 29 / 94 LTE Module Series EC21 Hardware Design The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application withUSB Remote Wakeup Sending data to EC21through USB will wake up the module. When EC21has URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are threepreconditions to let the module enter into the sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held in high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspended state. EC21_Hardware_Design Confidential / Released 30 / 94 LTE Module Series EC21 Hardware Design The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with RI Sending data to EC21through USB will wake up the module. When EC21has URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, you should disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1command to enable sleep mode. Ensure the DTR is held in high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function EC21_Hardware_Design Confidential / Released 31 / 94 LTE Module Series EC21 Hardware Design Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and thehost.Refer to document [1] for more details about EC21 power management application. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. Hardware:
The W_DISABLE# pin is pulled up by default;driving it to low level will let the module enter into airplane mode. Software:
AT+CFUNcommand provides the choice of the functionality level. AT+CFUN=0: Minimum functionality mode;both USIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG=airplanecontrol command. This commandis under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC21 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for module RF part. Two VBAT_BB pins for module baseband part. The following table shows the details of VBAT pins and ground pins. EC21_Hardware_Design Confidential / Released 32 / 94 LTE Module Series EC21 Hardware Design Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57,58 VBAT_BB 59,60 8,9,19,22,36,46
, 48,50~54,56, 72, 85~112 GND Power supply for module RF part. Power supply for module baseband part. 3.3 3.3 3.8 3.8 4.3 4.3 Ground
-
0
-
V V V 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3Vto4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network.The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR should be used, and amulti-layer ceramic chip (MLCC) capacitorarray should also be used to provide the low ESR. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; andthe width of VBAT_RF trace should be no less than 2mm.In principle, the longerthe VBAT trace is, the wider it will be. Three ceramic capacitors (100nF, 33pF, 10pF) are recommended to be applied to the VBAT pins. These capacitors should be placed close to the VBAT pins. In addition, in order to get a stable power source, it is suggested that you should use a zener diode of which reverse zener voltage is 5.1V and dissipation power is more than 0.5W. The following figure shows the star structure of the power supply. EC21_Hardware_Design Confidential / Released 33 / 94 LTE Module Series EC21 Hardware Design Figure 8: Star Structure of the Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, asthe performance of the module largely depends on the power source. The power supply is capable of providing sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that you shoulduse an LDO to supply power for the module. If there is a big voltage difference between the input source and the desired output
(VBAT), a buck converter is preferred to be used as thepower supply. The following figure shows a reference design for +5V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3A. Figure 9: Reference Circuit of Power Supply NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shutdown by PWRKEY or AT command, the power supply can be cut off. EC21_Hardware_Design Confidential / Released 34 / 94 LTE Module Series EC21 Hardware Design 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Turn on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: PWRKEY Pin Description Pin Name Pin No. Description DC Characteristics Comment PWRKEY 21 Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC21 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 100ms. It is recommended to use an open drain/collector driver to control the PWRKEY.After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 10: Turn on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shownin the following figure. EC21_Hardware_Design Confidential / Released 35 / 94 LTE Module Series EC21 Hardware Design Figure 11: Turn on the Module Using Keystroke The turn on scenario is illustrated in the following figure. Figure 12: Timing of Turning on Module NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. EC21_Hardware_Design Confidential / Released 36 / 94 LTE Module Series EC21 Hardware Design 3.7.2. Turn off Module The following procedures can be used to turn off the module:
Normal power down procedure: Turn off the module using the PWRKEY pin. Normal power down procedure: Turn off the module using AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltagefor at least 650ms, the module will execute power-down procedure after the PWRKEY is released. The power-down scenario is illustrated inthe following figure. Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWDcommandto turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer todocument [2] for details about AT+QPOWD command. NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shutdown by PWRKEY or AT command, the power supply can be cut off. EC21_Hardware_Design Confidential / Released 37 / 94 LTE Module Series EC21 Hardware Design 3.8. Reset the Module The RESET_N pin can be used to reset the module.The module can be reset by driving RESET_N to a low level voltage for time between 150ms and 460ms. Table 8: RESET_N Pin Description Pin Name Pin No. Description DC Characteristics Comment RESET_N 20 Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N TBD Reset pulse 4.7K 47K Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using Button EC21_Hardware_Design Confidential / Released 38 / 94 LTE Module Series EC21 Hardware Design The reset scenario is illustrated inthe following figure. Figure 16: Timing of Resetting Module NOTES 1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. USIM Card Interface The USIM card interface circuitrymeets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.0V USIM cards are supported. Table 9: Pin Definition of the USIM Card Interface Pin Name Pin No. I/O Description Comment USIM_VDD USIM_DATA USIM_CLK USIM_RST USIM_ PRESENCE USIM_GND 14 15 16 17 13 10 PO Power supply for USIM card IO DO DO Data signal of USIM card Clock signal of USIM card Reset signal of USIM card DI USIM card insertion detection Specified ground for USIM card Either 1.8V or 3.0V is supported by the module automatically. EC21_Hardware_Design Confidential / Released 39 / 94 LTE Module Series EC21 Hardware Design EC21 supports USIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] about AT+QSIMDET command for details. The following figure shows a reference design for USIM card interface with an 8-pin USIM card connector. Figure 17: Reference Circuit of USIM Card Interface with an 8-Pin USIM Card Connector If USIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference circuit for USIM card interface with a 6-pin USIM card connector is illustrated inthe following figure. Figure 18: Reference Circuit of USIM Card Interface with a6-Pin USIM Card Connector EC21_Hardware_Design Confidential / Released 40 / 94 LTE Module Series EC21 Hardware Design In order to enhance the reliability and availability of the USIM card in your application, please follow the criteria below in USIM circuit design:
Keep layout of USIM card as close to the module as possible. Keep the trace length as less than 200mm as possible. Keep USIM card signals away from RF and VBAT traces. Assure the ground between the module and the USIM card connectorshort and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away fromeach other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVSdiode array whose parasitic capacitance should not be more than 50pF. The 22ohmresistors should be added in series between the module and the USIM card so as to suppress EMI spurious transmission and enhance ESD protection. The 33pFcapacitors are used for filtering interference of GSM900.Please note that the USIM peripheral circuit should be close to the USIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion areapplied, and should be placed close to the USIM card connector. 3.10. USB Interface EC21 contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps)modes. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 10: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB Signal Part USB_DP USB_DM 69 70 USB_VBUS 71 GND 72 IO IO PI USB differential data bus (positive) USB differential data bus (minus) Require differential impedance of 90 Require differential impedance of 90 Used for detecting the USB connection Typical 5.0V Ground For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. EC21_Hardware_Design Confidential / Released 41 / 94 LTE Module Series EC21 Hardware Design The USB interface is recommended to be reserved for firmware upgrade in your design. The following figure shows areference circuit of USB interface. Figure 19: Reference Circuit of USB Application In order to ensurethe integrity of USB data line signal, components R1, R2, R3 and R4 must be placed close to the module, and alsothese resistors should be placed close to each other. The extra stubs of trace must be as short as possible. In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply with the following principles:
It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90ohm. Do not route signal traces under crystals, oscillators, magnetic devicesorRF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding onnot only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. NOTES
* means under development. 1. EC21 module can only be used as a slave device. 2. EC21_Hardware_Design Confidential / Released 42 / 94 LTE Module Series EC21 Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The 9600,19200,38400, 57600,115200,230400,460800,921600and 3000000bps baud rates, and the default is 115200bps. The interface is used for data transmission and AT command communication. supports interface UART 4800, main The debug UART interface supports 115200bpsbaud rate. It is used forLinux console and log output. The following tables show the pin definition of the main UART interface. Table 11: Pin Definition of the Main UART Interface Pin Name Pin No. RI DCD CTS RTS DTR TXD RXD 62 63 64 65 66 67 68 I/O DO DO DO DI DI DO DI Comment Description Ring indicator Data carrier detection Clear to send Request to send 1.8V power domain Sleep mode control Transmit data Receive data Table 12: Pin Definition of the Debug UART Interface Pin Name Pin No. DBG_TXD DBG_RXD 12 11 I/O DO DI Description Transmit data Receive data The logic levels are described in the following table. Comment 1.8V power domain EC21_Hardware_Design Confidential / Released 43 / 94 LTE Module Series EC21 Hardware Design Table 13:Logic Levels of Digital I/O Parameter VIL VIH VOL VOH Min.
-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides 1.8V UART interface. A level translator should be used if your application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrumentis recommended. The following figure shows areference design. Figure 20: Reference Circuit with Translator Chip Please visithttp://www.ti.comfor more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module input and output circuit designs; but please pay attention to the direction of connection. EC21_Hardware_Design Confidential / Released 44 / 94 LTE Module Series EC21 Hardware Design Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EC21 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes:
Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long framesynchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge.The PCM_SYNC this mode, PCM_CLK supports 128,256,512,1024 and2048kHz for different speech codecs. In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the rising edge.But the PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 128kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only. EC21 supports 8-bit A-law* and-law*, and also 16-bit linear data formats. The following figures show theprimary modes timing relationship with 8kHz PCM_SYNC and 2048kHz PCM_CLK, as well asthe auxiliary modes timing relationship with 8kHz PCM_SYNC and 128kHz PCM_CLK. falling edge represents the MSB. In EC21_Hardware_Design Confidential / Released 45 / 94 LTE Module Series EC21 Hardware Design Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN PCM_OUT PCM_SYNC 24 25 26 DI DO IO PCM data input PCM data output 1.8V power domain 1.8V power domain PCM data frame sync signal 1.8V power domain EC21_Hardware_Design Confidential / Released 46 / 94 LTE Module Series EC21 Hardware Design PCM_CLK I2C_SCL I2C_SDA 27 41 42 IO OD OD PCM data bit clock 1.8V power domain I2C serial clock I2C serial data Require external pull-up to 1.8V Require external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHzPCM_CLK and 8kHz PCM_SYNC.Please refer to document [2] about AT+QDAIcommand for details. The following figure shows areference design of PCM interface with external codec IC. Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. 2.
* means under development. It is recommended to reserve RC (R=22ohm, C=22pF) circuit on the PCM lines, especially for PCM_CLK. 3. EC21 works as a master device pertaining to I2C interface. EC21_Hardware_Design Confidential / Released 47 / 94 LTE Module Series EC21 Hardware Design 3.13. ADC Function The module provides two analog-to-digital converters (ADC).AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer todocument [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 15: Pin Definition of the ADC Pin Name Pin No. Description ADC0 ADC1 45 44 General purpose analog to digital converter General purpose analog to digital converter The following table describes the characteristic of the ADC function. Table 16: Characteristic of the ADC Parameter ADC0 Voltage Range ADC1 Voltage Range ADC Resolution NOTES Min. 0.3 0.3 Typ. Max. VBAT_BB VBAT_BB 15 Unit V V bits 1. ADC input voltage must not exceed VBAT_BB. 2. It is prohibited to supply any voltage to ADC pins when VBAT is removed. 3. It is recommended to use resistor divider circuit for ADC application. EC21_Hardware_Design Confidential / Released 48 / 94 LTE Module Series EC21 Hardware Design 3.14. Network Status Indication The network indication pins can be used to drive network status indicationLEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe thepin definition and logic level changes in different network status. Table 17: Pin Definition of Network ConnectionStatus/Activity Indicator Pin Name Pin No. I/O Description Comment DO DO Indicate the modules network registrationstatus Indicate the modules network activity status 1.8V power domain NET_MODE1) 5 NET_STATUS 6 NOTE 1) means that this pin cannot be pulled up before startup. Table 18: Working State of Network Connection Status/Activity Indicator Pin Name Logic Level Changes Network Status NET_MODE Always High Always Low Registered on LTE network Others NET_STATUS Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. EC21_Hardware_Design Confidential / Released 49 / 94 LTE Module Series EC21 Hardware Design Figure 25: Reference Circuit of the Network Indicator 3.15. STATUS The STATUS pin is an open drain output for indicating the modules operation status. You can connect it to a GPIO of DTE with a pull up resistor, or as the LED indication circuit shown below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 19: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status Require external pull-up The following figure shows different circuit designs of STATUS, and you can choose either one according to your application demands. Figure 26: Reference Circuits of STATUS EC21_Hardware_Design Confidential / Released 50 / 94 LTE Module Series EC21 Hardware Design 3.16. Behavior of the RI AT+QCFG=risignaltype,physical command can be usedto configure RI behavior. No matter on which port URC is presented, URC will trigger the behavior of RI pin. NOTE URC can be output from UART port, USB AT port and USB modem port by AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below. Table 20: Behavior of the RI State Idle URC Response RI keeps in high level RI outputs 120ms low pulse when new URC returns The RI behavior can be changed by AT+QCFG=urc/ri/ringcommand.Please refer to document [2] for details. IEEE802.3 compliance 3.17. SGMII Interface EC21 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces, key features of the SGMII interface are shown below:
Full duplex at 1000Mbps Half/full duplex for 10/100Mbps Support VLAN tagging Support IEEE1588 and Precision Time Protocol (PTP) Can be used to connect to external Ethernet PHY like AR8033, or to an external switch Management interfaces support dual voltage 1.8V/2.85V The following table shows the pin definition of SGMII interface. EC21_Hardware_Design Confidential / Released 51 / 94 LTE Module Series EC21 Hardware Design Table 21: Pin Definition of the SGMII Interface Pin Name Pin No. I/O Description Comment Control Signal Part EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 SGMII_MDATA 121 DI IO SGMII_MCLK 122 DO Ethernet PHY interrupt SGMII MDIO (Management Data Input/Output) data SGMII MDIO (Management Data Input/Output) clock USIM2_VDD 128 PO SGMII MDIO pull-up power source SGMII Signal Part SGMII_TX_M 123 AO SGMII transmission-minus SGMII_TX_P 124 AO SGMII transmission-plus SGMII_RX_P 125 SGMII_RX_M 126 AI AI SGMII receiving-plus SGMII receiving-minus 1.8V power domain 1.8V/2.85V power domain 1.8V/2.85V power domain Configurable power source. 1.8V/2.85V power domain. External pull-up power source for SGMII MDIO pins. Connect with a 0.1uF capacitor, close to the PHY side. Connect with a 0.1uF capacitor, close to the PHY side. Connect with a 0.1uF capacitor, close to EC21 module. Connect with a 0.1uF capacitor, close to EC21 module. The following figure shows the simplified block diagram for Ethernet application. SGMII Module AR8033 MDI Ethernet Transformer RJ45 Control Figure 27: Simplified Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application. EC21_Hardware_Design Confidential / Released 52 / 94 LTE Module Series EC21 Hardware Design Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in your application, please follow the criteria below in the Ethernet PHY circuit design:
Keep SGMII data and control signals away from RF and VBAT trace. Keep the maximum trace length less than 10inch and keep skew on the differential pairs less than 20mil. The differential impedance of SGMII data trace is 100ohm10%. To minimize crosstalk, the distance between separate adjacent pairs that are on the same layer must be equal to or larger than 40mil. NOTE For more information about SGMII application, please refer to document [5]and document[7]. EC21_Hardware_Design Confidential / Released 53 / 94 LTE Module Series EC21 Hardware Design 3.18. Wireless Connectivity Interfaces EC21supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT. The following table shows the pin definition of wireless connectivity interfaces. Table 22: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment WLAN Part SDC1_DATA3 SDC1_DATA2 SDC1_DATA1 SDC1_DATA0 SDC1_CLK SDC1_CMD WLAN_EN 129 130 131 132 133 134 136 IO IO IO IO DO IO DO SDIO data bus D3 1.8V power domain SDIO data bus D2 1.8V power domain SDIO data bus D1 1.8V power domain SDIO data bus D0 1.8V power domain SDIO clock 1.8V power domain SDIO command 1.8V power domain WLAN function control via FC20 module. Active high. 1.8V power domain Coexistence and Control Part PM_ENABLE WAKE_ON_ WIRELESS 127 135 COEX_UART_RX 137 DO External power control 1.8V power domain DI DI Wake up the host (EC21 module) by FC20 module. 1.8V power domain LTE/WLAN&BT coexistence signal 1.8V power domain COEX_UART_TX 138 DO LTE/WLAN&BT coexistence signal 1.8V power domain WLAN_SLP_CLK 118 DO WLAN sleep clock BT Part*
BT_RTS*
BT_TXD*
BT_RXD*
37 38 39 DI BT UART request to send 1.8V power domain DO BT UART transmit data 1.8V power domain DI BT UART receive data 1.8V power domain EC21_Hardware_Design Confidential / Released 54 / 94 LTE Module Series EC21 Hardware Design BT_CTS*
PCM_IN1) PCM_OUT1) PCM_SYNC1) PCM_CLK1) 40 24 25 26 27 BT_EN*
139 DO NOTES DO BT UART clear to send 1.8V power domain DI PCM data input DO PCM data output 1.8V power domain 1.8V power domain IO IO PCM data frame sync signal 1.8V power domain PCM data bit clock 1.8V power domain WLAN function control via FC20 module. Active high. 1.8V power domain 1. * means under development. 2. 1) Pads 24~27 are multiplexing pins used for audio design on EC21 module and BT function on FC20 module. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module. Figure 29: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module EC21_Hardware_Design Confidential / Released 55 / 94 LTE Module Series EC21 Hardware Design NOTES 1. FC20 module can only be used as a slave device, 2. When BT function is enabled on EC21 module, PCM_SYNC and PCM_CLK pins are only used to output signals. 3. For more information about wireless connectivity interfaces, please refer to document [5]. 3.18.1. WLAN Interface EC21 provides a low power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports the following modes:
Single data rate (SDR) mode (up to 200MHz) Double data rate (DDR) mode (up to 52MHz) As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:
It is important to route the SDIO signal traces with total grounding. The impedance of SDIOsignal trace is 50ohm (10%). Protect other sensitive signals/circuits (RF, analog signals, etc.) from SDIO corruption and protect SDIO signals from noisy signals (clocks, DCDCs, etc.). It is recommended to keep matching lengthbetween CLK and DATA/CMD less than 1mm and total routing length less than 50mm. Keep termination resistors within 15~24ohm on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5mm. Make sure the adjacent trace spacing is 2x line width and bus capacitance is less than 15pF. 3.18.2. BT Interface*
EC21 supports a dedicated UART interface and a PCM interface for BTfunction application. Further information about BT interface will be added in future version of this document. NOTE
* means under development. EC21_Hardware_Design Confidential / Released 56 / 94 LTE Module Series EC21 Hardware Design 3.19. USB_BOOT Interface EC21 provides a USB_BOOT pin. During development or factory production, USB_BOOT pin can force the module to boot from USB port for firmware upgrade. Table 23: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Force the module to boot from USB port 1.8V power domain. Active high. If unused, keep it open. The following figure shows a reference circuit of USB_BOOT interface. Figure 30: Reference Circuit of USB_BOOT Interface EC21_Hardware_Design Confidential / Released 57 / 94 LTE Module Series EC21 Hardware Design 4 GNSS Receiver 4.1. General Description EC21 includes a fully integrated global navigation satellite system solution that supports Gen8C-Liteof Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC21 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update ratevia USB interface by default. By default, EC21 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of EC21. Table 24: GNSS Performance Parameter Description Cold start Conditions Autonomous Sensitivity
(GNSS) TTFF
(GNSS) Reacquisition Autonomous Tracking Cold start
@open sky Warm start
@open sky Autonomous Autonomous XTRA enabled Autonomous XTRA enabled Typ.
-146
-157
-157 35 18 26 2.2 Unit dBm dBm dBm s s s s EC21_Hardware_Design Confidential / Released 58 / 94 LTE Module Series EC21 Hardware Design Hot start
@open sky CEP-50 Autonomous XTRA enabled Autonomous
@open sky 2.5 1.8
<1.5 s s m Accuracy
(GNSS) NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in your design. Maximize the distance among GNSS antenna, main antenna and the Rx-diversity antenna. Digital circuits such as USIM card, USB interface, camera module, display connector and SD card should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep 50ohm characteristic impedance forthe ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna consideration. EC21_Hardware_Design Confidential / Released 59 / 94 LTE Module Series EC21 Hardware Design 5 Antenna Interfaces EC21 antenna interfaces include a main antennainterface,anRx-diversity antenna interface which is used toresist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna interfaceshave an impedance of 50ohm. 5.1. Main/Rx-diversityAntenna Interface 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversityantenna interfacesis shown below. Table 25: Pin Definition of the RF Antenna Pin Name Pin No. ANT_MAIN ANT_DIV 49 35 I/O IO AI 5.1.2. Operating Frequency Table 26: Module Operating Frequencies 3GPP Band B1 B2 (1900) B3 (1800) B4 B5 (850) B7 B8 (900) Transmit 1920~1980 1850~1910 1710~1785 1710~1755 824~849 2500~2570 880~915 Description Comment Main antenna pad 50ohmimpedance Receive diversityantenna pad 50ohm impedance Receive 2110~2170 1930~1990 1805~1880 2110~2155 869~894 2620~2690 925~960 Unit MHz MHz MHz MHz MHz MHz MHz EC21_Hardware_Design Confidential / Released 60 / 94 LTE Module Series EC21 Hardware Design 699~716 777~787 815~830 830~845 832~862 814~849 703~748 729~746 746~756 860~875 875~890 791~821 859~894 758~803 2300~2400 2300~2400 MHz MHz MHz MHz MHz MHz MHz MHz B12 B13 B18 B19 B20 B26 B28 B40 5.1.3. Reference Design of RF Antenna Interface Areference design of ANT_MAIN and ANT_DIVantenna pads is shown as below. It should reserve a
-type matching circuit for better RF performance. The capacitors are not mounted by default. Figure 31: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabledby default. 3. Place the -type matching components (R1, C1, C2, R2, C3, C4) as close to the antenna as possible. EC21_Hardware_Design Confidential / Released 61 / 94 LTE Module Series EC21 Hardware Design 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50 ohm. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the distance between signal layer and reference ground (H), and the clearance between RF trace and ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control. The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures
. Figure 32: Microstrip Line Design on a 2-layer PCB Figure 33: Coplanar Waveguide Line Design on a 2-layer PCB EC21_Hardware_Design Confidential / Released 62 / 94 LTE Module Series EC21 Hardware Design Figure 34: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:
Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50ohm. The GND pins adjacent to RF pins should not be hot welded, and should be fully connected to ground. The distance between the RF pinsand the RFconnector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground viasaround RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [6]. EC21_Hardware_Design Confidential / Released 63 / 94 LTE Module Series EC21 Hardware Design 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 27: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50ohmimpedance Table 28: GNSS Frequency Type Frequency GPS/Galileo/QZSS 1575.421.023 GLONASS BeiDou 1597.5~1605.8 1561.0982.046 A reference design of GNSS antenna is shown as below. Unit MHz MHz MHz Figure 36: Reference Circuit of GNSS Antenna NOTES 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. EC21_Hardware_Design Confidential / Released 64 / 94 LTE Module Series EC21 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 29: Antenna Requirements Type Requirements Frequency range: 1561~1615MHz Polarization: RHCP or linear VSWR: <2 (Typ.) Passive antenna gain: >0dBi Active antenna noise figure: <1.5dB Active antenna gain: >-2dBi Active antenna embedded LNA gain: 20dB (Typ.) Active antenna total gain: >18dBi (Typ.) VSWR: 2 Gain (dBi): 1 Max input power (W): 50 Input Impedance (ohm): 50 Polarization type: Vertical Cable insertion loss: <1dB
(GSM900, WCDMA B5/B8, LTE B5/B8/B12/B13/B18/B19/B20/B26/B28) Cable insertion loss: <1.5dB
(GSM1800, WCDMA B1/B2/B4,LTE B1/B2/B3/B4) Cable insertion loss <2dB
(LTE B7/B40) GNSS GSM/WCDMA/LTE EC21_Hardware_Design Confidential / Released 65 / 94 LTE Module Series EC21 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use UF.L-R-SMT connector provided by HIROSE. Figure 37: Dimensions of the UF.L-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the UF.L-R-SMT. Figure 38:Mechanicalsof UF.L-LP Connectors EC21_Hardware_Design Confidential / Released 66 / 94 LTE Module Series EC21 Hardware Design The following figure describes the space factor of mated connector. Figure39:Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC21_Hardware_Design Confidential / Released 67 / 94 LTE Module Series EC21 Hardware Design 6 Electrical, Reliability and RadioCharacteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 30: Absolute Maximum Ratings Max. Unit 4.7 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Voltage at ADC0 Voltage at ADC1 Min.
-0.3
-0.3 0 0
-0.3 0 0 6.2. Power Supply Ratings Table 31: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and Voltage must stay within the 3.3 3.8 4.3 V EC21_Hardware_Design Confidential / Released 68 / 94 LTE Module Series EC21 Hardware Design IVBAT VBAT_RF Voltage drop during burst transmission Peak supply current
(during transmissionslot) min/max values, including voltage drop, ripple and spikes. Maximum power control level on GSM900 Maximum power control level on GSM900 400 mV 1.8 2.0 A V USB_VBUS USB detection 3.0 5.0 5.25 6.3. Operating Temperature The operating temperature is listed in the following table. Table 32: Operating Temperature Parameter OperationTemperature Range1) ExtendedTemperature Range2) Min.
-35
-40 NOTES Typ.
+25 Max.
+75
+85 Unit C C 1. 2. 1)Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. EC21_Hardware_Design Confidential / Released 69 / 94 LTE Module Series EC21 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 33: EC21-A Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) Idle state
(GNSS OFF) IVBAT WCDMA datatransfer(GNSS OFF) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDDPF=64 (USB disconnected) LTE-FDDPF=64 (USB connected) WCDMA B2 HSDPA @22.09dBm WCDMA B2 HSUPA @22.28dBm WCDMA B4 HSDPA @21.94dBm WCDMA B4 HSUPA @21.81dBm WCDMA B5 HSDPA @22.13dBm WCDMA B5 HSUPA @22.48dBm LTE datatransfer(GNSS OFF) LTE-FDD B2 @22.79dBm LTE-FDD B4 @22.89dBm LTE-FDD B12 @23.39dBm WCDMA voice call WCDMA B2 @23.67dBm 20 1.0 2.8 2.3 2.2 2.2 21.6 31.6 23.7 36.5 542.0 681.0 550.0 547.0 429.0 459.0 709.0 710.0 679.0 663.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design Confidential / Released 70 / 94 LTE Module Series EC21 Hardware Design WCDMA B4 @23.36dBm WCDMA B5 @23.64dBm 594.0 522.0 mA mA Table 34: EC21-AUT Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDDPF=64 (USB disconnected) LTE-FDDPF=64 (USB connected) WCDMA B1 HSDPA@22.59dBm WCDMA B1 HSUPA@22.29dBm WCDMA B5 HSDPA@22.22dBm WCDMA B5 HSUPA@21.64dBm Idle state WCDMA data
(GNSS OFF) LTE datatransfer(GNSS OFF) WCDMA voice call LTE-FDD B1 @23.38dBm LTE-FDD B3 @22.87dBm LTE-FDD B5 @23.12dBm LTE-FDD B7 @22.96dBm LTE-FDD B28 @23.31dBm WCDMA B1 @24.21dBm WCDMA B5 @23.18dBm 20 0.99 2.1 1.7 2.9 2.4 22.0 32.0 23.6 33.6 589.0 623.0 511.0 503.0 813.0 840.0 613.0 761.0 650.0 687.0 535.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA IVBAT EC21_Hardware_Design Confidential / Released 71 / 94 LTE Module Series EC21 Hardware Design Table 35: EC21-E Current Consumption Parameter Description OFF state Conditions Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) FDD-LTE PF=64 (USB disconnected) FDD-LTE PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state
(GNSS OFF) IVBAT GPRS datatransfer(GNSS OFF) EDGE datatransfer(GNSS OFF) GSM900 4DL/1UL @32.3dBm GSM900 3DL/2UL @32.18dBm GSM900 2DL/3UL @30.3dBm GSM900 1DL/4UL @29.4dBm DCS1800 4DL/1UL @29.6dBm DCS1800 3DL/2UL @29.1dBm DCS1800 2DL/3UL @28.8dBm DCS1800 1DL/4UL @29.1dBm GSM900 4DL/1UL @26dBm GSM900 3DL/2UL @26dBm GSM900 2DL/3UL @25dBm GSM900 1DL/4UL @25dBm DCS1800 4DL/1UL @26dBm DCS1800 3DL/2UL @25dBm DCS1800 2DL/3UL @25dBm Typ. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 220 387 467 555 185 305 431 540 148 245 338 432 150 243 337 Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design Confidential / Released 72 / 94 LTE Module Series EC21 Hardware Design DCS1800 1DL/4UL @25dBm WCDMA B1 HSDPA@22.5dBm WCDMA B1 HSUPA@21.11dBm WCDMA datatransfer(GNSS OFF) WCDMA B5 HSDPA@23.5dBm WCDMA B5 HSUPA@21.4dBm WCDMA B8 HSDPA@22.41dBm WCDMA B8 HSUPA@21.2dBm LTE-FDD B1 @23.45dBm LTE-FDD B3 @23.4dBm LTE-FDD B5 @23.4dBm LTE-FDD B7 @23.86dBm LTE-FDD B8 @23.5dBm LTE-FDD B20 @23.57dBm GSM900 PCL=5 @32.8dBm PCS1800 PCL=0 @29.3dBm WCDMA B1 @23.69dBm LTE datatransfer(GNSS OFF) GSMvoice call WCDMAvoice call WCDMA B5 @23.61dBm WCDMA B8 @23.35dBm Table 36: EC21-KL Current Consumption Parameter Description OFF state Conditions Power down IVBAT AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) Idle state
(GNSS OFF) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) EC21_Hardware_Design Confidential / Released 73 / 94 430 659 545 767 537 543 445 807 825 786 887 675 770 336 291 683 741 564 Typ. 20 0.98 2.5 2.4 23.0 34.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit uA mA mA mA mA mA LTE Module Series EC21 Hardware Design LTE datatransfer(GNSS OFF) LTE-FDD B1 @23.65dBm LTE-FDD B3 @23.2dBm LTE-FDD B5 @23.2dBm LTE-FDD B7 @23.7dBm LTE-FDD B8 @23.1dBm Table 37: EC21-V Current Consumption Parameter Description OFF state Conditions Power down AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) Idle state
(GNSS OFF) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE datatransfer(GNSS OFF) LTE-FDD B4 @22.79dBm LTE-FDD B13 @23.26dBm IVBAT Table 38: EC21-AUV Current Consumption Parameter Description OFF state Conditions Power down IVBAT AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) Idle state
(GNSS OFF) EC21_Hardware_Design Confidential / Released 74 / 94 765.0 825.0 598.0 762.0 569.0 mA mA mA mA mA Typ. Unit 20 1.0 2.5 2.0 22.0 32.0 752.0 534.0 uA mA mA mA mA mA mA mA Typ. Unit 20 1.0 2.0 1.6 2.4 1.9 24.0 34.0 uA mA mA mA mA mA mA mA LTE Module Series EC21 Hardware Design LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B1 HSDPA@22.05dBm WCDMA B1 HSUPA@22.29dBm WCDMA datatransfer(GNSS OFF) WCDMA B5 HSDPA@22.43dBm WCDMA B5 HSUPA@22.43dBm LTE datatransfer(GNSS OFF) WCDMA B8 HSDPA@22.44dBm WCDMA B8 HSUPA@21.78dBm LTE-FDD B1 @23.12dBm LTE-FDD B3 @23.04dBm LTE-FDD B5 @23.16dBm LTE-FDD B8 @23.21dBm LTE-FDD B28 @23.57dBm WCDMA B1 @22.72dBm WCDMA voice call WCDMA B5 @23.19dBm WCDMA B8 @23.27dBm 24.0 34.0 586.0 630.0 576.0 600.0 577.0 555.0 721.0 734.0 669.0 698.0 790.0 640.0 638.0 626.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 39: GNSS Current Consumption of EC21 Series Module Parameter Description Conditions Typ. Unit Searching
(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna Tracking
(AT+CFUN=0) Instrument Environment OpenSky @Passive Antenna OpenSky @Active Antenna 58 58 33 35 43 mA mA mA mA mA IVBAT
(GNSS) EC21_Hardware_Design Confidential / Released 75 / 94 LTE Module Series EC21 Hardware Design 6.5. RF Output Power The following table shows the RF output power of EC21 module. Table 40: RF Output Power Frequency GSM900 DCS1800 DCS1800 WCDMA bands LTE-FDD bands LTE-TDD bands NOTE Max. 33dBm2dB 30dBm2dB 26dBm3dB 22.5dBm+1/-3dB 22.5dBm+1/-3dB 22.5dBm+1/-3dB Min. 5dBm5dB 0dBm5dB 0dBm5dB
<-50dBm
<-44dBm
<-44dBm In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. Thedesign conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC21 series module. Table 41: EC21-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM900 DCS1800
-109.0dBm
-109.0dBm WCDMA Band1
-110.5dBm WCDMA Band5
-110.5dBm WCDMA Band8
-110.5dBm
/
/
/
/
/
/
/
/
/
/
-102.0dBm
-102.0dbm
-106.7dBm
-104.7dBm
-103.7dBm EC21_Hardware_Design Confidential / Released 76 / 94 LTE Module Series EC21 Hardware Design LTE-FDD B1(10M)
-98.0dBm LTE-FDD B3(10M)
-96.5dBm LTE-FDD B5(10M)
-98.0dBm LTE-FDD B7(10M)
-97.0dBm LTE-FDD B8(10M)
-97.0dBm LTE-FDD B20(10M)
-97.5dBm
-98.0dBm
-98.5dBm
-98.5dBm
-94.5dBm
-97.0dBm
-99.0dBm
-101.5dBm
-96.3dBm
-101.5dBm
-93.3dBm
-101.0dBm
-94.3dBm
-99.5dBm
-94.3dBm
-101.0dBm
-93.3dBm
-102.5dBm
-93.3dBm Table 42: EC21-A Conducted RF Receiving Sensitivity Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary Diversity SIMO 3GPP (SIMO)
-110.0dBm
-110.0dBm
-110.5dBm
/
/
/
/
/
/
-104.7dBm
-106.7dBm
-104.7dBm LTE-FDD B2 (10M)
-98.0dBm LTE-FDD B4 (10M)
-97.5dBm LTE-FDD B12 (10M)
-96.5dBm
-98.0dBm
-99.0dBm
-98.0dBm
-101.0dBm
-94.3dBm
-101.0dBm
-96.3dBm
-101.0dBm
-93.3dBm Table 43: EC21-V Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) LTE-FDD B4 (10M)
-97.5dBm
-99.0dBm
-101.0dBm
-96.3dBm LTE-FDD B13 (10M)
-95.0dBm
-97.0dBm
-100.0dBm
-93.3dBm Table 44: EC21-AUT Conducted RF Receiving Sensitivity Frequency WCDMA B1 WCDMA B5 Primary Diversity SIMO 3GPP (SIMO)
-110.0dBm
-110.5dBm
/
/
/
/
-106.7dBm
-104.7dBm EC21_Hardware_Design Confidential / Released 77 / 94 LTE Module Series EC21 Hardware Design LTE-FDD B1(10M)
-98.5dBm
-98.0dBm
-101.0dBm
-96.3dBm LTE-FDD B3(10M)
-98.0dBm LTE-FDD B5(10M)
-98.0dBm
-96.0dBm
-99.0dBm
-100.0dBm
-93.3dBm
-102.5dBm
-94.3dBm LTE-FDD B7(10M)
-97.0dBm
-95.0dBm
-98.5dBm
-94.3dBm LTE-FDD B28(10M)
-97.0dBm
-99.0dBm
-102.0dBm
-94.8dBm Table 45: EC21-AUTL Conducted RF Receiving Sensitivity Frequency Primary LTE-FDD B3(10M)
-98.0dBm LTE-FDD B7(10M)
-97.0dBm Diversity
-96.0dBm
-95.0dBm SIMO 3GPP (SIMO)
-100.0dBm
-93.3dBm
-98.5dBm
-94.3dBm LTE-FDD B28(10M)
-97.0dBm
-99.0dBm
-102.0dBm
-94.8dBm Table 46: EC21-KL Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) LTE-FDD B1(10M)
-98.0dBm
-99.5dBm
-100.5dBm
-96.3dBm LTE-FDD B3(10M)
-97.0dBm LTE-FDD B5(10M)
-98.0dBm
-97.5dBm
-99.5dBm
-99.5dBm
-93.3dBm
-100.5dBm
-94.3dBm LTE-FDD B7(10M)
-96.0dBm
-96.0dBm
-98.5dBm
-94.3dBm LTE-FDD B8(10M)
-97.0dBm
-99.0dBm
-101.0dBm
-93.3dBm Table 47: EC21-CT Conducted RF Receiving Sensitivity Frequency Primary LTE-FDD B1(10M)
-98.0dBm LTE-FDD B3(10M)
-97.0dBm Diversity
-99.5dBm
-97.5dBm SIMO 3GPP (SIMO)
-100.5dBm
-96.3dBm
-99.5dBm
-93.3dBm LTE-FDD B5* (10M) TBD TBD TBD TBD EC21_Hardware_Design Confidential / Released 78 / 94 LTE Module Series EC21 Hardware Design Table 48: EC21-J Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) LTE-FDD B1 (10M)
-97.5dBm
-98.7dBm
-100.2dBm
-96.3dBm LTE-FDD B3 (10M)
-96.5dBm
-97.1dBm
-100.5dBm
-93.3dBm LTE-FDD B8 (10M)
-98.4dBm LTE-FDD B18 (10M)
-99.5dBm
-99.0dBm
-99.0dBm
-101.2dBm
-93.3dBm
-101.7dBm
-96.3dBm LTE-FDD B19 (10M)
-99.2dBm
-99.0dBm
-101.4dBm
-96.3dBm LTE-FDD B26 (10M)
-99.5dBm
-99.0dBm
-101.5dBm
-93.8dBm Table 49: EC21-AUV Conducted RF Receiving Sensitivity Frequency WCDMA B1 WCDMA B5 WCDMA B8 Primary Diversity SIMO 3GPP (SIMO)
-110.0dBm
-111.0dBm
-111.0dBm
/
/
/
/
/
/
-106.7dBm
-104.7dBm
-103.7dBm LTE-FDD B1 (10M)
-97.2dBm
-97.2dBm
-100.2dBm
-96.3dBm LTE-FDD B3 (10M)
-98.2dBm LTE-FDD B5 (10M)
-99.2dBm
-98.7dBm
-98.7dBm
-100.7dBm
-93.3dBm
-101.7dBm
-94.3dBm LTE-FDD B8 (10M)
-97.7dBm
-97.2dBm
-101.2dBm
-93.3dBm LTE-FDD B28 (10M)
-97.0dBm
-98.2dBm
-101.2dBm
-94.8dBm NOTES 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance.
* means under development. 1. 2. EC21_Hardware_Design Confidential / Released 79 / 94 LTE Module Series EC21 Hardware Design 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatic discharge characteristics. Table 50: Electrostatic Discharge Characteristics Tested Points VBAT, GND All Antenna Interfaces Other Interfaces Contact Discharge Air Discharge 5 4 0.5 10 8 1 Unit kV kV kV EC21_Hardware_Design Confidential / Released 80 / 94 LTE Module Series EC21 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm. 7.1. Mechanical Dimensions of the Module
(32+/-0.15) 2.4+/-0.2
.
) 5 1 0
-
/
+
9 2
(
Figure40: Module Top and Side Dimensions 0.8 EC21_Hardware_Design Confidential / Released 81 / 94 LTE Module Series EC21 Hardware Design 1.90 1.8 2.15 2.49 1.9 5.96 0.82 4.88 1.6 6.75 1.7 4.4 2.4 3.45 32.0 3.35 1.15 1.05 3.2 3.4 3.2 3.4 3.2 1.30 3.85 1.30 5 3
. 2.0 2.0 3.0 1.8 2.8 1.10 1.10 8
. 4 0
. 9 2 0.8 5
. 3 1.5 Figure41: Module Bottom Dimensions (Bottom View) EC21_Hardware_Design Confidential / Released 82 / 94 LTE Module Series EC21 Hardware Design 7.2. Recommended Footprint 3.85 24.70 1.90 0 8
. 7 1.10 2.00 0 1
. 1 2.00 0 0
. 3 2.00 1.80 3.00 2.80 0.50 Keepout area 0.50
. 0 6 5 1 0.50 0.50 4.80 4.80 4.80 4.80 3.45 0 4
. 3 1.80 0 5 3
. 1.90 3.20 3.40 3.20 3.40 3.20 1.30 32.0 0 4
. 3 0.80 2.50 1.00 Figure42: Recommended Footprint (Top View) NOTES 1. The keepout area should not be designed. 2. For easy maintenance of the module, please keep about 3mm between the module and other components in thehost PCB. EC21_Hardware_Design Confidential / Released 83 / 94 EC LTE Mod C21 Hardw dule Series s ware Design n ign Effec ct Drawin ngsof th e Module e Figure43: T Top Viewof the Module e Fig gure 44: Bo ottom View of the Mod ule 7.3. Des NOTE esign effect t from Quect drawings of tel. Thesearede that you get f EC21 modu ule. For mor re accurate pictures, ple ease refer to o the module e dware_Desi ign EC21_Hard Confident tial / Releas sed 84 / 94 LTE Module Series EC21 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC21 is stored in a vacuum-sealed bag. The storage restrictionsareshown as below. 1. Shelf life in thevacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bagis opened, devices that will be subjected to reflow soldering or other high temperature processes must be:
Mounted within 72 hours at the factory environment of 30C/60%RH Stored at <10%RH 3. Devices require baking before mounting, if any circumstances below occurs:
When the ambient temperature is 23C5C and the humidity indicator card shows the humidity is>10% before opening the vacuum-sealed bag. If baking is required, devices may be baked for 48 hours at 125C5C. Device mounting cannot be finished within 72 hours at factory conditions of 30C/60%RH. 4. NOTE As the plastic packagecannot be subjected to high temperature, it should be removed from devices before high temperature (125C) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for bakingprocedure. EC21_Hardware_Design Confidential / Released 85 / 94 LTE Module Series EC21 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, thethickness of stencil for the module is recommended to be 0.18mm. For more details, please refer todocument [4]. It is suggested that the peak reflow temperature is from 235 to 245C (for SnAg3.0Cu0.5 alloy). The absolute maximum reflow temperature is 260C. To avoid damage to the module caused by repeated heating, it is suggested that the module should be mounted after reflow soldering for the other side of PCB has been completed. Recommended reflow soldering thermal profile is shown below:
Figure 45: Reflow Soldering Thermal Profile NOTE During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. EC21_Hardware_Design Confidential / Released 86 / 94 LTE Module Series EC21 Hardware Design 8.3. Packaging EC21 is packaged in tape andreel carriers. One reel is 11.53m longand contains 250pcs modules. The figure below shows the packagingdetails, measured in mm. 1
. 0 5 7 1
. 5 1
. 0 0 2
. 0 2 3
. 0 0 0 4 4
. 44.00 0.1 2.00 0.1 4.00 0.1 32.5 0.15 33.5 0.15 32.5 0.15 33.5 0.15 48.5 0 0 1 13 44.5+0.20
-0.00 1.50 0.1 0.35 0.05 5 1
. 0 3
. 9 2 5 1
. 0 3
. 0 3 5 1
. 0 3
. 0 3 4.2 0.15 3.1 0.15 Cover tape Direction of feed Figure 46: Tape and Reel Specifications EC21_Hardware_Design Confidential / Released 87 / 94 LTE Module Series EC21 Hardware Design 9 Appendix A References Table 51: Related Documents SN Document Name Remark
[1] Quectel_EC21_Power_Management_Application_Note EC21 Power Management Application Note
[2] Quectel_EC25&EC21_AT_Commands_Manual EC25 and EC21 AT Commands Manual
[3] Quectel_EC25&EC21_GNSS_AT_Commands_Manual EC25 and EC21GNSS AT Commands Manual
[4] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide
[5] Quectel_EC21_Reference_Design EC21 Reference Design
[6] Quectel_RF_Layout_Application_Note RF Layout Application Note
[7] Quectel_SGMII_Design_Application_Note SGMII Design Application Note Table 52: Terms and Abbreviations Abbreviation Description AMR bps CHAP CS CSD CTS Adaptive Multi-rate Bits Per Second Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data Clear To Send DC-HSPA+
DFOTA Dual-carrier High Speed Packet Access Delta Firmware Upgrade Over The Air EC21_Hardware_Design Confidential / Released 88 / 94 LTE Module Series EC21 Hardware Design DL DTR DTX EFR ESD FDD FR Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GLONASS GLObalnayaNAvigatsionnayaSputnikovayaSistema, the Russian Global Navigation Satellite System GMSK GNSS GPS GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO MO MS MT Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Mobile Terminated EC21_Hardware_Design Confidential / Released 89 / 94 LTE Module Series EC21 Hardware Design PAP PCB PDU PPP QAM QPSK RF RHCP Rx SGMII SIM SIMO SMS TDD Password Authentication Protocol Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Serial Gigabit Media IndependentInterface Subscriber Identification Module Single Input Multiple Output Short Message Service Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TX UL UMTS URC USIM Vmax Vnorm Vmin VIHmax Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value EC21_Hardware_Design Confidential / Released 90 / 94 LTE Module Series EC21 Hardware Design VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin VSWR WCDMA WLAN Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network EC21_Hardware_Design Confidential / Released 91 / 94 LTE Module Series EC21 Hardware Design 10 Appendix B GPRS Coding Schemes Table 53: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF CS-1 1/2 3 3 Radio Block excl.USF and BCS 181 BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16
-
456
-
21.4 EC21_Hardware_Design Confidential / Released 92 / 94 LTE Module Series EC21 Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 54: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 1 2 2 3 2 3 3 4 3 4 4 4 1 1 2 1 2 2 3 1 2 2 3 4 2 3 3 4 4 4 4 5 5 5 5 5 EC21_Hardware_Design Confidential / Released 93 / 94 EC LTE Mo C21 Hardw odule Sires s ware Design n App Cod 12 pendix ding S x D E Schem EDGE mes E Mod dulati onan nd Table 55: E EDGE Modu ulation and Coding Sch hemes Coding Sch heme Mod dulation Coding Family 1 1 Timeslot 2 Tim meslot 4 Timeslot GM SK GM SK GM SK GM SK GM SK GM SK GM SK GM SK 8-PS SK 8-PS SK 8-PS SK 8-PS SK 8-PS SK
/
/
/
/
C B A C B A B A A 9 9.05kbps 18.1k kbps 36.2kbps 13.4kbps 26.8k kbps 53.6kbps 15.6kbps 31.2k kbps 62.4kbps 2 21.4kbps 42.8k kbps 85.6kbps 8 8.80kbps 17.60 0kbps 35.20kbps 11.2kbps 22.4k kbps 44.8kbps 14.8kbps 29.6k kbps 59.2kbps 17.6kbps 35.2k kbps 70.4kbps 2 22.4kbps 44.8k kbps 89.6kbps 2 29.6kbps 59.2k kbps 118.4kbps 4 44.8kbps 89.6k kbps 179.2kbps 5 54.4kbps 108.8 8kbps 217.6kbps 5 59.2kbps 118.4 4kbps 236.8kbps EC21_Har rdware_Des sign Confide ential / Rele ased94 /94 CS-1:
CS-2:
CS-3:
CS-4:
MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9
| 1 | Label Location | ID Label/Location Info | 95.37 KiB |
Te a x)
| Mee LO Y Sows huh ATT bella 0 C mn Mmm 0 2 3 i QUEC EC21EFA-XXX-XXX EC 21-E ecoterarxxaxxuxx FA Q1-AXXXX-XXXXXX SN:
IMEI:86XXXXXXXXXXXXX FCC ID: XMR201708EC21E
| 1 | Confidentiality Request | Cover Letter(s) | 17.61 KiB |
Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2017-8-14_ Subject: Confidentiality Request for: _____ FCC ID: XMR201708EC21E ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*
Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual
*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR201708EC21E _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:
The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:
The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:
The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:
(Signature/Title2) Johnny Xiang
(Print name)
| 1 | Modular Approval Letter | Cover Letter(s) | 102.46 KiB |
Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:
Model:
The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 2.12 as below:
Quectel Wireless Solutions Company Limited XMR201708EC21E EC21-E Modular approval requirement EUT Condition
(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The radio elements of the modular transmitter have their own shielding. Comply YES
(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. The modular has buffered data inputs, it is integrated in chip EC21-E. Please see schematic.pdf YES YES Not Applicable All power lines derived from the host device are regulated before energizing other circuits internal to the EC21-E. Please see schematic.pdf A permanently attached antenna or unique antenna connector is not a requirement for licensed modules.
(c)The modular transmitter must have its ownpowersupplyregulation.
(d) The modular antenna must transmitter must the antenna and comply with transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. either
(e)The modular be transmitter must tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with line conducted requirements found in Section 15.207. AC or DC the AC YES The EC21-E was tested in a stand alone configuration via a PCMCIA extender. Please see conducted set up photo.pdf and spurious set up Quec ctel Wirel ess Solu utions Co ompany Limited powe to the will 15.27 lengt unkn there modu acce conn unmo Sect devic er lines and e module mu be marketed 7(a)). The le th typical of nown, at lea e is no cou ule essories, pe nected to the odified and ion 15.31(i) ce during tes output lines c data input/o ain ferrites, u ust not conta module (se d with the ese lines sh ength of the e or, if that f actual use meters to in ast 10 centi een the cas upling betwe equipme supporting ripherals, o or support e e module d uring testing cially availa d commerc
) must not be in side sting. connected nless they ee Section all be the length is nsure that se of the ent. Any equipment g shall be able
(see e another and
(f)The modular uipped with e must be cap FCC identific transmit either a perm pable of elec cation numbe st be tter mus xed label manently affix isplaying ctronically d er. equ or m its F
(g) The wit that the inst suc mus equ edo e modular tra h any specifi t ordinarily ap manufacture ructions alon hrequiremen st be include uipmentautho on theintende ansmitter mu ic rules or op pply to a com er must provi ng with the m nts. A copy o ed in the appl orizationrequ eduse/config st comply uirements perating requ mplete transm mitter and e ide adequate plain any module to exp of these instru uctions lication for uirements,wh urations. hicharebas modular trans any applicab nal configura smitter must ble RF expos ation. with its fin comply sure requirem ments in
(h)The m Dated By:
The label po clearly indic of the modu when it is in label must i Contains FC XMR20170 see the labe The EC21-E applicable F instructions User Manua osition of EC cated. If the F ule cannot be nstalled, then nclude the te CC ID:
08EC21E. Pl el.pdf E is complian FCC rules. D are given in al. C21-E is FCC ID e seen n the host ext:
lease nt with all Detail the YES Y YES Y The EC21-E comply with exposure re see the MP 20cm as the E is approved h the applicab equirement, p E evaluation e distance re d to ble RF please n with estriction. YES Y 2017/5 5/19 Sign nature Joh nny Xiang Pri rinted Quectel Wireless Solutions Company Limited Title: Project Manager On behalf of :
(Quectel Wireless Solutions Limited) Telephone:
+86-2150086326-800
| 1 | Power of Attorney Letter | Cover Letter(s) | 55.50 KiB |
Quectel Wireless Solutions Company Limited POWER OF ATTORNEY DATE: August 14, 2017 To:
Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.
/Hao jinhua on our behalf, to apply to FCC on our equipment for FCC ID:
XMR201708EC21E. Any and all acts carried out by TA Technology (Shanghai) Co., Ltd. / Hao jinhua on our behalf shall have the same effect as acts of our own. Sincerely, Signature:
Print name: Johnny Xiang Company: Quectel Wireless Solutions Company Limited
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2017-08-21 | 2510 ~ 2560 | TNB - Licensed Non-Broadcast Station Transmitter | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 | Effective |
2017-08-21
|
||||
| 1 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
| 1 | FCC Registration Number (FRN) |
0018988279
|
||||
| 1 | Physical Address |
Building 5, Shanghai Business Park PhaseIII
|
||||
| 1 |
Shanghai, 200233
|
|||||
| 1 |
China
|
|||||
| app s | TCB Information | |||||
| 1 | TCB Application Email Address |
t******@timcoengr.com
|
||||
| 1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
| app s | FCC ID | |||||
| 1 | Grantee Code |
XMR
|
||||
| 1 | Equipment Product Code |
201708EC21E
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 | Name |
J**** x******
|
||||
| 1 | Telephone Number |
+8602******** Extension:
|
||||
| 1 | Fax Number |
+8621********
|
||||
| 1 |
j******@quectel.com
|
|||||
| app s | Technical Contact | |||||
| n/a | ||||||
| app s | Non Technical Contact | |||||
| n/a | ||||||
| app s | Confidentiality (long or short term) | |||||
| 1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 | Equipment Class | TNB - Licensed Non-Broadcast Station Transmitter | ||||
| 1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE Module | ||||
| 1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 | Modular Equipment Type | Single Modular Approval | ||||
| 1 | Purpose / Application is for | Original Equipment | ||||
| 1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 | Grant Comments | Output power listed is conducted. Single Modular Approval for mobile RF Exposure condition. This module can only be used with a host antenna circuit trace layout design in strict compliance with the OEM instructions provided. The antennas used for this transmitter must be installed to provide a separation distance of at least 20-cm from all persons, must have gain less than 1.0 dBi, and must not be co-located or operating in conjunction with any other antenna or transmitter, except the collocation as described in this filing. Approved for OEM integration only. The grantee must provide OEM integrators, or end-users if marketed directly to end-users, with installation and operating instructions for satisfying FCC multi-transmitter product guidelines. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. This device contains functions that are not operational in U.S. Territories; this filing is applicable only for U.S. operations. | ||||
| 1 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 | Firm Name |
TA Technology (Shanghai) Co., Ltd.
|
||||
| 1 | Name |
Z**** L********
|
||||
| 1 | Telephone Number |
86-21******** Extension:
|
||||
| 1 | Fax Number |
86-21********
|
||||
| 1 |
l******@ta-shanghai.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 22H | 825.5 | 847.5 | 0.213 | 0.004 ppm | 2M75G7D | ||||||||||||||||||||||||||||||||||
| 1 | 2 | 22H | 829 | 844 | 0.212 | 0.003 ppm | 9M02G7D | ||||||||||||||||||||||||||||||||||
| 1 | 3 | 22H | 825.5 | 847.5 | 0.181 | 0.003 ppm | 2M76W7D | ||||||||||||||||||||||||||||||||||
| 1 | 4 | 22H | 829 | 844 | 0.178 | 0.005 ppm | 9M03W7D | ||||||||||||||||||||||||||||||||||
| 1 | 5 | 22H | 826.4 | 846.6 | 0.218 | 0.001 ppm | 4M12F9W | ||||||||||||||||||||||||||||||||||
| 1 | 6 | 27 | 2502.5 | 2567.5 | 0.208 | 0.003 ppm | 9M04G7D | ||||||||||||||||||||||||||||||||||
| 1 | 7 | 27 | 2510 | 2560 | 0.206 | 0.003 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
| 1 | 8 | 27 | 2502.5 | 2567.5 | 0.179 | 0.003 ppm | 9M03W7D | ||||||||||||||||||||||||||||||||||
| 1 | 9 | 27 | 2510 | 2560 | 0.175 | 0.002 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC