FCC ID: XMR202311EG915NLA LTE Module

EG915N Series Hardware Design LTE Standard Module Series Version: 1.2 Date: 2023-08-09 Status: Released LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. EG915N_Series_Hardware_Design 2 / 98 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG915N_Series_Hardware_Design 3 / 98 LTE Standard Module Series About the Document Revision History Version Date Author Description

2021-11-19 1.0 2022-02-25 Shihao HUANG/

Jeff SHEN Shihao HUANG/

Jeff SHEN Creation of the document First official release 1. Added a new variant EG915N-LA and related information. 2. Updated the weight of the module. (Table 2) 3. Added dual SIM single Standby function. (Table 6 and Chapter 3.10) 4. Updated the USB serial drivers. (Table 6) 5. Added the emergency call function. (Table 6) 6. Added the normal voltage in DC characteristics of PWRKEY and RESET_N. (Table 8) 7. Updated the reference design of power supply.

(Figure 11) 1.1 2022-10-14 Evan ZOU/

9. Updated the reference design of microphone Shihao HUANG/

8. Updated the power-down timing. (Figure 15) Yule Deng interface. (Figure 28) 10. Deleted the information on long frame mode and the PCM interface used as slave device in short frame mode. (Chapter 3.13) 11. Updated reference design of PCM and I2C applications. (Figure 27) 12. Updated GNSS frequency range. (Table 39) 13. Updated the digital I/O characteristics. (Chapter 5.4) 14. Updated the power consumption of the module.

(Table 46) 15. Updated the ramp-up slope, cool-down slope and the note. (Chapter 7.2) EG915N_Series_Hardware_Design 4 / 98 LTE Standard Module Series Shihao HUANG/

1.2 2023-08-09 Jeff SHEN/

Yule DENG 1. Added a new variant: EG915N-EA, and related information. 2. Deleted SBAS of GNSS function (Table 3 & 40). 3. Added 3GPP features in LTE features (Table 4). 4. Added new function for USB interface (Table 4 &

chapter 3.11). 5. Added new function for debug UART (Table 4 & 14). 6. Updated the USB serial drivers for Android and Linux

(Table 4). 7. Added USB_BOOT and indicators (Figure 1). 8. Changed pin 76 and 77 from RESERVED to GRFC_1 and GRFC_2 respectively (Figure 2 &

Table 6 & Chapter 4.1.2). 9. Added two 0 resistors (Figure 9). 10. Added one 1 k resistor (Figure 16). 11. Deleted RC circuit (Figure 26). 12. Update GNSS performance (Table 41). 13. Updated VSWR of GNSS (Table 42). 14. Updated power consumption (Chapter 5.3). 15. Updated packaging specification (Chapter 7.3). EG915N_Series_Hardware_Design 5 / 98 LTE Standard Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents .................................................................................................................................................... 6 Table Index ............................................................................................................................................... 9 Figure Index ............................................................................................................................................ 11 1 Introduction ..................................................................................................................................... 13 1.1. Special Mark ......................................................................................................................... 13 2 Product Overview ............................................................................................................................ 14 2.1. 2.2. 2.3. 2.4. Frequency Bands and Functions .......................................................................................... 14 Key Features ......................................................................................................................... 15 Functional Diagram ............................................................................................................... 17 EVB Kit .................................................................................................................................. 18 3 Application Interfaces ..................................................................................................................... 19 3.1. General Description .............................................................................................................. 19 3.2. 3.3. Pin Assignment ..................................................................................................................... 20 Pin Description ...................................................................................................................... 21 3.4. Operating Modes .................................................................................................................. 27 3.5. Sleep Mode ........................................................................................................................... 28 3.5.1. UART Application Scenario .......................................................................................... 28 3.5.2. USB Application Scenario ............................................................................................ 29 3.5.2.1. USB Application with USB Remote Wakeup Function ....................................... 29 3.5.2.2. USB Application with USB Suspend/Resume and RI Function .......................... 29 3.5.2.3. USB Application without USB Suspend Function ............................................... 30 3.6. 3.7. Airplane Mode ....................................................................................................................... 31 Power Supply ........................................................................................................................ 32 3.7.1. Power Supply Pins ....................................................................................................... 32 3.7.2. Voltage Stability Requirements .................................................................................... 32 3.7.3. Reference Design for Power Supply ............................................................................ 33 3.8. Turn On ................................................................................................................................. 34 3.8.1. Turn On with PWRKEY ................................................................................................ 34 3.9. Turn Off ................................................................................................................................. 36 3.9.1. Turn off with PWRKEY ................................................................................................. 37 3.9.1.1. Turn off with AT Command ................................................................................. 37 3.10. Reset ..................................................................................................................................... 37 3.11. USB Interface ........................................................................................................................ 39 3.12. USB_BOOT .......................................................................................................................... 40 3.13.

(U)SIM Interfaces .................................................................................................................. 42 3.14. UART .................................................................................................................................... 44 3.15. PCM and I2C Interfaces ........................................................................................................ 47 3.16. Analog Audio Interfaces ........................................................................................................ 49 EG915N_Series_Hardware_Design 6 / 98 LTE Standard Module Series 3.16.1. Audio Interfaces Design Considerations ...................................................................... 50 3.16.2. Microphone Interface Design ....................................................................................... 50 3.16.3. Earpiece and Loudspeaker Interface Design ............................................................... 51 3.17. ADC Interfaces ...................................................................................................................... 52 3.18. Indication Signal .................................................................................................................... 53 3.18.1. Network Status Indication ............................................................................................ 53 3.18.2. STATUS ....................................................................................................................... 54 3.18.3. MAIN_RI ...................................................................................................................... 54 4 RF Specifications ............................................................................................................................ 56 4.1. Cellular Network .................................................................................................................... 56 4.1.1. Main Antenna Interface & Frequency Bands ............................................................... 56 4.1.2. Antenna Tuner Control Interfaces* ............................................................................... 58 4.1.3. Transmitting Power ...................................................................................................... 59 4.1.4. Receiver Sensitivity ..................................................................................................... 60 4.1.5. Reference Design ........................................................................................................ 62 4.1.6. RF Routing Guidelines ................................................................................................. 63 4.2. GNSS (Optional) ................................................................................................................... 64 4.2.1. Antenna Interface & Frequency Bands ........................................................................ 65 4.2.2. GNSS Performance ..................................................................................................... 65 4.2.3. GNSS Antenna Reference Design ............................................................................... 66 4.2.3.1. Reference Design for GNSS Active Antenna ..................................................... 66 4.2.3.2. Reference Design for GNSS Passive Antenna .................................................. 67 4.2.4. GNSS Antenna Routing Guidelines ............................................................................. 67 4.3. 4.4. Antenna Design Requirements ............................................................................................. 68 RF Connector Recommendation ........................................................................................... 69 5 Electrical Characteristics and Reliability ...................................................................................... 71 5.1. 5.2. 5.3. 5.4. 5.5. Absolute Maximum Ratings .................................................................................................. 71 Power Supply Ratings ........................................................................................................... 71 Power Consumption .............................................................................................................. 72 Digital I/O Characteristics ...................................................................................................... 79 ESD Protection ..................................................................................................................... 80 5.6. Operating and Storage Temperatures ................................................................................... 81 6 Mechanical Information .................................................................................................................. 82 6.1. Mechanical Dimensions ........................................................................................................ 82 6.2. 6.3. Recommended Footprint ....................................................................................................... 84 Top and Bottom Views .......................................................................................................... 85 7 Storage, Manufacturing and Packaging ........................................................................................ 86 7.1. Storage Conditions ............................................................................................................... 86 7.2. Manufacturing and Soldering ................................................................................................ 87 7.3. Packaging Specification ........................................................................................................ 89 7.3.1. Carrier Tape ................................................................................................................. 89 7.3.2. Plastic Reel .................................................................................................................. 90 EG915N_Series_Hardware_Design 7 / 98 LTE Standard Module Series 7.3.3. Mounting Direction ....................................................................................................... 90 7.3.4. Packaging Process ...................................................................................................... 91 8 Appendix References ..................................................................................................................... 92 EG915N_Series_Hardware_Design 8 / 98 LTE Standard Module Series Table Index Table 1: Special Mark .............................................................................................................................. 13 Table 2: Brief Introduction ........................................................................................................................ 14 Table 3: Frequency Bands and Functions ............................................................................................... 14 Table 4: Key Features ............................................................................................................................. 15 Table 5: I/O Parameters Definition ........................................................................................................... 21 Table 6: Pin Description .......................................................................................................................... 21 Table 7: Overview of Operating Modes ................................................................................................... 27 Table 8: Power Supply and GND Pins ..................................................................................................... 32 Table 9: Pin Description of PWRKEY ...................................................................................................... 34 Table 10: Pin Description of RESET_N ................................................................................................... 38 Table 11: Pin Description of USB Interface .............................................................................................. 39 Table 12: Pin Definition of USB_BOOT Interface .................................................................................... 41 Table 13: Pin Definition of (U)SIM Interfaces ........................................................................................... 42 Table 14: UART Interface Information ..................................................................................................... 44 Table 15: Pin Definition of Main UART .................................................................................................... 45 Table 16: Pin Definition of Auxiliary UART ............................................................................................... 45 Table 17: Pin Definition of Debug UART ................................................................................................. 45 Table 18: Pin Definition of PCM and I2C Interfaces ................................................................................. 47 Table 19: Pin Definition of Audio Interfaces ............................................................................................. 49 Table 20: Pin Definition of EG915N-EU ADC Interfaces .......................................................................... 52 Table 21: Characteristics of ADC Interfaces of EG915N-EU ................................................................... 52 Table 22: Pin Definition of Indication Signal ............................................................................................ 53 Table 23: Working State of Network Activity Indicator ............................................................................. 53 Table 24: Default Behaviors of the MAIN_RI ........................................................................................... 55 Table 25: Pin Definition of Main Antenna ................................................................................................. 56 Table 26: EG915N-EU Operating Frequency .......................................................................................... 56 Table 27: EG915N-LA Operating Frequency ........................................................................................... 57 Table 28: EG915N-EA Operating Frequency ........................................................................................... 57 Table 29: Pin Definition of GRFC Interfaces ............................................................................................ 58 Table 30: EG915N-EU Truth Table of GRFC Interface (Unit: MHz) ......................................................... 58 Table 31: EG915N-LA Truth Table of GRFC Interface (Unit: MHz) .......................................................... 58 Table 32: EG915N-EA Truth Table of GRFC Interface (Unit: MHz) .......................................................... 59 Table 33: EG915N-EU RF Transmitting Power ....................................................................................... 59 Table 34: EG915N-LA RF Transmitting Power ........................................................................................ 59 Table 35: EG915N-EA RF Transmitting Power ........................................................................................ 60 Table 36: EG915N-EU Conducted RF Receiver Sensitivity ..................................................................... 60 Table 37: EG915N-LA Conducted RF Receiver Sensitivity ..................................................................... 61 Table 38: EG915N-EA Conducted RF Receiver Sensitivity ..................................................................... 62 Table 39: GNSS Antenna Pin Definition .................................................................................................. 65 Table 40: GNSS Frequency ..................................................................................................................... 65 Table 41: EG915N Series GNSS Performance ....................................................................................... 65 EG915N_Series_Hardware_Design 9 / 98 LTE Standard Module Series Table 42: Antenna Requirements ............................................................................................................ 68 Table 43: Absolute Maximum Ratings ..................................................................................................... 71 Table 44: Power Supply Ratings .............................................................................................................. 71 Table 45: EG915N-EU Power Consumption ............................................................................................ 72 Table 46: EG915N-LA Power Consumption ............................................................................................ 74 Table 47: EG915N-EA Power Consumption ............................................................................................ 77 Table 48: 1.8 V Digital I/O Requirements ................................................................................................ 79 Table 49: (U)SIM 1.8 V I/O Requirements ............................................................................................... 80 Table 50: (U)SIM 3.0 V I/O Requirements ............................................................................................... 80 Table 51: Electrostatics Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) .......... 80 Table 52: Operating and Storage Temperatures ...................................................................................... 81 Table 53: Recommended Thermal Profile Parameters ............................................................................ 88 Table 54: Carrier Tape Dimension Table (Unit: mm) ................................................................................ 89 Table 55: Plastic Reel Dimension Table (Unit: mm) ................................................................................. 90 Table 56: Related Documents ................................................................................................................. 92 Table 57: Terms and Abbreviations .......................................................................................................... 92 EG915N_Series_Hardware_Design 10 / 98 LTE Standard Module Series Figure Index Figure 1: Functional Diagram of EG915N Series .................................................................................... 18 Figure 2: Pin Assignment (Top View) ....................................................................................................... 20 Figure 3: DRX Run Time and Current Consumption in Sleep Mode........................................................ 28 Figure 4: Sleep Mode Application via UART ............................................................................................ 28 Figure 5: Sleep Mode Application with USB Remote Wakeup Function .................................................. 29 Figure 6: Sleep Mode Application with MAIN_RI ..................................................................................... 30 Figure 7: Sleep Mode Application without USB Suspend Function ......................................................... 31 Figure 8: Power Supply Limits during Burst Transmission ...................................................................... 33 Figure 9: Reference Design of Power Supply ......................................................................................... 33 Figure 10: Reference Design of Power Supply ....................................................................................... 34 Figure 11: Reference Design of Turning on the Module with Driving Circuit ............................................ 35 Figure 12: Reference Design of Turning on the Module with a Button .................................................... 35 Figure 13: Power Up Timing .................................................................................................................... 36 Figure 14: Power Down Timing ............................................................................................................... 37 Figure 15: Reference Design of RESET_N with Driving Circuit .............................................................. 38 Figure 16: Reference Design of RESET_N with a Button ....................................................................... 38 Figure 17: Reset Timing .......................................................................................................................... 39 Figure 18: Reference Design of USB Application .................................................................................... 40 Figure 19: Reference Design of USB_BOOT Interface ........................................................................... 41 Figure 20: Timing Sequence for Entering Emergency Download Mode .................................................. 41 Figure 21: Reference Design of (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 43 Figure 22: Reference Design of (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 43 Figure 23: Reference Design with a Voltage-level Translator .................................................................. 46 Figure 24: Reference Design with Transistor Circuit ............................................................................... 46 Figure 25: Timing of Short Frame Mode .................................................................................................. 48 Figure 26: Reference Design of PCM and I2C Application with Audio Codec ......................................... 48 Figure 27: Reference Design for Microphone Interface ........................................................................... 50 Figure 28: Reference Design for Earpiece Interface ............................................................................... 51 Figure 29: Reference Design of External Audio Amplifier Output ............................................................ 51 Figure 30: Reference Design of Network Status Indication ..................................................................... 54 Figure 31: Reference Design of STATUS ................................................................................................ 54 Figure 32: Reference Design for Main Antenna Interface ........................................................................ 62 Figure 33: Microstrip Design on a 2-layer PCB ....................................................................................... 63 Figure 34: Coplanar Waveguide Design on a 2-layer PCB ...................................................................... 63 Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 63 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 64 Figure 37: GNSS Active Antenna Reference Design ............................................................................... 66 Figure 38: GNSS Passive Antenna Reference Design ............................................................................ 67 Figure 39: Dimensions of the Receptacle (Unit: mm) .............................................................................. 69 Figure 40: Specifications of Mated Plugs ................................................................................................ 69 Figure 41: Space Factor of Mated Connectors (Unit: mm) ...................................................................... 70 EG915N_Series_Hardware_Design 11 / 98 LTE Standard Module Series Figure 42: Top and Side Dimensions ....................................................................................................... 82 Figure 43: Bottom Dimensions (Bottom View) ......................................................................................... 83 Figure 44: Recommended Footprint (Top View) ...................................................................................... 84 Figure 45: Top View and Bottom View of the Module .............................................................................. 85 Figure 46: Recommended Reflow Soldering Thermal Profile .................................................................. 87 Figure 47: Carrier Tape Dimension Drawing ............................................................................................ 89 Figure 48: Plastic Reel Dimension Drawing ............................................................................................ 90 Figure 49: Mounting Direction ................................................................................................................. 90 Figure 50: Packaging Process................................................................................................................. 91 EG915N_Series_Hardware_Design 12 / 98 LTE Standard Module Series 1 Introduction This document defines the EG915N series module and describes its air interface and hardware interfaces which are connected with your applications. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, you can use the module to design and set up wireless applications easily. 1.1. Special Mark Table 1: Special Mark Mark Definition Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, argument, and so on, it indicates that the function, feature,

interface, pin, AT command, argument, and so on, is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. EG915N_Series_Hardware_Design 13 / 98 LTE Standard Module Series 2 Product Overview The module is an SMD type module which is engineered to meet most of the requirements for M2M applications such as automation, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC. Categories Packaging pins number Dimensions LGA 126 Pins

(23.6 0.2) mm (19.9 0.2) mm (2.4 0.2) mm Weight Approx. 2.46 g Table 2: Brief Introduction EG915N Series Packaging pins number Dimensions Weight LGA 126 pins

(23.6 0.2) mm (19.9 0.2) mm (2.4 0.2) mm Approx. 2.46 g 2.1. Frequency Bands and Functions Table 3: Frequency Bands and Functions EG915N-EU EG915N-LA EG915N-EA LTE-FDD B1/B3/B7/B8/B20 B2/B4/B5/B7/B66 B1/B3/B7/B8/B20/B28 GSM EGSM900/DCS1800 GSM850/PCS1900 EGSM900/DCS1800 EG915N_Series_Hardware_Design 14 / 98 GNSS (optional) GPS/GLONASS/Galileo/

GPS/GLONASS/Galileo/

GPS/GLONASS/Galileo/

BDS/QZSS BDS/QZSS BDS/QZSS LTE Standard Module Series 2.2. Key Features The following table describes the detailed features of the module. Table 4: Key Features Features Details Power Supply Supply voltage: 3.44.5 V Typical supply voltage: 3.8 V Transmitting Power Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (29 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (23 dBm 2 dB) for LTE-FDD bands Supports up to 3GPP Rel-9 non-CA Cat 1 FDD LTE Features Supports 1.4/3/5/10/15/20 MHz RF bandwidth LTE-FDD: Max. 10 Mbps (DL), Max. 5 Mbps (UL) GSM Features GPRS:

Supports GPRS multi-slot class 12 Coding scheme: CS 14 Max. 85.6 kbps (DL), Max. 85.6 kbps (UL) EDGE:

Supports EDGE multi-slot class 12 Supports GMSK and 8-PSK for different MCS Downlink coding schemes: MCS 19 Uplink coding schemes: MCS 19 Max. 236.8 kbps (DL), Max. 236.8 kbps (UL) Internet Protocol Supports TCP/UDP/PPP/FTP/HTTP/NTP/PING/NITZ/CMUX/HTTPS/

Features SMTP/MMS/FTPS/SMTPS/SSL/FILE/MQTT protocols EG915N_Series_Hardware_Design 15 / 98 LTE Standard Module Series Supports PAP and CHAP for PPP connections SMS Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: (U)SIM card and ME, ME by default

(U)SIM Interfaces Supports (U)SIM card: 1.8/3.0 V Supports Dual SIM Single Standby Audio Features PCM Interface USB Interface Supports one digital audio interface: PCM interface Supports one analog audio input and one analog audio output HR/FR/EFR/AMR/AMR-WB Supports echo cancellation and noise suppression Used for audio function with an external codec Short frame mode: module can only be used as master device Compliant with USB 2.0 specification (slave mode only), with data transmission rate up to 480 Mbps Used for AT command communication, data transmission, software debugging, firmware upgrade and GNSS NMEAM message output Supports USB serial drivers for: Windows 7/8/8.1/10/11, Linux 2.66.5, Android 4.x13.x, etc. Main UART:

Used for AT command communication and data transmission Baud rate: 115200 bps by default Supports RTS and CTS hardware flow control Auxiliary UART*:

UART Used for communication with peripheral Baud rate: 115200 bps Supports RTS and CTS hardware flow control Debug UART:

AT Commands Used for the output of partial logs and GNSS NMEA message Baud rate:115200 bps Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel enhanced AT commands Network Indication NET_STATUS to indicate the network connectivity status Antenna Interfaces Main antenna interface (ANT_MAIN) GNSS antenna interface (ANT_GNSS) 1 50 impedance 1 GNSS function is optional for the module. Only the module with built-in GNSS function can support GNSS positioning function. EG915N_Series_Hardware_Design 16 / 98 LTE Standard Module Series Position Fixing Operating Temperature Supports Wi-Fi scan and shares the main antenna Supports GNSS positioning 1 Operating temperature range: -35 C to +75 C 2 Extended temperature range: -40 C to +85 C 3 Storage temperature range: -40 C to +90 C Firmware Upgrade Via USB interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Power management Baseband Memory Radio frequency Peripheral interfaces 2 Within operating temperature range, the module is 3GPP compliant. 3 Within extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, emergency call, etc, without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915N_Series_Hardware_Design 17 / 98 LTE Standard Module Series 2.4. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (UMTS & LTE EVB) with accessories to control or test the module. For more details, see document [1]. EG915N_Series_Hardware_Design 18 / 98 LTE Standard Module Series 3 Application Interfaces 3.1. General Description The module is equipped with 126 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces. Power supply

(U)SIM interfaces USB interface UART interfaces Analog audio interfaces PCM and I2C interfaces Network status indication USB_BOOT interface STATUS ADC interfaces EG915N_Series_Hardware_Design 19 / 98 LTE Standard Module Series 3.2. Pin Assignment The following figure shows the pin assignment of the module. Figure 2: Pin Assignment (Top View) NOTE 1. For EG915N-EU, pin 2 and pin 24 are ADC pins; for EG915N-LA and EG915N-EA, pin 2 and pin 24 are RESERVED pins. 2. All GND pins should be connected to ground, and keep unused and RESERVED pins open. 3. USB_BOOT cannot be pulled up to high level before the module starts up successfully. 4. ANT_GNSS and PPS_GNSS are GNSS pins for the module with built-in GNSS function. 5. Ensure that there is a complete reference ground plane below the module, and the ground plane is as close to the module layer as possible. At least a 4-layer board design is recommended. EG915N_Series_Hardware_Design 20 / 98 123456711121314151617185051525354555859606162313029282726232221201910984948474645444340414239383736353433322425575663646566676883848586878898979695949378777675747391928990717269708079828110099102101SLEEP_INDADC1RESERVEDAUX_RTSAUX_CTSANT_MAINAP_READYSTATUSNET_STATUSPCM_CLKPCM_SYNCPCM_DINPCM_DOUTW_DISABLE#GNDUSB_VBUSUSB_DPUSB_DMRESERVEDRESERVEDRESERVEDRESERVEDPWRKEYDBG_RXDDBG_TXDADC0VDD_EXTMAIN_DTRGNDMAIN_RIMAIN_DCDMAIN_RTSMAIN_TXDMAIN_RXDVBAT_BBMAIN_CTSI2C_SCLI2C_SDAVBAT_BBGNDGNDGNDRESERVEDVBAT_RFVBAT_RFGNDGNDGNDGNDAUX_TXDAUX_RXDRESET_NUSB_BOOTUSIM2_DETUSIM2_CLKUSIM2_RSTUSIM2_DATAUSIM2_VDDRESERVEDRESERVEDRESERVEDRESERVEDWAKEUP_INRESERVEDRESERVEDGRFC_1GRFC_21031041031151141031181132112111103106105107116103108117109110RESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVED119126120121122123124125MIC_NMIC_PSPK_PSPK_NRESERVEDRESERVEDRESERVEDMICBIASPower PinsGND PinsSignal PinsRESERVED Pins(U)SIM PinsUSB PinsADC PinsUART PinsAudio PinsUSIM1_CLKUSIM1_DATAUSIM1_RSTUSIM1_VDDUSIM1_GNDUSIM1_DETANT_GNSSGNDI2C PinsPPS_GNSSGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDRESERVEDPCM Pins LTE Standard Module Series 3.3. Pin Description The following tables show the pin definition and description of the module. Table 5: I/O Parameters Definition Type AI AIO AO DI DO DIO OD PI PO Description Analog Input Analog Input/Output Analog Output Digital Input Digital Input/Output Digital Output Open Drain Power Input Power Output DC characteristics include power domain and rate current. Table 6: Pin Description Power Supply Input Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI modules baseband Vmin = 3.4 V Power supply for the Vmax = 4.5 V part Vnom = 3.8 V External power supply must be provided with sufficient current of at least 0.8 A. It is recommended to add external TVS diode. A test point is recommended to be reserved. EG915N_Series_Hardware_Design 21 / 98 LTE Standard Module Series VBAT_RF 52, 53 PI Power supply for the modules RF part External power supply must be provided with sufficient current of at least 2.2 A. It is recommended to add external TVS diode. A test point is recommended to be reserved. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 Power Supply Output Pin Name Pin No. I/O Description DC Characteristics Comment Power supply for external GPIOs VDD_EXT 29 PO Provide 1.8 V for Vnom = 1.8 V pull-up circuits. external circuit IOmax = 50 mA A test point is recommended to be reserved. Turn On/Off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turn on/off the module VBAT power domain. VILmax = 0.5 V A test point is Vnom = VBAT recommended to be RESET_N 17 DI Reset the module VILmax = 0.5 V Vnom = 1.8 V reserved. Active low. 1.8 V power domain. A test point is recommended to be reserved if unused. Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment SLEEP_IND 1 DO STATUS 20 DO Indicate the module's sleep mode Indicate the modules operation status 1.8 V NET_STATUS 21 DO Indicate the modules If unused, keep them open. EG915N_Series_Hardware_Design 22 / 98 LTE Standard Module Series network activity status USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 8 AI USB connection detect Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V USB_DP 9 AIO USB_DM 10 AIO USB differential data

(+) USB differential data

(-) A test point must be reserved. Requires differential impedance of 90 . USB 2.0 compliant. Test points must be reserved.

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_DET 42 DI

(U)SIM1 card hot-plug detect 1.8 V If unused, keep it open. Either 1.8 V or 3.0 V

(U)SIM card is USIM1_VDD 43 PO

(U)SIM1 card power IOmax = 50 mA supported and can supply 1.8/3.0 V be identified USIM1_RST 44 DO

(U)SIM1 card reset USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_VDD 1.8/3.0 V USIM1_CLK 46 DO

(U)SIM1 card clock USIM1_GND 47

USIM2_DET*

83 DI Specified ground for

(U)SIM1

(U)SIM2 card hot-plug detect 1.8 V USIM2_CLK 84 DO

(U)SIM2 card clock USIM2_RST 85 DO

(U)SIM2 card reset USIM2_DATA 86 DIO

(U)SIM2 card data USIM2_VDD 1.8/3.0 V automatically by the module. Connect to main GND of PCB. If unused, keep it open. USIM2_VDD 87 PO

(U)SIM2 card power IOmax = 50 mA

(U)SIM card is supply 1.8/3.0 V supported and can Either 1.8 V or 3.0 V be identified EG915N_Series_Hardware_Design 23 / 98 LTE Standard Module Series automatically by the module. Main UART Pin Name Pin No. I/O Description DC Characteristics Comment MAIN_DTR 30 DI Main UART data terminal ready MAIN_RXD MAIN_TXD 34 35 DI Main UART receive DO Main UART transmit MAIN_CTS 36 DO MAIN_RTS 37 DI MAIN_DCD 38 DO MAIN_RI 39 DO Clear to send signal from the module Request to send signal to the module Main UART data carrier detect Main UART ring indication If unused, keep them open. Connect to MCUs CTS. If unused, keep 1.8 V it open. Connect to MCUs RTS. If unused, keep it open. If unused, keep them open. Auxiliary UART*

Pin Name Pin No. I/O Description DC Characteristics Comment AUX_RTS 25 DI Request to send signal to the module AUX_CTS 26 DO Clear to send signal from the module 1.8 V AUX_TXD 27 DO AUX_RXD 28 DI Auxiliary UART transmit Auxiliary UART receive Connect to MCUs RTS. If unused, keep it open. Connect to MCUs CTS. If unused, keep it open. If unused, keep them open. Debug UART Pin Name DBG_RXD DBG_TXD Pin No. 22 23 I/O Description DC Characteristics Comment DI Debug UART receive DO Debug UART transmit 1.8 V Test points must be reserved. EG915N_Series_Hardware_Design 24 / 98 LTE Standard Module Series ADC Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 24 AI General-purpose ADC If unused, keep them interface open. ADC1 2 AI General-purpose ADC 0 V to VBAT_BB EG915N-EA do not Voltage range:

EG915N-LA and interface support ADC function. PCM Interface Pin Name PCM_CLK PCM_SYNC PCM_DIN PCM_DOUT I2C Interface Pin Name Pin No. 4 5 6 7 Pin No. I/O Description DC Characteristics Comment DO PCM clock DO PCM data frame sync DI PCM data input DO PCM data output 1.8 V If unused, keep them open. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C serial clock I2C_SDA 41 OD I2C serial data An external 1.8 V pull-up resistor is 1.8 V required. If unused, keep them open. Analog Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment MICBIAS 120 PO MIC_N 119 AI MIC_P 126 AI SPK_P 121 AO SPK_N 122 AO Bias voltage output for microphone Microphone analog input (-) Microphone analog input (+) Analog audio differential output (+) Analog audio differential output (-) If unused, keep them open. The interface can drive 32 earpiece with power rate at 37 mW. It can also be EG915N_Series_Hardware_Design 25 / 98 LTE Standard Module Series used to drive external power amplifier devices if the output power rate cannot meet the demand. If unused, keep them open. RF Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 60 AIO ANT_GNSS 49 AI Main antenna interface GNSS antenna interface Antenna Tuner Control Interfaces*

50 impedance. 50 impedance. If unused, keep it open. This function is optional Pin Name GRFC_1 GRFC_2 Pin No. 76 77 Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment DO DO Generic RF Controller If unused, keep them open. I/O Description DC Characteristics Comment WAKEUP_IN*

96 DI Wake up the module AP_READY 19 DI Application processor ready W_DISABLE#

18 DI Airplane mode control 1.8 V USB_BOOT 75 DI emergency download Force the module into mode PPS_GNSS 51 DO PPS output If unused, keep them open. Pull-up by default. In low voltage level, module can enter airplane mode. If unused, keep it open. Active high. A test point is recommended to be reserved. Cannot pull it down when GNSS function EG915N_Series_Hardware_Design 26 / 98 LTE Standard Module Series Reserved Pins Pin Name Pin No. 1114, 16, 56, 57, 6366, 78, 88, 9295, 9799, 103118, 123125 RESERVED NOTE is active. This function is optional Comment Keep them open. 1. ANT_GNSS and PPS_GNSS are the GNSS pins for the module with built-in GNSS function. See Chapter 4.2 for details about GNSS antenna interfaces. 2. For EG915N-LA/EA, pin 2 and pin 24 are RESERVED pins. 3.4. Operating Modes Table 7: Overview of Operating Modes Modes Details Full Functionality Operation Idle Voice/Data Software is active. The module remains registered on the network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transmission rate. Minimum AT+CFUN=0 can set the module into a minimum functionality mode without Functionality removing the power supply. In this case, both RF function and (U)SIM card will be Mode invalid. Airplane Mode AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the power consumption of the module is reduced to the minimal level. Sleep Mode During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power Down In this mode, the modules power supply is cut off by its power management IC. The Mode software is inactive, while the VBAT_RF and VBAT_BB pins are still powered. NOTE For more information about the AT command, see document [2] for details. EG915N_Series_Hardware_Design 27 / 98 LTE Standard Module Series 3.5. Sleep Mode With DRX technology, power consumption of the module will be reduced to a minimal level. Figure 3: DRX Run Time and Current Consumption in Sleep Mode NOTE DRX cycle values are transmitted over the wireless network. The following section describes ways to let the module enter sleep mode. 3.5.1. UART Application Scenario If the MCU communicates with module via UART interfaces, the following preconditions should be met at the same time to let the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR high or keep it open. The following figure shows the connection between the module and the MCU. Figure 4: Sleep Mode Application via UART EG915N_Series_Hardware_Design 28 / 98 Current ConsumptionRun TimeDRX OFF ON OFF ON OFF ON OFF ON OFF MAIN_RXDMAIN_TXDMAIN_RIMAIN_DTRAP_READYTXDRXDEINTGPIOGPIOModuleMCUGNDGND LTE Standard Module Series Drive MAIN_DTR low by the MCU will wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 3.18.3 for details about MAIN_RI behaviors. 3.5.2. USB Application Scenario For the two situations (USB application with USB suspend/resume and USB remote wakeup function and USB application with USB suspend/resume and RI function) below, three preconditions must be met to set the module into sleep mode:

Execute AT+QSCLK=1. Ensure the MAIN_DTR is held high or is kept disconnected. Ensure the hosts USB bus, which is connected to the modules USB interface, enters suspend state. 3.5.2.1. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with USB Remote Wakeup Function Sending data to the module through USB will wake up the module. When the module has a URC to report, the module sends remote wake-up signals to wake up the host via USB bus. 3.5.2.2. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. EG915N_Series_Hardware_Design 29 / 98 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGND LTE Standard Module Series The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application with MAIN_RI Sending data to the module through USB will wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 3.18.3 for details about MAIN_RI behavior. 3.5.2.3. USB Application without USB Suspend Function If the host does not support USB suspend function, disconnect USB_VBUS with an external control circuit to let the module enter sleep mode. The following three preconditions must be met at the same time to let the module enter sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. Disconnect the USB_VBUS power supply. The following figure shows the connection between the module and the host. EG915N_Series_Hardware_Design 30 / 98 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDMAIN_RIEINT LTE Standard Module Series Figure 7: Sleep Mode Application without USB Suspend Function You can wake up the module by turning on the power switch to supply power to USB_VBUS. NOTE 1. Pay attention to the level match shown in dotted line between the module and the host in the circuit diagrams of Chapter 3.5.2. 2. For more information about the AT command, see document [2] for details. 3.6. Airplane Mode When the module enters airplane mode, the RF function does not work and all AT commands related to the RF function are inaccessible. The following ways can be used to let the module enter airplane mode. Hardware:

The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving the pin low after its control function for airplane mode is enabled by AT command, which can make the module enter the airplane mode. Software:

AT+CFUN=<fun> provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode (disable (U)SIM and RF functions). AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode (disable RF function). EG915N_Series_Hardware_Design 31 / 98 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostMAIN_RIEINTPower SwitchGPIOGNDGND LTE Standard Module Series NOTE For more information about the AT command, see document [2] for details. 3.7. Power Supply 3.7.1. Power Supply Pins The module provides four VBAT pins dedicated to connecting with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part Table 8: Power Supply and GND Pins Pin Name Pin No. I/O Description Comment VBAT_RF 52, 53 Power supply for the External power supply must be provided modules RF part with sufficient current of at least 3.0 A. PI Power supply for the It is recommended to add a TVS diode VBAT_BB 32, 33 modules baseband externally. Test points are recommended part to be reserved. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 3.7.2. Voltage Stability Requirements The power supply range of the module is from 3.4 V to 4.5 V. Please make sure that the input voltage never drops below 3.4 V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 4G networks. EG915N_Series_Hardware_Design 32 / 98 LTE Standard Module Series Figure 8: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR 0.7 ) should be used. It is recommended to reserve three multi-layer ceramic chip (MLCC) capacitors (100 nF, 33 pF and 10 pF) with the best ESD performance, and place these capacitors close to the VBAT_BB and VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star configuration. The width of VBAT_BB trace should be not less than 1 mm; and the width of VBAT_RF trace should be not less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In order to avoid the ripple and surge and ensure the stability of the power supply to the module, add a TVS diode with VRWM = 4.7 V, low-clamp voltage and peak pulse current Ipp at the front end of the power supply. Figure 9: Reference Design of Power Supply 3.7.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 3.0 A to the module. If EG915N_Series_Hardware_Design 33 / 98 Power Supply (V)Burst TransmissionRippleDropBurst TransmissionLoad (A)ModuleVBAT_RFVBAT_BBVBATC1100FC6100nFC733pFC810pF++C2100nFC5100FC333pFC410pFD1GND0R 1/10 W0R 1/10 WR1R2 LTE Standard Module Series the voltage drop between the input and output is not too high, it is suggested that an LDO should be used. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used. The following figure shows a reference design for 5 V input power source. The circuit is designed using the LDO of Microchip. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 10: Reference Design of Power Supply 3.8. Turn On 3.8.1. Turn On with PWRKEY Table 9: Pin Description of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 15 DI Turn on/off the module A test point is recommended to be VBAT power domain. reserved. When the module is in power down mode, you can turn it on to normal mode by driving the PWRKEY pin low for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference design is illustrated in the following figure. EG915N_Series_Hardware_Design 34 / 98 DC_INLDOINOUTENGNDADJ24135VBAT 100 nF470 F100 nF100K47K470 F51K1%1%4.7K47KVBAT_EN330 LTE Standard Module Series Figure 11: Reference Design of Turning on the Module with Driving Circuit Another way to control the PWRKEY is using a button directly. a TVS diode is indispensable to be placed nearby the button for ESD protection. A reference design is shown in the following figure. Figure 12: Reference Design of Turning on the Module with a Button The timing of turning on the module is illustrated in the following figure. EG915N_Series_Hardware_Design 35 / 98 PWRKEYMCUGPIOModuleTurn on pulse4.7K47KQ110 nF 500 msTVSPWRKEYS1Close to S1 LTE Standard Module Series NOTE Figure 13: Power Up Timing 1. Ensure that VBAT is stable for at least 30 ms before pulling down the PWRKEY. 2. If the module needs to turn on automatically but does not need turn-off function, PWRKEY can be driven low directly to ground with a recommended 4.7 k resistor. 3.9. Turn Off The following procedures can be used to turn off the module normally:

Use the PWRKEY pin. Execute AT+QPOWD. EG915N_Series_Hardware_Design 36 / 98 VIL 0.5 VVBATPWRKEY 500 msRESET_NSTATUSInactiveActiveUARTNOTE 1InactiveActiveUSB 10 sVDD_EXTUSB_BOOTAfter this, the pin can be driven high by an external circuit. 28 ms 10 ms 10 s 10 s 1 s LTE Standard Module Series 3.9.1. Turn off with PWRKEY Drive the PWRKEY pin low for at least 650 ms and then release it. After this, the module executes power-down procedure. The timing of turning off the module is illustrated in the following figure. Figure 14: Power Down Timing 3.9.1.1. Turn off with AT Command It is also a safe way to use AT+QPOWD to turn off the module, which is similar to the procedure of turning off the module via PWRKEY pin. See document [2] for details about AT+QPOWD. NOTE 1. To avoid corrupting the data in the internal flash, do not switch off the power supply to turn off the module when the module works normally. Only after turning off the module by PWRKEY or API, can you cut off the power supply. 2. When turning off module with the AT command, keep PWRKEY at high level after the execution of the command. Otherwise, the module will turn on again after successful turn-off. 3.10. Reset The module can be reset by driving the RESET_N low for at least 300 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. EG915N_Series_Hardware_Design 37 / 98 VBATPWRKEY2~14 s 650 msRunningPower-down procedureOFFModuleStatusSTATUS LTE Standard Module Series Table 10: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Reset the module A test point is recommended to be reserved if unused. Active low. The recommended design is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control RESET_N. Figure 15: Reference Design of RESET_N with Driving Circuit Figure 16: Reference Design of RESET_N with a Button The reset scenario is illustrated in the following figure. EG915N_Series_Hardware_Design 38 / 98 RESET_N 300 msMCUGPIOModuleReset pulse4.7K47KQ1RESET_NModuleS2Close to S2TVS1KReset pulseR1 LTE Standard Module Series Figure 17: Reset Timing NOTE 1. Ensure that the load capacitance does not exceed 10 nF on PWRKEY and RESET_N pins. 2. RESET_N only resets the internal baseband chip of the module and does not reset the power management chip. 3. Use RESET_N only when you fail to turn off the module with the AT+QPOWD and PWRKEY. 3.11. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve in the slave mode and is used for AT command communication, data transmission, software debugging, firmware upgrade and GNSS NMEA message output. The following table shows the pin definition of USB interface. Table 11: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS 8 AI USB connection detect USB_DP 9 AIO USB differential data (+) USB_DM 10 AIO USB differential data (-) Typical: 5.0 V A test point must be reserved. Requires differential impedance of 90 . USB 2.0 compliant. Test points must be reserved. EG915N_Series_Hardware_Design 39 / 98 VIL 0.5 VVBATModule StatusRunningRESET_NBaseband restart Baseband resetting 300 msVIH 1.3 V LTE Standard Module Series For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. Reserve test points for debugging and firmware upgrade in your designs. The following figure shows a reference design of USB interface. Figure 18: Reference Design of USB Application A common mode choke L1 is recommended to be added in series between the module and MCU to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R1 and R2) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default. To ensure the signal integrity of USB data traces, L1, R1 and R2 must be placed close to the module, and resistors R1 and R2 should be placed close to each other. The extra stubs of trace must be as short as possible. When designing the USB interface, follow the following principles to meet USB 2.0 specifications. Route the USB signal traces as a differential pair with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. Route the USB differential traces of equal length in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Pay attention to the selection of the ESD protection component on the USB data trace. Its parasitic capacitance should not exceed 2 pF and should be placed as close as possible to the USB interface. 3.12. USB_BOOT The module provides a USB_BOOT pin. Before the module is turned on, pull up USB_BOOT to 1.8 V, or short-circuit VDD_EXT and USB_BOOT, and the module will enter emergency download mode. In this mode, the module supports firmware upgrade over USB interface. EG915N_Series_Hardware_Design 40 / 98 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR1R2Test PointsTVS ArrayNM_0RNM_0RMinimize these stubsModuleMCUUSB_VBUSVDD LTE Standard Module Series Table 12: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module into emergency download mode 1.8 V power domain. Active high. A test point is recommended to be reserved. The following figure shows a reference design and timing sequence for entering emergency download mode of USB_BOOT interface. Figure 19: Reference Design of USB_BOOT Interface Figure 20: Timing Sequence for Entering Emergency Download Mode EG915N_Series_Hardware_Design 41 / 98 ModuleUSB_BOOTVDD_EXT4.7KTest pointsClose to test pointsESD Protection ComponentVIL 0.5VVBATPWRKEY 500 msRESET_NNOTE 1VDD_EXT 10 msUSB_BOOTPulled up USB_BOOT to 1.8 V or short-circuit VDD_EXT and USB_BOOT before the module is powered on, and the module will enter emergency download mode when it is turned on. 28 ms LTE Standard Module Series NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is not less than 30 ms. 2. When using MCU to control module to enter the emergency download mode, follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8 V before powering up VBAT. Directly connect the test points as shown in Figure 19Error! Reference source not found. can manually force the module to enter download mode. 3.13. (U)SIM Interfaces The module provides two (U)SIM interfaces, which meet ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V (U)SIM card is supported. The module supports Dual SIM Single Standby. Table 13: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_DET 42 DI

(U)SIM1 card hot-plug detect 1.8 V power domain. If unused, keep it open. Either 1.8 V or 3.0 V (U)SIM card USIM1_VDD 43 PO

(U)SIM1 card power supply is supported and can be identified automatically by the module. USIM1_RST 44 DO

(U)SIM1 card reset USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_CLK 46 DO

(U)SIM1 card clock USIM1_GND 47 Specified ground for (U)SIM1 Connect to main GND of PCB. USIM2_DET*

83 DI

(U)SIM2 card hot-plug detect 1.8 V power domain. If unused, keep it open. USIM2_CLK 84 DO

(U)SIM2 card clock USIM2_RST 85 DO

(U)SIM2 card reset USIM2_DATA 86 DIO

(U)SIM2 card data USIM2_VDD 87 PO

(U)SIM2 card power supply is supported and can be identified Either 1.8 V or 3.0 V (U)SIM card automatically by the module. EG915N_Series_Hardware_Design 42 / 98 LTE Standard Module Series The module supports (U)SIM card hot-plug via the USIM1_DET pin, and both high- and low-level detection are supported. The function is disabled by default and can be configured via AT+QSIMDET. See document [2] for more details. The following figure shows a reference design for (U)SIM card interface with an 8-pin (U)SIM card connector. Figure 21: Reference Design of (U)SIM Interface with an 8-pin (U)SIM Card Connector If the function of (U)SIM card hot-plug is not needed, please keep USIM_DET disconnected. A reference design for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 22: Reference Design of (U)SIM Interface with a 6-pin (U)SIM Card Connector EG915N_Series_Hardware_Design 43 / 98 ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET0R0R0RVDD_EXT51K100 nFGNDGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15K(U)SIM Card ConnectorSwitchTVS arrayMAIN GNDConnect to main GND of PCBModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100 nFGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD(U)SIM Card ConnectorUSIM_DETTVS arrayMAIN GNDConnect to main GND of PCB LTE Standard Module Series To enhance the reliability and availability of the (U)SIM card in your applications, follow the criteria below in (U)SIM circuit design:

Place the (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm. Keep (U)SIM card signals away from RF and power supply traces. Ensure that the ground between the module and the (U)SIM card connector is short and wide. Keep the trace width of ground and USIM_VDD not less than 0.5 mm to maintain the same electric potential. If the ground is complete on your PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. Make sure the bypass capacitor between USIM_VDD and GND less than 1 F, and place it as close to the (U)SIM card connector as possible. To offer good ESD protection, it is recommended to add a TVS array whose parasitic capacitance should not be more than 15 pF. Add 0 resistors in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST lines are used for filtering interference of EGSM900. Note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the

(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. 3.14. UART The module provides three UART: one main UART, one auxiliary UART* and one debug UART. Their features are described below. Table 14: UART Interface Information UART Types Supported Baud Rates (bps) Default Baud Rates (bps) Functions 4800, 9600, 19200, 38400, Main UART 57600, 115200, 230400, 115200 460800, 921600, 1M Debug UART 115200 Auxiliary UART*

115200 115200 115200 Data transmission and AT command communication Output of partial log and GNSS NMEA message Communication with peripherals EG915N_Series_Hardware_Design 44 / 98 LTE Standard Module Series Table 15: Pin Definition of Main UART Pin Name Pin No. I/O Description Comment MAIN_DTR MAIN_RXD MAIN_TXD 30 34 35 DI Main UART data terminal ready DI Main UART receive DO Main UART transmit MAIN_CTS 36 DO Clear to send signal from the module MAIN_RTS 37 DI Request to send signal to the module 1.8 V power domain. If unused, keep them open. Connect to MCUs CTS. 1.8 V power domain. If unused, keep it open. Connect to MCUs RTS. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep them MAIN_DCD MAIN_RI 38 39 DO Main UART data carrier detect DO Main UART ring indication open. Table 16: Pin Definition of Auxiliary UART Pin Name Pin No. I/O Description Comment AUX_RTS*

25 DI Request to send signal to the module AUX_CTS*

26 DO Clear to send signal from the module AUX_TXD*

AUX_RXD*

27 28 DO Auxiliary UART transmit DI Auxiliary UART receive Table 17: Pin Definition of Debug UART Connect to MCUs RTS. 1.8 V power domain. If unused, keep it open. Connect to MCUs CTS. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep them open. Pin Name Pin No. I/O Description Comment DBG_RXD DBG_TXD 22 23 DI DO Debug UART receive Debug UART transmit 1.8 V power domain. Test points must be reserved. The module provides a 1.8 V UART interface. Use a voltage-level translator if the application is equipped EG915N_Series_Hardware_Design 45 / 98 LTE Standard Module Series with a 3.3 V UART interface. A voltage-level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 23: Reference Design with a Voltage-level Translator Visit http://www.ti.com for more information. Another example with transistor circuit is shown as below. For the design of circuits in dotted lines, see that shown in solid lines, but pay attention to the direction of connection. Figure 24: Reference Design with Transistor Circuit EG915N_Series_Hardware_Design 46 / 98 VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTMAIN_RIMAIN_DCDMAIN_RTSMAIN_RXDMAIN_DTRMAIN_CTSMAIN_TXD51K51K0.1 F0.1 FRI_MCUDCD_MCURTS_MCUTXD_MCUDTR_MCUCTS_MCURXD_MCUVDD_MCUVoltage-levelTranslator10K120KMCUTXDRXDVDD_EXT10KVDD_MCU4.7K10KVDD_EXTMAIN_TXDMAIN_RXDMAIN_RTSMAIN_CTSMAIN_DTRMAIN_RIRTSCTSGNDGPIOMAIN_DCDModuleGPIOEINTVDD_EXT4.7KGND1 nF1 nF LTE Standard Module Series NOTE 1. Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. 2. Note that the modules CTS is connected to MCUs CTS, and the modules RTS is connected to MCUs RTS. 3.15. PCM and I2C Interfaces The module provides one Pulse Code Modulation (PCM) interface and one I2C interface. Table 18: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_CLK PCM_SYNC PCM_DIN PCM_DOUT I2C_SCL I2C_SDA 4 5 6 7 40 41 DO PCM clock DO PCM data frame sync DI PCM data input DO PCM data output 1.8 V power domain. If unused, keep them open. OD I2C serial clock An external 1.8 V pull-up resistor is OD I2C serial data If unused, keep it open. required. PCM interface supports short frame mode: module can only be used as master device. The module supports 16-bit linear encoding format. The following figure is the short frame mode timing diagram (PCM_SYNC = 8 kHz, PCM_CLK = 2048 kHz). EG915N_Series_Hardware_Design 47 / 98 LTE Standard Module Series Figure 25: Timing of Short Frame Mode In short frame mode, data is sampled on the falling edge of PCM_CLK, and sent on the rising edge. The falling edge of PCM_SYNC represents the high effective bit. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz, and 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. The default configuration is short frame mode, PCM_CLK = 2048 kHz, PCM_SYNC =8 kHz. The following figure shows a reference design of PCM interface with an external codec IC. Figure 26: Reference Design of PCM and I2C Application with Audio Codec EG915N_Series_Hardware_Design 48 / 98 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125 s12256255PCM_DINMSBLSBMSBPCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8 V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec LTE Standard Module Series NOTE 1. It is recommended to reserve an RC (R = 0 , C = 33 pF) circuit on the PCM traces, especially for PCM_CLK. 2. The module can only be used as a master device in applications related to PCM and I2C interfaces. 3.16. Analog Audio Interfaces The module provides one analog input channel and one analog output channel. Table 19: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MICBIAS MIC_P MIC_N 120 126 119 PO Bias voltage output for microphone AI AI Microphone analog input (+) Microphone analog input (-) SPK_P 121 AO Analog audio differential output (+) SPK_N 122 AO Analog audio differential output (-) If unused, keep them open. The interface can drive 32 earpiece with power rate at 37 mW. It can also be used to drive external power amplifier devices if the output power rate cannot meet the demand. If unused, keep them open. AI channels are differential input channels, which can be applied for input of microphone (usually an electret microphone is used). AO channels are differential output channels, which can be applied for output of earpiece and loudspeaker. You can use the AT+QMIC to adjust the input gain of the microphone, or AT+CLVL to adjust the volume gain output to the handset. The AT+QSIDET is used to set the side tone gain. For details, see document [3]. EG915N_Series_Hardware_Design 49 / 98 LTE Standard Module Series 3.16.1. Audio Interfaces Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) for filtering out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied for filtering out RF interference when the module is transmitting at EGSM900. Without placing this capacitor, TDD noise could be heard. The 10 pF capacitor here is used for filtering out RF interference at DCS1800. Note that the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, you need to discuss with your capacitor vendors to choose the most suitable capacitor for filtering out high-frequency noises. The severity degree of the RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, a suitable capacitor can be selected based on the test results. The filter capacitor on the PCB should be placed as close as possible to the audio device or audio interface, and the wiring should be as short as possible. The filter capacitor should be passed before reaching other connection points. To decrease radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces. Power traces cannot be parallel with and also should be far away from the audio traces. The differential audio traces must be routed according to the differential signal layout rule. 3.16.2. Microphone Interface Design The microphone channel reference design is shown in the following figure. Figure 27: Reference Design for Microphone Interface EG915N_Series_Hardware_Design 50 / 98 MIC_PDifferential layoutModule10 pF33 pF33 pF33 pFGNDGNDElectret MicrophoneGNDGND10 pF10 pFGNDGNDClose to ModuleMIC_NGNDClose to Microphone2.2 F100 nF1.5K1.5K510R510RMICBIASESD protection componentESD protection componentGND100 nF100 nF LTE Standard Module Series NOTE MIC channel is sensitive to ESD, so it is not recommended to remove the ESD protection components used for protecting the MIC. 3.16.3. Earpiece and Loudspeaker Interface Design Figure 28: Reference Design for Earpiece Interface Figure 29: Reference Design of External Audio Amplifier Output For differential input and output audio power amplifiers, please visit http://www.ti.com to obtain the required devices. There are also many audio power amplifiers with the same performance to choose from on the market. EG915N_Series_Hardware_Design 51 / 98 SPK_PSPK_NDifferential layoutModule10 pF GND33 pF 33 pF GND10 pF 10 pF 33 pF 32 Close to EarpieceESD Protection ComponentESD Protection ComponentSPK_PSPK_NDifferential layoutAmplifiercircuitModule10 pF GND33 pF 33 pF GND10 pF 10 pF 33 pF Close to LoudspeakerESD Protection ComponentESD Protection Component LTE Standard Module Series 3.17. ADC Interfaces EG915N-EU provides two analog-to-digital conversion (ADC) interfaces. EG915N-LA and EG915N-EA does not support ADC function. To improve the accuracy of ADC, surround the trace of ADC with ground. Table 20: Pin Definition of EG915N-EU ADC Interfaces Pin Name Pin No. I/O Description Comment ADC1 2 ADC0 24 AI AI General-purpose ADC interface General-purpose ADC interface If unused, keep them open. The voltage value on ADC pins can be read via AT+QADC=<port>:

AT+QADC=0: read the voltage value on ADC0 AT+QADC=1: read the voltage value on ADC1 For more details about these AT commands, see document [2]. Table 21: Characteristics of ADC Interfaces of EG915N-EU Parameter Min. Typ. Max. ADC0 voltage range ADC1 voltage range ADC resolution 0 0

VBAT_BB VBAT_BB 12 Unit V V bits NOTE 1. When the module is not powered by VBAT, the ADC interface cannot be directly connected to any input voltage. 2. If the collected voltage is greater than 4.5 V, it is recommended to use a resistor divider circuit input for the ADC pin. When designing, reserve a 1 nF capacitor at both ends of the grounding divider resistor, which is not mounted by default. EG915N_Series_Hardware_Design 52 / 98 LTE Standard Module Series 3.18. Indication Signal Table 22: Pin Definition of Indication Signal Pin Name Pin No. I/O Description Comment NET_STATUS 21 DO Indicate the modules network activity status STATUS MAIN_RI 20 39 DO Indicate the modules operation status 1.8 V power domain. If unused, keep it open. DO Main UART ring indication 3.18.1. Network Status Indication The network indication pins can drive the network status indicators. The module provides a network status indication pin: NET_STATUS. The following tables describe pin definition and logic level changes in different network status. Table 23: Working State of Network Activity Indicator Pin Name Logic Level Changes Network Status Flicker slowly (200 ms high/1800 ms low) Network searching NET_STATUS Flicker slowly (1800 ms high/200 ms low) Idle Flicker quickly (125 ms high/125 ms low) Data transmission is ongoing Always High (Always on) Voice calling A reference design is shown in the following figure. EG915N_Series_Hardware_Design 53 / 98 LTE Standard Module Series Figure 30: Reference Design of Network Status Indication 3.18.2. STATUS The STATUS pin is an output for modules operation status indication. When the module is turned on normally, the STATUS will output high level. The following figure shows a reference design of STATUS. Figure 31: Reference Design of STATUS 3.18.3. MAIN_RI Send AT+QCFG="risignaltype","physical" so that no matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin. EG915N_Series_Hardware_Design 54 / 98 4.7K47KVBAT2.2KModuleNetwork Indicator4.7K47KVBAT2.2KModule STATUS LTE Standard Module Series NOTE AT+QURCCFG allows you to set the main UART, USB AT port or USB modem port as the URC output port. The USB AT port is the URC output port by default. You can configure MAIN_RI behaviors flexibly. The default behavior of the MAIN_RI is shown as below. Table 24: Default Behaviors of the MAIN_RI State Idle URC Response MAIN_RI keeps at high level MAIN_RI outputs 120 ms low pulse when a new URC returns The indication mode of MAIN_RI can be configured through multiple commands. For example, AT+QCFG="urc/ri/ring" can be used to configure the behavior of MAIN_RI during URC reporting. See document [2] for details. EG915N_Series_Hardware_Design 55 / 98 LTE Standard Module Series 4 RF Specifications Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. The module includes one main antenna interface. The module with built-in GNSS function also has one GNSS antenna interface. The impedance of antenna interface is 50 . 4.1. Cellular Network 4.1.1. Main Antenna Interface & Frequency Bands Table 25: Pin Definition of Main Antenna Pin Name Pin No. I/O Description Comment ANT_MAIN 60 AIO Main antenna interface 50 impedance. Table 26: EG915N-EU Operating Frequency 3GPP Band Transmit EGSM900 880915 Receive 925960 DCS1800 17101785 18051880 LTE-FDD B1 19201980 21102170 LTE-FDD B3 17101785 18051880 LTE-FDD B7 25002570 26202690 LTE-FDD B8 880915 LTE-FDD B20 832862 925960 791821 Unit MHz MHz MHz MHz MHz MHz MHz EG915N_Series_Hardware_Design 56 / 98 LTE Standard Module Series Table 27: EG915N-LA Operating Frequency 3GPP Band Transmit GSM850 EGSM900 DCS1800 PCS1900 824-849 880915 Receive 869-894 925960 17101785 18051880 1850-1910 1930-1990 LTE-FDD B2 1850-1910 1930-1990 LTE-FDD B3 17101785 18051880 LTE-FDD B4 1710-1755 2110-2155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 LTE-FDD B8 880915 LTE-FDD B28 703748 925960 758803 LTE-FDD B66 17101780 21102180 Table 28: EG915N-EA Operating Frequency 3GPP Band Transmit EGSM900 880915 Receive 925960 DCS1800 17101785 18051880 LTE-FDD B1 19201980 21102170 LTE-FDD B3 17101785 18051880 LTE-FDD B7 25002570 26202690 LTE-FDD B8 880915 LTE-FDD B20 832862 LTE-FDD B28 703748 925960 791821 758803 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz EG915N_Series_Hardware_Design 57 / 98 LTE Standard Module Series 4.1.2. Antenna Tuner Control Interfaces*

The module can use GRFC (generic RF control) interfaces to control external antenna tuner. Table 29: Pin Definition of GRFC Interfaces Pin Name Pin No. I/O Description Comment GRFC_1 GRFC_2 76 77 DO DO Generic RF Controller If unused, keep them open. Table 30: EG915N-EU Truth Table of GRFC Interface (Unit: MHz) GRFC_1 Level GRFC_2 Level Frequency Range Bands Low Low High High Low High Low High

832862 880915 19201980 17101785 25002570

LTE B20 LTE B8, EGSM900 LTE B1\B3\B7 DCS1800 Table 31: EG915N-LA Truth Table of GRFC Interface (Unit: MHz) GRFC_1 Level GRFC_2 Level Frequency Range Bands Low Low High Low High Low High High 703748 824849 880915 18501910 17101785 17101755 25002570 LTE B28 LTE B5, GSM850 LTE B8, EGSM900 LTE B2\B3\B4\B7\B66 DCS1800, PCS1900 EG915N_Series_Hardware_Design 58 / 98 LTE Standard Module Series Table 32: EG915N-EA Truth Table of GRFC Interface (Unit: MHz) GRFC_1 Level GRFC_2 Level Frequency Range Bands Low Low High High Low High Low High 703748 832862 880915 19201980 17101785 25002570 LTE B28 LTE B20 LTE B8, EGSM900 LTE B1\B3\B7 DCS1800 4.1.3. Transmitting Power The following tables show the RF output power of the module. Table 33: EG915N-EU RF Transmitting Power Frequency Bands Max. Min. EGSM900 DCS1800 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB LTE-FDD B1/B3/B7/B8/B20 23 dBm 2 dB

< -39 dBm Table 34: EG915N-LA RF Transmitting Power Frequency Bands Max. Min. GSM850 EGSM900 DCS1800 PCS1800 33 dBm 2 dB 5 dBm 5 dB 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB GSM850 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB EG915N_Series_Hardware_Design 59 / 98 LTE Standard Module Series EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB PCS1900 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB LTE-FDD B2/B3/B4/B5/B7/B8/B28/B66 23 dBm 2 dB

< -39 dBm Table 35: EG915N-EA RF Transmitting Power Frequency Bands Max. Min. EGSM900 DCS1800 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB LTE-FDD B1/B3/B7/B8/B20/B28 23 dBm 2 dB

< -39 dBm NOTE In GPRS 4 slots Tx mode, the maximum output power is reduced by 4 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 4.1.4. Receiver Sensitivity The following tables show conducted RF receiver sensitivity of the module. Table 36: EG915N-EU Conducted RF Receiver Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiver Sensitivity (Typ.) EGSM900 DCS1800

-109 dBm

-104 dBm LTE-FDD B1 (10 MHz)

-98 dBm

-102 dBm

-102 dBm

-96.3 dBm EG915N_Series_Hardware_Design 60 / 98 LTE Standard Module Series LTE-FDD B3 (10 MHz)

-98 dBm LTE-FDD B7 (10 MHz)

-97 dBm LTE-FDD B8 (10 MHz)

-98 dBm LTE-FDD B20 (10 MHz)

-98 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm Table 37: EG915N-LA Conducted RF Receiver Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiver Sensitivity (Typ.) GSM850 EGSM900 DCS1800 PCS1900

-108 dBm

-108 dBm

-106 dBm

-106 dBm LTE-FDD B2 (10 MHz)

-99 dBm LTE-FDD B3 (10 MHz)

-98 dBm LTE-FDD B4 (10 MHz)

-98.5 dBm LTE-FDD B5 (10 MHz)

-99.5 dBm LTE-FDD B7 (10 MHz)

-97 dBm LTE-FDD B8 (10 MHz)

-99 dBm LTE-FDD B28 (10 MHz)

-99 dBm LTE-FDD B66 (10 MHz)

-99 dBm

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-94.3 dBm

-93.3 dBm

-9.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-94.8 dBm

-96.5 dBm EG915N_Series_Hardware_Design 61 / 98 LTE Standard Module Series Table 38: EG915N-EA Conducted RF Receiver Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiver Sensitivity (Typ.) EGSM900 DCS1800

-108 dBm

-106 dBm LTE-FDD B1 (10 MHz)

-99 dBm LTE-FDD B3 (10 MHz)

-98 dBm LTE-FDD B7 (10 MHz)

-97 dBm LTE-FDD B8 (10 MHz)

-100 dBm LTE-FDD B20 (10 MHz)

-100.8 dBm LTE-FDD B28 (10 MHz)

-99 dBm

4.1.5. Reference Design

-102 dBm

-102 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-94.8 dBm A reference design of ANT_MAIN antenna is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 32: Reference Design for Main Antenna Interface NOTE Place the -type matching components (R1, C1 and C2) as close to the antenna as possible. EG915N_Series_Hardware_Design 62 / 98 ANT_MAINR1 0 C1ModuleMainAntennaNMC2NM LTE Standard Module Series 4.1.6. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 33: Microstrip Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EG915N_Series_Hardware_Design 63 / 98 LTE Standard Module Series Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [5]. 4.2. GNSS (Optional) GNSS function is optional for the module. Only the module with built-in GNSS function integrates a multi-constellation GNSS receiver. For EG915N series, the built-in GNSS parameters are as follows:

Supports GPS, GLONASS, Galileo, BDS and QZSS positioning system. Supports NMEA 0183 protocol and outputs NMEA message via USB interface by default (refresh rate for positioning: 1 Hz). The modules GNSS function is switched off by default. It must be switched on via A T c o m m a n d . EG915N_Series_Hardware_Design 64 / 98 LTE Standard Module Series For more information about the AT command, see document [2] for details. The following tables list the pin definition and frequency characteristics of the GNSS antenna interface. 4.2.1. Antenna Interface & Frequency Bands The following table lists the pin definition and frequency characteristics of the GNSS antenna interface. Table 39: GNSS Antenna Pin Definition Pin Name Pin No. I/O Description Comment ANT_GNSS 49 AI GNSS antenna interface 50 impedance. If unused, keep it open. Table 40: GNSS Frequency Type GPS Frequency 1575.42 1.023 (L1) GLONASS 1597.51605.8 (L1) Galileo BDS QZSS 1575.42 2.046 (E1) 1561.098 2.046 (B1I) 1575.42 1.023 (L1) 4.2.2. GNSS Performance Table 41: EG915N Series GNSS Performance Parameter Description Acquisition Sensitivity Reacquisition Tracking Typ.

-145

-159

-159 TTFF Cold start @ open sky 27.98 Unit MHz MHz MHz MHz MHz Unit dBm dBm dBm s EG915N_Series_Hardware_Design 65 / 98 LTE Standard Module Series Warm start @ open sky 27.52 Hot start @ open sky Accuracy CEP-50 0.12 3.7 s s m NOTE 1. For more information about GNSS performance, contact Quectel Technical Support. 2. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 3. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 4. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 4.2.3. GNSS Antenna Reference Design 4.2.3.1. Reference Design for GNSS Active Antenna GNSS active antenna connection reference design is shown in the figure below. Figure 37: GNSS Active Antenna Reference Design The power supply voltage range of the external active antenna is 2.84.3 V, and the typical value is 3.3 V. EG915N_Series_Hardware_Design 66 / 98 GNSS AntennaVDDModuleANT_GNSS47 nH0.1 FNMNM100 pF0 10 ESD Protection ComponentC1C2R1C3L1C3C4R1R2 LTE Standard Module Series NOTE 1. You can select an external LDO for power supply according to the active antenna requirements. 2. The junction capacitance of the antenna interface ESD protection component is recommended to be less than 0.05 pF. 4.2.3.2. Reference Design for GNSS Passive Antenna GNSS passive antenna connection reference design is shown in the figure below. Figure 38: GNSS Passive Antenna Reference Design C1, R1 and C2 form the matching circuit, which is recommended to be reserved for adjusting the antenna impedance. Among them, C1 and C2 are not mounted by default, and R1 is only mounted with 0 resistor. The impedance of the RF trace should be controlled at about 50 , and the trace should be as short as possible. NOTE 1. If the module is designed with a passive antenna, then the VDD circuit is not needed. 2. The junction capacitance of the antenna interface ESD protection component is recommended to be less than 0.05 pF. 4.2.4. GNSS Antenna Routing Guidelines In your application design, the following design principles should be followed:

The distance between the GNSS antenna and the main antenna should be as large as possible. Digital signals such as (U)SIM card, USB interface, camera module, SD card and display interface etc. should be far away from the antenna. EG915N_Series_Hardware_Design 67 / 98 ANT_GNSSR1 0 C1ModuleGNSSAntennaNMC2NMESD Protection Component LTE Standard Module Series Sensitive analog signals should be far away from GNSS signal paths, and ground holes should be added for isolation and protection. ANT_GNSS trace maintains 50 characteristic impedance. For the reference design of GNSS antenna interface and antenna precautions, see Chapter 4.2. 4.3. Antenna Design Requirements Table 42: Antenna Requirements Requirements VSWR: 2 Efficiency: > 30 %

Max input power: 50 W Input impedance: 50 Cable insertion loss:

< 1 dB: LB (< 1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) Frequency range:

L1:15591609 MHz Polarization: RHCP or linear VSWR: 2 Passive antenna gain: > 0 dBi Active antenna noise factor: < 1.5 dB Active antenna gain: > -2 dBi Active antenna internal LNA gain: < 17 dB Type GSM/LTE GNSS EG915N_Series_Hardware_Design 68 / 98 LTE Standard Module Series 4.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the Receptacle (Unit: mm) U.FL-LP series connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Specifications of Mated Plugs EG915N_Series_Hardware_Design 69 / 98 LTE Standard Module Series The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://hirose.com. EG915N_Series_Hardware_Design 70 / 98 LTE Standard Module Series 5 Electrical Characteristics and Reliability 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 43: Absolute Maximum Ratings Parameter VBAT_BB/VBAT_RF USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Min.

-0.3

-0.3

Voltage at Digital Pins

-0.3 5.2. Power Supply Ratings Table 44: Power Supply Ratings Max. Unit 6.0 5.5 0.8 2.2 2.3 V V A A V Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and must be kept between the VBAT_RF minimum and maximum 3.4 3.8 4.5 V The actual input voltages values. EG915N_Series_Hardware_Design 71 / 98 LTE Standard Module Series Parameter Description Conditions Min. Typ. Max. Unit Voltage drop during Maximum power control burst transmission level on EGSM900. Peak supply current IVBAT

(during transmission slot) Maximum power control level on EGSM900. USB_VBUS USB connection detect

400 mV 2.0 2.5 A 3.0 5.0 5.25 V 5.3. Power Consumption The power consumption of the module is shown in the table below. Table 45: EG915N-EU Power Consumption Description Conditions Typ. Unit OFF state Power down 26.64 AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB suspend) EGSM900 @ DRX = 9 (USB disconnected) DCS1800 @ DRX = 2 (USB disconnected) Sleep state DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB suspend) DCS1800 @ DRX = 9 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB suspend) LTE-FDD @ PF = 128 (USB disconnected) 0.87 1.82 1.32 1.47 1.16 1.92 1.36 1.53 1.19 1.89 1.44 1.62 1.24 A mA mA mA mA mA mA mA mA mA mA mA mA mA EG915N_Series_Hardware_Design 72 / 98 LTE Standard Module Series Idle state GPRS data transmission EDGE data transmission LTE-FDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB connected) DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB connected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB connected) EGSM900 4DL/1UL @ 32.88 dBm EGSM900 3DL/2UL @ 32.79 dBm EGSM900 2DL/3UL @ 31.52 dBm EGSM900 1DL/4UL @ 29.17 dBm DCS1800 4DL/1UL @ 29.31 dBm DCS1800 3DL/2UL @ 29.24dBm DCS1800 2DL/3UL @ 27.77 dBm DCS1800 1DL/4UL @ 25.98 dBm EGSM900 4DL/1UL @ 26.39 dBm EGSM900 3DL/2UL @ 25.9 dBm EGSM900 2DL/3UL @ 25.15 dBm EGSM900 1DL/4UL @ 22.14 dBm DCS1800 4DL/1UL @ 25.01 dBm DCS1800 3DL/2UL @ 25.09 dBm DCS1800 2DL/3UL @ 23.31 dBm DCS1800 1DL/4UL @ 21.27 dBm LTE data transmission LTE-FDD B1 LTE-FDD B3 1.13 19.34 29.04 19.36 29.02 19.70 29.60 235.41 412.87 511.46 529.85 159.05 263.67 317.38 345.74 144.67 229.64 287.01 310.43 128.51 200.49 256.65 298.11 594.00 607.00 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915N_Series_Hardware_Design 73 / 98 LTE Standard Module Series LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 EGSM900 PCL = 5 @ 32.53 dBm EGSM900 PCL = 12 @ 19.77 dBm EGSM900 PCL = 19 @ 5.37 dBm DCS1800 PCL = 0 @ 29.25 dBm DCS1800 PCL = 7 @ 16.43 dBm DCS1800 PCL = 15 @ 0.28 dBm GSM voice call 658.00 618.00 523.00 225.96 87.22 54.57 151.06 71.09 50.98 mA mA mA mA mA mA mA mA mA Table 46: EG915N-LA Power Consumption Description Conditions Typ. Unit OFF state Power down 24.96 AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB suspend) EGSM900 @ DRX = 9 (USB disconnected) Sleep state DCS1800 @ DRX = 2 (USB disconnected) DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB suspend) DCS1800 @ DRX = 9 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB suspend) 0.90 1.94 1.49 1.65 1.37 2.00 1.53 1.69 1.38 1.87 1.47 1.62 A mA mA mA mA mA mA mA mA mA mA mA mA EG915N_Series_Hardware_Design 74 / 98 LTE Standard Module Series Idle state GPRS data transmission LTE-FDD @ PF = 128 (USB disconnected) LTE-FDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB connected) DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB connected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB connected) GSM850 4DL/1UL @ 32.66 dBm GSM850 3DL/2UL @ 32.54 dBm GSM850 2DL/3UL @ 31.12 dBm GSM850 1DL/4UL @ 28.95 dBm EGSM900 4DL/1UL @ 32.46 dBm EGSM900 3DL/2UL @ 32.37 dBm EGSM900 2DL/3UL @ 31.03 dBm EGSM900 1DL/4UL @ 28.85 dBm DCS1800 4DL/1UL @ 29.66 dBm DCS1800 3DL/2UL @ 29.59 dBm DCS1800 2DL/3UL @ 27.98 dBm DCS1800 1DL/4UL @ 25.88 dBm PCS1900 4DL/1UL @ 29.73 dBm PCS1900 3DL/2UL @ 29.68 dBm PCS1900 2DL/3UL @ 28.26 dBm PCS1900 1DL/4UL @ 26.36 dBm EDGE data GSM850 4DL/1UL @ 25.85 dBm 1.23 1.11 1.94 1.49 1.65 1.37 2.00 1.53 224.00 403.00 502.00 530.00 225.00 406.00 511.00 547.00 162.00 282.00 344.00 379.00 153.00 265.00 331.00 362.00 135.00 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915N_Series_Hardware_Design 75 / 98 LTE Standard Module Series transmission GSM850 3DL/2UL @ 25.8 dBm GSM850 2DL/3UL @ 24.12 dBm GSM850 1DL/4UL @ 22.76 dBm EGSM900 4DL/1UL @ 26.56 dBm EGSM900 3DL/2UL @ 26.37 dBm EGSM900 2DL/3UL @ 24.63 dBm EGSM900 1DL/4UL @ 23.51 dBm DCS1800 4DL/1UL @ 25.50 dBm DCS1800 3DL/2UL @ 25.66 dBm DCS1800 2DL/3UL @ 24.47 dBm DCS1800 1DL/4UL @ 22.13 dBm PCS1900 4DL/1UL @ 27.41 dBm PCS1900 3DL/2UL @ 27.25 dBm PCS1900 2DL/3UL @ 24.11 dBm PCS1900 1DL/4UL @ 21.61 dBm LTE data transmission LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B28 LTE-FDD B66 GSM voice call GSM850 PCL = 5 @ 32.66 dBm GSM850 PCL = 12 @ 19.48 dBm 235.00 281.00 324.00 135.00 236.00 293.00 338.00 123.00 218.00 282.00 328.00 133.00 235.00 278.00 314.00 659.00 697.00 669.00 590.00 709.00 610.00 615.00 573.00 234.00 95.00 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915N_Series_Hardware_Design 76 / 98 LTE Standard Module Series GSM850 PCL = 19 @ 5.10 dBm EGSM900 PCL = 5 @ 32.61 dBm EGSM900 PCL = 12 @ 19.30 dBm EGSM900 PCL = 19 @ 4.13 dBm DCS1800 PCL = 0 @ 29.43 dBm DCS1800 PCL = 7 @ 16.72 dBm DCS1800 PCL = 15 @ -0.02 dBm PCS1900 PCL = 0 @ 29.63 dBm PCS1900 PCL = 7 @ 16.74 dBm PCS1900 PCL = 15 @0.96 dBm 63.00 242.00 93.00 61.00 159.00 80.00 58.00 159.00 78.00 59.00 mA mA mA mA mA mA mA mA mA mA Table 47: EG915N-EA Power Consumption Description Conditions Typ. Unit OFF state Power down 23.65 AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB suspend) EGSM900 @ DRX = 9 (USB disconnected) Sleep state DCS1800 @ DRX = 2 (USB disconnected) DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB suspend) DCS1800 @ DRX = 9 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) LTE-FDD @ PF = 64 (USB disconnected) 0.92 1.92 1.46 1.66 1.35 1.96 1.50 1.64 1.35 1.88 1.44 A mA mA mA mA mA mA mA mA mA mA mA EG915N_Series_Hardware_Design 77 / 98 LTE Standard Module Series LTE-FDD @ PF = 64 (USB suspend) LTE-FDD @ PF = 128 (USB disconnected) LTE-FDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB connected) DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB connected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB connected) EGSM900 4DL/1UL @ 32.99 dBm EGSM900 3DL/2UL @ 32.45 dBm EGSM900 2DL/3UL @ 30.79 dBm EGSM900 1DL/4UL @ 28.64 dBm DCS1800 4DL/1UL @ 28.75 dBm DCS1800 3DL/2UL @ 29.29 dBm DCS1800 2DL/3UL @ 27.66 dBm DCS1800 1DL/4UL @ 24.73 dBm EGSM900 4DL/1UL @ 25.88 dBm EGSM900 3DL/2UL @ 25.62 dBm EGSM900 2DL/3UL @ 24.25 dBm EGSM900 1DL/4UL @ 22.92 dBm DCS1800 4DL/1UL @ 25.27 dBm DCS1800 3DL/2UL @ 25.11 dBm DCS1800 2DL/3UL @ 23.50 dBm DCS1800 1DL/4UL @ 22.33 dBm 1.60 1.22 1.10 16.69 29.61 16.73 29.59 16.52 29.39 232.00 411.00 513.00 557.00 170.00 290.00 349.00 376.00 127 216 276 319 121 207 266 319 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state GPRS data transmission EDGE data transmission EG915N_Series_Hardware_Design 78 / 98 LTE Standard Module Series LTE-FDD B1 LTE-FDD B3 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 EGSM900 PCL = 5 @ 32.53 dBm EGSM900 PCL = 12 @ 19.40 dBm EGSM900 PCL = 19 @ 4.05 dBm DCS1800 PCL = 0 @ 29.16 dBm DCS1800 PCL = 7 @ 16.27 dBm DCS1800 PCL = 15 @ -0.72 dBm LTE data transmission GSM voice call NOTE 682.00 743.00 737.00 611.00 555.00 534.00 244.00 101.00 68.00 180.00 88.00 66.00 mA mA mA mA mA mA mA mA mA mA mA mA For more information about power consumption, contact Quectel Technical Support for the power consumption test report of the module. 5.4. Digital I/O Characteristics Table 48: 1.8 V Digital I/O Requirements Parameter Description Min. Max. Unit VIH VIL VOH VOL Input high voltage 0.7 VDDIO VDDIO + 0.2 Input low voltage

-0.3 0.3 VDDIO Output high voltage VDDIO - 0.2

Output low voltage

0.2 V V V V EG915N_Series_Hardware_Design 79 / 98 LTE Standard Module Series Table 49: (U)SIM 1.8 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 1.62 Max. 1.98 VIH VIL VOH VOL Input high voltage 0.7 USIM_VDD USIM_VDD Input low voltage 0 0.2 USIM_VDD Output high voltage 0.7 USIM_VDD USIM_VDD Output low voltage 0 0.15 USIM_VDD V Unit V V V V Table 50: (U)SIM 3.0 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.7 Max. 3.3 VIH VIL VOH VOL Input high voltage 0.7 USIM_VDD USIM_VDD Input low voltage 0 0.15 USIM_VDD Output high voltage 0.7 USIM_VDD USIM_VDD Output low voltage 0 0.15 USIM_VDD Unit V V V V V 5.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. The following table shows the module electrostatics discharge characteristics. Table 51: Electrostatics Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) Tested Interfaces Contact Discharge Air Discharge VBAT, GND 5 10 Unit kV EG915N_Series_Hardware_Design 80 / 98 LTE Standard Module Series All Antenna Interfaces 4 Other Interfaces 0.5 8 1 kV kV 5.6. Operating and Storage Temperatures Table 52: Operating and Storage Temperatures Parameter Min. Operating Temperature Range 4

-35 Extended Operation Range 5

-40 Storage Temperature Range

-40 Typ.

+25

Max. Unit

+75

+85

+90 C C C 4 Within operating temperature range, the module is 3GPP compliant. 5 Within extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, emergency call, etc, without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915N_Series_Hardware_Design 81 / 98 LTE Standard Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 42: Top and Side Dimensions EG915N_Series_Hardware_Design 82 / 98 LTE Standard Module Series Figure 43: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. EG915N_Series_Hardware_Design 83 / 98 LTE Standard Module Series 6.2. Recommended Footprint Figure 44: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG915N_Series_Hardware_Design 84 / 98 LTE Standard Module Series 6.3. Top and Bottom Views Figure 45: Top View and Bottom View of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915N_Series_Hardware_Design 85 / 98 LTE Standard Module Series 7 Storage, Manufacturing and Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 6 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a drying cabinet. 6 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EG915N_Series_Hardware_Design 86 / 98 LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [6]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 46: Recommended Reflow Soldering Thermal Profile EG915N_Series_Hardware_Design 87 / 98 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s LTE Standard Module Series Table 53: Recommended Thermal Profile Parameters Factor Soak Zone Ramp-to-soak slope Recommended Value 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirement. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. 4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [6]. EG915N_Series_Hardware_Design 88 / 98 LTE Standard Module Series 7.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

Figure 47: Carrier Tape Dimension Drawing Table 54: Carrier Tape Dimension Table (Unit: mm) P 32 T A0 0.35 20.2 B0 24 K0 K1 F E 3.15 6.65 20.2 1.75 W 44 EG915N_Series_Hardware_Design 89 / 98 LTE Standard Module Series 7.3.2. Plastic Reel Figure 48: Plastic Reel Dimension Drawing Table 55: Plastic Reel Dimension Table (Unit: mm) D1 330 7.3.3. Mounting Direction D2 100 W 44.5 Figure 49: Mounting Direction EG915N_Series_Hardware_Design 90 / 98 LTE Standard Module Series 7.3.4. Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 1000 modules. Figure 50: Packaging Process EG915N_Series_Hardware_Design 91 / 98 LTE Standard Module Series 8 Appendix References Table 56: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EC200x&EG912Y&EG915N_Series_AT_Commands_Manual

[3] Quectel_EC200x&EG912Y&EG915N_Series_Audio_Application_Note

[4] Quectel_EC200N-CN&EC800M-CN&EG915N_Series_GNSS_Application_Note

[5] Quectel_RF_Layout_Application_Note

[6] Quectel_Module_SMT_Application_Note Table 57: Terms and Abbreviations Abbreviation Description 3GPP 3rd Generation Partnership Project ADC AMR BB BDS bps CEP CHAP CMUX Analog-to-Digital Converter Adaptive Multi-rate Baseband BeiDou Navigation Satellite System Bits Per Second Circular Error Probable Challenge Handshake Authentication Protocol Connection MUX EG915N_Series_Hardware_Design 92 / 98 LTE Standard Module Series CS CTS DCE DCS Coding Scheme Clear To Send Data Communications Equipment Data Coding Scheme DFOTA Delta Firmware Upgrade Over-The-Air DL DTE DTR EDGE EFR EGSM EMI ESD ESR ETSI EVB FDD FILE FR FTP FTPS Galileo Downlink Data Terminal Equipment Data Terminal Ready Enhanced Data Rates for GSM Evolution Enhanced Full Rate Enhanced GSM Electromagnetic Interference Electrostatic Discharge Equivalent Series Resistance European Telecommunications Standards Institute Evaluation Board Frequency Division Duplex File Protocol Full Rate File Transfer Protocol FTP over SSL Galileo Satellite Navigation System (EU) GLONASS Global Navigation Satellite System (Russia) GMSK GNSS Gaussian Minimum Shift Keying Global Navigation Satellite System EG915N_Series_Hardware_Design 93 / 98 LTE Standard Module Series GPIO GPRS GPS GSM HR HTTP HTTPS General-Purpose Input/Output General Packet Radio Service Global Positioning System Global System for Mobile Communications Half Rate Hyper Text Transfer Protocol Hyper Text Transfer Protocol over Secure Socket Layer IMT-2000 International Mobile Telecommunications 2000 IOmax Maximum Output Load Current I2C LDO LED LGA LNA LTE M2M Mbps MCS ME MIC MLCC MMS MO MQTT MSL Inter-Integrated Circuit Low Dropout Regulator Light Emitting Diode Land Grid Array Low-Noise Amplifier Long Term Evolution Machine to Machine Megabits per second Modulation and Coding Scheme Mobile Equipment Microphone Multi-layer Ceramic Capacitor Multimedia Messaging Service Mobile Origination Message Queuing Telemetry Transport Moisture Sensitivity Level EG915N_Series_Hardware_Design 94 / 98 LTE Standard Module Series MT NITZ NMEA NTP PA PAM PAP PC PCB PCM PDA PDU PF PING PMIC POS PPP PPS PSK QZSS RAM RHCP RF RoHS RTS Mobile Terminating Network Identity and Time Zone

(National Marine Electronics Association)0183 Interface Standard Network Time Protocol Power Amplifier Power Amplifier Module Password Authentication Protocol Personal Computer Printed Circuit Board Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Paging Frame Packet Internet Groper Power Management IC Point of Sale Point-to-Point Protocol Pulse Per Second Phase Shift Keying Quasi-Zenith Satellite System Random Access Memory Right Hand Circular Polarization Radio Frequency Restriction of Hazardous Substances Request to Send EG915N_Series_Hardware_Design 95 / 98 LTE Standard Module Series SAW SBAS SIM SIMO SMD SMS SMT SMTP SMTPS SSL TCP TDD TTFF TVS UART UDP UL UMTS URC USB

(U)SIM VBAT VIH VIL Vmax Surface Acoustic Wave Satellite-Based Augmentation System Subscriber Identity Module Single Input Multiple Output Surface Mount Device Short Message Service Surface Mount Technology Simple Mail Transfer Protocol Simple Mail Transfer Protocol Secure Secure Sockets Layer Transmission Control Protocol Time Division Duplexing Time to First Fix Transient Voltage Suppressor Universal Asynchronous Receiver &Transmitter User Datagram Protocol Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus

(Universal) Subscriber Identity Module Voltage at Battery (Pin) High-level Input Voltage Low-level Input Voltage Maximum Voltage EG915N_Series_Hardware_Design 96 / 98 LTE Standard Module Series Vmin Vnom VOH VOL VSWR Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202311EG915NLA 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

radiation, maximum antenna gain

(including cable loss) must not exceed:

FCC Max Antenna GaindBi Operating Band GSM850 GSM1900 LTE B2 LTE B4 LTE B5 LTE B7 LTE B66 5.60 2.00 8.00 5.00 9.41 8.00 5.00 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. EG915N_Series_Hardware_Design 97 / 98 LTE Standard Module Series Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR202311EG915NLA or Contains FCC ID: XMR202311EG915NLA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. This device complies with Part 22(H), Part 24(E),Part 27 of the FCC Rules. The FCC ID for this device is XMR202311EG915NLA. Antenna change notice If you desire to increase antenna gain and either change antenna type or use same antenna type certified , a Class Il permissive change application is required to be filed by us , or you ( host manufacturer ) can take responsibility through the change in FCC ID ( new application ) procedurefollowed by a Class Il permissive change application. Information on test modes and additional testing requirements The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install the module .The module is limited to installation in mobile applications , a separate approval is required for all other operating configurations , including portable configurations with respect to Part 2.1093 and different antenna configurations Test software to access different test modes : Communication Tester Testing item , frequencies , transmit power can be selected following the test script instructions. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/

warning as show in this manual. EG915N_Series_Hardware_Design 98 / 98

Label Label location Remark: Its hard to put FCC statement on the product due to devices irregular appearance. FCC statement will be placed in the user manual which the device is marketed.

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: LTE Module Type designation: EG915N-LA Trademark:

FCC ID: XMR202311EG915NLA Quectel on our behalf. Date:

City:

Name:

Email:

2023/11/08.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Date: 2023/11/08 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR202311EG915NLA To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, Date:

Name:

Email:

2023/11/08.. Jean Hu .. jean.hu@quectel.com.... Signature:

RF_734_02 04 April 16 Quectel Wireless Solutions Co., Ltd. Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR202311EG915NLA Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, the modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the SCH.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, the requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, please refer to the setup photo exhibition for the stand-alone configuration Yes, the module will be label with its own FCC ID, and the instruction on the labelling rule of the end product has been stated in the user manual of this module. Please refer to the label and user manual exhibition. Yes, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):

Date:

City:

Name:

Email:

2023/11/08.. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

SGS North America Inc. 620 Old Peachtree Road SUITE 100 Suwanee, Georgia 30024 United States Applicant Declaration Applicant Legal Business Name Quectel Wireless Solutions Co., Ltd. Address Grantee Code FCC ID Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 XMR XMR202311EG915NLA Authorized Contact Name Jean Hu Contact Email Contact Phone jean.hu@quectel.com

+8602150086326 I, the undersigned, certify that I am an authorized signatory for the Applicant and therefore declare;

a) b) in accordance with 47CFR2.911(d), all of the statements herein and the exhibits attached hereto are true and correct to the best of my knowledge and belief. in accepting a Grant of Equipment Authorization issued by a TCB, under the authority of the FCC, as a result of the representations made in this application, the Applicant is responsible for:

labeling the equipment with the exact FCC ID as specified in this application,

(1)

(2) compliance statement labeling pursuant to the applicable rules,

(3) compliance of the equipment with the applicable technical rules, c) d) e) if the Applicant is not the actual manufacturer of the equipment, appropriate arrangements have been made with the manufacturer to ensure that production units of this equipment will continue to comply with the FCCs technical requirements. in accordance with 47 CFR 2.909 and KDB394321, the Applicant has read, understood and agrees to accept that they are the responsible party and agree to abide by their responsibilities as specified under 47 CFR 2.909 and KDB394321. in accordance with ISO 17065, FCC KDB641163, FCC KDB610077, KDB394321 and RSP-100, the Applicant has read, understood, accepts and agrees to abide by the post market surveillance requirements.

(1)

(2)

(3) the Applicant understands, accepts and agrees that a sample may be requested for surveillance testing. the Applicant shall make provisions to always have a production sample available upon request by SGS, FCC and/or ISED. the Applicant shall, upon request by SGS, at the Applicants expense, provide a production sample of the requested product to SGS, FCC and/or ISED as instructed. The sample shall include all support devices, cables, software, accessories or other hardware or software required for evaluation, review, certification and audit surveillance of products certified by SGS. f) g) neither the Applicant nor any party to the application is subject to a denial of Federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862 because of a conviction for possession or distribution of a controlled substance. See 47CFR 1.2002(b) for the definition of a party for these purposes. the Applicant has read, understood, accepts and agrees to abide by the SGS North America, Inc.(TCB) terms and conditions. Link to CFRs: https://www.fcc.gov/wireless/bureau-divisions/technologies-systems-and-innovation-division/rules-regulations-title-47 Link to KDBs: https://apps.fcc.gov/oetcf/kdb/index.cfm Link to RSP-100: https://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf01130.html Link to the Covered List: Covered List

[Quectel Wireless Solutions Co., Ltd.] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules.

[Quectel Wireless Solutions Co., Ltd.] (the applicant) certifies that, as of the date of the filing of the application, the applicant [is not]

identified on the Covered list, established pursuant to 1.50002, as an entity producing covered equipment. Date:2023/11/08 Applicant Signature:

Print Name:

Jean Hu Title:

Certification Manager

*NOTE: This declaration cannot be signed by an Agent, it shall be signed by an authorized person listed in the FCC database QSF27-14-04 Rev 1.0 Rev. Feb 6, 2023 Page 1 of 1 Original Issue: Jan. 4, 2021