FCC ID: XMR20SC200RWF Smart Module

 

SC200R Series Hardware Design Smart Module Series Version: 1.1 Date: 2020-09-09 Status: Released www.quectel.com Smart Module Series SC200R Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm or email to support@quectel.com. GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. DISCLAIMER WHILE QUECTEL HAS MADE EFFORTS TO ENSURE THAT THE FUNCTIONS AND FEATURES UNDER DEVELOPMENT ARE FREE FROM ERRORS, IT IS POSSIBLE THAT THESE FUNCTIONS AND FEATURES COULD CONTAIN ERRORS, INACCURACIES AND OMISSIONS. UNLESS OTHERWISE PROVIDED BY VALID AGREEMENT, QUECTEL MAKES NO WARRANTIES OF ANY KIND, IMPLIED OR EXPRESS, WITH RESPECT TO THE USE OF FEATURES AND FUNCTIONS UNDER DEVELOPMENT. TO THE MAXIMUM EXTENT PERMITTED BY LAW, QUECTEL EXCLUDES ALL LIABILITY FOR ANY LOSS OR DAMAGE SUFFERED IN CONNECTION WITH THE USE OF THE FUNCTIONS AND FEATURES UNDER DEVELOPMENT, REGARDLESS OF WHETHER SUCH LOSS OR DAMAGE MAY HAVE BEEN FORESEEABLE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCING, DISSEMINATING AND EDITING THIS DOCUMENT AS WELL AS USING THE CONTENT WITHOUT PERMISSION ARE FORBIDDEN. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. SC200R_Series_Hardware_Design 1 / 125 Smart Module Series SC200R Series Hardware Design About the Document Revision History Version Date Author Description 1.0 2019-12-30 Arsene TONG Initial 1.1 2020-09-09 Jasper LAI/

Jamie SHI

(Chapter 4.2.1). 6. Added GNSS performance data (Chapter 5.1). 7. Added current consumption of SC200R-CE/-NA 1. Updated SC200R-EM frequency bands (Chapter 2.1/6.1):

Added B4 in LTE-FDD Deleted B39 in LTE-TDD Added B4 in WCDMA 2.1/2.2/5/6.3). 2. Added Galileo in supported GNSS

(Chapter 3. Added a note for the wakeup of LDO6_1V8 during sleep mode (Chapter 3.3). 4. Updated Wi-Fi output power and added Wi-Fi receiving sensitivity (Chapter 4.1.1). 5. Added BT transmitting and receiving performance

(Chapter 7.4). 7.5).

(Chapter 7.6). 8. Added RF output power of SC200R-NA (Chapter 9. Added RF receiving sensitivity of SC200R-CE/-NA 10. Updated the maintenance clearance between the module and other components to at least 5 mm

(Chapter 8.2). 11. Updated general description of storage, manufacturing and soldering (Chapter 9.1/9.2). 12. Added package weight of the module (Chapter 9.3). SC200R_Series_Hardware_Design 2 / 125 Smart Module Series SC200R Series Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 6 Figure Index ................................................................................................................................................. 8 1 Introduction ........................................................................................................................................ 10 1.1. Safety Information.................................................................................................................... 12 2 Product Concept ................................................................................................................................ 13 2.1. General Description ................................................................................................................. 13 Key Features ........................................................................................................................... 16 2.2. 2.3. Functional Diagram ................................................................................................................. 19 Evaluation Board ..................................................................................................................... 19 2.4. 3.5. 3 Application Interfaces ....................................................................................................................... 20 3.1. General Description ................................................................................................................. 20 Pin Assignment ........................................................................................................................ 21 3.2. 3.3. Pin Description ......................................................................................................................... 22 Power Supply ........................................................................................................................... 35 3.4. 3.4.1. Power Supply Pins ......................................................................................................... 35 3.4.2. Decrease Voltage Drop .................................................................................................. 35 3.4.3. Reference Design for Power Supply .............................................................................. 37 Turn on and off Scenarios ....................................................................................................... 38 3.5.1. Turn on the Module Using PWRKEY ............................................................................. 38 3.5.2. Turn off the Module ........................................................................................................ 40 VRTC Interface ........................................................................................................................ 40 3.6. Power Output ........................................................................................................................... 41 3.7. Battery Charging and Management ........................................................................................ 42 3.8. 3.9. USB Interface .......................................................................................................................... 43 3.10. UART Interfaces ...................................................................................................................... 46 3.11.

(U)SIM Interfaces..................................................................................................................... 47 3.12. SD Card Interface .................................................................................................................... 50 3.13. GPIO Interfaces ....................................................................................................................... 52 3.14. I2C Interfaces .......................................................................................................................... 55 3.15. SPI Interfaces .......................................................................................................................... 55 3.16. ADC Interface .......................................................................................................................... 56 3.17. Motor Drive Interface ............................................................................................................... 56 3.18. LCM Interface .......................................................................................................................... 57 3.19. Touch Panel Interface .............................................................................................................. 59 3.20. Camera Interfaces ................................................................................................................... 61 3.20.1. Design Considerations ................................................................................................... 64 3.21. Sensor Interfaces..................................................................................................................... 66 3.22. Audio Interfaces ....................................................................................................................... 66 SC200R_Series_Hardware_Design 3 / 125 Smart Module Series SC200R Series Hardware Design 3.22.1. Reference Circuit Design for Microphone Interfaces ..................................................... 67 3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 68 3.22.3. Reference Circuit Design for Headphone Interface ....................................................... 69 3.22.4. Reference Circuit Design for Loudspeaker Interface..................................................... 69 3.22.5. Design Considerations for Audio Interfaces .................................................................. 69 3.23. Emergency Download Interface .............................................................................................. 70 4 Wi-Fi and BT ....................................................................................................................................... 71 4.1. Wi-Fi Overview ........................................................................................................................ 71 4.1.1. Wi-Fi Performance ......................................................................................................... 71 BT Overview ............................................................................................................................ 73 4.2.1. BT Performance ............................................................................................................. 74 4.2. 5 GNSS ................................................................................................................................................... 75 5.1. GNSS Performance ................................................................................................................. 75 5.2. GNSS RF Design Guidelines .................................................................................................. 76 6 Antenna Interfaces ............................................................................................................................. 77 6.1. Main/Rx-diversity Antenna Interfaces ...................................................................................... 77 6.1.1. Reference Design for Main and Rx-diversity Antenna Interfaces .................................. 81 6.2. Wi-Fi/BT Antenna Interface ..................................................................................................... 81 6.3. GNSS Antenna Interface ......................................................................................................... 82 6.3.1. Recommended Circuit for Passive Antenna .................................................................. 83 6.3.2. Recommended Circuit for Active Antenna ..................................................................... 84 6.4. Reference Design for RF Layout ............................................................................................. 84 Antenna Installation ................................................................................................................. 86 6.5. 6.5.1. Antenna Requirements .................................................................................................. 86 6.5.2. Recommended RF Connector for Antenna Installation ................................................. 87 7 Electrical, Reliability and Radio Characteristics ............................................................................ 89 7.1. Absolute Maximum Ratings ..................................................................................................... 89 7.2. Power Supply Ratings ............................................................................................................. 89 7.3. Operating and Storage Temperatures ..................................................................................... 90 7.4. Current Consumption .............................................................................................................. 91 7.5. RF Output Power ................................................................................................................... 100 7.6. RF Receiving Sensitivity ........................................................................................................ 103 7.7. Electrostatic Discharge .......................................................................................................... 107 8 Mechanical Dimensions .................................................................................................................. 108 8.1. Mechanical Dimensions of the Module.................................................................................. 108 8.2. Recommended Footprint ....................................................................................................... 110 8.3. Top and Bottom Views of the Module .....................................................................................111 9 Storage, Manufacturing and Packaging ........................................................................................ 112 9.1. Storage................................................................................................................................... 112 9.2. Manufacturing and Soldering ................................................................................................ 113 Packaging .............................................................................................................................. 115 9.3. SC200R_Series_Hardware_Design 4 / 125 Smart Module Series SC200R Series Hardware Design 10 Appendix A References ................................................................................................................... 117 11 Appendix B GPRS Coding Schemes ............................................................................................. 122 12 Appendix C GPRS Multi-slot Classes ............................................................................................ 123 13 Appendix D EDGE Modulation and Coding Schemes ................................................................. 125 SC200R_Series_Hardware_Design 5 / 125 Smart Module Series SC200R Series Hardware Design Table Index Table 1: SC200R-CE Frequency Bands .................................................................................................... 13 Table 2: SC200R-EM* Frequency Bands .................................................................................................. 14 Table 3: SC200R-NA Frequency Bands..................................................................................................... 14 Table 4: SC200R-JP* Frequency Bands .................................................................................................... 15 Table 5: SC200R-WF* Frequency Bands .................................................................................................. 15 Table 6: Key Features ................................................................................................................................ 16 Table 7: I/O Parameters Definition ............................................................................................................. 22 Table 8: Pin Description ............................................................................................................................. 22 Table 9: Power Description ........................................................................................................................ 41 Table 10: Pin Definition of Charging Interface ........................................................................................... 42 Table 11: Pin Definition of USB Interface ................................................................................................... 44 Table 12: USB Trace Length Inside the Module ........................................................................................ 45 Table 13: Pin Definition of UART Interfaces ............................................................................................... 46 Table 14: Pin Definition of (U)SIM Interfaces ............................................................................................. 47 Table 15: Pin Definition of SD Card Interface ............................................................................................ 50 Table 16: SD Card Trace Length Inside the Module .................................................................................. 51 Table 17: Pin Definition of GPIO Interfaces ............................................................................................... 52 Table 18: Pin Definition of I2C Interfaces ................................................................................................... 55 Table 19: Pin Definition of SPI Interfaces .................................................................................................. 55 Table 20: Pin Definition of ADC Interface ................................................................................................... 56 Table 21: Pin Definition of Motor Drive Interface ....................................................................................... 56 Table 22: Pin Definition of LCM Interface .................................................................................................. 57 Table 23: Pin Definition of Touch Panel Interface ...................................................................................... 59 Table 24: Pin Definition of Camera Interface ............................................................................................. 61 Table 25: MIPI Trace Length Inside the Module ........................................................................................ 64 Table 26: Pin Definition of Sensor Interfaces ............................................................................................. 66 Table 27: Pin Definition of Audio Interfaces ............................................................................................... 66 Table 28: Wi-Fi Transmitting Performance ................................................................................................. 71 Table 29: Wi-Fi Receiving Performance ..................................................................................................... 72 Table 30: BT Data Rate and Version .......................................................................................................... 73 Table 31: BT Transmitting and Receiving Performance............................................................................. 74 Table 32: GNSS Performance .................................................................................................................... 75 Table 33: Pin Definition of Main/Rx-diversity Antenna Interfaces .............................................................. 77 Table 34: SC200R-CE Operating Frequencies .......................................................................................... 77 Table 35: SC200R-EM* Operating Frequencies ........................................................................................ 78 Table 36: SC200R-NA Operating Frequencies .......................................................................................... 79 Table 37: SC200R-JP* Operating Frequencies ......................................................................................... 80 Table 38: Pin Definition of Wi-Fi/BT Antenna Interface .............................................................................. 81 Table 39: Wi-Fi/BT Frequency .................................................................................................................... 82 Table 40: Pin Definition of GNSS Antenna Interface ................................................................................. 82 Table 41: GNSS Frequency ....................................................................................................................... 83 SC200R_Series_Hardware_Design 6 / 125 Smart Module Series SC200R Series Hardware Design Table 42: Antenna Requirements ............................................................................................................... 86 Table 43: Absolute Maximum Ratings ........................................................................................................ 89 Table 44: Power Supply Ratings ................................................................................................................ 89 Table 45: Operating and Storage Temperatures ........................................................................................ 90 Table 46: SC200R-CE Current Consumption ............................................................................................ 91 Table 47: SC200R-EM* Current Consumption .......................................................................................... 93 Table 48: SC200R-NA Current Consumption ............................................................................................ 97 Table 49: SC200R-JP* Current Consumption ............................................................................................ 98 Table 50: SC200R-CE RF Output Power ................................................................................................. 100 Table 51: SC200R-EM* RF Output Power ............................................................................................... 100 Table 52: SC200R-NA RF Output Power ................................................................................................. 101 Table 53: SC200R-JP* RF Output Power ................................................................................................ 102 Table 54: SC200R-CE RF Receiving Sensitivity ...................................................................................... 103 Table 55: SC200R-EM* RF Receiving Sensitivity .................................................................................... 104 Table 56: SC200R-NA RF Receiving Sensitivity ...................................................................................... 105 Table 57: SC200R-JP* RF Receiving Sensitivity ..................................................................................... 106 Table 58: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) .................................................... 107 Table 59: Recommended Thermal Profile Parameters ............................................................................ 114 Table 60: Reel Packaging ........................................................................................................................ 116 Table 61: Related Documents .................................................................................................................. 117 Table 62: Terms and Abbreviations .......................................................................................................... 117 Table 63: Description of Different Coding Schemes ................................................................................ 122 Table 64: GPRS Multi-slot Classes .......................................................................................................... 123 Table 65: EDGE Modulation and Coding Schemes ................................................................................. 125 SC200R_Series_Hardware_Design 7 / 125 Smart Module Series SC200R Series Hardware Design Figure Index Figure 1: Functional Diagram ..................................................................................................................... 19 Figure 2: Pin Assignment (Top View) ......................................................................................................... 21 Figure 3: Voltage Drop Sample .................................................................................................................. 35 Figure 4: Star Structure of the Power Supply ............................................................................................. 36 Figure 5: Reference Circuit of Power Supply ............................................................................................. 37 Figure 6: Turn on the Module Using Driving Circuit ................................................................................... 38 Figure 7: Turn on the Module Using Keystroke ......................................................................................... 38 Figure 8: Timing of Turning on the Module ................................................................................................ 39 Figure 9: Timing of Turning off the Module ................................................................................................ 40 Figure 10: RTC Powered by Coin Cell ....................................................................................................... 40 Figure 11: Reference Design for Battery Charging Circuit ........................................................................ 43 Figure 12: USB Interface Reference Design (OTG Not Supported) .......................................................... 44 Figure 13: USB Interface Reference Design (OTG Supported) ................................................................ 45 Figure 14: Reference Circuit with Level Translator Chip (for UART5) ....................................................... 46 Figure 15: RS-232 Level Match Circuit (for UART5) ................................................................................. 47 Figure 16: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 48 Figure 17: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 49 Figure 18: Reference Circuit for SD Card Interface ................................................................................... 50 Figure 19: Reference Circuit for Motor Connection ................................................................................... 57 Figure 20: Reference Circuit Design for LCM Interface ............................................................................. 58 Figure 21: Reference Design for External Backlight Driving Circuit .......................................................... 59 Figure 22: Reference Circuit Design for TP Interface ................................................................................ 60 Figure 23: Reference Circuit Design for 3-Camera Applications ............................................................... 63 Figure 24: Reference Circuit Design for ECM Microphone Interface ........................................................ 67 Figure 25: Reference Circuit Design for MEMS Microphone Interface ..................................................... 68 Figure 26: Reference Circuit Design for Earpiece Interface ...................................................................... 68 Figure 27: Reference Circuit Design for Headphone Interface .................................................................. 69 Figure 28: Reference Circuit Design for Loudspeaker Interface ............................................................... 69 Figure 29: Reference Circuit Design for Emergency Download Interface ................................................. 70 Figure 30: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces ................................. 81 Figure 31: Reference Circuit Design for Wi-Fi/BT Antenna ....................................................................... 82 Figure 32: Reference Circuit Design for GNSS Passive Antenna ............................................................. 83 Figure 33: Reference Circuit Design for GNSS Active Antenna ................................................................ 84 Figure 34: Microstrip Design on a 2-layer PCB ......................................................................................... 84 Figure 35: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 85 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 85 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 85 Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 87 Figure 39: Mechanicals of U.FL-LP Connectors ........................................................................................ 88 Figure 40: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 88 Figure 41: Top and Side Dimensions ....................................................................................................... 108 SC200R_Series_Hardware_Design 8 / 125 Smart Module Series SC200R Series Hardware Design Figure 42: Bottom Dimensions (Bottom View) ......................................................................................... 109 Figure 43: Recommended Footprint (Top View) ...................................................................................... 110 Figure 44: Top View of the Module ............................................................................................................ 111 Figure 45: Bottom View of the Module ...................................................................................................... 111 Figure 46: Recommended Reflow Soldering Thermal Profile ................................................................. 114 Figure 47: Tape Dimensions (Unit: mm) .................................................................................................. 115 Figure 48: Reel Dimensions (Unit: mm) ................................................................................................... 116 SC200R_Series_Hardware_Design 9 / 125 Smart Module Series SC200R Series Hardware Design 1 Introduction This document, describing SC200R-WF module and its air and hardware interfaces connected to your applications, informs you of the interface specifications, electrical and mechanical details, as well as other related information of the module. With the application notes and user guides provided separately, you can easily use SC200R-WF to design and set up mobile applications. Federal Communications Commission (FCC) Declaration of Conformity FCC Caution:

Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. this device must accept any interference received, including interference that may cause un-desired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equip-ment does cause harmful interference to radio or television reception, which can be determined by turning the equipment o and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important NoteThis radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other ra-dio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the mod-ular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, SC200R_Series_Hardware_Design 10 / 125 Smart Module Series SC200R Series Hardware Design including: This product must be in-stalled and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID: XMR20SC200RWF.The final end product must be labeled in a visible area with the following: Contains Transmitter Mod-ule FCC ID: XMR20SC200RWF This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20cm is main-tained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance require-ments required with this module installed. Declaration of Conformity European notice. Canada Regulations:

This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsentappareilestconforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitationestautorise aux deux conditions suivantes :

(1) lappareil ne doit pas produire de brouillage;

(2) lutilisateur de lappareildoit accepter tout brouillageradiolectriquesubi, mmesi le brouillageest susceptible dencompromettre le fonctionnement. Caution A label with the following statements must be attached to the host end product: This device contains IC:

10224A-20SC200RWF. The manual provides guidance to the host manufacturer will be included in the documentation that will be provided to the OEM. The module is limited to installation in mobile or fixed applications. The separate approval is required for all other operating configurations, including portable configurations and different antenna configurations. The OEM integrators are responsible for ensuring that the end-user has no manual or instructions to remove or install module. The module is limited to OEM installation ONLY. Une tiquette avec les instructions suivantes doit tre attache au produit final hte:

Cet appareil contient IC: 10224A-20SC200RWF. Le manuel fournit des conseils au fabricant hte sera inclus dans la documentation qui sera fournie l'OEM. Le module est limit l'installation dans des applications mobiles ou fixes. L'approbation distincte est requise pour toutes les autres configurations de fonctionnement, y compris les configurations portables et diffrentes configurations d'antenne. Les intgrateurs OEM sont responsables de s'assurer que l'utilisateur n'a pas de manuel ou d'instructions pour retirer ou installer le module. Le module est limit l'installation OEM SEULEMENT. SC200R_Series_Hardware_Design 11 / 125 Smart Module Series SC200R Series Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. SC200R_Series_Hardware_Design 12 / 125 Smart Module Series SC200R Series Hardware Design 2 Product Concept 2.1. General Description SC200R is a series of 4G Smart LTE module based on Qualcomm platform and Android operating system, and provides industrial grade performance. Its general features are listed below:

Supports worldwide LTE-FDD, LTE-TDD, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA, EVDO/CDMA, EDGE and GPRS coverage. Integrates GPS/GLONASS/BeiDou or GPS/Galileo/Beidou satellite positioning systems. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n and BT 4.2 LE. Supports multiple audio and video codecs. Built-in high performance AdrenoTM 308 graphics processing unit. Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces. SC200R series module is available in five variants: SC200R-CE, SC200R-EM*, SC200R-NA, SC200R-JP*, SC200R-WF*. The following tables show the supported frequency bands and network standards of SC200R series modules. Table 1: SC200R-CE Frequency Bands Mode LTE-FDD LTE-TDD WCDMA EVDO/CDMA GSM Wi-Fi 802.11a/b/g/n BT 4.2 LE Frequency B1/B3/B5/B8 B34/B38/B39/B40/B41 B1/B8 BC0 900/1800 MHz 24022482 MHz 51805825 MHz 24022480 MHz SC200R_Series_Hardware_Design 13 / 125 Smart Module Series SC200R Series Hardware Design Table 2: SC200R-EM* Frequency Bands GNSS Mode LTE-FDD LTE-TDD WCDMA GSM BT 4.2 LE GNSS Mode LTE-FDD LTE-TDD WCDMA BT 4.2 LE GNSS Wi-Fi 802.11a/b/g/n Wi-Fi 802.11a/b/g/n GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Frequency B1/B2/B3/B4/B5/B7/B8/B20/B28 850/900/1800/1900 MHz B38/B40/B41 B1/B2/B4/B5/B8 24022482 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Frequency B41 B2/B4/B5 24022482 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Table 3: SC200R-NA Frequency Bands B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 SC200R_Series_Hardware_Design 14 / 125 Smart Module Series SC200R Series Hardware Design Table 4: SC200R-JP* Frequency Bands Wi-Fi 802.11a/b/g/n Mode LTE-FDD LTE-TDD WCDMA BT 4.2 LE GNSS Mode BT 4.2 LE GNSS NOTES Table 5: SC200R-WF* Frequency Bands Wi-Fi 802.11a/b/g/n B1/B3/B5/B8/B11/B18/B19/B21/B26/B28 GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Frequency B41 B1/B6/B8/B19 24022482 MHz 51805825 MHz 24022480 MHz Frequency 24022482 MHz 51805825 MHz 24022480 MHz

* means under development. 1. 2. SC200R-JP supports 802.11b channel 14. SC200R is a series of SMD type modules, which can be embedded into applications through its 274 pins, including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm 40.5 mm 2.8 mm, the module can meet almost all requirements for M2M applications such as edge device, edge computing, CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry PDA, etc. SC200R_Series_Hardware_Design 15 / 125 Smart Module Series SC200R Series Hardware Design 2.2. Key Features The following table describes the detailed features of SC200R series module. Table 6: Key Features Feature Details Application Processor 64-bit quad-core ARM Cortex-A53 microprocessor, up to 1.3 GHz 512 KB L2 cache Modem DSP GPU Memory Hexagon DSP v56 core, up to 691 MHz 768 KB L2 cache AdrenoTM 308 GPU with 64-bit addressing, up to 485 MHz 8 GB eMMC + 1 GB LPDDR3 (default) 16 GB eMMC + 2 GB LPDDR3 (optional) Operating System Android 10.0 Power Supply Supply voltage: 3.554.2 V Typical supply voltage: 3.8 V Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (24 dBm +3/-1 dB) for EVDO/CDMA BC0 Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Supports 3GPP R10 Cat 4 FDD and TDD Supports 1.4 to 20 MHz RF bandwidth FDD: Max. 150 Mbps (DL)/Max. 50 Mbps (UL) TDD: Max. 130 Mbps (DL)/Max. 30 Mbps (UL) Transmitting Power LTE Features UMTS Features Supports 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA Supports 16-QAM, 64-QAM and QPSK modulations DC-HSDPA: Max. 42 Mbps (DL) DC-HSUPA: Max. 11.2 Mbps (UL) WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL) SC200R_Series_Hardware_Design 16 / 125 Smart Module Series SC200R Series Hardware Design CDMA2000 Features Supports 3GPP2 CDMA2000 1X Advanced, CDMA2000 1xEV-DO Rev.A EVDO: Max. 3.1 Mbps (DL)/Max. 1.8 Mbps (UL) 1X Advanced: Max. 307.2 kbps (DL)/Max. 307.2 kbps (UL) GSM Features R99:

CSD: 9.6 kbps, 14.4 kbps GPRS:

Supports GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max. 107 kbps (DL)/Max. 85.6 kbps (UL) EDGE:

Supports EDGE multi-slot class 33 (33 by default) Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max. 296 kbps (DL)/Max. 236.8 kbps (UL) WLAN Features Support AP and STA mode 2.4/5 GHz, 802.11a/b/g/n, up to 150 Mbps Bluetooth Feature BT 4.2 LE GNSS Features1) GPS/GLONASS/BeiDou or GPS/Galileo/BeiDou SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast LCM Interface Supports one 4-lane MIPI_DSI Supports HD+ (1440 720) @ 60 fps Camera Interfaces Supports two 4-lane MIPI_CSI, up to 2.1 Gbps/lane Supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane + 1-lane) Up to 13 MP Video Codec Video encoding + decoding: 720P @ 30 fps + 1080P @ 30 fps Encoding up to 1080P @ 30 fps, decoding up to 1080P @ 30 fps Audio Interfaces Audio Codec Audio inputs:

Three single-ended microphone inputs Audio outputs:

Class AB stereo headphone output Class AB earpiece differential output Class D speaker differential amplifier output EVRC, EVRC-B, EVRC-WB;

G.711, G.729A, and G.729AB;

GSM-FR, GSM-EFR, GSM-HR;

AMR-NB, AMR-WB, eAMR, BeAMR SC200R_Series_Hardware_Design 17 / 125 Smart Module Series SC200R Series Hardware Design USB Interface UART Interfaces SD Card Interface

(U)SIM Interfaces Compliant with USB 2.0 specification Supports up to 480 Mbps Supports USB OTG Used for AT command communication, data transmission, software debugging and firmware upgrade Three UART interfaces: UART5, UART2 (debug UART) and UART1, baud rate up to 4 Mbps UART5: 4-wire UART interface, hardware flow control supported UART2 (debug UART): 2-wire UART interface, used for debugging by default UART1: 2-wire UART interface Supports SD 3.0 Supports SD card hot-plug Two (U)SIM interfaces Supports USIM/SIM card: 1.8 V or 2.95 V Supports Dual SIM Dual Standby (supported by default) I2C Interfaces Four I2C interfaces Used for peripherals such as camera, sensor, touch panel, etc. ADC Interfaces One generic ADC interface up to 15-bit resolution Real Time Clock Supported Antenna Interfaces Main antenna, Rx-diversity antenna, GNSS1) antenna and Wi-Fi/BT antenna Physical Characteristics Size: (40.5 0.15) mm (40.5 0.15) mm (2.8 0.2) mm Package: LCC + LGA Weight: Approx. 10.2 g Temperature Range Operating temperature range: -35 C to +75 C 2) Storage temperature range: -40 C to +90 C Firmware Upgrade Over USB interface RoHS All hardware components are fully compliant with EU RoHS directive 1. 2. 1) SC200R-WF does not support GNSS. 2) Within the operating temperature range, the module is 3GPP compliant. NOTES SC200R_Series_Hardware_Design 18 / 125 Smart Module Series SC200R Series Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of SC200R series module and illustrates the major functional parts. Power management Radio frequency Baseband LPDDR3 + eMMC flash Peripheral interfaces

-- USB interface

-- UART interfaces

-- (U)SIM interfaces

-- SD card interface

-- GPIO interfaces

-- I2C interfaces

-- SPI interfaces

-- ADC interface

-- Motor drive interface

-- LCM interface

-- Touch panel interface

-- Camera interfaces

-- Audio interfaces 2.4. Evaluation Board To help you design and test applications with the module, Quectel supplies an evaluation kit, which includes an evaluation board, a USB to RS-232 converter cable, a USB data cable, a power adapter, an earphone and antennas. For details, see document [1]. SC200R_Series_Hardware_Design 19 / 125 Smart Module Series SC200R Series Hardware Design 3 Application Interfaces 3.1. General Description SC200R is a series of SMD type modules with 146 LCC pins and 128 LGA pins. The following chapters provide the detailed description of pins/interfaces listed below. Power supply VRTC interface USB interface UART interfaces

(U)SIM interfaces SD card interface GPIO interfaces I2C interfaces SPI interfaces ADC interface Motor drive interface LCM interface Touch panel interface Camera interfaces Sensor interfaces Audio interfaces Emergency download interface SC200R_Series_Hardware_Design 20 / 125 Smart Module Series SC200R Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of SC200R series module. VBAT_BB VBAT_BB GND MIC1_P MIC_GND MIC2_P GND EAR_P EAR_N SPK_P SPK_N GND USB_DM USB_DP GND USB_ID USIM2_DET USIM2_RST USIM2_CLK USIM2_DATA USIM2_VDD USIM1_DET USIM1_RST USIM1_CLK USIM1_DATA USIM1_VDD GND VIB_DRV_N PWM TP_INT TP_RST SD_LDO12 GPIO_33 UART5_TXD UART5_RXD UART5_CTS UART5_RTS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 24 25 26 27 28 29 30 31 32 33 34 35 36 37 F R _ T A B V F R _ T A B V D N G D N G S U B V S U B V D N G T E D _ S H L _ H P H F E R _ H P H R _ H P H D N G M R E H T _ T A B S N S _ T A B X R D _ T N A D N G D N G C D A 5 8 V 2 _ 7 1 O D L L E S _ G H C C T R V 8 V 1 _ 6 O D L 7 4 _ O P G I 2 6 _ O P G I D N G S S N G _ T N A 0 2 _ O P G I 1 2 _ O P G I 2 2 _ O P G I 3 2 _ O P G I 9 8 _ O P G I D N G Y E K R W P 6 4 _ O P G I 3 9 _ O P G I 8 V 1 _ 5 O D L 6 4 1 5 4 1 4 4 1 3 4 1 2 4 1 1 4 1 0 4 1 9 3 1 8 3 1 7 3 1 6 3 1 5 3 1 4 3 1 3 3 1 2 3 1 1 3 1 0 3 1 9 2 1 8 2 1 7 2 1 6 2 1 5 2 1 4 2 1 3 2 1 2 2 1 1 2 1 0 2 1 9 1 1 8 1 1 7 1 1 6 1 1 5 1 1 4 1 1 3 1 1 2 1 1 1 1 1 186 185 184 183 182 181 180 179 178 177 147 187 222 221 220 219 218 217 216 215 214 176 148 188 223 250 249 248 247 246 245 244 213 175 149 189 224 251 270 269 268 267 266 243 212 174 150 190 225 252 265 242 211 173 151 191 226 253 264 241 210 172 152 192 227 254 254 263 240 209 171 153 193 228 255 262 239 208 170 154 194 229 256 257 258 259 260 261 238 207 169 155 195 230 231 232 233 234 235 236 237 206 168 156 196 197 198 199 200 201 202 203 204 205 167 157 158 159 160 161 162 163 164 165 166 271 274 272 273 8 3 9 3 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8 4 9 4 0 5 1 5 2 5 3 5 4 5 5 5 6 5 7 5 8 5 9 5 0 6 1 6 2 6 3 6 4 6 5 6 6 6 7 6 8 6 9 6 0 7 1 7 2 7 3 7 K L C _ D S D M C _ D S 1 1 O D L _ D S 0 A T A D _ D S 1 A T A D _ D S 2 A T A D _ D S 3 A T A D _ D S T E D _ D S T O O B _ B S U L C S _ C 2 I _ P T A D S _ C 2 I _ P T D N G E T _ D C L T S R _ D C L N _ K L C _ I S D P _ K L C _ I S D N _ 0 N L _ S D I P _ 0 N L _ S D I N _ 1 N L _ S D I P _ 1 N L _ S D I N _ 2 N L _ S D I P _ 2 N L _ S D I N _ 3 N L _ S D I P _ 3 N L _ S D I D N G D N G N _ K L C _ 1 I S C P _ K L C _ 1 I S C N _ 0 N L _ 1 S C I P _ 0 N L _ 1 I S C N _ 1 N L _ 1 S C I P _ 1 N L _ 1 I S C N _ 3 N L _ 1 S C I P _ 3 N L _ 1 I S C N _ 2 N L _ 1 S C I P _ 2 N L _ 1 I S C 110 109 108 107 106 105 104 103 102 101 100 99 GPIO_42 GPIO_44 GPIO_63 GPIO_43 GPIO_66 GPIO_87 GPIO_94 GPIO_95 GPIO_13 GPIO_12 GPIO_59 GPIO_48 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 GPIO_45 GPIO_130 VOL_DOWN VOL_UP DBG_TXD DBG_RXD SENSOR_I2C_SDA SENSOR_I2C_SCL GPIO_25 GND GND ANT_MAIN GND GND CAM_I2C_SDA CAM_I2C_SCL CAM1_PWDN CAM1_RST CAM0_PWDN CAM0_RST GND ANT_WIFI/BT GND CAM1_MCLK CAM0_MCLK POWER Pins

(U)SIM Pins UART Pins GPIO Pins ANT Pins LCM Pins OTHERS Pins GND Pins AUDIO Pins USB Pins TP Pins CAMERA Pins SDCARD Pins RESERVED Pins Figure 1: Pin Assignment (Top View) SC200R_Series_Hardware_Design 21 / 125 Smart Module Series SC200R Series Hardware Design 3.3. Pin Description Table 7: I/O Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog input Analog output Digital input Digital output Bidirectional Open drain Power input Power output The following table shows the pin definition and electrical characteristics of the module. Table 8: Pin Description Power Supply VBAT_BB 1, 2 Pin Name Pin No. I/O Description DC Characteristics Comment PI/

PO Power supply for the modules baseband part Vmax = 4.2 V Vmin = 3.55 V Vnorm = 3.8 V Power supply for the modules RF part Vmax = 4.2 V Vmin = 3.55 V Vnorm = 3.8 V You must provide them with sufficient current of up to 3.0 A. It is suggested to add a TVS for surge protection. PI/

PO Power supply for internal RTC circuit VOmax = 3.2 V VI = 2.03.25 V If it is not used, keep this pin open. VBAT_RF 145, 146 PI VRTC 126 LDO5_1V8 111 PO 1.8 V output power supply Vnorm = 1.8 V IOmax = 20 mA Power supply for external GPIOs pull-up and level shift circuits. SC200R_Series_Hardware_Design 22 / 125 Smart Module Series SC200R Series Hardware Design LDO6_1V81) 125 PO 1.8 V output power supply Vnorm = 1.8 V IOmax = 150 mA LDO10_2V85 156 PO 2.85 V output power supply Vnorm = 2.85 V IOmax = 150 mA LDO17_2V85 129 PO 2.85 V output power supply Vnorm = 2.85 V IOmax = 450 mA Power supply for sensors, cameras, and I2C pull-up circuit. If it is used, connect an external 1.04.7 F capacitor to this pin in parallel. If it is not used, keep it open. Reserved power supply. If it is used, add a 1.02.2 F bypass capacitor. If it is not used, keep it open. Power supply for AVDD of LCM, TP, sensors and cameras. If it is used, connect an external 2.24.7 F capacitor to this pin in parallel. If it is not used, keep it open. Reserved power supply. If it is used, add a 1.02.2 F bypass capacitor. If it is not used, keep it open. LDO16_2V8 193 PO 2.8 V output power supply Vnorm = 2.8 V IOmax = 55 mA Pin Name Pin No. GND GND 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 149, 162, 171, 172, 176, 187191, 202204, 206224, 226231, 233238, 240, 241, 243245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271274 SC200R_Series_Hardware_Design 23 / 125 Smart Module Series SC200R Series Hardware Design Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment If it is not used, connect it to the ground. MIC1_P MIC_GND MIC2_P EAR_P EAR_N SPK_P SPK_N 4 5 6 8 9 10 11 AI AI AI Main microphone input (+) Microphone reference ground Microphone input for headset (+) AO Earpiece output

(+) AO Earpiece output (-) AO Speaker output (+) AO Speaker output (-) HPH_R 136 AO HPH_REF 137 AO HPH_L 138 AO HS_DET 139 AI MIC3_P 148 AI Headphone right channel output Headphone reference ground Headphone left channel output Headset insertion detect Microphone bias voltage 1 Secondary microphone input

(+) Microphone bias voltage 2 MIC_BIAS1 147 AO VO = 1.62.85 V High level by default. MIC_BIAS2 155 AO VO = 1.62.85 V USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 141, 142 PI USB 5 V power input and USB connection detect Vmax = 6.2 V Vmin = 4.35 V Vnorm = 5.0 V USB_DM USB_DP 13 14 AI/

AO AI/

AO USB 2.0 differential data (-) USB 2.0 differential data (+) USB 2.0 standard compliant. 90 differential impedance. SC200R_Series_Hardware_Design 24 / 125 Smart Module Series SC200R Series Hardware Design USB_ID 16 DI USB ID detect

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment High level by default. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported. USIM2_DET 17 DI

(U)SIM2 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM2_RST DO

(U)SIM2 card reset VOLmax = 0.4 V USIM2_CLK 18 19 DO

(U)SIM2 card clock USIM2_DATA 20 IO

(U)SIM2 card data USIM2_VDD 21 PO

(U)SIM2 card power supply VOHmin =

0.8 USIM2_VDD VILmax =

0.2 USIM2_VDD VIHmin =

0.7 USIM2_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM2_VDD For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V SC200R_Series_Hardware_Design 25 / 125 Smart Module Series SC200R Series Hardware Design USIM1_DET 22 DI

(U)SIM1 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM1_RST DO

(U)SIM1 card reset VOLmax = 0.4 V USIM1_CLK 23 24 DO

(U)SIM1 card clock USIM1_DATA 25 IO

(U)SIM1 card data Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported. VOHmin =

0.8 USIM1_VDD VILmax =

0.2 USIM1_VDD VIHmin =

0.7 USIM1_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM1_VDD For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V USIM1_VDD 26 PO

(U)SIM1 card power supply Pin Name Pin No. I/O Description DC Characteristics Comment UART Interfaces UART5_TXD UART5_RXD UART5_CTS UART5_RTS DBG_RXD 34 35 36 37 93 DO UART5 transmit data VOLmax = 0.45 V VOHmin = 1.35 V UART5 receive data UART5 clear to send VILmax = 0.63 V VIHmin = 1.17 V VILmax = 0.63 V VIHmin = 1.17 V DO UART5 request to send VOLmax = 0.45 V VOHmin = 1.35 V UART2 (debug UART) receive data VILmax = 0.63 V VIHmin = 1.17 V DI DI DI 1.8 V power domain. If not used, keep these pins open. SC200R_Series_Hardware_Design 26 / 125 Smart Module Series SC200R Series Hardware Design DBG_TXD 94 DO UART1_RXD 153 DI UART1_TXD 154 DO SD Card Interface UART2 (debug UART) transmit data UART1 receive data VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V UART1 transmit data VOLmax = 0.45 V VOHmin = 1.35 V Pin Name Pin No. I/O Description DC Characteristics Comment SD_LDO11 38 PO 2.95 V output power supply Vnorm = 2.95 V IOmax = 800 mA SD_LDO12 32 PO 1.8/2.95 V output power supply Vnorm = 1.8/2.95 V IOmax = 50 mA Power supply for SD card. Power supply for SD card pull-up circuits. SD_CLK 39 DO High speed digital clock signal of SD card Command signal of SD card High speed bidirectional digital signals of SD card 1.8 V SD card:

VOLmax = 0.45 V VOHmin = 1.4 V 2.95 V SD card:

VOLmax = 0.37 V VOHmin = 2.2 V 1.8 V SD card:

VILmax = 0.58 V VIHmin = 1.27 V VOLmax = 0.45 V VOHmin = 1.4 V 2.95 V SD card:

VILmax = 0.73 V VIHmin = 1.84 V VOLmax = 0.37 V VOHmin = 2.2 V IO IO IO IO IO DI 50 characteristic impedance. SD card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Active low. Touch Panel Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_INT DI Interrupt signal of TP VILmax = 0.63 V VIHmin = 1.17 V TP_RST DO Reset signal of TP VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. 1.8 V power domain. Active low. SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 SD_DET 40 41 42 43 44 45 30 31 SC200R_Series_Hardware_Design 27 / 125 Smart Module Series SC200R Series Hardware Design TP_I2C_SCL TP_I2C_SDA 47 48 LCM Interface OD OD I2C clock signal of TP I2C data signal of TP Externally pull them up to 1.8 V. Can be used for other I2C devices. Pin Name Pin No. I/O Description DC Characteristics Comment PWM 29 DO PWM output which adjusts the backlight brightness VOLmax = 0.45 V VOHmax = VBAT_BB LCD_RST DO LCD reset LCD_TE DI LCD tearing effect DSI_CLK_N AO LCD MIPI clock (-) DSI_CLK_P AO LCD MIPI clock (+) VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. 49 50 52 53 54 55 56 57 58 59 60 61 63 64 DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P Camera Interfaces CSI1_CLK_N CSI1_CLK_P AO AO AO AO AO AO AO AO LCD MIPI data 0

(-) LCD MIPI data 0

(+) LCD MIPI data 1

(-) LCD MIPI data 1

(+) LCD MIPI data 2

(-) LCD MIPI data 2

(+) LCD MIPI data 3

(-) LCD MIPI data 3

(+) AI AI Camera MIPI clock signal (-) Camera MIPI clock signal (+) Pin Name Pin No. I/O Description DC Characteristics Comment SC200R_Series_Hardware_Design 28 / 125 Smart Module Series SC200R Series Hardware Design CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P 65 66 67 68 70 71 72 73 CSI0_CLK_N 157 CSI0_CLK_P 196 CSI0_LN0_N 158 CSI0_LN0_P 197 CSI0_LN1_N 159 CSI0_LN1_P 198 CSI0_LN2_N 160 CSI0_LN2_P 199 CSI0_LN3_N 161 CSI0_LN3_P 200 CAM0_MCLK 74 CAM1_MCLK 75 CAM0_RST 79 AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI DO DO DO Camera MIPI clock signal (+) Camera MIPI data 0 signal (-) Camera MIPI data 0 signal (+) Camera MIPI data 1 signal (-) Camera MIPI data 1 signal (+) Camera MIPI data 3 signal (-) Camera MIPI data 3 signal (+) Camera MIPI data 2 signal (-) Camera MIPI data 2 signal (+) Camera MIPI clock signal (-) Camera MIPI data 0 signal (-) Camera MIPI data 0 signal (+) Camera MIPI data 1 signal (-) Camera MIPI data 1 signal (+) Camera MIPI data 2 signal (-) Camera MIPI data 2 signal (+) Camera MIPI data 3 signal (-) Camera MIPI data 3 signal (+) Clock signal of camera Clock signal of camera Reset signal of camera VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. SC200R_Series_Hardware_Design 29 / 125 Smart Module Series SC200R Series Hardware Design CAM0_PWDN 80 CAM1_RST 81 CAM1_PWDN 82 CAM_I2C_SCL 83 CAM_I2C_SDA 84 DO DO DO OD OD CAM2_MCLK 165 DO CAM2_RST 164 DO CAM2_PWDN 163 DO DCAM_I2C_SCL 166 OD DCAM_I2C_SDA 205 OD Keypad Interfaces Power down signal of camera Reset signal of camera Power down signal of camera I2C clock signal of camera I2C data signal of camera Clock signal of camera Reset signal of camera Power down signal of camera I2C clock signal of camera I2C data signal of camera VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 114 DI Turns on/off the module VILmax = 0.63 V VIHmin = 1.17 V RESET_N 225 DI Resets the module VOL_UP 95 DI Volume up VOL_DOWN 96 DI Volume down SENSOR_I2C Interface VILmax = 0.63 V VIHmin = 1.17 V VILmax = 0.63 V VIHmin = 1.17 V SC200R_Series_Hardware_Design 30 / 125 Externally pull them up to 1.8 V. Externally pull them up to 1.8 V. Pulled up to 1.8 V internally. Active low. Disabled by default and can be enabled via software configuration. If it is not used, keep it open. Do not pull it up. 1.8 V power domain. If it is not used, keep it open. Do not pull it up. 1.8 V power domain. Smart Module Series SC200R Series Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment SENSOR_I2C_ SCL 91 OD I2C clock for external sensor SENSOR_I2C_ SDA 92 OD I2C data for external sensor Charging Interface Pin Name Pin No. I/O Description DC Characteristics Comment BAT_SNS 133 AI Battery voltage detect BAT_THERM 134 AI Battery temperature detect BAT_ID 185 AI Battery type detect VOLmin = 0.1 V VOHmax = 1.7 V CHG_SEL 127 DI Charger select Dedicated for external sensors. Cannot be used for touch panel, NFC, I2C keyboard, etc. Externally pull them up to 1.8 V. The maximum input voltage is 4.2 V. Internally pulled up. Externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. Internal pulled down with a 100 k resistor. If it is not used, keep it open. If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. The maximum input voltage is 1.7 V. ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment ADC 128 AI Generic ADC Antenna Interfaces SC200R_Series_Hardware_Design 31 / 125 Smart Module Series SC200R Series Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 87 ANT_DRX 131 ANT_GNSS2) 121 ANT_WIFI/BT 77 GPIO Interfaces AI/

AO Main antenna interface AI AI Rx-diversity antenna interface GNSS antenna interface AI/

AO Wi-Fi/BT antenna interface 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment GPIO_33 GPIO_25 GPIO_130 GPIO_45 GPIO_48 GPIO_59 GPIO_12 GPIO_13 GPIO_95 GPIO_94 GPIO_87 GPIO_66 GPIO_43 GPIO_63 GPIO_44 GPIO_42 GPIO_93 33 90 97 98 99 100 101 102 103 104 105 106 107 108 109 110 112 IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.4 V 1.8 V power domain. SC200R_Series_Hardware_Design 32 / 125 Smart Module Series SC200R Series Hardware Design GPIO_46 GPIO_89 GPIO_23 GPIO_22 GPIO_21 GPIO_20 GPIO_62 GPIO_47 GPIO_6 GPIO_7 GPIO_127 GPIO_34 GPIO_90 GPIO_39 GPIO_86 113 115 116 117 118 119 123 124 167 168 169 170 177 201 239 IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO GPIO_88 264 IO GPIO GPIO_85 GPIO_61 265 267 IO GPIO IO GPIO GNSS LNA Enable Interface Do not pull up this GPIO when turning on the module. 1.8 V power domain. 1.8 V power domain. Cannot be multiplexed into a generic GPIO. Pin Name Pin No. I/O Description DC Characteristics Comment GNSS_LNA_EN 194 IO External GNSS LNA enable GRFC Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment SC200R_Series_Hardware_Design 33 / 125 Smart Module Series SC200R Series Hardware Design Cannot be multiplexed into generic GPIOs. You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-up. The module cannot be turned off when this pin is pulled down. If it is not used, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment RFFE3_CLK 260 RFFE3_DATA 262 IO IO GRFC used for RF tuner control GRFC used for RF tuner control Emergency Download Interface USB_BOOT 46 DI Forces the module to enter emergency download mode Motor Drive Interface Pin Name Pin No. I/O Description DC Characteristics Comment VIB_DRV_N 28 PO Motor drive Indication Interface VO = 1.23.1 V IOmax = 175 mA Connect it to the negative pole of the motor. Pin Name Pin No. I/O Description DC Characteristics Comment CHG_LED 195 AO IOmax = 5 mA Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment NFC_CLK 181 DO NFC clock NFC_CLK_REQ 182 DI Indicates the module's charging status NFC clock request Initiates power-on when pulled down CBL_PWR_N 186 DI Reserved Pins Pin Name Pin No. Comment SC200R_Series_Hardware_Design 34 / 125 Smart Module Series SC200R Series Hardware Design RESERVED 150152, 173175, 178180, 183, 184, 192, 232, 242, 246, 249, 252254, 257, 263, 270 Keep these pins open. 1. 1) When the module is in sleep mode, LDO6_1V8 wakes up periodically or randomly. Considering the actual requirement for power consumption during sleep mode, you can use either LDO6_1V8 or an external LDO for power supply. For lower power consumption, use an external LDO instead. 2. 2) SC200R-WF does not support GNSS. NOTE 3.4. Power Supply 3.4.1. Power Supply Pins SC200R series module provides two VBAT_RF pins and two VBAT_BB pins for connection with the external power supply. The VBAT_RF pins are used for the RF part of the module and the VBAT_BB pins are used for the baseband part of the module. 3.4.2. Decrease Voltage Drop The power supply range of the module is 3.554.2 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc. directly influences the modules performance and stability. Under ultimate conditions, the transient peak current of the module may surge up to 3 A. If the supply voltage is not enough, there will be voltage drops, and if the voltage drops below 3.1 V, the module will be turned off automatically. Therefore, make sure the input voltage never drops below 3.1 V. Figure 2: Voltage Drop Sample SC200R_Series_Hardware_Design 35 / 125 Smart Module Series SC200R Series Hardware Design To decrease voltage drop, use a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ), and reserve a multi-layer ceramic chip capacitor (MLCC) array due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) to compose the MLCC array and place these capacitors close to VBAT_BB/VBAT_RF pins. Additionally, add a 4.7 F capacitor in parallel. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT trace should be no less than 3 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, in order to get a stable power source, it is suggested to use a TVS and place it as close to the VBAT_BB/VBAT_RF pins as possible to enhance surge protection. The following figure shows the star structure of the power supply. Figure 3: Star Structure of the Power Supply SC200R_Series_Hardware_Design 36 / 125 Smart Module Series SC200R Series Hardware Design 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of SC200R series module should be able to provide sufficient current of at least 3 A. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is recommended. The following figure shows a reference design for +5 V input power source. The typical output voltage is 3.8 V and the maximum load current is 5.0 A. N E D N G J D A 1 3 5 Figure 4: Reference Circuit of Power Supply It is recommended to switch off the power supply when the module is in abnormal state, and then switch on the power to restart the module. 2. The module supports battery charging by default. If the above power supply design is adopted, make sure the charging function is disabled by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply chip. NOTES 1. SC200R_Series_Hardware_Design 37 / 125 Smart Module Series SC200R Series Hardware Design 3.5. Turn on and off Scenarios 3.5.1. Turn on the Module Using PWRKEY The module can be turned on by driving the PWRKEY pin low for at least 1.6 s. The PWRKEY pin is pulled up to 1.8 V internally. It is recommended to use an open drain/collector driver to control PWRKEY. A simple reference circuit is illustrated in the following figure. PWRKEY R3 1K

>1.6 s Turn on pulse R1 4.7K Q1 R2 47K Figure 5: Turn on the Module Using Driving Circuit The other way to control PWRKEY is by using a button directly. You must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 6: Turn on the Module Using Keystroke SC200R_Series_Hardware_Design 38 / 125 Smart Module Series SC200R Series Hardware Design The turning on scenario is illustrated in the following figure. Figure 7: Timing of Turning on the Module NOTES shown above. 1. When the module is powered on for the first time, its timing of turning on may be different from that 2. Make sure that VBAT is stable before pulling down PWRKEY. It is recommended to wait until VBAT to be stable at 4.0 V for at least 30 ms before pulling down PWRKEY. Additionally, PWRKEY cannot be pulled down all the time. SC200R_Series_Hardware_Design 39 / 125 Smart Module Series SC200R Series Hardware Design 3.5.2. Turn off the Module Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. You can also force the module to power off by driving PWRKEY low for at least 8 s. The forced power-down scenario is illustrated in the following figure. Figure 8: Timing of Turning off the Module 3.6. VRTC Interface The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supply for VBAT. The external power source can be a rechargeable battery (such as a coin cell) according to application demands. A reference circuit design is shown below. Figure 9: RTC Powered by Coin Cell If RTC is ineffective, it can be synchronized through the network after the module is powered on. The recommended input voltage range for VRTC is 2.03.25 V and the recommended typical value is 3.0 V. SC200R_Series_Hardware_Design 40 / 125 Smart Module Series SC200R Series Hardware Design 3.7. Power Output SC200R series module supports output of regulated voltages for peripheral circuits. During application, it is recommended to connect a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high-frequency noise. Pin Name Default Voltage (V) Driving Current (mA) Idle 20 150 150 450 55 50 800 55 55 Keep

Table 9: Power Description LDO5_1V8 LDO6_1V81) LDO10_2V85 LDO17_2V85 LDO16_2V8 1.8 1.8 2.85 2.85 2.8 SD_LDO12 1.8/2.95 SD_LDO11 2.95 USIM1_VDD 1.8/2.95 USIM2_VDD 1.8/2.95 NOTE 1) When the module is in sleep mode, LDO6_1V8 wakes up periodically or randomly. Considering the actual requirement for power consumption during sleep mode, you can use either LDO6_1V8 or an external LDO for power supply. If you require lower power consumption during sleep mode, use an external LDO for power supply. SC200R_Series_Hardware_Design 41 / 125 Smart Module Series SC200R Series Hardware Design 3.8. Battery Charging and Management SC200R series module supports battery charging. The battery charger in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. Trickle charging: There are two steps in this mode. When the battery voltage is below 2.8 V, a 90 mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.8 V and 3.2 V, the charging current can be set to 450 mA maximally. Constant current mode (CC mode): When the battery is increased to between 3.2 V and 4.2 V, the system will switch to CC mode. The maximum charging current is 1.44 A when an adapter is used for battery charging, and the maximum charging current is 450 mA for USB charging. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.2 V, the system will switch to CV mode and the charging current will decrease gradually. When the battery level reaches 100 %, charging is completed. Table 10: Pin Definition of Charging Interface Pin Name Pin No. I/O Description Comment BAT_SNS 133 AI Battery voltage detect The maximum input voltage is 4.2 V. BAT_THERM 134 AI Battery temperature detect BAT_ID 185 AI Battery type detect CHG_SEL 127 DI Charger select Internally pulled up. Externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. Internal pulled down with a 100 k resistor. If it is not used, keep it open. If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. SC200R series module supports battery temperature detection in the condition that the battery integrates a thermistor (47 k 1 % NTC thermistor with a B-constant of 4050 K by default) and the thermistor is connected to BAT_THERM pin. If the BAT_THERM pin is not connected, there will be malfunctions such as battery charging failure, battery level display error, etc. The default battery temperature range is

-3.0 C to 48.5 C. SC200R_Series_Hardware_Design 42 / 125 Smart Module Series SC200R Series Hardware Design A reference design for the battery charging circuit is shown below. Figure 10: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS systems are powered by batteries. For different batteries, you should modify the charging and discharging curve correspondingly to achieve the best performance. If the thermistor is not available in the battery, or an adapter is utilized to power the module, you must connect BAT_THERM to GND via a 47 k resistor. Otherwise, the system may mistakenly judge that the battery temperature is abnormal, and therefore cause battery charging failure. BAT_SNS must be connected. Otherwise, the module will have abnormalities in voltage detection, as well as associated problems with power-on/off and battery charging/discharging. 3.9. USB Interface SC200R series module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification and supports high speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface supports USB OTG and is used for AT command communication, data transmission, software debugging and firmware upgrade. SC200R_Series_Hardware_Design 43 / 125 Smart Module Series SC200R Series Hardware Design The following table shows the pin definition of USB interface. Table 11: Pin Definition of USB Interface Pin Name Pin No. I/O Description USB_VBUS 141, 142 PI USB 5 V power input and USB connection detect USB_DM 13 AI/AO USB 2.0 differential data (-) USB_DP 14 AI/AO USB 2.0 differential data (+) Comment Vmax = 6.2 V Vmin = 4.35 V Vnorm = 5.0 V USB 2.0 standard compliant. 90 differential impedance. USB_ID 16 AI USB ID detect High level by default. For the design of USB 2.0 interface, it is recommended to connect USB_ID directly to the USB_ID pin of the external USB port for USB ID detection. When you insert a device into the external USB port, the USB_ID pin of the module will be pulled down to make the module enter host mode. You can choose either to support USB OTG or not. The following figures show the reference designs. Figure 11: USB Interface Reference Design (OTG Not Supported) SC200R_Series_Hardware_Design 44 / 125 Smart Module Series SC200R Series Hardware Design Figure 12: USB Interface Reference Design (OTG Supported) In order to ensure USB performance, comply with the following principles when designing the USB interface. Route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace should be 90 . Keep the ESD protection devices as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection devices on USB data lines. Typically, the capacitance value should be less than 2 pF. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. Route the USB differential traces in inner-layer with ground shielding on not only the upper and lower layers but also the right and left sides. Make sure the trace length difference between USB 2.0 differential data signals is less than 0.7 mm. Table 12: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP-DM) 13 14 USB_DM USB_DP 32.25 32.15

-0.10 SC200R_Series_Hardware_Design 45 / 125 Smart Module Series SC200R Series Hardware Design 3.10. UART Interfaces SC200R series module provides three UART interfaces and supports up to 4 Mbps:

UART5: 4-wire UART interface, hardware flow control supported UART2 (debug UART): 2-wire UART interface, used for debugging by default UART1: 2-wire UART interface Table 13: Pin Definition of UART Interfaces Pin Name Pin No. I/O Description Comment UART5_TXD 34 DO UART5 transmit data UART5_RXD 35 UART5 receive data UART5_CTS 36 UART5 clear to send DI DI UART5_RTS 37 DO UART5 request to send DBG_RXD DI UART2 (debug UART) receive data DBG_TXD DO UART2 (debug UART) transmit data 93 94 UART1_RXD 153 DI UART1 receive data UART1_TXD 154 DO UART1 transmit data 1.8 V power domain. If not used, keep these pins open. UART5 is a 4-wire UART interface with 1.8 V power domain. You should use a level translator if your application is equipped with a 3.3 V UART interface. The following figure shows the reference design. Figure 13: Reference Circuit with Level Translator Chip (for UART5) SC200R_Series_Hardware_Design 46 / 125 Smart Module Series SC200R Series Hardware Design The following figure is an example of connection between the module and PC. It is recommended to add a level translator and an RS-232 level translator chip between the module and PC. The following figure shows the reference design. Figure 14: RS-232 Level Match Circuit (for UART5) NOTE UART2 and UART1 are similar to UART5. For the reference design, refer to that of UART5. 3.11. (U)SIM Interfaces SC200R series module provides two (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the

(U)SIM card is powered by the internal power supply of the module. Table 14: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM2_DET 17 DI

(U)SIM2 card hot-plug detect Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. SC200R_Series_Hardware_Design 47 / 125 Smart Module Series SC200R Series Hardware Design USIM2_RST DO

(U)SIM2 card reset USIM2_CLK DO

(U)SIM2 card clock USIM2_DATA IO

(U)SIM2 card data USIM2_VDD PO

(U)SIM2 card power supply USIM1_DET 22 DI

(U)SIM1 card hot-plug detect USIM1_RST DO

(U)SIM1 card reset USIM1_CLK DO

(U)SIM1 card clock USIM1_DATA IO

(U)SIM1 card data USIM1_VDD PO

(U)SIM1 card power supply 18 19 20 21 23 24 25 26 Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported. SC200R series module supports (U)SIM card hot-plug via the USIM_DET pin. (This function is disabled by default via software. To enable it, contact Quectel Technical Supports to change the software configuration.) A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Figure 15: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector SC200R_Series_Hardware_Design 48 / 125 Smart Module Series SC200R Series Hardware Design If you do not need to use USIM_DET, keep this pin open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector. Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to ensure good performance and avoid damage of (U)SIM cards, follow the criteria listed below during (U)SIM circuit design:

Place the (U)SIM card connector as close to the module as possible. Keep the trace length of (U)SIM card signals as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Reserve a filter capacitor for USIM_VDD, and its maximum capacitance should not exceed 1 F. Additionally, place the capacitor near the (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. In order to ensure good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 50 pF. Add 22 resistors in series between the module and (U)SIM card to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. Add 22 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST signal lines to filter RF interference, and place them as close to the (U)SIM card connector as possible. Place the reserved pull-up resistors R6 and R5 in Figure 16 and 17 close to the module. SC200R_Series_Hardware_Design 49 / 125 Smart Module Series SC200R Series Hardware Design 3.12. SD Card Interface SD Card interface of SC200R series module supports SD 3.0 protocol. The pin definition of SD card interface is shown below. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment DO High-speed digital clock signal of SD card Command signal of SD card High-speed bidirectional digital signals of SD card 50 characteristic impedance. SD_CLK SD_CMD 39 40 SD_DATA0 41 SD_DATA1 42 SD_DATA2 43 SD_DATA3 44 IO IO IO IO IO DI SD_DET 45 SD card hot-plug detect Active low. SD_LDO11 38 PO 2.95 V output power supply SD_LDO12 32 PO 1.8/2.95 V output power supply A reference circuit for the SD card interface is shown below. Power supply for SD card. Power supply for SD card pull-up circuits. Figure 17: Reference Circuit for SD Card Interface SC200R_Series_Hardware_Design 50 / 125 Smart Module Series SC200R Series Hardware Design SD_LDO11 is the power supply for the SD card and can provide up to 800 mA output current. Due to the high output current, it is recommended that the trace width should be at least 0.8 mm. In order to ensure stability of output current, add a 4.7 F and a 33 pF capacitor in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2, and SD_DATA3 are all high-speed signal lines. In PCB design, control the characteristic impedance of them to 50 , and do not cross them with other traces. It is recommended to route the traces on the inner layer of PCB and keep them of the same length. Additionally, SD_CLK needs separate ground shielding. Layout guidelines:

Control the impedance to 50 10 % and add ground shielding. The total trace length difference between SD_CLK and other signal traces like SD_CMD and SD_DATA should not exceed 1 mm. Table 16: SD Card Trace Length Inside the Module Pin No. Length (mm) Signal SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 21.50 21.40 21.45 21.60 21.40 21.35 39 40 41 42 43 44 SC200R_Series_Hardware_Design 51 / 125 Smart Module Series SC200R Series Hardware Design 3.13. GPIO Interfaces SC200R series module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 17: Pin Definition of GPIO Interfaces Pin Name Pin No. GPIO No. Default State Comment GPIO_6 GPIO_7 GPIO_12 GPIO_13 GPIO_20 GPIO_21 GPIO_22 GPIO_23 GPIO_25 GPIO_33 GPIO_34 GPIO_39 GPIO_42 GPIO_43 GPIO_44 GPIO_45 GPIO_46 GPIO_47 GPIO_48 167 168 101 102 119 118 117 116 90 33 170 201 110 107 109 98 113 124 99 GPIO_6 B-PD:nppukp1) GPIO_7 B-PD:nppukp GPIO_12 B-PD:nppukp Wakeup2) GPIO_13 B-PD:nppukp Wakeup GPIO_20 B-PD:nppukp GPIO_21 B-PD:nppukp Wakeup GPIO_22 B-PD:nppukp GPIO_23 B-PD:nppukp GPIO_25 B-PD:nppukp Wakeup GPIO_33 B-PD:nppukp GPIO_34 B-PD:nppukp Wakeup GPIO_39 B-PD:nppukp GPIO_42 B-PD:nppukp Wakeup GPIO_43 B-PD:nppukp Wakeup GPIO_44 B-PD:nppukp Wakeup GPIO_45 B-PD:nppukp Wakeup GPIO_46 B-PD:nppukp Wakeup GPIO_47 B-PD:nppukp GPIO_48 B-PD:nppukp Wakeup SC200R_Series_Hardware_Design 52 / 125 Smart Module Series SC200R Series Hardware Design GPIO_59 GPIO_61 GPIO_62 GPIO_63 GPIO_66 GPIO_85 GPIO_86 GPIO_87 GPIO_88 GPIO_89 GPIO_90 GPIO_93 GPIO_94 GPIO_95 GPIO_127 GPIO_130 SD_DET TP_INT TP_RST TP_I2C_SCL TP_I2C_SDA LCD_RST LCD_TE CAM0_MCLK CAM1_MCLK 100 267 123 108 106 265 239 105 264 115 177 112 104 103 169 97 45 30 31 47 48 49 50 74 75 GPIO_59 B-PD:nppukp Wakeup GPIO_61 B-PD:nppukp Wakeup GPIO_62 B-PD:nppukp Wakeup GPIO_63 B-PD:nppukp Wakeup GPIO_86 B-PD:nppukp Wakeup GPIO_66 B-PD:nppukp GPIO_85 B-PD:nppukp GPIO_87 B-PD:nppukp GPIO_88 B-PD:nppukp GPIO_89 B-PD:nppukp GPIO_90 B-PD:nppukp Wakeup GPIO_93 B-PD:nppukp Wakeup GPIO_94 B-PD:nppukp GPIO_95 B-PD:nppukp GPIO_127 B-PD:nppukp Wakeup GPIO_130 B-PD:nppukp Wakeup GPIO_67 B-PD:nppukp Wakeup GPIO_65 B-PD:nppukp Wakeup GPIO_64 B-PD:nppukp GPIO_11 B-PD:nppukp GPIO_10 B-PD:nppukp GPIO_60 B-PD:nppukp GPIO_24 B-PD:nppukp GPIO_26 B-PD:nppukp GPIO_28 B-PD:nppukp Wakeup SC200R_Series_Hardware_Design 53 / 125 Smart Module Series SC200R Series Hardware Design CAM0_RST GPIO_128 B-PD:nppukp Wakeup CAM0_PWDN GPIO_126 B-PD:nppukp Wakeup CAM2_PWDN GPIO_41 B-PD:nppukp Wakeup GPIO_38 B-PD:nppukp Wakeup 79 80 81 82 165 164 163 95 96 34 35 36 37 154 153 GPIO_129 B-PD:nppukp GPIO_125 B-PD:nppukp GPIO_27 B-PD:nppukp GPIO_91 B-PD:nppukp Wakeup GPIO_50 B-PD:nppukp Wakeup GPIO_16 B-PD:nppukp GPIO_17 B-PD:nppukp Wakeup GPIO_18 B-PD:nppukp GPIO_19 B-PD:nppukp GPIO_0 B-PD:nppukp GPIO_1 B-PD:nppukp Wakeup 1. 1) B: Bidirectional digital with CMOS input; PD:nppukp = default pull-down with programmable options following the colon (:). 2) Wakeup: Interrupt pins that can wake up the system. 2. 3. For more details about GPIO configuration, see document [2]. CAM1_RST CAM1_PWDN CAM2_MCLK CAM2_RST VOL_UP VOL_DOWN UART5_TXD UART5_RXD UART5_CTS UART5_RTS UART1_TXD UART1_RXD NOTES SC200R_Series_Hardware_Design 54 / 125 Smart Module Series SC200R Series Hardware Design 3.14. I2C Interfaces SC200R series module provides four I2C interfaces. All I2C interfaces are open drain signals and therefore you must pull them up externally. The reference power domain is 1.8 V. The SENSOR_I2C interface only supports sensors of aDSP architecture. CAM_I2C and DCAM_I2C signals are controlled by Linux Kernel code and support connection with devices related to video output. Table 18: Pin Definition of I2C Interfaces 47 48 83 84 Pin Name Pin No. I/O Description Comment TP_I2C_SCL OD I2C clock signal of touch panel TP_I2C_SDA OD I2C data signal of touch panel Used for touch panel CAM_I2C_SCL OD I2C clock signal of camera CAM_I2C_SDA OD I2C data signal of camera DCAM_I2C_SCL 166 OD I2C clock signal of camera DCAM_I2C_SDA 205 OD I2C data signal of camera SENSOR_I2C_SCL 91 OD I2C clock signal for external sensor SENSOR_I2C_SDA 92 OD I2C data signal for external sensor Used for camera Used for camera Used for external sensor 3.15. SPI Interfaces SC200R series module provides three SPI interfaces, which are multiplexed from UART and GPIO interfaces. These interfaces can only support master mode and can be used for fingerprint recognition. Table 19: Pin Definition of SPI Interfaces Pin Name Pin No. I/O Description Comment UART5_RXD 35 DI SPI5 data input Can be multiplexed into SPI5_MISO UART5_TXD 34 DO SPI5 data output Can be multiplexed into SPI5_MOSI UART5_RTS 37 DO SPI5 clock Can be multiplexed into SPI5_CLK SC200R_Series_Hardware_Design 55 / 125 Smart Module Series SC200R Series Hardware Design UART5_CTS 36 DO SPI5 chip select Can be multiplexed into SPI5_CS GPIO_22 GPIO_23 GPIO_20 GPIO_21 GPIO_87 GPIO_85 GPIO_88 GPIO_86 117 116 119 118 105 265 264 239 DO SPI6 chip select Can be multiplexed into SPI6_CS DO SPI6 clock Can be multiplexed into SPI6_CLK DO SPI6 data output Can be multiplexed into SPI6_MOSI DI SPI6 data input Can be multiplexed into SPI6_MISO DO SPI7 chip select Can be multiplexed into SPI7_CS DO SPI7 data output Can be multiplexed into SPI7_MOSI DO SPI7 clock Can be multiplexed into SPI7_CLK DI SPI7 data input Can be multiplexed into SPI7_MISO 3.16. ADC Interface SC200R series module supports one analog-to-digital converter (ADC) interface. The ADC interface supports resolution of up to 15 bits. The pin definition is shown below. Table 20: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC 128 AI Generic ADC The maximum input voltage is 1.7 V. 3.17. Motor Drive Interface The pin definition of the motor drive interface is listed below. Table 21: Pin Definition of Motor Drive Interface Pin Name Pin No. I/O Description Comment VIB_DRV_N 28 PO Motor drive Connect it to the negative pole of the motor. SC200R_Series_Hardware_Design 56 / 125 Smart Module Series SC200R Series Hardware Design The motor is driven by an exclusive circuit, and a reference circuit is shown below. Figure 18: Reference Circuit for Motor Connection When the motor stops working and the VIB_DRV_N is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.18. LCM Interface SC200R series module provides one LCM interface, which is MIPI_DSI standard compliant. The interface supports high-speed differential data transmission and supports HD+ display (1440 720 @ 60 fps). The pin definition of the LCM interface is shown below. Table 22: Pin Definition of LCM Interface Pin Name Pin No. I/O Description Comment LDO17_2V85 129 PO PWM LCD_RST LCD_TE DSI_CLK_N DSI_CLK_P 29 49 50 52 53 DO DI AO AO 2.85 V output power supply for LCM VCC PWM output which adjusts the backlight brightness LCD tearing effect LCD MIPI clock (-) LCD MIPI clock (+) DO LCD reset 1.8 V power domain SC200R_Series_Hardware_Design 57 / 125 Smart Module Series SC200R Series Hardware Design DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P 54 55 56 57 58 59 60 61 AO AO AO AO AO AO AO AO LCD MIPI data 0 (-) LCD MIPI data 0 (+) LCD MIPI data 1 (-) LCD MIPI data 1 (+) LCD MIPI data 2 (-) LCD MIPI data 2 (+) LCD MIPI data 3 (-) LCD MIPI data 3 (+) A reference circuit for the LCM interface is shown below. Figure 19: Reference Circuit Design for LCM Interface SC200R_Series_Hardware_Design 58 / 125 Smart Module Series SC200R Series Hardware Design MIPI are high-speed signal lines. It is recommended to add common-mode filters in series near the LCM connector, to improve protection against electromagnetic radiation interference. It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that the LCM factory should burn an OTP register to distinguish different screens. You can also connect the LCD_ID pin of LCM to the ADC pin of the module, but you need to make sure that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin. You can design the external backlight driving circuit for LCM according to actual requirements. A reference circuit design is shown in the following figure, in which the PWM pin is used to adjust the backlight brightness. VBAT C1 2.2F PWM Module Backlight driver LCM_LED+

LCM_LED-

Figure 20: Reference Design for External Backlight Driving Circuit 3.19. Touch Panel Interface SC200R series module provides one I2C interface for connection with Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The definitions of TP interface pins are illustrated below. Table 23: Pin Definition of Touch Panel Interface Pin Name Pin No. I/O Description Comment LDO17_2V85 129 PO LDO6_1V8 125 PO 2.85 V output power supply for TP VDD Vnorm = 2.85 V IOmax = 450 mA 1.8 V output power supply for TP I/O power domain and I2C pull-up circuit Vnorm = 1.8 V IOmax = 150 mA SC200R_Series_Hardware_Design 59 / 125 Smart Module Series SC200R Series Hardware Design TP_INT TP_RST 30 31 DO Reset signal of TP DI Interrupt signal of TP 1.8 V voltage domain. 1.8 V voltage domain. Active low. Externally pull them up to 1.8 V. Can be used for other I2C devices. TP_I2C_SCL 47 OD I2C clock signal of TP TP_I2C_SDA 48 OD I2C data signal of TP A reference circuit for the TP interface is shown below. Figure 21: Reference Circuit Design for TP Interface SC200R_Series_Hardware_Design 60 / 125 Smart Module Series SC200R Series Hardware Design 3.20. Camera Interfaces Based on MIPI_CSI standard, SC200R series module supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 13 MP. The video and photo quality is determined by various factors such as the camera sensor, camera lens quality, etc. Table 24: Pin Definition of Camera Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO LDO17_2V85 129 PO 1.8 V output power supply for DOVDD of camera Vnorm = 1.8 V IOmax = 150 mA 2.85 V output power supply for AVDD of camera Vnorm = 2.85 V IOmax = 450 mA CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P 63 64 65 66 67 68 70 71 72 73 157 196 158 197 159 198 AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI Camera MIPI clock signal (-) Camera MIPI clock signal (+) Camera MIPI data 0 signal (-) Camera MIPI data 0 signal (+) Camera MIPI data 1 signal (-) Camera MIPI data 1 signal (+) Camera MIPI data 3 signal (-) Camera MIPI data 3 signal (+) Camera MIPI data 2 signal (-) Camera MIPI data 2 signal (+) Camera MIPI clock signal (-) Camera MIPI clock signal (+) Camera MIPI data 0 signal (-) Camera MIPI data 0 signal (+) Camera MIPI data 1 signal (-) Camera MIPI data 1 signal (+) SC200R_Series_Hardware_Design 61 / 125 Smart Module Series SC200R Series Hardware Design Camera MIPI data 2 signal (-) Camera MIPI data 2 signal (+) Camera MIPI data 3 signal (-) Camera MIPI data 3 signal (+) Clock signal of camera Clock signal of camera Reset signal of camera Power down signal of camera Reset signal of camera Power down signal of camera I2C clock signal of camera I2C data signal of camera Clock signal of camera 1.8 V power domain. Externally pull them up to 1.8 V. CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P CAM0_MCLK CAM1_MCLK CAM0_RST CAM0_PWDN CAM1_RST CAM1_PWDN CAM_I2C_SCL CAM_I2C_SDA CAM2_MCLK CAM2_RST CAM2_PWDN 160 199 161 200 74 75 79 80 81 82 83 84 165 164 163 AI AI AI AI DO DO DO DO DO DO OD OD DO DO DO OD OD Reset signal of camera 1.8 V power domain. Power down signal of camera DCAM_I2C_SDA 205 I2C data signal of camera DCAM_I2C_SCL 166 I2C clock signal of camera Externally pull them up to 1.8 V. SC200R_Series_Hardware_Design 62 / 125 Smart Module Series SC200R Series Hardware Design The following is a reference circuit design for 3-camera applications. Figure 22: Reference Circuit Design for 3-Camera Applications SC200R_Series_Hardware_Design 63 / 125 Smart Module Series SC200R Series Hardware Design NOTE In 3-camera applications, CSI1_LN3_P and CSI1_LN3_N are used as CLK_P and CLK_N of camera1, CSI1_LN2_P and CSI1_LN2_N are used as the LN_P and LN_N of the camera1. 3.20.1. Design Considerations Special attention should be paid to the pin definition of LCM/camera connectors. Make sure the module and the connectors are correctly connected . MIPI are high speed signal lines, supporting maximum data rate of up to 2.1 Gbps. The differential impedance should be controlled to 100 . Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, keep all the MIPI traces of the same length. In order to avoid crosstalk, keep a distance of 1.5 times the trace width among MIPI signal lines. During impedance matching, do not connect GND on different planes to ensure impedance consistency. It is recommended to select a low-capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF. Route MIPI traces according to the following rules:

a) The total trace length should not exceed 305 mm;

b) Control the differential impedance to 100 10 %;

c) Control intra-lane length difference within 0.67 mm;

d) Control inter-lane length difference within 1.3 mm. Table 25: MIPI Trace Length Inside the Module Pin Name Pin No. Length (mm) Length Difference (P-N) DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P 12.40 12.40 11.75 11.65 9.40 9.30 9.60 9.60 DSI_LN3_N 12.35 0.00

-0.10

-0.10 0.00 0.00 52 53 54 55 56 57 58 59 60 SC200R_Series_Hardware_Design 64 / 125 Smart Module Series SC200R Series Hardware Design DSI_LN3_P CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P 12.35 18.10 18.05 18.05 18.10 18.15 18.20 18.10 18.20 18.05 18.10 22.60 22.55 22.55 22.50 20.25 20.30 20.50 20.50 12.95 12.95

-0.05 0.05 0.05 0.10 0.05

-0.05

-0.05 0.05 0.00 0.00 61 63 64 65 66 67 68 70 71 72 73 157 196 158 197 159 198 160 199 161 200 SC200R_Series_Hardware_Design 65 / 125 Smart Module Series SC200R Series Hardware Design 3.21. Sensor Interfaces SC200R series module supports communication with sensors via I2C interfaces, and it supports ALS/PS, compass, accelerometer, gyroscope, etc. Table 26: Pin Definition of Sensor Interfaces Pin Name Pin No. I/O Description Comment Dedicated for external sensors. Cannot be used for touch panel, NFC, I2C keyboard, etc. Externally pull them up to 1.8 V. SENSOR_I2C_SCL 91 OD I2C clock for external sensor SENSOR_I2C_SDA 92 OD I2C data for external sensor GPIO_43 GPIO_44 GPIO_42 GPIO_63 107 109 110 108 DI DI DI DI Light sensor interrupt Compass sensor interrupt Accelerometer sensor interrupt Gyroscope sensor interrupt 3.22. Audio Interfaces SC200R series module provides three analog input channels and three analog output channels. The following table shows the pin definition. Table 27: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MIC1_P MIC_GND MIC2_P 4 5 6 AI AI AI Main microphone input (+) Microphone reference ground Microphone input for headset (+) If it is not used, connect it to the ground. MIC_BIAS2 155 AO Microphone bias voltage 2 VO = 1.62.85 V SC200R_Series_Hardware_Design 66 / 125 Smart Module Series SC200R Series Hardware Design MIC3_P AI Secondary microphone input (+) MIC_BIAS1 AO Microphone bias voltage 1 VO = 1.62.85 V AO Earpiece output (+) AO Earpiece output (-) AO Speaker output (+) AO Speaker output (-) 148 147 8 9 10 11 136 137 138 139 EAR_P EAR_N SPK_P SPK_N HPH_R HPH_L HS_DET AO Headphone right channel output HPH_REF AO Headphone reference ground AO Headphone left channel output AI Headset insertion detect High level by default. The module offers three audio input channels, including three single-ended channels. The output voltage range of the two MIC_BIAS is programmable between 1.6 V and 2.85 V, and the maximum output current is 3 mA. The earpiece interface uses differential output. The loudspeaker interface uses differential output as well. The output channel is available with a Class-D amplifier whose output power is 1362 mW when the load is 8 . The headphone interface features stereo left and right channel output, and supports headphone insertion detect. 3.22.1. Reference Circuit Design for Microphone Interfaces Figure 23: Reference Circuit Design for ECM Microphone Interface SC200R_Series_Hardware_Design 67 / 125 Smart Module Series SC200R Series Hardware Design Figure 24: Reference Circuit Design for MEMS Microphone Interface 3.22.2. Reference Circuit Design for Earpiece Interface Figure 25: Reference Circuit Design for Earpiece Interface SC200R_Series_Hardware_Design 68 / 125 Smart Module Series SC200R Series Hardware Design 3.22.3. Reference Circuit Design for Headphone Interface Figure 26: Reference Circuit Design for Headphone Interface 3.22.4. Reference Circuit Design for Loudspeaker Interface Figure 27: Reference Circuit Design for Loudspeaker Interface 3.22.5. Design Considerations for Audio Interfaces It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900. Without this capacitor, TDD noise could be heard during voice calls. The 10 pF capacitor is used to filter out RF interference at DCS1800. Please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing SC200R_Series_Hardware_Design 69 / 125 Smart Module Series SC200R Series Hardware Design technique. Therefore, you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high-frequency noises. The severity of RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, you should select a suitable capacitor accroding to the test results. Sometimes, even no RF filtering capacitor is required. In order to decrease radio or other signal interference, place RF antennas away from audio interfaces and audio traces. Additionally, keep power traces far away from the audio traces and do not route them in parallel. Route the differential audio traces according to the differential signal layout rule. 3.23. Emergency Download Interface USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-up. This is an emergency option when failures such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design. Figure 28: Reference Circuit Design for Emergency Download Interface SC200R_Series_Hardware_Design 70 / 125 Smart Module Series SC200R Series Hardware Design 4 Wi-Fi and BT SC200R series module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth (BT) functions. The interface impedance is 50 . You can connect external antennas such as PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and BT functions. 4.1. Wi-Fi Overview SC200R series module supports 2.4/5 GHz dual-band WLAN based on IEEE 802.11a/b/g/n standard protocols. The maximum data rate is up to 150 Mbps. The features are as below:

Supports Wake-on-WLAN (WoWLAN) Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP mode Supports Wi-Fi Direct Supports MCS 0-7 for HT20 and HT40 4.1.1. Wi-Fi Performance The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 28: Wi-Fi Transmitting Performance Standard 802.11b 802.11b 802.11g 802.11g 2.4 GHz Rate 1 Mbps Output Power 16 dBm 2.5 dB 11 Mbps 16 dBm 2.5 dB 6 Mbps 16 dBm 2.5 dB 54 Mbps 14 dBm 2.5 dB 802.11n HT20 802.11n HT20 MCS0 MCS7 15 dBm 2.5 dB 13 dBm 2.5 dB SC200R_Series_Hardware_Design 71 / 125 Smart Module Series SC200R Series Hardware Design 6 Mbps 15 dBm 2.5 dB 54 Mbps 13 dBm 2.5 dB Table 29: Wi-Fi Receiving Performance 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 Standard 802.11b 802.11b 802.11g 802.11g 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 5 GHz 2.4 GHz 5 GHz MCS0 MCS7 MCS0 MCS7 MCS0 MCS7 Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 14 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB Sensitivity

-96

-87

-90

-73

-89

-71

-89

-69

-90

-72

-88

-69

-86

-66 SC200R_Series_Hardware_Design 72 / 125 Smart Module Series SC200R Series Hardware Design Reference specifications are listed below:

IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. BT Overview SC200R series module supports BT 4.2 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK,

/4-DQPSK modulation modes. Maximally supports up to 7 wireless connections. Maximally supports up to 3.5 piconets at the same time. Support one SCO (Synchronous Connection Oriented) or eSCO connection. The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. Table 30: BT Data Rate and Version Version 1.2 2.0 + EDR 3.0 + HS 4.0 Data Rate Maximum Application Throughput 1 Mbit/s 3 Mbit/s 24 Mbit/s 24 Mbit/s

> 80 kbit/s

> 80 kbit/s Reference 3.0 + HS Reference 4.0 LE Reference specifications are listed below:

Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1 + EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 SC200R_Series_Hardware_Design 73 / 125 Smart Module Series SC200R Series Hardware Design 4.2.1. BT Performance The following table lists the BT transmitting and receiving performance of SC200R series module. Table 31: BT Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 Transmitting Power 10.0 Receiver Performance Packet Types DH5 Receiving Sensitivity

-91 2-DH5 10.0 2-DH5

-90 3-DH5 9.9 3-DH5

-90 SC200R_Series_Hardware_Design 74 / 125 Smart Module Series SC200R Series Hardware Design 5 GNSS SC200R series module integrates a Qualcomm IZat GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo and BeiDou. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of the module in conduction mode. Typ.

-146

-158

-158 30.8 21 3.3

< 2.5 Unit dBm dBm dBm s s s m Table 32: GNSS Performance Parameter Description Sensitivity Reacquisition TTFF Warm start Cold start Tracking Cold start Hot start CEP-50 SC200R-WF does not support GNSS. Static Drift NOTE SC200R_Series_Hardware_Design 75 / 125 Smart Module Series SC200R Series Hardware Design 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below:

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. In user systems, place GNSS RF signal lines and RF components far away from high-speed circuits, switch-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with harsh electromagnetic environment or high ESD-protection requirements, it is recommended to add ESD protective diodes for the antenna interface. The junction capacitance of the diodes should be less than 0.5 pF. Otherwise, it will influence the impedance characteristic of RF circuit loop, or cause attenuation of bypass RF signals. Control the impedance of feeder lines and PCB traces to 50 , and keep the trace as short as possible. See Chapter 6.3 for reference circuit designs of GNSS antenna. SC200R_Series_Hardware_Design 76 / 125 Smart Module Series SC200R Series Hardware Design 6 Antenna Interfaces SC200R series module provides four antenna interfaces for the main antenna, Rx-diversity antenna, Wi-Fi/BT antenna and GNSS antenna respectively. The antenna ports have an impedance of 50 . 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. Table 33: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_MAIN 87 AI/AO Main antenna interface 50 impedance ANT_DRX 131 AI Rx-diversity antenna interface The operating frequencies of SC200R series modules are listed in the following tables. Table 34: SC200R-CE Operating Frequencies 3GPP Band EGSM900 DCS1800 Receive 925960 18051880 17101785 WCDMA B1 21102170 19201980 WCDMA B8 925960 EVDO/CDMA BC0 869894 LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 Transmit 880915 880915 824849 Unit MHz MHz MHz MHz MHz MHz MHz SC200R_Series_Hardware_Design 77 / 125 Smart Module Series SC200R Series Hardware Design LTE-FDD B5 LTE-FDD B8 869894 925960 824849 880915 LTE-TDD B34 20102025 20102025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25552655 25552655 Table 35: SC200R-EM* Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 Receive 869894 925960 Transmit 824849 880915 18051880 17101785 19301990 18501910 WCDMA B1 21102170 19201980 WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 WCDMA B8 869894 925960 824849 880915 LTE-FDD B1 21102170 19201980 LTE-FDD B2 19301990 18501910 LTE-FDD B3 18051880 17101785 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC200R_Series_Hardware_Design 78 / 125 Smart Module Series SC200R Series Hardware Design LTE-FDD B8 LTE-FDD B20 925960 791821 LTE-FDD B28(A + B) 758803 880915 832862 703748 LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25552655 25552655 Table 36: SC200R-NA Operating Frequencies 3GPP Band Receive Transmit WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 869894 824849 LTE-FDD B2 19301990 18501910 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 729746 746756 758768 734746 699716 777787 788798 704716 LTE-FDD B25 19301995 18501915 LTE-FDD B26 859894 814849 LTE-FDD B66 21002200 17101780 LTE-FDD B71 663698 617652 LTE-TDD B41 24962690 24962690 MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC200R_Series_Hardware_Design 79 / 125 Smart Module Series SC200R Series Hardware Design Table 37: SC200R-JP* Operating Frequencies 3GPP Band Receive Transmit WCDMA B1 21102170 19201980 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 830840 880915 830845 824849 880915 815830 830845 814849 703748 WCDMA B6 WCDMA B8 WCDAM B19 875885 925960 875890 LTE-FDD B5 869894 LTE-FDD B8 925960 LTE-FDD B18 LTE-FDD B19 LTE-FDD B26 LTE-FDD B28 860875 875890 859894 758803 NOTE

* means under development. LTE-FDD B11 14281447 14751495 LTE-FDD B21 1496~1511 1448~1463 LTE-TDD B41 24962690 24962690 SC200R_Series_Hardware_Design 80 / 125 Smart Module Series SC200R Series Hardware Design 6.1.1. Reference Design for Main and Rx-diversity Antenna Interfaces A reference circuit design for main and Rx-diversity antenna interfaces is shown below. Reserve a -type matching circuit for each antenna to achieve better RF performance, and place the -type matching components (R1/C1/C2, R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 . Figure 29: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi/BT Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/BT antenna interface. Table 38: Pin Definition of Wi-Fi/BT Antenna Interface Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 77 AI/AO Wi-Fi/BT antenna interface 50 impedance SC200R_Series_Hardware_Design 81 / 125 Smart Module Series SC200R Series Hardware Design Table 39: Wi-Fi/BT Frequency Type Wi-Fi (2.4 GHz) Wi-Fi (5 GHz) BT 4.2 LE Frequency 24022482 51805825 24022480 Unit MHz MHz MHz A reference circuit design for Wi-Fi/BT antenna interface is shown as below. C1 and C2 are not mounted by default and the resistor is 0 . Figure 30: Reference Circuit Design for Wi-Fi/BT Antenna 6.3. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 40: Pin Definition of GNSS Antenna Interface Pin Name Pin No. Description Comment ANT_GNSS 121 GNSS antenna interface 50 impedance I/O AI SC200R_Series_Hardware_Design 82 / 125 Smart Module Series SC200R Series Hardware Design Table 41: GNSS Frequency GLONASS 1597.51605.8 Frequency 1575.42 1.023 1561.098 2.046 1575.42 1.023 Type GPS BeiDou Galileo NOTE SC200R-WF does not support GNSS. Unit MHz MHz MHz MHz 6.3.1. Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 31: Reference Circuit Design for GNSS Passive Antenna NOTE When the passive antenna is placed far away from the module (that is, the antenna trace is long) and the external loss is more than 2 dB, it is recommended to add an external LNA circuit for better GNSS receiving performance, and place the LNA close to the antenna. SC200R_Series_Hardware_Design 83 / 125 Smart Module Series SC200R Series Hardware Design 6.3.2. Recommended Circuit for Active Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies. Therefore, it is recommended to use high-performance LDO as the power supply. A reference design for GNSS active antenna is shown below. Figure 32: Reference Circuit Design for GNSS Active Antenna 6.4. Reference Design for RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 33: Microstrip Design on a 2-layer PCB SC200R_Series_Hardware_Design 84 / 125 Smart Module Series SC200R Series Hardware Design Figure 34: Coplanar Waveguide Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) SC200R_Series_Hardware_Design 85 / 125 Smart Module Series SC200R Series Hardware Design In order to ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground. Keep the distance between the RF pins and the RF connector as short as possible. Change all the right-angle traces to curved ones and the recommended trace angle is 135. Reserve clearance under the signal pin of the antenna connector or solder joint. Keep the reference ground of RF traces complete. Meanwhile, add some ground vias around RF traces and the reference ground to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. 6.5. Antenna Installation 6.5.1. Antenna Requirements Table 42: Antenna Requirements Type Requirements The following table shows the requirement on the main antenna, Rx-diversity antenna, Wi-Fi/BT antenna and GNSS antenna. VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, EVDO/CDMA BC0, LTE B5/B8/B12/B13/B14/B17/B18/B19/B20/B26/B28A/B28B/B71) Cable Insertion Loss: < 1.5 dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B11/B21/

B25/B34/B39/B66) Cable Insertion Loss: < 2 dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) GSM/WCDMA/LTE Wi-Fi/BT VSWR: 2 Gain: 1 dBi SC200R_Series_Hardware_Design 86 / 125 Smart Module Series SC200R Series Hardware Design Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB Frequency range: 1559 MHz1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive Antenna Gain: > 0 dBi Active Antenna Noise Figure: < 1.5 dB (Typ.) Active Antenna Gain: > -2 dBi Active Antenna Embedded LNA Gain: < 17 dB (Typ.) Active Antenna Total Gain: < 17 dBi (Typ.) 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.5.2. Recommended RF Connector for Antenna Installation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 37: Dimensions of the U.FL-R-SMT Connector (Unit: mm) SC200R_Series_Hardware_Design 87 / 125 GNSS1) NOTE Smart Module Series SC200R Series Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 38: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connectors. Figure 39: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. SC200R_Series_Hardware_Design 88 / 125 Smart Module Series SC200R Series Hardware Design 7 Electrical, Reliability and Radio Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 43: Absolute Maximum Ratings Parameter VBAT USB_VBUS Peak Current of VBAT Voltage on Digital Pins Min.

-0.5

-0.5 0

-0.3 Max. Unit 6 16 3 2.16 V V A V 7.2. Power Supply Ratings Table 44: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT 3.55 3.8 4.2 V VBAT Voltage drop during transmitting burst The actual input voltages must stay between the minimum and maximum values Maximum power control level at EGSM900 400 mV SC200R_Series_Hardware_Design 89 / 125 Smart Module Series SC200R Series Hardware Design Maximum power control level at EGSM900 1.8 3.0 A USB_VBUS USB power supply 4.35 5.0 6.2 V IVBAT VRTC Peak supply current (during transmission slot) Power supply voltage of the backup battery 2.0 3.0 3.25 V 7.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 45: Operating and Storage Temperatures Parameter Min. Max. Unit Operating temperature range1)

-35 Storage Temperature Range

-40

+75

+90 C C Typ.

+25 NOTE 1) Within the operating temperature range, the module is 3GPP compliant. SC200R_Series_Hardware_Design 90 / 125 Smart Module Series SC200R Series Hardware Design 7.4. Current Consumption The values of current consumption are shown below. Table 46: SC200R-CE Current Consumption Parameter Description Conditions OFF state Power down Typ. Unit 13 A IVBAT GSM/GPRS supply current WCDMA supply current CDMA supply current LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected) @ DRX = 2 5.26 mA Sleep (USB disconnected) @ DRX = 5 4.82 mA Sleep (USB disconnected) @ DRX = 9 4.55 mA Sleep (USB disconnected) @ DRX = 6 4.60 mA Sleep (USB disconnected) @ DRX = 7 4.55 mA Sleep (USB disconnected) @ DRX = 8 3.70 mA Sleep (USB disconnected) @ DRX = 9 3.60 mA BC0 CH283 @ Slot Cycle Index = 1 4.80 mA BC0 CH283 @ Slot Cycle Index = 7 5.80 mA Sleep (USB disconnected) @ DRX = 5 7.03 mA Sleep (USB disconnected) @ DRX = 6 4.95 mA Sleep (USB disconnected) @ DRX = 7 4.20 mA Sleep (USB disconnected) @ DRX = 9 3.90 mA Sleep (USB disconnected) @ DRX = 5 6.78 mA Sleep (USB disconnected) @ DRX = 6 5.11 mA Sleep (USB disconnected) @ DRX = 7 4.34 mA Sleep (USB disconnected) @ DRX = 9 3.93 mA EGSM900 @ PCL 5 255.7 mA EGSM900 @ PCL 12 113.9 mA SC200R_Series_Hardware_Design 91 / 125 Smart Module Series SC200R Series Hardware Design EGSM900 @ PCL 19 98.68 mA DCS1800 @ PCL 0 185.8 mA DCS1800 @ PCL 7 103.2 mA DCS1800 @ PCL 15 97.06 mA WCDMA voice call B1 @ max power B8 @ max power 534.1 mA 529.6 mA EGSM900 (1UL/4DL) @ PCL 5 246.2 mA EGSM900 (2UL/3DL) @ PCL 5 394.1 mA EGSM900 (3UL/2DL) @ PCL 5 487.9 mA GPRS data transfer EGSM900 (4UL/1DL) @ PCL 5 576.6 mA DCS1800 (1UL/4DL) @ PCL 0 170.8 mA DCS1800 (2UL/3DL) @ PCL 0 266.2 mA DCS1800 (3UL/2DL) @ PCL0 368.4 mA DCS1800 (4UL/1DL) @ PCL 0 442.5 mA EGSM900 (1UL/4DL) @ PCL 8 188.3 mA EGSM900 (2UL/3DL) @ PCL 8 321.6 mA EGSM900 (3UL/2DL) @ PCL 8 441.3 mA EGSM900 (4UL/1DL) @ PCL 8 562.5 mA DCS1800 (1UL/4DL) @ PCL 2 163.2 mA DCS1800 (2UL/3DL) @ PCL 2 274.4 mA DCS1800 (3UL/2DL) @ PCL 2 386.4 mA DCS1800 (4UL/1DL) @ PCL 2 496.5 mA B1 (HSDPA) @ max power 476.4 mA EDGE data transfer WCDMA data transfer B8 (HSDPA) @ max power 461.5 mA B1 (HSUPA) @ max power 505.4 mA SC200R_Series_Hardware_Design 92 / 125 Smart Module Series SC200R Series Hardware Design EVDO/CDMA data transfer B8 (HSUPA) @ max power 493.5 mA BC0 @ max power 495.0 mA LTE-FDD B1 @ max power 709.5 mA LTE-FDD B3 @ max power 677.4 mA LTE-FDD B5 @ max power 559.2 mA LTE-FDD B8 @ max power 631.9 mA LTE-TDD B38 @ max power 412.6 mA LTE-TDD B39 @ max power 379.9 mA LTE-TDD B40 @ max power 411.3 mA LTE-TDD B41 @ max power 413.5 mA LTE data transfer LTE-TDD B34 @ max power 374.3 mA Table 47: SC200R-EM* Current Consumption Parameter Description Conditions OFF state Power down Typ. Unit 20 A IVBAT Sleep (USB disconnected) @ DRX = 8 TBD mA GSM/GPRS supply current WCDMA supply current LTE-FDD supply current Sleep (USB disconnected) @ DRX = 2 TBD mA Sleep (USB disconnected) @ DRX = 5 TBD mA Sleep (USB disconnected) @ DRX = 9 TBD mA Sleep (USB disconnected) @ DRX = 6 TBD mA Sleep (USB disconnected) @ DRX = 9 TBD mA Sleep (USB disconnected) @ DRX = 6 TBD mA Sleep (USB disconnected) @ DRX = 8 TBD mA Sleep (USB disconnected) @ DRX = 9 TBD mA LTE-TDD Sleep (USB disconnected) @ DRX = 6 TBD mA SC200R_Series_Hardware_Design 93 / 125 Smart Module Series SC200R Series Hardware Design supply current Sleep (USB disconnected) @ DRX = 8 TBD mA GSM voice call Sleep (USB disconnected) @ DRX = 9 TBD mA GSM850 @ PCL 5 TBD mA GSM850 @ PCL 12 TBD mA GSM850 @ PCL 19 TBD mA EGSM900 @ PCL 5 TBD mA EGSM900 @ PCL 12 TBD mA EGSM900 @ PCL 19 TBD mA DCS1800 @ PCL 0 TBD mA DCS1800 @ PCL 7 TBD mA DCS1800 @ PCL 15 TBD mA PCS1900 @ PCL 0 TBD mA PCS1900 @ PCL 7 TBD mA PCS1900 @ PCL 15 TBD mA WCDMA voice call B4 @ max power B1 @ max power B2 @ max power B5 @ max power B8 @ max power TBD mA TBD mA TBD mA TBD mA TBD mA GSM850(1UL/4DL) @ PCL 5 TBD mA GSM850 (2UL/3DL) @ PCL 5 TBD mA GPRS data transfer GSM850 (3UL/2DL) @ PCL 5 TBD mA GSM850 (4UL/1DL) @ PCL 5 TBD mA EGSM900 (1UL/4DL) @ PCL 5 TBD mA EGSM900 (2UL/3DL) @ PCL 5 TBD mA SC200R_Series_Hardware_Design 94 / 125 Smart Module Series SC200R Series Hardware Design EGSM900 (3UL/2DL) @ PCL 5 TBD mA EGSM900 (4UL/1DL) @ PCL 5 TBD mA DCS1800 (1UL/4DL) @ PCL 0 TBD mA DCS1800 (2UL/3DL) @ PCL 0 TBD mA DCS1800 (3UL/2DL) @ PCL0 TBD mA DCS1800 (4UL/1DL) @ PCL 0 TBD mA PCS1900 (1UL/4DL) @ PCL 0 TBD mA PCS1900 (2UL/3DL) @ PCL 0 TBD mA PCS1900 (3UL/2DL) @ PCL0 TBD mA PCS1900 (4UL/1DL) @ PCL 0 TBD mA GSM850(1UL/4DL) @ PCL 8 TBD mA GSM850 (2UL/3DL) @ PCL 8 TBD mA GSM850 (3UL/2DL) @ PCL 8 TBD mA GSM850 (4UL/1DL) @ PCL 8 TBD mA EGSM900 (1UL/4DL) @ PCL 8 TBD mA EGSM900 (2UL/3DL) @ PCL 8 TBD mA EGSM900 (3UL/2DL) @ PCL 8 TBD mA DCS1800 (2UL/3DL) @ PCL 2 TBD mA DCS1800 (3UL/2DL) @ PCL 2 TBD mA DCS1800 (4UL/1DL) @ PCL 2 TBD mA PCS1900 (1UL/4DL) @ PCL 2 TBD mA PCS1900 (2UL/3DL) @ PCL 2 TBD mA PCS1900 (3UL/2DL) @ PCL 2 TBD mA PCS1900 (4UL/1DL) @ PCL 2 TBD mA EDGE data transfer DCS1800 (1UL/4DL) @ PCL 2 TBD mA SC200R_Series_Hardware_Design 95 / 125 Smart Module Series SC200R Series Hardware Design WCDMA data transfer B1 (HSDPA) @ max power TBD mA B2 (HSDPA) @ max power TBD mA B4 (HSDPA) @ max power TBD mA B5 (HSDPA) @ max power TBD mA B8 (HSDPA) @ max power TBD mA B1 (HSUPA) @ max power TBD mA B2 (HSUPA) @ max power TBD mA B4 (HSUPA) @ max power TBD mA B5 (HSUPA) @ max power TBD mA B8 (HSUPA) @ max power TBD mA LTE-FDD B1 @ max power TBD mA LTE-FDD B2 @ max power TBD mA LTE-FDD B3 @ max power TBD mA LTE-FDD B4 @ max power TBD mA LTE-FDD B5 @ max power TBD mA LTE-FDD B20 @ max power TBD mA LTE-FDD B28 @ max power TBD mA LTE-TDD B38 @ max power TBD mA LTE-TDD B40 @ max power TBD mA LTE-TDD B41 @ max power TBD mA LTE data transfer LTE-FDD B7 @ max power TBD mA LTE-FDD B8 @ max power TBD mA SC200R_Series_Hardware_Design 96 / 125 Smart Module Series SC200R Series Hardware Design Table 48: SC200R-NA Current Consumption Parameter Description Conditions OFF state Power down Typ. Unit 13 A IVBAT WCDMA voice call B4 @ max power WCDMA supply current LTE-FDD supply current LTE-TDD supply current Sleep (USB disconnected) @ DRX = 6 3.922 mA Sleep (USB disconnected) @ DRX = 8 3.041 mA Sleep (USB disconnected) @ DRX = 9 2.795 mA Sleep (USB disconnected) @ DRX = 6 6.748 mA Sleep (USB disconnected) @ DRX = 8 3.689 mA Sleep (USB disconnected) @ DRX = 9 3.133 mA Sleep (USB disconnected) @ DRX = 6 6.935 mA Sleep (USB disconnected) @ DRX = 8 3.788 mA Sleep (USB disconnected) @ DRX = 9 3.145 mA B2 @ max power B5 @ max power 643.7 mA 554.5 mA 475.5 mA B2 (HSDPA) @ max power 592.1 mA B4 (HSDPA) @ max power 554.9 mA WCDMA data transfer B5 (HSDPA) @ max power 445.0 mA B2 (HSUPA) @ max power 522.7 mA B4 (HSUPA) @ max power 526.9 mA B5 (HSUPA) @ max power 444.5 mA LTE-FDD B2 @ max power LTE-FDD B4 @ max power LTE-FDD B5 @ max power LTE-FDD B7 @ max power 791 761 590 861 mA mA mA mA LTE data transfer SC200R_Series_Hardware_Design 97 / 125 Smart Module Series SC200R Series Hardware Design LTE-FDD B12 @ max power LTE-FDD B13 @ max power LTE-FDD B14 @ max power LTE-FDD B17@ max power LTE-FDD B25 @ max power LTE-FDD B26 @ max power LTE-FDD B66 @ max power LTE-FDD B71 @ max power LTE-TDD B41 @ max power 636 650 648 617 812 672 782 803 491 mA mA mA mA mA mA mA mA mA Table 49: SC200R-JP* Current Consumption Parameter Description Conditions OFF state Power down Typ. Unit 20 A IVBAT Sleep (USB disconnected) @ DRX = 9 TBD mA WCDMA supply current LTE-FDD supply current LTE-TDD supply current Sleep (USB disconnected) @ DRX = 6 TBD mA Sleep (USB disconnected) @ DRX = 8 TBD mA Sleep (USB disconnected) @ DRX = 9 TBD mA Sleep (USB disconnected) @ DRX = 6 TBD mA Sleep (USB disconnected) @ DRX = 8 TBD mA Sleep (USB disconnected) @ DRX = 6 TBD mA Sleep (USB disconnected) @ DRX = 8 TBD mA Sleep (USB disconnected) @ DRX = 9 TBD mA WCDMA voice call B6 @ max power B1 @ max power B8 @ max power TBD mA TBD mA TBD mA SC200R_Series_Hardware_Design 98 / 125 Smart Module Series SC200R Series Hardware Design WCDMA data transfer B19 @ max power TBD mA B1 (HSDPA) @ max power TBD mA B6 (HSDPA) @ max power TBD mA B8 (HSDPA) @ max power TBD mA B19 (HSDPA) @ max power TBD mA B1 (HSUPA) @ max power TBD mA B6 (HSUPA) @ max power TBD mA B8 (HSUPA) @ max power TBD mA B19 (HSUPA) @ max power TBD mA LTE-FDD B1 @ max power TBD mA LTE-FDD B3 @ max power TBD mA LTE-FDD B5 @ max power TBD mA LTE-FDD B8 @ max power TBD mA LTE-FDD B11 @ max power TBD mA LTE-FDD B19 @ max power TBD mA LTE-FDD B21 @ max power TBD mA LTE-FDD B26 @ max power TBD mA LTE-FDD B28 @ max power TBD mA LTE-TDD B41 @ max power TBD mA LTE data transfer LTE-FDD B18 @ max power TBD mA NOTE

* means under development. SC200R_Series_Hardware_Design 99 / 125 Smart Module Series SC200R Series Hardware Design 7.5. RF Output Power The following tables show the RF output power of SC200R series modules. Table 50: SC200R-CE RF Output Power Max. Min. 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm EVDO/CDMA BC0 24 dBm +3/-1 dB

< -49 dBm Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8 LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 Frequency GSM850 EGSM900 DCS1800 LTE-TDD B34 23 dBm 2 dB LTE-TDD B38 23 dBm 2 dB LTE-TDD B39 23 dBm 2 dB LTE-TDD B40 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB Table 51: SC200R-EM* RF Output Power 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB Max. TBD TBD TBD

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm Min. TBD TBD TBD SC200R_Series_Hardware_Design 100 / 125 Smart Module Series SC200R Series Hardware Design TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 LTE-TDD B38 LTE-TDD B40 LTE-TDD B41 Frequency WCDMA B2 WCDMA B4 WCDMA B5 Table 52: SC200R-NA RF Output Power Max. Min. 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm LTE-FDD B2 23 dBm 2 dB

< -39 dBm SC200R_Series_Hardware_Design 101 / 125 Smart Module Series SC200R Series Hardware Design LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB LTE-FDD B12 23 dBm 2 dB LTE-FDD B13 23 dBm 2 dB LTE-FDD B14 23 dBm 2 dB LTE-FDD B17 23 dBm 2 dB LTE-FDD B25 23 dBm 2 dB LTE-FDD B26 23 dBm 2 dB LTE-FDD B66 23 dBm 2 dB LTE-FDD B71 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB Table 53: SC200R-JP* RF Output Power Frequency WCDMA B1 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 LTE-FDD B11 LTE-FDD B18 Max. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm Min. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD SC200R_Series_Hardware_Design 102 / 125 LTE-FDD B19 LTE-FDD B21 LTE-FDD B26 LTE-FDD B28 LTE-TDD B41 NOTES 1. 2. Smart Module Series SC200R Series Hardware Design TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD In GPRS 4-slot Tx mode, the maximum output power is reduced by 3 dB. This design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.

* means under development. 7.6. RF Receiving Sensitivity The following table shows the RF receiving sensitivity of SC200R series modules. Table 54: SC200R-CE RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8

-109.5

-109.6

-109.5

-110.5 EVDO/CDMA BC0

-109.5 LTE-FDD B3 (10 MHz)

-97.9 LTE-FDD B5 (10 MHz)

-100.1 LTE-FDD B8 (10 MHz)

-98.3

-110.5

-110.5

-97.6

-97.3

-99.6

-98.1

TBD TBD

-99.2

-102.8

-102.3

-102.4 dBm

-102.4 dBm

-106.7 dBm

-103.7 dBm

-104 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm LTE-FDD B1 (10 MHz)

-98.1

-100.2

-96.3 dBm SC200R_Series_Hardware_Design 103 / 125 Smart Module Series SC200R Series Hardware Design LTE-TDD B34 (10 MHz)

-98.4 LTE-TDD B38 (10 MHz)

-98.8 LTE-TDD B39 (10 MHz)

-98.5 LTE-TDD B40 (10 MHz)

-98.9

-98.3

-98.7

-98

-99 LTE-TDD B41 (10 MHz)

-98.2

-97.9 Table 55: SC200R-EM* RF Receiving Sensitivity

-101.5

-101.8

-101.3

-102.4

-101.3

-96.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO Frequency GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 TBD TBD TBD TBD TBD TBD TBD TBD TBD LTE-FDD B1 (10 MHz) TBD LTE-FDD B2 (10 MHz) TBD LTE-FDD B3 (10 MHz) TBD LTE-FDD B4 (10 MHz) TBD LTE-FDD B5 (10 MHz) TBD LTE-FDD B7 (10 MHz) TBD LTE-FDD B8 (10 MHz) TBD

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-102.4 dBm

-102.4 dBm

-102.4 dBm

-102.4 dBm

-106.7 dBm

-104.7 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm SC200R_Series_Hardware_Design 104 / 125 Smart Module Series SC200R Series Hardware Design Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO

-110.5

-104.7 dBm LTE-FDD B20 (10 MHz) TBD LTE-FDD B28 (10 MHz) TBD LTE-TDD B38 (10 MHz) TBD LTE-TDD B40 (10 MHz) TBD LTE-TDD B41 (10 MHz) TBD TBD TBD TBD TBD TBD Table 56: SC200R-NA RF Receiving Sensitivity Frequency WCDMA B2 WCDMA B4 WCDMA B5

-109.5

-110.5

-111 LTE-FDD B2 (10 MHz)

-97.4 LTE-FDD B4 (10 MHz) LTE-FDD B5 (10 MHz)

-98

-99 LTE-FDD B7 (10 MHz)

-96.8 LTE-FDD B12 (10 MHz)

-96.4 LTE-FDD B13 (10 MHz)

-99.1 LTE-FDD B14 (10 MHz)

-98.2 LTE-FDD B17 (10 MHz)

-96.5 LTE-FDD B25 (10 MHz)

-97.2 LTE-FDD B66 (10 MHz)

-98.3 LTE-FDD B71 (10 MHz)

-96.3

-110

-110.5

-111.5

-98.2

-98.2

-100.6

-97.4

-96.8

-96.4

-96.3

-96.7

-98.2

-98.7

-97.3

-97.9 LTE-FDD B26 (10 MHz)

-99.3

-100.6 TBD TBD TBD TBD TBD

-111

-112

-99.6

-100.5

-102.7

-99.7

-100.2

-101.1

-100.3

-100.1

-99.5

-102.4

-100.7

-99.8

-93.3 dBm

-94.8 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm

-106.7 dBm

-104.7 dBm

-94.3 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-92.8 dBm

-93.8 dBm

-96.3 dBm

-93.5 dBm LTE-TDD B41 (10 MHz)

-97.9

-100.1

-94.3 dBm SC200R_Series_Hardware_Design 105 / 125 Smart Module Series SC200R Series Hardware Design Table 57: SC200R-JP* RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-102.4 dBm

-102.4 dBm

-106.7 dBm

-103.7 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-93.8 dBm

-94.8 dBm

-94.3 dBm Frequency WCDMA B1 WCDMA B6 WCDMA B8 WCDAM B19 TBD TBD TBD TBD LTE-FDD B1 (10 MHz) TBD LTE-FDD B3 (10 MHz) TBD LTE-FDD B5 (10 MHz) TBD LTE-FDD B8 (10 MHz) TBD LTE-FDD B11 (10 MHz) TBD LTE-FDD B18 (10 MHz) TBD LTE-FDD B19 (10 MHz) TBD LTE-FDD B21 (10 MHz) TBD LTE-FDD B26 (10 MHz) TBD LTE-FDD B28 (10 MHz) TBD LTE-TDD B41 (10 MHz) TBD NOTE

* means under development. SC200R_Series_Hardware_Design 106 / 125 Smart Module Series SC200R Series Hardware Design 7.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the electrostatic discharge characteristics of SC200R series module. Table 58: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Points Contact Discharge Air Discharge Unit VBAT, GND

+/-5 All Antenna Interfaces

+/-5 Other Interfaces

+/-0.5

+/-10

+/-10

+/-1 kV kV kV SC200R_Series_Hardware_Design 107 / 125 Smart Module Series SC200R Series Hardware Design 8 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are 0.05 mm. 8.1. Mechanical Dimensions of the Module Pin 1 Top view Figure 40: Top and Side Dimensions Side view SC200R_Series_Hardware_Design 108 / 125 Smart Module Series SC200R Series Hardware Design Figure 41: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC200R_Series_Hardware_Design 109 / 125 Smart Module Series SC200R Series Hardware Design 8.2. Recommended Footprint Figure 42: Recommended Footprint (Top View) NOTES on the host PCB. 1. For easy maintenance of the module, keep at least 5 mm between the module and other components 2. All RESERVED pins should be kept open and MUST NOT be connected to ground. SC200R_Series_Hardware_Design 110 / 125 Smart Module Series SC200R Series Hardware Design 8.3. Top and Bottom Views of the Module Figure 43: Top View of the Module Figure 44: Bottom View of the Module NOTE These are renderings of SC200R series module. For authentic dimension and appearance, refer to the module that you receive from Quectel. SC200R_Series_Hardware_Design 111 / 125 Smart Module Series SC200R Series Hardware Design 9 Storage, Manufacturing and Packaging 9.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. should be 35 %60 %. 3. The floor life of the module is 168 hours 1) in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 5. SC200R_Series_Hardware_Design 112 / 125 Smart Module Series SC200R Series Hardware Design NOTES 1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. 2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative moisture is over 60 %, It is recommended to start the solder reflow process within 24 hours after the package is removed. And do not remove the packages of tremendous modules if they are not ready for soldering. 3. Please take the module out of the packaging and put it on high-temperature resistant fixtures before the baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for baking procedure. 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. It is suggested that the peak reflow temperature is 238246 C, and the absolute maximum reflow temperature is 246 C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. SC200R_Series_Hardware_Design 113 / 125 Smart Module Series SC200R Series Hardware Design Reflow Zone Max slope:

2 to 3C/s C Cooling down slope:

-1.5 to -3C/s B D Temp. (C) 246 238 220 200 150 100 Soak Zone A Max slope: 1 to 3C/s Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle Figure 45: Recommended Reflow Soldering Thermal Profile Table 59: Recommended Thermal Profile Parameters Soak time (between A and B: 150 C and 200 C) 70120 s Recommendation 13 C/s 23 C/s 4570 s 238 C to 246 C

-1.5 to -3 C/s 1 SC200R_Series_Hardware_Design 114 / 125 Smart Module Series SC200R Series Hardware Design 9.3. Packaging SC200R series module is packaged in tape and reel carriers, and sealed in the vacuum-sealed bag. It is not recommended to open the vacuum package before using the module for actual production. Each reel is 380 mm in diameter and contains 200 modules. The following figures show the package details, measured in mm. Figure 46: Tape Dimensions (Unit: mm) SC200R_Series_Hardware_Design 115 / 125 Smart Module Series SC200R Series Hardware Design Figure 47: Reel Dimensions (Unit: mm) Table 60: Reel Packaging Model Name MOQ for MP Minimum Package: 200 pcs Minimum Package 4 = 800 pcs SC200R 200 pcs Size: 405 mm 390 mm 83 mm N.W: 1.9 kg G.W: 3.7 kg Size: 425 mm 358 mm 410 mm N.W: 7.6 kg G.W: 15.2 kg SC200R_Series_Hardware_Design 116 / 125 Smart Module Series SC200R Series Hardware Design 10 Appendix A References Table 61: Related Documents SN Document Name Remark

[1]

Quectel_Smart_EVB_G2_User_Guide Smart EVB G2 User Guide Quectel_SC200R_Series_Pin_Description_and _GPIO_Configuration SC200R Series Pin Description and GPIO Configuration

[3]

Quectel_RF_Layout_Application_Note RF Layout Application Note Quectel_Module_Secondary_SMT_Application _Note Module Secondary SMT Application Note

[5]

Quectel_SC200R_Series_Reference_Design SC200R Series Reference Design Table 62: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter Ambient Light Sensor Adaptive Multi-rate Access Point Bits per Second Code Division Multiple Access Complementary Metal Oxide Semiconductor Coding Scheme Circuit Switched Data Camera Serial Interface

[2]

[4]

ADC ALS AMR AP bps CDMA CMOS CS CSD CSI SC200R_Series_Hardware_Design 117 / 125 Smart Module Series SC200R Series Hardware Design EV-DO/EVDO Evolution-Data Optimized CTS DC DRX DSI DSP ECM EDGE EFR EGSM ESD ESR FDD FR GMSK GNSS GPIO GPRS GPS GPU GRFC GSM HR HSDPA HSPA Clear to Send Dual Carrier Discontinuous Reception Display Serial Interface Digital Signal Processor Electret Condenser Microphone Enhanced Data Rate for GSM Evolution Enhanced Full Rate Enhanced GSM Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System General Purpose Input/Output General Packet Radio Service Global Positioning System Graphics Processing Unit Generic RF control Global System for Mobile Communications Half Rate High Speed Downlink Packet Access High Speed Packet Access SC200R_Series_Hardware_Design 118 / 125 Smart Module Series SC200R Series Hardware Design HSPA+

HSUPA High-Speed Packet Access+

High Speed Uplink Packet Access IC I/O I2C Imax Inorm LCC LCD LCM LDO LE LED LGA LNA LTE MIPI NFC NTC OTG OTP PCB PDU PWM Integrated Circuit Input/Output Inter-Integrated Circuit Maximum Load Current Normal Current Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy Light Emitting Diode Land Grid Array Low Noise Amplifier Long-Term Evolution Mobile Industry Processor Interface Near Field Communication Negative Temperature Coefficient On-The-Go One Time Programable Printed Circuit Board Protocol Data Unit Pulse Width Modulation MEMS Micro-Electro-Mechanical System SC200R_Series_Hardware_Design 119 / 125 Smart Module Series SC200R Series Hardware Design SD Card Secure Digital Card PS PSK QAM QPSK RF RFFE RTC RTS Rx SAW SMS SPI TDD TP TVS Tx UART UMTS USB

(U)SIM VBAT Vmax Vnorm Vmin Proximity Sensor Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency RF Front End Real Time Clock Request to Send Receive Surface Acoustic Wave Short Message Service Serial Peripheral Interface Time-Division Duplex Touch Panel Transient Voltage Suppressor Transmit Universal Asynchronous Receiver & Transmitter Universal Mobile Teleco mmunications System Universal Serial Bus

(Universal) Subscriber Identity Module Voltage at Battery (Pin) Maximum Voltage Value Normal Voltage Value Minimum Voltage Value SC200R_Series_Hardware_Design 120 / 125 Smart Module Series SC200R Series Hardware Design VI VIHmax VIHmin VILmax VILmin VImax VImin VO VOHmax VOHmin VOLmax VOLmin WCDMA WLAN Voltage Input Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Voltage Output Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Wideband Code Division Multiple Access Wireless Local Area Network SC200R_Series_Hardware_Design 121 / 125 Smart Module Series SC200R Series Hardware Design 11 Appendix B GPRS Coding Schemes Table 63: Description of Different Coding Schemes Radio Block excl. USF and BCS 181 Scheme Code Rate USF Pre-coded USF BCS Tail Coded Bits Punctured Bits Data Rate kbit/s CS-1 1/2 3 3 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16

456 21.4 SC200R_Series_Hardware_Design 122 / 125 Smart Module Series SC200R Series Hardware Design 12 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3 + 1 or 2 + 2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 64: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 1 1 2 1 2 2 3 1 2 2 3 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA SC200R_Series_Hardware_Design 123 / 125 Smart Module Series SC200R Series Hardware Design 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 SC200R_Series_Hardware_Design 124 / 125 Smart Module Series SC200R Series Hardware Design 13 Appendix D EDGE Modulation and Coding Schemes Table 65: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslots 4 Timeslots GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK C B A C B A B A A 8.80 kbps 17.60 kbps 35.20 kbps 11.2 kbps 22.4 kbps 44.8 kbps 14.8 kbps 29.6 kbps 59.2 kbps 17.6 kbps 35.2 kbps 70.4 kbps 22.4 kbps 44.8 kbps 89.6 kbps 29.6 kbps 59.2 kbps 118.4 kbps 44.8 kbps 89.6 kbps 179.2 kbps 54.4 kbps 108.8 kbps 217.6 kbps 59.2 kbps 118.4 kbps 236.8 kbps MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 SC200R_Series_Hardware_Design 125 / 125

 

 

 

 

 

 

 

 

 

 

ees Secrets

$C200R-WF Q1-A2202 NA SC200RWFNA-E51-UNNNA C FCC. ID:XMR20SC200RWF IC:10224A-20SC200RWE SN: E18671975000050

 

 

Quectel Wireless Solutions Co., Ltd Request for Confidentiality Date: _2020/12/14_ Subject: Confidentiality Request for: _____ FCC ID: XMR20SC200RWF ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR20SC200RWF _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title2) Jean Hu

(Print name)

 

 

 

 

 

 

Quectel Wireless Solutions Co., Ltd Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Co., Ltd XMR20SC200RWF Smart Module The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

EUT Condition The radio elements of the modular transmitter have their own shielding. Comply YES YES YES YES YES The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf All power lines derived from the host device are regulated before energizing other circuits internal to SMART MODULE . Please see schematic.pdf Device uses a micro-strip trace on the hosts printed circuit board to an antenna connector on the host circuit board. SMART MODULE was tested in a standalone configuration via a PCMCIA extender. Please see spurious setup Modular approval requirement

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements

(b) The modular transmitter have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. must

(c)The modular transmitter must have its own power supply regulation.

(d)

(e)The modular The must modular transmitter comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. be transmitter must requirements. Unless line conducted requirements tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 the transmitter module will be battery powered, it must comply with the AC in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no found Quectel Wireless Solutions Co., Ltd the case of coupling between the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)) must not be in side another device during testing.

(f)The modular transmitter be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. must

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization requirements, which are based on the intendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. The label position of SMART MODULE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text:

Contains FCC ID:

XMR20SC200RWF. Please see the label.pdf SMART MODULE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. SMART MODULE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES YES YES Dated By:

2020/12/14 Jean Hu Signature Printed Title: Certification Section On behalf of :

Quectel Wireless Solutions Co., Ltd Telephone:

+86-21-51086236 ext 6511

 

 

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE: December 14, 2020 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR20SC200RWF. Any and all acts carried out by TA Technology (Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Co., Ltd