FCC ID: XMR2023FCS960KN Wi-Fi & Bluetooth Module

FCS960K-N Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-06-29 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCS960K-N_Hardware_Design 1 / 46 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FCS960K-N_Hardware_Design 2 / 46 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCS960K-N_Hardware_Design 3 / 46 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

2023-06-29 Wesley WEI Creation of the document 1.0.0 2023-06-29 Wesley WEI Preliminary FCS960K-N_Hardware_Design 4 / 46 Wi-Fi&Bluetooth Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Contents ...................................................................................................................................................... 5 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 8 1 Introduction ......................................................................................................................................... 9 1.1. Special Mark .............................................................................................................................. 9 2 Product Overview ............................................................................................................................. 10 2.1. Key Features ............................................................................................................................ 11 2.2. Functional Diagram .................................................................................................................. 12 3 RF Performances .............................................................................................................................. 13 3.1. Wi-Fi Performances ................................................................................................................. 13 3.2. Bluetooth Performances .......................................................................................................... 15 4 Application Interfaces ...................................................................................................................... 16 4.1. Pin Assignment ........................................................................................................................ 16 4.2. Pin Description ......................................................................................................................... 17 4.3. Power Supply ........................................................................................................................... 20 4.4. Wi-Fi Application Interfaces ..................................................................................................... 21 4.4.1. SDIO Interface .............................................................................................................. 21 4.5. Bluetooth Application Interfaces .............................................................................................. 22 4.5.1. UART ............................................................................................................................ 23 4.5.2. PCM Interface ............................................................................................................... 23 4.6. RF Antenna Interfaces ............................................................................................................. 24 4.6.1. Reference Design ......................................................................................................... 24 4.6.2. RF Routing Guidelines .................................................................................................. 25 4.6.3. RF Connector Recommendation .................................................................................. 27 5 Electrical Characteristics & Reliability ........................................................................................... 29 5.1. Absolute Maximum Ratings ..................................................................................................... 29 5.2. Power Supply Ratings .............................................................................................................. 29 5.3. Power Consumption ................................................................................................................. 30 5.3.1. Wi-Fi Power Consumption ............................................................................................ 30 5.3.2. Bluetooth Power Consumption ..................................................................................... 31 5.4. Digital I/O Characteristics ........................................................................................................ 31 5.5. ESD Protection ......................................................................................................................... 32 5.6. Thermal Dissipation ................................................................................................................. 32 6 Mechanical Information .................................................................................................................... 34 6.1. Mechanical Dimensions ........................................................................................................... 34 6.2. Recommended Footprint ......................................................................................................... 36 FCS960K-N_Hardware_Design 5 / 46 Wi-Fi&Bluetooth Module Series 6.3. Top and Bottom Views ............................................................................................................. 37 7 Storage, Manufacturing & Packaging ............................................................................................. 38 7.1. Storage Conditions................................................................................................................... 38 7.2. Manufacturing and Soldering ................................................................................................... 39 7.3. Packaging Specifications ......................................................................................................... 41 7.3.1. Carrier Tape .................................................................................................................. 41 7.3.2. Plastic Reel ................................................................................................................... 42 7.3.3. Mounting Direction ........................................................................................................ 42 7.3.4. Packaging Process ....................................................................................................... 43 8 Appendix References ....................................................................................................................... 44 FCS960K-N_Hardware_Design 6 / 46 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark................................................................................................................................... 9 Table 2: Basic Information ......................................................................................................................... 10 Table 3: Key Features ................................................................................................................................ 11 Table 4: Wi-Fi Performances ..................................................................................................................... 13 Table 6: Bluetooth Performances .............................................................................................................. 15 Table 8: I/O Parameters Definition ............................................................................................................. 17 Table 9: Pin Description ............................................................................................................................. 17 Table 10: UART Parameters ...................................................................................................................... 23 Table 11: Antenna Design Requirements .................................................................................................. 24 Table 12: Absolute Maximum Ratings (Unit: V) ......................................................................................... 29 Table 13: Module Power Supply Ratings (Unit: V) .................................................................................... 29 Table 5: Wi-Fi Power Consumption ........................................................................................................... 30 Table 7: Bluetooth Power Consumption in Non-signalling Modes ............................................................ 31 Table 15: VDD_IO I/O Requirements (Unit: V) .......................................................................................... 31 Table 14: Electrostatics Discharge Characteristics (Unit: kV) ................................................................... 32 Table 16: Recommended Thermal Profile Parameters ............................................................................. 40 Table 17: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 41 Table 18: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 42 Table 19: Related Documents .................................................................................................................... 44 Table 20: Terms and Abbreviations ........................................................................................................... 44 FCS960K-N_Hardware_Design 7 / 46 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 12 Figure 2: Pin Assignment (Top View) ........................................................................................................ 16 Figure 3 Reference Circuit of Power Supply .............................................................................................. 20 Figure 4: Power-up Timing ......................................................................................................................... 20 Figure 5 Wi-Fi Application Interface Connection ....................................................................................... 21 Figure 6: SDIO Interface Connection ......................................................................................................... 21 Figure 7: Bluetooth Application Interface Connection ............................................................................... 22 Figure 8: Reference Circuit for RF Antenna Interface ............................................................................... 25 Figure 9: Microstrip Design on a 2-layer PCB ........................................................................................... 25 Figure 10: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 25 Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 26 Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 26 Figure 13: Dimensions of the Receptacle (Unit: mm) ................................................................................ 27 Figure 14: Specifications of Mated Plugs .................................................................................................. 27 Figure 15: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 28 Figure 16: Placement and Fixing of the Heatsink ...................................................................................... 33 Figure 17: Top and Side Dimensions ......................................................................................................... 34 Figure 18: Bottom Dimensions (Bottom View) ........................................................................................... 35 Figure 19: Recommended Footprint .......................................................................................................... 36 Figure 20: Top and Bottom Views .............................................................................................................. 37 Figure 21: Recommended Reflow Soldering Thermal Profile ................................................................... 39 Figure 22: Carrier Tape Dimension Drawing ............................................................................................. 41 Figure 23: Plastic Reel Dimension Drawing .............................................................................................. 42 Figure 24: Mounting Direction .................................................................................................................... 42 Figure 25: Packaging Process ................................................................................................................... 43 FCS960K-N_Hardware_Design 8 / 46 Wi-Fi&Bluetooth Module Series 1 Introduction This document describes the FCS960K-N features, performances, and air interfaces and hardware interfaces connected to your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, and other module information, as well. 1.1. Special Mark Table 1: Special Mark Mark Definition Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same

type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FCS960K-N is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:

http://www.quectel.com/support/technical.htm The device could be used with a separation distance of 20cm to the human body. The WLAN function for this device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range. FCS960K-N_Hardware_Design 9 / 46 Wi-Fi&Bluetooth Module Series 2 Product Overview FCS960K-N is a low-energy, high-performance IEEE 802.11 a/b/g/n/ac/ax Wi-Fi 6 and Bluetooth 5.3 module. It supports 2.4 GHz and 5 GHz dual-band and 1T1R with maximum data transmission rate up to 286.8 Mbps. It provides SDIO 3.0 interface for Wi-Fi functions and UART and PCM interface for Bluetooth functions. It is an SMD module with compact packaging. Related information is listed in the table below:

Table 2: Basic Information FCS960K-N Packaging type Pin counts LCC 44 Dimensions

(12.0 0.15) mm (12.0 0.15) mm (2.0 0.2) mm Weight Approx. 0.6 g FCS960K-N_Hardware_Design 10 / 46 Wi-Fi&Bluetooth Module Series 2.1. Key Features Table 3: Key Features Basic Information Protocols and Standard Bluetooth protocol: Bluetooth 5.4 Wi-Fi protocols: IEEE 802.11 a/b/g/n/ac/ax All hardware components are fully compliant with EU RoHS directive Power Supplies VBAT Power Supply:

3.03.6 V Typ.: 3.3 V VDD_IO Power Supply:

1.713.63 V Temperature Ranges Typ.: 1.8/3.3 V Operating temperature 1: -20 to +80 C Storage temperature: -25 to +90 C EVB Kit FCS960K-N-M.2 RF Antenna Interface Wi-Fi Antenna Interface BT Antenna Interface 2 Application Interface Wi-Fi Application Interface Bluetooth Application Interfaces ANT_WIFI/BT 50 characteristic impedance ANT_BT (optional) 50 characteristic impedance SDIO 3.0 UART, PCM 1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules indicators comply with IEEE and Bluetooth specification requirements. 2 The dedicated Bluetooth antenna interface is optional. For more details, contact Quectel Technical Support. FCS960K-N doesnt use ANT_BT in modules CE testing, its reserved for clients design. FCS960K-N_Hardware_Design 11 / 46 Wi-Fi&Bluetooth Module Series 2.2. Functional Diagram Figure 1: Functional Diagram FCS960K-N_Hardware_Design 12 / 46 DiplexerAIC8800D40ANT_BT2.4G_WLAN/BT_TRX5G_WLAN_TRXSDIO 3.0WLAN_WAKE_HOSTANT_WIFI/BT40 MHz XOVBATVDD_IOUSB 2.0HOST_WAKE_WLANBT_WAKE_HOSTHOST_WAKE_BTUARTWLAN_ENBT_ENGPIOPCM Wi-Fi&Bluetooth Module Series 3 RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.4002.4835 GHz 5 GHz: 5.1505.850 GHz Modulation DSSSCCKBPSKQPSK16QAM64QAM256QAM1024QAM Encryption Mode WEP, WPA, WPA2, WPA3-SAE Operating Mode AP STA Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) 802.11ac: VHT20 (MCS 08), VHT40 (MCS 09) 802.11ax: HE20 (MCS 011), HE 40(MCS 011) Condition EVM Typ.; Unit: dBm; Tolerance: 2 dB Transmitting Power Receiving Sensitivity 802.11b @ 1 Mbps 2.4 GHz 802.11b @ 11 Mbps 35 %

19 19 802.11g @ 6 Mbps

-5 dB 17

-96

-88

-93 FCS960K-N_Hardware_Design 13 / 46 Wi-Fi&Bluetooth Module Series 802.11g @ 54 Mbps

-25 dB 15 802.11n, HT20 @ MCS 0

-5 dB 17 802.11n, HT20 @ MCS 7

-27 dB 15 802.11n, HT40 @ MCS 0

-5 dB 17 802.11n, HT40 @ MCS 7

-27 dB 15 802.11ax, HE20 @ MCS 0

-5 dB 17 802.11ax, HE20 @ MCS 11

-35 dB 14 802.11ax, HE40 @ MCS 0

-5 dB 17 802.11ax, HE40 @ MCS 11

-35 dB 14 802.11a @ 6 Mbps

-5 dB 17 802.11a @ 54 Mbps

-25 dB 15 802.11n, HT20 @ MCS 0

-5 dB 17 802.11n, HT20 @ MCS 7

-27 dB 15 802.11n, HT40 @ MCS 0

-5 dB 17 802.11n, HT40 @ MCS 7

-27 dB 15 802.11ac, VHT20 MCS 0

-5 dB 17 802.11ac, VHT20 MCS 8

-30 dB 14 802.11ac, VHT40 @ MCS 0

-5 dB 17 802.11ac, VHT40 @ MCS 9

-32 dB 12 802.11ax, HE20 @ MCS 0

-5 dB 16 802.11ax, HE20 @ MCS 11

-35 dB 12 802.11ax, HE40 @ MCS 0

-5 dB 16 802.11ax, HE40 @ MCS 11

-35 dB 12 5 GHz

-77

-90

-76

-90

-72

-94

-67

-92

-63

-93

-76

-93

-74

-89

-71

-92

-70

-89

-65

-93

-65

-90

-61 FCS960K-N_Hardware_Design 14 / 46 Wi-Fi&Bluetooth Module Series 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.4002.4835 GHz Modulation GFSK, /4-DQPSK, 8-DPSK Operating Mode Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) Condition BR EDR (/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) BLE (2 Mbps) BLE Long Range (S = 8) 125 Kbps BLE Long Range (S = 2) 500 Kbps Typ.; Unit: dBm; Tolerance: TBD Receiving Sensitivity

-90

-85

-85

-90

-85

-90

-90 FCS960K-N_Hardware_Design 15 / 46 Wi-Fi&Bluetooth Module Series 4 Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all RESERVED and unused pins unconnected. 2. All GND pins should be connected to ground. FCS960K-N_Hardware_Design 16 / 46 FCS960K-N1234567891011333231302928272625242335363738394041424344222120191817161514131234GNDANT_WIFI/BTGNDRESERVEDHOST_WAKE_BTBT_WAKE_HOSTRESERVEDVBATUSB_DMUSB_DPGNDANT_BTGNDDBG_RXDDBG_TXDPCM_SYNCPCM_DINPCM_CLKPCM_DOUTHOST_WAKE_WLANRESERVEDWLAN_ENWLAN_WAKE_HOSTSDIO_DATA2SDIO_DATA3SDIO_CMDSDIO_CLKSDIO_DATA0SDIO_DATA1GNDRESERVEDVDD_IOBT_ENGPIOGNDRESERVEDRESERVEDRESERVEDRESERVEDBT_RTSBT_TXDBT_RXDBT_CTSGNDPowerRESERVEDRFWLANRESERVEDBluetooth Other signalsGPIO Wi-Fi&Bluetooth Module Series 4.2. Pin Description Table 6: I/O Parameters Definition Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 9 PI VDD_IO 22 PI Power supply for the module Power supply for the modules I/O pins Vmin = 3.0 V It must be provided Vnom = 3.3 V with sufficient current Vmax = 3.6 V of at least 0.5 A. Vmin = 1.7 V The voltage domain of Vnom = 1.8/3.3 V I/O pins is determined Vmax = 3.6 V by the VDD_IO. GND 1, 3, 20, 31, 33, 36 Wi-Fi Application Interfaces Pin Name Pin No. I/O Description WLAN_EN HOST_WAKE_ WLAN WLAN_WAKE_ HOST SDIO_CMD 12 24 13 16 DI DI DO WLAN enable control Host wakes up WLAN WLAN wakes up host DC Characteristics Comment Active high. VDD_IO DIO SDIO command Requires impedance of FCS960K-N_Hardware_Design 17 / 46 Wi-Fi&Bluetooth Module Series SDIO_CLK 17 DI SDIO clock SDIO_DATA0 18 DIO SDIO data bit 0 SDIO_DATA1 19 DIO SDIO data bit 1 SDIO_DATA2 14 DIO SDIO data bit 2 SDIO_DATA3 15 DIO SDIO data bit 3 Bluetooth Application Interfaces Pin Name Pin No. I/O Description BT_EN 34 DI Bluetooth enable control Request to send BT_RTS 41 DO signal from the BT_CTS BT_TXD BT_RXD PCM_DOUT PCM_CLK PCM_DIN PCM_SYNC HOST_WAKE_ BT BT_WAKE_ HOST 44 42 43 25 26 27 28 6 7 RF Antenna Interfaces module Clear to send signal to the module Bluetooth UART transmit Bluetooth UART receive DI DO DI DO PCM data output DI PCM clock DI PCM data input DI DI DO PCM data frame sync Host wakes up Bluetooth Bluetooth wakes up host 50 . SDIO 3.0 compliant. Reserve 10100 k resistors to pull each of them up to VDD_IO. DC Characteristics Comment Active high. VDD_IO It is recommended to add a 0 series resistor. If unused, keep them open. Active high. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_WIFI/BT 2 AIO ANT_BT 3 32 AIO Wi-Fi/Bluetooth antenna interface Bluetooth antenna interface (optional) 50 characteristic impedance. 3 The dedicated Bluetooth antenna interface is optional. For more details, contact Quectel Technical Support. FCS960K-N doesnt use ANT_BT in modules CE testing, its reserved for clients design. FCS960K-N_Hardware_Design 18 / 46 Wi-Fi&Bluetooth Module Series Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USB_DM USB_DP DBG_TXD DBG_RXD GPIO Interface 10 11 29 30 AIO AIO DO DI USB differential data (-) USB differential data (+) Debug UART transmit Debug UART receive If unused, keep them open. VDD_IO Test points must be reserved. Pin Name Pin No. I/O Description DC Characteristics Comment GPIO 35 DIO General-purpose input/output VDD_IO If unused, keep it open. RESERVED Pins Pin Name Pin No. RESERVED 4, 5, 8, 21, 23, 3740 Comment Keep them open. FCS960K-N_Hardware_Design 19 / 46 Wi-Fi&Bluetooth Module Series 4.3. Power Supply The module is powered by VBAT. It is recommended to use a power supply chip with sufficient of at least 0.5 A. For better power supply performance, it is recommended to parallel a 47 F decoupling capacitor, and 1 F and 100 nF filter capacitors near the modules VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be. VBAT reference circuit is shown below:

Figure 3 Reference Circuit of Power Supply The power-up timing of the module is shown below. Figure 4: Power-up Timing NOTE 1. VDD_IO's power on time VBAT's power on time. 2. WLAN_EN or BT_EN's high time VDD_IO's power on time + 200 s. 3. Module all power on ready time WLAN_EN or BT_ENs high time + 8 ms. 4. WLAN_EN or BT_ENs low time to module all power off time 6 ms. FCS960K-N_Hardware_Design 20 / 46 ModuleVBATVBATD1C2C3C4NMC147 F1 F100 nFR10RVBATWLAN_ENBT_ENVDD_IO 0200 s8 ms 6 ms8 ms200 s8 ms 6 msPower OffPower OnPower OffPower OffPower On8 ms Wi-Fi&Bluetooth Module Series 4.4. Wi-Fi Application Interfaces The Wi-Fi application interface connection between the module and the host is illustrated in the following figure Figure 5 Wi-Fi Application Interface Connection 4.4.1. SDIO Interface The module provides SDIO 3.0 interface communicating with the host for Wi-Fi functions. SDIO interface connection between the module and the host is illustrated in the following figure. Figure 6: SDIO Interface Connection FCS960K-N_Hardware_Design 21 / 46 SDIO 3.0SDIO 3.0WLAN_ENWLAN_ENWLAN_WAKE_HOSTWLAN_WAKE_HOSTHOST_WAKE_WLANHOST_WAKE_WLANModuleHostSDIO_CLKSDIO_CMDSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3HostModuleSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3SDIO_CLKSDIO_CMDNM_10KVDD_IONM_10KNM_10KNM_10KNM_10KNMNMNMNMNMNMNM_10K Wi-Fi&Bluetooth Module Series To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:

To avoid jitter of bus, pull up SDIO_CLK and SDIO_DATA_[0:3]/SDIO_CMD to VDD_IO with resistors respectively. Value range of these resistors should be 10100 k and the recommended value is 10 k. The impedance of SDIO signal trace is 50 10 %. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. And the SDIO_CLK signal trace should be routed with ground surrounded separately. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals. The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF. Route the SDIO traces on the same floor as much as possible and surround them with ground without crossing with each other. 4.5. Bluetooth Application Interfaces The Bluetooth application interface connection between the module and the host is illustrated in the following figure Figure 7: Bluetooth Application Interface Connection FCS960K-N_Hardware_Design 22 / 46 UARTUARTBT_ENBT_ENHOST_WAKE_BTHOST_WAKE_BTBT_WAKE_HOSTBT_WAKE_HOSTModuleHostPCMPCM Wi-Fi&Bluetooth Module Series 4.5.1. UART The module supports Bluetooth HCI (Host Controller Interface) UART which supports hardware flow control (RTS/CTS) and can be used for data transmission with the host. The baud rate can be up to 3.25 Mbps. Table 8: UART Parameters Parameter Description Data Bits Per Frame Parity 8 bits None Number of Stop Bits 1 bit Hardware Flow Control RTS/CTS 4.5.2. PCM Interface The module provides a PCM interface for Bluetooth audio application. It supports the following features:

Supports Master and Slave mode Programmable Long/Short Frame Sync Supports 8-bit A-law/u-law, and 13/16-bit linear PCM formats Supports sign-extension PCM Master Clock Output: 64 kHz, 128 kHz, 256 kHz, or 512 kHz Supports SCO/eSCO link FCS960K-N_Hardware_Design 23 / 46 Wi-Fi&Bluetooth Module Series 4.6. RF Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. The module provides two antenna pins (ANT_WIFI/BT and ANT_BT) among which the ANT_BT is optional. The impedance of antenna port is 50 . Table 9: Antenna Design Requirements Parameter Requirement 4 Frequency Ranges (GHz) 2.4 GHz: 2.4002.4835 5 GHz: 5.1505.850 Cable Insertion Loss (dB)

< 1 VSWR Gain (dBi) 2 (Typ.) 2.4GHZ : 0.73 dBi 5G HZ: 1.14dBi Max Input Power (W) Input Impedance () 50 50 Polarization Type Vertical 4.6.1. Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 . The following reference design is based on ANT_WIFI/BT as an example, the reference design of other RF antenna interfaces is the same. 4 For more details about the RF performances, see Chapter 3. FCS960K-N_Hardware_Design 24 / 46 Wi-Fi&Bluetooth Module Series Figure 8: Reference Circuit for RF Antenna Interface 4.6.2. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 9: Microstrip Design on a 2-layer PCB Figure 10: Coplanar Waveguide Design on a 2-layer PCB FCS960K-N_Hardware_Design 25 / 46 ANT_WIFI/BTR1 C1NMC2NMModule0RD1NM Wi-Fi&Bluetooth Module Series Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. FCS960K-N_Hardware_Design 26 / 46 Wi-Fi&Bluetooth Module Series 4.6.3. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 13: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 14: Specifications of Mated Plugs FCS960K-N_Hardware_Design 27 / 46 Wi-Fi&Bluetooth Module Series The following figure describes the space factor of mated connectors. Figure 15: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCS960K-N_Hardware_Design 28 / 46 Wi-Fi&Bluetooth Module Series 5 Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 10: Absolute Maximum Ratings (Unit: V) Parameter VBAT VDD_IO Voltage at Digital Pins Min.

-0.3

-0.3

-0.3 Max. 3.6 3.6 3.6 5.2. Power Supply Ratings Table 11: Module Power Supply Ratings (Unit: V) Parameter Description Condition Min. Typ. Max. VBAT VDD_IO Power supply for the module The actual input voltages must be kept between the minimum 3.0 3.3 3.6 and maximum values. Power supply for the modules I/O pins

1.71 1.8/3.3 3.63 FCS960K-N_Hardware_Design 29 / 46 Wi-Fi&Bluetooth Module Series 5.3. Power Consumption 5.3.1. Wi-Fi Power Consumption Table 12: Wi-Fi Power Consumption Condition 802.11b 802.11g Tx @ 1 Mbps Tx @ 11 Mbps Tx @ 6 Mbps Tx @ 54 Mbps 2.4 GHz 802.11n 802.11ax Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Tx HE20 @ MCS 0 Tx HE20 @ MCS 11 Tx HE40 @ MCS 0 Tx HE40 @ MCS 11 802.11a Tx @ 6 Mbps Tx @ 54 Mbps 5 GHz 802.11n Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 IVDD_IO 1.94 4.084 3.384 6.706 2.811 5.812 3.418 6.465 4.612 8.697 4.914 9.645 7.027 10.777 114.905 7.08 9.921 7.776 306.718 163.578 275.664 10.517 134.32 802.11ac Tx VHT20 @ MCS 0 7.874 307.566 Tx VHT20 @ MCS 8 11.105 148.076 IVBAT Unit 302.809 178.482 206.316 96.536 274.119 139.41 277.887 143.633 262.744 106.781 269.08 110.919 241.489 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FCS960K-N_Hardware_Design 30 / 46 Wi-Fi&Bluetooth Module Series Tx VHT40 @ MCS 0 8.774 309.432 Tx VHT40 @ MCS 9 12.114 144.725 Tx HE20 @ MCS 0 9.271 297.141 Tx HE20 @ MCS 11 13.301 122.743 Tx HE40 @ MCS 0 10.596 302.692 Tx HE40 @ MCS 11 14.321 125.739 mA mA mA mA mA mA 802.11ax 5.3.2. Bluetooth Power Consumption Table 13: Bluetooth Power Consumption in Non-signalling Modes Transmitting Power IVDD_IO Condition BR EDR (/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) BLE (2 Mbps) 5.02 1.45 1.45 4.97 4.99 16.32 16.714 16.814 17.134 16.854 17.23 IVBAT 102.54 93.90 93.59 110.63 81.13 123.58 BLE Long Range (S = 8) 125 Kbps 4.67 BLE Long Range (S = 2) 500 Kbps 5.00 17.267TBD 116.96 5.4. Digital I/O Characteristics Table 14: VDD_IO I/O Requirements (Unit: V) Parameter Description Min. Max. VIH VIL High-level input voltage 0.7 VDD_IO VDD_IO Low-level input voltage 0 0.3 VDD_IO FCS960K-N_Hardware_Design 31 / 46 Wi-Fi&Bluetooth Module Series VOH VOL High-level output voltage 0.7 VDD_IO

Low-level output voltage

0.3 VDD_IO 5.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 15: Electrostatics Discharge Characteristics (Unit: kV) Model Test Result Standard Human Body Model (HBM) 3 ESDA/JEDEC JS-001-2017 Charged Device Model (CDM) 0.8 ESDA/JEDEC JS-002-2018 5.6. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.

- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

- Choose the heatsink with adequate fins to dissipate heat;

FCS960K-N_Hardware_Design 32 / 46 Wi-Fi&Bluetooth Module Series

- Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

- Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 16: Placement and Fixing of the Heatsink FCS960K-N_Hardware_Design 33 / 46 PCBHeatsinkTIMModuleScrewTIMModuleHeatsinkPCB Wi-Fi&Bluetooth Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 17: Top and Side Dimensions FCS960K-N_Hardware_Design 34 / 46 Wi-Fi&Bluetooth Module Series Figure 18: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCS960K-N_Hardware_Design 35 / 46 Wi-Fi&Bluetooth Module Series 6.2. Recommended Footprint Figure 19: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS960K-N_Hardware_Design 36 / 46 Wi-Fi&Bluetooth Module Series 6.3. Top and Bottom Views Figure 20: Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS960K-N_Hardware_Design 37 / 46 Wi-Fi&Bluetooth Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 5 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FCS960K-N_Hardware_Design 38 / 46 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 21: Recommended Reflow Soldering Thermal Profile FCS960K-N_Hardware_Design 39 / 46 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s Wi-Fi&Bluetooth Module Series Table 16: Recommended Thermal Profile Parameters Factor Soak Zone Ramp-to-soak slope Recommended Value 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. 4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2]. FCS960K-N_Hardware_Design 40 / 46 Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

Figure 22: Carrier Tape Dimension Drawing Table 17: Carrier Tape Dimension Table (Unit: mm) P 16 T A0 B0 0.35 12.4 12.4 K0 2.6 K1 3.6 F E 11.5 1.75 W 24 FCS960K-N_Hardware_Design 41 / 46 Wi-Fi&Bluetooth Module Series 7.3.2. Plastic Reel Figure 23: Plastic Reel Dimension Drawing Table 18: Plastic Reel Dimension Table (Unit: mm) D1 330 7.3.3. Mounting Direction D2 100 W 24.5 Figure 24: Mounting Direction FCS960K-N_Hardware_Design 42 / 46 Wi-Fi&Bluetooth Module Series 7.3.4. Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 25: Packaging Process FCS960K-N_Hardware_Design 43 / 46 Wi-Fi&Bluetooth Module Series 8 Appendix References Table 19: Related Documents Document Name

[1] Quectel_RF_Layout_Application_Note

[2] Quectel_Module_SMT_Application_Note Table 20: Terms and Abbreviations Abbreviation Description 1T1R AP BLE BPSK BR CCK CTS DPSK DQPSK DSSS EDR eSCO ESD One Transmit One Receive Access Point Bluetooth Low Energy Binary Phase Shift Keying Basic Rate Complementary Code Keying Clear To Send Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Direct Sequence Spread Spectrum Enhanced Data Rate Extended Synchronous Connection-Oriented Electrostatic Discharge FCS960K-N_Hardware_Design 44 / 46 Wi-Fi&Bluetooth Module Series EVM GFSK GND HCI HE HBM HT IEEE I/O LCC Mbps MCS MSL PCB PCM QAM QPSK RF RoHS RTS Rx SAE SCO SDIO SMD Error Vector Magnitude Gauss Frequency Shift Keying Ground Host Controller Interface High Efficiency Human Body Model High Throughput Institute of Electrical and Electronics Engineers Input/Output Leadless Chip Carrier (package) Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Levels Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request to Send Receive Simultaneous Authentication of Equals Synchronous Connection-Oriented Secure Digital Input/Output Surface Mount Device FCS960K-N_Hardware_Design 45 / 46 Wi-Fi&Bluetooth Module Series SMT STA TBD TVS Tx Surface Mount Technology Station To Be Determined Transient Voltage Suppressor Transmit UART Universal Asynchronous Receiver/Transmitter USB VHT VIH VIL Vmax Vmin Vnom VOH VOL Universal Serial Bus Very High Throughput High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage VSWR Voltage Standing Wave Ratio Wired Equivalent Privacy Wireless Fidelity Wi-Fi Protected Access WEP Wi-Fi WPA FCS960K-N_Hardware_Design 46 / 46 Wi-Fi&Bluetooth Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023FCS960KN. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth/Bluetooth LE/Wi-Fi 2.4G:0.73 dBi U-NII-1: 1.14 dBi U-NII-2A: 1.00 dBi U-NII-2C: 0.60 dBi U-NII-3: 0.95 dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2023FCS960KN. or Contains FCC ID: XMR2023FCS960KN. must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user FCS960K-N_Hardware_Design 47 / 46 Wi-Fi&Bluetooth Module Series that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. IC Certification Requirements. This device contains licence-exempt transmitteris)/receivers) that comply with Innovation, Science and EconomicDevelopment Canada's licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth/Bluetooth LE/Wi-Fi 2.4G:0.73 dBi U-NII-1: 1.14 dBi U-NII-2A: 1.00 dBi U-NII-2C: 0.60 dBi U-NII-3: 0.95 dBi L'appareil contient un metteur / rcepteur exempt de licence conforme au CNR exempt de licence d'innovation, sciences et dveloppement conomique Canada. Les oprations sont soumises aux deux conditions suivantes:

1. Cet appareil peut ne pas causer d'interfrence. L'appareil doit accepter toute interfrence, y compris celles qui peuvent entraner un fonctionnement ind sirable de l'appareil. This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. To comply with RSS-102 RF Exposure compliance requirements, this grant is applicable to only Mobile Configurations. The antennas used for the transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. FCS960K-N_Hardware_Design 48 / 46 Wi-Fi&Bluetooth Module Series The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-023FCS960KN or where: 10224A-023FCS960KNis the modules certification number. FCS960K-N_Hardware_Design 49 / 46

QUELLE. PCSSE0GK-N 01-Axxxx FCS960KNAAMD SN:C1149065G2XXXXX Ce FCC ID: XMR2023FCS960KN =

IC: 10224A-023FCS960KN J. re QUELLE. PCSSE0GK-N 01-Axxxx FCS960KNAAMD SN:C1149065G2XXXXX Ce FCC ID: XMR2023FCS960KN =

IC: 10224A-023FCS960KN J. re

(Quectel Wireless Solutions Company Limited) To: Federal Communications Commission Date: 2024/3/12 7435 Oakland Mills Road Columbia, MD 21046 USA Attestation Section 2.911(d)(5)(i) and Section 2.911(d)(5)(ii)

(KDB 986446 D01 Covered Equipment) Section 2.911(d)(5)(i)

[Quectel Wireless Solutions Company Limited] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Section 2.911(d)(5)(ii)

[Quectel Wireless Solutions Company Limited] (the applicant) certifies that, as of the date of the filing of the application, the applicant [is not] identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment. Type of Equipment subject to FCC Certification:

FCC ID: XMR2023FCS960KN If you have any questions, please feel free to contact me Contact Person:

Position in the Company: Quectel Wireless Solutions Company Limited Email:jean.hu@quectel.com Date of Signature:

Jean Hu/Project Manager 2024/3/12 ___________________________ Signatory

(signature of the applicant)

QUECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, FRN: 0018988279, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:

Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) 7 he! Jean Hu Name: eterson Title Certification Manager Title: CEO. Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 07 July, 2023 Date: 07 July, 2023

Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2024/3/12_ Subject: Confidentiality Request for: _____ FCC ID: XMR2023FCS960KN IC Number: 10224A-023FCS960KN Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100 Issue 12 / 12.4, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description& BOM Schematics Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ ___Quectel Wireless Solutions Company Limited _has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ____ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, Signatory Printed Name : Jean Hu Position :Project Manager Company: Quectel Wireless Solutions Company Limited Email:jean.hu@quectel.com

Quectel Wireless Solutions Company Limited UNII Declaration Letter We have declared below featured for FCC equipment authorization, device FCC ID:

XMR2023FCS960KN

(1) DFS Device --

Master, Client without radar detection capability, Client with Radar detection capability , N/A

(2) Active / Passive Scanning , adhoc mode access point capability passive scanning

(where the device Ad Hoc Mode capability Access point capability Frequency Band

(MHz) Active Scanning

(the device can transmit a probe

(beacon)) 2412 2462 MHz 5745 5825 MHz 5755 5795 MHz 5180 5240 MHz 5190 5230 MHz 5260 5320 MHz 5270 5310 MHz 5500 5700 MHz Yes, 5510 5670 MHz Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No is can listen only with no probes) Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No

(3) Country code selection ability -

If no, pls explain how was implemented : use Microsoft network utility

(4) Meet 15.202 requirement -

pls check below :

Yes , Yes , No , No A master device is defined as a device operating in a mode in which it has the capability to transmit without receiving an enabling signal. In this mode it is able to select a channel and initiate a network by sending enabling signals to other devices A client device is defined as a device operating in a mode in which the transmissions of the device are under control of the master. A device in client mode is not able to initiate a network.

(5) For client devices that have software configuration control to operate in different modes (active scanning in some and passive scanning in others) in different bands (devices with multiple equipment classes or those that operate on non-DFS frequencies) or modular devices which configure the modes of operations through software, the application must provide software and operations description on how the software and / or hardware is implemented to ensure that proper operations modes can not be modified by end user or an installer. Apply , No Apply ,

(If apply , pls help to provide explanation on how it was implement (By hardware or software , and how software was controlled) If you have any questions, please feel free to contact me at the address shown below. Yours sincerely, Signatory Printed Name : Jean Hu Position :Project Manager Company: Quectel Wireless Solutions Company Limited Email:jean.hu@quectel.com Date :2024/3/12

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Company Limited XMR2023FCS960KN FCS960K-N The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Modular approval requirement The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(c)The modular transmitter must have its own powersupply regulation.

(d) The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual EUT Condition The radio elements of the modular Comply YES transmitter have their own shielding. The modular has buffered data inputs, it is YES integrated in chip. Please see schematic.pdf All power lines derived from the host device are regulated before energizing other the FCS960K-N. circuits Please see schematic.pdf internal to A permanently attached antenna or unique antenna connector is a requirement for unlicensed the modules. YES YES The FCS960K-N was tested in a stand YES alone configuration via a PCMCIA extender. Please see spurious setup Quectel Wireless Solutions Company Limited use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially Section 15.31(i))mustnotbeinsideanotherdeviceduringtesting. available

(see The label position of FCS960K-N is clearly YES indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text:

Contains FCC ID: XMR2023FCS960KN. Please see the label.pdf The FCS960K-N is compliant with all YES applicable FCC rules. Detail instructions are given in the User Manual. The FCS960K-N is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES

(f)The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedonth eintendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. Signatory Printed Name : Jean Hu Position :Project Manager Company: Quectel Wireless Solutions Company Limited Email:jean.hu@quectel.com Date:2024/3/12

Quectel Wireless Solutions Co., Ltd. Quectel Wireless Solutions Company Limted POWER OF ATTORNEY DATE:2024/3/12 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR2023FCS960KN. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Han jinnan on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Printed Name : Jean Hu Position :Project Manager Company: Quectel Wireless Solutions Co., Ltd Email:jean.hu@quectel.com Date:2024/3/12