FCC ID: 2AAGMGM01Q GM01Q EZlinkLTE modules

M onarch P l atform - GM01 Q Modul e Datasheet SEQUANS Communications 15-55 Boulevard Charles de Gaulle 92700 Colombes, France Phone. +33.1.70.72.16.00 Fax. +33.1.70.72.16.09 www.sequans.com contact@sequans.com Preface Legal Notices Copyright 2017-2018, SEQUANS Communications All information contained herein and disclosed by this document is confidential and the proprietary property of SEQUANS Communications, and all rights therein are expressly reserved. Acceptance of this material signifies agreement by the recipient that the information contained in this document is confidential and that it will be used solely for the purposes set forth herein. Acceptance of this material signifies agreement by the recipient that it will not be used, reproduced in whole or in part, disclosed, distributed, or conveyed to others in any manner or by any means graphic, electronic, or mechanical, including photocopying, recording, taping, or information storage and retrieval systems without the express written permission of SEQUANS Communications. All Sequans logos and trademarks are the property of SEQUANS Communications. Unauthorized usage is strictly prohibited without the express written permission of SEQUANS Communications. All other company and product names may be trademarks or registered trademarks of their respective owners. Products and services of SEQUANS Communications, and those of its licensees may be protected by one or more pending or issued U.S. or foreign patents. Because of continuing developments and improvements in design, manufacturing, and deployment, material in this document is subject to change without notification and does not represent any commitment or obligation on the part of SEQUANS Communications. SEQUANS Communications shall have no liability for any error or damages resulting from the use of this document. GM01Q D PROPRIETARY SEQUANS Communications i Document Revision History Revision Date Product Application February 2018 Second edition of the document. June 2018 Third edition of the document. July 2018 Fourth edition of the document. August 2018 Fifth edition of the document. See list of changes in Section Changes in this Document on page iii. PROPRIETARY SEQUANS Communications GM01Q D 02 03 04 05 ii About this Datasheet Purpose and Scope The GM01Q is a complete certified LTE Category M1 module including base-band, RF and memory, for the design of connected machine-to-machine devices, and other Internet-of-Things devices with embedded LTE connectivity. This document provides technical information about GM01Q LGA module. GM01Q is based on Sequans Monarch platform. Who Should Read this Datasheet This document is intended for engineers who are developing User Equipment

(UE) for LTE systems. Changes in this Document The changes since the previous edition of the document are as follows:

Updated footprint figures and dimensions in Section 3.9.1 Module Foot-print on page 15. GM01Q D PROPRIETARY SEQUANS Communications iii References

[1]

Core technology specifications:

3GPP E-UTRA 21 series Release 13 (EPS) 3GPP E-UTRA 22 series Release 13 (IMEI) 3GPP E-UTRA 23 series Release 13 (NAS, SMS) 3GPP E-UTRA 24 series Release 13 (NAS) 3GPP E-UTRA 31 series Release 13 (UICC) 3GPP E-UTRA 33 series Release 13 (security) 3GPP E-UTRA 36 series Release 13 (RAN) 3GPP2 C.S0015-A v1.0 (SMS) IETF, RFC 3261, 4861, 4862, 6434 For more information, see ftp://ftp.3gpp.org/Specs/archive/

http://www.3gpp2.org/public_html/specs/CS0015-0.pdf https://tools.ietf.org/html/

Test specifications:

3GPP E-UTRA 36 series Release 13 (RAN) ftp://ftp.3gpp.org/Specs/archive/

Vocabulary reference:

3GPP TR 21.905: "Vocabulary for 3GPP Specifications"

For more information, see http://www.3gpp.org/ftp/specs/archive/21_series/21.905/

PROPRIETARY SEQUANS Communications GM01Q D

[2]

[3]

iv Documentation Conventions This section illustrates the conventions that are used in this document. Important information requiring the users attention. A condition or circumstance that may cause damage to the equipment or loss of data. A condition or circumstance that may cause personal injury. Italic font style denotes emphasis of an important word;

first use of a new term;

title of a document. Sans serif, bold font denotes on-screen name of a window, dialog box or field;

keys on a keyboard;

labels printed on the equipment. Regular Courier font denotes code or text displayed on-screen. Bold Courier font denotes commands and parameters that you enter exactly as shown. Multiple parameters are grouped in brackets [ ]. If you are to choose only one among grouped parameters, the choices are separated with a pipe: [parm1 |

parm2 | parm3] If there is no pipe separator, you must enter each parameter:

[parm1 parm2 parm3]

Italic Courier font denotes parameters that require you to enter a value or variable. Multiple parameters are grouped in brackets [ ]. If you are to choose only one among grouped parameters, the choices are separated with a pipe:

[parm1 | parm2 | parm3] If there is no pipe separator, you must enter a value for each parameter: [parm1 parm2 parm3]

General Conventions Note Caution Warning Italics Screen Name Software Conventions Code Code Code GM01Q D PROPRIETARY SEQUANS Communications v Table of Contents Preface .............................................................................................................. i Legal Notices ............................................................................................................................................ i Document Revision History .................................................................................................................... ii About this Datasheet

. iii Purpose and Scope .................................................................................................................................. iii Who Should Read this Datasheet ........................................................................................................... iii Changes in this Document ...................................................................................................................... iii References .............................................................................................................................................. iv Documentation Conventions ................................................................................................................... v Chapter 1 Product Features .............................................................................................. 1 1.1 Features Description .......................................................................................................... 1 Chapter 2 Regulatory Approval ........................................................................................ 4 Chapter 3 Physical Characteristics ................................................................................... 5 3.2.1 3.2.2 3.2.3 3.3.1 3.3.2 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.9.1 3.9.2 3.10 3.11 ECCN and Part Number ......................................................................................................5 Electrical Operating Conditions .......................................................................................... 6 Detailed Information ....................................................................................................6 GM01Q Power Tree .................................................................................................... 7 Power Supplies Environment .......................................................................................8 Environmental Operating Conditions ................................................................................. 8 Temperature ................................................................................................................ 8 Humidity ..................................................................................................................... 8 Power Supply Dimensioning ...............................................................................................9 I/O Characteristics .............................................................................................................10 Auxiliary ADC ..................................................................................................................13 Performance ......................................................................................................................14 Component Reliability ......................................................................................................15 Package Description ..........................................................................................................15 Module Footprint ....................................................................................................... 15 Marking Information .................................................................................................. 17 Packing Information ..........................................................................................................18 Storage Conditions ............................................................................................................19 Proprietary SEQUANS Communications vi Table of Contents 3.12 Mounting Considerations ..................................................................................................20 Chapter 4 Signal and Pins ............................................................................................... 21 4.1 4.2 4.3 4.4 4.4.1 4.4.2 4.4.3 GM01Q Pinout ..................................................................................................................21 UART Interfaces ...............................................................................................................22 Power-up Sequence ...........................................................................................................23 LTE Low Power Mode...................................................................................................... 24 General Information ................................................................................................... 24 Detailed Behavior of IO Pads of BIDIR Type ...........................................................25 Detailed Behavior of IO Pads of BIDIR_WAKE Type ............................................. 26 Appendix A Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Proprietary SEQUANS Communications vii 1 Product Features 1.1 Features Description Sequans GM01Q module includes Monarch SQN3330 Cat-M1 baseband, a complete dual band RF front end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Release 13) Cat-M1 UE specifications. For more information on the core technology specifications see the section References on page iv. The term GM01Q module refers to the hardware and the associated embedded software.

$$$

"

#

$%&' ()* +

$$$

!

! ,-

. ' /0 1

+2

'$3 )*

#

4

!

!

5 6 5 6

#

#

#

Figure 1-1: GM01Q Block Diagram Table 1-1 on page 2 provides detail on general features of the GM01Q. Table 1-2 on page 2 provides detail for the LTE-related features of the GM01Q. GM01Q D PROPRIETARY SEQUANS Communications 1 PRODUCT FEATURES FEATURES DESCRIPTION GM01Qs ECCN and part number are detailed in the Section 3.1 ECCN and Part Number on page 5. Table 1-1: General Features General interfaces JTAG I2C (reserved) USIM SPI (reserved) GPIO UART (x3, including one reserved) Supported Frequency Bands One of the following LTE Bands sets:

GM01Q-0 : LTE bands B2, B3, B4, B8, B12, B20 GM01Q-1 : LTE bands B1, B3, B5, B8, B19, B28 GM01Q-2 : LTE bands B2, B4, B8, B12, B13, B20 GM01Q-3 : LTE bands B2, B4, B12, B13, B25, B26 GM01Q-4 : LTE bands B1, B2, B3, B4, B5, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B66 Operation voltages Vbat1 (range from 3.1 V to 4.5 V) Packaging Operating temperature Humidity LGA module 108 pads (21.35 x 20.25 x 1.79 mm) RoHS compliant, halogen-free RF compliant -30C to +60C (ambient) Operational: -40C to +85C (board) See also Section 3.3 Environmental Operating Conditions on page 8. 10% to 85%

See also Section 3.3 Environmental Operating Conditions on page 8. Table 1-2: LTE Features Standard compliance 3GPP E-UTRA Release 13 compliant GM01Q D PROPRIETARY SEQUANS Communications 2 PRODUCT FEATURES FEATURES DESCRIPTION Table 1-2: LTE Features (Continued) PHY One UL and one DL transceiver Support of HD-FDD Duplexing Channel 1.4 MHz bandwidth Normal and extended cyclic prefix Support of MPDCCH Modulation

- DL: QPSK, 16QAM

- UL: QPSK, 16QAM All coding schemes corresponding to modulations All channel coding (turbo-coding with interleaver, tail biting convolutional coding, block and repetition coding) and CRC lengths Sounding (including in special subframes) Control and data in special subframes All power control schemes and DL power allocation schemes HARQ Incremental Redundancy and Chase Combining, with bundling or multi-

plexing Measurements and computations related to CQI (Channel Quality Indicator), PMI

(Pre-coding Matrix Indicator) and RI (Rank Indicator), RSRP, and RSRQ UEPCOP (from 3GPP Release 12) Power Saving Mode Random Access procedure in normal and special subframes Scheduling Request, Buffer Status Reporting, and Power Headroom Reporting Discontinuous reception (DRX, eDRX) with long and short cycles Fast scanning Hosted configuration IPv4, IPv6 RoHC Location based services Advanced QoS features ARQ modes: UM, AM, and TM Ciphering and deciphering: NULL, AES, SNOW 3G Integrity and protection: AES, SNOW 3G MIB and new SIB1bis Intra and inter-frequency measurements and handover Up to 8 Data Radio Bearers supported Support of CE (Coverage Extension) Mode MAC RLC PDCP RRC NAS and above NAS SMS over SG LWM2M Client 3 PROPRIETARY SEQUANS Communications GM01Q D 2 Regulatory Approval LTE band 2 (1800 MHz): 3 dBi LTE band 4 (1700 MHz): 3 dBi LTE band 12 (700 MHz): 3 dBi LTE band 66 (1700 MHz): 3 dBi Attention: FCC-ID: 2AAGMGM01Q (single modular approval) This above identified LTE radio module is not intended to be provided to end-users but is for installation by OEM integrators only. Installation/Integration OEM integrators must follow Sequans installation instructions to provide for and benefit from FCC compliant module integrations and must abide especially by the following:

The maximum antenna gain values (accounting for cable attenuation) to comply with the FCC maximum ERP/EIRP limits and with RF Exposure rules:

The Sequans module integration guidelines must be closely followed. Compliance of host integrations of the module is limited to hosts adaptation designs which are identical to Sequans reference design. Host integrations with adaption designs deviating from Sequans reference design require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID;

Host integrations with co-located (simultaneously operating) radio transmitters must be evaluated in accordance with FCC multi-transmitter rules and may require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID, dependent on the result of the evaluation; Inquiry at FCC or a TCB is urgently recommended. Integrations of the module into host products which are intended for portable use, i.e. less than 20cm distance between its radiating structures (antenna) and the body of nearby persons, or which otherwise put additional technical requirements like Hearing Aid compatibility require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID;

Compliance with Unwanted Emission Limits for Digital Device If the OEM host integration fully complies with the above described reference design and can completely inherit and rest on compliance of the existing modular approval the OEM remains still responsible to show compliance of the overall end-product with the FCC limits for unwanted conducted and radiated emissions from the digital device (unintentional radio) portion of such end-product (commonly addressed as part 15B compliance or similar). GM01Q D PROPRIETARY SEQUANS Communications 4 End-product Labelling FCC-ID The module's FCC-ID must either be visible from the exterior of the host product (e.g. per window) or per electronic display, or shall be displayed on an additional exterior label per the following or similar string:

contains FCC-ID: 2AAGMGM01Q Digital Device - Unwanted Emissions Notice If the end-product falls under part 15 of the FCC rules (it shall display the following user notice on its exterior acc. to part 15.19 (the notice may be printed in the manual in case the host is too small):

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that may cause undesired operation. Further Labelling Requirements may apply dependent on the FCC rule parts relevant to the host product. End-product User Instructions / Notices in the Manual At a minimum, end-product users must be provided with the following notices at a prominent location of the product literature furnished with the product:

* Product Modifications Modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

* RF Exposure Compliance This equipment complies with FCC radio frequency radiation exposure rules and limits set forth for an uncontrolled environment, when installed and operated with minimum distance of 20cm between its radiating structures (antenna) and the body of nearby persons and when not operated simultaneously with other nearby radio-transmitters. Maximum Antenna Gain The user instructions of end-products equipped with standard external antenna connectors for the modular radio transmitter providing the option to connect other antennae than those which may or may not be bundled with the end-product must list the maximum allowed antenna gain values as derived from those given above, accounting for the cable attenuations of the actual installation. Digital Device - Unwanted Emissions Notice If the end-product is or contains a digital device (unintentional radio portions) and is not exempted by its use case (like vehicular use) the following part 15.105 (b) user notice shall be provided at prominent location of the product literature:

GM01Q D PROPRIETARY SEQUANS Communications 4 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

which the receiver is connected. Further User Notices May be required dependent on the FCC rule parts relevant to the host product. Non-allowed User Instructions The end-product user guidance may NOT include instructions about how to install or de-install the module. Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to Consult the dealer or an experienced radio/TV technician for help. GM01Q D PROPRIETARY SEQUANS Communications 4 3 Physical Characteristics 3.1 ECCN and Part Number The orderable part numbers of the GM01Q module are as follows, according to the supported LTE bands:

LTE Bands 2, 3, 4, 8, 12, 20: GM01R63QR0 LTE Bands 1, 3, 5, 8, 19, 28: GM01R63QR1 LTE Bands 2, 4, 8, 12, 13, 20: GM01R63QR2 LTE Bands 2, 4, 12, 13, 25, 26: GM01R63QR3 LTE Bands 1, 2, 3, 4, 5, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 66: GM01R63QR4 The ECCN of the GM01Q module is 5A992.c. CCATS number is G168006. The following comment from licensing officer is reported on the license information:

This encryption item is described in paragraph B to note 3 (mass market note) of category 5 part 2. It is authorized for export and reexport under section 740.17(B)(3) of the export administration regulations (EAR). GM01Q D PROPRIETARY SEQUANS Communications 5 PHYSICAL CHARACTERISTICS ELECTRICAL OPERATING CONDITIONS 3.2 Electrical Operating Conditions 3.2.1 Detailed Information Table 3-1 describes the electrical operating conditions for GM01Q. Table 3-1: Electrical Operating Conditions Direction Minimum Typical Maximum VBAT1 In 3.1 V SIM_VCC (1.8 V or 3.0 V) Out 1.62 V 1V8 See notes below. 3V0 See note 2 below. VCC1_PA VCC2_PA Out In In 2.7 V Out 1.71 V 2.85 V 4.5 V 1.8 V 1.98 V 3.0 V 3.3 V 1.8 V 1.89 V 3.15 V 3.0 V 2.85 V 3.0 V 3.3 V 2.85 V 3.0 V 3.3 V Note:

1. The maximum current consumption allowed from the 1V8 reference pin is 100 mA. 2. Each output reference voltage (1V8, 3V0) can be either running or powered off depending on the internal software configuration. They should not be used to power external IC or parts that require permanent supply. GM01Q D PROPRIETARY SEQUANS Communications 6 PHYSICAL CHARACTERISTICS ELECTRICAL OPERATING CONDITIONS 3.2.2 GM01Q Power Tree Figure 3-1 provides a representation of the power tree of the GM01Q. All current values are maximum RMS current. Note:

SKY68020 is the Front-End module.

$ : 3$;

<

<

# !

# +

# + '

# +

7 87 7 87 7 87

$ <)

$ <)

$ <)

=

& >

<

= '

& >

<

=

& >

<

<

# !

+

7

=

= '

; > ; >

=

A >

;

;>

= '

' >

=

>

#

!

72 72 72 77 6

>

72

>

@

'

'$3 )*

+2 72 72 72 72

!

#

!

>

@

$

=

8

'

>

@

$

=

8

'

$

=

$

=

? !

# 2 !

# 2 2

()*

>

'

@

=

>

@

=

'

69&'

) Figure 3-1: GM01Q Power Tree PROPRIETARY SEQUANS Communications GM01Q D 7 PHYSICAL CHARACTERISTICS ENVIRONMENTAL OPERATING CONDITIONS 3.2.3 Power Supplies Environment Figure 3-2 illustrates the connections between the RF front-end power supplies of the GM01Q. 69&'

Figure 3-2: GM01Q LTE RF Front-End Power Supplies Diagram 3.3 Environmental Operating Conditions 3.3.1 Temperature RF compliant: -30C to +60C (ambient) Operational, with additional software to limit TxPower: -40C to +85C

(measured on board) Storage: -40C to +85C 3.3.2 Humidity Operating: 10% to 85% (non condensing) Storage: 5% to 85% (non condensing) GM01Q D PROPRIETARY SEQUANS Communications 8 PHYSICAL CHARACTERISTICS POWER SUPPLY DIMENSIONING 3.4 Power Supply Dimensioning Important: - Information provided here is estimated peak current consump-

tion for the GM01Q Module in various LTE Tx/Rx configurations, with and without the DC/DC losses. It represents the maximum RMS current.

- The power consumption depends on LTE band of operation. The figures in Table 3-1 are provided for LTE Band 13 only. Please contact your Sequans representative for other LTE Bands figures.

- Average and detailed power consumption figures are provided in Sequans Software Release Notes. Table 3-2: Measured Peak Current and Peak Power Consumption

(LTE Band 13) RRC Connected, 0dBm Tx, with UL and DL traffic RRC Connected, 10dBm Tx, with UL and DL traffic RRC Connected, 23dBm Tx, with UL and DL traffic Measured Peak Power Consumption Measured Battery Peak Current

(for VBAT1=4.2 V) 0.9 W 210 mA 1.1 W 2.0 W 250 mA 485 mA 9 PROPRIETARY SEQUANS Communications GM01Q D PHYSICAL CHARACTERISTICS I/O 3.5 I/O Characteristics The voltage and current characteristics of the various IO pads of the GM01Q versus IO bank supply voltage are illustrated in the tables below. Caution: Note that the Voh values in the tables below do not apply to GPIOs configured in open drain mode. GPIOs can be individually configured in open drain mode. When in open drain mode they either drive the line to Vol, or leave it floating, to be pulled up by an external pullup resistance. The PCB designer must ensure that the voltage on these pads never exceeds Vih of the IO group to which they belong. Refer to GM01Q Pin List to know the type of IO pad used on every termination. The Minimum values for Iol and Ioh should not be exceeded to guarantee that the logical level are not spoiled for each pad type. The Nominal values for Iol and Ioh represent the nominal values for the pad type. They are provided for information only. The Maximum values for Iol and Ioh represent the maximal values for the pad type. They are provided for information only. By default, during boot time:

The pad defined as GPIO as default function, with BIDIR or BIDIR_WAKE types, are configured as input, output disabled, with no internal pull-up and no internal pull-down. The pads defined as RFDATA as alternate function are configured as input, output disabled, with no internal pull-up and no internal pull-down. Contact Sequans's Support Team for detail on persistent AT Commands availability to change these default behaviors. Table 3-3: DC Characteristics for Digital IOs, Voltage 1.8 V - BIDIR and IN Types Paramete r VIL Input Low Voltage VIH Input High Voltage VT Threshold Point VT+

Schmitt Trigger Low to High Threshold Point Drive Strength Min. Nom. Max. Unit 0 1.26 0.79 1 0.87 1.12 0.54 V 3.6 0.94 1.22 V V V GM01Q D PROPRIETARY SEQUANS Communications 10 PHYSICAL CHARACTERISTICS I/O CHARACTERISTICS Table 3-3: DC Characteristics for Digital IOs, Voltage 1.8 V - BIDIR and IN Types Drive Strength Min. Nom. Max. Unit 0.61 0.71 0.8 V Paramete r VT-

Schmitt Trigger High to Low Threshold Point VT PU Threshold Point with Pull-up Resistor Enabled VT PD Threshold Point with Pull-down Resistor Enabled VT+ PU Schmitt Trigger Low to High Threshold Point with Pull-up Resistor Enabled VT- PU Schmitt Trigger High to Low Threshold Point with Pull-up Resistor Enabled VT+ PD Schmitt Trigger Low to High Threshold Point with Pull-down Resistor Enabled VT- PD Schmitt Trigger High to Low Threshold Point with Pull-down Resistor Enabled II Input Leakage Current @ VI=1.8V or 0V IOZ Tri-state Output Leakage Current @ VO=1.8V or 0V Input Capacitance RPU Pull-up Resistor RPD Pull-down Resistor VOL Output Low Voltage VOH Output High Voltage 0.86 0.87 1.12 0.7 1.13 0.72 3 89 90 0.79 0.8 1 0.61 1.01 0.62 56 52 1.35 0.93 0.95 1.21 0.8 1.23 0.81 10 10 148 167 0.45 V V V V V V A A pF kOhm kOhm V V IOL Low Level Output Current at VOL(max) 2 mA 4 mA 8 mA 1.2 2.2 3.6 mA 2.3 4.3 7.1 mA 4.6 8.6 14.3 mA 11 PROPRIETARY SEQUANS Communications GM01Q D PHYSICAL CHARACTERISTICS I/O Table 3-3: DC Characteristics for Digital IOs, Voltage 1.8 V - BIDIR and IN Types Paramete r IOH High Level Output Current at VOH(max) Drive Strength Min. Nom. Max. Unit 2 mA 4 mA 8 mA 1.0 2.4 4.6 mA 2.0 4.7 9.2 mA 4.0 9.4 18.4 mA Table 3-4: DC Characteristics - IN_PMU Type Parameter Drive Strength Min. Nom. Max. Unit VIL Input Low Voltage VIH Input High Voltage

-0.3 1.1 0.4 V 3.6 V Table 3-5: DC Characteristics - BIDIR_WAKE Type Paramete r VIL Input Low Voltage VIH Input High Voltage. See note below related to maximum value. VOL Output Low Voltage VOH Output High Voltage Min. Nom. Max. Unit 0 0.8 1.6 0.2 V 3.6 0 1.8 V V V GM01Q D PROPRIETARY SEQUANS Communications 12 PHYSICAL CHARACTERISTICS AUXILIARY ADC 3.6 Auxiliary ADC ADC specification is described in Table 3-6. Table 3-6: ADC Specification Performanc e Specificatio ADC voltage range ADC tolerance ADC resolution ADC input capacitance ADC input resistance Descriptio n After calibration. The tolerance considered is the highest value between the percentage and the absolute voltage mentioned. Nominal resolution ADC input capacitance. See the note below to prevent current leakage in low-power mode. ADC input resistance. See the note below to prevent current leakage in low-power mode. Value Min. Typical Max. Unit 0.1 Highest of

-2% or -5 mV 1 10 1.8 V Highest of

+2% or +5 mV 2

% or mV bit pF MOhm Important: If the ADC input is interfacing with an external device which doesnt drive 0V when the GM01Q is in Sleeping Mode, then an external analog switch (such as FET) must be connected to ADC input pin to prevent any current leakage in PMU sleeping state. 13 PROPRIETARY SEQUANS Communications GM01Q D 3.7 Performance PHYSICAL CHARACTERISTICS P Table 3-7 and Table 3-8 present the GM01Q modules performance in the supported LTE Bands. Table 3-7: Output Power GM01Q Module Version LTE Bands Conducted Power

(dBm) Bandwidth 1.4 MHz, 6 RB GM01Q-0 B2, B3, B4, B8, B12, B20 23 +1/-1.7 GM01Q-1 B1, B3, B5, B8, B19, B28 23 +1/-1.7 GM01Q-2 B2, B4, B8, B12, B13, B20 23 +1/-1.7 GM01Q-3 B2, B4, B12, B13, B25, B26 23 +1/-1.7 GM01Q-4 B1, B2, B3, B4, B5, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B66 23 +1/-1.7 Table 3-8: RF Sensitivity GM01Q Module Version GM01Q-0 GM01Q-1 GM01Q-2 GM01Q-3 GM01Q-4 LTE Bands B2, B3, B4, B8, B12, B20 B1, B3, B5, B8, B19, B28 B2, B4, B8, B12, B13, B20 B2, B4, B12, B13, B25, B26 B1, B2, B3, B4, B5, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B66 Typ. Sensitivity level (dBm) Bandwidth 1.4 MHz, 6 RB, MCS-5, BLER

<5%

-104

-104

-104

-104

-104 GM01Q D PROPRIETARY SEQUANS Communications 14 PHYSICAL CHARACTERISTICS COMPONENT 3.8 Component Reliability Note:

Information related to component reliability will be provided in a future edition of this document. 3.9 Package Description 3.9.1 Module Footprint Figure 3-3: Module Top and Side View and Dimensions 15 PROPRIETARY SEQUANS Communications GM01Q D PHYSICAL CHARACTERISTICS PACKAGE Figure 3-4: Module General Bottom View and Dimensions Figure 3-5: Module Detailed Bottom View and Dimensions GM01Q D PROPRIETARY SEQUANS Communications 16 PHYSICAL CHARACTERISTICS PACKAGE DESCRIPTION 3.9.2 Marking Information Figure 3-6: GM01Q Marking Description (to be updated) Table 3-9: Marking Details Symbol Descriptio n a b c d e f g h 17 Sequans Logo GM01Q Product Name Monarch / RoHS logo IMEI: XXXXXXXXXXXXXXX (15 digits) S/N: VZQYYMMDDNNNNSSS (16 digits) VZQ: is immovable (3digits) YYMMDD: Manufacturing Date(YY: Year, MM: Month, DD: Date) NNNN: Panel Counter(4 digits 0001~9999);

SSS: Piece counter( 001~020) Made in PRC IMEI Barcode S/N Barcode PROPRIETARY SEQUANS Communications GM01Q D PHYSICAL CHARACTERISTICS PACKING 3.10 Packing Information The module is delivered in Tape-and-Reel as described in Figure 3-7. Figure 3-7: Packing Tape and Reel Description GM01Q D PROPRIETARY SEQUANS Communications 18 PHYSICAL CHARACTERISTICS STORAGE CONDITIONS 3.11 Storage Conditions Note:

Additional storage conditions impacting the mounting process are provided in Section 3.12 Mounting Considerations on page 20. 1. Calculated shelf life in sealed bag : 12 months at < 40C and < 90% RH 2. Peak package body temperature: 250C 3. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be:

a) mounted within 168 hours of factory conditions 30C/60%RH, or b) Stored as per J-STD-033 4. Devices require bake, before mounting, if a) Humidity Indicator Card reads >10% for level 2a-5a devices or >60% for level 2 devices when read at 235C b) 3a or 3b above are not met 5. If baking is required, refer to IPC/FEDEC J-STD-033 for bake procedure. Note:

Level and body temperature are defined by IPC/JEDEC J-STD-020. 19 PROPRIETARY SEQUANS Communications GM01Q D PHYSICAL CHARACTERISTICS MOUNTING 3.12 Mounting Considerations The GM01Q can support up to 3 reflows with 250C maximum. Figure 3-8: Reflow Profile Table 3-10: Reflow Parameters Parameter Setting Peak package body temperature Liquidous Time Preheat/Soak Ramp-up rate Ramp-down rate To be defined To be defined To be defined To be defined To be defined GM01Q D PROPRIETARY SEQUANS Communications 20 4 Signal and Pins 4.1 GM01Q Pinout The signals and all the related details are listed in the MS-Excel companion file delivered together with the present document in a PDF portfolio. The pads listed in Table 4-1 are connected to ground. Table 4-1: Ground and Thermal Pads Pad

#

1 20 22 24 26 28 30 31 32 33 34 42 43 45 46 53 55 62 63 64 65 66 68 69 70 71 72 73 74 86 87 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 T23 T24 T25 T26 T27 T28 T29 T30 Pad Name GND GND Commen t All GND pads shall be connected to the same copper. T1 to T30 pads are used as both GND and thermal drops. GM01Q D PROPRIETARY SEQUANS Communications 21 4.2 UART Interfaces SIGNAL AND PINS UART INTERFACES Figure 4-1 represents the typical implementation for the hardware flow control for UART0, UART1 and UART2. TXD and RXD signals are mandatory. RTS and CTS are strongly recommended. The other signals are optional. GM01Q is designed for use as DCE (Data Communication Equipment). Based on the conventions for DCE-DTE connections, the DCE device will communicate with the customer application (DTE) using the following signals:

Port TXD on Application sends data to the modules TXD signal line. Port RXD on Application receives data from the modules RXD signal line.

"" 0B 0

+7 8 8

+7 8 8 8 8 8 8

!

+7

+7

!

Figure 4-1: UART0, UART1 and UART2 Signals Convention and Flow Control GM01Q D PROPRIETARY SEQUANS Communications 22 SIGNAL AND PINS POWER-UP SEQUENCE 4.3 Power-up Sequence The following timing requirement applies to the signals VBAT1, POWER_EN and RESET_N. It must be respected for proper GM01Qs behavior. Note:

The POWER_EN signal has no function for Monarch platform modules. It is mentioned here for compatibility reasons with Calliope platform modules. 25

,

, 2 7 Figure 4-2: VBAT1, POWER_EN and RESET_N Signals Timing Requirement for Cold Start 25

, 5 Figure 4-3: VBAT1, POWER_EN and RESET_N Signals Timing Requirement for Warm Start 25

-

9 Figure 4-4: VBAT1, POWER_EN and RESET_N Signals Timing Requirement for Reset Cycle The timing minimum values are listed in Table 4-2. Note:

For cold start: ts+ts1=10 s maximum. Table 4-2: VBAT1 and RESET_N Signal Timing Values Symbo l Description Minimum Duration Maximum Duration th1 ts ts1 23 RESET_N hold time VBAT1 setup time 1 s 1 ms RESET_N setup time 1 ms

-

-

-

PROPRIETARY SEQUANS Communications GM01Q D SIGNAL AND PINS LTE LOW POWER MODE 4.4 LTE Low Power Mode 4.4.1 General Information Important: The GM01Q module is provided with an internal RTC whose supply is VBAT1. As a consequence, VBAT1 should not be removed, in order to keep RTC active. The GM01Q will automatically enter in low-power mode. GM01Q can be woken from low power mode by external sources through:

SIM_DETECT input signal to cope with SIM card insertion or removal into a SIM card connector with built-in hardware detection. The RTS0 input signal whenever data traffic is initiated by the host connected to the module UART0 with hardware flow control; The default configuration to wake-up the module is low level. Two dedicated input signal WAKE0 and WAKE1. They are not configured by default as wake-up source but a persistent AT command can enable them. For instance, WAKE0 or WAKE1 can be used to detect an alarm from an external IC such as a sensor. GM01Q D PROPRIETARY SEQUANS Communications 24 SIGNAL AND PINS LTE LOW POWER M 4.4.2 Detailed Behavior of IO Pads of BIDIR Type Behavior in PS-P or Active Mode Figure 4-5 shows a simplified diagram of the Digital bi-directional IOs in PS-P or active mode. Figure 4-5: Digital Bi-Directional IOs in PS-P or Active Mode Behavior in PS-PM In PS-PM the Digital bi-directional IOs are completly powered Off. In PS-PM the Digital bi-directional IOs can be seen as high-impedance from the outside. Table 4-3 shows the Digital bi-directional IOs expected impedance value as seen from the ouside in PS-PM. Table 4-3: Digital Bi-Directional IOs Expected Impedance Value

(Seen from the Outside) in PS-PM 50 MOhm Typica l 25 PROPRIETARY SEQUANS Communications GM01Q D SIGNAL AND PINS LTE LOW POWER MODE 4.4.3 Detailed Behavior of IO Pads of BIDIR_WAKE Type Behavior in PS-P or Active Mode PMU bi-directional wake IOs are used as general purposed IO buffers in PS-P or active mode. Figure 4-6 shows a simplified diagram of the PMU bi-directional wake IOs in PS-P or active mode. Note:

The PMU bi-directional wake IOs output buffer requires the 3.0V power supply to be ON. Figure 4-6: PMU Wake IOs in PS-P or Active Mode GM01Q D PROPRIETARY SEQUANS Communications 26 SIGNAL AND PINS LTE LOW POWER M Behavior in PS-PM. Note:

The PMU bi-directional wake IOs output buffer is disabled in PS-PM. Figure 4-7 shows a simplified diagram of the PMU bi-directional wake IOs in PS-PM. Figure 4-7: PMU Wake IOs in PS-PM Mode In PS-PM, all PMU bi-directional wake IOs are high impedance with ultra low leakage current. This corresponds to a minimum impedance of 180 MOhm at the maximum input supply voltage of 3.6 V. If an event is presented on the wake IO pad and this wake IO has been configured to be sensitive on that event, this will take the system back to Active mode. 27 PROPRIETARY SEQUANS Communications GM01Q D SIGNAL AND PINS LTE LOW POWER MODE Table 4-4 shows the values of the measured leakage current (measurements taken on silicon) for the PMU bi-directional wake IOs. Table 4-4: Measured leakage current for the PMU bi-directional wake IOs. Minimum Typical Maximum 3 nA 4 nA 12 nA Table 4-5 shows values of the external pull-up/pull-down resistor to be used on the PMU bi-directional wake IOs pads. Table 4-5: External pull-up/pull-down resistor to be used on the PMU bi-directional wake IOs Pads. Minimum Typical Maximum 1 kOhm 10 kOhm 100 kOhm Table 4-6 shows details about the PMU bi-directional wake IOs pulses detection mechanism timings. Table 4-6: Details about the PMU bi-directional wake IOs pulses detection mechanism timings Maximum pulse width that is guaranteed to be ignored 11.1 ns 100 s Minimum pulse width that is guaranteed to be seen GM01Q D PROPRIETARY SEQUANS Communications 28 A Acronyms Acronym Definition AFE Analog Front-End APC Automatic Control Power CE Coverage Extension COO Country of origin CPU Central Processing Unit DC/DC Direct current converter DDR Double Data Rate (SDRAM) DL Downlink DPLL Digital Phase-Locked Loop ECCN Export Control Classification Number EPS ESD Evolved Packet System Electro-static discharge ETSI European Telecommunications Standard Institute FCC Federal Communications Commission (USA) GND Ground GPIO General Purpose Input Output HBM Human Body Model (ESD) Input/Output Inter-integrated circuit (bus) I/O I2C GM01Q D PROPRIETARY SEQUANS Communications 29 Acronym Definition IETF Internet Engineering Task Force. See https://www.ietf.org/

IMEI International Mobile Equipment Identity IMS Instant Messaging Service IP Internet Protocol JTAG Joint Test Action Group. See IEEE 1149.7 specification LDO Low Drop-Out regulator LGA Large Grid Array LNA Low-Noise Amplifier LTE Long Term Evolution, or 4G. Standard is developed by the 3GPP www.3gpp.org. MM Machine Model (ESD) NAS Network Access Server NVM Non Volatile Memory OEM Original Equipment Manufacturer OMADM Open Mobile Alliance Device Management PCB Printed Circuit Board PHY Physical Layer PLL Phase-Locked Loop PMIC Power Management Integrated Circuit pSRAM Pseudo-Static Random Access Memory QTY Quantity RAM Random Access Memory RAN Radio Access Network RB RF Resource Block Radio Frequency RFIC RF Integrated Circuit GM01Q D PROPRIETARY SEQUANS Communications 30 Acronym Definition RoHS Restriction of Hazardous Substances RTC Real-Time Clock Rx S/N Reception or SN: Serial Number SAW Surface Acoustic Wave (filters) SDM Socketed Device Model (ESD) SDRAM Synchronous Dynamic Random Access Memory SIM Subscriber Identification Module SMS Short Message Service SPI Serial Peripheral Interface TCXO Temperature-controlled crystal oscillator Tx Transmission UART Universal asynchronous receiver transmitter. UE User Equipment UICC Universal integrated circuit card (SIM) UL Uplink XTAL Crystal 31 PROPRIETARY SEQUANS Communications GM01Q D