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Sequans Module VZM20Q Module Integration Guide SEQUANS Communications 15-55, Boulevard Charles de Gaulle 92700 Colombes, France Phone. +33.1.70.72.16.00 Fax. +33.1.70.72.16.09 www.sequans.com contact@sequans.com Preface Legal Notices Copyright 2016, SEQUANS Communications All information contained herein and disclosed by this document is confidential and the proprietary property of SEQUANS Communications, and all rights therein are expressly reserved. Acceptance of this material signifies agreement by the recipient that the information contained in this document is confidential and that it will be used solely for the purposes set forth herein. Acceptance of this material signifies agreement by the recipient that it will not be used, reproduced in whole or in part, disclosed, distributed, or conveyed to others in any manner or by any means graphic, electronic, or mechanical, including photocopying, recording, taping, or information storage and retrieval systems without the express written permission of SEQUANS Communications. All Sequans logos and trademarks are the property of SEQUANS Communications. Unauthorized usage is strictly prohibited without the express written permission of SEQUANS Communications. All other company and product names may be trademarks or registered trademarks of their respective owners. Products and services of SEQUANS Communications, and those of its licensees may be protected by one or more pending or issued U.S. or foreign patents. Because of continuing developments and improvements in design, manufacturing, and deployment, material in this document is subject to change without notification and does not represent any commitment or obligation on the part of SEQUANS Communications. SEQUANS Communications shall have no liability for any error or damages resulting from the use of this document. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications i Document Revision History Revision Date Product Application 01 November 2016 First edition of the VZM20Q Module Integration Guide. ii PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE About this Guide Purpose and Scope This Application note is intended to help customers who want to deviate from the Sequans Reference Designs to successfully integrate and test their product based on module. It presents Integration Guidelines for:
All VZM20Q Interface Requirements Tips and how-tos for troubleshooting Development of the Hardware should follow a process that ensures the solution will be optimum and it is the purpose / goal of this document to reach this. For this to occur it is recommended that these processes are followed in order. This document is delivered as three sections:
1. 2. 3. System Overview Hardware and software design guidelines Bring-up verification and test Caution:
It is highly recommended that Sequans support teams are involved during all processes to ensure the very best can be achieved for the alternative design. Who Should Read this Document This Application Note is for hardware designers of user applications based on Sequans VZM20Q Module. Important: Reference design source files are based on the application PADS from Mentor Graphics (www.mentor.com). Customers using the other CAD applications can use schematics translators and viewers, such as Elgris (www.elgris.com). Such translators may save time and prevent mistakes during manual PADs conversion. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications iii Reference Documentation 1. 2. 3. 4. DV Tool User Guide Sequans Hardware Platform User Guide mTools Reference Manual Nimbelink Evaluation Kit User Manual See http://nimbelink.com/
Changes in this Document This is the first edition of the document. iv PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE Documentation Conventions This section illustrates the conventions that are used in this document. General Conventions Note Important information requiring the users attention. Caution Warning Italics Screen Name Software Conventions Code Code Code A condition or circumstance that may cause damage to the equipment or loss of data. A condition or circumstance that may cause personal injury. Italic font style denotes emphasis of an important word;
first use of a new term;
title of a document. Sans serif, bold font denotes on-screen name of a window, dialog box or field;
keys on a keyboard;
labels printed on the equipment. Regular Courier font denotes code or text displayed on-screen. Bold Courier font denotes commands and parameters that you enter exactly as shown. Multiple parameters are grouped in brackets [ ]. If you are to choose only one among grouped parameters, the choices are separated with a pipe: [parm1 |
parm2 | parm3] If there is no pipe separator, you must enter each parameter:
[parm1 parm2 parm3]
Italic Courier font denotes parameters that require you to enter a value or variable. Multiple parameters are grouped in brackets [ ]. If you are to choose only one among grouped parameters, the choices are separated with a pipe:
[parm1 | parm2 | parm3] If there is no pipe separator, you must enter a value for each parameter: [parm1 parm2 parm3]
MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications v Table of Contents Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Legal Notices . i Document Revision History . ii About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Purpose and Scope . iii Who Should Read this Document . iii Reference Documentation . iv Changes in this Document . iv Documentation Conventions . v 1.1 1.2 Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 System Architecture . 1 Recommended Design Flow. 3 Design Modifications . 3 Schematics Review . 3 PCB Placement and Layout Review . 3 Optimization . 4 Functional Validation . 4 Manufacturing Recommended Process . 4 1.2.1 1.2.2 1.2.3 1.2.4 1.2.5 1.2.6 Chapter 2 Manufacturing Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Manufacturing Process Overview. 5 Module Upgrade . 5 2.1 2.2 3.1 3.1.1 3.1.2 3.1.3 Chapter 3 Hardware Integration Recommendations . . . . . . . . . . . . . . . . . . . 6 Power Supply . 7 Synthesis of the Power Supplies . 7 Power Supply Circuit Example . 8 Module Operating Mode . 8 SIM Interface . 8 Interface Description . 8 Other Hardware Considerations . 9 Software-Configurable Options . 9 Host Communications Signals . 9 3.2.1 3.2.2 3.2.3 3.2 3.3 Proprietary SEQUANS Communications vi Table of Contents 3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 3.4.1 3.4.2 3.4.3 3.4.4 3.6.1 3.6.2 3.4 3.5 3.6 Introduction to UART Interfaces . 9 General Notes on UART Connections . 10 UART0 Interface . 11 UART1 Interface . 12 UART2 Interface . 13 RF Interface . 15 RF Signals . 15 Circuit Diagram Example . 16 Test Points and Measurement Access . 17 Antennas and RF Design Considerations . 17 Reset and Environmental Signals . 20 GPIO Control Interface. 21 Interface Description . 21 Software Configurable Options . 22 4.1 4.2 Chapter 4 PCB Layout Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Placement . 23 Trace Characteristic Design . 24 Digital Traces . 24 Power Supply Traces . 24 RF Traces . 25 Controlled Impedance Traces . 25 Grounding . 26 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 5.3.1 5.3.2 5.1 5.2 5.3 Chapter 5 Bring-Up and Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Introduction. 27 Prerequisites . 27 Functional Verification without Assembled Module . 28 Power Supply . 28 RF Path . 30 Functional Verification with Assembled Module. 31 Power Supply . 31 Confirm Module Power-Up Operation (UART1) . 32 GPIOs . 33 SIM Communication . 34 LTE RF Performance Test . 35 Test Configuration . 35 Procedure . 36 Troubleshooting . 36 5.4.1 5.4.2 5.4.3 5.4.4 5.5.1 5.5.2 5.5.3 5.5 5.4 Appendix A Hardware Test Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . 37 RF Interfaces Preparation . 37 A.1 Proprietary SEQUANS Communications vii Table of Contents A.1.1 LTE RF Test Preparation . 37 Appendix B Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 viii Proprietary SEQUANS Communications MODULE INTEGRATION GUIDE 1 Introduction 1.1 System Architecture Figure 1-1 provides an overview of the Host to VZM20Q interfacing relationship. The various interfaces are explained in detail later in this document. It provides summary details of:
Digital interfaces between the VZM20Q and the host platform Power supply requirement (Vbat). Note:
VBAT1 range is 3.1 V to 4.5 V. It does not show the VZM20Q local terminations. DKh>KE D Z K
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MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 1 INTRODUCTION SYSTEM ARCHITECTURE Figure 1-2: VZM20Q Mounted on Skywire 4G LTE CAT M1 Embedded Modem Figure 1-3: Skywire 4G LTE CAT M1 Embedded Modem - Bottom View 2 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE INTRODUCTION RECOMMENDED DESIGN FLOW Note:
The hardware design package of VZM20Q reference design is available from your Sequans local contact. 1.2 Recommended Design Flow To ensure that the customer benefits from the details of this document we recommend to carefully take the following information into account during the design process. 1.2.1 Design Modifications Compared to Nimbelink reference design, only the following modifications to the BOM are allowed to designers:
SIM connector Level shifter on UARTs Circuitry on RESETN Note:
Any GNSS/GPS function is out of scope of VZM20Q Reference Design. Consultancy with Sequans is highly recommended to verify these alternate preferences. 1.2.2 Schematics Review Ensuring that the circuit design by analysis will be compliant with the Sequans chipset. It is recommended that the review of the design includes Sequans technical support team. 1.2.3 PCB Placement and Layout Review To ensure the PCB layout is compliant, it is recommended that the review of this CAD activity includes Sequans at several iterative steps such as component placement, RF and digital routing, final layout levels etc. This might avoid later rework. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 3 INTRODUCTION RECOMMENDED DESIGN FLOW 1.2.4 Optimization When the design returns from the manufacture, it might occur that improvements have to be made to the circuits. It is also recommended to communicate such results to Sequans who can help to verify the implementation. 1.2.5 Functional Validation The test of the design performance should be done in thorough detail. This will ensure the compliance with the test standard as the final design will be subjected to a formal qualification. It is the designers responsibility to meet this goal. Sharing the results with Sequans will help identify any particular problem that could be fixed at an early stage to ensure strong confidence of qualification. This should be done for all the tests that involve Sequans chipsets. Hardware Test Preparation on page 37 provides you with the hardware setup required to proceed with test phases. 1.2.6 Manufacturing Recommended Process Manufacturing Process on page 5 provides information on the process required to achieve the manufacturing of your product. 4 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 2 Manufacturing Process 2.1 Manufacturing Process Overview Note:
The contents of this section will be provided in a future revision of the document. 2.2 Module Upgrade Note:
The contents of this section will be provided in a future revision of the document. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 5 3 Hardware Integration Recommendations This chapter provides the information necessary to understand the various interface requirements to interconnect with the VZM20Q, associated software-configurable items for the respective interface and, more generally, good practices for board design when considering the various interface types. Table 3-1 describes the requirements for trace characteristics. Important: Different signals require different special needs. Please consider carefully the interfacing requirement of each relevant connection. Table 3-1: Requirements Overview: Trace Characteristics Trace Characteristics Description Digital Supply 50 Ohm Quiet Ground Generic digital trace if reasonable high impedance Broader trace routing based on the power needs of the load Conventionally used for RF routing. Track must be retained to this impedance Intention is to keep away from digital signals and as short as possible, possibly burying the signal Shortest VZM20Q Ground to Host Ground possible, best possible lowest impedance path MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 6 HARDWARE INTEGRATION RECOMMENDATIONS POWER SUPPLY 3.1 Power Supply 3.1.1 Synthesis of the Power Supplies Table 3-2 and Table 3-3 provide a synthesis of the power supplies and their characteristics. Please see typical voltage values in VZM20Q Datasheet. Note:
Each output reference voltage (pads 3, 9, 11) can be either running or powered off depending on the internal software configuration. They should not be used to power external IC or parts that require permanent supply. Table 3-2: Power Supply Signals Pin Name Pin Number Trace Style Direction Notes 1V8 3V0 GNSS_VCC1 GNSS_VCC2 GNSS_VCC3 3 9,11 100 101 102 Supply Out Reference voltage. See the note above. Supply Out To be only connected to VCC1_PA and VCC2_PA. These pads should not be used for any other usage. See the note above. Supply In Reserved. Do not connect. Supply Out Reserved. Do not connect. Supply VBAT1 107, 108 Supply VCC1_PA 97 Supply VCC2_PA 98, 99 Supply In In In In Reserved. Do not connect. Voltage used for qualification is 3.8 V, range 3.1 V to 4.5 V To be connected to 3V0 To be connected to 3V0 Table 3-3: Power Supply Digital Enable Signals Pin Name Pin Number Trace Style Direction Typical Voltage Ref Notes POWER_EN 106 Digital In 1V8 MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 7 HARDWARE INTEGRATION RECOMMENDATIONS SIM INTERFACE 3.1.2 Power Supply Circuit Example 3.1.2.1 Test Points and Measurement Access Test point access is recommended on all supply nets so that the supply voltages can be measured. 3.1.2.2 Special Layout Considerations PLease refer to Section 4.2.2 Power Supply Traces on page 24. 3.1.3 Module Operating Mode Note:
The contents of this section will be provided in a future revision of the document. 3.2 SIM Interface 3.2.1 Interface Description Table 3-4 lists the VZM20Q pins related to the SIM interface. Table 3-4: SIM Interface Signals Pin Name SIM_CLK SIM_DETECT1 SIM_IO SIM_RESETN SIM_VCC Pin Number Trace Style Direction Electrical Characteristics 14 16 17 12 18 Digital Digital Digital Digital Digital Output from Module Input to Module Input or Output to/from Module Output from Module Output from Module SIM_VCC 1V8 SIM_VCC SIM_VCC 1V8 or 3V0 1. SIM_DETECT=1 signals that a card is present. SIM_DETECT=0 signals that no card is present. 8 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 3.2.2 Other Hardware Considerations HARDWARE INTEGRATION RECOMMENDATIONS HOST COMMUNICATIONS SIGNALS When considering the placement of the SIM connector and Monarch SIM interface, try to keep the distance between them as small as possible. This is to avoid supply trace inductance buildup which could cause unexpected SIM VCC supply drops under specific SIM control situations. If it is unavoidable, then be sure to add 4.7F decoupling capacitor at the SIM connector itself to act as a charge reserve in help in such situations. Please ensure that a good ground return exists between the SIM card and the VZM20Q. If the application requires the support of the hot insertion or removal of SIM card, then the SIM card handler must include a removal/insertion pad detector in order to allow the software to process the event immediately. The software support of the hot removal feature is not currently avail-
able. Please contact your Sequans representative for details. 3.2.3 Software-Configurable Options Note:
The content of this section will be provided in a future revision of the document. 3.3 Host Communications Signals 3.3.1 Introduction to UART Interfaces The communication between the VZM20Q and the host platform is supported as follows by 3 UART interfaces. UART0 is dedicated to Host-Modem interface UART1 is an optional additional Host-Modem interface. It is reserved for future use. UART2 is reserved for debug usage and Sequans manufacturing and hard-
ware qualification tools such as DMTool or DVTool. The following sections detail those interfaces. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 9 HARDWARE INTEGRATION RECOMMENDATIONS HOST COMMUNICATIONS SIGNALS 3.3.2 General Notes on UART Connections VZM20Q uses the DCE-DTE convention for UART lines. The TXD output from the device at one end of the link connects to the RXD input at the other end of the link and vice versa. Figure 3-1 represents the typical implementation for the UART connection (including hardware flow control in case of high-speed UART). TXD and RXD signals are mandatory for all interfaces. The other signals are optional. Only UART0 interface supports all data transfer signals. The DCE (Data Communication Equipment) device will communicate with the customer application (DTE) using the following signals:
Port TXD on Application sends data to the VZM20Q's TXD signal line. Port RXD on Application receives data from the VZM20Q's RXD signal line. sDY
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See the Section 3.3.2 General Notes on UART Connections on page 10 for usage of UART0. If not used, the UART0 signals should be connected to test points. Table 3-4 lists the VZM20Q pins related to the UART0 interface. Table 3-5: UART Interface Signals Pin Name Pin Number Trace Style Direction Electrical Characteristics Notes RXD0 TXD0 RTS0 CTS0 GPIO19/CLK0 GPIO41/DTR0 GPIO39/DSR0 79 77 75 76 7 84 85 Digital Out Digital Digital In In Digital Out Digital In/Out Digital In 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V Digital Out 1.8 V GPIO24/DCD0 88 Digital Out 1.8 V GPIO25/RING0 89 Digital Out 1.8 V UART0 RXD UART0 TXD UART0 RTS UART0 CTS UART0 CLK optional signal multiplexed with GPIO19. Default setting is GPIO. UART0 DTR optional signal multiplexed with GPIO41. Default setting is GPIO. UART0 DSR optional signal multiplexed with GPIO39. Default setting is GPIO. UART0 DCD optional signal multiplexed with GPIO24. Default setting is GPIO. UART0 RING optional signal multiplexed with GPIO25. Default setting is GPIO. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 11 HARDWARE INTEGRATION RECOMMENDATIONS HOST COMMUNICATIONS SIGNALS 3.3.3.2 Default Configuration The default software configuration of UART0 is AT Commands mode. The serial link settings are as follows:
Baud rate: 921600 Data: 8 bits Parity: None Stop : 1 bit Flow control: Hardware (RTS/CTS) 3.3.4 UART1 Interface 3.3.4.1 Interface Description Important:
See the Section 3.3.2 General Notes on UART Connections on page 10 for usage of UART1. If not used, the UART1 signals should be connected to test points. Table 3-6 lists the VZM20Q pins related to the UART1 interface. Table 3-6: UART1 Interface Signals Pin Name Pin Number Trace Style Direction Electrical Characteristics Notes GPIO15/RXD1 80 Digital Out 1.8 V GPIO14/TXD1 78 Digital In GPIO16/RTS1 83 Digital In 1.8 V 1.8 V GPIO17/CTS1 81 Digital Out 1.8 V GPIO38/CLK1 82 Digital In/Out 1.8 V UART1 RXD optional signal multiplexed with GPIO15. Default setting is RXD1. UART1 TXD optional signal multiplexed with GPIO14. Default setting is TXD1. UART1 RTS optional signal multiplexed with GPIO16. Default setting is GPIO. UART1 CTS optional signal multiplexed with GPIO17. Default setting is GPIO. UART1 CLK optional signal multiplexed with GPIO38. Default setting is GPIO. 12 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 3.3.4.2 Default Configuration HARDWARE INTEGRATION RECOMMENDATIONS HOST COMMUNICATIONS SIGNALS The default software configuration of UART1 is console mode. Boot traces are sent on this interface as shown on Section 5.4.2 Confirm Module Power-Up Operation (UART1) on page 32. The serial link settings are as follows:
Baud rate: 115200 Data: 8 bits Parity: None Stop : 1 bit Flow control: None 3.3.5 UART2 Interface 3.3.5.1 Interface Description Important:
See the Section 3.3.2 General Notes on UART Connections on page 10 for usage of UART2. If not used, the UART2 signals should be connected to test points. Table 3-7 lists the VZM20Q pins related to the UART2 interface. Table 3-7: UART2 Interface Signals Pin Name Pin Number Trace Style Direction Electrical Characteristics Notes RXD2 TXD2 GPIO28/RTS2 56 58 10 Digital Out Digital Digital In In 1.8 V 1.8 V 1.8 V GPIO27/CTS2 8 Digital Out 1.8 V GPIO26/CLK2 91 Digital In/Out 1.8 V UART2 RXD. UART2 TXD UART2 RTS optional signal multiplexed with GPIO28. Default setting is RTS. UART2 CTS optional signal multiplexed with GPIO27. Default setting is CTS. UART2 CLK optional signal multiplexed with GPIO26. Default setting is GPIO MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 13 HARDWARE INTEGRATION RECOMMENDATIONS HOST COMMUNICATIONS SIGNALS 3.3.5.2 Default Configuration UART2 default software configuration allows firmware upload when the device is configured in FFH mode, then it switchs in debug mode (enabling DVTool, DMTool). The serial link settings are as follows:
Baud rate: 921600 Data: 8 bits Parity: None Stop : 1 bit Flow control: Hardware (RTS/CTS) 14 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE HARDWARE INTEGRATION RECOMMENDATIONS RF INTERFACE 3.4 RF Interface 3.4.1 RF Signals 3.4.1.1 RF Interface Signals Table 3-8: RF Interface Signals Pin Name Pin Number Trace Style Direction Electrical Characteristics Notes LTE_ANT0 GNSS_ANT1 54 44 RF In/Out RF LTE antenna. Special RF routing conditions Reserved Reserved. Do not connect. 3.4.1.2 RF Control Signals Table 3-9: RF Control Signals Pin Name RFDATA12 RFDATA16 RFDATA17 39 40 41 Pin Number Trace Style Direction Electrical Characteristics Digital Digital Digital In/Out In/Out In/Out Notes Reserved. Reserved. Reserved. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 15 HARDWARE INTEGRATION RECOMMENDATIONS RF INTERFACE 3.4.2 Circuit Diagram Example Important: Figure 3-4 should be strictly followed as a topology reference. It is recommended not to deviate from this circuit from your applica-
tion. More information is provided in this document on the layout constraint which are too very important to abide by. The RF inter-connect called P1 is for example purposes only. Depending on the antenna, interfacing system will dictate the RF inter-connect. Figure 3-2: RF Typical Circuit LTE_ANT0 is the primary (main) antenna pin and carries TX and RX signals. Connect 50 Ohm transmission lines from this pins to the 50 Ohm Primary Antenna/Antenna-connector. Figure 3-2 shows, included in the connection between ANT and the antenna connectors, T-type network for matching. See Section 3.4.4 Antennas and RF Design Considerations on page 17 for more detail on connecting to these pins and for information on the T-type matching network and ESD protection. 16 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 3.4.3 Test Points and Measurement Access HARDWARE INTEGRATION RECOMMENDATIONS RF INTERFACE 50 Ohm termination points, for example P1 in Figure 3-2, are needed for Engineering and Production teams for the validation of the RF performance. The potential need to optimize the Pi-type matching network in the antenna path means that access to the IOs of this matching network is needed, so that a coaxial cable (usually 1.25mm diameter semi-rigid) can be manually attached for precision impedance measurements. Critically, a sufficient area of GND metal on the top layer adjacent to these matching networks and well-grounded to the transmission line reference GND is needed to permit robust physical attachment of the coaxial cable and with short GND connection. This area of GND metal does not need any resist removal as this can be removed manually where needed. Please refer to Section 3.4.4 Antennas and RF Design Considerations on page 17 for more detail on managing RF Trace Design. 3.4.4 Antennas and RF Design Considerations Antennas require special interfacing for optimum RX and TX Performance. 3.4.4.1 T-Type Matching A 3-component T-type matching network is recommended to be fitted. The purpose of the T-type matching network is to transform the impedance of the RF-path that extends beyond to 50 Ohm if needed. The 3 components in this matching network should be as close together as possible to minimise the interconnecting track lengths. By default the component pads should be for a 0201-size capacitor which can be a No Fit by default. There should be a short low-impedance connection connecting the GND node of this component. The series matching element should be connected at the junction where first shunt component and by default a 0 Ohm 0201-size resistor should be fitted but if matching is needed the pads needs to be able to take 0201-size inductor;
The final shunt matching element should be connected from the node where the series matching component ends to the signal ground connection. By default the component pads should be for a 0201-size capacitor which can be a No Fit by default. There should be a short low-impedance connection connecting the GND node of this component to the GND node of the first shunt component. There should be a short low-impedance connection connecting the GND node of this component to the GND reference of the 50 Ohm transmission line that continues beyond to the Antenna/Antenna-connector. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 17 HARDWARE INTEGRATION RECOMMENDATIONS RF INTERFACE 3.4.4.2 ESD Protection ESD protection is a discretionary requirement and only required if necessary, for higher ESD specifications than those provided by the VZM20Q. It is recommended to select an ESD device with very low capacitance and small size (0201) to prevent further RF matching compensation. 3.4.4.3 Standard Impedance Transmission Lines There are 2 possible methods to design 50 Ohm transmission lines:
1. With the RF track on the outer metal layer both micro-strip and coplanar types can be implemented. 2. With the RF track on an inner metal layer embedded micro-strip and strip-line topologies can be used. Irrespective of which one is selected the following guidelines are recommended:
Design the transmission line tracks appropriately wide to minimise the RF insertion loss between the Antenna/Antenna-connector and VZM20Q. The maximum insertion loss of the conducted path should be < 0.5dB Transmission lines EM fields will couple to adjacent metal layers. For microstrip implementation, make sure that a minimum of twice the spacing exists between transmission-line and associated GND. This clear-
ance to adjacent metal layers will ensure that the designed transmission line impedance is not impacted. For co-planar design, the spacing helps to define the controlled impedance. Take special care to make the calculations correctly. Whether these are microstrip or co-planar designed transmission lines, make sure that the adjacent metal GND areas are connected to the GND reference plane using periodic via connections, as to effectively terminate these leakage EM fields. 18 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE HARDWARE INTEGRATION RECOMMENDATIONS RF INTERFACE Figure 3-3: Transmission Line Implementation Examples Figure 3-3 provides examples of both transmission line implementations, specifically showing:
a) The clearance from the transmission line to adjacent metal on layer 1. b) The periodic via connections connecting metal-1 layer through to the reference GND layer for the transmission line. Avoid routing of noisy signal tracks adjacent to RF transmission lines to minimize interference coupling into VZM20Q RF ports. The component pads for the SMD terminals of the matching components used in the 3-component T-type matching circuit are effectively very short transmission lines. To minimise the RF insertion loss caused by the discon-
tinuity in width differences, the ideal width of the 50 Ohm track should be as close as possible to the width of the component pads. If connectors are used in-line on antenna paths design the PCB interface tracking and cut-out carefully to these connectors to keep the transmission line impedance to 50 Ohm. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 19 HARDWARE INTEGRATION RECOMMENDATIONS RESET AND ENVIRONMENTAL SIGNALS 3.5 Reset and Environmental Signals Table 3-10 lists the Reset and other environmental signals and the following subsections describe their purpose and termination requirements. Table 3-10: Non-Interfacing Signals Pin Name Pin Number Direction Electrical Characteristics Notes 1V8 1V8 1V8 RESETN 47 GPIO3/STATUS_LED 2 Out In/Out RESERVED/FFF_FFH 5 ADC WAKE0 WAKE1 JTAG_TDO JTAG_TRSTN JTAG_TMS JTAG_TDI JTAG_TCK 57 104 96 48 49 50 51 52 In In In In/Out Out In In In In
- GPIO
- Optional STATUS_LED. Note that the LED function is currently not available. Reserved pad: it must be PU & connected to a Test Point. An external switch should be connected to the AuxADC pins to prevent current leakage in low power modes. JTAG interface, should be connected to a test point. JTAG interface, should be connected to a test point. JTAG interface, should be connected to a test point. JTAG interface, should be connected to a test point. JTAG interface, should be connected to a test point. 20 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE HARDWARE INTEGRATION RECOMMENDATIONS GPIO CONTROL INTERFACE 3.6 GPIO Control Interface 3.6.1 Interface Description Several general purpose IOs are available:
Table 3-11: GPIOs Signals Pin Name Pin Number Direction Electrical Characteristics Notes GPIO14/TXD1 GPIO15/RXD1 GPIO17/CTS1 GPIO38/CLK1 GPIO16/RTS1 GPIO41/DTR0 GPIO39/DSR0 GPIO24/DCD0 GPIO25/RING0 78 80 81 82 83 84 85 88 89 In/Out 1V8 In/Out 1V8 In/Out 1V8 In/Out 1V8 In/Out 1V8 In/Out 1V8 In/Out 1V8 In/Out 1V8 In/Out 1V8 UART1 TXD (Input) alternate function to GPIO. See Section UART1 Interface. UART1 RXD (Output) alternate function to GPIO. See Section UART1 Interface. Optional UART1 CTS (Output) alternate function to GPIO. See Section UART1 Interface. Optional UART1 CLK (I/O) alternate function to GPIO. See Section UART1 Interface. Optional UART1 RTS (Input) alternate function to GPIO. See Section UART1 Interface. Optional UART0 DTR (Input) alternate function to GPIO. See Section UART0 Interface. Optional UART0 DSR (Output) alternate function to GPIO. See Section UART0 Interface. Optional UART0 DCD (Output) alternate function to GPIO. See Section UART0 Interface. Optional UART0 RING (Output) alternate function to GPIO. See Section UART0 Interface. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 21 HARDWARE INTEGRATION RECOMMENDATIONS GPIO CONTROL INTERFACE Table 3-11: GPIOs Signals (Continued) Pin Name Pin Number Direction Electrical Characteristics Notes GPIO40/POWER_SHDN 90 In/Out 1V8 GPIO2/POWER_MON 6 In/Out 1V8 GPIO26/CLK2 GPIO21 GPIO23 GPIO29/32KHZ_CLK_OUT GPIO42/SAR_DETECT 91 95 93 103 105 In/Out 1V8 In/Out In/Out In/Out In/Out 1V8 1V8 1V8 1V8 GPIO, emergency power shutdown signal (Input) in option. In emergency powershutdown mode, 1 kOhm PU needed, pin should be forced low level to trigger emergency shutdown procedure. Note that this feature is currently not available. GPIO or Power monitor (Output) in option.POWER_MON is high right after POWER_ON, then remains high until shutdown procedure is completed. Module can be safely electrically power off as soon as POWER_MON goes low. Note that this feature is currently not available. Optional UART2 CLK (I/O) alternate function to GPIO. See Section UART2 Interface. Optional 32 kHz (Output) GPIO, SAR detection signal (Input, active low) in option. In this SAR detection mode, 1 kOhm PU needed. Note that this feature is currently not available. 3.6.2 Software Configurable Options Note:
The content of this section will be provided in a future revision of the document. 22 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 4 PCB Layout Rules This section provides general good practices in defining a PCB layout. 4.1 Placement It is good to perform the placement of all the major components blocks before routing any section of the PCB design. The considerations here are:
VZM20Q module RF interface Initial placement of these parts allows assessment of the PCB floor plan usage and avoids any significant changes to final routed areas of the design if a placement issue is found. This also provides an opportunity for Sequans to review the placement. The following information presents considerations when performing this placement:
1. Keep them in a similar quadrant to interface they connect to. 2. Consider orientation to avoid crossing traces when routing 3. Keep them as close as possible to the VZM20Q module where possible. Note:
You can consider keeping 4mm from the perimeter of the module for component placement to allow possible update of alternative Sequans' module solution such as US130Q. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 23 PCB LAYOUT RULES TRACE CHARACTERISTIC DESIGN 4.2 Trace Characteristic Design This section explains some standard design rules when considering different types of signals involved (digital, power supply, RF). 4.2.1 Digital Traces 1. Careful and logical placement of digital signals are required to ensure sepa-
ration of digital interference between each other and unrelated traces. 2. Consider the flow of ground currents during routing. Make sure that the grounding surrounding the traces (from source to load) remains contin-
uous, with no cut or breaks. This will avoid long convoluted ground return currents which can create EMI-type problems. 3. Ensure the steps provided in Section Controlled Impedance Traces are taken into account for digital traces requiring specific impedance. 4. For those with no impedance requirements, be practical with the trace thickness. Keep them thin to avoid a buildup of capacitance, but make sure they are suitable to manufacture. If routing traces on alternate layers, avoid paralleling them and keep them orthogonal. Good practice is to run traces on alternative layer from vertical to horizontal and so forth. This avoid traces directly coupling. Important recommendation related to SIM connector placement can be found in Section 3.2.2 Other Hardware Considerations on page 9. 5. 6. 4.2.2 Power Supply Traces 1. Size the power supply traces appropriately for low impedance source. Pay attention to the number of vias used when routing traces across multiple layers. This is especially true for high current signals such as PA supply voltage. 2. For each power supply output, the decoupling capacitors ground pad must be connected to ground return of the power supply source. 3. Make sure that the digital traces remain well away from the power supply traces. 4. Appropriate dimensioning of the width and length of each supply track and the number of any interlayer connecting vias is needed to minimize the resistive losses in each supply track. 24 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 4.2.3 RF Traces PCB LAYOUT RULES TRACE CHARACTERISTIC DESIGN 1. Avoid burying these traces as much as possible, because it increases RF losses compared with routing on the top. 2. Keep as short as possible to help reduce RF losses. 3. Design the impedance of the trace keeping in mind that the footprint of the RF components should be of similar width. This help avoid impedance discontinuities. 4. Ensure the steps provided in Section Controlled Impedance Traces are taken into account when making the trace width. 4.2.4 Controlled Impedance Traces Calculation of traces width and spacing:
Use simple RF design tools to calculate the copper trace thicknesses based upon:
a) Thickness of the dielectric substrate that is used between the RF copper b) Spacing between the copper trace and the adjacent ground plane (on trace and the ground plane the same layer) c) Dielectric constant of the substrate material being used for manufac-
ture. It happens that the required trace width is impossible to manufac-
ture. It must be reconsidered until feasible. In this case, consider implementation of one of the following:
- Thicker substrate
- Moving the ground plane reference to the next layer down by removing the ground plane under the transmission line of interest General good practice guidelines a) Careful placement is required to keep RF traces short and kink-free. b) Do not route RF traces on intermediate layers. c) Ground planes beneath RF traces should be continuous. d) The ground fill around RF traces should have sufficient clearance to maintain the desired impedance. RF matching component footprints Depending on the substrate thickness and the size of the components pads used can deviate the desired transmission impedance from the wanted
(nominally 50 Ohm). For RF devices, if any copper pad in relation to RF signals is significantly larger than the transmission line width, then the ground reference could be moved to the next layer down. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 25 PCB LAYOUT RULES TRACE CHARACTERISTIC DESIGN 4.2.5 Grounding 1. Stitch ground areas together with vias where flooded ground remains unterminated. 2. Stitch ground areas together in general to keep common ground imped-
ance the same across the region. 3. RF ground planes should be as large and continuous as possible and not be cut into small islands. Check that strings of vias do not inadvertently create slots in ground or power planes. 26 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 5 Bring-Up and Testing 5.1 Introduction The purpose of this chapter is to describe what has to be done for board bring-up, test and qualification. The expectations at this stage of the products life are:
1. Consider any inconsistent and potentially hazardous manufacturing faults to be eliminated. 2. Confirm that it is safe to proceed to further detailed calibration and measurement steps. 3. Evaluate board performances. 5.2 Prerequisites The following lists the necessary tools to perform all aspects of the Hardware Qualification. 1. Device under test a) Without VZM20Q assembled:
- to check RF extra loss between the VZM20Q RF ports and product RF output
- to perform sanity check of connection with VZM20Q
- for debugging if necessary b) With VZM20Q assembled: to do hardware qualification 2. External Host PC / Laptop for UART interface Note:
Detailed information will be provided in a future revision of this document. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 27 BRING-UP AND TESTING FUNCTIONAL VERIFICATION WITHOUT ASSEMBLED MODULE 3. LTE RF test equipments Setup a) Shielding box to avoid any RF performances results degradation due to b) RF components such as: cable, splitter, 50 Ohm loads corresponding to environment the RF working band 4. Power supply with current measuring ability 5.3 Functional Verification without Assembled Module Attention:
If a fault is discovered, consider the impact of the issue observed on all the manufactured samples. The purpose of this section is to establish a sanity check of the board before soldering the module, in order to avoid any damage due to a manufacturing issue. This test covers VBAT power supply. 5.3.1 Power Supply 5.3.1.1 Test Procedure Figure 5-1 presents the equipment necessary to perform the next following test steps and the required configuration for test. Figure 5-1: Pre-Test Configuration (No Module on Board) 28 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE BRING-UP AND TESTING FUNCTIONAL VERIFICATION WITHOUT ASSEMBLED MODULE Test voltage values Test the DC nature of the voltage with an oscilloscope before connecting the DUT. Once the DC source is confirmed, you can power the DUT and measure accurately the test points voltage with a multimeter. At this stage, only VBAT1 can be tested. Check at each voltage test point, as illustrated on Figure 5-2, that the voltage value corresponds to what is expected. The values must be in the range specified in the VZM20Q Datasheet, section Electrical Operating Condi-
tions. dW sDY s Z dW dW dW Z Z Z sd s sW
sW
sd
'E
Figure 5-2: Measuring Voltage Value (VZM20Q) 5.3.1.2 Troubleshooting One power supply is incorrect If the voltage is zero for one or more supply outputs
- Check any resistor link to detect unexpected shunts or open circuits. If the voltage is incorrect for one of more supply outputs
- Check any resistor link to detect unexpected shunts or open circuits. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 29 BRING-UP AND TESTING FUNCTIONAL VERIFICATION WITHOUT ASSEMBLED MODULE 5.3.2 RF Path 5.3.2.1 Test Procedure Important: Those tests should be run or supervised by engineers with RF measurement preparation and test experience. RF path check To avoid any issue on RF extra path (from the VZM20Q module antenna output to the board antenna connector), the purpose of this part is to check its integrity. It corresponds to losses between VZM20Q pin 54 and/or pin 44 and the antenna ports of the board. Figure 5-3 provides an overview of the equipment configuration for this test. The connection to the block RF is a connection to the VZM20Q pin 54, using an RF soldered coaxial probe and RF cable connected to the SMA RF connector. Figure 5-3: RF Path Check Setup a) Measure and record the insertion loss on LTE band 4 and LTE band 13 for the first antenna from pin 54 of the VZM20Q to LTE port antenna b) By design, the extra RF path loss must be lower than 0.5 dB, to assume having good RF performances. 5.3.2.2 Troubleshooting In case of unexpected RF losses a) Ensure that the assembly of the coaxial connectors are correct :
- No dry joints.
- The right way round. b) Ensure that the soldered SMA is not short circuit or open circuit
- Test with digital voltmeter. c) Verify the RF equipment calibration, including coaxial cable used to connect to the VZM20Q pin and RF cable d) Verify that the RF matching is good 30 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE 5.4 Functional Verification with Assem-
bled Module BRING-UP AND TESTING FUNCTIONAL VERIFICATION WITH ASSEMBLED MODULE Attention:
If a fault is discovered, consider the impact of the issue observed on all manufactured samples. The purpose of this section is to validate the assembly process of the module. This test covers:
1. VZM20Q pins and features:
a) Power supply b) UART1 console output during power-up operation c) SIM Interface d) GPIOs 2. Nominal power consumption 3. VZM20Q boot 5.4.1 Power Supply 5.4.1.1 Procedure 1. Turn on the device under test in FFH mode. 2. Confirm voltages of the power supplies remain the same before VZM20Q is assembled. Caution:
If, at this point, the voltages are incorrect, stop immediately to diagnose the cause of the issue. 3. Confirm that the current is nominal from the internal power supply Observe the current drawn and ensure it is in line with the expected one. a) Expected VZM20Q current with no firmware loaded will be provided in a future revision of this document. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 31 BRING-UP AND TESTING FUNCTIONAL VERIFICATION WITH ASSEMBLED MODULE 5.4.1.2 Troubleshooting Excessive current draw Check all VZM20Q voltage supplies. Confirm that there is no VZM20Q supply short circuits. Voltage should read according to the nominal requirement. No current draw or current less than expected a) Check the external power supply wiring b) Check for dry joint between VZM20Q pin(s) and the power supply source. 5.4.2 Confirm Module Power-Up Operation (UART1) An example of the output on UART1 console is provided below (boot in FFH mode):
[0000000000] RBGerbil 11.5@26553 '5.0.0.0 [26553]'
[0000000004] Reset cause 'EXT'(real 'EXT' ) (bootWDG :
'0') [rawRst '0x00000001']
[0000000011] regConfig 0xEF317ABF@1
[0000000014] Running sector 0x1C040000
[0000000018] boot: Current flash, timeout 10000, proto thp
[0000000023] FFH forced.
[0000000025] boot: Switched to uart1, timeout 60000, proto at
[0000000031] uart: using uart1 with baudrate 921600
[0000000035] [AT] Info: Forcing baudrate to 115200 for AT negociation 32 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE BRING-UP AND TESTING FUNCTIONAL VERIFICATION WITH ASSEMBLED MODULE 5.4.3 GPIOs 5.4.3.1 Procedure This section helps to confirm a GPIOs behavior. Use the mTools command AT+SMGT. The first 32-bits triplet of parameters is a bitmask to address the GPIO, the second 32-bits triplet of parameters is the bitmask of the value to drive on the GPIO, and the third 32-bits triplet provides the expected polarity setting for the GPIO. Refer to mTools Reference Manual for more detail on this command. The following command tests SQN3330_GPIO_22 (GPIO[22]) setting to 1, active high. Value 22 is represented by bitmask 0x400000, coded as triplet 0,0,0x400000. AT+SMGT=0,0,0x400000,0,0,0x400000,0,0,0 The following command tests SQN3330_GPIO_38 (GPIO[38]) setting to 1, active low. Value 38 is represented by bitmask 0x4000000000, coded as triplet 0,0x40,0. AT+SMGT=0,0x40,0,0,0x40,0,0,0x40,0 Test the expected behavior as needed by your implementation. 5.4.3.2 Troubleshooting Unexpected AT command error Make sure that the version of Firmware used is the correct version. Unexpected GPIO behavior Ensure that there exists no short or open circuit between the test point and the VZM20Q. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 33 BRING-UP AND TESTING FUNCTIONAL VERIFICATION WITH ASSEMBLED MODULE 5.4.4 SIM Communication 5.4.4.1 Procedure Confirmation of SIM behavior:
Insert the following command to verify the SIM is working properly. Send AT commands <AT+SMST?>, as described in mTools Reference Manual. Response will display +SMST=<status>, where <status> can be:
OK: Test completed with a positive status. NO SIM: No SIM card was detected. NOK: Test completed and detected a problem. 5.4.4.2 Troubleshooting Unexpected AT command error Make sure that the version of Firmware used is the correct version. Unexpected SIM behavior Check all the connections between the SIM housing and the VZM20Q module are done according to Section 3.2 SIM Interface on page 8. Ensure that there exists no short or open circuit between the SIM housing and the VZM20Q. 34 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE BRING-UP AND TESTING LTE RF PERFORMANCE TEST 5.5 LTE RF Performance Test The purpose of this part is to check LTE RF performances of module in non-signaling mode. This test allows validation of TX and RX path using mTools firmware. For this part, the board has to be used in FFH mode. 5.5.1 Test Configuration The test configuration is as follows:
sd
,
^
^
'
hd hZd
^
D
^
Figure 5-4: RF Performance Test Configuration 1. VZM20Q UART2 connection routed to an External PC/Laptop running:
a) VZM20Q mTools firmware (already validated with Sequans Reference DUT) b) Sequans DVTool (already validated with LTE RF test Equipment) 2. RF connection via coaxial cable to the coaxial test points of the VZM20Q and LTE RF Test Equipment 3. The board is configured in FFH mode by configuring FFF_FFH level. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 35 BRING-UP AND TESTING LTE RF PERFORMANCE TEST 5.5.2 Procedure 1. Apply the power from the local Host to the VZM20Q. 2. Launch DVTool on UART2. Guidelines for using DVTool can be found in document 4G-EZ DV Tool User Manual. a) Ensure that the external RF losses from VZM20Q to MXA / MXG are configured into DVTool b) Perform the Rx and TX Screening 3. Change DV Tool configuration so as to perform Rx test in each band at mid-frequency and mid input level (typically -60 dBm), and check the usual criteria on RSRP and CINR for RX. Notes:
DVTool contains a board suite of RF test tools to help validate the RF performance against the 3GPP test specification. It is highly recommended that once the screening is validated a full DVTool test campaign is performed for both RF bands. This should include releasing such results to Sequans for qualification. Final product pre-conformance test at a reputable test facility to test stan-
dards TS 36.521-1 & 36.521-2 is further recommended in advance of final conformance test requirements. Releasing results to Sequans for checking is also highly recommended. 5.5.3 Troubleshooting Note:
The most frequent problems that can occur at this stage either can be solved with recommendations deduced from other sections in this document, or will be provided in a future edition of this docu-
ment. 36 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE A Hardware Test Preparation A.1 RF Interfaces Preparation A.1.1 LTE RF Test Preparation Note:
The list of the test equipment compatible with the tests is to be found in Section 1.2 of 4G-EZ DV Tool User Manual. To ensure that the RF test platform will provide the most reliable interface for testing. The following setup is proposed when measuring RF characteristics of the VZM20Q System. The shield box cavity is configured as shown on Figure A-1:
The DUT is connected to the computer by UART2. The DUT is also connected by one RF cable. MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 37 RF INTERFACES PREPARATION Figure A-1: Shield Box Cavity View Figure A-2 shows the required configuration for calibration and screening. It consists of:
1 x ZN2PD2-50-S + power splitter if the signal analyzer and the signal generator are two distinct equipments. R&S CMW500 for instance allows the use of a single bidirectional RF port and prevents the need of a power splitter. 1 x RF cable to the MXA (if needed) 1 x RF cable to the MXG (if needed) 1 x RF cable to the DUT (in the shield box) 38 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE RF INTERFACES PREPARATION Figure A-2: Configuration for Calibration and Screening MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 39 B Abbreviations AC ACLR Alternate Current Adjacent Channel Leakage Ratio LTE_ANT0 Antenna 0 for LTE AT Command Modem-type commands prefixed with AT characters ATR BOM cDRX CLI CMOS COM CPU CS dB DC DL DRX DUT DVM Answer To Reset (SIM) Bill Of Material Connected Discontinuous Reception Command Line Interface Complementary Metal Oxide Semiconductor Communication Central Processing Unit Chip Select decibel Direct Current Downlink Discontinuous Reception Device Under Test Digital Voltmeter DV Tool Diagnostic and Validation Tool EEPROM Electricaly Erasable Programable Read-Only Memory MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 40 EM EMI FFF FFH FS FW GND GNSS GPIO GPS HW IC IMEI IT LNA LTE MAC MII MIO MXA MXG NIE OBB PA PC PCB Electromagnetic Electromagnetic interference Firmware From Flash module boot mode Firmware From Host module boot mode File System Firmware Ground Global Navigation Satellite System, such as GPS, GLONASS, IRNSS, BeiDou-2tf, or GALILEO. General Purpose Input/Output Global Positioning System (see GNSS) Hardware Integrated Circuit International Mobile Equipment Identity Interrupt Low-Noise Amplifier Long-Term Evolution. See also www.3gpp.org/. Medium Access Control protocol layer Medim Independant Interface Multiple Input/Output Signal Analyzer Signal Generator Sequans internal format for data representation Opaque Binary Blob file format Power amplifier Personal Computer Printed Circuit Board MODULE INTEGRATION GUIDE PROPRIETARY SEQUANS Communications 41 PMIC PPS PS PS-P PS-PA PSI R RF RFIC RX S/N SIM SMA SMD SPI SW TX Power Management Integrated Circuit Protocol and Parameters Selection (SIM) Power Supply Power supply state. See section Operating Modes. Power supply state. See section Operating Modes. Platform Specification Interface Short notation for Ohm Radio Frequency Radio Frequency Integrated Circuit Reception Serial Number Subscriber Identity Module RF connector type Storage Module Device Serial Peripheral Interface Software Transmission or Emission UART Universal Asynchronous Receiver Transmitter UE UL USB USIM WP User Equipment Uplink Universal Serial Bus Universal SIM. Write Protect 42 PROPRIETARY SEQUANS Communications MODULE INTEGRATION GUIDE
1 | Users Manual | Users Manual | 2.32 MiB |
CAT-M Module USER GUIDE SEQUANS Communications Les Portes de la Dfense Hall A 15-55 Boulevard Charles de Gaulle 92700 Colombes - France Phone. +33.1.70.72.16.00 Fax. +33.1.70.72.16.09 www.sequans.com contact@sequans.com Cat-M Module Board User Guide Legal Notices Copyright 2015, SEQUANS Communications All information contained herein and disclosed by this document is confidential and the proprietary property of SEQUANS Communications and all rights therein are expressly reserved. Acceptance of this material signifies agreement by the recipient that the information contained in this document is confidential and that it will be used solely for the purposes set forth herein. Acceptance of this material signifies agreement by the recipient that it will not be used, reproduced in whole or in part, disclosed, distributed, or conveyed to others in any manner or by any means graphic, electronic, or mechanical, including photocopying, recording, taping, or information storage and retrieval systems without the express written permission of SEQUANS Communications. All Sequans logos and trademarks are the property of SEQUANS Communications. Unauthorized usage is strictly prohibited without the express written permission of SEQUANS Communications. All other company and product names may be trademarks or registered trademarks of their respective owners. Products and services of SEQUANS Communications, and those of its licensees may be protected by one or more pending or issued U.S. or foreign patents. Because of continuing developments and improvements in design, manufacturing, and deployment, material in this document is subject to change without notification and does not represent any commitment or obligation on the part of SEQUANS Communications. SEQUANS Communications shall have no liability for any error or damages resulting from the use of this document. Software Acknowledgements Document Revision History Revision Date Description 1 09 30, 2016 Creation Referenced Documents Revision Date Document Name Document Title 1 09 25, 2016 Cat-M_Board_user_manual Cat-M Board user manual SEQUANS Communications Confidential and Proprietary 2/25 Cat-M Module User Guide Table of Contents Legal Notices ................................................................................................................................................ 2 Software Acknowledgements ........................................................................................................................ 2 Document Revision History ........................................................................................................................... 2 Referenced Documents ................................................................................................................................ 2 Table of Contents .......................................................................................................................................... 3 Introduction ........................................................................................................................................ 4 1. 2. Board overview.................................................................................................................................. 4 3. Board boot up .................................................................................................................................... 5 3.1. MFW ............................................................................................................................................ 5 3.2. BAT file for FW flashing .............................................................................................................. 5 3.3. Bootup ......................................................................................................................................... 5 3.4. Bootloader Update ...................................................................................................................... 6 4. DM connection Please contact Sequans POC for latest Version of DM tool. ................................. 8 4.1. Start DM ...................................................................................................................................... 8 4.2. Activate light events .................................................................................................................... 9 4.3. Activate and stop DM logs ........................................................................................................ 10 4.4. Power up & Power Down the UE .............................................................................................. 10 5. Establish Data Connection to PC .................................................................................................... 11 5.1. Setup the Modem & Baud Rate ................................................................................................ 11 SEQUANS Communications Confidential and Proprietary 3/25 Cat-M Module User Guide 1. Introduction This document describes how to use the Cat-M "Module" board, from boot to data traffic. This document targets engineers who will need to use the Cat-M Module board for test activities and demos. 2. Board overview The main interfaces and buttons are described in the picture below. NOTE : A USB to Serial Adapter will be required to communicate with the Module SEQUANS Communications Confidential and Proprietary 4/25 Cat-M Module User Guide 3. Board boot up 3.1. MFW MFW is based on default.ELF file. Note : That currently the FW is to be pushed from the Laptop and hence requires a dedicated Laptop per UE to be used at all times. Bootup procedure below needs to be performed everytime the UE is USB Powered down or Reset is performed. 3.2. BAT file for FW flashing Please contact your Sequans POC for Batch file to Flash the UE & Latest FW Firmware file (*.elf) should be renamed to default.elf & be placed under SQN_CATM_DM_STP_V0.3\SQN_FW_Load\Firmwares ( Please unzip the Batchfile to get this location. Note this folder can be placed & run from anywhere on your PC, however it is important that *.elf file be placed inside the Firmwares folder) Note : Firmware file & Bootloader both are both in *.elf but can be differentiated by size. Firmware file is approximately 3+ megabytes while the Bootrom will be approximately 1.5 megabytes 3.3. Bootup 1. Connect USB cable on the laptop to power up. Serial Ports will appear as you connect them to different UART ports. 2. Use putty or teraterm to open UE console through UART2 with the baud rate 115200 3. On UE press on the Reset button to have UE loading the bootrom and to be able to load the firmware 4. Copy your *.elf into the folder "SQN_FW_Load/Firmwares" with the name "default.elf"
5. Modify the "load_SQN_CatM_Fw.bat" script so as to use your correct COM port Number instead of the preconfigured "COM45" & set the Baud rate to 921600 6. Run the "load_SQN_CatM_Fw.bat" script 7. When the FW finish to load with 100%. 8. Now you can start your DM 9. Let's configure the DM if it was not done 10. DM->File->Preferences-> the window "Configuration" will open 11. Tick "enable UART"; then type correct COMM port corresponding to UART0 in the port name, use baud rate 921600 instead of 115200 on the baudrate section 12. Click on OK. Using the UART0 serial port UE can now be seen connected on the DM. SEQUANS Communications Confidential and Proprietary 5/25 Cat-M Module User Guide 3.4. Bootloader Update To check the current Bootrom Version Log into UE through console Port & The first line displays the current version of Bootrom. Steps to update the Bootrom:
1. Connect UE USB cable on the laptop. Serial Ports will appear as you connect them to different UART ports. 2. Use putty or teraterm to open UE console through UART2 with the baud rate 115200 and keep it open all the while. 3. On UE press on the Reset button to have UE load the bootrom and to see the current version. 4. Copy your *.elf into the folder "SQN_FW_Load/Firmwares" with the name "default.elf" . Modify the
"load_SQN_CatM_Fw.bat" script so as to use your correct COMM port Number instead of the preconfigured "COM45" & set the Baud rate to 921600 5. Run the "load_SQN_CatM_Fw.bat" script 6. When the FW finish to load with 100%. 7. Go back to already open console port and press Enter. Mtools dedicated application text will appear on screen. 8. To upgrade the Bootrom use the following commands. AT ( Press Enter) AT+SMBB=0,"DROP" ( Press Enter) 9. Bootrom is updated when console port returns OK. Reset the UE Manually or use AT^Reset &
from next boot up updated bootrom will be used. See below image highlighting the above steps. SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 6/25 Please Note : Currently Reverting back to Older Bootrom is not compatible. SEQUANS Communications Confidential and Proprietary 7/25 Cat-M Module User Guide 4. DM connection Please contact Sequans POC for latest Version of DM tool. 4.1. Start DM 1. Click on 4G Debug & Monitoring tool; Sequans DM window shall be displayed as below:
If not, make sure File->Offline Mode is untick. 2. SEQUANS Communications Confidential and Proprietary 8/25 Cat-M Module User Guide 4.2. Activate light events 1. Click on Views->Record config 2. Click on Add base events this will enable basic LTE events, Add specific events if required. SEQUANS Communications Confidential and Proprietary 9/25 Cat-M Module User Guide 4.3. Activate and stop DM logs 1. Before performing the test, activate DM logs by clicking on Start on Sequans DM window. 2. At the end of your test, stop DM logs by clicking on same button, then click on Cancel. DM logs are located at Basename path 4.4. Power up & Power Down the UE 1. To power up the UE, type poweron then press Enter on CLI for UE window. 2. To power off the UE, type poweroff then press Enter on CLI for UE window. Please run the command addscanfreq 13 5230 before running any test in CLI for UE window SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 10/25 5. Establish Data Connection to PC 5.1. Setup the Modem & Baud Rate Open the device manager, click on ActionAdd legacy hardware SEQUANS Communications Confidential and Proprietary 11/25 Cat-M Module User Guide Click on Next Select Install the hardware manually
]
In the list, select Modem SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 12/25 Check Don't detect my modem In the list, select Communications cable between two computers SEQUANS Communications Confidential and Proprietary 13/25 Cat-M Module User Guide Select the COM port associated with the UART1 of the board (in this case, we use COM5) Click on Finish SEQUANS Communications Confidential and Proprietary 14/25 Cat-M Module User Guide Now in the device manager, under the Modem section, you can see the Communications cable between two computers Click right on it, and select Properties SEQUANS Communications Confidential and Proprietary 15/25 Cat-M Module User Guide In the tab Modem list the baudrates for Maximum Port Speed, you will see that the maximum value is 115200. We want to make 921600 baudrate available. To do so we have to modify the base register. Close the Properties window and start regedit as administrator SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 16/25 into HKEY_LOCAL_MACHINE\SYSTEM\CurrentControlSet\Control\Class\{4D36E96D-E325-11CE-
Go BFC1-08002BE10318}\0000 Check the AttachedTo field value matches the UART1 COM port. Here we have highlighted an example of COM24. Double click on Properties SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 17/25 Find the first occurence of 00 C2 01 00 and change it into 00 10 0E 00 SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 18/25 Close regedit, return in the device manager and re-open the Properties window of Communications cable between two computers Select 921600 as maximum baudrate SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 19/25 Open the Network and sharing center Click on Set up a new connection or network Select Set up a dial-up connection SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 20/25 Put a dummy number in Dial-up phone number then click on Connect When the dialing window appear, click on Skip SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 21/25 Click on Close on the next window Return in the Network and sharing center and click on Change adapter settings on the top left SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 22/25 Click right on the Dial-up Connection and click on Properties In the Options tab, uncheck Prompt for name and password, certificate, etc. and Prompt for a phone number SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 23/25 Once the UE is ATTCHED to the Network, Type below commands to establish PPP connection to the Laptop Connect to the UART1 port( Used to load the FW) with baud rate of 921600 & then AT ( Press Enter) AT+CGDATA="PPP",1,1 Once you see Connect message close the window and proceed to Next Step. Note : It is important to close the window as otherwise the port remains occupied and PPP connections is not established. SEQUANS Communications Confidential and Proprietary Cat-M Module User Guide 24/25 Click right on the Dial-up Connection and select Connect A dialog window opens, passes quickly the connection steps until it shows Connected for a few seconds, then it closes itself. The console of the board shows that PPP connection is established and shows the local and remote IP adresses. SEQUANS Communications Confidential and Proprietary 25/25 Cat-M Module User Guide
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2017-04-30 | 777 ~ 787 | TNB - Licensed Non-Broadcast Station Transmitter | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2017-04-30
|
||||
1 | Applicant's complete, legal business name |
Sequans Communications
|
||||
1 | FCC Registration Number (FRN) |
0022755912
|
||||
1 | Physical Address |
15-55 Boulevard Charles de Gaulle
|
||||
1 |
Colombes, N/A 92700
|
|||||
1 |
France
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
T******@intertek.com
|
||||
1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
2AAGM
|
||||
1 | Equipment Product Code |
VZM20Q
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
S**** F****
|
||||
1 | Title |
PLM senior director
|
||||
1 | Telephone Number |
00336********
|
||||
1 | Fax Number |
00331********
|
||||
1 |
s******@sequans.com
|
|||||
app s | Technical Contact | |||||
1 | Firm Name |
Sequans Communications S.A.
|
||||
1 | Name |
P****** G****
|
||||
1 | Physical Address |
15-55 Boulevard Charles de Gaulle
|
||||
1 |
Colombes, 92700
|
|||||
1 |
France
|
|||||
1 | Telephone Number |
33619********
|
||||
1 | Fax Number |
33170********
|
||||
1 |
p******@sequans.com
|
|||||
app s | Non Technical Contact | |||||
1 | Firm Name |
Sequans Communications S.A.
|
||||
1 | Name |
P**** G****
|
||||
1 | Physical Address |
15-55 Boulevard Charles de Gaulle
|
||||
1 |
Colombes, 92700
|
|||||
1 |
France
|
|||||
1 | Telephone Number |
33619********
|
||||
1 | Fax Number |
33170********
|
||||
1 |
p******@sequans.com
|
|||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 10/25/2017 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | TNB - Licensed Non-Broadcast Station Transmitter | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | VZM20Q | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Limited Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Limited Licensed Modular Transmitter. Approval is limited to OEM installation only. Power listed is conducted power. This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. OEM integrators and end-users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Under no conditions may an antenna gain be used that would exceed the ERP power limit as specified in Part 27. The Grantee is responsible for providing the documentation required for modular use. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
Intertek Testing Services NA
|
||||
1 | Name |
J**** S****
|
||||
1 | Telephone Number |
859-2********
|
||||
1 | Fax Number |
859 2********
|
||||
1 |
j******@intertek.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 27 | 777.00000000 | 787.00000000 | 0.2500000 | 2.5000000000 ppm | 1M40F9W |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC