DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 1 DK7050 Bluetooth Low Energy Module Version 0.5BETA Formal Release
INTRODUCTION DK7050 is a Bluetooth Low Energy wireless module to provide BLE connectivity to MCU or hosted systems. It consists of a fully integrated 2.4GHz radio transceiver, modem, and baseband processor for Bluetooth Low Energy system. DK7050 runs autonomously, automatically advertising, scanning and maintaining connection with minimal host effort. DK7050 supports iCMD, a light-weight command set with BLE GAP and GATT Server function. SPI & UART interface are supported. Typical code usage on the system host for the DK7050 setup is 4kB to 8kB and SRAM usage of 200 to 500 bytes depending on application complexity.
FEATURES
Bluetooth Core Spec v4.2 compliant
GAP roles supported: Broadcaster, Observer, & Peripheral
GATT features: GATT server; up to 22 bytes for each Characteristic, expandable to 512 bytes; up to 38 Characteristics
Radio Certification MIC Japan (Certification no. TBD) FCC (FCC ID: TBD) RED (R&TTE ID: TBD)
Bluetooth Qualification (End Product, QDID: D033798)
Battery Supply Voltage
Operational Temperature
Current Consumptions 1.9V to 3.6V
-20C to +85C Hibernate (Idle, XTAL off) Mode 3.5uA (Typ.) On State (Idle) Mode TX Mode (2dBm) RX Mode 7.5mA (Typ.) 31mA (Typ.) 28mA (Typ.)
Dimension
Pb Free, RoHS Compliant 12.0mm(W) x 13.0mm(L) x 1.8mm(H)
SCHEMATICS DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 2
PIN ASSIGNMENTS (TOP VIEW)
PIN DEFINITIONS DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 3
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1 2 3 4 5 6 7 8 9 Pin Name I/O Ana/Dig I/O Type Function GND GND VDDQ INT1 INT0
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-
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GND GND GND GND GND GND ANA
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E-Fuse programming power input pin Required connect to GND for normal usage. IN OUT DIG DIG CMOS Interrupt input to DK7050 (WAKELOCK) CMOS Interrupt to external MCU, active-low CMIF0 INOUT DIG CMOS iCMD interface, set to SPI SCLK by strapping CMIF2 iCMD interface, CMIF1 INOUT DIG CMOS set to SPI CSN by strapping CMIF2 or UART RXD CMIF2 INOUT DIG CMOS iCMD interface, set to SPI MISO by strapping CMIF2 or UART TXD CMIF3 INOUT DIG CMOS 10 RF_IND OUT DIG CMOS iCMD interface, set to SPI MOSI by strapping CMIF2 Indicating RF (TX or RX) is on, Configurable active polarity 11 12 13 RES1 OUT DIG CMOS Reserved test pins, NC for normal operation VBAT GND
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-
PWR VCC Power Supply, 1.9V to 3.6V GND GND GND UART DTX for DTM tests, default tri-state 14 UART_DTM1 INOUT DIG CMOS Enable by iCMD Keep floating for normal operation UART DRX for DTM tests, default tri-state 15 UART_DTM0 INOUT DIG CMOS Enable by iCMD 16 HW_RSTN IN DIG CMOS Hardware reset pin (active low) Keep floating for normal operation 17 UART_DEB1 INOUT DIG CMOS 18 UART_DEB0 INOUT DIG CMOS Debugging UART DTX (protocol debug) Keep floating for normal operation Debugging UART DRX (protocol debug) Keep floating for normal operation TP0 ICE_RSTN IN DIG CMOS ICE reset pin (active low), debugging purpose TP1 SWCLK INOUT DIG CMOS ICE SWCLK pin, debugging purpose TP2 SWD INOUT DIG CMOS ICE SWD pin, debugging purpose DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 4
SYSTEM OVERVIEW
Power States DK7050 consists of 2 power states: hibernate and active. The different power states have different level of current consumption and activities. Mode Name Function Hibernate 32k RC as RTC System on, set up protocol parameters and databases, running BLE protocol and RF Active activities. The 32k RC clock is calibrated with the RF crystal during active state, ensuring frequency accuracy during hibernate state.
Boot Strapping DK7050 iCMD interface supports UART and SPI (SPI MODE0) interfaces. The choice is set by boot strapping pin CMIF2 during POR. For choosing SPI interface requires adding external pull-up resistor
(< 5kohm) on CMIF2 pin. For using UART interface there is no any additional action required. The timing chart about strapping related to VBATT power sequence is shown below. After VBATT power settled interface mode would be strapped in 1ms. The mapping table for SPI or UART is shown below. DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 5
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6 7 8 9 Pin Name SPI definition UART definition Notes CMIF0 CMIF1 SCLK CSN CMIF2 MISO CMIF3 MOSI
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RXD TXD
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Strapping pin pull high for SPI, leave open for UART DK7050 UART and SPI specification are shown below. Mode Name Max Speed Notes UART SPI 9600bps 8 data bits, no polarity bit used, 1 stop bit used 4MHz Only support SPI MODE0
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5 4 IRQ/WAKELOCK Pin Name INT0 INT1 I/O OUT IN
Hardware Reset definition Notes IRQ Event interrupt, active low WAKELOCK Prevent DK7050 into idle mode, active high
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Pin Name 16 HW_RSTN I/O IN definition Notes RSTN Weakly pull-high, Active low
UART_DTM UART_DTM1 and UART_DTM0 pins are used for SIG DTM tests. A special iCMD command enables the UART function for DTM test; system host should have a test mode procedure to set DK7050 to DTM mode.
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Pin Name I/O definition Notes 15 UART_DTM0 INOUT DRX 14 UART_DTM1 INOUT DTX Default Tri-State, Enable by iCMD Keep floating for normal operation Default Tri-State, Enable by iCMD Keep floating for normal operation DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 6
UART_DEB UART_DEB1 and UART_DEB0 pins provide debugging log for the BLE protocol. Leave the pins open; tying the pins to logic 0 or 1 will cause malfunction.
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Pin Name I/O definition Notes 18 UART_DEB0 INOUT DRX 17 UART_DEB1 INOUT DTX Protocol debugging purpose keep floating for normal operation Protocol debugging purpose keep floating for normal operation
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings Symbol Description Note Min. Typ. Max. Unit VPIN Limiting voltage on pin TStore TVRISE Storage temperature Power supply rise time VBATT_L Supply voltage limit ESDHBM ESD, human body mode ESDMM ESD, machine mode ESDCDM ESD, charged device mode
Operating Conditions
-0.1
-50 5
-0.1 VBATT 150 V C 100 msec. 3.6 4000 125 1000 V V V V Parameter Description Note Min. Typ. Max. Unit VBATT VDDQ VIO T Supply Voltage E-fuse programming voltage I/O Voltage Operational Temperature
Power Consumptions 1.9 2.4 0
-20 3.6 2.6 VBATT V V V
+85 C 2.5 Parameter Description Note Min. Typ. Max. Unit IHIB ION Hibernate mode current On state (Idle) mode current ITX2DBM TX mode current IRX RX mode current 3.5 7.5 31 28 uA uA mA mA DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 7
TX Characteristics Parameter Description Note Min. Typ. Max. Unit FRANGE Operational frequency range FDEV Frequency deviation PRF_MAX Maximum output power*
PRF_TYP Typical output power PRF_RANGE output power range PRF_LP Quiet mode output power PRF_OFFSET2M Spurious @ 2MHz offset PRF_OFFSET3M Spurious @ 3MHz offset PRF_HD2 2nd harmonic power PRF_HD3 3rd harmonic power 2400 225 250 8 2 30
-40
-53
-44 2483 MHz 275 kHz
-54
-58
-49
-42 dBm dBm dB dBm dBm dBm dBm dBm
*Not support radio certification in +8dBm TX output case.
RX Characteristics Parameter Description Note Min. Typ. Max. Unit PRX_MAX Maximum received power PRX_MIN_IDEAL Minimum received power, ideal PRX_MIN_DIRTY Minimum received power, dirty CRX_I_CO CRX_I_1ST CRX_I_2ND CRX_I_3+N CRX_I_IMG CRX_I_IMG1 PRX_IMD PRX_OOB1 PRX_OOB2 PRX_OOB3 Out-of-band blocker, 2GHz~2.399GHz Out-of-band blocker,
< 2GHz Out-of-band blocker, 2.484GHz~6GHz 2
-93.5
-92 8 1
-28
-38
-21
-23
-35
-16
-5
-15
-38 dBm dBm dBm dB dB dB dB dB dB dBm dBm dBm dBm
Power On Reset DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 8 Parameter Description Note Min. Typ. Max. Unit TPOR Time from power ready to POR TCH THD Time from POR to strap latched THD = TPOR+TCH 2 1 3 msec msec msec
SPI Specification Parameter Description Note Min. Typ. Max. Unit TCSF TCSB TCSI TCK TSE THD TCH CSN to SCK positive edge SCK negative edge to CSN time CSN inactive time SCK period time MOSI data input setup time MOSI data input hold time MISO data output change time 1000 1000 1000 250 5 5 15 nsec nsec nsec nsec nsec nsec nsec DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 9
MODULE DIMENTIONS Top View m m 0
. 3 1 Top View
REFERENCE PCB LAYOUT/METAL KEEP-OUT AREA DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 10 DaKai Coperation DK7050 BLE Module Datasheet, Version 0.5BETA 11 Important notes to third party user for transceiver module:
The transceiver Module complies with Part15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC Certification, the third party user must comply with the following regulations:
1. The third party user must ensure that the text on the external label provided with this device is placed on the outside of the final product. Contains FCC ID: 2APYU-DK7050. The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 2. The transceiver Module may only be used with the onboard PCB antenna (internal, integral antenna) that have been tested and approved for use with this module. 3. The transceiver Module have been certified by the FCC for use with other products without any further certification. Modifications not approved by DAKAI could void the user's authority to operate the equipment. 4. This device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. 5. Third party users must test final product to comply with unintentional radiators before declaring compliance of their final product to Part 15 of the FCC Rules. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.