FCC ID: 2AMWOFSC-BT958 Bluetooth module

FSC-BT958 Datasheet FSC-BT958 5.0 Dual Mode Bluetooth Module Datasheet Version 1.0 Shenzhen Feasycom Technology Co.,Ltd www.feasycom.com

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FSC-BT958 Datasheet Copyright 2013-2021 Feasycom Technology. All Rights Reserved. Feasycom Technology reserves the right to make corrections, modifications, and other changes to its products, documentation and services at anytime. Customers should obtain the newest relevant information before placing orders. To minimize customer product risks, customers should provide adequate design and operating safeguards. Without written permission from Feasycom Technology, reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is prohibited. Revision History Version 1.0 Data 2021/04/20 Notes Initial Version Fish Contact Us Shenzhen Feasycom Technology Co.,LTD Email: sales@feasycom.com Address: Room 2004-2005,20th Floor,Huichao Technology Building,Jinhai Road, Xixiang ,Baoan District,Shenzhen,518100,China. Tel: 86-755-27924639, 86-755-23062695 Shenzhen Feasycom Technology Co.,Ltd www.feasycom.com

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FSC-BT958 Datasheet Contents 1. INTRODUCTION ............................................................................................................................................................... 4 2. GENERAL SPECIFICATION ................................................................................................................................................. 5 3. HARDWARE SPECIFICATION .......................................................................................................................................... 5 3.1 BLOCK DIAGRAM AND PIN DIAGRAM ......................................................................................................................................... 5 3.2 PIN DEFINITION DESCRIPTIONS ................................................................................................................................................. 6 4. PHYSICAL INTERFACE ....................................................................................................................................................... 8 4.1 POWER SUPPLY....................................................................................................................................................................... 8 4.2 AUDIO INTERFACES .................................................................................................................................................................. 8 4.2.1 Microphone Input & line IN ........................................................................................................................................ 8 4.2.2 SPEAKER ..................................................................................................................................................................... 8 4.3 RESET ................................................................................................................................................................................... 8 4.4 RF INTERFACE ........................................................................................................................................................................ 8 4.5 SERIAL INTERFACES .................................................................................................................................................................. 9 4.5.1 UART........................................................................................................................................................................... 9 5. ELECTRICAL CHARACTERISTICS ...................................................................................................................................... 10 5.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................... 10 5.2 RECOMMENDED OPERATING CONDITIONS ................................................................................................................................. 10 5.3 AUDIO CODEC ELECTRICAL CHARACTERISTICS ............................................................................................................................. 10 6. MSL & ESD ..................................................................................................................................................................... 11 7. RECOMMENDED TEMPERATURE REFLOW PROFILE ........................................................................................................ 11 8. MECHANICAL DETAILS ................................................................................................................................................... 13 8.1 MECHANICAL DETAILS ............................................................................................................................................................ 13 9. HARDWARE INTEGRATION SUGGESTIONS ..................................................................................................................... 14 9.1 SOLDERING RECOMMENDATIONS ............................................................................................................................................. 14 9.2 LAYOUT GUIDELINES(INTERNAL ANTENNA)................................................................................................................................. 14 9.3 LAYOUT GUIDELINES(EXTERNAL ANTENNA) ................................................................................................................................ 15 9.3.1 Antenna Connection and Grounding Plane Design .................................................................................................. 15 10. PRODUCT PACKAGING INFORMATION ......................................................................................................................... 16 10.1 DEFAULT PACKING ............................................................................................................................................................... 16 10.2 PACKING BOX(OPTIONAL) ................................................................................................................................................... 17 11. APPLICATION SCHEMATIC ............................................................................................................................................ 18 Shenzhen Feasycom Technology Co.,Ltd www.feasycom.com

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True wireless stereo earbud solution High-end BT speaker Smart BT/WIFI music box BT docking stations and Soundbars BT boom box Other portable audio device IOT platform Module picture as below showing Figure 1: FSC-BT958 Picture FSC-BT958 Datasheet 1. INTRODUCTION Overview Application FSC-BT958 is a multimedia system-on-chip solution with Bluetooth 5.0 dual-mode and highly integrated, dedicated to music and audio applications. Integrating all necessary electronic components

(including baseband, Bluetooth transceiver, power management) into a single system-on-chip, it provides a best-in-class bill of materials, space requirements, and cost/function ratio for Bluetooth music and audio applications. By default, Feasycom standard firmware is built-in, and customized firmware is also available. FSC-BT958 is a suitable product for designers who want to add wireless functions to their products. Features Compliant with Bluetooth 5.0 dual mode specification High power output(10dBm) Class2 and Class3 transmission supported UART programming and data interface (baudrate Internal LPO support for low power mode can up to 921600bps) Postage stamp sized form factor A2DP v1.3/AVRCP v1.5/HFP v1.6 Echo Cancellation 24 bit audio processing HiFi Stereo Audio DAC:

120Db 2NR 110Db DNR Supports Rates From 8 kHz to 384 kHz HiFi Stereo Audio ADC:

100dB SNR Sample Rates From 8 kHz to 384 kHz RoHS compliant Shenzhen Feasycom Technology Co.,Ltd www.feasycom.com

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FSC-BT958 Datasheet 2. General Specification Table 1: General Specifications Categories Wireless Specification Features Bluetooth Version Frequency Implementation Bluetooth v5.0 2.402 - 2.480 GHz Transmit Power

+10 dBm (Maximum) Receive Sensitivity

-85 dBm@0.1%BER (Typical) Modulation GFSK, /4 DQPSK , 8DPSK Host Interface and Peripherals UART Interface TX, RX, CTS, RTS Default 115200,N,8,1 Baudrate support from 1200 to 921600 5, 6, 7, 8 data bit character GPIO 9(maximum configurable) lines Classic Bluetooth SPP (Serial Port Profile) - Up to 600 Kbps Bluetooth Low Energy GATT Client & Peripheral - Any Custom Services Classic Bluetooth Bluetooth Low Energy 1 Clients Support Supply Voltage Supply VBAT_IN: 3.4V ~ 4.5V Physical Dimensions 13mm(W) X 26.9mm(L) X 2.0H); Pad Pitch 1mm Operating Storage Lead Free Warranty

-20C to +80C

-30C to +90C Lead-free and RoHS compliant 10% ~ 90% non-condensing Human Body Model: Class-2 Machine Model: Class-B One Year MSL 3 Profiles Maximum Connections Environmental Miscellaneous Humidity MSL grade:

ESD grade:

3. HARDWARE SPECIFICATION 3.1 PIN Diagram Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet Figure 3: FSC-BT958 PIN Diagram(Top View) 3.2 PIN Definition Descriptions Table 2: Pin definition Pin Pin Name GND 1 2 3 NC NC 4,12 GPIO_03/I2S_CLK 5,10 GPIO_00/I2S_DI Type Pin Descriptions Power Ground Vss I/O I/O Programmable input/output line Alternative Function: I2S2 synchronous data clock Programmable input/output line Alternative Function: I2S2 synchronous data input 6,11 GPIO_02/I2S_DO I/O Programmable input/output line Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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27282930312120191817163536373839NCGPIO_03/I2S_CLKNCVCC_CHGNCNCNC33341514NCVREGENABLEDEBUG_TX/I2C_DATNCNCNCLED0LED1LED2GNDGPIO_02/I2S_DOGPIO_00/I2S_DIGPIO_01/I2S_WSNCEXT_ANT3225232422VBAT_INBT_TXBT_RXMIC_NMIC_PNCSPK_LPSPK_LNNCNCSPK_RNSPK_RP1312111098765432143444546474142405152495048NCGNDGNDGNDGPIO_03/I2S_CLKGPIO_10/BT_CTSGPIO_11/BT_RTS2726GPADC1GNDNCDEBUG_RX/I2C_CLKNCNCMIC_BIASGPIO_00/I2S_DIGPIO_02/I2S_DOGPIO_01/I2S_WSRESET Alternative Function: I2S2 synchronous data output Programmable input/output line Alternative Function: I2S2 word select Reset if low. Pull low for minimum 5 ms to cause a reset UART Data output UART Data input UART clear to send, active low Alternative Function: Programmable input/output line UART request to send, active low Alternative Function: Programmable input/output line LED driver. (RED LED) LED driver. (BLUE LED) LED driver. (GREEN LED) Analogue programmable input/output line DEBUG_RX/I2C_CLK 25 DEBUG_TX/I2C_DAT Vss Power Ground Debug_RX Alternative Function2: I2C_SCL Debug_TX Alternative Function2: I2C_SDA FSC-BT958 Datasheet 7,9 GPIO_01/I2S_WS RESET BT_TX BT_RX GPIO_10/BT_CTS 16 GPIO_11/BT_RTS 8 13 14 15 17 18 19 20 21 22 23 24 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 GPADC1 LED0 LED1 LED2 NC GND NC NC NC NC NC NC NC NC NC NC NC NC NC NC I/O I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VBAT_IN VREGENABLE Vss Power Ground Vdd Power supply voltage 3.4V~ 4.5V(Battery positive terminal) I Power enable

* Chip power on input, high level/ high pules(min 10ms) is active . VCC_CHG Vdd Battery charger input (5V) 43 MIC_P 44 MIC_N 45 MIC _BIAS 46 47 SPK_RN SPK_RP Line or Microphone input positive Line or Microphone input negative O Microphone bias Speaker output negative, right Speaker output positive, right I I O O Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet 48 49 50 51 52 SPK_LN SPK_LP GND EXT_ANT GND 4. PHYSICAL INTERFACE 4.1 Power Supply Speaker output negative, left Speaker output positive, left Power Ground Bluetooth 50 transmitter output /receiver input Power Ground O O Vss RF Vss The transient response of the regulator is important. If the power rails of the module are supplied from an external voltage source, the transient response of any regulator used should be 20s or less. It is essential that the power rail recovers quickly. 4.2 Audio Interfaces 4.2.1 Microphone Input & line IN Check the Application Schematic for the microphone input & line IN design. If need to use Microphone & Line IN simultaneously, please refer to the Analog Characteristics introduction. Check the Application Schematic for the microphone input & line IN design. Please refer to the Analog Characteristics introduction. 4.2.2 SPEAKER 4.3 Reset The module may be reset from several sources: Power-on Reset (POR), Low level on the nRESET Pin (nRST), Debug Reset, Watchdog time-out reset (WDT), Global soft reset. 4.4 RF Interface Fully integrated RF synthesizer without any external component TX output power of +10dBm High power output(10dBm) Class2 and Class3 transmission supported High performance in receiver sensitivity, -93dBm@GFSK, -95dBm@/4 DQPSK, -87dBm@8DPSK Supports GFSK,/4 DQPSK and 8DPSK modulation Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet 4.5 Serial Interfaces 4.5.1 UART FSC-BT958 provides one channels of Universal Asynchronous Receiver/Transmitters(UART)(Full-duplex asynchronous communications). The UART Controller performs a serial-to-parallel conversion on data received from the peripheral and a parallel-to-serial conversion on data transmitted from the CPU. Each UART Controller channel supports ten types of interrupts. This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. This module output is at 3.3V CMOS logic levels (tracks VCC). Level conversion must be added to interface with an RS-232 level compliant interface. Table 3: Possible UART Settings Parameter Baudrate Flow control Parity Number of stop bits Minimum Standard Maximum Possible Values 1200 baud (2%Error) 115200bps(1%Error) 921600bps(1%Error) Supports Automatic Flow Control (CTS and RTS lines) None, Odd or Even 1 /1.5/2 5/6/7/8 Bits per channel When connecting the module to a host, please make sure to follow . Figure 4: UART Connection Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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ModuleHostTXRXRXTXGNDGND FSC-BT958 Datasheet 5. ELECTRICAL CHARACTERISTICS 5.1 Absolute Maximum Ratings Table 4: Absolute Maximum Rating Parameter VBAT_IN Input Voltage VIL CMOS Low Level Input Voltage VIH CMOS High Level Input Voltage 5.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Parameter VBAT_IN Input Voltage TA - Operating Temperature TST - Storage Temperature IIN Input Current 5.3 Audio Codec Electrical Characteristics Table 6: Digital to Analogue Converter under 1.95V (b) Parameter Resolution Condition Output Sample Rete, Fsample Min 3.4 0 1.8 Type 3.8 Max 4.5 0.3*1.8 0.7*1.8 Unit V V V Min 3.4

-20

-30

-10 Type 3.8 25 25 Max 4.5

+80

+90

+10 Unit V C C mA fin=1kHz B/W=20Hz~20kHz A-Weighted 1Vrms Output fin=1kHz B/W=20Hz~20KHz 1Vrms Output Fsample Load Fsample Load 48kHz 48kHz 48kHz 8kHz 8kHz 8kHz 48kHz 48kHz 48kHz 200k 32 16 100k 32 16 100k 32 16 Digital Gain Resolution = 1dB Analogue Gain Resolution = 0.75dB

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-18 600-Ohm loading TMTPE 1kHz sine wave A-WT Noise Gating Min 8 Type Max 24 384 Unit Bits kHz 112 120 120

-100

-100

-100

-100

-100

-100 93

-95

-95

-95

-95

-95

-98 24 3 dB dB dB dB dB dB dB dB dB dB dB 1000 mV rms SNR THD+N Digital Gain Analogue Gain Output Voltage IMD Phase Pop Up Noise Noise Floor Freq. Response 0.02-20kHz 30mW output Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet Noise Floor Crosstalk Crosstalk Crosstalk Aduio PA on A-WT 100Hz,1Vrms Output 1KHz,1Vrms Output 10KHz,1Vrms Output A-Weight,32 DNR

(a) SNR is the ratio of output level with a 1-kHz full-scale input, to the output level playing an all-zero signal, measured A-weighted over a 20-Hz to 20-kHz bandwidth.

(b) The BES2300-L provides a digital noise gate function for each of the output signal paths. The noise gate ensures best noise performance when the signal path is idle. When the noise gate is enabled, and the applicable signal level is below the noise gate threshold, then the noise gate is activated, causing the signal path to be muted. Table 7: Codec - Analogue to Digital Converter under 1.95V Condition Parameter Resolution Max 24 Unit Bits Type Min Output Sample Rete, Fsample 8 384 kHz 100

-95 dB dB dB dB fin=1kHz B/W=20Hz~20kHz A-Weighted 0.7Vrms Input fin=1kHz B/W=20Hz~20KHz 1Vrms Output Fsample 48kHz Fsample 48kHz Digital Gain Resolution = 1dB Analogue Gain Resolution = 3dB

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-9 30 12 SNR THD+N Digital Gain Analogue Gain 6. MSL & ESD Table 8: MSL and ESD Parameter MSL grade:

ESD grade:

Value MSL 3 Human Body Model: Class-2 Machine Model: Class-B 7. RECOMMENDED TEMPERATURE REFLOW PROFILE Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, please check the below next table and follow instructions specified by IPC/JEDEC J-STD-033. Note: The shipping tray cannot be heated above 65C. If baking is required at the higher temperatures displayed in the below next table, the modules must be removed from the shipping tray. Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet 30C/60%RH. Table 9: Recommended baking times and temperatures 125C Baking Temp. 90C/ 5%RH Baking Temp. 40C/ 5%RH Baking Temp. MSL Saturated @

30C/85%

Floor Life Limit

+ 72 hours @

30C/60%

Saturated @

30C/85%

Floor Life Limit

+ 72 hours @

30C/60%

Saturated @

30C/85%

Floor Life Limit

+ 72 hours @

30C/60%

3 9 hours 7 hours 33 hours 23 hours 13 days 9 days Feasycom surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Feasycom surface mount modules conform to J-STD-020D1 standards for reflow temperatures. The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. Figure 5: Typical Lead-free Re-flow Pre-heat zone (A) This zone raises the temperature at a controlled rate, typically 0.5 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (C) (optional) In order to resolve the upright component issue, it is recommended to keep the temperature in 210 217 for about 20 to 30 second. Reflow Zone (D) The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint. Typical cooling rate should be 4 C. Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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210 217 250 A B C D 1 2 0 25 3 4 5 6 min E FSC-BT958 Datasheet 8. MECHANICAL DETAILS 8.1 Mechanical Details Dimension: 13mm(W) x 26.9mm(L) x 2.0mm(H) Tolerance: 0.1mm Module size: 13mm X 26.9mm Tolerance: 0.2mm Pad size: 1.6mmX0.6mm Tolerance: 0.2mm Pad pitch: 1.0mm Tolerance: 0.1mm Figure 6: FSC-BT958 footprint Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet 9. HARDWARE INTEGRATION SUGGESTIONS 9.1 Soldering Recommendations FSC-BT1006A is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Feasycom will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. 9.2 Layout Guidelines(Internal Antenna) It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated max 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB edges. The mother board should have no bare conductors or vias in this restricted area, because it is not covered by stop mask print. Also no copper (planes, traces or vias) are allowed in this area, because of mismatching the on-board antenna. Figure 7: FSC-BT1006A Restricted Area Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. Following list is aimed to avoid EMC problems caused by RF part of the module. Use good consideration to avoid problems arising from digital signals in the design. Ensure that signal lines have return paths as short as possible. For example if a signal goes to an inner layer through a via, always use ground vias around it. Locate them tightly and symmetrically around the signal vias. Routing of any sensitive signals should be done in the inner layers of the PCB. Sensitive traces should have a ground area above and under the line. If this is not possible, make sure that the return path is short by other means (for example using a ground line next to the signal line). Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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526.9Max.0.5201043.51318Max.0.51020Applic. PCBno bare copper(exept solder pads for module)no copper and components on any layerno components on any layerdo not place any conductive parts in this areaProvide solid ground plane(s) as large as possible around area FSC-BT958 Datasheet 9.3 Layout Guidelines(External Antenna) Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and RF-IN port to better match the impedance to minimize the return loss. As indicated in Figure below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this way that module digital part towards your digital section of the system PCB. Figure 8: Placement the Module on a System Board 9.3.1 Antenna Connection and Grounding Plane Design Figure 9: Leave 5mm Clearance Space from the Antenna General design recommendations are:

The length of the trace or connection line should be kept as short as possible. Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness. Routing the RF close to digital sections of the system board should be avoided. Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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AntennaRF_INDigital PartNon enmitting circuitsNon enmitting circuitsDigital & Analog CircuitsPCBAntennaRF & heat enmitting circuitsDigital PartRF_INDigital & Analog CircuitsRF & heat enmitting circuitsPCBAntennaMatchingNetwork5mmRF_IN FSC-BT958 Datasheet To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree routing. Figure 10: Recommended Trace Connects Antenna and the Module Routing of the RF-connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of this part of the trace cannot be controlled. Use as many vias as possible to connect the ground planes. 10. PRODUCT PACKAGING INFORMATION 10.1 Default Packing a, Tray vacuum b, Tray Dimension: 180mm * 195mm Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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AntennaAntennaAntennaPCBPCBPCBWrongBetterBest FSC-BT958 Datasheet Figure 11: Tray vacuum 10.2 Packing box(Optional)

* If require any other packing, must be confirmed with customer

* Package: 1000PCS Per Carton (Min Carton Package) Figure 12: Packing Box Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturers instruction manual. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This compliance to FCC radiation exposure limits for an uncontrolled environment, and minimum of 5mm separation The host product manufacturer would provide the above information to end users in their end-product manuals. The end product must carry a physical label or shall use e-labeling followed KDB784748D01 and KDB 784748 stating Contains Transmitter Module FCC ID: 2AMWOFSC-BT958. 2.9 Information on test modes and additional testing requirements For more information on testing, please contact the manufacturer. 2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity. FSC-BT958 Datasheet 11. APPLICATION SCHEMATIC 2.2 List of applicable FCC rules FCC Part 15.247 2.3 Specific operational use conditions 2.4 Limited module procedures not applicable 2.5 Trace antenna designs not applicable 2.6 RF exposure considerations between antenna and body. 2.7 Antennas PCB antenna; 2dBi; 2.402 GHz2.480GHz 2.8 Label and compliance information Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet FCC Statements

(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B

(15.107 and if applicable 15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in 15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the FCC ID of the RF Module, such as "Contains FCC ID: 2AMWOFSC-BT958

"This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

(1)this device may not cause harmful interference, and

(2)this device must accept any interference received, including interference that may cause undesired operation."

"Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment."

the Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device. Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label. 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements. Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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FSC-BT958 Datasheet NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help Shenzhen Feasycom Technology Co., Ltd www.feasycom.com

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Shenzhen Feasycom Technology Co., LTD Agent Authorization Company: Shenzhen Feasycom Technology Co., LTD Address: Rm 508, Building A, Fenghuang Zhigu, No.50, Tiezai Road, Xixiang, Baoan District, Shenzhen, 518102, China Product Name: Bluetooth module Model Number(s): FSC-BT958 Product Description: Bluetooth module We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature:

Date: 2022-01-18 Name:

Wan Zhifu Company: Shenzhen Feasycom Technology Co., LTD

Shenzhen Feasycom Technology Co., LTD Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2022-01-17 Subject; Request for Confidentiality FCC ID: 2AMWOFSC-BT958 To Whom It May Concern, Pursuant to the provisions of the Commissions rules Title 47 Sections 0.457 and 0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Lx} Schematic Diagram Block Diagram Parts List Lx} Operational Description Tune-up Procedure In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR 2.803 and the importation rules in Title 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s);

External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01.

\t is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely Wow ait Shenzhen Feasycom Technology Co., LTD Contact person: Wan Zhifu

Shenzhen Feasycom Technology Co., LTD RE FCC ID: 2AMWOFSC-BT958 To the certification reviewer:

We are hereby applying for full modular approval of the above-referenced FCC ID, based on compliance with all of the criteria as detailed below. Sincerely, Contact person: Wan Zhifu Part 15 Unlicensed Single Modular Transmitter Approval Justification per 15.212

(i)

(ii) Requirement per 15.212 radio elements of the modular their own RF The transmitter must have shielding. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided.

(iii) The modular transmitter must have its own power supply regulation. transmission

(iv) The modular transmitter must comply with the antenna and system requirements of 15.203, 15.204(b) and 15.204(c). The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during for compliance with Part 15 testing parameters.

(v)

(vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is label referring to the enclosed module. installed must also display a reference Shielding is provided by a metal cover over the circuitry. All modulation and data inputs are buffered by circuitry on the transmitter chip. Power supply regulation is provided by circuitry on the transmitter chip. The antenna is permanently attached. Testing was performed with the module extended outside of the host on a special extender board, as shown in the test setup photos. / Testing was performed in a stand-alone configuration as shown in the test setup photos. A sample of the host label is provided as an exhibit, showing the FCC identifier of the module. Shenzhen Feasycom Technology Co., LTD The module complies fully with the operating requirements of Part 15 section [] as demonstrated in the test report exhibit.

(vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. This module operates under Part 15 section

[15.247], compliance with RF Exposure please refer to MPE Report.