FCC ID: N7NAR7550 Wireless Module

Prroducct Tec chnic cal Sp pecific catio on A AirPri ime A AR75 50 4114188 0.4 rch 29, 2013 Ma Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note:

Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operators control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided as is. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Customer understands that Sierra Wireless is not providing cellular or GPS (including A-GPS) services. These services are provided by a third party and should be purchased directly by the Customer. 41124764188 Rev 0.41 March 20, 2013 2 Product Technical Specification SPECIFIC DISCLAIMERS OF LIABILITY: CUSTOMER RECOGNIZES AND ACKNOWLEDGES SIERRA WIRELESS IS NOT RESPONSIBLE FOR AND SHALL NOT BE HELD LIABLE FOR ANY DEFECT OR DEFICIENCY OF ANY KIND OF CELLULAR OR GPS (INCLUDING A-GPS) SERVICES. Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright 2013 Sierra Wireless. All rights reserved. Trademarks AirCard is a registered trademark of Sierra Wireless. Sierra Wireless, AirPrime, AirLink, AirVantage, Watcher and the Sierra Wireless logo are trademarks of Sierra Wireless.

, inSIM, WAVECOM, WISMO, Wireless Microprocessor, Wireless CPU, Open AT are filed or registered trademarks of Sierra Wireless S.A. in France and/or in other countries. Windows and Windows Vista are registered trademarks of Microsoft Corporation. Macintosh and Mac OS are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of the respective owners. Contact Information 1-604-232-1488 8:00 AM to 5:00 PM Pacific Time sales@sierrawireless.com Sales Desk:

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Sierra Wireless 13811 Wireless Way Richmond, BC Canada V6V 3A4 Technical Support: support@sierrawireless.com repairs@sierrawireless.com RMA Support:

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Fax: 1-604-231-1109 Web: www.sierrawireless.com Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases: www.sierrawireless.com 41124764188 Rev 0.41 March 20, 2013 3 Product Technical Specification Document History Version Date Updates 0.1 March 29, 2013 Creation based on document 4112476: AirePrime AR755x Series Product Technical Specification Rev0.4. 41124764188 Rev 0.41 March 20, 2013 4 Contents 4.1. 3.3. 1.1. 3.2.1. 3.1. 3.2. 2.1. 2.2. 2.3. 1. INTRODUCTION ................................................................................................ 11 General Features ............................................................................................................ 11 2. FUNCTIONAL SPECIFICATIONS ...................................................................... 12 Modes of Operation ......................................................................................................... 12 Communications Functions ............................................................................................. 12 Block Diagrams ............................................................................................................... 13 3. HARDWARE SPECIFICATIONS ........................................................................ 14 Environmental Specifications .......................................................................................... 14 Electrical Specifications ................................................................................................... 14 Absolute Maximum and ESD Ratings ...................................................................... 14 Mechanical Specifications ............................................................................................... 15 Physical Dimensions and Connection Interface ....................................................... 15 3.3.1. 3.3.2. Mechanical Drawing ................................................................................................. 16 Footprint ................................................................................................................... 17 3.3.3. 3.3.4. Thermal Consideration ............................................................................................. 18 4. RF SPECIFICATION .......................................................................................... 19 LTE RF Interface ............................................................................................................. 19 LTE Max TX Output Power ...................................................................................... 19 LTE RX Sensitivity ................................................................................................... 20 CDMA RF Interface ......................................................................................................... 20 CDMA Max TX Output Power .................................................................................. 20 CDMA RX Sensitivity ............................................................................................... 21 WCDMA RF Interface ...................................................................................................... 21 4.3.1. WCDMA Max TX Output Power ............................................................................... 21 4.3.2. WCDMA RX Sensitivity ............................................................................................ 21 WWAN Antenna Interface ............................................................................................... 22 4.4.1. WWAN Antenna Recommendations ........................................................................ 22 Primary Antenna Diagnostics .......................................................................................... 23 RX2 Antenna Diagnostics ............................................................................................... 23 5. GNSS SPECIFICATION ..................................................................................... 25 GNSS .............................................................................................................................. 25 GNSS Antenna Interface ................................................................................................. 25 GNSS Antenna Recommendations ......................................................................... 26 GNSS Antenna Diagnostics ............................................................................................ 26 Current Consumption ...................................................................................................... 29 Digital IO Characteristics ................................................................................................. 29 Internal Device Frequencies ............................................................................................ 30 5.3. 5.4. 5.5. 5.6. 4.1.1. 4.1.2. 4.2.1. 4.2.2. 5.1. 5.2. 4.5. 4.6. 5.2.1. 4.2. 4.3. 4.4. 4112476 Rev 0.4 March 20, 2013 5 Product Technical Specification 6.8. 6.1. 6.8.1. 6.7.1. 6.1.1. 6.2. 6.3. 6.3.1. 6.3.3. 6.3.4. 6.4. 6.5. 6.6. 6.7. 6.9. 6.10. 6.11. 6.12. 6.13. 6.14. 6.15. 6. BASEBAND SPECIFICATION ........................................................................... 32 Power Supply .................................................................................................................. 32 Under-Voltage Lockout (UVLO) ............................................................................... 32 VCOIN ............................................................................................................................. 33 ON/OFF Control .............................................................................................................. 34 ON/OFF Timing ........................................................................................................ 34 Software-Initiated Power Down ................................................................................ 36 Deep Sleep............................................................................................................... 36 6.3.4.1. Sequence to Enter Deep Sleep Mode ........................................................................... 37 USB ................................................................................................................................. 37 UART ............................................................................................................................... 38 Ring Indicator .................................................................................................................. 38 UIM Interface ................................................................................................................... 39 Internal UIM .............................................................................................................. 39 General Purpose IO ........................................................................................................ 40 AT Port Switch ......................................................................................................... 40 Secure Digital IO ............................................................................................................. 40 I2C ................................................................................................................................... 41 Voltage Reference ........................................................................................................... 41 RESET ............................................................................................................................. 41 ADC ................................................................................................................................. 42 LED .................................................................................................................................. 43 Audio ............................................................................................................................... 43 6.15.1. Analog Audio ............................................................................................................ 43 6.15.2. Digital Audio ............................................................................................................. 44 6.15.2.1. PCM ............................................................................................................................ 44 6.15.2.2. I2S .............................................................................................................................. 47 SPI Bus ............................................................................................................................ 49 6.16.1. Characteristics ......................................................................................................... 49 6.16.2. SPI Configuration ..................................................................................................... 49 6.16.3. SPI Waveforms ........................................................................................................ 49 6.16.4. SPI Pin Description .................................................................................................. 50 6.16.5. Application ................................................................................................................ 50 HSIC Bus ......................................................................................................................... 51 6.17.1. HSIC Pin Description ............................................................................................... 51 6.17.2. HSIC Waveforms ..................................................................................................... 51 6.17.3. Application ................................................................................................................ 52 Temperature Monitoring .................................................................................................. 53 7. ROUTING CONSTRAINTS AND RECOMMENDATIONS ................................. 54 RF Routing Recommendations ....................................................................................... 54 Power and Ground Recommendations ........................................................................... 56 Antenna Recommendations ............................................................................................ 56 Interface Circuit Recommendations ................................................................................ 57 7.1. 7.2. 7.3. 7.4. 6.16. 6.17. 6.18. 41124764188 Rev 0.41 March 20, 2013 6 Product Technical Specification 8.1. 8.2. 8. REGULATORY INFORMATION ......................................................................... 58 Important Notice .............................................................................................................. 58 Important Compliance Information for USA OEM Integrators ......................................... 58 9. REFERENCES ................................................................................................... 60 10.ABBREVIATIONS .............................................................................................. 61 41124764188 Rev 0.41 March 20, 2013 7 List of Figures AirPrime AR7550 Block Diagram .................................................................................... 13 Figure 1. AR55x Assembly Drawing ............................................................................................... 16 Figure 2. AirPrime AR7550 Mechanical Dimensions Drawing ....................................................... 16 Figure 3. AirPrime AR7550 Footprint ............................................................................................. 17 Figure 4. AirPrime AR7550 Recommended Application Land Pattern ........................................... 17 Figure 5. AirPrime AR7550 Heatsink Contact Area ....................................................................... 18 Figure 6. VGNSS_ANT vs. ADC Readings Relationship ............................................................... 28 Figure 7. GNSS Power Supply and Antenna Diagnostics Block Diagram ..................................... 28 Figure 8. Under-Voltage Lockout (UVLO) Diagram ........................................................................ 32 Figure 9. Figure 10. Recommended ON/OFF Control ..................................................................................... 34 Figure 11. Alternate ON/OFF Control ............................................................................................... 35 Figure 12. Power Mode Diagram ...................................................................................................... 36 Figure 13. Recommended UIM Holder Implementation ................................................................... 39 Illustration of Reset Timing When RESIN_N < Trdel ...................................................... 42 Figure 14. Figure 15. Illustration of Reset Timing When RESIN_N Held Low > Trdet+Trdel ............................ 42 Figure 16. LED Reference Circuit ..................................................................................................... 43 Figure 17. Audio Block Diagram ....................................................................................................... 43 Figure 18. PCM_FS Timing Diagram (2048 kHz Clock) ................................................................... 45 Figure 19. PCM Codec to AR Device Timing Diagram (Primary PCM) ........................................... 46 Figure 20. AR Device to PCM Codec Timing Diagram (Primary PCM) ........................................... 46 Figure 21. PCM_FS Timing Diagram (128 kHz Clock) ..................................................................... 47 Figure 22. PCM Codec to AR Device Timing Diagram (Auxiliary PCM) .......................................... 47 Figure 23. AR Device to PCM Codec Timing Diagram (Auxiliary PCM) .......................................... 47 Figure 24. I2S Signals Timing Diagram ............................................................................................ 48 Figure 25. 4-Wire Configuration SPI Transfer .................................................................................. 49 Figure 26. Example of 4-wire SPI Bus Application ........................................................................... 50 Figure 27. HSIC Signal Sample Waveforms .................................................................................... 51 Figure 28. Example of HSIC Bus Application ................................................................................... 52 Figure 29. Temperature Monitoring State Machine .......................................................................... 53 Figure 30. AppCAD Screenshot for Microstrip Design Power Mode Diagram ................................. 54 Figure 31. RF Routing Examples ..................................................................................................... 55 Figure 32. Coplanar Clearance Example ......................................................................................... 55 Figure 33. Antenna Microstrip Routing Example .............................................................................. 56 Figure 34. AirPrime AR7550 Input Reference Circuit ....................................................................... 57 Figure 35. AirPrime AR7550 Output Reference Circuit .................................................................... 57 4112476 Rev 0.4 March 20, 2013 8 List of Tables AirPrime AR7550 Embedded Modules ........................................................................... 11 Table 1. AirPrime AR7550 Modes of Operation ............................................................................ 12 Table 2. Communications Functions ............................................................................................. 12 Table 3. AirPrime AR7550 Environmental Specifications ............................................................. 14 Table 4. AirPrime AR7550 Absolute Maximum Ratings ................................................................ 14 Table 5. AirPrime AR7550 Embedded Module Dimensions ......................................................... 15 Table 6. AirPrime AR7550 Maximum LTE Transmitter Output Power .......................................... 19 Table 7. AirPrime AR7550 Minimum LTE Receiver Sensitivity ..................................................... 20 Table 8. AirPrime AR7550 Maximum CDMA Transmitter Output Power ...................................... 21 Table 9. AirPrime AR7550 Minimum CDMA Receiver Sensitivity ................................................. 21 Table 10. AirPrime AR7550 Maximum WCDMA Transmitter Output Power .................................. 21 Table 11. AirPrime AR7550 Minimum WCDMA Receiver Sensitivity ............................................. 21 Table 12. Table 13. AirPrime AR7550 WWAN Antenna Characteristics ........................................................ 22 Table 14. WWAN Antenna Interface Pads ...................................................................................... 22 Table 15. AirPrime AR7550 WWAN Antenna Recommendations ................................................. 22 Primary Antenna ADC Characteristics ............................................................................ 23 Table 16. Primary Antenna Diagnostics Ranges ............................................................................ 23 Table 17. Table 18. RX2 Antenna ADC Characteristics.................................................................................. 23 Table 19. RX2 Antenna Diagnostics Ranges .................................................................................. 24 Table 20. GNSS Characteristics ..................................................................................................... 25 Table 21. GNSS Antenna Interface Characteristics ........................................................................ 25 Table 22. GNSS Antenna Interface Pads ........................................................................................ 26 Table 23. GNSS Recommended Antenna Characteristics ............................................................. 26 Table 24. GNSS Antenna Diagnostics Ranges ............................................................................... 26 VGNSS_ANT Current Draw ............................................................................................ 27 Table 25. Table 26. AirPrime AR7550 Current Consumption Values ............................................................. 29 Digital IO Characteristics ................................................................................................. 29 Table 27. Internal Device Frequencies ............................................................................................ 30 Table 28. Table 29. Power Supply Requirements ........................................................................................... 32 Power Supply Pads ......................................................................................................... 32 Table 30. UVLO Thresholds ............................................................................................................ 33 Table 31. Table 32. VCOIN Pad ...................................................................................................................... 33 VCOIN Interface Specification ......................................................................................... 33 Table 33. Table 34. VCOIN Charging Specifications ...................................................................................... 33 Table 35. ON/OFF Control Pads ..................................................................................................... 34 Table 36. ON/OFF Internal Pull-Up ................................................................................................. 34 Table 37. Power-ON Sequence Symbol Definitions ....................................................................... 35 4112476 Rev 0.4 March 20, 2013 9 Product Technical Specification Period of Wake Intervals ................................................................................................. 36 Table 38. Deep Sleep Function Availability ..................................................................................... 36 Table 39. USB Pad Details .............................................................................................................. 37 Table 40. USB Characteristics ........................................................................................................ 38 Table 41. UART Pads ...................................................................................................................... 38 Table 42. Ring Indicator Pad ........................................................................................................... 38 Table 43. Table 44. UIM Pads ......................................................................................................................... 39 Table 45. GPIO Interface Pads ....................................................................................................... 40 Table 46. AT Port Switch States ..................................................................................................... 40 SDIO Interface Pads ....................................................................................................... 40 Table 47. I2C Interface Pads ........................................................................................................... 41 Table 48. Table 49. Voltage Reference Pad ................................................................................................... 41 Voltage Reference Characteristics .................................................................................. 41 Table 50. Reset Interface Pads ....................................................................................................... 41 Table 51. Table 52. Reset Timing ................................................................................................................... 42 ADC Interface Pads ......................................................................................................... 42 Table 53. ADC Interface Characteristics ......................................................................................... 43 Table 54. Table 55. LED Interface Pad ........................................................................................................... 43 Analog Audio Interface Pads ........................................................................................... 43 Table 56. Analog Audio Interface Characteristics ........................................................................... 44 Table 57. Table 58. Digital Audio Interface Pads ............................................................................................ 44 PCM Interface Configurations ......................................................................................... 44 Table 59. Primary PCM Timing ....................................................................................................... 45 Table 60. Table 61. Auxiliary PCM Timing ...................................................................................................... 46 SPI Configuration ............................................................................................................ 49 Table 62. Table 63. SPI Master Timing Characteristics .................................................................................. 50 SPI Pin Description ......................................................................................................... 50 Table 64. HSIC Pin Description ....................................................................................................... 51 Table 65. Table 66. Temperature Monitoring States ....................................................................................... 53 Reference Specifications ................................................................................................. 60 Table 67. Table 68. Abbreviations ................................................................................................................... 61 41124764188 Rev 0.41 March 20, 2013 10 1. Introduction 1.1. General Features The AirPrime AR7550 embedded modules are designed for the automotive industry. They support LTE, CDMA, WCDMA air interface standards and shares hardware and firmware interfaces with the AirPrime AR5550 and AR855x. They also have Global Navigation Satellite System (GNSS) capabilities including GPS and GLONASS. The AirPrime AR7550 embedded modules are based on the Qualcomm MDM9615 wireless chipset and support the following bands. Table 1. AirPrime AR7550 Embedded Modules Product Description AirPrime AR7550 LTE/CDMA2000/ /WCDMA embedded module LTE B7 for AirPrime AR7550 is optional.

Band Support LTE: B4, B7*, B13 CDMA: BC0, BC1 WCDMA: B2, B5 4112476 Rev 0.4 March 20, 2013 11 2. Functional Specifications This chapter highlights the features of the AirPrime AR7550 series of embedded modules. 2.1. Modes of Operation The AirPrime AR7550 supports 2G/3G/4G operations and also supports GNSS operation. For complete details, refer to the table below. Table 2. AirPrime AR7550 Modes of Operation Mode Band Frequency (MHz) Downlink (DL) UE Receive Uplink (UL) UE Transmit Band 4 Band 7 Band 13 Band Class 0 Band Class 1 II (1900/PCS) V (850/CELL) GPS L1 GLONASS L1 FDMA 1597.5 1605.8 2110 MHz to 2155 MHz 2620MHz to 2690 MHz 746 MHz to 756 MHz 869 MHz to 894 MHz 1930 MHz to 1990 MHz 1930 MHz to 1990 MHz 869 MHz to 894 MHz 1574.42 1576.42 1710 MHz to 1755 MHz 2500 MHz to 2570 MHz 777 MHz to 787 MHz 824 MHz to 849 MHz 1850 MHz to 1910 MHz 1850 MHz to 1910 MHz 824 MHz to 849 MHz

Supported bands vary depending on product. Refer to Table 1 AirPrime AR7550 Embedded Modules for the list of bands supported by each module variant. LTE CDMA2000 1xRTT & 1xEVDO WCDMA/HSPA GNSS Note:

2.2. Communications Functions The AirPrime AR7550 provides the following communications functions via the LTE, CDMAand UMTS networks. Table 3. Communications Functions Communications Function LTE CDMA WCDMA GSM/GPRS/EDGE Voice Circuit Switched VoLTE Packet Data Short Message Service (SMS) OTA DTMF OTAPA OTASP EVRC, EVRC-B AMR, AMR-WB FR, EFR, HR 4112476 Rev 0.4 March 20, 2013 12 Product Technical Specification 2.3. Block Diagrams Figure 1. AirPrime AR7550 Block Diagram 41124764188 Rev 0.41 March 20, 2013 13 3. Hardware Specifications 3.1. Environmental Specifications The environmental specification for both operating and storage of the AirPrime AR7550 embedded modules are defined in the table below. Table 4. AirPrime AR7550 Environmental Specifications Parameter Temperature Range Operating Class Ambient Operating Temperature Ambient Storage Temperature Ambient Humidity

-30C to +75C

-40C to -30C

+75C to +85C

-40C to +90C 95% or less Class A Class B

Class A is defined as the operating temperature range that the device:

Shall exhibit normal function during and after environmental exposure. Shall meet the minimum requirements of 3GPP, 3GPP2 or appropriate wireless standards. Class B is defined as the operating temperature range that the device:

Shall remain fully functional during and after environmental exposure Shall exhibit the ability to establish a voice, SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance. Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed. 3.2. Electrical Specifications This section provides details for some of the key electrical specifications of the AirPrime AR7550 embedded modules. 3.2.1. Absolute Maximum and ESD Ratings This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the AirPrime AR7550 embedded modules. Warning: If these parameters are exceeded, even momentarily, damage may occur to the device. Table 5. AirPrime AR7550 Absolute Maximum Ratings Parameter VBATT VIN IIN Power Supply Input Voltage on any digital input or output pin Latch-up current Min

-100 Max Units V 5.0 VCC_1v8+0.5 V 100 mA 4112476 Rev 0.4 March 20, 2013 14 Product Technical Specification Parameter Min Max Units Maximum Voltage applied to antenna interface pins VANT Primary Antenna RX2 Antenna GNSS Antenna ESD Ratings ESD1 Primary, RX2 and GNSS antenna pads - Contact All other signal pads - Contact 1 The ESD Simulator configured with 330pF, 1000.

36 36 36 8 1.5 V V V kV kV Caution:

The AirPrime AR7550 embedded modules are sensitive to Electrostatic Discharge. ESD countermeasures and handling methods must be used when handling the AirPrime AR7550 devices. 3.3. Mechanical Specifications 3.3.1. Physical Dimensions and Connection Interface The AirPrime AR7550 embedded modules are a Land Grid Array (LGA) form factor device. The device does not have a System or RF connectors. All electrical and mechanical connections are made via the 303 pad LGA on the underside of the PCB. Table 6. AirPrime AR7550 Embedded Module Dimensions Parameter Overall Dimension Overall Module Height PCB Thickness Flatness Specification Weight Nominal Max Units 32 x 37 3.64 1.6

tbd 32.25 x 37.25 3.89 1.76 0.1

mm mm mm mm g Note:

The dimensions in Error! Reference source not found. are accurate as of the release date of this document. 41124764188 Rev 0.41 March 20, 2013 15 Product Technical Specification 3.3.2. Mechanical Drawing Figure 2. AR55x Assembly Drawing Figure 3. AirPrime AR7550 Mechanical Dimensions Drawing Note:

The dimensions in Error! Reference source not found. are preliminary and subject to change. 41124764188 Rev 0.41 March 20, 2013 16 Product Technical Specification 3.3.3. Footprint The AirPrime AR7550 device LGA footprint is a 303 pad array of 0.9mm, 1.45mm, and 1.90mm pads. The following drawing illustrates the device footprint. The application footprint is recommended to mirror the device footprint as illustrated in the following drawing (subject to change). Figure 4. AirPrime AR7550 Footprint Figure 5. AirPrime AR7550 Recommended Application Land Pattern 41124764188 Rev 0.41 March 20, 2013 17 Product Technical Specification 3.3.4. Thermal Consideration The AirPrime AR7550 device is designed to work over an extended temperature range. In order to do this efficiently a method of sinking heat from the product is recommended. Refer to application notes (TBD) for details. Figure 6. AirPrime AR7550 Heatsink Contact Area 41124764188 Rev 0.41 March 20, 2013 18 4. RF Specification This section presents the WWAN RF interface of the AirPrime AR7550 series of embedded modules. The specifications for the LTE, CDMA and WCDMA interfaces are defined. 4.1. LTE RF Interface This section presents the LTE RF Specification for the AirPrime AR7550. 4.1.1. LTE Max TX Output Power The Maximum Transmitter Output Power of the AirPrime AR7550 embedded modules are specified in the following table. Table 7. AirPrime AR7550 Maximum LTE Transmitter Output Power Nomi nal Max TX Outp ut Powe r Tolera nce

+23 dB

+1/2 dB Band Frequency Band Band 4 4112476 Rev 0.4 March 20, 2013 19 Product Technical Specification Band Frequency Band Tolera nce Nomi nal Max TX Outp ut Powe r Band 13 776 MHz to 787 MHz 4.1.2. LTE RX Sensitivity The Minimum Receiver Sensitivity of the AirPrime AR7550 embedded modules are specified in the following table. Table 8. AirPrime AR7550 Minimum LTE Receiver Sensitivity Band Frequency Band Minimum RX Downlink Criteria Band 4 Band 7 Band 13 1710 MHz to 1755 MHz 2500 MHz to 2570 MHz 746 MHz to 757 MHz tbd tbd tbd tbd tbd tbd 4.2. CDMA RF Interface This section presents the CDMA RF Specification for the AirPrime AR7550 embedded modules. AirPrime AR7550 devices are designed to be compliant with 3GPP2 C.S0011 Rev A and 3GPP2 C.S0033 Rev A v1.0. Parameters specified differently for the reference standard are identified below. 4.2.1. CDMA Max TX Output Power The Maximum Transmitter Output Power of the AirPrime AR7550 embedded module is specified in the following table. 41124764188 Rev 0.41 March 20, 2013 20 Product Technical Specification Table 9. AirPrime AR7550 Maximum CDMA Transmitter Output Power Band Class Frequency Band Nominal Max TX Output Power Tolerance BC0 BC1 800 MHz 1900 MHz

+24 dBm

+1.5/-1 dB (Class A)

+1.5/-2 dB (Class B) 4.2.2. CDMA RX Sensitivity The Minimum Receiver Sensitivity of the AirPrime AR7550 embedded module is specified in the following table. Table 10. AirPrime AR7550 Minimum CDMA Receiver Sensitivity Band Class Frequency Band Minimum RX downlink Criteria BC0 BC1 800 MHz 1900 MHz

-106 dBm (Class A)

-104 dBm (Class B) Less than 0.5% FER 4.3. WCDMA RF Interface This section presents the WCDMA RF Specification for the AirPrime AirPrime AR7550 embedded modules. 4.3.1. WCDMA Max TX Output Power The Maximum Transmitter Output Power of the AirPrime AR7550 embedded module are specified in the following table. Table 11. AirPrime AR7550 Maximum WCDMA Transmitter Output Power Band Frequency Band Nominal Max TX Output Power Tolerance II (1900/PCS) V (850/CELL) 1850 MHz to 1910 MHz 824 MHz to 849 MHz

+23.5 dBm

+1.5/-1 dB (Class A)

+1.5/-2 dB (Class B) 4.3.2. WCDMA RX Sensitivity The Minimum Receiver Sensitivity of the AirPrime AR7550A embedded module are specified in the following table. Table 12. AirPrime AR7550 Minimum WCDMA Receiver Sensitivity Band Frequency Band Minimum RX Downlink Criteria II (1900/PCS) 1930 MHz to 1990 MHz V (850/CELL) 869 MHz to 894 MHz

-106 dBm (Class A)

-105 dBm (Class B)

-107 dBm (Class A)

-106 dBm (Class B) BER < 0.001 41124764188 Rev 0.41 March 20, 2013 21 Product Technical Specification 4.4. WWAN Antenna Interface The specification for the WWAN Antenna Interface of the AirPrime AR7550 embedded modules are defined in the table below. Table 13. AirPrime AR7550 WWAN Antenna Characteristics Characteristics CDMA BC0, WCDMA B5 CDMA BC1, WCDMA B2 Frequency (MHz) Impedance VSWR max Maximum Voltage TX RX RF RX TX 1850-1910 1930-1990 824-849 869-894 50 2:1 2:1 Primary Antenna 36 Volts RX2 Antenna 36 Volts (LTE MIMO: tbd) LTE B4 LTE B13 1710 1755 2110 2155 777 787 746 756 Note:

RX2 Antenna port is RX only, RX parameters in the above tables are also applicable. Table 14. WWAN Antenna Interface Pads Pad BA11 BA12 BA13 BA7 BA8 BA9 Name GND PRIMARY_ANT GND GND DIVERSITY_ANT GND Direction Input/Output Input Function Primary Antenna Ground Primary Antenna Interface Primary Antenna Ground Diversity Antenna Ground Diversity Antenna Interface Diversity Antenna Ground 4.4.1. WWAN Antenna Recommendations The table below defines the key characteristics to consider for antenna selection. Table 15. AirPrime AR7550 WWAN Antenna Recommendations Characteristics CDMA BC0, WCDMA B5 CDMA BC1, WCDMA B2 Frequency (MHz) Impedance VSWR max Polarization Typical radiated gain TX RX RF DC RX TX 1850-1910 1930-1990 824-849 869-894 50 10 k 1k 1.5: 1 1.5: 1 Linear, vertical 0 dBi in one direction at least LTE B4 LTE B13 1710 1755 2110 2155 777 787 746 756 41124764188 Rev 0.41 March 20, 2013 22 Product Technical Specification 4.5. Primary Antenna Diagnostics The primary antenna diagnostic feature allows the AirPrime AR7550 embedded module to determine if the primary antenna connected to the module is: open, shorted or normal. The antenna connected to this interface needs to have a DC resistance to ground of 10 k 1k embedded inside. The ARx55x FW accepts two limits which are used to evaluate the status of the antenna, representing the short and open thresholds. Refer to [7] for the syntax of AT+ANTLIMT. Table 16. Primary Antenna ADC Characteristics ADC Voltage Range Resolution ADC Values Voltage/ADC step Min 0

0 Nom 0.9

~0.0011 Max 1.8 15 16383 Units Volts Bit Volts 1 Assumes 10k Nominal DC resistance in the attached antenna and internal to AirPrime AR7550 device The following example illustrates the Antenna states and resistance values for a typical limit setting. AT+ANTLIMT=1,839,1088 Table 17. Primary Antenna Diagnostics Ranges Antenna State Min ADC Max ADC Antenna Resistance Range Short Normal Open Note:

0 841 1088 839 1086 1900

~ 7 k 7 k < x < 13 k 13 k Highlighted numbers in the table above are programmed as shortLim and openLim using the

+ANTLIMT command. 4.6. RX2 Antenna Diagnostics The RX2 antenna diagnostic feature allows the AirPrime AR75500 to determine if the RX2 antenna connected to the module is: open, shorted or normal. The antenna connected to this interface needs to have a DC resistance to ground of 10 k 1k embedded inside. The AirPrime AR7550 FW accepts two limits which are used to evaluate the status of the antenna, representing the short and open thresholds. Refer to [7] for the syntax of AT+ANTLIMT. Table 18. RX2 Antenna ADC Characteristics ADC Voltage Range Resolution ADC Values Voltage/ADC step Min 0

0 Nom 0.9

~0.0011 Max 1.8 15 16383 Units Volts Bit Volts 1 Assumes 10k Nominal DC resistance in the attached antenna and internal to AirPrime AR7550 device 41124764188 Rev 0.41 March 20, 2013 23 Product Technical Specification The following example illustrates the Antenna states and resistance values for a typical limit setting. AT+ANTLIMT=2,839,1088 Table 19. RX2 Antenna Diagnostics Ranges Antenna State Min ADC Max ADC Antenna Resistance Range 0 841 1088 839 1086 1900

~ 7 k 7 k < x < 13 k 13 k Highlighted numbers in the table above are programmed as shortLim and openLim using the

+ANTLIMT command. Short Normal Open Note:

41124764188 Rev 0.41 March 20, 2013 24 5. GNSS Specification The AirPrime AR7550 embedded module includes optional Global Navigation Satellite System

(GNSS) capabilities via the Qualcomm gpsOne Gen8 Engine, capable of operation in assisted and stand-alone GPS modes as well as GPS+GLONASS mode. 5.1. GNSS The GNSS implementation supports GPS L1 operation and GLONASS L1 FDMA operation. Table 20. GNSS Characteristics Parameter Sensitivity Standalone or MS Based Tracking Sensitivity Cold Start Sensitivity MS Assisted Synchronous A-GNSS Acquisition Sensitivity Accuracy in Open Sky (1 Hz tracking) Total number of SV available Support for Predicted Orbits Predicted Orbit CEP-50 Accuracy Standalone Time To First Fix (TTFF) Number of channels GNSS Message Protocols Super Hot Warm Cold Value tbd tbd tbd

<2m CEP-50

~30 SVs Yes 5 m 1 s 29 s 32 s tbd NMEA Note:

Acquisition/Tracking Sensitivity performance figures assume open sky w/ active patch GNSS antenna and a 2.5 dB Noise Figure. 5.2. GNSS Antenna Interface The specification for GNSS Antenna Interface is defined in the table below. The AirPrime AR7550 provides biasing for an active antenna as well as onboard circuitry for diagnostics of this antenna interface. Table 21. GNSS Antenna Interface Characteristics Characteristics GNSS Frequency GPS L1 (Wideband) Glonass L1 FDMA RF Impedance VSWR max LNA Bias Voltage LNA Current Consumption Maximum Voltage applied to antenna RX 1575.42 20 MHz 1597.5 1605.8 MHz 50 2:1 4.4 4.9V, 5.25V (No Load) 50 mA Max 36 Volts 4112476 Rev 0.4 March 20, 2013 25 Product Technical Specification Minimum isolation between the GNSS and WWAN Antenna must be 10 dB for the AirPrime AR7550. Table 22. GNSS Antenna Interface Pads Pad BA4 BA5 BA6 Name GND GNSS_ANT GND Direction Function Input GNSS Antenna Ground GNSS Antenna Interface GNSS Antenna Ground 5.2.1. GNSS Antenna Recommendations The table below defines the key characteristics to consider for antenna selection. Table 23. GNSS Recommended Antenna Characteristics Characteristics Frequency GPS L1 (Wideband) Glonass L1 FDMA RX RF Impedance VSWR max LNA Bias Voltage LNA Noise Figure LNA Current Consumption Antenna System Gain (Antenna + LNA - Cable) Polarization GNSS 1575.42 20 MHz 1597.5 1605.8 MHz 50 1.5: 1 4.4 4.9V 2.0 dB Max 50 mA Max 20 24 dB Right Hand Circular Polarization 5.3. GNSS Antenna Diagnostics The GNSS Antenna Diagnostic feature measures the current drawn by an active GNSS antenna to determine the state of this antenna interface. Based on the current draw an assessment of open, short, normal or over-current is made. If an over-current is detected, the bias for the active antenna is removed to eliminate the fault for drawing excess current which could potentially damage the antenna. The limits between open/normal and normal/short can be set by the application through an AT Command. ADC Value GNSS Antenna State

Open openLim

Normal shortLim

Short The Over Current limit is set by hardware and cannot be altered. Table 24. GNSS Antenna Diagnostics Ranges Control State HW Over Current Min 78 Max 100 Units mA The GNSS antenna supply is powered from VBATT through a boost regulator. 41124764188 Rev 0.41 March 20, 2013 26 Product Technical Specification The following table identifies some key VGNSS_ANT current draw values and the associated ADC values. Table 25. VGNSS_ANT Current Draw I (mA) Nominal 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 337 612 936 1242 1558 1877 2194 2494 2821 3188 3444 3747 4065 4292 4319 The graph below illustrates the relationship between current drawn on VGNSS_ANT vs the ADC readings used to monitor the GNSS Antenna status. 41124764188 Rev 0.41 March 20, 2013 27 Product Technical Specification Figure 7. VGNSS_ANT vs. ADC Readings Relationship PMIC GNSS_ANT_ADC 10K Vout 200V/V Converter MPP_02 0~4.35V 150K S+

S LGA VBATT BOOSTREG VIN VOUT 5V 330m FB BOOST_CTRL PM8018 GPIO_59 GPIO_09 GNSSPWR_EN ILIM_OC_N MDM9X15 GPIO_69 ILIM_EN ILim VIN VOUT VGNSS 5V FLAGB ON CurrentLimit=75mA Figure 8. GNSS Power Supply and Antenna Diagnostics Block Diagram 41124764188 Rev 0.41 March 20, 2013 28 Product Technical Specification 5.4. Current Consumption The table below summarizes some key current consumption values for various modes of the AirPrime AR7550 devices. Table 26. AirPrime AR7550 Current Consumption Values Mode Parameter Typical Max Units On Call CDMA On Call WCDMA On Call LTE Maximum TX Output 1xRTT/1xEVDO

+0dBm TX Output 1xRTT

+0dBm TX Output 1xEVDO Maximum TX Output WCDMA/HSPA

+0dBm TX Output WCDMA

+0dBm TX Output HSPA Maximum TX Output

+0dBm TX Output Idle CDMA Registered USB Enumerated USB Not Enumerated Searching for network CDMA Idle WCDMA Registered USB Enumerated USB Not Enumerated Searching for network WCDMA Idle LTE Registered USB Enumerated USB Not Enumerated Sleep Mode Off GNSS Searching for network LTE Average current, QPCH, SCI=2 Average current, WCDMA, DRX=8 Average current, LTE Power OFF Current Acquisition (Airplane mode, cold start) Tracking (Registered) Powering an Active Antenna from VGNSS_ANT

tbd tbd

tbd tbd

tbd tbd tbd tbd tbd tbd tbd tbd tbd tbd

tbd tbd tbd tbd

tbd

tbd

tbd tbd tbd tbd tbd mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA A mA mA mA 1 This is the additional current draw on VBATT for 10mA consumption by Active LNA from VGNSS_ANT. Higher current consumption by the antenna will result in higher consumption on VBATT. 5.5. Digital IO Characteristics The Digital IO characteristics are defined in the table below. These apply to GPIOs, UART, LED, SDIO and PCM/I2S. Table 27. Digital IO Characteristics Parameter Comments Min Typ Max Units VIH High level input voltage CMOS/Schmitt 0.65* VCC_1V8 VCC_1V8+0.3 V 41124764188 Rev 0.41 March 20, 2013 29 Product Technical Specification Parameter Comments Low level input voltage CMOS/Schmitt Min

-0.3 Typ Max Units 0.35* VCC_1V8 V VIL VOH VOL IOH IOL IOH-LED IOL-LED IIHPD IILPU IL CIN CIN-LED Caution:

High level output voltage CMOS, at pin rated drive strength VCC_1V8 - 0.45 VCC_1V8 Low-level output voltage CMOS, at pin rated drive strength VOH = VCC_1V8 0.45 V VOL = 0.45 V LED signal only High level output current Low Level output current High level output current Low Level output current Input high leakage current With pull-down Input low leakage current With pull-up VIO = max, VIN = 0 V to VIO LED signal only Input leakage current LED signal only Input capacitance Input capacitance LED signal only 0

-6

-3 5

-30

-0.3 0.45 6 20 30

-5

+0.35 7 5 V V mA mA mA mA A A A pF pF Digital IOs shall not be pulled-up to an external voltage as this may cause VCC_1V8 to not go low when the AirPrime AR7550 device is powered down. Also, this would partially bias the AirPrime AR7550 device which could potentially damage the device or result in GPIOs being set to undetermined levels. Internal Device Frequencies 5.6. The table below summarizes the frequencies generated within the AirPrime AR7550. This table is provided for reference only to the device integrator. Table 28. Internal Device Frequencies Subsystem/Feature Real Time Clock PCM Audio interface (Primary PCM Master Mode) [TBD]

I2C Interface PMIC switching power supplies GNSS Antenna bias switching supply Frequency Units 32.768 8, 128, 2048 400 tbd 3.5 kHz kHz kHz MHz MHz 41124764188 Rev 0.41 March 20, 2013 30 Product Technical Specification Subsystem/Feature Frequency Fundamental clock, codec, TCXO_OUT PLL USB 19.2 tbd 12, 480 Units MHz MHz Mb/s 41124764188 Rev 0.41 March 20, 2013 31 6. Baseband Specification 6.1. Power Supply The AirPrime AR7550 embedded module is powered via a single regulated DC power supply, 3.7V nominal. The power supply requirements can be found in the following table. Table 29. Power Supply Requirements Power Supply Main DC Power Input Range Power Supply Ripple Maximum Current draw 0 to 1kHz

>1kHz AR7550 Min Typ Max Units 3.4

3.7

4.2 200 50 tbd V mVpp mVpp mA AirPrime AR7550 does not support USB bus-powered operation. DC power must be supplied via the VBATT input. Table 30. Power Supply Pads Pad Name Direction Function EA2 EB2 EC2 VBATT VBATT VBATT Input Input Input Power Supply Input Power Supply Input Power Supply Input If Unused Must Be Used Must Be Used Must Be Used 6.1.1. Under-Voltage Lockout (UVLO) The power management section of the AirPrime AR7550 includes an under-voltage lockout circuit that monitors supply and shuts down when VBATT falls below the threshold. Figure 9. Under-Voltage Lockout (UVLO) Diagram The AirPrime AR7550 will power down and remain off until the level of VBATT returns to the valid range and the ON/OFF signal is active. 4112476 Rev 0.4 March 20, 2013 32 Product Technical Specification Note:

If the AirPrime AR7550 device has 6 UVLO events without a valid power down or reset sequence, it enters a mode in which only the DM port enumerates on the USB. Table 31. UVLO Thresholds UVLO Description Rising threshold Falling threshold Minimum Duration below Falling threshold Value Units 2.725 2.55 1.0 V V uS 6.2. VCOIN The AirPrime AR7550 provides an interface for a coin cell to maintain the internal RTC when VBATT is removed from the AirPrime AR7550 device. Whenever VBATT is applied the RTC is powered from the VBATT supply. The AirPrime AR7550 also supports charging of a coin cell if connected to this interface. Table 32. VCOIN Pad Pad Name Direction Function If Unused AC11 VCOIN Input /Output Voltage Input/Charging output Leave Open The table below defines the specifications of this interface. Table 33. VCOIN Interface Specification VCOIN DC Power Input Range Current Draw Min TBD Typ TBD 1.1 Max TBD 2.0 Units V A The table below defines the VCOIN charging specifications. Table 34. VCOIN Charging Specifications VCOIN Charging Specs Comments Target regulator voltage1 Target series resistance2 Coin cell charger voltage error Coin cell charger resistor error Dropout voltage3 Ground current, charger enabled VBAT = 3.6 V, T = 27 C VBAT = 3.2 to 4.2 V VIN > 2.5 V, ICHG = 100 A ICHG = 0 A ICHG = 2 mA IC = off; VCOIN = open Min TBD 800

-5

-20 Typ TBD 4.5 Max TBD 2100

+5

+20 200 8 Units V

mV A A 1. Valid regulator voltage settings are 2.5, 3.0, 3.1, and 3.2 V. 2. Valid series resistor settings are 800, 1200, 1700, and 2100 . 3. Set the input voltage (VBAT) to 3.5 V. Note the charger output voltage; call this value V0. Decrease the input voltage until the regulated output voltage drops 100 mV (until the charger output voltage = V0 - 0.1 V). The voltage drop across the regulator under this condition is the dropout voltage (Vdropout = VBAT - the charger output voltage). 41124764188 Rev 0.41 March 20, 2013 33 Product Technical Specification 6.3. ON/OFF Control The AirPrime AR7550 provides an interface for controlling the device ON/OFF state. Table 35. ON/OFF Control Pads Pad BB1 Name ON/OFF Direction Function If Unused Input ON/OFF Control Must Be Used The ON/OFF signal is internally pulled up to an internal 1.8V reference voltage. An open drain transistor should be connected to this pin to generate a low pulse. This pin should not be driven high external to the AirPrime AR7550 embedded module. Table 36. ON/OFF Internal Pull-Up Signal Parameter ON/OFF Internal Pull-up Min

Typ 200 Max Units

k 6.3.1. ON/OFF Timing The ON/OFF pin is a low pulse toggle control. The first pulse powers the AirPrime AR7550 ON, a second pulse instructs the AirPrime AR7550 to begin the Shutdown process. The diagram below illustrates the recommended application implementation for ON/OFF control. Figure 10. Recommended ON/OFF Control The diagram below illustrates an alternate application implementation that holds ON/OFF low during operation. 41124764188 Rev 0.41 March 20, 2013 34 Product Technical Specification Figure 11. Alternate ON/OFF Control Table 37. Power-ON Sequence Symbol Definitions Symbol Parameter Boot Min Typ Max tON tOFF tpwroff tpwrrmv tHI Turn ON Pulse duration Turn OFF Pulse duration Time to Power OFF Time VBATT must be maintained after VCC_1V8 goes inactive Time required for ON/OFF to be high prior to OFF pulse. In process Complete 50 ms 50 ms

0 s 10 s 50 ms 100 ms 100 ms 5 s 500 ms

Tpwroff is the time between when a power OFF pulse is complete and when shutdown is completed by the AirPrime AR7550 devices. This duration is network and device dependent, i.e. in a CDMA network a power down registration is initiated by the AirPrime AR7550 device, when the acknowledgement is received from the network power OFF completes. Detection of power down can be accomplished by monitoring for one of the following:

+WIND: 10 output on the AT Command interface USB ports are de-enumerated The application must wait for a power down to be detected prior to removing power from the AirPrime AR7550 device. If a timeout is required, it is recommended to be in excess of 30s prior to removing power from the AirPrime AR7550 device. Note:

Refer to [7] for details on enabling the +WIND message for power down and +USLGRPMSK and

+USLEVTMSK for unsolicited message output. 41124764188 Rev 0.41 March 20, 2013 35 Product Technical Specification 6.3.3. Software-Initiated Power Down The host application may choose to use the AT Command AT!POWERDOWN to initiate a power down of the AirPrime AR7550 device instead of using an OFF pulse. In this scenario the ON/OFF signal should be left open by the application. The AirPrime AR7550 device will initiate a power up after completion of the power down if ON/OFF is low. 6.3.4. Deep Sleep The AirPrime AR7550 embedded modules support a low power mode in which the device is registered on the LTE/CDMA/GSM/WCDMA network and sleeps in between wake intervals where it listens for pages. Figure 12. Power Mode Diagram The following table lists the parameter that defines the wake interval period for the various devices. Table 38. Period of Wake Intervals AR Series Device Network Standard Parameter AR7550 CDMA WCDMA LTE SCI DRX DRX The average current consumption of the AirPrime AR7550 while in this mode is defined in the Sleep Mode portion of the current consumption tables in section 5.4 Current Consumption. The Slot Cycle Index is the lower of the values stored in the AirPrime AR7550 or the value being broadcast by the wireless network that the AirPrime AR7550 is registered on. The MFRM and DRX cycle index values are broadcast by the wireless network on which the AirPrime AR7550 embedded module is registered. While in Deep Sleep mode the functions of the AirPrime AR7550 are limited as defined in the following table. Table 39. Deep Sleep Function Availability Function Paging 41124764188 Availability Conditions Rev 0.41 March 20, 2013 36 Product Technical Specification Function GNSS Time measurement USB UART Digital IO Availability Conditions

GNSS is powered down USB_VBUS is not applied Digital IO pins maintained last state Events that cause the AirPrime AR7550 to wake-up from Deep Sleep mode include:

Incoming call Expiration of an internal timer in the AirPrime AR7550 USB_VBUS is applied to the AirPrime AR7550 WAKE_N is asserted (low) UART1 DTR is asserted (high) if UART1 DTR has been enabled as a sleep control

(AT+W32K=1,1) and AT Command Service is mapped to UART1 GNSS location fix request is initiated from an Embedded Application See the Ring Indicator section for more information about configuring the RI signal to notify an external application of a wake-up event while the AR device is in sleep mode. 6.3.4.1. Sequence to Enter Deep Sleep Mode The following list defines the sequence needed by the application to allow the AirPrime AR7550 to enter Deep Sleep mode:

1. AR7550 has registered on the WWAN network (or callbox), and is not in a call. 2. End GNSS Tracking session. 3. Turn off GNSS Antenna bias. 4. Confirm WAKE_N is not held low (pulled-up in AirPrime AR7550). 5. 6. 7. Ensure UARTs are in the inactive state. 8. Remove VBUS from being applied to the AR device. Issue AT command to request AR device to enter deep sleep (AT+W32K=1,x). If AT+W32K=1,1 is used, DTR must also be de-asserted to allow sleep. 6.4. USB The AirPrime AR7550 has a High Speed USB2.0 compliant, peripheral only interface. Table 40. USB Pad Details Pad DA7 DB6 DA6 DD5 Name USB_VBUS USB_D_P USB_D_M USB_ID Direction Function Input In/Out In/Out In/Out USB Power Supply Differential data interface positive Differential data interface negative USB ID The AR7550 will not be damaged if a valid USB_VBUS is supplied while the main DC power is not supplied. 41124764188 Rev 0.41 March 20, 2013 37 Product Technical Specification Table 41. USB Characteristics USB USB_VBUS Voltage range Maximum Current draw1 Maximum Input Capacitance (Min ESR = 50 m) Value Units 2.0 5.25 1 10 V mA F 1 With the AirPrime AR7550 device powered ON. 6.5. UART The AirPrime AR7550 has two UART interfaces. The primary UART is an 8-wire1 electrical interface and the secondary UART is a 2-wire electrical interface. Table 42. UART Pads Pad Name Direction Function Interface If Unused AD9 AE6 AD8 AE7 AF6 AE5 AF5 DB2 DA2 RXD1 RTS1 TXD1 CTS1 DCD1 DTR1 DSR1 RXD2 TXD2 Output Input Input Output Output Input Output Output Input Receive Data (UART1) Ready To Send (UART1) Transmit Data (UART1) Clear To Send (UART1) Data Carrier Detect (UART1) Data Terminal Ready (UART1) Data Set Ready (UART1) UART2 Receive Data UART2 Transmit Data UART1 UART1 UART1 UART1 UART1 UART1 UART1 UART2 UART2 Leave Open Leave Open1 Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open 1 If UART1 is implemented as a 2-wire interface, RTS1 should be pulled low to disable flow control. 6.6. Ring Indicator The Ring Indicator (RI) may be used to notify an external application of several events such as an incoming call, timer expiration or incoming SMS. Table 43. Ring Indicator Pad Pad Name Direction Function AD7 RI1 Output Ring Indicator If Unused Leave Open The events which toggle the RI signal can be configured using the AT+WWAKESET command. The duration of the RI pulse can be configured using the AT+WRID command. The reason for the RI signal being activated can be queried using the AT+WWAKE command. Refer to [7] for details of these AT Commands. The RI signal is independent of the UART. 1 Includes Ring Indicator which may also be used independently of UART1. 41124764188 Rev 0.41 March 20, 2013 38 Product Technical Specification 6.7. UIM Interface The UIM interface of the AirPrime AR7550 supports a USIM/CSIM for LTE, WCDMA, GSM and CDMA. The UIM can be embedded internally in AR7550 and can be external to AR7550. Table 44. UIM Pads Pad DA5 DB4 DC3 DA4 DE1 Name Direction Function UIM_DETECT UIM_VCC UIM_RST UIM_DAT UIM_CLK Input Output Output Input /Output Output Detection of an external UIM card Supply output for an external UIM card Reset output to an external UIM card Data connection with an external UIM card Clock output to an external UIM card If Unused Leave Open Leave Open Leave Open Leave Open Leave Open The diagram below illustrates the recommended implementation of a UIM holder on the application. Figure 13. Recommended UIM Holder Implementation UIM_DETECT is used to detect the physical presence of a SIM/UIM card in the holder. It has a 3.0uA to 30A pull-up to 1.8V inside the AirPrime AR7550. It should be set to GND if a SIM/UIM is present. All signals must be ESD-protected near the UIM holder. The capacitor and two resistors should be added as placeholders to compensate for potential layout issues. UIM_DAT trace should be routed away from the UIM_CLK trace. Keep distance from AirPrime AR7550 to UIM-Holder as short as possible. An ESD device specifically designed for SIM/UIM cards is recommended for UIM_VCC, UIM_RST, UIM_CLK and UIM_DAT. i.e. SEMTECH EClamp2455K, Infineon BGF106C or NXP IP4264CZ8-20-

TTL. For UIM_DETECT a low leakage ESD suppressor should be selected. Internal UIM 6.7.1. Alternatively, a hardware option is available that includes a UIM device mounted on the AirPrime AR7550 PCB thus eliminating the need for an external UIM holder 41124764188 Rev 0.41 March 20, 2013 39 Product Technical Specification 6.8. General Purpose IO The AirPrime AR7550 defines 10 GPIOs for customer use. Table 45. GPIO Interface Pads Pad Name Pull State Function CA10 CA11 CB10 CB11 CC7 CC8 CC9 CD7 CE5 CF5 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 Pull-Down Pull-Down Pull-Down Pull-Down Pull-Down Pull-Down Pull-Down Pull-Down Pull-Down Pull-Down Available-GPIO Available-GPIO Available-GPIO Available-GPIO Available-GPIO Available-GPIO Available-GPIO Available-GPIO Available-GPIO Available-GPIO If Unused Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open Multiplexed Function Band indicator1 Band indicator2 Band indicator3 Refer to the Digital IO Characteristics section for electrical characteristics of these signals. 6.8.1. AT Port Switch The AirPrime AR7550 supports switching the active AT command port between USB and UART. Table 46. AT Port Switch States Pad AB5 Name State AT Port AT_PORT_SW Low (default) High Available on USB Available on UART1 6.9. Secure Digital IO The AirPrime AR7550 defines a 1.8V SDIO interface for future use. Table 47. SDIO Interface Pads Pad AA11 AA10 AB9 AB10 AB8 AA9 Name Direction Function SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3 SDIO_CMD SDIO_CLK Input/Output Input/Output Input/Output Input/Output Output Output SDIO Data bit 0 SDIO Data bit 1 SDIO Data bit 2 SDIO Data bit 3 SDIO Command SDIO Clock If Unused Leave Open Leave Open Leave Open Leave Open Leave Open Leave Open 41124764188 Rev 0.41 March 20, 2013 40 Product Technical Specification 6.10. I2C The AirPrime AR7550 provides an I2C interface. Table 48. I2C Interface Pads Pad CD6 CC6 Name I2C_CLK I2C_SDA Direction Function Output Input/Output I2C Clock output I2C Data If Unused Leave Open Leave Open The I2C signals are open drain outputs with 2.2 k pull-up resistors to VCC_1V8 internal to the AirPrime AR7550. 6.11. Voltage Reference The AirPrime AR7550 utilizes 1.8V logic. A voltage reference output for this rail is provided below. Table 49. Voltage Reference Pad Pad AA12 AB12 Name VCC_1V8 VCC_1V8 Direction Function Output Output Voltage Reference Output Voltage Reference Output If Unused Leave Open Leave Open Table 50. Voltage Reference Characteristics Parameter VCC_1V8 Voltage Level Output Current Min 1.746 Typ 1.8 Max 1.854 25 Units V mA The VCC_1V8 signal can be used to power external circuitry and/or detect the power state of the AirPrime AR7550 device. Using VCC_1V8 to determine the power state is recommended when the user application wants to disable VBATT. VBATT should not be disabled before VCC_1V8 goes inactive. To be able to detect the power state on VCC_1V8, all logic input signals to the AirPrime AR7550device must be set low

(see Digital IO Characteristics for affected signal groups). The VCC_1V8 signal is High-Z when the AirPrime AR7550 embedded module is powered down. 6.12. RESET The AirPrime AR7550 provides an interface to allow an external application to RESET the module as well as an output to indicate the current RESET state or control an external device. Table 51. Reset Interface Pads Pad AH2 AG4 Name Direction Function RESIN_N RESOUT_N Input Output External Reset Input Reset Output If Unused Leave Open Leave Open 41124764188 Rev 0.41 March 20, 2013 41 Product Technical Specification The RESIN_N signal is pulled-up internal to the AirPrime AR7550. An open collector transistor or equivalent should be used to Ground the signal when necessary to RESET the module. Note:

Use of the RESIN_N signal to RESET the AirPrime AR7550 could result in memory corruption if used inappropriately. This signal should only be used if the AirPrime AR7550 has become unresponsive and it is not possible to perform a power cycle. Table 52. Reset Timing Symbol Parameter Trdet Trlen Trdel Duration of RESIN_N signal before firmware detects it

(debounce timer) Duration reset asserted Delay between minimum Reset duration and Internal Reset generated Min Typ Max

32 ms 40 ms

500 ms

Figure 14. Illustration of Reset Timing When RESIN_N < Trdel Figure 15. Illustration of Reset Timing When RESIN_N Held Low > Trdet+Trdel 6.13. ADC The AirPrime AR7550 provides two ADC inputs. The interface information is provided in the tables below. Table 53. ADC Interface Pads Pad Name Direction Function If Unused ADC0 ADC1 DE3 DF2 Input Input Analog to Digital Converter Input Analog to Digital Converter Input Leave Open or Ground Leave Open or Ground 41124764188 Rev 0.41 March 20, 2013 42 Product Technical Specification Table 54. ADC Interface Characteristics ADC ADCx Full-Scale Voltage Level Resolution Input Impedance Value 1.8 15

>4 Units V bit M 6.14. LED The AirPrime AR7550 provides an LED control output signal pad. This signal is an open drain input. Table 55. LED Interface Pad Name LED Pad AA6 Direction Function Output LED driver control If Unused Leave Open Figure 16. LED Reference Circuit The behavior of the LED signal can be modified using the AT command AT!LEDCTRL. 6.15. Audio The AirPrime AR7550 supports both Analog and Digital audio interfaces. The following diagram illustrates the Audio subsystem and identifies where various AT commands affect the audio subsystem. Refer to [7] for details of the AT commands.

[Diagram tbd]

Figure 17. Audio Block Diagram 6.15.1. Analog Audio The AirPrime AR7550 provides a mono differential analog audio interface. Table 56. Analog Audio Interface Pads Pad Name Direction Function Interface AUDIO1_IN_P CD9 CC10 AUDIO1_IN_M CE6 CE8 AUDIO1_OUT_P AUDIO1_OUT_M Input Output Microphone 1 input positive Microphone 1 input negative Speaker 1 output positive Speaker 1 output negative Primary 41124764188 Rev 0.41 March 20, 2013 43 Product Technical Specification Table 57. Analog Audio Interface Characteristics Analog Audio Min. Typ. Max. Units Audio IN Audio OUT Input Impedance Signal Level Differential Signal Level Single-ended

(the unused audio signal must be tied to GND or analog reference) Signal Level Differential Signal Level Single-ended Output Impedance Signal Drive Strength Application Load 16

-0.3

-0.3

-0.3

-0.3

20

600 24 2.9 2.9 2.9 2.9 1M k dBV dBV dBV dBV k 6.15.2. Digital Audio The AirPrime AR7550 provides a 4-wire digital audio interface. This interface can be configured as either a PCM or an I2S. Table 58. Digital Audio Interface Pads Pad Name Direction1 PCM Function Direction I2S Function If Unused Input/Output Input/Output PCM Frame Sync PCM Clock PCM Data Out Output PCM Data In Input I2S_WS I2S_SCLK I2S_DOUT I2S_DIN Leave Open Leave Open Leave Open Leave Open DB3 DA3 DC2 DD2 PCM_FS PCM_CLK PCM_DOUT PCM_DIN Output Output Output Input 1 Direction when defined in Master mode. 6.15.2.1. PCM The AirPrime AR7550 PCM interface can be configured in one of two modes: primary PCM or auxiliary PCM mode. The table below defines the configurations for each of these two modes. Table 59. PCM Interface Configurations Element Primary PCM Auxiliary PCM Slot Configuration Sync type Frequency Duty Cycle Clock (Master) Data formats AirPrime AR7550 Master/Slave Slot-based Short 2.048 MHz 16-bit linear, 8-bit A-law, 8-bit m-law Master or Slave Single Long 8 kHz 50%

128 kHz Master 41124764188 Rev 0.41 March 20, 2013 44 Product Technical Specification 6.15.2.1.1. PCM Data format The PCM data is 8 kHz and 16 bits with the following PDM bit format:

PCM_DIN SDDD DDDD DDDD DDVV PCM_DOUT SDDD DDDD DDDD DDVV Where:

S Signed bit D Data V Volume padding 6.15.2.1.2. Primary PCM Timing The table and drawings below illustrate the PCM signals timing when the AirPrime AR7550 module is operating in Primary PCM mode. Table 60. Primary PCM Timing Parameter Description Min Typ Max unit T(sync) T(synch) T(syncl) T(clk) T(clkh) T(clkl) T(susync) T(hsync) T(sudin) T(hdin) T(pdout) T(zdout) PCM_FS cycle time PCM_FS high time PCM_FS low time PCM_CLK cycle time PCM_CLK high time PCM_CLK low time PCM_FS setup time high before falling edge of PCM_CLK PCM_FS Hold time after falling edge of PCM_CLK PCM_DIN setup time before falling edge of PCM_CLK PCM_DIN hold time after falling edge of PCM_CLK Delay from PCM_CLK rising to PCM_DOUT valid Delay from PCM_CLK falling to PCM_DOUT HIGH-Z

60 60

125 488 124.5 488 244 244 122

366

60 60 s ns s ns ns ns ns ns ns ns ns ns Figure 18. PCM_FS Timing Diagram (2048 kHz Clock) 41124764188 Rev 0.41 March 20, 2013 45 Product Technical Specification Figure 19. PCM Codec to AR Device Timing Diagram (Primary PCM) Figure 20. AR Device to PCM Codec Timing Diagram (Primary PCM) 6.15.2.1.3. Auxiliary PCM Timing The table and drawings below illustrate the timing of the PCM signals when the AirPrime AR7550 module is operating in Auxiliary PCM mode. Table 61. Auxiliary PCM Timing Parameter Description PCM_FS cycle time PCM_FS high time PCM_FS low time PCM_CLK cycle time PCM_CLK high time PCM_CLK low time T(auxsync) T(auxsynch) T(auxsyncl) T(auxclk) T(auxclkh) T(auxclkl) T(suauxsync) PCM_FS setup time high before falling edge of PCM_CLK T(hauxsync) T(sudin) T(hauxdin) T(pauxdout) PCM_FS Hold time after falling edge of PCM_CLK PCM_DIN setup time before falling edge of PCM_CLK PCM_DIN hold time after falling edge of PCM_CLK Delay from PCM_CLK rising to PCM_DOUT valid Min

62.4 62.4

3.8 3.8 1.95 1.95 70 20

Typ 125 62.5 62.5 7.8 3.9 3.9

Max unit

50 s s s s s s ns ns ns ns ns 41124764188 Rev 0.41 March 20, 2013 46 Product Technical Specification Figure 21. PCM_FS Timing Diagram (128 kHz Clock) Figure 22. PCM Codec to AR Device Timing Diagram (Auxiliary PCM) Figure 23. AR Device to PCM Codec Timing Diagram (Auxiliary PCM) 6.15.2.2. I2S The AirPrime AR7550 I2S interface can be used to transfer serial digital audio to/from an external stereo DAC/ADC. The I2S interface is a 4-wire interface: serial clock (I2S_SCLK), word select

(I2S_WS), serial uplink data (I2S_DIN), and serial downlink data (I2S_DOUT). The AirPrime AR7550 I2S interface can be configured as a master or slave and either transmitter or receiver. A high-level timing diagram of the I2S signals is presented below. 41124764188 Rev 0.41 March 20, 2013 47 Product Te echnical Spec cification Figure 24. I2S Signals T Timing Diagram m 6.15.2. 2.1. I2S_DIN a and I2S_D OUT ial PCM stere UT signal pin ment, with th eo-data strea n and input o e MSB first. am for both c on the I2S_D The transmit channels are DIN signal pin tter and rece e output from n. Serial data eiver are not m the AirPrime a is transmitt required to h e AR7550 on ted in twos have the sam n the me word The seri I2S_DO complem length:

When the tra receivers LS When the tra LSB will be s The MSB ha The transmit Serial data s leading (L-to Serial data m ansmitted wo SB are ignor ansmitted wo set to zero in as a fixed po tter always s sent by the tr o-H) edge of must be latch ord length is ed; the rest o ord length is nitially, so the sition, where sends the MS ransmitter m the clock sig hed into the r greater than of the transm less than the ey will remai eas the LSB SB of the nex ay be synch gnal. receiver on t n the receive mitters LSBs e receiver wo n at zero. position dep xt word one c ronized with r word length h, the bits aft

. are ignored ord length, th he receivers ter the s missing ends upon w clock period either the tra word length. after WS ch ailing (H-to-L anges. L) or the leading e dge of the se erial clock si gnal. 6.15.2. 2.2. I2S_WS The wor rd-select line 0 specifies t 1 specifies t The WS sign indicates th he left chann he right chan nal changes e channel be nel nnel one clock pe eing transmit tted / receive ed:

eriod before the MSB is t transmitted. 6.15.2. 2.3. I2S_SCLK K This is th he serial bit c I2S_SCLK Where bit_w I2S_SCLK clock whose rate = (2 width = 16 bit rate = 32 rate is a fun x bit_wi ts per channe x FS nction of the d idth) x FS el and FS is data width a S the sample r nd sample ra ate:

rate, therefor re:

Sample rates of 8, 1 I2S_SCLK Where bit_w 6, 24, 32, 44 rate = (2 width = 16 an 4.1, and 48 k x 16) x nd FS = 48 kH kHz are supp 48 kHz =

Hz. ported. An ex 1.536 MHz xample clock z k rate is:

4112476418 88 Rev 0.41 March 2 20, 2013 48 8 Product Technical Specification 6.16. SPI Bus The AirPrime AR7550 embedded module provides one SPI bus (4-wire interface). SPI bus interface includes:

A CLK signal An O signal An I signal A CS (Chip Select) signal 6.16.1. Characteristics The following features are available on the SPI bus:

Master-only mode operation SPI speed is from 128 kbit/s to 26 Mbit/s in master mode operation 4-wire interface 4 to 32 (TBD) bits data length. 6.16.2. SPI Configuration Table 62. SPI Configuration Operation Maximum Speed SPI-Mode Duplex 4-wire Type Master 26Mb/s 0,1,2,3 full SPIx-CLK;

SPIx-IO;

SPIx-I;

SPIx_CS For the 4-wire configuration, SPIx-I/O is used as output only, SPIx-I is used as input only (TBC by firmware). 6.16.3. SPI Waveforms The following figure shows waveforms for SPI transfer with 4-wire configuration. Figure 25. 4-Wire Configuration SPI Transfer 41124764188 Rev 0.41 March 20, 2013 49 Product Te echnical Spec cification Table 63. SPI Master T Timing Charac cteristics 6.16. Refer to 4. SPI the following Pin De g table for th scriptio he SPI interfa on ace pin descr ription. Table 64. SPI Pin Des cription Signal SPI-CLK O SPI-MISO SI SPI-MOS SPI_CS Pin n #

O I/O I/O Typ pe R Reset State Des scription E4 CE E3 CE D4 CD D5 CD O I O O 1V8 1V8 1V8 1V8 Z Z Z Z SPI SPI SPI SPI Serial Clock Serial input Serial output Chip Select 6.16. A 4-wire 5. App e SPI configu plication n he input and uration has th output data lines disasso ociated. Figure 26. Example of 4 4-wire SPI Bus A Application 4112476418 88 Rev 0.41 March 2 20, 2013 50 0 Product Technical Specification 6.17. HSIC Bus The AirPrime AR7550 embedded module provides one HSIC bus (2-wire interface). HSIC bus interface includes:

HSIC strobe signal HSIC data signal Calibration pad for HSIC port signal 6.17.1. HSIC Pin Description Refer to the following table for the HSIC interface pin description. Table 65. HSIC Pin Description Signal Pin #

I/O I/O Type Reset State Description HSIC_STB HSIC_DATA HSIC_CAL AA2 AA3 AA4 B B B 1V2 1V2 1V2 Z Z Z HSIC strobe signal HSIC data HSIC calibration pad 6.17.2. HSIC Waveforms The following figure shows waveforms for HSIC signal sample. Figure 27. HSIC Signal Sample Waveforms 41124764188 Rev 0.41 March 20, 2013 51 Product Technical Specification 6.17.3. Application A 4-wire SPI configuration has the input and output data lines disassociated. Figure 28. Example of HSIC Bus Application Note 1: Trace length to 10cm maximum 2: Skew between data and strobe signals < 15ps, and 3: Connect HSIC_Ready to HSIC_RST_N of the HSIC device. 41124764188 Rev 0.41 March 20, 2013 52 Product Technical Specification 6.18. Temperature Monitoring The AirPrime AR7550 has internal temperature monitoring of both the PMIC device and the Power Amplifier devices. current_temp < TEMP_HI_WARN High Temperature Critical

(Low power mode) Application asserts ON/OFF Or Issues AT!POWERDOWN current_temp > TEMP_HI_CRIT current_temp > TEMP_HI_WARN Normal High Temperature Warning Power off. Handled by Power State state machine. current_temp < TEMP_HI_NORM current_temp < TEMP_LO_CRIT Low Temperature Critical

(Low power mode) current_temp > TEMP_NORM_LO Figure 29. Temperature Monitoring State Machine Table 66. Temperature Monitoring States Application asserts ON/OFF Or Issues AT!POWERDOWN State Description Threshold1 Default Temp value (C) Functionality Normal High Temperature Warning High Temperature Critical Low Temperature Critical Both PMIC and PA Thermistors are between Either PMIC or PA Thermistor has exceeded Either PMIC or PA Thermistor has exceeded Either PMIC or PA Thermistor has descended past TEMP_HI_NORM TEMP_LO_NORM TEMP_HI_WARN

+85

-40

+95 TEMP_HI_CRIT 140 TEMP_HI_CRIT

-45 All All Warning message output on AT Command port Low Power Mode Device will only make Emergency calls Low Power Mode Device will only make Emergency calls 1 There are two sets of thresholds: PATEMP for PA Thermistor, and PCTEMP for PMIC Thermistor. To restore full operation, temperature readings for both the PA and PMIC Thermistors must be within the Normal or High Temperature Warning state thresholds. 41124764188 Rev 0.41 March 20, 2013 53 7. Routing Constraints and Recommendations Layout and routing of the AirPrime AR7550 device in the application is critical to maintaining the performance of the radio. The following sections provide guidance to the developer when designing their application to include an AirPrime AR7550 device and achieve optimal system performance. 7.1. RF Routing Recommendations To route the RF antenna signals, the following recommendations must be observed for PCB layout:

The RF signals must be routed using traces with a 50 characteristic impedance. Basically, the characteristic impedance depends on the dielectric constant (r) of the material used, trace width (W), trace thickness (T), and height (H) between the trace and the reference ground plane. In order to respect this constraint, Sierra Wireless recommends that a MicroStrip structure be used and trace width be computed with a simulation tool (such as AppCAD, shown in the figure below and available free of charge at http://www.avagotech.com). Figure 30. AppCAD Screenshot for Microstrip Design Power Mode Diagram The trace width should be wide enough to maintain reasonable insertion loss and manufacturing reliability. Cutting out inner layers of ground under the trace will increase the effective substrate height; therefore, increasing the width of the RF trace. Caution:

It is critical that no other signals (digital, analog, or supply) cross under the RF path. The figure below shows a generic example of good and poor routing techniques. 4112476 Rev 0.4 March 20, 2013 54 Product Technical Specification Poor routing Correct routing The yellow traces cross the RF trace. There is no signal around the RF path. Figure 31. RF Routing Examples Fill the area around the RF traces with ground and ground vias to connect inner ground layers for isolation. Cut out ground fill under RF signal pads to reduce stray capacitance losses. Avoid routing RF traces with sharp corners. A smooth radius is recommended. E.g. Use of 45 angles instead of 90. The ground reference plane should be a solid continuous plane under the trace. The coplanar clearance (G, below) from the trace to the ground should be at least the trace width (W) and at least twice the height (H). This reduces the parasitic capacitance, which potentially alters the trace impedance and increases the losses. E.g. If W = 100 microns then G = 200 microns in an ideal setup. G = 150 microns would also be acceptable is space is limited. Figure 32. Coplanar Clearance Example Note:

The figure above shows several internal ground layers cut out, which may not be necessary for every application. 41124764188 Rev 0.41 March 20, 2013 55 Product Technical Specification Figure 33. Antenna Microstrip Routing Example 7.2. Power and Ground Recommendations Power and ground routing is critical to achieving optimal performance of the AirPrime AR7550 devices when integrated into an application. Recommendations:

Do not use a separate GND for the Antennas Connections to GND from the AirPrime AR7550 should be flooded plane using thermal reliefs to ensure reliable solder joints. VBATT is recommended to be routed as a wide trace(s) directly from the 4V supply to the LGA pad. 7.3. Antenna Recommendations The AirPrime AR7550 devices are designed to provide diagnostics status of the antennas connected to it. The Primary antenna interface is optimized for a multiband cellular antenna with a 10 k DC impedance between the antenna element and the ground reference. The GNSS antenna interface is optimized for a 5V active GNSS antenna supporting the GPS L1 and GLONASS L1 FDMA bands. Refer to the GNSS Antenna Diagnostics section. Connecting the antenna ground reference to the vehicle chassis is not recommended since that has been known to cause noise from the engine to couple into the audio of the device. It is ultimately up to the integrator to evaluate this performance. 41124764188 Rev 0.41 March 20, 2013 56 Product Technical Specification Interface Circuit Recommendations 7.4. The recommended interface implementation is to use open-drain non-inverting buffers with pull-ups to the appropriate voltage reference. This allows a host processor operating at a different voltage to communicate with the AirPrime AR7550 using the appropriate voltage levels. The figure below is a reference circuit for a digital input signal to the AirPrime AR7550 device. Figure 34. AirPrime AR7550 Input Reference Circuit The figure below is a reference circuit for a digital output signal from the AirPrime AR7550 device. Figure 35. AirPrime AR7550 Output Reference Circuit Refer to Chapter Error! Reference source not found. Error! Reference source not found. section to identify the appropriate reference voltage and direction of the specific signals. The open-drain non-inverting buffer used in the reference circuits above is the OnSemi NL17SZ07. Tip:

The NL17SZ07 is over-voltage tolerant on the inputs. It may be possible to power all the buffers from the 1.8V reference voltage output. Review the digital output characteristics of the applications drivers and the Input characteristics of the buffer selected to determine if this would work in your application. If a Digital IO signal is used bidirectional in the application then a bidirectional buffer or bidirectional level translator is needed. 41124764188 Rev 0.41 March 20, 2013 57 8. Regulatory Information Important Notice 8.1. Because of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless and its affiliates accept no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the AR7550 modem:

In areas where blasting is in progress Where explosive atmospheres may be present including refueling points, fuel depots, and chemical plants Near medical equipment, life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the AR Series device MUST BE POWERED OFF. Otherwise, the AR Series device can transmit signals that could interfere with this equipment In an aircraft, the AR Series device MUST BE POWERED OFF. Otherwise, the AR Series device can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular network. Use of cellular phone in aircraft is illegal in some jurisdictions. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both. Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The AR Series device may be used normally at this time. 8.2. Important Compliance Information for USA OEM Integrators The AR Series device is granted with a modular approval for mobile applications. Integrators may use the AR Series device in their final products without additional FCC/IC (Industry Canada) certification if they meet the following conditions. Otherwise, additional FCC/IC approvals must be obtained. 1. At least 20cm separation distance between the antenna and the users body must be maintained at all times. 2. To comply with FCC/IC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the gain values presented in the table below:

6.5 dBi in Cellular band 3 dBi in PCS band 6.0 dBi in LTE Band 4 9.0 dBi in LTE Band 7 9.0 dBi in LTE Band 13 (Note: LTE Band 13 is not permitted in Canada.) 4112476 Rev 0.4 March 20, 2013 58 Product Technical Specification 3. The AR7550 modem may transmit simultaneously with other collocated radio transmitters within a host device, provided the following conditions are met:

Each collocated radio transmitter has been certfied by FCC / IC for mobile application. At least 20 cm separation distance between the antennas of the collocated transmitters and the users body must be maintained at all times. stipulated in the following table. The output power and antenna gain must not exceed the limits and configurations Device Technology Band Frequency

(MHz) Maximum conducted power Maximum antenna gain AR7550 Module Collocated transmitters1 LTE UMTS CDMA 4 7 13 2 5 BC0 BC1 24 24 24 24 24 25 25 29 29 29 29 29 15 1. Valid collocated Transmitter combinations: WLAN+BT; WiMAX+BT.

(WLAN+WiMAX+BT is not permitted.) 4. A label must be affixed to the outside of the end product into which the AirPrime AR7550 1710-1755 2500 2570 777-787 1850-1910 824-849 824-849 1850-1910 2400-2500 5150-580 2300-2400 2500-2700 3300-3800 2400-2500 6 9 6 3 3 3 3 5 5 5 5 5 5 WiMAX WLAN BT device is incorporated, with a statement similar to the following:

a. This device contains FCC ID: N7NAR7550 This equipment contains equipment certified under IC: 2417C-AR7550 A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC/IC RF exposure guidelines. The end product with an embedded AirPrime AR7550 device may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized. Note:

If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102. 41124764188 Rev 0.41 March 20, 2013 59 9. References The table below lists the reference specifications for this product. Table 67. Reference Specifications Ref Title

[1]

[2]

[3]

[4]

[5]

[6]

[7]

[8]

Recommended Minimum Performance Standards for cdma2000 High Rate Packet Data Access Terminal C.S0033 Recommended Minimum Performance Standards for cdma2000 Spread Spectrum Mobile Stations C.S0011 (IS-98D) Universal Serial Bus Specification Universal Serial Bus CDC Subclass Specification for Wireless Mobile Communication Devices Universal Serial Bus Class Definitions for Communication Devices AirPrime AR Series Customer Process Guidelines AirPrime AR7 Series AT Command Interface Specification AirPrime AR7 Series Firmware Download Guide Issuer 3GPP2 3GPP2 USB Implementers Forum USB Implementers Forum USB Implementers Forum Sierra Wireless Sierra Wireless Sierra Wireless 4112476 Rev 0.4 March 20, 2013 60 10. Abbreviations The table below lists several abbreviations used in this document. Table 68. Abbreviations Abbreviation Description CDMA DRX GNSS GSM HSPA LTE SCI USB WCDMA WWAN Code Division Multiple Access Discontinuous Receive Global Navigation Satellite System Global System for Mobile Communications High Speed Packet Access Long Term Evolution Slot Cycle Index Universal Serial Bus Wideband Code Division Multiple Access Wireless Wide Area Network 4112476 Rev 0.4 March 20, 2013 61