FCC ID: QOQBGM111 Blue Gecko BGM111 Bluetooth Smart Module

INSTALLATION GUIDE Figure 1: Recommended PCB land pattern of BGM111E Because BGM111E is using an external antenna through the embedded u.fl connector, the radiated performance does not depend on the PCB layout. The module can be placed freely in the application board. It is recommended to use good engineering practices in the layout to avoid RF noise coupling and EMI issues. Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com QUALIFIED ANTENNA TYPES FOR BGM111E BGM111E module is approved with a standard 2.14 dBi dipole antenna. Any antenna of the same type, similar in-band out of band characteristics and with the same or less gain can be used without reassessment. In case using antenna of a different type and/or higher gain reassessments and notification to the particular certification authority is required. Page 2 of 7 Japan BGM111E is certified in Japan with certification number 209-J00240. It is recommended that a manufacturer who integrates a radio module in their host equipment will place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Translation:

This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law. Figure 2: GITEKI mark and ID Page 3 of 7 R209-J00240 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the users authority to operate the equipment. FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. OEM Responsibilities to comply with FCC Regulations The BGM111 Bluetooth Smart Module has been certified for integration into products only by OEM integrators under the following condition:

The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note:

In the event that this condition cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The BGM111 Bluetooth Smart Module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQBGM111"

Or

"Contains FCC ID: QOQBGM111"

The OEM integrator must not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. Page 4 of 7 ISEDC IC (English) This radio transmitter has been approved by Industry Canada to operate with a standard 2.14 dBi dipole antenna. Other antenna types are strictly prohibited for use with this device. This device complies with Industry Canadas license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. BGM111E Bluetooth Smart Module meets the given requirements when the minimum separation distance to human body is 15 mm. RF exposure or SAR evaluation is not required when the separation distance is 15 mm or more. If the separation distance is less than 15 mm the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The BGM111 Bluetooth Smart Module has been certified for integration into products only by OEM integrators under the following conditions:

The antenna(s) must be installed such that a minimum separation distance of 15 mm is maintained between the radiator (antenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note:

In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization. End Product Labeling The BGM111 Bluetooth Smart module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module IC: 5123A-BGM111"

Or

"Contains IC: 5123A-BGM111"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. Page 5 of 7 IC (Francais) Cet metteur radio (IC : 5123A-BGM111) a reu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorpore. Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil. Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes:

1. Lappareil ne doit pas produire de brouillage;

2. Lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Dclaration relative l'exposition aux radiofrquences (RF) Les limites applicables lexemption de lvaluation courante du DAS sont nonces dans le CNR 102, 5e dition. L'appareil BGM111 rpond aux exigences donnes quand la distance de sparation minimum par rapport au corps humain est infrieure ou gale 15 mm. L'valuation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de sparation est de 15 mm ou plus. Si la distance de sparation est infrieure 15 mm, il incombe l'intgrateur FEO d'valuer le DAS. Responsabilits du FEO ayant trait la conformit avec les rglements IC Le module BGM111 a t certifi pour une intgration dans des produits uniquement par les intgrateurs FEO dans les conditions suivantes:

La ou les antennes doivent tre installes de telle faon qu'une distance de sparation minimum de 15 mm soit maintenue entre le radiateur (antenne) et toute personne tout moment. Le module metteur ne doit pas tre install au mme endroit ou fonctionner conjointement avec toute autre antenne ou metteur. Ds lors que les deux conditions ci-dessus sont respectes, d'autres tests de l'metteur ne sont pas obligatoires. Cependant, il incombe toujours l'intgrateur FEO de tester la conformit de son produit final vis--vis de toute exigence supplmentaire avec ce module install (par exemple, missions de dispositifs numriques, exigences relatives aux matriels priphriques PC, etc). Note:

S'il s'avre que ces conditions ne peuvent tre respectes (pour certaines configurations ou la colocation avec un autre metteur), alors l'autorisation IC n'est plus considre comme valide et l'identifiant IC ne peut plus tre employ sur le produit final. Dans ces circonstances, l'intgrateur FEO aura la responsabilit de rvaluer le produit final (y compris l'metteur) et d'obtenir une autorisation IC distincte. tiquetage du produit final L'tiquette du module BGM111 porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est install l'intrieur d'un autre appareil, l'extrieur de l'appareil dans lequel le module est install doit aussi porter une tiquette faisant rfrence au module qu'il contient. Dans ce cas, une tiquette comportant les informations suivantes doit tre colle sur une partie visible du produit final.

"Contient le module metteur IC: 5123A-BGM111"

or

"Contient IC : 5123A-BGM111"

L'intgrateur FEO doit tre conscient de ne pas fournir d'informations l'utilisateur final permettant d'installer ou de retirer ce module RF ou de changer les paramtres lis aux RF dans le mode d'emploi du produit final. Page 6 of 7 CE The Declaration of Conformity may be consulted at www.silabs.com. Please note that every application using the BGM111 will need to perform the radio EMC tests on the end product according to EN 301 489-17. The conduced test results can be inherited from the modules test report to the test report of the end product using BGM111. EN300328 radiated spurious emission test must be repeated with the end product assembly. Test documentation and software for the EN 300 328 radiated spurious emissions testing can be requested from the Silicon Labs support. Page 7 of 7

Blue Gecko BGM111 Bluetooth Smart Module Data Sheet The BGM111 is a Bluetooth Smart module targeted for Bluetooth Smart applications where good RF performance, low power consumption and easy application development are key requirements. At +8 dBm TX power BGM111 has best-in-class RF performance and can provide long range, robust Bluetooth Smart connectivity. The BGM111 integrates all of the necessary elements required for a Bluetooth Smart application: Bluetooth radio, software stack and GATT based profiles and it can also host end user applications, which means no external microcontroller is required in size, price or power constrained devices. The BGM111 Bluetooth Smart module also has highly flexible hardware interfaces to connect to different peripherals or sensors. Although the BGM111 Bluetooth Smart Module is targeted at applications requiring high RF performance, it still has ultra-low power consumption and can be operated using a standard 3V coin cell battery. BGM111 can be used in a wide variety of applications:

Health and Fitness Point-of-Sales Consumer Electronics Automotive Aftermarket Industrial and Home Automation Others KEY FEATURES Bluetooth 4.1 Compliant (Bluetooth Smart) Software upgradable to Bluetooth 4.2 TX power: up to +8 dBm RX sensitivity: down to -92 dBm Range: up to 200 meters CPU core: 32-bit ARM Cortex-M4 Flash memory: 256 kB RAM: 32 kB Autonomous Hardware Crypto Accelerator and True Random Number Generator Integrated DC-DC Converter silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 1. Feature List The highlighted features are listed below. Bluetooth Features Bluetooth 4.1 Compliant Software Upgradable to Bluetooth 4.2 Central and Peripheral Roles Up to 6 x BLE Connections in Central Role Radio Features Integrated Antenna TX Power (+8 dBm) RX Sensitivity (-92 dBm) Up to 200 meters LoS range Software Features Integrated Bluetooth Smart Stack Any GATT based Bluetooth Smart Profile 100 kbps throughput over BLE BGAPI serial protocol over UART for modem (NCP) usage BGLIB host library which implements BGAPI serial protocol BGScript script and C programming for standalone usage Profile Toolkit for creating GATT based services Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Feature List Harware Interfaces UART host interface 2 x SPI, UART and 2 x I2C peripheral interfaces Up to 25 x GPIO with interrupts 4 x 12-bit ADC and 1 x 12-bit IDAC Internal temperature sensor Internal battery voltage measurement option Clock generator Real-time counter MCU Features ARM Cortex-M4F 40 MHz 32 kB RAM 256 kB Flash Advanced cryptography support Electrical Characteristics Supply voltage: 1.8 V to 3.8 V with DC-DC bypass mode Supply voltage: 2.4 V to 3.8 V when using DC-DC 8.7 mA TX current at 0 dBM 8.8 mA RX current 63 A/MHz @ Energy Mode 0 1.4 A EM2 deep sleep current Environmental/Regulatory Temperature range: -40C to +85C Bluetooth, CE, FCC and IC, Japan and South-Korea qualified Dimensions W x L x H: 12.9 mm x 15.0 mm x 2.2 mm silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 1 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Ordering Information 2. Ordering Information BGM111A256V1 (orderable part number) is the product code for a pre-production (non-certified) version of the Module based on rev A2 SoC. This (V1) product code is updated to production version (V2) when the logos of the official CE and FCC certifications are marked into the Modules metallic RF shield and the SoC used inside the Module is in mass production. The product code of the production version with the certification markings is BGM111A256V2R (1000 pcs cut reel) and BGM111A256V2 (100 pcs cut reel). Note: The only visual difference between pre-production (V1) and production module (V2) versions will be the certification codes prin-

ted on the RF shield. Silicon Labs reserves the right to deliver BGM111A256V2R or BGM111A256V2 (production version) for custom-

ers ordering BGM111A256V1R or BGM111A256V1. Part Number BGM111A256V1 Description BGM111 Bluetooth Smart Mod-

ule with internal chip antenna Cut reel Features Radio:

Core:

Memory:

Antenna:

Packaging:

Status:

Bluetooth Smart 4.1, +8 dBm TX ARM Cortex M4 32 kB RAM/256 kB flash chip 100 pcs cut reel pre-production samples BGM111A256V1R BGM111 Bluetooth Smart Mod-

ule with internal chip antenna Radio:

Bluetooth Smart 4.1, +8 dBm TX Production PN:

BGM111A256V2 Full reel Core:

Memory:

Antenna:

Packaging:

Status:

Production PN:

ARM Cortex M4 32 kB RAM/256 kB flash chip 1000 pcs tape and reel pre-production samples BGM111A256V2R SLWSTK6101A Blue Gecko Bluetooth Smart Module Wireless Development Kit (WSTK) BGM111 Radio Board WSTK Main Board BGM111A256V2 BGM111 Bluetooth Smart Mod-

ule with internal chip antenna Cut reel Expansion Board (buttons, leds, accelerometer, joystick) Accessories See BGM111A256V1 BGM111A256V2R BGM111 Bluetooth Smart Mod-

ule with internal chip antenna See BGM111A256V1R SLWSTK6101B Full reel Blue Gecko Bluetooth Smart Module Wireless Development Kit (WSTK) BGM111 Radio Board and BGM113 Radio Board WSTK Main Board Expansion Board (buttons, leds, accelerometer, joystick) Accessories silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 2 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Interfaces 3. Interfaces This section describes the features and functionalities of the interfaces and peripherals. 3.1 USART The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous UART communication with hardware flow control as well as SPI. If UART is used as BGAPI serial protocol host interface it is strongly recommended to use RTS and CTS signals for reliable data trans-

mission. Figure 3.1. USART 3.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) The unique LEUART provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication possible with a minimum of software intervention and energy consumption. 3.3 I2C The I2C module provides an interface between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10 kbit/s up to 1 Mbit/s. Figure 3.2. I2C 3.4 Timer/Counter (TIMER) TIMER peripherals count events, generate PWM outputs. The core of each TIMER is a 16-bit counter. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 3 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Interfaces 3.5 Real Time Counter The Real Time Counter is a 32-bit counter providing timekeeping in all energy modes and it is capable of providing system wake-up at user defined instances. The RTCC includes 128 bytes of general purpose data retention, allowing easy and convenient data storage in all energy modes. 3.6 Low Energy Timer (LETIMER) The unique LETIMER is a 16-bit timer that is available in energy mode EM2 DeepSleep in addition to EM1 Sleep and EM0 Active. This allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be per-

formed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms with minimal software intervention. 3.7 Ultra Low Power Wake-Up Timer (CRYOTIMER) The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO) or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-

rupt periods, facilitating flexible ultra-low energy operation. 3.8 Pulse Counter (PCNT) The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. 3.9 General Purpose Input/Output (GPIO) BGM111 has 25 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The GPIO subsystem supports asynchronous external pin interrupts. When configured as GPIO output drive strength can be applied to pins on port by port basis and it can be either 1 mA or 10 mA. 3.10 Analog Comparator (ACMP) The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-

er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption is configurable by software. The ACMP can also be used to monitor the supply voltage from software. An interrupt can be generated when the supply falls below or rises above a programmable threshold. 3.11 Analog to Digital Converter (ADC) The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits up to 1 Msamples/sec. The out-

put sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple sam-

ples. The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of source, including pins configurable as either single-ended or differential. 3.12 Digital to Analog Current Converter (IDAC) The Digital to Analog Current Converter can source or sink a configurable constant current. This current can be driven on an output pin or routed to the selected ADC input pin for capacitive sensing. The current is programmable between 0.05 A and 64 A with several ranges with various step sizes. 3.13 Integrated DC-DC Converter (DC-DC) The DC-DC buck converter covers a wide range of load currents and provides high efficiency in energy modes EM0, EM1, EM2 and EM3. The converter operates in active and bypass operating modes. Bypass mode may be entered when the input voltage is too low for efficient operation of the DC-DC converter. In Bypass mode, the DC-DC input supply is internally connected directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to avoid dipping the input supply due to excessive current transients. Note:

When DC/DC is enabled, supply voltage range is 2.4V to 3.8V. When DC/DC is disabled, supply voltage range is 1.8V to 3.8V. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 4 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Antenna 4. Antenna This section contain design guidelines and recommendations for the BGM111 antenna. 4.1 PCB Design Guidelines For optimal performance of the BGM111, please follow the following guidelines:

Place the module at the edge of the PCB as shown in the the figure below. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Do not place plastic or any other dielectric material in touch with the antenna. Figure 4.1. Recommended Layout for BGM111 silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 5 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Antenna Figure 4.2. Poor Layouts for BGM111 Figure 4.3. Impact of the Size of GND Plane to the BGM111 Range 4.2 Effect of Plastic and Metal Materials Do not place plastic or any other dielectric material in touch with the antenna. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis-

tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. 4.3 Locating the Module Close to Human Body Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus reducing range. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 6 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Hardware Design Guidelines 5. Hardware Design Guidelines The BMG111 is an easy-to-use module with regard to hardware application design but certain design guidelines must be followed to guarantee optimal performance. These guidelines are listed in the next sub-sections. 5.1 Power Supply Requirements Coin cell batteries cannot withstand high peak currents (e.g. higher than 15 mA). If the peak current exceeds 15 mA its recommended to place 47 - 100 F capacitor in parallel with the coin cell battery to improve the battery life time. Notice that the total current consump-

tion of your application is a combination of the radio, peripherals and MCU current consumption so you must take all of these into ac-

count. BGM111 should be powered by a unipolar supply voltage with nominal value of 3.3 V. Operating voltage range of the module is 2.4 - 3.8 V when using the built-in DC/DC converter. External high frequency bypass capacitors are not needed because the module contains the required supply filter capacitors. However, care should be taken to prevent strong switching noise from being superimposed on the supply line. Such noise can be generated e.g. by on-board charge pump converters used in RS232 level shifters. If this type of switching noise is present, a power filter circuit on the VDD input is recommended. Note that there is a total of about 4.8 F of low ESR ceramic capacitors on the VDD line inside the module. When using low-dropout linear regulators to generate a regulated supply for the VDD line, the stability of the regulator with the low ESR provided by these capacitors should be checked. Many linear regulators and also some switched mode regulators are not stable when using ceramic output capacitors. The datasheet of the regulator typically lists recommendations concerning suitable capacitors includ-

ing data on ESR range and/or stability curves. A regulator which is stated stable with ceramic capacitors is recommended. 5.2 Power Saving Functions EM power saving modes are automatically controlled by the firmware and it always enters the lowest possible power save mode possi-

ble depending on the radio, peripheral and software activity. 5.3 Reset Functions The BGM111 can be reset by three different methods: by pulling the RESET line low, by the internal watchdog timer or software com-

mand. The reset state in BGM111 does not provide any power saving functionality and thus is not recommended as a means to con-

serve power. BGM111 has an internal system power-up reset function. The RESET pin includes an on-chip pull-up resistor and can therefore be left unconnected if no external reset switch or source is needed. 5.4 Debug and Firmware Updates This section contains information on debug and firmware update methods. 5.4.1 JTAG It is recommended to expose the JTAG debug pins in your own hardware design for firmware update and debug purposes. The follow-

ing table lists the required pins for JTAG connection. The debug pins have pull-down and pull-up enabled by default, so leaving them enabled may increase current consumption if left con-

nected to supply or ground. If enabling the JTAG pins the module must be power cycled to enable a SWD debug session. PAD NAME PAD NUMBER JTAG SIGNAL NAME COMMENTS Table 5.1. JTAG Pads PF3 PF2 PF1 PF0 24 23 22 21 5.4.2 DFU TDI TDO TMS TCK This pin is disabled after reset. Once enabled the pin has a built-in pull-up. This pin is disabled after reset Pin is enabled after reset and has a built-in pull-up Pin is enabled after reset and has a built-in pull-down It is also possible to update the firmware over UART using DFU protocol. However the bootloader cannot be updated using DFU but requires that the firmware is updated using JTAG. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 7 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Bluetooth Stack Software 6. Bluetooth Stack Software Silicon Labs Bluetooth Smart Software is a complete Bluetooth Smart software stack for the BGM111 Bluetooth Smart module. The software implements a full Bluetooth LE compatible stack and L2CAP, RFCOMM, SMP and ATT protocols along with any GATT based Bluetooth Smart profiles. The Bluetooth Smart Ready Software also is supported by a complete SDK for developing Bluetooth Smart applications using either an external host with the BGAPI serial protocol over UART or fully standalone applications based on a simple scripting language called BGScript. Several profiles and software project examples are offered as part of the Bluetooth Smart SDK to help expedite the development of Bluetooth Smart compatible end-user products. The main parts of the Bluetooth Smart software stack are shown below. Figure 6.1. Bluetooth Smart Ready Software Stack Note: To learn more about the Bluetooth Smart software stack, the SDK, and the APIs please read QSG108: Blue Gecko Bluetooth Smart Software Quick-Start Guide. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 8 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Host Interface 7. Host Interface This section contains information about the host interface available on the BGM111 module. 7.1 UART The BGM111 can be controlled over the UART interface as a peripheral to an external processor. In order for the communication to be reliable, hardware flow control signals (RTS and CTS) must be present between the host and the module. For baud rates exceeding 115200 kbps the controlling processor should have a clock frequency accurate to within 1% in order for the UART signaling to work reliably. When UART is used as a host interface (network co-processor mode) two optional I/O pins can be used either to wake-up the BGM111 from EM2 sleep mode when the host has commands or data to send or alternatively to wake-up the host when the BGM111 has events or data to the host. Default UART settings are listed below:

Table 7.1. BGM111 UART Interface Default Settings Parameter UART baud rate RTS/CTS flow control Data bits Parity Stop bits Default setting 115200 kbs Enabled 8 None 1 The figure below shows the recommended layout for connecting BGM111 with an external host. Note: A programming connector as shown in the figure below must be available in the design for BGM111 firmware update. Figure 7.1. Connecting BGM111 with an external host silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 9 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Electrical Characteristics 8. Electrical Characteristics Parameter Storage temperature VDD 5 V tolerant GPIO voltages Other terminal voltages Note:

1. 5.25 V or VDD + 2 V, whichever is less. Table 8.1. Absolute Maximum Ratings Min

-50

-0.3

-0.3

-0.3 Max 150 3.8 5.251 VDD+0.3 Table 8.2. Recommended Operating Conditions Rating Operating Temperature Range VDD (when using internal DC/DC) VDD (when DC/DC is in bypass mode) VDD (when operating ADC or DAC) Min

-40 2.4 1.8 1.8 Max 85 3.8 3.8 3.8 Unit C V V V Unit C V V V silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 10 Logic Signal Characteristics Table 8.3. I/O Terminal Electrical Characteristics Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Electrical Characteristics Typ Max Unit I/O Terminals Input voltage levels VIL input logic level low 1.7 V VDD 3.6 V VIH input logic level high 1.7 V VDD 3.6 V Output Voltage Levels VOL output logic level low, Vdd = 3.3 V, Iol

= 3 mA, weak driver VOH output logic level high Vdd = 3.3 V, Ioh = -3 mA, weak driver VOH output logic level high Vdd = 3.3 V, Ioh = 20 mA, strong driver VOH output logic level high Vdd = 3.3 V, Ioh = -20 mA, strong driver Min

-0.3 0.7 VDD 0.8 x VDD 0.8 x VDD Table 8.4. Reset Signal Characteristics Power-on Reset Power on reset threshold (rising edge) Power on reset threshold (falling edge) RESET signal pulse width (pulled low) Min 1.84 1.80 500 Typ 1.92 1.88 Table 8.5. Analog Digital Converter (ADC) Characteristics Power-on Reset ADC input impedance ADC input voltage range Resolution (Programmable) Sampling Rate Offset Error Differential nonlinearity error Integral nonlinearity error Min 0 6

-1

-3 Typ 670 1 Table 8.6. Current Digital Analog Converter (IDAC) Characteristics Power-on Reset Steps per range DAC output current range (range 0) DAC output current range (range 1) DAC output current range (range 2) Min 0.05 1.6 0.5 Typ 31 Max 1.6 4.6 16 0.3VDD VDD + 0.3 0.2 x VDD 0.2 x VDD Max 2.00 1.96 Max 2 x VREF 12 1 1 3 V V V V V V Unit V V ns Unit kohm V bits MSps LSB LSB LSB Unit A A A silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 11 Power-on Reset DAC output current range (range 3) Total error (continuous mode) Total error (duty cycle mode) Settling time to 1% (range changed) Settling time to 1% (step changed) Power Consumption Min 2

-1

-2 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Electrical Characteristics Typ Max 64 1 2 5 1 Unit A

%

%

s s Table 8.7. Typical Power Consumption of Different Operating Modes Operation State Transmit, +8 dBm, 1 Mbps Transmit, 0 dBm Receive Radio off, CPU active Radio off, CPU idle EM2 sleep mode EM3 sleep mode EM4 sleep mode Shutdown mode Full shutdown mode Operating Mode LE advertising, discoverable LE connected, master LE connected, slave Current 26.3 8.8 8.7 TBD TBD 1.4 TBD TBD TBD TBD Unit mA mA mA A/MHz A/MHz A A A A A Description Continous packet transmission (average value) Continous packet transmission (average value) Continous packet receive (average value) RTC running, full RAM retention RTC running, 128B RAM retention No RTC, no RAM retention Table 8.8. Typical Power Consumption in Practical Use Cases Current TBD TBD TBD Unit A A A silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 12 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet RF Characteristics 9. RF Characteristics Parameter Frequency Packet type LE Table 9.1. Supported Frequencies and Channels Min 2402 Table 9.2. Typical Receiver Sensitivity

-40 C TBD 20 C

-92 Max 2480 85 C TBD Table 9.3. Transmitter Output Power at Maximum Setting Modulation type LE Min

+6.5 Typ

+8 Max

+9 Unit MHz Unit dBm Unit dBm 9.1 Antenna Characteristics Parameter Efficiency Peak gain Table 9.4. BGM111 Antenna Efficiency and Peak Gain With optimal layout Note

-2 dB

+1 dBi Efficiency and peak gain depend on the application PCB layout and mechanical design silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 13 9.2 2D Radiation Pattern Plots Blue Gecko BGM111 Bluetooth Smart Module Data Sheet RF Characteristics Figure 9.1. Typical 2D Radiation Pattern Front View Figure 9.2. Typical 2D Radiation Pattern Side View silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 14 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet RF Characteristics Figure 9.3. Typical 2D Radiation Pattern Top View silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 15 10. Pinout This section contains a description of the BGM111 pin-out. Each pin may have one or more functions which are all listed in tables. The pin-out is shown in the figure below. Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Pinout Figure 10.1. BGM111 Pinout (Top View) 10.1 Power, Ground, and Reset Pins Power supply, ground, and reset signal related pins are listed in the table below. Table 10.1. Power, Ground, and Reset Pins Pad Number Function Description 29 1, 12, 20, 31 VDD GND Module power supply Ground, connected together internally but should all be connected directly to a solid ground plane with vias in close proximity to the pads, especially on the antenna end. 30 RESET Module reset signal. Pulling RESET low will reset the internal processor. This pin has an internal pull-up and can be left floating if not needed. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 16 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Pinout 10.2 GPIO Pins The 25 GPIO pins of BGM111 module are organized into ports with up to 16 pins each. These GPIO pins can individually be configured as either an output or input. More advanced configurations like open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. GPIO pins can also be overridden by peripheral pin connections like TIMER PWM outputs or USART communica-

tion, which can be routed to several locations on the device. The GPIO supports up to 16 asynchronous external pin interrupts, which enable interrupts from any pin on the device. Also, the input value of a pin can be routed through the Peripheral Reflex System to other peripherals. Except for a few special functions, the internal signal crossbar allows various peripheral functions to be assigned freely to any GPIO pad, simplifying application board layout. Table 10.2. BGM111 GPIO Assignments Related to Functionalities and Peripherals GPIO Assignments PA PB PD Comment 0 1 2 3 4 5 5 6 7 8 9 10 11 13 14 15 16 17 18 19 2 11 13 6 8 7 10 11 13 14 15 0 3 4 3 2 1 7 21 22 23 24 25 26 27 28 5 6 PC 9 PF 4 Port Name Port Pin Pad Number BOOTLOADER BOOT_RX BOOT_TX DEBUG DBG_SWCLKTCK DBG_SWDIOTMS DBG_SWO DBG_TDI DBG_TDO WAKE UP GPIO_EM4WU0 GPIO_EM4WU1 GPIO_EM4WU4 GPIO_EM4WU8 GPIO_EM4WU9 GPIO_EM4WU12 I2C I2CO_SCL I2CO_SDA USART 0 US0_CTS US0_CLK US0_RTS US0_CS US0_RX MISO US0_TX MOSI USART 1 US1_CTS US1_CLK US1_RTS US1_CS UART SPI CTS CLK RTS CS RX TX MISO MOSI UART SPI CTS CLK RTS CS silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 17 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Pinout GPIO Assignments Port Name Port Pin Pad Number US1_RX MISO US1_TX MOSI LEUART 0 LEU0_RX LEU0_TX TIMER TIM0_CC0 TIM0_CC1 TIM0_CC2 TIM0_CDTI0 TIM0_CDTI1 TIM0_CDTI2 TIM1_CC0 TIM1_CC1 TIM1_CC2 TIM1_CC3 LOW ENERGY TIMER LETIM0_OUT0 LETIM0_OUT1 ACMP0 1X 1Y 2X 2Y 3X 3Y 4X 4Y ACMP 1 1X 1Y 2X 2Y 3X PA PB PD Comment 0 1 2 3 4 5 5 6 7 8 9 10 11 13 14 15 16 17 18 19 2 11 13 6 8 7 10 11 13 14 15 0 3 4 3 2 1 7 21 22 23 24 25 26 27 28 5 6 PC 9 PF 4 RX TX MISO MOSI silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 18 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Pinout GPIO Assignments PA PB PD PC 9 0 1 2 3 4 5 5 6 7 8 9 10 11 13 14 15 16 17 18 19 2 11 13 6 8 7 10 11 13 14 15 0 3 4 3 2 1 7 21 22 23 24 25 26 27 28 5 6 PF 4 Comment END Port Name Port Pin Pad Number 3Y 4X 4Y ADC0 1X 1Y 2X 2Y 3X 3Y 4X 4Y IDAC0 1X 1Y PULSE COUNTER PCNT0_S0IN PCNT0_S1IN CLOCK MANAGEMENT CMU_CLK0 CMU_CLK1 silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 19 11. Physical Dimensions Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Physical Dimensions Figure 11.1. Module Physical Dimensions Figure 11.2. Module Recommended PCB Pad Pattern silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 20 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Physical Dimensions Figure 11.3. Module Side View Dimensions silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 21 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Soldering Recommendations 12. Soldering Recommendations The BGM111 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther-

mal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the data-

sheet of particular solder paste for profile configurations. The following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommen-

dation should be taken as a starting point guide. Refer to technical documentations of particular solder paste for profile configurations Avoid using more than one flow. Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150 m stencil thickness is recommended. Aperture size of the stencil should be 1:1 with the pad size. A low residue, no clean solder paste should be used due to low mounted height of the component. If the vias used on the application board have a diameter larger than 0.3 mm, it is recommended to mask them at the module side to prevent solder wicking through the via holes. Solders have a tendency to fill holes and leave voids in the thermal pad solder junction, as well as form solder balls on the other side of the application board which can in some cases be problematic. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 22 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Certifications 13. Certifications Note:

Some of the certifications for the BGM111 Bluetooth Smart Module are pending. 13.1 Disclaimer Bluetooth specification and CE power spectral density requirements limit the absolute maximum TXP of Bluetooth LE devices to 10 dBm in all conditions. In FCC SAR testing is not required in any end product installation if the TXP is lower than 9 mW. In order to be compliant with these regulations in all conditions, BGM111 has been certified with nominal 8 dBm TXP. Manipulation of the TXP to higher values than 8 dBm is not allowed. 13.2 Bluetooth Bluetooth qualifications for the BGM111 Bluetooth Smart Module are pending. 13.3 CE The BGM111 Bluetooth Smart Module is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive (1999/5/EC). This device is compliant with the following standards:

Safety: EN 60950 EMC: EN 301 489 Spectrum: EN 300 328 A formal DoC is available from www.silabs.com. 13.4 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the users authority to operate the equipment. FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-

ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance require-

ments required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). OEM Responsibilities to comply with FCC Regulations The BGM111 Bluetooth Smart Module has been certified for integration into products only by OEM integrators under the following con-

dition:

The antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radiator (antenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-

ance with FCC multi-transmitter product procedures. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 23 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Certifications As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note:

In the event that this condition cannot be met (for certain configurations or co-location with another transmitter), then the FCC authori-

zation is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The BGM111 Bluetooth Smart Module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQBGM111"

or

"Contains FCC ID: QOQBGM111"

The OEM integrator must not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 24 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Certifications 13.5 IC IC (English) This radio transmitter has been approved by Industry Canada to operate with the embedded chip antenna. Other antenna types are strictly prohibited for use with this device. This device complies with Industry Canadas license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. BGM111 Bluetooth Smart Module meets the given require-

ments when the minimum separation distance to human body is 15 mm. RF exposure or SAR evaluation is not required when the sepa-

ration distance is 15 mm or more. If the separation distance is less than 15 mm the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The BGM111 Bluetooth Smart Module has been certified for integration into products only by OEM integrators under the following con-

ditions:

The antenna(s) must be installed such that a minimum separation distance of 15 mm is maintained between the radiator (antenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-

sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra-

tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization. End Product Labeling The BGM111 Bluetooth Smart module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module IC: 5123A-BGM111"

or

"Contains IC: 5123A-BGM111"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. IC (Francais) Cet metteur radio (IC : 5123A-BGM111) a reu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorpore. Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil. Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes:

1. Lappareil ne doit pas produire de brouillage;

2. Lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Dclaration relative l'exposition aux radiofrquences (RF) Les limites applicables lexemption de lvaluation courante du DAS sont nonces dans le CNR 102, 5e dition. L'appareil BGM111 rpond aux exigences donnes quand la distance de sparation minimum par rapport au corps humain est infrieure ou gale 15 mm. L'valuation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de sparation est de 15 mm ou plus. Si la distance de sparation est infrieure 15 mm, il incombe l'intgrateur FEO d'valuer le DAS. Responsabilits du FEO ayant trait la conformit avec les rglements IC silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 25 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Certifications Le module BGM111 a t certifi pour une intgration dans des produits uniquement par les intgrateurs FEO dans les conditions sui-

vantes:

La ou les antennes doivent tre installes de telle faon qu'une distance de sparation minimum de 15 mm soit maintenue entre le radiateur (antenne) et toute personne tout moment. Le module metteur ne doit pas tre install au mme endroit ou fonctionner conjointement avec toute autre antenne ou metteur. Ds lors que les deux conditions ci-dessus sont respectes, d'autres tests de l'metteur ne sont pas obligatoires. Cependant, il in-

combe toujours l'intgrateur FEO de tester la conformit de son produit final vis--vis de toute exigence supplmentaire avec ce mod-

ule install (par exemple, missions de dispositifs numriques, exigences relatives aux matriels priphriques PC, etc). Note: S'il s'avre que ces conditions ne peuvent tre respectes (pour certaines configurations ou la colocation avec un autre met-

teur), alors l'autorisation IC n'est plus considre comme valide et l'identifiant IC ne peut plus tre employ sur le produit final. Dans ces circonstances, l'intgrateur FEO aura la responsabilit de rvaluer le produit final (y compris l'metteur) et d'obtenir une autorisa-

tion IC distincte. tiquetage du produit final L'tiquette du module BGM111 porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est install l'intr-

ieur d'un autre appareil, l'extrieur de l'appareil dans lequel le module est install doit aussi porter une tiquette faisant rfrence au module qu'il contient. Dans ce cas, une tiquette comportant les informations suivantes doit tre colle sur une partie visible du produit final.

"Contient le module metteur IC: 5123A-BGM111"

or

"Contient IC : 5123A-BGM111"

L'intgrateur FEO doit tre conscient de ne pas fournir d'informations l'utilisateur final permettant d'installer ou de retirer ce module RF ou de changer les paramtres lis aux RF dans le mode d'emploi du produit final. 13.6 MIC Japan The certification of BGM111 Bluetooth Smart Module in Japan is pending. Certification number: TBD. Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Figure 13.1. Text to be placed on the housing of the end-user device Translation of the text in the figure above:

This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law. 13.7 KC South-Korea The certification of BGM111 Bluetooth Smart Module in South-Korea is pending. Certification number: TBD. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 26 Blue Gecko BGM111 Bluetooth Smart Module Data Sheet Revision History 14. Revision History Revision 0.96 February 10th, 2016 Ordering information updated FCC and IC codes corrected. Revision 0.95 January 28th, 2016 Certification status updated. Current consumption figures added. New block diagram. Revision 0.94 Disclaimer section added to Certificates main section. Technical specification tables TBD values edited partially. Revision 0.93 Added a schematics to show connection principle with external host. Revision 0.92 Corrected supply voltage range. Revision 0.91 Style Changes. Revision 0.90 Preliminary. silabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 27 Table of Contents

. 4. Antenna . 1. Feature List . 2. Ordering Information . 3. Interfaces. 3.1 USART . 3.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) . 3.3 I2C . 3.4 Timer/Counter (TIMER)

. 3.5 Real Time Counter

. 3.6 Low Energy Timer (LETIMER)

. 3.7 Ultra Low Power Wake-Up Timer (CRYOTIMER) . 3.8 Pulse Counter (PCNT) . 3.9 General Purpose Input/Output (GPIO). 3.10 Analog Comparator (ACMP)

. 3.11 Analog to Digital Converter (ADC). 3.12 Digital to Analog Current Converter (IDAC)

. 3.13 Integrated DC-DC Converter (DC-DC)

. 4.1 PCB Design Guidelines

. 4.2 Effect of Plastic and Metal Materials . 4.3 Locating the Module Close to Human Body . 10.1 Power, Ground, and Reset Pins . 5. Hardware Design Guidelines . 5.1 Power Supply Requirements . 5.2 Power Saving Functions . 5.3 Reset Functions . 5.4 Debug and Firmware Updates . 5.4.1 JTAG . 5.4.2 DFU . 6. Bluetooth Stack Software. 7. Host Interface . 8. Electrical Characteristics . 9. RF Characteristics . 9.1 Antenna Characteristics

. 9.2 2D Radiation Pattern Plots

. 10. Pinout 7.1 UART

. Table of Contents

. 1

. 2

. 3

. 3

. 3

. 3

. 3

. 4

. 4

. 4

. 4

. 4

. 4

. 4

. 4

. 4

. 5

. 5

. 6

. 6

. 7

. 7

. 7

. 7

. 7

. 7

. 7

. 8

. 9

. 9 10 13

.13

.14 16

.16 28

. 10.2 GPIO Pins

. 11. Physical Dimensions . 12. Soldering Recommendations . 13. Certifications . 13.1 Disclaimer. 13.2 Bluetooth . 13.3 CE . 13.4 FCC. 13.5 IC . 13.6 MIC Japan

. 13.7 KC South-Korea. 14. Revision History. 17 20 22 23

.23

.23

.23

.23

.25

.26

.26 27 Table of Contents 29 http://www.silabs.comSilicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USASmart.Connected.Energy-FriendlyProductswww.silabs.com/productsQualitywww.silabs.com/qualitySupport and Communitycommunity.silabs.comDisclaimerSilicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are not designed or authorized for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, Clockbuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress and others are trademarks or registered trademarks of Silicon Laborato-ries Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.