| submitted | available | document details (if available) | source link |
|---|---|---|---|
| July 11 2019 | July 11 2019 | Adobe Acrobat Pro DC 15.6.30499 |
| various | User manual - v1 | Users Manual | 2.05 MiB | July 11 2019 |
WGM160P Wi-Fi Module Data Sheet The WGM160P is an ultra low power standalone Wi-Fi module targeted for applications requiring superior RF performance in noisy environments, low power consumption, high security, integrated customer applications and fast time to market. The WGM160P module integrates all of the necessary elements required for a cloud connected IoT Wi-Fi application, including 802.11b/g/n radio, integrated chip antenna, certifications, microcontroller, Wi-Fi and IP stacks, HTTP server, and multiple protocols, such as TCP and UDP. Co-existence with external 2.4GHz transceivers is supported. WGM160P can be configured to concurrently act as a Wi-Fi client and a Wi-Fi access point, which is ideal for user friendly device provisioning. WGM160P can natively host C-
applications, removing the need for an external host controller. Alternatively, the Wi-Fi Module can run in Network Co-Processor (NCP) mode, leaving the complexity of TCP/IP networking to the module so that the customers own host controller can be fully dedica-
ted to processing the customer application tasks. The WGM160P module has highly flexible host and peripheral hardware interfaces for wide application use. This module also supports Gecko OS, a comprehensive software suite designed to sim-
plify your Wi-Fi, application, device management and cloud connectivity development process. KEY POINTS Available with integrated chip antenna or an RF pin Antenna diversity supported via secondary RF pin IEEE 802.11 b/g/n compliant TX power: +16 dBm RX sensitivity: -95.5 dBm CPU core: 32-bit ARM Cortex-M4 Flash memory: 2 MB RAM: 512 kB Concurrent mode: Wi-Fi AP and STA Ultra low power consumption Wi-Fi Alliance certified (pending) Modular certification CE, FCC, ISED Japan, KC (pending) End-to-end security Built-in 10/100 Ethernet Support Gecko OS support Size: 23.8 mm x 14.2 mm x 2.3 mm Certified Module Core / Memory Antenna Matching Radio XTAL Wi-Fi Radio 2.4 GHz Transceiver 802.11 b/g/n MODEM Diversity Input PTA support ARM CortexTM M4 processor with FPU and MPU Flash Program Memory RAM Memory ETM Debug Interface LDMA Controller Serial Interfaces USART UART 10/100 Ethernet Quad-SPI CAN LEUSB
(crystal free) Low Energy UARTTM I2C Clock Management High Frequency Crystal Oscillator High Frequency RC Oscillator PLL Universal HF RC Oscillator Auxiliary High Freq. RC Osc. Ultra Low Freq. RC Oscillator Low Frequency XTAL + Oscillator Low Frequency RC Oscillator 32-bit bus Peripheral Reflex System Energy Management Voltage Regulator Monitor Voltage/Temp Other CRYPTO CRC DC-DC Converter Brown-Out Detector Power-On Reset True Random Number Generator Backup Domain SMU I/O Ports External Interrupts General Purpose I/O Pin Reset Pin Wakeup Timers and Triggers Timer/Counter Low Energy Sensor IF Low Energy Timer Real Time Counter Pulse Counter Watchdog Timer Real Time Counter and Calendar CRYOTIMER Analog Interfaces Low Energy LCD Controller VDAC Analog Comparator Capacitive Sensing ADC Operational Amplifier IDAC Lowest power mode with peripheral operational:
EM0 - Active EM1 - Sleep EM2 Deep Sleep EM3 - Stop EM4H - Hibernate EM4S - Shutoff silabs.com | Building a more connected world. This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Preliminary Rev. 0.5 WGM160P Wi-Fi Module Data Sheet Key Features 1. Key Features The key features of the WGM160P module are listed below. Radio Features Built-in Antenna (optional) TX Power: +16 dBm RX Sensitivity: -95.5 dBm Superior blocking performance Wi-Fi Features 802.11: b/g/n Bit rate: up to 72.2 Mbps 802.11 Security: WPA2/WPA Personal STA (Station Mode) SoftAP (Soft Access Point Mode) Electrical Characteristics Supply voltage: 3.0V to 3.6V Environmental Specifications Temperature range: -40C to +85C Modular Certification Wi-Fi Alliance CE, FCC, ISED, KC (pending), Japan (pending) RoHS/REACH compliant Dimensions L x W x H: 23.8 mm x 14.2 mm x 2.3 mm MCU Features ARM Cortex-M4, 72MHz 512 kB RAM 2 MB Flash Hardware Interfaces Host interface: UART/SPI/USB Peripheral interfaces 2 x USART (UART/SPI/I2S) QSPI with Execute In Place (XIP) support SD Card support (SPI) Capacitive Touch Sensing in all GPIOs LESENSE 10/100 Ethernet MAC with RMII interface USB device (2.0 Full speed) I2C peripheral interfaces CAN Up to 31 x GPIO with interrupts 2 x 12-bit ADC 2 x 12-bit DAC Rich selection of timers, inc. Real-time counters Co-existence interface (PTA: 2, 3, 4 wire) silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 2 2. Ordering Information Table 2.1. Ordering Information WGM160P Wi-Fi Module Data Sheet Ordering Information Part Number Protocol WGM160PX22KGA2 Wi-Fi (802.11 b/g/n) Max TX Power 16 dBm Flash/Ram
(kB) 2048 / 512 Included WGM160PX22KGA2R Wi-Fi (802.11 b/g/n) 16 dBm 2048 / 512 Included WGM160P022KGA2 Wi-Fi (802.11 b/g/n) 16 dBm 2048 / 512 WGM160P022KGA2R Wi-Fi (802.11 b/g/n) 16 dBm 2048 / 512 None None Built-in Built-in Built-in Built-in Up to 31 Cut Tape Up to 31 Reel Up to 31 Cut Tape Up to 31 Reel LF XTAL Antenna GPIO Carrier WGM160PX22KGN2 Wi-Fi (802.11 b/g/n) 16 dBm 2048 / 512 Included External (RF Pin) Up to 31 Cut Tape WGM160PX22KGN2R Wi-Fi (802.11 b/g/n) 16 dBm 2048 / 512 Included External (RF Pin) Up to 31 Reel WGM160P022KGN2 Wi-Fi (802.11 b/g/n) 16 dBm 2048 / 512 WGM160P022KGN2R Wi-Fi (802.11 b/g/n) 16 dBm 2048 / 512 None None External (RF Pin) Up to 31 Cut Tape External (RF Pin) Up to 31 Reel Note:
1. WGM160P modules come pre-programmed with the Gecko OS Kernel. Devices ship with the debug interface locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials. 2. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-
ules. 3. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the full orderable part number throughout this document. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 3
. 4. Electrical Specifications . Table of Contents
. 1. Key Features . 2. Ordering Information . 3. System Overview . 3.1 Introduction . 3.2 Wi-Fi Supported 2.4 GHz ISM Modulations, BW, and Channels
. 4.1 Absolute Maximum Ratings. 4.2 Operating Conditions . 4.3 Power Consumption . 4.4 Digital I/O Specifications. 4.5 RF Transmitter General Characteristics
. 4.6 RF Receiver General Characteristics
. 4.7 Radiated Characteristics. 4.8 Microcontroller Peripherals . 5. Typical Applications and Connections . 5.2 Multi-Protocol Coexistence . 5.3 Example Schematic . 5.1.1 Antenna Ports . 5.1.2 Antenna Diversity
. 5.1 RF Connections
. 6. Gecko OS Features . 7. Pin Descriptions
. 7.1 WGM160P Device Pinout
. 7.2 GPIO Functionality
. 7.3 Alternate Pin Functionality . 8.1 Package Outline . 8.2 Recommended PCB Land Patterns . 8.3 Package Marking . 8. Package Specifications
. 9. Soldering Recommendations 10. Tape and Reel Dimensions . 11. Certifications . 11.1 Qualified External Antenna Types . 11.2 CE . 2
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. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 4
. 11.3 FCC . 11.4 ISED Canada . 11.5 Locating the Module Close to Human Body . 12. Revision History. 39
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.42 43 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 5 WGM160P Wi-Fi Module Data Sheet System Overview 3. System Overview 3.1 Introduction The WGM160P module combines the WF200 Wi-Fi transceiver with an EFM32GG11 microcontroller to deliver a complete and certified standalone Wi-Fi solution, with the ability to run customer application on an Cortex M4 processor. This device supports Gecko OS, a comprehensive software solution that simplifies the Wi-Fi , application and cloud connectivity devel-
opment process to reduce time to market. For more details on the software platform, please consult our online documentation. VBAT 3.0 3.6V 1.8V 4.7 H External Antenna VDDPA VDDIO Chip Antenna WF200 WiFi NCP 802.11 B/G/N RF1 RF2 HFXO RF XTAL 38.4M VDDRF VDDDIG RESETN WUP HIF LP_CLK WIRQ PTA DVDD VREGSW VREGVDD AVDD IOVDD RESETb WUP SDIO 32.768 kHz WIRQ GPIO GPIO SDIO GPIO GPIO USB 2.0 ADC DAC GPIO USART QSPI ETH RMII EFM32GG11 MCU Host LFXO HFRCO HFXO LF XTAL 32.768K Figure 3.1. WGM160P Block Diagram 3.2 Wi-Fi Supported 2.4 GHz ISM Modulations, BW, and Channels Table 3.1. Supported Wi-Fi Modulations, BW, and Channels Parameter Channel Center Frequency Channel Bandwidth Symbol CHAN BW Test Condition Subject to Regulatory Agency Min 2412 Typ 2437 20 Max 2484 Unit MHz MHz silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 6 WGM160P Wi-Fi Module Data Sheet Electrical Specifications 4. Electrical Specifications All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
Typical values are based on TAMB = 25 C; VVBAT = 3.3V; Center Frequency = 2,437 MHz. Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-
er-specific external RF impedance-matching networks for interfacing to a 50 antenna port. Conducted RF measurements include additional output power reductions to guarantee WiFi and regulatory emissions compliance while connected to the specified anten-
nas which have non-ideal impedance loading. Refer to Section 4.2 Operating Conditions for more details about operational supply and temperature limits. 4.1 Absolute Maximum Ratings Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-
bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Parameter Storage temperature RF power level at RF1 and RF2 ports Symbol TSTG PRFMAX Maximum supply voltage to VBAT VBATMAX DC voltage on I/O pins VGMAX Current into any GPIO pin Sum of current into all GPIO pins IOMAX IOALLMAX Range of load impedance at RF1 and RF2 pins during TX LOADTX Note:
Table 4.1. Absolute Maximum Ratings Test Condition Max power that can be applied to input of recommended matching network connected to RF1 and RF2 pins. 5 V tolerant GPIO (PF0, PF1, PF10, PF11)1 2 All other GPIO and PTA pins Min
-40
-0.3
-0.3
-0.3 Typ Max 105 10 3.6 Min of 5.25 and VBAT
+2 VBAT + 0.3 20 150 Unit C dBm V V V mA mA 10:1 VSWR 1. When a GPIO is used for analog functions via the APORT, the maximum voltage is VBAT. 2. To operate above the VBAT supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register. Pins with over-voltage tolerance disabled have the same limits as all other GPIO (max = VBAT + 0.3 V). silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 7 WGM160P Wi-Fi Module Data Sheet Electrical Specifications 4.2 Operating Conditions Table 4.2. Recommended Operating Conditions Test Condition Parameter Ambient operating tempera-
ture Nominal supply voltage to VBAT1 Note:
Symbol TAOP VVBAT Min
-40 3.0 Typ 3.3 Max 85 3.6 Unit C V 1. Operating outside of the recommended voltage supply range is not supported. The module may disable WiFi transmit functions when operating outside of this range in order to guarantee regulatory emissions compliance. 4.3 Power Consumption All currents measured with VBAT = 3.3 V. Parameter Continuous TX current, 1 Mbps, max power setting Continuous TX current, MCS7, max power setting Continuous RX listen current Continuous RX receive cur-
rent, 1 Mbps Continuous RX receive cur-
rent, MCS7 Symbol ITXMAX ITXMAX_N IRXMAX IRXMAXR IRXMAXR_N Standby mode current ISTANDBY Table 4.3. Power Consumption Test Condition No memory retained. WF200 in Shutdown mode, EFM32GG11 in EM4 mode. Min Typ 141.3 131.4 36.6 34.5 38.5 638 Max Unit mA mA mA mA mA nA silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 8 4.4 Digital I/O Specifications Parameter Voltage input high (relative to VBAT) Symbol VIH Voltage input low (relative to VBAT) Logic low output voltage (rel-
ative to VBAT) Logic high output voltage
(relative to VBAT) VIL VOL VOH Input leakage current ILeak Pullup resistance Pulldown resistance Output fall time from VOH to VOL RPU RPD TOF Output rise time from VOL to VOH TOR Required external series re-
sistor on USB D+ and D-
RUSB WGM160P Wi-Fi Module Data Sheet Electrical Specifications Table 4.4. Digital I/O Specifications Test Condition Min 70 Typ Max Unit
%
PTA Pins, Sinking 5 mA GPIO Pins, Sinking 20 mA, DRIV-
ESTRENGTH = STRONG PTA Pins, Sourcing 5 mA GPIO Pins, Sourcing 20 mA, DRIVESTRENGTH = STRONG All I/O when GPIO voltage VBAT 5 V Tolerant I/O (PF0, PF1, PF10, PF11) when VBAT < GPIO volt-
age VBAT + 2 V 50 pF load, DRIVESTRENGTH =
STRONG, SLEWRATE = 0x6 50 pF load, DRIVESTRENGTH =
WEAK, SLEWRATE = 0x6 50 pF load, DRIVESTRENGTH =
STRONG, SLEWRATE = 0x6 50 pF load, DRIVESTRENGTH =
WEAK, SLEWRATE = 0x6 80 80 30 30 1 3.3 40 40 1.8 4.5 2.2 7.4 33 +/-10%
30 25 20 15 65 65
%
%
%
%
%
nA A k k ns ns ns ns silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 9 WGM160P Wi-Fi Module Data Sheet Electrical Specifications 4.5 RF Transmitter General Characteristics Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 C, VBAT = 3.3 V, center frequency = 2,437 MHz, and measured in 50 test equipment attached at antenna port. Measurements for this specification are made at the 50 Antenna Port. See Section 5.1.1 Antenna Ports. Conducted RF measure-
ments include additional output power reductions to guarantee WiFi and regulatory emissions compliance while connected to the speci-
fied antennas which have non-ideal impedance loading. Table 4.5. RF Transmitter Characteristics Test Condition 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 Across temperature VBAT = 3.0-3.6 V Parameter Maximum RMS Output Pow-
er at Antenna (High Power PA)1 2 Symbol POUTMAX_RMS_ HPPA Carrier frequency error POUT variation over supply voltage range, relative to nominal 3.3 V POUT variation over fre-
quency range, relative to average2 POUT variation over temper-
ature range, relative to 25C Note:
CARRFREQ_ER-
ROR POUTVAR_V POUTVAR_F CH1 to CH14 POUTVAR_T
-40 to +85C Min
-25 Typ 16.1 15.1 14.7 9.1 14.4 5.8
+0.3 / -1.1
+/-0.15
+0.1 / -1.2 Max 25 Unit dBm dBm dBm dBm dBm dBm ppm dB dB dB 1. VBAT should be at least 3.0 V to achieve the rated RF transmitter output power levels. 2. Rated power levels may not apply to the edge channels, which may need additional backoff for FCC compliance. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 10 WGM160P Wi-Fi Module Data Sheet Electrical Specifications 4.6 RF Receiver General Characteristics Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 C, VBAT = 3.3 V, center frequency = 2,437 MHz, and measured in 50 test equipment attached at antenna port. Measurements for this specification are made at the 50 Antenna Port. See Section 5.1.1 Antenna Ports. Table 4.6. RF Receiver Characteristics Parameter RX Sensitivity for 8% FER
(1024 Octet)1 Symbol SENSB RX Sensitivity for 10% PER
(1024 Octet)1 SENSG RX Sensitivity for 10% PER
(4096 Octet)1 SENSEN RX Max Strong Signal for 8% FER (1024 Octet) RXSAT_B RX Max Strong Signal for 10% PER (1024 Octet) RXSAT_G RX Max Strong Signal for 10% PER (4096 Octet) RXSAT_N Test Condition 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 Sensitivity variation across frequency range, CH1 to CH14 Sensitivity variation over temperature range, -40 to 85C RX Channel power Indicator Step Size Note:
SENSVAR_V 802.11b 1 Mbps SENSVAR_TEMP 802.11b 1 Mbps RCPISTEP 802.11b: 1 Mbps Min Typ
-95.5
-88.3
-89
-75.2
-89.3
-72.8
-4.0
-10.0
-9.0
-9.0
-9.0
-9.0
+/-0.5
+/-1.3 0.5 Max Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dB dB dBm 1. Conducted measurement made on typical application board with U.Fl connector. Includes 0.5 dB loss introduced by connector. 4.7 Radiated Characteristics Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 C, VBAT = 3.3 V, center frequency = 2437 MHz, using the integrated antenna, and measured with a typical application board size for 2.4 GHz radiation. Table 4.7. Radiated Characteristics Parameter Application board size, radi-
ated edge "X" dimension1 Antenna Efficiency Note:
Symbol PCBX_MM Test Condition ANTEFF Optimal application board design Min 40 Typ 50
-1.4 Max Unit mm dB 1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 11 WGM160P Wi-Fi Module Data Sheet Electrical Specifications 4.8 Microcontroller Peripherals WGM160P offers an extensive list of peripherals, some of which are listed below:
12-bit ADC 12-bit DAC GPIO USART (UART/SPI/I2S) QSPI with Execute In Place (XIP) support Capacitive Touch Sensing in all GPIOs LESENSE 10/100 Ethernet MAC with RMII interface (50 MHz external crystal required) USB device (2.0 Full speed) I2C peripheral interfaces CAN Timers LCD Driver For more information on the pins these peripherals are availabile on, please consult: 7.2 GPIO Functionality and 7.3 Alternate Pin Func-
tionality. For details on the electrical performance of these peripherals, please consult the relevant portions of Section 4 in the EFM32GG11 Family Datasheet (See EFM32GG11B820F2048GM64) . silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 12 WGM160P Wi-Fi Module Data Sheet Typical Applications and Connections 5. Typical Applications and Connections For more information, see UG384: WGM160P Hardware Design Users Guide. 5.1 RF Connections 5.1.1 Antenna Ports The WGM160P offers two RF ports that support antenna diversity using an internal switch. In applications with only one antenna, the unused port should be terminated to ground with a 47-51 resistor. Leaving the unused port floating or tying directly to ground will result in degraded performance. An external antenna connected to either RF port needs to be properly matched with at least -10dB return loss (VSWR < 2). 5.1.2 Antenna Diversity In applications where multipath fading is a potential issue, such as indoors, a second antenna can be connected. A firmware feature can be enabled to automatically determine which of the two antennas gives a better signal, allowing significant improvement in link reli-
ability. 5.2 Multi-Protocol Coexistence Packet Transmit Arbitration (PTA) pins are provide to share antenna and optimize coexistence performance with other networks includ-
ing other protocols. See Application Notes AN1128: Bluetooth Coexistence with Wi-Fi and AN1017: Zigbee and Thread Coexistence with Wi-Fi for more information. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 13 5.3 Example Schematic Note: RF1 pin connected internally to module antenna in WGM160PX22KGAx. WGM160P Wi-Fi Module Data Sheet Typical Applications and Connections Figure 5.1. Example Schematic for NCP Application silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 14 6. Gecko OS Features The Gecko OS software supplied with the WGM160P provides a wide range of features beyond the underlying hardware, and supports application development via its command API. WGM160P Wi-Fi Module Data Sheet Gecko OS Features For complete documentation of Gecko OS, see https://docs.silabs.com/gecko-os/. Software APIs Gecko OS Command API Gecko OS Native C API Peripherals and Sensors Interfaces Serial (UART, remote terminal) SoftAP and WLAN client (concurrent) I2C master SPI master Servers TCP/TLS, UDP, HTTP(S), DHCP, DNS HTTP(S) Server with RESTful API and Websockets Clients TCP/TLS, UDP, NTP, Secure-SMTP, DHCP, DNS HTTP(S) client Websocket client Setup Multiple Wi-Fi setup options, including via serial command and Web setup with SoftAP GPIOs for control, indication and monitoring I2C-master API for interfacing to external peripherals SPI-master API for interfacing to external peripherals Automated broadcast and streaming of sensor data Local caching of sensor data Update and Recovery Wireless OTA (Over-the-Air) update to remote manage firm-
ware using the Zentri DMS (Device Management Service) System Management System configuration and monitoring via setting and getting a wide range of variables Configurable power states Sleep/wake timers File System Read/write file system with appendable log files Storage of large files Optional additional bulk serial flash HTTP download to file system, HTTP upload from file system silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 15 7. Pin Descriptions 7.1 WGM160P Device Pinout WGM160P Wi-Fi Module Data Sheet Pin Descriptions Figure 7.1. WGM160P Device Pinout The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-
ported features for each GPIO pin, see 7.2 GPIO Functionality or 7.3 Alternate Pin Functionality. Table 7.1. WGM160P Device Pinout Pin Name Pin(s) Description Pin Name Pin(s) Description ANT_GND 1 2 54 55 Antenna ground. RF2 3 External antenna connection for diversi-
ty antenna. Terminate to ground with 47-51 Ohms if not connected to an an-
tenna. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 16 Pin Name Pin(s) Description Pin Name Pin(s) Description WGM160P Wi-Fi Module Data Sheet Pin Descriptions 4 8 9 10 11 23 27 30 33 43 52 6 12 14 16 18 20 22 25 28 31 34 36 38 40 42 45 47 49 51 GND PTA_TX_CO NF PTA_FREQ PE14 PA0 PA2 PA4 PB3 PB5 PB13 PB11 RESETn PD8 PF5 VBUS PF11 PF1 PE6 PC4 PA15 Ground. Connect all ground pins to ground plane. VBAT 5 Module power supply PTA TX_CONF pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. PTA FREQ pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. PTA_RF_AC T PTA_STA-
TUS GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO PE15 PA1 PA3 PA5 PB4 PB6 PB14 PB12 PTA RF_ACT pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. PTA STATUS pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO 7 13 15 17 19 21 24 26 29 32 Reset input, active low. This pin is inter-
nally pulled up to VBAT. To apply an external reset source to this pin, it is re-
quired to only drive this pin low during reset, and let the internal pull-up ensure that reset is released. GPIO GPIO USB VBUS signal and auxiliary input to 5 V regulator. May be left disconnected if USB is unused. GPIO (5V) GPIO (5V) GPIO GPIO GPIO PD6 35 GPIO PF2 PC5 PF10 PF0 PE7 PE5 PA6 RF1 37 39 41 44 46 48 50 53 GPIO GPIO GPIO (5V) GPIO (5V) GPIO GPIO GPIO External antenna connection on WGM160P22N. Not connected on WGM160P22A. Note:
1. GPIO with 5V tolerance are indicated by (5V). silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 17 7.2 GPIO Functionality A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of each GPIO pin, followed by the functionality available on that pin. Refer to 7.3 Alternate Pin Functionality for a list of GPIO locations available for each function. Full peripheral features and flexibility are not supported with all software architectures. In particular, some restrictions apply when using Gecko OS. Refer to UG384 WGM160P Hardware Design Users Guide for more details. WGM160P Wi-Fi Module Data Sheet Pin Descriptions GPIO Name PA0 PA1 PA2 PA3 PA4 PA5 Table 7.2. GPIO Functionality Table Pin Alternate Functionality / Description Communication ETH_RMIITXEN Timers TIM0_CC0 #0 TIM0_CC1 #7 TIM3_CC0 #4 PCNT0_S0IN #4 TIM0_CC0 #7 TIM0_CC1 #0 TIM3_CC1 #4 PCNT0_S1IN #4 TIM0_CC2 #0 TIM3_CC2 #4 TIM0_CDTI0 TIM3_CC0 #5 TIM0_CDTI1 TIM3_CC1 #5 TIM0_CDTI2 #0 TIM3_CC2 #5 PCNT1_S0IN #0 US1_RX #5 US3_TX #0 QSPI0_CS0 LEU0_RX #4 I2C0_SDA #0 ETH_RMIIRXD1 US3_RX #0 QSPI0_CS1 I2C0_SCL #0 ETH_RMIIRXD0 US1_RX #6 US3_CLK QSPI0_DQ0 ETH_RMIIREFCLK US3_CS U0_TX #2 QSPI0_DQ1 ETH_RMIICRSDV US3_CTS #0 U0_RX #2 QSPI0_DQ2 ETH_RMIIRXER US3_RTS U0_CTS QSPI0_DQ3 LEU1_TX #1 Analog BUSBY BUSAX LCD_SEG13 BUSAY BUSBX LCD_SEG14 BUSBY BUSAX LCD_SEG15 BUSAY BUSBX LCD_SEG16 BUSBY BUSAX LCD_SEG17 BUSAY BUSBX LCD_SEG18 Other CMU_CLK2 #0 PRS_CH0 #0 PRS_CH3 GPIO_EM4WU0 CMU_CLK1 #0 PRS_CH1 CMU_CLK0 #0 PRS_CH8 ETM_TD0 #3 CMU_CLK2 #1 CMU_CLKI0 #1 CMU_CLK2 #4 LES_ALTEX2 PRS_CH9 ETM_TD1 LES_ALTEX3 PRS_CH16 #0 ETM_TD2 #3 LES_ALTEX4 PRS_CH17 #0 ACMP1_O #7 ETM_TD3 #3 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 18 GPIO Name PA6 PA15 PB3 PB4 PB5 PB6 PB11 PB12 Analog BUSBY BUSAX LCD_SEG19 BUSAY BUSBX LCD_SEG12 BUSAY BUSBX LCD_SEG20 /
LCD_COM4 BUSBY BUSAX LCD_SEG21 /
LCD_COM5 BUSAY BUSBX LCD_SEG22 /
LCD_COM6 BUSBY BUSAX LCD_SEG23 /
LCD_COM7 BUSAY BUSBX VDAC0_OUT0 /
OPA0_OUT IDAC0_OUT BUSBY BUSAX VDAC0_OUT1 /
OPA1_OUT WGM160P Wi-Fi Module Data Sheet Pin Descriptions Pin Alternate Functionality / Description Communication Timers TIM3_CC0 #6 WTIM0_CC0 #1 LETIM1_OUT1 #0 PCNT1_S1IN #0 TIM3_CC2 #0 TIM1_CC3 #2 WTIM0_CC0 #6 PCNT1_S0IN #1 WTIM0_CC1 #6 PCNT1_S1IN #1 WTIM0_CC2 #6 LETIM1_OUT0 PCNT0_S0IN #6 TIM0_CC0 #3 TIM2_CC0 #4 WTIM3_CC0 LETIM1_OUT1 #4 PCNT0_S1IN #6 TIM0_CDTI2 #4 TIM1_CC2 WTIM2_CC2 LETIM0_OUT0 #1 PCNT0_S1IN #7 PCNT1_S0IN #6 TIM1_CC3 #3 WTIM2_CC0 LETIM0_OUT1 #1 PCNT0_S0IN #7 PCNT1_S1IN #6 ETH_MDC #3 U0_RTS #2 LEU1_RX #1 ETH_MDIO #3 US2_CLK #3 ETH_MDIO #0 US2_TX #1 US3_TX #2 QSPI0_DQ4 ETH_MDC #0 US2_RX #1 QSPI0_DQ5 LEU1_TX #4 ETH_TSUEXTCLK US0_RTS #4 US2_CLK #1 QSPI0_DQ6 LEU1_RX #4 ETH_TSUTMRTOG US0_CTS #4 US2_CS #1 QSPI0_DQ7 US0_CTS #5 US1_CLK #5 US2_CS #3 U1_CTS #2 I2C1_SDA #1 US2_CTS #1 U1_RTS #2 I2C1_SCL #1 Other PRS_CH6 #0 ACMP0_O #4 ETM_TCLK GPIO_EM4WU1 PRS_CH15 #0 PRS_CH19 #0 ACMP0_O #7 PRS_CH20 PRS_CH21 #0 PRS_CH12 #1 CMU_CLK1 #5 CMU_CLKI0 #7 PRS_CH21 #2 ACMP0_O #3 GPIO_EM4WU7 PRS_CH16 #1 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 19 WGM160P Wi-Fi Module Data Sheet Pin Descriptions GPIO Name PB13 PB14 PC4 PC5 PD6 Analog BUSAY BUSBX HFXTAL_P BUSBY BUSAX HFXTAL_N BUSACMP0Y BUSACMP0X OPA0_P BUSACMP0Y BUSACMP0X OPA0_N BUSADC0Y BUSADC0X ADC0_EXTP VDAC0_EXT ADC1_EXTP OPA1_P Pin Alternate Functionality / Description Communication Timers TIM6_CC0 WTIM1_CC0 #0 PCNT2_S0IN #2 TIM6_CC1 WTIM1_CC1 PCNT2_S1IN #2 TIM0_CC0 #5 TIM0_CDTI2 #3 TIM2_CC2 LETIM0_OUT0 #3 PCNT1_S0IN #3 TIM0_CC1 #5 LETIM0_OUT1 #3 PCNT1_S1IN #3 TIM1_CC0 #4 TIM6_CC2 WTIM0_CDTI2 WTIM1_CC0 #2 LETIM0_OUT0 #0 PCNT0_S0IN #3 US0_CLK #4 US1_CTS LEU0_TX #1 US0_CS US1_RTS LEU0_RX #1 US2_CLK #0 U0_TX #4 U1_CTS #4 I2C1_SDA #0 US2_CS #0 U0_RX #4 U1_RTS #4 I2C1_SCL #0 US0_RTS #5 US1_RX #2 US2_CTS #5 US3_CTS #2 U0_RTS #5 I2C0_SDA #1 PD8 BU_VIN WTIM1_CC2 #2 US2_RTS PE5 PE6 BUSCY BUSDX LCD_COM1 BUSDY BUSCX LCD_COM2 TIM3_CC0 #3 TIM3_CC2 #2 TIM5_CC1 #0 TIM6_CDTI1 WTIM0_CC1 #0 WTIM1_CC2 #4 TIM3_CC1 #3 TIM5_CC2 #0 TIM6_CDTI2 WTIM0_CC2 #0 WTIM1_CC3 US0_CLK #1 US1_CLK #6 US3_CTS #1 U1_RTS #3 I2C0_SCL #7 US0_RX US3_TX #1 Other CMU_CLKI0 #3 PRS_CH7 #0 PRS_CH6 #1 LES_CH4 PRS_CH18 GPIO_EM4WU6 LES_CH5 PRS_CH19 #2 CMU_CLK2 #2 LES_ALTEX0 PRS_CH5 ACMP0_O #2 ETM_TD0 #0 CMU_CLK1 #1 PRS_CH12 #2 ACMP2_O PRS_CH17 #2 PRS_CH6 #2 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 20 GPIO Name PE7 PE14 PE15 PF0 PF1 PF2 PF5 PF10 PF11 WGM160P Wi-Fi Module Data Sheet Pin Descriptions Pin Alternate Functionality / Description Communication Timers Other PRS_CH7 #2 PRS_CH13 ETM_TD2 #4 PRS_CH14 ETM_TD3 #4 PRS_CH15 #2 ACMP3_O DBG_SWCLKTCK BOOT_TX PRS_CH4 DBG_SWDIOTMS GPIO_EM4WU3 BOOT_RX CMU_CLK0 #4 PRS_CH0 #3 ACMP1_O #0 DBG_TDO DBG_SWO GPIO_EM4WU4 PRS_CH2 DBG_TDI Analog BUSCY BUSDX TIM3_CC2 #3 TIM5_CC0 LCD_COM3 WTIM1_CC0 #5 BUSDY BUSCX LCD_SEG10 BUSCY BUSDX LCD_SEG11 BUSDY BUSCX BUSCY BUSDX BUSDY BUSCX LCD_SEG0 BUSCY BUSDX LCD_SEG3 BUSDY BUSCX BUSCY BUSDX TIM2_CDTI1 TIM3_CC0 #0 TIM2_CDTI2 TIM3_CC1 #0 TIM0_CC0 #4 WTIM0_CC1 #4 LETIM0_OUT0 #2 TIM0_CC1 #4 WTIM0_CC2 #4 LETIM0_OUT1 #2 TIM0_CC2 #4 TIM1_CC0 #5 TIM2_CC0 #3 TIM0_CDTI2 #2 TIM1_CC3 #6 TIM4_CC0 TIM5_CC1 #6 WTIM3_CC1 PCNT2_S0IN #3 TIM5_CC2 #6 WTIM3_CC2 PCNT2_S1IN #3 US0_TX US3_RX #1 ETH_RMIITXD1 US0_CTS #0 QSPI0_SCLK LEU0_TX #2 ETH_RMIITXD0 US0_RTS #0 QSPI0_DQS LEU0_RX #2 US2_TX #5 CAN0_RX US1_CLK #2 LEU0_TX #3 I2C0_SDA #5 US2_RX #5 US1_CS U0_TX #5 LEU0_RX #3 I2C0_SCL #5 US2_CLK #5 CAN0_TX US1_TX U0_RX #5 LEU0_TX #4 I2C1_SCL #4 US2_CS #5 I2C2_SCL #0 USB_VBUSEN U1_TX I2C2_SDA USB_DM U1_RX I2C2_SCL #2 USB_DP silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 21 WGM160P Wi-Fi Module Data Sheet Pin Descriptions 7.3 Alternate Pin Functionality A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter-
nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings and the associated GPIO pin. Refer to 7.2 GPIO Functionality for a list of functions available on each GPIO pin. Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout is shown in the column corresponding to LOCATION 0. Alternate Functionality ACMP0_O ACMP1_O ACMP2_O ACMP3_O ADC0_EXTP ADC1_EXTP BOOT_RX BOOT_TX BU_VIN CAN0_RX CAN0_TX CMU_CLK0 CMU_CLK1 CMU_CLK2 CMU_CLKI0 DBG_SWCLKTCK DBG_SWDIOTMS DBG_SWO Table 7.3. Alternate Functionality Overview LOCATION 0 - 3 2: PD6 3: PB11 0: PF2 0: PD8 0: PF0 0: PD6 0: PD6 0: PF1 0: PF0 0: PD8 1: PF0 1: PF2 0: PA2 0: PA1 1: PD8 0: PA0 1: PA3 2: PD6 1: PA3 3: PB13 0: PF0 0: PF1 0: PF2 4 - 7 4: PA6 7: PB3 7: PA5 Description Analog comparator ACMP0, digital output. Analog comparator ACMP1, digital output. Analog comparator ACMP2, digital output. Analog comparator ACMP3, digital output. Analog to digital converter ADC0 external reference input positive pin. Analog to digital converter ADC1 external reference input positive pin. Bootloader RX. Bootloader TX. Battery input for Backup Power Domain. CAN0 RX. CAN0 TX. 4: PF2 Clock Management Unit, clock output number 0. 5: PB11 4: PA3 7: PB11 Clock Management Unit, clock output number 1. Clock Management Unit, clock output number 2. Clock Management Unit, clock input number 0. Debug-interface Serial Wire clock input and JTAG Test Clock. Note that this function is enabled to the pin out of reset, and has a built-in pull down. Debug-interface Serial Wire data input / output and JTAG Test Mode Select. Note that this function is enabled to the pin out of reset, and has a built-in pull up. Debug-interface Serial Wire viewer Output. Note that this function is not enabled after reset, and must be enabled by software to be used. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 22 WGM160P Wi-Fi Module Data Sheet Pin Descriptions LOCATION 0 - 3 0: PF5 4 - 7 Debug-interface JTAG Test Data In. Description Note that this function becomes available after the first valid JTAG command is re-
ceived, and has a built-in pull up when JTAG is active. 0: PF2 Debug-interface JTAG Test Data Out. Note that this function becomes available after the first valid JTAG command is re-
ceived. Alternate Functionality DBG_TDI DBG_TDO ETH_MDC ETH_MDIO 0: PB4 3: PA6 0: PB3 3: PA15 ETH_RMIICRSDV 0: PA4 ETH_RMIIREFCLK 0: PA3 ETH_RMIIRXD0 ETH_RMIIRXD1 ETH_RMIIRXER ETH_RMIITXD0 ETH_RMIITXD1 0: PA2 0: PA1 0: PA5 0: PE15 0: PE14 ETH_RMIITXEN 0: PA0 ETH_TSUEXTCLK 0: PB5 ETH_TSUTMR-
TOG ETM_TCLK ETM_TD0 ETM_TD1 ETM_TD2 ETM_TD3 GPIO_EM4WU0 GPIO_EM4WU1 GPIO_EM4WU3 GPIO_EM4WU4 0: PB6 3: PA6 0: PD6 3: PA2 3: PA3 3: PA4 3: PA5 0: PA0 0: PA6 0: PF1 0: PF2 Ethernet Management Data Clock. Ethernet Management Data I/O. Ethernet RMII Carrier Sense / Data Valid. Ethernet RMII Reference Clock. Ethernet RMII Receive Data Bit 0. Ethernet RMII Receive Data Bit 1. Ethernet RMII Receive Error. Ethernet RMII Transmit Data Bit 0. Ethernet RMII Transmit Data Bit 1. Ethernet RMII Transmit Enable. Ethernet IEEE1588 External Reference Clock. Ethernet IEEE1588 Timer Toggle. Embedded Trace Module ETM clock . Embedded Trace Module ETM data 0. Embedded Trace Module ETM data 1. 4: PE14 Embedded Trace Module ETM data 2. 4: PE15 Embedded Trace Module ETM data 3. Pin can be used to wake the system up from EM4 Pin can be used to wake the system up from EM4 Pin can be used to wake the system up from EM4 Pin can be used to wake the system up from EM4 GPIO_EM4WU6 0: PC4 Pin can be used to wake the system up from EM4 GPIO_EM4WU7 HFXTAL_N HFXTAL_P I2C0_SCL 0: PB11 0: PB14 0: PB13 0: PA1 Pin can be used to wake the system up from EM4 High Frequency Crystal negative pin. Also used as external optional clock input pin. High Frequency Crystal positive pin. I2C0 Serial Clock Line input / output. 5: PF1 7: PE5 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 23 LOCATION WGM160P Wi-Fi Module Data Sheet Pin Descriptions Description 4 - 7 5: PF0 4: PF2 I2C0 Serial Data input / output. I2C1 Serial Clock Line input / output. I2C1 Serial Data input / output. I2C2 Serial Clock Line input / output. I2C2 Serial Data input / output. IDAC0 output. LCD driver common line number 1. LCD driver common line number 2. LCD driver common line number 3. LCD segment line 0. LCD segment line 3. LCD segment line 10. LCD segment line 11. LCD segment line 12. LCD segment line 13. LCD segment line 14. LCD segment line 15. LCD segment line 16. LCD segment line 17. LCD segment line 18. LCD segment line 19. Alternate Functionality I2C0_SDA I2C1_SCL I2C1_SDA I2C2_SCL I2C2_SDA IDAC0_OUT LCD_COM1 LCD_COM2 LCD_COM3 LCD_SEG0 LCD_SEG3 LCD_SEG10 LCD_SEG11 LCD_SEG12 LCD_SEG13 LCD_SEG14 LCD_SEG15 LCD_SEG16 LCD_SEG17 LCD_SEG18 LCD_SEG19 LCD_SEG20 /
LCD_COM4 LCD_SEG21 /
LCD_COM5 LCD_SEG22 /
LCD_COM6 LCD_SEG23 /
LCD_COM7 LES_ALTEX0 LES_ALTEX2 LES_ALTEX3 LES_ALTEX4 LES_CH4 0 - 3 0: PA0 1: PD6 0: PC5 1: PB12 0: PC4 1: PB11 0: PF5 2: PF11 2: PF10 0: PB11 0: PE5 0: PE6 0: PE7 0: PF2 0: PF5 0: PE14 0: PE15 0: PA15 0: PA0 0: PA1 0: PA2 0: PA3 0: PA4 0: PA5 0: PA6 0: PB3 0: PB4 0: PB5 0: PB6 0: PD6 0: PA3 0: PA4 0: PA5 0: PC4 LCD segment line 20. This pin may also be used as LCD COM line 4 LCD segment line 21. This pin may also be used as LCD COM line 5 LCD segment line 22. This pin may also be used as LCD COM line 6 LCD segment line 23. This pin may also be used as LCD COM line 7 LESENSE alternate excite output 0. LESENSE alternate excite output 2. LESENSE alternate excite output 3. LESENSE alternate excite output 4. LESENSE channel 4. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 24 WGM160P Wi-Fi Module Data Sheet Pin Descriptions Alternate Functionality LES_CH5 LETIM0_OUT0 LETIM0_OUT1 LETIM1_OUT0 LETIM1_OUT1 LEU0_RX LOCATION 4 - 7 Description LESENSE channel 5. Low Energy Timer LETIM0, output channel 0. Low Energy Timer LETIM0, output channel 1. Low Energy Timer LETIM1, output channel 0. Low Energy Timer LETIM1, output channel 1. 4: PB5 4: PB6 4: PA0 LEUART0 Receive input. 0 - 3 0: PC5 0: PD6 1: PB11 2: PF0 3: PC4 1: PB12 2: PF1 3: PC5 0: PA6 1: PB14 2: PE15 3: PF1 1: PB13 4: PF2 LEU0_TX 2: PE14 LEUART0 Transmit output. Also used as receive input in half duplex communication. LEU1_RX LEU1_TX OPA0_N OPA0_P OPA1_P PCNT0_S0IN PCNT0_S1IN PCNT1_S0IN PCNT1_S1IN PCNT2_S0IN 4: PB5 4: PB4 4: PA0 6: PB5 7: PB12 4: PA1 6: PB6 7: PB11 6: PB11 6: PB12 3: PF0 1: PA6 1: PA5 0: PC5 0: PC4 0: PD6 3: PD6 0: PA5 1: PB3 3: PC4 0: PA6 1: PB4 3: PC5 2: PB13 3: PF10 LEUART1 Receive input. LEUART1 Transmit output. Also used as receive input in half duplex communication. Operational Amplifier 0 external negative input. Operational Amplifier 0 external positive input. Operational Amplifier 1 external positive input. Pulse Counter PCNT0 input number 0. Pulse Counter PCNT0 input number 1. Pulse Counter PCNT1 input number 0. Pulse Counter PCNT1 input number 1. Pulse Counter PCNT2 input number 0. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 25 LOCATION WGM160P Wi-Fi Module Data Sheet Pin Descriptions 0 - 3 2: PB14 3: PF11 0: PA0 3: PF2 0: PA1 1: PF5 3: PA0 2: PF1 2: PD6 0: PA6 1: PB14 2: PE6 0: PB13 2: PE7 1: PA2 1: PA3 1: PB6 2: PD8 2: PE14 2: PE15 0: PA15 2: PF0 0: PA4 1: PB12 0: PA5 2: PE5 2: PC4 0: PB3 2: PC5 0: PB4 0: PB5 2: PB11 1: PA0 1: PA1 1: PA2 1: PA3 4 - 7 Description Pulse Counter PCNT2 input number 1. Peripheral Reflex System PRS, channel 0. Peripheral Reflex System PRS, channel 1. Peripheral Reflex System PRS, channel 2. Peripheral Reflex System PRS, channel 3. Peripheral Reflex System PRS, channel 4. Peripheral Reflex System PRS, channel 5. Peripheral Reflex System PRS, channel 6. Peripheral Reflex System PRS, channel 7. Peripheral Reflex System PRS, channel 8. Peripheral Reflex System PRS, channel 9. Peripheral Reflex System PRS, channel 12. Peripheral Reflex System PRS, channel 13. Peripheral Reflex System PRS, channel 14. Peripheral Reflex System PRS, channel 15. Peripheral Reflex System PRS, channel 16. Peripheral Reflex System PRS, channel 17. Peripheral Reflex System PRS, channel 18. Peripheral Reflex System PRS, channel 19. Peripheral Reflex System PRS, channel 20. Peripheral Reflex System PRS, channel 21. Quad SPI 0 Chip Select 0. Quad SPI 0 Chip Select 1. Quad SPI 0 Data 0. Quad SPI 0 Data 1. Alternate Functionality PCNT2_S1IN PRS_CH0 PRS_CH1 PRS_CH2 PRS_CH3 PRS_CH4 PRS_CH5 PRS_CH6 PRS_CH7 PRS_CH8 PRS_CH9 PRS_CH12 PRS_CH13 PRS_CH14 PRS_CH15 PRS_CH16 PRS_CH17 PRS_CH18 PRS_CH19 PRS_CH20 PRS_CH21 QSPI0_CS0 QSPI0_CS1 QSPI0_DQ0 QSPI0_DQ1 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 26 LOCATION WGM160P Wi-Fi Module Data Sheet Pin Descriptions 0 - 3 1: PA4 1: PA5 1: PB3 1: PB4 1: PB5 1: PB6 1: PE15 1: PE14 0: PA0 3: PB6 0: PA1 0: PA2 0: PA3 0: PA4 0: PA5 2: PF5 3: PC4 4 - 7 Description Quad SPI 0 Data 2. Quad SPI 0 Data 3. Quad SPI 0 Data 4. Quad SPI 0 Data 5. Quad SPI 0 Data 6. Quad SPI 0 Data 7. Quad SPI 0 Data S. Quad SPI 0 Serial Clock. 4: PF0 5: PC4 7: PA1 4: PF1 5: PC5 7: PA0 4: PF2 4: PB11 4: PD6 5: PF2 Timer 0 Capture Compare input / output channel 0. Timer 0 Capture Compare input / output channel 1. Timer 0 Capture Compare input / output channel 2. Timer 0 Complimentary Dead Time Insertion channel 0. Timer 0 Complimentary Dead Time Insertion channel 1. Timer 0 Complimentary Dead Time Insertion channel 2. Timer 1 Capture Compare input / output channel 0. Alternate Functionality QSPI0_DQ2 QSPI0_DQ3 QSPI0_DQ4 QSPI0_DQ5 QSPI0_DQ6 QSPI0_DQ7 QSPI0_DQS QSPI0_SCLK TIM0_CC0 TIM0_CC1 TIM0_CC2 TIM0_CDTI0 TIM0_CDTI1 TIM0_CDTI2 TIM1_CC0 TIM1_CC2 3: PB11 Timer 1 Capture Compare input / output channel 2. TIM1_CC3 TIM2_CC0 TIM2_CC2 TIM2_CDTI1 TIM2_CDTI2 TIM3_CC0 TIM3_CC1 2: PB3 6: PF5 3: PB12 3: PF2 2: PE14 2: PE15 0: PE14 3: PE5 0: PE15 3: PE6 4: PB6 5: PC4 4: PA0 5: PA3 6: PA6 4: PA1 5: PA4 Timer 1 Capture Compare input / output channel 3. Timer 2 Capture Compare input / output channel 0. Timer 2 Capture Compare input / output channel 2. Timer 2 Complimentary Dead Time Insertion channel 1. Timer 2 Complimentary Dead Time Insertion channel 2. Timer 3 Capture Compare input / output channel 0. Timer 3 Capture Compare input / output channel 1. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 27 LOCATION WGM160P Wi-Fi Module Data Sheet Pin Descriptions 0 - 3 0: PA15 2: PE5 3: PE7 2: PF5 1: PE7 0: PE5 0: PE6 2: PE5 2: PE6 2: PA5 2: PA6 2: PA4 2: PA3 2: PB11 2: PB12 3: PE5 1: PF11 1: PF10 4 - 7 4: PA2 5: PA5 Description Timer 3 Capture Compare input / output channel 2. Timer 4 Capture Compare input / output channel 0. Timer 5 Capture Compare input / output channel 0. 6: PF10 6: PF11 Timer 5 Capture Compare input / output channel 1. Timer 5 Capture Compare input / output channel 2. 5: PB13 Timer 6 Capture Compare input / output channel 0. 5: PB14 Timer 6 Capture Compare input / output channel 1. 7: PD6 Timer 6 Capture Compare input / output channel 2. 5: PD6 4: PC5 5: PF2 4: PC4 5: PF1 4: PC4 4: PC5 Timer 6 Complimentary Dead Time Insertion channel 1. Timer 6 Complimentary Dead Time Insertion channel 2. UART0 Clear To Send hardware flow control input. UART0 Request To Send hardware flow control output. UART0 Receive input. UART0 Transmit output. Also used as receive input in half duplex communication. UART1 Clear To Send hardware flow control input. UART1 Request To Send hardware flow control output. UART1 Receive input. UART1 Transmit output. Also used as receive input in half duplex communication. 1: PE5 4: PB13 USART0 clock input / output. 4: PB14 USART0 chip select input / output. 0: PE14 4: PB6 5: PB11 4: PB5 5: PD6 0: PE15 1: PE6 1: PE7 USART0 Clear To Send hardware flow control input. USART0 Request To Send hardware flow control output. USART0 Asynchronous Receive. USART0 Synchronous mode Master Input / Slave Output (MISO). USART0 Asynchronous Transmit. Also used as receive input in half duplex communica-
tion. USART0 Synchronous mode Master Output / Slave Input (MOSI). 2: PF0 5: PB11 6: PE5 USART1 clock input / output. Alternate Functionality TIM3_CC2 TIM4_CC0 TIM5_CC0 TIM5_CC1 TIM5_CC2 TIM6_CC0 TIM6_CC1 TIM6_CC2 TIM6_CDTI1 TIM6_CDTI2 U0_CTS U0_RTS U0_RX U0_TX U1_CTS U1_RTS U1_RX U1_TX US0_CLK US0_CS US0_CTS US0_RTS US0_RX US0_TX US1_CLK silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 28 WGM160P Wi-Fi Module Data Sheet Pin Descriptions Alternate Functionality US1_CS US1_CTS US1_RTS US1_RX US1_TX US2_CLK US2_CS US2_CTS US2_RTS US2_RX US2_TX US3_CLK US3_CS US3_CTS US3_RTS US3_RX US3_TX USB_DM USB_DP USB_VBUSEN VDAC0_EXT LOCATION 0 - 3 2: PF1 4 - 7 USART1 chip select input / output. Description 5: PB13 USART1 Clear To Send hardware flow control input. 5: PB14 USART1 Request To Send hardware flow control output. 2: PD6 0: PC4 1: PB5 3: PA15 0: PC5 1: PB6 3: PB11 1: PB12 1: PB4 5: PA0 6: PA2 5: PF2 5: PF2 5: PF5 5: PD6 5: PD8 5: PF1 USART1 Asynchronous Receive. USART1 Synchronous mode Master Input / Slave Output (MISO). USART1 Asynchronous Transmit. Also used as receive input in half duplex communica-
tion. USART1 Synchronous mode Master Output / Slave Input (MOSI). USART2 clock input / output. USART2 chip select input / output. USART2 Clear To Send hardware flow control input. USART2 Request To Send hardware flow control output. USART2 Asynchronous Receive. USART2 Synchronous mode Master Input / Slave Output (MISO). 1: PB3 5: PF0 USART2 Asynchronous Transmit. Also used as receive input in half duplex communica-
tion. USART2 Synchronous mode Master Output / Slave Input (MOSI). 0: PA2 0: PA3 0: PA4 1: PE5 2: PD6 0: PA5 0: PA1 1: PE7 0: PA0 1: PE6 2: PB3 0: PF10 0: PF11 0: PF5 0: PD6 USART3 clock input / output. USART3 chip select input / output. USART3 Clear To Send hardware flow control input. USART3 Request To Send hardware flow control output. USART3 Asynchronous Receive. USART3 Synchronous mode Master Input / Slave Output (MISO). USART3 Asynchronous Transmit. Also used as receive input in half duplex communica-
tion. USART3 Synchronous mode Master Output / Slave Input (MOSI). USB D- pin. USB D+ pin. USB 5 V VBUS enable. Digital to analog converter VDAC0 external reference input pin. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 29 WGM160P Wi-Fi Module Data Sheet Pin Descriptions Alternate Functionality VDAC0_OUT0 /
OPA0_OUT VDAC0_OUT1 /
OPA1_OUT WTIM0_CC0 WTIM0_CC1 WTIM0_CC2 WTIM0_CDTI2 WTIM1_CC0 WTIM1_CC1 WTIM1_CC2 WTIM1_CC3 WTIM2_CC0 WTIM2_CC2 WTIM3_CC0 WTIM3_CC1 WTIM3_CC2 LOCATION 0 - 3 0: PB11 0: PB12 1: PA6 0: PE5 0: PE6 0: PB13 2: PD6 0: PB14 2: PD8 3: PB12 2: PB11 3: PF10 3: PF11 4 - 7 Description Digital to Analog Converter DAC0 output channel number 0. 6: PB3 4: PF0 6: PB4 4: PF1 6: PB5 4: PD6 5: PE7 4: PE5 4: PE6 Digital to Analog Converter DAC0 output channel number 1. Wide timer 0 Capture Compare input / output channel 0. Wide timer 0 Capture Compare input / output channel 1. Wide timer 0 Capture Compare input / output channel 2. Wide timer 0 Complimentary Dead Time Insertion channel 2. Wide timer 1 Capture Compare input / output channel 0. Wide timer 1 Capture Compare input / output channel 1. Wide timer 1 Capture Compare input / output channel 2. Wide timer 1 Capture Compare input / output channel 3. Wide timer 2 Capture Compare input / output channel 0. Wide timer 2 Capture Compare input / output channel 2. 6: PB6 Wide timer 3 Capture Compare input / output channel 0. Wide timer 3 Capture Compare input / output channel 1. Wide timer 3 Capture Compare input / output channel 2. Certain alternate function locations may have non-interference priority. These locations will take precedence over any other functions selected on that pin (i.e. another alternate function enabled to the same pin inadvertently). Some alternate functions may also have high speed priority on certain locations. These locations ensure the fastest possible paths to the pins for timing-critical signals. The following table lists the alternate functions and locations with special priority. Table 7.4. Alternate Functionality Priority Alternate Functionality CMU_CLK2 CMU_CLKI0 ETH_RMIICRSDV ETH_RMIIREFCLK ETH_RMIIRXD0 ETH_RMIIRXD1 ETH_RMIIRXER ETH_RMIITXD0 ETH_RMIITXD1 Location 1: PA3 1: PA3 0: PA4 0: PA3 0: PA2 0: PA1 0: PA5 0: PE15 0: PE14 Priority High Speed High Speed High Speed High Speed High Speed High Speed High Speed High Speed High Speed silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 30 WGM160P Wi-Fi Module Data Sheet Pin Descriptions Alternate Functionality ETH_RMIITXEN Location 0: PA0 TIM0_CC0 US2_CLK US2_CS US2_RX US2_TX 3: PB6 5: PF2 5: PF5 5: PF1 5: PF0 Priority High Speed Non-interference High Speed High Speed High Speed High Speed silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 31 8. Package Specifications 8.1 Package Outline WGM160P Wi-Fi Module Data Sheet Package Specifications Figure 8.1. WGM160P Package Outline silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 32 8.2 Recommended PCB Land Patterns WGM160P Wi-Fi Module Data Sheet Package Specifications Figure 8.2. WGM160P22A Land Pattern silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 33 WGM160P Wi-Fi Module Data Sheet Package Specifications Figure 8.3. WGM160P22N Land Pattern silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 34 8.3 Package Marking WGM160P Wi-Fi Module Data Sheet Package Specifications WGM160Pxxxxxxx Model: WGM160P22A T N A Certification Marks Pin#1 Location WGM160Pxxxxxxx Model: WGM160P22N Certification Marks YYWWTTTTTT www.silabs.com YYWWTTTTTT www.silabs.com Pin#1 Location Figure 8.4. Package Marking The package marking consists of:
WGM160Pxxxxxxx - Part number designation Model: WGM160Pxxx - Model number designation Certification Marks - All certification marks will be printed in this area according to regulatory body requirements. QR Code: YYWWMMABCDE YY Last two digits of the assembly year. WW Two-digit workweek when the device was assembled. MMABCDE Silicon Labs unit code YYWWTTTTTT YY Last two digits of the assembly year. WW Two-digit workweek when the device was assembled. TTTTTT Manufacturing trace code. The first letter is the device revision. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 35 WGM160P Wi-Fi Module Data Sheet Soldering Recommendations 9. Soldering Recommendations It is recommended that final PCB assembly of this product follows the industry standard as identified by the Institute for Printed Circuits
(IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. CLASS 1 General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. CLASS 2 Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. CLASS 3 High Performance/Harsh Environment Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 36 10. Tape and Reel Dimensions WGM160P Wi-Fi Module Data Sheet Tape and Reel Dimensions All dimensions in mm unless otherwise indicated. Figure 10.1. Carrier Tape Dimensions All dimensions in mm unless otherwise indicated. Figure 10.2. Reel Dimensions silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 37 WGM160P Wi-Fi Module Data Sheet Certifications 11. Certifications This section details certification status of the module in various regions. The address for the module manufacturer and certification applicant is:
SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 11.1 Qualified External Antenna Types This device has been certified with an integrated chip antenna as well as external antennas connected to either RF port or both. The required antenna impedance is 50 . Table 11.1. Qualified Antennas for WGM160P Antenna Type Connectorized Coaxial Dipole Maximum Gain 2.14 dBi Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. If an antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) with a gain less than or equal to 2.14 dBi is needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 2.14 dBi may require a fully new certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house, for example while performing with them the EMC testing of the end-product. 11.2 CE The WGM160P22A and WGM160P22N module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU). Please note that every application using the WGM160P22A and WGM160P22N will need to perform the radio EMC tests on the end product, according to EN 301 489-17. It is ultimately the responsibility of the manufac-
turer to ensure the compliance of the end-product. The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the end-product assembly. A formal Declaration of Conformity
(DoC) is available via https://www.silabs.com/products/wireless/wi-fi/wgm160p-wifi-module. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 38 WGM160P Wi-Fi Module Data Sheet Certifications 11.3 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the users authority to operate the equipment. FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-
ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile requirements in ac-
cordance to the limits exposed in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. OEM Responsibilities to comply with FCC Regulations:
OEM integrator is responsible for testing their end-product for any additional compliance requirements needed with this module instal-
led (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot check-
ing are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. In the typical case when the integral antenna of the WGM160P22A is used, a minimum separation distance of 40 mm must be main-
tained at all times between the human body and the radiator (antenna) to meet the SAR exemption for portable conditions. When the WGM160P22N is used instead, the minimum separation distance is also 40 mm, unless only the RF port 2 is used with a dipole antenna, in which case the minimum distance is 37 mm. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-
ance with FCC multi-transmitter product procedures. Important Note:
In the event that these conditions cannot be met, then for the FCC authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. End Product Labeling The variants of WGM160P Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module FCC ID: QOQWGM160P"
Or
"Contains FCC ID: QOQWGM160P"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. Class B Device Notice Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equip-
ment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular in-
stallation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 39 WGM160P Wi-Fi Module Data Sheet Certifications 11.4 ISED Canada ISED This radio transmitter (IC: 5123A-WGM160P) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada) to operate with the antenna types listed above, with the maximum permissible gain indicated. An-
tenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This device complies with ISEDs license-exempt RSS standards. Operation is subject to the following two conditions:
1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exemption from routine SAR evaluation limits are given in RSS-102 Issue 5. The models WGM160P22A and WGM160P22N meet the given exemption requirements when the minimum separation distance be-
tween the antenna(s) and the human body is respectively 30 mm and 40 mm. In the case of the N variant, the minimum separation distance could also be 30 mm but only in the case of using exclusively the dipole antenna at RF port 2, without configuring any trans-
mission out of RF port 1. In other words, RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR when using the module at its highest transmission power. OEM Responsibilities to comply with IC Regulations The WGM160P modules have been certified for integration into products only by OEM integrators under the following conditions:
The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (an-
tenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-
sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE In the event that these conditions cannot be met, then for the ISED authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. End Product Labeling The WGM160P module is labeled with its own ISED ID. If the ISED ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
Contains Transmitter Module IC: 5123A-WGM160P or Contains IC: 5123A-WGM160P The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. CAN ICES-003 (B) This Class B digital apparatus complies with Canadian ICES-003. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 40 WGM160P Wi-Fi Module Data Sheet Certifications ISED (Franais) ISED a approuv lutilisation de cet metteur radio (IC: 5123A-WGM160P) en conjonction avec des antennes de type dipolaire 2.14dBi ou de son antenne intgre. Lutilisation de tout autre type dantenne avec ce composant est proscrite. Ce composant est conforme aux normes RSS, exonres de licence d'ISED. Son mode de fonctionnement est soumis aux deux condi-
tions suivantes:
1. Ce composant ne doit pas gnrer dinterfrences. 2. Ce composant doit pouvoir tre soumis tout type de perturbation y compris celle pouvant nuire son bon fonctionnement. Dclaration d'exposition RF L'exemption tire des limites courantes d'valuation DAS est donne dans le document RSS-102 Issue 5. Les modles WGM160P22A et WGM160P22N respectent les exigences dexemption prvues lorsque la distance de sparation mini-
male entre le(s) antenne(s) et le corps humain est respectivement de 30 mm et 40 mm. Dans le cas de la variante N, la distance mini-
male de sparation pourrait galement tre de 30 mm, mais uniquement dans le cas dune utilisation exclusive de lantenne diple sur le port RF 2, sans configurer de transmission sur le port RF 1. La dclaration dexposition RF ou l'valuation DAS n'est pas ncessaire lorsque la distance de sparation est identique ou suprieure celle indique ci-dessus. Si la distance de sparation est infrieure celle mentionnes plus haut, il incombe l'intgrateur OEM de procd une valuation DAS. Responsabilits des OEM pour une mise en conformit avec le Rglement du Circuit Intgr Le module WGM160P a t approuv pour l'intgration dans des produits finaux exclusivement raliss par des OEM sous les condi-
tions suivantes:
L'antenne (s) doit tre installe de sorte qu'une distance de sparation minimale indique ci-dessus soit maintenue entre le radiateur
(antenne) et toutes les personnes avoisinante, ce tout moment. Le module metteur ne doit pas tre localis ou fonctionner avec une autre antenne ou un autre transmetteur que celle indique plus haut. Tant que les deux conditions ci-dessus sont respectes, il nest pas ncessaire de tester ce transmetteur de faon plus pousse. Ce-
pendant, il incombe lintgrateur OEM de sassurer de la bonne conformit du produit fini avec les autres normes auxquelles il pour-
rait tre soumis de fait de lutilisation de ce module (par exemple, les missions des priphriques numriques, les exigences de p-
riphriques PC, etc.). REMARQUE IMPORTANTE Dans le cas o ces conditions ne peuvent tre satisfaites (pour certaines configurations ou co-implantation avec un autre metteur), l'autorisation ISED n'est plus considre comme valide et le numro didentification ID IC ne peut pas tre appos sur le produit final. Dans ces circonstances, l'intgrateur OEM sera responsable de la rvaluation du produit final (y compris le transmetteur) et de l'ob-
tention d'une autorisation ISED distincte. tiquetage des produits finis Les modules WGM160P sont tiquets avec leur propre ID ISED. Si l'ID ISED n'est pas visible lorsque le module est intgr au sein d'un autre produit, cet autre produit dans lequel le module est install devra porter une tiquette faisant apparaitre la rfrence du mod-
ule intgr. Dans un tel cas, sur le produit final doit se trouver une tiquette aisment lisible sur laquelle figurent les informations sui-
vantes:
Contient le module transmetteur IC: 5123A-WGM160P ou Contient le circuit IC: 5123A-WGM160P L'intgrateur OEM doit tre conscient quil ne doit pas fournir, dans le manuel dutilisation, d'informations relatives la faon d'installer ou de denlever ce module RF ainsi que sur la procdure suivre pour modifier les paramtres lis la radio. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 41 WGM160P Wi-Fi Module Data Sheet Certifications 11.5 Locating the Module Close to Human Body When using the module in an application where the radio is located close to human body, the human RF exposure must be evaluated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard will require a differ-
ent minimum separation distance between the module and human body. Certification of WGM160P allows for the minimum separation distances detailed in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 42 in portable use cases
(less than 20 cm from human body). The module is approved for the mobile use case (more than 20 cm) without any need for RF expo-
sure evaluation. Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption Certification WGM160P with integrated antenna 40 mm 30 mm WGM160P with external reference dipole antenna 40 mm (or 37 mm when transmitting only over RF port 2) 40 mm (or 30 mm mm when transmitting only over RF port 2) The RF exposure must always be evaluated using the end-product when transmitting with power levels higher than 20 mW = 13 dBm. FCC ISED CE For FCC and ISED, using the module in end products where the separation distance is smaller than those listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the end-product in all cases. Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus reducing range. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 42 WGM160P Wi-Fi Module Data Sheet Revision History 12. Revision History Revision 0.5 April 2019 Updated naming for Sections 7.2 GPIO Functionality and 7.3 Alternate Pin Functionality Removed TBD Idle currents from Table 4.3 Power Consumption on page 8 and changed term "Sleep" to "Standby"
Updated Table 4.4 Digital I/O Specifications on page 9 Updated Table 4.6 RF Receiver Characteristics on page 11 Updated min PCBx_mm to 40 mm in Table 4.7 Radiated Characteristics on page 11 Updated Section 9. Soldering Recommendations Updated module manufacturer address in Section 11. Certifications Updated text in Sections 11.1 Qualified External Antenna Types, 11.3 FCC, 11.4 ISED Canada, and 11.5 Locating the Module Close to Human Body Updated Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 42 Revision 0.3 Feb 2019 Updated top-level device details throughout document. Removed software details from Section 1. Key Features (moved to Section 6. Gecko OS Features). Updated Section 2. Ordering Information to expand all OPN details. Corrected details in Section Figure 3.1 WGM160P Block Diagram on page 6. Updated all tables in Section 4. Electrical Specifications with latest nomenclature and characterization data. Added Section 5.3 Example Schematic. Added Section 6. Gecko OS Features. Updated pinout details in Section 7. Pin Descriptions. Removed functions not pinned out from Section 7.2 GPIO Functionality and 7.3 Alternate Pin Functionality. Updated Section 8. Package Specifications with additional landing diagram and package marking details. Added Section 9. Soldering Recommendations. Added Section 10. Tape and Reel Dimensions. Added Section 11. Certifications. Revision 0.2 November 2018 Initial release. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 43 Simplicity StudioOne-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux!IoT Portfoliowww.silabs.com/IoTSW/HWwww.silabs.com/simplicityQualitywww.silabs.com/qualitySupport and Communitycommunity.silabs.comhttp://www.silabs.comSilicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USADisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.Trademark InformationSilicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, Clockbuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, Gecko OS, Gecko OS Studio, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress , Zentri, the Zentri logo and Zentri DMS, Z-Wave, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. UG384: WGM160P Hardware Design Users Guide The purpose of this guide is to help users design WiFi applications using the WGM160P. This guide includes information for schematics and layout. Some options available with WGM160P hardware are not available with all software architectures, so the pin features versus software are detailed. KEY FEATURES Schematic guidelines Package information Layout guidelines silabs.com | Building a more connected world. Rev. 0.3
. Table of Contents
. 1. WGM160P Pinout . 2. WGM160P Pin Description . 2.7.1 Software Architecture Considerations . 3. Application Schematic Recommendations
. 2.1 Pin Table . 2.2 Power Pin
. 2.3 RESETn Pin . 2.4 RF Pins . 2.5 Clocks . 2.6 PTA Pins . 2.7 Multifunction Pins . 4. Typical Application Schematics
. 5. Layout Recommendations 3.1 Power Supply . 3.2 RF Part
. 5.1 Generic RF Layout Considerations . 5.2 RF-Pads Including the Diversity Port and External Antennas 5.3 Module Chip Antenna. 6. Recommendations for Certification . 7. Package Outline
. 8. Recommended PCB Land Pattern
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. silabs.com | Building a more connected world. Rev. 0.3 | 2 1. WGM160P Pinout WGM160P is a 23.8 mm x 14.2 mm x 2.3 mm PCB module. The diagram below describes pinout (top view) UG384: WGM160P Hardware Design Users Guide WGM160P Pinout Figure 1.1. WGM160P Device Pinout silabs.com | Building a more connected world. Rev. 0.3 | 3 UG384: WGM160P Hardware Design Users Guide WGM160P Pin Description 2. WGM160P Pin Description 2.1 Pin Table Pin Name Pin(s) Description Pin Name Pin(s) Description Table 2.1. WGM160P Device Pinout ANT_GND GND PTA_TX_CO NF PTA_FREQ PE14 PA0 PA2 PA4 PB3 PB5 PB13 PB11 RESETn PD8 PF5 VBUS PF11 PF1 1 2 54 55 4 8 9 10 11 23 27 30 33 43 52 6 12 14 16 18 20 22 25 28 31 34 36 38 40 42 45 Antenna ground. RF2 3 External antenna connection for diversi-
ty antenna. Terminate to ground with 47-51 Ohms if not connected to an an-
tenna. Ground. Connect all ground pins to ground plane. VBAT 5 Module power supply PTA TX_CONF pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. PTA FREQ pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. PTA_RF_AC T PTA_STA-
TUS GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO PE15 PA1 PA3 PA5 PB4 PB6 PB14 PB12 PTA RF_ACT pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. PTA STATUS pin. These pins can be used to manage co-existence with an-
other 2.4 GHz radio. GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO 7 13 15 17 19 21 24 26 29 32 Reset input, active low. This pin is inter-
nally pulled up to VBAT. To apply an external reset source to this pin, it is re-
quired to only drive this pin low during reset, and let the internal pull-up ensure that reset is released. GPIO GPIO USB VBUS signal and auxiliary input to 5 V regulator. May be left disconnected if USB is unused. GPIO (5V) GPIO (5V) PD6 35 GPIO PF2 PC5 PF10 PF0 PE7 37 39 41 44 46 GPIO GPIO GPIO (5V) GPIO (5V) GPIO silabs.com | Building a more connected world. Rev. 0.3 | 4 Pin Name Pin(s) Description Pin Name Pin(s) Description UG384: WGM160P Hardware Design Users Guide WGM160P Pin Description 47 49 51 GPIO GPIO GPIO PE6 PC4 PA15 Note:
1. GPIO with 5V tolerance are indicated by (5V). 2.2 Power Pin PE5 PA6 RF1 48 50 53 GPIO GPIO External antenna connection on WGM160P22N. Not connected on WGM160P22A. The WGM160P module is supplied through the VBAT pin. There is no need for external bypass capacitors as the ICs decoupling is performed within the module. Note that, although the VBAT supply is variable, the maximum TX output power can be achieved only when the supply is set to 3.3 V or higher. Note that pin VBUS cannot be used to supply the module. 2.3 RESETn Pin The WGM160P module is reset by driving the RESETn pin low. A weak internal pull-up resistor holds the RESETn pin high allowing it to be left unconnected if no external reset source is required. Note that when WGM160P is not powered, RESETn must not be connected to an active supply through an external pull-up resistor as this could damage the device. Note also that the WGM160P features Power On Reset to keep WGM160P in reset mode until VBAT is high enough. For more details, refer to the MCU EFM32GG11 reference manual. 2.4 RF Pins The WGM160P module is available with two RF configurations. Table 2.2. WGM160P RF Configuration Part Numbers WGM160PX22KGA2 WGM160P022KGA2 WGM160PX22KGN2 WGM160P022KGN2 RF1 Internal antenna. Pin RF1 is not connected. RF port RF2 RF port RF port RF ports are internally matched to 50 . It is recommended to connect any unused RF port to ground through a 50 resistor. Any of the RF ports can be used in a similar way. However, performance obtained on RF1 is slightly better, so it is preferable to use this one. Only one RF port is active at a given time, but the module can also achieve antenna diversity if the application requires it. Port selection and antenna diversity enablement are achieved through software configuration. silabs.com | Building a more connected world. Rev. 0.3 | 5 UG384: WGM160P Hardware Design Users Guide WGM160P Pin Description 2.5 Clocks The WGM160P module is available with two clock configurations. Table 2.3. WGM160P Low Power Clock Configuration Part Numbers WGM160PX22KGA2 WGM160PX22KGN2 WGM160P022KGA2 WGM160P022KGN2 Low Frequency Crystal Internal 32.768 kHz crystal No crystal A 32.768 kHz clock source is required to enable the lowest power operation in WiFi power save modes. 32.768 kHz can be generated using either an internal Low Frequency RC oscillator or an internal crystal. As the frequency tolerance of this clock affects wake-up scheduling, power consumption in DTIM modes is optimized when using the WGM160P with an integrated 32.768 kHz crystal. For WGM160P applications requiring Ethernet, a 50 MHz reference clock is required. This can be achieved either by connecting a 50 MHz external clock to module pin PB14 or by connecting a 50 MHz crystal oscillator between pins PB13 (HFXTAL_P) and PB14
(HFXTAL_N). For more details, refer to the MCU EFM32GG11 reference manual. Table 2.4. WGM160P 50 MHz High-Frequency Crystal Oscillator Parameter Crystal frequency Symbol fHFXO Supported crystal equivalent ser-
ies resistance (ESR) ESRHFXO Nominal on-chip tuning cap range1 On-chip tuning capacitance step CHFXO_T SSHFXO Startup time tHFXO Current consumption after startup IHFXO Note:
Test Condition No clock doubling Clock doubler enabled 50 MHz crystal 24 MHz crystal 4 MHz crystal On each of HFXTAL_N and HFXTAL_P pins 50 MHz crystal, ESR = 50 , CL = 8 pF 24 MHz crystal, ESR = 150 , CL = 6 pF 4 MHz crystal, ESR = 180 , CL = 18 pF 50 MHz crystal 24 MHz crystal 4 MHz crystal Min Typ Max 4 4 8.7 0.084 350 700 3 880 420 80 50 25 50 150 180 51.7 Unit MHz MHz pF pF s s ms A A A 1. The effective load capacitance seen by the crystal will be CHFXO_T /2. This is because each XTAL pin has a tuning cap and the two caps will be seen in series by the crystal. silabs.com | Building a more connected world. Rev. 0.3 | 6 UG384: WGM160P Hardware Design Users Guide WGM160P Pin Description 2.6 PTA Pins If an RF transceiver using the same 2.4 GHz band (e.g. Bluetooth) is located next to WGM160P, a Packet Transfer Arbitration (PTA) interface can be used to avoid mutual interference. In this case, the PTA pins are connected to the other transceiver. The PTA interface is highly programmable and can use 1, 2, 3, or 4 pins upon configuration. PTA signal names can vary by manufacturer, so the table below shows their alternative names. Table 2.5. WGM160P PTA Configuration WGM160P Pin #
WGM160P Pin Name Alternative Name 6 7 13 12 PTA_TX_CONF PTA_RF_ACT PTA_STATUS PTA_FREQ GRANT REQUEST PRIORITY RHO PTA interface configuration is achieved through software configuration. PTA operation will be detailed in an upcoming application note. 2.7 Multifunction Pins The multifunction pins refer to the WGM160P pins directly connected to the embedded MCU, EFM32GG11. 2.7.1 Software Architecture Considerations As described in the data sheet, the WGM160P module has considerable flexibility regarding the configuration of MCU pins, but not all software architectures support all functions. 2.7.1.1 Bootloader All devices come preprogrammed with a UART bootloader. This bootloader resides in flash and can be erased if it is not needed. More information about the bootloader protocol and usage can be found in AN0003: UART Bootloader. Application notes can be found on the Silicon Labs website (www.silabs.com/32bit-appnotes) or within Simplicity Studio in the [Documentation] area. WGM160P pin 44 (GG11 PF0) and pin 45 (GG11 PF1) provide the bootloader with TX and RX access, respectively. 2.7.1.2 Implementation with GG11 Open Software Full flexibility can be achieved when using the source software based on the Full MAC driver provided by Silicon Labs. The configura-
tion of multifunction pins is accomplished within Simplicity Studio similar to the software development for the EFM32GG11. For more details regarding these pins, refer to tables 6.2 and 6.3 of the WGM160P data sheet. silabs.com | Building a more connected world. Rev. 0.3 | 7 2.7.1.3 Implementation with Gecko OS The following table provides details on the various multifunction pin features supported through Gecko OS 4.0. Features such as SPI slave and USB will be supported in future releases of the Gecko OS. Table 2.6. WGM160P Multifunction Pin Configuration With GeckoOS UG384: WGM160P Hardware Design Users Guide WGM160P Pin Description WGM160P Pin 14 15 16 17 18 19 20 21 22 24 25 26 28 29 31 32 35 36 37 GG11 Port PE14 PE15 PA0 PA1 PA2 PA3 PA4 PA5 PB3 PB4 PB5 PB6 PB13 PB14 PB11 PB12 PD6 PD8 PF2 Default Function GPIO GPIO SPI Master MOSI SPI Master MISO SPI Master CLK GPIO GPIO GPIO Bulk sflash MOSI or 4 UART TX
(logging) Bulk sflash MISO or 4 UART RX
(logging) UART RTS
(Com-
mands) UART CTS
(Com-
mands) GPIO GPIO I2C Master SDA I2C Master SCL Factory Re-
set5 GPIO GPIO GPIO GPIO1
(GOS_ GPIO_x) UART2
(GOS_ UART_x) SPI3
(GOS_ SPI_x) I2C
(GOS_ I2C_x) ADC
(GOS_ ADC_x) PWM
(GOS_ PWM_x) Ethernet
(RMII) TXD1 TXD0 TXEN RXD1 RXD0 REFCLK CRSDV RXER 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 SPI0 MOSI SPI0 MISO SPI0 CLK UART1 TX SPI1 MOSI UART1 RX SPI1 MISO UART0 RTS UART0 CTS UART1 CTS UART1 RTS I2C0 SDA I2C0 SCL 0
-
6
-
10
-
11
-
-
12
-
1
-
2
-
3 4
-
5 0 1 2 3 4 5 6 7 8 9 10 11
-
-
12 13 14 15 16 silabs.com | Building a more connected world. Rev. 0.3 | 8 UG384: WGM160P Hardware Design Users Guide WGM160P Pin Description GPIO1
(GOS_ GPIO_x) UART2
(GOS_ UART_x) SPI3
(GOS_ SPI_x) I2C
(GOS_ I2C_x) ADC
(GOS_ ADC_x) PWM
(GOS_ PWM_x) Ethernet
(RMII) 19 20 21 22 23 24 25 26 27 28 UART0 TX UART0 RX SPI1 CLK
-
-
7
-
-
8
-
-
9
-
17 18
-
-
19 20 21 22 23 24 MDC MDIO WGM160P Pin 38 39 41 42 46 47 48 49 50 51 Note:
GG11 Port PF5 PC5 PF10 PF11 PE7 PE6 PE5 PC4 PA6 PA15 Default Function GPIO GPIO USB DM USB DP UART TX
(Com-
mands) UART RX
(Com-
mands) GPIO Bulk sflash SCLK GPIO GPIO 1. The prefix _x in GOS_GPIO_x is replaced with the numbers in the column: GOS_GPIO_1, GOS_GPIO_2, etc. SDK have all those symbols defined in header files. 2. All UART IOs are relevant to WGM160P, so when RX is used it means WGM160P receives, and TX means WGM160P trans-
mits. 3. SPI can be configured as master or slave. At the moment, only SPI master is supported in Gecko OS. SPI slave is coming in a future release. SPI interface does not define fixed SPI_CS pin. CS is configurable and any unused GPIO can be used for this function. 4. PB3 and PB4 showing 2 default functions means that those pins can be assigned using Gecko OS command API (variables and command) to one of those functions. For example, set bus.data_bus uart1 or set system.bflash.port spi1. Once one of these variables is assigned, the other one will give an error that pins are already in use. UART (logging) is used to print Gecko OS log messages: https://docs.silabs.com/gecko-os/4/standard/latest/cmd/variables/bus#bus-log-bus 5. WGM160P PAD 35 is used as factory reset pin and resets all Gecko OS variables to defaults. Any of the spare GPIOs is expec-
ted to be configured as factory reset pin, default being GOS_GPIO_16. More about factory reset at https://docs.silabs.com/gecko-
os/4/standard/latest/getting-started#performing-a-factory-reset. silabs.com | Building a more connected world. Rev. 0.3 | 9 UG384: WGM160P Hardware Design Users Guide Application Schematic Recommendations 3. Application Schematic Recommendations 3.1 Power Supply The WGM160P consists of two main blocks, the microcontroller (EFM32GG11) and the Wi-Fi network co-processor (WF200). The mi-
crocontroller contains an internal dc-dc converter that powers both the microcontroller core and the WiFi chip with a lower supply volt-
age to reduce overall power consumption. All the internal supplies are connected together and supplied by module pin VBAT. Care should be taken that the supply source is capable of supplying enough current for the load peaks of the power amplifier (which can go momentarily up to 200 mA), so it is recommended to select a regulator capable of supplying 300 mA. The peaks can be very fast, and the power supply for the module should be capable of reacting to load changes within 5 s. External high-frequency bypass capacitors are not needed because the module contains the required supply filter capacitors. However, care should be taken to prevent strong switching noise from being superimposed on the supply lines. Such noise can be generated, for example, by the onboard charge pump converters used in RS232 level shifters. Note that there is a total of about 15 F of low ESR ceramic capacitors inside the module connected directly on the supply input. When using external regulators to generate regulated supplies for the module, the stability of the regulator with the low ESR provided by these capacitors should be checked. Some low-drop linear regulators and some older switched mode regulators are not stable when ceramic output capacitors are used. The data sheet of the regulator typically lists recommendations concerning suitable capacitors, including data on ESR range and/or stability curves. A regulator should include the statement stable with ceramic capacitors. 3.2 RF Part When using the WGM160P with an antenna external to the module, be they connectorized off-the-shelf antennas or PCB trace anten-
nas, antenna impedance must be well matched to 50 , achieving better than -10 dB return loss throughout the 2.4-2.48 GHz band to reduce distortion in the module power amplifier due to impedance mismatch. The matching should be verified in the final enclosure, and it is recommended to reserve SMD placeholders for external antenna tuning. The suggested external antenna matching structure is a 3-element PI network. Unused RF ports (RF2 on both variants or RF1 on the variant without the chip antenna assembled) must be terminated to ground with a resistor of between 47 and 51 . silabs.com | Building a more connected world. Rev. 0.3 | 10 4. Typical Application Schematics The diagrams below show a simple application schematic with WGM160P and its internal antenna. UG384: WGM160P Hardware Design Users Guide Typical Application Schematics Figure 4.1. WFM160PX22KGA2 Schematics silabs.com | Building a more connected world. Rev. 0.3 | 11 UG384: WGM160P Hardware Design Users Guide Layout Recommendations 5. Layout Recommendations 5.1 Generic RF Layout Considerations For custom designs, use the same number of PCB layers as are present in the reference design whenever possible. Deviation from the reference PCB layer count can cause different PCB parasitic capacitances, which can detune the matching network from its optimal form. If a design with a different number of layers than the reference design is necessary, make sure that the distance between the top layer and the first inner layer is similar to that found in the reference design because this distance determines the parasitic capacitance value to ground. Otherwise, detuning of the matching network is possible, and fine tuning of the component values may be required. The Silicon Labs development kit uses a 1.6 mm thick FR4 PCB with the following board stack-up. Figure 5.1. Reference Design PCB Specification silabs.com | Building a more connected world. Rev. 0.3 | 12 UG384: WGM160P Hardware Design Users Guide Layout Recommendations Use as much continuous and unified ground plane metallization as possible, especially on the top and bottom layers. Use as many ground stitching vias, especially near the GND pins, as possible to minimize series parasitic inductance between the ground pours of different layers and between the GND pins. Use a series of GND stitching vias along the PCB edges and internal GND metal pouring edges. The maximum distance between the vias should be less than lambda/10 of the 10th harmonic (the typical distance between vias on a reference design is 1 mm). This dis-
tance is required to reduce the PCB radiation at higher harmonics caused by the fringing field of these edges. For designs with more than two layers, it is recommended to put as many traces (even the digital traces) as possible in an inner layer and ensure large, continuous GND pours on the top and bottom layers, while keeping the GND pour metallization unbroken beneath the RF areas (between the antenna, matching network and module). To benefit from parasitic decoupling capacitance, the inner layer can be used to route the power supply with a wide VBAT sub-plane and traces to increase parasitic capacitance with nearby ground layers. Avoid using long and/or thin transmission lines to connect the RF-related components. Otherwise, due to their distributed parasitic in-
ductance, some detuning effects can occur. Also, shorten the interconnection lines as much as possible to reduce the parallel parasitic caps to the ground. However, couplings between neighbor discretes may increase in this way. Route traces (especially the supply and digital lines) on inner layers for boards with more than two layers. To achieve good RF ground on the layout, it is recommended to add large, continuous GND metallization on the top layer in the area of the RF section (at a minimum). Better performance may be obtained if this is applied to the entire PCB. To provide a good RF ground, the RF voltage potentials should be equal along the entire GND area as this helps maintain good VBAT filtering. Any gap on each PCB layer should ideally be filled with GND metal and the resulting sections on the top and bottom layers should be connected with as many vias as possible. The reason for not using vias on the entire GND section is due to layout restrictions, such as traces routed on other layers or components on the bottom side. Use tapered lines between transmission lines with different widths (i.e., different impedances) to reduce internal reflections. Avoid using loops and long wires to obviate their resonances. They also work well as unwanted radiators, especially at the harmonics. Avoid routing GPIO lines close or beneath the RF lines, antenna or crystal, or in parallel with a crystal signal. Use the lowest slew rate possible on GPIO lines to decrease crosstalk to RF or crystal signals. Use as many parallel grounding vias at the GND metal edges as possible, especially at the edge of the PCB and along the VBAT traces, to reduce their harmonic radiation caused by the fringing field. Place any high-frequency (MHz-ranged) crystal as close to the module as possible. External crystal load capacitors are not needed since there is an on-chip capacitance bank for this purpose. Thus, it is suggested that one select crystals with load capacitance require-
ments that can be supported by the module. This way, the crystal can be placed close to the chip pins, and external capacitors are not needed. Connect the crystal case to the ground using many vias to avoid radiation of the ungrounded parts. Do not leave any metal unconnected and floating that may be an unwanted radiator. Avoid leading supply traces close or beneath the crystal or parallel with a crystal signal or clock trace. If possible, use an isolating ground metal between the crystal and any nearby supply traces to avoid any detuning effects on the crystal and to avoid the leakage of the crystal/clock signal and its harmonics to the supply lines. If possible, route traces between crystal and module pins as differential signals to minimize the trace loop area. 5.2 RF-Pads Including the Diversity Port and External Antennas With WGM160P variants without a chip antenna, the important properties are mainly to ensure that WGM160P ground pads are well connected to the PCB ground plane in order to optimize thermal conductivity and prevent unwanted emissions due to ground currents. The RF pads and RF traces conducting the RF signal should be dimensioned to have a characteristic impedance of 50 . It is vital that proper RF design principles be used when designing an application using the RF pads. Antennas external to the module, be they connectorized off-the-shelf antennas or PCB trace antennas, must be well-matched to 50 . PCB size and layout recommendations from the antenna manufacturer must be followed. Board size, ground plane size, plastic enclo-
sures, metal shielding, and components in close proximity to the antenna can affect the antenna impedance and radiation pattern. Therefore, antenna matching should be verified in the final enclosure. Better than 10 dB return loss throughout the 2.42.48 GHz band is recommended to prevent distortion in the module power amplifier due to impedance mismatch. PA distortion can cause significant packet loss and poor overall performance. silabs.com | Building a more connected world. Rev. 0.3 | 13 UG384: WGM160P Hardware Design Users Guide Layout Recommendations 5.3 Module Chip Antenna As is common for very small antennas, the antenna on WGM160P uses the ground plane edge to radiate, rather than just the antenna chip itself. The antenna on WGM160P is robust to the detuning effect of the proximity of various objects and makes the module easy to use with a consistent and reliable performance. All the antenna needs is a small patch free from copper under the antenna end of the module and a solid ground plane covering the whole PCB on at least one layer, especially the edge of the application board where the antenna is placed. To prevent the RF signal coupling to other, sensitive parts of the design, it is recommended to have a solid, board-
wide ground plane. For optimal performance of the WGM160P Module, please follow these guidelines:
1. Place the Module at the edge of the PCB with the antenna end flush against the application board edge. If it is necessary to place the module some distance from the edge, limit the copper plane edges to the level of the module antenna end. 2. Place the module close to the center of the edge of the board. 3. Do not place any metal (traces, components, battery, etc.) within the clearance area of the antenna. 4. Connect all ground pads directly to a solid ground plane covering the whole PCB. The grounds closest to the antenna end conduct strong RF currents and are critical for good performance, while the rest of the ground pads are important for thermal conductivity. 5. Place multiple ground vias as close to the ground pads as possible. If possible, fill every unused area in all layers with ground-
connected copper to improve thermal conductivity. 6. Terminate unused RF ports to ground with a resistor between 47 and 51 ohms Figure 5.2. Top Layer Layout of WGM160P Reference Design silabs.com | Building a more connected world. Rev. 0.3 | 14 UG384: WGM160P Hardware Design Users Guide Layout Recommendations Figure 5.3. Details of Antenna Ground Clearance Figure 5.4. Details about Board Dimensions and Module Placement Any metallic objects in close proximity to the antenna will distort the antenna's electromagnetic fields and cause the antenna center frequency to shift, reducing performance. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna, except in the directions of the application PCB ground planes. Please note that even if nearby metallic ob-
jects do not shift the antenna's center frequency, they will still distort the radiation pattern and prevent the antenna from radiating freely. Metals are opaque to radio frequencies and may create the equivalent of a shadow, a region of weaker performance, in the direction covered by the metal. silabs.com | Building a more connected world. Rev. 0.3 | 15 UG384: WGM160P Hardware Design Users Guide Layout Recommendations Figure 5.5. Enclosure Clearance Recommendations Because the application board is part of the antenna circuit, its dimensions affect the antenna's efficiency and thus its achievable range. Narrower ground planes can be used but will result in compromised RF performance. The following two-dimensional radiation pattern plots have been measured on the BRD4321A board:
Figure 5.6. WGM160P Radio Board BRD4321A with XYZ Axis Added silabs.com | Building a more connected world. Rev. 0.3 | 16 UG384: WGM160P Hardware Design Users Guide Layout Recommendations Figure 5.7. Typical 2D Radiation PatternTop View silabs.com | Building a more connected world. Rev. 0.3 | 17 UG384: WGM160P Hardware Design Users Guide Layout Recommendations Figure 5.8. Typical 2D Radiation PatternFront View silabs.com | Building a more connected world. Rev. 0.3 | 18 UG384: WGM160P Hardware Design Users Guide Layout Recommendations Figure 5.9. Typical 2D Radiation PatternSide View silabs.com | Building a more connected world. Rev. 0.3 | 19 6. Recommendations for Certification Customers should refer to the datasheet for detailed recommendations about certification. UG384: WGM160P Hardware Design Users Guide Recommendations for Certification silabs.com | Building a more connected world. Rev. 0.3 | 20 7. Package Outline UG384: WGM160P Hardware Design Users Guide Package Outline Figure 7.1. WGM160PX22KGA2 Package Outline silabs.com | Building a more connected world. Rev. 0.3 | 21 8. Recommended PCB Land Pattern UG384: WGM160P Hardware Design Users Guide Recommended PCB Land Pattern Figure 8.1. WGM160PX22KGA2/ WGM160P022KGA2 Recommended Land Footprint For WGM160P modules without antenna, there is no need for PCB antenna clearance. silabs.com | Building a more connected world. Rev. 0.3 | 22 UG384: WGM160P Hardware Design Users Guide Recommended PCB Land Pattern Figure 8.2. WGM160PX22KGN2/ WGM160P022KGN2 Recommended Land Footprint silabs.com | Building a more connected world. Rev. 0.3 | 23 Smart. Connected. Energy-Friendly.Productswww.silabs.com/productsQualitywww.silabs.com/qualitySupport and Communitycommunity.silabs.comhttp://www.silabs.comSilicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USADisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.Trademark InformationSilicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, Clockbuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, Gecko OS, Gecko OS Studio, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress , Zentri, the Zentri logo and Zentri DMS, Z-Wave, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.
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