FCC ID: QOQWFM200 Wi-Fi 802.1 1 bgn SiP transceiver radio module

WFM200S Data Sheet The Silicon Labs WFM200S is an Ultra Low Power Wi-Fi transceiver or network co-pro-

cessor (NCP) SiP module targeted for applications where optimal RF performance, low-

power consumption, and secure end-to-end solution, together with fast time to market, are key requirements. The very compact 6.5mm x 6.5mm WFM200S SiP module contains an embedded an-

tenna, high frequency crystal, and shield. This all-inclusive module offer the fastest time to market. The WFM200S integrates a balun, T/R switch, LNA and PA for the best possible RF per-

formance. Co-existence with external 2.4GHz transceivers is supported via a PTA inter-

face. WFM200S has been optimized for resource and power constrained devices at the RF, protocol and firmware levels. Power conscious devices can take advantage of these fea-

tures in both active and idle/sleep modes. For security sensitive applications, the WFM200S provides secure boot and a secure, encrypted host interface. Robust security is made possible with the native integrated True Random Number Generator and OTP memory for confidential encryption key stor-

age. The WFM200S fits well witl Linux-based and RTOS-based host processors. WFM200S supports both the 802.11 split MAC architecture and the 802.11 full MAC software archi-

tecture. WFM200S communicates with the external host controller over the SPI or SDIO interface. KEY POINTS IEEE 802.11 b/g/n compliant Embedded high efficiency antenna Integrated crystal and shield 105C ambient temp support TX power: up to +15.1 dBm RX sensitivity: -96.3 dBm Integrated switched antenna diversity support Ultra low power consumption Secure and signed software Encrypted host interface communication Linux and RTOS host support Certifications CE, FCC, ISED, Japan 6.5 x 6.5 mm SiP Module silabs.com | Building a more connected world. This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Preliminary Rev. 0.51

. 4. Electrical Specifications . 4.5.1 RF Receiver Characteristics . Table of Contents

. 1. Features List 2. Ordering Information . 3. System Overview . 4.4.1 RF Transmitter Characteristics . 4.5 RF Receiver General Characteristics

. 4.1 Absolute Maximum Ratings. 4.2 Operating Conditions . 4.3 Power Consumption . 4.4 RF Transmitter General Characteristics

. 3.1 Introduction . 3.2 Wi-Fi Supported 2.4 GHz Bandwidth and Channels

. 4.6 Reference Oscillator and Low Power Clock Characteristics . 4.6.1 Low Power 32.768 kHz Clock Input Requirements

. 5.1 Typical Application Circuit for SDIO Host Interface . 5.2 Typical Application Circuit for SPI Host Interface 5.3 Power States and Low-Power Modes

. 5.4 RF Connections

. 5.5.1 High Frequency Crystal Oscillator . 5.5.2 LP_CLK Port

. 4.7.1 Supply Terminal Specifications . 4.7.2 Digital I/O Terminal Specifications . 5. Typical Applications and Connections . 5.4.1 RF Ports

. 5.4.2 Antenna Diversity

. 5.4.3 Embedded Antenna Pins . 4.8.1 SPI Specification . 4.8.2 SDIO Specification . 4.7 Interface Terminal Characteristics

. 4.8 Host Interface . 5.5 Clocks . 5.6 Multi-Protocol Coexistence . 6. Pin Descriptions 7. Package Outline 8. Land Pattern 9. Top Marking. 4

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. 11. Software Reference

. 10. Tape and Reel Specifications . 10.1 Tape and Reel Packaging. 10.2 Reel and Tape Specifications 10.3 Orientation and Tape Feed . 10.4 Tape and Reel Box Dimensions. 10.5 Moisture Sensitivity Level . 11.1 Host and Device Software. 11.2.1 Secure Device . 11.2.2 Secure Boot . 11.2.3 Secure Link (WFM200SS only)

. 11.1.1 Split MAC . 11.1.2 Full MAC . 11.1.3 Software Documentation . 11.3.1 Power On, Reset, and Boot . 11.3.2 Sleep and Snooze Modes . 11.3.3 Shutdown Mode. 11.3 Startup, Sleep and Shutdown 11.2 Security . 12. Certifications . 12.1 Qualified External Antenna Types . 12.2 CE . 12.3 FCC . 12.4 ISED Canada . 12.5 Japan

. 12.6 Locating the Module Close to Human Body . 13. Revision History. 32

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. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 3 WFM200S Data Sheet Features List RF Features Tx Power: +15.1 dBm Rx Sensitivity: -96.3 dBm 2 x 2.4GHz antenna pads for switched antenna diversity sup-

port 2.4GHz co-existence; 2-, 3- and 4-wire PTA support Integrated Balun, T/R switch, LNA and PA for 2.4GHz Power Consumption Rx (@DSSS-1Mbps): 42.3 mA Tx (15.1 dBm @DSSS-1Mbps): 145 mA Associated DTIM3 average current : 298 A Associated Sleep Current : 22 A Shutdown mode: 0.5 A Security and Encryption Features Secure boot with roll-back prevention Encrypted host interface, dedicated hardware acceleration block (optional) Integrated True Random Number Generator Secure key storage using protected OTP technology AES/WEP hardware acceleration Host Interfaces SDIO (1-bit and 4-bit SD mode @ 26MHz) SPI (1-bit @ 52MHz) Peripheral Interfaces External 32kHz crystal for low power GPIOs (including wake-up and Tx/Rx activity monitoring) ROHS/REACH Compliant Certifications CE, FCC, ISED, Telec Electrical Characteristics 1.62V - 3.6V (VDDD, VDDIO) 3.0 - 3.6V (VDDPA) Packaging 6.5x6.5 LGA58 SiP Module Temperature range: -40C to +105C 1. Features List The WFM200S Wi-Fi SiP module key features are listed below. Applications Industrial, Home and Buidling automation Home appliances Security solutions Retail and Commercial Commercial transportation Consumer medical Sports and Fitness Features 802.11 b/g/n Wi-Fi NCP including the radio, baseband, MAC, security and host interface Integrated LNA, PA and Balun Integrated 38.4 MHz Crystal and embedded antenna OTP included removing the need for an external EEPROM Ultra low power optimized solution End-to-end security with hardware protected secure boot and encrypted host interface (optional) 802.11 split and full MAC architecture support Complete Network Co-Processor (NCP) support for Linux and RTOS external hosts Standards/IEEE 802.11 and WFA b - symbol rates: up to 11 Mbps g - symbol rates: up to 54 Mbps n - symbol rates: up to 72.2Mbps d - regulatory domains e - QoS as per definition in WMM specification i - as per definition in WPA2 specification w - protected management frames WMM Power save WPA/WPA2 Personal Supported with Linux UMAC:

WPA2 Enterprise WPS - Wi-Fi Protected Setup Key MAC and Baseband Features 1x1 802.11n (20 MHz) with full 802.11 b/g compatibility, 72.2Mbps Greenfield Tx/Rx for 802.11n optimal performance Short Guard Interval (SGI) for 802.11n optimal throughput A-MPDU Rx and Tx for high MAC throughput Block acknowledgement for several frames Rx Defragmentation Roaming supported Client, SoftAP modes supported Concurrent AP + STA supported on different channels silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 4 WFM200S Data Sheet Ordering Information 2. Ordering Information This section contains ordering information for WFM200S. Note: The parts may be referred to by the product family friendly name (WFM200S), or by the model names (WFM200SA, WFM200SN), or by the full orderable part numbers throughout this document Table 2.1. WFM200S Ordering Information (R indicates Full Reel) Part Number Description WFM200S022XNA2(R) WFM200SS22XNA2(R) WFM200S022XNN2(R) WFM200SS22XNN2(R) WFM200S 802.11bgn NCP WFM200S 802.11bgn NCP Secure host interface WFM200S 802.11bgn NCP WFM200S 802.11bgn NCP Secure host interface Antenna Type Package Embedded 6.5x6.5 LGA52 SiP module Embedded 6.5x6.5 LGA52 SiP module External only 6.5x6.5 LGA52 SiP module External only 6.5x6.5 LGA52 SiP module silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 5 3. System Overview 3.1 Introduction WFM200S is a WiFi network co-processor module optimized for RF performance, low energy, and low cost, with two antenna ports, Crystal Oscillator, One Time Programmable Memory, and several GPIOs for interfacing with multi-protocol and RF Front End Module controls. WFM200S Data Sheet System Overview Figure 3.1. WFM200SA Block Diagram Figure 3.2. WFM200SN Block Diagram silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 6 WFM200S Data Sheet System Overview 3.2 Wi-Fi Supported 2.4 GHz Bandwidth and Channels Supported operating frequencies and bandwidth Table 3.1. Supported Wi-Fi Modulations, BW, and Channels Parameter Symbol Test Condition Channel Center Frequency CHAN Subject to Regulatory Agency Channel Bandwidth Note:

BW 1. Channel 14 only supports 1 and 2 Mbps modulations. Min 2412 Typ 20 Max 2484 Unit MHz MHz silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 7 WFM200S Data Sheet Electrical Specifications 4. Electrical Specifications All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

Typical values are based on TA = 25 C; VVDD_IO, VVDD, VVDD_PA= 3.3V Radio performance numbers are measured in conducted mode, based on Silicon Labs reference designs WFM200S features and benefits depend on system configuration and may require specific driver, firmware or service activation. Learn more at https://www.silabs.com/products/wireless/wi-fi Refer to Section 4.2 Operating Conditions for more details about operational supply and temperature limits. 4.1 Absolute Maximum Ratings Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Parameter Storage temperature Junction temperature RF power level at RF1 and RF2 ports Symbol TSTG TJMAX PRFMAX Supply voltage to VDD_PA, VDD_IO, VDD VDDMAX Voltage on all other pins

(GPIO, Host interface, PTA, etc.) Current into any GPIO pin Sum of current into all GPIO pins VGMAX IOMAX IOALL_MAX Range of load impedance at RF1 and RF2 pins during TX LOADTX Table 4.1. Absolute Maximum Ratings Test Condition Min

-40

-40

-0.3

-0.3 Typ Max 150 125 10 3.6 VDDIO +

0.3 V 20 150 Unit C C dBm V V mA mA 10:1 VSWR silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 8 WFM200S Data Sheet Electrical Specifications Table 4.2. Recommended Operating Conditions Test Condition Min

-40

-40 3.0 1.62 1.62 Typ 3.3 1.8 1.8 Max 105 125 3.6 3.6 3.6 Unit C C V V V 4.2 Operating Conditions Parameter Ambient operating tempera-

ture Symbol TA Junction operating tempera-

ture TJ DC supply voltage to VDD_PA1 VVDD_PA Nominal supply voltage to VDD VVDD Nominal supply voltage to VDD_IO Note:

VVDD_IO 1. VVDD_PA must always be greater than or equal to VVDD. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 9 4.3 Power Consumption Unless otherwise indicated, VVDD_PA = 3.3 V, VVDD = VVDD_IO = 1.8 V. Parameter TX mode current Symbol ITX RX mode current IRX Sleep current on power sup-

ply pins1 ISLEEP Table 4.3. Power Consumption Test Condition Min 802.11.b: 1 Mbps, from VDD_PA at 3.3 V 802.11.b: 11 Mbps, from VDD_PA at 3.3 V 802.11.g: 6 Mbps, from VDD_PA at 3.3 V 802.11.g: 54 Mbps, from VDD_PA at 3.3 V 802.11.n: MCS = 0, from VDD_PA at 3.3 V 802.11.n: MCS = 7, from VDD_PA at 3.3 V 802.11.b: 1 Mbps, from 1.8 V sup-

plies (VDD, VDD_IO) 802.11.b: 11 Mbps, from 1.8 V supplies (VDD, VDD_IO) 802.11.g: 6 Mbps, from 1.8 V sup-

plies (VDD, VDD_IO) 802.11.g: 54 Mbps, from 1.8 V supplies (VDD, VDD_IO) 802.11.n: MCS = 0, from 1.8 V supplies (VDD, VDD_IO) 802.11.n: MCS = 7, from 1.8 V supplies (VDD, VDD_IO) 802.11.b: 1 Mbps, from 1.8 V sup-

plies (VDD, VDD_IO) 802.11.b: 11 Mbps, from 1.8 V supplies (VDD, VDD_IO) 802.11.g: 6 Mbps, from 1.8 V sup-

plies (VDD, VDD_IO) 802.11.g: 54 Mbps, from 1.8 V supplies (VDD, VDD_IO) 802.11.n: MCS = 0, from 1.8 V supplies (VDD, VDD_IO) 802.11.n: MCS = 7, from 1.8 V supplies (VDD, VDD_IO) VDD_PA pin, VVDD_PA = 3.3 V VDD pin, VVDD = 1.8 V VDD_IO pin, VVDD_IO = 3.3 V WFM200S Data Sheet Electrical Specifications Typ 99.4 95.6 95.2 92.6 94.9 92.3 45.5 45.4 46.7 47.4 46.7 47.4 42.3 43.0 45.4 47.8 45.2 48.3 66 18.7 3.5 Max Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA nA A A silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 10 Parameter Snooze current on power supply pins2 Symbol ISNOOZE Shutdown current on power supply pins3 ISHUTDOWN Average current for DTIM=1 Interval Profile4 ILP_DTIM1 Average current for DTIM=3 Interval Profile4 ILP_DTIM3 Average current for DTIM=10 Interval Profile4 ILP_DTIM10 Test Condition VDD_PA pin, VVDD_PA = 3.3 V VDD pin, VVDD = 1.8 V VDD_IO pin, VVDD_IO = 3.3 V VDD_PA pin, VVDD_PA = 3.3 V VDD pin, VVDD = 1.8 V VDD_IO pin, VVDD_IO = 3.3 V VDD_PA pin, VVDD_PA = 3.3 V VDD pin, VVDD = 1.8 V VDD_IO pin, VVDD_IO = 3.3 V VDD_PA pin, VVDD_PA = 3.3 V VDD pin, VVDD = 1.8 V VDD_IO pin, VVDD_IO = 3.3 V VDD_PA pin, VVDD_PA = 3.3 V VDD pin, VVDD = 1.8 V VDD_IO pin, VVDD_IO = 3.3 V Min Typ 66 1146 51 67 83.8 49 154 891 3.7 128 294 3.6 118 103 3.7 Note:

1. All memory is retained in sleep mode. WUP on timer and/or interrupt. 2. All memory is retained and Xtal oscillator is kept on if no 32 kHz clock is provided. 3. Requires complete start-up sequence to resume operation. 4. All DTIM currents assume a 1 ms beacon time duration with a beacon interval of 102.4ms from the AP. WFM200S Data Sheet Electrical Specifications Max Unit nA A A nA nA nA nA A A nA A A nA A A 4.4 RF Transmitter General Characteristics Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 C, VVDD_IO = VVDD = 1.8 V; VVDD_PA= 3.3V, center frequency = 2,442 MHz, and measured in 50 test equipment attached at antenna port. The output power levels are backed off to ensure compliance into a 2:1 VSWR antenna at the worst phase angles. More details are in UG395: WFM200 Hardware Design User's Guide. Measurements for this specification are made using the RF_1 port. See Section 5.4.1 RF Ports. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 11 WFM200S Data Sheet Electrical Specifications 4.4.1 RF Transmitter Characteristics Table 4.4. RF Transmitter Characteristics Parameter RMS output power with com-

pliance for antennas up to 2:1 VSWR Symbol POUTMAX_RMS_ HPPA Second Harmonic Level for POUT_MAX_PA Setting HD2MAX Carrier Suppression per 802.11-2012 for POUT_MAX PA setting CSUP Test Condition 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 POUT variation from VDD_PA=3.0 V to 3.6 V POUT variation across tem-

perature POUTMAX_VAR_ V POUTMAX_VAR_ T VDD_PA = 3.0 V to 3.6 V, Meas-

ured on single channel 25C to 85C Min Typ 15.1 13.0 12.5 7.1 12.1 5.0

-47.9

-49.1

-50.2

-54.2

-50.4

-55.6

-45.8

-44.3

-36.9

-35.9

-39.6

-31.4 1.6 0.9 Max Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBr dBr dBr dBr dBr dBr dB dB 4.5 RF Receiver General Characteristics Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 C, VVDD_IO = VVDD = 1.8 V; VVDD_PA= 3.3V, center frequency = 2,442 MHz, and measured in 50 test equipment attached at antenna port. Measurements for this specification are made using the RF_1 port. See Section 5.4.1 RF Ports. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 12 4.5.1 RF Receiver Characteristics Parameter RX Sensitivity for 8% FER

(1024 Octet) Symbol SENSB RX Sensitivity for 10% PER

(1024 Octet) SENSG RX Sensitivity for 10% PER

(4096 Octet) SENSEN ACSWB ACSWG ACSWN A2CSWB A2CSWG A2CSWN Adjacent Channel ( 30 MHz) Selectivity with desired signal at 6 dB above refer-

ence sensitivity for 8% FER

(1024 Octet) Adjacent Channel ( 25 MHz) Selectivity with desired signal at 3 dB above refer-

ence sensitivity for 10% PER

(1024 Octet) Adjacent Channel ( 25 MHz) Selectivity with desired signal at 3 dB above refer-

ence sensitivity for 10% FER

(4096 Octet) 2nd Adjacent Channel Sele-

citivity ( 50 MHz) with de-

sired at 6 dB above refer-

ence sensitivity 8% FER

(1024 Octet) 2nd Adjacent Channel Sele-

citivity ( 50 MHz) with de-

sired at 3 dB above refer-

ence sensitivity 10% PER

(1024 Octet) 2nd Adjacent Channel Sele-

citivity ( 50 MHz) with de-

sired at 3 dB above refer-

ence sensitivity 10% PER

(4096Octet) RX Max Strong Signal for 8% FER (1024 Octet) RXSAT_B RX Max Strong Signal for 10% PER (1024 Octet) RXSAT_G RX Max Strong Signal for 10% PER (4096 Octet) RXSAT_N WFM200S Data Sheet Electrical Specifications Typ

-96.3

-88.0

-91.5

-74.6

-91.0

-71.7 56.0 45.2 47.9 32.2 47.5 29.9 57.5 52.0 52.4 36.4 51.7 33.4

-4.0

-10.0

-9.0

-9.0

-9.0

-9.0 Max Unit dBm dBm dBm dBm dBm dBm dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBm dBm dBm dBm dBm dBm Min Table 4.5. RF Receiver Characteristics Test Condition 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 802.11b: 1 Mbps 802.11b: 11 Mbps 802.11g: 6 Mbps 802.11g: 54 Mbps 802.11n: MCS=0 802.11n: MCS=7 silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 13 Parameter RX Channel Power Indicator Accuracy worst case with in-

put swetp from -60 dBm to RX_SAT RX Channel Power Indicator Accuracy Worst Case with input signal swept from refer-

ence sensitivity to -69 dbm Symbol RCPITOLS RCPITOLW RX Channel power Indicator Step Size RCPISTEP Test Condition 802.11b: 1 Mbps 802.11g: 6 Mbps 802.11n: MCS=7 802.11b: 1 Mbps 802.11g: 6 Mbps 802.11n: MCS=7 802.11b: 1 Mbps 802.11g: 6 Mbps 802.11n: MCS=7 WFM200S Data Sheet Electrical Specifications Max Unit dB dB dB dB dB dB dB dB dB Min Typ

-4.5

-2.8

-3.3

-1.3

-1.4

-1.0 0.5 0.5 0.5 4.6 Reference Oscillator and Low Power Clock Characteristics The WFM200S contains a built-in 38.4 MHz XTAL to generate the reference clock. To achieve low power operation during power save modes, an external 32.768 KHz clock is required. 4.6.1 Low Power 32.768 kHz Clock Input Requirements Table 4.6. Low Power 32.768 kHz Clock Input Requirements Test Condition Parameter Nominal Frequency of LP_CLK Symbol FNOMLPCLK Frequency Tolerance of LP_CLK over all conditions1 FTOLLPCLK Load of LP_CLK pin Input Level at LP_CLK RLPCLK SIGLLPCLK Symmetry of LP_CLK DUTYLPCLK Note:

Min

-1000 0.7 *

VDD_IO Typ 32.768 30 50 Max 1000 Unit KHz ppm KOhm VDD_IO V p-p

%

1. To optimize power consumption in DTIM modes, it is recommended that the frequency drift of LP_CLK within 1 second be lower than +- 100ppm. 4.7 Interface Terminal Characteristics Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 C, VVDD_IO = VVDD = 1.8 V; VVDD_PA= 3.3V, center frequency = 2,442 MHz, and measured by 50 test equipment attached at pin. 4.7.1 Supply Terminal Specifications There are three supply pins to attach to DC power sources: VDD_PA, VDD and VDD_IO. Please refer to the section on 4.2 Operating Conditions for details on allowed voltages on these pins. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 14 4.7.2 Digital I/O Terminal Specifications WFM200S Data Sheet Electrical Specifications Table 4.7. Digital I/O Terminal Specifications Symbol VIL Test Condition VIH VOL VOH ILeak RPU RPD TOF TOR Sinking 5 mA, VVDD_IO 1.62 V Sourcing 5 mA, VVDD_IO 1.62 V 50 pF load, VVDD_IO = 1.62 V 50 pF load, VVDD_IO = 1.62 V Min 70 80 30 30 Typ Max Unit 1 43 43 15 15 30 25 65 65

%

%

%

%

nA k k ns ns Parameter Voltage input low (relative to VVDD_IO) Voltage input high (relative to VVDD_IO) Logic low output voltage (rel-

ative to VVDD_IO) Logic high output voltage

(relative to VVDD_IO) Input leakage current Pullup resistance Pulldown resistance1 Output fall time from VOH to VOL Output rise time from VOL to VOH Note:

1. RESETn pin has only pull-up resistance. 4.8 Host Interface The host interface allows control of WFM200S by an MCU or SoC using either SPI or SDIO. Selection between SPI and SDIO is done upon the logic state on SDIO_DAT2/HIF_SEL pin during the rising edge of RESETn signal. If this signal is HIGH, the host interface is configured as SDIO, otherwise it is configured as SPI. The tables below summarizes the pin configurations for the two modes and the achievable speeds on both interfaces Table 4.8. WFM200S SPI and SDIO interface pin configuration WFM200S Pin Name RESETn SDIO_DAT2/HIF_SEL SDIO_CLK/SPI_CLK SDIO_CMD/SPI_MOSI SDIO_DAT0/SPI_MISO SDIO_DAT1/SPI_WIRQ SDIO_DAT3/SPI_CSn SPI Mode 0 -> 1 1 x SPI_CLK SPI_MOSI SPI_MISO WIRQ

(interrupt request to the SPI host) SPI_CSn 0 x x x x x SDIO Mode 1 SDIO_DAT2 SDIO_CLK SDIO_CMD SDIO_DAT0 SDIO_DAT1 SDIO_DAT3 0 -> 1 1 x x x x x silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 15 WFM200S Data Sheet Electrical Specifications Parameter SDIO V2.0 clock rate Table 4.9. Host Interface Speeds Symbol SDRate Test Condition Host Interface SDIO DS Mode Host Interface SDIO HS Mode SPI clock rate SPIRate Host Interface SPI Min Typ Max 26 52 52 Unit MHz MHz MHz Besides the main host interface signals, a couple of other pins also complement the host interface. See AN1219 for more details:

The GPIO/WUP pin should be used by the host to wake up the WFM200S when in power-save mode. This pin is programmable and if power save is not enabled on the device, this pin can be configured as a GPIO. Note that this pin should be LOW to enable the WFM200S to reach sleep or shutdown modes. GPIO/WIRQ can also optionally be used as a duplication of the IRQ signal from SPI or SDIO. If this is not required, the pin can be configured as a GPIO. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 16 4.8.1 SPI Specification WFM200S Data Sheet Electrical Specifications Figure 4.1. SPI Interface Timing Parameters Table 4.10. SPI Interface Timing Specifications Symbol tCLK tCLK_HI tCLK_LO tCS_DIS_MI Description Clock period Clock high Clock low CS disable to MISO. VDDIO = 3.3V CS disable to MISO. VDDIO = 1.8V CS setup time MOSI setup time tSU_CS tSU_MO tHD_MO tCLKr_MI, tCLKf_MI CLK to MISO out; VDDIO = 3.3V CLK to MISO out; VDDIO = 1.8V MOSI hold time Min. 19.231 9 9 3 3 3 Typ. Max. Unit ns ns ns ns ns ns ns ns ns ns 8 10 10 21 Note:

1. 19.23 ns = 1/52 MHz 2. MISO can optionally be latched either on rising edge or falling edge of CLK 3. All timing parameters valid for output load up to 2 mA silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 17 4.8.2 SDIO Specification WFM200S Data Sheet Electrical Specifications Figure 4.2. SDIO Interface Timing Parameters Table 4.11. SDIO Interface Timing Specifications Symbol tCLK_HS tCLK_DS Description Clock period in high speed mode Clock period in default speed mode Min 19.23 38.46 Clock low time Clock high time tCLK_LO tCLK_HI CMD, DAT0~3 Inputs (with reference to SDIO_CLK) tSU tHD CMD, DAT0~3 Outputs (with reference to SDIO_CLK) tODLY_CLKr, tODLY_CLKf Output delay time (relative to rising and falling edge) for VDD

= 3.3V Input Hold time Input Set time Output delay time (relative to rising and falling edge) for VDD

= 1.8V tOH Output Hold time 9 9 3 3 3 Typ Max Unit Conditions ns ns ns ns ns ns ns ns ns CL 20pF CL 20pF CL 20pF CL 20pF CL 20pF CL 20pF VDDIO = 3.3V;

CL 20pF VDDIO = 1.8V;

CL 20pF CL 20pF 11 22 1. Output data can be latched either on rising edge (HS mode) or falling edge (DS mode) of CLK 2. All timing parameters valid for output load of up to 2 mA silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 18 5. Typical Applications and Connections 5.1 Typical Application Circuit for SDIO Host Interface WFM200S Data Sheet Typical Applications and Connections Figure 5.1. Typical Application Circuit SDIO Host Interface Note:

The SDIO pin pullup resistors are only required if the Host does not integrate internal pull-ups on SDIO signals as required by the SDIO standard. Refer to UG395: WFM200S Hardware Design User's Guide for more details on the application circuit. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 19 5.2 Typical Application Circuit for SPI Host Interface WFM200S Data Sheet Typical Applications and Connections Figure 5.2. Typical Application Circuit SPI Host Interface Note:

Refer to UG395: WFM200S Hardware Design User's Guide for more details on the application circuit. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 20 WFM200S Data Sheet Typical Applications and Connections 5.3 Power States and Low-Power Modes The current consumption on WFM200S is highly dynamic. It varies significantly depending on its activity, the activation of power-save modes, and when it is in shutdown. There are four main modes, each of them having several power states as detailed below. Traffic mode: The Traffic mode is defined as the mode when WFM200S is transmitting data, receiving data, or listening to the channel. If power save is not activated, the device stays in listen mode when there is no traffic. Current consumption is similar between receive and listen modes, while it is higher during transmission. Power save modes: When power save mode is activated, the device goes to a low-consumption mode and wakes-up periodically to listen to network beacons, so the device stays associated to the network. The current consumption, while receiving beacons, is as mentioned above for reception. There are three power-save/low-power consumption cases:

1. Sleep: If a 32 KHz clock is available at LP_CLK input, then the device goes in sleep mode between reception of beacons. In this mode, most of the chip is turned off (including Xtal oscillator and host interface) to reduce the power consumption as much as possible. Given that the host interface is shut down in this mode, the host should assert the WUP pin to wake up the device before any communication with the host can be achieved. 2. Sleep with XO on: If low-power clock is not available on LP_CLK or if the Xtal oscillator cannot be shut down, then the device goes in "Sleep with XO on" mode between reception of beacons. In this mode, the Xtal oscillator is active, so the typical consumption is higher. 3. Snooze: If low-power clock is not available on LP_CLK then the device goes in snooze mode between reception of beacons. In this mode, a smaller part of the device is shut down and the XO is always enabled, so the typical consumption is higher. The sleep or snooze state/mode can also be achieved when not associated if the firmware decides there are no tasks to perform when the wake-up signal (pin GPIO/WUP) from host is low. Shutdown mode: Shutdown mode is the case where the transceiver is shut down and reaches the lowest power consumption while still being connected to the power supplies. Getting out of stand-by requires a complete start-up sequence triggered by RESETn pin being set from low to high. Reset mode:When RESETn is low, the consumption is typically 76 A, mainly due to the RESETn pull-up resistor within the device. 5.4 RF Connections 5.4.1 RF Ports This device has two RF ports to allow antenna diversity using an internal switch. In applications with only one antenna, the un-used port should be terminated to ground through a resistor between 47 to 51 . 5.4.2 Antenna Diversity In Applications where the main antenna is subject to obstruction or de-tuning, a second antenna can be attached to the alternate RF port by using the diversity antenna switch. The location of this second antenna should be such that both cannot be prevented from operating satisfactorily by the same event. A firmware feature can be invoked to determine which antenna has a better path to the re-

mote Wi-Fi Device. 5.4.3 Embedded Antenna Pins For OPNs with embedded antenna, pin 2 (2G4ANT_IN) is the antenna input port. This has a reference impedance of 50 Ohms on nomi-

nal size host boards. The pin 3 (RF_1 port) is coupled to pin 2 when using the embedded antenna. Pin 47 is an intermediate connection to a loop trace on the host board. Follow UG395 for required dimensions of this trace when using the embedded antenna. When not using the embedded antenna, pin 2 and pin 47 are left floating. For OPNs without embedded antenna, pin 2 and pin 47 are disconnec-

ted internally. 5.5 Clocks 5.5.1 High Frequency Crystal Oscillator WFM200S has an internal 38.4MHz crystal used with the integrated oscillator circuitry to provide High Frequency Crystal Oscillator as the internal reference clock. A proprietary technique is used to calibrate and compensate for frequency errors. This achieves a frequen-

cy stability of +/-20ppm over the operating temperature range. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 21 WFM200S Data Sheet Typical Applications and Connections 5.5.2 LP_CLK Port A 32.768KHz clock source should be supplied to LP_CLK pin to enable the lowest power operation in power save modes. The frequen-

cy tolerance of this source affects wake up scheduling. 5.6 Multi-Protocol Coexistence In case an RF transceiver using the same 2.4 GHz band (e.g. Bluetooth, Zigbee, or Thread) is co-located with the WFM200S Wi-Fi transceiver, the Packet Traffic Arbitration (PTA) interface can be used to minimize mutual interference. In this case, PTA pins are con-

nected to the other transceiver. The PTA interface is highly programmable and can use 1, 2, 3, or 4 pins upon configuration. WFM200S embeds a Packet Traffic Arbitration block in order to share the access to the RF medium between WLAN and another standard. Depending on manufacturer, PTA signal names can vary and the table below shows some alternative naming:

Table 5.1. PTA Alternative Naming WFM200S Pin Name PTA_TX_CONF PTA_RF_ACT PTA_STATUS PTA_FREQ Alternative Names GRANT, WL_ACTIVE, WL_DENY REQUEST, BT_ACTIVE PRIORITY, BT_STATUS FREQ, BT_FREQ PTA interface configuration is also achieved via the configuration file. See AN1224 for more information regarding PTA and coexistence management on WFM200S, as well as AN1128 for EFR32BGx and EFR32MGx devices supporting BLE, Zigbee, and Thread. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 22 6. Pin Descriptions WFM200S Data Sheet Pin Descriptions Pin #

1 2 3 4-8 9 10 11 12 13 Pin Name GND 2G4ANT_IN RF_1 GND RF_2 VDD_PA GND RESETn GPIO/WUP Figure 6.1. WFM200S Pinout Table 6.1. Pin Definitions Pin Type GND Analog Analog GND Analog VDD GND Input I/O Description / Default Embedded 2.4 Ghz antenna Port. To use the embedded antenna, this pin should be connected to RF_1. For OPNs without an em-

bedded antenna, the pin is a No Connect RF_1 port + matching. Can be connected to 2G4ANT_IN pin RF_2 port + matching. Can be connected to a second antenna for switched antenna diversity Power supply for the power amplifier Reset pin, active low This pin should be used to wake-up the chip while in power-save mode using LP_CLK. If not used, the pin can be used as a GPIO silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 23 Pin #

Pin Name Pin Type Description / Default WFM200S Data Sheet Pin Descriptions 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35,36 37 38 39 40 41-56 47 48-58 GPIO/PTA_TX_CONF GPIO/PTA_RF_ACT GPIO/PTA_STATUS GPIO/PTA_FREQ LP_CLK GPIO/WIRQ VDD GND SDIO_CLK/SPI_CLK SDIO_CMD/SPI_MOSI SDIO_DAT0/SPI_MISO SDIO_DAT1/SPI_WIRQ SDIO_DAT2/HIF_SEL SDIO_DAT3/SPI_CSn VDD_IO GPIO GPIO GPIO GPIO GND GPIO GND GPIO GPIO RESERVE_1 RESERVE_2 GND ANT_LOOP GND I/O I/O I/O I/O Input I/O VDD GND Input I/O I/O I/O I/O I/O VDD I/O I/O I/O I/O GND As part of PTA interface, these pins can be used to manage co-

existence with another 2.4 GHz radio, or can be used as GPIO Low Power clock input. This pin is typically connected to the 32 KHz clock. If not used, the pin should be connected to GND This pin can be used as an IRQ to host for SDIO, or can be used as a GPIO. Power supply for the digital and RF parts Host interface: SDIO_CLK or SPI_CLK Host interface: SDIO_CMD or SPI_MOSI Host interface: SDIO_DAT0 or SPI_MISO Host interface: SDIO_DAT1 or WIRQ Host interface selection: Used to select the host interface during RESETn rising edge. If Low, selects SPI interface. When High, selects SDIO interface and this pin becomes SDIO_DAT2 Host interface: SDIO_DAT3 or SPI_CSn Power supply for I/Os These pins can be used for GPIO. This pin can be used for dynamic control of an external Power Amplifier, otherwise this can be used as GPIO. I/O or Analog This pin can be used as a GPIO GND I/O I/O N/A N/A GND Analog GND These pins can be used for GPIO. Reserved. For normal operation, this pin must be grounded. Reserved. This pin should be left unconnected. To use the embedded antenna, this pin should be connected to ground through the embedded antenna loop capacitor. For OPNs without the embedded antenna, this pin should be a No Connect. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 24 7. Package Outline WFM200S Data Sheet Package Outline Figure 7.1. WFM200S Package Outline silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 25 Table 7.1. Package Outline Dimensions (in mm) WFM200S Data Sheet Package Outline MIN 1.20 0.26 0.95 0.27 0.43 0.11 0.34 0.24 0.14 0.62 MIN Dimension A A1 A2 b D e E L L1 L2 L3 L4 L5 Dimensions aaa bbb ccc ddd eee MAX 1.40 0.34 1.05 0.37 0.53 0.21 0.44 0.34 0.24 0.72 NORM NORM 1.30 0.30 1.00 0.32 6.50 BSC 0.50 BSC 6.50 BSC 0.48 0.16 0.39 0.29 0.19 0.67 MAX 0.10 0.10 0.10 0.10 0.10 silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 26 Pad Number Pad Coord (X,Y) Pad Size (X,Y) Pad Number Pad Coord (X,Y) Pad Size (X,Y) Note: These coordinates correspond to the BOTTOM view. Please refer to UG395: WFM200S Hardware Design User's Guide for the stencil design. WFM200S Data Sheet Package Outline 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 2.850 2.850 2.850 2.850 2.850 2.850 2.850 2.850 2.850 2.250 1.750 1.250 0.750 0.250

-0.250

-0.750

-1.250

-1.750

-2.250

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850 1.300 0.800 0.300

-0.200

-0.700

-1.200

-1.700

-2.200

-2.700

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.850

-2.700

-2.200

-1.700

-1.200

-0.700

-0.200 0.300 0.800 1.300 1.800 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58

-2.850

-2.850

-2.250

-1.750

-1.250

-0.750

-2.250

-1.750

-1.250

-0.750

-0.250 0.250 0.750 1.250 1.750 2.250

-0.070 2.850

-0.070 2.850

-1.200 0.000 1.200

-1.200 0.000 1.200

-1.200 0.000 1.200 2.300 2.800 2.850 2.850 2.850 2.850 1.250 1.250 1.250 1.250 1.250 1.250 1.250 1.250 1.250 1.250 2.900 2.900 1.900 1.900 0.270 0.270 0.270

-0.800

-0.800

-0.800

-1.870

-1.870

-1.870 0.480 0.480 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.320 0.480 0.480 0.480 0.480 0.670 0.670 0.670 0.670 0.670 0.670 0.670 0.670 0.670 0.320 0.320 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.480 0.320 0.320 0.320 0.320 0.670 0.670 0.670 0.670 0.670 0.670 0.670 0.670 0.670 silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 27 WFM200S Data Sheet Package Outline Note:

The dimensions in parenthesis are reference All dimensions in millimeters (mms) Unless otherwise specified tolerances are:

Decimal:

X.X = 0.1 X.XX = 0.05 X.XXX=0.03 Angular: 0.1 (In Deg) Hatching lines means package shielding area Pad coordinates located from package center (0,0) Dimensioning and Tolerance per ANSI Y14.5M-1994 silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 28 8. Land Pattern WFM200S Data Sheet Land Pattern Figure 8.1. WFM200S Land Pattern Table 8.1. PCB Land Pattern Dimension b D1 D2 D3 D4 D5 D6 D7 eD1 eD2 eD3 e mm 0.32 5.50 4.77 3.70 2.63 1.65 4.00 0.05 1.00 0.60 0.15 0.50 silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 29 Dimension E1 E2 E3 E4 E5 E6 E7 E8 E9 L L1 eE1 eE2 WFM200S Data Sheet Land Pattern mm 5.70 5.10 2.92 2.85 1.65 4.50 2.40 1.20 4.50 0.48 0.67 0.60 0.60 Notes:

1. General a. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed. b. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 2. Stencil Design a. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste re-

lease. b. The stencil thickness should be 0.100mm (4 mils). c. The stencil aperture to land pad size recommendation is 80% paste coverage. The above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 30 9. Top Marking WFM200S Data Sheet Top Marking Figure 9.1. WFM200S Top Marking Table 9.1. Top Marking Definition OPN Line 1 Marking Line 2 Marking WFM200S022XNA2 WFM200SS22XNA2 WFM200S022XNN2 WFM200SS22XNN2 WFM200SA WFM200SA WFM200SN WFM200SN Note: YY = Year. WW = Work Week 200022XNA2 200S22XNA2 200022XNN2 200S22XNN2 Line 3 Marking See note below See note below See note below See note below silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 31 WFM200S Data Sheet Tape and Reel Specifications 10. Tape and Reel Specifications 10.1 Tape and Reel Packaging This section contains information regarding the tape and reel packaging for the WFM200S Module. 10.2 Reel and Tape Specifications Reel material: Polystyrene (PS) Reel diameter: 13 inches (330 mm) Number of modules per reel: 1000 pcs Disk deformation, folding whitening and mold imperfections: Not allowed Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm) Antistatic treatment: Required Surface resistivity: 104 - 109 /sq. Figure 10.1. Reel Dimensions - Side View Table 10.1. Reel Dimensions Symbol W0 W1 Dimensions [mm]

32.5 0.3 37.1 1.0 silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 32 WFM200S Data Sheet Tape and Reel Specifications Figure 10.2. Cover tape information Table 10.2. Cover Tape Dimensions Symbol Thickness (T) Width (W) Dimensions [mm]

0.061 25.5 + 0.2 Figure 10.3. Tape information silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 33 10.3 Orientation and Tape Feed The user direction of feed, start and end of tape on reel and orientation of the Modules on the tape are shown in the figures below. WFM200S Data Sheet Tape and Reel Specifications Figure 10.4. Module Orientation and Feed Direction 10.4 Tape and Reel Box Dimensions Figure 10.5. Tape and Reel Box Dimensions Table 10.3. Tape and Reel Box Dimensions Symbol W2 W3 W4 Dimensions [mm]

368 338 72 10.5 Moisture Sensitivity Level Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 34 WFM200S Data Sheet Software Reference 11. Software Reference This section gives a short overview of the software involved to run applications based on this device. The firmware running in the WFM200S allows it to be used at Lower MAC level (in split MAC) or at the Upper Mac level (in Full MAC). 11.1 Host and Device Software This device is intended to be used as a Network Co-Processor (NCP) which means that it requires a host processor to run the applica-

tion. Depending on architecture choices based on required throughput, host memory size and power, the MAC layer can be split be-

tween WFM200S and its host or fully ran in WFM200S. 11.1.1 Split MAC The so-called split MAC is the case where WFM200S runs the Lower MAC section while the host processor runs the Upper MAC. This is a use case that typically fits the Linux application as MAC802.11 is provided with Linux For such an application, Silicon Labs provides the embedded firmware implementing the Lower MAC as well as needed configuration tasks. Sample core Linux drivers are available for a variety of platforms. The figure below shows the typical software architecture in Split MAC implementations. Figure 11.1. Split MAC Implementation silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 35 11.1.2 Full MAC In this scenario, both the lower MAC and upper MAC are running in WFM200S. The WFM200S contains a WPA/WPA2 personal suppli-

cant, allowing it to handle full MAC responsibilities without utilizing the host MCU. The host receives an IP packet and implements all stack layers necessary above it. The figure below shows the typical software architecture in Full MAC implementations. WFM200S Data Sheet Software Reference Figure 11.2. Full MAC Implementation Note: The WPA supplicant on WFM200S does not support WPA enterprise. If WPA-enterprise is required, then it should be implemen-

ted above the IP stack in the host MCU software. 11.1.3 Software Documentation Documentation required for software implementation is available at https://docs.silabs.com/. 11.2 Security The WFM200S implements several security features as listed below. 11.2.1 Secure Device WFM200S disables access to all debug ports. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 36 WFM200S Data Sheet Software Reference 11.2.2 Secure Boot Secure Boot includes several features related to boot and firmware security. Firmware authentication and encryption do not have any impact on host software, whereas firmware roll back prevention requires more flexibility and is managed by each customer through soft-

ware. Firmware authentication: The downloaded firmware is authenticated such that only Firmware provided by Silicon Labs can run in WFM200S. Firmware encryption: The downloaded firmware is encrypted when generated by Silicon Labs and is decrypted inside WFM200S during firmware download. Firmware roll back prevention: If a security threat is discovered, Silicon Labs has the ability to increment in its firmware an anti-roll-

back tag. This can be used by the customer to prevent the part from starting with a firmware having a tag lower than a specified one. This mechanism is managed by each customer on a case-by-case need. 11.2.3 Secure Link (WFM200SS only) Secure Link refers to the capability to have encrypted SPI/SDIO communication between the host and WFM200S. This feature requires the host and WFM200S to exchange a key based on a shared secret stored on both sides nonvolatile secured memories and program-

med at the end product manufacturing stage. The encrypted interface uses a Diffie-Hellman algorithm key exchanges on a per session/per device basis. As a result, a given link is secured uniquely on a given device, and keys are regenerated on a power cycle. There are 3 possible cases for secure link:

Secure link is not used: In this scenario, the part does not encrypt any communication with the host. Secure link is temporary enabled: Secure Link can be activated through software, with a software key which is not stored in WFM200S. Doing this allows to assess the performance and consumption impacts of secure link. In this mode, Secure Link is ach-

ieved as long as the part is not reset. The next restart of WFM200S will make it start in Non-Secure Link mode. Permanent Secure Link: This mode is activated by software and the key exchanged is permanently stored in WFM200S non-volatile memory. Once configured in this mode, WFM200S only understands host interface messages which have been encrypted with the stored key. Once a secure link has been established, the host can choose to only encrypt certain API messages between the host and the WFM200S to reduce the power and latency overhead of encryption. 11.3 Startup, Sleep and Shutdown 11.3.1 Power On, Reset, and Boot When RESETn pin is set HIGH, WFM200S is getting out of its reset mode. All supply voltages should be settled within the operational range before the rising edge of RESETn pin. Then the boot sequence can be initiated by the host software with the following sequence:

Some registers describing the required configuration before firmware download are written by the driver. The driver initiates the boot. The driver downloads the embedded firmware into WFM200S. The driver configures WFM200S upon the hardware platform and requested features with a dedicated configuration file. 11.3.2 Sleep and Snooze Modes The sleep or snooze modes are reached when power-save mode has been enabled on the WFM200S. These modes highly reduce power consumption while maintaining all configuration and context, so that the device can be quickly back to normal operation. A WFM200S driver command is used to indicate that the driver wants the part to go to power-save. However it is the firmware on WFM200S that decides when it switches into sleep mode based on Wi-Fi activity. The part wake-up is achieved by asserting the GPIO/WUP pin. The sleep mode requires a 32 KHz clock to be provided on LP_CLK pin. In case a 32 KHz clock is not available, the part can be set in a snooze mode which is functionally equivalent but draws more current. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 37 11.3.3 Shutdown Mode The shutdown mode can be used if the Wi-Fi feature is not needed for a long period of time. This mode achieves the lowest current consumption on the device but requires a full power-up reset and boot sequence to come back to the operational mode. This mode should be initiated by the host. Note: A similar behavior could be achieved by asserting RESETn pin low, but would draw more current. WFM200S Data Sheet Software Reference silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 38 WFM200S Data Sheet Certifications 12. Certifications This section details certification status of the module in various regions. The address for the module manufacturer and certification applicant is:

SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 12.1 Qualified External Antenna Types This device has been certified with an embedded antenna with an external loop as well as external dipole whip antennas connected to either RF port or both. The required antenna impedance is 50 . Table 12.1. Qualified Antennas for WFM200S Antenna Type Connectorized Coaxial Dipole Maximum Gain 4.7 dBi Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. If an antenna of a different type (such as a patch antenna) with a gain less than or equal to 4.7 dBi is needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 4.7 dBi may require a fully new certifi-

cation. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house, for example while performing with them the EMC testing of the end-product. The use of this certified module requires all applications to adhere to UG395: WFM200 Hardware Design User's Guide. 12.2 CE The WFM200SA and WFM200SN modules are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU). Please note that every application using the WFM200SA and WFM200SN modules will need to perform the radio EMC tests on the end product, according to EN 301 489-17. It is ultimately the responsibility of the manu-

facturer to ensure the compliance of the end-product. The specific product assembly may have an impact to RF radiated characteris-

tics, and manufacturers should carefully consider RF radiated testing with the end-product assembly. A formal Declaration of Conformi-

ty (DoC) is available on the product web page at www.silabs.com. To ensure full conformity for CE, the end-product manufacturer is supposed to set the CCA to Absolute Mode, and to make sure the max RF TX power levels are configured appropriately, primarily based on the system antenna gain (the UG395: WFM200 Hardware Design User's Guide comes with a table showing configuration examples of this.) silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 39 WFM200S Data Sheet Certifications 12.3 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the users authority to operate the equipment. FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-

ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile requirements in ac-

cordance to the limits exposed in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. OEM Responsibilities to comply with FCC Regulations:

OEM integrator is responsible for testing their end-product for any additional compliance requirements needed with this module instal-

led (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot check-

ing are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. See the table in the Section 12.6 Locating the Module Close to Human Body for information on the minimum spacing between the module and the human body. This transmitter meets the Portable requirements at distances equal or above 23 mm. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-

ance with FCC multi-transmitter product procedures. Important Note:

In the event that these conditions cannot be met, then for the FCC authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. End Product Labeling The outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQWFM200"

Or

"Contains FCC ID: QOQWFM200"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 40 WFM200S Data Sheet Certifications 12.4 ISED Canada ISED This radio transmitter (WFM200S) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, for-

merly Industry Canada) to operate with the antenna types listed above, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This device complies with ISEDs license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exemption from routine SAR evaluation limits are given in RSS-102 Issue 5. See the Section 12.6 "Locating the Module Close to Human Body" for details on minimum spacing between the module and the human body In other words, RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR when using the module at its highest transmission power. OEM Responsibilities to comply with IC Regulations The WFM200S modules have been certified for integration into products only by OEM integrators under the following conditions:

The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (an-

tenna) and all persons at all times. For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 40 mm. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-

sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE In the event that these conditions cannot be met, then for the ISED authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. End Product Labeling The outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

Contains Transmitter Module IC: 5123A-WFM200 or Contains IC: 5123A-WFM200 The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 41 WFM200S Data Sheet Certifications ISED (Franais) ISED a approuv lutilisation de cet metteur radio (WFM200S) en conjonction avec des antennes de type dipolaire 2.14dBi ou de son antenne intgre. Lutilisation de tout autre type dantenne avec ce composant est proscrite. Ce composant est conforme aux normes RSS, exonres de licence d'ISED. Son mode de fonctionnement est soumis aux deux condi-

tions suivantes:

1. Ce composant ne doit pas gnrer dinterfrences. 2. Ce composant doit pouvoir tre soumis tout type de perturbation y compris celle pouvant nuire son bon fonctionnement. Dclaration d'exposition RF L'exemption tire des limites courantes d'valuation DAS est donne dans le document RSS-102 Issue 5. Reportez-vous la Section 12.6 "Localisation du module prs du corps humain" pour obtenir des informations sur l'espacement mini-

mal entre le module et le corps humain.Pour les cas d'utilisation Portables, l'exposition aux frquences radio ou l'valuation du SAR n'est pas ncessaire lorsque les distances de sparation du corps humain sont gales ou suprieures 40 mm. Pour les cas d'utilisation Portables, l'exposition aux frquences radio ou l'valuation du SAR n'est pas ncessaire lorsque les distances de sparation du corps humain sont gales ou suprieures 40 mm La dclaration dexposition RF ou l'valuation DAS n'est pas ncessaire lorsque la distance de sparation est identique ou suprieure celle indique ci-dessus. Si la distance de sparation est infrieure celle mentionnes plus haut, il incombe l'intgrateur OEM de procd une valuation DAS. Responsabilits des OEM pour une mise en conformit avec le Rglement du Circuit Intgr Le module WFM200S a t approuv pour l'intgration dans des produits finaux exclusivement raliss par des OEM sous les condi-

tions suivantes:

L'antenne (s) doit tre installe de sorte qu'une distance de sparation minimale indique ci-dessus soit maintenue entre le radiateur

(antenne) et toutes les personnes avoisinante, ce tout moment. Le module metteur ne doit pas tre localis ou fonctionner avec une autre antenne ou un autre transmetteur que celle indique plus haut. Tant que les deux conditions ci-dessus sont respectes, il nest pas ncessaire de tester ce transmetteur de faon plus pousse. Ce-

pendant, il incombe lintgrateur OEM de sassurer de la bonne conformit du produit fini avec les autres normes auxquelles il pour-

rait tre soumis de fait de lutilisation de ce module (par exemple, les missions des priphriques numriques, les exigences de p-

riphriques PC, etc.). REMARQUE IMPORTANTE Dans le cas o ces conditions ne peuvent tre satisfaites (pour certaines configurations ou co-implantation avec un autre metteur), l'autorisation ISED n'est plus considre comme valide et le numro didentification ID IC ne peut pas tre appos sur le produit final. Dans ces circonstances, l'intgrateur OEM sera responsable de la rvaluation du produit final (y compris le transmetteur) et de l'ob-

tention d'une autorisation ISED distincte. tiquetage des produits finis Le produit dans lequel le module est install devra porter une tiquette faisant apparaitre la rfrence du module intgr. Dans un tel cas, sur le produit final doit se trouver une tiquette aisment lisible sur laquelle figurent les informations suivantes:

Contient le module transmetteur IC: 5123A-WFM200 ou Contient le circuit IC: 5123A-WFM200 L'intgrateur OEM doit tre conscient quil ne doit pas fournir, dans le manuel dutilisation, d'informations relatives la faon d'installer ou de denlever ce module RF ainsi que sur la procdure suivre pour modifier les paramtres lis la radio. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 42 WFM200S Data Sheet Certifications 12.5 Japan The WFM200S modules are certified in Japan with certification number 006-000781 Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment places the certification mark and certification number on the outside of the host equipment (same marking/number might also appear on the label of the radio module). The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Certification Text to be Placed on the Outside Surface of the Host Equipment:

Translation of the text:

This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law. The "Giteki" mark shown in the following figures must be affixed to an easily noticeable section of the specified radio equipment. Note: Additional information may be required if the device is also subject to a telecom approval. Figure 12.1. GITEKI Mark and ID Figure 12.2. Detail of GITEKI Mark silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 43 WFM200S Data Sheet Certifications 12.6 Locating the Module Close to Human Body When using the module in an application where the radio is located close to human body, the human RF exposure must be evaluated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard will require a differ-

ent minimum separation distance between the module and human body. Certification of WFM200S allows for the minimum separation distances detailed in Table 12.2 Minimum Separation Distances for SAR Evaluation Exemption on page 44 in Portable use cases

(less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF expo-

sure evaluation. Table 12.2. Minimum Separation Distances for SAR Evaluation Exemption Certification WFM200S with embedded antenna WFM200S with external reference dipole antenna FCC ISED CE 23 mm 40 mm 23 mm 40 mm The RF exposure must always be evaluated using the end-product when transmitting with power levels higher than 20 mW = 13 dBm. For FCC and ISED, using the module in end products where the separation distance is smaller than those listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the end-product in all cases. Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus reducing range. silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 44 WFM200S Data Sheet Revision History 13. Revision History Revision 0.51 October 2019 Minor updates to Certifications section September 2019 Updated Sections 2,3, and 5 with new text Minor specification updates in section 4 Revision 0.3 July 2019 Updated Pin Descriptions, Package Outline and Land Pattern sections with new pinout Revision 0.31 August 2019 Updated pin description for pin 47 Revision 0.32 August 2019 Added Certifications section Revision 0.5 silabs.com | Building a more connected world. Preliminary Rev. 0.51 | 45 46 Smart. Connected. Energy-Friendly.Productswww.silabs.com/productsQualitywww.silabs.com/qualitySupport and Communitycommunity.silabs.comhttp://www.silabs.comSilicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USADisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.Trademark InformationSilicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, ClockBuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, Gecko OS, Gecko OS Studio, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress , Zentri, the Zentri logo and Zentri DMS, Z-Wave, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.

UG395: WFM200 Hardware Design User's Guide This document provides information to help users design Wi-Fi applications using the WFM200. KEY FEATURES Schematics guidelines BOM selection guideline Antenna matching guideline Layout guideline Package information Certification guideline silabs.com | Building a more connected world. This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Preliminary Rev. 0.1

. Table of Contents

. 1. WFM200 Pinout 2. Device Configuration . 3. Features Description . 3.1 WFM200 RF Ports. 3.2 Host Interface . 3.3 Programmable Pins . 3.3.1 Multi-Protocol Coexistence . 3.3.2 FEM . 3.3.3 Common Features for Programmable Pins . 4. Power Supplies . 5. Application Schematic Recommendations

. 5.1 Power Supplies Schematics . 5.2 RF Ports Schematics . 6. Typical Application Schematics 7. Layout Recommendations

. 3.4 Clocks . 7.1 Generic RF Layout Considerations . 7.2 GND and RF Pads Including the Diversity Port and External Antennas . 7.3 Module Antenna . 7.3.1 Small Board Size Recommendations for Good RF Performance . 7.3.2 Extended X Dimension Recommendation for Good RF Performance . 7.3.3 Y Dimension (65 to 80 mm) Recommendation for Good RF Performance . 7.3.4 Y Dimension (80 mm or Larger) Recommendation for Good RF Performance . 7.3.5 WFM200 Portion One Corner Bias with 3 mm Metal Keep-Outs . 7.3.6 Recommended Antenna Loop Trace Capacitor Values . 7.4 WFM200 Reference Evaluation Board . 8. Recommendations for Certification . 8.1 Qualified External Antenna Type . 8.2 Certified Module Antenna . 8.3 CE Certification Requirements. 9. Package Outline

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. 35 silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 2 1. WFM200 Pinout WFM200 is a 6.5 x 6.5 mm LGA module. The diagram below describes the pinout (top view). UG395: WFM200 Hardware Design User's Guide WFM200 Pinout Figure 1.1. WFM200 Pinout Table 1.1. WFM200 Pin Description Pin #

WFM200 Pin Name Description 1 2 3 4, 5, 6, 7, 8 9 10 11 12 13 14 15 16 17 GND 2G4ANT_IN, or No Connect on OPN with no integral antenna Embedded 2.4 GHz antenna port. To use the antenna, connect this pin to RF_1. RF_1 GND RF_2 VDD_PA GND RESETn 50 RF_1 input/output port. If not used, this pin should be connected to GND through a 50 resistor. 50 RF_2 input/output port. If not used, this pin should be connected to GND through a 50 resistor. Power supply for the power amplifier. RESET pin, active Low. GPIO/WUP This pin can be used to wake-up the device from sleep mode or as a GPIO. GPIO/PTA_TX_CONF GPIO/PTA_RF_ACT GPIO/PTA_STATUS GPIO/PTA_FREQ As part of PTA interface, these pins can be used to manage co-existence with another 2.4 GHz radio or can be used as a GPIO. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 3 Pin #

WFM200 Pin Name Description UG395: WFM200 Hardware Design User's Guide WFM200 Pinout 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 LP_CLK GPIO/WIRQ VDD GND Low Power clock input. This pin is typically connected to the 32 kHz clock. If not used, the pin should be connected to GND. This pin can be used as an IRQ from WFM200 to host to indicate that a message or data should be read or can be used as a GPIO if the WIRQ is done using SDIO_DAT1/SPI_WIRQ. Power supply for the digital and RF parts. SDIO_CLK/SPI_CLK Host interface: SDIO_CLK or SPI_CLK. SDIO_CMD/SPI_MOSI Host interface: SDIO_CMD or SPI_MOSI. SDIO_DAT0/SPI_MISO Host interface: SDIO_DAT0 or SPI_MISO. SDIO_DAT1/SPI_WIRQ Host interface: SDIO_DAT1 or WIRQ. SDIO_DAT2/HIF_SEL Host interface selection: Used to select the host interface during reset rising edge. If Low, selects SPI interface. When High, selects SDIO interface and this pin becomes SDIO_DAT2. SDIO_DAT3/SPI_CSn Host interface: SDIO_DAT3 or SPI_CSn. VDD_IO GPIO/FEM_1 GPIO/FEM_2 GPIO/FEM_3 GPIO/FEM_4 GND Power supply for I/Os. These pins can be used for dynamic control of an external front-end module

(FEM); otherwise, they can be used as a GPIO. This pin can be used for dynamic control of an external Power Amplifier;

otherwise, this pin can be used as a GPIO. GPIO/FEM_PDET(2) This pin can be used as an analog input to be connected to a Power Ampli-

fier Vdet output whenever an external Power amplifier or a FEM is used. Otherwise, it can be used as a GPIO. 35, 36 37 38 39 40 41, 42, 43, 44, 45, 46, GND GPIO/FEM_6 GPIO/FEM_5 RESERVE_1 RESERVE_2 GND These pins can be used for dynamic control of an external front-end module

(FEM); otherwise, this can be used as a GPIO. Reserved. For normal operation, this pin must be grounded. Reserved. Leave this pin unconnected. 47 ANT_LOOP, or No Connect on OPN with no integral antenna To use the embedded antenna, connect this pin to GND through the anten-

na loop capacitor. 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58 Note:

GND 1. All digital pins (GPIO/xx, host interface pins, RESETn, LP_CLK) are referred to VDD_IO voltage. 2. GPIO/FEM_PDET requires special care because it refers to VDD_IO voltage when configured as a GPIO. However,when config-

ured as FEM_PDET, this pin is an analog input pin with a 0 to 1.2 V range. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 4 UG395: WFM200 Hardware Design User's Guide Device Configuration 2. Device Configuration The configuration linked to the hardware platform (RF pins, configurable pins, etc.) is achieved through firmware by downloading a dedicated binary file (a PDS file, which stands for "Platform Data Set") just after firmware download and before operation. More details on device configuration will be provided in an upcoming application note. Table 2.1. WFM200 Pin Status and Impedance Pin #

Pin Name 3 9 12 13 14 15 16 17 18 19 29 30 31 32 34 37 38 RF_1 RF_2 RESETn GPIO/WUP PTA_TX_CONF PTA_RF_ACT PTA_STATUS PTA_FREQ LP_CLK GPIO_WIRQ GPIO/FEM_1 GPIO/FEM_2 GPIO/FEM_3 GPIO/FEM_4 GPIO/FEM_DET GPIO/FEM_6 GPIO/FEM_5 I/O I/O I/O I I/O I/O I/O I/O I/O I I/O I/O I/O I/O I/O I/O I/O I/O Configuration Reset1 After Boot 50 at 2442 MHz 50 at 2442 MHz 43 k pull-up resistor tristate tristate tristate tristate tristate tristate tristate tristate tristate tristate tristate tristate tristate no pull resistor according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS according to PDS Note:

1. All digital I/Os are in tristate except pin LP_CLK, which is configured as input. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 5 UG395: WFM200 Hardware Design User's Guide Features Description 3. Features Description 3.1 WFM200 RF Ports WFM200 has two Tx/Rx RF ports named RF_1 (pin 3) and RF_2 (pin 9). RF_1 and RF_2 have internal low-pass filtering and RF impe-

dance matching components to 50 in the 2.4 GHz band of operation. Any of the RF ports can be used in a similar way. However, note that RF_2 output power is around 1 dB lower than that of RF_1. Several configurations for the RF part are possible, as described below:

Single antenna: For this use case, any RF pin can be used. Antenna diversity without external FEM: In this case, both RF_1 and RF_2 ports are connected to their respective antennas and, over time, the WFM200 selects the antenna that provides the best budget link to optimize performance, range, and throughput. Use of an external Front-End Module (FEM): In this case, one port is used for Tx and the other for Rx. This RF configuration is set with the PDS file. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 6 3.2 Host Interface The host interface allows control of the WFM200 by an MCU or SoC using either SPI or SDIO. Selection between SPI and SDIO is done upon the logic state on the SDIO_DAT2/HIF_SEL pin during the rising edge of the RESETn signal. If this signal is HIGH, the host interface is configured as SDIO; otherwise, it is configured as SPI. These configurations are summarized in the table below:

Table 3.1. WFM200 Host Interface Configuration UG395: WFM200 Hardware Design User's Guide Features Description WFM200 Pin Name RESETn SDIO_DAT2/HIF_SEL SDIO_CLK/SPI_CLK SDIO_CMD/SPI_MOSI SDIO_DAT0/SPI_MISO SDIO_DAT1/SPI_WIRQ SDIO_DAT3/SPI_CSn SPI Mode 0 1 0 x x x x x 1 x SPI_CLK SPI_MOSI SPI_MISO WIRQ SPI_CSn SDIO Mode 0 1 1 x x x x x 1 SDIO_DAT2 SDIO_CLK SDIO_CMD SDIO_DAT0 SDIO_DAT1 SDIO_DAT3 Figure 3.1. WFM200 Power Up and Host Interface Timing Parameters Besides the host interface main signals, a couple of pins also complement the host interface. The GPIO/WIRQ pin is programmable and optionally can be used in SDIO mode to provide the interrupt request to the host if a given host does not support in-band IRQ. In SPI mode, the pin can be configured as a copy of SDIO_DAT1/SPI_WIRQ IRQ. The pin can also be used to wake up the host if it is in a power saving mode with the host interface inactive. If this is not required, the pin can be config-

ured as GPIO. The GPIO/WUP pin should be used by the host to wake up the WFM200 when in power-save mode. This pin is programmable and if power save mode is not enabled on the WFM200, this pin can be configured as a GPIO. Note that this pin should be LOW to enable the WFM200 to reach sleep or shutdown modes. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 7 UG395: WFM200 Hardware Design User's Guide Features Description 3.3 Programmable Pins 3.3.1 Multi-Protocol Coexistence If an RF transceiver using the same 2.4 GHz band (e.g., Bluetooth, Zigbee, or Thread) is located next to the WFM200 Wi-Fi transceiver, a Packet Transfer Arbitration (PTA) interface can be used to minimize mutual interference. In this case, PTA pins are connected to the other transceiver. The PTA interface is highly programmable and can use 1, 2, 3, or 4 pins upon configuration. Because PTA signal names can vary by manufacturer, the table below shows some alternative names. Pin #

14 15 16 17 Table 3.2. PTA Pins WFM200 Pin Name PTA_TX_CONF PTA_RF_ACT PTA_STATUS PTA_FREQ Potential Alternative Naming GRANT, WL_ACTIVE, WL_DENY REQUEST, BT_ACTIVE PRIORITY, BT_STATUS FREQ, BT_FREQ Details on PTA operation will be provided in an upcoming application note. 3.3.2 FEM FEM pins can be used to control a potential Front-End Module (FEM). The FEM interface is composed of seven pins as described be-

low:

FEM_PDET is an analog input that is connected to the Tx Power Amplifier detector output for Tx power control. The voltage range on this input is 0 to 1.2 V, which matches most of the power amplifier's detector output. FEM_4 is the signal to be used as the power amplifier enable. FEM_1 to FEM_3, FEM_5, and FEM_6 are used to dynamically control the FEM during Tx and Rx. All other FEM_x signals are configurable beause of an embedded LookUp Table. This configurability facilitates PCB layout because a given FEM control signal can be generated by any of these pins. The LUT also enables adapting to any FEM control logic. FEM signals can be configured by using the downloaded PDS file. Available pins can also be configured to monitor the WLAN activity, that is, to drive an LED during Tx and another one during Rx, or a single one during Tx/Rx. Details regarding FEM control and signals configurations will be provided in an upcoming application note. 3.3.3 Common Features for Programmable Pins In this section, programmable pins refer to GPIO/FEM_xx pins (7 pins), GPIO/PTA_xx pins (4 pins), GPIO/WUP and GPIO/WIRQ. Each of these pins has the following features:

Configurable slew rate to optimize power consumption. Programmable pull-up or pull-down. Resistance value for such pull-up or pull-down is 43 k typical. These features are available whether the pin is used as a GPIO or in functional mode and are configured through the PDS file. 3.4 Clocks The master clock oscillator is embedded in WFM200. It is calibrated in production and temperature compensated in firmware. Additionally, WFM200 has a provision for a 32 kHz clock input (LP_CLK pin) that allows the lowest power consumption (sleep state) while in power save mode. This clock can be used during sleep mode and should be a square wave with I/O levels complying with I/O pin requirements. Minimizing battery current between Rx beacons requires frequency drift of LP_CLK within 1 second to be lower than 100 ppm. Most hosts have 32 kHz that can be shared with WFM200. If there is no 32 kHz clock provided, this pin should be connected to ground. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 8 UG395: WFM200 Hardware Design User's Guide Power Supplies 4. Power Supplies WFM200 has three power supply pins. VDD_PA supplies the Power amplifier. Recommended to have VDD_PA as the highest supply voltage of WFM200. VDD supplies the core, i.e., both RF and digital parts. VDD_IO supplies the pins and determines the voltage levels on pins, so this voltage should be compatible with WFM200 peripher-

als. Bypass capacitors and filtering are included internally. If DC regulators are not placed sufficiently close to the supply pins to minimize trace inductance and voltage drop, then additional external bypass caps (ceramics) may be required depending on application. Similar-

ly, it is recommended to use external bypass caps and series ferrite beads for supply pins fed by the same supply. The requirements for these supplies are summarized in the table below:

Table 4.1. Power Supply Requirements Pin #

WFM200 Pin Name Min Voltage Max Voltage Typical Supply Current 10 20 28 VDD_PA VDD VDD_IO 3.0 V 1.62 V 1.62 V 3.6 V VDD_PA 3.6 V

~100 mA

~40 mA Upon SPI/SDIO frequency and load Note: Although VDD_PA is variable, the maximum TX power can be achieved only when VDD_PA is set to 3.3 V minimum. For exam-

ple, the TX power may be slightly lower if VDD_PA is set to 3.0 V. There are no specific pin requirements on supplies sequencing except that all supply voltages should be settled at the rising edge of the RESETn pin, as shown in Figure 3.1 WFM200 Power Up and Host Interface Timing Parameters on page 7. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 9 UG395: WFM200 Hardware Design User's Guide Application Schematic Recommendations 5. Application Schematic Recommendations 5.1 Power Supplies Schematics Care should be taken that the VDD_PA supply source is capable of supplying enough current for the load peaks of the power amplifier

(which can go momentarily up to 200 mA), so it is recommended to select a regulator capable of supplying 300 mA. The peaks can be very fast, and the power supply for the module should be capable of reacting to load changes within 5 s. External high-frequency bypass capacitors are not needed because the module contains the required supply filter capacitors. However, care should be taken to prevent strong switching noise from being superimposed on the supply lines. Such noise can be generated, for example, by the onboard charge pump converters used in RS232 level shifters, in which case it is recommended to place series ferrite and decoupling capacitors with proper SRF at the switching noise frequencies on the supply lines connected. Silicon Labs reference expansion board design with the WFM200 SiP module utilizes a series ferrite with a 10 F decoupling capacitor between the external power regulator and SiP. Note that there is a total of about 2.3 F of low ESR ceramic capacitors inside the module connected directly on the supply input. When using external regulators to generate regulated supplies for the module, the stability of the regulator with the low ESR provided by these capacitors should be checked. Some low-drop linear regulators and some older switched mode regulators are not stable when ceramic output capacitors are used. The data sheet of the regulator typically lists recommendations concerning suitable capacitors, including data on ESR range and/or stability curves. A regulator should include the statement stable with ceramic capacitors. 5.2 RF Ports Schematics When using the module with the integrated antenna or an antenna external to the module, whether they are connectorized off-the-shelf antennas or PCB trace antennas, antenna impedance must be well matched to 50 to reduce distortion in the module power amplifier because of the impedance mismatch. The matching should be verified in the final enclosure, and it is recommended to reserve SMD placeholders for external antenna tuning. The suggested external antenna matching structure is a 3-element PI network. The optimum load impedance for each RF port is 50 , so externally, only the antenna matching components may be required. When using the integrated module antenna (with its required external GND loop trace on the top layer and copper clearance area ap-

plied on each layer), the RF_1 port needs to be connected to the 2G4ANT_IN port while externally only a capacitor is required on the antenna loop trace (C_ANT) to the GND. Unused RF port must be terminated to ground with a resistor between 47 and 51 . External antennas used with the Single Modular Transmitter are required to meet these specifications. For reference impedance of 50 , the VSWR must be less than or equal to 2:1 (which is the same as Return Loss higher than 9.5 dB), over the allowed operat-

ing frequency range for all operating conditions and production variations. The integral antenna on the reference board nominally achieves 18 dB return loss from 2412 MHz to 2462 MHz with reference impe-

dance of 50 . Production tolerance and variations over operating conditions of the main board can degrade this to 12 dB return loss. Production tolerance and variations over operating conditions of WFM200 module can further degrade up to VSWR = 2:1. If the hardware design guide is not properly followed, the resulting VSWR may be higher than 2:1 over operating conditions, which would require Tx Output Power to be reduced using PDS file Back Off, and possibly agency approval. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 10 6. Typical Application Schematics The following diagrams show simple applications using SDIO and SPI interfaces. UG395: WFM200 Hardware Design User's Guide Typical Application Schematics Figure 6.1. Application Using SDIO Interface silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 11 UG395: WFM200 Hardware Design User's Guide Typical Application Schematics Figure 6.2. Application Using SPI Interface silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 12 7. Layout Recommendations The figure below shows the WFM200 section of Silicon Labs reference board layout with some feature highlights. UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.1. WFM200 Portion of Reference Design Board Layout silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 13 UG395: WFM200 Hardware Design User's Guide Layout Recommendations 7.1 Generic RF Layout Considerations For custom designs, use the same number of PCB layers as are present in the reference design. Deviation from the reference PCB layer count can cause different PCB parasitic capacitances, which can detune the antenna matching network from its optimal form. If a design with a different number of layers than the reference design is necessary, make sure that the distance between the top layer and the first inner layer is similar to that found in the reference design because this distance determines the parasitic capacitance value to ground. Otherwise, detuning of the matching network is possible, and fine tuning of the component values may be required. The Silicon Labs development kit uses a 1.6 mm thick FR-4 PCB with the board stack-up detailed in the figure below. For best performance, use the following guidelines for custom layout designs:

Use as much continuous and unified ground plane metallization as possible, especially on the top and bottom layers. Use as many ground stitching vias as possible, especially near the GND pins, to minimize series parasitic inductance between the ground pours of different layers and between the GND pins. Use a series of GND stitching vias along the PCB edges and internal GND metal pouring edges. The maximum distance between the vias should be less than lambda/10 of the 10th harmonic (the typical distance between vias on a reference design is 1 mm). This distance is required to reduce the PCB radiation at higher harmonics caused by the fringing field of these edges. For designs with more than two layers, it is recommended to put as many traces (even the digital traces) as possible in an inner layer and ensure large, continuous GND pours on the top and bottom layers, while keeping the GND pour metallization unbroken beneath the RF areas (between the antenna, matching network, and module). To benefit from parasitic decoupling capacitance, the inner layer can be used to route the power supply with a wide VDD_PA sub-plane and traces to increase parasitic capacitance with nearby ground layers. Avoid using long and/or thin transmission lines to connect the RF-related components. Otherwise, because of their distributed para-

sitic inductance, some detuning effects can occur. Also, shorten the interconnection lines as much as possible to reduce the parallel parasitic caps to the ground. However, couplings between neighbor discrete components may increase in this way. Route traces (especially the supply and digital lines) on inner layers for boards with more than two layers. To achieve good RF ground on the layout, it is recommended to add large, continuous GND metallization on the top layer in the area of the RF section (at a minimum). Better performance may be obtained if this is applied to the entire PCB. To provide a good RF ground, the RF voltage potentials should be equal along the entire GND area as this helps maintain good supply filtering. Any gap on each PCB layer should ideally be filled with GND metal and the resulting sections on the top and bottom layers should be con-

nected with as many vias as possible. Because of the layout restrictions, such as traces routed on other layers or components on the bottom side, vias are not used on the entire GND section. Use tapered lines between transmission lines with different widths (i.e., different impedances) to reduce internal reflections. Avoid using loops and long wires to obviate their resonances. They also result in unwanted radiation, especially at the harmonics. Avoid routing GPIO lines close or beneath the RF lines, antenna, or crystal, or in parallel with a crystal signal. Use the lowest slew rate possible on GPIO lines to decrease crosstalk to RF or crystal signals. Use as many parallel grounding vias at the GND metal edges as possible, especially at the edge of the PCB and along the supply traces, to reduce their harmonic radiation caused by the fringing field. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 14 UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.2. Reference Design PCB Specification silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 15 UG395: WFM200 Hardware Design User's Guide Layout Recommendations 7.2 GND and RF Pads Including the Diversity Port and External Antennas WFM200 ground pads need to be well connected to the PCB ground plane to optimize thermal conductivity and prevent unwanted emissions that result from ground currents. The RF pads and RF traces conducting the RF signal should be dimensioned to have a characteristic impedance of 50 . It is vital that proper RF design principles be used when designing an application using the RF pads. Antennas external to the module, be they connectorized, off-the-shelf antennas or PCB trace antennas, must be well-matched to 50 . PCB size and layout recommendations from the antenna manufacturer must be followed. Board size, ground plane size, plastic enclo-

sures, metal shielding, and components in close proximity to the antenna can affect the antenna impedance and radiation pattern. Therefore, antenna matching should be verified in the final enclosure. See Section 5.2 for antenna specifications. Ensuring proper antenna impedance matching is also recommended to prevent distortion in the module power amplifier because of the impedance mismatch. PA distortion can cause significant packet loss and poor overall performance. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 16 UG395: WFM200 Hardware Design User's Guide Layout Recommendations 7.3 Module Antenna To minimize impedance detuning and degradation of the radiation pattern, reduce as much shielding of the selected antenna as possi-

ble. The ground plane usually forms an important part of the antenna as there is significant current running along the ground plane (i.e., the GND plane is also part of any monopole-type antenna, in general). For optimal performance when using an integral antenna, ensure that the PCB size is at least 55 mm ( 3mm) in width and follow the layout recommendations for the different host PCB sizes as de-

tailed in this section. These layout drawing solutions are patented by Silicon Labs. For optimal performance of the WFM200 module antenna, follow these generic guidelines:

Place the module at the edge of the carrier PCB where the centers of pins 1, 47, and 49 are 1.8 mm away from the metal edge of the PCB. Do not place any metal (traces, components, etc.) in the antenna clearance area. This keep-out applies on each layer. The form and dimensions of the antenna clearance area are shown in Section 10 of this document. Connect all ground pads directly to a solid ground plane and place the ground stitching vias close to the ground pads. The recom-

mended GND via stitching placement for WFM200 is shown in Figure 7.3 Grounding and Via Stitching of WFM200 Part on page 17. Using size, thickness, or permittivity for the main board other than optimum requires tuning and testing to re-optimize antenna loop trace capacitor value (C_ANT). The default capacitor value is C_ANT = 0.9 pF in an SMD0201 package. Additionally, a series-matching capacitor/inductor between the 2G4ANT_IN and RF_1 ports can also be utilized for fine impedance tuning (C_SER). The default configuration of C_SER is a 0 jumper as shown in Figure 7.1 WFM200 Portion of Reference Design Board Layout on page 13 above. The area occupied by WFM200, its required loop trace, and keep-out is 8.5 mm x 13.5 mm = 115 mm2. The rest of the required area can have components and traces which are surrounded by GND fill, especially 1 mm wide around the perimeter of the placement areas, which amounts to 120 mm2. There can be no cable connections within the required area during TX operation except for the UFL connector for the second RF I/O port in the location shown just north of WFM200 and away from the edge (refer to the figure below). The co-ax cable must exit the northern placement area over the allowed GND bridge or routing area between the WFM200 required board portion and the rest of the main board portion. Any digital component added to the loop side and supply side could degrade WFM200 sensitivity because of signal harmonics falling into Wi-Fi band. To get lower than 0.5 dB desensitization, the radiated level of CW interference measured at pin 2G4ANT_IN should be less than -108 dBm. To get lower than 3 dB desensitization, the level of AWGN-like interference measured at pin 2G4ANT_IN in channel bandwidth should be less than -94 dBm. Figure 7.3. Grounding and Via Stitching of WFM200 Part silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 17 7.3.1 Small Board Size Recommendations for Good RF Performance UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.4. Reference Design for Small PCB Sizes Note: Spaces filled in black represent metal keep-outs on the PCB in the figure above. Required WFM200 Board size in X = 17.5 mm 3 mm of metal. Required WFM200 Board size in Y = 55 mm 3 mm of metal. PCB may be slightly larger to account for PCB edge routing. Area for optimum performance is 55 mm z 17.5 mm = 963 mm2 The recommended board width is Y= 55 mm. Board widths up to Y= 65 mm still meet regulatory certifications but will result slightly degraded RF performance. Board size smaller than 17.5 mm x 55 mm will have lower antenna efficiency, more variation in return loss, and may require TX power to be reduced to meet RF performance specifications. If the carrier board width Y < 45 mm, then better RF performance can be achieved if the WFM200 module is shifted to the north, i.e., ensure larger (close to 22.5 mm) PCB metal width on the antenna clearance area side of WFM200. Otherwise, center pins 49 and 48 vertically. The center of pin 49 is 1.8 mm from the metal edge. Connectors are only allowed in the middle 18 mm adjacent to the occupied area. Components may be placed north and south of occupied area. The PCB must have continuous GND fill around the edge inboard to at least 1.8 mm with the exception of the occupied area as shown. Cables must exit from the connector area directly away from the designated occupied area. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 18 7.3.2 Extended X Dimension Recommendation for Good RF Performance UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.5. Reference Design for Extended X-dimensioned PCB Sizes*

Note: Spaces filled in black represent metal keep-outs on the PCB in the figure above.*

Required WFM200 portion size is X = 17.5 mm of metal. Required board size is Y = 55mm 3 mm of metal. PCB may be slightly larger to account for PCB edge routing. The recommended board width is Y = 55 mm. Board widths up to Y = 65 mm still meet regulatory certifications but will result in slightly degraded RF performance. Board width (Y) smaller than 55 mm will have lower antenna efficiency, more variation in return loss, and may require TX power to be reduced to meet RF performance specifications. If the carrier board width Y < 45 mm, then better RF performance can be achieved if the WFM200 module is shifted to north, i.e., ensure larger (close to 22.5 mm) PCB metal width on the antenna clearance area side of WFM200. Otherwise, center pins 49 and 48 vertically. Add 3 mm wide keep-outs adjacent to the designated component placement areas near WFM200, which allows only an 18 mm wide bridge of GND and signal routing area between the two PCB portions. The extension in X dimension can be any length. The center of pin 49 is 1.8 mm from the metal edge. Connectors are only allowed in the X dimension extension portion. Components may be placed north and south of the occupied area, but these must be surrounded by GND to the edge of the place-

ment areas. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 19 7.3.3 Y Dimension (65 to 80 mm) Recommendation for Good RF Performance UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.6. Reference Design for Extended X- and Slightly Extended Y-dimensioned PCB Sizes*

Note: Spaces filled in black represent metal keep-outs on the PCB in the figure above.*

Add 3 mm wide keep-outs adjacent to the designated Component Placement Areas near the WFM200, which allows only an 18 mm wide bridge of GND and signal routing area between the two PCB portions. The 20.5 mm corners beyond the placement areas must be metal keep-outs. PCB may be slightly larger to account for PCB edge routing. Main portion of the PCB X dimension can be any length. Main portion of PCB Y dimension can be any length over 65 mm. WF(M)200S portion of board X dimension is 17.5 mm +/-3 mm. WF(M)200S portion of board Y dimension is 45 mm to 55 mm. Pins 49 and 48 are to be centered vertically, and center of Pin 49 is 1.8 mm from metal edge. Connectors are only allowed in the Extension X dimension portion away from WFM200. Components may be placed north and south of the occupied area, but only within the designated component placement areas. Also, these must be surrounded by GND to the edge of the placement areas. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 20 7.3.4 Y Dimension (80 mm or Larger) Recommendation for Good RF Performance UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.7. Reference Design for Extended X- and Y-dimensioned PCB Sizes*

Note: Spaces filled in black represent metal keep-outs on the PCB in the figure above.*

WFM200 PCB portion size is X = 17.5 mm and Y= 45 mm of metal. PCB may be slightly larger to account for PCB edge routing. Main portion of PCB X dimension can be any length. The Y dimension of PCB may be of any length, however, 3 mm metal keep-outs must be placed as shown. There must only be an 18 mm x 3 mm area where traces and GND fill can bridge between the two portions of the PCB. Pins 49 and 48 are to be centered vertically, and the center of pin 49 is 1.8 mm from metal edge. Connectors are allowed in the extension X dimension portion away from WFM200. If connectors are placed in the 17.5 mm corners north or south of the designated component placement areas, testing must be per-

formed with cables in place to assure good RF performance. Components may be placed in the component placement areas, and north and south of these areas beyond the 3 mm metal keep-

out gap. Component placement areas must have GND surrounding them to the edge of the placement areas. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 21 7.3.5 WFM200 Portion One Corner Bias with 3 mm Metal Keep-Outs UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.8. Reference Design for Extended X- and Y-dimensioned PCB Sizes with WFM200 Portion in Corner*

Note: Spaces filled in black represent metal keep-outs on the PCB in the figure above.*

If the available metallization size of WFM200 section is equal to or smaller than 15 mm x 35 mm on a space-restricted design, then better performance can be achieved when the metal keep-out gap is set to 1 mm. Also, shift the WFM200 module to north to ensure close to 22.5 mm PCB metal width on the antenna loop side of the WFM200. The center of pin 49 is 1.8 mm from the metal edge. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 22 UG395: WFM200 Hardware Design User's Guide Layout Recommendations 7.3.6 Recommended Antenna Loop Trace Capacitor Values This sections provides guidelines for antenna matching component values for various board sizes. System integrators should verify the antenna impedance in their full application with all housings and connections attached and mounted. The antenna matching component values can be adjusted to achieve Max VSWR of 2:1 in the actual application. As the board size is reduced, the antenna gain also reduces, and it becomes more important to adjust these component values to meet 2:1 max VSWR. Table 7.1. Recommended BOM vs. PCB Size Carrier PCB Dimensions Size of WFM200 Section X [mm]

Y [mm]

X [mm]

Y [mm]

C_ANT

[pF]

C_SER Antenna Re-

alized Gain Typ. [dBi]

Notes 17.5 14.5 20.5 17.5 27 17.5 14 100 100 100 85 100 75 35 75 100 200 75 75 75 75 200 110 55 55 55 45 45 65 42 55 45 65 55 65 75 100 100 100 100 80 120 150 200 200 140 17.5 14.5 20.5 17.5 27 17.5 14 28 17.5 17.5 17.5 21.5 17.5 17.5 17.5 17.5 17.5 17.5 17.5 17.5 17.5 17.5 15 55 55 55 45 45 65 42 55 45 65 55 55 45 45 45 45 45 45 45 45 45 45 30 0.9 0.9 0.8 0.7 0.7 0.8 0.8 0.8 0.6 0.9 0.8 0.7 0.6 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.6 0 0 0 0 0 0 4.3 nH 0 0 0 0 1.8 pF 0 0 0 0 0 0 0 0 0 0 1.0 pF

+2.5

+2.4

+2.2

+2.2

+2.0

+2.0

+1.0

+2.8

+1.2

+3.3

+2.8

+4.0

+2.1

+2.4

+3.7

+2.2

+3.7

+3.6

+3.7

+2.0

+2.5

+2.8

+0.3 Small PCB size as shown in Figure 7.4 on page 18 Extended X-dimension PCB size as shown in Figure 7.5 on page 19 Maximum gain is +4.7 dBi. Configured as shown in Figure 7.5 on page 19 Extended PCB size as shown in Figure 7.6 on page 20 Extended PCB size as shown in Figure 7.7 on page 21 Ext. PCB size, in corner, as shown in Figure 7.8 on page 22 Note:

1. C_SER can be a series tuning capacitor [pF] / inductor [nH] option mounted between the 2G4ANT_IN and RF_1 ports for carrier boards with small GND metallization size. C_ANT is the antenna loop trace capacitor. 2. Using FR-4 Carrier PCB with a relative permittivity of r = 4.4 10%

3. The recommended component values provided in this table might need to be optimized on a custom design within its final enclo-

sure by measuring S11 at pin 2G4ANT_IN to ensure VSWR antenna requirements are met. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 23 7.4 WFM200 Reference Evaluation Board UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.9. WFM200 Evaluation Board Design with Expansion Header The carrier board size is 84 mm x 55 mm. The WFM200 section has a metallization of 17.5 mm x 55 mm. Figure 7.10. WFM200 Evaluation Board with Raspberry PI Connected and Reference Coordinates The following two-dimensional radiation pattern plots have been measured on the BRD8023A evaluation board using the integrated module antenna and being connected together with the Raspberry Pi:

silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 24 UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.11. 2D Radiation Pattern of WFM200 Evaluation Board Top View Figure 7.12. 2D Radiation Pattern of WFM200 Evaluation Board Side View silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 25 UG395: WFM200 Hardware Design User's Guide Layout Recommendations Figure 7.13. 2D Radiation Pattern of WFM200 Evaluation Board Rear View Note: The X and Y axis are in the PCB plane cut as shown in the previous section, while the Z axis is orthogonal to the PCB. The typical antenna gain is +3.0 dBi and the antenna efficiency is -1 dB (= ~80%). silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 26 UG395: WFM200 Hardware Design User's Guide Recommendations for Certification 8. Recommendations for Certification This section provides additional information on the certification details already provided in the WFM200 data sheet. WFM200 embeds TX power backoffs for 2:1 VSWR on its RF ports and is certified with an external connectorized coaxial dipole anten-

na and an integrated module antenna. Except for minor cosmetic changes, most changes to an FCC certified equipment require testing to determine whether the change is a Class I or Class II permissive change. For more details about using the Single Modular Transmitter, such as WFM200, refer to the following FCC documents:

KDB 996369 D01 Transmitter Module Equipment Authorization Guide KDB 996369 D02 Frequently Asked Questions and Answers about Modules KDB 178919 D01 Permissive Change Policy KDB 178919 D02 Permissive Change Frequently-Asked Questions Certification was performed with:

Linux driver 2.2.4 WLAN firmware FW3.0.1 8.1 Qualified External Antenna Type The WFM200 SiP module has been certified in multiple regions and is designed to operate with a connectorized whip dipole antenna type with a reference impedance of 50 . FCC certification is restricted to external antennas of this type. The maximum antenna gain is

+4.7 dBi. System integrators must comply with all regulatory agency requirements for the applicable regions including FCC, IC, and CE, especially those governing antennas used with this module. Table 8.1. Certified and Approved External Antennas and Board Sizes External Antenna Type Specification for max. VSWR Specified Max. Gain [dBi]

Notes Connectorized Whip Dipole 2:1

+4.7 Straight or 90 degrees bent W1038 anten-

na, or similar type silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 27 UG395: WFM200 Hardware Design User's Guide Recommendations for Certification 8.2 Certified Module Antenna The WFM200 SiP module has also been certified and designed to operate with the integrated module antenna. When using the module antenna, customer designs should ensure that the layout recommendations are carefully being followed as described in the previous sections in this document. The maximum module antenna gain with an appropriate carrier board size and proper layout design is +4.7 dBi with a maximum VSWR of 2:1 across frequency band 2412-2462 MHz. The antenna total radiation efficiency is about -1 dB (=

~80%). Customer designs which do not follow this hardware guideline may not meet Max VSWR over production part-to-part variation and/or across the Wi-Fi frequency band of interest. The customer should configure additional backoffs within the PDS for the worst-case VSWR achievable by the design. To reduce the probability of needing to configure such additional backoffs, use the BOM and PCB ground antenna area sizes as discussed in Section 7.3. Module Antenna. Certified and approved board sizes and BOM are provided in the table below. Table 8.2. Certification Board Dimensions and BOM with Integral on-Module Antenna Carrier PCB Dimensions Y [mm]

X [mm]

Size of WFM200 Section Y [mm]

X [mm]

C_ANT [pF]

C_SER [pF]

Antenna Realized Gain Max. [dBi]

100 3 65 3 21.5 55 0.7 1.8

+4.7 Note:

1. Using an FR-4 host board PCB with a relative permittivity of r = 4.4 10%. This device is certified based on the board size with the maximum antenna gain (100 mm x 65 mm overall, and 55 mm x 21.5 mm WFM200S portion) and the two external components for the loop antenna, which have values optimized to minimize mismatch loss. Although this board size is valid to use, the recommended board size (55 mm x 17.5 mm) with the recommend nominal component values results in a smaller overall solution size and allows for a wider range of board size and production variations. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 28 UG395: WFM200 Hardware Design User's Guide Recommendations for Certification 8.3 CE Certification Requirements The Certification in CE Regions requires lower TX Power for the 1 Mbps and 2 Mbps 802.11b modulations. The amount of power re-

duction is based on the actual Max Gain specification of the Antenna used in the application. When the antenna gain reduces by 0.25 dB, the application may use 0.25 dB higher power settings for these two modulations. Use the PDS file for this purpose. The two affec-

ted modulations are in Mod_Group_0. This section provides the minimum amount of TX Power Back Off necessary in the PDS file for Mod_Group_0 for specific channels, for a given Antenna Max Gain Specification. As stated in previous sections, the highest gain anten-

na allowed is 4.7 dBi. The first column in the table below shows the Specified Max Antenna Gain for the application in CE Regions. If the exact value is not found, use the next higher gain specification provided in the table. The values to the right of the antenna gain are the minimum values for TX Power Back Off in quarter dB steps, which are required to go into the PDS file for the given operating Wi-Fi Channels. More back off than given here may be applied for other concerns. CE Certified and Approved PDS File Minimum TX Power Back Off based on Antenna Max Gain Specification Table 8.3. Required Minimum TX Power Back Off to Apply in PDS according to Maximum Antenna Gain Antenna Max Gain dBi CE Minimum PDS File TX Power Back Off in quarter dB steps CH1, CH2, CH3-CH9, 2412-2417 MHz 2422-2452 MHz CH10, CH11, 2457-2462 MHz CH12, CH13, 2467-2472 MHz 4.7 4.45 4.2 3.95 3.7 3.45 3.2 2.95 2.7 2.45 2.2 1.95 8 7 6 5 4 3 2 1 0 0 0 0 11 10 9 8 7 6 5 4 3 2 1 0 9 8 7 6 5 4 3 2 1 0 0 0 5 4 3 2 1 0 0 0 0 0 0 0 Clear Channel Assessment must be configured in absolute mode to meet CE requirements. This is achievable with Linux driver 2.2.4 by sending the following command to WFM200 after firmware download and before connect-

ing the the Access Point:

"sudo su" + "echo -en "\x0c\x00\x06\x04\x03\x20\x04\x00\x01\x00\x00\x00" > /sys/kernel/debug/ieee80211/

phy*/wfx/send_hif_msg"

silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 29 9. Package Outline UG395: WFM200 Hardware Design User's Guide Package Outline BOTTOM VIEW silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 30 UG395: WFM200 Hardware Design User's Guide Package Outline Dimension A A1 A2 b D e E L L1 L2 L3 L4 L5 aaa bbb ccc ddd eee Table 9.1. Top Marking Description MIN 1.20 0.26 0.95 0.27 0.43 0.11 0.34 0.24 0.14 0.62 NOM 1.30 0.30 1.00 0.32 6.50 BSC 0.50 BSC 6.50 BSC 0.48 0.16 0.39 0.29 0.19 0.67 0.10 0.10 0.10 0.10 0.10 MAX 1.40 0.34 1.05 0.37 0.53 0.21 0.44 0.34 0.24 0.72 silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 31 Dimension MIN NOM MAX UG395: WFM200 Hardware Design User's Guide Package Outline Note:

1. All dimensions in millimeters (mms). 2. Unless otherwise specified tolerances are:

a. Decimal:

X.X = 0.1 X.XX = 0.05 X.XXX = 0.03 b. Angular: 0.1 (In Deg) 3. Hatching lines means package shielding area. 4. Dimensioning and Tolerance per ANSI Y14.5M-1994. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 32 10. Integral Antenna Loop and Keep-Out Required Dimensions UG395: WFM200 Hardware Design User's Guide Integral Antenna Loop and Keep-Out Required Dimensions Figure 10.1. Integral Antenna Loop and Keep-Out Required Dimensions silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 33 UG395: WFM200 Hardware Design User's Guide Integral Antenna Loop and Keep-Out Required Dimensions Figure 10.2. Dimensions and Coordinates for Integral Antenna Loop and Keep-Out Areas of WFM200 silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 34 11. Recommended PCB Land Pattern UG395: WFM200 Hardware Design User's Guide Recommended PCB Land Pattern Table 11.1. PCB Land Pattern Dimensions mm 0.32 5.50 4.77 3.70 2.63 1.65 4.00 0.05 1.00 0.60 0.15 0.50 5.70 5.10 2.92 2.85 Dim b D1 D2 D3 D4 D5 D6 D7 eD1 eD2 eD3 e E1 E2 E3 E4 silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 35 Dim E5 E6 E7 E8 E9 L L1 eE1 eE2 UG395: WFM200 Hardware Design User's Guide Recommended PCB Land Pattern mm 1.65 4.50 2.40 1.20 4.50 0.48 0.67 0.60 0.60 Note:

1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 2. Dimensioning and Tolerance is per the ANSI Y14.5M-1994 specification. Table 11.2. Stencil Design Pad No. Pad Size (mm) 47 1 2 9 10 19 20 31 32 36 45 49 46 50 51 52 55 58 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.32 x 0.48 0.67 x 0.67 0.67 x 0.67 0.67 x 0.67 0.67 x 0.67 0.67 x 0.67 Pad Coordinates (X, Y) Pad Center Origin (0,0)

(0.00, -1.60)

(0.00, -2.10)

(0.00, -5.60)

(0.60, -5.75)

(5.10, -5.75)

(5.70, -5.60)

(5.70, -0.10)

(5.10, -0.05)

(5.10, -1.65)

(0.60, -1.65)

(0.00, -1.00)

(2.92, 0.00)

(4.05, -2.63)

(2.85, -2.63)

(1.65, -2.63)

(1.65, -3.70)

(1.65, -4.77) Note:

1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.100 mm (4 mils). 3. The stencil aperture to land pad size recommendation is 70% paste coverage. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 36 Smart. Connected. Energy-Friendly.Productswww.silabs.com/productsQualitywww.silabs.com/qualitySupport and Communitycommunity.silabs.comhttp://www.silabs.comSilicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USADisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.Trademark InformationSilicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, ClockBuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, Gecko OS, Gecko OS Studio, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress , Zentri, the Zentri logo and Zentri DMS, Z-Wave, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.

Photos of the Wi-Fi 802.11bgn wireless radio modules with model names: WFM200SA and WFM200SN Figure 1: Top (front) view of WFM200SA and WFM200SN Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 1 of 5 Figure 2: Bottom (rear) view of WFM200SA and WFM200SN Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 2 of 5 Markings of the Wi-Fi 802.11bgn wireless radio modules with model names: WFM200SA and WFM200SN Figure 3: Top shield markings of WFM200SA Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 3 of 5 Figure 4: Top shield markings of WFM200SN Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 4 of 5 Packaging label with information related to regulatory certifications, attached to the reels containing the Wi-Fi 802.11bgn wireless radio modules with model names:

WFM200SA and WFM200SN Figure 5: Packaging Label of WFM200SA and WFM200SN Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 5 of 5

SILICON LABS Confidentiality Request Letter SGS North America Inc. 620 Old Peachtree Road, SUITE 100 Suwanee, Georgia, United States Attn:

Re:

To Whom it May Concern / Application Examiner! Review Engineer! Officer in Charge Confidentiality request regarding application for FCC ID: QOQWFM200 Dear Madam or Sir, We, Silicon Laboratories Finland Oy, a corporation validly organized and existing under the laws of Finland, having its principal place of business at Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland,

> LONG TERM CONFIDENTIALITY <

pursuant to 47 CFR Section 0.459 and 0.457 of the commissions rules, hereby request confidential treatment of the documents listed below, associated with the certification application referenced above. Schematic(s) Block Diagrams Operational Descriptions Parts List I BOM The documents above contain proprietary information not released to the public. Public disclosure of this information may prove harmful to the business of the applicant.

> Short TERM CONFIDENTIALITY <

Additionally, we request the following documents be held confidential until the device is marketed or 180 days from the grant date, whichever is less. applicant will notify the TCB per FCC KDB 726920 DOl Confidentiality Request Procedures. If the device is marketed within 180 days of the Grant Date, the None Should there be any query regarding this request, please do not hesitate to contact the undersigned. Thank you for your attention to this matter. Place and date of issue (of this letter):7,/

Espoo September 25 2019 Senior Contact: Pasi Rahikkala Job Title: Staff Hardware Engineer, loT Wireless Modules Email: pasi.rahikkala@silabs.com Silicon Laboratories Finland Dy Alberga Business Park Bertel Jungin aukio 3 Fl-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com

SILICON LABS Cover Letter SGS North America Inc. 620 Old Peachtree Road, SUITE 100 Suwanee, Georgia, United States Afin:

Re:

To Whom it May Concern / Application Examiner / Review Engineer / Officer in Charge Cover letter regarding the application for FCC ID: QOQWFM200 Dear Madam or Sir, We, Silicon Laboratories Finland Oy, a corporation validly organized and existing under the laws of Finland, having its principal place of business at Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland, hereby state that we would like to apply for the full modular grant of our Wi-Fl modules having model names of WFM200SA and WFM200SN. The same grant, under the same FCC ID, should cover both models as a family, where the only difference between the models is described at the end of the next paragraph. Our devices are low-power Wi-Fl 802.11 bgn SIP transceiver radio modules, operating at a bandwidth up to 20MHz, targeted to, but not limited to, function within Linux-based host systems as loT network co-processors for connectivity to WLANs, enabling wireless communication of data and audio for the end-products they are going to be embedded in. The wireless chipset within each module comes with two RE ports which are routed to two corresponding modules RF pins. An end-product manufacturer can decide to connect external antenna to RE1 and/or RF2 via the exposed RE pins. An unused RE port should be 500 terminated. Reason for connecting both external antennas would be to implement the supported switched diversity. However, there is no MIMO functionality, and there is never simultaneous transmission out of the antennas, since an internal switch redirects the RF signal to either RF1 or RF2, where RF2 has 1dB less TX power compared to RF1. Only the A-variant, WFM200SA, has an embedded antenna assembled, so a customer might want to use It, instead of an external antenna, by shorting the RF1 pin with the adjacent ANT_IN pin using a 00 resistor; the embedded antenna being or not being assembled is in fact the only difference between the models WFM200SA and WFM200SN, and the more complete variant (the A-variant) has been under compliance testing since it covers all possible test cases and scenarios. Should there be any query regarding this request, please do not hesitate to contact the undersigned. Thank you for your attention to this matter. Place and date of issue (of thsleff):

Espoo, September Senior Contact: Pasi Rahikkala Job Title: Staff Hardware Engineer, loT Wireless Modules Email: pasi.rahikkala@silabs.com Silicon Laboratories Finland Oy Alberga Business Park Bertel Jungin aukio 3 Fl-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com

SILICON LABS Modular Request Letter SGS North America Inc. 620 Old Peachtree Road, SUITE 100 Suwanee, Georgia, United States Attn:

Re:

To Whom it May Concern / Application Examiner / Review Engineer / Officer in Charge Request for FCC module certification, FCC ID: QOQWFM200 Dear Madam or Sir, We, Silicon Laboratories Finland Oy, a corporation validly organized and existing under the laws of Finland, having its principal place of business at Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland, hereby request a Full Modular certification for the FCC ID referenced above. The device meets the requirements indicated below as outlined in the FCC KDB 996369 DOl Module Equip Auth Guide vOl r04 The device has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal;

The device has power supply regulation on the module, except for the last stage PA; the device is proven to be compliant between the mm and max supply voltage being instructed in the integration manual, and the firmware prevents operation when the supply voltage is outside the indicated range; a pre-approval for this case exists, KDB Tracking Number 935357 The device has a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b);

The device has demonstrated compliance in a stand-alone configuration;

The device will not be labeled with a permanently affixed FCC ID label due to the small size;

the ID is printed in the packaging label, and the integration manual mentions the ID and the need by the integrator to refer to the ID in the end-product labelling. The device does comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee;

The device does comply with RF exposure requirements. Should there be any query regarding this request, please do not hesitate to contact the undersigned. Thank you for your attention to this matter. Place and date of issue (of thiIetter):

Espoo, September 25 Senior Contact: Pasi Rahikkala Job Title: Staff Hardware Engineer, loT Wireless Modules Email: pasi.rahikkala silabs.com Silicon Laboratories Finland Oy Alberga Business Park Bertel Jungin aukio 3 Fl-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com