TI CC3000 Evaluation Module User's Guide Literature Number: SWRU326 November 2012 Contents Preface ....................................................................................................................................... 4 Introduction ........................................................................................................................ 5 1 CC3000 EM Board ............................................................................................................... 6 2 EM Board Top View ........................................................................................................ 6 2.1 EM Board Bottom View .................................................................................................... 9 2.2 Antenna ..................................................................................................................... 10 2.3 Hardware Setup ........................................................................................................... 13 2.4 Schematics ................................................................................................................. 14 2.5 Bill of Materials (BOM) .................................................................................................... 15 2.6 Layout Guidelines ............................................................................................................. 16 Application Development ................................................................................................... 21 3 4 2 Contents Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback www.ti.com List of Figures CC3000 EM Board Top View.............................................................................................. 6 2-1. CC3000 EM Board Bottom View.......................................................................................... 9 2-2. Antenna Location and RF Trace Routing .............................................................................. 10 2-3. 2-4. Matching Circuit Between the Antenna and the CC3000 EM Board ............................................... 11 Return Loss from the ACX Antenna and Matching Circuit........................................................... 11 2-5. Antenna Radiation Patterns.............................................................................................. 12 2-6. Host PCB Mating Connector Arrangement ............................................................................ 13 2-7. Schematics of the CC3000 EM Board.................................................................................. 14 2-8. 3-1. Module Layout Guidelines................................................................................................ 16 3-2. Module Layout Guidelines................................................................................................ 17 Trace Design for the PCB Layout ....................................................................................... 18 3-3. Layer 1 Combined With Layer 2......................................................................................... 18 3-4. Antenna and RF Trace Routing Layout Guidelines................................................................... 19 3-5. Power Supply Routing of the CC3000 EM Board ..................................................................... 20 3-6. 4-1. MSP-EXP430FR5739 Test Platform and CC3000 EM Board ....................................................... 21 List of Tables Key Parts of CC3000 EM Board Top View .............................................................................. 7 2-1. J2 Configuration of the CC3000 EM Board.............................................................................. 7 2-2. Header J4 of the CC3000 EM Board Top View......................................................................... 7 2-3. Header J5 of the CC3000 EM Board Top View......................................................................... 8 2-4. Header J6 of CC3000 EM Board Bottom View ......................................................................... 9 2-5. J7 of CC3000 EM Board Bottom View ................................................................................... 9 2-6. BOM for the TI CC3000 EM Board...................................................................................... 15 2-7. 3-1. Module Layout Guidelines................................................................................................ 17 Trace Design Measurement Values .................................................................................... 18 3-2. Antenna and RF Trace Routing Layout Guidelines................................................................... 19 3-3. SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated List of Figures 3 Preface SWRU326November 2012 Read This First About This Manual This user guide describes how to use the TI CC3000 evaluation module (EM) board to evaluate the performance of the TI CC3000 module. Related Documentation From Texas Instruments TI SimpleLink CC3000 Module Wi-Fi 802.11b/g Network Processor Data Sheet (SWRS126) CC3000 Wiki for MCU: http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU If You Need Assistance The primary sources of CC3000 information are the device-specific data sheets and users guides. For the most up-to-date version of the users guide and data sheets, go to http://www.ti.com/product/cc3000. FCC Warning This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. 4 Read This First Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback Chapter 1 SWRU326November 2012 Introduction This user guide describes how to use the TI CC3000 evaluation module (EM) board to evaluate the performance and functionality of the TI CC3000 module. The CC3000 module is a self-contained Wi-Fi solution that enables internet connectivity for a wide variety of microcontroller (MCU) systems. The SimpleLink Wi-Fi from TI minimizes the host MCU software requirements, making it ideal for low-power and low-cost applications. The CC3000 EM board is targeted for TI MCUs, such as the MSP430-FR5739 and other various host platforms. This document details the key parts and features of the CC3000 EM board and the different options available to the user. This document includes layout guidelines to assist the designer in PCB development. SimpleLink is a trademark of Texas Instruments. Wi-Fi is a registered trademark of Wi-Fi Alliance. SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated Introduction 5 Chapter 2 SWRU326November 2012 CC3000 EM Board This section describes the key parts and features of the CC3000 EM board top and bottom views. 2.1 EM Board Top View Figure 2-1 shows the key parts and jumpers mounted on the top of the CC3000 EM board. Table 2-1 describes the key parts of the EM board. Table 2-2 describes the J2 configuration of the CC3000 EM board. Table 2-3 and Table 2-4 describe the J4 and J5 signals, respectively. Figure 2-1. CC3000 EM Board Top View 6 CC3000 EM Board Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback www.ti.com EM Board Top View Key Parts CC3000MOD Antenna J1 J2 J3 J4 J5 Table 2-1. Key Parts of CC3000 EM Board Top View Descriptions Core module for performance evaluation (for more information, see the CC3000 module data sheet). Can be used for radiated testing by reworking the capacitor to correct pads U.FL RF connector used for conductive RF test Used to switch between test mode and operation mode. When pins 2 and 3 are shorted, J2 runs in operation mode. When pins 1 and 2 are shorted, J2 runs in test mode. Used to test power consumption. The pins of the jumper are shorted in operation mode. For power testing, the jumper is removed and an ammeter bridges the pins. Through-hole test points (For more information, see Table 2-3.) Through-hole test points (For more information, see Table 2-4.) Table 2-2. J2 Configuration of the CC3000 EM Board Mode Test mode: CC3000 radio tool (1) Functional mode: Normal mode Description Connect pins 1 and 2. Test mode is used with the CC3000 radio tool for operating, testing, and calibrating the CC3000 chip-set designs during development. This tool uses the RS232/UART pins to run radio frequency (RF) RX and TX tests on the CC3000 module. For more information, see the CC3000 wiki. Connect pins 2 and 3. Normal mode is for regular functionality between the host platform and the CC3000 module.
(1) For more information about test software for the PC, go to the CC3000 wiki at http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU. Table 2-3. Header J4 of the CC3000 EM Board Top View J4 Pin 1 2 3 4 5 6 7 8 9 10 11 12 Pin Name GND Reserved Reserved Reserved WL_RS232_TX WL_RS232_RX GND WL_SPI_CS WL_SPI_DOUT WL_SPI_IRQ WL_SPI_DIN WL_SPI_CLK Pin Type Descriptions Output Input Input Output Output Input Input Ground Reserved Reserved Reserved RS232 transmit output; used for the radio tool serial interface in test mode. Leave floating in functional mode. RS232 receive output; used for the radio tool serial interface in test mode. Leave floating in functional mode. Ground Host interface SPI chip select Host interface SPI data output Host interface SPI interrupt request Host interface SPI data input Host interface SPI clock input SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated CC3000 EM Board 7 EM Board Top View J5 Pin 1 2 3 4 5 6 7 8 9 10 11 Table 2-4. Header J5 of the CC3000 EM Board Top View www.ti.com Pin Name SCL_CC3000 (1) Pin Type Output SCL_EEPROM (1) Input SDA_CC3000 (1) Input/Output SDA_EEPROM (1) Input/Output VBAT_SW_EN GND GND VIO_HOST Input Power In VBAT_IN Power In GND Reserved Descriptions I2C clock signal output from the CC3000 module. This pin is connected to SCL_EEPROM through a 0-
resistor and is not used by end users. I2C clock signal input from EEPROM inside the CC3000 module. This pin is connected to SCL_CC3000 using a 0- resistor and is not used by end users. I2C data signal from the CC3000 module. This pin is connected to SDA_EEPROM using a 0- resister and is not used by end users. I2C data signal from EEPROM inside the CC3000 module. This pin is connected to the SDA_CC3000 device using a 0- resistor and is not used by end users. Active-high enables the signal from the host device. Ground Ground VIO power supply from the host to the module. For the MSP430 host platform, VIO_HOST = VBAT_IN. For other platforms that have different voltage levels from battery voltages, R14 can be removed. Battery voltage input to module. For the MSP430 host platform, VIO_HOST = VBAT_IN. For other platforms that have different voltage levels from the battery voltages, R14 can be removed. Ground Reserved
(1) The EM board arrives with EEPROM preprogrammed. 8 CC3000 EM Board Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback www.ti.com 2.2 EM Board Bottom View EM Board Bottom View The two EM board mating connectors J6 and J7 connect to the host platform and are mounted on the bottom of the EM board, as shown in Figure 2-2. Table 2-5 and Table 2-6 describe the signals brought out from these two EM mating connectors. Figure 2-2. CC3000 EM Board Bottom View Table 2-5. Header J6 of CC3000 EM Board Bottom View Pin Name GND Reserved VBAT_SW_EN WL_SPI_IRQ WL_SPI_CS WL_SPI_CLK WL_SPI_DIN GND WL_SPI_DOUT Module Pin Type Description Input Output Input Input Input Output Ground Reserved Active-high enable signal from the host device Host interface SPI interrupt request Host interface SPI CS Host interface SPI clock input Host Interface SPI data input Ground Host interface SPI data output Table 2-6. J7 of CC3000 EM Board Bottom View Pin Name GND VBAT_IN VBAT_IN Reserved Module Pin Type Description Power In Power In Ground Battery voltage input to the module Battery voltage input to the module Reserved J6 Pin 1 5 10 12 14 16 18 19 20 J7 Pin 2 7 9 15 SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated CC3000 EM Board 9 SWRU326-002 Antenna 2.3 Antenna www.ti.com The ACX ceramic antenna is mounted on the EM board with a specific layout and matching circuit for the radiation tests conducted in FCC, CE, and IC certifications. Figure 2-3 shows the location of the ACX ceramic antenna on the EM board and the RF trace routing from the CC3000 module to the antenna. Figure 2-4 shows the matching circuit between the antenna and the EM board. The return loss is based on the matching circuit and RF trace routing, as shown in Figure 2-5. Figure 2-6 shows the radiation patterns on XY, XZ, and YZ planes. Figure 2-3. Antenna Location and RF Trace Routing 10 CC3000 EM Board Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback www.ti.com Antenna Figure 2-4. Matching Circuit Between the Antenna and the CC3000 EM Board Figure 2-5. Return Loss from the ACX Antenna and Matching Circuit SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated CC3000 EM Board 11 SWRU326-005AT8010-E2R9HAA2.2 pF2.2 nHSWRU326-004 Antenna www.ti.com Figure 2-6. Antenna Radiation Patterns 12 CC3000 EM Board Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback SWRU326-006YZ planeXYplaneXZ planeUnit : dBiXYplanePeak gainAvg. gain0.32.6XZ planePeak gainAvg. gain1.34.2YZ planePeak gainAvg. gain0.90.9 www.ti.com 2.4 Hardware Setup Hardware Setup Before conducting performance tests, the EM board must be connected to the host platform, either with the mating connectors (J6 and J7) or the single-row headers (J4 and J5). To use the EM mating connectors to connect the hardware, the mating EM connector must be lined up and spaced 1.2 inches apart (see Figure 2-7). To use the single-row headers, the required signals from the EM mating connectors must be wired to the host platform. Figure 2-7. Host PCB Mating Connector Arrangement SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated CC3000 EM Board 13 1.2 inchesJ2J1201912201912SWRU326-007 Schematics 2.5 Schematics Figure 2-8 shows the schematics of the CC3000 EM board. www.ti.com Figure 2-8. Schematics of the CC3000 EM Board 14 CC3000 EM Board Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback SWRU326-008 www.ti.com 2.6 Bill of Materials (BOM) Table 2-7 lists the BOM for the TI CC3000 EM board. Bill of Materials (BOM) Items Reference Designator Description Table 2-7. BOM for the TI CC3000 EM Board 1 2 3 4 5 6 7 8 9 10 U1 ANT1 J1 J2 J3 J6,J7 C1,C3 C4,C5 R1, R2, R3, R4, R5, R6, R8, R9, R10, R11, R13, R15, R16, R17, R18, R19, R20, R21 R14 TI CC3000 Wi-Fi b/g module (BM) ANT, 2.4 GHz, peak gain 2.5 dB Mini RF header receptacle CON male 1 x 3, pitch 2.0 mm CON male 1 x 2, pitch 2.0 mm Female header, Fool Proof H:4.3, 2 x 10, pitch 1.27 mm, SMT CAP 0402 10 pF, 50 V, NPO, 5%
CAP 0402 1 F, X5R, 6.3 V, 10%, HF RES 0402, 0- jumper RES 0603, 0- jumper SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated CC3000 EM Board 15 Chapter 3 SWRU326November 2012 Layout Guidelines This section presents guidelines that must be followed when creating a board design incorporating the TI CC3000 module. Figure 3-1 shows the TI CC3000 EM four-layer board. Table 3-1 and Figure 3-2 describe instances of good layout practices. Figure 3-1. Module Layout Guidelines 16 Layout Guidelines Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback SWRU326-014 www.ti.com Reference (1) Guideline Description Table 3-1. Module Layout Guidelines 1 2 3 4 5 6 The proximity of ground vias must be close to the pad. Signal traces must not be run underneath the module on the layer where the module is mounted. Have a complete ground pour in layer 2 for thermal dissipation. Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible. Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer.
(1) See Figure 3-2. Figure 3-2. Module Layout Guidelines Figure 3-3 shows the trace design for the PCB. A 50- impedance match on the trace to the antenna should be used. Also, 50- traces are recommended for the PCB layout. Table 3-2 lists the distances shown in Figure 3-3. Figure 3-4 shows layer 1 with the trace to the antenna over ground layer 2. Table 3-3 and Figure 3-5 describe instances of good layout practices for the antenna and RF trace routing. SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated Layout Guidelines 17 SWRU326-013 www.ti.com Figure 3-3. Trace Design for the PCB Layout Figure 3-4. Layer 1 Combined With Layer 2 Table 3-2. Trace Design Measurement Values Measurement H (height between L1 and L2) W (RF trace) T (thickness) S (separation) r (dielectric) Length 12.0 mil 14.3 mil 1.2 mil 10.0 mil 4.3 18 Layout Guidelines Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback SWRU326-015SWRU326-010 www.ti.com Table 3-3. Antenna and RF Trace Routing Layout Guidelines Reference (1) Guideline Description 1 2 3 4 5 6 7 8 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. The RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must have constant impedance (microstrip transmission line). For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. There must be no traces or ground under the antenna section. The PCB designer must understand the microstrip model used and the scale line width according to the microstrip model. RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered.
(1) See Figure 3-5. Figure 3-5. Antenna and RF Trace Routing Layout Guidelines SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated Layout Guidelines 19 SWRU326-011 Figure 3-6 shows the supply routing guidelines:
For power supply routing, the power trace for VBAT must be at least 40 mil wide. The 1.8-V trace must be at least 18 mil wide. Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. If possible, shield VBAT traces with ground above, below, and beside the traces. www.ti.com Figure 3-6. Power Supply Routing of the CC3000 EM Board 20 Layout Guidelines Copyright 2012, Texas Instruments Incorporated SWRU326 November 2012 Submit Documentation Feedback SWRU326-012 Chapter 4 SWRU326November 2012 Application Development TI supports the CC3000 EM board when paired with the following TI MCU host platforms:
MSP-EXP430FR5739 MSP-EXP430F5529 MSP-EXP430F5438 MSP-EXP430FG4618 DK-LM3S9B96 EK-LM4F232 To find example applications for each of the listed host platforms, go to the TI wiki at:
http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU#TI_Platforms. In addition to the TI MCU platforms, the CC3000 EM board can be used on other platforms with the same RF connector interface. For a host driver porting guide to assist with porting to other platforms, go to http://processors.wiki.ti.com/index.php/CC3000_Host_Driver_Porting_Guide. Figure 4-1 shows the MSP-EXP430FR5739 test platform and CC3000 EM board. Figure 4-1. MSP-EXP430FR5739 Test Platform and CC3000 EM Board SWRU326 November 2012 Submit Documentation Feedback Copyright 2012, Texas Instruments Incorporated Application Development 21 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity Applications Automotive and Transportation www.ti.com/automotive Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap www.ti.com/wirelessconnectivity www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video TI E2E Community e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2012, Texas Instruments Incorporated REGULATORY COMPLIANCE INFORMATION When the radio module is included in a final product, the following warning statements must be included in the final product user guide Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Industry Canada Warnings This Class B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numrique de la classe A ou B est conforme la norme NMB-003 du Canada. Les changements ou les modifications pas expressment approuvs par la partie responsable de la conformit ont pu vider lautorit de l'utilisateur pour actionner l'quipement. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. Le prsent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs dans le manuel dusage et ayant un gain admissible maximal et l'impdance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. Labeling of the final product The final product must contain a label with the statement Contains radio module FCC ID: Z64-CC3000EM, IC: 451I-CC3000EM.