FCC ID: Z64-CC3235MOD Dual-Band Wi-Fi Module

CC3235MODSF SimpleLink Wi-Fi and IoT Solution With MCU LaunchPad Hardware User's Guide Literature Number: SWRU548A February 2019 Restrictions A D N TI Confidential Contents 3 2 1 3.4 3.1 3.2 3.3 2.4 2.3 2.5 2.2 2.1 1.8 1.5 1.6 1.4 1.2 1.7 1.1 1.3 Introduction......................................................................................................................... 6 CC3235MODSF LaunchPad ........................................................................................ 6 LAUNCHCC3235MOD Key Features ................................................................................. 7 What's Included .......................................................................................................... 7 REACH Compliance ..................................................................................................... 7 Regulatory Compliance ................................................................................................. 8 First Steps: Out-of-Box Experience ................................................................................... 8 Next Steps: Looking into the Provided Code ........................................................................ 8 Trademarks ............................................................................................................... 9 Hardware .......................................................................................................................... 10 Block Diagram........................................................................................................... 11 Hardware Features ..................................................................................................... 13 Electrical Characteristics .............................................................................................. 27 Antenna Characteristics ............................................................................................... 27 BoosterPack Header Pin Assignment ............................................................................ 28 Layout Guidelines .............................................................................................................. 29 LAUNCHCC3235MOD Board Layout ................................................................................ 29 General Layout Recommendations .................................................................................. 33 RF Layout Recommendations ........................................................................................ 33 Antenna Placement and Routing .................................................................................... 35 Transmission Line Considerations ................................................................................... 35 Operational Setup and Testing ............................................................................................ 37 Measuring the CC3235MOD Current Draw ........................................................................ 38 RF Connections ........................................................................................................ 39 Design Files ............................................................................................................ 40 Software ................................................................................................................. 40 Development Environment Requirements ............................................................................. 40 CCS ...................................................................................................................... 40 IAR........................................................................................................................ 40 Additional Resources ......................................................................................................... 41 CC3235MODx Product Page ......................................................................................... 41 Download CCS, IAR ................................................................................................... 41 SimpleLink Academy for CC3235 SDK .......................................................................... 41 TI E2E Community ..................................................................................................... 41 Assembly Drawing and Schematics ..................................................................................... 42 Assembly Drawing ..................................................................................................... 42 Schematics ............................................................................................................. 43 Revision History.......................................................................................................................... 48

........................................................................................................................................ 49 1 RF Function and Frequency Range....................................................................................... 49 2 FCC and IC Certification and Statement ................................................................................ 49 3 7.1 4.1 3.5 4.4 4.2 4.3 5.2 5.1 6.1 6.3 6.4 6.2 7.2 4 6 7 5 2 Table of Contents Copyright 2019, Texas Instruments Incorporated SWRU548A February 2019 Submit Documentation Feedback Restrictions A D N TI Confidential www.ti.com 3.6 3.4 3.2 3.5 3.3 3.1 FCC....................................................................................................................... 49 CAN ICES-3(B) and NMB-3(B) Certification and Statement...................................................... 50 End Product Labeling .................................................................................................. 51 Device Classifications.................................................................................................. 51 FCC Definitions ......................................................................................................... 51 Simultaneous Transmission Evaluation.............................................................................. 52 EU Certification and Statement ............................................................................................ 52 RF Exposure Information (MPE)...................................................................................... 52 Simplified DoC Statement ............................................................................................. 52 Waste Electrical and Electronic Equipment (WEEE)............................................................... 53 OEM and Host Manufacturer Responsibilities ...................................................................... 53 Antenna Specifications................................................................................................. 53 CC3235MODx Approved Antennas ....................................................................................... 53 4.1 4.5 4.4 4.2 4.3 4 5 SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Contents 3 Restrictions A D N TI Confidential User's Guide SWRU548A February 2019 CC3235MODSF LaunchPad Development Kit

(LAUNCHCC3235MOD) Start your design with the industry's first programmable FCC, IC/ISED, ETSI/CE, and MIC Certified SimpleLinkTM Wi-Fi CC3235MOD Dual-Band Wireless Microcontroller Module with built-in Dual-

Band (2.4 GHz and 5 GHz) Wi-Fi connectivity. Created for the Internet-of-Things (IoT), the SimpleLink CC3235MODx family of devices from Texas Instruments are wireless modules that integrate two physically separated, on-chip MCUs:

An application processor Arm Cortex-M4 MCU with a user-dedicated 256KB of RAM and an optional 1MB of Serial Flash. A network processor MCU to run all Wi-Fi and Internet logic layers. This ROM based subsystem includes an 802.11 a/b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure internet connections with 256-bit encryption. The CC3235MODx comes in 2 variants:

CC3235MODSM2MOB Requires an external antenna CC3235MODSF12MOB Requires an external antenna Contains 1MB of Serial Flash The LAUNCHCC3235MOD is a low-cost evaluation platform for MCUs based on Arm Cortex-M4 devices. The LaunchPad design highlights the CC3235MODSF fully-integrated industrial module solution and Dual-Band Wi-Fi capabilities. The LAUNCHCC3235MOD also features temperature and accelerometer sensors, programmable user buttons, an RBG LED for custom applications, and onboard emulation for debugging. The stackable headers interface demonstrates how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on existing BoosterPack add-on boards, such as graphical displays, audio codec, antenna selection, environmental sensing, and more. Figure 1 shows the CC3235MODSF LaunchPad development kit. 4 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com Figure 1. CC3235MODSF SimpleLink Wi-Fi LaunchPad Development Kit SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 5 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Introduction 1 Introduction 1.1 CC3235MODSF LaunchPad www.ti.com Created for the Internet of Things (IoT), the SimpleLink CC3235MODx is a wireless module with built-in Dual-Band Wi-Fi connectivity for the LaunchPad ecosystem, which integrates a high-performance Arm Cortex-M4 MCU and lets customers develop an entire application with one device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for fast development. The CC3235MODSF LaunchPad, referred to by its part number LAUNCHCC3235MOD, is a low-cost evaluation platform for Arm Cortex-M4-based MCUs. The LaunchPad design highlights the CC3235MODSF Internet-on-a chip solution and Dual-Band Wi-Fi capabilities. The CC3235MODSF LaunchPad also features temperature and accelerometer sensors, programmable user buttons, an RGB LED for custom applications, and onboard emulation for debugging. The stackable headers of the CC3235MODSF LaunchPad XL interface demonstrate how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on many existing BoosterPack add-on boards, such as graphical displays, audio codecs, antenna selection, environmental sensing, and more. Figure 1 shows the CC3235MOD LaunchPad. Multiple development environment tools are also available, including TIs Eclipse-based Code Composer Studio (CCS) integrated development environment (IDE) and IAR Embedded Workbench. More information about the LaunchPad, the supported BoosterPack modules, and the available resources can be found at TIs LaunchPad portal. NOTE: The maximum RF power transmitted in each WLAN 2.4 GHz band is 19 dBm (EIRP power). The maximum RF power transmitted in each WLAN 5 GHz band is 18.8 dBm (EIRP power). NOTE: The antennas used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be colocated or operating in conjunction with any other antenna or transmitter. 6 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 1.2 LAUNCHCC3235MOD Key Features Introduction The LAUNCHCC3235MOD SimpleLink LaunchPad includes the following features:

CC3235MODSF, SimpleLinkTM Dual-Band Wi-Fi module solution Integrated MCU 40.0-MHz Crystal 32.768-kHz Crystal (RTC) 32-Mbit SPI Serial Flash RF and Full Power-Management Components 40-pin LaunchPad standard that leverages the BoosterPack ecosystem TI standard, XDS110-based JTAG emulation with serial port for flash programming Supports 4-wire JTAG and 2-wire SWD Two buttons and one RGB LED for user interaction Back-channel universal asynchronous receiver/transmitter (UART) through USB to PC Onboard chip antenna with U.FL for conducted testing selectable using 0- resistors Onboard accelerometer and temperature sensor for out-of-box demo with option to isolate the sensors from the inter-integrated circuit (I2C) bus Micro-USB connector for power and debug connections Headers for current measurement and external JTAG connection (option to use the onboard XDS110 to debug customer platforms) Bus-powered device with no external power required for Wi-Fi Long-range transmission with highly optimized antenna (200 m typical in open air using an access point with 6-dBi antenna AP) Can be powered externally, with two AA or two AAA alkaline batteries working down to 2.3-V typical Dimensions: 106.1 mm (L) 58.42 mm (W) 1.3 What's Included 1.3.1 Kit Contents CC3235MODSF LaunchPad development tool (LAUNCHCC3235MOD) Micro USB cable Quick start guide 1.3.2 Software Examples Out-of-Box Experience (OOBE) Software 1.4 REACH Compliance In compliance with the Article 33 provision of the EU REACH regulation we are notifying you that this EVM includes component(s) containing at least one Substance of Very High Concern (SVHC) above 0.1%. These uses from Texas Instruments do not exceed 1 ton per year. The SVHCs are:

Component Manufacturer Abracon Abracon Crystal Crystal Component type SVHC Substance SVHC CAS (when available) Component part number ABM3-16.000MHZ-D2Y-

T ABM3-16.000MHZ-D2Y-

T Diboron Trioxide 1303-86-2 Lead Oxide 1317-36-8 SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 7 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Introduction 1.5 Regulatory Compliance Certifications in Process Indoor Usage Restrictions:

www.ti.com The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range. AT EE IT PT BE FI LV RO BG FR LT SK HR DE LU SI CY EL MT ES CZ HU NL SE DK IE PL UK 1.6 First Steps: Out-of-Box Experience An easy way to get started with the EVM is by using its preprogrammed out-of-box experience code. It demonstrates some key features of the EVM. 1.6.1 Connecting to the Computer Connect the LaunchPad development kit by connecting the included USB cable to a computer. A red power LED should illuminate. For proper operation, the SimpleLink drivers and Service Pack from the CC3235 Software Development Kit (SDK) are needed. The SDK is available at http://www.ti.com/tool/simplelink-cc32xx-sdk. 1.6.2 Running the Out-of-Box Experience The CC3235MODSF LaunchPad development kit's Out-of-Box Experience (OOBE) demonstrates and highlights the following features:

Easy connection to the CC3235MODSF LaunchPad:

Using the SimpleLinkTM Wi-Fi Starter Pro application (available on iOS and Android), users can use Access Point (AP) provisioning or SmartConfig provisioning for a fast CC3235MOD connection. Configuring the device in AP mode gives users a direct connection to the CC3235MODSF Once the device is provisioned and connected to an AP in station mode, the profile is stored on the local file system so that any reset to the CC3235MODSF automatically connects it to the AP. Easy access to the CC3235MODSF through its internal web server, using either:

The SimpleLinkTM Wi-Fi Starter Pro application Any browser; web pages stored on the serial flash are loaded on the browser, to provide ease of LaunchPad. use. This feature demonstrates configuring and reading onboard sensors. Over-The-Air (OTA) updates that demonstrate an update of a full image. OTA service enables in-

system updates of the MCU application, CC3235 firmware releases (Service Pack) made available by TI, and other vendor files. An update procedure executed in a full-system integrity fashion, such as failure to upgrade any image components, results in rolling back to the previous valid version. Visit the CC3235 LaunchPad Out-of-Box Experience Guide on SimpleLink Academy (see Section 6.3) for more details. 1.7 Next Steps: Looking into the Provided Code After the EVM features have been explored, the user can open an integrated development environment and start editing the code examples from the SDK. See Section 6.2 for available IDEs and where to download them. The Out-of-Box source code and more code examples are provided in the CC3235 SDK. Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs. 8 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 1.8 With the onboard XDS110 debug probe, debugging and downloading new code is simple. A USB connection between the EVM and a PC through the provided USB cable is all that is needed. Trademarks SimpleLink, Texas Instruments, LaunchPad, BoosterPack, Code Composer Studio are trademarks of Texas Instruments. Arm, Cortex are registered trademarks of Arm Limited. IAR Embedded Workbench is a registered trademark of IAR Systems AB. WPA, WPA2 are trademarks of Wi-Fi Alliance. Wi-Fi, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance. All other trademarks are the property of their respective owners. Introduction SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 9 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware 2 Hardware www.ti.com Figure 2 shows the CC3235MODSF LaunchPad EVM. Figure 2. CC3235MODSF LaunchPad EVM Overview 10 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 2.1 Block Diagram Figure 3 shows a functional block diagram of the CC3235MODx module. Figure 3. CC3235MODx Functional Block Diagram Hardware SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 11 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential UART SPI nReset 2.3 V to 3.6 V VBA T CC323 5 40 MHz 32.768 kHz RF_ANT1 WRF_BGN F D BGN Aba nd 5 GHz SPDT WRF_A F M A C P H Y

PM 32-Mbit SFlash Exte rnal SPI Pro gramming Use r G PIO x Hardware www.ti.com Figure 4 shows a functional block diagram of the LAUNCHCC3235MOD SimpleLink LaunchPad. Figure 4. LAUNCHCC3235MOD Functional Block Diagram 12 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential INT (GPIO13) I2C Acc BMA280 Temperature Sensor TMP116 FTDI FT2232D and SWD Circuit JTAG and SWD UART (Flashing) USB Connector LDO 3.3 V VCC CC3235MODSF12MOBR Two AA Battery Connectors Reverse Protection Two 20-pin LaunchPad headers

(compatible with TI MCU standard) Push buttons GPIO13, GPIO22 RGB LED GPIO9, GPIO10, GPIO11 www.ti.com 2.2 Hardware Features Hardware 40-pin LaunchPad standard that leverages the BoosterPack ecosystem CC3235MODSF, SimpleLinkTM Dual-Band Wi-Fi module solution with integrated MCU TI Standard XDS110-based JTAG emulation with serial port for flash programming Supports both 4-wire JTAG and 2-wire SWD Two buttons and a RGB LED for user interaction Virtual COM port UART through USB on PC Onboard chip antenna with U.FL or SMA for conducted testing, selectable using 0- resistors Onboard accelerometer and temperature sensor for out-of-box demo, with the option to isolate them from the inter-integrated circuit (I2C) bus Micro USB connector for power and debug connections Headers for current measurement and external JTAG connection, with an option to use the onboard XDS110 to debug customer platforms Bus-powered device, with no external power required for Wi-Fi Long-range transmission with a highly optimized antenna (200-meter typical in open air with a 6-dBi antenna AP) Can be powered externally, working down to 2.3 V 2.2.1 Key Benefits 802.11 a/b/g/n: 2.4 GHz and 5 GHz The CC3235MODx modules offer the following benefits:

Fully Integrated and Green/RoHS Modules Includes All Required Clocks, SPI Flash, and Passives FCC, IC/ISED, ETSI/CE, and MIC Certified FIPS 140-2 Level 1 Validated IC Inside Multilayered security features, help developers protect identities, data, and software IP Coexistence with 2.4 GHz Radios CC3235MODx Multiple-core architecture, system-on-chip (SoC) Transferrable Wi-Fi Alliance Certification Application microcontroller subsystem:

1.27-mm Pitch QFM Package for Easy Assembly and Low-Cost PCB Design Low-Power Modes for battery powered application Industrial Temperature: 40C to +85C Arm Cortex-M4 core at 80 MHz User-dedicated memory 256 KB RAM Optional 1 MB executable Flash Rich set of peripherals and timers 26 I/O pins with flexible multiplexing options UART, I2S, I2C, SPI, SD, ADC, and 8-bit parallel interface Timers and PWM 8-bit Synchronous Image Interface Debug Interfaces: JTAG, cJTAG, and SWD SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 13 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware www.ti.com Wi-Fi network processor subsystem:

Wi-Fi core:

Modes:

802.11 a/b/g/n 2.4 GHz and 5 GHz Access Point (AP) Station (STA) Wi-Fi Direct (only supported on 2.4 GHz) Security:

WEP WPA/WPA2 PSK WPA2 Enterprise Internet and application protocols:

HTTPs server, mDNS, DNS-SD, DHCP IPv4 and IPv6 TCP/IP stack 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0) Built-in power management subsystem:

Configurable low-power profiles (always, intermittent, tag) Advanced low-power modes Integrated DC/DC regulators Multilayered security features:

Separate execution environments Networking security Device identity and key Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC) Application-level security (encryption, authentication, access control) Initial secure programming Software tamper detection Secure boot Certificate signing request (CSR) Unique per device key pair Application Throughput UDP: 16 Mbps TCP: 13 Mbps 14 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com Hardware Power-Management Subsystem:

Integrated DC/DC converters support a wide range of supply voltage:

VBAT wide-voltage mode: 2.3 V to 3.6 V VIO is always tied with VBAT Advanced low-power modes:

Low-power deep sleep (LPDS): 120 A Idle connected (MCU in LPDS): 710 A Shutdown: 1 A, hibernate: 5.5 A RX traffic (MCU active): 59 mA TX traffic (MCU active): 223 mA Wi-Fi TX Power 2.4 GHz: 16.5 dBm at 1 DSSS 5 GHz: 15.1 dBm at 6 OFDM Wi-Fi RX Sensitivity 2.4 GHz: 94.5 dBm at 1 DSSS 5 GHz: 89 dBm at 6 OFDM Additional Integrated Components 40.0 MHz Crystal 32.768 kHz Crystal (RTC) 32 Mbit SPI Serial Flash RF Filters, Diplexer and Passive Components Footprint Compatible QFM Package CC3235MODx: 1.27-mm Pitch, 63-Pin, 20.5-mm 17.5-mm Module Supports SimpleLink Developer's Ecosystem SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 15 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware 2.2.2 XDS110-Based Onboard Debug Probe www.ti.com To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard debug probe, which eliminates the need for expensive programmers. The CC3235MODSF LaunchPad has the XDS-110-based debug probe (see Figure 5), which is a simple and low-cost debugger that supports nearly all TI Arm device derivatives. Figure 5. XDS-110 Debug Probe The dotted line through J101 shown in Figure 5 divides the XDS110 debug probe from the target area. The signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More details on the isolation jumper block are in Section 2.2.3. The XDS110 debug probe also provides a "backchannel" UART-over-USB connection with the host, which can be very useful during debugging and for easy communication with a PC. More details can be found in Section 2.2.4. The XDS110 debug probe hardware can be found in the schematics in Section 7.2 and in the CC3235MOD LaunchPad hardware design files. 16 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com Hardware 2.2.3 Debug Probe Connection: Isolation Jumper Block The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the XDS110 domain into the CC3235MOD target domain. This includes JTAG signals, application UART signals, and 3.3-V and 5-V power. Reasons to open these connections:

To remove any and all influence from the XDS110 debug probe for high accuracy target power To control 3-V and 5-V power flow between the XDS110 and target domains To expose the target MCU pins for other use than onboard debugging and application UART measurements communication To expose the programming and UART interface of the XDS110 so that it can be used for devices other than the onboard MCU. Jumper BRD GND 5V VBAT RX TX RST TMS TCK TDO TDI VBUFFER Table 1. Isolation Block Connections Board Power. Supplies the board power from the onboard DC-DC converter. The board power includes the sensors, LED, and the OPAMP used to drive the ADC input. Description Ground reference 5-V VBUS from USB 3.3-V rail, derived from VBUS in the XDS110 domain. Can also be used to measure the current flowing into the CC3235MOD. Backchannel UART: The target CC3235MODSF receives data through this signal. Backchannel UART: The target CC3235MODSF sends data through this signal. This pin functions as the RST signal (active low). Serial wire data input (SWDIO) / JTAG test mode select (TMS) Serial wire clock input (SWCLK) / JTAG clock input (TCK) JTAG test data out JTAG test data in Used to power the level shifters located on the emulator side of the board. The level shifters can be powered by shorting this pin with a jumper. Removing the jumper enables low current measurement. SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 17 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware 2.2.4 Application (or "Backchannel") UART www.ti.com The board supports a USB-based virtual COM port, using the Tiva Arm MCU. The LaunchPad is shipped with the UART lines from the CC3235MODSF connected to the UART on the Tiva MCU. The CC3235MODSF's UART can also be routed to the 20-pin connector for use as a GPIO or external UART. The selection is performed using jumpers on the board. Figure 6 shows the UART routed to USB COM port. Ensure that a jumper is also placed on the VBUFFER header to power the level shifters located on the emulator side of the board. Figure 7 shows the UART routed to 20-pin header connector. Figure 6. UART Routed to USB COM Port Figure 7. UART Routed to 20-Pin Header Connector 18 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 2.2.5 JTAG Headers Hardware The headers are provided on the board to isolate the CC3235MOD from the onboard XDS110-based JTAG emulator. These jumpers are shorted by default when the board is shipped from TI. Figure 5 and Table 1 are for default configurations, and Figure 8 shows the external emulator connection. To connect an external emulator, remove the isolation block JTAG jumpers and place the external emulator on the JTAG IN connector. Figure 8. JTAG IN Connector (J6) SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 19 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware www.ti.com 2.2.6 Using the XDS110 Debug Probe with a Different Target The XDS110 debug probe on the LaunchPad development kit can interface to most Arm Cortex-M devices, not just the onboard target CC3235MODSF device. This functionality is enabled by the J2 10-pin Cortex-M JTAG connector (see Figure 9) and a 10-pin cable, such as the FFSD-05-D-06.00-01-N (sold separately from the LaunchPad development kit). Figure 9. XDS110 OUT Connector (J2) Header J2 follows the Arm Cortex-M standard; however, pin 1 is not a voltage sense pin. The XDS110 outputs only 3.3-V JTAG signals. If another voltage level is needed, the user must provide level shifters to translate the JTAG signal voltages. 1. Remove jumpers on the JTAG signals on the isolation block, including RST, TMS, TCK, TDO, and TDI. 2. Plug the 10-pin cable into J2, and connect to an external target. a. J2 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors. 3. Plug USB power into the LaunchPad development kit, or power it externally a. JTAG levels are 3.3-V ONLY 20 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 2.2.7 Power Connections Hardware The board accommodates various power methods, including through the onboard XDS110 as well as external or BoosterPack plug-in module power (see Figure 10). Figure 10. LAUNCHCC3235MOD Power Block Diagram SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 21 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware 2.2.7.1 XDS110 USB Power www.ti.com The most common power-supply scenario is from USB through the XDS110 debugger. This provides 5-V power from the USB and also regulates this power rail to 3.3 V for XDS110 operation and 3.3-V to the target side of the LaunchPad development kit. Power from the XDS110 is controlled by jumper J101. When the board is powered from the USB connector, ensure that the jumpers are placed on the following headers, shown in Figure 11. Figure 11. Powering the CC3235MODSF LP from USB 22 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com Hardware 2.2.7.2 BoosterPack Plug-in Module and External Power Supply Headers J19 and J20 are present on the board to supply external power directly when USB power is not available. Use the following precautions before using the board with an external power supply. 1. Remove the USB cable. 2. Ensure that jumpers are only placed on the headers shown in Figure 12. 3. Use a jumper wire to connect VBAT and BRD. 4. Plug in the external power supply on J20 with the correct polarity. Figure 12. Powering the CC3235MODSF LP from an External Power Supply The OPAMP EN and LED EN jumpers are also available to remove any current draw from the onboard OpAmp and LEDs being driven by the GPIOs, see Table 2. Table 2. External Supply Connections and Enable Jumpers Reference Use Comments J19 J20 J21 5-V power input 3.3-V power input OPAMP EN Used to power the board from an external 5-V supply Used to power the board from an external 3.3-V supply. If uninstalled, the power supply to the operational amplifier is cut off. This can be used to enable low-power measurements. SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 23 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware www.ti.com Table 2. External Supply Connections and Enable Jumpers (continued) Reference J26 Use LED EN Comments If uninstalled, the LEDs connected to the GPIO are disabled; this can be used to enable low-power measurements. 2.2.8 Reset Pullup Jumper Table 3 lists the reset pullup jumper. Table 3. Reset Pullup Jumper Reference Use Comments J13 RESET pullup Install this jumper to enable the pullup resistor on the nRESET pin of the device, when the board is powered from an external supply. 2.2.9 Clocking All of the required clocks are inside the module. There is no need to supply any external clock. 24 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 2.2.10 I2C Connection Hardware The board features an accelerometer and a temperature sensor for the out-of-box demo. These are connected to the I2C bus, and can be isolated using the jumpers provided (shown as yellow jumpers J23 and J24 in Figure 13). Figure 13. I2C Connections By removing J23 and J24, the accelerometer and the temperature sensors are isolated from the I2C bus. This measure also removes the I2C pullup resistors from the sensor side of the circuit, and therefore any connection to the circuit requires the user to install external pullup resistors. Table 4 lists the I2C jumper definitions. Table 4. I2C Jumper Definitions Reference J23 J24 Use I2C SCL Comments Populated: CC3235MOD SCL connected to onboard sensors with pullup Open: CC3235MOD SCL disconnected from onboard sensors I2C SDA Populated: CC3235MOD SDA connected to onboard sensors with pullup Open: CC3235MOD SDA disconnected from onboard sensors 2.2.10.1 Default I2C Addresses Table 5 lists the default I2C addresses of the onboard sensors. Table 5. Default I2C Addresses (of Onboard Sensors) Sensor Type Reference Designator on LP Part Number (Manufacturer) Default Slave Address (Hex) Temperature (Digital ) Accelerometer (Triaxial) U10 U11 TMP116 (TI) BMA280 (Bosch) 0x49 0x30 SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 25 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware 2.2.11 Sense on Power (SOP) www.ti.com The CC3235MODx device can be set to operate in four different modes based on the state of the sense on power (SOP) lines. The SOP lines are pins 23, 24, and 34 on the CC3235MODx module. Table 6 shows the state of the device and Figure 14 shows the SOP jumpers. Binary Value 100 000 001 010 Table 6. SOP[2:0]

Function Flash programming Functional mode + 4-wire JTAG Functional mode + SWD Functional mode + flash NOTE: SOP[2:0] corresponds to J18 on the LaunchPad design. Figure 14. SOP Jumpers (Default Setting Shown) NOTE: Placing no jumpers on the block ensures that the line is pulled low using 100K pull down resistors. Placing the jumper pulls the pin high using a 10K resistor. 26 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 2.2.12 Push-Buttons and LED Indicators Table 7 lists the push-button definitions. Hardware Table 7. Push-Button Definitions Reference SW1 Use RESET Comments This is used to reset the CC3235MOD device. This signal is also output on the 20-pin connector to reset any external BoosterPack which may be stacked. The reset can be isolated using the RST jumper at the isolation block. SW2 SW3 SW4 GPIO_13 GPIO_22 Factory default When pushed, GPIO_13 is pulled to VCC. When pushed, GPIO_22 is pulled to VCC. Pressing this button and toggling RESET restores the factory default image on the serial flash. This can be used to recover a corrupted serial flash, provided the s-flash was programmed with a recovery image. Table 8 lists the LED indicators. Reference D1,D2 Color Green and Red Table 8. LED Indicators D3 D4 D7 D8 Yellow Red RGB RGB RGB Red Use Debug nRESET Power GPIO_09 GPIO_10 (1) GPIO_11 (1) Factory Reset Comments Indicates the state of the JTAG emulator. For TI use only. Indicates the state of the NRESET pin. If this LED is on, the device is functional. Indicates when the 3.3-V power is supplied to the board. Glows when the GPIO is logic-1. Glows when the GPIO is logic-1. Glows when the GPIO is logic-1. Indicates that the push-button for the factory reset is pressed.

(1) GPIO_10 and GPIO_11 are also used as I2C. Whenever the pullups are enabled, the LEDs glow by default without configuring the GPIOs. 2.3 Electrical Characteristics 2.4 Antenna Characteristics For electrical characteristics of the CC3235MODx modules, see CC3235MODx SimpleLink Wi-Fi CERTIFIED Dual-Band Wireless MCU Module data sheet. The CC3235MODSM2MOB and the CC3235MODSF12MOB reference design detail the use of an on-

board antenna. For more information on the antenna VSWR, efficiency, and electrical characteristics, see M830520. SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 27 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Hardware 2.5 BoosterPack Header Pin Assignment www.ti.com The BoosterPack header pinout specification is at Build Your Own BoosterPack. Also see the BoosterPack Pinout Standard. The CC3235MODSF LaunchPad follows this standard, with the exception of naming. (P1:P4 is used instead of J1:J4.). See Figure 15 for the CC3235MODSF LaunchPad pin-mapping assignments and functions. Figure 15. LAUNCHCC3235MOD BoosterPack Header Pin Assignments NOTE: RESET output is an open-drain-type output and can only drive the pin low. The pullup ensures that the line is pulled back high when the button is released. No external BoosterPack can drive this pin low. All the signals are referred to by the pin number in the SDK; Figure 15 shows the default mappings. Some of the pins are repeated across the connector. For instance, pin 62 is available on P1 and P4, but only P1 is connected by default. The signal on P4 is marked with an asterisk (*) to signify that it is not connected by default. The signal can be routed to the pin by using a 0- resistor in the path. For the exact resistor placement, see the CC3235MODSF SimpleLinkTM Wi-Fi Wireless MCU LaunchPad Board Design Files. 28 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 3 Layout Guidelines Layout Guidelines The integrator of the CC3235MODx modules must comply with the PCB layout recommendations described in the following subsections to preserve and minimize the risk with regulatory certifications for FCC, ISED/IC, ETSI/CE, and MIC. Also, TI recommends that customers follow the guidelines described in this section to achieve similar performance. 3.1 LAUNCHCC3235MOD Board Layout The reference layout consists of a four-layer design. Figure 16 shows the LAUNCHCC3235MOD top layer. Figure 16. LAUNCHCC3235MOD Top Layer SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 29 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Layout Guidelines www.ti.com Figure 17 shows the LAUNCHCC3235MOD first inner layer. Figure 17. LAUNCHCC3235MOD First Inner Layer 30 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com Layout Guidelines Figure 18 shows the LAUNCHCC3235MOD second inner layer. Figure 18. LAUNCHCC3235MOD Second Inner Layer SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 31 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Layout Guidelines www.ti.com Figure 19 shows the LAUNCHCC3235MOD bottom layer. Figure 19. LAUNCHCC3235MOD Bottom Layer 32 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 3.2 General Layout Recommendations Layout Guidelines Ensure that the following general layout recommendations are followed:

Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. Do not run signal traces underneath the module on a layer where the module is mounted. 3.3 RF Layout Recommendations The RF section of this wireless module gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the module. A poor layout can cause low-output power, EVM degradation, sensitivity degradation, and mask violations. Figure 20 shows the RF placement and routing of the CC3235MODSF module. Figure 20. RF Section Layout SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 33 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Layout Guidelines www.ti.com Use the following RF layout recommendations for the CC3235MODx module:

RF traces must have 50- impedance. RF trace bends must be made with gradual curves, and 90 degree bends must be avoided. RF traces must not have sharp corners. There must be no traces or ground under the antenna section. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. For optimal RF performance, ensure the copper cut out on the top layer under the RF-BG pin (pin 31) is as shown in Figure 21. Figure 21. Top Layer Copper Pullback on RF Pads 34 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Copyright 2017, Texas Instruments Incorporated www.ti.com 3.4 Antenna Placement and Routing Layout Guidelines The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 9 provides a summary of the recommended antennas to use with the CC3235MODx module. Table 9. Antenna Guidelines SR NO. GUIDELINES Place the antenna on an edge or corner of the PCB. 1 2 3 4 5 6 7 8 Ensure that no signals are routed across the antenna elements on all the layers of the PCB. Most antennas, including the chip antenna used on the LaunchPad, require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well. Ensure that there is provision to place matching components for the antenna. These must be tuned for best return loss when the complete board is assembled. Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance. Ensure that the antenna impedance is 50 because the module is rated to work only with a 50- system. In case of printed antenna, ensure that the simulation is performed with the solder mask in consideration. Ensure that the antenna has a near omnidirectional pattern. The feed point of the antenna is required to be grounded. This is only for the antenna type used on the CC3235MODx LaunchPad. See the specific antenna data sheets for the recommendations. 3.5 Transmission Line Considerations The RF signal from the module is routed to the antenna using a Coplanar Waveguide with ground (CPW-

G) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding. Figure 22 shows a cross section of the coplanar waveguide with the critical dimensions. Figure 22. Coplanar Waveguide (Cross Section) SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 35 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Layout Guidelines www.ti.com Figure 23 shows the top view of the coplanar waveguide with GND and via stitching. Figure 23. CPW With GND and Via Stitching (Top View) The recommended values for the PCB are provided for 2-layer boards in Table 10 and for 4-layer boards in Table 11. Table 10. Recommended PCB Values for 2-Layer Board

(L1 to L2 = 42.1 mils) PARAMETER VALUE W S H W S H Er (FR-4 substrate) Er (FR-4 substrate) 26 5.5 42.1 4.2 21 10 16 4.5 Table 11. Recommended PCB Values for 4-Layer Board

(L1 to L2 = 16 mils) PARAMETER VALUE UNITS UNIT mils mils mils F/m mils mils mils F/m 36 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential S W www.ti.com 4 Operational Setup and Testing Operational Setup and Testing A compatible BoosterPack can be stacked on top of the LaunchPad using the two, 20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse connection. Ensure that the VCC and 5-V pins are aligned with the BoosterPack header pins. On the CC3235MODSF LaunchPad, a small white symbol is provided near pin 1 (see Figure 24) to orient all BoosterPacks. Figure 24. Pin 1 Marking on LaunchPad (3V3 Mark) SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 37 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Operational Setup and Testing www.ti.com 4.1 Measuring the CC3235MOD Current Draw To measure the current draw of the CC3235MOD device using a multimeter, use the VBAT jumper on the J101 isolation block. The current draw measured in this mode includes only the CC3235MOD device, Serial Flash, any current drawn through the BoosterPack plug-in module headers. However, if a GPIO of the CC3235MOD is driving a high current load like the LED, then that is also included in this measurement. 4.1.1 Low-Current Measurement with USB Power (<1 mA) See the following instructions to measure ultra-low power when powering with a USB cable (see ). 1. Remove the VBAT jumper in the J101 isolation block, and attach an ammeter across this jumper. 2. Consider the effect that the backchannel UART and any circuitry attached to the CC3235MOD may have on current draw. Consider disconnecting these at the siolation jumper block, or at least consider their current sinking and sourcing capability in the final measurement. 3. Begin target execution and set the device to low-power modes (LPDS or hibernate). 4. Measure the current. Remember that if the current levels are fluctuating, it may be difficult to get a stable measurement. It is easier to measure quiescent states. 4.1.2 Active Current Measurements See the following instructions to measure active power. 1. Remove the VBAT jumper (J18). 2. Solder a 0.1- resistor on a wire which can be connected to a voltmeter/oscilloscope. Or, attach a jumper across J18 so that it can be used with a current probe. 3. Measure the voltage across the resistor using an oscilloscope with a differential probe. For the current probe, coil the wire around the sensor several times for good sensitivity. An ammeter can also be used for this measurement, but the results may be erroneous due to the switching nature of the current 38 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 4.2 RF Connections 4.2.1 AP Connection Testing Operational Setup and Testing By default, the board ships with the 2.4 GHz and 5 GHz RF signals routed to the onboard chip antenna, as shown in Figure 25. Figure 25. Using Onboard Antenna (Default Condition) A U.FL connector J17 provides a way to test in the lab using a compatible cable. Alternatively, trackpads for an SMA connector J15 are provided onboard to replace the J17 U.FL connector for testing conducted measurements. A rework must be performed before these connectors can be used; this involves swapping the position of a resistor. Figure 26 shows the modified board. Figure 26. Board Modified for External Antenna Connections (Measure 2.4 GHz or 5 GHz) SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 39 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com Operational Setup and Testing 4.3 Design Files 4.3.1 Hardware Design Files 4.4 Software Schematics can be found in Section 7.2.All design files, including schematics, layout, Bill of Materials

(BOM), Gerber files, and documentation are available for download from LAUNCHCC3235MOD. All design files, including firmware patches, software example projects, and documentation are available from the CC3235 Software Development Kit. Inside of the SDK, a set of very simple CC3235 code examples can be found that demonstrates how to use the entire set of CC3235 peripherals. When starting a new project or adding a new peripheral, these examples serve as a great starting point. 5 Development Environment Requirements The following software examples with the LaunchPad require an integrated development environment

(IDE) that supports the CC3235MOD. The CC313x and CC323x SimpleLink Wi-Fi Embedded Programming User's Guide has detailed information about software environment setup with examples. See this document for further details on the software sample examples. 5.1 CCS 5.2 IAR CCS 6.0 or higher is required. When CCS is launched, and a workspace directory is chosen, use Project Import Existing CCS Eclipse Project. Direct it to the desired demo project directory containing main.c. IAR 6.70 or higher is required. To open the demo in IAR, choose File Open Workspace, and direct it to the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is within this file. The subdirectory also has an *.ewp project file; this file can be opened into an existing workspace, using Project Add-Existing-Project. 40 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 6 Additional Resources 6.1 CC3235MODx Product Page Additional Resources For more information on the CC3235MOD device, visit the CC3235MOD product page, which includes the CC3235MODx SimpleLink Wi-Fi Wireless and Internet-of-Things Solution, a Single-Chip Wireless MCU data sheet and key documents such as the CC32xx SimpleLink Wi-Fi and Internet-of-Things Technical Reference Manual. 6.2 Download CCS, IAR Although the files can be viewed with any text editor, more can be done with the projects if they are opened with a development environment such as Code Composer Studio (CCS), IAR, or Energia. CCS and IAR are each available in a full version, or a free, code-size-limited version. The full out-of-box demo cannot be built with the free version of CCS or IAR (IAR Kickstart), due to the code-size limit. To bypass this limitation, a code-size-limited CCS version is provided that has most functionality integrated into a library. The code built into the library is able to be viewed by the user, but it cannot be edited. For full functionality, download the full version of either CCS or IAR. 6.3 SimpleLink Academy for CC3235 SDK The SimpleLink Academy is a collection of curated training modules developed by TI subject matter experts to help developers get up and running as quickly as possible with a SimpleLink MCU device and its SDK. The training is delivered using TI Resource Explorer, which offers a powerful cloud-enabled environment that includes background information, interactive exercises, code snippets, quizzes, and more. Experience the SimpleLink Academy now using the TI Resource Explorer at dev.ti.com. Figure 27. CC32xx SimpleLink Academy 6.4 TI E2E Community Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community!

SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 41 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential Assembly Drawing and Schematics 7 Assembly Drawing and Schematics 7.1 Assembly Drawing www.ti.com Figure 28. LAUNCHCC3235MOD Top-Layer Assembly Drawing 42 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential www.ti.com 7.2 Schematics Assembly Drawing and Schematics Figure 29. Schematics (1 of 5) SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 43 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential XDSET_P XDSET_N XDSET_P XDSET_N ID -> PK[7:4] =0x07 GND P01_GPIO_10 P02_GPIO_11 R21 R22 33 33 P57_GPIO_02 P55_GPIO_01 TM4C HOST MCU FOR EMULATION XDS_UART_RX XDS_UART_TX XDS_JTAG_TCK XDS_JTAG_TMS XDS_JTAG_TDO XDS_JTAG_TDI XDS_nRESET XDS_JTAG_TCK XDS_JTAG_TMS XDS_JTAG_TDO XDS_JTAG_TDI R2 R4 R6 R7 R8 R9 R10 33.0 33.0 33.0 33.0 33.0 33.0 33.0 U1A PA0/CAN0RX/I2C9SCL/T0CCP0/U0RX PA1/CAN0TX/I2C9SDA/T0CCP1/U0TX PA2/I2C8SCL/SSI0CLK/T1CCP0/U4RX PA3/I2C8SDA/SSI0FSS/T1CCP1/U4TX PA4/I2C7SCL/SSI0XDAT0/T2CCP0/U3RX PA5/I2C7SDA/SSI0XDAT1/T2CCP1/U3TX PA6/EPI0S8/I2C6SCL/SSI0XDAT2/T3CCP0/U2RX/USB0EPEN PA7/EPI0S9/I2C6SDA/SSI0XDAT3/T3CCP1/U2TX/USB0EPEN/USB0PFLT ITCK ITMS ITDI ITDO 33 34 35 36 37 38 40 41 100 99 98 97 25 24 23 22 15 14 13 12 123 124 49 50 116 117 81 82 83 84 85 86 94 93 107 108 109 110 111 112 118 119 103 104 105 106 PC0/SWCLK/TCK PC1/SWDIO/TMS PC2/TDI PC3/SWO/TDO PC4/C1-/EPI0S7/U7RX PC5/C1+/EPI0S6/RTCCLK/U7TX PC6/C0+/EPI0S5/U5RX PC7/C0-/EPI0S4/U5TX PE0/AIN3/U1RTS PE1/AIN2/U1DSR PE2/AIN1/U1DCD PE3/AIN0/U1DTR PE4/AIN9/SSI1XDAT0/U1RI PE5/AIN8/SSI1XDAT1 PG0/EN0PPS/EPI0S11/I2C1SCL/M0PWM4 PG1/EPI0S10/I2C1SDA/M0PWM5 PJ0/EN0PPS/U3RX PJ1/U3TX PL0/EPI0S16/I2C2SDA/M0FAULT3/USB0D0 PL1/EPI0S17/I2C2SCL/PHA0/USB0D1 PL2/C0O/EPI0S18/PHB0/USB0D2 PL3/C1O/EPI0S19/IDX0/USB0D3 PL4/EPI0S26/T0CCP0/USB0D4 PL5/EPI0S33/T0CCP1/USB0D5 PL6/T1CCP0/USB0DP PL7/T1CCP1/USB0DM PN0/U1RTS PN1/U1CTS PN2/EPI0S29/U1DCD/U2RTS PN3/EPI0S30/U1DSR/U2CTS PN4/EPI0S34/I2C2SDA/U1DTR/U3RTS PN5/EPI0S35/I2C2SCL/U1RI/U3CTS PP0/C2+/SSI3XDAT2/U6RX PP1/C2-/SSI3XDAT3/U6TX PP2/EPI0S29/U0DTR/USB0NXT PP3/EPI0S30/RTCCLK/U0DCD/U1CTS/USB0DIR PP4/U0DSR/U3RTS/USB0D7 PP5/I2C2SCL/U3CTS/USB0D6 TM4C1294NCPDTI3R PB0/CAN1RX/I2C5SCL/T4CCP0/U1RX/USB0ID PB1/CAN1TX/I2C5SDA/T4CCP1/U1TX/USB0VBUS PB2/EPI0S27/I2C0SCL/T5CCP0/USB0STP PB3/EPI0S28/I2C0SDA/T5CCP1/USB0CLK PB4/AIN10/I2C5SCL/SSI1FSS/U0CTS PB5/AIN11/I2C5SDA/SSI1CLK/U0RTS PD0/AIN15/C0O/I2C7SCL/SSI2XDAT1/T0CCP0 PD1/AIN14/C1O/I2C7SDA/SSI2XDAT0/T0CCP1 PD2/AIN13/C2O/I2C8SCL/SSI2FSS/T1CCP0 PD3/AIN12/I2C8SDA/SSI2CLK/T1CCP1 PD4/AIN7/SSI1XDAT2/T3CCP0/U2RX PD5/AIN6/SSI1XDAT3/T3CCP1/U2TX PD6/AIN5/SSI2XDAT3/T4CCP0/U2RTS/USB0EPEN PD7/AIN4/NMI/SSI2XDAT2/T4CCP1/U2CTS/USB0PFLT PF0/EN0LED0/M0PWM0/SSI3XDAT1/TRD2 PF1/EN0LED2/M0PWM1/SSI3XDAT0/TRD1 PF2/M0PWM2/SSI3FSS/TRD0 PF3/M0PWM3/SSI3CLK/TRCLK PF4/EN0LED1/M0FAULT0 /SSI3XDAT2/TRD3 R3 R5 0 100 XDSET_ID VBUS_USB1 XDSET_ID C1 0.1uF GND LED1 LED0 D1 Green D2 Red VBUS_USB1 R11 330k C2 0.01uF R12 220k GND PH0/EPI0S0/U0RTS PH1/EPI0S1/U0CTS PH2/EPI0S2/U0DCD PH3/EPI0S3/U0DSR R14 220 R15 220 VBAT_CC TP1 PK0/AIN16/EPI0S0/U4RX PK1/AIN17/EPI0S1/U4TX PK2/AIN18/EPI0S2/U4RTS PK3/AIN19/EPI0S3/U4CTS PK4/EN0LED0/EPI0S32/I2C3SCL/M0PWM6 PK5/EN0LED2/EPI0S31/I2C3SDA/M0PWM7 PK6/EN0LED1/EPI0S25/I2C4SCL/M0FAULT1 PK7/EPI0S24/I2C4SDA/M0FAULT2/RTCCLK/U0RI R16 R17 R18 R20 1.0k 1.0k 1.0k 1.0k VCC_LDO_3V3 GND 95 96 91 92 121 120 1 2 3 4 125 126 127 128 42 43 44 45 46 29 30 31 32 18 19 20 21 63 62 61 60 78 77 76 75 74 73 72 71 PM0/EPI0S15/T2CCP0 PM1/EPI0S14/T2CCP1 PM2/EPI0S13/T3CCP0 PM3/EPI0S12/T3CCP1 PM4/T4CCP0/TMPR3/U0CTS PM5/T4CCP1/TMPR2/U0DCD PM6/T5CCP0/TMPR1/U0DSR PM7/T5CCP1/TMPR0/U0RI PQ0/EPI0S20/SSI3CLK PQ1/EPI0S21/SSI3FSS PQ2/EPI0S22/SSI3XDAT0 PQ3/EPI0S23/SSI3XDAT1 PQ4/DIVSCLK/U1RX 5 6 11 27 102 VCC_BRD R1 1.0k VCC_LDO_3V3 R13 1.0k GND GND J6 J2 1 3 5 7 9 1 3 5 7 9 J3 1 3 5 7 9 11 13 2 4 6 8 10 12 14 GND P20_JTAG_TMS P19_JTAG_TCK P17_JTAG_TDO P16_JTAG_TDI CC_nRESET XDS_JTAG_TMS XDS_JTAG_TCK XDS_JTAG_TDO XDS_JTAG_TDI XDS_CC_nRESET VBAT_CC 2 4 6 8 10 2 4 6 8 10 R19 1.0k GND J4 1 2 3 4 5 DNP 10 9 8 7 6 IRSTN ITDI ITDO CMP-0075101-1 VCC_LDO_3V3 ITMS ITCK GND IRSTN R25 100 U1B WAKE RST HIB VREFA+

RBIAS EN0RXIP EN0RXIN 64 70 65 9 59 54 53 VCC_LDO_3V3 R24 10k VREFA GND R27 4.87k GND TM4C1294NCPDTI3R OSC0 OSC1 XOSC0 XOSC1 EN0TXOP EN0TXON 88 89 66 67 57 56 2 1 16MHz Y1 C4 22pF C11 22pF VCC_LDO_3V3 GND C3 1uF R23 51 VCC_LDO_3V3 GND C5 0.01uF C6 0.01uF C7 0.01uF C8 0.1uF C9 0.1uF C10 0.1uF GND VCC_LDO_3V3 U1C VBAT VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDDA VDDC VDDC 68 7 16 26 28 39 47 51 52 69 79 90 101 113 122 8 87 115 GND GND GND GND GND GND 17 48 55 58 80 114 GNDA 10 C14 0.01uF C15 1uF C16 2.2uF C17 0.1uF C18 1uF TM4C1294NCPDTI3R GND GND GND VCC_LDO_3V3 R26 1.0k 1 3 2 VREFA C12 0.01uF C13 1uF U2 LM4040B25IDBZR GND Assembly Drawing and Schematics www.ti.com Figure 30. Schematics (2 of 5) 44 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential USB-INTERFACE VCC_Buffer VCC_LDO_3V3 VBUS_USB1 XDSET_N XDSET_P XDSET_ID 0 1 1 1 9 J1 1 2 3 4 5 VBUS D-

D+

ID GND 678 L1 10 ohm L2 10 ohm GND U4 D1+

D1-

NC NC NC NC 1 2 6 7 9 10 D2+

D2-

GND GND 4 5 3 8 TPD4S010DQAR GND C21 0.01uF R31 100k GND POWER MANAGEMENT VBUS_USB1 VCC_MCU_5V J9 VCC_LDO_3V3 J7 VCC_BRD J8 VCC_Buffer L3 2.2uH U6 VIN EN PG 2 3 8 SW 7 VOS FB EP AGND PGND 6 5 9 4 1 C26 10uF R36 100k GND TPS62162DSGR C25 22uF C24 10uF R35 270 D4 Red C27 100uF C28 100uF GND GND GND GND GND GND P16_JTAG_TDI P17_JTAG_TDO P19_JTAG_TCK P20_JTAG_TMS CC_nRESET to Targ et J5 to Host-MCU 2 4 6 8 10 1 3 5 7 9 XDS_JTAG_TDI XDS_JTAG_TDO XDS_JTAG_TCK XDS_JTAG_TMS 10k R29 XDS_CC_nRESET 61301021121 C19 0.1uF R28 100k GND U3 VCCA A DIR 1 3 5 VCCB B GND 6 4 2 C20 0.1uF GND XDS_nRESET VCC_Buffer GND GND SN74LVC1T45DCKR SW1 23 4 1 R32 100 GND D3 Yellow R30 390 3 2 GND GND 1 Q1 BSS138 VOLTA GE TRANSLATORS VCC_Buffer VCC_LDO_3V3 C22 0.1uF C23 0.1uF R33 100k GND U5 VCCA A DIR 1 3 5 GND VCCB B GND 6 4 2 R34 33.0 XDS_UART_RX 1 2 3 J11 J12 1 2 3 VCC_Buffer VCC_LDO_3V3 C30 0.1uF GND U7 VCCA A DIR 1 3 5 VCCB B GND 6 4 2 C29 0.1uF GND XDS_UART_TX LP_GPIO_02 P57_GPIO_02 R37 33.0 SN74LVC1T45DCKR GND GND CHECK LAYOUT GUIDE FROM DATASHEET J10 VBAT_CC P55_GPIO_01 LP_GPIO_01 SN74LVC1T45DCKR GND www.ti.com Assembly Drawing and Schematics Figure 31. Schematics (3 of 5) SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 45 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential VBAT_CC C31 0.1uF C32 0.1uF C33 0.1uF GND GND GND J13 VBAT_CC R44 100k R45 R46 0 0 P17_GPIO_24 P16_GPIO_23 DNP R47 100k GND SPI_CS_IN P17_JTAG_TDO P16_JTAG_TDI P19_JTAG_TCK RF SECTION RF_ABG CC3235MOD TARGET EXTERNAL FLASH RF_ABG 31 RF_ABG VBAT_CC CC_nRESET P16_JTAG_TDI P17_JTAG_TDO P19_JTAG_TCK P20_JTAG_TMS SOP0 SOP1 SOP2 SPI_MISO SPI_CS_IN SPI_CLK SPI_MOSI GPIO0 GPIO01 GPIO02 GPIO03 GPIO04 GPIO05 GPIO06 GPIO07 GPIO08 GPIO09 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO22 GPIO28 GPIO30 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 44 46 47 48 49 50 51 52 53 54 3 4 9 10 5 6 7 8 11 19 42 1 2 16 25 26 27 28 29 30 32 38 43 55 56 57 58 59 60 61 62 63 CC1 VBAT1 VBAT2 VBAT_RESET RESET NC JTAG_TDI JTAG_TDO JTAG_TCK JTAG_TMS 37 40 36 35 39 12 18 21 22 34 24 23 13 14 15 17 20 33 41 45 FLASH_SPI_MISO FLASH_SPI_CS_IN FLASH_SPI_CLK FLASH_SPI_MOSI SOP0 SOP1 SOP2 NC NC NC NC CC3235MODSF12MOBR J15 1 DNP 2345 R48 DNP 8.2pF C35 0 DNP C36 0.5pF DNP C37 0.5pF GND DNP C38 0.5pF GND GND GND R50 8.2pF C39 1pF DNP C40 0.5pF GND E1 J17 1 23 L4 4.7nH GND 123456 d e e F M830520 GND GND GND GND P50_GPIO_00 P55_GPIO_01 P57_GPIO_02 P58_GPIO_03 P59_GPIO_04 P60_GPIO_05 P61_GPIO_06 P62_GPIO_07 P63_GPIO_08 P64_GPIO_09 P01_GPIO_10 P02_GPIO_11 P03_GPIO_12 P04_GPIO_13 P05_GPIO_14 P06_GPIO_15 P07_GPIO_16 P08_GPIO_17 P15_GPIO_22 P18_GPIO_28 P53_GPIO_30 VCC_BRD VBAT_CC R38 DNP 0 R39 DNP 0 C34 0.1uF GND R40 DNP 0 R41 DNP 0 R42 DNP 0 R43 DNP 0 SPI_MISO SPI_MOSI SPI_CLK SPI_CS_IN U8 VCC DNP CS SCLK SI/SIO0 SO/SIO1 WP/SIO2 RESET/SIO3 8 1 6 5 2 3 7 GND 4 MX25R6435FM2IL0 GND GANG PROGRAMMING CONNECTOR CC_nRESET DNP J14 1 2 3 4 5 10 9 8 7 6 TC2050-IDC-NL-FP SPI_CS_IN SPI_CLK SPI_MOSI SPI_MISO GND GND SOP JUMPERS VBAT_CC VCC_BRD J16 1 2 3 R49 10k J18 1 3 5 2 4 6 SOP0 SOP1 SOP2 D5 R52 10k GND R51 2.2k P21_GPIO_25 OUTPUT ONLY Assembly Drawing and Schematics www.ti.com Figure 32. Schematics (4 of 5) 46 CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential I2C BUS SELECTION TEMP SENSOR ACCELEROMETER VCC_BRD VCC_BRD VCC_BRD R126 3.3k R127 3.3k J23 J24 SENS_I2C_SCL SENS_I2C_SDA P01_GPIO_10 P16_GPIO_23 R130 R134 DNP P02_GPIO_11 P17_GPIO_24 R137 R139 DNP 0 0 0 0 R125 0 U10 V+

SDA SCL ALERT 5 6 1 3 R128 0 R132 DNP 0 ADD0 GND PAD 4 2 7 C46 0.1uF SENS_I2C_SDA R135 SENS_I2C_SCL R136 GND 0 0 TMP116AIDRVR GND SENS_I2C_SCL R141 0 GND SENS_I2C_SDA R138 0 SWITCHES & FACTORY RESET VCC_BRD VCC_BRD VCC_BRD R143 10k R144 100k 1 6 Q3A BSS84DW-7-F 2 Q3B 5 4 3 VCC_BRD VCC_BRD SOP1 SOP0 VCC_BRD R142 100k D6 CDBU00340 CC_nRESET LP_RESET_OUT R148 1.0k R149 1.0k 23 23 SW2 SW3 4 1 4 1 R155 10k R156 10k GND GND GND GND P04_GPIO_13 P15_GPIO_22 1 Q4 FDN358P 2 3 D8 Red R153 270 4 3 1 2 SW4 EVQ-PSD02K R154 1.0k P02_GPIO_11 P01_GPIO_10 P64_GPIO_09 R150 100k R151 100k R152 100k J26 J27 J28 GND GND GND GND GND GND VCC_BRD R124 0 C48 0.1uF R129 DNP 0 R131 0 GND R140 0 C47 0.1uF 7 3 12 10 1 2 U11 GND VDD VDDIO SCX CSB SDO SDX BMA280 INT1 INT2 PS NC GND GNDIO 5 6 9 8 11 4 GND R133 DNP 0 P04_GPIO_13 LED INDICAT ORS VCC_BRD J25 6 5 4 G R B D7 19-337/R6GHBHC-A01/2T 3 2 1 R145 16 R146 110 R147 24 1 Q5 BSS138 3 2 1 Q6 BSS138 3 2 1 Q7 BSS138 3 2 www.ti.com Assembly Drawing and Schematics Figure 33. Schematics (5 of 5) SWRU548A February 2019 Submit Documentation Feedback CC3235MODSF LaunchPad Development Kit (LAUNCHCC3235MOD) 47 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential BOOSTER PACK INTERFACE VCC_BRD VBAT_CC R57 DNP R58 0 0 ANA_IN2 ANA_IN3 R61 R64 R68 R71 R74 R78 R82 R86 R90 DNP DNP 0 0 0 0 0 0 0 0 0 R97 R100 DNP DNP R102 R103 DNP DNP 0 0 0 0 P04_GPIO_13 P03_GPIO_12 P61_GPIO_06 P05_GPIO_14 P62_GPIO_07 P01_GPIO_10 P02_GPIO_11 Alternate I2C P16_GPIO_23 P17_GPIO_24 P03_GPIO_12 P04_GPIO_13 P1 1 2 3 4 5 6 7 8 9 10

+3.3V Analog_In LP_UART_RX LP_UART_TX GPIO !

Analog In SPI_CLK GPIO !

I2C_SCL I2C_SDA

+5V GND Analog_In Analog_In Analog_In Analog_In Analog_In/I2S_WS Analog_In/I2S_SCLK Analog_Out/I2S_SDout Analog_Out/I2S_SDin 21 22 23 24 25 26 27 28 29 30 R65 R69 R72 R75 R79 R83 R87 R91 VCC_MCU_5V 0 0 0 0 0 0 0 0 0 R94 DNP ANA_IN1 ANA_IN4 ANA_IN2 ANA_IN3 GND P63_GPIO_08 P53_GPIO_30 P64_GPIO_09 P50_GPIO_00 P60_GPIO_05 P02_GPIO_11 P01_GPIO_10 P17_GPIO_24 P64_GPIO_09 P21_GPIO_25 P18_GPIO_28 P62_GPIO_07 P60_GPIO_05 P16_GPIO_23 P17_GPIO_24 R60 R62 R66 R70 R73 R76 R80 R84 R88 R92 DNP DNP DNP DNP DNP DNP DNP DNP 0 0 0 0 0 0 0 0 0 0 P2 40 39 38 37 36 35 34 33 32 31 PWM/GPIO !

PWM/GPIO !

PWM/GPIO !

PWM/GPIO !

Timer_Cap/GPIO !

Timer_Cap/GPIO !

GPIO !

GPIO !

GPIO !

GPIO !

GND PWM/GPIO !

GPIO !

GPIO RST SPI_MOSI SPI_MISO SPI_CS/GPIO !

SPI_CS/GPIO !

GPIO !

20 19 18 17 16 15 14 13 12 11 For Antenna diversity CC_COEX_SW_OUT CC_COEX_BLE R53 R54 0 0 P58_GPIO_03 P50_GPIO_00 P58_GPIO_03 & P50_GPIO_00 can also be used for ANTSEL R55 100k R56 100k COEX_SW_OUT &

CC_COEX_BLE_IN routed to ANTSEL on Diversity Board GND GND P50_GPIO_00 P62_GPIO_07 Alternate RTS P61_GPIO_06 Alternate CTS R95 R98 DNP DNP R101 DNP 0 0 0 4 1 1 4 1 1 VCC_OPAMP 8 R109 470 U9C OPA4342EA/250 R112 422k GND GND C42 0.01uF GND R107 DNP 0 P60_GPIO_05 VCC_OPAMP 14 R117 470 U9D OPA4342EA/250 R114 DNP 0 R118 0 C44 0.01uF GND R122 422k GND GND VCC_MCU_5V VBAT_CC J19 1 2 3 R104 0 2 3 FDN358P DNP Q2 1 R105 DNP 0 J20 1 2 3 GND GND P59_GPIO_04 / DIO 12 on CC2640R2LP

(COEX_WAKEUP) R59 DNP P59_GPIO_04 CC_COEX_WAKEUP 0 0 0 0 0 0 0 0 R63 R67 R77 R81 R85 R89 R93 R96 R99 0 0 DNP DNP SWAP MOSI/MISO GND P18_GPIO_28 P08_GPIO_17 LP_RESET_OUT P07_GPIO_16 P06_GPIO_15 P21_GPIO_25 LP_GPIO_01 P15_GPIO_22 P06_GPIO_15 P07_GPIO_16 VCC_BRD VCC_OPAMP J21 J22 GND GND R110 576k ANA_IN1 LP_GPIO_02 ANA_IN4 R108 576k 9 10 ADC DRIVER VCC_OPAMP C41 0.01uF GND R113 422k GND GND 6 5 2 3 4 1 1 4 1 1 VCC_OPAMP 7 1 R123 422k GND GND R111 470 U9B OPA4342EA/250 R106 0 DNP C43 0.01uF GND R120 470 U9A OPA4342EA/250 R115 DNP 0 R121 DNP 0 C45 0.01uF GND R119 576k ANA_IN2 P58_GPIO_03 ANA_IN3 R116 576k 13 12 P59_GPIO_04 TP2 Revision History www.ti.com NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Revision History Changes from Original (February 2019) to A Revision .................................................................................................. Page Added last paragraph to Section 1.6.2 ................................................................................................. 8 Added Section 6.3 ....................................................................................................................... 41 48 Revision History Copyright 2019, Texas Instruments Incorporated SWRU548A February 2019 Submit Documentation Feedback Restrictions A D N TI Confidential User's Guide SWRU548A February 2019 Manual Information to the End User 1 2 The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual must include all required regulatory information and warnings as shown in this manual. RF Function and Frequency Range The CC3235MODSM2MOB and CC3235MODSF12MOB devices are designed to operate in the WLAN 2.4-GHz and 5-GHz band. The CC3235MODSM2MOB and CC3235MODSF12MOB devices support the following channels dependent on the region of operation:

FCC and IC: Ch 1 to 11 (2142 MHz to 2462 MHz) and 36 to 161 (5180 MHz to 5805 MHz) EU: Channels 1 through 13 (2142 MHz to 2472 MHz) and 36 to 136 (5180 MHz to 5680 MHz) JP: Channels 1 through 13 (2142 MHz to 2472 MHz) and 36 to 136 (5180 MHz to 5680 MHz) Note that the CC3235MODx devices do not support determination of its region through any external mechanism. The region is set by the application SW, or at the time of programming of the device. The end user is unable to change the region of operation at any time. NOTE: The maximum RF power transmitted in each WLAN 2.4 GHz band is 19 dBm (EIRP power). The maximum RF power transmitted in each WLAN 5 GHz band is 18.8 dBm (EIRP power). 3 FCC and IC Certification and Statement This device is intended for OEM integrators under the following conditions:

The antenna must be installed so 20 cm of space is maintained between the antenna and the users. The transmitter module may not be colocated with any other transmitter of antenna. To comply with FCC and IC regulations limiting maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed:

+2.5 dBi in WLAN 2.4 GHz

+4.5 dBi in WLAN 5 GHz In the event that these conditions cannot be met (for example, certain laptop configurations or colocation with another transmitter), then the FCC and IC authorization is no longer considered valid and the FCC and IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and IC authorization. 3.1 FCC The TI CC3235MODx modules are certified for FCC as a single-modular transmitter. The module is an FCC-certified radio module that carries a modular grant. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

This device may not cause harmful interference. SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Manual Information to the End User 49 Restrictions A D N TI Confidential FCC and IC Certification and Statement www.ti.com This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement:

CAUTION This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from the one the receiver is connected to. Consult the dealer or an experienced radio or TV technician for help. Increase the separation between the equipment and receiver. The antennas listed in Table 12 of this document were verified in the compliance testing. Use only the antennas listed in Table 12 . A separate approval is required for all other operating configurations, including different antenna configurations 3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement The TI CC3235MODx modules are certified for IC as a single-modular transmitter. The TI CC3235MODx modules meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada license-exempt RSS standards. Operation is subject to the following two conditions:

This device may not cause interference. This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deus conditions suivantes:

L'appareil ne doit pas produire de brouillage. L'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage ests susceptible d'en compromettre lu fonctionnement. 50 Manual Information to the End User Copyright 2019, Texas Instruments Incorporated SWRU548A February 2019 Submit Documentation Feedback Restrictions A D N TI Confidential www.ti.com FCC and IC Certification and Statement IC RF Radiation Exposure Statement:

CAUTION This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. Dclaration d'exposition aux radiations:

Cut quipement est conforme aux limites d'exposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This radio transmitter (451I-CC3235MOD) has been approved by Industry Canada to operated with the antenna types listed in Table 12 of this document with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. The antennas listed in Table 12 of this document were verified in the compliance testing. Use only the antennas listed in Table 12 . A separate approval is required for all other operating configurations, including different antenna configurations. 3.3 End Product Labeling This module is designed to comply with the FCC statement, FCC ID: Z64-CC3220MOD. The host system using this module must display a visible label indicating the following text:

Contains FCC ID: Z64-CC3235MOD This module is designed to comply with the IC statement, IC: 451I-CC3220MOD. The host system using this module must display a visible label indicating the following text:

Contains IC: 451I-CC3235MOD This module is designed to comply with JP statement 201-190033. The host system using this module must display a visible label indicating the following text:

Contains transmitter module with certificate module 201-190033 3.4 Device Classifications Because host devices vary widely with design features and configurations, module integrators shall reference the following guidelines regarding device classification and simultaneous transmission, and seek guidance from their preferred regulatory test lab to determine how regulatory guidelines will impact the device compliance. Proactive management of the regulatory process will minimize unexpected schedule delays and costs due to unplanned testing activities. The module integrator must determine the minimum distance required between their host device and the body of the user. The FCC provides device classification definitions to assist in making the correct determination. Note that these classifications are guidelines only; strict adherence to a device classification may not satisfy the regulatory requirement as near-body device design details may vary widely. The user-preferred test lab will be able to assist in determining the appropriate device category for the host product and if a KDB or PBA must be submitted to the FCC. Note, the module that the user is using has been granted modular approval for mobile applications. Portable applications may require further RF exposure (SAR) evaluations. It is also likely that the host and module combination will need to undergo testing for FCC Part 15, regardless of the device classification. The preferred test lab of the user will be able to assist in determining the exact tests which are required on the host and module combination. 3.5 FCC Definitions Portable: (2.1093) A portable device is defined as a transmitting device designed to be used so that the radiating structures of the device is or are within 20 centimeters of the body of the user. SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Manual Information to the End User 51 Restrictions A D N TI Confidential FCC and IC Certification and Statement www.ti.com Mobile: (2.1091) (b) A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitters radiating structures and the body of the user or nearby persons. Per 2.1091d(d)(4) In some cases (for example, modular or desktop transmitters), the potential conditions of use of a device may not allow easy classification of that device as either Mobile or Portable. In these cases, applicants are responsible for determining minimum distances for compliance for the intended use and installation of the device based on evaluation of either specific absorption rate (SAR), field strength, or power density, whichever is most appropriate. 3.6 Simultaneous Transmission Evaluation This module has not been evaluated or approved for simultaneous transmission as it is impossible to determine the exact multi-transmission scenario that a host manufacturer may choose. Any simultaneous transmission condition established through module integration into a host product must be evaluated per the requirements in KDB447498D01(8) and KDB616217D01,D03 (for laptop, notebook, netbook, and tablet applications). These requirements include, but are not limited to:

Transmitters and modules certified for mobile or portable exposure conditions can be incorporated in mobile host devices without further testing or certification when:

The closest separation among all simultaneous transmitting antennas is > 20 cm or Antenna separation distance and MPE compliance requirements for ALL simultaneous transmitting antennas have been specified in the application filing of at least one of the certified transmitters within the host device. In addition, when transmitters certified for portable use are incorporated in a mobile host device, the antennas must be > 5 cm from all other simultaneous transmitting antennas All antennas in the final product must be at least 20 cm from users and nearby persons. 4 EU Certification and Statement 4.1 RF Exposure Information (MPE) 4.2 Simplified DoC Statement 4.2.1 CC3235MODx This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply with the RF exposure requirements, this module must be installed in a host platform that is intended to be operated in a minimum of 20-cm separation distance to the user. Hereby, Texas Instruments declares that the radio equipment type CC3235MODSM2MOB and CC3235MODSF12MOB are in compliance with Directive 2014/53/EU. The full text of the EU declarations of conformity are available at:

CC3220MODSM2MOB EC Declaration of Conformity (DoC) CC3220MODSF12MOB EC Declaration of Conformity (DoC) CC3220MODASM2MON EC Declaration of Conformity (DoC) CC3220MODASF12MON EC Declaration of Conformity (DoC) 4.2.2 LAUNCHCC3235MOD Hereby, Texas Instruments declares that the radio equipment type LAUNCHCC3235MOD is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity are available at LAUNCHCC3220MODASF EC Declaration of Conformity (DoC). 52 Manual Information to the End User Copyright 2019, Texas Instruments Incorporated SWRU548A February 2019 Submit Documentation Feedback Restrictions A D N TI Confidential www.ti.com EU Certification and Statement 4.3 Waste Electrical and Electronic Equipment (WEEE) 4.4 OEM and Host Manufacturer Responsibilities OEM and host manufacturers are ultimately responsible for the compliance of the host and module. The final product must be reassessed against all of the essential requirements of the RED before it can be placed on the EU market. This includes reassessing the transmitter module for compliance with the radio and EMF essential requirements of the RED. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. 4.5 Antenna Specifications In all cases, assessment of the final product must be met against the Essential requirements of RE Directive Article 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. 1. The antennas listed in Table 12 were verified in the conformity testing, and for compliance the antenna 2. shall not be modified. A separate approval is required for all other operating configurations, including different antenna configurations. If any other simultaneous transmission radio is installed in the host platform together with this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment certification is required. 5 CC3235MODx Approved Antennas Antenna Information Table 12. CC3235MODx Approved Antennas Antenna Type Chip Model W3078 2.4-GHz Gain 5-GHz Gain 1 2 3 4 5 6 7 8 9 10 11 Ethertronics Brand Pulse Yageo Laird LSR PCB Dipole PIFA ANT5320LL04R245 5A M830520 1000423 CAF94504 CAF94505 001-0012 080-0013 080-0014 001-0016 001-0021 1.7 2.17

-0.6 1 2 2 2 2 2 2.5 2.5 4.3 3.51 2.6 4.5 4 4 2 2 2 3 3 SWRU548A February 2019 Submit Documentation Feedback Copyright 2019, Texas Instruments Incorporated Manual Information to the End User 53 Restrictions A D N TI Confidential Waste Electrical and Electronic Equipment (WEEE) This symbol means that according to local laws and regulations your product and/or battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment. IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES AS IS AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TIs products are provided subject to TIs Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TIs provision of these resources does not expand or otherwise alter TIs applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2019, Texas Instruments Incorporated Restrictions A D N TI Confidential

CC3235MODx Label Sample and Location CC3235MODSM2MOB CC3220MODSF12MOB

Texas Instruments Incorporated 12500 Tl Boulevard, M/S D2000, Dalllas, TX, United States 75243 Tel: 214-567-5409 ; Fax: 214-479-5605 Date: June 4, 2019 Request for Modular Approval for FCC ID: 264-CC323SMOD EUT item Requirements 1. The modular transmitter must have its own } The module is equipped with its own shielding case RF shielding. that is soldered and cannot be removed by the customer. 2. The modular transmitter must have The module has buffer modulation / data inputs. buffered modulation / data inputs. 3. The modular transmitter must have its own | The module has its own power supply regulation. power supply regulation. _ -

4, The module must contain a permanently The requirements of the antenna(s} and spurious i attached antenna, or contain a unique emissions have been fulfilled. Please refer to the antenna connector, and be marketed and test report and the integrator instructions of this operated only with specific antenna(s), filing. 5. The modular transmitter must be tested ina | The module was tested on a stand-alone evaluation stand-alone configuration. board and its not inside of another device during testing 6. The modular transmitter must be labeled The module transmitter will be labeled with its own with its own FCC ID number. FCC ID, and for OEM integration the integration manual contains labeling instructions for the host device per Part 15.212 (vi) 7. The modular transmitter must comply with | The module approved transmitter complies with all any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. applicable rules and the integration manual contains any specific requirements addressed to the integrator and/or to the end-user of the final end-product. The modular transmitter must comply with any applicable RF exposure requirement.

+f The module complies with the FCC RF exposure requirements for fixed and mobile applications. RF exposure is addressed in the RF exposure exhibit. Mattias Lange /

m-lange@ti.com

exas Instruments Incorported 12500 TI BLVD., Dallas Texas, 75243 OF CoN Ward Product Equality Declaration FCC: Z64-CC3235M0D We, Texas Instruments Incorported, declare on our sole responsibility for the product of CC3235MODSM2MOB, CC3235MODSF12MOB as below:

The differences are between the products are as below:

Pi Anterna | On-Chip Flash Pere er rns eee me A CC3220MODSF12MOB Non Integral Antenna Except listings above, the radio operation between products are identical. ld you have any questions or comments regarding this matter, please have my best attention. Sincerely yours, Eyed eee.) rer Cad emeleal