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Community Reference Design WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED April 2019 WL18xxMOD WiLink 8 Single-Band Combo Module Wi-Fi, Bluetooth, and Bluetooth Low Energy (LE) 1 Device Overview 1.1 Features General Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management Quick Hardware Design With TI Module Collateral and Reference Designs Operating Temperature: 20C to +70C Small Form Factor: 13.3 13.4 2 mm 100-Pin MOC Package FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFA Antennas Wi-Fi WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11b, 802.11g, and 802.11n 20- and 40-MHz SISO and 20-MHz 2 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps
(TCP), 100 Mbps (UDP) 2.4-GHz MRC Support for Extended Range Fully Calibrated: Production Calibration Not Required 4-Bit SDIO Host Interface Support Wi-Fi Direct Concurrent Operation
(Multichannel, Multirole) Internet of Things (IoT) 1.2 Applications Multimedia Home Electronics Home Appliances and White Goods Bluetooth and Bluetooth low energy
(WL183xMOD Only) Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID: D032799) Host Controller Interface (HCI) Transport for Bluetooth Over UART Dedicated Audio Processor Support of SBC Encoding + A2DP Dual-Mode Bluetooth and Bluetooth Low Energy TI's Bluetooth- and Bluetooth Low Energy-
Certified Stack Key Benefits Reduces Design Overhead Differentiated Use Cases by Configuring WiLink 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks) Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4 the Range Versus One Antenna Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in One Step Lowest Wi-Fi Power Consumption in Connected Idle (< 800 A) Configurable Wake on WLAN Filters to Only Wake Up the System Wi-Fi-Bluetooth Single Antenna Coexistence Industrial and Home Automation Smart Gateway and Metering Video Conferencing Video Camera and Security An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 1.3 Description The certified WiLink 8 module from TI offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linuxand Android. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties. PART NUMBER WL1801MOD WL1805MOD WL1831MOD WL1835MOD
(1) For more information, see Section 9. 1.4 Functional Block Diagram Device Information (1) PACKAGE QFM (100) QFM (100) QFM (100) QFM (100) BODY SIZE 13.3 mm 13.4 mm 2 mm 13.3 mm 13.4 mm 2 mm 13.3 mm 13.4 mm 2 mm 13.3 mm 13.4 mm 2 mm Figure 1-1 shows a functional block diagram of the WL1835MOD variant. RF_ANT2 RF_ANT1 BG1 BG2 BT F F 2.4-GHz SPDT ZigBee COEX Interface BT_UART WLAN_SDIO BT_EN WLAN_EN 32.768 kHz VIO VBAT 26M XTAL WRF2 WRF1 BTRF M A C P H Y
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M A C P H Y
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PM NOTE: Dashed lines indicate optional configurations and are not applied by default. Figure 1-1. WL1835MOD Functional Block Diagram Copyright 2017, Texas Instruments Incorporated 2 Device Overview Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback Copyright 20132017, Texas Instruments Incorporated www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Table of Contents 1 Device Overview ......................................... 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 1 1.3 Description ............................................ 2 1.4 Functional Block Diagram ............................ 2 2 Revision History ......................................... 3 3 Device Comparison ..................................... 4 3.1 Related Products ..................................... 4 4 Terminal Configuration and Functions.............. 5 4.1 Pin Attributes ......................................... 6 5 Specifications ............................................ 9 5.1 Absolute Maximum Ratings .......................... 9 5.2 ESD Ratings .......................................... 9 5.3 Recommended Operating Conditions ................ 9 5.4 External Digital Slow Clock Requirements .......... 10 5.5 Thermal Resistance Characteristics for MOC 100-
Pin Package......................................... 10 5.6 WLAN Performance: 2.4-GHz Receiver Characteristics....................................... 11 5.7 WLAN Performance: 2.4-GHz Transmitter Power .. 12 5.8 WLAN Performance: Currents ...................... 13 5.9 Bluetooth Performance: BR, EDR Receiver CharacteristicsIn-Band Signals ................... 13 5.10 Bluetooth Performance: Transmitter, BR ........... 14 5.11 Bluetooth Performance: Transmitter, EDR.......... 14 5.12 Bluetooth Performance: Modulation, BR ............ 15 5.13 Bluetooth Performance: Modulation, EDR .......... 15 5.14 Bluetooth low energy Performance: Receiver Characteristics In-Band Signals................... 15 5.15 Bluetooth low energy Performance: Transmitter 2 Revision History Characteristics....................................... 16 5.16 Bluetooth low energy Performance: Modulation Characteristics....................................... 16 5.17 Bluetooth BR and EDR Dynamic Currents.......... 16 5.18 Bluetooth low energy Currents ...................... 17 5.19 Timing and Switching Characteristics ............... 17 6 Detailed Description ................................... 25 6.1 WLAN Features ..................................... 26 6.2 Bluetooth Features .................................. 26 6.3 Bluetooth low energy Features ..................... 27 6.4 Device Certification.................................. 27 6.5 Module Markings .................................... 29 6.6 Test Grades ......................................... 29 6.7 End Product Labeling ............................... 30 6.8 Manual Information to the End User ................ 30 7 Applications, Implementation, and Layout........ 31 7.1 Application Information .............................. 31 8 Device and Documentation Support ............... 38 8.1 Device Support ...................................... 38 8.2 Related Links........................................ 41 8.3 Community Resources .............................. 41 8.4 Trademarks.......................................... 41 8.5 Electrostatic Discharge Caution..................... 41 8.6 Glossary ............................................. 41 9 Mechanical, Packaging, and Orderable Information .............................................. 42 9.1 TI Module Mechanical Outline ...................... 42 9.2 Tape and Reel Information .......................... 43 9.3 Packaging Information .............................. 45 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from November 18, 2016 to October 31, 2017 Page Changed Features section .......................................................................................................... 1 Changed Bluetooth 4.1 to Bluetooth 4.2 .......................................................................................... 1 Added Bluetooth 4.2 secure connection compliance in Features .............................................................. 1 Changed package information in Device Information table ..................................................................... 2 Changed name for pin 18 from 2G4_ANT2_W in Pin Attributes ............................................................... 7 Changed name for pin 18 from 2G4_ANT1_WB in Pin Attributes ............................................................. 7 Changed note in Absolute Maximum Ratings..................................................................................... 9 Bluetooth LE sensitivity typical value from 93.2 in LE Receiver Characteristics In-Band Signals .................... 15 added (Typ) to Specification column in WLAN Performance Parameters ................................................... 25 calibration performance from 5 seconds to 5 minutes WLAN Performance Parameters .................................. 25 Added Device Certification and Qualification section........................................................................... 27 Changed Module Markings section ............................................................................................... 29 Added End Product Labeling section ............................................................................................. 30 Added Device Nomenclature image ............................................................................................. 40 Changed package type in Package Option Addendum ........................................................................ 46 Copyright 20132017, Texas Instruments Incorporated Revision History 3 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 3 Device Comparison The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and Bluetooth combo connectivity. Table 3-1 compares the features of the module variants. FEATURE WLAN 2.4-GHZ SISO (1) WLAN 2.4-GHZ MIMO (1) WLAN 2.4-GHZ MRC (1) BLUETOOTH Table 3-1. TI WiLink 8 Module Variants DEVICE WL1835MOD WL1831MOD WL1805MOD WL1801MOD
(1) SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining, supported at 802.11 g/n. 3.1 Related Products For information about other devices in this family of products or related products, see the following links. Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF solutions suitable for a broad range of application. The offerings range from fully customized solutions to turnkey offerings with precertified hardware and software (protocol). Sub-1 GHz Long-range, low power wireless connectivity solutions are offered in a wide range of Sub-1 GHz ISM bands. Reference Designs for WL18xx The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns. 4 Device Comparison Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback Copyright 20132017, Texas Instruments Incorporated www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 4 Terminal Configuration and Functions Figure 4-1 shows the pin assignments for the 100-pin MOC package. K 2 3 _ T X E
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6 3 N P I D N G
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7 3 N P I O V I
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7 4 N P I D N G
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8 4 N P I D N G D N G
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4 4 N P I
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5 4 N P I PIN 32 - RF_ANT1 PIN 31 - GND PIN 30 - GND PIN 29 - GND PIN 28 - GND PIN 27 - GPIO1 PIN 26 - GPIO2 PIN 25 - GPIO4 PIN 24 - GND PIN 23 - GND PIN 22 - RESERVED2 PIN 21 - RESERVED1 PIN 20 - GND PIN 19 - GND PIN 18 - RF_ANT2 PIN 17 - GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND PIN 49 - GND PIN 50 - BT_HCI_RTS PIN 51 - BT_HCI_CTS PIN 52 - BT_HCI_TX PIN 53 - BT_HCI_RX PIN 54 - GND PIN 55 - GND PIN 56 - BT_AUD_IN PIN 57 - BT_AUD_OUT PIN 58 - BT_AUD_FSYNC PIN 59 - GND PIN 60 - BT_AUD_CLK PIN 61 - GND PIN 62 - RESERVED3 PIN 63 - GND PIN 64 - GND Pin 2 Indicator D N G
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6 N P I Figure 4-1. 100-Pin MOC Package (Bottom View) Copyright 20132017, Texas Instruments Incorporated Terminal Configuration and Functions 5 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 4.1 Pin Attributes Table 4-1 describes the module pins. Table 4-1. Pin Attributes PIN NAME PIN NO. Clocks and Reset Signals WL_SDIO_CLK EXT_32K WLAN_EN BT_EN 8 36 40 41 Power-Management Signals VIO_IN VBAT_IN VBAT_IN TI Reserved GPIO11 GPIO9 GPIO10 GPIO12 RESERVED1 RESERVED2 GPIO4 RESERVED3 38 46 47 2 3 4 5 21 22 25 62 TYPE/
DIR I ANA I I POW POW POW I/O I/O I/O I/O I I I/O O WLAN Functional Block: Int Signals WL_SDIO_CMD_1V8 WL_SDIO_D0_1V8 WL_SDIO_D1_1V8 WL_SDIO_D2_1V8 6 10 11 12 I/O I/O I/O I/O SHUTDOWN STATE AFTER POWER UP (1) Hi-Z PD PD PD PD PD PU PU PD PD PD PD Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z PD PD PD PD PD PU PU PD PD PD PD Hi-Z Hi-Z Hi-Z Hi-Z VOLTAGE LEVEL CONNECTIVITY (2) 1801 1805 1831 1835 DESCRIPTION (3) 1.8 V 1.8 V 1.8 V 1.8 V VBAT VBAT 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V v v v x v v v v v v v x x v x v v v v v v v x v v v v v v v x x v x v v v v v v v v v v v WLAN SDIO clock. Must be driven by the host. Input sleep clock:
32.768 kHz Mode setting: high =
enable Mode setting: high =
enable Connect to 1.8-V external VIO Power supply input, 2.9 to 4.8 V Power supply input, 2.9 to 4.8 V v Reserved for future use. NC if not used. v Reserved for future use. NC if not used. v Reserved for future use. NC if not used. v Reserved for future use. NC if not used. x Reserved for future use. NC if not used. x Reserved for future use. NC if not used. v Reserved for future use. NC if not used. x Reserved for future use. NC if not used. v v v v WLAN SDIO command WLAN SDIO data bit 0 WLAN SDIO data bit 1 WLAN SDIO data bit 2 v v v v v v v v v v v x x v x v v v v
(1) PU = pullup; PD = pulldown
(2) v = connect; x = no connect
(3) Host must provide PU using a 10-K resistor for all non-CLK SDIO signals. 6 Terminal Configuration and Functions Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Table 4-1. Pin Attributes (continued) PIN NAME WL_SDIO_D3_1V8 WL_IRQ_1V8 RF_ANT2 GPIO2 GPIO1 RF_ANT1 PIN NO. 13 14 18 26 27 32 TYPE/
DIR I/O O ANA I/O I/O ANA WL_UART_DBG Bluetooth Functional Block: Int Signals 42 O BT_UART_DBG BT_HCI_RTS_1V8 BT_HCI_CTS_1V8 BT_HCI_TX_1V8 BT_HCI_RX_1V8 BT_AUD_IN BT_AUD_OUT BT_AUD_FSYNC BT_AUD_CLK 43 50 51 52 53 56 57 58 60 O O I O I I O I/O I/O SHUTDOWN STATE AFTER POWER UP (1) PU 0 PD PD PU PU PU PU PU PU PD PD PD PD Hi-Z PD PD PD PU PU PU PU PU PU PD PD PD PD VOLTAGE LEVEL CONNECTIVITY (2) 1801 1805 1831 1835 v v v v v v v x x x x x x x x x v v x v v v v x x x x x x x x x v v x v v v v v v v v v v v v v 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V v v v v v v v v v v DESCRIPTION (3) WLAN SDIO data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization. WLAN SDIO out-of-
band interrupt line. Set to rising edge
(active high) by default. (To extract the debug option WL_RS232_TX/RX interface out, pull up the IRQ line at power up before applying enable.) 2.4-GHz ANT2 TX, RX; 2.4-GHz secondary antenna MRC/MIMO only. WL_RS232_RX
(when WLAN_IRQ =
1 at power up) WL_RS232_TX
(when WLAN_IRQ =
1 at power up) 2.4-GHz WLAN main antenna SISO, Bluetooth v Option: WLAN logger v Option: Bluetooth logger v UART RTS to host. NC if not used. v UART CTS from host. NC if not used. v UART TX to host. NC if not used. v UART RX from host. NC if not used. Bluetooth PCM/I2S bus. Data in. NC if not used. Bluetooth PCM/I2S bus. Data out. NC if not used. Bluetooth PCM/I2S bus. Frame sync. NC if not used. Bluetooth PCM/I2S bus. NC if not used. Copyright 20132017, Texas Instruments Incorporated Terminal Configuration and Functions 7 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com DESCRIPTION (3) WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 PIN NAME PIN NO. TYPE/
DIR SHUTDOWN STATE AFTER POWER UP (1) VOLTAGE LEVEL CONNECTIVITY (2) 1801 1805 1831 1835 Table 4-1. Pin Attributes (continued) Ground Pins GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 1 GND 7 GND 9 15 GND 16 GND 17 GND 19 GND 20 GND 23 GND 24 GND 28 GND 29 GND 30 GND 31 GND 33 GND 34 GND 35 GND 37 GND 39 GND 44 GND 45 GND 48 GND 49 GND 54 GND 55 GND 59 GND 61 GND 63 GND 64 GND GND G1 G36 v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v 8 Terminal Configuration and Functions Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com 5 Specifications WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25C for typical values with matched RF antennas, unless otherwise indicated. For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os Application Report. NOTE 5.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VBAT VIO Input voltage to analog pins Input voltage limits (CLK_IN) Input voltage to all other pins Operating ambient temperature Storage temperature, Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings 0.5 0.5 0.5 0.5 20 40 V V V V V C C MAX 4.8 (2) 2.1 2.1 VDD_IO
(VDD_IO + 0.5 V) 70 (3) 85 UNIT only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks
(3) In the WL18xx system, a control mechanism exists to ensure Tj < 125C. When Tj approaches this threshold, the control mechanism manages the transmitter patterns. 5.2 ESD Ratings V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) Charged device model (CDM), per JEDEC specification JESD22-C101 (2) VALUE 1000 250 UNIT V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 5.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted)
(1) VBAT VIO VIH VIL VIH_EN VIL_EN VOH VOL Tr,Tf Tr Tf DC supply range for all modes 1.8-V I/O ring power supply voltage I/O high-level input voltage I/O low-level input voltage Enable inputs high-level input voltage Enable inputs low-level input voltage High-level output voltage Low-level output voltage Input transitions time Tr,Tf from 10% to 90% (digital I/O) (2) Output rise time from 10% to 90%
(digital pins) (2) Output fall time from 10% to 90%
(digital pins) (2)
@ 4 mA
@ 4 mA CL < 25 pF CL < 25 pF MIN 2.9 1.62 0.65 VDD_IO 0 1.365 0 VDD_IO 0.45 0 1 TYP 3.7 1.8 MAX UNIT 4.8 1.95 VDD_IO 0.35 VDD_IO VDD_IO 0.4 VDD_IO 0.45 10 V V V V V V V V ns 5.3 ns 4.9 ns
(1) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V.
(2) Applies to all digital lines except PCM and slow clock lines Copyright 20132017, Texas Instruments Incorporated Specifications 9 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) Maximum power dissipation Ambient operating temperature WLAN operation Bluetooth operation www.ti.com MIN 20 TYP MAX UNIT 70 C 2.8 W 0.2 5.4 External Digital Slow Clock Requirements The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input. TYP 32768 CONDITION MIN Input slow clock frequency Input slow clock accuracy (Initial + temp +
aging) Input transition time (10% to 90%) Frequency input duty cycle Tr, Tf VIH, VIL Input voltage limits Input impedance Input capacitance WLAN, Bluetooth Square wave, DC-
coupled MAX UNIT Hz ppm 250 ns 200 85%
VDD_IO Vpeak 15%
0.65 x VDD_IO 50%
0 1 0.35 x VDD_IO M pF 5 5.5 Thermal Resistance Characteristics for MOC 100-Pin Package THERMAL METRICS (1) JA JB JC
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Junction to free air (3) Junction to board Junction to case (4) 16.6 6.06 5.13
(C/W) (2) Report.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70C is assumed.
(3) According to the JEDEC EIA/JESD 51 document
(4) Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias 10 Specifications Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 5.6 WLAN Performance: 2.4-GHz Receiver Characteristics over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION MIN TYP MAX UNIT Operation frequency range Sensitivity: 20-MHz bandwidth. At < 10% PER limit Maximum input level Adjacent channel rejection: Sensitivity level +3 dB for OFDM; Sensitivity level +6 dB for 11b RF_ANT1 pin 2.4-GHz SISO 1 Mbps DSSS 2 Mbps DSSS 5.5 Mbps CCK 11 Mbps CCK 6 Mbps OFDM 9 Mbps OFDM 12 Mbps OFDM 18 Mbps OFDM 24 Mbps OFDM 36 Mbps OFDM 48 Mbps OFDM 54 Mbps OFDM MCS0 MM 4K MCS1 MM 4K MCS2 MM 4K MCS3 MM 4K MCS4 MM 4K MCS5 MM 4K MCS6 MM 4K MCS7 MM 4K MCS0 MM 4K 40 MHz MCS7 MM 4K 40 MHz MCS0 MM 4K MRC MCS7 MM 4K MRC MCS13 MM 4K MCS14 MM 4K MCS15 MM 4K OFDM CCK DSSS 2 Mbps DSSS 11 Mbps CCK 54 Mbps OFDM 2412 2484 MHz 96.3 93.2 90.6 87.9 92.0 90.4 89.5 87.2 84.1 80.7 76.5 74.9 90.4 87.6 85.9 82.8 79.4 75.2 73.5 72.4 86.7 67.0 92.7 75.2 73.7 72.3 71.0 10.0 6.0 1.0 20.0 10.0 4.0 42.0 38.0 2.0 dBm dBm dB Copyright 20132017, Texas Instruments Incorporated Specifications 11 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 5.7 WLAN Performance: 2.4-GHz Transmitter Power over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. MAX UNIT dBm dBm MHz dB PARAMETER CONDITION (1) Output Power: Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM (2) 1 Mbps DSSS 2 Mbps DSSS 5.5 Mbps CCK 11 Mbps CCK 6 Mbps OFDM 9 Mbps OFDM 12 Mbps OFDM 18 Mbps OFDM 24 Mbps OFDM 36 Mbps OFDM 48 Mbps OFDM 54 Mbps OFDM MCS0 MM MCS1 MM MCS2 MM MCS3 MM MCS4 MM MCS5 MM MCS6 MM MCS7 MM (3) MCS0 MM 40 MHz MCS7 MM 40 MHz MCS12 (WL18x5) MCS13 (WL18x5) MCS14 (WL18x5) MCS15 (WL18x5) MIN TYP RF_ANT1 Pin 2.4-GHz SISO 17.3 17.3 17.3 17.3 17.1 17.1 17.1 17.1 16.2 15.3 14.6 13.8 16.1 16.1 16.1 16.1 15.3 14.6 13.8 12.6 14.8 11.3 RF_ANT1 + RF_ANT2 18.5 17.4 14.5 13.4 Operation frequency range Return loss Reference input impedance RF_ANT1 + RF_ANT2 2412 2484 10.0 50.0
(1) Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80C ambient temperature on MIMO operation
(2) Regulatory constraints limit TI module output power to the following:
Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm. Channels 1, 11 @ OFDM legacy and HT 20-MHz rates: 12 dBm Channels 1, 11 @ HT 40-MHz rates: 10 dBm Channel 7 @ HT 40-MHz lower rates: 10 dBm Channel 5 @ HT 40-MHz upper rates: 10 dBm All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit. All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit. For clarification regarding power limitation, see the WL18xx .INI File Application Report.
(3) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11 2012:
MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value. MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value. 12 Specifications Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback Copyright 20132017, Texas Instruments Incorporated www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 5.8 WLAN Performance: Currents over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER SPECIFICATION TYP (AVG) 25C UNIT Receiver Transmitter Low-power mode (LPM) 2.4-GHz RX SISO20 single chain 2.4 GHz RX search SISO20 2.4-GHz RX search MIMO20 2.4-GHz RX search SISO40 2.4-GHz RX 20 M SISO 11 CCK 2.4-GHz RX 20 M SISO 6 OFDM 2.4-GHz RX 20 M SISO MCS7 2.4-GHz RX 20 M MRC 1 DSSS 2.4-GHz RX 20 M MRC 6 OFDM 2.4-GHz RX 20 M MRC 54 OFDM 2.4-GHz RX 40-MHz MCS7 2.4-GHz TX 20 M SISO 6 OFDM 15.4 dBm 2.4-GHz TX 20 M SISO 11 CCK 15.4 dBm 2.4-GHz TX 20 M SISO 54 OFDM 12.7 dBm 2.4-GHz TX 20 M SISO MCS7 11.2 dBm 2.4-GHz TX 20 M MIMO MCS15 11.2 dBm 2.4-GHz TX 40 M SISO MCS7 8.2 dBm 49 54 74 59 56 61 65 74 81 85 77 285 273 247 238 420 243 mA mA 5.9 Bluetooth Performance: BR, EDR Receiver CharacteristicsIn-Band Signals (1) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION Bluetooth BR, EDR operation frequency range Bluetooth BR, EDR channel spacing Bluetooth BR, EDR input impedance Bluetooth BR, EDR sensitivity (2) Dirty TX on Bluetooth EDR BER floor at sensitivity + 10 dB Dirty TX off (for 1,600,000 bits) Bluetooth BR, EDR maximum usable input power BR, BER = 0.1%
EDR2, BER = 0.01%
EDR3, BER = 0.01%
EDR2 EDR3 BR, BER = 0.1%
EDR2, BER = 0.1%
EDR3, BER = 0.1%
Bluetooth BR intermodulation Level of interferers for n = 3, 4, and 5 MIN 2402 1e-6 1e-6 5.0 15.0 15.0 36.0 TYP 1 50 92.2 91.7 84.7 30.0 MAX 2480 UNIT MHz MHz dBm dBm dBm
(1) All RF and performance numbers are aligned to the module pin.
(2) Sensitivity degradation up to 3 dB may occur due to fast clock harmonics with dirty TX on. Copyright 20132017, Texas Instruments Incorporated Specifications 13 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com Bluetooth Performance: BR, EDR Receiver CharacteristicsIn-Band Signals(1) (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER Bluetooth BR, EDR C/I performance Numbers show wanted signal-to-interfering-signal ratio. Smaller numbers indicate better C/I performances (Image frequency = 1 MHz) CONDITION MIN TYP BR, co-channel EDR, co-channel BR, adjacent 1 MHz EDR, adjacent 1 MHz,
(image) BR, adjacent +2 MHz EDR, adjacent +2 MHz BR, adjacent 2 MHz EDR, adjacent 2 MHz BR, adjacent 3 MHz EDR, adjacent 3 MHz EDR2 EDR3 EDR2 EDR3 EDR2 EDR3 EDR2 EDR3 EDR2 EDR3 UNIT dB MAX 10 12 20 3.0 3.0 2.0 33.0 33.0 28.0 20.0 20.0 13.0 42.0 42.0 36.0 Bluetooth BR, EDR RF return loss 10.0 dB 5.10 Bluetooth Performance: Transmitter, BR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN BR RF output power (2) BR gain control range BR power control step BR adjacent channel power |M-N| = 2 BR adjacent channel power |M-N| > 2 VBAT 3 V (3) VBAT < 3 V (3) TYP 11.7 7.2 30.0 5.0 43.0 48.0 MAX UNIT dBm dB dB dBm dBm
(1) All RF and performance numbers are aligned to the module pin.
(2) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.
(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. 5.11 Bluetooth Performance: Transmitter, EDR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN VBAT 3 V (3) VBAT < 3 V (3) EDR output power (2) EDR gain control range EDR power control step EDR adjacent channel power |M-N| = 1 EDR adjacent channel power |M-N| = 2 EDR adjacent channel power |M-N| > 2 TYP 7.2 5.2 30 5 36 30 42 MAX UNIT dBm dB dB dBc dBm dBm
(1) All RF and performance numbers are aligned to the module pin.
(2) Values reflect default maximum power. Maximum power can be changed using a VS command.
(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. 14 Specifications Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 5.12 Bluetooth Performance: Modulation, BR (1) over operating free-air temperature range (unless otherwise noted) CHARACTERISTICS CONDITION (2) Mod data = 4 1s, 4 0s:
111100001111... Mod data =
1010101... BR 20-dB bandwidth BR modulation characteristics BR carrier frequency drift BR drift rate BR initial carrier frequency tolerance (3) f1avg f2max limit for at least 99.9% of all f2max f2avg, f1avg One-slot packet Three- and five-slot packet lfk+5 fkl , k =
0 . max f0fTX
(1) All RF and performance numbers are aligned to the module pin.
(2) Performance values reflect maximum power.
(3) Numbers include XTAL frequency drift over temperature and aging. 5.13 Bluetooth Performance: Modulation, EDR (1) over operating free-air temperature range (unless otherwise noted) MIN 145 TYP 925 160 MAX 995 170 120 130 88%
25 35 UNIT kHz kHz kHz kHz kHz 85%
25 35 75 15 kHz/50 s 75 kHz PARAMETER (2) EDR carrier frequency stability EDR initial carrier frequency tolerance (3) EDR RMS DEVM EDR 99% DEVM EDR peak DEVM CONDITION MIN 5 75 EDR2 EDR3 EDR2 EDR3 EDR2 EDR3
(1) All RF and performance numbers are aligned to the module pin.
(2) Performance values reflect maximum power.
(3) Numbers include XTAL frequency drift over temperature and aging. TYP 4%
4%
9%
9%
UNIT kHz kHz MAX 5 75 15%
10%
30%
20%
25%
18%
5.14 Bluetooth low energy Performance: Receiver Characteristics In-Band Signals (1) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION (2) Bluetooth low energy operation frequency range Bluetooth low energy channel spacing Bluetooth low energy input impedance Bluetooth low energy sensitivity (3) Dirty TX on Bluetooth low energy maximum usable input power Bluetooth low energy intermodulation characteristics Level of interferers. For n = 3, 4, 5 MIN 2402 5 36 TYP 2 50 92.2 30 MAX 2480 UNIT MHz MHz dBm dBm dBm
(1) All RF and performance numbers are aligned to the module pin.
(2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth low energy test specification.
(3) Sensitivity degradation of up to 3 dB can occur due to fast clock harmonics. Copyright 20132017, Texas Instruments Incorporated Specifications 15 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com Bluetooth low energy Performance: Receiver Characteristics In-Band Signals(1) (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER Bluetooth low energy C/I performance. Note: Numbers show wanted signal-to-
interfering-signal ratio. Smaller numbers indicate better C/I performance. Image = 1 MHz CONDITION (2) low energy, co-channel low energy, adjacent 1 MHz low energy, adjacent +2 MHz low energy, adjacent 2 MHz low energy, adjacent
|3|MHz MIN TYP 5.15 Bluetooth low energy Performance: Transmitter Characteristics (1) over operating free-air temperature range (unless otherwise noted) PARAMETER Bluetooth low energy RF output power (2) VBAT 3 V (3) VBAT < 3 V (3) MIN Bluetooth low energy adjacent channel power |M-N| = 2 Bluetooth low energy adjacent channel power |M-N| > 2
(1) All RF and performance numbers are aligned to the module pin.
(2) Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement.
(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. TYP 7.0 7.0 51.0 54.0 5.16 Bluetooth low energy Performance: Modulation Characteristics (1) over operating free-air temperature range (unless otherwise noted) UNIT dB MAX 12 0 38 15 40 MAX UNIT dBm dBm dBm Mod data = four 1s and four 0s:
111100001111... Mod data = 1010101... CHARACTERISTICS CONDITION (2) Bluetooth low energy modulation characteristics Bluetooth low energy carrier frequency drift Bluetooth low energy drift rate Bluetooth low energy initial carrier frequency tolerance (3) f1avg f2max limit for at least 99.9% of all f2max f2avg, f1avg lf0 fnl , n = 2,3 . K lf1 f0l and lfn fn-5l , n = 6,7. K fn fTX MIN 240 195 85%
25 75 TYP 250 215 90%
MAX UNIT 260 25 kHz kHz 15 kHz/50 s 75 kHz
(1) All RF and performance numbers are aligned to the module pin.
(2) Performance values reflect maximum power.
(3) Numbers include XTAL frequency drift over temperature and aging. 5.17 Bluetooth BR and EDR Dynamic Currents Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm. USE CASE (1) (2) BR voice HV3 + sniff EDR voice 2-EV3 no retransmission + sniff Sniff 1 attempt 1.28 s EDR A2DP EDR2 (master). SBC high quality 345 kbps EDR A2DP EDR2 (master). MP3 high quality 192 kbps Full throughput ACL RX: RX-2DH5 (3) (4) Full throughput BR ACL TX: TX-DH5 (4)
(1) The role of Bluetooth in all scenarios except A2DP is slave.
(2) CL1P5 PA is connected to VBAT, 3.7 V.
(3) ACL RX has the same current in all modulations.
(4) Full throughput assumes data transfer in one direction. TYP 11.6 5.9 178.0 10.4 7.5 18.0 50.0 UNIT mA mA A mA mA mA mA 16 Specifications Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Bluetooth BR and EDR Dynamic Currents (continued) Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm. USE CASE (1) (2) Full throughput EDR ACL TX: TX-2DH5 (4) Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively) Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively) 5.18 Bluetooth low energy Currents All current measured at output power of 7.0 dBm USE CASE (1) Advertising, not connectable (2) Advertising, discoverable (2) Scanning (3) Connected, master role, 1.28-s connect interval (4) Connected, slave role, 1.28-s connect interval (4)
(1) CL1p% PA is connected to VBAT, 3.7 V.
(2) Advertising in all three channels, 1.28-s advertising interval, 15 bytes advertise data
(3) Listening to a single frequency per window, 1.28-s scan interval, 11.25-ms scan window
(4) Zero slave connection latency, empty TX and RX LL packets 5.19 Timing and Switching Characteristics 5.19.1 Power Management 5.19.1.1 Block Diagram Internal DC-DCs TYP 33.0 253.0 332.0 TYP 131 143 266 124 132 UNIT mA A A UNIT A A A A A The device incorporates three internal DC-DCs (switched-mode power supplies) to provide efficient internal supplies, derived from VBAT. VIO VBAT VIO_IN VBAT_IN_MAIN_DC2DC VBAT_IN_PA_DC2DC MAIN_DC2DC_OUT LDO_IN_DIG WL18xx Top Level VBAT VBAT Main DC2DC SW FB 1.8 V PA DC2DC SW FB PA_DC2DC_OUT FB_IN_PA_DC2DC 2.2 2.7 V DIG_DC2DC_OUT SW VDD_DIG FB Digital DC2DC 1 V Figure 5-1. Internal DC-DCs 5.19.2 Power-Up and Shut-Down States The correct power-up and shut-down sequences must be followed to avoid damage to the device. While VBAT or VIO or both are deasserted, no signals should be driven to the device. The only exception is the slow clock that is a fail-safe I/O. While VBAT, VIO, and slow clock are fed to the device, but WL_EN is deasserted (low), the device is in SHUTDOWN state. In SHUTDOWN state all functional blocks, internal DC-DCs, clocks, and LDOs are disabled. Copyright 20132017, Texas Instruments Incorporated Specifications 17 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock start to ramp and stabilize. Stable slow clock, VIO, and VBAT are prerequisites to the assertion of one of the enable signals. To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device
(VBAT, VIO, and slow clock) are still stable and available. The supplies to the chip (VBAT and VIO) can be deasserted only after both enable signals are deasserted (low). Figure 5-2 shows the general power scheme for the module, including the power-down sequence. VBAT VIO EXT_32K 5 1
>10 s 2 WLEN NOTE: 1. Either VBAT or VIO can come up first. 3
> 60 s 5
>10 s 4 2. VBAT and VIO supplies and slow clock (SCLK), must be stable prior to EN being asserted and at all times when the EN is active. 3. At least 60 s is required between two successive device enables. The device is assumed to be in shutdown state during that period, meaning all enables to the device are LOW for that minimum duration. 4. EN must be deasserted at least 10 s before VBAT or VIO supply can be lowered (order of supply turn off after EN shutdown is immaterial). 5. EXT_32K - Fail safe I/O Figure 5-2. Power-Up System 5.19.3 Chip Top-level Power-Up Sequence Figure 5-3 shows the top-level power-up sequence for the chip. VBAT / VIO input EXT_32K input WL_EN input Main 1V8 DC2DC DIG DC2DC SRAM LDO Top RESETZ TCXO_CLK_REQ output 4.5 ms delay Internal power stable = 5 ms Figure 5-3. Chip Top-Level Power-Up Sequence 18 Specifications Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 5.19.4 WLAN Power-Up Sequence Figure 5-4 shows the WLAN power-up sequence. VBAT / VIO input SLOWCLK input WL_EN input TCXO_CLK_REQ output TXCO_LDO output TCXO input SDIO_CLK input WLAN_IRQ output NLCP WLAN_IRQ output MCP Indicates completion of firmware download and internal initialization Wake-up time Indicates completion of firmware download and internal initialization Wake-up time Host configures device to reverse WLAN_IRQ polarity NLCP: trigger at rising edge MCP: trigger at low level Figure 5-4. WLAN Power-Up Sequence 5.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence Figure 5-5 shows the Bluetooth-Bluetooth low energy power-up sequence. Completion of Bluetooth firmware initialztion. Initialization time Figure 5-5. Bluetooth-Bluetooth low energy Power-Up Sequence Copyright 20132017, Texas Instruments Incorporated Specifications 19 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 5.19.6 WLAN SDIO Transport Layer The SDIO is the host interface for WLAN. The interface between the host and the WL18xx module uses an SDIO interface and supports a maximum clock rate of 50 MHz. The device SDIO also supports the following features of the SDIO V3 specification:
4-bit data bus Synchronous and asynchronous in-band interrupt Default and high-speed (HS, 50 MHz) timing Sleep and wake commands 5.19.6.1 SDIO Timing Specifications Figure 5-6 and Figure 5-7 show the SDIO switching characteristics over recommended operating conditions and with the default rate for input and output. VDD Clock Input VSS VDD Data Input VSS VIH tTHL Not Valid tWL tWH VIH VIH VIL VIL tISU VIH VIL tTLH tIH Valid VIH VIL Not Valid Figure 5-6. SDIO Default Input Timing VDD Clock Input VSS VDD Data Output VSS tTHL VIH Not Valid tWL tWH VIL tODLY(max) VIH tTLH Valid VIL VOH VOL VIH tODLY(min) Not Valid VOH VOL Table 5-1 lists the SDIO default timing characteristics. Figure 5-7. SDIO Default Output Timing Table 5-1. SDIO Default Timing Characteristics (1) Clock frequency, CLK (2) Low, high duty cycle (2) Rise time, CLK (2) Fall time, CLK (2) Setup time, input valid before CLK (2) Hold time, input valid after CLK (2) Delay time, CLK to output valid (2) Capacitive load on outputs (2) fclock DC tTLH tTHL tISU tIH tODLY Cl
(1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit.
(2) Parameter values reflect maximum clock frequency. 3.0 2.0 7.0 MIN 0.0 40.0%
MAX 26.0 60.0%
10.0 10.0 10.0 15.0 UNIT MHz ns ns ns ns ns pF 20 Specifications Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 5.19.6.2 SDIO Switching Characteristics High Rate Figure 5-8 and Figure 5-9 show the parameters for maximum clock frequency. VDD Clock Input VSS VDD Data Input VSS VIH tTHL Not Valid tWL VIL VIL tWH VIH 50% VDD tTLH VIH tISU tIH VIH VIL Valid VIH VIL Not Valid Figure 5-8. SDIO HS Input Timing 50% VDD tTHL VIH VIL tWL VIL tWH VIH 50% VDD tTLH VIH tODLY(max) Not Valid tOH(min) Not Valid VOH VOL Valid VOH VOL VDD Clock Input VSS VDD Data Output VSS Table 5-2 lists the SDIO high-rate timing characteristics. Figure 5-9. SDIO HS Output Timing Table 5-2. SDIO HS Timing Characteristics fclock DC tTLH tTHL tISU tIH tODLY Cl Clock frequency, CLK Low, high duty cycle Rise time, CLK Fall time, CLK Setup time, input valid before CLK Hold time, input valid after CLK Delay time, CLK to output valid Capacitive load on outputs MIN 0.0 40.0%
3.0 2.0 7.0 MAX 52.0 60.0%
3.0 3.0 10.0 10.0 UNIT MHz ns ns ns ns ns pF Copyright 20132017, Texas Instruments Incorporated Specifications 21 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 5.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN) The device includes a UART module dedicated to the Bluetooth shared-transport, host controller interface
(HCI) transport layer. The HCI transports commands, events, and ACL between the Bluetooth device and its host using HCI data packets ack as a shared transport for all functional blocks except WLAN. Table 5-3 lists the transport mechanism for WLAN and bluetooth audio. Table 5-3. Transport Mechanism WLAN WLAN HS SDIO SHARED HCI FOR ALL FUNCTIONAL BLOCKS EXCEPT WLAN Over UART BLUETOOTH VOICE-AUDIO Bluetooth PCM The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies up to a maximum of 4 Mbps. After power up, the baud rate is set for 115.2 Kbps, regardless of the fast-clock frequency. The baud rate can then be changed using a VS command. The device responds with a Command Complete Event (still at 115.2 Kbps), after which the baud rate change occurs. HCI hardware includes the following features:
Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions Receiver-transmitter underflow detection CTS, RTS hardware flow control 4 wire (H4) Table 5-4 lists the UART default settings. Table 5-4. UART Default Setting PARAMETER Bit rate Data length Stop-bit Parity VALUE 115.2 Kbps 8 bits 1 None 5.19.7.1 UART 4-Wire Interface H4 The interface includes four signals:
TXD RXD CTS RTS Flow control between the host and the device is byte-wise by hardware. When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device finishes transmitting the byte and stops the transmission. 22 Specifications Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Figure 5-10 shows the UART timing. Table 5-5 lists the UART timing characteristics. Figure 5-10. UART Timing Diagram Table 5-5. UART Timing Characteristics t3 t4 t6 t1 t2 PARAMETER Baud rate Baud rate accuracy per byte Baud rate accuracy per bit CTS low to TX_DATA on CTS high to TX_DATA off CTS high pulse width RTS low to RX_DATA on RTS high to RX_DATA off CONDITION Receive-transmit Receive-transmit Hardware flow control MIN 37.5 2.5%
12.5%
0.0 1.0 0.0 TYP 2.0 2.0 MAX 4364 1.5%
12.5%
1.0 UNIT Kbps s Byte Bit s Interrupt set to 1/4 FIFO 16.0 Bytes Figure 5-11 shows the UART data frame. tb TX STR STR-Start-bit; D0..Dn - Data bits (LSB first);
D0 D2 D1 Dn PAR STP PAR - Parity bit (if used) ; STP - Stop-bit Figure 5-11. UART Data Frame Copyright 20132017, Texas Instruments Incorporated Specifications 23 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 5.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications Figure 5-12 shows the Bluetooth codec-PCM (audio) timing diagram. tCLK tW tW tis tih top Figure 5-12. Bluetooth Codec-PCM (Audio) Master Timing Diagram Table 5-6 lists the Bluetooth codec-PCM master timing characteristics. Table 5-6. Bluetooth Codec-PCM Master Timing Characteristics PARAMETER Tclk Tw tis tih top top Cl Cycle time High or low pulse width AUD_IN setup time AUD_IN hold time AUD_OUT propagation time FSYNC_OUT propagation time Capacitive loading on outputs MIN 162.76 (6.144 MHz) 35% of Tclk min 10.6 0 0 0 MAX 15625 (64 kHz) UNIT ns 15 15 40 pF Table 5-7 lists the Bluetooth codec-PCM slave timing characteristics. Table 5-7. Bluetooth Codec-PCM Slave Timing Characteristics PARAMETER Tclk Tw tis tih tis tih top Cl Cycle time High or low pulse width AUD_IN setup time AUD_IN hold time AUD_FSYNC setup time AUD_FSYNC hold time AUD_OUT propagation time Capacitive loading on outputs MIN 81.38 (12.288 MHz) 35% of Tclk min 5 0 5 0 0 MAX UNIT ns 19 40 pF 24 Specifications Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com 6 Detailed Description WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology. Figure 6-1 shows a high-level view of the WL1835MOD variant. 32 kHz XTAL VBAT Antenna 1 Wi-Fi and Bluetooth Bluetooth Stack and Profiles UART Driver WPA Supplicant and Wi-Fi Driver SDIO Driver WL1835MOD Antenna 2 Wi-Fi
(Optional) VIO 32 kHz Enable Wi-Fi SDIO Bluetooth UART Figure 6-1. WL1835MOD High-Level System Diagram Table 6-1, Table 6-2, and Table 6-3 list performance parameters along with shutdown and sleep currents. Table 6-1. WLAN Performance Parameters WLAN (1) CONDITIONS SPECIFICATION (TYP) Maximum TX power Minimum sensitivity Sleep current Connected IDLE RX search RX current (SISO20) TX current (SISO20) Maximum peak current consumption during calibration (2) 1-Mbps DSSS 1-Mbps DSSS Leakage, firmware retained No traffic IDLE connect Search (SISO20) MCS7, 2.4 GHz MCS7, 2.4 GHz, +11.2 dBm 17.3 96.3 160 750 54 65 238 850
(1) System design power scheme must comply with both peak and average TX bursts.
(2) Peak current VBAT can hit 850 mA during device calibration. At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4-GHz band. Once a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned. The maximum VBAT value is based on peak calibration consumption with a 30% margin. Table 6-2. Bluetooth Performance Parameters BLUETOOTH CONDITIONS SPECIFICATION (TYP) Maximum TX power Minimum sensitivity Sniff Page or inquiry A2DP GFSK GFSK 1 attempt, 1.28 s (+4 dBm) 1.28-s interrupt, 11.25-ms scan window
(+4 dBm) MP3 high quality 192 kbps (+4 dBm) 11.7 92.2 178 253 7.5 UNIT dBm dBm A A mA mA mA mA UNIT dBm dBm A A mA Copyright 20132017, Texas Instruments Incorporated Detailed Description 25 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com Table 6-3. Shutdown and Sleep Currents PARAMETER POWER SUPPLY CURRENT Shutdown mode All functions shut down WLAN sleep mode Bluetooth sleep mode 6.1 WLAN Features VBAT VIO VBAT VIO VBAT VIO TYP 10 2 160 60 110 60 UNIT A A A The device supports the following WLAN features:
Baseband processor: IEEE Std 802.11b/g and IEEE Std 802.11n data rates with 20- or Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution 40-MHz SISO and 20-MHz MIMO Fully calibrated system (production calibration not required) Medium access controller (MAC) Embedded ARM central processing unit (CPU) Hardware-based encryption-decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys Requirements for Wi-Fi-protected access (WPA and WPA2.0) and IEEE Std 802.11i (includes hardware-accelerated Advanced Encryption Standard [AES]) New advanced coexistence scheme with Bluetooth and Bluetooth low energy wireless technology 2.4-GHz radio Internal LNA and PA IEEE Std 802.11b, 802.11g, and 802.11n 4-bit SDIO host interface, including high speed (HS) and V3 modes 6.2 Bluetooth Features The device supports the following Bluetooth features:
Bluetooth 4.2 secure connection as well as CSA2 Concurrent operation and built-in coexisting and prioritization handling of Bluetooth and Bluetooth low energy wireless technology, audio processing, and WLAN Dedicated audio processor supporting on-chip SBC encoding + A2DP Assisted A2DP (A3DP): SBC encoding implemented internally Assisted WB-speech (AWBS): modified SBC codec implemented internally 26 Detailed Description Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com 6.3 Bluetooth low energy Features WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 The device supports the following Bluetooth low energy features:
Bluetooth 4.2 low energy dual-mode standard All roles and role combinations, mandatory as well as optional Up to 10 low energy connections Independent low energy buffering allowing many multiple connections with no affect on BR-EDR performance 6.4 Device Certification The WL18MODGB modules from TI (test grades 01, 05, 31, and 35) are certified for FCC, IC, ETSI/CE, and Japan MIC. Moreover, the module is also Wi-Fi certified and has the ability to request a certificate transfer for Wi-Fi alliance members. TI customers that build products based on the WL18MODGI device from TI can save on testing costs and time per product family. Table 6-4 shows the certification list for the WL18MODGI module. Table 6-4. Device Certification Regulatory Body FCC (USA) ISED (Canada) ETSI/CE (Europe) MIC (Japan) ID (If Applicable) Z64-WL18SBMOD 451I-WL18SBMOD Specification Part 15C + MPE FCC RF exposure RSS-102 (MPE) and RSS-247 (Wi-Fi, Bluetooth) EN300328 v2.1.1 (2.4-GHz Wi-Fi, Bluetooth) EN301893 v2.1.1 (5-GHz Wi-Fi) EN62311:2008 (MPE) EN301489-1 v2.1.1 (general EMC) EN301489-17 v3.1.1 (EMC) EN60950-
1:2006/A11:2009/A1:2010/A12:2011/A2:2013 Article 49-20 of ORRE 201-135370 6.4.1 FCC Certification and Statement The WL18MODGB modules from TI are certified for the FCC as a single-modular transmitter. The modules are FCC-certified radio modules that carries a modular grant. Users are cautioned that changes or modifications not expressively approved by the party responsible for compliance could void the authority of the user to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
This device may not cause harmful interference. This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement:
CAUTION This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be colocated or operating with any other antenna or transmitter. Copyright 20132017, Texas Instruments Incorporated Detailed Description 27 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 6.4.2 Innovation, Science, and Economic Development Canada (ISED) The WL18MODGB modules from TI are certified for IC as a single-modular transmitter. The WL18MODGB modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada licence-exempt RSS standards. Operation is subject to the following two conditions:
This device may not cause interference. This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
L'appareil ne doit pas produire de brouillage. L'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. IC RF Radiation Exposure Statement:
CAUTION To comply with IC RF exposure requirements, this device and its antenna must not be colocated or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformit RF canadienne l'exposition, cet appareil et son antenne ne doivent pas tre co-localiss ou fonctionnant en conjonction avec une autre antenne or transmitter. 6.4.3 ETSI/CE The WL18MODGB modules conform to the EU Radio Equipment Directive. For further detains, see the full text of the EU Declaration of Conformity for the WL18MODGBWL18MODGB (test grade 01), WL18MODGB (test grade 05), WL18MODGB (test grade 31), and WL18MODGI (test grade 35) devices. 6.4.4 MIC Certification The WL18MODGB modules from TI are MIC certified against article 49-20 and the relevant articles of the Ordinance Regulating Radio Equipment. Operation is subject to the following condition:
The host system does not contain a wireless wide area network (WWAN) device. 28 Detailed Description Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com 6.5 Module Markings WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Figure 6-2 shows the markings for the TI WiLink 8 module. Model: WL18 MODGB Test Grade:&&
FCC ID: Z64-WL18SBMOD IC: 451I-WL18SBMOD R 201-135370 LTC: XXXXXXX Table 6-5 describes the WiLink 8 module markings. Figure 6-2. WiLink 8 Module Markings Table 6-5. Description of WiLink 8 Module Markings MARKING WL18 MODGB
&&
Z64-WL18SBMOD 451I-WL18SBMOD LTC (lot trace code): XXXXXXX 201-135370 DESCRIPTION Model Test grade (for more information, see Section 6.6) FCC ID: single modular FCC grant ID IC: single modular IC grant ID LTC: Reserved for TI Use R: single modular TELEC grant ID TELEC compliance mark CE CE compliance mark 6.6 Test Grades To minimize delivery time, TI may ship the device ordered or an equivalent device currently available that contains at least the functions of the part ordered. From all aspects, this device will behave exactly the same as the part ordered. For example, if a customer orders device WL1801MOD, the part shipped can be marked with a test grade of 35, 05 (see Table 6-6). MARK 1 0&
3&
MARK 2
&1
&5 Table 6-6. Test Grade Markings WLAN Tested Tested WLAN 2.4 GHz Tested Tested BLUETOOTH Tested MIMO 2.4 GHz Tested Copyright 20132017, Texas Instruments Incorporated Detailed Description 29 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 6.7 End Product Labeling These modules are designed to comply with the FCC single modular FCC grant, Z64- WL18SBMOD. The host system using this module must display a visible label indicating the following text:
Contains FCC ID: Z64-WL18SBMOD These modules are designed to comply with the IC single modular FCC grant, IC: 451I-WL18SBMOD. The host system using this module must display a visible label indicating the following text:
Contains IC: 451I-WL18SBMOD This module is designed to comply with the JP statement, 201-135370. The host system using this module must display a visible label indicating the following text:
Contains transmitter module with certificate number: 201-135370 6.8 Manual Information to the End User The OEM integrator must be aware of not providing information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user's manual must include all required regulatory information and warnings as shown in this manual. 30 Detailed Description Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback Copyright 20132017, Texas Instruments Incorporated www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 7 Applications, Implementation, and Layout Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TIs customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. NOTE 7.1 Application Information 7.1.1 Typical Application WL1835MODGB Reference Design Figure 7-1 shows the TI WL1835MODGB reference design. Copyright 20132017, Texas Instruments Incorporated Applications, Implementation, and Layout 31 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com BT_EN WLAN_EN For Debug only VBAT_IN TP1 TP2 VIO_IN C1 1uF 0402 C2 10uF 0.1uF 0603 0402 C3 WLAN/BT Enable Control. Connect to Host GPIO. SLOW_CLK R6 0R 0402 3 2 BT_HCI_RTS_1V8 BT_HCI_CTS_1V8 BT_HCI_TX_1V8 BT_HCI_RX_1V8 Connect to Host HCI Interface. BT_AUD_IN BT_AUD_OUT BT_AUD_FSYNC BT_AUD_CLK Connect to Host BT PCM Bus. TP8 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 GND BT_HCI_RTS BT_HCI_CTS BT_HCI_TX BT_HCI_RX GND GND BT_AUD_IN BT_AUD_OUT BT_AUD_FSYNC GND BT_AUD_CLK GND RESERVED3 GND GND G19 GND G20 GND G21 GND G22 GND G23 G24 GND G25 GND G26 GND G27 GND G28 GND G29 GND G30 GND G31 GND G32 GND G33 GND G34 GND G35 GND G36 GND GND 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 4 0 4 9 3 8 3 7 3 6 3 5 3 4 3 3 3 D N G T A B V T A B V D N G D N G G B D _ T R A U _ T B G B D _ T R A U _ L W C O S _ N E _ T B C O S _ N E _ N A L W D N G O V I D N G D N G D N G D N G K 2 3 _ T X E U1 WL1835MODGB E-13.4X13.3-N100_0.75-TOP D M C _ O D S _ L W I I K L C _ O D S _ L W D N G I 0 D _ O D S _ L W I 1 D _ O D S _ L W I 2 D _ O D S _ L W I 3 D _ O D S _ L W I Q R _ N A L W D N G D N G D N G 1 1 O P G I I 9 O P G 0 1 O P G I 2 1 O P G I D N G 1 2 3 4 5 6 7 8 9 0 1 1 1 2 1 3 1 4 1 5 1 6 1 TP10TP11TP12TP13 RF_ANT1 GND GND GND GND GPIO_1 GPIO_2 GPIO_4 GND GND RESERVED2 RESERVED1 GND GND RF_ANT2 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 GND G1 GND G2 GND G3 GND G4 GND G5 GND G6 GND G7 GND G8 GND G9 GND G10 GND G11 GND G12 GND G13 GND G14 GND G15 GND G16 GND G17 GND G18 GND VIO_IN R20 NU RES1005 VIO_IN OSC1 1V8 / 32.768kHz OSC-3.2X2.5 OUT EN 1 GND VCC 4 C4 0.1uF 0402 C5 10pF 0402 C7 NU_10pF 0402 L1 1.1nH 0402 ANT1- WL_2.4_IO2/BT C13 8pF 0402 ANT1 ANT016008LCD2442MA1 ANT-N3-1.6X0.8MM-A A FEED 2.4G 1 B 5G 2 B C9 2.2pF NU_0.3pF 0402 0402 C10 The value of antenna matching components is for WL1835MODCOM8B ANT2- WL_2.4_IO1 C14 4pF 0402 A ANT2 ANT016008LCD2442MA1 ANT-N3-1.6X0.8MM-B FEED 2.4G 1 B C11 1.2pF 0402 5G 2 B C12 NU 0402 L2 1.5nH 0402 The value of antenna matching components is for WL1835MODCOM8B J5 U.FL-R-SMT(10) U.FL For Debug only C6 10pF 0402 C8 NU_10pF 0402 2 1 3 2 1 3 J6 U.FL-R-SMT(10) U.FL For Debug only WL_RS232_TX_1V8 WL_RS232_RX_1V8 TP3 TP4 For Debug only TP5 TP6 TP7 For Debug only WL_IRQ_1V8 WL_SDIO_D3_1V8 WL_SDIO_D2_1V8 WL_SDIO_D1_1V8 WL_SDIO_D0_1V8 WL_SDIO_CLK_1V8 WL_SDIO_CMD_1V8 Figure 7-1. TI Module Reference Schematics Connect to Host SDIO Interface. www.ti.com 32 Applications, Implementation, and Layout WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Submit Documentation Feedback Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Table 7-1 lists the bill materials (BOM). Table 7-1. BOM ITEM DESCRIPTION PART NUMBER PACKAGE WL1835MODGI 7XZ3200005 13.4 x 13.3 x 2.0 mm 3.2 x 2.5 x 1.0 mm REF. U1 OSC1 QTY MFR TI TXC 1 1 ANT016008LCD2442MA1 1.6 mm x 0.8 mm ANT1, ANT2 1 2 3 TI WL1835 Wi-Fi / Bluetooth module XOSC 3225 / 32.768 kHz / 1.8 V /
50 ppm Antenna / chip / 2.4 and 5 GHz / peak gain > 5 dBi 6 Mini RF header receptacle 7 8 9 Inductor 0402 / 1.1 nH / 0.05 nH SMD Inductor 0402 / 1.5 nH / 0.05 nH SMD Capacitor 0402 / 1.2 pF / 50 V / C0G /
0.1 pF U.FL-R-SMT-1 (10) LQP15MN1N1W02 LQP15MN1N5W02 GJM1555C1H1R2BB01 10 Capacitor 0402 / 2.2 pF / 50 V / C0G /
GJM1555C1H1R2BB01 0.1 pF 11 Capacitor 0402 / 4 pF / 50 V / C0G /
GJM1555C1H4R0BB01 0.1 pF 12 Capacitor 0402 / 8 pF / 50 V / C0G /
GJM1555C1H8R0BB01 0.1 pF 13 Capacitor 0402 / 10 pF / 50 V / NPO /
0402N100J500LT 5%
14 Capacitor 0402 / 0.1 F / 10 V / X7R /
0402B104K100CT 10%
15 Capacitor 0402 / 1 F / 6.3 V / X5R /
GRM155R60J105KE19D 10% / HF 16 Capacitor 0603 / 10 F / 6.3 V / X5R /
C1608X5R0J106M 20%
7.1.2 Design Recommendations 3.0 x 2.6 x 1.25 mm J5, J6 0402 0402 0402 0402 0402 0402 0402 0402 0402 0603 L1 L2 C11 C9 C14 C13 C5, C6 C3, C4 C1 C2 2 2 1 1 1 1 1 1 2 1 1 1 TDK Hirose Murata Murata Murata Murata Murata Walsin Walsin Walsin Murata TDK This section describes the layout recommendations for the WL1835 module, RF trace, and antenna. Table 7-2 summarizes the layout recommendations. ITEM Thermal Table 7-2. Layout Recommendations Summary DESCRIPTION 1 2 3 4 5 6 The proximity of ground vias must be close to the pad. Signal traces must not be run underneath the module on the layer where the module is mounted. Have a complete ground pour in layer 2 for thermal dissipation. Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible. Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer. RF Trace and Antenna Routing 7 8 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. The RF trace bends must be gradual with an approximate maximum bend of 45 with trace mitered. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. 9 10 RF traces must have constant impedance (microstrip transmission line). 11 For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. There must be no traces or ground under the antenna section. 12 13 RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. Copyright 20132017, Texas Instruments Incorporated Applications, Implementation, and Layout 33 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com ITEM Supply and Interface Table 7-2. Layout Recommendations Summary (continued) DESCRIPTION The power trace for VBAT must be at least 40-mil wide. The 1.8-V trace must be at least 18-mil wide. 14 15 16 Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. 17 18 If possible, shield VBAT traces with ground above, below, and beside the traces. SDIO signals traces (CLK, CMD, D0, D1, D2, and D3) must be routed in parallel to each other and as short as possible (less than 12 cm). In addition, every trace length must be the same as the others. There should be enough space between traces greater than 1.5 times the trace width or ground to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses. SDIO and digital clock signals are a source of noise. Keep the traces of these signals as short as possible. If possible, maintain a clearance around them. 19 7.1.3 RF Trace and Antenna Layout Recommendations Figure 7-2 shows the location of the antenna on the WL1835MODCOM8B board as well as the RF trace routing from the WL1835 module (TI reference design). The Pulse multilayer antennas are mounted on the board with a specific layout and matching circuit for the radiation test conducted in FCC, CE, and IC certifications. NOTE At least an equivalent 1dB loss (in the form of trace, cable or 1-dB pi-pad loss) is required between the output of the WL18MODGB module and the antenna to be compliant with the current Z64-WL18SBMOD and 451I-WL18SBMOD module certification. Antennas are orthogonal to each other. Antennas distance is Higher than half wavelength. 76.00mm No sharp corners. Constant 50 OHM control impedance RF Trace. Antenna placement on the edge of the board. Figure 7-2. Location of Antenna and RF Trace Routing on the WL1835MODCOM8B Board Follow these RF trace routing recommendations:
RF traces must have 50- impedance. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. 34 Applications, Implementation, and Layout Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 7.1.4 Module Layout Recommendations Figure 7-3 shows layer 1 and layer 2 of the TI module layout. Layer 2 (Solid GND) Layer 1 Figure 7-3. TI Module Layout Follow these module layout recommendations:
Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation. Do not run signal traces underneath the module on a layer where the module is mounted. Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting. Run the host interfaces with ground on the adjacent layer to improve the return path. TI recommends routing the signals as short as possible to the host. 7.1.5 Thermal Board Recommendations The TI module uses vias for layers 1 through 6 with full copper filling, providing heat flow all the way to the module ground pads. TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Figure 7-4). Copyright 20132017, Texas Instruments Incorporated Applications, Implementation, and Layout 35 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com Module COM8 Board Figure 7-4. Block of Ground Pads on Bottom Side of Package Figure 7-5 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI module central or main ground pads. Figure 7-5. Via Array Patterns 36 Applications, Implementation, and Layout Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 7.1.6 Baking and SMT Recommendations 7.1.6.1 Baking Recommendations Follow these baking guidelines for the WiLink 8 module:
Follow MSL level 3 to perform the baking process. After the bag is open, devices subjected to reflow solder or other high temperature processes must be mounted within 168 hours of factory conditions (< 30C/60% RH) or stored at <10% RH. If the Humidity Indicator Card reads >10%, devices require baking before they are mounted. If baking is required, bake devices for 8 hours at 125C. 7.1.6.2 SMT Recommendations Figure 7-6 shows the recommended reflow profile for the WiLink 8 module. Temp
(degC) D3 D2 D1 T1 T3 T2 Meating Preheat Soldering Cooling Time
(SeC) Figure 7-6. Reflow Profile for the WiLink 8 Module Table 7-3 lists the temperature values for the profile shown in Figure 7-6. Table 7-3. Temperature Values for Reflow Profile ITEM Preheat Soldering Peak temperature TEMPERATURE (C) D1 to approximately D2: 140 to 200 D2: 220 D3: 250 maximum TIME (s) T1: 80 to approximately 120 T2: 60 10 T3: 10 TI does not recommend the use of conformal coating or similar material on the WiLink 8 module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Care should be taken during module assembly process to the final PCB to avoid the presence of foreign material inside the module. NOTE Copyright 20132017, Texas Instruments Incorporated Applications, Implementation, and Layout 37 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 8 Device and Documentation Support 8.1 Device Support 8.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 8.1.2 Development Support TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. 8.1.2.1 Tools and Software For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. Design Kits and Evaluation Modules AM335x EVM (TMDXEVM3358) The AM335x EVM enables developers to immediately evaluate the AM335x processor family (AM3351, AM3352, AM3354, AM3356, and AM3358) and begin building applications, such as portable navigation, portable gaming, and home and building automation. AM437x Evaluation Module (TMDSEVM437X) The AM437x EVM enables developers to immediately evaluate the AM437x processor family (AM4376, AM4377, AM4378, and AM4379 ) and begin building applications, such as portable navigation, patient monitoring, home and building automation, barcode scanners, and portable data terminals. BeagleBone Black Development Board (BEAGLEBK) BeagleBone Black is a low-cost, open source, community-supported development platform for ARM Cortex-A8 processor developers and hobbyists. Boot Linux in under 10 seconds and get started on Sitara AM335x ARM Cortex-
A8 processor development in less than 5 minutes using just a single USB cable. WiLink 8 Module 2.4 GHz Wi-Fi + Bluetooth COM8 EVM (WL1835MODCOM8B) The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add Wi-Fi and Bluetooth technology (WL183x module only) to embedded applications based on TI's Sitara microprocessors. TIs WiLink 8 Wi-Fi + Bluetooth modules are precertified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply). Note: The WL1835MODCOM8 EVM is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5-GHz band and extended temperature range, see the WL1837MODCOM8I EVM. WL18XXCOM82SDMMC Adapter Board The WiLink SDIO board is an SDMMC adapter board and an easy-to-use connector between
(WL1837MODCOM8i and WL1835MODCOM8B) and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO and provides a UART connection for Bluetooth technology over an FPC connector or wire cables. In addition, the adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink module or chip solution with a PCB 100-pin edge connector. This board is designed for use with various platforms such as the TI Sitara AM335 and AM437. the WiLink COM8 EVM TI Designs and Reference Designs The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs include schematics or block diagrams, BOMs, and design files to speed your time to market. 38 Device and Documentation Support Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 TI WiLink 8 Wi-Fi/Bluetooth/Bluetooth Smart Audio Multi-Room Cape Reference Design (TIDC-
WL1837MOD-AUDIO-MULTIROOM-CAPE) The TI WiLink 8 WL1837MOD audio cape is wireless a multi-room audio reference design used with BeagleBone Black featuring the TI Sitara (AM335x). The WLAN capability of the WiLink 8 device to capture and register precise arrival time of the connected AP beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi/Bluetooth/Bluetooth Smart solution featuring 2.4-GHz MIMO and antenna diversity on the 5-GHz band. The WiLink 8 module offers a best-in-class audio solution featuring multi-room, Airplay receiver, full audio stack streaming, support for online music services, and much more. This TI Design enables customers to design their own audio boards with Wi-Fi/Bluetooth/Bluetooth Smart connectivity from our WiLink 8 module
(WL1837MOD) and evaluate audio multi-room software. 2.4-GHz Wi-Fi + Bluetooth Certified Antenna Design on WiLink 1835 Module (TIDC-
WL1835MODCOM8B) The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way the module is certified. Customers can thus evaluate the performance of the module through embedded applications, such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth low energy functionalities found on the WiLink 1835 module. This antenna design is the same layout used during module certification, allowing customers to avoid repeated certification when creating their specific applications. Smart Home and Energy Gateway Reference Design (TIEP-SMART-ENERGY-GATEWAY) The Smart Home and Energy Gateway Reference Design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as Wi-Fi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Because objects in homes and buildings are becoming more and more connected and no single RF standard dominates the market, the gateway design must be flexible to accommodate different RF standards. This example gateway addresses the problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF standards ( ZigBee and BLE). Streaming Audio Reference Design (TIDEP0009) The TIDEP0009 Streaming Audio Reference Design minimizes design time for customers by offering small form factor hardware and major software components, including streaming protocols and Internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink 8 platform solution. This proven combination solution provides key advantages in this market category that helps bring your products to the next level. Software WiLink 8 Wi-Fi Driver for Linux OS (WILINK8-WIFI-NLCP) The NLCP package contains the install package, pre-compiled object and source of the TI Linux Open-Source Wi-Fi image to easily upgrade the default LINUX EZSDK release with the TI WiLink family NLCP Wi-Fi driver. The software is built with Linaro GCC 4.7 and can be added to Linux Software Development Kits
(SDKs) that use similar toolchain on other platforms. Android Development Kit for Sitara Microprocessors (ANDROIDSDK-SITARA) Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and production today. Linux EZ Software Development Kit (EZSDK) for Sitara Processors (LINUXEZSDK-SITARA) Linux SDKs provide Sitara developers with an easy setup and quick out-of-box experience that is specific to and highlights the features of TI's ARM processors. Launching demos, benchmarks, and applications is a snap with the included graphical user interface. The Sitara Linux SDK also allows developers to quickly start development of their own applications and easily add them to the application launcher, which can be customized by the developer. TI Dual-Mode Bluetooth Stack (TIBLUETOOTHSTACK-SDK) TIs dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy and is comprised of single-mode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, provides simple command line sample applications to speed development and has MFI capability on request. Copyright 20132017, Texas Instruments Incorporated Device and Documentation Support 39 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com Bluetooth Service Pack for WL18xx (WL18XX-BT-SP) The Bluetooth Service Pack is composed of the four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML following
(TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note. TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and CC256x (TI-BT-STACK-LINUX-ADDON) The Bluetooth Linux Add-On package contains the install package, pre-compiled object, and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified
(QDID 69886 and QDID 69887), provides simple command line sample applications to speed development, and has MFI capability on request. WiLink Wireless Tools for WL18XX Modules (WILINK-BT_WIFI-WIRELESS_TOOLS) The WiLink Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool
(RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool
(BTSout, BTSTransform, and ScriptPad). The applications provide all of the capabilities required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues. Development Tools WiLink 8 Proprietary Wi-Fi Driver QNX, WinCE, Nucleus RTOS Baseline (WILINK8-WIFI-WAPI-
MCP8, WILINK8-WIFI-MCP8, WILINK8-WIFI-SIGMA-MCP8) The MCP package contains the install package, precompiled object, and source of the proprietary Wi-Fi driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, C, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through third party vendors. The WAPI package provides the WPA Supplicant patch to support WAPI security protocol. The Sigma package provides the required APIs for WL8 code to support automated Sigma certification testing. 8.1.3 Device Support Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices. X WL18XY MOD XX MOC X Prefix X= Preproduction No Prefix = Production Device Packaging R = Large Reel T = Small Reel WL18XY Family X = 0/3 0 = WLAN only 3 = Bluetooth, WLAN Y = 1/5/7 1 = 2.4 GHz SISO 5 = 2.4 GHz MIMO 7 = 2.4 GHz MIMO + 5 GHz Figure 8-1. Device Nomenclature Package Designator MOC = LGA Package Model GB = 2.4 GHz Wi-Fi GI = 5 GHz Wi-Fi Module MOD = module X Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer: This product is still in development and is intended for internal evaluation purposes. Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device. null Device is qualified and released to production. TIs standard warranty applies to production devices. 40 Device and Documentation Support Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com 8.2 Related Links WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Table 8-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 8-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY WL1801MOD WL1805MOD WL1831MOD WL1835MOD Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here 8.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use. TI E2E Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 8.4 Trademarks WiLink, Sitara, E2E are trademarks of Texas Instruments. ARM is a registered trademark of ARM Physical IP, Inc. Airplay is a registered trademark of Apple Inc. Bluetooth is a registered trademark of Bluetooth SIG. Android is a trademark of Google, Inc. IEEE Std 802.11 is a trademark of IEEE. Linux is a registered trademark of Linus Torvalds. Wi-Fi is a registered trademark of Wi-Fi Alliance. ZigBee is a registered trademark of ZigBee Alliance. All other trademarks are the property of their respective owners. 8.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.6 Glossary SLYZ022 TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Copyright 20132017, Texas Instruments Incorporated Device and Documentation Support 41 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 9 Mechanical, Packaging, and Orderable Information 9.1 TI Module Mechanical Outline Figure 9-1 shows the mechanical outline for the device. e4 W e5 e2 d2 d1 e1 T e3 e6 L W L Pin 2 Indicator 4 3 2 1 c1 c2 c3 b1 b2 b3 a3 a1 a2 Bo tto m Vi e w Si d e Vi e w Figure 9-1. TI Module Mechanical Outline Table 9-1 lists the dimensions for the mechanical outline of the device. The TI module weighs 0.684 g typical. NOTE To p Vi e w MARKING L (body size) W (body size) T (thickness) a1 a2 a3 b1 b2 b3 c1 Table 9-1. Dimensions for TI Module Mechanical Outline MIN (mm) NOM (mm) MAX (mm) MARKING MIN (mm) NOM (mm) MAX (mm) 13.20 13.30 1.80 0.30 0.60 0.65 0.20 0.65 1.20 0.20 13.30 13.40 1.90 0.40 0.70 0.75 0.30 0.75 1.30 0.30 13.40 13.50 2.00 0.50 0.80 0.85 0.40 0.85 1.40 0.40 c2 c3 d1 d2 e1 e2 e3 e4 e5 e6 0.65 1.15 0.90 0.90 1.30 1.30 1.15 1.20 1.00 1.00 0.75 1.25 1.00 1.00 1.40 1.40 1.25 1.30 1.10 1.10 0.85 1.35 1.10 1.10 1.50 1.50 1.35 1.40 1.20 1.20 42 Mechanical, Packaging, and Orderable Information Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 9.2 Tape and Reel Information Emboss taping specification for MOC 100 pin. 9.2.1 Tape and Reel Specification Po Do P2 E F W Pin 1 P T C0.5 5.00 Ao = Bo o K Figure 9-2. Tape Specification Table 9-2. Dimensions for Tape Specification ITEM W E F P DIMENSION
(mm) 24.00
(0.30) 1.75
(0.10) 11.50
(0.10) 20.00
(0.10) Po 4.00 P2 2.00 Do 2.00
(0.10)
(0.10)
(0.10) T 0.35
(0.05) Ao 13.80
(0.10) Bo 13.80
(0.10) Ko 2.50
(0.10) 330.002.0 2.200.7 100.001.5 W1 W2 Figure 9-3. Reel Specification Table 9-3. Dimensions for Reel Specification ITEM DIMENSION (mm) W1 24.4 (+1.5, 0.5) W2 30.4 (maximum) Copyright 20132017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 43 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com 9.2.2 Packing Specification 9.2.2.1 Reel Box The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is packed into a reel box, as shown in Figure 9-4. 856 360 45 2 7 5 0 7 3 The reel box is made of corrugated fiberboard. 9.2.2.2 Shipping Box Figure 9-4. Reel Box Figure 9-5 shows a typical shipping box. If the shipping box has excess space, filler (such as cushion) is added. The size of the shipping box may vary depending on the number of reel boxes packed. NOTE 6 1 6 2 6 3 354 250 1,243 Figure 9-5. Shipping Box The shipping box is made of corrugated fiberboard. 44 Mechanical, Packaging, and Orderable Information Copyright 20132017, Texas Instruments Incorporated Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback www.ti.com 9.3 Packaging Information WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright 20132017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 45 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Submit Documentation Feedback WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 www.ti.com PACKAGE OPTION ADDENDUM Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish MSL Peak Temp (C) (3) Op Temp (C) WL1801MODGBMOCR WL1801MODGBMOCT WL1805MODGBMOCR WL1805MODGBMOCT WL1831MODGBMOCR WL1831MODGBMOCT WL1835MODGBMOCR WL1835MODGBMOCT ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE QFM QFM QFM QFM QFM QFM QFM QFM MOC MOC MOC MOC MOC MOC MOC MOC 100 100 100 100 100 100 100 100 1200 250 1200 250 1200 250 1200 250 Green Green Green Green Green Green Green Green NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu 250 250 250 250 250 250 250 250 20 to 70 20 to 70 20 to 70 20 to 70 20 to 70 20 to 70 20 to 70 20 to 70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2) RoHS Compliance: This product has an RoHS exemption for one or more subcomponent(s). The product is otherwise considered Pb-Free (RoHS compatible) as defined above.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 46 Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Copyright 20132017, Texas Instruments Incorporated www.ti.com WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M JULY 2013 REVISED OCTOBER 2017 Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD MOC0100A PACKAGE OUTLINE QFM - 2.0 mm max height QUAD FLAT MODULE 13.4 13.2 B 1 PIN 1 INDEX AREA A 13.5 13.3 C 0.08 C 33 56X 0.7
(1.4) TYP 2 MAX 17 7.7 TYP 2X 9.8 4X 36X 1 0.8 0.7 2X 11.95 2X 9.8 7.7 TYP G6 G3 G7 G19 SYMM G1 64 1.05 0.95 2X 12.05 PIN 2 ID NOTES:
G36 G31 60X 0.7 0.45 0.35 0.1 0.05 C C A B 4221006/B 10/2016 49
(1.4) TYP 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance. MOC0100A EXAMPLE BOARD LAYOUT QFM - 2.0 mm max height QUAD FLAT MODULE 64 1 2X (11.95) 49 G1 G7 G13 G19 G25 G31 2X
(12.05)
(1.05) TYP
(1.4) TYP 17 4X (0.75) 56X (0.7) SYMM 60X (0.75) 60X (0.4) 33 G6 G12 G18
(1.05) TYP G24 G30 G36
(1.4) TYP 36X (1) SYMM LAND PATTERN EXAMPLE SCALE: 8X 0.05 MIN ALL AROUND SOLDER MASK DETAILS SOLDER MASK DEFINED
(R0.05) TYP SOLDER MASK OPENING METAL UNDER SOLDER MASK NOTES: (continued) 4221006/B 10/2016 4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented. www.ti.com www.ti.com MOC0100A EXAMPLE STENCIL DESIGN QFM - 2.0 mm max height QUAD FLAT MODULE 64 1 2X (11.95) G1 G7 G13 G19 G25 G31 2X
(12.05)
(1.05) TYP
(1.4) TYP 49 60X (0.4) 60X (0.75) SYMM 56X (0.7) SEE DETAIL B G6 G12 G18
(1.05) TYP G24 G30 G36
(1.4) TYP 17 SEE DETAIL A SYMM 33 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PADS 1, 17, 33, 49, G1-G36 90% PRINTED COVERAGE BY AREA SCALE: 8X SOLDER PASTE METAL UNDER SOLDER MASK SOLDER MASK EDGE DETAIL A SCALE 20X METAL UNDER SOLDER MASK SOLDER MASK EDGE 36X (0.95) DETAIL B SCALE 20X 4221006/B 10/2016 SOLDER PASTE 4X
(0.713) NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TIs published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. 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