WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/5965390.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Empowering Every IoT Device with Our Technology Thundercomm TurboX CM6125 Development Kit Hardware User Manual Table of Contents Chapter 1. Product Overview ............................................................................................ - 2 -
1.1. Features and specifications ............................................................................................................. - 3 -
1.2. Product diagram .............................................................................................................................. - 4 -
1.3. Development kit introduction ......................................................................................................... - 5 -
1.4. DIP switches ................................................................................................................................... - 11 -
Chapter 2. Specifications for CM6125 DK ......................................................................... - 15 -
2.1. Main Board .................................................................................................................................... - 15 -
2.2. Interposer Board ............................................................................................................................ - 29 -
2.3. Audio Board ................................................................................................................................... - 31 -
2.4. Sensor Board.................................................................................................................................. - 32 -
Appendix 1. Compliance and Certificate Information ......................................................... - 34 -
Appendix 2. Contact Information of EU Local Agency ......................................................... - 39 -
Appendix 3. Contact Information of US Local Agency ......................................................... - 40 -
Appendix 4. Notices ........................................................................................................... - 41 -
Appendix 5. Trademarks .................................................................................................... - 43 -
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Chapter 1. Product Overview The TurboX CM6125 development kit is a cost-effective solution to evaluate the performance and build the prototype of the smart cameras and intelligent IoT devices quickly. The development kit features rich interfaces, including Type-C USB, LCD, and camera modules. The development kit supports Android-S operating system, combining powerful artificial intelligence and machine learning to address increasing demand for smart cities, commercial and enterprise, homes, and vehicles applications. TurboX referred to herein is the English text of our registered trademark:
. Figure 1-1. CM6125 Development Kit - Board Identification
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1.1. Features and specifications Table 1-1. Features and specifications Item Processor Memory Multimedia USB Ethernet SDIO Sensor Power supply Audio Charger Button SIMs Air interface Specification CPU:
Customized 64-bit Arm v-8.0 compliant applications processor (Qualcomm Kryo 260 CPU) Kryo Gold: quad-core (2.0 GHz high-performance) Kryo Silver: quad-core (1.8 GHz low-power) GPU: Qualcomm Adreno GPU 610 at 950 MHz graphics processing unit
(GPU) with 64-bit addressing DSP: Qualcomm Hexagon DSP with Qualcomm Hexagon Vector eXtensions (dual HVX 512) eMCP (eMMC 5.1 + LPDDR4X) Alternative of 4-lane MIPI DSI interface or LVDS interface Three 4-lane MIPI CSI interfaces. HDMI in and HDMI out 2.0 (TBD) Native DisplayPort 1.4 FM (WCN3950/WCN3980) 1 x USB 3.0 Type-C device port 1 x Micro USB 2.0 connector (for UART debug) Onboard HUB:
1 x USB host Type-C 4 x USB Type-A 10BASE-Te/100BASE-Tx/1000BASE-T IEEE 802.3 compliant 1 x TF Card 1 x IMU 1 x ALS + Proximity 1 x barometer 1 x Mag sensor DC-Jack: 1 x 12 V DC in WCD9335 audio codec 1 x 3.5 mm audio jack HP jack 2 x WSA8815 audio amplifiers 8x DMIC IN PMI632 + SMB1355 1 x Power on 2 x Volume 1 x Force_USB_boot 2x UIM interface GSM/WCDMA/LTE WLAN BT Operating temperature
-25 to +75
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1.2. Product diagram NOTE: Camera module and TFT-LCD are accessories to the development kit. Figure 1-2. Main Board Block Diagram Figure 1-3. Interposer Board Block Diagram
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1.3. Development kit introduction TurboX CM6125 DK adopts TCSOM_Carrier which consists of various sub boards. CM6125 SOM is connected to the DK via the Interposer Board. Main Board Core board of TCSOM_Carrier, adaptable to various SOMs via 500-pin connector. It mainly supports functions of USB, LCM, HDMI out, camera, SD card, SIM card, key, LED, etc. In addition, it can be connected to other expansion modules via rich peripheral interfaces including low-speed connectors, camera interface, display connector, PCIe expansion connector, etc. Interposer Board Carrier board of SOM, transferring signal from SOM to the Main Board via 500-pin connector. It also contains all RF interfaces and special SOM interfaces (for example, eDP). Audio Board This board is used together with the Main Board and is connected to the Main Board via the low-speed connectors. It contains codec WCD9385, amp WSA8835, and supports speaker, DMIC as well as headset functions. Sensor Board This board is used together with the Main Board and is connected to the Main Board via the low-speed connectors. It is mainly used for sensors. In addition, it is fit for applications including battery, NFC, CAN, FAN, etc. To fit all the boards together, refer to Figure 1-1. Refer to the following sub sections for the detailed description of interfaces on each board.
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1.1.1. Main Board overview Figure 1-4. Main Board Overview Table 1-2. Main Board interface list Item Reference Description 1 2 3 17 4 5 6 7 8 9 10 11 12 13 J600 12V DC jack input, 2.5mm/5.5mm USB3400 J3901 a) USB3900 b) J3900 J3800 J3700 c) J1200 J3401 J3400 J3300 J3301 J3200 J3201 LED4408 d) UART debug port, UART to USB USB Type-A port, only as host Micro USB port, sharing DP/DM with USB Type C connector, adb/download/host/device USB Type-C port, adb/download/host/device HDMI out interface, 2.0 LCD1 interface (option) PCIe expansion module connector, 2 x 2-lane Camera interface #5 Camera interface #4 Camera interface #2 Camera interface #3 Camera interface #0 Camera interface #1 LED4408, Flash LED #3 14 LED4409 LED4409, Flash LED #2 LED4410 SIM4201 SIM4200 LED4410, Flash LED #1 Nano SIM card slot #2 Nano SIM card slot #1 CON1000 500-pin connector to the Interposer Board J4100 SD card slot 15 16 19 20
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Item Reference Description 6-pin switch, boot configuration and CBL SW1, SDM_WDOG_DISABLE SW2, SDM_FAST_BOOT_0 SW3, SDM_FAST_BOOT_1 SW4, SDM_FAST_BOOT_2 SW5, SDM_FAST_BOOT_3 SW6, CBL_PWR_N Key, Force USB boot button Key, Volume up button Key, Volume down button Key, Power on button 3 x RGB LED from PMIC with independent brightness control:
LED4406, red LED LED4407, green LED LED4411, blue LED 3 x RGB LED from GPIO, for example, BT/Wi-Fi activity:
LED4400, red LED, no use LED4402, green LED, indicating Wi-Fi status LED4404, blue LED, indicating BT status Low-speed connector to low-speed expansion board 4 x 80-pin B2B connector LED4401, indicating Main Board 4V2 OK LED4403, indicating SOM power input OK 90-pin B2B connector, for camera interface extension such as HDMI in function and so on
(with HDMI in) LCD0 interface 90-pin B2B connector, for display interface extension such as LVDs, 4k LCM DIP switches for board function control 21 SW4404 22 23 24 25 26 18 27 28 29 30 31 40 SW4403 SW4401 SW4402 SW4400 LED4406 LED4407 LED4411 LED4400 LED4402 LED4404 J1100 J1101 J1102 J1103 LED4401 LED4403 J3500 J3600 J5000 SW1300 SW1301 SW2100 SW2101 SW2200 a) Only HS 2.0 signal is available on CM6125 SOM. b) CM6125 USB0 is a complete Type-C port. By default, USB3900 is not used. c) CM6125 has only one group of DSI0, and thus all LCD1 interfaces are unavailable. d) Unavailable on CM6125.
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1.1.2. Interposer Board overview Figure 1-5. Interposer Board Overview Table 1-3. Interposer Board interface list Item Reference Description 1 2 3 4 5 6 J1600 J1400 a) J1602 J1606 J1000 J1604 ANT_2G_5G_WLAN, Wi-Fi 2.4G/5G&BT Camera module connector, CSI4 ANT_DRX, 2G+3G+4G RF Diversity RX ANT_GPS_L1_IN, GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS CM6125 SOM ANT_PRI, 2G+3G+4G Primary RX and TX a). This connector is reserved for internal CSI signal test only, and is thus unavailable to users.
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1.1.3. Audio Board overview Figure 1-6. Audio Board Overview Table 1-4. Audio Board interface list Item Reference Description 1 2 3 4 5 6 7 8 9 10 11 12 13 21 J900 J901 J902 J903 SW3400 SW3401 SW3402 SW3403 SW3404 SW3100 SW3101 SW3102 J3505 J3301M a) J3300M a) J3201M a) J3200M a) J3504 J3503 J3500 J3501 J3502 J1000 J1100 J1101 J1102 Low-speed connector to low-speed expansion board 4 x 80-pin B2B connector DIP switch for DMIC connection selection DIP switch to control Audio Board configuration Speaker connector Right WSA881x speaker connector Left WSA881x speaker connector Right WSA883x speaker connector Left WSA883x speaker connector Ear out connector Line out connector Analog microphone connector 1 Analog microphone connector 3 Headset connector Low-speed connector to Main Board 4 x 80-pin B2B connector a) CM6125 uses WSA8835 as the speaker amplifier, and thus J3201M and J3200M are available for CM6125 speaker connection.
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1.1.4. Sensor Board overview Figure 1-7. Sensor Board Overview Table 1-5. Sensor Board interface list Item Reference Description 1 2 3 4 5 6 7 8 9 10 21 J900 J901 J902 J903 J4102 J4103 U3103 U3100 U3101 U3102 U3104 J1001 a) J4200 b) J1500 J1000 J1100 J1101 J1102 Low-speed connector to low-speed expansion board 4 x 80-pin B2B connector NFC antenna connector ALS+ PROXIMITY sensor, TMD2755 Magnetic, SK09915C ACC+GYRO sensor, LSM6DS3TR-C Pressure sensor, BMP280 SAR sensor Battery connector CAN connector FAN connector Low-speed connector to Main Board 4 x 80-pin B2B connector 22 SW1100 DIP switch a) CM6125 DK uses DCDC to supply CM6125 SOM by default. To use battery as the supply source, please refer to Main Board circuit and rework the related resistors. b) Unavailable on CM6125 SOM.
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1.4. DIP switches 1.4.1. DIP switches on Main Board SW1300 and SW1301 (for function configuration) Table 1-6. State description of SW1300 No. Name Function 1 CSI0_HDMI_SEL 2 CSI1_HDMI_SEL Control CSI0 switch for CAM0 or Camera Expansion Board OFF: Use CAM0 on Main Board ON: Use Camera Expansion Board Control CSI1 switch for CAM1 or Camera Expansion Board OFF-use CAM1 on Main Board ON -use Camera Expansion Board 3 -
default OFF OFF OFF 4 NFC_GPIO_SEL Control GPIO switch for NFC function or PCIE Expansion Board OFF-connect NFC related GPIO to NFC IC ON - connect NFC related GPIO to pcie board for control OFF 5 -
6 HS_SW_TYPEC_MICROUSB Control USB0 HS switch for Type C or Micro USB OFF-use Type-C port ON -use Micro USB port Table 1-7. State description of SW1301 No. Name Function 1 DSI0_HDMI_SEL Control DSI0 switch for LCD0 on board or HDMI OUT OFF-use LCD0 on Main Board ON use HDMI OUT as display OFF OFF Default OFF 2 DSI0_HDMI_EXT_SEL 3 DSI1_HDMI_SEL 4 DSI1_HDMI_EXT_SEL Control DSI0 switch for HDMI OUT or Display Expansion Board OFF- use HDMI OUT as display ON use Display Expansion Board OFF Control DSI1 switch for LCD1 on board or HDMI OUT OFF-use LCD1 on Main Board ON use HDMI OUT as display OFF Control DSI1 switch for HDMI OUT or Display Expansion Board OFF- use HDMI OUT as display ON use Display Expansion Board OFF 5 LCD0_PWR_SEL_BL Select LCD0 backlight source, supplied by SOM or DK OFF-select SOM backlight for LCD0 ON select DK backlight generator for LCD0 6 LCD0_PWR_SEL_DISP Select LCD0 BIAS source, supplied by SOM or DK OFF-select SOM bias for LCD0 ON select DK bias generator for LCD0 ON ON
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SW2200 (for display function configuration) No. Name Function 1 PM_PWM_A_LS 2 LCD0_BL_PWM_T 3 CON_GPIO_A9_LS Connect PM_PWM_A to low speed interface as GPIO OFF - /
ON connect this signal to low speed con Connect PM_PWM_A to LCD0 for dimming backlight OFF- /
ON LCD0 backlight dimming Connect CON_GPIO_A9 to low speed interface as GPIO OFF- /
ON connect this signal to low speed con 4 LCD0_TE_T Connect CON_GPIO_A9 to LCD0 for TE OFF- /
ON LCD0 use TE signal Default OFF ON OFF OFF 5 CON_GPIO_A10_LS Connect CON_GPIO_A10 to low speed interface as GPIO OFF- /
ON connect this signal to low speed con OFF 6 LCD1_TE_T Connect CON_GPIO_A10 to LCD1 for TE OFF- /
ON LCD1 use TE signal OFF SW2100 and SW2101 (for camera function configuration) Table 1-8. State description of SW2100 No. Name Function 1 CAM0_STROBE_LS 2 CAM0_STROBE_CON 3 CAM0_DOVDD_1V8_EN_LS Connect CAM0_STROBE to low speed interface as GPIO OFF- /
ON connect this signal to low speed con Connect CAM0_STROBE to CAM0 for strobe OFF- /
ON CAM0 uses flash strobe Connect CAM0_DOVDD_1V8_EN to low speed interface as GPIO OFF- /
ON connect this signal to low speed con 4 CAM0_DOVDD_1V8_EN_CON Connect CAM0_DOVDD_1V8_EN to CAM0 for power control OFF- /
ON CAM0 power-on control 5 SLEEP_CLK_LS 6 SLEEP_CLK_CON Connect SLEEP_CLK to low speed interface for other function OFF- /
ON connect this signal to low speed con Connect SLEEP_CLK to CAM0 for low power mode OFF- /
ON CAM0 uses sleep clock for low power mode Default OFF OFF OFF ON OFF OFF
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Table 1-9. State description of SW2101 No. Name Function Default 1 /
2 /
3 CAM1_SPI_CS_LS Connect CAM1_SPI_CS to low speed interface as GPIO OFF- /
ON connect this signal to low speed con 4 CAM1_SPI_CS_CON Connect CAM1_SPI_CS to CAM1 for SPI communication OFF- /
ON CAM1 use SPI as communication interface 5 CAM0_SPI_CS_LS Connect CAM0_SPI_CS to low speed interface as GPIO OFF- /
ON connect this signal to low speed con 6 CAM0_SPI_CS_CON Connect CAM0_SPI_CS to LCD1 for SPI communication OFF- /
ON CAM1 use SPI as communication interface OFF OFF OFF OFF OFF OFF 1.4.2. DIP switches on Audio Board By default, these DIP switches are set per the sequence of pin#1~pin#6. Figure 1-8. DIP Switches on Audio Board Board function settings:
SW3101: OFF/OFF/OFF/ON/OFF/ON, enabling WCD9385 and WSA8835 SW3100: OFF/OFF/OFF/OFF/OFF/OFF SW3102: OFF/OFF/OFF/OFF/OFF/OFF
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DMIC connection settings:
SW3400: ON/ON/OFF/OFF/OFF/OFF, connecting SOM DMIC01 SW3401: OFF/OFF/OFF/OFF/ON/ON, connecting SOM DMIC23 SW3403: OFF/OFF/ON/ON/OFF/OFF, connecting SOM DMIC45 SW3402 & SW3404: OFF/OFF/OFF/OFF/OFF/OFF
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Chapter 2. Specifications for CM6125 DK 2.1. Main Board 2.1.1. Power-on Step 1. Connect the device (via the UART debug port, No. 2 in Figure 1-4) to a PC with a Micro USB cable. Step 2. Run the serial console tool on host PC (for example: minicom). NOTE:
Set the Bps/Par/Bits to 115200 8N1 If the UART log is not required, skip Steps 1 and 2. Step 3. Connect the power adapter to the board. Figure 2-1. Connect Power Adapter Step 4. Press and hold the power on button (No. 25 in Figure 1-4) for at least six seconds. Afterwards, the board will start the bootup process.
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2.1.2. Camera interface Camera interfaces: No.8 to No.13 in Figure 1-4. There are 6 x 4L camera BTB (Board to Board) interfaces on the Main Board. Also, there is a 90-pin connector to expand camera or HDMI in interface on the camera module (see Figure 1-2. Main Board Block Diagram). CM6125 SOM supports five integrated MIPI CSIs. Figure 2-2. Camera Interfaces All camera interfaces have the same pin definition (refer to Table 3-1) and all camera modules need dedicated FPC to enable connection to the interface. In other words, the camera interface is not directly adaptive to any camera.
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Table 3-1. Camera interface description No. Name Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 STROBE SPI_CLK AVDD_2V8 SPI_MOSI RST GND CSI_C1_LN2_P CSI_A2_LN2_M GND CSI_B0_LN0_P CSI_C0_LN0_M GND CSI_B2_LN3_P CSI_C2_LN3_M PWR_SWITCH a) GND CSI_B1_LN1_M CSI_A1_LN1_P GND CSI_A0_CLK_M CSI_NC_CLK_P GND MCLK GND I2C_SCL I2C_SDA SPI_CS b) DOVDD SPI_MISO Camera strobe for flash driver (FLASH_STROBE), only for CAM0 Reserved for Camera SPI communication interface, only for CAM0
Reserved for Camera SPI communication interface, only for CAM0
Used for DVDD power selection.
Reserved for Camera SPI communication interface, only for CAM0;
Share with AFVDD (Auto Focus VDD), 5V, only for CAM0 and CAM1. 1.8V Reserved for Camera SPI communication interface, only for CAM0 DVDD_1V1_1V2 Camera DVDD supports 1.1V and 1.2V selection. NOTE:
a) When the DVDD of camera module is 1.1V, the PIN-15 of FPC should be pulled up to DOVDD, then PIN-30 DVDD will output 1.1V for Camera; otherwise, PIN-30 outputs 1.2V for Camera by default. b) On CAM0 and CAM1, the interface adds AFVDD power supply, which shares with SPI_CS PIN-27. The voltage of AFVDD is 5V.
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2.1.3. Display interface LCD0: No.30 in Figure 1-4 HDMI out interface: No.5 in Figure 1-4 2.1.3.1. LCM The LCM on the Main Board is connected to 5-inch 1280*720 TFT-LCD with touch panel, fixed by a dedicated holder. Check the connection between the LCD panel (accessory) and the board, refer to Figure 2-3. For detailed information on how to open LCM, refer to the relevant software user manual. Figure 2-3. Display Panel Connection
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Table 3-2. LCM pin definition No. Symbol Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 LED-
LED+
GND TP-SDA TP-SCL TP-INT TP-RST Backlight cathode Backlight anode Ground IIC signal of TP INT signal of TP Reset signal of TP TP-VDD(2.8V) Power supply 2.8V for TP LCD-ID1 AVDD5.5V AVEE-5.5V VDD1.8V LCM-RSTN NC Power supply of 5.5V Power supply of -5.5V Power supply 1.8V for LCD Reset Singal for LCD N25530738(PWM) LCD backlight control PWM output Pin LCM-FMARK(TE) Tearing effect output pin GND MIPI_D0P MIPI_D0N GND MIPI_D1P MIPI_D1N GND MIPI_CLKP MIPI_CLKN GND MIPI_D2P MIPI_D2N GND MIPI_D3P MIPI_D3N Ground MIPI DSI Data0+ signal MIPI DSI Data0- signal Ground MIPI DSI Data1+ signal MIPI DSI Data1- signal Ground MIPI DSI CLK+ signal MIPI DSI CLK- signal Ground MIPI DSI Data2+ signal MIPI DSI Data2- signal Ground MIPI DSI Data3+ signal MIPI DSI Data3- signal
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2.1.3.2. HDMI out There is one HDMI out interface on the Main Board. A DSI to HDMI Bridge (LONTIUM SEMICONDUCTOR LT9611UXC) performs this task and supports a resolution from 1080P to 4K at 60Hz. This bridge also supports the audio function performed by a 1-bit I2S on SOMs. For detailed information on how to open HDMI out, refer to the relevant software user manual. Figure 2-4. HDMI Out Interface 2.1.4. USB ports The Main Board includes three USB ports:
USB Type C Micro USB USB 3.0 Type A NOTE: CM6125 does not use Micro USB by default.
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2.1.5. Type-C port The Main Board can implement a USB Type-C port (USB3900), No. 4 in Figure 1-4. Figure 2-5. USB Type-C Port Connection This integrated Type-C port is connected to CM6125 USB0. It supports adb and firmware upgrade, as well as charger, DRD, DP. NOTE: Make sure to toggle SW6 of SW1300 to OFF ande connect USB0 DP/DM to Type-C port. 2.1.6. USB Type-A port The Main Board can implement a USB Type-A port (J3900), No. 3 in Figure 1-4, which supports only the device mode. Figure 2-6. USB Type-A Port Connection This port is connected to CM6125 USB1, which only supports USB2.0. So J3900 does not support USB3.0 on CM6125 SOM. 2.1.7. SD card slot The Main Board supports one Micro SD slot.
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Figure 2-7. SD Card Slot 2.1.8. Buttons Four buttons are available on the Main Board. SW4400: power on button, (No. 25 in Figure 1-4), serves as the Power ON/OFF/Sleep button. You can press and hold the button for more than 3 seconds to power on the device. SW4401: volume up button (No. 23 in Figure 1-4) SW4402: volume down button (No. 24 in Figure 1-4) SW4403: force USB boot button (No. 22 in Figure 1-4), used for emergency USB boot-up during product development. Figure 2-8. Buttons 2.1.9. LED Ten LEDs are available on the Main Board. Two green LEDs (LED4401/LED4403), (No. 28 in Figure 1-4), as power indicators;
LED4401 indicates that the Main Board functions well. LED4403 indicates that the SOM functions well with 4.2 V power supply. Three RGB LEDs (LED4406/LED4407/LED4411) from PMIC with independent brightness control;
Three RGB LEDs (LED4400/LED4402/LED4404) from GPIO, for example, BT/Wi-Fi activity;
Two flashing LEDs (LED4409/LED4410) as camera flash indicators.
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Figure 2-9. Locate LEDs
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2.1.10. Boot config switch A 6-pin DIP (Double In-line Package) switch (No. 21 in Figure 1-4) is located at the top of the Main IO Board. Pin#1, 2, 3, and 4 are used for boot configuration. Figure 2-10. Boot Config Switch Pin#1: BOOT_CONFIG(0), WDOG_DISABLE (ON: disable WDOG; OFF: enable WDOG) Pin#2: BOOT_CONFIG(1), FAST_BOOT_0 Pin#3: BOOT_CONFIG(2), FAST_BOOT_1 Pin#4: BOOT_CONFIG(3), FAST_BOOT_2 NOTE: Pin#2/3/4 can define the device bootup sequence of the SOM. Refer to Figure 3-8. Table 3-3. Device bootup sequence of SOM (example) FAST_BOOT GPIO [2:0]
Boot device Default: eMMC uSD USB eDL(USB) uSD eMMC USB(eDL) SDC2 USB(eDL) USB(eDL) UFS uSD USB(eDL) uSD UFSUSB(eDL) UFSUSB(eDL) UFS_PWM_MODE USB(eDL) 000 001 010 011 100 101 110 111 Others Reserved Pin#5: BOOT_CONFIG(4), reserved. Pin#6 serves as CBL_PWR_N.
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2.1.11. Camera expansion connector No. 29 in Figure 1-4 This connector is used to expand the camera board, including camera module and HDMI in. For more information on the camera expansion connector pin-outs, refer to Table 6-1. Table 3-4. Camera expansion connector pin-outs Name No. No. Name GND CAM0_SDA_EXT CAM0_SCL_EXT GND CAM0_AVDD_2V8_EN_EXT CAM0_DVDD_1V2_EN_EXT CAM0_RST_EXT CAM0_XVS_EXT CAM0_XHS_EXT CAM_SPI_CS_EXT CAM_SPI_MOSI_EXT CAM_SPI_MISO_EXT I2S_CLK_HDMI_IN I2S_MCLK_HDMI_IN I2S_WS_HDMI_IN I2S_D0_HDMI_IN GND VDC_1V8 VDC_1V8 GND VDC_1V8 VDC_1V8 GND VDC_3V3 VDC_3V3 GND VDC_5V VDC_5V GND HDMI_IN_I2C_SCL HDMI_IN_I2C_SDA HDMI_IN_RSTN_EXT HDMI_IN_INT_EXT 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 GND CSI0_B0_LN0_P_HS CSI0_C0_LN0_M_HS GND CSI0_A1_LN1_P_HS CSI0_B1_LN1_M_HS GND CSI0_NC_CLK_P_HS CSI0_A0_CLK_M_HS GND CSI0_C1_LN2_P_HS CSI0_A2_LN2_M_HS GND CSI0_B2_LN3_P_HS CSI0_C2_LN3_M_HS GND CAM0_MCLK_EXT NC NC CAM_SPI_CLK_EXT VDC_3V3 VDC_3V3 GND VDC_1V8 VDC_1V8 NC CAM1_MCLK_EXT FLASH_LED1_EXT FLASH_LED2_EXT GND CSI1_C2_LN3_M_HS CSI1_B2_LN3_P_HS GND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65
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Name No. No. Name UART_RTS_EXT UART_RXD_EXT UART_TXD_EXT CAM1_XHS_EXT CAM1_XVS_EXT CAM1_RST_EXT CAM1_DVDD_1V2_EN_EXT CAM1_AVDD_2V8_EN_EXT GND CAM1_SCL_EXT CAM1_SDA_EXT GND 67 69 71 73 75 77 79 81 83 85 87 89 68 70 72 74 76 78 80 82 84 86 88 90 CSI1_A2_LN2_M_HS CSI1_C1_LN2_P_HS GND CSI1_A0_CLK_M_HS CSI1_NC_CLK_P_HS GND CSI1_B1_LN1_M_HS CSI1_A1_LN1_P_HS GND CSI1_C0_LN0_M_HS CSI1_B0_LN0_P_HS GND 2.1.12. Display expansion connector This connector is used to expand the display board. For more information on the camera expansion connector pin-outs, refer to Table 3-4. Table 3-5. Display expansion connector pin-outs Name No. No. Name GND TP0_SDA_EXT TP0_SCL_EXT GND LCD0_VDD_2V8_EN_EXT LCD0_VDD_1V8_EN_EXT TP0_RST_EXT TP0_INT_EXT LCD0_TE_EXT LCD0_RESET_N_EXT LCD0_BL_EN_EXT LCD0_VSP_EN_EXT I2S_CLK_HDMI_OUT_EXT I2S_MCLK_HDMI_OUT_EXT I2S_WS_HDMI_OUT_IN_EXT I2S_D0_HDMI_OUT_EXT GND N529916 N529916 GND GND DSI0_A0_LN0_P_EXT DSI0_B0_LN0_M_EXT GND DSI0_C0_LN1_P_EXT DSI0_A1_LN1_M_EXT GND DSI0_B1_CLK_P_EXT DSI0_C1_CLK_M_EXT GND DSI0_A2_LN2_P_EXT DSI0_B2_LN2_M_EXT GND DSI0_C2_LN3_P_EXT DSI0_NC_LN3_M_EXT GND LCD0_BL_PWM_EXT HDMI_OUT_PWREN_EXT HDMI_OUT_PWREN_1P2_EXT LCD0_VSN_EN_EXT 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39
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Name No. No. Name VDC_1V8 VDC_1V8 GND VDC_3V3 VDC_3V3 GND VDC_5V VDC_5V GND HDMI_OUT_I2C_SCL_EXT HDMI_OUT_I2C_SDA_EXT HDMI_OUT_RSTN_EXT HDMI_OUT_INT_EXT LCD1_VSP_EN_EXT LCD1_BL_EN_EXT LCD1_RESET_N_EXT LCD1_TE_EXT TP1_INT_EXT TP1_RST_EXT LCD1_VDD_1V8_EN_EXT LCD1_VDD_2V8_EN_EXT GND TP1_SCL_EXT TP1_SDA_EXT GND 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 77 79 81 83 85 87 89 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86 88 90 VDC_3V3 VDC_3V3 GND VDC_1V8 VDC_1V8 LCD1_VSN_EN_EXT LCD1_BL_PWM_EXT FLASH_LED1_EXT FLASH_LED2_EXT GND DSI1_NC_LN3_M_EXT DSI1_C2_LN3_P_EXT GND DSI1_B2_LN2_M_EXT DSI1_A2_LN2_P_EXT GND DSI1_C1_CLK_M_EXT DSI1_B1_CLK_P_EXT GND DSI1_A1_LN1_M_EXT DSI1_C0_LN1_P_EXT GND DSI1_B0_LN0_M_EXT DSI1_A0_LN0_P_EXT GND
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2.1.13. PCIe expansion connector NO. 7 in Figure 1-4 This connector is used to expand the PCIe board. For pin-outs of the high-speed expansion connector, refer to Table 3-5. Table 3-6. High-speed expansion connector pin-outs Name No. No. Name PCIE1_REFCLK_M PCIE1_REFCLK_P GND PCIE1_RX0_M PCIE1_RX0_P GND PCIE1_TX0_M PCIE1_TX0_P GND PCIE1_RX1_M PCIE1_RX1_P GND PCIE1_TX1_M PCIE1_TX1_P GND PCIE1_CLK GND PCIE1_RST PCIE1_WK GND PCIE_CTL_1 PCIE_CTL_2 SPI_CS_EXT SPI_CLK_EXT SPI_MOSI_EXT GND VDC_1V8 VDC_3V3 VDC_3V3 VBAT_MB 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 PCIE2_REFCLK_M PCIE2_REFCLK_P GND PCIE2_RX0_M PCIE2_RX0_P GND PCIE2_RX1_M PCIE2_RX1_P GND PCIE2_TX0_M PCIE2_TX0_P GND PCIE2_TX1_M PCIE2_TX1_P GND PCIE2_CLK GND PCIE2_RST PCIE2_WK
PCIE_CTL_3
PCIE_CTL_3 GND SPI_MISO_EXT GND VDC_1V8 VDC_3V3 VDC_3V3 VBAT_MB 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59
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2.2. Interposer Board 2.2.1. Wi-Fi/Bluetooth and GPS connection The SOM supports Wi-Fi/BT function via the Wi-Fi antenna connector (No.1 in Figure 1-5). The SOM supports GPS function via the GPS antenna connector (No.4 in Figure 1-5). Figure 2-11. Wi-Fi/BT Antenna Connector Figure 2-12. GPS Antenna Connector
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2.2.2. 2G/3G/4G connection The SOM supports 2G/3G/4G via the primary antenna connector (No.6 in Figure 1-5) and DRX antenna connector (No. 3 in Figure 1-5). Figure 2-13. Primary Antenna Connector Figure 2-14. DRX Antenna Connector
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2.3. Audio Board This section descripts functions located on the Audio Board. NOTE: Make sure to set the DIP switches should be set to the right state (see 1.4.2. DIP switches on Audio Board). 2.3.1. Speaker connector CM6125 SOM supports dedicated SoundWire interface for smart speaker amplifier, WSA8835. The maximum output power is 7.3W into 8 for speaker. Figure 2-15. Speaker Connection 2.3.2. Headset connector CM6125 SOM supports a headset interface form codec WCD9385. The headset supports microphone and is suitable CTIA standard. Figure 2-16. Headset Connection
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2.3.3. DMIC CM6125 SOM supports three DMIC arrays, connected to SoC. Figure 2-17. DMIC Arrays 2.4. Sensor Board 2.4.1. Sensor CM6125 SOM implements five-sensor IC. Refer to Figure 1-7. 2.4.2. Battery connector No. 8 in Figure 1-7 Table 3-7. Pin definition of battery connector No. Name Description 1 2 3 4 5 VBAT_SOM Battery positive BATT_ID Battery missing detection GND Battery negative NOTE: CM6125 DK uses DCDC to supply CM6125 SOM by default. To use battery as the supply source, refer to relevant software user manual.
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2.4.3. Fan connector Step 1. Refer to Figure 3-11 to connect a fan to the board via the fan connector (No.10 in Figure 1-5). Figure 2-18. Fan Connector Table 3-1. Fan function No. 1 2 3 4 Function PWM NA FAN_VCC, default 12V GND
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Appendix 1. Compliance and Certificate Information FCC Statements:
OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note Notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to XXXX that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product Labeling When the module is installed in the host device, the FCC label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID:
2AOHHTURBOXCM6125 The FCC ID can be used only when all FCC compliance requirements are met. Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
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(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation. Antenna type BT&2.4GHz band Peak Gain (dBi) 5.2GHz band 5.3GHz band 5.5GHz band 5.8GHz band Peak Gain (dBi) Peak Gain (dBi) Peak Gain (dBi) Peak Gain (dBi) Monopole Dipole 4
3.1
3.2
3.2
3.1 WWAN antenna types and gain values:
Antenna type Frequency Bands Antenna Gain (dBi) Monopole Antenna UMTS Band(s) LTE Bands(s) FDD II FDD IV FDD V FDD 2 FDD 4 FDD 5 FDD 7 FDD 12 FDD 13 FDD 17 FDD 25 FDD 26 TDD 41 FDD 66 FDD 71 3 4.5 1.2 3 4.5 1.2 4 1.2 1.2 1.2 3 1.2 4 4.5 2 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
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Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with 15.247 and 15.407 Part22/24/27/90 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
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EU Regulatory Conformance Hereby, Thundercomm Technology Co., Ltd declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. The device for operation in the band 51505350 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems. AT EE IT PT IS BE FI LV RO LI BG FR LT SK NO HR DE LU SI TR CY EL MT ES CZ HU NL SE UK(NI) DK IE PL CH The device could be used with a separation distance of 20 cm to the human body. The device is operated with the following RF bands power in different operation modes:
Operating Frequency Range TX(MHz) RX(MHz) Maximum Transmit Power
(EIRP) dBm 13.88 Conducted Power dBm Operating Mode Bluetooth WLAN 2.4GHz WLAN 5GHz Band 1 WLAN 5GHz Band 2 WLAN 5GHz Band 3 WLAN 5GHz Band 4 2402 - 2480 2412 - 2472 5150 - 5250 5250 - 5350 5470 - 5725 5725 - 5850 Frequency bands and maximum transmit power:
GSM Band(s) UMTS Band(s) LTE Bands(s) Frequency Bands E-GSM 900 DCS 1800 FDD I FDD V FDD VIII FDD 1 FDD 3 FDD 5 FDD 7 FDD 8 FDD 20
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33.5 30 24 24 24 24 24 24 24 24 24 Frequency Bands Conducted Power dBm FDD 28 TDD 34 TDD 38 TDD 40 TDD 41 24 24 24 24 24
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Appendix 2. Contact Information of EU Local Agency Company:
Thundercomm Europe GmbH Address:
20, Oskar-von-Miller-Ring, 80333 Mnchen, c/o WeWork Contact person:
Daodong Zhang E-mail:
zhangdd0913@thundercomm.com
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Appendix 3. Contact Information of US Local Agency Company:
Thundercomm America Corporation Address:
10180 Telesis Court, Suite 120, San Diego, CA 92121 Contact person:
Weiqin Bai E-mail:
weiqin.bai@thundercomm.com baiwq@thundersoft.com Mobile:
+1-8585315328
+86-18618401680
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Appendix 4. Notices Thundercomm may have patents or pending patent programs covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries to service@thundercomm.com. THUNDERCOMM PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or implied warranties in certain transactions; therefore, this statement may not apply to you. Changes are made periodically to the information herein; these changes will be incorporated in new editions of the publication. To provide better service, Thundercomm reserves the right to improve and/or modify the products and software programs described in the manuals, and the content of the manual, at any time without additional notice. The software interface and function and hardware configuration described in the manuals included with your development board or system on module might not match exactly the actual configuration of that you have purchased. For the configuration of the product, refer to the related contract (if any) or product packing list, or consult the distributor for the product sales. Thundercomm may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you. The products described in this document are not intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Thundercomm product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Thundercomm or third parties. All information contained in this document was obtained in specific environments and is presented as an illustration. The result obtained in other operating environments may vary. The information of this document should not be as any invitation for offer or any advice to the visitors. Please consult the professional comments from the sales consultant prior to do any actions of investment or purchase. Thundercomm may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you. Any references in this publication to non-Thundercomm Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this Thundercomm product, and use of those Web sites is at your own risk. Thundercomm shall not be responsible for the content of the third party. Any performance data contained herein was determined in a controlled environment. Therefore, the result obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurements may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.y This document is copyrighted by Thundercomm and the property right of the date mentioned in this document, including but not limited trademarks, patents, copyrights, trade name etc. are not covered by any open-source license. Thundercomm may update this document at any time without notice. Anyone doesnt have the right to amend, reprint, republication, reproduce, transmit, distribute or any other way to use this document in business or public purpose without the prior written consent by Thundercomm. E-mail messages sent to Thundercomm via the Internet are not guaranteed to be completely secure.Thundercomm shall not be liable for any loss incurred by the surfer when transmitting any information over the Internet or for any loss incurred by Thundercomm when sending any information over
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the Internet at your request. Thundercomm has all rights under other relevant exemptions provided by laws and regulations, and Thundercomm's failure to claim or delay in claiming such rights shall not be deemed to be a waiver of such rights by Thundercomm. Thundercomm reserves the right of final interpretation of this document.
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Appendix 5. Trademarks Thundercomm, Thundercomm TurboX, TURBOX, Thundersoft turbox are trademarks of Thundercomm Corporation or its associate companies in China and/or other countries. Intel, Intel SpeedStep, Optane, and Thunderbolt are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Microsoft, Windows, Direct3D, BitLocker, and Cortana are trademarks of the Microsoft group of companies. Mini DisplayPort (mDP), DisplayPort, and VESA are trademarks of the Video Electronics Standards Association. The terms HDMI and HDMI High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries. Wi-Fi, Wi-Fi Alliance, WiGig, and Miracast are registered trademarks of Wi-Fi Alliance. USB-C is a registered trademark of USB Implementers Forum. All other trademarks are the property of their respective owners.
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Antenna trace interpretation Trace of WIFI 2.4/5G, The width is 0.3175mm and the length is 27.75mm. Impedance: 50ohm, keep out cooper of L2 under the trace. Trace of Primary antenna, CM6125 only The width is 0.3175mm and the length is 27.75mm. Impedance: 50ohm, keep out cooper of L2 under the trace.. Trace of Diversity antenna, CM6125 only The width is 0.3175mm and the length is 18.5mm. Impedance: 50ohm, keep out cooper of L2 under the trace. Trace of GPS antenna, CM6125 only The width is 0.3175mm and the length is 17.98mm. Impedance: 50ohm.