2.4GHz 3216 Chip Antenna: AAN3216F5P2G45 ______________________________________________________________________________________________________ Application:
WLAN, 802.11b/g, Bluetooth, etc Features SMD, high reliability, ultra Impact, Omni-directional Part number AAN 3216 - F5
(3)
(2) P 2G45
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(5)
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(1)Product Type Chip Antenna
(2)Size Code
(3)Type Code
(4)Packing
(5)Frequency 3.2x1.6mm F5 Paper Tape 2.45GHz Electrical Specification Working Frequency Range 2400 ~2484 MHz Peak Gain Impedance Return loss Polarization Azimuth Beamwidth Operation Temperature() The specification is defined on EVB. 1.6 dBi (Typ.) 50 Ohm 10 dB ( Min) Linear Omni-directional
-40 ~85 Dimension and Terminal Configuration Dimension (mm) No. Terminal Name L W T A 3.15+-0.15 1.55+-0.15 0.50+-0.10 0.35+-0.10 1 2 Feeding point GND 2.4GHz 3216 Chip Antenna: AAN3216F5P2G45 ______________________________________________________________________________________________________ Evaluation Board Reference PCB Dimension Antenna Layout Reference Electrical Characteristics Return Loss Return Loss & Radiation unit :mm Frequency
(MHz) 2400 2442 2484 S11 (dB)
-11.0
-20.2
-10.6 Radiation 2.4GHz 3216 Chip Antenna: AAN3216F5P2G45 ______________________________________________________________________________________________________ Taping Specifications Reel Specification Reel and Taping Specification TYPE SIZE A B C D W M 3216 7 3K/Reel 2.00.5 13.51.0 211.0 601.0 11.52.0 1782.0 Tapping Specification Packaging Type A B W E F G H T Paper Type 3216 1.900.20 3.500.20 8.00.20 1.750.10 3.50.05 4.00.10 2.00.05 0.750.10 D
+0.10 P 1.50
-0 4.00.1 2.4GHz 3216 Chip Antenna: AAN3216F5P2G45 ______________________________________________________________________________________________________ Reliability Table Test ItemProcedureRequirementsCeramic TypeRemark(Reference)ElectricalCharacterizationFulfill the electricalspecificationUser Spec.ThermalShock1.Preconditioning:50 10 / 1 hr , then keep for 24 1 hrs at room temp.2.Initial measure: Spec: refer Initial spec.3.Rapid change of temperature test:-30 to +85; 100 cycles;15 minutes at Lower category temperature;15 minutes at Upper category temperature.No Visible Damage.Fulfill the electricalspecification.MIL-STD-202107TemperatureCycling1.Initial measure: Spec: refer Initial spec.2.100 Cycles (-30 to +85), Soak Mode=1 (2 Cycle/hours).3.Measurement at 24 2Hours after test condition.No Visible Damage.Fulfill the electricalspecification.JESD22JA104High TemperatureExposure1.Initial measure: Spec: refer Initial spec.2.Unpowered; 500hours @ T=+85.3.Measurement at 24 2 hours after test.No Visible Damage.Fulfill the electricalspecification.MIL-STD-202108Low TemperatureStorage1.Initial measure: Spec: refer Initial spec.2.Unpowered: 500hours @ T= -30.3.Measurement at 24 2 hours after test.No Visible Damage.Fulfill the electricalspecification.MIL-STD-202108Solderability(SMD Bottom Side)Dipping method:a.Temperature: 235 5Cb.Dipping time: 3 0.5sThe solder should coverover 95% of the criticalarea of bottom side.IEC 60384-21/224.10Soldering HeatResistance(RSH)Preheating temperature: 150 10C.Preheating time: 1~2 min.Solder temperature: 260 5C.Dipping time: 5 0.5sNo Visible Damage.IEC 60384-21/224.10Vibration5g's for 20 min., 12 cycles each of 3 orientationsNote: Use 8"X5" PCB .031" thick 7 secure points on, one longside and 2 secure points at corners of opposite sides. Partsmounted within 2" from any secure point. Test from 10-2000Hz.No Visible Damage.MIL-STD-202Method 204MechanicalShockThree shocks in each direction shall be applied along the threemutually perpendicular axes of the test specimen (18 shocks)Peak value: 1,500gsDuration: 0.5msVelocity change: 15.4 ft/sWaveform: Half-sineNo Visible Damage.MIL-STD-202Method 213HumidityBias1.Humidity: 85% R.H., Temperature: 85 2 C.2.Time: 500 24 hours.3. Measurement at 24 2hrs after test condition.No Visible Damage.Fulfill the electricalspecification.MIL-STD-202Method 106 2.4GHz 3216 Chip Antenna: AAN3216F5P2G45 ______________________________________________________________________________________________________ Revision History Revision Date Content 1 2018/7/20 New issue BoardFlex(SMD)1.Mounting method:IR-Reflow. PCB Size (L:100 W:40 T:1.6mm)2.Apply the load in direction of the arrow until bending reaches2 mm.No Visible Damage.AEC-Q200005AdhesionForce of 1.8Kg for 60 seconds.No Visible DamageMagnification of 20X orgreater may be employedfor inspection of themechanical integrity of thedevice body terminals andbody/terminal junction.AEC-Q200006PhysicalDimensionAny applicable method using x10 magnification, micrometers,calipers, gauges, contour projectors, or other measuringequipment, capable of determining the actual specimendimensions.In accordance withspecification.JESD22JB100