FCC ID: SRQ-MG2639 GSM wireless data terminals

ZTE MG2639 Module Hardware Design User Manual VersionV1.2 User Manual Copyright Statement If you accept this manual of ZTE Corporation, it means that you have agreed to the following terms and conditions; if you dont agree, please stop using this manual. The copyright of this manual belongs to ZTE Corporation. ZTE Corporation reserves any rights not expressly granted in this manual. The contents in this manual are the proprietary information of ZTE Corporation. This manual and any image, table, data or other information contained in this manual may not be reproduced, transferred, distributed utilized or disclosed without the prior written permission of ZTE Corporation. and are the registered trademark of ZTE Corporation. All other trademarks appeared in this manual are owned by the relevant companies. Nothing contained in this manual should be construed as granting, by implication, estoppel, or otherwise, any license or right to use any trademarks displayed in this manual without the prior written permission of ZTE Corporation or third-party obligee. This product conforms to the design requirements of relevant environment protection and personal safety. The storage, usage and disposal of this product should comply with the product user manual, relevant contracts or requirements of laws and regulation in relevant countries. ZTE Corporation keeps the right to modify or improve the product described in the manual without prior notice; and meanwhile keeps the right to modify or retract this manual. If there is anything ambiguous in this manual, please consult ZTE Corporation or its distributor or agent promptly. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved I Version update description Product version Document version Document No. ZTE MG2639 V1.0 ZTE MG2639 V1.2 User Manual Document update descriptions Released for the first time 1) the modules thickness has changed from 2.68mm to 3.0mm. Date of release 2013-9-6 2014-1-4 Writer Document version 1.0 1.1 1.2 Date Written by 2012-8-23 2013-11-08 Cai Zongfei Cai Zongfei 2014-1-4 Zhao Xiaolin Checked by Approved by With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA module customers with the following all-around technical support:

1. Provide complete technical documentation;

2. Provide the development board used for R&D, test, production, after-sales, etc. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved II User Manual 3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;

4. Provide test environment;

ZTE Corporation provides customers with onsite supports, and also you could get supports through telephone, website, instant messenger, E-mail, etc. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved III User Manual Preface Summary This document describes ZTE MG2639 modules product principle diagram, modules PINs, hardware interface and modules structure, and instructs the users to perform hardware design of modules, and quickly and conveniently design different kinds of wireless terminals on the basis of this module. Target Readers This document mainly applies to the following engineers:

System designing engineers Mechanical engineers Hardware engineers Software engineers Test engineers This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved IV User Manual Contents 1 GENERAL DESCRIPTION OF MODULE ............................................................................... 1 1.1 INTRODUCTION OF MODULES FUNCTIONS 1.2 MODULES APPLICATION BLOCK DIAGRAM 1 2 1.3 ABBREVIATIONS 3 2 DESCRIPTIONS OF MODULES EXTERNAL INTERFACES .................................................. 6 2.1 DEFINITIONS OF MODULES INTERFACES 6 2.2 ANTENNA INTERFACE 8 2.3 ANTENNA INTERFACES RF PERFORMANCE 11 2.4 ANTENNA 11 3 MODULES ELECTRICAL CHARACTERISTICS .......................................................... 12 3.1 DESCRIPTIONS OF LEVELS OF INTERFACE SIGNALS 12 3.1.1 RESET 12 3.1.2 UART 12 3.1.3 I2C 3.1.4 SPI 12 13 3.1.5 PCM 13 3.1.6 USB 14 3.1.7 ADC 14 3.1.8 PWM 14 3.1.9 LCD 14 3.1.10 CHARGING 15 3.1.11 SIM CARD INTERFACE 15 3.1.12 AUDIO INTERFACE 16 3.1.13 NETWORK SIGNAL INDICATION 16 3.2 MODULES POWER CONSUMPTION 16 3.3 RELIABILITY CHARACTERISTICS 17 3.4 ESD CHARACTERISTICS 17 4 INTERFACE CIRCUIT DESIGN ...................................................................................... 18 4.1 RESET AND POWER DESIGN 18 This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved V User Manual 4.2 UART INTERFACE 20 4.2.1 DESCRIPTIONS OF UART1 INTERFACE 22 4.2.2 DESCRIPTIONS OF UART2 INTERFACE 23 4.3 SIM CARD INTERFACE 23 4.4 AUDIO INTERFACE 24 1.1 CHARGING INTERFACE 26 5 PCB DESIGN ................................................................................................................... 27 5.1 PCB DESIGN 27 6 MODULE BOARDS MOUNTING PROCESS AND BAKING GUIDE ........................... 28 6.1 MODULES MOUNTING PROCESS 28 6.1.1 PROCESS ROUTING SELECTION 28 6.1.2 SOLDER PASTE SELECTION 28 6.1.3 DESIGN OF INTERFACE BOARDS PAD & THICKNESSES OF GREEN OIL AND WHITE OIL AT THE MODULE ON THE INTERFACE BOARD 28 6.1.4 DESIGN OF STEEL MESH APERTURE AT THE MODULE BOARDS PAD ON THE INTERFACE BOARD 29 6.1.5 MODULE BOARDS MOUNTING 30 6.1.6 FURNACE TEMPERATURE CURVE 30 6.1.7 REFLOW METHOD 31 6.1.8 MAINTENANCE OF RETURNED DEFECTS 31 6.2 MODULES BAKING GUIDE 31 6.2.1 MODULES BAKING ENVIRONMENT 32 6.2.2 BAKING DEVICES AND OPERATION PROCEDURE 32 6.2.3 PARAMETER SETTINGS OF BAKING DEVICES 32 7 MECHANICAL DIMENSIONS ......................................................................................... 33 7.1 APPEARANCE DIAGRAM 33 7.2 MODULES ASSEMBLY DIAGRAM 34 7.3 MODULES PCB PACKAGE DIMENSIONS 35 8 DECLARATION OF CONFORMITY ............................................................................... 37 9 IMPORTANT ANNOUNCEMENT ................................................................................... 38 This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved VI User Manual Figures Figure 1-1 Modules application block diagram ................................................................................... 3 Figure 2-1 shape matching network diagram ................................................................................... 9 Figure 2-2 Antenna interface diagram ............................................................................................... 10 Figure 2-3 RF test socket dimensions ................................................................................................ 10 Figure 4-1 Power & reset circuit reference design principle diagram ................................................ 18 Figure 4-2 Power reference circuit .................................................................................................... 19 Figure 4-3 Power-on/off time sequence ............................................................................................ 20 Figure 4-4 UART interface reference design diagram ........................................................................ 21 Figure 4-5 UART1 DCEDTE connection relationship diagram ..................................................... 22 Figure 4-6 UART2 DCEDTE connection relationship diagram ........................................................ 23 Figure 4-7 SIM card circuit reference design diagram ....................................................................... 24 Figure 4-8 Audio interface circuit reference design principle diagram .............................................. 25 Figure 4-9 Charging interface circuit reference design principle diagram .......................................... 26 Figure 7-1 ZTE MG2639 appearance diagram ................................................................................... 33 Figure 7-2 Modules assembly diagram ............................................................................................. 34 Figure 7-3 Relevant package dimensions from TOP view .................................................................. 35 Figure 7-4 Relevant package dimensions from BOTTOM view ........................................................... 36 Tables Table 1-1 Modules functions .............................................................................................................. 1 Table 2-1 60pin stamp-hole definitions ............................................................................................... 6 Table 2-2 Antenna interfaces RF performance .................................................................................. 11 Table 3-1 UART interface signal definitions ...................................................................................... 12 Table 3-2 I2C interface signal definitions .......................................................................................... 12 Table 3-3 SPI Interface signal definitions .......................................................................................... 13 Table 3-4 PCM interface signal definitions ........................................................................................ 13 Table 3-5 USB interface signal definitions ......................................................................................... 14 Table 3-6 ADC interface signal definitions ......................................................................................... 14 Table 3-7 PWM interface signal definitions ....................................................................................... 14 Table 3-8 LCD interface signal definitions ......................................................................................... 14 Table 3-11 Charging interface signal definitions ............................................................................... 15 This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved VII User Manual Table 3-12 SIM card interface signal definitions ................................................................................ 15 Table 3-13 Audio interface signal definitions .................................................................................... 16 Table 3-14 ZTE MG2639 (GPRS) power consumption ....................................................................... 16 Table 3-15 ZTE MG2639 modules temperature characteristics ........................................................ 17 Table 3-16 ESD characteristics .......................................................................................................... 17 Table 4-1 Voltage characteristics ...................................................................................................... 19 Table 4-3 UART1 interface definitions .............................................................................................. 22 Table 4-4 UART2 interface definitions .............................................................................................. 23 This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved VIII User Manual 1 General description of module Developed by ZTE Corporation, ZTE MG2639 is a kind of GSM850/EGSM900/DCS1800/

PCS1900 industrial module, which can be built in the Set-Top-Box, vehicle-mounted terminals through a 60-PIN stamp-hole interface, and it allows users to send/receive Emails, browse the web pages and download at high speed anywhere and anytime. In a place where the GSM network is covered, users can get access to the Internet any time, send/receive SMS and dial/answer voice calls, etc. In the field of mobile data communication, it provides a highly free and convenient solution to users and truly realizes the dream of mobile office. This chapter mainly provides a general description of the module, including basic functions and logic block diagram. 1.1 Introduction of modules functions See the functions of ZTE MG2639 module in table 1-1:

Table 1-1 Modules functions Parameters ZTE MG2639 Frequency bands Dimensions Weight Operating temperature Limited temperature range Storage temperature Performance Operating voltage Standard power consumption Max. TX power General Features GSM850/EGSM900/DCS1800/PCS1900 30.0 25.0 x 3.0mm 7g

-40C~+80C

-40C~+80C

-40C~+80C 3.4V~4.2V Typical=: 3.8V Standby current: 24mA@-75dBm Sleep current1mA Talk Current:: 128mA@-75dBm Max. Current: 300mA@-104dBm GSM850/EGSM900: Class 4 (2W) DCS1800/PCS1900: Class 1 (1W) Rx. signal sensitivity

<-106dBm Interfaces Connector This document is not allowed to transmit without ZTE Corporations permission 60pin Stamp-hole interface ZTE CORPORATION All rights reserved 1 User Manual Parameters ZTE MG2639 Antenna SMT 50 antenna connector Integrated Full Duplex UART AT commands/Data transmission SIM card socket level 1.8V/3.0V Data service GPRS Mobile Station Max Downlink Max Uplink Protocol SMS Voice call AT Command Set Class 12 Class B 85.6kbps 42.8kbps Internal TCP/IP & UDP protocol stack Embedded FTP Support TEXT/PDU Mode Point-to-point MO/MT SMS Cell Broadcast Audio encoder HR/FR/EFR/AMR//

Echo Cancellation/Volume Control/DTMF GSM 07.05/GSM 07.07/ZTE Proprietary AT Commands 1.2 Modules application block diagram See the application block diagram of ZTE MG2639 in the following figure:

This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 2 User Manual Figure 1-1 Modules application block diagram 1.3 Abbreviations A ADC AFC AGC ARFCN ARP ASIC B BER BTS C CDMA CDG CS CSD Analog-Digital Converter Automatic Frequency Control Automatic Gain Control Absolute Radio Frequency Channel Number Antenna Reference Point Application Specific Integrated Circuit Bit Error Rate Base Transceiver Station Code Division Multiple Access CDMA Development Group Coding Scheme Circuit Switched Data This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 3 User Manual CPU D DAI DAC DCE DSP DTE DTMF DTR E EDGE EFR EGSM EMC EMI ESD ETS F FDMA FR G GPRS GSM GPS H HR I IC IMEI ISO ITU L LCD LED M MCU MMI MS MTBF P PCB PCL PCS PDU PLL PPP R RAM RF ROM Central Processing Unit Digital Audio interface Digital-to-Analog Converter Data Communication Equipment Digital Signal Processor Data Terminal Equipment Dual Tone Multi-Frequency Data Terminal Ready Enhanced Data Rate for GSM Evolution Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electro Magnetic Interference Electronic Static Discharge European Telecommunication Standard Frequency Division Multiple Access Full Rate General Packet Radio Service Global Standard for Mobile Communications Global Positioning System Half Rate Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union Liquid Crystal Display Light Emitting Diode Machine Control Unit Man Machine Interface Mobile Station Mean Time Before Failure Printed Circuit Board Power Control Level Personal Communication System Protocol Data Unit Phase Locked Loop Point-to-point protocol Random Access Memory Radio Frequency Read-only Memory This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 4 User Manual RMS RTC S SIM SMS SMT SRAM T TA TDMA TE U UART UIM USB USIM V VSWR Z ZTE Root Mean Square Real Time Clock Subscriber Identification Module Short Message Service Surface Mount Technology Static Random Access Memory Terminal adapter Time Division Multiple Access Terminal Equipment also referred it as DTE Universal asynchronous receiver-transmitter User Identifier Management Universal Serial Bus Universal Subscriber Identity Module Voltage Standing Wave Ratio ZTE Corporation This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 5 User Manual 2 Descriptions of modules external interf aces ZTE MG2639 module connects externally through a 60PIN stamp-hole interface. 2.1 Definitions of modules interf aces See the definitions of ZTE MG2639 modules 60PIN stamp-hole interface in the following table:

Table 2-1 60pin stamp-hole definitions PIN No. PIN Name Functions Default signal direction, whether or not used for GPIOX Descriptions Remarks 1 2 3 4 5 6 GND RF_ANT GND Ground RF Ground I/O Ground RF antenna plug Ground RING UART1 Output, GPIO9 Ringer signal indication GND VBAT Ground Power Input Ground Work voltage 7 RSSI_LED LED Output, GPIO58 Network signal indication The voltage varies upon an incoming call or receipt of text message. 2.8V IO 3.4~4.2V

--Need add dynatron to drive. The LED is ON at high level.

-Power on state: the LED is off;

- Network searching state: the LED blinks at 3Hz

- Idle state: the LED blinks at 1Hz

-Traffic state (call, data):

the LED blinks at 5Hz 8 9 10 11 12 13 14 15 URTS1 UART1 UCTS1 UART1 DCD1 UART1 SIM_RST SIM_CLK SIM_DATA VSIM GND SIM card SIM card SIM card SIM card Ground This document is not allowed to transmit without ZTE Corporations permission Output, GPIO47 Input, GPIO48 Output, GPIO15 Output Output I/O Output Ready to send 2.8V IO Clear to send 2.8V IO Carrier detection 2.8V IO SIM card reset SIM card clock SIM card data SIM card voltage Ground ZTE CORPORATION All rights reserved 6 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 User Manual Input Input Input Ground Battery voltage detection Charging current detection Charging power Need externally connect charging circuit Need externally connect charging circuit 4.3V~5V Output Charging ON/OFF 2.8V NC GND NC NC NC NC NC BATSNS ISENSE VCHG CHR_LDO GATDRV ADCIN NC Ground NC NC NC NC NC Charging control Charging control Power Charging control Charging control Analogue signal input Output Input URXD1/SPIM OSI UART1/SPI Input, GPIO20 UTXD1/SPIMI SO UART1/SPI Output GPIO21 SYSRST_N EAR_L RECP RECN MIC_P1 MIC_P0 MIC_N0 Reset Analogue audio Analogue audio Analogue audio Analogue audio Analogue audio Analogue audio Input Output Output Output Input Input Input Charging dynatron control ADC voltage detection Receiving data for serial port, UART1 can be used as SPI interface when not used Port sending, UART1 can be used as SPI interface when not used Reset signal Earpiece speaker anode Receiver speaker anode Receiver speaker cathode Earpiece MIC anode Receiver MIC anode Receiver MIC cathode Need externally connect charging circuit 0~2.8V 2.8V IO 2.8V IO Valid at low level 38 PWRKEY_N Power key Input Power on/off Valid at low level; need external connect a open-collector or open-drain switch. 39 40 41 42 DTR1 UART1 DSR1 VDDIO GND UART1 LDO output Ground This document is not allowed to transmit without ZTE Corporations permission Input, GPIO5 Output, GPIO19 Output Data terminal ready _WAKEUP 2.8V IO Data set ready 2.8V IO 2.8V Ground ZTE CORPORATION All rights reserved 7 User Manual 43 44 45 46 47 48 49 50 51 52 URXD2 UART2 UTXD2 UART2 USB_DM USB_DP USB USB LSDA0 Serial LCD LSCE0B0 Serial LCD LSRSTB Serial LCD LSCK0 Serial LCD LSDI0 Serial LCD LSA0DA0 Serial LCD Input, GPIO22 Output, GPIO23 I/O I/O Output GPIO38 Output GPIO40 Output GPIO46 Output GPIO37 Input GPIO39 Output GPIO36 53 SDA28/SPICS I2C/SPI I/OGPIO2 SCL28/SPISC K I2C/SPI Output GPIO1 PWM/EARDE T PWM output PCMRST PCM reset PCMOUT PCMCLK PCM PCM 59 PCMSYNC PCM 60 PCMIN PCM Output GPIO0 Output GPIO56 Output GPIO54 Output GPIO50 Output GPIO55 Input GPIO53 54 55 56 57 58 Receiving data from serial port Transmitting data from serial port USB data -

USB data +

Serial LCD data cable data0 Serial LCD enabled 2.8V IO 2.8V IO 1.8V IO 1.8V IO Serial LCD reset 1.8V IO Serial LCD clock cable Serial LCD data cable input Serial LCD data cable1 I2C data cable, also used for SPI chip select I2C clock cable, also used for SPI clock;

PWM output, PWM can be used as earpiece insert detection when not used Reset external PCM settings 1.8V IO 1.8V IO 1.8V IO 2.8V IO 2.8V IO 2.8V IO 2.8V IO PCM data output 2.8V IO PCM clock 2.8V IO PCM bytes SYNC 2.8V IO PCM data input 2.8V IO 2.2 Antenna Interf ace Regarding the antenna of ZTE MG2639 module, proper measures should be taken to reduce the access loss of effective bands, and good shielding should be established between external antenna and RF connector. Besides, external RF cables should be kept far away from all interference sources such as high-speed digital signal or switch power supply. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 8 User Manual According to the standard for mobile devices, the stationary wave ratio of ZTE MG2639 modules antenna should be between 1.1 and 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the antennas gain. Generally, the larger gain in the band and smaller outside the band, the better performance the antenna has. Isolation degree among ports must more than 30dB when multi-ports antenna is used. For example, between two different polarized ports on dual-polarized antenna, two different frequency ports on dual-frequency antenna, or among four ports on dual-polarized dual-frequency antenna, isolation degree should be more than 30dB. ZTE MG2639 module provides both GSM, and either interface provides both RF socket and stamp-hole connection method; therefore users can select reasonably according to the product form to optimize the cost of BOM. Scenario 1 PIN2 and PIN16 are respectively used as the input pin for GSM. Pay attention to the following when using it as the antennas feed PIN:

1 The feed connected to PIN2 or PIN 16 is 50ohm micro-strip or strip line. To approach the module, put shape matching network for later tuning. See shape matching network in the diagram below:

Figure 2-1 shape matching network diagram 2The RF wires must be kept away from the GND, and generally the distance should be 3 times of the width of RF wires. 3Its forbidden to put some interference sources such as DC to DC, WIFI module around RF wires or RF port. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 9 Scenario 2:

User Manual When using GSM RF socket as the antenna feed, disconnect PIN2 from the main board and make sure there are some empty areas below or around PIN2. Keep 2mm distance between the surface of PIN2 and GND, and drill holes below PIN2. Its not suggested to use the compatible design of PIN2 at the same time when using the RF connector. Figure 2-2 Antenna interface diagram Figure 2-3 RF test socket dimensions This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 10 2.3 Antenna interf aces RF perf ormance See the antenna interfaces RF performance in table 2-2:

Table 2-2 Antenna interfaces RF performance User Manual Antenna interfaces RF performance GSM850 EGSM900 DCS1800 PCS1900 Modules uplink MS->BTS Modules downlink BTS->MS Max. Tx. Power dBm Antenna interfaces Rx. sensitivity 824MHz-849MHz 880MHz-915MHz 1710MHz-1785MHz 1850MHz-1910MHz 869MHz-894MHz 925MHz-960MHz 1805MHz-1880MHz 1930MHz-1990MHz 332 332 292 292

< -107dBm

< -107dBm

< -106dBm

< -106dBm 2.4 Antenna It is recommended to use an external antenna 50 ohm impedance or sucker rod antenna, the antenna gain requirement in -5 dbi to 5 dbi, generally requires the use of -5 dbi antenna. Antenna installation using distance away from the human body must keep a distance of more than 20 cm, in case of electromagnetic radiation. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 11 User Manual 3 Modules electrical characteristics The chapter mainly describes the modules electrical characteristics, including the level, power consumption, reliability of modules interfaces. 3.1 Descriptions of levels of interface signals It describes the MAX, MIN and typical value of the level of modules external interfaces. 3.1.1 Reset The reset PIN is pulled up to 2.8VVmax=2.9VVmin=2.7VTypical=2.8Vthrough the resistance inside the module. The SYSRST_N PIN is used to reset the modules main chipset. Pull down the SYSRST_N signal 500ms to reset the module. 3.1.2 UART ZTE MG2639 module provides three serial interfaces. The UART1 supports 8-wire serial BUS interface (see signal definitions in table 4-3); while UART2 supports 2-wire serial interface only. The module can communicate externally and input the AT commands through the UART interface. Table 3-1 UART interface signal definitions Classification UART1 UART2 No. 29 30 43 44 Definitions I/O Description Remarks URXD1 UTXD1 URXD2 UTXD2 Output Receiving data from serial port Input Transmitting data from serial port Output Receiving data from serial port Input Transmitting data from serial port 2.8V IO 2.8V IO 2.8V IO 2.8V IO 3.1.3 I2C ZTE MG2639 module provides one I2C BUS interface. SCL and SDA have been pulled up to 2.8V through 2.2K resistance inside the module, and it supports 7BIT/10BIT seeking and high-speed transmission mode. Classification No. Definitions I/O Description Remarks Table 3-2 I2C interface signal definitions This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 12 User Manual I2C 53 54 SDA SCL I/O Output I2C data cable I2C clock cable 2.8V IO 2.8V IO Note: the software doesnt support this interface by default, therefore it requires customization. 3.1.4 SPI ZTE MG2639 module provides one SPI BUS interface, SPICS & SPISCK signal multiplex with the I2C interface, while SPIMOSI & SPIMISO signals multiplex with the UART interface. When UART2 and I2C function are not used, it can be configured as the SPI interface. Table 3-3 SPI Interface signal definitions Classification No. Definitions I/O Description Remarks SPI 53 54 29 30 SPICS SPISCK SPIMOSI SPIMISO Output Output Input Output SPI chip select SPI clock SPI data input SPI data output 2.8V IO 2.8V IO 2.8V IO 2.8V IO Note: the software doesnt support this interface by default, therefore it requires customization. 3.1.5 PCM ZTE MG2639 module adopts its 56-60 PINs as the PCM interface, through which users can expand the audio DAC. Table 3-4 PCM interface signal definitions Classification No. Definitions I/O Description Remarks PCM 56 57 58 59 60 PCMRST Output PCMOUT PCMCLK PCMSYNC PCMIN Output Output Output Input Reset external PCM settings PCM data output PCM clock PCM bytes SYNC PCM data input 2.8V IO 2.8V IO 2.8V IO 2.8V IO 2.8V IO Note: the software doesnt support this interface by default, therefore it requires customization. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 13 3.1.6 USB User Manual ZTE MG2639 module integrates the USB interface and conforms to USB1.1 interface specifications. The module can connect the host through the interface and provide up to 12Mbps data rate. Users can upgrade the software via the interface. Table 3-5 USB interface signal definitions Classification No. Definitions USB 45 46 USB_DM USB_DP I/O I/O I/O Description USB data -

USB data +

Remarks 3.1.7 ADC MG2639 modules 28th pin can provide up to 98.1 KSPS sampling rate and 10BIT A/D conversion function. Table 3-6 ADC interface signal definitions Classification No. Definitions ADC 28 ADCIN I/O Input Description Remarks Analogue signal input 0-2.8V Note: the software doesnt support this interface by default, therefore it requires customization. 3.1.8 PWM Table 3-7 PWM interface signal definitions Classification No. Definitions I/O PWM 55 PWM output Description Pulse width modulation output Remarks 2.8V IO Note: the software doesnt support this interface by default, therefore it requires customization. 3.1.9 LCD ZTE MG2639 module provides a serial LCD interface and supports the LCD device with serial communication. It supports up to 480*320 resolutions. Table 3-8 LCD interface signal definitions This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 14 User Manual Classification No. Definitions I/O Description Remarks LCD 47 48 49 50 51 LSDA0 Output LSCE0B0 LSRSTB LSCK0 LSDI0 Output Output Output Output 52 LSA0DA0 Output Serial LCD data cable data0 Serial LCD enabled Serial LCD reset Serial LCD clock cable Serial LCD data cable input Serial LCD data cable data1 Note: the software doesnt support this interface by default, therefore it requires customization. 3.1.10 Charging ZTE MG2639 module provides the charging of Li battery through the design of external circuits. See section 4.5 for external reference design. Table 3-11 Charging interface signal definitions Classification No. Definitions I/O Description Remarks Charging 23 24 25 26 27 BATSNS Input Charging control ISENSE Input Charging control Battery voltage detection Battery current detection Charging power supply VCHG CHR_LDO Input Output Power Charging control Charging on/off GATDRV Output Charging control Charging dynatron control Note: the software doesnt support this interface by default, therefore it requires customization. 3.1.11 SIM card interface ZTE MG2639 module supports the SIM card interface conforming to ISO 7816-3 standard, and it supports SIM cards with two different standards: 1.8V and 3.0V. Users should note that the SIM cards electrical interface should be defined exactly the same as the SIM card socket. Table 3-12 SIM card interface signal definitions Classification No. Definitio I/O Description Remarks ns This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 15 SIM User Manual 14 11 12 13 VSIM SIM_RST SIM_CLK SIM_DATA Output Output Output I/O SIM card voltage SIM card reset SIM card clock SIM card data 1.8V/3V, Max. output current 30 mA 3.1.12 Audio interface ZTE MG2639 module supports 2CH audio signal inputs/outputs. The two MIC inputs are internally capacitive coupled with the offset voltage, and directly connected to the receiver. See the audio interface signals in the table 3-2:

Table 3-13 Audio interface signal definitions Classification No. Definition 37 36 35 34 33 32 MIC_N0 MIC_P0 MIC_P1 RECN RECP EAR_L AUDIO Remarks I/O Description Input Receiver on the host Input Receiver on the host Receiver on the earpiece Differential input Input Speaker on the host Output Output Speaker on the host Speaker on the earpiece Output Differential input Differential output Single-ended output 3.1.13 Network signal indication The RSSI_LED is driven at high level.

---Power-on status: the LED turns off;

---Network searching status: the LED blinks at 3Hz;

---Idle status: the LED blinks at 1Hz;

---Traffic status (call, data): the LED blinks at 5Hz. The output status of RSSI_LED PIN is defined according to the software protocol. The RSSI_LED PIN is a general I/O port with the output driving capability 4mA. 3.2 Modules power consumption It describes the modules power consumption under each status:

Table 3-14 ZTE MG2639 (GPRS) power consumption Status Power-off Sleep Frequency Rx. power Min. Standby Call GSM850 EGSM900 Average 15uA 2mA 24 mA 240mA 240mA Max. Remarks VBAT=4.0V This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 16 User Manual GSM1800 GSM1900 Network searching 180 mA 175 mA 78mA 3.3 Reliability characteristics The modules reliability testing items include: High/low temperature operation, high/low temperature storage, thermal shock, alternating temperature humidity, etc. The test results must conform to the industrial requirements. See the modules working temperature in the table below:

Table 3-15 ZTE MG2639 modules temperature characteristics Parameters Descriptions Min. Max. Remarks To Operation temperature

-30 70 Ta Limited temperature

-35

+75 Make sure not to compromise the RF performance apparently Ts Storage temperature

-35

+75 3.4 ESD characteristics See the ESD characteristics at room temperature. Table 3-16 ESD characteristics Interface Testing items Testing requirements Performance Air discharge 8 kV Nothing unusual Contact discharge 6 kV Nothing unusual Air discharge 8 kV Nothing unusual Contact discharge 6 kV Nothing unusual Antenna interface SIM card interface This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 17 User Manual 4 Interface circuit design The chapter provides the reference design on the interface circuit according to the modules functions and describes the precautions. 4.1 Reset and power design See the reference design principle of power and reset circuit in figure 4-1. Select appropriate parameters according to the actual selected power supply since VD1 is TVS tube, and select CJ2305 from Changjiang Electronics or DMP2305U-7 from DIODES since VT1 is MOS tube. Refer to figure 4-2 for the design of power circuit. Select MIC29302 and adjust the output voltage through the adjustment of R5 and R6. Please refer to MIC29302s specification for detailed parameters design. Please note that the components in the figure are just for your reference. For details, please adjust according to the actual circuit. Figure 4-1 Power & reset circuit reference design principle diagram This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 18 VD1TVSC1C222ufC3100ufVT1R115kVBATC40.1ufMCU_ON/OFFR24.7KMCU_RESETSYSRST_NPWRKEY_NR34.7K User Manual Figure 4-2 Power reference circuit Power design ZTE MG2639 module is powered by VBAT. If the external power cannot be stably started, its recommended to add buffer circuit in the circuit. See the modules required voltage characteristics in table 4-1. Table 4-1 Voltage characteristics Classification Input voltage Input current Vmin 3.4V 1mA Typical 3.8V

--

Vmax 4.2V 300mADepends on the network signal The module is very strict with the requirements on the power supply and grounding:

(1). The filtering must be performed on the power and grounding, and the power ripple must be controlled under 50Mv. Do not power any other part in the system because it might affect the RF performance.

(2). Select the power cables with at least 80mil traces during the layout and keep the integrality of ground line.

(3). Make sure the Max. instantaneous output current is larger than 2A if the Max. input current is very high. Power on The module is under power-off status after its normally powered on. To turn on the module, provide a 2s-5s low level pulse to the PWRKEY_N PIN. If one 1K resistance is connected with the PWRKEY_N PIN, the module can be automatically powered on after connected to the power supply. Power off To turn off the module, use AT command AT+ZPWROFF or provide a 2s~5s low level pulse to the PWRKEY_N PIN. Reset Use the above method to firstly power-off and then power-on to hard reset the module. If the external reset function has to be used, provide a low level pulse lasting at least 500ms to the SYSRST_N PIN within 2 seconds after the module is turned on. Before that, the external MCU_RESET signal must be kept at low level. See the reset circuit design in figure 4-1. Suspend the SYSRST_N PIN if not used. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 19 R52.2KR61KC60.1uFC8100uFC70.1uFR410KC510uFD1MIC29302GNDTAB/SHUTINOUTSENSEVBAT User Manual See the modules power-on/off time sequence in figure 4-3 below:

Figure 4-3 Power-on/off time sequence VDDIO The module has one LDO voltage output pin, which can be used to supply external power to the main board. The voltage output is available only when the module is on. The normal output voltage is 2.8V, and users should absorb the current from this pin as little as possible (less than 10mA). Generally, it is recommended to use this pin to pull up the chipset PIN as per the requirements of level matching. Therefore, its not recommended to use this pin for other purposes. Other advice In order to make sure the data is saved safely and guarantee the safety of modules data, please dont cut off the power when the module is on. 4.2 UART interface ZTE MG2639 module provides an integrated full duplex UART1 interface (shortly referred to as UART interface) and an accessorial UART2 interface. The default baud rate is 115200bps and the external interface adopts 2.8V CMOS level signal, which conforms to RS-232 interface protocol. The UART1 interface could be used as serial interface for AT commands, data service. The UART2 interface can be used to debug the applications. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 20 User Manual ZTE MG2639 modules output I/O level is 2.8V, therefore it needs level conversion when connecting with standard 3.3V or 5V logic circuitsuch as MCU or RS232 drive chip MAX3238. The most common method is to use a dynatron to realize the level conversion. Figure 4-3 shows the level conversion to 3.3V through the UART interface of ZTE MG2639. The resistance and capacitance in figure 4-3 are just for reference, and they need to be recalculated during the design. The diode in Figure 4-4 is Schottky diode (forward voltage drop is 0.3V). If you select other diodes, please select one with lower forward voltage drop to make sure RXD_2V8 is below the threshold when inputting low level. Figure 4-4 UART interface reference design diagram This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 21 VDDIOTXD_2V833.2K1KVCC(3.3V)TXD_3V322pF10KRXD_3V3100pFRXD_2V8VDDIO User Manual 4.2.1 Descriptions of UART1 interface Figure 4-5 UART1 DCEDTE connection relationship diagram See the definitions of UART1 interface in table 4-3. Table 4-3 UART1 interface definitions Classification No. Definitions I/O Descriptions Remarks UART 29 8 30 39 9 4 40 10 RXD1 RTS1 TXD1 DTR1 Input Receiving data DTE transmits serial data Output Ready to send DTE informs DCE to send Output Transmitting data DTE receives serial data Input Data terminal ready DTE is ready CTS1 Input Clear to send DCE has switched to Rx. mode RING Output Ringtone indication Inform DTE upon a remote call DSR1 DCD1 Output Data set ready DCE is ready Output Carrier detection Data link connected This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 22 User Manual 4.2.2 Descriptions of UART2 interface Figure 4-6 UART2 DCEDTE connection relationship diagram See the definitions of UART2 interface in table 4-4. Table 4-4 UART2 interface definitions Classification No. Definitions I/O Descriptions Remarks UART 43 44 RXD2 TXD2 Input Receiving data DTE transmits serial data Output Transmitting data DTE receives serial data 4.3 SIM card interface ZTE MG2639 module supports 1.8V or 3.0V SIM card. Refer to figure 4-7 for design. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 23 User Manual Figure 4-7 SIM card circuit reference design diagram NOTE:

(1) The SIM card PCB wiring should be laid closely around the module as much as possible.

(2) The VSIM, CLK, DATA and RST signals should be enveloped by the ground wires. The position of 33pF capacitance should be reserved on CLK, DATA and RST signals wiring and the position should be close to the SIM card socket to prevent the interference sources from affecting the SIM cards reading/writing.

(3) Since the ESD components are very close to the SIM card socket, its recommended to add TVS components on 4-CH SIM card signals, meanwhile, the signal wires need go through TVS component before entering the modules baseband processor during the layout to avoid damaging the module.

(4) The width of VSIM power wiring should be above 6mil at least (recommended to use 8mil).

(5) The filter capacitance of VSIM power wiring adopts 1uf (the value cant be larger than 10uf or smaller than 1uf), and then 0.1uf capacitance is added. 4.4 Audio interface ZTE MG2639 module provides audio input and output interfaces through its PINs. There are 2 Speaker interfaces and 2 Microphone interfaces. Only one pair I/O works at the same time. See the audio interface circuit in figure 4-8. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 24 User Manual Figure 4-8 Audio interface circuit reference design principle diagram Microphone The MIC_N0 & MIC_P0 are both differential interfaces, and they can also be used for single-ended input. Its recommended to use differential method to reduce the noises. The MIC2_P interface is used for single-ended input. Directly connect to the microphone since these two inputs are internally coupled and 1.9V offset voltage is generated. Speaker The RECP & RECN are both differential interfaces with 32 ohm impedance, while the EAR_L is single-ended interface with 32 ohm impedance. GSM/GPRS module audio interface is designed as below:

Design of the audio interface on the receiver Select the microphone with the sensitivity lower than -51.5dB since the max. gain inside MIC0 can reach 51.5dB. The level of MIC1_P0 is about 1.48V Note: if other kind of audio input method is adopted, the dynamic range of input signals should be within 0.5V. If the dynamic range is lower than 0.5V, then the pre-amplifier should be added. If the dynamic range is higher than 0.5V, then network attenuation should be added. Design of the audio interface on the earpiece This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 25 User Manual Select the microphone with the sensitivity lower than -51.5dB since the max. gain in MIC1 can reach 51.5dB. The level of MIC_P1 is about 1.73V. Note: In order to get better audio effect for users, we present the following suggestions:

1During the process of using ZTE MG2639 module, its advised to use 100pf & 33pf capacitance on its external audio path, and serially connect with the beads to improve the audio quality. 2Connect TVS tube or pressure sensitive resistance on the audio path (approaching the modules interface) to prevent the ESD from damaging the module. 3Make sure the use environment and module are well grounded and there is no mutual influence. 4The power ripple supplied to the module is less than 50mV. 1.1 Charging interface The PINs used for ZTE MG2639 modules charging interface are 23-27 PINs. See the charging external connection in the figure below: D3 adopts CJ10P20DE6G or MBT35200MT1; VT1 adopts 2SK3019, NTA4001NT1 or SSM3K15FS; R1 is 0.2 current inspection resistance, which requires 1206 encapsulation. Figure 4-9 Charging interface circuit reference design principle diagram This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 26 User Manual 5 PCB design 5.1 PCB design 1Enough Pad area must be reserved for the modules grounding pin to guarantee adequate grounding and avoid interference on the sensitivity. 2Copper-clad and wiring are forbidden in the nearby areas of the RF stamp-hole. 3For the convenience of testing and maintenance, it is recommended to drill holes on the PCB to expose JTAG test points. 4The wiring between the SIM card socket and MCU should be as short as possible to prevent signals from being affected by long wiring, which might result in the failure of SIM card recognition. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 27 User Manual 6 Module Boards Mounting Process and Baking Guide 6.1 Modules mounting process Now with the increasing number of module board products in our company, customers have encountered numerous welding problems of module boards during the process of using the products. Therefore, we specially formulate the guide to the module boards mounting process for customers in order to ensure the FTT of soldering at the client-end. The current standard of flatness in our company is 0.15mm (measurement method: put the module at the marble surface, use the feeler gauge to measure the clearance width at the maximum cocked position. Do not exert a force on the module during the measurement). If there is any question, please contact the relevant staff in our company. The module must be baked at 125 for 8 hours prior to second reflow. 6.1.1 Process Routing Selection As our module boards are manufactured with the lead-free technology and meet the ROHS requirements, we recommend that the lead-free manufacturing process should be used upon the selection of process routing for module board and interface board. 6.1.2 Solder Paste Selection The solder pastes with metal particle TYPE3 and TYPE4 can fulfill the welding requirements. It is accordingly recommended to use the no-clean solder paste. If the solder paste which needs cleaning is used, we cannot guarantee the components on the module board could withstand the washing of the cleaning solvents. This might cause the functional problems of such components and affect the appearance of the module. Make sure the thickness of solder paste at the modules PAD is between 0.18mm and 0.2mm during the printing. 6.1.3 Design of interface boards PAD & thicknesses of green oil and white oil at the module on the interface board For the design of interface boards pad, please refer to the standard pad design recommended by ZTE Mobile Telecom Co., Ltd. It is recommended that the sum of the thickness of the green oil and white oil at the module on the interface board should be less than 0.02mm because the greater thickness would affect the welding quality of module board and interface board. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 28 User Manual Thicknesses of White Oil and Green Oil

(The diagram is just for your reference; it does not represent the actual module encapsulation) In addition, other components cannot be arranged within 2mm around the module on the interface board to ensure the maintenance of the module. 6.1.4 Design of steel mesh aperture at the module boards pad on the interface board The thickness of the steel mesh on the interface board is selected based on the principle of comprehensive consideration according to the encapsulation type of components on the interface board. The expected thickness of steel mesh at the module on the interface board is 0.15mm (locally increased to 0.18MM at the module position), or just 0.18mm. In respect of the steel mesh aperture, the inner side of the pad is cut by 0.3mm, the two sides are respectively cut by 0.1mm, and the outside is extended by 0.5mm. 0.1MM 0.1M M Steel Mesh Mouth Module Pad on PCB 0.5MM 0.3MM This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 29 User Manual 6.1.5 Module Boards Mounting The pallets, which are suitable for mounting, have been made for many modules. If our company has offered the pallets, customers can directly apply them in Pick & placement machine; otherwise, customers need make a loading tool similar to the pallet. Customers can take out the modules from the packaging box, put them into the pallet according to the sequence and direction, and then start mounting. Loading pallet Mounting Pressure: In order to ensure a good contact between the module and the tin of the interface board, and the convenient welding, the pressure of placing the module board on the interface board is 2-5N according to our experiences. Different modules have different numbers of pads, therefore the pressure selected are different. Customers can select proper pressure based on their own situations. 6.1.6 Furnace Temperature Curve As for the furnace temperature curve of module, we recommend that the peak temperature should be about 240~245C. The time of the temperature above 217C is 30~60 seconds. Besides, the temperature at the preheating area is kept at 150~200C, and the time is 60~120 seconds. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 30 User Manual The furnace temperature test board must be a physical board mounted on the interface board, and there must be the testing wires at the module board. 6.1.7 Reflow Method If the interface board used by customers is a double-sided board, it is recommended to mount the module board at the second time. In addition, it is preferable for the interface board to reflow on the mesh belt at the first mounting and the second mounting. If such failure is caused by any special reason, the fixture should be also used to reflow in order to avoid the deformation of PCB during the reflow process. 6.1.8 Maintenance of Returned Defects If any poor welding occurs to the module board and the interface board, e.g., pseudo soldering of the module board and the interface board, the welder can directly use the soldering iron to repair welding according to the normal welding parameters of our company 6.2 Modules Baking Guide The module must be baked prior to second reflow. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 31 User Manual 6.2.1 Modules Baking Environment The operators must wear dust-free finger cots and anti-static wrist strap under the lead-free and good static-resistant environment. See the following environment requirements. During the process of transportation, storage and disposal, you must conform to the IPC/JEDE J-STD-033 standard. 6.2.2 Baking Devices and Operation Procedure Baking device: any oven where the temperature can rise up to 125C or above. Precautions regarding baking: during the baking process, the modules should be put in the high-temperature resistant pallet flatly and slightly to avoid the collisions and frictions between the modules. During the baking process, do not overlay the modules directly because it might cause damage to the modules chipset. 6.2.3 Parameter Settings of Baking Devices Baking temperature: 1255 Baking duration: 8 hours This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 32 User Manual 7 Mechanical dimensions 7.1 Appearance diagram Figure 7-1 ZTE MG2639 appearance diagram Dimensions (LWH)30.0 25.0 3.0mm Weight: <6g This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 33 7.2 Modules assembly diagram See the modules assembly diagram in figure 7-2. User Manual Figure 7-2 Modules assembly diagram This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 34 7.3 Modules PCB package dimensions See the modules PCB package dimensions in figure 7-3. Figure 7-3 Relevant package dimensions from TOP view User Manual This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 35 User Manual Figure 7-4 Relevant package dimensions from BOTTOM view This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 36 User Manual 8 Declaration of Conformity We ZTE CORPORATION ZTE Plaza, Keji Road South, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P.R. China Declare under our sole responsibility that the product ZTE MG2639 To which this declaration relates, is inconformity with the following standards EN 301 511 V9.0.2;

EN 301 489-1 V1.9.2; EN 301 489-7 V1.3.1; EN 55022:2010; EN 55024:2010;

EN 50385:2002; EN 50383:2002;

EN 60950-1:2006+A11:2009+A1:2010+A12:2011 We hereby declare that [all essential radio test suites have been carried out and that] the above named product is in conformity to all the essential requirement of Directive 1999/5/EC. The conformity assessment procedure referred to in Article 10 and detailed in Annex [III] or [IV]

of Directive 1999-5-EC has been followed with the involvement of the following Notified Body (ies):

PHOENIX TESTLAB Gm bH, Konigswinkel 10, D-32825 Blomberg, Germany Identification mark : CE0700 The device complies with RF specifications when the device used at 20 cm form your body. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 37 User Manual 9 Important announcement FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. IMPORTANT NOTE This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for a population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the users authority to operate this equipment. USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the users authority to operate this equipment. If the size of the end product is smaller than 810cm, the additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following Contains TX FCC ID:

SRQ-MG2639. If the size of the end product is larger than 810cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. This document is not allowed to transmit without ZTE Corporations permission ZTE CORPORATION All rights reserved 38