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L830-EB-11 Hardware User Manual Version: V1.0.2 Update date: 2017.09.21 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EBHardware User Manual Page 1 of 39 Applicability Table No. Product model Description 1 L830-EB-11 NA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 2 of 39 Copyright Copyright 2017 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Version Record Version Update Remark V1.0.0 2017.04.25 Initial version V1.0.1 2017-09-21 1. Update timing of power on/off and reset 2. Modify the RF Band 3. Modify the packing description Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 3 of 39 Contents 1 Preface....................................................................................................................................................................6 1.1 Introduction.....................................................................................................................................................6 1.2 Reference Standard......................................................................................................................................6 1.3 Related Documents...................................................................................................................................... 6 2 Overview.....................................................................................................................................................................7 2.1 Introduction.....................................................................................................................................................7 2.2 Specification...................................................................................................................................................7 2.3 Application Framework.................................................................................................................................8 2.4 Hardware Framework................................................................................................................................... 9 3 Application Interface.................................................................................................................................................9 3.1 M.2 Interface.................................................................................................................................................. 9 3.1.1 Pin Map............................................................................................................................................. 10 3.1.2 Pin Definition.....................................................................................................................................11 3.2 Power Supply...............................................................................................................................................14 3.2.1 Power Supply................................................................................................................................... 15 3.2.2 Logic level......................................................................................................................................... 16 3.2.3 Power Consumption........................................................................................................................16 3.3 Control Signal.............................................................................................................................................. 17 3.3.1 Module Start-Up...............................................................................................................................17 3.3.1.1 Start-up Circuit................................................................................................................................................17 3.3.1.2 Start-up Timing Sequence............................................................................................................................ 18 3.3.2 Module Shutdown............................................................................................................................19 3.3.3 Module Reset................................................................................................................................... 20 3.4 USB Interface...............................................................................................................................................21 3.4.1 USB Interface Definition................................................................................................................. 21 3.4.2 USB Interface Application.............................................................................................................. 21 3.5 USIM Interface.............................................................................................................................................22 3.5.1 USIM Pins......................................................................................................................................... 22 3.5.2 USIM Interface Circuit.....................................................................................................................23 3.5.2.1 N.C. SIM Card Slot........................................................................................................................................ 23 3.5.2.2 N.O. SIM Card Slot........................................................................................................................................ 23 3.5.3 USIM Hot-Plugging..........................................................................................................................24 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 4 of 39 3.5.4 USIM Design.................................................................................................................................... 25 3.6 Status Indicator............................................................................................................................................25 3.6.1 LED#1 Signal....................................................................................................................................26 3.6.2 WOWWAN#......................................................................................................................................26 3.7 Interrupt Control.......................................................................................................................................... 27 3.7.1 W_DISABLE1#.................................................................................................................................27 3.7.2 Body SAR..........................................................................................................................................28 3.8 Digital Audio................................................................................................................................................. 28 3.8.1 I2S Mode...........................................................................................................................................28 3.8.2 PCM Mode........................................................................................................................................29 3.9 I2C Interface Description........................................................................................................................... 29 3.10 Clock Interface.......................................................................................................................................... 30 3.11 Configuration Interface.............................................................................................................................30 3.12 Other Interfaces........................................................................................................................................ 31 4 Radio Frequency.................................................................................................................................................... 31 4.1 RF Interface................................................................................................................................................. 31 4.1.1 RF Interface Functionality.............................................................................................................. 31 4.1.2 RF Connector Characteristic......................................................................................................... 31 4.1.3 RF Connector Dimension...............................................................................................................32 4.2 Operating Band........................................................................................................................................... 33 4.3 Transmitting Power..................................................................................................................................... 33 4.4 Receiver Sensitivity.................................................................................................................................... 33 4.5 GNSS............................................................................................................................................................ 34 4.6 Antenna Design........................................................................................................................................... 34 5 Structure Specification...........................................................................................................................................35 5.1 Product Appearance...................................................................................................................................35 5.2 Dimension of Structure...............................................................................................................................35 5.3 M.2 Interface Model....................................................................................................................................36 5.4 M.2 Connector............................................................................................................................................. 37 5.5 Storage..........................................................................................................................................................37 5.5.1 Storage Life...................................................................................................................................... 37 5.6 Packing......................................................................................................................................................... 37 5.6.1 Tray Package....................................................................................................................................38 5.6.2 Tray size............................................................................................................................................ 39 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 5 of 39 1 Preface 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L830-EB (hereinafter referred to as L830). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L830 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards:
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission and reception (FDD);Part 1: Conformance specification 3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 21.111 V10.0.0: USIM and IC card requirements 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM) application 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT) 3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE) PCI_Express_M.2_Specification_Rev1.1 Related Documents 1.3 RF Antenna Application Design Specification L8-Family System Driver Integration and Application Guidance L8-Family AT Commands Manual Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 6 of 39 EU Regulator Conformance Hereby, We, Fibocom Wireless Inc. declares that the radio equipment type L830-EB-11 is in compliance with the Directive 2014/53/EU. In all cases assessment of the final product must be mass against the Essential requirements of the Directive 2014/53/EU Article 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2 requirements. External antenna is used with the module during the testing process, the maximum antenna gain for frequency < 1G is 3dBi, for frequency > 1G is 5dBi and the antenna separation distance is 20cm. EU Declaration of Conformity (DoC) Hereby, Name of manufacturer: Fibocom Wireless Inc. Address:
City:
Country:
5/F, Tower A, Technology Building II, 1057 Nanhai Blvd, Nanshan, Shenzhen, China declares that the DoC is issued under its sole responsibility and that this product:
Product description:
Type designation(s):
Trademark:
Product Identification Element is in conformity with the relevant Union harmonization legislation:
Radio Equipment directive: 2014 / 53 / EU. LTE module L830-EB-11 Fibocom L830-EB-11 with reference to the following standards applied:
1. Health (Article 3.1(a) of Directive 2014/53/EU) Applied Standard(s):
EN 62311 : 2008 2. Safety (Article 3.1(a) of Directive 2014/53/EU) Applied Standard(s):
EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013 3. Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU) Applied Standard(s):
Draft EN 301 489-1 V2.2.0 / -52 V1.1.0 4. Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU) Applied Standard(s):
EN 301 908-1 V11.1.1 / -2 V11.1.1 / -13 V11.1.1 The Notified Body SIEMIC INC. with Notified Body number 2200 performed:
Modules: B+C and issued the EU-type examination certificate. Signed for and on behalf of:
Date:
City:
Name:
Title:
September 7, 2017 Shenzhen, Alan Yu Test Director Signature:
Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that Increase the separation between the equipment and receiver. to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions:
1) External antenna is used with the module during the testing process, the maximum antenna gain for External antenna is used with the module during the testing process, the maximum antenna gain frequency<1G is 3dBi, for frequency>1G is 5 dBi and the antenna separation distance is 20cm. for frequency>1G is 5 dBi and the antenna separation distance is 20cm. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID:
The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. ZMOL830EB11 2 Overview 2.1 Introduction The L830 is a highly integrated 4G cellular module which uses the standard PCIe M.2 interface.It supports LTE FDD/WCDMA mode cellular communication. 2.2 Specification Specification LTE FDD: Band 1,3,7,8,20,28,32 Operating Band WCDMA/HSPA+: Band I, VIII CA GPS/GLONASS: Not Support 1 +3,7,20 LTE inter-band CA 3 +7,8,20,28,32 7 +20,28 LTE intra-band CA 3,7 LTE FDD 300Mbps DL/50Mbps UL(Cat 6) Data Transmission UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6) Power Supply DC 3.135V4.4V, Typical 3.3V Normal Operating temperature-10C +55C Temperature Extended Operating temperature-30C +65C Storage temperature-40C +85C Interface: M.2 Key-B Dimension30 x 42 x 2.3mm Weight: About 5.8 g Physical characteristics Interface Antenna Connector WWAN Main Antenna x 1 WWAN Diversity Antenna x 1 Function Interface USIM 3V/1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 7 of 39 USB 2.0 x 1 I2S I2C EINTSystem Indicator Clock Software Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands Firmware update USB Note When temperature goes beyond normal operating temperature range of -10C~+55C, RF performance of module may be slightly off 3GPP specifications. 2.3 Application Framework The peripheral applications for L830 module are shown in Figure 2-1:
Figure2-1 Application Framework Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 8 of 39 2.4 Hardware Framework The hardware framework in Figure 2-2 shows the main hardware functions of L830 module, including baseband and RF functions. Baseband contains the followings:
UMTS/LTE FDD controller/Power supply NAND/internal LPDDR2 RAM Application interface RF contains the followings:
RF Transceiver RF Power/PA RF Front end RF Filter Antenna Connector Figure 2-2 Hardware Framework 3 Application Interface 3.1 M.2 Interface The L830 module uses standard M.2 Key-B interface, with a total of 75 pins. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 9 of 39 3.1.1 Pin Map Figure 3-1 Pin Map Note:
Pin Notch represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 10 of 39 3.1.2 Pin Definition The pin definition is as follows:
Pin Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 2
+3.3V 3 GND 4
+3.3V 5 GND O PI PI 6 FULL_CARD_POWER_OFF#
I 7 USB D+
8 W_DISABLE1#
9 USB D-
10 LED1#
11 GND 12 Notch 13 Notch 14 Notch 15 Notch 16 Notch 17 Notch 18 Notch 19 Notch 20 I2S_CLK 21 CONFIG_0 22 I2S_RX I/O I I/O O O O I L Connected to internal GND, L830 M.2 module is configured as the WWAN-SSIC 0 interface type. Module main power input. GND Module main power input. GND Power on/off control signal,active High. USB 2.0 D+ signal Power Supply Power Supply Power Supply Power Supply CMOS 3.3/1.8V 0.3---3V PU WWAN Disable, active low. CMOS 3.3V USB 2.0 D- signal 0.3---3V OD System status LED, drain output. CMOS 3.3V Power Supply GND Notch Notch Notch Notch Notch Notch Notch Notch PD I2S serial clock CMOS 1.8V NC Not connected, L830 M.2 module is configured as the WWAN-SSIC 0 interface type. PD I2S serial data input CMOS 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 11 of 39 Pin Pin Name I/O 23 WOWWAN#
24 I2S_TX 25 DPR 26 W_DISABLE2#
27 GND 28 I2S_WA 29 NC 30 UIM_RESET 31 NC 32 UIM_CLK 33 GND O O I I O O O Reset Value PU Wake up host signal Pin Description PD PU PU I2S serial data output Body SAR detection GPS Disable signal, active low. (Not supported yet) GND Type CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V Power Supply PD I2S clock for left and right channels CMOS 1.8V NC PP USIM reset signal 1.8V/3V NC PP USIM clock signal GND 1.8V/3V Power Supply 34 UIM_DATA I/O PU 35 NC 36 UIM_PWR 37 NC 38 NC 39 GND 40 GNSS_SCL 41 NC USIM data signal, internal 4.7K pull-up. 1.8V/3V NC O USIM power supply 1.8V/3V NC NC GND O PU I2C serial clock signal, internal 4.7K pull-up NC Power Supply CMOS 1.8V 42 GNSS_SDA I/O PU I2C serial data signal, internal 4.7K pull-up CMOS 1.8V 43 NC 44 GNSS_IRQ 45 GND 46 SYSCLK 47 NC NC I PU Reserved GND CMOS 1.8V Power Supply O L 26MHz clock output 1.8V NC Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 12 of 39 Pin Pin Name 48 TX_BLANKING I/O Reset Value O L Pin Description Type TDMA Timer output, external GPS control signal.(not supported) CMOS 1.8V 49 NC 50 NC 51 GND 52 NC 53 NC 54 NC 55 NC 56 NC 57 GND 58 NC 59 ANTCTL0 60 COEX3 61 ANTCTL1 62 COEX2 63 ANTCTL2 64 COEX1 65 ANTCTL3 66 SIM_DETECT 67 RESET#
68 NC 69 CONFIG_1 NC NC GND NC NC NC NC NC GND NC Power Supply Power Supply O O O O O O O I I L L L Tunable antenna control signal, bit0
(not supported yet). CMOS 1.8V Reserved Tunable antenna control signal, MIPI RFFE SDATA, bit1 (not supported yet). CMOS 1.8V Reserved Tunable antenna control signal, MIPI RFFE SCLK, bit2 (not supported yet). CMOS 1.8V Reserved Tunable antenna control signal, MIPI RFFE VIO, bit3 (not supported yet). SIM card detect, external 390K pull-up. External reset input signal, internal 100K pull-up. CMOS 1.8V CMOS 1.8V CMOS 1.8V NC O L Connected to internal GND, L830 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 13 of 39 Pin Pin Name I/O Reset Value Pin Description Type 70 +3.3V 71 GND 72 +3.3V 73 GND 74 +3.3V 75 CONFIG_2 M.2 module is configured as the WWAN-SSIC 0 interface type. Module main power input. GND Module main power input. GND Module main power input. L Connected to internal GND, L830 M.2 module is configured as the WWAN-SSIC 0 interface type. PI PI PI O Power Supply Power Supply Power Supply Power Supply Power Supply Reset Value: The initial status after module reset, not the status when working H: High Voltage Level L:
Low Voltage Level PD: Pull-Down PU: Pull-Up T: Tristate OD: Open Drain PP: Push-Pull PI: Power Input PO: Power Output Note:
The unused pins can be left floating. Power Supply 3.2 The power interface of L830 module as shown in the following table:
Pin Pin Name I/O Pin Description DC ParameterV Minimum Value Typical Value Maximum Value 2,4,70,72,74
+3.3V 36 UIM_PWR PI PO Power supply input 3.135 3.3 4.4 USIM power supply 1.8V/3V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 14 of 39 3.2.1 Power Supply The L830 module should be powered through the +3.3V pins, and the power supply design is shown in Figure 3-2:
Figure 3-2 Power Supply Design The filter capacitor design for power supply as shown in the following table:
Recommended capacitance Description Application 220uF x 2 Voltage-stabilizing capacitors 1uF,100nF Digital signal noise 39pF,33pF 18pF,8.2pF,6.8pF 700,800,900 MHz frequency band 1800,2100,2600MHz frequency band Reduce power fluctuations of the module in operation, requiring capacitors with low ESR. LDO or DC/DC power supply requires the capacitor of no less than 220uF The capacitor for battery power supply can be reduced to 100uF Filter out the interference generated from the clock and digital signals Filter out low frequency band RF interference Filter out medium/high frequency band RF interference The stable power supply can ensure the normal operation of L830 module; and the ripple of the power supply should be less than 300mV in design. When the module operates with the maximum emission power, the maximum operating current can reach 1A, so the power source should be not lower than 3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 15 of 39 Figure 3-3 Power Supply Limit 3.2.2 Logic level The L830 module 1.8V logic level definition as shown in the following table:
Parameters Minimum Typical Maximum 1.8V logic level VIH VIL 1.71 1.3
-0.3 1.8 1.8 0 1.89 1.89 0.3 The L830 module 3.3V logic level definition as shown in the following table:
Parameters Minimum Typical Maximum 3.3V logic level VIH VIL 3.135 2.3
-0.3 3.3 3.3 0 3.465 3.465 0.3 Unit V V V Unit V V V 3.2.3 Power Consumption In the condition of 3.3V power supply, the L830 power consumption as shown in the following table:
Parameter Mode Condition Ioff ISleep Power off Power supply, module power off WCDMA DRX=6 DRX=8 DRX=9 Average Current(mA) 0.29 3.0 1.8 1.5 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 16 of 39 Parameter Mode Condition LTE FDD Radio Off IWCDMA-RMS WCDMA ILTE-RMS LTE FDD Paging cycle #64 frames (0.64 sec DRX cycle) AT+CFUN=4,Flight mode WCDMA Data transfer Band I @+23.5dBm WCDMA Data transfer Band VIII @+23.5dBm LTE FDD Data transfer Band 1 @+23dBm LTE FDD Data transfer Band 3 @+23dBm LTE FDD Data transfer Band 7 @+23dBm LTE FDD Data transfer Band 8 @+23dBm LTE FDD Data transfer Band 20 @+23dBm LTE FDD Data transfer Band 28 @+23dBm Average Current(mA) 3.6 1.0 687 597 713 733 735 675 685 833 Note The data above is an average value obtained by testing some samples. Control Signal 3.3 The L830 module provides two control signals for power on/off and reset operations, the pin defined as shown in the following table:
Pin Pin Name I/O Reset Value Functions Type 6 FULL_CARD_POWER_ OFF#
67 RESET#
I I 3.3.1 Module Start-Up 3.3.1.1 Start-up Circuit Power on/off signal High: Power on Low or floating: Power off 3.3V/1.8V Reset signal, internal 100K pull-up, active low. 1.8V The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The VDD(3.3V/1.8V) should be provided from the external circuit. Two methods for module starting up:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 17 of 39 AP (Application Processor) controls the module start-up, and the circuit design is shown in Figure 3-4:
Automatically start-up when powered on, and the circuit design is shown in Figure 3-5:
Figure 3-4 Circuit for Module Start-up Controlled by AP Figure 3-5 Circuit for Automatic Start-up 3.3.1.2 Start-up Timing Sequence After powering on, module will start-up by pulling up FULL_CARD_POWER_OFF# signal for more than 20ms (100ms is recommended).The internal PMU of the module will output the voltage and start the start-up process. After about 10s time, the module completes the initialization process. The start-up timing is shown in Figure 3-6:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 18 of 39 Figure 3-6 Timing Control for Start-up Index Minimum Typical tpr ton 20ms 100ms Notes The time for +3.3 V stable output.If + 3.3 V keeps constant supply, the delay time can be ignored. The time difference between the RESET # signal and the FULL_CARD_POWER_OFF # signal. 3.3.2 Module Shutdown The module can be shutdown by the following controls:
Shutdown Control Action Condition Software Sending AT+CFUN=0 command Normal shutdown. Hardware Pull down FULL_CARD_POWER_OFF# pin Only used when a hardware exception occurs and the software control cannot be used. Module can be shut down by sending AT+CFUN=0 command. When module receives the software shutdown command, it will start the finalization process (the reverse process of initialization), then it will shut down after tsd time(AP received OK from AT+CFUN=0 command, if AP cant received OK the time is 5s maxim).In the finalization process, the module will save the network, SIM card and some other parameters from memory, then clear the memory and PMU will be powered off. The software control timing is shown in Figure 3-7:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 19 of 39 Figure 3-7 Shutdown Timing Control Index Minimum Typical tpd toff 10ms 10ms 100ms 100ms Notes The time for+3.3 V delay time of shutdown.If + 3.3 V keeps constant supply, the delay time can be ignored. The time difference between the RESET # signal and the FULL_CARD_POWER_OFF # signal. 3.3.3 Module Reset The L830 module can reset to its initial status by pulling down the RESET# signal for more than 20ms
(100ms is recommended), and the module will restart after the RESET# signal is released. When the customer executes RESET# function, the PMU remains its power inside the module. The recommended circuit design is shown in the Figure 3-8:
Figure 3-8 Recommended Design for Reset Circuit The reset control timing is shown in Figure 3-9:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 20 of 39 Figure 3-9 Reset Timing Control Index Minimum Typical Notes tres 20ms 100ms RESET# signal to pull down time 3.4 USB Interface The L830 module supports USB 2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB Full-Speed (12 Mbit/s). For the USB timing and electrical specification of L830 module, please refer to Universal Serial Bus Specification 2.0 . 3.4.1 USB Interface Definition Reset Value Pin# Pin Name I/O 7 9 USB_D+
USB_D-
I/O I/O T T 3.4.2 USB Interface Application The reference circuit is shown in Figure 3-10:
Description USB Data Plus USB Data Minus Type 0.3---3V, USB2.0 0.3---3V, USB2.0 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 21 of 39 Figure 3-10 Reference Circuit for USB 2.0 Interface Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use 0.5pF TVS diodes. USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of 480 Mbit/s, so the following rules shall be followed carefully in the case of PCB layout:
3.5 USB_D- and USB_D+ signal lines should have the differential impedance of 90 ohms. USB_D- and USB_D+ signal lines should be parallel and have the equal length, the right angle routing should be avoided. USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the ground layer, and wrapped with GND vertically and horizontally. USIM Interface The L830 module supports USIM card interface including 1.8V and 3V SIM cards. 3.5.1 USIM Pins The USIM pins description as shown in the following table:
Pin Pin Name I/O Reset Value Description 36 30 32 34 UIM_PWR UIM_RESET UIM_CLK UIM_DATA PO O O I/O L L L USIM power supply USIM reset USIM clock USIM data, internal 4.7K pull-up Type 1.8V/3V 1.8V/3V 1.8V/3V 1.8V/3V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 22 of 39 Pin Pin Name I/O Reset Value Description 66 SIM_DETECT I USIM card detect, internal 390K pull-up. Active high, and high level indicates SIM card is inserted; and low level indicates SIM card is detached. Type 1.8V 3.5.2 USIM Interface Circuit 3.5.2.1 N.C. SIM Card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-11:
Figure 3-11 Reference Circuit for N.C. SIM Card Slot The principles of the N.C. SIM card slot are described as follows:
When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.2.2 N.O. SIM Card Slot The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-12:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 23 of 39 Figure 3-12 Reference Circuit for N.O. SIM Card Slot The principles of the N.O. SIM card slot are described as follows:
When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.3 USIM Hot-Plugging The L830 module supports the SIM card hot-plugging function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot. The SIM card hot-plugging function can be configured by AT+MSMPD command, and the description for AT command as shown in the following table:
AT Command Hot-plugging Detection Function Description AT+MSMPD=1 Enable AT+MSMPD=0 Disable Default value, the SIM card hot-plugging detection function is enabled. The module can detect whether the SIM card is inserted or not through the SIM_DETECT pin state. The SIM card hot-plugging detect function is disabled. The module reads the SIM card when starting up, and the SIM_DETECT status will not be detected. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 24 of 39 After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card is inserted when the SIM_DETECT pin is high, then executes the initialization program and finish the network registration after reading the SIM card information. When the SIM_DETECT pin is low, the module determines that the SIM card is detached and does not read the SIM card. Note:
By default, SIM_DETECT is active-high, which can be switched to active-low by the AT command. Please refer to the AT Commands Manual for the AT command. The system doesnt need SIM hot-plug function, please left SIM_DTECT floating. 3.5.4 USIM Design The SIM card circuit design shall meet the EMC standards and ESD requirements with the improved capability to resist interference, to ensure that the SIM card can work stably. The following guidelines should be noted in case of design:
The SIM card slot placement should near the module as close as possible, and away from the RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources. The SIM card slot with a metal shielding housing can improve the anti-interference ability. The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality. The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least. The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22~33pF capacitance should be used. 3.6 Status Indicator The L830 module provides three signals to indicate the operating status of the module, and the status indicator pins as shown in the following table:
Pin Reset Value Pin Description Pin Name Type I/O 10 23 LED1#
WOWWAN#
O O PD PU System status LED, drain output. CMOS 3.3V Module wakes up Host (AP). CMOS 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 25 of 39 3.6.1 LED#1 Signal The LED#1 signal is used to indicate the operating status of the module, and the detailed description as shown in the following table:
Module Status LED1# Signal RF function ON RF function OFF Low level (LED On) High level (LED Off) The LED driving circuit is shown in figure 3-13:
Figure 3-13 LED Driving Circuit Note:
The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current. 3.6.2 WOWWAN#
The WOWWAN# signal is used to wake the Host (AP) when there comes the data request. The definition of WOWWAN# signal is as follows:
Operating Mode WOWWAN# Signal Ringing /SMS or data requests Pull low 1s then pull high (pulse signal). Idle/Sleep High level The WOWWAN# timing is shown in Figure 3-14:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 26 of 39 Figure 3-14 WOWWAN# Timing 3.7 Interrupt Control The L830 module provides four interrupt signals, and the pin definition is as follows:
Pin Pin Name I/O Reset Value Pin Description 8 25 W_DISABLE1#
DPR I I PU PU Enable/Disable RF network Body SAR detection Type CMOS 3.3V CMOS 1.8V 3.7.1 W_DISABLE1#
The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The definition of W_DISABLE1# signal is as follows:
W_DISABLE1# signal Function High/Floating Low WWAN function is enabled, the module exits the Flight mode. WWAN function is disabled, the module enters Flight mode. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 27 of 39 3.7.2 Body SAR The L830 module supports Body SAR function by detecting the DPR pin. The voltage level of DPR is high by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing the RF radiation on the human body. The threshold of emission power can be set by the AT Commands. The definition of DPR signal as shown in the following table:
DPR signal High/Floating Low Function The module keeps the default emission power Lower the maximum emission power to the threshold value of the module. 3.8 Digital Audio The L830 module supports I2S digital audio interface and it supports the ordinary I2S mode and PCM mode. The signal level of the I2S interface is 1.8V. Please refer to FIBOCOM Digital Voice description for detailed application design. The definition of I2S signals is as follows:
Pin Pin Name I/O Reset Value Pin Description 20 22 24 26 I2S_CLK I2S_RX I2S_TX I2S_WA O I O O PD PD PD PD I2S clock I2S serial data receive I2S serial data transmit Type CMOS 1.8V CMOS 1.8V CMOS 1.8V I2S left and right channel clock (LRCK) CMOS 1.8V
. 3.8.1 I2S Mode The L830 module is connected to the Audio Codec via I2S interface, and the codec encodes the audio data to implement the voice call function. For the scenario, the module works as the I2S master, and the codec works as the I2S slave. I2S signal connection is shown in Figure 3-18:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 28 of 39 Figure 3-18 I2S Signal Connection Description:
I2S interface can be configured as master or slave mode. It supports multiple audio sampling rates (44.1KHz,32KHz,24KHz,16KHz,8KHz). It supports 16bit and 32bit mode. 3.8.2 PCM Mode In the case of the Bluetooth (BT) call, the PCM mode is used to transmit digital voice data if the BT chip does not support I2S. For the scenario, the module works as the PCM master, and BT works as the PCM slave mode. The signal connection under the PCM mode is shown in Figure 3-19:
Figure 3-19 Signal Connection for PCM Mode Description:
The PCM mode interface can be configured as master or slave mode. It supports various audio sampling rates (444.1KHz,32KHz,24KHz,16KHz,8KHz). It supports short frame sync for 16 and 32 bit mode. It supports burst and continuous transmission modes. It supports clock length trigger for frame sync signal and rising/falling edge trigger for data transmission. Note:
The PCM mode timing is relative complicated to adjust, and the audio quality will be reduced if it is not In contrast is recommended to use I2S mode. I2S mode is easier to adjust, hence it to PCM mode, fine tuned. 3.9 I2C Interface Description The L830 module supports one I2C interface, which is configured as I2C master by default. The I2C master is used for driving external I2C slave devices, such as the Audio Codec. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 29 of 39 Pin Pin Name 40 42 GNSS_SCL GNSS_SDA I/O O I/O Reset Value Pin Description Type PU PU I2C serial data, internal 4.7K pull up. CMOS 1.8V I2C serial clock, internal 4.7K pull up. CMOS 1.8V The module is connected to the external I2C slave devices (e.g. Audio Codec), which is as follows:
Figure 3-20 I2C Signal Connection Note:
The I2C interface pins can be left floating if not used. 3.10 Clock Interface The L830 module supports a clock interface, it can output 26MHz clock. Pin I/O Reset Value Pin Description Pin Name 46 SYSCLK O 26MHz clock output, can be used for external GPS or Audio Codec. 3.11 Configuration Interface Type 1.8V The L830 module provides four config pins for the configuration as the WWAN-SSIC-0 type M.2 module:
Pin I/O Reset Value Pin Name Type Pin Description 1 21 69 75 CONFIG_3 O L CONFIG_0 O CONFIG_1 CONFIG_2 O L O L Internally connected to GND NC Internally connected to GND Internally connected to GND The M.2 module configuration as the following table:
Config_3 Config_0
(pin21) Config_1
(pin69) Config_2
(pin75) NC GND GND Module Type and Main Port Host Interface Configuration WWAN-SSIC 0
(pin1) GND Please refer to PCI_Express_M.2_Specification_Rev1.1 for more details. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 30 of 39 3.12 Other Interfaces The module does not support ANT Tunable interface yet. 4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The L830 module supports two RF connectors used for external antenna connection. As the Figure 4-1 shows, M is for Main antenna, used to receive and transmit RF signals; D/G is for Diversity antenna, used to receive the diversity RF signals. Figure 4-1 RF connectors 4.1.2 RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50 40C to +85C Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 31 of 39 4.1.3 RF Connector Dimension The L830 module adopts standard M.2 module RF connectors, the model name is 818004607 from ETC company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:
Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 32 of 39 4.2 Operating Band The L830 module operating bands of the antennas are as follows:
Operating Band Band 1 Band 3 Band 7 Band 8 Band 20 Band 28 Band 32 Description Mode Tx (MHz) Rx (MHz) IMT 2100MHz LTE FDD/WCDMA 1920 - 1980 2110 - 2170 DCS 1800MHz LTE FDD 1710 - 1785 1805 - 1880 IMT-E 2600Mhz LTE FDD 2500 - 2570 2620 - 2690 E-GSM 900MHz LTE FDD/WCDMA EUDD 800MHz APT700 L-Band1500 LTE FDD LTE FDD LTE FDD 880 - 915 832 - 862 703-748 N/A 925 - 960 791 - 821 758-803 1452-1496 4.3 Transmitting Power The transmitting power for each band of the L830 module as shown in the following table:
Mode Band 3GPP Requirement Tx Power(dBm) Note WCDMA LTE FDD Band I Band VIII Band 1 Band 3 Band 7 Band 8 Band 20 Band 28 24+1.7/-3.7 24+1.7/-3.7 232.7 232.7 232.7 232.7 232.7 23+2.7/-3.2 23.51 23.51 231 231 231 231 231 231 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 4.4 Receiver Sensitivity The receiver sensitivity for each band of the L830 module as shown in the following table:
Mode Band 3GPP Requirement WCDMA Band I
-106.7 Rx Sensitivity(dBm) Typical
-110 Note BER<0.1%
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 33 of 39 Mode Band 3GPP Requirement LTE FDD Band VIII Band 1 Band 3 Band 7 Band 8 Band 20 Band 28 Band 32
-103.7
-96.3
-93.3
-94.3
-93.3
-93.3
-94.8
-96.5 Rx Sensitivity(dBm) Typical
-110.5
-101
-101
-101.5
-101
-101
-101 TBD Note BER<0.1%
10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth Note:
The above values are measured for the dual antennas situation (Main + Diversity). For single main antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE. 4.5 GNSS L830-EB-11 module not support GNSS. 4.6 Antenna Design The L830 module provides main and diversity antenna interfaces, and the antenna design requirements as shown in the following table:
L830 module Main antenna requirements Frequency range Bandwidth(WCDMA) Bandwidth(LTE) The most proper antenna to adapt the frequencies should be used. WCDMA band I(2100) : 250 MHz WCDMA band VIII(900) : 80 MHz LTE band 1(2100): 250 MHz LTE Band 3(1800): 170 MHz LTE band 7(2600): 190 MHz LTE Band 8(900): 80 MHz LTE band 20(800): 71 MHz LTE band 28(850): 100 MHz LTE band 32(700): 11 MHz Impedance 50 Ohm Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 34 of 39 L830 module Main antenna requirements Input power
> 25dBm average power WCDMA & LTE Recommended standing-wave ratio (SWR) 2:1 5 Structure Specification 5.1 Product Appearance The product appearance for L830 module is shown in Figure 5-1:
Figure 5-1 Module Appearance 5.2 Dimension of Structure The structural dimension of the L830 module is shown in Figure 5-2:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 35 of 39 Figure 5-2 Dimension of Structure 5.3 M.2 Interface Model The L830 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to chapter 5.2. Based on the M.2 interface definition, L830 module adopts Type 3042-S3-B interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 36 of 39 5.4 M.2 Connector The L830 module connects to AP via M.2 connector, it is recommended to use M.2 connector from LOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector, please refer to the specification. Figure 5-3 M.2 Dimension of Structure 5.5 Storage 5.5.1 Storage Life Storage Conditions (recommended): Temperature is 23 5 , relative humidity is RH 35-70%. Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is 12 months. 5.6 Packing The L830 module uses the tray sealed vacuum packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 37 of 39 Note:
The module is a precision electronic product, and may suffer permanent damage if no correct electrostatic protection measures are taken. 5.6.1 Tray Package The L830 module uses tray package, 20 pcs are packed in each tray, with 5 trays in each box and 6 boxes in each case. Tray packaging process is shown in Figure 5-4:
Figure 5-4 Tray Packaging Process Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 38 of 39 5.6.2 Tray size The pallet size is 330*175*6.0mm, as shown in Figure 5-5:
ITEM DIM ITEM DIM ITEM DIM L W H T A0 B0 330.00.5 175.00.5 6.00.3 0.50.1 430.3 33.00.3 A1 B1 C D E F 294.00.3 159.00.3 20.00.5 9.00.5 24.50.5 187.50.2 G J 105.00.2 9.00.2 Figure 5-5 Tray Size (Unit: mm) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L830-EB-11 Hardware User Manual Page 39 of 39
This product uses the FCC Data API but is not endorsed or certified by the FCC