| submitted | available | document details (if available) | source link |
|---|---|---|---|
| June 09 2018 | July 09 2018 | ng fangs Microsoft® Word 2016 |
| various | Users Manual | Users Manual | 2.65 MiB | June 09 2018 / July 09 2018 |
FIBOCOM_L860-GL Hardware User Manual Version1.0.2 Date2018-07-28 Copyright Copyright 2018 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End user must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 2 of 55 This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed antenna gain is as following table showed:
Operating Band Antenna GaindBi WCDMA BAND II WCDMA BAND IV WCDMA BAND V LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13 LTE BAND 14 LTE BAND 17 LTE BAND 25 LTE BAND 26814-824 LTE BAND 26824-849 LTE BAND 30 LTE BAND 38 LTE BAND 41 LTE BAND 66 8.5 5.5 9.07 9 6 9.41 9 8.85 10.31 10.38 9.74 9 8.51 8.56 1 9 5.5 6 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed Host manufacturer is responsible for ensuring that the host continues to be compliant with the Part 15 subpart B unintentional radiator requirements after the module is installed and operational. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 3 of 55 The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: ZMOL860GL. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 4 of 55 This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareilne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration d'exposition aux radiations:
Cet quipement est conforme aux limites d'exposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.\
This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de la classe B est conforme la norme NMB-003 du Canada. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the words Contains transmitter module IC: 21374-L860GL L'tiquette de certification Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'elle est installe dans le dispositif hte. sinon, le priphrique hte doit tre tiquet pour afficher le numro de certification Innovation, Sciences et Dveloppement conomique Canada du module, prcd des mots "Contient le module metteur IC: 21374-L860GL. The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed antenna gain is as following table showed Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 5 of 55 L'antenne doit tre installe de telle sorte que 20 cm soient maintenus entre l'antenne et les utilisateurs, et le gain d'antenne maximal autoris est indiqu dans le tableau suivant. Operating Band/
Bande d'opration WCDMA BAND II WCDMA BAND IV WCDMA BAND V LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13 LTE BAND 14 LTE BAND 17 LTE BAND 25 LTE BAND 26 824-849 LTE BAND 30 LTE BAND 38 LTE BAND 41 LTE BAND 66 Max allowed Gain/
Max autoris Gain
(dBi) 8.50 5.50 8.76 9.00 6.00 8.25 9.00 8.76 9.09 9.13 8.79 9.00 8.25 1.00 9.00 5.50 6.00 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 6 of 55 Trademark The trademark is registered and owned by Fibocom Wireless Inc. Version Record Version Update date Remark V1.0.0 2018-01-25 Draft version V1.0.1 2018-03-09 1. Add UL CA combinations description. 2. Modify pin definition and description. V1.0.2 2018-07-19 1. Modify module timing 2. Change tray package type 3. Modify CA Combinations 4. And add RF performance parameters and power consumption V1.0.3 2018-07-28 1. Modify B41 HPUE maximum TX power description 2. Delete Band21/Band32 Related Information Applicability Table No. Product model Description 1 L860-GL-01 NA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 7 of 55 Contents 1 Foreword .................................................................................................................................................. 11 1.1 Introduction .................................................................................................................................... 11 1.2 Reference Standard ....................................................................................................................... 11 1.3 Related Documents ....................................................................................................................... 11 2 Overview.................................................................................................................................................. 12 2.1 Introduction ................................................................................................................................... 12 2.2 Specification .................................................................................................................................. 12 2.3 CA combinations ........................................................................................................................... 13 2.4 Application Framework.................................................................................................................. 15 2.5 Hardware Block Diagram .............................................................................................................. 15 2.6 Antenna Configuration .................................................................................................................. 16 3 Application Interface ................................................................................................................................ 17 3.1 M.2 Interface ................................................................................................................................. 17 3.1.1 Pin Map ............................................................................................................................... 17 3.1.2 Pin Definition ....................................................................................................................... 18 3.2 Power Supply ................................................................................................................................ 22 3.2.1 Power Supply ...................................................................................................................... 22 3.2.2 Logic level ........................................................................................................................... 24 3.2.3 Power Consumption ........................................................................................................... 24 3.3 Control Signal ............................................................................................................................... 26 3.3.1 Module Start-Up.................................................................................................................. 27 3.3.1.1 Start-up Circuit ......................................................................................................... 27 3.3.1.2 Start-up Timing Sequence ........................................................................................ 27 3.3.2 Module Shutdown ............................................................................................................... 28 3.3.3 Module Reset ...................................................................................................................... 28 3.3.4 PCIe Reset ......................................................................................................................... 30 3.4 PCIe & USB .................................................................................................................................. 31 3.4.1 PCIe Interface ..................................................................................................................... 31 3.4.1.1 PCIe Interface Definition .......................................................................................... 31 3.4.1.2 PCIe Interface Application ........................................................................................ 32 3.4.2 USB Interface ..................................................................................................................... 34 3.4.2.1 USB Interface Definition ........................................................................................... 34 3.4.2.2 USB2.0 Interface Application ................................................................................... 34 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 8 of 55 3.5 USIM Interface .............................................................................................................................. 35 3.5.1 USIM1 Pins ......................................................................................................................... 35 3.5.2 USIM2 Pins ......................................................................................................................... 35 3.5.3 USIM Interface Circuit ........................................................................................................ 36 3.5.3.1 N.C. SIM Card Slot ................................................................................................... 36 3.5.3.2 N.O. SIM Card Slot ................................................................................................... 36 3.5.4 USIM Hot-Plugging ............................................................................................................. 37 3.5.5 USIM Design ....................................................................................................................... 38 3.6 Status Indicator ............................................................................................................................. 38 3.6.1 LED#1 Signal ...................................................................................................................... 38 3.7 Interrupt Control ............................................................................................................................ 39 3.7.1 W_DISABLE1# ................................................................................................................... 39 3.7.2 BODYSAR .......................................................................................................................... 40 3.7.3 ANT_CONFIG ..................................................................................................................... 40 3.8 ANT Tunable Interface .................................................................................................................. 40 3.9 Configuration Interface ................................................................................................................. 41 3.10 Other Interfaces .......................................................................................................................... 42 4 Radio Frequency ..................................................................................................................................... 42 4.1 RF Interface .................................................................................................................................. 42 4.1.1 RF Interface Functionality................................................................................................... 42 4.1.2 RF Connector Characteristic .............................................................................................. 42 4.1.3 RF Connector Dimension ................................................................................................... 42 4.2 Operating Band ............................................................................................................................. 44 4.3 Transmitting Power ....................................................................................................................... 45 4.4 Receiver Sensitivity ....................................................................................................................... 46 4.4.1 Dual Antenna Receiver Sensitivity ..................................................................................... 46 4.4.2 Four Antenna Receiver Sensitivity ..................................................................................... 47 4.5 GNSS ............................................................................................................................................ 48 4.6 Antenna Design ............................................................................................................................. 49 5 Structure Specification ............................................................................................................................ 51 5.1 Dimension of Structure ................................................................................................................. 51 5.2 M.2 Interface Model ...................................................................................................................... 51 5.3 M.2 Connector .............................................................................................................................. 52 5.4 Storage .......................................................................................................................................... 53 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 9 of 55 5.4.1 Storage Life ........................................................................................................................ 53 5.5 Packing ......................................................................................................................................... 53 5.5.1 Tray Package ...................................................................................................................... 53 5.5.2 Tray size ............................................................................................................................. 55 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 10 of 55 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L860-GL (hereinafter referred to as L860). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L860 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards:
3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission and reception (FDD);Part 1: Conformance specification 3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD) 3GPP TS 36.521-1 V13.4.0: User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 21.111 V10.0.0: USIM and IC card requirements 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM) application 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT) 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE) 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service
(CBS) PCI Express M.2 Specification Rev1.1 1.3 Related Documents RF Antenna Application Design Specification L8-Family System Driver Integration and Application Guidance L8-Family AT Commands Manual Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 11 of 55 2 Overview 2.1 Introduction L860 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the world. 2.2 Specification Specification LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 29, 30, 66 LTE TDD: Band 38, 39, 40, 41 Operating Band LAA Band 46 Receiver only WCDMA/HSPA+: Band 1, 2, 4, 5, 8 GNSS/Beidou: support LTE 1 Gbps DL/75 Mbps UL(Cat 16) Data Transmission UMTS/HSPA+
Carrier aggregation 5CA Downlink UMTS:384 kbps DL/384 kbps UL DC-HSPA+:42 Mbps DL(Cat 24)//11.52 Mbps UL(Cat7) Power Supply DC 3.135V4..4V, Typical 3.3V Normal operating temperature: -10C +55C Temperature Extended operating temperature: -20C +65C Storage temperature: -40C +85C Interface: M.2 Key-B Dimension30 x 42 x 2.3mm Weight: About 6.2 g Physical characteristics Interface Antenna WWAN Antenna x 4 Connector Support 4x4 MIMO Function Interface Dual SIM, 3V/1.8V PCIe 2.0 X1 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 12 of 55 Specification USB 2.0 USB 3.0(Reserved) W_Disable#
Body Sar LED Tunable antenna I2S(Reserved) Software Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005 Firmware update PCIe Multiple carrier Windows MBIM support Windows update AGNSS Other feature Note:
When temperature goes beyond normal operating temperature range of -10C~+55C, RF performance of module may be slightly off 3GPP specifications. For normal operating temperature, LTE FDD Band 4 and 13 can support temperature ranging from -20 to +60. 2.3 CA combinations DL CA Combinations 2CA Inter-band 1+3, 5, 7, 8, 18, 19, 20, 26, 28, 38, 41, 46 2+4, 5, 12, 13, 14, 29, 30, 46, 66 3+5, 7, 8, 19, 20, 28, 38, 40, 41, 46 4+5, 12, 13, 29, 30, 46 5+7, 30, 46, 66 7+8, 20, 28, 32, 46 12+30, 66 13+46, 66 14+30, 66 25+26, 41, 46 26+41 29+30, 66 30+66 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 13 of 55 DL CA Combinations Intra-band(non-contiguous) Intra-band(contiguous) 41+46 46+66 1, 2, 3, 4, 7, 25, 41, 66 1, 2, 3, 5, 7, 40, 41, 66 Inter-band 3CA 2 intra-band(non-contiguous) plus inter-band 2 intra-band(contiguous) plus inter-band Intra-band(non-contiguous) Intra-band(contiguous) Inter-band 1+3+5, 1+3+7, 1+3+8, 1+3+19, 1+3+20, 1+3+28, 1+3+38, 1+5+7, 1+7+8, 1+7+20, 1+7+28 2+4+5, 2+4+12, 2+4+13, 2+5+30, 2+12+30, 2+29+30, 2+5+66, 2+13+66, 2+14+30, 2+14+66, 2+30+66, 2+5+46, 2+13+46, 2+46+66, 2+12+66 3+5+7, 3+7+8, 3+7+20, 3+7+28 4+5+30, 4+12+30, 4+29+30 5+30+66, 5+46+66 12+30+66, 13+46+66, 14+30+66, 29+30+66 2+2+5, 2+2+12, 2+2+13, 2+2+30, 2+2+66, 2+4+4, 2+46+46, 2+66+66 3+7+7, 4+4+5, 4+4+12, 4+4+13, 4+46+46, 5+66+66 12+66+66, 13+66+66, 46+46+66, 29+66+66, 30+66+66 1+3+3, 1+7+7, 1+40+40*, 1+41+41*
2+5+5*, 2+46+46, 2+66+66 3+3+5*, 3+3+7, 3+3+20, 3+3+28*, 3+7+7, 3+40+40, 3+41+41*, 3+3+41 4+46+46, 5+5+30*, 5+5+66, 5+46+46*, 5+66+66, 7+7+28*
13+46+46*, 13+66+66, 25+41+41*, 26+41+41*, 28+40+40*,46+46+66 41, 66 40*, 41*
1+3+5+7, 1+3+7+8, 1+3+7+20, 1+3+7+28 2+5+30+66, 2+12+30+66, 2+14+30+66 2 intra-band(non-contiguous) plus 2 inter-band 2+2+5+66, 2+2+12+30, 2+2+12+66, 2+2+13+66, 2+5+66+66, 2+12+66+66, 2+13+66+66, 5+30+66+66, 29+30+66+66*
2 intra-band(contiguous) plus 2 inter-band 4CA 1+3+3+5*, 1+3+3+7, 1+3+3+20*, 1+3+7+7, 1+7+7+28*, 1+3+40+40*, 2+5+5+30*, 2+5+5+66*, 2+5+46+46*, 2+13+46+46*, 2+46+46+46*, 2+46+46+66, 2+5+66+66, 2+13+66+66 3+3+7+20*, 3+3+7+28*, 3+7+7+28*, 3+28+40+40*, 4+46+46+46*, 5+5+30+66*, 5+46+46+66*, 13+46+46+66*, 66+46+46+46*
2 intra-band(contiguous) plus 2 intra-band(contiguous) 2 intra-band(contiguous) plus 2 intra-band(non-contiguous) 3+3+7+7 5+5+66+66 3 intra-band(contiguous) plus inter-band 2+46+46+46, 3+40+40+40, 4+46+46+46, 5+46+46+46, 13+46+46+46, 25+41+41+41, 28+40+40+40, 66+46+46+46 Intra-band(non-contiguous) Intra-band(contiguous) 2 intra-band(contiguous) plus 2 intra-band(contiguous) plus inter-
band 2 intra-band(contiguous) plus 3 inter-band 5CA 41 40*
1+3+3+7+7, 3+3+7+7+28*, 2+46+46+46+46*, 46+46+46+46+66*
1+3+3+7+20*, 1+3+7+7+28*, 2+5+5+30+66*
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 14 of 55 DL CA Combinations 2 intra-band(contiguous) plus 2 intra-band(non-contiguous) plus inter-band 2+5+5+66+66*
3 intra-band(contiguous) plus 2 intra-band(non-contiguous) 2+2+46+46+46*
3 intra-band(contiguous) plus 2 inter-band 2+5+46+46+46*, 2+13+46+46+46*, 2+46+46+46+46*, 2+46+46+46+66*, 3+28+40+40+40*, 4+46+46+46+46*, 5+46+46+46+66*, 13+46+46+46+66*, 46+46+46+46+66*
3 intra-band(contiguous) plus 2 intra-band(non-contiguous) 46+46+46+66+66*
4 intra-band(contiguous) plus inter-band 2+46+46+46+46*, 3+40+40+40+40*, 5+46+46+46+46*, 13+46+46+46+46*, 46+46+46+46+66*
Intra-band(non-contiguous) 41*
Note:
* Those CA are not defined in 3GPP as of publication date, they are not fully applicable for SAR test,support pending 3GPP approval. 2.4 Application Framework The peripheral applications for L860 module are shown in Figure 2-1:
Figure2-1 Application Framework 2.5 Hardware Block Diagram The hardware block diagram in Figure 2-2 shows the main hardware functions of L860 module, including base band and RF functions. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 15 of 55 ModuleSIM1USB2.0Power SupplyON/OFF# RESET#ControlEINTIndicatorHost applicationD/G(AUX1) ANTMain ANTSIM CardPCIeSIM2SIM CardM2(AUX3) ANTM1(AUX2) ANT Baseband contains the followings:
GSM/UMTS/LTE FDD controller/Power supply NAND/internal LPDDR4 RAM Application interface RF contains the followings:
RF Transceiver RF Power/PA RF Front end RF Filter Antenna Connector Figure 2-2 Hardware Block Diagram 2.6 Antenna Configuration L860 module support four antennas and the configuration is as below table:
Antenna Connector Function Description Band configuration M M1 M2 D/G Main ANT All supported bands transmit & receive MIMO1 ANT 4x4 MIMO supported bands receive MIMO2 ANT 4x4 MIMO supported bands receive Diversity & GNSS ANT All supported bands and GNSS receive Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 16 of 55 3 Application Interface 3.1 M.2 Interface The L860 module applies standard M.2 Key-B interface, with a total of 75 pins. 3.1.1 Pin Map Figure 3-1 Pin Map Note:
Pin Notch represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 17 of 55 3.1.2 Pin Definition The pin definition is as follows:
Pin Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 O NC the WWAN PCIe, USB3.0 interface NC, L860 M.2 module is configured as 2 3 4 5 6 7
+3.3V GND
+3.3V GND FULL_CARD_ POWER_OFF#
PI
-
PI
-
I
-
-
-
-
PU USB D+
I/O type Power input GND Power input GND Power Supply Power Supply Power Supply Power Supply Power enable, Module power on input, CMOS internal pull up USB Data Plus 8 W_DISABLE1#
I PD WWAN Disable, active low 9 USB D-
I/O USB Data Minus 10 LED1#
OD T 11 GND
-
-
12 Notch 13 Notch 14 Notch 15 Notch 16 Notch 17 Notch 18 Notch 19 Notch System status LED, Output open drain, CMOS 3.3V GND Notch Notch Notch Notch Notch Notch Notch Notch 3.3/1.8V 0.3---3V CMOS 3.3/1.8V 0.3---3V CMOS 3.3V Power Supply 20 I2S_CLK O PD I2S Serial clock, Reserved CMOS 1.8V 21 CONFIG_0 NC the WWAN PCIe, USB3.0 interface NC, L860 M.2 module is configured as 22 I2S_RX I PD type I2S Serial receive data, Reserved CMOS 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 18 of 55 Pin Pin Name I/O Reset Value Pin Description Type 23 WOWWAN#
24 I2S_TX 25 DPR 26 W_DISABLE2#
27 GND 28 I2S_WA 29 USB3.0_TX-
30 UIM_RESET 31 USB3.0_TX+
32 UIM_CLK 33 GND O O I I
-
O O O O O
-
PD PD PD PD
-
PD L L
-
Wake up host, Reserved CMOS 1.8V I2S Serial transmit data, Reserved CMOS 1.8V Body SAR Detect, active low GNSS disable, active low, Reserved CMOS 3.3/1.8V CMOS 3.3/1.8V GND Power Supply I2S Word alignment/select, Reserved CMOS 1.8V USB3.0 Transmit data minus, Reserved SIM reset signal 1.8V/3V USB3.0 Transmit data plus, Reserved SIM clock Signal 1.8V/3V GND Power Supply 34 UIM_DATA I/O L SIM data input/output 1.8V/3V 35 USB3.0_RX-
36 UIM_PWR 37 USB3.0_RX+
38 NC 39 GND 40 SIM2_DETECT I O I
-
I
-
PD USB3.0 receive data minus, Reserved SIM power supply, 3V/1.8V 1.8V/3V USB3.0 receive data plus, Reserved NC GND SIM2 Detect, internal pull up(390K), active high Power Supply CMOS 1.8V 41 PETn0 O PCIe TX Differential signals Negative 42 UIM2_DATA I/O L SIM2 data input/output 1.8V/3V 43 PETp0 44 UIM2_CLK 45 GND 46 UIM2_RESET 47 PERn0 48 UIM2_PWR O O
-
O I O L
-
L PCIe TX Differential signals Positive SIM2 clock Signal 1.8V/3V GND Power Supply SIM2 reset signal 1.8V/3V PCIe RX Differential signals Negative SIM2 power supply, 3V/1.8V 1.8V/3V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 19 of 55 Pin Pin Name I/O Reset Value Pin Description Type 49 PERp0 50 PERST#
I I PCIe RX Differential signals Positive Asserted to reset module PCIe interface default. If module went into PU core dump, it will reset whole module, CMOS 3.3V not only PCIe interface. Active low, internal pull up(10K) 51 GND
-
-
GND Power Supply 52 CLKREQ#
O PU also used by L1 PM Sub states CMOS 3.3V Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It 53 REFCLKN I 54 PEWAKE#
O L mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up(10K) PCIe Reference Clock signal Negative Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system whether supports wake up functionality. Active low, open drain output and should add external pull up on platform CMOS 3.3V 55 REFCLKP I PCIe Reference Clock signal Positive 56 RFFE_SCLK O PD MIPI Interface Tunable ANT, RFFE clock 57 GND GND 58 RFFE_SDATA I/O PD MIPI Interface Tunable ANT, RFFE data CMOS 1.8V Power Supply CMOS 1.8V 59 ANTCTL0 O L Tunable ANT CTRL0 CMOS 1.8V 60 COEX3 I/O PD Wireless Coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. COEX_EXT_FTA, CMOS 1.8V Reserved 61 ANTCTL1 O PD Tunable ANT CTRL1 CMOS 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 20 of 55 Pin Pin Name I/O Reset Value Pin Description Type 62 COEX_RXD I T Wireless Coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. UART receive signal(WWAN module side), Reserved CMOS 1.8V 63 ANTCTL2 O PD Tunable ANT CTRL2 CMOS 1.8V 64 COEX_TXD O T Wireless Coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. UART transmit signal(WWAN module side), Reserved CMOS 1.8V 65 ANTCTL3 O PD Tunable ANT CTRL3 CMOS 1.8V 66 SIM1_DETECT I PD 67 RESET#
I PU SIM1 Detect, internal pull up(390K), active high WWAN reset input, internal pull up(10K), active low Host antenna configuration detect, CMOS 1.8V CMOS 1.8V 68 ANT_CONFIG I PD internal pull up(100K), CMOS 1.8V 69 CONFIG_1 O GND as the WWAN PCIe, USB3.0 Reserved GND, L860 M.2 module is configured 70
+3.3V 71 GND 72
+3.3V 73 GND 74
+3.3V PI
-
PI
-
PI
-
-
-
-
-
interface type Power input GND Power input GND Power input Power Supply Power Supply Power Supply Power Supply Power Supply 75 CONFIG_2 O NC the WWAN PCIe, USB3.0 interface NC, L860 M.2 module is configured as type Reset Value: The initial status after module reset, not the status when working. H: High Voltage Level L: Low Voltage Level PD: Pull-Down PU: Pull-Up T: Tristate Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 21 of 55 OD: Open Drain PI: Power Input PO: Power Output Note:
The unused pins can be left floating. 3.2 Power Supply The power interface of L860 module as shown in the following table:
Pin Pin Name I/O Pin Description DC ParameterV Minimum Typical Maximum Value Value Value 2, 4, 70, 72, 74 +3.3V PI Power supply input 3.135 3.3 4.4 36 48 UIM_PWR PO USIM power supply UIM2_PWR PO USIM power supply
-
-
1.8V/3V 1.8V/3V
-
-
L860 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as the external power cannot control the module status through the PCIe protocol. 3.2.1 Power Supply The L860 module should be powered through the +3.3V pins, and the power supply design is shown in Figure 3-2:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 22 of 55 The filter capacitor design for power supply as shown in the following table:
Figure 3-2 Power Supply Design Recommended capacitance Application Description Reduce power fluctuations of the module in operation, requiring capacitors with low ESR. LDO or DC/DC power supply requires the capacitor of no less than 440uF The capacitor for battery power supply can be reduced to 100~200uF Filter out the interference generated from the clock and digital signals Filter out low frequency band RF interference 220uF x 2 Voltage-stabilizing capacitors 1uF, 100nF Digital signal noise 700/800, 850/900 MHz frequency band 1500/1700/1800/1900, 39pF, 33pF 18pF, 10pF, 8.2pF, 6.8pF, 3.3pF 2100/2300, 2500/2600MHz, Filter out medium/high frequency band RF 3500/3700MHz, 5GHz frequency interference band The stable power supply can ensure the normal operation of L860 module; and the ripple of the power supply should be less than 300mV in design. Because module support 5CA download, when module operates with the maximum data transfer throughput, the maximum operating current can reach to upper 2500mA. It requests the power source voltage should not be lower than 3.135V, otherwise module may shut down or restart. The power supply requirement is shown in Figure 3-3:
Figure 3-3 Power Supply Requirement Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 23 of 55 Burst transmitBurst transmitmin:3.135VPower supplyRipple300mVDrop VBAT3.135V 3.2.2 Logic level The L860 module 1.8V logic level definition as shown in the following table:
Parameters Minimum Typical Maximum Unit 1.8V logic level VIH VIL 1.71 1.3
-0.3 1.8 1.8 0 1.89 1.89 0.3 V V V The L860 module 3.3V logic level definition as shown in the following table:
Parameters Minimum Typical Maximum Unit 3.3V logic level VIH VIL 3.135 2.3
-0.3 3.3 3.3 0 3.465 3.465 0.3 V V V 3.2.3 Power Consumption In the condition of 3.3V power supply, the L860 power consumption as shown in the following table:
Parameter Mode Condition Average Current(mA) Ioff Power off Power supply, module power off DRX=6 WCDMA DRX=8 DRX=9 ISleep LTE FDD Paging cycle #64 frames (0.64 sec DRx cycle) LTE TDD Paging cycle #64 frames (0.64 sec DRx cycle) Radio Off AT+CFUN=4, Flight mode WCDMA Data call Band 1 @+23.5dBm WCDMA Data call Band 2 @+23.5dBm IWCDMA-RMS WCDMA WCDMA Data call Band 4 @+23.5dBm WCDMA Data call Band 5 @+23.5dBm WCDMA Data call Band 8 @+23.5dBm 0.08 13 11.5 11 13 13 10 665 625 825 570 565 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 24 of 55 Parameter Mode Condition LTE FDD Data call Band 1 @+23dBm LTE FDD Data call Band 2 @+23dBm LTE FDD Data call Band 3 @+23dBm LTE FDD Data call Band 4 @+23dBm LTE FDD Data call Band 5 @+23dBm LTE FDD Data call Band 7 @+23dBm LTE FDD Data call Band 8 @+23dBm LTE FDD Data call Band 12 @+23dBm LTE FDD Data call Band 13 @+23dBm LTE FDD LTE FDD Data call Band 14 @+23dBm LTE FDD Data call Band 17 @+23dBm ILTE-RMS LTE FDD Data call Band 18 @+23dBm LTE FDD Data call Band 19 @+23dBm LTE FDD Data call Band 20 @+23dBm Average Current(mA) 840 970 785 890 700 890 725 610 750 750 625 690 700 635 LTE FDD Data call Band 25 @+23dBm 1240 LTE FDD Data call Band 26 @+23dBm LTE FDD Data call Band 28 @+23dBm LTE FDD Data call Band 30 @+23dBm LTE FDD Data call Band 66 @+23dBm LTE TDD Data call Band 38 @+23dBm LTE TDD Data call Band 39 @+23dBm LTE TDD Data call Band 40 @+23dBm LTE TDD Data call Band 41 @+23dBm LTE TDD 700 680 780 915 620 450 770 690 In 5CA mode, the L860 power consumption as shown in the following table:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 25 of 55 5CA Combination 1+3+3+7+7, 3+3+7+7+28, 2+46+46+46+46, Condition Average
(LTE FDD 5CA, Full RB) Current(mA) Band 1 @+22dBm Band 2 @+22dBm
<2500mA
<2500mA 46+46+46+46+66 Band 3 @+22dBm
<2500mA 1+3+3+7+20, 1+3+7+7+28, 2+5+5+30+66 2+5+5+66+66, 2+2+46+46+46 2+5+46+46+46, 2+13+46+46+46, 2+46+46+46+46, 2+46+46+46+66, Band 5 @+22dBm Band 7 @+22dBm Band 13 @+22dBm 3+28+40+40+40, 4+46+46+46+46, Band 20 @+22dBm 5+46+46+46+66, 13+46+46+46+66, 46+46+46+66+66 2+46+46+46+46, 3+40+40+40+40, 5+46+46+46+46, 13+46+46+46+46, 41+41+41+41+41 Note Band 28 @+22dBm Band 30 @+22dBm Band 40 @+22dBm Band 41 @+22dBm Band 66 @+22dBm The data above is an average value obtained by testing some samples. 3.3 Control Signal
<2500mA
<2500mA
<2500mA
<2500mA
<2500mA
<2500mA
<2500mA
<2500mA
<2500mA The L860 module provides two control signals for power on/off and reset operations, the pin defined as shown in the following table:
Pin Pin Name I/O Reset Value Functions Type 6 FULL_CARD_POWER _OFF#
67 RESET#
50 PERST#
I I I PU PU Module power on/off input, internal pull up Power on: High/Floating Power off: Low 3.3/1.8V WWAN reset input, internal pull up(10K), active low 1.8V Asserted to reset module PCIe interface default. If module went into PU core dump, it will reset whole module, not only PCIe interface. Active low, internal pull up(10K) CMOS 3.3V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 26 of 55 Note RESET# and PERST# need to be controlled by independent GPIO, and not shared with other devices on the host. 3.3.1 Module Start-Up 3.3.1.1 Start-up Circuit The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. AP
(Application Processor) controls the module start-upthe circuit design is shown in Figure3-4:
Figure 3-4 Circuit for Module Start-up Controlled by AP 3.3.1.2 Start-up Timing Sequence When power supply is ready, the PMU of module will power on and start initialization process by pulling high FULL_CARD_POWER_OFF# signal. After about 10s, module will complete initialization process. The start-up timing is shown in Figure 3-5:
Figure 3-5 Timing Control for Start-up Index Minimum Typical Notes tpr 0ms
-
The delay time of power supply rising from 0V up to 3.135V. If power supply always ready, it can be ignored ton1 100ms 200ms If the RESET# has a residual voltage, then 100ms is necessary Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 27 of 55
+3.3VPERST#tprRESET#ton1Module StateInitializationActivation(AT Command Ready)FULL_CARD_POWER_OFF#ton2typical 10sOFF Index Minimum Typical Notes ton2 100ms 400ms PERST# should de-asserted after FULL_CARD_POWER_OFF#
3.3.2 Module Shutdown Module can be shut down by following control:
Shutdown Control Action Condition Software Sending AT+CFUN=0 command Normal shutdown(recommend) Hardware Pull down Only used when a hardware exception occurs and the software control cannot be FULL_CARD_POWER_OFF# pin used. Module can be shut down by sending AT+CFUN=0 command. When the module receives the software shutdown command, the module will start the finalization process (the reverse process of initialization), and it will be completed after tsd time(tsd is the time which AP receive OK of AT+CFUN=0, if there is no response, the max tsd is 5s). In the finalization process, the module will save the network, SIM card and some other parameters from memory, then clear the memory and shut down PMU. The software control timing is shown in Figure 3-6:
Figure 3-6 Software control power off timing Index Minimum Typical Maxim Notes tpd 10ms 100ms
-
+3.3V power supply goes down time. If power supply is always on, it can be ignored toff1 10ms 30ms
-
RESET# should asserted before FULL_CARD_POWER_OFF#
toff2 0ms 30ms toff1 PERST# should asserted after RESET#
3.3.3 Module Reset The L860 module can reset to its initial status by pulling down the RESET# signal for more than 10ms Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 28 of 55
+3.3VPERST#tpdRESET#Module StateFinalizationActivationFULL_CARD_POWER_OFF#toff2tsdOFFAT+CFUN=0toff1
(30msis recommended), and module will restart after RESET# signal is released. When customer executes RESET# function, the PMU remains its power inside the module. The recommended circuit design is shown in the Figure 3-7:
There are two reset control timings as below:
Figure 3-7 Recommended Design for Reset Circuit Host may keep FULL_CARD_POWER_OFF# high when system restarting, module reset timing is shown in the Figure 3-8;
Host may assert FULL_CARD_POWER_OFF# high when system restarting, module reset timing is shown in the Figure 3-9;
Figure 3-8 Reset control timing1st Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 29 of 55
+3.3VPERST#RESET#Module StateRestartActivationFULL_CARD_POWER_OFF#typical 10sPMU RESETActivationtres1tres2 Figure 3-9 Reset control timing2nd Index Minimum Typical Notes tres1 10ms 30ms RESET# should asserted time tres2 0ms 30ms PERST# is not required for modem restart, thus this pin can be PERST# should asserted after RESET#. remains high during restart Note:
RESET# is a sensitive signal, its recommended to add a filter capacitor close to the module. In case of PCB layout, the RESET# signal lines should keep away from the RF interference and protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on the surface planes to avoid module from reset caused by ESD problems. 3.3.4 PCIe Reset Module supports PCIe goes in to D3cold L2 state in Win10 system. The D0->D3cold L2@S0/S0ix/S3
->D0 timing is shown in figure 3-10:
Figure 3-10 PCIe reset timing Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 30 of 55
+3.3VPERST#RESET#Module StateRestartActivationFULL_CARD_POWER_OFF#typical 10sPMU RESETActivationtres1tres1tres2+3.3VPERST#RESET#Module StateD3cold L2@S0/S0ix/S3D0FULL_CARD_POWER_OFF#D0 3.4 PCIe & USB L860 module supports PCIe and USB interface for data request. PCIe & USB interface functions are as below table:
Interface System Priority Description PCIe Win10 High If PCIe and USB ports connected both with PC, module will initial Priority: PCIe>USB. PCIe first, then disable USB port It must disconnect PCIe port, only keep USB connecting. USB Android/Linux Low If keep PCIe and USB connecting both, it needs disable PCIe by BIOS/UEFI of PC 3.4.1 PCIe Interface L860 module supports PCIe Gen2, one lane for data transmission channel.it is also compatible with PCIe Gen1.After L860 module is inserted into PC, PCIe interface can work with the driver, then map a MBIM port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10 system and GNSS interface for receiving GNSS data. 3.4.1.1 PCIe Interface Definition Pin# Pin Name I/O Reset Value Description Type 41 PETn0 O
-
43 PETP0 O
-
47 PERn0 I
-
49 PERP0 I
-
53 REFCLKN I
-
55 REFCLKP I
-
PCIe TX Differential signals Negative PCIe TX Differential signals Positive PCIe RX Differential signals NegativeBit0 PCIe RX Differential signals Positive PCIe Reference Clock signal Negative PCIe Reference Clock signal Positive
-
-
-
-
-
-
50 PERST#
I PU default. If module went into coredump, it will CMOS 3.3V Asserted to reset module PCIe interface reset whole module, not only PCIe interface. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 31 of 55 Pin# Pin Name I/O Reset Value Description Type 52 CLKREQ# O L Active low, internal pull up(10K) Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It also used by L1 PM Sub states mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up(10K) Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system CMOS 3.3V 54 PEWAKE# O L whether supports wake up functionality. CMOS 3.3V Active low, open drain output and should add external pull up on platform 3.4.1.2 PCIe Interface Application The reference circuit is shown in Figure 3-11:
Figure 3-11 Reference Circuit for PCIe Interface L860 module supports PCIe Gen2 interface, including three difference pairs: transmit pair TXP/N, receiving pair RXP/N and clock pair CLKP/N. PCIe can achieve the maximum transmission rate of 5 GT/s, and must strictly follow the rules below in PCB Layout:
The differential signal pair lines shall be parallel and equal in length;
The differential signal pair lines shall be short if possible and be controlled within 15 inch(380 mm) for AP end;
The impedance of differential signal pair lines is recommended to be 100 ohm, and can be controlled to 80120 ohm in accordance with PCIe protocol;
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 32 of 55 Module sideM.2 Key-B 75pin ConnectorAP sideAC CapsAC CapsPERST#CLKREQ#WAKE#PERST#(pin50)CLKREQ#(pin52)PEWAKE#(pin54)PERn0PERP0PETn0PETP0REFCLKNREFCLKPPETn0(pin41)PETP0(pin43)PERn0(pin47)PERP0(pin49)REFCLKN(pin53)REFCLKP(pin55)+3.3V10K It shall avoid the discontinuous reference ground, such as segment and space;
When the differential signal lines go through different layers, the via hole of grounding signal should be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes and the lines shall never cross the segment of plane;
Try to avoid bended lines and avoid introducing common-mode noise in the system, which will influence the signal integrity and EMI of difference pair. As shown in Figure 3-12, the bending angle of all lines should be equal or greater than 135, the spacing between difference pair lines should be larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least. When a serpentine line is used for length match with another line, the bended length of each segment shall be at least 3 times the line width (3W). The largest spacing between the bended part of the serpentine line and another one of the differential lines must be less than 2 times the spacing of normal differential lines (S1<2S);
Figure 3-12 Requirement of PCIe Line The difference in length of two data lines in difference pair should be within 5mil, and the length match is required for all parts. When the length match is conducted for the differential lines, the designed position of correct match should be close to that of incorrect match, as shown in Figure 3-
13. However, there is no specific requirements for the length match of transmit pair and receiving pair, that is, the length match is only required in the internal differential lines rather than between different difference pairs. The length match should be close to the signal pin and pass the small-
angle bending design. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 33 of 55 PCIe Difference Pair 1WSS1<2S3W13520milPCIe Difference Pair 21.5W Figure 3-13 Length Match Design of PCIe Difference Pair 3.4.2 USB Interface The L860 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB Full-
Speed (12 Mbit/s).For the USB timing and electrical specification of L860 module, please refer to Universal Serial Bus Specification 2.0. When module inserted PC, USB can enumerate three ACM and three NCM ports in Android/Linux system, the ports can be configured in practical application. 3.4.2.1 USB Interface Definition Pin#
Pin Name I/O Description USB_D+
I/O USB Data Plus USB_D-
I/O USB Data Minus 7 9 3.4.2.2 USB2.0 Interface Application The reference circuit is shown in Figure 3-14:
Type 0.3---3V, USB2.0 0.3---3V, USB2.0 Figure 3-14 Reference Circuit for USB 2.0 Interface Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 34 of 55 Correct matchDismatched endIncorrect matchMatched end Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use 0.5pF TVS diodes. USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of 480 Mbit/s, so the following rules shall be followed carefully in the case of PCB layout:
USB_D- and USB_D+ signal lines should have the differential impedance of 90 ohms. USB_D- and USB_D+ signal lines should be parallel and have the equal length, the right angle routing should be avoided. USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the ground layer, and wrapped with GND vertically and horizontally. 3.5 USIM Interface The L860 module has dual built-in USIM card interface, which supports 1.8V and 3V SIM cards. 3.5.1 USIM1 Pins The USIM1 pins description as shown in the following table:
Pin Pin Name I/O Reset Value Description 36 UIM_PWR 30 UIM_RESET 32 UIM_CLK 34 UIM_DATA PO O O
-
L L I/O L USIM power supply USIM reset USIM clock Type 1.8V/3V 1.8V/3V 1.8V/3V USIM data, internal pull up(4.7K) 1.8V/3V USIM card detect, internal 390K pull-
up. 66 SIM_DETECT I PD Active high, and high level indicates 1.8V SIM card is inserted; and low level indicates SIM card is detached. 3.5.2 USIM2 Pins The USIM2 pins description as shown in the following table:
Pin Pin Name I/O Reset Value Description 48 UIM2_PWR 46 UIM2_RESET 44 UIM2_CLK PO O O
-
L L USIM2 power supply USIM2 reset USIM2 clock Type 1.8V/3V 1.8V/3V 1.8V/3V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 35 of 55 Pin Pin Name I/O Reset Value Description Type 42 UIM2_DATA I/O L USIM2 data, internal pull up(4.7K) 1.8V/3V USIM2 card detect, internal 390K pull-up. 40 SIM2_DETECT I PD Active high, and high level indicates 1.8V SIM card is inserted; and low level indicates SIM card is detached. 3.5.3 USIM Interface Circuit 3.5.3.1 N.C. SIM Card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-15:
The principles of the N.C.SIM card slot are described as follows:
Figure 3-15 Reference Circuit for N.C. SIM Card Slot When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.3.2 N.O. SIM Card Slot The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-16:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 36 of 55 The principles of the N.O.SIM card slot are described as follows:
Figure 3-16 Reference Circuit for N.O. SIM Card Slot When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.4 USIM Hot-Plugging The L860 module supports the SIM card hot-plugging function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot. The SIM card hot-plugging function can be configured by AT+MSMPD command, and the description for AT command as shown in the following table:
AT Command Hot-plugging Detection Function Description AT+MSMPD=1 Enable enabled. Default value, the SIM card hot-plugging detection function is The module can detect whether the SIM card is inserted or not through the SIM_DETECT pin state. The SIM card hot-plugging detect function is disabled. AT+MSMPD=0 Disable The module reads the SIM card when starting up, and the SIM_DETECT status will not be detected. After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card is Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 37 of 55 inserted when the SIM_DETECT pin is high, then executes the initialization program and finish the network registration after reading the SIM card information. When the SIM_DETECT pin is low, the module determines that the SIM card is detached and does not read the SIM card. Note:
By default, SIM_DETECT is active-high, which can be switched to active-low by the AT command. Please refer to the AT Commands Manual for the AT command. 3.5.5 USIM Design The SIM card circuit design shall meet the EMC standards and ESD requirements with the improved capability to resist interference, to ensure that the SIM card can work stably. The following guidelines should be noted in case of design:
The SIM card slot placement should near the module as close as possible, and away from the RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources. The SIM card slot with a metal shielding housing can improve the anti-interference ability. The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality. The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least. The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22~33pF capacitance should be used. 3.6 Status Indicator The L860 module provides two signals to indicate the operating status of the module, and the status indicator pins as shown in the following table:
Pin Pin Name I/O Reset Value Pin Description Type 10 LED1#
23 WOWWAN#
O O T PD 3.6.1 LED#1 Signal System status LED, drain output. CMOS 3.3V Module wakes up Host (AP)Reserved CMOS 1.8V The LED#1 signal is used to indicate the operating status of the module, and the detailed description as shown in the following table:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 38 of 55 Module Status LED1# Signal RF function ON Low level (LED On) RF function OFF High level (LED Off) The LED driving circuit is shown in figure 3-17:
Figure 3-17 LED Driving Circuit Note:
The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current. 3.7 Interrupt Control The L860 module provides four interrupt signals, and the pin definition is as follows:
Reset Value PD PD PD PD Pin Pin Name I/O 8 W_DISABLE1#
25 DPR 26 W_DISABLE2#
68 ANT_CONFIG I I I I 3.7.1 W_DISABLE1#
Pin Description Type Enable/Disable RF network CMOS 3.3/1.8V Body SAR detection CMOS 3.3/1.8V GNSS Disable signal Reserved Host antenna configuration detection Reserved CMOS 3.3/1.8V CMOS 1.8V The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The definition of W_DISABLE1# signal is as below table:
W_DISABLE1# signal Function High/Floating WWAN function is enabled, the module exits the Flight mode. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 39 of 55 W_DISABLE1# signal Function Low WWAN function is disabled, the module enters Flight mode. Note The function of W_DISABLE1# can be customized, please refer to the software porting guide. 3.7.2 BODYSAR The L860 module supports Body SAR function by detecting the DPR pin. The voltage level of DPR is high by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing the RF radiation on the human body. The threshold of emission power can be set by the AT Commands. The definition of DPR signal as shown in the following table:
DPR signal Function High/Floating The module keeps the default emission power Low Lower the maximum emission power to the threshold value of the module. 3.7.3 ANT_CONFIG L860 module can be configured to support dual antennas or 4 antennas by detecting the ANT_CONFIG pin. ANT_CONFIG is an input port which is pulled high internal in default. When ANT_CONFIG is high level, then module supports dual antennas (Main & D/G ANT). When module detects low level of ANT_CONFIG, then module will be configured to support 4 antennas. The definition of ANT_CONFIG signal is shown as below table:
ANT_CONFIG signal Function High/Floating Support dual antennas(Main & D/G ANT)Reserved Low Support 4 antennasReserved 3.8 ANT Tunable Interface The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 4bit GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly configure the bands of LTE antenna to improve the antennas working efficiency and save space for the antenna. Pin Pin Name I/O Pin Description Type 22 RFFE_VIO O Tunable ANT control, MIPI Interface, Power 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 40 of 55 Pin Pin Name I/O Pin Description Type RFFE VIO 56 RFFE_SCLK O Tunable ANT control, MIPI Interface, RFFE clock 58 RFFE_SDATA I/O Tunable ANT control, MIPI Interface, 59 ANTCTL0 61 ANTCTL1 63 ANTCTL2 65 ANTCTL3 RFFE data Tunable ANT control, GPO interface, Bit0 Tunable ANT control, GPO interface, bit1 Tunable ANT control, GPO interface, Bit2 Tunable ANT control, GPO interface, Bit3 O O O O 3.9 Configuration Interface CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V The L860 module provides four configuration pins for the configuration as the WWAN-PCIe, USB3.0 type M.2 module:
Pin Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 O 21 CONFIG_0 O 69 CONFIG_1 75 CONFIG_2 O O
-
-
L
-
NC NC Internally connected to GND NC The M.2 module configuration as the following table:
Config_0 Config_1 Config_2 Config_3 Module Type and
(pin21)
(pin69)
(pin75)
(pin1) Main Host Interface Port Configuration NC GND NC NC WWAN - PCIe Gen2, USB3.0 Vender defined Please refer to PCI Express M.2 Specification Rev1.1 for more details. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 41 of 55 3.10 Other Interfaces The module does not support other interfaces yet. 4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The L860 module supports four RF connectors used for external antenna connection. As the Figure 4-1 shows, M is for Main antenna, used to receive and transmit RF signals; D/G is for Diversity antenna, used to receive the diversity RF signals. M1 and M2 are used for support 4x4 MIMO data transfer. Figure 4-1 RF connectors 4.1.2 RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50 40C to +85C 4.1.3 RF Connector Dimension L860 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 42 of 55 Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 43 of 55 4.2 Operating Band The L860 module operating bands of the antennas are as follows:
Operating Band Description Mode Tx (MHz) Rx (MHz) Band 1 Band 2 Band 3 Band 4 Band 5 Band 7 Band 8 2100MHz LTE FDD/WCDMA 1920 - 1980 2110 - 2170 1900MHz LTE FDD/WCDMA 1850 - 1910 1930 - 1990 1800MHz LTE FDD 1710 - 1785 1805 - 1880 1700MHz LTE FDD/WCDMA 1710 - 1755 2110 - 2155 850MHz LTE FDD/WCDMA 824 - 849 869 - 894 2600Mhz LTE FDD 2500 - 2570 2620 - 2690 900MHz LTE FDD/WCDMA 880 - 915 925 - 960 Band 12 700MHz LTE FDD 699 - 716 729 - 746 Band 13 700MHz LTE FDD 777 - 787 746 - 756 Band 14 700MHz LTE FDD 788 798 758 768 Band 17 700MHz LTE FDD 704 - 716 734 - 746 Band 18 800MHz LTE FDD 815 - 830 860 - 875 Band 19 800MHz LTE FDD 830 - 845 875 - 890 Band 20 800MHz LTE FDD 832 - 862 791 - 821 Band 25 1900MHz LTE FDD 1850 1915 1930 1995 Band 26 850MHz LTE FDD 814 - 849 859 - 894 Band 28 700MHz LTE FDD 703 - 748 758 - 803 Band 29 700MHz LTE FDD N/A 716 - 728 Band 30 2300MHz LTE FDD 2305 - 2315 2350 - 2360 Band 66 1700MHz LTE FDD 1710 - 1780 2110 - 2200 Band 38 2600MHz LTE TDD Band 39 1900MHZ LTE TDD Band 40 2300MHz LTE TDD Band 41 2500MHZ LTE TDD Band 46 5200MHZ LTE TDD GPS L1
-
-
2570 - 2620 1880 - 1920 2300 - 2400 2496 - 2690 N/A
/
5150 5925 1575.421.023 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 44 of 55 Operating Band Description Mode Tx (MHz) Rx (MHz) GLONASS L1 BeiDou
-
-
-
-
/
/
1602.56254 1561.0982.046 4.3 Transmitting Power The transmitting power for each band of the L860 module as shown in the following table:
Mode Band 3GPP Requirement(dBm) Tx Power(dBm) Note Band 1 24+1.7/-3.7 Band 2 24+1.7/-3.7 WCDMA Band 4 24+1.7/-3.7 Band 5 24+1.7/-3.7 Band 8 24+1.7/-3.7 Band 1 232.7 Band 2 232.7 Band 3 232.7 Band 4 232.7 23.51 23.51 23.51 23.51 23.51 231 231 231 231
-
-
-
-
-
10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB Band 5 232.7 23+2/-1 10MHz Bandwidth, 1 RB Band 7 232.7 Band 8 232.7 Band 12 232.7 LTE FDD Band 13 232.7 Band 14 232.7 Band 17 232.7 Band 18 232.7 Band 19 232.7 Band 20 232.7 Band 25 232.7 231 231 231 231 231 231 231 231 231 231 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB Band 26 232.7 23+2/-1 10MHz Bandwidth, 1 RB Band 28 23+2.7/-3.2 231 10MHz Bandwidth, 1 RB Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 45 of 55 Mode Band 3GPP Requirement(dBm) Tx Power(dBm) Note Band 30 232.7 23+1/-2 10MHz Bandwidth, 1 RB Band 66 232.7 Band 38 232.7 Band 39 232.7 Band 40 232.7 231 231 231 231 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB Band 41 Normal Mode:232.7 HPUE Mode:262.7 Normal Mode:23+2/-1 HPUE Mode:26+1.5/-1 10MHz Bandwidth, 1 RB LTE TDD 4.4 Receiver Sensitivity 4.4.1 Dual Antenna Receiver Sensitivity All bands support dual antenna, the receiver sensitivity for each band of L860 module is shown in below table:
Mode Band Band 1 Band 2 WCDMA Band 4 Band 5 Band 8 Band 1 Band 2 Band 3 Band 4 Band 5 Band 7 Band 8 Band 12 Band 13 Band 14 LTE FDD 3GPP Requirement
(dBm)
-106.7
-104.7
-106.7
-104.7
-103.7
-96.3
-94.3
-93.3
-96.3
-94.3
-94.3
-93.3
-93.3
-93.3
-93.3 Rx Sensitivity(dBm) Typical
-111.0
-110.6
-110
-111.4
-111.4
-101.1
-100.6
-101
-101.5
-103.1
-99
-102.5
-103.2
-103.1
-102.4 Note BER<0.1%
BER<0.1%
BER<0.1%
BER<0.1%
BER<0.1%
10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 46 of 55 3GPP Requirement
(dBm)
-93.3
-96.3
-96.3
-93.3
-92.8
-93.8
-94.8
-93.3
-95.3
-95.8
-96.3
-96.3
-96.3
-94.3
-88.5 Rx Sensitivity(dBm) Typical Note
-103.5
-103.1
-103.2
-102.7
-98.5
-103.0
-103.3
--101
--101
-101.5
-100.2
-102.2
-100.1
-99.4
-95.5 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 20MHz Bandwidth Mode Band Band 17 Band 18 Band 19 Band 20 Band 25 Band 26 Band 28 Band 29 Band 30 Band 66 Band 38 Band 39 LTE TDD Band 40 Band 41 Band 46 Note:
The above values are measured in dual antennas condition (Main+Diversity). For single main antenna (without Diversity), the sensitivity will drop about 3dBm for each band of LTE. 4.4.2 Four Antenna Receiver Sensitivity Some middle/high bands support four antenna, the receiver sensitivity for some middle/high bands of L860 module is shown in below table:
Mode Band Middle/High 3GPP Requirement Bands
(dBm) Rx Sensitivity Typical(dBm) Note Band 1 Middle Band Band 2 Middle Band LTE FDD Band 3 Middle Band Band 4 Middle Band
-99
-97
-96
-99
-103.5 10MHz Bandwidth
-104
-103
-104 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth Band 66 Middle Band
-98.5
/
10MHz Bandwidth Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 47 of 55 Mode Band Middle/High 3GPP Requirement Bands
(dBm) Rx Sensitivity Typical(dBm) Note Band 7 High Band Band 30 High Band Band 40 High Band Band 41 High Band
-97
/
-99
-97 LTE TDD
-103 10MHz Bandwidth
/
/
/
10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth
(2540~2655MHz) Note:
The above values are measured in four antennas condition (Main+Diversity+M1+M2). If only use dual antennas (Main+Diversity), the sensitivity will drop about 3dBm for each band of LTE. 4.5 GNSS L860 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidou integrated antenna. Description Power Condition GPS fixing Test Result 130mA / -122dbm GPS tracking 130mA / -122dbm GLONASS fixing 130mA / -122dbm GLONASS tracking 130mA / -122dbm BeiDou fixing 130mA / -122dbm BeiDou tracking 130mA / -122dbm Power GPS Sleep GLONASS Sleep BeiDou Sleep Cold start GPS Warm start TTFF Hot Start Cold start GLONASS Warm start Hot Start 4mA 4mA 4mA 37s / -130dBm 34s / -130dBm 2s / -130dBm 31s / -130dBm 22s / -130dBm 3s / -130dBm Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 48 of 55 Description Condition Cold start BeiDou Warm start Hot Start AGNSS Cold start GPS Sensitivity GLONASS BeiDou Note:
Tracking Acquisition Tracking Acquisition Tracking Acquisition Test Result 148s / -130dBm 148s / -130dBm 3s / -130dBm
/
-160dBm
-149dBm
-160dBm
-146dBm
-160dBm
-141dBm Please note that GPS current is tested with RF disabled. 4.6 Antenna Design The L860module provides main and diversity antenna interfaces, and the antenna design requirements as shown in the following table:
L860 module Main antenna requirements Frequency range The most proper antenna to adapt the frequencies should be used. WCDMA band 1(2100) : 250 MHz WCDMA band 2(1900) : 140 MHz Bandwidth(WCDMA) WCDMA band 4(1700) : 445 MHz WCDMA band 5(850) : 70 MHz WCDMA band 8(900) : 80 MHz LTE band 1(2100): 250 MHz LTE band 2(1900): 140MHz LTE Band 3(1800): 170 MHz Bandwidth(LTE) LTE band 4(1700): 445MHz LTE band 5(850): 70 MHz LTE band 7(2600): 190 MHz LTE Band 8(900): 80 MHz Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 49 of 55 L860 module Main antenna requirements LTE Band 12(700): 47 MHz LTE Band 13(700): 41 MHz LTE Band 14(700): 40 MHz LTE Band 17(700): 42 MHz LTE Band 18(800): 80 MHz LTE Band 19(800): 80 MHz LTE band 20(800): 71 MHz LTE band 25(1900): 145 MHz LTE band 26(850): 80 MHz LTE band 28(700): 100 MHz LTE band 29(700): 12 MHz LTE band 30(2300): 55 MHz LTE band 66(1700): 490MHz LTE band 38(2600): 50 MHz LTE Band 39(1900): 40 MHz LTE band 40(2300): 100 MHz LTE band 41(2500): 194 MHz LTE band 46(5GHz): 775 MHz GPS: 2 MHz Bandwidth(GNSS/BeiDou) GLONASS: 8 MHz Impedance Input power BeiDou: 4 MHz 50 ohm
> 28 dBm average power WCDMA & LTE Recommended standing-wave ratio (SWR) 2:1 Note:
ANT on B30 suggestion: Peak gain<0dBi, for FCC EIRP requirement, Efficient>50% for carrier TRP requirement. If integrator doesn't follow the instruction, Fibocom doesn't take the responsibility. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 50 of 55 5 Structure Specification 5.1 Dimension of Structure The structural dimension of the L860 module is shown in Figure 5-2:
Figure 5-2 Dimension of Structure 5.2 M.2 Interface Model The L860 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 5.2 Dimension of Structure. Based on the M.2 interface definition, L860 module adopts Type 3042-S3-B interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 51 of 55 5.3 M.2 Connector The L860 module connects to AP via M.2 connector, it is recommended to use M.2 connector from LOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector, please refer to the specification. Figure 5-3 M.2 Dimension of Structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 52 of 55 5.4 Storage 5.4.1 Storage Life Storage Conditions (recommended): Temperature is 23 5 , relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months. 5.5 Packing The L860 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent. Note The module is a precision electronic product, and may suffer permanent damage if no correct electrostatic protection measures are taken. 5.5.1 Tray Package The L860 module uses tray package, 20 pcs are packed in each tray, with 5 trays including one empty tray on top in each box and 5 boxes in each case. Tray packaging process is shown in Figure 5-4:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 53 of 55 Figure 5-4 Tray Packaging Process Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 54 of 55 5.5.2 Tray size The pallet size is 315*170*6.5mm, as shown in Figure 5-5:
Figure 5-5 Tray Size (Unit: mm) ITEM L W H T A B C D E F G DIM(Unit: mm) 315.02.0 170.02.0 6.50.3 0.80.1 43.00.3 31.00.3 79.00.2 60.00.2 180.00.2 60.00.2 40.00.2 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 55 of 55
This product uses the FCC Data API but is not endorsed or certified by the FCC