| submitted | available | document details (if available) | source link |
|---|---|---|---|
| various | User Manual | Users Manual | 809.88 KiB |
Tuya TYWE3SE Wi-Fi and Bluetooth Module Product Manual Version: 1.0.1 Date: 2019-07-23 TYWE3SE Datasheet No.: 0000000001 1. Product Overview TYWE3SE is a low-power embedded 2.4 GHz Wi-Fi and Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip (ESP32) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. TYWE3SE is embedded with a low-power 32-bit CPU, 4 MB flash memory, 448 KB read only memory (ROM), and 520 KB static random-access memory (SRAM), and has extensive peripherals. TYWE3SE is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi and Bluetooth products as required. 1.1 Features Embedded low-power 32-bit CPU, which can also function as an application processor Dominant frequency: 160 MHz Working voltage: 3.0 V to 3.6 V Peripherals: 14 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1 analog-to-digital converter (ADC) Wi-Fi connectivity 802.11b/g/n 2.4 GHz Wi-fi WPA and WPA2 security modes 1 Up to +20 dBm output power in 802.11b mode Smart and AP network configuration modes for Android and iOS devices TYWE3SE Datasheet Onboard PCB antenna with a gain of 2.5 dBi Working temperature: 20C to +85C Bluetooth connectivity Complete Bluetooth 4.2 standards: Bluetooth Basic Rate/Enhanced Data Rate
(BR/EDR) and Bluetooth Low Energy (BLE) Class 1, Class 2, and Class 3 standards, requiring no external power amplifiers Up to +9 dBm output power Zero-IF receiver: 92 dBm BLE RX sensitivity Adaptive frequency hopping (AFH) Connections with multiple traditional Bluetooth and BLE devices Simultaneous broadcasting and scanning 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 TYWE3SE Datasheet Change History No. Date Change Description Version After Change 1 2 2019-06-25 This is the first release. 2019-07-23 Added GPIO information. 1.0.0 1.0.1 3 TYWE3SE Datasheet Contents 1. Product Overview ...........................................................................................................1 1.1 Features ................................................................................................................1 1.2 Applications ...........................................................................................................2 Tables .................................................................................................................................6 Figures................................................................................................................................6 2. Module Interfaces ...........................................................................................................7 2.1 Dimensions and Footprint......................................................................................7 2.2 Interface Pin Definition ..........................................................................................7 2.3 Test Pin Definition .................................................................................................9 3. Electrical Parameters....................................................................................................10 3.1 Absolute Electrical Parameters ...........................................................................10 3.2 Electrical Conditions ............................................................................................10 3.3 RF Current...........................................................................................................11 3.4 Working Current ..................................................................................................11 4. RF Features..................................................................................................................12 4.1 Basic RF Features...............................................................................................12 4.2 TX Performance ..................................................................................................12 4.3 RX Performance ..................................................................................................13 5. Antenna Information .....................................................................................................14 5.1 Antenna Type ......................................................................................................14 5.2 Antenna Interference Reduction..........................................................................14 5.3 Antenna Connector Specifications ......................................................................15 6. Packaging Information and Production Instructions .....................................................16 6.1 Mechanical Dimensions.......................................................................................16 4 TYWE3SE Datasheet 6.2 Recommended PCB Encapsulation ....................................................................17 6.3 Production Instructions ........................................................................................18 6.4 Recommended Oven Temperature Curve ..........................................................20 6.5 Storage Conditions ..............................................................................................21 7. MOQ and Packing Information .....................................................................................22 8. Appendix: Statement ....................................................................................................23 5 TYWE3SE Datasheet Tables Table 2-1 TYWE3SE interface pins....................................................................................7 Table 2-2 TYWE3SE test pins............................................................................................9 Table 3-1 Absolute electrical parameters .........................................................................10 Table 3-2 Normal electrical conditions .............................................................................10 Table 3-3 Current during constant transmission and receiving ........................................11 Table 3-4 TYWE3SE working current...............................................................................11 Table 4-1 Basic RF features.............................................................................................12 Table 4-2 Performance during constant transmission ......................................................12 Table 4-3 RX sensitivity....................................................................................................13 Figures Figure 2-1 TYWE3SE front and rear views ........................................................................7 Figure 6-1 TYWE3SE mechanical dimensions.................................................................16 Figure 6-2 Side view.........................................................................................................16 Figure 6-3 TYWE3SE pins ...............................................................................................17 Figure 6-4 PCB encapsulation diagram of TYWE3SE .....................................................18 Figure 6-5 HIC for TYWE3SE...........................................................................................19 Figure 6-6 Oven temperature curve .................................................................................20 6 TYWE3SE Datasheet 2. Module Interfaces 2.1 Dimensions and Footprint TYWE3SE has three rows of pins with a 2 mm pin spacing. The TYWE3SE dimensions (H x W x D) are 3.30.15 mm x 160.35 mm x 240.35 mm. The PCB thickness is 0.80.1 mm. The shield cover height is 2.50.05 mm. Figure 2-1 shows the TYWE3SE front and rear views. Figure 2-1 TYWE3SE front and rear views 2.2 Interface Pin Definition Table 2-1 TYWE3SE interface pins Pin No. Symbol I/O Type Function 1 2 3 NC ADC EN N/A AI Input N/A 10-bit SAR ADC (See the following Note 2.) Module enabling pin, which is connected to 3.3 V for normal use 7 Pin No. Symbol I/O Type Function TYWE3SE Datasheet 4 5 6 7 8 9 10 11 12 13 14 15 16 17 IO33 I/O IO14 I/O IO25 I/O IO13 I/O VDD IO26 P I/O IO27 I/O GND IO16 P I/O IO17 I/O IO15 I/O GND IO4 P I/O Used as a GPIO, which is connected to 32K_XN (pin 13) on the internal IC Used as a GPIO, which is connected to MTMS (pin 17) on the internal IC Used as a GPIO, which is connected to GPIO25 (pin 14) on the internal IC Used as a GPIO, which is connected to MTCK (pin 20) on the internal IC Power supply pin (3.3 V) Used as a GPIO, which is connected to GPIO_26 (pin 15) on the internal IC Used as a GPIO, which is connected to GPIO_27 (pin 16) on the internal IC Power supply reference ground pin Used as a GPIO, which is connected to GPIO_16 (pin 25) on the internal IC Used as a GPIO, which is connected to GPIO_17 (pin 27) on the internal IC Used as a GPIO, which is connected to MTDO (pin 21) on the internal IC Power supply reference ground pin Used as a GPIO, which is connected to GPIO_4 (pin 24) on the internal IC IO2 Output UART0_TXD (used to print the module internal information, but not recommended to be used. For details, see the following Note 3.) 18 IO0 I/O GPIO_0 (used during module power-on and 8 Pin No. Symbol I/O Type Function TYWE3SE Datasheet IO5 I/O GPIO22 I/O initialization; cannot be pulled down when the module is powered on) Used as a GPIO, which is connected to GPIO_5 (pin 34) on the internal IC Used as a GPIO, which is connected to GPIO_22 (pin 39) on the internal IC RXD TXD I/O UART0_RXD (See the following Note 3.) Output UART0_TXD (See the following Note 3.) 19 20 21 22 Note:
1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2. This pin can only function as an ADC input and not a common I/O. If this pin is not used, it must be disconnected. When this pin is used as the ADC input, the input voltage range is 0 V to 3.3 V. 3. UART0 is a user-side serial interface, which generates information when the module is powered on and starts. 2.3 Test Pin Definition Table 2-2 TYWE3SE test pins Pin No. Symbol I/O Type Function N/A RFTP Input Used for the module production test Note:
Test pins are not recommended. 9 3. Electrical Parameters 3.1 Absolute Electrical Parameters TYWE3SE Datasheet Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Ts VDD Static electricity voltage
(human body model) Static electricity voltage
(machine model) Value Value 40 125 0.3 3.6 Storage temperature Power supply voltage Tamb = 25C N/A 2 Tamb = 25C N/A 0.5 C V kV kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typical Value Maximum Unit Value Ta VDD VIL VIH VOL Working temperature 20 Power supply voltage 3.0 I/O low-level input 0.3 N/A 3.3 N/A 85 3.6 VDD x 0.25 I/O high-level input VDD x 0.75 N/A VDD I/O low-level output N/A N/A VDD x 0.1 C V V V V 10 Parameter Description Minimum VOH Imax Cpad I/O high-level output I/O drive current Input pin capacitance Value VDD x 0.8 N/A N/A TYWE3SE Datasheet Typical Value Maximum Unit Value N/A VDD V N/A 2 16 N/A mA pF 3.3 RF Current Table 3-3 Current during constant transmission and receiving Working Status Mode Rate Parameter TX Power/
Receiving Typical Value Unit 802.11b 802.11g TX 802.11n 802.11n 11 Mbit/s
+18 dBm 54 Mbit/s
+14 dBm MCS0 MCS7
+14 dBm
+12 dBm Bluetooth/BLE Pout = 0 dBm 220 185 200 185 130 802.11b 802.11g 802.11n 11 Mbit/s Constant receiving 100 54 Mbit/s Constant receiving 100 MCS7 Constant receiving 100 RX Bluetooth/BLE Constant receiving 100 mA mA mA mA mA mA mA mA mA 11 TYWE3SE Datasheet 3.4 Working Current Table 3-4 TYWE3SE working current Working Mode Working Status (Ta = 25C) Average Maximum Unit Value Value EZ AP Connected Disconnected The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and the Wi-Fi indicator blinks slowly. The module is connected to the network, and the Wi-Fi indicator is steady on. The module is disconnected from the network, and the Wi-Fi indicator is steady off. 80 90 55 80 140 430 400 mA mA mA 430 mA 4. RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4 GHz Wi-fi Wi-Fi standard IEEE 802.11b/g/n Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 HT40 MCS0 to MCS7 12 Antenna type PCB antenna with a gain of 2.5 dBi TYWE3SE Datasheet 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Unit Value Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode 1 Mbit/s N/A 54 Mbit/s N/A MCS7 N/A BLE TX power 1 Mbit/s Frequency error 11 10 EVM under 802.11b CCK 11 Mbit/s 20 dBm EVM under 802.11g OFDM 54 Mbit/s 14.0 dBm EVM under 802.11n OFDM MCS7 12.0 dBm 20 14 12 N/A N/A 22 28 30 N/A dBm N/A dBm N/A dBm 9
+10 dBm ppm dB dB dB 13 4.3 RX Performance TYWE3SE Datasheet Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit PER < 8%, 802.11b CCK mode PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode 1 Mbit/s N/A 97.5 N/A dBm 54 Mbit/s N/A 75 N/A dBm MCS7 N/A 72 92 N/A 90 dBm BLE 1 Mbit/s 94 5. Antenna Information 5.1 Antenna Type TYWE3SE uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. The following describes three antenna placement solutions:
1. Place the antenna outside the PCB frame. 2. Place the antenna along the PCB frame without copper nearby. 3. Place the antenna in a carved area on the PCB. 14 The preceding solutions ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance. TYWE3SE Datasheet 5.3 Antenna Connector Specifications TYWE3SE does not use an antenna connector. 15 6. Packaging Information and Production Instructions TYWE3SE Datasheet 6.1 Mechanical Dimensions Figure 6-1 TYWE3SE mechanical dimensions 16 TYWE3SE Datasheet Note:
Figure 6-2 Side view The default dimensional tolerance is 0.25 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.2 Recommended PCB Encapsulation Figure 6-3 TYWE3SE pins 17 TYWE3SE Datasheet Figure 6-4 PCB encapsulation diagram of TYWE3SE 6.3 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven 18 TYWE3SE Datasheet ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-5 HIC for TYWE3SE 3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C 19 TYWE3SE Datasheet
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve 1. Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. 2. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. 20 TYWE3SE Datasheet Figure 6-6 Oven temperature curve 21 6.5 Storage Conditions TYWE3SE Datasheet 22 7. MOQ and Packing Information TYWE3SE Datasheet 23 TYWE3SE Datasheet 8. Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 24 TYWE3SE Datasheet Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labeled in a visible area with the following:
"Contains Transmitter Module 2ANDL-TYWE3SE"
This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com. EN 300 328 V2.1.1 EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1 25 EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 TYWE3SE Datasheet 26
This product uses the FCC Data API but is not endorsed or certified by the FCC