WRD8P Module User manual

Global Intelligent Platform WRD8P Datasheet Product Manual Tuya WRD8P Wi-Fi Module Version: 2.0.0 Date: 2019-09-18 No.:

1 Product Overview WRD8P is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (RDA5981BM) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WRD8P is embedded with a low-power Arm Cortex-M4 MCU, 2 MB flash memory, and 384 KB static random-access memory (SRAM), and has extensive peripherals. WRD8P is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Figure 1-1 shows the WRD8P architecture. 3.3 V input 2 MB flash SPI Interface 3.3 V TTL UART 5 x PWMs 1 x ADC Wi-Fi module Arm Cortex-

M4 MCU 384 KB SRAM 802.11b/g/n HT20 2.4 GHz radio Figure 1-1 WRD8P architecture 26 MHz crystal oscillator PCB antenna 1 WRD8P Datasheet Embedded low-power CPU, which can also function as an application processor 1.1 Features Dominant frequency: up to 160 MHz Working voltage: 3.3 V to 4.2 V Peripherals: five pulse width modulation (PWM) pins, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC) Wi-Fi connectivity 802.11b/g/n/HT20 Channels 1 to 14 at 2.4 GHz WPA, WPA2, WEP, and TKIP security modes Up to +18 dBm output power in 802.11b mode STA, AP, and STA+AP working modes Smart and AP network configuration modes for Android and iOS devices Onboard PCB antenna Working temperature: 40C to +105C Smart household and home appliances 1.2 Applications Intelligent building Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 WRD8P Datasheet Change History No. Date Change Description Version After Change 1 2 2019-07-18 This is the first release. 2019-09-18 Updated the ADC input voltage and production instructions. 1.0.0 2.0.0 3 WRD8P Datasheet Contents 1 Product Overview..........................................................................................................................1 1.1 Features.............................................................................................................................. 2 1.2 Applications........................................................................................................................ 2 2 Module Interfaces......................................................................................................................... 6 2.1 Dimensions and Footprint................................................................................................ 6 2.2 Interface Pin Definition..................................................................................................... 6 2.3 Test Pin Definition..............................................................................................................7 3 Electrical Parameters................................................................................................................... 8 3.1 Absolute Electrical Parameters....................................................................................... 8 3.2 Electrical Conditions......................................................................................................... 8 3.3 WRD8P TX Power Consumption....................................................................................9 3.4 WRD8P RX Power Consumption................................................................................... 9 3.5 Working Current.................................................................................................................9 4 RF Features.................................................................................................................................10 4.1 Basic RF Features.......................................................................................................... 10 4.2 WRD8P TX Power.......................................................................................................... 10 4.3 WRD8P RX Sensitivity....................................................................................................11 5 Antenna Information................................................................................................................... 11 5.1 Antenna Type....................................................................................................................11 5.2 Antenna Interference Reduction................................................................................... 11 6 Packaging Information and Production Instructions............................................................. 12 6.1 Mechanical Dimensions................................................................................................. 12 6.2 Recommended PCB Layout..........................................................................................13 6.3 Production Instructions...................................................................................................13 6.4 Recommended Oven Temperature Curve.................................................................. 15 6.5 Storage Conditions......................................................................................................... 16 7 MOQ and Packing Information.................................................................................................17 4 WRD8P Datasheet 8 Appendix: Statement.................................................................................................................. 17 Figure 1-1 WRD8P architecture.....................................................................................................1 Figure 2-1 WRD8P front and rear views...................................................................................... 6 Figure 6-1 WRD8P PCB mechanical dimensions.................................................................... 12 Figure 6-2 WRD8P pins................................................................................................................ 13 Figure 6-3 Layout of the PCB to which WRD8P applies......................................................... 13 Figure 6-4 HIC for WRD8P...........................................................................................................14 Figure 6-5 Oven temperature curve............................................................................................16 Figures Tables Table 2-1 WRD8P interface pins....................................................................................................6 Table 2-2 WRD8P test pins.............................................................................................................7 Table 3-1 Absolute electrical parameters..................................................................................... 8 Table 3-2 Normal electrical conditions.......................................................................................... 8 Table 3-3 Power consumption during constant transmission................................................... 9 Table 3-4 Power consumption during constant receiving..........................................................9 Table 3-5 WRD8P working current................................................................................................ 9 Table 4-1 Basic RF features......................................................................................................... 10 Table 4-2 Power during constant transmission......................................................................... 10 Table 4-3 RX sensitivity................................................................................................................. 11 5 WRD8P Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint WRD8P has a row of pins with a 1.27 mm pin spacing. The WRD8P dimensions (H x W x D) are 3.50.15 mm x 160.35 mm x 24.80.35 mm. Figure 2-1 shows WRD8P front and rear views. The PCB thickness is 1.20.1 mm, and the distance between the solder pad edges is 1.270.15 mm. Figure 2-1 WRD8P front and rear views 2.2 Interface Pin Definition Table 2-1 WRD8P interface pins Pin No. Symbol I/O Type Function 1 2 3 4 3V3 GND P P GPIO23 I/O GPIO22 I/O Power supply pin Power supply reference ground pin Standard PWM pin, which is connected to pin 33 on the internal IC Standard PWM pin, which is connected to pin 34 on the internal IC 6 WRD8P Datasheet Pin No. Symbol I/O Type Function 5 6 7 8 9 10 GPIO24 I/O GPIO3 I/O GPIO25 I/O ADC AI Standard PWM pin, which is connected to pin 32 on the internal IC Standard PWM pin, which is connected to pin 23 on the internal IC Standard PWM pin, which is connected to pin 31 on the internal IC ADC pin, which is connected to pin 11 on the internal IC (See the following Note 2.) TX RX Output Input UART_TX, which is connected to pin 16 on the internal IC (See the following Note 3.) UART_RX, which is connected to pin 24 on the internal IC (See the following Note 3.) Note:

input pins. 1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog 2. This pin can only function as an ADC input and not a common I/O. If this pin is not used, it must be disconnected. When this pin is used as the ADC input, the input voltage range is 0 V to 2.0 V. The button test uses the interrupt mode. When the button is being pressed, the maximum voltage is 1.4 V. 3. UART is a user-side serial interface. 2.3 Test Pin Definition Table 2-2 WRD8P test pins Pin No. Symbol I/O Type Function N/A N/A Used for the module production test 7 WRD8P Datasheet Note:

Test pins cannot be used. 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value IIN VIN Input current Input voltage 10 0.3 10 mA VIO + 0.3 V VLNA LNA input power N/A

+10 dBm 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Maximum Unit Value Value Typical Value 40 N/A 105 C Ta VCC VIL VIH VOL VOH Working temperature Working voltage I/O low-level input I/O high-level input I/O low-level output I/O high-level output 3.3 0 4.0 4.2 N/A VCC x 0.3 VCC x 0.7 N/A VCC N/A N/A VCC x 0.1 VCC x 0.8 N/A VCC V V V V V 8 WRD8P Datasheet Parameter Description Minimum Maximum Unit Value Value Typical Value Imax N/A N/A 12 mA I/O drive current 3.3 WRD8P TX Power Consumption Table 3-3 Power consumption during constant transmission Symbol IRF IRF IRF Parameter Mode Rate TX Power 802.11b 11 Mbit/s 16 dBm 802.11g 54 Mbit/s 13.5 dBm 802.11n HT20 MCS7 12 dBm Typical Value Unit 280 250 190 mA mA mA 3.4 WRD8P RX Power Consumption Table 3-4 Power consumption during constant receiving Symbol Mode Rate Typical Value Unit IRF IRF IRF 802.11b 11 Mbit/s 802.11g 54 Mbit/s 802.11n MCS7 80 80 80 mA mA mA 3.5 Working Current Table 3-5 WRD8P working current Working Mode Working Status (Ta = 25C) Average Value Unit EZ The module is in EZ mode. 70 mA 9 WRD8P Datasheet Working Mode Working Status (Ta = 25C) Average Value Unit AP The module is in AP mode. Connected The module is connected to the network. 80 70 mA mA 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.412 GHz to 2.4835 GHz Wi-Fi standard IEEE 802.11b/g/n20 (channels 1 to 14) Data transmission rate 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 Antenna type Onboard PCB antenna 4.2 WRD8P TX Power Table 4-2 Power during constant transmission Parameter Minimum Value Typical Value Maximum Unit Value 11 Mbit/s N/A 16 N/A dBm 54 Mbit/s N/A 13.5 N/A dBm MCS7 N/A 12 N/A dBm Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode 10 WRD8P Datasheet Parameter Minimum Value Typical Value Maximum Unit Value Average RF output power, HT40 mode MCS7 N/A 12 N/A dBm Frequency error 20 N/A

+20 ppm 4.3 WRD8P RX Sensitivity Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit 11 Mbit/s N/A 84 N/A dBm 54 Mbit/s N/A 72 N/A dBm MCS7 N/A 69 N/A dBm MCS7 N/A 68 N/A dBm PER < 8%, 802.11b CCK mode PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode PER < 10%, HT40 mode 5 Antenna Information 5.1 Antenna Type WRD8P uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. 11 To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. For details about the size of the onboard PCB antenna area on WRD8P, see Figure 6-1. WRD8P Datasheet 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions Figure 6-1 WRD8P PCB mechanical dimensions 12 6.2 Recommended PCB Layout WRD8P Datasheet Figure 6-2 WRD8P pins Figure 6-3 Layout of the PCB to which WRD8P applies 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is 13 burned. If not, vacuum pack the module again. Bake the module before mounting the WRD8P Datasheet module onto the PCB.

(1) SMT placement equipment Reflow soldering machine Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter

(2) Baking equipment Cabinet oven Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves i. ii. i. ii. 2. Storage conditions for a delivered module are as follows:

(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.

(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

(3) The package contains a humidity indicator card (HIC). Figure 6-4 HIC for WRD8P 1. Bake a module based on HIC status as follows when you unpack the module package:

hours. hours.

(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive

(2) If the 30% circle is pink, bake the module for 4 consecutive hours.

(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive 14 WRD8P Datasheet 2. Baking settings:

(1) Baking temperature: 1255C

(2) Alarm temperature: 130C

(3) SMT placement ready temperature after natural cooling: < 36C

(4) Number of drying times: 1

(5) Rebaking condition: The module is not soldered within 12 hours after baking. 3. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 4. Before SMT placement, take electrostatic discharge (ESD) protective measures. 5. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. 15 WRD8P Datasheet Figure 6-5 Oven temperature curve 6.5 Storage Conditions 16 7 MOQ and Packing Information WRD8P Datasheet MOQ and packing information Product Model MOQ Packing Method Number of Modules in Number of Reel Each Reel Pack Packs in Each Box WRD8P 3600 900 4 Carrier tape and reel packing 17 8 Appendix: Statement WRD8P Datasheet Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. interference in a residential This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. this equipment does cause harmful If Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. The final end product must be labeled in a visible area with the following: Contains Transmitter Module 2ANDL-WRD8P This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final requires Part 15 Subpart B compliance testing with the modular host product still transmitter required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. installed. The end user manual shall include all 18 Declaration of Conformity European notice WRD8P Datasheet Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that product of Directive 2014/53/EU. A copy of https://www.tuya.com. this module relevant provisions the Declaration of conformity can be found at is in compliance with essential requirements and other This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. ISED Notice This device complies with Innovation, Science and Economic Development Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR Innovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de la classe B est conforme la norme NMB-003 du Canada. ISED Radiation Exposure Statement This device complies with RSS-102 radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the ISED radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. Cet appareil est conforme aux limites d'exposition aux rayonnements de la CNR-102 dfinies pour un environnement non contrl. Afin d'viter la possibilit de dpasser les limites d'exposition aux frquences radio de la CNR-102, la proximit humaine l'antenne ne doit pas tre infrieure 20 cm (8 pouces) pendant le fonctionnement normal. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the words Contains transmitter module IC: 23243-WRD8P. 19