| submitted | available | document details (if available) | source link |
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| various | UserMan 20190227 | Users Manual | 261.35 KiB |
COMPANY CONFIDENTIAL REV 0.7 LTE PCI Express M.2 Module 95.1993T01 User Manual version 0.7
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COMPANY CONFIDENTIAL REV 0.7 Table of Contents 1. INTRODUCTION ................................................................................................................................................... - 3 -
1.1 SCOPE ............................................................................................................................................................... - 3 -
1.2 FUNCTION.......................................................................................................................................................... - 3 -
2. SPECIFICATION ................................................................................................................................................... - 4 -
2.1 PHYSICAL INTERFACE ....................................................................................................................................... - 4 -
2.2 PIN ARRANGEMENT ........................................................................................................................................... - 4 -
3. PRODUCT REQUIREMENTS ............................................................................................................................ - 6 -
3.1 HARDWARE FEATURE ....................................................................................................................................... - 6 -
3.2 MECHANICAL SPECIFICATIONS ........................................................................................................................ - 11 -
3.3 ELECTRICAL SPECIFICATIONS .......................................................................................................................... - 11 -
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COMPANY CONFIDENTIAL REV 0.7 1. Introduction Project Name: LTE PCI Express M.2 Module Foxconn Project Code: 95.1993T01 This documentation describes the hardware, and mechanical requirements specification of LTE PCI Express M.2 Module. It is a confidential document of Foxconn. 1.1 Scope The function of this module provides a LTE wireless WAN interface to access the internet, and it is fully compliant with LTE specification (3GPP Release 12). 1.2 Function LTE Standards 3GPP standard Operating Frequency Number of T/Rx interface:
Channel Bandwidth:
Carrier Aggregation Band 25:
1930 to 1995 MHz (DL), 1850 to 1915 MHz (UL) Band 41:
(L) 2500 to 2570 MHz (DL/UL)
(H) 2620 to 2690MHz (DL/UL) Band 25:
2Tx /8Rx Band 41L/H: 4Tx /8Rx 5, 10, 15, 20 MHz for Band 41 5, 10, 15, 20 MHz for Band 25 DL carrier aggregation UL carrier aggregation B41 (20+20) contiguous B41 (20+20) contiguous and non-contiguous B41 (20+20+20) contiguous B41 (20+15) contiguous and non-contiguous B25 (5+5) non-contiguous B41 (15+20) contiguous and non-contiguous B25 (5+10) non-contiguous B41 (20+10) contiguous and non-contiguous B41 (10+20) contiguous and non-contiguous B41 (20+5) contiguous and non-contiguous B41 (5+20) contiguous and non-contiguous B41 (15+15) contiguous and non-contiguous B41 (10+15) contiguous and non-contiguous B41 (15+10) contiguous and non-contiguous
(hardware design can support above CA combination, but the final CA combinations plan depends on carrier engagement and software design.)
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COMPANY CONFIDENTIAL REV 0.7 2. Specification 2.1 Physical Interface RGMII, PCI express M.2 module, PCB size: 64.4 mm x 65 mm Antenna connector: UFL connector *8 Dual SIM interface (one for testing) 2.2 Pin Arrangement Figure 2.1 the sequence of pins on the 75-pin signal interface of M.2 Key.B.
(Input: Carrier board to Module)
(Output: Module to Carrier board)
(Bi-direction: both direction among module and carrier board) Pin number pin name description direction Voltage Domain 1 2 3 4 5 6 7 8 9 10 11 12 SIM_SEL Select SIM0 or SIM1 SIM_SEL Open or HIGH = SIM0 is active SIM_SEL LOW = SIM1 is active Input OD, PU(1.8V) 3.6V_AUX power GND ground 3.6V_AUX power GND ground PWR_EN enable/disable PMIC USB2.0_DP USB2.0 D+ signal DCDC_1.8V power USB2.0_DM USB2.0 D- signal VBUS GND NA USB VBUS ground NA
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input NA input NA Input VCC = 3.6V NA VCC = 3.6V NA PU(VCC=3.6V) Bi-Direction Output Bi-Direction NA NA NA 1.8V floating NA NA 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NA NA NA NA NA NA NA NA NA NA NA NA NA NA COMPANY CONFIDENTIAL REV 0.7 NA NA NA NA NA NA NA NA NA NA NA NA NA NA SIM1_RST_O Test SIM reset Output SIM1 VCC GND ground SIM1_CLK_O Test SIM clock UART0_RXD UART0 serial receive data NA Output Input NA SIM1 VCC 1.8V SIM1_DAT_O Test SIM data Bi-Direction SIM1 VCC UART0_TXD UART0 serial transmit data SIM_VCC1 Test SIM power GND ground GPD2_21 GPIO for future use 3.6V_AUX power SIM0_RST LTE SIM reset 3.6V_AUX power SIM0_CLK LTE SIM clock GND ground Output output NA NA input Output input Output NA 1.8V SIM1 VCC NA 1.8V VCC = 3.6V SIM0 VCC VCC = 3.6V SIM0 VCC NA SIM0_DAT LTE SIM data Bi-Direction SIM0 VCC 3.6V_AUX power SIM_VCC0 SIM power 3.6V_AUX power 10MS_PULSE GPIO(1PPS PULSE) GND ground RGMII_RCTL RGMII Interface 3.6V_AUX power RGMII_RCLK RGMII Interface 3.6V_AUX power RGMII_MDIO RGMII Interface GND ground RGMII_MDC RGMII Interface Default_Fact factory default RGMII_TCLK RGMII Interface GPD2_0 GPIO for future use RGMII_TCTL RGMII Interface
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input output input Output NA Input input Input input Input NA Output Input Output NA Output VCC = 3.6V SIM0 VCC VCC = 3.6V 1.8V NA 1.8V VCC = 3.6V 1.8V VCC = 3.6V 1.8V NA 1.8V 1.8V 1.8V 1.8V 1.8V 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 GND NA ground NA GPD2_1 GPIO for future use RGMII_RXD3 RGMII Interface GPD2_2 GPIO for future use RGMII_RXD2 RGMII Interface GND ground RGMII_RXD1 RGMII Interface GPD2_3 GPIO for future use RGMII_RXD0 RGMII Interface GPD2_4 GPIO for future use RGMII_TXD3 RGMII Interface GPD2_5 GPIO for future use RGMII_TXD2 RGMII Interface GPD2_6 GPIO for future use RGMII_TXD1 RGMII Interface RESET#_KEY Reset signal (Active LOW) RGMII_TXD0 RGMII Interface GPD2_7 GPIO for future use 3.6V_AUX power GND ground 3.6V_AUX power GND ground 3.6V_AUX power GND ground COMPANY CONFIDENTIAL REV 0.7 NA NA NA Input NA Input NA Input NA Input NA Output NA Output NA Output input Output NA input NA input NA input NA NA floating 1.8V 1.8V 1.8V 1.8V NA 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V PU(1.8V) 1.8V 1.8V VCC = 3.6V NA VCC = 3.6 NA VCC = 3.6V NA 3. Product Requirements 3.1 Hardware Feature 3.1.1 Baseband processor: GDM7243A GDM7243A is a highly integrated System-on-a-Chip (SOC) designed to support Long Term Evolution (LTE). It includes a LTE baseband, high performance dual Cortex-a7 processor and radio transceivers.
Dual processor architecture: Application CPU + Modem CPU (LTE)
RGMII/USIM/UART interface
Supports NAND Flash Interface
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COMPANY CONFIDENTIAL REV 0.7
LTE Features:(Internal: 4Rx-2TX; External: 4Rx-2TX)
8RX Diversity
TDD/FDD 3.1.2 RF transceiver: GRF7243A GRF7243A is a fully integrated RF transceiver, all required PLL/VCO/loop filters are integrated. Patented direct-conversion RF architecture with CMOS integration and minimizing external BOM cost.
Supports all LTE bandwidth with multiple bandwidth channel selection filter 5/10/15/20MHz
RX saw-less architecture except UHB
TX single-ended port except UHB 3.1.3 PMIC: G5851 The G5851 provide a complete power supply solution, it contains 4 dc/dc converters and 7 LDOs. All channels DC/DC converters operate at one fixed frequency of 3.0MHz. The G5851 features an I2C compatible interface.
2.8V ~ 5.5V Input Voltage Operation.
Built-In Power ON/OFF Sequence for PMU.
7-channel LDOs are Programmable to Voltage Options by I2C.
SIM Card I/F Level Shifter 3.1.4 MCP NAND Flash Density: 2-Gbits
Operating voltage : 1.7V to 1.95V
Operating Temperature : -25~ +85
Organization :
- Memory cell array: 2176 x 128K x 8
- Register: 2176 x 8
- Page size: 2176 bytes
- Block size: (128K + 8K) bytes
- 8bit ECC Mobile DDR2 SD RAM Density: 2-Gbit
Operating voltage: 1.7V to 1.95V
Operating Temperature: -25 ~ +85
Speed: 533Mbps
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3.1.6 USIM Off-board USIM connector supported. This module provides the dual SIM interface, and it can be selected by SIM_SEL pin (the pin 1 of M.2 connector). COMPANY CONFIDENTIAL REV 0.7 SIM_SEL(internally pull up) State High Low 3.1.7 RF CONNECTOR SIM selection SIM0 SIM1 Figure 3.1 RF connector location and description
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Figure 3.2 RF connector detailed information COMPANY CONFIDENTIAL REV 0.7
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COMPANY CONFIDENTIAL REV 0.7 Support Band 25,41L, 41H 25,41L, 41H 25,41L, 41H 25,41L, 41H 25,41L, 41H 25,41L, 41H 25,41L, 41H 25,41L, 41H ANT
# 0
# 1
# 2
# 3
# 4
# 5
# 6
# 7 And this module supports TX antenna switching as below,
(Each + indicates a separate TX path) TX 25,41L,41H NA 41L,41H NA 41L,41H 25 41L,41H NA RX 25,41L,41H 25,41L,41H 25,41L,41H 25,41L,41H 25,41L,41H 25,41L,41H 25,41L,41H 25,41L,41H Remark TDD/FDD TDD/FDD TDD/FDD TDD/FDD TDD/FDD TDD/FDD TDD/FDD TDD/FDD
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COMPANY CONFIDENTIAL REV 0.7 3.2 Mechanical Specifications 3.2.1 Overview The golden finger of 95.1993T01 is compatible with the NGFF 75 pin card edge-type connector. Refer to NGFF Electromechanical Specification Revision P12 with Input Power and Voltage Tolerance ECN for more details. 3.2.2 Mechanical constraints Figure 3.3 Shows the mechanical constraints of 95.1993T01 3.3 Electrical Specifications Parameter Storage Temperature Recommend operating temperature
(3GPP compliant) Extendable (with limited performance) Operating Voltage Min
-30
-10
-40 3.42 Type
+25
+25 3.6 Max
+85
+55
+85 3.78 Units V
*Temperature measured on 95.1993T01 module Table 3.1 Recommended operating conditions Remark:
1. Extendable operation allows normal mode data transmission for limited time within the extendable temperature range (outside the operating temperature range) the specified electrical characteristics may be degraded. 2. Due to temperature measurement uncertainly, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of +/- 2 at the over-temperature and under-temperature limit.
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COMPANY CONFIDENTIAL REV 0.7 3. Need implement thermal solution on Platform (Example: add thermal pad to heat dissipated from LTE module to Platform PCB) would get more thermal margin and benefit then extend the operating temperature 4. Operating 95.1993T01 device under conditions beyond its absolute maximum ratings (Table 3-1) may damage the device. Absolute maximum ratings are limiting values to be considered individually when all other parameters are within their specified operating ranges. Functional operation and specification compliance under any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied. Exposure may affect device reliability 3.3.1 RF performance specifications RF performance for 95.1993T01:
DL MCS: up to 256-QAM
UL MCS: up to 64-QAM
Uplink MIMO 2x2
Downlink MIMO 4x4
Compliance with 3GPP Rel. 12, in particular TS36.101
Transmission modes: TM1, 2, 3, 4, 5, 6, 7, 8, 9
TM3: 2/3/4 layers MIMO
TM4: 2/3/4 layers MIMO
TM9: 2/3/4 layers MIMO, up to eight CSI-RS
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COMPANY CONFIDENTIAL REV 0.7 OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: MCL951993A The FCC ID can be used only when all FCC compliance requirements are met. Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed:
Standalone Condition:
6.5 dBi in LTE B25 11.5 dBi in LTE B41 Assuming collocated with an ordinary WLAN transmitter with 5 dBi antenna gain 6.5 dBi in LTE B25 10.0 dBi in LTE B41 In the event that these conditions cannot be met (for example certain laptop configurations or co-location
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with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. COMPANY CONFIDENTIAL REV 0.7 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &
your body.
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This product uses the FCC Data API but is not endorsed or certified by the FCC