T77W980 Gigabit RF Card Users Manual rev 2

 

COMPANY CONFIDENTIAL SDR845 Gigabit RF Card Engineering Requirements Specification Project code: T77W980T00 Solution: SDR845 Copyright 2017. Foxconn Communications Inc. All rights reserved.

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COMPANY CONFIDENTIAL Reviewers Department Name Signature Review Dates

* Plan

** Results Project Manager Choro Chung ProjectLeader Hardware Engineer Jeff Guo Neil Li Modification History Rev Date Originator Comment V1.0 2018/01/11 Neil Li Initial release for carrier engagement, will update it after fix hardware design V1.1 2018/02/03 Neil Li Update the mechanical drawing V1.2 2018/02/06 Neil Li Update the soldering condition V1.3 2018/02/22 Neil Li Update the soldering information V1.4 2018/04/14 Neil Li Update the Qlink information V1.5 2018/05/22 Neil Li Add the Qlink length information V1.6 2018/06/13 Neil Li Add the label information

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COMPANY CONFIDENTIAL CONTENTS 1. GENERAL DESCRIPTION........................................................................ 5 1.1 SYSTEM MAIN FEATURE ...................................................................... 6 1.2 CARRIER AGGREGATION COMBINATION ..................................... 8 1.3 SYSTEM BLOCK DIAGRAM .................................................................. 8 1.4 PIN DEFINITION ...................................................................................... 8 1.5 PLATFORM CONNECTION DESIGN ................................................. 13 2. HARDWARE FEATURES ........................................................................ 15 2.1 RF TRANSCEIVER ................................................................................. 15 2.2 ANTENNA DESIGN ................................................................................ 16 4.1RECOMMENDED OPERATING CONDITIONS ................................ 17 4.2 STORAGE REQUIREMENT ................................................................. 17 4.3 THERMAL DISSIPATION PROPOSAL .............................................. 17 4.4CRYSTAL MATERIAL ........................................................................... 17 4.5ELECTROSTATIC DISCHARGE .......................................................... 18 5. MECHANICS, MOUNTING AND PACKAGING ................................. 19 5.1MECHANICS ............................................................................................. 19 5.2MOUNTING ONTO THE APPLICATION PLATFORM ................... 22 5.2.1SMT PCB ASSEMBLY .......................................................................... 22 5.2.1.1LAND PATTERN AND STENCIL .................................................... 22 5.2.1.2BOARD LEVEL CHARACTERIZATION ...................................... 23 5.2.2MOISTURE SENSITIVITY LEVEL ................................................... 23 5.2.3SOLDERING CONDITIONS AND TEMPERATURE ...................... 24 5.2.3.1REFLOW PROFILE ........................................................................... 24 5.2.3.2MAXIMUM TEMPERATURE AND DURATION ......................... 25 5.2.4DURABILITY AND MECHANICAL HANDLING ........................... 25 5.2.4.1STORAGE LIFE .................................................................................. 25 5.2.4.2PROCESSING LIFE ........................................................................... 25

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COMPANY CONFIDENTIAL 5.2.4.3 BAKING .............................................................................................. 25 5.2.4.4 ELECTROSTATIC DISCHARGE ................................................... 26 5.3PACKAGING ............................................................................................. 26 5.3.1TAPE AND REEL .................................................................................. 26 5.3.1.1 ORIENTATION .................................................................................. 26 5.3.1.2BARCODE LABEL ............................................................................. 26 5.3.2SHIPPING MATERIALS ...................................................................... 26 5.3.2.1MOISTURE BARRIER BAG ............................................................. 27 5.3.2.2TRANSPORTATION BOX ................................................................ 27 6. SAMPLE APPLICATION ......................................................................... 28

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1. General Description COMPANY CONFIDENTIAL T77W980T00 is designed to enable wireless data connectivity for notebook computer or any other device which runs on Qualcomm Snapdragon SDM845/ SDM850, it is compatible with the LGA interface 31x31type. It delivers wireless wide-area network (WWAN) connectivity for the LTE, UMTS and GPS/GLONASS/Beidou/Galileo protocols in one hardware configuration. Form Fact LGA 31x31 Module Carrier Support QCT Solution LTE Mode Band CA MIMO Cat

(DL/UL Mbps) North America: AT&T, Verizon, T-Mobile, Sprint, Bell, Rogers Europe: Vodafone, EE, DT, H3G, Orange, TEF, TIM, Swisscom Russia: MTS China: CMCC, CT, CU Australia: Telstra, Optus South Korea: SKT Japan: KDDI, DCM, SBM Carriers above is subject to biz discussion SDR845 FDD / TDD LB:B8/12(17)/13/14/20/26(5/18/19)/28/29 /B71 MB:B1/2(25)/3/4(66)/32/B39/B34 HB:B7/30/40/41(38) 3.5G:B42/43/48 LAA/LTE-U (DL only): B46 5xDL CA (Up to 100MHz, 256QAM) 2xUL CA (Up to 40MHz. 64QAM) -- intra-band contiguous CA 4X4(band plan: B1/2(25)/3/4(66)/7/30/40/41(38)/, 4X2, 2X2 ue-CategoryUL 13 (UL: 150Mbps) + ue-CategoryDL 16 (DL: 1.0Gbps) @ 2X2 ue-CategoryUL 13 (UL: 150Mbps) + ue-CategoryDL 18 (DL: 1.2Gbps) @ 4X4 3G WCDMA Band GNSS Interface HSPA+ Rel8 (DL/UL: up to 42/11 Mbps) Band1/2/4/5(6/19)/8/9 GPS/GLONASS/Beidou/Galileo Qlink/MIPI/GRFC 5 1.1 System Main Feature COMPANY CONFIDENTIAL Feature Physical Electrical Dimension Shielding design Weight USIM Operating Bands Description LTE module, 31 x 31 mm, 183 pin LGA No single voltage supply Dimensions (L W H): 31 mm 31 mm 2.05 mm Shield case on board design, no additional shielding requirement 4.4g Off-board USIM connector supported WCDMA/HSDPA/HSUPA/HSPA+ operating bands:

Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL) Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL) LTE bands:

Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL) Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL) Band 7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL) Band 12: 699 to 716 MHz (UL), 729 to 746 MHz (DL) Band 13: 777 to 787 MHz (UL), 746 to 756 MHz (DL) Band 14: 788 to 798 MHz (UL), 758 to 768 MHz (DL) Band 17: 704 to 716 MHz (UL), 734 to 746 MHz (DL) Band 25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL)) Band 26: 814 to 849 MHz (UL), 859 to 894 MHz (DL) Band 29: 717 to 728 MHz (DL) Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL) Band 38: 2570 to 2620 MHz (UL/DL) Band 41: 2496 to 2690 MHz (UL/DL) Band 66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL) Band 71:663 to 698 MHz (UL), 617 to 652 MHz (DL) Diversity/2nd Rx GNSS Antenna connectors Throughput All UMTS operating bands All LTE operating bands GPS: L1 (1575.42MHz) GLONASS: L1 (1602MHz) Beidou (1561.098MHz) Galileo (1575.42MHz) MAIN and AUX(supports Diversity and GPS simultaneously) WCDMA CS: DL 64 kbps /UL 64 kbps WCDMA PS: DL 384 kbps /UL 384 kbps 6 COMPANY CONFIDENTIAL HSPA+:DL 21.6 Mbps /UL 5.76 Mbps DC-HSPA+: DL 42 Mbps/UL 5.76 Mbps LTE Cat4: DL:150 Mbps/UL 50 Mbps LTE Cat6: DL:300 Mbps/UL 50 Mbps LTE Cat9: DL:450 Mbps/UL 50 Mbps LTE Cat11: DL:585 Mbps/UL 50 Mbps LTE Cat16: DL:1Gbps/UL 150Mbps LTE Cat18: DL:1.2Gbps/UL 150Mbps LTE air interface LTE Rel13 DL 1.2 Gbps / 12-layer / 100 MHz CA UL - 150 Mbps / 40 MHz CA 256 QAM DL / 64 QAM UL 4 2 MIMO 5x CA (R13) 4 4 MIMO 3x CA FDD + TDD CA 3.5 GHz and 600 MHz Bands LAA and LTE-U (up to 80 MHz of unlicens) Advance LTE IC + NAIC (with CRS only) WCDMA/HSPA air interface R99:

All modes and data rates for WCDMA FDD R5 HSDPA PS data speeds up to 7.2 Mbps on the downlink R6 HSUPA E-DCH data rates of up to 5.76 Mbps for 2 ms TTI (UE category 6) uplink R7 HSPA+

Downlink 64 QAM SISO: up to 21 Mbps Downlink 16 QAM 2X2 MIMO: up to 28 Mbps Uplink 16 QAM: up to 5.76 Mbps R8 DC-HSPA+

Downlink dual carrier with 64 QAM (SISO); up to 42 Mbps GNSS Customizable tracking session Automatic tracking session on startup Concurrent standalone GPS, GLONASS, Beidou and Galileo 7 gpsOneXTRA with GPS + GLONASS + Beidou + Galileo support COMPANY CONFIDENTIAL 1.2 Carrier aggregation combination 1.2.1. Refer to Qualcomm documents 80-P8641-123 Rev. A, Published: 2017/7/31. Remark: T77W980 hardware design can support follow CA combination, but the Final CA combinations plan depends on carrier engagement and Qualcomm software design. 1.2.2. Qualcomm SDX20 support 5CA+256QAM (up to Cat18) and Rel13 (FDD+TDD CA) which is mandatory for AU/JP/China carriers. Update the Carrier CA combination, please refer the document:

SDR845_CA_list_20180508 .xlsx 1.3 System Block Diagram 1. GRC is the RF only module, it doesnt include the CPU & memory. So GRC doesnt have the SW image. 2. Each GRC will have its unique QCN data, it will use the GRC SN to name it, and provide these data to one ftp server. OEM can scan the SN to get the QCN data then load it to the platform memory. 1. Just one antenna to support Tx;

2.Support 2 or 4 antennas simultaneously (2 ANTs up to Cat16: 2X2 MIMO+5CA, 4 ANTs up to Cat18: 4X4 MIMO+3CA and 2X2 MIMO+5CA) 1.Single main antenna design with Pentaplexer;

2.All the PAMiD with PA+SW+Filter+LNA+ASM. Figure 1-3-2 RF Block Diagram-DRX 1.Single aux antenna design with Pentaplexer;

2.Add QLN2042 for 3.5GHz 1.4 Pin definition 1.4.1 LGA interface Pin sequence 1.4.2 Pin definition Table 1-4-2Definitions of pins on the LGA interface 8 COMPANY CONFIDENTIAL PIN #

Signal Name^

Description Comments A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 D1 D2 D3 D4 D5 D6 D7 D8 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GNSS_EN GRFC4 VREG_L12M_2P7 VREG_L12M_2P7 VREG_L12M_2P7 VREG_L6M_1P8 VREG_L6M_1P8 GNSS Enable Generic RF control Power supply input Power supply input Power supply input VDD_1P8_DIG VDD_1P8_DIG 9 For switch, for FEM VDD For PA ,LNA, FEM VIO,for SDR845 COMPANY CONFIDENTIAL PIN #

Signal Name^

Description Comments 1P8_DIG, for ET D9 D10 D11 D12 D13 D14 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 E11 E12 E13 E14 F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 G1 G2 G3 G4 G5 G6 GRFC2 Generic RF control GND GND GND GND GND GND GND GPIO_1 GPIO_2 GRFC6 GND GND GRFC7 GND GND GND GND GND GND GND GND GND HW Version check HW Version check Generic RF control GND GND Generic RF control GND GND PA_THERM_2 AMUX input for 3.5G PA thermistor It is a NTC --

100Kohm 1%

170mW GND GND GND GND GND RFFE3_DATA RFFE3_CLK GND RFFE4_CLK RFFE4_DATA GND GND GND GND GND GND MIPI RFFE data MIPI RF front end (RFFE) clock GND MIPI RF front end (RFFE) clock MIPI RFFE data GND RFFE6_CLK MIPI RF front end (RFFE) clock GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 10 COMPANY CONFIDENTIAL PIN #

Signal Name^

Description Comments G7 G8 G9 G10 G11 G12 G13 G14 H1 H2 H3 H4 H5 H6 H7 H8 H9 H10 H11 H12 H13 H14 I1 I2 I3 I4 I5 I6 I7 I8 I9 I10 I11 I12 I13 I14 J1 J2 J3 J4 J5 GND GND RFFE6_DATA GND GRFC1 GND GND GND MIPI RFFE data GND Generic RF control GND VREG_L5M VDD_1P8_ANA_W0 GND GND VREG_L6M_1P8 VREG_L6M_1P8 GND QLINK_REQ QPHY_DL2_P QPHY_DL1_P GND GND GRFC3 VREG_L1M VREG_L1M VREG_L5M GND GND VREG_L5M VREG_L5M GND QLINK_EN QPHY_DL2_M QPHY_DL1_M GND GND GND VDD_1P8_DIG VDD_1P8_DIG GND QLink request from SDR845 QLink downlink lane 2 plus QLink downlink lane 1 plus GND GND Generic RF control VDD_1P2_ANA_W0 VDD_1P2_ANA_W0 VDD_1P8_ANA_W0 GND GND VDD_1P8_ANA_W0 VDD_1P8_ANA_W0 GND QLink Enable for SDR845 QLink downlink lane 2 minus QLink downlink lane 1 minus GND RFFE5_CLK MIPI RF front end (RFFE) clock GND GND PA_THERM_1 AMUX input for M/HB PA thermistor VREG_L1M VREG_L5M GND GND VREF_DAC VREF_DAC GND QPHY_DL0_P VDD_1P2_ANA_W0 VDD_1P8_ANA_W0 GND GND Transmitter DAC voltage reference Transmitter DAC voltage reference GND QLink downlink lane 0 plus 11 It is a NTC --

100Kohm 1%

170mW PIN #

J6 J7 J8 J9 J10 J11 J12 J13 J14 K1 K2 K3 K4 K5 K6 K7 K8 K9 K10 K11 K12 K13 K14 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 M2 M3 M4 M5 WMSS_RESET Reset functionality for the digital sections VREF_DAC Transmitter DAC voltage reference inside the transceiver COMPANY CONFIDENTIAL Description Comments QLink clock minus QLink uplink lane 0 plus GND MIPI RFFE data GND VDD_1P0_DIG_W0 VDD_1P8_DIG GND GND GND GND QLink downlink lane 0 minus QLink clock plus QLink uplink lane 0 minus GND GND VDD_1P0_DIG_W0 VDD_1P0_DIG_W0 VDD_1P8_DIG Power supply input for RF GND GND GND Generic RF control GND GND GND GND GND GND For SDR845 Signal Name^

QPHY_CLK_M QPHY_UL0_P GND RFFE5_DATA GND VREG_L8M VREG_L6M_1P8 GND GND GND GND QPHY_DL0_M QPHY_CLK_P QPHY_UL0_M GND GND VREG_L8M VREG_L8M VREG_L6M_1P8 VPH_QFE GND GND GND GRFC5 GND GND GND GND GND GND VREG_L3M VREG_L6M_1P8 VDD_1P0_ANA_W0 For SDR845 VDD_1P8_DIG VPH_QFE VPH_QFE Power supply input for RF -- 3.3V~4.4V Power supply input for RF -- 3.3V~4.4V GND GND GND GND GND GND RF_CLK1 38.4 MHz reference input forPLLs and other GND circuits GND 12 PIN #

M6 M7 M8 M9 M10 M11 M12 M13 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 Signal Name^

RFFE1_CLK RFFE1_DATA GND VREG_L3M VREG_L3M VPH_QFE VPH_QFE GND GND GND GND GND GND GND GND GND GND GND COMPANY CONFIDENTIAL Description Comments MIPI RF front end (RFFE) clock MIPI RFFE data GND VDD_1P0_ANA_W0 VDD_1P0_ANA_W0 Power supply input for RF -- 3.3V~4.4V Power supply input for RF -- 3.3V~4.4V GND GND GND GND GND GND GND GND GND GND GND 1.5 Platform connection design 1.5.1 For signal line impedance control Metrics Total channel bus length Guidance

<=60mm Comments Maximun PCB bus routing length for entire ch annel between SDM845 to GRC Impedance Diff Z0 min/max Field route 85 +/- 10 Differential PCB routing Z0 Length Match Intrapair match 0.7mm Length match between P and N side of differe ntial pair, need to include the GRC internal trace length For Qlink signal line:

For Qlink line, shall shielding well for themself, difference control for each pair lines. Please refer Qualcomm document: 80-P6348-3 Rev. A 1.5.2 For GRC mother board layout suggestion a: Please put the Q-link signals routing on the first priority, Q-link signal frequency will be up to 6GHz. If GRC module mounts on the mother board top side, that on the mother board PCB top layer, please dont have the other signal trace during the position of these Q-link signals. Detail location please see the below pictures. 13 COMPANY CONFIDENTIAL b: For Q-link signal lines upper and lower layers must be GND, they should be wrapped up in GND well. GRC also have the MIPI line, suggest to route by differential. If GRC module mounts on the mother board top side, please reserve the relative position clearance on the back side. We need to consider the thermal, reserve the location for future thermal solution. So it is better that dont put the components on the GRC module back side. Please refer the below picture, suggest to reserve the red dotted line location (31L * 25H mm). Figure 1-5-2PC mother board (Top/bottom view) 14 2. Hardware features COMPANY CONFIDENTIAL T77W980T00 consists of the following key engine components, in addition to the required front-end RF and other discrete components. Modem engine RF: SDR845 Connectivity engine Antenna: connectors for the off board antennas 2.1 RF transceiver The SDR845 device is a highly-integrated multimode, multiband RF CMOS transceiver IC that interfaces with the SDX20 device through QLink. The SDR845 is the first integrated single-chip RFIC for LTE downlink carrier aggregation (CA) up to 100 MHz BW supporting 5DL CA (two of the carriers must be contiguous). It also supports LTE uplink carrier aggregation up to 20 MHz + 20 MHz for interband and 40 MHz for contiguous intraband. 2.1.1 For Key features of SDR845 Qualcomm Technologies, Inc. (QTI) 28 nm RF CMOS device with an integrated modem subsystem in a PSP package (0.35 mm pitch) Integrating RF receive, transmit, and the QLink controller First QTI single-chip RF device to support three-carrier 4 4 MIMO (where two carriers are contiguous) First QTI single-chip RF device to have dedicated MIMO inputs SDR845 is the first QTI RF transceiver to support 12-layer DL MIMO 2.1.1 For Key benefits of SDR845 First QTI single-chip RF device to support three-carrier 4 4 MIMO (where two carriers are contiguous) This device is also capable of supporting two-carrier 4 4 MIMO and two-carrier 4x HORxD First QTI single-chip RF device to have dedicated MIMO inputs SDR845 is the first QTI RF transceiver to support 12-layer DL MIMO QTI RF device that supports high-speed digital interface (QLink) between SDR845 and SDX20/SDM845 QTI RF device supporting external GRFCs that can be used for RF front-end communication and general-purpose functions QTI single-chip RF transceiver with integrated LTE-unlicensed (LTE-U)/LAA support QTI RF device that supports B42, B43, B46, and B48 15 COMPANY CONFIDENTIAL QTI single-chip RF device that supports uplink carrier aggregation (using two Tx chains) QTI single-chip RF device that supports the integrated envelope tracking (ET) feature for both Tx chains (ETDAC0 and ETDAC1) QTI single-chip RF transceiver that supports up to five downlink (DL) carrier aggregation One independent differential low noise amplifier (LNA) port, supporting Tx feedback for all WAN bands (UL) Most highly integrated RF transceiver Up to 10 receivers running concurrently Simplified DC power requirements for this highly integrated RFIC with built-in microprocessor 2.2 Antenna Design The antenna elements are typically integrated into the notebook/ultrabook /tablet and connected to T77W980T00module via flexible RF coaxial cables. T77W980T00 provides four RF connectors

(MHF4 type), one for the primary transmitter/receiver port and one for the diversity receiver and GNSS the others for the 4*4 MIMO. To ensure customer has a clear knowledge of the four antennas, check below product picture. Antenna Interface Frequencies [MHz]

0 1 2 3 WWANMain 600~6000 WWAN MIMO 1 1700~2700 WWAN MIMO 2 1700~2700 WWAN Aux/GPS 600~6000 Figure 2-2-1 Antenna connector location and type 16 COMPANY CONFIDENTIAL 3.1 commended operating conditions Parameter Storage temperature Recommend operating temperature

(3GPP compliant with mitigation plan) (*1) Extendable (with limited performance) Temperature measure on T77W980 module(*2) Min

-30

-30 Type

+25

+25 Max

+85

+70

-40

+85 Units C C C Table 4-1 Recommended operating conditions 3.2 Storage Requirement The module must be stored and sealed properly in vacuum package under a temperature below 40 C and the relative humidity less than 90% in order to ensure the weldability within 12 months. 3.3 Crystal material For T77W980T00 OEM main board crystal , please OEM choose the same material TXC

-OW38477001, when mount the GRC on the mother board, for OEM just redo the XO_Calibration, and leverage the RF QCN parameter. OEM vendor needs to set up a RF calibration station for crystal, Using IQXStream or 8820C to re-calirbate the XO then rewrite the XO NV. NV items list will provide later. Figure 4-2 RF calibration station 17 COMPANY CONFIDENTIAL 4. Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a T77W980T00 LTE module. The remaining interfaces of T77W980T00 LTE module are not accessible to the user of the final product (since they are installed within the device) and are therefore only protected according to the JEDEC JESD22-A114D requirements. T77W980T00 LTE module has been tested according to the following standards. Electrostatic values can be gathered from the following table. Table 4-5: Electrostatic values Specification / Requirements JEDEC JESD22-A114D All SMT interfaces ETSI EN 301 489-1/7 All antenna interfaces

(LTE/WCDMA/GPS) BATT+

Contact discharge Air discharge 1kV Human Body Model n.a. 4kV 4kV 8kV 8kV Note: Please note that the values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment 18 COMPANY CONFIDENTIAL 5. Mechanics, Mounting and Packaging 5.1Mechanics 5.1.1 Overview The T77W980T00 LTE module uses the 183-pin LGA as their external interface. For details about the module and dimensions, see 5.1.2 Dimensions and Interfaces (Tolerance:+/-0.10). Typical module dimension (W x L): 31mmx31mm. Max Z-height is 2.15mm Pin1 Figure 5-1-1Top & side view 5.1.2 Dimensions and Interfaces Figure 5-1-2 shows the dimensions in details. Figure 5-1-2 Dimensions Top view (Unit: mm) 19 COMPANY CONFIDENTIAL 5.1.2 Recommended LGA Land Pattern(bottom view), unit:mm 20 COMPANY CONFIDENTIAL 5.1.3PCB stacking 10 Layers, HDI, thickness:0.8mm +/-0.05mm 5.1.4 label information 21 COMPANY CONFIDENTIAL 5.2Mounting onto the Application Platform This section describes how to mount T77W980T00 LTE Module onto the PCBs (=printed circuit boards), includingland pattern and stencil design, board-level characterization, soldering conditions, durabilityand mechanical handling. Note: All SMT module pads need to be soldered to the applications PCB. Not only must all supply pads and signals be connected appropriately, but all pads denoted as Do not use will alsohave to be soldered (but not electrically connected) in order to ensure the best possible mechanical stability. 5.2.1SMT PCB Assembly 5.2.1.1Land Pattern and Stencil Recommended design of the solder pads on customers' PCBs (Unit: mm) Non Solder Mask Defined (NSMD) is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved. 22 COMPANY CONFIDENTIAL Figure 5-2-1Land pattern (top view) It is recommended that the stencil for the LGA module be at least 0.15 mm in thickness. For the recommended stencil aperture design, refer figure 5-2-1.Unit: mm The solder paste dosage(0.1587g/pcs) is a theoretical value for reference. 5.2.1.2Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process. Characterization tests should attempt to optimize the SMT process with regard to board levelreliability. This can be done by performing the following physical tests on sample boards:

Peeltest, bend test, tensile pull test, drop shock test and temperature cycling. It is recommended to characterize land patterns before an actual PCB production, taking individual processes, materials, equipment, stencil design, and reflow profile into account. For landand stencil pattern design recommendations see also Section 5.2.1.1. Optimizing the solderstencil pattern design and print process is necessary to ensure print uniformity, to decrease solder voids, and to increase board level reliability. Generally, solder paste manufacturer recommendations for screen printing process parameters and reflow profile conditions should be followed. Maximum ratings are described in Section5.2.3. 5.2.2Moisture Sensitivity Level T77W980T00 LTE Module comprises components that are susceptible to damage induced by absorbed moisture. 23 COMPANY CONFIDENTIAL T77W980T00 LTE Module complies with the latest revision of the IPC/JEDEC J-STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4.For additional MSL

(=moisture sensitivity level) related information see Section 5.2.4 and Section 5.3.2. 5.2.3Soldering Conditions and Temperature 5.2.3.1Reflow Profile Figure 5-2-3: Reflow Profile Table 5-2: Reflow temperature ratings Profile Feature Preheat & Soak Temperature Minimum (TSmin ) Temperature Maximum (TSmax ) Time (tSminto t Smax ) (tS ) Average ramp up rate (TSmax to TP ) Liquidous temperature (TL ) Time at liquidous (tL ) Peak package body temperature (TP ) Time (tP ) within 5 C of the peak package body temperature (TP ) Average ramp-down rate (TP to TSmax ) Time 25C to maximum temperature Pb-Free Assembly 150 180 60~120 seconds 3 K/second max 217 50~90 seconds 240~250 30 seconds max. 3 K/second max. 8 minutes max. 24 COMPANY CONFIDENTIAL 5.2.3.2Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 245C. This specifies the temperature as measured atthe modules top side. A maximum duration of 30 seconds at this temperature. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. T77W980T00 LTE Module is specified for one soldering cycle only.Once T77W980T00 LTE module is removed from the application, themodule will very likely be destroyed and cannot be soldered onto another application. 5.2.4Durability and Mechanical Handling 5.2.4.1Storage Life T77W980T00 LTE modules, as delivered in tape and reel (TBD) carriers, must be stored in sealed, moisture barrieranti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, sucha life span requires a non-condensing atmospheric environment, ambient temperatures below 40C and a relative humidity below 90%. Additional storage conditions are listed in Table 3-1. 5.2.4.2Processing Life T77W980T00 LTE module must be soldered to an application within 72 hours after opening the MBB (=moisturebarrier bag) it was stored in.As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing themodules should have ambient temperatures below 30C and a relative humidity below 60%. 5.2.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 49 for details):

It is not necessary to bake T77W980T00 LTE module , if the conditions specified in Section 5.2.4.1 and Section5.2.4.2 were not exceeded. 25 It is necessary to bake T77W980T00 LTE module , if any condition specified in Section 5.2.4.1 COMPANY CONFIDENTIAL and Section 5.2.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 5.2.4.4 Electrostatic Discharge ESD (=electrostatic discharge) may lead to irreversible damage for the module. It is thereforeadvisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 4.5 for further information on electrostatic discharge. 5.3Packaging 5.3.1Tape and Reel(TBD) The single-feed tape carrier for T77W980T00 LTE is illustrated in Figure 45. The figure also shows the proper part orientation. 5.3.1.1 Orientation 5.3.1.2Barcode Label Figure 5-3-1: Carrier tape Figure 5-3-2: Roll direction A barcode label provides detailed information on the tape and its contents. It is attached to thereel. Figure 5-3-3: Barcode label on tape reel 5.3.2Shipping Materials T77W980T00 LTE module is distributed in tape and reel carriers. The tape and reel carriers used to distribute T77W980T00 LTE module are packed as described below, including the following required shipping materials:

26 COMPANY CONFIDENTIAL Moisture barrier bag, including desiccant and humidity indicator card Transportation bag 5.3.2.1Moisture Barrier Bag The tape reels are stored inside an MBB (=moisture barrier bag), together with a humidity indicator card and desiccant pouches - see Figure 48. The bag is ESD protected and delimits moisture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing ortearing. The bag protects the T77W980T00 LTE modules from moisture exposure. It should not be openeduntil the devices are ready to be soldered onto the application. Figure 5-3-4: Moisture barrier bag (MBB) with imprint The label shown in Figure 5-3-5 summarizes requirements regarding moisture sensitivity, including shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. Figure 5-3-5: Moisture Sensitivity Label MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. Thehumidity indicator card described below should be used to determine whether the enclosedcomponents have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the approximate relative humidity level within the bag. Sample humidity cards are shown in Figure 5-3-6.If the components have been exposed to moisture above the recommended limits, the units willhave to be rebaked. Figure 5-3-6: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. 5.3.2.2Transportation Box 27 Tape and reel carriers are distributed in a box, marked with a barcode label for identificationpurposes. COMPANY CONFIDENTIAL A box contains 2 reels with 500 modules each. 3. Sample Application TBD 28 COMPANY CONFIDENTIAL Host integration instructions GNSS Install module through golden finger. z Customizable tracking session The End Host information:

MT code : 81JL Marketing name : Lenovo YOGA C630-13Q50 Automatic tracking session on startup Concurrent standalone GPS, GLONASS, Beidou and Galileo gpsOneXTRA with GPS + GLONASS + Beidou + Galileo support 1.2 Carrier aggregation combination 1.2.1. Refer to Qualcomm documents 80-P8641-123 Rev. A, Published: 2017/7/31. Remark: T77W980 hardware design can support follow CA combination, but the Final CA combinations plan depends on carrier engagement and Qualcomm software design. 1.2.2. Qualcomm SDX20 support 5CA+256QAM (up to Cat18) and Rel13 (FDD+TDD CA) which is mandatory for AU/JP/China carriers. Update the Carrier CA combination list later 1.3 System Block Diagram 1. GRC is the RF only module, it doesnt include the CPU & memory. So GRC doesnt have the SW Figure 1-3-1 GRC Architecture image. 2. Each GRC will have its unique QCN data, it will use the GRC SN or IMEI to name it, and provide these data to one ftp server. OEM can scan the SN or IMEI to get the QCN data then load it to the platform memory. 8 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

-

Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20 cm is maintained between the antenna and users, and The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID:MCLT77W980. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Industry Canada statement:

This device complies with ISEDs licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un Antenna spec:

Antenna No. 1 2 3 4 5 Antenna No. 3 3 2 3 3 2 3 1 1 1 1 3 2 5 3 3 3 1 Antenna Gain(dBi) Please refer to below table Please refer to below table Please refer to below table Please refer to below table Please refer to below table Frequency range (MHz) Antenna Type Connecter Type Cable Length 699~803 PIFA i-pex(MHF) 100mm 791~960 1447.9~1606 1710~2170 2500~2690 5110~5925

(for LAA RX) PIFA i-pex(MHF) 100mm PIFA i-pex(MHF) 100mm PIFA i-pex(MHF) 100mm 2305~2315 Dipole i-pex(MHF) 80mm Antenna gain list Band Freq. Range (MHz) Gain (dBi) WCDMA II (B2) WCDMA IV (B4) WCDMA V (B5) LTE Band (2) LTE Band (4) LTE Band (5) LTE Band (7) LTE Band (12) LTE Band (13) LTE Band (14) LTE Band (17) LTE Band (25) LTE Band (26) LTE Band (30) LTE Band (38) LTE Band (41) LTE Band (66) LTE Band (71) 1850~1910 1710~1755 824~849 1850~1910 1710~1755 824~849 2500~2570 698~716 777~787 788~798 704~716 1850~1915 814~849 2305~2315 2570~2620 2496~2690 1710~1780 663~698 4.92 5.99 2.68 4.92 5.99 2.68 5.2 4.17 3.05 2.87 4.17 4.92 2.92 3.02 4.82 5.38 5.99 3.83