| submitted | available | document details (if available) | source link |
|---|---|---|---|
| November 12 2015 | November 12 2015 |
| various | Manual | Users Manual | 3.76 MiB | November 12 2015 |
BM20/BM23 Bluetooth 4.1 Stereo Audio Module Spanish/ French) voice prompts and 20 events for each one (This function can be set up in IS20XXS_UI tool.) Support SCMS-T Audio Codec 20 bit DAC and 16 bit ADC codec 98dB SNR DAC playback Peripherals Built-in Lithium-ion battery charger (up to 350mA) Integrate 3V, 1.8V configurable switching regulator and LDO Built-in ADC for battery monitor and voltage sense. A line-in port for external audio input Two LED drivers Flexible HCI interface High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps) MAC/Baseband/Higher Layer:
Secure AES128 encryption Bluetooth profiles
- HFP v1.6
- HSP v1.1
- A2DP v1.2
- AVRCP v1.5
- SPP v1.0
- PBAP v1.0 Antenna:
Printed Antenna Compliance:
Bluetooth SIG QDID: 58996 Module certified for the United States (FCC) and Canada (IC), European Economic Area (CE), Korea (LTA), Taiwan (NCC) and Japan (MIC) Features:
Complete, Fully Certified, Embedded 2.4 GHz Bluetooth Version 4.1 Module Bluetooth Classic (BDR/EDR) Bluetooth SIG Certified Onboard embedded Bluetooth Stack Transparent UART mode for seamless serial Easy to configure with Windows GUI or direct Firmware can be field upgradable via UART Compact surface mount module: 29 x 15 x data over UART interface by MCU 2.5 mm3 Castellated surface mount pads for easy and reliable host PCB mounting Environmentally friendly, RoHS compliant Perfect for Portable Battery Operated Devices Internal Battery Regulator Circuitry Worldwide regulatory certifications Audio-In / Out BM23 support digital audio I2S format. BM20 support analog audio output. Operational:
Operating voltage: 3.0V to 4.2V Temperature range: 20C to 70C Simple, UART interface Multiple I/O pins for control and status Integrated crystal, internal voltage regulator, and matching circuitry RF/Analog:
Frequency: 2.402 to 2.480 GHz Receive Sensitivity: 91 dBm (2Mbps EDR) Power Output: class 2 / +4dBm max. Connection Distance: >10m
(free space and no interference) Audio processor Support 64 kb/s A-Law or -Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation. Noise suppression Echo suppression SBC and optional AAC decoding Packet loss concealment Build-in four languages (Chinese/ English/
2015 Microchip Technology Inc. Preliminary Edition Page 1 This stereo module built-in Li-Ion charger and BM23 contain a digital audio interface. It supports HSP, HFP, SPP, A2DP, and AVRCP profiles. Both AAC and SBC codecs are supported for A2DP. Note that the customer must connect their own external analog CODEC/DSP/amplifier and MCU for audio output. Applications:
Bluetooth sound bar Bluetooth stereo speaker phone FIGURE 1:
General Description:
Stereo module is a fully-certified Bluetooth Version 4.1 (BDR/EDR) module for designers who want to add Bluetooth wireless audio and voice applications to their products. This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package, 29x15x2.5 mm3. 2015 Microchip Technology Inc. Preliminary Edition Page 2 Table of Contents Stereo Module 1.0 DEVICE OVERVIEW .................................................................................................................................. 4 2.0 APPLICATION INFORMATION ............................................................................................................... 10 3.0 ELECTRICAL CHARACTERISTICS ....................................................................................................... 18 4.0 PRINTED ANTENNA INFORMATION ..................................................................................................... 23 5.0 REFERENCE CIRCUIT ........................................................................................................................... 25 6.0 CERTIFICATION INFORMATION .......................................................................................................... 27 7.0 MODULE OUTLINE AND REFLOW PROFILE ...................................................................................... 29 8.0 PACKAGING AND STORAGE INFORMATION .................................................................................... 34 APPENDIX ........................................................................................................................................................ 37 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:
Microchips Worldwide Web site; http://www.microchip.com Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. Abbreviations List:
HFP: Hands-free Profile AVRCP: Audio Video Remote Control Profile A2DP: Advanced Audio Distribution Profile PBAP: Phone Book Access Profile HSP: Headset Profile SPP: Serial Port Profile 2015 Microchip Technology Inc. Preliminary Edition Page 3 Stereo Module 1.0 DEVICE OVERVIEW The stereo module series include BM20 and BM23. The chip integrates Bluetooth 4.1 radio transceiver, PMU and DSP. Figure 1-1and 1-2 shows the application block diagram. FIGURE 11: BM20 Typical Application The following depicts an example of BM20 module operate as an independent system or connected to an MCU. Audio Output Microphone Aux_In IS2020S I2C EEPROM IC 16M Hz Crystal UART BM20 MCU Option FIGURE 12: BM23 Typical Application The following depicts an example of BM23 module connected to an MCU, external DSP/CODEC. 2015 Microchip Technology Inc. Preliminary Edition Page 4 Stereo Module 1.1 INTERFACE DESCRIPTION BM20 pin diagram is shown in Figure 1-3. The pin descriptions are shown in Table 1-1 FIGURE 1-3: BM20 PIN DIAGRAM TABLE 11: BM20 PIN DESCRIPTION Pin No. Pin type Name Description 1 2 3 4 5 6 7 8 I/O I I I P0_0 EAN P3_0 P2_0 I/O P1_5 I/O O O P0_4 SPKR AOHPM IO pin, default pull-high input (Note 1) 1. Slide Switch Detector, active low. 2. UART TX_IND, active low. Embedded ROM/External Flash enable H: Embedded; L: External Flash IO pin, default pull-high input (Note 1) Line-in Detector (default), active low. IO pin, default pull-high input System Configuration, H: Application L: Baseband(IBDK Mode) IO pin, default pull-high input (Note 1) 1. NFC detection pin, active low. 2. Out_Ind_0 3. Slide Switch Detector, active low. 4. Buzzer Signal Output IO pin, default pull-high input. (Note 1) 1. NFC detection pin, active low. 2. Out_Ind_0 R-channel analog headphone output Headphone common mode output/sense input. 2015 Microchip Technology Inc. Preliminary Edition Page 5 Pin No. Pin type Stereo Module Description L-channel analog headphone output Positive power supply/reference voltage for CODEC, no need to add power to this pin. Mic 1 mono differential analog positive input Mic 1 mono differential analog negative input Electric microphone biasing voltage R-channel single-ended analog inputs L-channel single-ended analog inputs System Reset Pin, Low: reset 1.28V RF LDO output, no need to add power to this pin. IO pin, default pull-high input (Note 1) 1. FWD key when class 2 RF (default), active low. 2. Class1 TX Control signal of external RF T/R switch, active high. Power output , no need to add power to this pin 5V Power adaptor input 3.3V~4.2V Li-Ion battery input No Connection Ground Pin System Power Output BAT mode: 3.3~4.2V Adapter mode: 4.0V 1.8V buck output, no need to add power to this pin 1. Power key when in off mode 2. UART_RX_IND: MCU use to wakeup BT (Note 1) LED Driver 1 LED Driver 2 IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination IO pin, default pull-high input (Note 1) Play/Pause key (default), active low. IO pin, default pull-high input (Note 1) 1. REV key (default), active low. 2. Buzzer Signal Output 3. Out_Ind_1 4. Class1 RX Control signal of external RF T/R switch, active high. HCI-UART TX data HCI-UART RX data IO pin, default pull-high input (Note 1) Volume down (default), active low. IO pin, default pull-high input (Note 1) Volume up key (default), active low. Name SPKL VDDA MIC1_P MIC1_N MIC_BIAS AIR AIL RST VCC_RF O P I I P I I I P I/O P0_1 P P P
-
P P P I I I I I VDD_IO ADAP_IN BAT_IN NC GND SYS_PWR BK_OUT MFB LED1 LED2 P2_4 P0_2 I/O P0_3 O I I I HCI_TXD HCI_RXD P0_5 P2_7 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 2015 Microchip Technology Inc. Preliminary Edition Page 6 Stereo Module Pin No. Pin type Name Description 36 37 38 39 40 I P
-
-
-
P2_4 GND NC NC NC IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination Ground Pin No Connection No Connection No Connection
* I: signal input pin
* O: signal output pin
* I/O: signal input/output pin
* P: power pin Note 1: These button or functions can be setup by IS20XXS_UI tool. 2015 Microchip Technology Inc. Preliminary Edition Page 7 Stereo Module BM23 pin diagram is shown in Figure 1-4. The pin descriptions are shown in Table 1-2 FIGURE 1-4: BM23 PIN DIAGRAM TABLE 12: BM23 PIN DESCRIPTION Pin Type Name Description I/O I/O I/O I/O I O I/O I I I P P I I P0_0 RFS0 TFS0 SLK0 DR0 DT0 P0_4 IO pin, default pull-high input (Note 1) UART TX_IND I2S interface: DAC Left/Right Clock I2S interface: ADC Left/Right Clock I2S interface: Bit Clock I2S interface: DAC Digital Left/Right Data I2S interface: ADC Digital Left/Right Data IO pin, default pull-high input Embedded ROM/External Flash enable High: ROM mode;
Low: External Flash mode MIC1_P Mic 1 mono differential analog positive input MIC1_N Mic 1 mono differential analog negative input MIC_BIAS EAN Power output, microphone biasing voltage Power output, reserve for external cap to fine tune audio frequency response, no need to add power to this pin Stereo analog line in, R-channel Stereo analog line in, L-channel VDDA AIR AIL Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 2015 Microchip Technology Inc. Preliminary Edition Page 8 Pin No. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 Stereo Module I/O P I
--
--
P I/O I/O P P
--
P P P P P I I/O I/O O I I/O I/O I/O I/O I P
--
--
--
Name GND RST_N NC NC VDDIO P1_5 P0_1 ADAP_IN BAT_IN NC SYS_PWR BK_OUT MFB LED1 LED2 P2_4 P0_2 P0_3 HCI_TXD HCI_RXD P0_5 P2_7 P2_0 P3_0 P2_0 GND NC NC NC Description Ground System Reset Pin, active when rising edge.
--
--
Power output, VDDIO pin, no need to add power to this pin IO pin, default pull-high input IO pin, default pull-high input 5V power adaptor input 3.3~4.2V Li-ion battery input
--
System Power Output BAT mode: 3.3~4.2V Adapter mode: 4.0V Power output, 1v8 pin, no need to add power to this pin 1. Power key when in off mode 2. UART_RX_IND: MCU use to wakeup BT LED Driver 1, 4mA max LED Driver 2, 4mA max IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination IO pin, default pull-high input IO pin, default pull-high input HCI-UART TX data HCI-UART RX data IO pin, default pull-high input IO pin, default pull-high input IO pin, default pull-high input IO pin, default pull-high input IO pin, default pull-high input System Configuration, H: Application L: Baseband(IBDK Mode) Ground.
--
--
--
* I: signal input pin
* O: signal output pin
* I/O: signal input/output pin
* P: power pin Note 1: These button or functions can be setup by IS20XXS_UI tool. 2015 Microchip Technology Inc. Preliminary Edition Page 9 Stereo Module 2.0 APPLICATION INFORMATION 2.1 OPERATION WITH EXTERNAL MCU Stereo module support UART command set to make an external MCU to control module. Here is the connection interface between BMXX and MCU. FIGURE 2-1: INTERFACE BETWEEN MCU AND BMXX MODULE MCU_ WAKEUP UART_RX UART_TX BT_ WAKEUP UART interface UART interface P0_0 HCI_TXD HCI_RXD MFB XX MCU can control module by UART interface and wakeup module by PWR pin. Stereo module provide wakeup MCU function by connect to P0_0 pin of module. UART Command Set document provide all function which module support and UI tool will help you to set up your system support UART command. For more detail description, please reference UART_CommandSet_v154 document and IS20XXS_UI tool. 2015 Microchip Technology Inc. Preliminary Edition Page 10 Here are some suggestions of UART control signal timing sequence:
FIGURE 2-2: POWER ON/OFF SEQUENCE Stereo Module 2015 Microchip Technology Inc. Preliminary Edition Page 11 FIGURE 2-3: TIMING SEQUENCE OF RX INDICATION AFTER POWER ON Stereo Module FIGURE 2-4: TIMING SEQUENCE OF POWER OFF 2015 Microchip Technology Inc. Preliminary Edition Page 12 FIGURE 2-5: TIMING SEQUENCE OF POWER ON (NACK) Stereo Module FIGURE 2-6: RESET TIMING SEQUENCE IF MODULE HANGS UP 2015 Microchip Technology Inc. Preliminary Edition Page 13 FIGURE 2-7: TIMING SEQUENCE OF POWER DROP PROTECTION Stereo Module Power BAT_IN +4V 2.9V ~
RST_N from Reset IC If BTs BAT use adaptor translates voltage by LDO, we recommend use Reset IC to avoid power off suddenly. Rest IC spec output pin must be Open Draindelay time 10ms Recommend part: TCM809SVNB713 or G691L263T73 2015 Microchip Technology Inc. Preliminary Edition Page 14 2.2 I2S Signal Application for BM23 Stereo Module BM23 support I2S digital audio signal interface to connect your external CODEC/DSP. It provide 8k Hz, 44.1k Hz and 48k Hz sampling rate; it also support 16 bits and 24bits data format. The I2S setting can be set up by UI and DSP tools. The external CODEC/DSP needs to be connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3, 5, and 6 respectively). The I2S signal connection between BM23 and external DSP as below:
FIGURE 2-9: MASTER MODE REFERENCE CONNECTION FIGURE 2-10: SLAVE MODE REFERENCE CONNECTION
. Note 1: For 002 version chip or module, system should connect line 1 in slave mode figure. And, system not support ADC signal from external DSP/CODEC. Note 2: For other version chip or module, system should connect line 2 in slave mode figure. About Mast or Slave mode setting, you can use DSP Configuration Tool to set up system. 2015 Microchip Technology Inc. Preliminary Edition Page 15 The clock and data timing as below:
FIGURE 2-11: TIMING FOR I2S MODES (both master and slave) Stereo Module FIGURE 2-12: TIMING FOR PCM MODES (both master and slave) 2.3 RESET (RST_N) RST is module reset pin which is active LOW. To reset the module, the RST_N must hold LOW for at least 63ns. 2.4 STATUS LED (LED1, LED2) The status LED provide below status indication:
Standby Inquiry Link Link Back Low Battery Page Battery Charging Each status indication LED flashing sequence and brightness is configurable by UI tool. 2015 Microchip Technology Inc. Preliminary Edition Page 16 Stereo Module 2.5 EXTERNAL CONFIGURATION Stereo module can be configured and firmware programmed using an external configuration and programming tool available from Microchip. Figure 27 shows the configuration and firmware programming interface on BM23. It is recommended to include a pin header on the main PCB for development. Configuration and firmware programming modes are entered accordingly to the system configuration I/O pins as shown in Table 2-1. Pin P20, P24 and EAN pin have internal pullup. FIGURE 2-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS
(Here is the interface connect example of the BM23) TABLE 2-1: SYSTEM CONFIGURATION SETTINGS P20 High Low Low P24 High High Low EAN High High High Write Flash (Firmware programming if flash build-in in chip) APP mode (Normal operation) Test mode (Write EEPROM) Operational Mode 2015 Microchip Technology Inc. Preliminary Edition Page 17 Stereo Module Min 0 0
-65
-20 Parameter Input voltage for battery Input voltage for adaptor Storage temperature Operation temperature 3.0 ELECTRICAL CHARACTERISTICS Table 3-1: ABSOLUTE MAXIMUM SPECIFICATION Symbol BAT_IN ADAP_IN TSTORE TOPERATION Table 3-2: RECOMMENDED OPERATING CONDITION Symbol BAT_IN ADAP_IN TOPERATION Note:
Absolute and Recommended operating condition tables reflect typical usage for device. TABLE 3-3: I/O AND RESET LEVEL Parameter Input voltage for battery Input voltage for adaptor Operation temperature Min 3 4.5
-20 Typical 3.7 5
+25 Min. 2.7 0.3 2.0 2.4 Typ. 3.0 1.6 Parameter I/O Supply Voltage (VDD_IO) I/O Voltage Levels VIL input logic levels low VIH input logic levels high VOL output logic levels low VOH output logic levels high RESET VTH,RES threshold voltage Note:
(1) VDD_IO voltage is programmable by EEPROM parameters.
(2) These parameters are characterized but not tested in manufacturing. 2015 Microchip Technology Inc. Preliminary Edition Max 4.3 7.0
+150
+70 Unit V V C C Max 4.2 5.5
+70 Unit V V C Max. 3.3 0.8 3.6 0.4 Units V V V V V V Page 18 Stereo Module Max 5.5 4.5 240 240 420 270 Typical 5.0 3 200 180 350 220 3 10 Unit V mA mA mA mA mA V
%
Typical Max 3.6 5.25 16 0.35 1 1 Unit V mA step mA A A Table 3-4: BATTERY CHARGER Parameter ADAP_IN Input Voltage Supply current to charger only Maximum Battery Fast Charge Current Note: ENX2=0 Maximum Battery Fast Charge Current Note: ENX2=1 Headroom > 0.7V
(ADAP_IN=5V) Headroom = 0.3V
(ADAP_IN=4.5V) Headroom > 0.7V
(ADAP_IN=5V) Headroom = 0.3V
(ADAP_IN=4.5V) Min 4.5 170 160 330 180 Min Trickle Charge Voltage Threshold Battery Charge Termination Current,
(% of Fast Charge Current) Note:
(1) Headroom = VADAP_IN VBAT
(2) ENX2 is not allowed to be enabled when VADAP_IN VBAT > 2V
(3) These parameters are characterized but not tested in manufacturing. Table 3-5: LED DRIVER Parameter Open-drain Voltage Programmable Current Range Intensity Control Current Step Power Down Open-drain Current Shutdown Current Note:
(1) Test condition: SAR_VDD=1.8V, temperature=25 C.
(2) These parameters are characterized but not tested in manufacturing. 0 2015 Microchip Technology Inc. Preliminary Edition Page 19 Stereo Module Table 3-6: AUDIO CODEC ANALOGUE TO DIGITAL CONVERTER T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Parameter (Condition) Resolution Output Sample Rate Signal to Noise Ratio Note: 1
(SNR @MIC or Line-in mode) Digital Gain Digital Gain Resolution MIC Boost Gain 8
-54 Min. Typ. 88 2~6 20 2.0 4 800 20 24 0.02 Analog Gain Analog Gain Resolution Input full-scale at maximum gain (differential) Input full-scale at minimum gain (differential) 3dB bandwidth Microphone mode (input impedance) THD+N (microphone input) @30mVrms input Note:
(1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 1%, 150mVpp input
(2) These parameters are characterized but not tested in manufacturing. 2015 Microchip Technology Inc. Preliminary Edition Max. 16 48 4.85 60 Unit Bits KHz dB dB dB dB dB dB mV rms mV rms KHz K
%
Page 20 Stereo Module Min. Table 3-7: AUDIO CODEC DIGITAL TO ANALOGUE CONVERTER T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Typ. Parameter (Condition) Over-sampling rate 128 Resolution Output Sample Rate Signal to Noise Ratio Note: 1
(SNR @cap-less mode) for 48kHz Signal to Noise Ratio Note: 1
(SNR @single-end mode) for 48kHz Digital Gain Digital Gain Resolution 16 8 96
-54 98 2~6 Analog Gain Analog Gain Resolution Output Voltage Full-scale Swing (AVDD=2.8V) Maximum Output Power (16 load) Maximum Output Power (32 load) Allowed Load THD+N (16 load) Resistive Capacitive
-28 1 495 742.5 8 34.5 17.2 16 Max. 20 48 4.85 3 O.C. 500 0.05 96 Unit fs Bits KHz dB dB dB dB dB dB mV rms mW mW pF
%
dB Signal to Noise Ratio (SNR @ 16load) Note:
(1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load=100K
(2) These parameters are characterized but not tested in manufacturing. Table 3-8: TRANSMITTER SECTION FOR BDR AND EDR Parameter Typ 3.0 Maximum RF transmit power
-1.2 Max 4.0 1 EDR/BDR
-4 Min Relative transmit power Bluetooth specification Unit dBm dB
-6 to 4
-4 to 1 Note:
The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment. Test condition: VCC_RF= 1.28V, temperature=25 C. 2015 Microchip Technology Inc. Preliminary Edition Page 21 Table 3-9: RECEIVER SECTION FOR BDR AND EDR Sensitivity at 0.1% BER Modulation GFSK Min Typ
-90 Stereo Module Max Bluetooth specification Unit dBm
-70 Sensitivity at 0.01% BER
/4 DQPSK 8DPSK
-91
-82
-70
-70 dBm dBm Note:
(1) Test condition: VCC_RF= 1.28V, temperature=25 C.
(2) These parameters are characterized but not tested in manufacturing. Table 3-10: SYSTEM CURRENT CONSUMPTION OF ANALOG AUDIO OUTPUT System Status Max. Typ. 5 System Off Mode Standby Mode Linked Mode SCO Link A2DP Link (V p-p=200mV; 1k tone signal) Note: Use BM20 EVB as test platform. Table 3-11: SYSTEM CURRENT CONSUMPTION OF DIGITAL AUDIO OUTPUT(I2S) System Status 2 0.8 0.4 7.8 10.7 Max. Typ. System Off Mode Standby Mode Linked Mode SCO Link A2DP Link (1k tone signal) Note: Use BM23 EVB as test platform 5 2 0.4 0.4 9.3 11.7 Unit uA mA mA mA mA Unit uA mA mA mA mA Test condition: BAT_IN= 3.8V, link with HTC EYE cell phone; distance between cell phone and EVB: 30cm. Test condition: BAT_IN= 3.8V, link with HTC M8 cell phone; distance between cell phone and EVB: 30cm;
I2S signal link with YAMAHA YDA174 EVB 2015 Microchip Technology Inc. Preliminary Edition Page 22 Stereo Module 4.0 PRINTED ANTENNA INFORMATION 4.1 MODULE RADIATION PATTERN The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is shown in Figure 4-2. FIGURE 4-1: ANTENNA KEEP OUT AREA EXAMPLES FIGURE 4-2: ANTENNA 3D RADIATION PATTERN @2441 MHz 2015 Microchip Technology Inc. Preliminary Edition Page 23 Stereo Module 4.2 MODULE PLACEMENT RULE On the main PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 41. A lowimpedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommended as need for the main PCB EMC noise reduction. For the best range performance, keep all external metal away from the ceramic chip antenna at least 15 mm. Here are some examples of good and poor placement on a carrier board with GND plane. FIGURE 4-3: MODULE PLACEMENT EXAMPLES FIGURE 4-4: GND PLANE ON MAIN APPLICATION BOARD 2015 Microchip Technology Inc. Preliminary Edition Page 24 Stereo Module 5.0 REFERENCE CIRCUIT 5.1 BM20 REFERENCE CIRCUIT 3 P J G U B E D H T O O T E U L B r o F E V R E S E R 8 x 1 P J 12345678 D X R _ D X T _ I I C H C H 4 _ 2 P 0 _ 2 P N A E V 5 I N _ T A B 2 P J 12345678 8 x 1 P J L O R T N O C T R A U
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C D 2 P 2015 Microchip Technology Inc. Preliminary Edition Page 26 6.0 CERTIFICATION INFORMATION 6.1 BQTF INFORMATION FIGURE 6-1: BM15/BM20/BM23/BM25 QDID Data Stereo Module 2015 Microchip Technology Inc. Preliminary Edition Page 27 Stereo Module Korea; Certification No.: MSIP-CRM-S9S-BM23SPKXY 6.2 REGULATORY APPROVAL BM23 has got these countries regulatory approval:
United States; FCC ID: A8TBM23SPKXYC2A Canada; IC ID: 12246A-BM23SPKXYC2 Europe Japan: 202-SMC067 Taiwan; NCC No.: CCAL15LP0270T3 BM20 has got these countries regulatory approval:
United States: FCC ID: A8TBM20SPKXYNBZ Canada; IC ID: 12246A-BM20SPKS1 Europe Japan: 202-SMD048 Korea; Certification No.: MSIP-CRM-mcp-BM20SPKS1NBC Taiwan; NCC No.: CCAN15LP0460T2 For more information, please reference appendix. 2015 Microchip Technology Inc. Preliminary Edition Page 28 Stereo Module 7.0 MODULE OUTLINE AND REFLOW PROFILE 7.1 MODULE DIMENSION AND PCB FOOT PRINT FIGURE 7-1: BM20 Outline Dimension PCB dimension:
X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc. Preliminary Edition Page 29 FIGURE 7-2: BM23 Outline Dimension Stereo Module PCB dimension:
X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc. Preliminary Edition Page 30 FIGURE 7-3: BM20 PCB FOOT PRINT Stereo Module Note: The Keep Out Area is reserved for RF performance check. 2015 Microchip Technology Inc. Preliminary Edition Page 31 FIGURE 7-4: BM23 PCB FOOT PRINT Stereo Module Note: The Keep Out Area is reserved for RF performance check. 2015 Microchip Technology Inc. Preliminary Edition Page 32 Stereo Module 7.2 REFLOW PROFILE FIGURE 7-5: REFLOW PROFILE Slope: 1~2/sec max.
(217 to peak) peak: 260 +5/-0 217 Preheat: 150~200 Ramp down rate :
Max. 3/sec. 20~40 sec. 60 ~ 180 sec. 60 ~150sec Time (sec) 25 Soldering Recommendations Stereo module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging of the module, the recommendations are listed as follows:
Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233) for the soldering reflow recommendations Refer to the solder paste data sheet for specific reflow profile recommendations Do not exceed peak temperature (TP) of 250 degree C Use no-clean flux solder paste Do not wash as moisture can be trapped under the shield Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. 2015 Microchip Technology Inc. Preliminary Edition Page 33 Stereo Module 8.0 PACKAGING AND STORAGE INFORMATION The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format. These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a dimension of 36 * 16 * 9.5 cm3. The shelf life of each module in a sealed bag is 12 months at <40C and <90% relative humidity. After a bag is opened, devices that will be subjected to reflow solder or other high temperature processes must be mounted within 168 hours (7 days) at factory conditions of <30C and <60% relative humidity. 2015 Microchip Technology Inc. Preliminary Edition Page 34 Stereo Module 2015 Microchip Technology Inc. Preliminary Edition Page 35 8.1 ORDERING INFORMATION TABLE 5-1: Module Ordering Information Part Number Description Stereo Module BM20SPKS1NBC BM23SPKS1NB9 Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield Note: The module can only be purchased through a Microchip representative. Go to http://www.microchip.com/ for current pricing and a list of distributors carrying Microchip products. 2015 Microchip Technology Inc. Preliminary Edition Page 36 APPENDIX A.1 United States Stereo Module The module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C Intentional Radiators modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the users authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B Unintentional Radiators), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. A.1.1 LABELING AND USER INFORMATION REQUIREMENTS The module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows:
Contains Transmitter Module FCC ID:
A8TBM23SPKXYC2A or Contains FCC ID: A8TBM23SPKXYC2A This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A users manual for the finished product should include the following statement:
2015 Microchip Technology Inc. Preliminary Edition Page 37 Stereo Module This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm. 3.1.2 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. 3.1.3 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm 2015 Microchip Technology Inc. Preliminary Edition Page 38 Stereo Module A.2 Canada The BM23 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 12246A-BM23SPKXYC2 User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December 2010): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals for transmitters shall display the following notice in a conspicuous location:
2015 Microchip Technology Inc. Preliminary Edition Page 39 Stereo Module Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power
(e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. The modules are approved with on board PCB Antenna only. A.2.2 OSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). A.2.3 WEB SITES Industry Canada: http://www.ic.gc.ca/
2015 Microchip Technology Inc. Preliminary Edition Page 40 A.3 Europe Stereo Module The BM23 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM23 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC)
(Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table 31: European Compliance Testing. A Notified Body Opinion has also been issued. The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm. Note: To maintain conformance to the testing listed in Table A.31: European Compliance Testing, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturerof the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. A.3.1 ABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM23 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. A.3.2 ANTENNA REQUIREMENTS From R&TTE Compliance Association document Technical Guidance Note 01:
Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturers installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4]
The European Compliance Testing listed in Table 31 was performed using the integral ceramic chip antenna. TABLE A .31: EUROPEAN COMPLIANCE TESTING Standards EN 60950-
1:2006+A11:2009+A1:2010 EN 50371:2002-03 EN 301 489-1 V1.8.1 (2008-04) EN 301 489-17 V2.1.1 (2009-05) EN 300 328 V1.7.1 (2006-10) Laboratory Article
(3.1(a))
(3.1(b))
(3.2) Report Number Date Certificatio n Safety Health EMC Radio Notified Body Opinion 2015 Microchip Technology Inc. Preliminary Edition Page 41 Stereo Module A.3.3 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 7003 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are:
Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org European Telecommunications Standards Institute (ETSI):
http://www.etsi.org European Radio Communications Office (ERO):
http://www.ero.dk The Radio and Telecommunications Terminal Equipment Compliance Association
(R&TTE CA):
http://www.rtteca.com/
2015 Microchip Technology Inc. Preliminary Edition Page 42 Stereo Module A.4 Japan The BM20/BM23 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required:
If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html A.4.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM20/BM23 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The BM20/BM23 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside:
Contains transmitter module with certificate number:
A.4.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
2015 Microchip Technology Inc. Preliminary Edition Page 43 Stereo Module A.5 Korea The BM23 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM23 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM23 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module:
(MSIP-CRM-S9S-BM23SPKXY) A.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency
(RRA): http://rra.go.kr 2015 Microchip Technology Inc. Preliminary Edition Page 44 Stereo Module A.6 Taiwan The BM23 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. installation instructions are followed and no modifications of the module are allowed. Integration of this module into a final product does not require additional radio certification provided A.6.1 LABELING AND USER INFORMATION REQUIREMENTS The BM23 module is labeled with its own NCC mark and certificate number as below:
CCAL15LP0270T3 The users manual should contain below warning (for RF device) in traditional Chinese:
!
A.6.2 HELPFUL WEB SITES National Communications Commission (NCC): http://www.ncc.gov.tw 2015 Microchip Technology Inc. Preliminary Edition Page 45 AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support:
http://www.microchip.com/
support Web Address:
www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 Page 46 Worldwide Sales and Service ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 2015 Microchip Technology Inc.
This product uses the FCC Data API but is not endorsed or certified by the FCC